Server heat dissipation method, device and system

Abstract

The present application discloses a server heat dissipation method, device and system, which relate to the field of server technology and provide a server heat dissipation device, wherein the outlet of the first air guide channel of the server heat dissipation device is directed toward the network card, the outlet of the second air guide channel is directed toward the CPU radiator, and the third air guide channel is connected to the outside of the server chassis, and fans are provided in the air guide channels. A plurality of baffles are provided at the intersections between the air guide channels, and the baffles are used to control the direction of the wind. The method includes detecting the heat dissipation temperature of the heat dissipation air entering the second air guide channel, and based on the relationship between the heat dissipation temperature and a preset temperature threshold, controlling the working state of the fan and adjusting the opening and closing state of the baffle. The method sets three independent air guide channels and equips them with fans and adjustable baffles, and dynamically adjusts the fans and baffles in the channels in a targeted manner, thereby achieving directional heat dissipation of the network card, ensuring the heat dissipation requirements under high load and reducing energy consumption under low load.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a server heat dissipation method, device, and system. Background Art

[0002] As core data processing equipment, servers are experiencing continuous improvements in CPU (Central Processing Unit) and network interface card (NIC) performance, leading to a sharp increase in power consumption. This high power consumption causes the internal temperature of the server chassis to rise during operation, impacting stable operation. Fan cooling is currently a method for cooling servers, typically increasing fan speed based on the temperature of the chassis' air inlet and outlet and power consumption. In current fan cooling methods, the front-panel system fan directs CPU cooling air to the rear-panel network interface card (NIC) area, potentially hindering heat dissipation. Furthermore, if server power consumption is excessively high, the fan typically runs at full power, resulting in excessive noise. Even in this case, insufficient cooling can still cause the server to cease operation. Summary of the Invention

[0003] The present application provides a server heat dissipation method, device and system to at least solve the problem of insufficient heat dissipation inside the server in the related art.

[0004] The present application provides a server heat dissipation method, which is applied to a server heat dissipation system. The server heat dissipation system includes at least a first controller, a second controller, and a server heat dissipation device. The server heat dissipation device is communicatively connected to the first controller and the second controller respectively. The first controller is connected to the second controller. The outlet of a first air guide channel of the server heat dissipation device faces a network card, the outlet of a second air guide channel faces a CPU radiator, and a third air guide channel is connected to the outside of a server chassis. Fans are provided in the first air guide channel, the second air guide channel, and the third air guide channel. A plurality of baffles are provided at the intersection of the first air guide channel, the second air guide channel, and the third air guide channel. The baffles are used to control the direction of air flow. The method includes:

[0005] detecting a heat dissipation temperature of heat dissipation air entering the second air guide channel, the heat dissipation air being discharged by the CPU radiator;

[0006] Based on the relationship between the heat dissipation temperature and a preset temperature threshold, the working state of the fan is controlled, and the opening and closing state of the baffle is adjusted.

[0007] The present application also provides a server heat dissipation device, comprising: a server heat dissipation device connected to the first controller and the second controller respectively, the outlet of the first air guide channel of the server heat dissipation device faces the network card, the outlet of the second air guide channel faces the CPU radiator, and the first air guide channel and the second air guide channel are respectively provided with a first fan and a second fan, the third air guide channel is connected to the outside of the server chassis, the third air guide channel is provided with a third fan, the third fan is an air inlet and outlet fan, a plurality of baffles are provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel, the baffles are used to control the direction of wind, the baffles include a first baffle, a second baffle and a third baffle, the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, and the third baffle is provided on the side walls of the second air guide channel and the third air guide channel.

[0008] The present application also provides a server cooling system, which is used to execute any of the above-mentioned server cooling methods, including:

[0009] a first controller connected to the server heat dissipation device, and configured to obtain a heat dissipation temperature of the heat dissipation air;

[0010] a second controller, the second controller being communicatively connected to the first controller;

[0011] A server heat dissipation device is communicatively connected to the first controller and the second controller respectively.

