Ultrathin RFID card and preparation method thereof

Abstract

The invention discloses an ultrathin RFID card and a preparation method thereof. The ultrathin RFID card comprises a multi-layer composite structure composed of a front protection layer, a chip layer and a back protection layer. The multi-layer composite structure composed of the front protection layer with the thickness of 0.15 mm, the chip layer with the thickness of 0.08 mm and the back protection layer with the thickness of 0.12 mm is adopted, the thickness of the multi-layer composite structure is smaller than or equal to 0.35 mm, the thickness of the card is reduced, and the requirements of ultra-thin application scenes such as textiles or ultra-thin electronic equipment are met.

Description

Technical Field

[0001] The present invention relates to the field of radio frequency technology, and particularly to an ultra-thin RFID card and a preparation method thereof. Background Art

[0002] An RFID (Radio Frequency Identification) card is an automatic identification technology card that uses radio waves for non-contact data transmission, and is widely used in fields such as traffic management, clothing management, and animal tracking. The RFID card mainly consists of two parts: a chip and an antenna. The chip is embedded with a unique identification code, and the antenna is responsible for receiving and transmitting radio waves. When the RFID card enters the identification range of the reader-writer, the reader-writer will emit specific radio waves to activate the antenna on the RFID card and generate an electric current, thereby waking up the chip and transmitting the stored identification code to the reader-writer. After receiving the identification code, the reader-writer will decode it and transmit it to a computer or other data processing systems, so as to realize the identification and information processing of the RFID card.

[0003] However, traditional RFID cards usually use materials such as PVC or PET, with a thickness of 0.8 - 1.2 mm, and the existing packaging processes for antennas and chips are likely to cause an increase in the card thickness, making it difficult to meet the requirements of ultra-thin application scenarios, such as embedding in paper, textiles, or ultra-thin electronic devices. Summary of the Invention

[0004] The main object of the present invention is to provide an ultra-thin RFID card, aiming to solve the problem that the traditional RFID card has a large thickness and is difficult to meet the requirements of ultra-thin application scenarios.

[0005] To achieve the above object, the present invention proposes an ultra-thin RFID card, which includes a multi-layer composite structure composed of a front protective layer, a chip layer, and a back protective layer, and the thickness of the multi-layer composite structure is ≤ 0.35 mm.

[0006] In one embodiment, the thickness of the front protective layer is 0.15 mm, the thickness of the chip layer is 0.08 mm, and the thickness of the back protective layer is 0.12 mm.

[0007] In one embodiment, the ultra-thin RFID card further includes a flexible substrate antenna layer and an adhesive layer.

[0008] The present invention also proposes a preparation method of an ultra-thin RFID card, which is applied to the above ultra-thin RFID card, and the preparation method of the ultra-thin RFID card includes the following steps: Print positioning format lines for the front protective layer, the chip layer, and the back protective layer using screen printing according to the alignment reference lines; Punch the chip layer according to the outer shape size of the wet Inlay label; Silk-screen and laminate oil on the reverse side of the front protective layer and the reverse side of the back protective layer; After positioning the front protective layer and the chip layer according to the alignment reference line, use ultrasonic welding to stack the points; After pasting the wet Inlay label into the punched frame of the stacked chip layer, then align and stack it with the back protective layer, and put it into a lamination equipment for high-temperature lamination to form a large sheet of ultra-thin RFID card; Use a die-cutting machine to punch the large sheet of ultra-thin RFID card into standard cards according to the positioning layout line.

[0009] In one embodiment, the pressure of the high-temperature lamination is 0.3~6MPa, and the temperature is 140~160°C.

[0010] The technical solution of the present invention adopts a multi-layer composite structure composed of a front protective layer with a thickness of 0.15mm, a chip layer with a thickness of 0.08mm, and a back protective layer with a thickness of 0.12mm. The thickness of the multi-layer composite structure ≤0.35mm, reducing the thickness of the card to meet the requirements of ultra-thin application scenarios, such as textiles or ultra-thin electronic devices, etc. Brief Description of the Drawings

[0011] Figure 1 It is a schematic structural diagram of the ultra-thin RFID card of the present invention; Figure 2 It is a punching schematic diagram of the preparation method of the ultra-thin RFID card of the present invention; Figure 3 It is a schematic diagram of pasting the wet Inlay label in the preparation method of the ultra-thin RFID card of the present invention; In the figure: 1 - front protective layer, 2 - chip layer, 3 - back protective layer. Detailed Embodiments

[0012] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Usually, the components of the embodiments of the present invention described and shown in the accompanying drawings here can be arranged and designed in various different configurations.

[0013] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed present invention, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0014] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0015] In the description of the present invention, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0016] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0017] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, terms such as "disposed" and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also mean internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0018] Traditional RFID cards are usually made of materials such as PVC or PET, with a thickness of 0.8~1.2mm. In addition, the existing antenna and chip packaging process easily leads to an increase in card thickness, making it difficult to meet the requirements of ultra-thin application scenarios, such as embedding in paper, textiles or ultra-thin electronic devices.

[0019] In order to solve the above problems, the present invention proposes an ultra-thin RFID card. The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0020] like Figures 1 - 3 As shown, the ultra-thin RFID card includes a multi-layer composite structure consisting of a front protection layer 1, a chip layer 2 and a back protection layer 3, and the thickness of the multi-layer composite structure is ≤0.35 mm.

