Integrated connection method of liquid crystal display based on flexible temperature-sensitive resistor circuit board

Abstract

The present invention relates to the technical field of flexible temperature-sensitive resistor circuit boards, and discloses a method for integrating a liquid crystal display (LCD) based on a flexible temperature-sensitive resistor circuit board, comprising: constructing a characteristic vector based on the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative; performing spatiotemporal clustering analysis on the standard characteristic vector and the unit region spatiotemporal points to obtain multiple dynamic cluster regions; performing adaptive gradient descent on the dynamic cluster regions using a comprehensive cost function to obtain the terminal resistance value of the dynamic cluster region; calculating the global energy efficiency ratio based on the terminal resistance value; determining whether the global energy efficiency ratio is less than a preset energy efficiency ratio; if so, updating the cost factor weight set; and if not, integrating the flexible temperature-sensitive resistor circuit board and the pre-built LCD according to the terminal resistance value. The main purpose of the present invention is to improve circuit signal integrity and circuit system stability.

Description

Technical Field

[0001] The invention relates to an integrated connection method of a liquid crystal display based on a flexible temperature-sensitive resistor circuit board, belonging to the technical field of flexible temperature-sensitive resistor circuit boards. Background Art

[0002] With the rapid development of flexible display technology, the integrated connection of flexible thermal resistor circuit boards and liquid crystal displays (LCDs) is gaining increasing attention. This integrated connection is an integrated technology that achieves thermoelectric control of display systems through an embedded thermal resistor network. Its core value lies in providing key support for applications such as the next generation of foldable devices and curved automotive displays, driving the evolution of flexible electronic systems towards high stability and energy efficiency.

[0003] Current integrated connection technology for flexible temperature-sensing resistor circuit boards and LCDs still has some technical drawbacks. For example, the fixed resistor partitioning mechanism cannot respond to sudden changes in local thermal load caused by dynamic switching of display content, resulting in delayed hotspot identification and inaccurate temperature control, which in turn degrades display uniformity. Therefore, how to adjust the terminal resistance value of the circuit in real time to further improve circuit signal integrity and system stability is an urgent technical problem that needs to be solved. Summary of the Invention

[0004] The present invention provides an integrated connection method for a liquid crystal display based on a flexible temperature-sensitive resistor circuit board, the main purpose of which is to improve circuit signal integrity and circuit system stability.

[0005] To achieve the above objectives, the present invention provides a method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board, comprising:

[0006] Dividing the pre-built flexible temperature-sensitive resistor circuit board into a space to obtain a set of square unit areas, and identifying a surface temperature field value set and a current density field value set for each square unit area in the set of square unit areas;

[0007] Calculate the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative based on the surface temperature field value set and the current density field value set;

[0008] Constructing a characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative;

[0009] Obtaining unit area spatiotemporal points, performing dimensionless processing on the characteristic vector to obtain a standard characteristic vector, performing spatiotemporal clustering analysis on the standard characteristic vector and the unit area spatiotemporal points to obtain a plurality of dynamic clustering areas;

[0010] Identifying clustering parameters of the dynamic clustering region, wherein the clustering parameters include: regional average temperature and root mean square value of current density;

[0011] Constructing a comprehensive cost function for the dynamic clustering region based on the clustering parameters and a preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering region using the comprehensive cost function to obtain a terminal resistance value of the dynamic clustering region, wherein the cost factor weight set includes: a temperature weight coefficient, a circuit weight coefficient, and a current density weight coefficient;

[0012] Calculate the global energy efficiency ratio based on the terminal resistance value;

[0013] Determine whether the global energy efficiency ratio is less than the preset energy efficiency ratio;

[0014] If the global energy efficiency ratio is less than the preset energy efficiency ratio, the cost factor weight set is updated and the process of constructing a comprehensive cost function of the dynamic clustering region based on the clustering parameters and the preset cost factor weight set is returned to the above step;

[0015] If the global energy efficiency ratio is not less than the preset energy efficiency ratio, the flexible temperature-sensing resistor circuit board and the pre-built liquid crystal display are integrated and connected according to the terminal resistance value.

[0016] Optionally, the identifying of the surface temperature field value set and the current density field value set of each square unit area in the square unit area set includes:

[0017] Obtaining the current temperature-sensing resistance value of each sampling point within the square unit area to obtain a current temperature-sensing resistance value set, and identifying the surface temperature field value set of each square unit area based on a preset temperature-resistance response relationship and the current temperature-sensing resistance value set, wherein the temperature-resistance response relationship refers to the response relationship between the temperature-sensing resistance value and the surface temperature field value;

[0018] According to the surface temperature field value set of the square unit area, combined with the preset electrothermal coupling simulation numerical simulation method, the current density field value of each sampling point in the square unit area is calculated to obtain the current density field value set.

[0019] Optionally, the calculating of the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative based on the surface temperature field value set and the current density field value set includes:

[0020] According to the surface temperature field value set and the preset number of sampling points, the unit average temperature is calculated using a preset average value formula, wherein the average value formula is as follows:

[0021]

[0022] in, is the average unit temperature, is the number of sampling points in the square unit area, The first Surface temperature field values ​​at each sampling point;

[0023] Identify adjacent square unit areas of the square unit area, obtain adjacent unit average temperatures of the adjacent square unit areas, and calculate the unit temperature gradient modulus according to a preset unit area side length and adjacent unit average temperature using a preset two-dimensional finite difference method formula, wherein the adjacent unit average temperature includes: upper adjacent unit average temperature, lower adjacent unit average temperature, left adjacent unit average temperature, and right adjacent unit average temperature, wherein the two-dimensional finite difference method formula is as follows:

[0024]

[0025] in, is the unit temperature gradient mode length, is the side length of the unit area, represents the average temperature of the right adjacent unit, represents the average temperature of the left adjacent unit, represents the average temperature of the upper adjacent unit, represents the average temperature of the adjacent unit;

[0026] According to the current density field value set and the number of sampling points, the effective value of the unit current density is calculated by the preset effective value formula, wherein the effective value formula is as follows:

[0027]

[0028] in, is the effective value of the unit current density, The first Current density field value at each sampling point;

[0029] Obtain a sampling time interval, determine a parameter sampling sequence based on the sampling time interval, obtain the unit average temperature at each parameter sampling moment in the parameter sampling sequence, obtain a unit average temperature set, and calculate the unit temperature partial derivative at the parameter sampling moment using a preset backward difference method formula based on the sampling time interval and the unit average temperature set. The backward difference method formula is as follows:

[0030]

[0031] in, is the partial derivative of the unit temperature at the parameter sampling time t, is the sampling time interval, is the average temperature of the unit at time t, for The average temperature of the unit at time.

