A solid state disk self-assembled with an internal flow system and a heat dissipation method thereof

Abstract

The application relates to the field of solid state disk heat dissipation technology, and discloses a solid state disk self-assembled with an internal flow system and a heat dissipation method thereof. The solid state disk comprises a detection module, which analyzes collected sensor data to obtain temperature distribution information; an activation module, which activates a heat pipe working fluid to establish a transmission path; a conduction module, which guides heat to a condensing section through the heat pipe; an absorption module, which buffers peak heat by using a phase change material; and a release module, which dissipates heat to the environment through heat dissipation fins. The application realizes efficient conduction, storage and release of internal heat of the solid state disk, so that the heat dissipation system can adaptively adjust a heat dissipation strategy according to a working load, effectively cope with temperature fluctuations, and ensure long-term stable operation of the equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of solid state disk heat dissipation technology, and in particular to a solid state disk self-assembled with an internal flow system and a heat dissipation method thereof. BACKGROUND

[0002] With the rapid development of computer technology, solid state disks (SSD) have gradually become mainstream storage devices due to their high-speed data transmission capability and reliability. Compared with traditional mechanical hard disks, solid state disks do not contain mechanical structures, use flash memory chips to store data, and have the advantages of fast read and write speed, strong anti-vibration, low noise, etc. However, with the increase of data throughput and chip integration, solid state disks will generate a large amount of heat when working under high load. Especially when the master control chip, flash chip array and cache module are running at high speed at the same time, heat is concentrated and difficult to dissipate, and the temperature rises rapidly. The existing solid state disk heat dissipation technology mainly includes passive heat dissipation methods such as metal shell heat conduction, heat sink attachment, external heat sink, and active heat dissipation methods assisted by forced air cooling in server environment. These methods can basically meet the heat dissipation needs in ordinary use environment and ensure the equipment to work within the normal temperature range.

[0003] However, the existing technology has many deficiencies. First, the traditional heat dissipation structure is difficult to cope with sudden high load working state, and the temperature fluctuation is obvious, which affects the equipment life and performance stability. Second, the conventional heat dissipation system lacks intelligent monitoring and control function, and cannot adaptively adjust the heat dissipation strategy for different working states, resulting in low heat dissipation efficiency or energy waste. Third, most of the heat dissipation schemes rely on external heat dissipation structure or environmental conditions, and the effect is significantly reduced in space-limited or poor air flow use environment. Fourth, the existing heat pipe heat dissipation technology is mostly simple application, which fails to fully utilize the high efficient heat transfer characteristics of heat pipe, and the combination with advanced heat dissipation technologies such as phase change material is not close enough. In addition, the integration of the heat dissipation system and the storage system is not high, which increases the product design complexity and manufacturing cost, and is not conducive to market promotion and application. SUMMARY

[0004] The present application provides a solid state disk self-assembled with an internal flow system and a heat dissipation method thereof, which is used to realize efficient conduction, storage and release of internal heat of the solid state disk by constructing an internal self-assembled flow system, integrating a heat pipe array, a phase change material and a microelectronic temperature control network, so that the heat dissipation system can adaptively adjust the heat dissipation strategy according to the working load, effectively cope with temperature fluctuation and ensure long-term stable operation of the equipment.

[0005] In a first aspect, the present application provides a solid state disk self-assembled with an internal flow system, comprising:

[0006] The detection module is configured to detect digital temperature sensor data of a temperature monitoring network system, and obtain temperature distribution information of a heat pipe array structure and a phase change material heat dissipation module.

[0007] The activation module is configured to activate working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat, and a heat transfer path is obtained.

[0008] The conduction module is configured to conduct heat of a surrounding area of the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure.

[0009] The absorption module is configured to absorb peak heat during temperature fluctuation by using the phase change material heat dissipation module, so that a heat buffering effect is obtained.

[0010] The release module is configured to release heat to an external environment via a heat dissipation fin assembly of the peripheral passive heat dissipation structure.

[0011] In a second aspect, the application provides a heat dissipation method for a solid state disk self-assembled with an internal flow system, including: detecting digital temperature sensor data of a temperature monitoring network system, and obtaining temperature distribution information of a heat pipe array structure and a phase change material heat dissipation module; activating working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat, and a heat transfer path is obtained; conducting heat of a surrounding area of a layered structure heat dissipation substrate to a condensation section through the heat pipe array structure; absorbing peak heat during temperature fluctuation by using the phase change material heat dissipation module, so that a heat buffering effect is obtained; and releasing heat to an external environment via a heat dissipation fin assembly of a peripheral passive heat dissipation structure.

[0012] In the technical scheme provided in the application, the solid state disk self-assembled with the internal flow system can obtain temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module in real time by detecting temperature monitoring network system digital temperature sensor data, ensure accurate perception and rapid response of the system to temperature changes, provide accurate data basis for heat dissipation strategy, and simultaneously activate the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat, establishes an efficient heat transfer path, realizes rapid transfer of heat energy from a high temperature zone to a low temperature zone, greatly improves heat conduction efficiency, reduces local hotspot temperature, and conducts heat around the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure, realizes the process of heat outward transmission, forms a heat conduction channel, so that heat can flow in an orderly manner and be timely dredged, avoids heat accumulation around sensitive components, effectively prevents performance degradation and shortens the service life caused by local overheating, in addition, the phase change material heat dissipation module absorbs peak heat during temperature fluctuation, obtains heat buffering effect, significantly reduces the impact of temperature fluctuation on the system, smooths the temperature curve, prolongs the service life of the equipment, improves the system stability, especially in high load burst working state, and the heat is released to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure, realizes the process of temperature reduction, increases the heat dissipation area, improves the heat exchange efficiency with the environment, ensures that heat can be continuously discharged from the system, maintains overall temperature balance, reduces the overall working temperature of the solid state disk, and finally adjusts the heat dissipation process parameters according to the continuous monitoring results through the central processing unit of the temperature monitoring network system, realizes dynamic control of the internal temperature of the solid state disk, so that the heat dissipation system has intelligent and adaptive characteristics, can automatically adjust the heat dissipation strategy according to different working states, reduces energy consumption while ensuring heat dissipation effect, and improves the overall efficiency of the system. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the technical scheme of the embodiments of the application, the drawings required in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the application, and those skilled in the art can obtain other drawings based on the drawings without creating labor.

[0014] Figure 1 An embodiment schematic diagram of the solid state disk self-assembled with the internal flow system in the embodiment of the application;

[0015] Figure 2 An embodiment schematic diagram of the heat dissipation method of the solid state disk self-assembled with the internal flow system in the embodiment of the application. DETAILED DESCRIPTION

[0016] The embodiment of the present application provides a solid state disk self-assembled with an internal flow system and a heat dissipation method thereof. The terms "first", "second", "third", "fourth" and the like (if any) in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and do not have to be used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the term "comprising" or "having" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device including a series of steps or units does not have to be limited to those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to the process, method, product or device.

[0017] For ease of understanding, the specific flow of the embodiment of the present application is described below, please refer to Figure 1 One embodiment of the solid state disk self-assembled with an internal flow system in the embodiment of the present application comprises:

[0018] The detection module is used for detecting the digital temperature sensor data of the temperature monitoring network system, and obtaining the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module.