[0012] The server cooling method provided in this embodiment is applied to a server cooling system. The cooling system includes at least a first controller, a second controller, and a server cooling device. The server cooling device is communicatively connected to the first and second controllers, respectively. The first controller is connected to the second controller. The outlet of the first air guide channel of the server cooling device is directed toward the network interface card (NIC), the outlet of the second air guide channel is directed toward the CPU heat sink, and the third air guide channel is connected to the exterior of the server chassis. Fans are provided in each of the first, second, and third air guide channels. Multiple baffles are provided at the intersection of the first, second, and third air guide channels to control the direction of air flow. The method includes detecting the heat dissipation temperature of the cooling air entering the second air guide channel and, based on the relationship between the heat dissipation temperature and a preset temperature threshold, controlling the operating state of the fan and adjusting the opening and closing state of the baffle. The server cooling device of this method is provided with three independent air guide channels and equipped with fans and adjustable baffles. By comparing the heat dissipation temperature with the preset temperature threshold, the fans and baffles in the channels are dynamically adjusted in a targeted manner, thereby achieving directional cooling of the network interface card, ensuring heat dissipation requirements under high load while reducing energy consumption under low load. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0014] Figure 1 A schematic diagram of a server heat dissipation device provided in an embodiment of the present application;

[0015] Figure 2 A schematic diagram of the structure of the server heat dissipation method provided in an embodiment of the present application;

[0016] Figure 3 A topological diagram of the server heat dissipation circuit system provided in an embodiment of the present application;

[0017] Figure 4 A flow chart of a server heat dissipation method provided in an embodiment of the present application;

[0018] Figure 5 A schematic diagram of a controller provided in an embodiment of the present application. DETAILED DESCRIPTION

[0019] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0021] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0022] In conjunction with the specific application environment architecture or specific hardware architecture on which the execution of the server heat dissipation method depends, the specific application environment architecture or specific hardware architecture is described herein.

[0023] The present invention provides a server heat dissipation device, which is connected to a first controller, an outlet of a first air guide channel of the server heat dissipation device faces a network card, an outlet of a second air guide channel faces a CPU radiator, and a first fan and a second fan are respectively provided in the first air guide channel and the second air guide channel, a third air guide channel is connected to the outside of a server chassis, a third fan is provided in the third air guide channel, and the third fan is an air inlet and outlet fan, a plurality of baffles are provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel, the baffles are used to control the direction of wind, and the baffles include a first baffle, a second baffle and a third baffle, the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, and the third baffle is provided on the side walls of the second air guide channel and the third air guide channel.

[0024] The server heat dissipation device provided by the embodiment of the present invention is as follows Figure 1 As shown, Figure 2 As shown, the server heat dissipation device is installed between the network card and the CPU in the server chassis. The front window is located at the fan. The fan wind flows from the front window to the rear window and flows to the CPU through a separate air guide channel. The cooling air discharged from the CPU radiator flows through the server heat dissipation device to the server rear window (i.e., the network card position) or is discharged upward from the server chassis.

[0025] Specifically, if Figure 1 As shown, the server heat dissipation device has three air guide channels, wherein the outlet of the first air guide channel is toward the network card, the outlet of the second air guide channel is toward the CPU heat sink, and the third air guide channel is connected to the outside of the chassis. In some optional embodiments, the first fan and the second fan are air inlet fans, and the third fan is an air inlet and outlet fan. The first fan and the second fan are respectively provided in the first air guide channel and the second air guide channel, both of which are air inlet fans. A third fan is provided in the third air guide channel, and the third fan is an air inlet and outlet fan. The wind direction of the third fan can be adjusted by adjusting the operating mode of the third fan according to actual conditions.

[0026] In some optional embodiments, the first fan and the third fan are both air inlet and outlet fans, and the second fan is an air inlet fan.

[0027] In some optional embodiments, a porous adsorption structure is provided between the first fan and the first and second baffles of the first air guide channel, and a humidity sensor is provided on the porous adsorption structure. A temperature sensor is provided at the entrance of the second air guide channel to detect the temperature of the cooling air discharged from the CPU heat sink. The porous adsorption structure can be honeycomb briquettes.

