Server CPU Test and Verification Platform

Abstract

The present application discloses a server central processing unit test and verification platform, which relates to the field of server technology and includes an open framework, a computing module, a management module, a heat dissipation module and an extension module; the computing module and the management module are arranged on the first layer of the open framework; the extension module is arranged on the second layer of the open framework; the computing module is used to perform test and verification tasks on the server central processing unit; the management module is used to manage and control the computing module and the heat dissipation module; the heat dissipation module is used to dissipate heat for the computing module, the management module and the extension module; the extension module is used to connect auxiliary test equipment; the auxiliary test equipment has an interface electrically connected to the server central processing unit to realize test and verification of the interface function of the server central processing unit. Through modular design and open architecture, the technical problem of limited applicable scenarios is solved, and the technical effect of improving the flexibility of hardware selection and being applicable to more test and verification scenarios is achieved.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a server central processing unit testing and verification platform. Background Art

[0002] In the early stages of hardware development, engineering validation can be used to verify that the server's central processing unit (CPU) meets design requirements. Currently, testing and validation platforms are typically built based on the server's CPU, hard drive, and motherboards. This approach is inflexible, limited in scope, and typically single-use. Summary of the Invention

[0003] The present application provides a server central processing unit test and verification platform to at least solve the problem of limited applicable scenarios of the server central processing unit test and verification platform in the related art.

[0004] This application provides a server central processing unit test and verification platform, including: an open framework, a computing module, a management module, a heat dissipation module and an expansion module;

[0005] The computing module and the management module are arranged on the first layer of the open frame; the expansion module is arranged on the second layer of the open frame; the computing module is electrically connected to the management module and the expansion module respectively; the heat dissipation module is electrically connected to the management module;

[0006] The computing module is used to perform test and verification tasks on the server central processing unit;

[0007] The management module is used to manage and control the computing module and the heat dissipation module;

[0008] The heat dissipation module is used to dissipate heat for the computing module, the management module, and the expansion module;

[0009] The extension module is used to connect to an auxiliary test device; the auxiliary test device has an interface electrically connected to the server central processing unit to implement test verification of the interface function of the server central processing unit.

[0010] Through this application, since the server central processing unit test and verification platform includes a decoupled computing module, management module, heat dissipation module and expansion module, etc., each functional module is connected through a standardized interface, and the computing module, management module, heat dissipation module and expansion module are all set on an open framework. Under the premise of being able to perform hardware function verification, performance testing and stability testing on the server central processing unit, the direct dependencies between the functional modules are isolated, allowing each functional module to be independently developed, tested and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in a single functional module. It is only necessary to replace the computing module to test and verify the server central processing units of different models. Now one machine can be used for multiple purposes, which can improve resource utilization and reduce platform development costs and test and verification costs. By utilizing the larger and more flexible installation space provided by the open architecture based on the open framework, it can realize the free combination of hardware layouts such as functional modules. When upgrading or adjusting components, it is not restricted by the size of the traditional chassis. It can be compatible with non-standard hardware such as overlong and / or oversized hardware, and can avoid hardware conflicts and inability to test due to insufficient installation space. Therefore, it can solve the technical problem of the limited application scenarios of the server central processing unit test and verification platform, and achieve the technical effect of ensuring hardware compatibility, improving hardware selection flexibility, and thus being applicable to more test and verification scenarios. In addition, by adopting an open structure, breaking the closed structure of the traditional chassis, the heat dissipation efficiency is significantly improved through natural air convection, and it has more excellent heat dissipation performance. It can achieve stable temperature control of the server central processing unit in high-load test scenarios, and can perform more test items and stronger testing capabilities in high-load test scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] Figure 1 This is one of the structural diagrams of a server central processing unit test and verification platform provided in an embodiment of the present application;

[0013] Figure 2 This is a second structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application;

[0014] Figure 3 This is a third structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application;

[0015] Figure 4A schematic diagram of the structure of an adapter card module in a server central processing unit test and verification platform provided in an embodiment of the present application;

[0016] Figure 5 A schematic structural diagram of a first hard disk module in a server central processing unit test and verification platform provided in an embodiment of the present application;

[0017] Figure 6 This is a fourth structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application;

[0018] Figure 7 This is a fifth structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application;

[0019] Figure 8 A schematic diagram of the structure of a computing module in a server central processing unit test and verification platform provided in an embodiment of the present application;

[0020] Figure 9 A schematic diagram of the topological structure of a computing module and a management module in a server central processing unit test and verification platform provided in an embodiment of the present application;

[0021] Figure 10 A schematic diagram of the connection relationship of an open core protocol connector in a server central processing unit test and verification platform provided in an embodiment of the present application;

[0022] Figure 11 A schematic diagram of the structure of a computing module and a management module in a server central processing unit test and verification platform provided in an embodiment of the present application;

[0023] Figure 12 A schematic diagram of a heat dissipation module in a server central processing unit test and verification platform provided in an embodiment of the present application. DETAILED DESCRIPTION

[0024] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0025] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0026] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0027] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0028] The embodiments of the present application provide a server central processing unit test and verification platform, and the platform is described in detail in combination with the structure and working principle of the server central processing unit test and verification platform.

[0029] Specifically, Figure 1 This is one of the structural diagrams of a server central processing unit test and verification platform provided in an embodiment of the present application. Figure 2 This is a second structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application. Figure 3 This is a third structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application.

[0030] refer to Figure 1 、 Figure 2 and Figure 3 A server central processing unit test and verification platform may include: an open framework 110, a computing module 120, a management module 130, a heat dissipation module 140 and an expansion module 150.

[0031] In actual implementation, the server central processing unit test and verification platform provided in the embodiment of the present application is used to test the central processing unit (CPU) of the server to verify whether the design of the CPU meets the requirements.

[0032] The above tests belong to the engineering validation for CPU testing. Engineering validation is usually used in the early stages of hardware development to verify whether the developed hardware design meets the requirements.

[0033] The development of server CPUs primarily focuses on optimizing and improving artificial intelligence (AI) computing power, energy efficiency, and architecture. Liquid cooling and heterogeneous computing technologies can address the high-density computing demands of server CPUs. Regarding server CPU architecture, both the x86 and ARM architectures have their own advantages, and optimization efforts for both are ongoing.

[0034] The rapid development of technologies like artificial intelligence has placed higher demands on new computing infrastructure. Data centers, a typical example of computing infrastructure, are typically composed of a large number of servers. To meet the high demands of this new computing infrastructure, the computing power of each server CPU core plays a decisive role.