[0032] Optionally, constructing the characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative includes:

[0033] The characteristic vector parameters are determined according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative. The characteristic vector of the square unit area is constructed by the characteristic vector parameters, wherein the characteristic vector parameters refer to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative. The characteristic vector is as follows:

[0034]

[0035] in, represents the feature vector.

[0036] Optionally, the dimensionless processing of the feature vector to obtain a standard feature vector includes:

[0037] The eigenvector parameters are dimensionally non-scaled using a preset dimensionless formula to obtain standard vector parameters, wherein the dimensionless formula is as follows:

[0038]

[0039] in, express Moment Rank The eigenvector parameters of the square unit area of ​​the column, Express The standard vector parameters obtained after dimensionless processing, Represents the average value of the characteristic vector parameters of each square unit area at each parameter sampling moment, Represents the standard deviation of the eigenvector parameters of each square unit area at each parameter sampling moment;

[0040] A standard feature vector is constructed according to the standard vector parameters.

[0041] Optionally, the spatiotemporal clustering analysis is performed on the standard feature vectors and the spatiotemporal points of the unit area to obtain multiple dynamic clustering areas, including:

[0042] Gather the standard eigenvectors of each square unit area to obtain a standard eigenvector group;

[0043] Perform spatiotemporal clustering analysis on the standard feature vector group and the unit area spatiotemporal points to obtain multiple dynamic clustering areas. The unit area spatiotemporal points are determined by the number of rows and columns of the square unit area and the parameter sampling time. The unit area spatiotemporal point p of the square unit area in the jth row and kth column at the tth time is: ;

[0044] The spatiotemporal cluster analysis steps are as follows: based on the standard feature vector and the unit area spatiotemporal points, dynamic clustering areas are identified through preset spatiotemporal proximity conditions and feature similarity conditions. The spatiotemporal proximity conditions are:

[0045]

[0046]

[0047] in, Indicates the row number of the square unit area where the unit area space-time point p is located, Indicates the row number of the square unit area where the space-time point q is located, Indicates the column number of the square unit area where the space-time point p of the unit area is located, Indicates the column number of the square unit area where the space-time point q is located, Indicates the spatial action radius, represents the parameter sampling moment of the space-time point p in the unit area, represents the parameter sampling moment of the space-time point q in the unit area, is the time action window, Indicates the absolute value symbol;

[0048] The feature similarity conditions are:

[0049]

[0050] in, express The corresponding standard eigenvector A quantity, express The corresponding standard eigenvector A quantity, express and the characteristic distance of the unit area space-time point q, Represents the feature distance threshold.

[0051] Optionally, the clustering parameters for identifying the dynamic clustering area include:

[0052] The clustering parameters of the dynamic clustering area are calculated according to the preset average value formula and the root mean square value formula. The average value formula is as follows:

[0053]

[0054] in, Indicates the Dynamic clustering regions, Represents dynamic clustering areas The average temperature of the region, Represents dynamic clustering areas The number of square unit areas included, Represents dynamic clustering areas The number of parameter sampling moments of the unit area space-time points contained in Indicates the The unit average temperature of the characteristic vector corresponding to the space-time point p of the unit area;

[0055] The root mean square value formula is as follows:

[0056]

[0057] in, Represents dynamic clustering areas The root mean square value of the current density, Indicates the Moment Rank The effective value of the unit current density corresponding to the unit area time and space point of the square unit area in the column.

[0058] Optionally, constructing a comprehensive cost function of the dynamic clustering area based on the clustering parameters and a preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering area using the comprehensive cost function to obtain the terminal resistance value of the dynamic clustering area includes:

[0059] A comprehensive cost function of the dynamic clustering region is constructed based on the clustering parameters and the preset cost factor weight set. The comprehensive cost function is:

[0060]

[0061] in, Represents dynamic clustering areas Terminal resistance variable The comprehensive cost function, Indicates the safe temperature of the flexible temperature sensing resistor circuit board. Indicates the nominal resistance of the circuit design, is the temperature weight coefficient, is the circuit weight coefficient, is the current density weight coefficient, Dynamic clustering area The terminal resistance variable;

[0062] Get an iterative update threshold, and construct an iterative update sequence according to the iterative update threshold, wherein the iterative update sequence is 0, 1, 2, , 200, 200 is the iterative update threshold;

[0063] Iterative update values ​​are sequentially extracted from the iterative update sequence, and a target gradient expression is constructed according to the iterative update values ​​and the comprehensive cost function, wherein the target gradient expression is as follows:

[0064]

[0065] in, Indicates iterative update value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The partial derivative of the comprehensive cost function, Represents dynamic clustering areas The regional thermal resistance, ;

[0066] When the iterative update value is 0, the first iteration is calculated according to the preset initial iteration update formula and target gradient expression. Dynamic clustering area after iterative update The terminal resistance value, wherein the initial iterative update formula is as follows:

[0067]

[0068] in, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the dynamic clustering area that has not been iteratively updated The terminal resistance value, represents the initial learning rate, Represents the partial derivative of the comprehensive cost function without iterative update ;

[0069] When the iterative update value is not 0, the first Dynamic clustering area after iterative update The terminal resistance value, the general iterative update formula is as follows:

[0070]

[0071] in, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, ;

[0072] Determining whether the iterative update value is equal to the iterative update threshold;

[0073] If the iterative update value is not equal to the iterative update threshold, the Dynamic clustering area after iterative update Update the terminal resistance value of Dynamic clustering area after iterative update The terminal resistance value is obtained, and returning to the above step of sequentially extracting iteratively updated values ​​in the iteratively updated sequence;

[0074] If the iterative update value is equal to the iterative update threshold, the The terminal resistance value after the iteration update is used as the terminal resistance value of the dynamic clustering area.

[0075] Optionally, calculating the global energy efficiency ratio according to the terminal resistance value includes:

[0076] The global energy efficiency ratio of the terminal resistance value is calculated according to a preset global energy efficiency ratio formula, which is as follows:

[0077]

[0078] in, Represents dynamic clustering areas of load resistance.

[0079] Optionally, the general iterative update formula is as follows:

[0080]

[0081] in, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, .

[0082] In order to solve the above problem, the present invention further provides an electronic device, comprising:

[0083] at least one processor; and,

[0084] a memory communicatively connected to the at least one processor; wherein,

[0085] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to implement the above-mentioned integrated connection method of liquid crystal display based on flexible temperature-sensitive resistor circuit board.