[0028] In some optional embodiments, an air guide hole is provided at the position of the humidity sensor, that is, at the side wall of the first air guide channel.

[0029] A baffle fixing device is provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel of the server heat dissipation device. Taking the first baffle as an example, the first baffle is adjusted to a closed state by controlling the connection between the first baffle and the baffle fixing device.

[0030] The present invention provides a server cooling system, comprising: a first controller, a second controller, and a server cooling device. The first controller is connected to the server cooling device and is configured to obtain the cooling temperature of cooling air; the second controller is communicatively connected to the first controller; and the server cooling device is communicatively connected to the first and second controllers, respectively. The first controller may be a BMC (Baseboard Management Controller), and the second controller may be a CPLD (Complex Programmable Logic Device). Figure 3 This is a topology diagram of the server cooling circuit system provided by an embodiment of the present invention, which includes a CPLD, a BMC, a temperature sensor, a humidity sensor, a windshield, fans, a power connector (PWR Connect), and a voltage conversion module. The windshield includes first, second, and third baffles, and the fans include first, second, and third fans. The first fan is the air inlet fan, the second fan is the air inlet fan, and the third fan is the air inlet and outlet fan.

[0031] The BMC is used to obtain the temperature and power consumption of various points on the server, communicate with the CPLD, and send the detected temperature and power consumption data to the CPLD, which then implements logical control of the server's cooling system. The power connector is used to connect the power supply module, and the voltage conversion module is used to convert different voltages to power the relevant chips. The baffle is used to control the direction of the air flow, and the fan is used to control the direction of the cooling air flow and dissipate heat. The temperature sensor is used to monitor the temperature of the air after it passes through the CPU heat sink, and the humidity sensor is used to monitor the humidity of the air flowing into the chassis to prevent problems such as short circuits caused by excessive humidity.

[0032] According to an embodiment of the present invention, an embodiment of a server heat dissipation method is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0033] In this embodiment, a server heat dissipation method is provided, which is applied to a server heat dissipation system. The heat dissipation system includes at least a first controller, a second controller and a server heat dissipation device. The server heat dissipation device is communicatively connected to the first controller and the second controller respectively. The first controller is connected to the second controller. The outlet of the first air guide channel of the server heat dissipation device is toward the network card, the outlet of the second air guide channel is toward the CPU radiator, and the third air guide channel is connected to the outside of the server chassis. Fans are provided in the first air guide channel, the second air guide channel and the third air guide channel. Multiple baffles are provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel, and the baffles are used to control the direction of wind flow.

[0034] Figure 4 FIG. 1 is a flow chart of a server heat dissipation method according to an embodiment of the present invention. Figure 4 As shown, the process includes the following steps:

[0035] Step S101: detecting the heat dissipation temperature of the heat dissipation air entering the second air guiding channel.

[0036] The cooling air is exhausted by the CPU cooler. The CPU generates a large amount of heat during operation, which is absorbed by the CPU cooler and then removed by the cooling air blown out by the fan on the front window of the server chassis. The cooling air is generated after heat exchange within the CPU cooler.

[0037] The server cooling system is located between the CPU cooler and the network card. The second air duct is a specific path in the cooling system that guides the cooling air. Cooling air from the CPU cooler enters the server cooling system through the second air duct. A temperature sensor is located at the entrance of the second air duct. When the cooling air from the CPU cooler enters the server cooling system through the second air duct, the temperature sensor at the entrance detects the cooling air's temperature.

[0038] Step S102 : Based on the relationship between the heat dissipation temperature and the preset temperature threshold, the working state of the fan is controlled, and the opening and closing state of the baffle is adjusted.

[0039] The preset temperature threshold is determined based on factors such as the server's cooling requirements, the heat tolerance of internal components (such as network cards), and the design objectives of the cooling system. The preset temperature threshold may include one or more temperature thresholds. After the first controller detects the cooling air temperature using a temperature sensor, it sends the temperature data to the second controller, which then performs logical control.