[0035] The server CPU is the "brain" of the server, responsible for data processing and instruction execution, which can include performing logical operations, instruction parsing, and data processing tasks. The server CPU's computing speed and cache capacity have a direct impact on the server's response speed and task execution efficiency. A high-performance server CPU can significantly improve processing capabilities in scenarios such as database queries and scientific computing, and reduce memory access latency. Therefore, the server CPU is not only a core component of the server, but also a key factor in determining the server's performance, functionality, and efficiency. A CPU with excellent performance, stability, reliability, and outstanding energy efficiency can provide the server with more efficient computing power, faster response speeds, and longer-term operational guarantees.

[0036] Whether it's a data center or an enterprise application, server CPU selection is a key component of design planning. Choosing the right CPU for your server design not only meets current needs but also provides a solid foundation for future expansion and optimization, enabling higher performance and a better user experience.

[0037] The server CPU test and verification platform may include: an open framework 110 and various functional modules, such as a computing module 120, a management module 130, a heat dissipation module 140, and an expansion module 150.

[0038] On the one hand, the server central processing unit test and verification platform provided in the embodiment of the present application adopts a decoupled modular design, and each functional module can be independently developed, tested and upgraded.

[0039] The computing module 120 is used to perform test and verification tasks on the server central processing unit;

[0040] The management module 130 is used to manage and control the computing module 120 and the heat dissipation module 140;

[0041] The heat dissipation module 140 is used to dissipate heat for the computing module 120 , the management module 130 , and the expansion module 150 ;

[0042] Extension module 150, for connecting to auxiliary test equipment; the auxiliary test equipment has an interface electrically connected to the server central processing unit to implement test verification of the interface function of the server central processing unit;

[0043] The computing module 120 is electrically connected to the management module 130 and the expansion module 150 respectively; the heat dissipation module 140 is electrically connected to the management module 130 .

[0044] In some embodiments, the computing module 120 may be specifically responsible for executing the test and verification task on the server central processing unit.

[0045] In an embodiment of the present application, the test and verification content of the server central processing unit may include but is not limited to at least one of the following categories: basic function verification, firmware and system compatibility testing, performance testing, memory bandwidth testing, stability and stress testing, and energy efficiency and temperature testing, etc.

[0046] Basic function verification is a fundamental function test that ensures the server CPU hardware parameters are correct. In some embodiments, basic function verification may include verifying CPU information. This information may include, but is not limited to, at least one of the following: the number of cores (referred to as "core count"), the number of threads (referred to as "thread count"), and the frequency of the CPU.

[0047] Firmware and system compatibility testing ensures the correct firmware version and settings, as well as basic system functionality such as time and memory usage. In some embodiments, firmware and system compatibility testing may include, but is not limited to, at least one of the following: Basic Input Output System (BIOS) testing and Baseboard Management Controller (BMC) testing.

[0048] The performance test may include testing at least one of the CPU's computing power, multi-threading performance, and database processing capabilities. In some embodiments, the server CPU may be performance tested using at least one of software tools such as Sysbench and Super PI.

[0049] Memory bandwidth testing can be used to verify the efficiency of interaction between the server CPU and memory, particularly when the server CPU is multi-core (meaning the server CPU has multiple cores). In some embodiments, memory bandwidth testing can be performed on the server CPU using software tools such as Stream.

[0050] Stability and stress testing is a long-term, high-load test. In some embodiments, at least one of software tools such as stressapptest (Stressful Application Test or Stressful App Test) and Sysbench can be used to fully load the server CPU to check the server CPU's heat dissipation performance and stability.

[0051] Energy efficiency and temperature testing can include dynamic frequency adjustment and temperature monitoring under high load to ensure that the server CPU cooling solution is effective.

[0052] In some embodiments, the management module 130 can manage and control the server CPU test and verification platform. Specifically, the management module 130 can manage and control the computing module 120 and the heat dissipation module 140 in the server CPU test and verification platform.

[0053] In some embodiments, the role and achievable functions of the management module 130 in the server central processing unit test and verification platform may be equivalent to those of the BMC in the server.

[0054] In some embodiments, the function of the heat dissipation module 140 is to dissipate heat, and by dissipating heat for the computing module 120 , the management module 130 and the expansion module 150 , the purpose of cooling the computing module 120 , the management module 130 and the expansion module 150 is achieved.

[0055] In some embodiments, the heat dissipation module 140 may adopt any structure with air cooling or water cooling function. The specific structure of the heat dissipation module 140 is not limited in the embodiment of the present application.

[0056] In some embodiments, in addition to the aforementioned test and verification content, the computing module 120 can also perform test and verification on the interface function of the server CPU through the cooperation of the expansion module 150.

[0057] In some embodiments, the expansion module 150 can be used to electrically connect the server CPU to auxiliary test equipment. In some embodiments, the auxiliary test equipment can include at least one of a hard disk and a high-speed peripheral component interconnect (PCIe) device.

[0058] In some embodiments, the functional modules are connected via standardized interfaces. Specifically, the management module 130 can be electrically connected to the computing module 120 and the heat dissipation module 140 via a standardized interface such as the Intelligent Platform Management Interface (IPMI). The computing module 120 can be electrically connected to the expansion module 150 via a standardized interface such as the PCIe interface.

[0059] On the other hand, the server CPU test and verification platform provided by the embodiment of the present application adopts an open chassis architecture. Each functional module included in the server CPU test and verification platform is arranged on an open chassis 110 .

[0060] In some embodiments, the open framework 110 may include two layers, wherein the computing module 120 and the management module 130 are disposed in the first layer of the open framework 110 , and the expansion module 150 is disposed in the second layer of the open framework 110 .

[0061] In some embodiments, the first layer of the open frame 110 may be a bottom layer, and the second layer of the open frame 110 may be an upper layer above the bottom layer.

[0062] In some embodiments, the first layer of the open frame 110 may include a tray 111 . The tray 111 may be used to carry the computing module 120 and the management module 130 .

[0063] In some embodiments, the second layer of the open frame 110 may include a base. The base may be used to support the expansion module 150. The area of ​​the base may be smaller than or equal to the area of ​​the tray 111.

[0064] In some embodiments, the open frame 110 may further include two parallel brackets. Each bracket may be rectangular or trapezoidal in shape. The first layer (e.g., tray 111) and the second layer (e.g., base) of the open frame 110 may be perpendicular to and connect the two brackets, thereby allowing the first and second layers of the open frame 110 to be parallel and spaced a certain distance apart.