[0086] In order to solve the above problems, the present invention also provides a computer-readable storage medium, which stores at least one instruction, and the at least one instruction is executed by a processor in an electronic device to implement the above-mentioned integrated connection method of a liquid crystal display based on a flexible temperature-sensitive resistor circuit board.

[0087] Compared with the problem described in the background technology, the present invention first divides the pre-constructed flexible temperature-sensing resistor circuit board into spaces to obtain a set of square unit areas, identifies the surface temperature field value set and the current density field value set of each square unit area in the square unit area set, and calculates the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative according to the surface temperature field value set and the current density field value set. The present invention divides the pre-constructed flexible temperature-sensing resistor circuit board into spaces and collects the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative data, thereby realizing Refined monitoring of the working status of the circuit board provides an accurate data basis for subsequent optimization; secondly, the characteristic vector of the square unit area is constructed according to the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative, and the unit area time and space points are obtained. The characteristic vector is dimensionless processed to obtain a standard characteristic vector, and a time and space cluster analysis is performed on the standard characteristic vector and the unit area time and space points to obtain multiple dynamic clustering areas. The time and space cluster analysis of the standard characteristic vector and the unit area time and space points can identify dynamic areas with similar thermoelectric characteristics and adapt to the circuit board in different working conditions. Dynamic changes; then identify the clustering parameters of the dynamic clustering area, wherein the clustering parameters include: regional average temperature, current density root mean square value, construct a comprehensive cost function of the dynamic clustering area according to the clustering parameters and the preset cost factor weight set, use the comprehensive cost function to perform adaptive gradient descent on the dynamic clustering area, and obtain the terminal resistance value of the dynamic clustering area, wherein the cost factor weight set includes: temperature weight coefficient, circuit weight coefficient, current density weight coefficient, by constructing the comprehensive cost function of the dynamic clustering area, the multi-objective collaborative optimization of the circuit board performance is achieved, and the adaptive gradient descent is used to solve the dynamic clustering The terminal resistance value of the cluster area ensures the globality and stability of the optimization result; finally, the global energy efficiency ratio is calculated based on the terminal resistance value, and it is judged whether the global energy efficiency ratio is less than the preset energy efficiency ratio. If the global energy efficiency ratio is less than the preset energy efficiency ratio, the cost factor weight set is updated and the above-mentioned step of constructing the comprehensive cost function of the dynamic cluster area based on the clustering parameters and the preset cost factor weight set is returned. If the global energy efficiency ratio is not less than the preset energy efficiency ratio, the flexible temperature-sensitive resistor circuit board and the pre-built liquid crystal display are integrated according to the terminal resistance value. By introducing the global energy efficiency ratio judgment and weight coefficient update mechanism, a closed-loop optimization system is formed. Therefore, the integrated connection method of the liquid crystal display based on the flexible temperature-sensitive resistor circuit board proposed in the present invention mainly aims to improve the circuit signal integrity and circuit system stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Figure 1 A schematic flow chart of a method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to an embodiment of the present invention;

[0089] Figure 2 A schematic structural diagram of an electronic device for implementing the liquid crystal display integrated connection method based on a flexible temperature-sensitive resistor circuit board provided by an embodiment of the present invention.

[0090] The purpose, features and advantages of the present invention will be further described with reference to the accompanying drawings and in conjunction with the embodiments. DETAILED DESCRIPTION

[0091] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0092] The embodiment of the present application provides an integrated connection method for a liquid crystal display based on a flexible temperature-sensitive resistor circuit board. The execution subject of the integrated connection method for a liquid crystal display based on a flexible temperature-sensitive resistor circuit board includes but is not limited to at least one of the electronic devices such as a server and a terminal that can be configured to execute the method provided by the embodiment of the present application. In other words, the integrated connection method for a liquid crystal display based on a flexible temperature-sensitive resistor circuit board can be executed by software or hardware installed on a terminal device or a server device. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. Example

[0093] Reference Figure 1 FIG2 is a flow chart of a method for connecting an LCD display integrated with a flexible temperature-sensitive resistor circuit board according to an embodiment of the present invention. In this embodiment, the method for connecting an LCD display integrated with a flexible temperature-sensitive resistor circuit board includes:

[0094] S1. Divide the pre-built flexible temperature-sensitive resistor circuit board into a space to obtain a set of square unit areas, and identify a surface temperature field value set and a current density field value set of each square unit area in the set of square unit areas.

[0095] It should be explained that the flexible temperature-sensing resistor circuit board is an electronic component that combines a flexible circuit board and a temperature-sensitive resistor element. The square unit area set refers to a set of square unit areas obtained by dividing the flexible temperature-sensing resistor circuit board into square areas. The surface temperature field value set refers to a set of surface temperature values ​​at each sampling point in the square unit area set. The current density field value set refers to a set of current density values ​​at each sampling point in the square unit area set.

[0096] In detail, the identifying of the surface temperature field value set and the current density field value set of each square unit area in the square unit area set includes:

[0097] Obtaining the current temperature-sensing resistance value of each sampling point within the square unit area to obtain a current temperature-sensing resistance value set, and identifying the surface temperature field value set of each square unit area based on a preset temperature-resistance response relationship and the current temperature-sensing resistance value set, wherein the temperature-resistance response relationship refers to the response relationship between the temperature-sensing resistance value and the surface temperature field value;

[0098] According to the surface temperature field value set of the square unit area, combined with the preset electrothermal coupling simulation numerical simulation method, the current density field value of each sampling point in the square unit area is calculated to obtain the current density field value set.

[0099] It should be explained that the sampling points in the square unit area refer to the locations where the temperature-sensitive resistance values ​​are sampled, and the current temperature-sensitive resistance values ​​of the respective sampling points in the square unit area are calculated according to the physical laws of the voltage divider circuit.

[0100] It should be emphasized that the electrothermal coupling simulation numerical simulation method is a multi-physics field modeling technology method. By establishing an electrothermal model in the COMSOL simulation software and inputting the surface temperature field value set of each square unit area in the identified square unit area set, the current density field value of each sampling point in the square unit area is calculated to obtain the current density field value set.

[0101] S2. Calculate the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative based on the surface temperature field numerical set and the current density field numerical set.

[0102] It should be explained that the unit average temperature refers to the average surface temperature field value of the sampling points within the square unit area, the unit temperature gradient modulus refers to the gradient modulus of the unit average temperature, the unit current density effective value refers to the average current density field value of the sampling points within the square unit area, and the unit temperature partial derivative refers to the partial derivative of the unit average temperature with respect to time.