[0040] The heat dissipation temperature is compared with a preset temperature threshold, and the corresponding control method is executed based on the heat dissipation temperature range. The control method includes controlling the airflow direction of the fan. The fan can be an inlet fan or an outlet fan. The inlet fan is used to draw outside air into the server heat dissipation device, and the outlet fan is used to exhaust internal air. The baffle is used to guide airflow and adjust airflow distribution. By adjusting the opening and closing of the baffle, the flow path and flow distribution of the cooling air can be changed.

[0041] If the temperature of the cooling air is high, you can close the baffles in some positions and open the baffles in specific positions, and combine them with fans in specific positions to allow more cooling air to enter the area that needs heat dissipation, or directly discharge the cooling air out of the chassis.

[0042] If the temperature of the cooling air is low, you can appropriately close some baffles or adjust the opening and closing angles of the baffles, and combine them with fans in specific positions to reduce the flow of cooling air in certain areas to optimize the overall performance and energy consumption of the cooling system.

[0043] The server cooling method provided in this embodiment is applied to a server cooling system. The cooling system includes at least a first controller, a second controller, and a server cooling device. The server cooling device is communicatively connected to the first and second controllers, respectively. The first controller is connected to the second controller. The outlet of the first air guide channel of the server cooling device is directed toward the network interface card (NIC), the outlet of the second air guide channel is directed toward the CPU heat sink, and the third air guide channel is connected to the exterior of the server chassis. Fans are provided in each of the first, second, and third air guide channels. Multiple baffles are provided at the intersection of the first, second, and third air guide channels to control the direction of air flow. The method includes detecting the heat dissipation temperature of the cooling air entering the second air guide channel and, based on the relationship between the heat dissipation temperature and a preset temperature threshold, controlling the operating state of the fan and adjusting the opening and closing state of the baffle. The server cooling device of this method is provided with three independent air guide channels and equipped with fans and adjustable baffles. By comparing the heat dissipation temperature with the preset temperature threshold, the fans and baffles in the channels are dynamically adjusted in a targeted manner, thereby achieving directional cooling of the network interface card, ensuring heat dissipation requirements under high load while reducing energy consumption under low load.

[0044] In this embodiment, a server heat dissipation method is provided, which includes the following steps:

[0045] Step S201: detecting the heat dissipation temperature of the heat dissipation air entering the second air guiding channel.

[0046] For details, please see Figure 4 Step S101 of the illustrated embodiment will not be described in detail here.

[0047] Step S202 : Based on the relationship between the heat dissipation temperature and the preset temperature threshold, the working state of the fan is controlled, and the opening and closing state of the baffle is adjusted.

[0048] In some optional embodiments, the preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold is less than the second temperature threshold, the baffle includes a first baffle, a second baffle, and a third baffle, the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, the third baffle is provided on the side walls of the second air guide channel and the third air guide channel, and the fan includes a first fan, a second fan, and a third fan. As an example, the first temperature threshold is 46°C and the second temperature threshold is 65°C. Specifically, step S202 includes:

[0049] Step S2021: If the heat dissipation temperature is lower than the first temperature threshold, the first fan and the second fan are controlled to start, and the third fan is controlled to stop.

[0050] Among them, the first fan and the second fan are air inlet fans, the first fan is arranged in the first air guide channel, the second fan is arranged in the second air guide channel, and the third fan is arranged in the third air guide channel.

[0051] The heat dissipation temperature is compared with a first temperature threshold. If the heat dissipation temperature is less than the first temperature threshold, a start command is issued to the first fan and the second fan, and a shutdown command is issued to the third fan. The first fan and the second fan start running after receiving the start command, and the third fan stops running after receiving the shutdown command.

[0052] Step S2022: adjust the second baffle to an open state, and adjust the first baffle and the third baffle to a closed state.

[0053] When the second baffle is open and the first and third baffles are closed, cooling air flows from the second air duct to the first air duct. Because the first and third baffles are closed, air does not flow between the first and third air ducts, nor between the second and third air ducts. Driven by the second fan, cooling air entering from the second air duct passes through the second baffle and flows into the first air duct. Accelerated by the first fan in the first air duct, it continues toward the outlet of the first air duct. The cooling air flowing out of the first air duct can be used to dissipate heat for devices such as the network interface card on the rear window of the server chassis.