[0019] The activation module is used for activating the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat, and obtains a heat transfer path.

[0020] The conduction module is used for conducting the heat of the surrounding area of the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure.

[0021] The absorption module is used for absorbing the peak heat during temperature fluctuation by the phase change material heat dissipation module, so as to obtain a heat buffering effect.

[0022] The release module is used for releasing heat to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure.

[0023] It can be understood that the execution subject of the present application can be a solid state disk self-assembled with an internal flow system, and can also be a terminal or a server, and the specific execution subject is not limited herein. The embodiment of the present application takes the server as the execution subject for example.

[0024] Specifically, the detection module collects temperature data through a network of digital temperature sensors arranged at key locations of the solid-state drive. The sensors, manufactured using MEMS technology, are small in size, high in temperature measurement accuracy, and distributed at locations such as the main control chip, flash chip array, DRAM cache module, phase change material module, and heat pipe condensing section, forming fifteen temperature measurement points. The temperature data collected by the sensors is transmitted to the central processing unit through a two-wire digital bus, and after processing, the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module is generated. The activation module determines the temperature state of the eight miniature pulsating heat pipes in the heat pipe array based on the temperature distribution information provided by the detection module, and generates a heat pipe activation signal when the temperature reaches a preset threshold. This signal drives the modified alcohol compound working fluid inside the miniature pulsating heat pipe into a pre-activated state. The pre-activated working fluid is guided to the heat pipe evaporation section and the chip contact area, absorbs the heat generated by the circuit board heat generating elements, and forms heat carrying working fluid. The heat carrying working fluid is driven by capillary force in the microporous core structure, flows along the sintered copper powder microporous channel to form directional fluid, and moves to the heat pipe condensing section at both ends.

[0025] The conduction module is responsible for conducting heat from the surrounding area of the layered structure heat dissipation substrate to the condensing section through the heat pipe array structure. The three layers of material in the layered structure heat dissipation substrate (high thermal conductivity copper plate, three-dimensional graphene aerogel layer, and nano ceramic coating) form a heat conduction network that contacts and absorbs heat from the heat generating elements on the circuit board. The absorbed heat is transferred horizontally through the high thermal conductivity copper plate to the heat pipe array mounting groove, and then to the evaporation section of the heat pipe array. The heat pipe evaporation section transfers heat to the internal working fluid to form heat carrying working fluid. The heat carrying working fluid is driven by pressure difference inside the heat pipe to flow to both ends, while the horizontal copper sheet connection between the heat pipes forms a heat network structure, promoting uniform heat distribution. The heat flow is guided to the condensing section at both ends of the heat pipe, and the heat is transferred to the peripheral heat dissipation structure through the heat conducting copper pipe wall and the heat conducting silicone layer.

[0026] The absorption module uses the phase change material heat dissipation module to handle peak heat generated by temperature fluctuations. When the temperature of the solid-state drive exceeds the phase change temperature threshold of the phase change material, a phase change activation signal is triggered. This signal causes the porous copper mesh heat conduction structure inside the module to contact the phase change material, forming a heat conduction channel. After the heat is transferred, the temperature of the phase change material reaches the phase change point, and the latent heat of phase change is used to convert the heat into phase change energy, realizing the transition from solid to liquid. The heat released during the phase change process is dispersed and handled through the internal serpentine microchannel structure of the module, increasing the heat exchange area to form a uniform heat distribution state. The nano carbon tube enhancer in the phase change material improves the heat conduction rate, forming an enhanced heat conduction field, and then the heat is transferred from the phase change material to the aluminum alloy shell, gradually released through the black micro-porous structure on the surface of the shell, achieving heat buffering.

[0027] The release module transmits heat to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure. The heat of the condensation section of the heat pipe is transmitted to the copper base of the heat dissipation fin assembly, and a heat conduction channel is formed through the heat-conducting silicone grease layer. After the heat enters the heat dissipation fin assembly, it is expanded by the parallel arrangement of the high-thermal-conductivity aluminum alloy heat dissipation fins. The micro-groove structure on the surface of the heat dissipation fins increases the contact area with air and strengthens the convective heat transfer conditions. The black anodizing treatment of the heat dissipation fins improves the emissivity, forming a combined heat dissipation mechanism of convection and radiation. At the same time, the graphite heat dissipation fins installed on the upper and lower surfaces of the solid-state hard drive guide the heat out of the inner surface of the cover, forming an auxiliary heat dissipation channel. Finally, the auxiliary heat dissipation channel and the micro heat dissipation holes on the side of the shell form a ventilation network, building a natural convection driven by the internal and external temperature difference, and completing the release of heat to the external environment.

[0028] For example, when the solid-state hard drive performs a large file continuous write operation, the temperature of the main control chip rises rapidly to 65°C, and the detection module captures this temperature change at the first time. The activation module determines that the temperature has exceeded the preset threshold (42°C) of the working fluid, and immediately triggers the state transition of the working fluid in the heat pipe. The heat-carrying working fluid flows to the condensation section, and the temperature of the condensation section rises to 50°C. At the same time, the phase change material module detects that the temperature exceeds the phase change point (55°C), and starts the phase change process, absorbing about 35 joules of heat. The peripheral heat dissipation fin assembly diffuses the heat of the condensation section to the air through 35 heat dissipation fins, and the internal temperature gradually stabilizes at 45°C. During the entire process, the central processing unit continuously monitors the temperature changes at various points, dynamically adjusts the heat dissipation parameters, and ensures that the hard drive can still maintain a suitable working temperature under high load conditions.

[0029] In the embodiment of the present application, the solid state disk with an internal flow system can obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module in real time by detecting the digital temperature sensor data of the temperature monitoring network system, ensuring accurate perception and rapid response of the system to temperature changes, providing accurate data basis for heat dissipation strategy, and activating the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat and establishes an efficient heat transfer path to realize rapid transfer of heat energy from high temperature area to low temperature area, greatly improving heat conduction efficiency and reducing local hotspot temperature. The heat around the layered structure heat dissipation substrate is conducted to the condensation section through the heat pipe array structure to realize the process of heat outward transmission, forming a heat conduction channel to enable heat to flow in an orderly manner and be timely dissipated, avoiding heat accumulation around sensitive components and effectively preventing performance degradation and shortened life caused by local overheating. In addition, the phase change material heat dissipation module absorbs peak heat during temperature fluctuations to obtain heat buffering effect, significantly reducing the impact of temperature fluctuations on the system, smoothing the temperature curve, prolonging the service life of the equipment, improving system stability, and especially performing outstandingly in high load burst working state. The heat is released to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure to realize the process of temperature reduction, increase the heat dissipation area and improve the heat exchange efficiency with the environment to ensure that heat can be continuously discharged from the system interior to maintain overall temperature balance, reduce the overall working temperature of the solid state disk, and finally adjust the heat dissipation process parameters according to the continuous monitoring results by the central processing unit of the temperature monitoring network system to realize dynamic control of the internal temperature of the solid state disk, so that the heat dissipation system has intelligent and adaptive characteristics and can automatically adjust the heat dissipation strategy according to different working states to ensure heat dissipation effect while reducing energy consumption and improving overall system efficiency.