[0103] In detail, the calculation of the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative based on the surface temperature field value set and the current density field value set includes:

[0104] According to the surface temperature field value set and the preset number of sampling points, the unit average temperature is calculated using a preset average value formula, wherein the average value formula is as follows:

[0105]

[0106] in, is the average unit temperature, is the number of sampling points in the square unit area, The first Surface temperature field values ​​at each sampling point;

[0107] Identify adjacent square unit areas of the square unit area, obtain adjacent unit average temperatures of the adjacent square unit areas, and calculate the unit temperature gradient modulus according to a preset unit area side length and adjacent unit average temperature using a preset two-dimensional finite difference method formula, wherein the adjacent unit average temperature includes: upper adjacent unit average temperature, lower adjacent unit average temperature, left adjacent unit average temperature, and right adjacent unit average temperature, wherein the two-dimensional finite difference method formula is as follows:

[0108]

[0109] in, is the unit temperature gradient mode length, is the side length of the unit area, represents the average temperature of the right adjacent unit, represents the average temperature of the left adjacent unit, represents the average temperature of the upper adjacent unit, represents the average temperature of the adjacent unit;

[0110] According to the current density field value set and the number of sampling points, the effective value of the unit current density is calculated by the preset effective value formula, wherein the effective value formula is as follows:

[0111]

[0112] in, is the effective value of the unit current density, The first Current density field value at each sampling point;

[0113] Obtain a sampling time interval, determine a parameter sampling sequence based on the sampling time interval, obtain the unit average temperature at each parameter sampling moment in the parameter sampling sequence, obtain a unit average temperature set, and calculate the unit temperature partial derivative at the parameter sampling moment using a preset backward difference method formula based on the sampling time interval and the unit average temperature set. The backward difference method formula is as follows:

[0114]

[0115] in, is the partial derivative of the unit temperature at the parameter sampling time t, is the sampling time interval, is the average temperature of the unit at time t, for The average temperature of the unit at time.

[0116] It should be explained that the adjacent square unit area refers to the square unit area adjacent to the square unit area. The adjacent unit average temperature refers to the average temperature of the adjacent square unit area. The unit area side length refers to the side length of the square unit area.

[0117] It should be explained that the surface temperature field value refers to the surface temperature value at the sampling point. The number of sampling points refers to the number of sampling points within the square unit area. The upper adjacent unit average temperature refers to the unit average temperature of the square unit area adjacent to the square unit area above the square unit area. The lower adjacent unit average temperature refers to the unit average temperature of the square unit area adjacent to the square unit area below the square unit area. The left adjacent unit average temperature refers to the unit average temperature of the square unit area adjacent to the left of the square unit area. The right adjacent unit average temperature refers to the unit average temperature of the square unit area adjacent to the right of the square unit area.

[0118] It should be emphasized that the current density field value refers to the current density value at the sampling point. The sampling time interval refers to the time interval for obtaining the unit average temperature. The parameter sampling sequence refers to the sequence of parameter sampling moments. The unit average temperature set refers to the set of unit average temperatures at the parameter sampling moments.

[0119] For example, when the sampling time interval is When , the parameter sampling timing is The set of non-negative integer multiples of , The partial derivative of the unit temperature at time t is: , The partial derivative of the unit temperature at time t is: .

[0120] S3. Construct a characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative.

[0121] It should be explained that the characteristic vector refers to a vector that characterizes the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative of the square unit area.

[0122] Specifically, constructing the characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative includes:

[0123] The characteristic vector parameters are determined according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative. The characteristic vector of the square unit area is constructed by the characteristic vector parameters, wherein the characteristic vector parameters refer to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative. The characteristic vector is as follows:

[0124]

[0125] in, represents the feature vector.

[0126] S4. Obtaining the unit area space-time points, performing dimensionless processing on the characteristic vector to obtain a standard characteristic vector, performing space-time clustering analysis on the standard characteristic vector and the unit area space-time points, and obtaining multiple dynamic clustering areas.

[0127] It should be explained that the unit area space-time point refers to the symbolic point of the square unit area at the parameter sampling time, which is used to represent the square unit area at the parameter sampling time. The standard eigenvector refers to the standardized eigenvector that characterizes the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative of the square unit area. The space-time clustering analysis is a square unit area clustering method that integrates spatial proximity, time evolution continuity, and multi-physical field state similarity. The dynamic clustering area refers to a set of clustering areas of square unit areas that dynamically change with time.

[0128] In detail, the dimensionless processing of the feature vector to obtain a standard feature vector includes:

[0129] The eigenvector parameters are dimensionally non-scaled using a preset dimensionless formula to obtain standard vector parameters, wherein the dimensionless formula is as follows:

[0130]

[0131] in, express Moment Rank The eigenvector parameters of the square unit area of ​​the column, Express The standard vector parameters obtained after dimensionless processing, Represents the average value of the characteristic vector parameters of each square unit area at each parameter sampling moment, Represents the standard deviation of the eigenvector parameters of each square unit area at each parameter sampling moment;

[0132] A standard feature vector is constructed according to the standard vector parameters.

[0133] Specifically, the spatiotemporal clustering analysis is performed on the standard feature vectors and the spatiotemporal points of the unit area to obtain multiple dynamic clustering areas, including:

[0134] Gather the standard eigenvectors of each square unit area to obtain a standard eigenvector group;

[0135] Perform spatiotemporal clustering analysis on the standard feature vector group and the unit area spatiotemporal points to obtain multiple dynamic clustering areas. The unit area spatiotemporal points are determined by the number of rows and columns of the square unit area and the parameter sampling time. The unit area spatiotemporal point p of the square unit area in the jth row and kth column at the tth time is: ;

[0136] The spatiotemporal cluster analysis steps are as follows: based on the standard feature vector and the unit area spatiotemporal points, dynamic clustering areas are identified through preset spatiotemporal proximity conditions and feature similarity conditions. The spatiotemporal proximity conditions are:

[0137]

[0138]

[0139] in, Indicates the row number of the square unit area where the unit area space-time point p is located, Indicates the row number of the square unit area where the space-time point q is located, Indicates the column number of the square unit area where the space-time point p of the unit area is located, Indicates the column number of the square unit area where the space-time point q is located, Indicates the spatial action radius, represents the parameter sampling moment of the space-time point p in the unit area, represents the parameter sampling moment of the space-time point q in the unit area, is the time action window, Indicates the absolute value symbol;

[0140] The feature similarity conditions are:

[0141]

[0142] in, express The corresponding standard eigenvector A quantity, express The corresponding standard eigenvector A quantity, express and the characteristic distance of the unit area space-time point q, Represents the feature distance threshold.