[0021] In one embodiment, the thickness of the front protection layer 1 is 0.15 mm, the thickness of the chip layer 2 is 0.08 mm, and the thickness of the back protection layer 3 is 0.12 mm.

[0022] In one embodiment, the ultra-thin RFID card further includes a flexible substrate antenna layer and an adhesive layer.

[0023] In this embodiment, the multi-layer composite structure of the ultra-thin RFID card is composed of a front protective layer 1, a chip layer 2, and a back protective layer 3. The chip layer 2 is disposed between the front protective layer 1 and the back protective layer 3. Among them, the front protective layer 1 is made of PVC / PET / PETG material with a thickness of 0.15 mm, the back protective layer 3 is made of PVC / PET / PETG material with a thickness of 0.12 mm, and the chip layer 2 is made of PVC / PET / PETG material with a thickness of 0.08 mm. Thus, the total thickness of the multi-layer composite structure ≤ 0.35 mm. Compared with traditional RFID cards, the thickness of the ultra-thin RFID card in this embodiment is thinner, which can meet the requirements of ultra-thin application scenarios, such as textiles or ultra-thin electronic devices, etc.

[0024] In this embodiment, the chip of the ultra-thin RFID card and the flexible substrate antenna adopt a wet Inlay label to reduce the overall thickness of the ultra-thin RFID card and improve the flexibility of the card, avoiding the problem of antenna circuit damage caused by long-term bending of the card.

[0025] The ultra-thin RFID card of the present invention adopts a multi-layer composite structure composed of a front protective layer 1 with a thickness of 0.15 mm, a chip layer 2 with a thickness of 0.08 mm, and a back protective layer 3 with a thickness of 0.12 mm. The thickness of the multi-layer composite structure ≤ 0.35 mm, reducing the thickness of the card to meet the requirements of ultra-thin application scenarios, such as textiles or ultra-thin electronic devices, etc.

[0026] The present invention also proposes a preparation method for an ultra-thin RFID card. The preparation method of the ultra-thin RFID card is applied to the above-mentioned ultra-thin RFID card. The preparation method of the ultra-thin RFID card includes the following steps: Print and position the layout lines of the front protective layer 1, the chip layer 2, and the back protective layer 3 using screen printing according to a unified alignment reference line; Punch the chip layer 2 according to the outer shape size of the wet Inlay label; Screen-print and laminate oil on the reverse side of the front protective layer 1 and the reverse side of the back protective layer 3; After positioning the front protective layer 1 and the chip layer 2 according to the alignment reference line, use ultrasonic welding to stack them at the welding points; After pasting the wet Inlay label into the punched frame of the stacked chip layer 2, then stack it in alignment with the back protective layer 3 and place it in a lamination device for high-temperature lamination to form a large version of the ultra-thin RFID card; The die-cutting machine punches the large version of the ultra-thin RFID card into standard cards according to the layout lines.

[0027] In one embodiment, the pressure of the high-temperature lamination is 0.3 - 6 MPa, and the temperature is 140 - 160 °C.

[0028] In the present invention, the chip uses a wet Inlay label with an etched antenna, and the total thickness is ≤ 0.35 mm; a front protective layer 1, a chip layer 2, and a back protective layer 3 are stacked in sequence, and air bubbles are eliminated through a hot pressing process to ensure the bonding strength between the protective layer and the chip layer 2 and avoid delamination.

[0029] In this embodiment, laser cutting or precision die cutting can be used to cut the large version of the ultra-thin RFID card into a specified shape to obtain a standard card, and the production is completed after passing the test and inspection.

[0030] The above are only the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the technical principle of the present invention, several improvements and retouches can be made, and these improvements and retouches should also be regarded as the protection scope of the present invention.

Claims

1. An ultra-thin RFID card, characterized in that, The ultra-thin RFID card includes a multi-layer composite structure composed of a front protective layer, a chip layer, and a back protective layer, and the thickness of the multi-layer composite structure is ≤ 0.35 mm.

2. The ultra-thin RFID card according to claim 1, wherein The thickness of the front protective layer is 0.15 mm, the thickness of the chip layer is 0.08 mm, and the thickness of the back protective layer is 0.12 mm.

3. The ultra-thin RFID card according to claim 1, characterized in that, The ultra-thin RFID card further includes a flexible substrate antenna layer and an adhesive layer.

4. A method for preparing an ultra-thin RFID card, which is applied to the ultra-thin RFID card according to any one of claims 1-3, characterized in that, The preparation method of the ultra-thin RFID card includes the following steps: Print the positioning layout lines of the front protective layer, the chip layer, and the back protective layer using screen printing according to the alignment reference line; Punch the chip layer according to the outer shape size of the wet Inlay label; Screen print and laminate oil on the reverse side of the front protective layer and the reverse side of the back protective layer; After positioning the front protective layer and the chip layer according to the alignment reference line, use ultrasonic welding to stack them at the welding points; After pasting the wet Inlay label into the punching frame of the stacked chip layer, stack it with the back protective layer by alignment positioning, and put it into a laminating device for high-temperature lamination to form a large version of the ultra-thin RFID card; Use a die cutter to punch the large version of the ultra-thin RFID card into standard cards according to the positioning layout lines.

5. The preparation method of the ultra-thin RFID card according to claim 4, characterized in that, The pressure of the high-temperature lamination is 0.3 - 6 MPa, and the temperature is 140 - 160 °C.

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