[0030] In a specific embodiment, the detection module is used for:

[0031] The data collected by the digital temperature sensors at the mounting points of the main control chip, flash chip array, DRAM cache module, phase change material module and heat pipe condensation section are transmitted to the central processing unit to obtain temperature values of fifteen temperature measuring points;

[0032] The obtained temperature values of the fifteen temperature measuring points are processed, and all temperature data is collected once per second to obtain real-time temperature monitoring data;

[0033] The temperature values of each section of the eight micro pulsating heat pipes in the heat pipe array structure are analyzed based on the real-time temperature monitoring data to obtain heat pipe working state data;

[0034] The temperature load distribution of the corresponding area of the heat generating element in the heat pipe array structure is determined based on the heat pipe working state data to obtain a temperature distribution map of the heat pipe array;

[0035] The temperature sensor data of the phase change material heat dissipation module is processed, the difference between the current temperature of the phase change material and the phase change point is analyzed, and the heat absorption state of the phase change material module is obtained.

[0036] The temperature distribution map of the heat pipe array and the heat absorption state of the phase change material module are integrated and processed, and the central processing unit generates the temperature distribution information of the heat dissipation system to obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module.

[0037] Specifically, precise digital temperature sensors are installed at key positions of the solid state disk. The sensors are manufactured using MEMS (Micro-Electro-Mechanical System) technology, with a size of only 1.5 mm x 1.5 mm x 0.4 mm, a temperature measurement range of -20°C to 120°C, an accuracy of ±0.1°C, and a response time of not more than 100 milliseconds. The sensors are arranged to monitor 3 points on the main control chip, 4 points on the flash memory chip array, 2 points on the DRAM cache module, 3 points on the phase change material module, and 3 points on the heat pipe condensing section, totaling 15 temperature measurement points, forming a complete temperature monitoring network. During data transmission, all sensors are connected to the central processing unit through a two-wire digital bus, and the bus is designed with anti-interference, with a copper shielding layer on the signal line to reduce electromagnetic interference. The central processing unit uses an ultra-low power microcontroller with a working frequency of 32 MHz, built-in 512 KB flash memory and 64 KB RAM, integrated 12-bit analog-to-digital converter and temperature compensation circuit. The raw data collected by the sensors is transmitted to the central processing unit through the bus, and the central processing unit receives the digital signal and converts it to the actual temperature value, forming a temperature value array of the fifteen temperature measurement points.

[0038] For the processing of the temperature values of the fifteen temperature measurement points, the central processing unit collects all temperature data once per second according to the preset sampling frequency. The collected temperature data is subjected to outlier filtering to eliminate abnormal readings caused by transient fluctuations of the sensors, and then compared with the data of the previous second to calculate the temperature change rate. The processed data is stored in the RAM of the central processing unit, forming a time series temperature data stream and constituting a real-time temperature monitoring data set. The process of analyzing the temperature values of each section of the eight micro-pulsating heat pipes in the heat pipe array structure based on the real-time temperature monitoring data includes data grouping and mapping. The central processing unit extracts the temperature measurement point data related to the heat pipes from the 15 temperature measurement points, and groups them according to the heat pipe number and position (evaporation section, adiabatic section, condensing section). For the sections of the heat pipes that do not have sensors directly arranged, the temperature values are calculated by interpolation algorithm of the adjacent temperature measurement points. The temperature profile of each heat pipe is constructed by the three key points of the evaporation section temperature, the adiabatic section temperature and the condensing section temperature, forming the temperature gradient distribution of the heat pipe. The central processing unit judges the temperature difference, heat flow direction and whether the working fluid reaches the starting temperature of each heat pipe, and generates the heat pipe working state data set.

[0039] The temperature load distribution of the heat pipe array structure is determined based on the heat pipe working state data, which is achieved through hot spot identification and corresponding analysis. The central processing unit compares the heat pipe working state data with the layout of the heat-generating elements on the circuit board to identify the temperature of the heat pipe segment corresponding to the heat-generating elements such as the main control chip, the flash memory chip array, and the DRAM cache module. By analyzing the temperature gradient of the heat pipe above each heat-generating element, the heat load of each region is calculated, and a heat spot distribution map of the heat-generating elements is established. Then, the central processing unit converts the data into a two-dimensional heat distribution matrix and generates a temperature distribution map of the heat pipe array through the built-in heat distribution algorithm, which visually displays the hot spot areas and heat flow direction inside the solid state disk. For the temperature sensor data processing of the phase change material heat dissipation module, the central processing unit extracts the data of the three temperature measurement points of the phase change material module and calculates the average temperature value of the module. Then, the average temperature value is compared with the preset phase change point temperature (55℃) of the phase change material to calculate the temperature difference. According to the temperature difference, the central processing unit evaluates the current state of the phase change material (completely solid, starting to phase change, completely liquid, etc.) and judges its remaining heat absorption capacity. At the same time, by monitoring the temperature change rate, the saturation time of the phase change material is predicted, and a heat absorption state report of the phase change material module is formed. The central processing unit integrates the temperature distribution map of the heat pipe array and the heat absorption state of the phase change material module to construct complete temperature distribution information of the heat dissipation system. During the integration process, the central processing unit establishes a heat interaction model between the heat pipe array and the phase change material module, analyzes the heat exchange between the two subsystems, including whether the heat pipe transfers heat to the phase change material or whether the phase change material has become a new heat source. Through the data fusion algorithm, the temperature distribution information is generated.

[0040] In a specific embodiment, the activation module is configured to:

[0041] The temperature data of the heat pipe array structure in the temperature distribution information is compared with the preset threshold value to determine whether the temperature of the eight micro-pulsating heat pipes in the heat pipe array exceeds the boiling point of the working fluid, and a heat pipe activation signal is obtained;

[0042] According to the heat pipe activation signal, a micro-current preheating treatment is applied to the modified alcohol compound working fluid inside the micro-pulsating heat pipe, so that the temperature of the working fluid reaches a state close to the boiling point, and a pre-activated working fluid is obtained;

[0043] The pre-activated working fluid is guided to the contact area between the heat pipe evaporation section and the chip, and the heat generated by the heat-generating elements on the circuit board is absorbed through the gold-plated middle part of the heat pipe, and a heat-carrying working fluid is obtained;

[0044] The heat-carrying working fluid is driven by capillary force in the micro-porous core structure, so that the working fluid flows through the sintered copper powder micro-porous channel with a pore size of 50 microns and a porosity of 75%, and a directional fluid is obtained;

[0045] The condensate liquid is subjected to the combined action of gravity and capillary force to return to the evaporation section along the inner wall of the heat pipe, forming an internal circulation loop, and obtaining a heat transfer path.

[0046] The condensate liquid is subjected to the combined action of gravity and capillary force to return to the evaporation section along the inner wall of the heat pipe, forming an internal circulation loop, and obtaining a heat transfer path.