[0143] It should be explained that the standard vector parameter refers to a vector parameter that eliminates dimension effects. The standard feature vector group refers to a set of standard feature vectors corresponding to different square unit areas. The spatiotemporal proximity condition refers to the clustering condition of two square unit areas in time and position. The feature similarity condition refers to the clustering condition that reflects the similarity of the feature vectors corresponding to two square unit areas.

[0144] It should be emphasized that the spatial action radius refers to the preset threshold value of the proximity distance of the square unit area. The time action window refers to the preset threshold value of the proximity of the parameter sampling moment. The feature distance refers to the similarity distance of the feature vector corresponding to the unit area space-time point. The feature distance threshold refers to the preset threshold value of the feature distance of the unit area space-time point, which can be .

[0145] For example, when the material of the two square unit areas is copper, the spatial effective radius can be taken as , the time action window can be taken as .

[0146] S5. Identify clustering parameters of the dynamic clustering region, wherein the clustering parameters include: regional average temperature and root mean square value of current density.

[0147] It should be explained that the clustering parameter refers to a parameter reflecting the characteristics of the dynamic clustering area, and the regional average temperature refers to the average temperature of the dynamic clustering area that changes with time and space.

[0148] In detail, the clustering parameters for identifying the dynamic clustering area include:

[0149] The clustering parameters of the dynamic clustering area are calculated according to the preset average value formula and the root mean square value formula. The average value formula is as follows:

[0150]

[0151] in, Indicates the Dynamic clustering regions, Represents dynamic clustering areas The average temperature of the region, Represents dynamic clustering areas The number of square unit areas included, Represents dynamic clustering areas The number of parameter sampling moments of the unit area space-time points contained in Indicates the The unit average temperature of the characteristic vector corresponding to the space-time point p of the unit area;

[0152] The root mean square value formula is as follows:

[0153]

[0154] in, Represents dynamic clustering areas The root mean square value of the current density, Indicates the Moment Rank The effective value of the unit current density corresponding to the unit area time and space point of the square unit area in the column.

[0155] S6. Constructing a comprehensive cost function of the dynamic clustering region according to the clustering parameters and the preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering region using the comprehensive cost function to obtain the terminal resistance value of the dynamic clustering region.

[0156] In detail, the cost factor weight set includes: a temperature weight coefficient, a circuit weight coefficient, and a current density weight coefficient.

[0157] It should be explained that the cost factor weight set refers to the set of weight coefficients of the comprehensive cost function. The comprehensive cost function is a scalar function that integrates the terminal resistance value optimization requirements in a differentiable form. The adaptive gradient descent refers to an iterative method for optimizing the terminal resistance value. The terminal resistor is an impedance matching element placed at the end of the circuit transmission line in the flexible temperature-sensitive resistor circuit board. Its resistance is equal to the characteristic impedance of the transmission line, which is used to eliminate signal reflection and ensure signal integrity. The terminal resistance value refers to the resistance value of the terminal resistor. The circuit design nominal resistance refers to the terminal resistance value calculated according to the signal transmission theory during the flexible circuit board circuit design stage. The temperature weight coefficient refers to the coefficient reflecting the weight of the average temperature of the area. The circuit weight coefficient refers to the coefficient reflecting the weight of the circuit design nominal resistance. The current density weight coefficient refers to the coefficient reflecting the weight of the root mean square value of the current density. For example, the temperature weight coefficient can be taken as , take the circuit weight coefficient as , the current density weight coefficient is The temperature weight coefficient can also be taken as , take the circuit weight coefficient as , the current density weight coefficient is .

[0158] In detail, the method of constructing a comprehensive cost function of the dynamic clustering area based on the clustering parameters and the preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering area using the comprehensive cost function to obtain the terminal resistance value of the dynamic clustering area includes:

[0159] A comprehensive cost function of the dynamic clustering region is constructed based on the clustering parameters and the preset cost factor weight set. The comprehensive cost function is:

[0160]

[0161] in, Represents dynamic clustering areas Terminal resistance variable The comprehensive cost function, Indicates the safe temperature of the flexible temperature sensing resistor circuit board. Indicates the nominal resistance of the circuit design, is the temperature weight coefficient, is the circuit weight coefficient, is the current density weight coefficient, Dynamic clustering area The terminal resistance variable;

[0162] Get an iterative update threshold, and construct an iterative update sequence according to the iterative update threshold, wherein the iterative update sequence is 0, 1, 2, , 200, 200 is the iterative update threshold;

[0163] Sequentially extract iterative update values ​​from the iterative update sequence,

[0164] A target gradient expression is constructed according to the iterative update value and the comprehensive cost function, wherein the target gradient expression is as follows:

[0165]

[0166] in, Indicates iterative update value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The partial derivative of the comprehensive cost function, Represents dynamic clustering areas The regional thermal resistance, ;

[0167] When the iterative update value is 0, the first iteration is calculated according to the preset initial iteration update formula and target gradient expression. Dynamic clustering area after iterative update The terminal resistance value, wherein the initial iterative update formula is as follows:

[0168]

[0169] in, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the dynamic clustering area that has not been iteratively updated The terminal resistance value, represents the initial learning rate, Represents the partial derivative of the comprehensive cost function without iterative update ;

[0170] When the iterative update value is not 0, the first Dynamic clustering area after iterative update The terminal resistance value, the general iterative update formula is as follows:

[0171]

[0172] in, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, ;

[0173] Determining whether the iterative update value is equal to the iterative update threshold;

[0174] If the iterative update value is not equal to the iterative update threshold, the Dynamic clustering area after iterative update Update the terminal resistance value of Dynamic clustering area after iterative update The terminal resistance value is obtained, and returning to the above step of sequentially extracting iteratively updated values ​​in the iteratively updated sequence;

[0175] If the iterative update value is equal to the iterative update threshold, the The terminal resistance value after the iteration update is used as the terminal resistance value of the dynamic clustering area.

[0176] It should be explained that the iterative update threshold refers to a preset maximum value of the iterative update value. The iterative update sequence refers to all non-negative integer sequences from 0 to the maximum value of the iterative update value.

[0177] S7. Calculate the global energy efficiency ratio based on the terminal resistance value.

[0178] It should be explained that the global energy efficiency ratio refers to the ratio of the effective output energy of the flexible temperature-sensitive resistor circuit board to the total input energy, and the preset energy efficiency ratio can be 70%.