[0054] In an embodiment of the present invention, when the heat dissipation temperature is low, the fan and the baffle are controlled to control the flow path of the heat dissipation air so that the air is directed to the area where heat dissipation is required, thereby improving the heat dissipation efficiency and ensuring that the network card is cooled with a reasonable air path when the heat dissipation temperature is low.

[0055] In some optional embodiments, the third fan is an air inlet and outlet fan. Specifically, step S202 includes:

[0056] Step S2023: If the heat dissipation temperature is greater than or equal to the first temperature threshold and the heat dissipation temperature is less than or equal to the second temperature threshold, the first fan and the second fan are controlled to start, and the third fan is adjusted to be an air inlet fan.

[0057] The heat dissipation temperature is compared with the first temperature threshold and the second temperature threshold. If the heat dissipation temperature is greater than or equal to the first temperature threshold and less than or equal to the second temperature threshold, a start instruction is sent to the first fan, the second fan and the third fan, and a control signal is sent to the third fan to adjust the third fan to an air inlet fan, thereby adjusting the third fan to an air inlet fan.

[0058] Step S2024: adjust the first baffle and the second baffle to an open state, and adjust the third baffle to a closed state.

[0059] When the first baffle and the second baffle are in the open state, the heat dissipation air flows from the second air guide channel to the first air guide channel, and the external air flows from the third air guide channel to the first air guide channel.

[0060] The cooling air entering the server heat sink from the second air duct is guided by the second fan, passes through the second baffle, and enters the first air duct. Simultaneously, external air (i.e., air outside the server chassis) is guided by the third fan's inlet, enters the third air duct, and passes through the first baffle before entering the first air duct. The external air and cooling air mix in the first air duct and, guided by the first fan, continue toward the outlet of the first air duct. The cooling air exiting the first air duct is used to dissipate heat for devices such as the network interface card (NIC) on the rear window of the server chassis.

[0061] Furthermore, a porous adsorption structure is provided between the first fan and the first and second baffles of the first air guide channel, and a humidity sensor is provided on the porous adsorption structure. The method further includes: detecting the humidity of the mixed air using the humidity sensor, and adsorbing the mixed air using the porous adsorption structure. The mixed air is obtained by mixing the heat dissipation air and the external air.

[0062] The porous adsorption structure can utilize adsorption honeycomb pores, which are rich in pores and provide a large surface area, facilitating the adsorption of certain substances in the air. A humidity sensor is installed at the porous adsorption structure, capable of detecting the humidity of the air passing through it in real time and transmitting the detected humidity data to the control system. When external air is drawn into the first air duct, it mixes with the cooling air within the first air duct to form a mixed airflow. The temperature, humidity, and composition of the mixed airflow are affected by the respective characteristics of the cooling airflow and the external airflow. The porous adsorption structure adsorbs the mixed airflow, reducing its humidity and thoroughly mixing it for cooling. The humidity of the mixed airflow is then detected by the humidity sensor, converted into an electrical signal, and transmitted to the control system. The control system analyzes the received humidity data within a preset humidity range to determine whether the current mixed airflow meets the required humidity. If not, further adjustments can be made to the fan and baffle to prevent damage to components within the chassis caused by the excessively humid mixed airflow.

[0063] In some optional embodiments, the third fan is an air inlet and outlet fan, and step S202 includes:

[0064] Step S2025: If the heat dissipation temperature is greater than the second temperature threshold, the first fan is controlled to be turned off and the second fan is controlled to be turned on, and the third fan is adjusted to be an outlet fan.

[0065] The heat dissipation temperature is compared with a second temperature threshold. If the heat dissipation temperature exceeds the second temperature threshold, indicating that the current heat dissipation temperature is too high, a shutdown command is issued to the first fan, and startup commands are issued to the second and third fans. Upon receiving the shutdown command, the first fan stops operating, while upon receiving the startup command, the second and third fans start operating. A control command is issued to the third fan, switching it to the outlet fan.