[0047] Specifically, the activation module receives temperature distribution information from the detection module and extracts temperature data of the heat pipe array structure. The temperature data includes the temperature values of the evaporation section, the adiabatic section and the condensation section of the eight micro-pulsating heat pipes. The activation module compares the temperature data with the preset threshold value, which is mainly the preset temperature threshold value 42℃ of the working fluid. The comparison process uses a judgment algorithm to judge the temperature value of each heat pipe one by one. When the evaporation section temperature of any heat pipe exceeds 42℃, or the average temperature of multiple heat pipes exceeds the threshold value, the activation module will generate a heat pipe activation signal. The heat pipe activation signal is in digital form and contains the heat pipe number and activation intensity level that need to be activated. The intensity level is determined according to the temperature difference that exceeds the threshold value. According to the generated heat pipe activation signal, the activation module controls the micro-current heating circuit to preheat the modified alcohol compound working fluid inside the specified heat pipe. The micro-current heating circuit is arranged near the evaporation section of the heat pipe and heats the working fluid by accurately controlling the current. The size of the heating current is dynamically adjusted according to the intensity level in the heat pipe activation signal, generally controlled in the range of 5-20 milliampere, to avoid overheating of the working fluid. During the preheating process, the temperature of the working fluid is controlled to be close to the preset threshold value but slightly lower than the preset threshold value, usually 40-41℃, so that when external heat is transferred, the working fluid can quickly reach the active state. The working fluid after preheating is called pre-activated working fluid, which is in a critical state of efficient heat absorption.

[0048] The pre-activated working fluid is naturally guided to the contact area between the evaporation section of the heat pipe and the chip. This process is mainly driven by the capillary force provided by the capillary structure inside the heat pipe and the micro-porous core structure. The evaporation section of the heat pipe is located in the middle of the heat pipe, and the surface is gold-plated with a thickness of 3 microns. This treatment significantly improves the contact thermal resistance between the heat pipe and the heat-generating components of the circuit board, enhancing the heat conduction efficiency. When the pre-activated working fluid reaches the evaporation section, it quickly absorbs the heat generated by the heat-generating components of the circuit board, causing the temperature to rise and the working fluid to begin efficiently absorbing heat. The heat absorption process is accompanied by a change in the state of the working fluid, and due to the latent heat of phase transition, the heat required for the state change is much greater than the heat required for simply raising the temperature of the liquid. After the working fluid absorbs heat, it forms a heat-carrying working fluid, which can effectively absorb heat from the heat source and convert it into flowing thermal energy. After the formation of the heat-carrying working fluid, a capillary force driving effect is generated within the micro-porous core structure. The micro-porous core structure is made of sintered copper powder with a pore size of 50 microns and a porosity of 75%. This structure not only provides good thermal conductivity but also forms a complex network of capillary channels. When the working fluid absorbs heat, the heat-carrying working fluid naturally moves towards the two ends of the heat pipe due to the pressure difference, but the movement path is guided by the micro-porous structure. Capillary force driving is a force generated by the surface tension of the liquid in the small pores, and the calculation formula is F = 2πrσcosθ, where r is the pore size, σ is the surface tension of the liquid, and θ is the contact angle. Through this mechanism, the heat-carrying working fluid is guided through the micro-porous channels to form an ordered flow, called directional fluid. The flow speed and direction of the directional fluid are determined by the temperature gradient and the size of the capillary force, ensuring that heat can be effectively transferred from the evaporation section to the condensation section.

[0049] The directional fluid is guided to flow to the condensation zones at both ends of the heat pipe. The condensation zones are located at both ends of the heat pipe, each extending 10 millimeters beyond the substrate, forming an area in contact with the external heat dissipation structure. The surface of the condensation zone is processed with a fish-scale-shaped microstructure with a depth of 20 microns and a width of 30 microns. This special structure significantly increases the heat dissipation area and improves the heat exchange efficiency. When the heat-carrying working fluid reaches the condensation zone, due to the lower temperature, the working fluid begins to release heat and change state. The heat release process is transferred to the external heat dissipation structure through the heat pipe wall, achieving heat dissipation. After releasing heat, the working fluid becomes a condensed liquid and accumulates on the inner wall of the condensation section of the heat pipe.

[0050] The condensed liquid returns to the evaporating section along the inner wall of the heat pipe under the combined action of gravity and capillary force. The gravity effect mainly occurs when the heat pipe is in a horizontal or inclined state, and the capillary force is a sustained power provided by the micro-porous core structure. The capillary force is inversely proportional to the pore size of the micro-porous, so a small pore size of 50 microns can generate a large enough capillary force to ensure that the liquid can effectively return. The liquid return establishes a liquid circulation path from the condensing section to the evaporating section, together with the previous fluid flow, forming a complete internal circulation loop. The circulation loop constitutes a continuous heat transfer path, which can continuously absorb heat from the heat source and transfer it to the heat dissipation area, achieving efficient dissipation of internal heat of the solid state disk.

[0051] In a specific embodiment, the conduction module is used for:

[0052] The heat conduction network formed by the three-layer structure of the high-thermal-conductivity copper plate, the three-dimensional graphene aerogel layer, and the nano-ceramic coating in the layered structure heat dissipation substrate is in contact with the heating elements on the circuit board, and the heat is absorbed through the high-thermal-conductivity contact surface, obtaining the heat load distribution of the heat dissipation substrate;

[0053] The heat load distribution of the heat dissipation substrate is conducted in stages, and the heat is transferred laterally to the heat pipe array mounting slot through the high-thermal-conductivity copper plate, obtaining the heat source input of the heat pipe slot;

[0054] The heat source input of the heat pipe slot is transmitted to the evaporating section of the heat pipe array, and the heat is transmitted to the internal working fluid through the 30mm-long evaporating section of the heat pipe, obtaining the heat-carrying working fluid;

[0055] The heat-carrying working fluid is driven by pressure difference in the heat pipe, and the heat is distributed through the heat network structure formed by the two lateral copper sheets in the heat pipe, obtaining the uniformly distributed heat flow;

[0056] The uniformly distributed heat flow is guided to the condensing section formed by the 10mm extension of the two ends of the heat pipe, and the heat is transmitted through the heat-conducting copper pipe wall of the condensing section, obtaining the temperature field of the outer surface of the condensing section;

[0057] Based on the temperature field of the outer surface of the condensing section, the contact surface between the condensing section of the heat pipe and the copper base is conducted, and the heat is transmitted to the peripheral heat dissipation structure through the 0.05mm-thick contact layer formed by the heat-conducting silicone grease, obtaining the conduction path for the heat to be transported outward.