[0179] In detail, the calculation of the global energy efficiency ratio according to the terminal resistance value includes:

[0180] The global energy efficiency ratio of the terminal resistance value is calculated according to a preset global energy efficiency ratio formula, which is as follows:

[0181]

[0182] in, Represents dynamic clustering areas of load resistance.

[0183] It should be emphasized that Represents the dynamic clustering area obtained after 201 iterations Terminal resistance value

[0184] S8. Determine whether the global energy efficiency ratio of the terminal resistance value is less than a preset energy efficiency ratio.

[0185] If the global energy efficiency ratio is less than the preset energy efficiency ratio, execute S9 to update the cost factor weight set.

[0186] Return to the above step of constructing a comprehensive cost function for dynamic clustering regions based on the clustering parameters and the preset cost factor weight set.

[0187] If the global energy efficiency ratio is not less than the preset energy efficiency ratio, S10 is executed to integrally connect the flexible temperature-sensing resistor circuit board and the pre-built liquid crystal display according to the terminal resistance value.

[0188] It should be explained that the integrated connection refers to redesigning the distributed resistance network layout of the flexible temperature-sensing resistor circuit board based on the optimized terminal resistance values ​​of each dynamic clustering area, so as to realize the integrated connection of the flexible temperature-sensing resistor circuit board and the pre-built liquid crystal display.

[0189] Compared with the problem described in the background technology, the present invention first divides the pre-constructed flexible temperature-sensing resistor circuit board into spaces to obtain a set of square unit areas, identifies the surface temperature field value set and the current density field value set of each square unit area in the square unit area set, and calculates the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative according to the surface temperature field value set and the current density field value set. The present invention divides the pre-constructed flexible temperature-sensing resistor circuit board into spaces and collects the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative data, thereby realizing Refined monitoring of the working status of the circuit board provides an accurate data basis for subsequent optimization; secondly, the characteristic vector of the square unit area is constructed according to the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative, and the unit area time and space points are obtained. The characteristic vector is dimensionless processed to obtain a standard characteristic vector, and a time and space cluster analysis is performed on the standard characteristic vector and the unit area time and space points to obtain multiple dynamic clustering areas. The time and space cluster analysis of the standard characteristic vector and the unit area time and space points can identify dynamic areas with similar thermoelectric characteristics and adapt to the circuit board in different working conditions. Dynamic changes; then identify the clustering parameters of the dynamic clustering area, wherein the clustering parameters include: regional average temperature, current density root mean square value, construct a comprehensive cost function of the dynamic clustering area according to the clustering parameters and the preset cost factor weight set, use the comprehensive cost function to perform adaptive gradient descent on the dynamic clustering area, and obtain the terminal resistance value of the dynamic clustering area, wherein the cost factor weight set includes: temperature weight coefficient, circuit weight coefficient, current density weight coefficient, by constructing the comprehensive cost function of the dynamic clustering area, the multi-objective collaborative optimization of the circuit board performance is achieved, and the adaptive gradient descent is used to solve the dynamic clustering The terminal resistance value of the class area ensures the globality and stability of the optimization result; finally, the global energy efficiency ratio is calculated based on the terminal resistance value, and it is judged whether the global energy efficiency ratio is less than the preset energy efficiency ratio. If the global energy efficiency ratio is less than the preset energy efficiency ratio, the cost factor weight set is updated and the above-mentioned step of constructing the comprehensive cost function of the dynamic clustering area according to the clustering parameters and the preset cost factor weight set is returned. If the global energy efficiency ratio is not less than the preset energy efficiency ratio, the flexible temperature-sensitive resistor circuit board and the pre-built liquid crystal display are integrated according to the terminal resistance value. By introducing the global energy efficiency ratio judgment and weight coefficient update mechanism, a closed-loop optimization system is formed. Therefore, the integrated connection method of the liquid crystal display based on the flexible temperature-sensitive resistor circuit board proposed in the present invention mainly aims to solve the problems of poor stability, reliability and energy efficiency performance of the display system caused by the fixed terminal resistance value. Example

[0190] like Figure 21 is a structural diagram of an electronic device that implements an integrated connection method of a liquid crystal display based on a flexible temperature-sensitive resistor circuit board provided by an embodiment of the present invention.

[0191] The electronic device 1 may include a processor 10, a memory 11, a bus 12 and a communication interface 13, and may also include a computer program stored in the memory 11 and run on the processor 10, such as an integrated connection program for a liquid crystal display based on a flexible temperature-sensitive resistor circuit board.

[0192] The memory 11 includes at least one type of readable storage medium, including flash memory, a mobile hard disk, a multimedia card, a card-type memory (e.g., SD or DX memory), a magnetic memory, a magnetic disk, an optical disk, etc. In some embodiments, the memory 11 may be an internal storage unit of the electronic device 1, such as a mobile hard disk of the electronic device 1. In other embodiments, the memory 11 may also be an external storage device of the electronic device 1, such as a plug-in mobile hard disk, a Smart Media Card (SMC), a Secure Digital (SD) card, a Flash Card, etc. equipped on the electronic device 1. Furthermore, the memory 11 may include both an internal storage unit of the electronic device 1 and an external storage device. The memory 11 can be used not only to store application software installed in the electronic device 1 and various types of data, such as the code for the integrated connection program for an LCD display based on a flexible temperature-sensitive resistor circuit board, but also to temporarily store data that has been output or is about to be output.

[0193] In some embodiments, the processor 10 may be composed of an integrated circuit, such as a single packaged integrated circuit or a plurality of packaged integrated circuits with the same or different functions, including one or more central processing units (CPUs), microprocessors, digital processing chips, graphics processors, and a combination of various control chips. The processor 10 is the control core (Control Unit) of the electronic device, connecting the various components of the entire electronic device using various interfaces and circuits. It executes or runs programs or modules stored in the memory 11 (such as a program for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board) and calls data stored in the memory 11 to perform various functions and process data.

[0194] The bus may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. The bus may be divided into an address bus, a data bus, a control bus, etc. The bus is configured to enable communication between the memory 11 and at least one processor 10, etc.

[0195] Figure 2 Only the electronic device with components is shown, and it can be understood by those skilled in the art that Figure 2 The structure shown does not constitute a limitation on the electronic device 1 , and may include fewer or more components than shown in the figure, or combine certain components, or arrange the components differently.