[0065] In some embodiments, the heat dissipation module 140 can be flexibly set on the open frame 110. For example, the heat dissipation module 140 can be set on the first layer or the second layer of the open frame 110, or the heat dissipation module 140 can be set on both the first layer and the second layer of the open frame 110.

[0066] In some embodiments, the first layer of the open frame 110 may be provided with at least one handle 112. The handle 112 may be provided for a worker and / or a robot to grasp.

[0067] According to the server central processing unit test and verification platform provided by the embodiment of the present application, the computing module, management module, heat dissipation module and expansion module of the decoupled design are included, and each functional module is connected through a standardized interface, and the computing module, management module, heat dissipation module and expansion module are all arranged on an open framework. Under the premise of being able to perform hardware function verification, performance testing and stability testing on the server central processing unit, the direct dependencies between the functional modules are isolated, and each functional module can be independently developed, tested and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in a single functional module. It is only necessary to replace the computing module to test and verify the server central processing unit of different models. This system can achieve multiple uses for a single machine, improve resource utilization, and reduce platform development and testing costs. Furthermore, by utilizing the larger and more flexible installation space provided by an open architecture based on an open framework, it can freely match hardware layouts such as functional modules. Upgrading or adjusting components is not restricted by traditional chassis dimensions, and it is compatible with non-standard hardware such as overlong and / or oversized components. This can avoid hardware conflicts and test failures caused by insufficient installation space. Therefore, it can resolve the technical issue of the limited applicable scenarios of server CPU test and verification platforms, ensuring hardware compatibility, increasing hardware selection flexibility, and thus being applicable to more testing and verification scenarios. Furthermore, by adopting an open structure, breaking the closed structure of traditional chassis, the system significantly improves heat dissipation efficiency through natural air convection, resulting in superior heat dissipation performance. This can achieve stable temperature control of the server CPU in high-load testing scenarios, enabling more test items and stronger testing capabilities in high-load testing scenarios.

[0068] In some embodiments of the present application, the expansion module 150 includes an adapter card module 151 ; the auxiliary test equipment connected to the adapter card module 151 includes a high-speed peripheral component interconnection device.

[0069] In actual implementation, the expansion module 150 may include an adapter card module 151. The adapter card (paddle card) may be used to transfer the PCIe interface. Accordingly, the auxiliary test device connected to the adapter card module 151 may include a PCIe device.

[0070] In some embodiments, the adapter card module 151 may also be provided with a plurality of first positioning holes. The second layer of the open frame 110 may be provided with the same number of second positioning holes as the adapter card module 151, and the positions of the second positioning holes correspond one-to-one to the positions of the first positioning holes. In some embodiments, the second positioning holes may be provided on the base. The adapter card module 151 may be connected to the second layer (e.g., base) of the open frame 110 through the first positioning holes, the second positioning holes, and fasteners to fix the adapter card module 151 to the second layer (e.g., base) of the open frame 110. The embodiment of the present application does not limit the type of fasteners. For example, the fasteners may be screws or latches.

[0071] In some embodiments, the maximum scale supported by the riser card module 151 may be verification of 10 double-width (DW) full-height full-length (FHFL) PCIe devices.

[0072] In some embodiments, the riser card module 151 may include multiple riser card slots, each of which may be plugged into a PCIe device. The PCIe device may typically be in the form of a board, ie, a PCIe card.

[0073] In some embodiments, the riser card module 151 may further include an upper cover. The upper cover may be used to cover the riser card slot to prevent dust and the like from falling into the riser card slot when not undergoing testing and verification, thereby preventing damage to subsequently inserted PCIe devices and avoiding inaccurate test and verification results for the server CPU. In some embodiments, the upper cover may be detachable from the riser card slot, or the upper cover may be connected to the body of the riser card module provided with the riser card slot by means of a hinge or the like, so that the upper cover does not cover the riser card slot when testing and verification is being performed, but covers the riser card slot when not undergoing testing and verification.

[0074] In some embodiments, the cable used by the adapter card module 151 can be a customized PCIE Gen5 cable. By defining the signal for the customized cable, the interoperability of the server CPU with different PCIe devices can be verified. Verifying the interoperability of the server CPU with different PCIe devices can include verifying link width (x1 / x4 / x16) auto-negotiation and power management coordination, and testing the PCIe interface's bifurcation functionality to ensure that an x16 slot can be split into multiple x8 or x4 lanes to support multi-device expansion. The different PCIe devices mentioned above can include at least one of a graphics processing unit (GPU) and a field programmable gate array (FPGA) accelerator card.

[0075] Figure 4 This is a schematic diagram of the structure of an adapter card module in a server central processing unit test and verification platform provided by an embodiment of the present application. For example, Figure 4 The riser card module shown may include eight riser card slots and may support a maximum of eight PCIe devices.

[0076] According to the server central processing unit test and verification platform provided by the embodiment of the present application, the adapter card module is decoupled from other functional modules by adopting a modularly designed adapter card module. On the premise that the PCIE interface function of the server central processing unit can be tested and verified, the direct dependency between the adapter card module and other modules is isolated, allowing the adapter card module to be independently developed, tested and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in the adapter card module, and reducing the development cost and efficiency of the platform as well as the cost and efficiency of testing and verification.

[0077] In some embodiments of the present application, the expansion module 150 includes a first hard disk module 152; the auxiliary test device connected to the first hard disk module 152 includes a target hard disk with an enterprise and data center solid-state hard disk form factor.

[0078] In actual implementation, the expansion module 150 may include a first hard disk module 152. The first hard disk module 152 may be used to connect to a hard disk. The target hard disk connected to the first hard disk module 152 may include an Enterprise and Data Center SSD Form Factor (EDSFF) hard disk. Accordingly, the auxiliary test device connected to the first hard disk module 152 may include an EDSFF hard disk.

[0079] EDSFF is a solid-state drive (SSD) standard designed specifically for data centers and enterprise storage systems. A solid-state drive, also known as a solid-state drive (SSD), is a hard drive made with an array of solid-state electronic memory chips. EDSFF defines four primary form factors: E1.S (Enterprise and Data Center 1U Short SSD Form Factor), E1.L (Enterprise and Data Center 1U Long SSD Form Factor), E3.S (Enterprise and Data Center 3U Short SSD Form Factor), and E3.L (Enterprise and Data Center 3U Long SSD Form Factor). EDSFF drives can be classified in both the Enterprise and Data Center Short SSD Form Factor (EDSFF) and the Enterprise and Data Center Long SSD Form Factor (EDLFF). The "S" in the aforementioned E1.S and E3.S specifications stands for "Short." These EDSFF hard drives are categorized as short SSDs for enterprises and data centers. The "L" in the aforementioned E1.L and E3.L specifications stands for "Long." These EDSFF hard drives are categorized as long SSDs for enterprises and data centers.