[0066] Step S2026: adjust the first baffle and the second baffle to a closed state, and adjust the third baffle to an open state.

[0067] When the first and second baffles are closed and the third baffle is open, cooling air flows from the second air duct to the third air duct. With the first and second baffles closed and the third baffle open, cooling air, guided by the second fan, flows through the third baffle to the third air duct, and then is discharged outside the chassis along the third air duct, guided by the third fan acting as the outlet fan. Simultaneously, the system fan speed can be increased to increase the amount of exhausted hot air.

[0068] Since the current heat dissipation air temperature is relatively high, in order to prevent the network card and other components from being in a high temperature state due to the high temperature, the heat dissipation air is discharged from the chassis under the air guiding effect of the second and third fans.

[0069] In some optional embodiments, the preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold is less than the second temperature threshold, the baffle includes a first baffle, a second baffle, and a third baffle, the first baffle is provided on the side walls of the first air guiding channel and the third air guiding channel, the second baffle is provided on the side walls of the first air guiding channel and the second air guiding channel, the third baffle is provided on the side walls of the second air guiding channel and the third air guiding channel, the fan includes a first fan, a second fan, and a third fan, the first fan and the third fan are air inlet and outlet fans, the second fan is an air inlet fan, and the side wall of the first air guiding channel is provided with an air guide hole, and step S102 includes:

[0070] If the heat dissipation temperature exceeds the second temperature threshold, the second fan is activated, and the first and third fans are adjusted to be outlet fans. The first and second baffles are closed, and the third baffle is opened. The first fan is located in the first air guide channel, the second fan is located in the second air guide channel, and the third fan is located in the third air guide channel. When the first and second baffles are closed and the third baffle is opened, the heat dissipation air flows from the second air guide channel to the third air guide channel.

[0071] In this embodiment, both the first and third fans are inlet and outlet fans. If the heat dissipation temperature exceeds the second temperature threshold, indicating that the current heat dissipation temperature is high, the first and third fans are adjusted to be outlet fans. The heat dissipation air, driven by the second fan, passes through the third baffle and is guided out of the chassis by the third fan, thus preventing high temperatures in devices such as the rear window network card. The first fan accelerates the heat dissipation air from the rear window of the chassis and outputs it to the rear window, thereby improving heat dissipation performance and simultaneously increasing the speed of the control system fan to replenish the exhaust heat.

[0072] If the heat dissipation temperature is less than or equal to the second temperature threshold, the first fan is adjusted to the air inlet fan, the third fan is turned off, the second baffle is adjusted to the open state, and the first baffle and the third baffle are adjusted to the closed state. When the second baffle is in the open state and the first baffle and the third baffle are in the closed state, the heat dissipation air flows from the second air guide channel to the first air guide channel.

[0073] Through the description of the above implementation methods, those skilled in the art can clearly understand that the method according to the above embodiment can be implemented by means of software plus the necessary general hardware platform, and of course it can also be implemented by hardware, but in many cases the former is a better implementation method.

[0074] The embodiment of the present application also provides a controller, such as Figure 5As shown, the system includes a memory 10 and a processor 20. The memory 10 stores a computer program, and the processor 20 is configured to execute the computer program to perform the steps of any of the above-mentioned server cooling method embodiments. The various components are interconnected using different buses and can be mounted on a common motherboard or installed in other ways as needed. The processor can process instructions executed within the computer device, including instructions stored in or on the memory for displaying graphical information of a GUI on an external input / output device (such as a display device coupled to an interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used with multiple memories and multiple storage devices. Similarly, multiple computer devices can be connected, with each device providing some of the necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). The processor 20 can be a central processing unit, a network processor, or a combination thereof. The processor 20 can further include a hardware chip. The hardware chip can be an application-specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device can be a complex programmable logic device, a field programmable gate array, a general purpose array logic, or any combination thereof.

[0075] The memory 10 stores instructions that can be executed by at least one processor 20, so that the at least one processor 20 executes the method shown in the above embodiment.