[0058] Specifically, the conduction module utilizes a layered structure heat dissipation substrate to contact the circuit board heat generating elements, forming a heat conduction channel. The layered structure heat dissipation substrate is composed of three layers of materials: the bottom layer is a high thermal conductivity copper plate with a thickness of 2 mm, the surface is treated with electroplated nickel to form a smooth contact surface; the middle layer is a three-dimensional graphene aerogel layer with a thickness of 4 mm, with a thermal conductivity of up to 2000 W / (m·K), much higher than traditional metal materials; the top layer is a nanometer ceramic coating with a thickness of 1 mm, with excellent thermal conductivity and insulation. The three layers of materials are tightly combined to form a whole heat conduction network. When the heat dissipation substrate contacts the heat generating elements on the circuit board, the heat is quickly absorbed through the high thermal conductivity of the contact surface. The contact area is 80 mm x 50 mm of the main control circuit board installation area, and the contact thermal resistance is reduced by high elasticity heat conduction pad. After the heat is transferred into the heat dissipation substrate, a specific distribution pattern is formed, and a thermal load distribution map is formed on the surface of the substrate according to the position and heat size of the heat generating elements.

[0059] After the heat dissipation substrate receives the thermal load, it begins to conduct in stages. The staged conduction refers to the process of orderly guiding heat according to the size and distribution position of the thermal load. The high thermal conductivity copper plate with a thickness of 2 mm plays a key role in the heat dissipation substrate, with a thermal conductivity of about 400 W / (m·K), which can quickly transfer heat laterally. The heat spreads inside the copper plate, flows from the high temperature area to the low temperature area, and finally concentrates to the 8 heat pipe array installation slots processed on the surface of the substrate. The installation slot is 3 mm wide and 2.5 mm deep, with a spacing of 8 mm between adjacent heat pipe slots, forming a regular arrangement of heat concentration channels. The heat conduction in the copper plate follows the Fourier heat conduction law, and the heat flux is proportional to the temperature gradient. During the lateral conduction process, the heat passes through the up and down conduction of the three-dimensional graphene aerogel layer and the lateral conduction of the high thermal conductivity copper plate, and is collected to the heat pipe slot, forming the heat source input of the heat pipe slot.

[0060] The heat source input of the heat pipe slot is directly transmitted to the evaporation section of the heat pipe array installed in the slot. The heat pipe array is composed of 8 micro-pulsating heat pipes, each heat pipe is made of oxygen-free copper pipe with an outer diameter of 3 mm and an inner diameter of 2.2 mm, with a total length of 100 mm. The heat pipe is tightly combined with the substrate heat pipe slot through high thermal conductivity epoxy resin, with a thermal conductivity of 8 W / (m·K), and the filling thickness is controlled within 0.1 mm to ensure effective heat transfer. The surface of the middle contact area with the chip of the heat pipe is treated with gold plating, with a thickness of 3 microns. This area is 30 mm long and is called the evaporation section. The evaporation section directly absorbs the heat from the heat pipe slot and transfers the heat to the internal working fluid. The working fluid is a modified alcohol compound with a state transition point of 42°C and a filling ratio of 50%. When heat is transmitted into the evaporation section, the working fluid temperature rises and exceeds the transition point, starting to absorb heat. The heat absorption process changes the state of the working fluid, converting thermal energy into kinetic energy of the fluid, forming a heat carrying working fluid.

[0061] The heat-carrying working fluid is driven by the pressure difference inside the heat pipe and starts to move axially along the heat pipe. Due to the high temperature of the evaporation section and the low temperature of the condensation section of the heat pipe, the pressure of the evaporation section is greater than that of the condensation section. This pressure difference drives the fluid to flow from the high-pressure area to the low-pressure area. Two transverse copper sheets are arranged in the heat pipe, with a thickness of 0.5 mm and a width of 3 mm. The 8 heat pipes are connected into a network structure. This heat network structure promotes the uniform distribution of heat among the heat pipe array. When the load of a certain heat pipe is too high, the transverse copper sheet will transfer part of the heat to the heat pipe with lower load, balancing the temperature distribution of the entire array. Through this heat redistribution mechanism, the originally concentrated heat flow is evenly dispersed, forming a more uniform heat flow distribution, reducing the load pressure of a single heat pipe, and improving the efficiency and stability of the overall heat dissipation system. The uniformly distributed heat flow continues to flow axially along the heat pipe and eventually reaches the condensation section formed by the 10 mm extension at both ends of the heat pipe. The condensation section is located outside the edge of the heat dissipation substrate and directly contacts the external heat dissipation structure. When the heat-carrying working fluid reaches the condensation section, it begins to release heat and change state due to the decrease in temperature. The heat is transferred out through the heat-conducting copper pipe wall of the condensation section, with a thickness of 0.4 mm and a thermal conductivity of about 400 W / (m·K). The condensation section surface is processed with a fish-scale-shaped microstructure with a depth of 20 microns and a width of 30 microns, increasing the heat dissipation area and heat conduction efficiency. The heat transfer process forms a temperature field on the outer surface of the condensation section, which presents a gradient distribution decreasing from the inside to the outside. The temperature is higher near the heat pipe on the inside and lower on the outside in contact with the air.

[0062] Based on the temperature field formed on the outer surface of the condensation section, heat continues to be transferred to the heat dissipation fin assembly. The condensation section is in direct contact with the copper base, and the contact surface is coated with heat-conducting silicone grease with a thickness of 0.05 mm and a thermal conductivity of about 5-8 W / (m·K). The heat-conducting silicone grease fills the small gaps in the contact surface, reducing the contact thermal resistance and improving the heat conduction efficiency. Heat is transferred through this contact layer to the copper base and then dispersed to each heat dissipation fin of the heat dissipation fin assembly. In this way, a complete heat conduction path from the heat source to the heat dissipation structure is established, and heat can be continuously conducted from the solid-state hard disk to the external heat dissipation structure and finally dissipated to the environment.

[0063] In a specific embodiment, the absorption module is used for:

[0064] Processing the data collected by the temperature monitoring network system to determine whether the temperature of the solid-state hard disk exceeds the preset threshold of the phase change temperature of the phase change material, and obtaining a phase change start trigger signal;

[0065] Transmitting the phase change start trigger signal to the phase change material heat dissipation module and contacting the phase change material through the porous copper mesh heat conduction structure inside the module to obtain a heat conduction channel;

[0066] The heat is applied to the phase change material, so that the temperature inside the phase change material reaches the phase change point, and the heat is converted into phase change energy through the latent heat of 200 joules per gram, to obtain the phase change process from solid to liquid;

[0067] The heat released during the phase change process is dispersed through the serpentine micro-channel structure inside the module, and the heat exchange area is increased through the total length of 200 millimeters of the channel to obtain a uniform heat distribution state;

[0068] The phase change material in the heat uniform distribution state is subjected to nano-carbon tube reinforcing agent assisted heat transfer treatment, and the heat transfer rate is improved by a mass fraction of 3% of the nano-carbon tube network to obtain an enhanced heat conduction field;

[0069] The heat of the enhanced heat conduction field is transferred from the phase change material to the aluminum alloy shell, and the heat is slowly released to the heat dissipation substrate through the black microporous structure heat dissipation layer on the surface of the shell, to obtain a heat buffering effect.