[0080] SSDs come in a variety of form factors, including SATA (Serial Advanced Technology Attachment), PCIe, M.2 (M2 interface), U.2 (SFF-8639 interface), SAS (Serial Attached SCSI), and E1.L, E1.S, and E3.S design types. E1.L is longer than E1.S, while E3.S is a new NVMe SSD (NVM Express or NonVolatile Memory) standard for cloud services and enterprise data centers. It offers enhanced scalability, superior performance, heat dissipation, and power consumption, making it ideal for large-capacity, high-density all-flash storage arrays. The E3 series SSDs break free from the design constraints of the 2.5-inch form factor and are optimized for high-performance, efficient servers and storage, including standardized LED status indicators.

[0081] In some embodiments, the first hard disk module 152 may also be provided with a plurality of third positioning holes. The second layer of the open frame 110 may be provided with the same number of fourth positioning holes as the first hard disk module 152, and the positions of the fourth positioning holes correspond one-to-one with the positions of the third positioning holes. In some embodiments, the fourth positioning holes may be provided on the base. The first hard disk module 152 may be connected to the second layer (e.g., the base) of the open frame 110 via the third positioning holes, the fourth positioning holes, and fasteners to secure the first hard disk module 152 to the second layer (e.g., the base) of the open frame 110. The embodiment of the present application does not limit the type of fasteners; for example, the fasteners may be screws or latches.

[0082] In some embodiments, the first hard disk module 152 can support multiple EDSFF hard disks of the same or different specifications to verify the storage form, thereby achieving the purpose of verifying the interface function of the server CPU.

[0083] According to the server central processing unit test and verification platform provided in the embodiment of the present application, by adopting a modularly designed first hard disk module, the first hard disk module is decoupled from other functional modules. Under the premise of being able to test and verify the storage function of the server central processing unit, the direct dependency between the first hard disk module and other modules is isolated, allowing the first hard disk module to be independently developed, tested and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in the first hard disk module, and reducing the development cost and efficiency of the platform as well as the cost and efficiency of testing and verification.

[0084] In some embodiments of the present application, the extension module 150 includes a second hard disk module 153; the auxiliary test equipment connected to the second hard disk module 153 includes a non-volatile storage high-speed solid-state hard disk.

[0085] In actual implementation, the expansion module 150 may include a second hard disk module 153. The second hard disk module 153 may be used to connect a hard disk. The type of hard disk connected to the second hard disk module 153 may be a non-volatile storage high-speed solid-state drive. Accordingly, the auxiliary test device connected to the second hard disk module 153 may include an NVMe SSD.

[0086] In some embodiments, the second hard disk module 153 may also be provided with a plurality of fifth positioning holes. The second layer of the open frame 110 may be provided with the same number of sixth positioning holes as the second hard disk module 153, and the positions of the sixth positioning holes correspond one-to-one to the positions of the fifth positioning holes. In some embodiments, the sixth positioning hole may be provided on the base. The second hard disk module 153 may be connected to the second layer (e.g., base) of the open frame 110 through the fifth positioning hole, the sixth positioning hole, and fasteners to fix the second hard disk module 153 to the second layer (e.g., base) of the open frame 110. The embodiment of the present application does not limit the type of fasteners. For example, the fasteners may be screws or latches.

[0087] In some embodiments, the second hard disk module 153 can support multiple NVMe SSDs to verify the storage form, thereby achieving the purpose of verifying the interface function of the server CPU. In some embodiments, the NVMe SSD connected to the second hard disk module 153 can adopt an NVMe SSD with an interface such as SATA or M.2.

[0088] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the second hard disk module is decoupled from other functional modules by adopting a modularly designed second hard disk module. On the premise that the storage function of the server central processing unit can be tested and verified, the direct dependency between the second hard disk module and the other modules is isolated, allowing the second hard disk module to be independently developed, tested and upgraded, thereby avoiding the global reconstruction of the platform caused by changes in the second hard disk module, and reducing the development cost and efficiency of the platform as well as the cost and efficiency of testing and verification.

[0089] Figure 5 This is a structural diagram of the first hard disk module in a server central processing unit test and verification platform provided by an embodiment of the present application. Figure 5In some embodiments of the present application, the first hard disk module includes a first shell 510; the first shell 510 is provided with a first opening and a first backplane 520; the first opening is arranged opposite to the first backplane 520; the first surface of the first backplane 520 is used to be electrically connected to the target hard disk; the second surface of the first backplane 520 is provided with a first interface; the first interface is used to be electrically connected to the server central processing unit.

[0090] In actual implementation, the first hard disk module 152 may include a first housing 510 having a cavity. The embodiment of the present application does not limit the specific shape of the first housing 510. In some embodiments, the first housing 510 may be in a shape such as a cuboid.

[0091] The first housing 510 is provided with a first opening and a first backplate 520 positioned opposite each other. An EDSFF hard drive can be inserted through the first opening and connected to the first side of the first backplate 520. It is understood that the first side of the first backplate 520 is the side opposite the first opening, while the second side of the first backplate 520 is the other side. The second side of the first backplate 520 can be provided with a first interface, through which the EDSFF hard drive can be electrically connected to the server CPU.

[0092] In some embodiments, the first housing 510, excluding the first backplate 520 and the first opening, may be provided with heat dissipation holes, forming a cage-like structure. The present invention does not limit the shape and arrangement of the heat dissipation holes. For example, the heat dissipation holes may be rectangular or circular. Heat dissipation holes of the same or different shapes may be used on different surfaces of the first housing 510.

[0093] For example, Figure 5 The first hard disk module shown can support a maximum of eight E3.S ESDFF hard disks.

[0094] According to the server central processing unit test and verification platform provided in the embodiment of the present application, by adopting a first shell including a first opening and a first backplate that are relatively arranged, the first hard disk module has better heat dissipation performance, which can achieve stable temperature control of the server central processing unit in a high-load test scenario. In a high-load test scenario, more test items can be performed and the test capability is stronger.