[0076] The memory 10 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; the data storage area may store data created based on the use of the computer device, etc. In addition, the memory 10 may include a high-speed random access memory and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 10 may optionally include a memory remotely located relative to the processor 20, and these remote memories may be connected to the computer device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0077] The memory 10 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid-state drive; the memory 10 may also include a combination of the above types of memory.

[0078] An embodiment of the present application further provides a computer-readable storage medium, in which a computer program is stored. The computer program is configured to execute the steps of any of the above-mentioned server heat dissipation method embodiments when running.

[0079] In an exemplary embodiment, the computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), a removable hard drive, a magnetic disk, or an optical disk. The methods according to the embodiments of the present invention described above may be implemented in hardware, firmware, or as computer code that can be recorded on a storage medium, or downloaded over a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein may be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium may be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid-state drive; further, the storage medium may include a combination of the aforementioned types of memory. It is understood that a computer, processor, microprocessor controller, or programmable hardware includes a storage component capable of storing or receiving software or computer code. When the software or computer code is accessed and executed by the computer, processor, or hardware, the methods described in the embodiments described above are implemented.

[0080] An embodiment of the present application further provides a computer program product, which includes a computer program. When the computer program is executed by a processor, the steps of any of the above-mentioned server heat dissipation method embodiments are implemented.

[0081] An embodiment of the present application further provides another computer program product, including a non-volatile computer-readable storage medium, wherein the non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of any of the above-mentioned server heat dissipation method embodiments are implemented.

[0082] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0083] The above is a detailed introduction to a server heat dissipation method, device, and system provided by the present application. This article uses specific examples to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server heat dissipation method, characterized in that: The server heat dissipation system is applied to a server heat dissipation system, the server heat dissipation system at least includes a first controller, a second controller and a server heat dissipation device, the server heat dissipation device is communicatively connected to the first controller and the second controller respectively, the first controller is connected to the second controller, the outlet of the first air guide channel of the server heat dissipation device is toward the network card, the outlet of the second air guide channel is toward the CPU radiator, the third air guide channel is connected to the outside of the server chassis, and fans are provided in the first air guide channel, the second air guide channel and the third air guide channel. A plurality of baffles are provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel, the baffles are used to control the direction of air flow, the baffles include a first baffle, a second baffle and a third baffle, the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, the third baffle is provided on the side walls of the second air guide channel and the third air guide channel, the fans include a first fan, a second fan and a third fan, the third fan is an air inlet and outlet fan, and the method includes: detecting a heat dissipation temperature of heat dissipation air entering the second air guide channel, the heat dissipation air being discharged by the CPU radiator; Based on the relationship between the heat dissipation temperature and a preset temperature threshold, controlling the working state of the fan and adjusting the opening and closing state of the baffle, including: if the heat dissipation temperature is greater than a second temperature threshold, controlling the first fan to be turned off and the second fan to be turned on, and adjusting the third fan to be an outlet fan; Adjust the first baffle and the second baffle to a closed state, and adjust the third baffle to an open state. When the first baffle and the second baffle are in a closed state and the third baffle is in an open state, the heat dissipation wind flows from the second air guide channel to the third air guide channel.

2. The method according to claim 1, characterized in that The preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold is less than the second temperature threshold, and controlling the working state of the fan and adjusting the opening and closing state of the baffle based on the relationship between the heat dissipation temperature and the preset temperature threshold includes: If the heat dissipation temperature is lower than the first temperature threshold, the first fan and the second fan are controlled to start, and the third fan is controlled to stop, the first fan and the second fan are air inlet fans, the first fan is arranged in the first air guide channel, the second fan is arranged in the second air guide channel, and the third fan is arranged in the third air guide channel; Adjust the second baffle to an open state, and adjust the first baffle and the third baffle to a closed state. When the second baffle is open and the first baffle and the third baffle are closed, the heat dissipation wind flows from the second air guide channel to the first air guide channel.