[0070] Specifically, the absorption module processes the data collected by the temperature monitoring network system, and the data comes from 15 temperature measuring points distributed at key positions of the solid state disk. The processing process starts with data collection, and after the central processing unit receives the data, it selects the temperature data related to the phase change material module, mainly the temperature data of the three temperature measuring points of the phase change material module itself and the surrounding area. The central processing unit calculates the average value and the change trend of the temperature, and compares it with the preset phase change material phase change temperature threshold value 55℃. The comparison uses a threshold judgment algorithm, when the average temperature exceeds the threshold value, or the temperature rising rate exceeds the preset value (usually more than 2℃ per second), the central processing unit generates a phase change start trigger signal. This trigger signal contains the start intensity level and the start area information, which is used to accurately control the phase change process. The phase change start trigger signal is transmitted to the control circuit of the phase change material heat dissipation module through the internal communication bus. After receiving the signal, the control circuit activates the porous copper mesh heat conduction structure inside the module, so that it is in full contact with the phase change material. The porous copper mesh is a special structure with a thickness of 0.3 millimeters, a pore size of 0.2 millimeters, and an opening rate of 60%, which is distributed between the phase change material and the shell. In the normal state, there is a small gap between the porous copper mesh and the phase change material, which limits heat conduction; when receiving the trigger signal, the copper mesh position is adjusted through a micro actuator (such as a shape memory alloy driver or a micro electromagnetic valve) to tightly fit the phase change material, forming a heat conduction channel. After the channel is formed, heat can be quickly conducted from the outside to the inside of the phase change material, starting the next heat absorption process.

[0071] After the heat conduction channel is established, the heat from the inside of the solid state disk is transferred to the phase change material through the channel. The phase change material is a special compound with a phase change temperature of 55°C, a phase change latent heat of 200 joules / gram, a thermal conductivity of 2.5 W / (m·K), and a total filling amount of 5 grams. When heat continues to be transferred, the temperature of the phase change material gradually rises from the initial temperature (usually the ambient temperature of 25-30°C) to the temperature close to the phase change point. This temperature rising process follows the temperature rising formula: ΔT = Q / (m×c), where ΔT is the temperature change, Q is the absorbed heat, m is the material mass, and c is the specific heat capacity. When the temperature reaches the phase change point of 55°C, the additional input heat no longer causes the temperature to rise, but is used for the phase change process, realizing the transition from solid to liquid. This phase change process can absorb a large amount of heat, equivalent to the material absorbing 5 grams x 200 joules / gram = 1000 joules of heat while maintaining a temperature of 55°C, effectively relieving temperature fluctuations.

[0072] The heat generated during the phase change process (including the heat transferred from the outside and the small amount of heat released during the phase change process) is dispersed through the serpentine microchannel structure inside the module. The serpentine microchannel is a special structure designed inside the phase change module, with a channel width of 0.5 mm and a depth of 1 mm, distributed in a serpentine shape. This design makes the total length of the channel reach 200 mm, greatly increasing the heat exchange area. After the heat enters the phase change material, it is dispersed and conducted through the microchannel network, avoiding local overheating. The serpentine design of the microchannel ensures that the heat is evenly distributed inside the phase change material, preventing the occurrence of hot spots. In this way, the heat is evenly distributed throughout the volume of the phase change material, forming a state of uniform heat distribution, with each unit volume of phase change material absorbing a similar amount of heat, maximizing the use of the heat capacity of the phase change material. To further improve the heat conduction efficiency, nano-carbon tube enhancers are uniformly distributed in the phase change material, with a mass fraction of 3%. Nano-carbon tubes have extremely high thermal conductivity (about 2000-6000 W / (m·K)) and form a three-dimensional continuous network structure, significantly improving the overall thermal conductivity of the phase change material. When the heat is evenly distributed in the phase change material, the nano-carbon tube network acts as a "highway" for heat conduction, accelerating the propagation of heat inside the phase change material. This enhanced heat transfer treatment increases the effective thermal conductivity of the phase change material by 3-5 times, forming an enhanced heat conduction field. The enhanced heat conduction field is characterized by fast heat propagation speed and good uniformity, which can more effectively utilize the overall volume of the phase change material and improve the heat absorption efficiency.

[0073] The heat of the enhanced heat conduction field needs to be transferred from the phase change material to the aluminum alloy shell. The aluminum alloy shell has a thickness of 0.3 mm, and the surface is treated by anodic oxidation to form a black microporous structure, which enhances the radiation heat dissipation capability. Heat is transferred through the contact surface between the phase change material and the shell, and the transfer rate is controlled by the thermal conductivity of the phase change material and the material-shell contact thermal resistance. After the shell absorbs heat, it slowly releases heat through the microporous structure on the surface, mainly through radiation and natural convection. This design makes the heat release process smooth, and the heat is not released instantaneously to the heat dissipation substrate, but maintains a relatively stable release rate, thereby achieving the heat buffering effect.

[0074] In a specific embodiment, the release module is used for:

[0075] The heat of the condenser section of the heat pipe is transferred to the copper base of the heat dissipation fin assembly through the heat conduction channel formed by the heat-conducting silicone grease layer on the contact surface, and the initial heat input of the heat dissipation fin assembly is obtained.

[0076] The initial heat input of the heat dissipation fin assembly is dispersed, and the heat is conducted from the base to each heat dissipation fin through the parallel arrangement of high-thermal-conductivity aluminum alloy heat dissipation fins, and the expanded heat dissipation area is obtained.

[0077] The expanded heat dissipation area is subjected to surface microstructure treatment, and the air contact area is increased through the micro-groove structure on the surface of the heat dissipation fin, and the enhanced convective heat transfer condition is obtained.

[0078] The enhanced convective heat transfer condition is combined with the black anodizing treatment on the surface of the heat dissipation fin, and the heat radiation effect is enhanced through the high-emissivity, and a composite heat dissipation mechanism is obtained.

[0079] The graphite heat dissipation fins installed on the upper and lower surfaces of the solid state drive are subjected to heat conduction, and the heat on the inner surface of the cover plate is conducted out through the high-thermal-conductivity graphite material, and an auxiliary heat dissipation channel is obtained.

[0080] The auxiliary heat dissipation channel is connected to the ventilation network formed by the micro-heat dissipation holes on the side of the shell, and the natural convection driven by the internal and external temperature difference is constructed through the heat dissipation holes and the trapezoidal distributed air flow channels, and the temperature reduction process is realized.

[0081] Specifically, the release module transfers the heat of the condenser section of the heat pipe to the copper base of the heat dissipation fin assembly, which is achieved through a carefully designed thermal contact interface. The condenser section of the heat pipe is in direct contact with the copper base, and the contact surface is coated with thermal conductive silicone grease to form a heat conduction channel. Thermal conductive silicone grease is a special thermal interface material with a thickness of 0.05 mm and a thermal conductivity of about 5-8 W / (m·K), which can effectively fill the small gaps in the contact surface and reduce the contact thermal resistance. Heat is conducted through this thin layer to the copper base, and the temperature of the copper base rises and forms a temperature gradient field, with the temperature decreasing from the inside to the outside. The temperature of the copper base directly affects the heat dissipation efficiency, and under normal working conditions, the temperature of the base is 5-10°C lower than that of the condenser section of the heat pipe, ensuring sufficient temperature difference to drive heat transfer. The heat received by the copper base constitutes the initial heat input of the heat dissipation fin assembly, which represents the total heat that needs to be dissipated.