[0095] In some embodiments of the present application, the second hard disk module 153 includes a second shell; the second shell is provided with a second opening and a second back plate; the second opening is arranged opposite to the second back plate; the first surface of the second back plate is used to be electrically connected to a non-volatile storage high-speed solid-state hard disk; the second surface of the second back plate is provided with a second interface; the second interface is used to be electrically connected to the server central processing unit.

[0096] In actual implementation, the second hard disk module 153 may adopt a structure similar to that of the first hard disk module 152 .

[0097] The second hard disk module 153 may include a second housing having a cavity. The specific shape of the second housing is not limited in the present embodiment. In some embodiments, the second housing may be in a shape such as a cuboid.

[0098] The second housing is provided with a second opening and a second backplate positioned opposite each other. The NVMe SSD can be inserted through the second opening and connected to the second side of the second backplate. It is understood that the second side of the second backplate is the side opposite the second opening, and the second side of the second backplate is the other side. The second side of the second backplate can be provided with a second interface, through which the NVMe SSD can be electrically connected to the server CPU.

[0099] In some embodiments, the second housing, excluding the second backplate and the second opening, may be provided with heat dissipation holes, forming a cage-like structure. The present application does not limit the shape and arrangement of the heat dissipation holes. For example, the heat dissipation holes may be rectangular or circular. Heat dissipation holes of the same or different shapes may be used on different surfaces of the second housing.

[0100] It should be noted that, generally, the first and second housings are not compatible due to differences in interfaces and dimensions. For example, if the first hard disk module supports E3.S EDSFF hard disks and the second hard disk module supports 2.5-inch NVMe SSDs, the first and second housings are not compatible.

[0101] In some embodiments, the expansion module 150 can be a flexible combination of a riser card module 151, a first hard disk module 152, and a second hard disk module 153. For example, the expansion module 150 can be at least one riser card module 151, or at least one first hard disk module 152, or at least one second hard disk module 153, or a combination of at least one riser card module 151 and at least one first hard disk module 152, or a combination of at least one riser card module 151 and at least one second hard disk module 153, or a combination of at least one first hard disk module 152 and at least one second hard disk module 153, or a combination of at least one riser card module 151, at least one first hard disk module 152, and at least one second hard disk module 153.

[0102] Figure 6 This is a fourth structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application. For example, Figure 6 The figure shows a situation where the expansion module 150 adopts a combination of an adapter card module 151 and a first hard disk module 152 .

[0103] Figure 7 This is a fifth structural diagram of a server central processing unit test and verification platform provided in an embodiment of the present application. For example, Figure 7 The figure shows a situation where the expansion module 150 adopts a combination of three first hard disk modules 152 .

[0104] For example, Figure 3 The diagram shows a situation where the expansion module 150 is a combination of a riser card module 151 , a first hard disk module 152 , and a second hard disk module 153 .

[0105] It is understandable that, when the expansion module 150 includes the first hard disk module 152 and the second hard disk module 153 , different storage forms can be verified, thereby achieving the purpose of verifying the interface function of the server CPU.

[0106] In some embodiments, based on different combinations of the adapter card module 151, the first hard disk module 152 and the second hard disk module 153, the expansion module 150 can actually support a maximum of 4 NVMe SSDs and 4 GPU cards, or 4 NVMe SSDs and 8 ordinary PCIe devices, or 24 NVMe SSDs.

[0107] In some embodiments, the computing module 120 may be connected to the adapter card module 151 , the first hard disk module 152 , and the second hard disk module 153 via a multi-channel input / output (Mini Cool Edge IO, MCIO) cable.

[0108] In some embodiments, the expansion module 150 can be used to assist in verifying the compatibility of densely installed eight E3.S SSDs in a 2U server to ensure the stability of the connection between the tray locking mechanism and the backplane in the server.

[0109] In some embodiments, the expansion module 150 can support automatic link reconstruction after a hot plug operation, and the state transition of the Link Training and Status State Machine (LTSSM) is normal.

[0110] In some embodiments, the computing module 120 can detect whether the server CPU correctly identifies all SSDs by using the lsscsi command, etc., and check whether the PCIe topology structure meets the x8 channel allocation (single disk bandwidth ≥ 14GB / s in Gen5 mode).

[0111] In some embodiments, the computing module 120 can confirm whether the firmware version of the SSD complies with the PCIe Gen5 / 6 specification through an NVMe CLI tool (such as nvme list).

[0112] In some embodiments, the computing module 120 can perform read and write tests including sequential tests for the performance of single disk and multi-disk aggregation, such as using fio to simulate full disk sequential read and write (e.g., block size 1M, QD=256) to verify whether the peak bandwidth of a single disk reaches the theoretical value.

[0113] In some embodiments, the computing module 120 performs a test on the number of random read / write operations per second (IOPS), and can test 4K random read and write (e.g., 70% read + 30% write) using an Iometer or the like to verify whether the theoretical value is reached.

[0114] According to the server central processing unit test and verification platform provided in the embodiment of the present application, by adopting a second shell including a second opening and a second backplate that are relatively arranged, the second hard disk module has better heat dissipation performance, which can achieve stable temperature control of the server central processing unit in a high-load test scenario. In a high-load test scenario, more test items can be performed and the test capability is stronger.

[0115] In some embodiments of the present application, the computing module 120 can be used to split the high-speed peripheral component interconnection port of the server central processing unit to respectively correspond to the high-speed peripheral component interconnection devices connected to the adapter card module.

[0116] In actual execution, the computing module 120 (specifically, the first controller) splits the PCIe port of the server CPU.

[0117] In the test verification platform, it is necessary to separate each PCIe port of the server CPU. In some embodiments, the PCIe port separation of the server CPU may include:

[0118] The first controller reads the ID status of each PCIe device serving as an auxiliary test device through MCIO;

[0119] The first controller transmits the ID status of each of the above PCIe devices to the BIOS via CPU0_I2C;

[0120] The BIOS converts the acquired ID status into different actual split parameters;

[0121] The BIOS splits the PCIe port according to the split parameters.

[0122] It should be noted that a personal identification number (PIN) can be set on each PCIe device's MCIO, allowing different PCIe devices to have different personal identification numbers (IDs). The PCIe device ID can be transparently transmitted to the MCIO on the motherboard via a cable.

[0123] In some embodiments, the BIOS can directly read the original split parameters in NVPARAM during the post phase. The BIOS can compare the two sets of parameters (including the original split parameters and the actual split parameters). If the two sets of parameters are inconsistent, the BIOS can reset the bifurcation parameters in NVPARAM and restart the computer. If the two parameters are consistent, the BIOS can boot normally, thereby achieving PCIe port splitting.