3. The method according to claim 2, characterized in that The method of controlling the working state of the fan and adjusting the opening and closing state of the baffle based on the relationship between the heat dissipation temperature and the preset temperature threshold further includes: If the heat dissipation temperature is greater than or equal to a first temperature threshold and the heat dissipation temperature is less than or equal to a second temperature threshold, controlling the first fan and the second fan to start, and adjusting the third fan to be an air inlet fan; Adjust the first baffle and the second baffle to an open state, and adjust the third baffle to a closed state. When the first baffle and the second baffle are in an open state, the heat dissipation air flows from the second air guide channel to the first air guide channel, and the external air flows from the third air guide channel to the first air guide channel.

4. The method according to claim 3, characterized in that A porous adsorption structure is provided between the first fan of the first air guide channel and the first baffle and the second baffle, and a humidity sensor is provided on the porous adsorption structure; the method further includes: The humidity of the mixed air is detected based on the humidity sensor, and the mixed air is adsorbed based on the porous adsorption structure. The mixed air is obtained by mixing the heat dissipation air and the external air.

5. The method according to claim 1, wherein The preset temperature threshold includes a first temperature threshold and a second temperature threshold, the first temperature threshold is less than the second temperature threshold, the baffle includes a first baffle, a second baffle and a third baffle, the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, and the third baffle is provided on the side walls of the second air guide channel and the third air guide channel, the fan includes a first fan, a second fan and a third fan, the first fan and the third fan are air inlet and outlet fans, the second fan is an air inlet fan, and the side wall of the first air guide channel is provided with an air guide hole, and the controlling the working state of the fan and adjusting the opening and closing state of the baffle based on the relationship between the heat dissipation temperature and the preset temperature threshold includes: If the heat dissipation temperature is greater than a second temperature threshold, the second fan is controlled to start, and the first fan and the third fan are adjusted to be air outlet fans, the first fan is arranged in the first air guide channel, the second fan is arranged in the second air guide channel, and the third fan is arranged in the third air guide channel; Adjust the first baffle and the second baffle to a closed state and the third baffle to an open state. When the first baffle and the second baffle are in a closed state and the third baffle is in an open state, the heat dissipation wind flows from the second air guide channel to the third air guide channel.

6. A server heat dissipation device, characterized in that: The server heat dissipation device is connected to the first controller and the second controller respectively, the outlet of the first air guide channel of the server heat dissipation device is toward the network card, the outlet of the second air guide channel is toward the CPU radiator, the third air guide channel is connected to the outside of the server chassis, and fans are provided in the first air guide channel, the second air guide channel and the third air guide channel, and multiple baffles are provided at the intersection of the first air guide channel, the second air guide channel and the third air guide channel, and the baffles are used to control the direction of wind flow; the first air guide channel and the second air guide channel are respectively provided with a first fan and a second fan, and the third air guide channel is provided with a third fan; the baffles include a first baffle, a second baffle and a third baffle; the first fan and the second fan are air inlet fans, and the third fan is an air inlet and outlet fan; the first baffle is provided on the side walls of the first air guide channel and the third air guide channel, the second baffle is provided on the side walls of the first air guide channel and the second air guide channel, and the third baffle is provided on the side walls of the second air guide channel and the third air guide channel.

7. The device according to claim 6, characterized in that A porous adsorption structure is provided between the first fan of the first air guide channel and the first baffle and the second baffle, and a humidity sensor is provided at the porous adsorption structure; a temperature sensor is provided at the entrance of the second air guide channel for detecting the temperature of the cooling air discharged from the CPU radiator.

8. A server cooling system, characterized in that: The server cooling system is used to execute the server cooling method according to any one of claims 1 to 5, comprising: a first controller connected to the server heat dissipation device, and configured to obtain a heat dissipation temperature of the heat dissipation air; a second controller, the second controller being communicatively connected to the first controller; A server heat dissipation device, the server heat dissipation device being communicatively connected to the first controller and the second controller respectively, comprising: if the heat dissipation temperature is greater than a second temperature threshold, controlling the first fan to be turned off and the second fan to be turned on, and adjusting the third fan to be an air outlet fan; Adjust the first baffle and the second baffle to a closed state, and adjust the third baffle to an open state. When the first baffle and the second baffle are closed and the third baffle is open, the heat dissipation air flows from the second air guide channel to the third air guide channel.

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