[0082] The initial heat input of the heat dissipation fin assembly is dispersed by the parallel arrangement of high thermal conductivity aluminum alloy fins. The heat dissipation fin assembly contains 35 parallel arranged fins, each with a thickness of 0.4 mm, a height of 12 mm, and an adjacent fin spacing of 1.2 mm. The aluminum alloy fins are made of high thermal conductivity aluminum alloy by die casting, with a thermal conductivity of about 150-200 W / (m·K) and moderate heat capacity. The root of the fin is in close contact with the copper base, and the heat is conducted from the base to the root of the fin, and then along the fin away from the base. Each fin obtains heat from the base and dissipates heat to the air, achieving heat diffusion. This parallel arrangement design disperses the heat of the base to multiple fins, greatly increasing the surface area in contact with the air. The originally concentrated heat is dispersed to an area of 600-800 square centimeters, which is several tens of times the original heat source area, forming an expanded heat dissipation area.

[0083] The surface microstructure treatment of the expanded heat dissipation area is achieved by processing micro-groove structures on the surface of the fins. The micro-groove structure is a special surface treatment process that forms regular arranged micro-grooves on the surface of the fins, with a groove depth of 0.1 mm, a width of 0.2 mm, and a groove spacing of 0.5 mm. This microstructure treatment has multiple effects: the micro-grooves increase the actual surface area of the fins, theoretically increasing the contact area by 30-50% compared to the plane; secondly, the micro-grooves break the airflow boundary layer on the surface of the fins, promoting the formation of turbulent flow and enhancing convective heat transfer; thirdly, the micro-cavities formed by the micro-grooves can capture more air molecules, increasing the heat exchange opportunity. The convective heat transfer coefficient on the surface of the fin is significantly improved, forming a strengthened convective heat transfer condition.

[0084] The enhanced convective heat exchange condition is combined with the black anodization treatment on the surface of the fins to form a composite heat dissipation mechanism. Anodization is an electrochemical surface treatment process that forms a dense layer of aluminum oxide on the surface of aluminum alloy, and black dye is added during the process to make the surface black. The black anodized layer has a high emissivity of about 0.92, which is much higher than the 0.1-0.2 of the untreated aluminum alloy surface. High emissivity means that the fins can dissipate heat more effectively through radiation, especially at high surface temperatures. The combination of convective heat dissipation and radiative heat dissipation forms a dual heat dissipation mechanism. At low temperatures, convective heat dissipation dominates; at high temperatures, the contribution of radiative heat dissipation increases significantly. This composite heat dissipation mechanism enables the heat dissipation system to maintain high efficiency under various working conditions.

[0085] The graphite fins installed on the upper and lower surfaces of the solid state drive are used for heat conduction as an auxiliary heat dissipation measure. The graphite fins are 0.025 mm thick, have a thermal conductivity of 1800 W / (m·K), and cover 80% of the entire surface. Graphite is a material with highly anisotropic thermal conductivity, with excellent thermal conductivity in the plane direction. The graphite fins are fixed to the inner surfaces of the upper and lower covers by thermal conductive double-sided adhesive, with a thickness of 0.08 mm. The working principle of the graphite fins is to quickly conduct the heat from the inner surface of the cover to the edge area, achieving lateral heat diffusion. This process is equivalent to establishing an auxiliary heat dissipation channel inside the solid state drive, increasing the path for heat dissipation. The surface of the graphite fins is treated by a special process to form a nano-scale protrusion structure, with a protrusion height of 5 microns and a density of 100 per square millimeter. The small protrusions significantly enhance the contact with air and the convective heat dissipation effect. The connection between the auxiliary heat dissipation channel and the ventilation network formed by the micro heat dissipation holes on the side of the shell is achieved through a carefully designed air flow path. The shell side is processed with 100 micro heat dissipation holes, with a diameter of 0.8 mm and a spacing of 3 mm between the holes, arranged in a trapezoidal pattern with higher density at the bottom than at the top. This distribution optimizes the natural convection effect, as the natural upward movement of hot air allows cold air to enter from the bottom to effectively dissipate heat. A stainless steel dust screen with a hole diameter of 0.15 mm is installed inside the heat dissipation holes to prevent dust from entering the interior of the hard drive. When the internal temperature of the solid state drive rises, a temperature difference is formed between the inside and outside, driving cold air to enter from the bottom heat dissipation holes and hot air to exit from the top heat dissipation holes, forming a natural convection cycle. This natural convection driven by the internal and external temperature difference is a heat dissipation method that does not require external energy input, making it particularly suitable for power-sensitive devices such as solid state drives. The ventilation network and the auxiliary heat dissipation channel formed by the graphite fins work together to continuously transfer internal heat to the external environment, achieving continuous reduction of the temperature of the solid state drive.

[0086] In a specific embodiment, the solid state drive with an internal flow system also includes a monitoring module, specifically for:

[0087] The continuous monitoring data of the temperature monitoring network system collected by the central processing unit is stored and processed, the temperature change trend of each temperature measuring point of the main control chip, the flash memory chip array, the DRAM cache module, the phase change material module and the condenser section of the heat pipe is recorded, and a temperature history database is obtained;

[0088] The data in the temperature history database is analyzed and processed, the temperature change law of each region of the solid state disk is calculated through a fuzzy neural network algorithm, and a temperature prediction model is obtained;

[0089] The working state of the phase change material module is adjusted and processed based on the temperature prediction model, the heat absorption capacity of the phase change material is changed by controlling the phase change point through a micro-current, and dynamic control parameters of the phase change material are obtained;

[0090] The hard disk working load is monitored and analyzed according to the dynamic control parameters, the starting time of the heat dissipation system is adjusted under different load states through a dynamic power consumption management module, and a heat dissipation system operation strategy is obtained;

[0091] The heat dissipation system operation strategy is converted into a control instruction, the heat dissipation mode of the heat dissipation fin assembly is optimized and adjusted through a self-adaptive temperature control algorithm, and a heat dissipation efficiency control scheme is obtained;

[0092] The heat dissipation efficiency control scheme is feedback adjusted, the temperature state and the health condition of the heat dissipation system are reported to the host through a SMART protocol, the sensor state and the abnormal condition of the heat dissipation system are detected in combination with a self-diagnosis function, and the dynamic control of the internal temperature of the solid state disk is obtained.