[0124] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the high-speed peripheral component interconnection ports of the server central processing unit are split through the computing module, so that the high-speed peripheral component interconnection ports of the server central processing unit respectively correspond to the high-speed peripheral component interconnection devices connected to the adapter card module. On this basis, the test and verification of each high-speed peripheral component interconnection port of the server central processing unit can be realized, and the test and verification of the high-speed peripheral component interconnection ports are more refined.

[0125] In some embodiments of the present application, the computing module 120 includes a mainboard, a first controller, an onboard non-volatile storage high-speed solid-state drive 123 and at least two test verification channels; each test verification channel is used to connect to a server central processing unit; the first controller is used to perform test verification tasks on the server central processing unit.

[0126] In actual implementation, the computing module 120 may include a mainboard, a first controller, and an onboard non-volatile storage high-speed solid-state drive 123 .

[0127] The mainboard (MB) can host the CPU testing and operation platform. The mainboard can adopt the same structure as a common server mainboard, the only difference being that the mainboard in this embodiment can be installed with multiple server CPUs, and each test and verification channel can be installed with a server CPU.

[0128] In some embodiments, the first controller may specifically perform the test and verification task on the server central processing unit by running a program, etc. The first controller may be a complex programmable logic device (CPLD), FPGA, or microcontroller unit (MCU).

[0129] In some embodiments, the storage function of the computing module 120 can be implemented by an onboard non-volatile storage high-speed solid-state drive 123 .

[0130] In some embodiments, all signals from interfaces related to server CPU verification testing, such as PCIe, Serial Peripheral Interface (SPI), Inter Integrated Circuit (I2C), and Improved Inter Integrated Circuit (I3C), can be brought out as test interfaces to verify the relevant functions of the server CPU. PCIe resources can be connected to an adapter card via a cable to enable functional verification of the server CPU.

[0131] Figure 8 A schematic diagram of the structure of a computing module in a server central processing unit test and verification platform provided in an embodiment of the present application; Figure 9 This is a schematic diagram of the topology of the computing module and management module in a server CPU test and verification platform provided by an embodiment of the present application. The structure of the computing module 120 and the topology of the components included can be referred to Figure 8 and Figure 9 . Figure 9 The CPLD located on the mainboard side is the first controller.

[0132] According to the server central processing unit test and verification platform provided by the embodiment of the present application, by adopting at least two test and verification channels, multiple server central processing units can be tested and verified at the same time, which can improve the efficiency of server central processing unit test and verification.

[0133] In some embodiments of the present application, the test verification channel includes at least one memory channel and a multi-channel input / output connector; the multi-channel input / output connector is used to connect to a high-speed peripheral component interconnection port of a server central processing unit.

[0134] In actual implementation, each test verification channel may include at least one memory channel and a multi-channel input / output (MCIO) connector. Figure 9The connectors in the figure are all MCIO connectors, and CPU0 and CPU1 are both server CPUs; the two CPUs can be connected to the connectors above or below them via PCIe cables to bring out PCIe signals. In addition, the CCIX0 port of CPU0 can be connected to two connectors via two PCIe cables or CCIX cables, and the CCIX0 port of CPU1 can be connected to two connectors via two PCIe cables or CCIX cables. The two connectors connected to the CCIX0 port of CPU0 can be connected to a connector connected to the CCIX0 port of CPU1 via PCIe cables respectively; the CCIX1 port of CPU0 can be connected to two connectors via two PCIe cables or CCIX cables, and the CCIX1 port of CPU1 can be connected to two connectors via two PCIe cables or CCIX cables. The two connectors connected to the CCIX1 port of CPU0 can be connected to a connector connected to the CCIX1 port of CPU1 via PCIe cables respectively. Among them, the CCIX (Cache Coherent Interconnect for Accelerators) protocol is a cache coherent inter-chip interconnect protocol that can optimize data transmission efficiency and resource sharing between processors and accelerators in heterogeneous computing systems.

[0135] In some embodiments, the memory channels in each test verification channel may be divided from the memory channels included in the memory installed on the motherboard.

[0136] In some embodiments, the computing module 120 may be configured as follows.

[0137] Supports dual-core CPUs. For example, the maximum thermal design power (TDP) of the CPU may be 300W.

[0138] The memory uses a single 16-channel 128GB DDR (Double Data Rate) 5 memory, such as DDR Synchronous Dynamic Random Access Memory (DDRSDRAM). For example, the memory can use dual-inline memory modules (DIMMs) with a bandwidth of x32.

[0139] PCIe resources can be brought out through the MCIO connector and can provide 2-way 16-way PCIe CEM interface 121 .

[0140] The onboard NVMe SSD can use a non-volatile storage high-speed solid-state drive 123 with an M.2 interface.

[0141] The network card may be an RJ45 interface network card and / or an Open Core Protocol (OCP) network card.

[0142] In some embodiments, the first layer of the open frame 110 (specifically, a tray) can be provided with at least one mounting bracket 113. In some embodiments, the mounting bracket 113 can be provided with a video interface, such as a Video Graphics Array (VGA) interface. This video interface can be connected to the server CPU via a cable. In some embodiments, the mounting bracket 113 can be provided with a Universal Serial Bus (USB) interface, such as USB 3.0. This USB interface can be connected to the server CPU via a cable.

[0143] According to the server central processing unit test and verification platform provided by the embodiment of the present application, each test and verification channel includes at least one memory channel and a multi-channel input / output connector, and the multi-channel input / output connector is connected to the high-speed peripheral component interconnection port of the server central processing unit, which can realize a more accurate and rapid test and verification platform for the high-speed peripheral component interconnection interface function of the server central processing unit. By each test and verification channel includes at least one memory channel and a multi-channel input / output connection, the efficiency of the server central processing unit test and verification can be improved.

[0144] In some embodiments of the present application, the computing module 120 further includes an open core protocol connector 122 to enable automatic allocation of high-speed peripheral component interconnect root components of multiple server central processing units.

[0145] In actual implementation, the mainboard of the computing module 120 may also be provided with an open core protocol (OCP) connector.

[0146] In some embodiments, the open core protocol connector 122 can automatically allocate PCIe root complexes (RCs) of multiple server CPUs when multiple server CPUs are installed on a motherboard.

[0147] Figure 10 This is a schematic diagram of the connection relationship of the open core protocol connector in a server central processor test and verification platform provided by the embodiment of the present application. Figure 10 , an exemplary description is given of the process of the open core protocol connector 122 automatically allocating PCIe RCs of multiple server CPUs.