[0196] For example, although not shown, the electronic device 1 may further include a power supply (e.g., a battery) to power various components. Preferably, the power supply may be logically connected to the at least one processor 10 via a power management device, thereby enabling functions such as charge management, discharge management, and power consumption management via the power management device. The power supply may further include any components such as one or more DC or AC power supplies, a recharging device, a power failure detection circuit, a power converter or inverter, and a power status indicator. The electronic device 1 may also include various sensors, Bluetooth modules, Wi-Fi modules, etc., which are not further described here.

[0197] Furthermore, the electronic device 1 may also include a network interface. Optionally, the network interface may include a wired interface and / or a wireless interface (such as a WI-FI interface, a Bluetooth interface, etc.), which is generally used to establish a communication connection between the electronic device 1 and other electronic devices.

[0198] Optionally, the electronic device 1 may further include a user interface, which may be a display or an input unit (such as a keyboard). Optionally, the user interface may also be a standard wired interface or a wireless interface. Optionally, in some embodiments, the display may be an LED display, a liquid crystal display, a touch-sensitive liquid crystal display, or an OLED (Organic Light-Emitting Diode) touchscreen. The display may also be appropriately referred to as a display screen or a display unit, and is used to display information processed in the electronic device 1 and to display a visual user interface.

[0199] It should be understood that the embodiment is for illustration only and the scope of the patent application is not limited to this structure.

[0200] The liquid crystal display integrated connection program based on the flexible temperature-sensitive resistor circuit board stored in the memory 11 of the electronic device 1 is a combination of multiple instructions. When running in the processor 10, it can achieve the following:

[0201] Dividing the pre-built flexible temperature-sensitive resistor circuit board into a space to obtain a set of square unit areas, and identifying a surface temperature field value set and a current density field value set for each square unit area in the set of square unit areas;

[0202] Calculate the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative based on the surface temperature field value set and the current density field value set;

[0203] Constructing a characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative;

[0204] Obtaining unit area spatiotemporal points, performing dimensionless processing on the characteristic vector to obtain a standard characteristic vector, performing spatiotemporal clustering analysis on the standard characteristic vector and the unit area spatiotemporal points to obtain a plurality of dynamic clustering areas;

[0205] Identifying clustering parameters of the dynamic clustering region, wherein the clustering parameters include: regional average temperature and root mean square value of current density;

[0206] Constructing a comprehensive cost function for the dynamic clustering region based on the clustering parameters and a preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering region using the comprehensive cost function to obtain a terminal resistance value of the dynamic clustering region, wherein the cost factor weight set includes: a temperature weight coefficient, a circuit weight coefficient, and a current density weight coefficient;

[0207] Calculate the global energy efficiency ratio based on the terminal resistance value;

[0208] Determine whether the global energy efficiency ratio is less than the preset energy efficiency ratio;

[0209] If the global energy efficiency ratio is less than the preset energy efficiency ratio, the cost factor weight set is updated and the process of constructing a comprehensive cost function of the dynamic clustering region based on the clustering parameters and the preset cost factor weight set is returned to the above step;

[0210] If the global energy efficiency ratio is not less than the preset energy efficiency ratio, the flexible temperature-sensing resistor circuit board and the pre-built liquid crystal display are integrated and connected according to the terminal resistance value.

[0211] Specifically, the specific implementation method of the processor 10 for the above instructions can refer to Figures 1 to 2 The description of the relevant steps in the corresponding embodiments will not be repeated here.

[0212] Furthermore, if the modules / units integrated into the electronic device 1 are implemented as software functional units and sold or used as independent products, they may be stored in a computer-readable storage medium. The computer-readable storage medium may be volatile or non-volatile. For example, the computer-readable medium may include any entity or device capable of carrying the computer program code, a recording medium, a USB flash drive, a mobile hard drive, a magnetic disk, an optical disk, a computer memory, or a read-only memory (ROM).

[0213] The present invention further provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program. When the computer program is executed by a processor of an electronic device, the computer program can implement:

[0214] Dividing the pre-built flexible temperature-sensitive resistor circuit board into a space to obtain a set of square unit areas, and identifying a surface temperature field value set and a current density field value set for each square unit area in the set of square unit areas;

[0215] Calculate the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative based on the surface temperature field value set and the current density field value set;

[0216] Constructing a characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative;

[0217] Obtaining unit area spatiotemporal points, performing dimensionless processing on the characteristic vector to obtain a standard characteristic vector, performing spatiotemporal clustering analysis on the standard characteristic vector and the unit area spatiotemporal points to obtain a plurality of dynamic clustering areas;

[0218] Identifying clustering parameters of the dynamic clustering region, wherein the clustering parameters include: regional average temperature and root mean square value of current density;

[0219] Constructing a comprehensive cost function for the dynamic clustering region based on the clustering parameters and a preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering region using the comprehensive cost function to obtain a terminal resistance value of the dynamic clustering region, wherein the cost factor weight set includes: a temperature weight coefficient, a circuit weight coefficient, and a current density weight coefficient;

[0220] Calculate the global energy efficiency ratio based on the terminal resistance value;

[0221] Determine whether the global energy efficiency ratio is less than the preset energy efficiency ratio;

[0222] If the global energy efficiency ratio is less than the preset energy efficiency ratio, the cost factor weight set is updated and the process of constructing a comprehensive cost function of the dynamic clustering region based on the clustering parameters and the preset cost factor weight set is returned to the above step;

[0223] If the global energy efficiency ratio is not less than the preset energy efficiency ratio, the flexible temperature-sensing resistor circuit board and the pre-built liquid crystal display are integrated and connected according to the terminal resistance value.

[0224] The modules described as separate components may or may not be physically separate, and the components shown as modules may or may not be physical units, that is, they may be located in one place or distributed across multiple network elements. Some or all of the modules may be selected to achieve the purpose of the solution of this embodiment according to actual needs.

[0225] In addition, the functional modules in various embodiments of the present invention may be integrated into a single processing unit, each unit may exist physically separately, or two or more units may be integrated into a single unit. The aforementioned integrated units may be implemented in the form of hardware or hardware plus software functional modules.