[0148] The two server CPUs are respectively denoted as CPU0 and CPU1, the PCIe RC of CPU0 is CPU0 RC0, the PCIe RC of CPU1 is CPU1 RC0, and the OCP connector may be an OCP3.0 connector.

[0149] CPU0 RC0_H is connected to the OCP3.0 connector. The default bandwidth of CPU0 RC0_H is x8. It can be expanded to x16 bandwidth with CPU0 RC0_L and can be combined with CPU1 RC0_L to form a multi-host.

[0150] The 1-pin OCP0_CABLE_PRSNT and 1-pin OCP0_CPU_ADDR are used for differentiation. When the expansion cable is in place, the OCP0_CABLE_PRSNT signal is low and is high by default. When the cable is connected to CPU0 RC0_L, the OCP0_CPU_ADDR signal is low. When the cable is connected to CPU1 RC0_L, the OCP0_CPU_ADDR signal is high and is low by default. These signal changes can automatically allocate PCIe RCs for multiple server CPUs.

[0151] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the high-speed peripheral component interconnection root components of multiple server central processing units are automatically allocated through an open core protocol connector, which can help to test and verify multiple server central processing units at the same time, improve the efficiency of server central processing unit test and verification, and by providing multiple test conditions for multiple servers, it can be applied to more test and verification scenarios.

[0152] In some embodiments of the present application, the management module 130 includes a data center security control module 131 and a power module 132 .

[0153] In actual implementation, refer to Figure 3 The management module 130 may include a data center security control module 131 and a power supply module 132 .

[0154] The data center secure control module 131 is a data center secure control module (DC-SCM) that moves common server management, security, and control functions from a typical motherboard architecture to a smaller, universal form factor module.

[0155] The power module 132 may be a power supply unit (PSU) configured to supply power to each of the computing modules 120 , the management module 130 , the heat dissipation module 140 , and the expansion module 150 .

[0156] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the data center security control module is adopted through the management module to realize the security control of the server central processing unit test and verification platform, which can improve the security of the server central processing unit test and verification, and the operation of each functional module can be guaranteed through the power supply module, thereby ensuring the successful implementation of the server central processing unit test and verification, and improving the efficiency of the server central processing unit test and verification.

[0157] In some embodiments of the present application, the data center security control module 131 includes a second controller and a baseboard management controller. Figure 11 A schematic diagram of the structure of a computing module and a management module in a server central processing unit test and verification platform provided in an embodiment of the present application.

[0158] In actual implementation, refer to Figure 9 and Figure 11 , the data center security control module 131 can include a second controller and a baseboard management controller.

[0159] The second controller may be a complex programmable logic device (CPLD), FPGA or microcontroller unit (MCU). Figure 9 The CPLD located on the data center security control module side is the first controller.

[0160] In some embodiments, the second controller may cooperate with the baseboard management controller to specifically manage and control the computing module 120 and the heat dissipation module 140 .

[0161] In some embodiments, the baseboard management controller may include a Trusted Platform Module (TPM) and / or a Trusted Cryptography Module (TCM).

[0162] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the second controller cooperates with the baseboard management controller to manage and control the computing module and the heat dissipation module, which can improve the security of the server central processing unit test and verification.

[0163] Figure 12 This is a schematic diagram of a heat dissipation module in a server CPU test and verification platform provided by an embodiment of the present application. Figure 12In some embodiments of the present application, the heat dissipation module 140 includes a first heat dissipation component 141 and a second heat dissipation component 142 ; the first heat dissipation component 141 is disposed on the first layer of the open frame 110 ; the second heat dissipation component 142 is disposed on the second layer of the open frame 110 .

[0164] In actual implementation, the heat dissipation module 140 may include two parts, one part is a first heat dissipation component 141 disposed on the first layer of the open frame 110 , and the other part is a second heat dissipation component 142 disposed on the second layer of the open frame 110 .

[0165] The first heat dissipation component 141 can be used to dissipate heat for the computing module 120 and the management module 130 .

[0166] The second heat dissipation component 142 can be used to dissipate heat for the extension module 150 .

[0167] In some embodiments, the first heat dissipation assembly 141 and the second heat dissipation assembly 142 may be connected to the aforementioned BMC via cables and managed by the BMC.

[0168] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the first heat dissipation component is arranged on the first layer of the open frame, and the second heat dissipation component is arranged on the second layer of the open frame, so that the heat dissipation of the functional modules arranged on the first layer of the open frame is separated from the heat dissipation of the functional modules arranged on the second layer of the open frame, which helps to adopt different heat dissipation schemes and strategies for the heat dissipation of the functional modules arranged on the first layer of the open frame and the functional modules arranged on the second layer of the open frame, thereby achieving both improved heat dissipation performance and avoided power waste.

[0169] In some embodiments of the present application, the first heat dissipation component 141 includes a first fan module 143 and a rotating component 144; the first fan module 143 is arranged at the first end of the rotating component 144; the second end of the rotating component 144 is connected to the first layer of the open frame 110 to achieve angular rotation of the first fan module 143 relative to the first layer of the open frame 110.

[0170] In actual implementation, the first fan module 143 may include multiple fans. The embodiment of the present application does not specifically limit the number and model of the fans included in the first fan module 143.

[0171] The first fan module 143 can be connected to the first layer of the open frame 110 via a rotating assembly 144. The first fan module 143 can be fixedly connected to the first end of the rotating assembly 144. The second end of the rotating assembly 144 connected to the first layer of the open frame 110 can rotate, thereby driving the first fan module 143 to rotate relative to the first layer of the open frame 110. This allows the angle of the first fan module 143 to be adjusted, thereby changing the relative position and distance between the first fan module 143 and the computing module 120 and management module 130, thereby changing the heat dissipation effect.

[0172] For example, Figure 12 Several different positions of the rotating assembly 144 are shown, corresponding to various angles of rotation of the first fan module 143 relative to the first layer of the open frame 110 .

[0173] In some embodiments, the management module 130 can be used to control the rotation assembly 144 to control the rotation angle of the first fan module 143 relative to the first layer of the open frame 110. Through such control, it is possible to provide cooling conditions on demand according to actual test and verification requirements, and perform more flexible or complex testing on the server CPU.

[0174] In some embodiments, the management module 130 can be used to control the power of the first fan module 143. Through the above control, it is possible to provide cooling conditions as needed according to actual test and verification requirements, and perform more flexible or complex tests on the server CPU.

[0175] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the angle rotation of the first fan module relative to the first layer of the open frame is achieved through a rotating component. The angle can be adjusted according to actual test and verification requirements to achieve a preset or optimal heat dissipation effect.

[0176] In some embodiments of the present application, the rotation angle of the first fan module 143 relative to the first layer of the open frame 110 includes a plurality of preset angles.

[0177] In actual implementation, multiple preset angles can be pre-set for the rotation angle of the first fan module 143 relative to the first layer of the open frame 110. The rotation angle of the first fan module 143 relative to the first layer of the open frame 110 can be adjusted to any of the preset angles.

[0178] The number and specific values ​​of the preset angles are not limited in the present embodiment. For example, the preset angles may include four levels, such as 55°, 68°, 83°, and 120°, or three levels, such as 30°, 45°, and 60°.

[0179] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the first fan module can be rotated to any preset angle relative to the first layer of the open frame through a rotating component. The angle can be adjusted according to actual test and verification requirements to achieve a preset or optimal heat dissipation effect.

[0180] In some embodiments of the present application, the second layer of the open frame 110 is provided with a slide rail; the second heat dissipation assembly 142 includes a second fan module 145; and the second fan module 145 is slidably connected to the second layer of the open frame 110 via the slide rail.

[0181] In actual implementation, the second fan module 145 may include multiple fans. The embodiment of the present application does not specifically limit the number and model of the fans included in the second fan module 145.

[0182] The second fan module 145 can slide along the slide rail provided on the second layer of the open frame 110 , thereby changing the relative position and distance between the second fan module 145 and the extension module 150 and changing the heat dissipation effect.

[0183] In some embodiments, the management module 130 can be used to move the second fan module 145 on the slide rail to control the position of the second fan module 145. Through the above control, it is possible to provide cooling conditions on demand according to actual test and verification requirements, and perform more flexible or complex testing on the server CPU.

[0184] In some embodiments, the management module 130 can be used to control the power of the second fan module 145. Through the above control, it is possible to provide cooling conditions as needed according to actual test and verification requirements, and perform more flexible or complex tests on the server CPU.

[0185] According to the server central processing unit test and verification platform provided in the embodiment of the present application, the second fan module slides along the slide rail set on the second layer of the open frame, and can adjust the angle according to actual test and verification requirements to achieve a preset or optimal heat dissipation effect.

[0186] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0187] The above is a detailed introduction to a server central processing unit test and verification platform provided by this application. This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of the claims of this application.

Claims

1. A server central processing unit test and verification platform, characterized in that: include: Open framework, computing module, management module, cooling module and expansion module; The computing module and the management module are arranged on the first layer of the open framework; The expansion module is arranged on the second layer of the open frame; the computing module is electrically connected to the management module and the expansion module respectively; the heat dissipation module is electrically connected to the management module; The computing module is used to perform test and verification tasks on the server central processing unit; The management module is used to manage and control the computing module and the heat dissipation module to provide heat dissipation conditions as needed and test the server central processing unit according to actual test and verification requirements; The heat dissipation module is used to dissipate heat for the computing module, the management module, and the expansion module; The extension module is used to connect to an auxiliary test device; the auxiliary test device has an interface electrically connected to the server central processing unit to implement test verification of the interface function of the server central processing unit; The heat dissipation module includes a first heat dissipation component and a second heat dissipation component; The first heat dissipation component is provided on the first layer of the open frame to dissipate heat for the computing module and the management module; the second heat dissipation component is provided on the second layer of the open frame to dissipate heat for the expansion module; The computing module includes a mainboard, a first controller, an onboard non-volatile storage high-speed solid-state hard disk, and at least two test and verification channels; each of the test and verification channels is used to connect to a server central processing unit; the first controller is used to perform test and verification tasks on the server central processing unit; The test verification channel includes at least one memory channel and a multi-channel input / output connector; The multi-channel input / output connector is used to connect to the high-speed peripheral component interconnection port of the server central processing unit; The expansion module includes an adapter card module; The auxiliary test equipment connected to the adapter card module includes a high-speed peripheral component interconnect device; The first controller is used to split the high-speed peripheral component interconnection port of the server central processing unit to respectively correspond to the high-speed peripheral component interconnection devices connected to the adapter card module.

2. The server CPU test and verification platform according to claim 1, characterized in that: The expansion module includes a first hard disk module; The auxiliary test device connected to the first hard disk module includes a target hard disk in the form factor of an enterprise and data center solid state drive.

3. The server CPU test and verification platform according to claim 1, characterized in that: The expansion module includes a second hard disk module; The auxiliary test device connected to the second hard disk module includes a non-volatile storage high-speed solid state hard disk.

4. The server CPU test and verification platform according to claim 2, characterized in that: The first hard disk module includes a first housing; the first housing is provided with a first opening and a first back plate; the first opening is arranged opposite to the first back plate; The first surface of the first backplane is used for electrically connecting to the target hard disk; the second surface of the first backplane is provided with a first interface; the first interface is used for electrically connecting to the server central processing unit.

5. The server CPU test and verification platform according to claim 3, characterized in that: The second hard disk module includes a second housing; the second housing is provided with a second opening and a second back plate; the second opening is arranged opposite to the second back plate; The first surface of the second backplane is used to be electrically connected to the non-volatile storage high-speed solid-state hard disk; the second surface of the second backplane is provided with a second interface; the second interface is used to be electrically connected to the server central processing unit.

6. The server CPU test and verification platform according to claim 1, characterized in that: The computing module also includes an open core protocol connector to achieve automatic allocation of high-speed peripheral component interconnect root components of multiple server central processing units.

7. The server CPU test and verification platform according to claim 1, characterized in that: The management module includes a data center security control module and a power supply module.

8. The server CPU test and verification platform according to claim 7, characterized in that: The data center security control module includes a second controller and a baseboard management controller.

9. The server CPU test and verification platform according to claim 1, characterized in that: The first heat dissipation assembly includes a first fan module and a rotating assembly; The first fan module is arranged at the first end of the rotating assembly; the second end of the rotating assembly is connected to the first layer of the open frame, so as to realize the angular rotation of the first fan module relative to the first layer of the open frame.

10. The server central processing unit test and verification platform according to claim 9, characterized in that: The rotation angle of the first fan module relative to the first layer of the open frame includes a plurality of preset angles.

11. The server central processing unit test and verification platform according to claim 1, 9 or 10, characterized in that: The second layer of the open frame is provided with a slide rail; the second heat dissipation assembly includes a second fan module; the second fan module is slidably connected to the second layer of the open frame via the slide rail.

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