[0226] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0227] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not limiting. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board, characterized in that: The method comprises: The pre-built flexible temperature-sensitive resistor circuit board is spatially divided to obtain a set of square unit areas, and a surface temperature field value set and a current density field value set of each square unit area in the set of square unit areas are identified; Calculate the unit average temperature, unit temperature gradient modulus, unit current density effective value, and unit temperature partial derivative based on the surface temperature field value set and the current density field value set; Constructing a characteristic vector of the square unit area according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative; Obtaining unit area spatiotemporal points, performing dimensionless processing on the characteristic vector to obtain a standard characteristic vector, performing spatiotemporal clustering analysis on the standard characteristic vector and the unit area spatiotemporal points to obtain a plurality of dynamic clustering areas; Identifying clustering parameters of the dynamic clustering region, wherein the clustering parameters include: regional average temperature and root mean square value of current density; Constructing a comprehensive cost function for the dynamic clustering region based on the clustering parameters and a preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering region using the comprehensive cost function to obtain a terminal resistance value of the dynamic clustering region, wherein the cost factor weight set includes: a temperature weight coefficient, a circuit weight coefficient, and a current density weight coefficient; Calculate the global energy efficiency ratio based on the terminal resistance value; Determine whether the global energy efficiency ratio is less than the preset energy efficiency ratio; If the global energy efficiency ratio is less than the preset energy efficiency ratio, the cost factor weight set is updated and the process of constructing a comprehensive cost function of the dynamic clustering region based on the clustering parameters and the preset cost factor weight set is returned to the above step; If the global energy efficiency ratio is not less than the preset energy efficiency ratio, the flexible temperature-sensing resistor circuit board and the pre-built liquid crystal display are integrally connected according to the terminal resistance value; The method of constructing a comprehensive cost function of the dynamic clustering region based on the clustering parameters and the preset cost factor weight set, and performing adaptive gradient descent on the dynamic clustering region using the comprehensive cost function to obtain the terminal resistance value of the dynamic clustering region includes: Constructing a comprehensive cost function for dynamic clustering regions based on clustering parameters and a preset set of cost factor weights; Get an iterative update threshold, and construct an iterative update sequence according to the iterative update threshold, wherein the iterative update sequence is 0, 1, 2, , 200, 200 is the iterative update threshold; Iterative update values ​​are sequentially extracted from the iterative update sequence, and a target gradient expression is constructed according to the iterative update values ​​and the comprehensive cost function, wherein the target gradient expression is as follows: in, Indicates iterative update value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The partial derivative of the comprehensive cost function, Represents dynamic clustering areas The regional thermal resistance, ; When the iterative update value is 0, the first iteration is calculated according to the preset initial iteration update formula and target gradient expression. Dynamic clustering area after iterative update The terminal resistance value; When the iterative update value is not 0, the first Dynamic clustering area after iterative update The terminal resistance value; Determining whether the iterative update value is equal to the iterative update threshold; If the iterative update value is not equal to the iterative update threshold, the Dynamic clustering area after iterative update Update the terminal resistance value of Dynamic clustering area after iterative update The terminal resistance value is obtained, and returning to the above step of sequentially extracting iteratively updated values ​​in the iteratively updated sequence; If the iterative update value is equal to the iterative update threshold, the The terminal resistance value after the iteration update is used as the terminal resistance value of the dynamic clustering area.

2. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 1, wherein: The identifying of the surface temperature field value set and the current density field value set of each square unit area in the square unit area set includes: Obtaining the current temperature-sensing resistance value of each sampling point within the square unit area to obtain a current temperature-sensing resistance value set, and identifying the surface temperature field value set of each square unit area based on a preset temperature-resistance response relationship and the current temperature-sensing resistance value set, wherein the temperature-resistance response relationship refers to the response relationship between the temperature-sensing resistance value and the surface temperature field value; According to the surface temperature field value set of the square unit area, combined with the preset electrothermal coupling simulation numerical simulation method, the current density field value of each sampling point in the square unit area is calculated to obtain the current density field value set.

3. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 2, wherein: The calculation of the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative based on the surface temperature field value set and the current density field value set includes: According to the surface temperature field value set and the preset number of sampling points, the unit average temperature is calculated using the preset average value formula; Identify adjacent square unit areas of the square unit area, obtain adjacent unit average temperatures of the adjacent square unit areas, and calculate the unit temperature gradient modulus using a preset two-dimensional finite difference method formula based on a preset unit area side length and adjacent unit average temperature, wherein the adjacent unit average temperature includes: an upper adjacent unit average temperature, a lower adjacent unit average temperature, a left adjacent unit average temperature, and a right adjacent unit average temperature; According to the current density field value set and the number of sampling points, the effective current density of the unit is calculated by the preset effective value formula; Obtain a sampling time interval, determine a parameter sampling sequence based on the sampling time interval, obtain the unit average temperature at each parameter sampling moment in the parameter sampling sequence, obtain a unit average temperature set, and calculate the unit temperature partial derivative at the parameter sampling moment using a preset backward difference formula based on the sampling time interval and the unit average temperature set.

4. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 3, wherein: The characteristic vector of the square unit area is constructed according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative, including: The characteristic vector parameters are determined according to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative, and the characteristic vector of the square unit area is constructed by the characteristic vector parameters, wherein the characteristic vector parameters refer to the unit average temperature, the unit temperature gradient modulus, the unit current density effective value, and the unit temperature partial derivative.

5. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 4, wherein: The dimensionless processing of the eigenvector to obtain a standard eigenvector includes: The eigenvector parameters are dimensionally processed using a preset dimensionless formula to obtain standard vector parameters; A standard feature vector is constructed according to the standard vector parameters.

6. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 5, wherein: The spatiotemporal clustering analysis is performed on the standard feature vectors and the spatiotemporal points of the unit area to obtain multiple dynamic clustering areas, including: Gather the standard eigenvectors of each square unit area to obtain a standard eigenvector group; Perform spatiotemporal clustering analysis on the standard feature vector group and the unit area spatiotemporal points to obtain multiple dynamic clustering areas. The unit area spatiotemporal points are determined by the number of rows and columns of the square unit area and the parameter sampling time. The unit area spatiotemporal point p of the square unit area in the jth row and kth column at the tth time is: ; The spatiotemporal cluster analysis steps are as follows: based on the standard feature vector and the unit area spatiotemporal points, dynamic clustering areas are identified through preset spatiotemporal proximity conditions and feature similarity conditions.

7. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 6, wherein: The clustering parameters for identifying the dynamic clustering area include: The clustering parameters of the dynamic clustering area are calculated according to the preset average value formula and root mean square value formula.

8. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 1, wherein: The calculating of the global energy efficiency ratio according to the terminal resistance value includes: The global energy efficiency ratio of the terminal resistance is calculated according to the preset global energy efficiency ratio formula.

9. The method for integrating a liquid crystal display with a flexible temperature-sensitive resistor circuit board according to claim 1, wherein: The general iterative update formula is as follows: in, Indicates the Dynamic clustering area after iterative update The terminal resistance value, Indicates the Dynamic clustering area after iterative update The terminal resistance value, .

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