[0093] Specifically, the monitoring module stores and processes the continuous monitoring data of the temperature monitoring network system collected by the central processing unit. The central processing unit is a super low power microcontroller with a working frequency of 32 MHz, built-in 512 KB flash memory and 64 KB RAM, integrated 12-bit analog-to-digital converter and temperature compensation circuit. The temperature monitoring network system is composed of 15 digital temperature sensors, distributed in key positions of the solid state disk: 3 on the main control chip, 4 on the flash chip array, 2 on the DRAM cache module, 3 on the phase change material module, and 3 on the condenser section of the heat pipe. Each sensor collects temperature data once every second, and the data is transmitted to the central processing unit through a two-wire digital bus. After receiving the data, the central processing unit timestamps and preprocesses the data, and then stores it in the built-in non-volatile memory to form a structured temperature history database. The database records the temperature curve and working state of the past 7 days, including the temperature value, temperature change rate, temperature peak value and duration of each temperature measurement point. The database uses a circular buffer structure, with new data covering the oldest data to ensure efficient use of storage space. The analysis and processing of data in the temperature history database is realized through a fuzzy neural network algorithm. The fuzzy neural network algorithm is an intelligent algorithm that combines the advantages of fuzzy logic and neural networks, suitable for handling temperature control problems with uncertainty and nonlinearity. The algorithm contains 5 input variables (main control chip temperature, flash chip temperature, phase change material temperature, environmental temperature and working load), 3 output variables (heat pipe activation intensity, phase change material control parameter and heat dissipation fin adjustment parameter) and 25 fuzzy rules. The algorithm extracts features from the temperature history database, including temperature change rate, temperature mean value, peak temperature occurrence time, etc., and then converts the precise numerical values into fuzzy sets through fuzzification processing. The fuzzy inference engine calculates the fuzzy output based on the pre-set rule base, and finally obtains the precise control parameters through defuzzification processing. At the same time, the neural network part continuously adjusts the weights and membership functions of the fuzzy rules through the backpropagation algorithm, and optimizes the algorithm adaptively according to the actual heat dissipation effect. This process is iterated continuously to analyze the temperature variation law of the solid state disk under different working modes, and finally a temperature prediction model that can predict future temperature changes is formed.

[0094] The adjustment of the working state of the phase change material module based on the temperature prediction model is realized through a precisely controlled micro-current heating system. The phase change point of the phase change material is 55°C, but in actual application, the effective phase change temperature of the material can be dynamically adjusted through micro-current heating. The micro-current heating system is composed of multiple micro-heating elements distributed at different positions of the phase change material module, and the power of each heating element is 0.1-0.5 watts. The central processing unit calculates the optimal phase change temperature of the phase change material under the current working state according to the output of the temperature prediction model. If a temperature peak is predicted in a short time, the phase change point is lowered in advance, so that the phase change material can start to absorb heat at a lower temperature; if a long-time stable work is predicted, the phase change point is appropriately increased, and the effective working time of the phase change material is prolonged. This dynamic adjustment is realized by controlling the size and duration of the micro-current, and the control parameters include current intensity, heating time and heating area, forming a dynamic control parameter set of the phase change material.

[0095] The monitoring and analysis of the hard disk working load according to the dynamic control parameters are completed through a dynamic power management module. The dynamic power management module monitors the working state of the solid state disk, including read-write speed, command queue depth, flash chip activity and other indicators. The indicators are obtained through the status register of the master control chip, and are sampled every 100 milliseconds. The module analyzes the working load data in combination with the temperature data, and establishes a correlation model between the working load and the temperature rise rate. Based on this model, the dynamic power management module can predict the temperature change trend under different working loads, and then determine the best starting time of the heat dissipation system. In the low load state, the heat dissipation system is delayed to start, reducing energy consumption; in the high load state, the heat dissipation system is started in advance to prevent the temperature from being too high. This heat dissipation control strategy based on load prediction forms the heat dissipation system operation strategy, including starting time, running intensity and duration parameters.

[0096] The conversion of the heat dissipation system operation strategy into control instructions is realized through an adaptive temperature control algorithm. The adaptive temperature control algorithm is based on the principle of reinforcement learning, which converts the control problem of the heat dissipation system into a decision-making process. The algorithm receives the heat dissipation system operation strategy as input and generates specific control instructions, including heat pipe working mode, phase change material state and heat dissipation fin assembly adjustment parameters. For the heat dissipation fin assembly, the control instructions mainly include the start-stop control and intensity adjustment of the active heat dissipation elements such as micro-fans or vibration devices. The adaptive temperature control algorithm continuously adjusts the control parameters according to real-time temperature feedback, establishes a mapping relationship between the control instructions and the heat dissipation effect, and gradually optimizes the control strategy. Through multiple iterations of learning, the algorithm forms an optimal control scheme for different working states, forming a heat dissipation efficiency control scheme library.

[0097] The feedback adjustment of the heat dissipation efficiency control scheme is realized through a monitoring feedback mechanism. The monitoring module reports the temperature status and the health status of the heat dissipation system to the host through the SMART (Self-Monitoring, Analysis and Reporting Technology) protocol. The SMART protocol is a standard interface for storage devices, allowing solid state disks to report the running status to the host system. The monitoring module encapsulates temperature data, heat dissipation system working status and abnormal information into a SMART data packet and updates the host once per second. At the same time, the monitoring module has a built-in self-diagnosis function to periodically detect the sensor state and the working condition of the heat dissipation system components. The self-diagnosis process includes sensor consistency check, heat pipe working efficiency evaluation and phase change material state monitoring. When an abnormal condition is detected, the monitoring module will automatically adjust the control strategy to prioritize the temperature safety of critical components. Through this closed-loop feedback mechanism, the heat dissipation system can dynamically adjust the control parameters according to the actual situation to achieve precise dynamic control of the internal temperature of the solid state disk.

[0098] The above describes the solid state disk self-assembled with an internal flow system in the embodiments of the present application, and the following describes a heat dissipation method of the solid state disk self-assembled with an internal flow system in the embodiments of the present application. Please refer to Figure 2 One embodiment of the heat dissipation method of the solid state disk self-assembled with an internal flow system in the embodiments of the present application includes:

[0099] Detecting the digital temperature sensor data of the temperature monitoring network system to obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module;

[0100] Activating the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat to obtain a heat transfer path;

[0101] Conducting the heat around the layered structure heat dissipation substrate to the condensation section through the heat pipe array structure;

[0102] Using the phase change material heat dissipation module to absorb the peak heat during temperature fluctuation to obtain a heat buffering effect;

[0103] Releasing the heat to the external environment through the heat dissipation fin assembly of the peripheral passive heat dissipation structure.

[0104] The heat dissipation method of the solid state disk self-assembled with an internal flow system further includes adjusting the heat dissipation process parameters according to the continuous monitoring results through the central processing unit of the temperature monitoring network system.

[0105] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A solid-state drive with a self-assembled internal circulation system, characterized in that, Solid-state drives include: The detection module is used to detect digital temperature sensor data from the temperature monitoring network system and acquire temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module. Specifically, it is used to: transmit data collected by digital temperature sensors at each mounting point of the main control chip, flash memory chip array, DRAM cache module, phase change material module, and heat pipe condensation section to the central processing unit to obtain temperature values ​​at fifteen measurement points; process the acquired temperature values ​​at the fifteen measurement points, collect all temperature data once per second to obtain real-time temperature monitoring data; analyze the temperature values ​​of each segment of the eight micro-pulsating heat pipes in the heat pipe array structure based on the real-time temperature monitoring data to obtain heat pipe operating status data; determine the temperature load distribution of the corresponding area of ​​the heating element in the heat pipe array structure based on the heat pipe operating status data to obtain the temperature distribution map of the heat pipe array; process the temperature sensor data corresponding to the phase change material heat dissipation module, analyze the difference between the current temperature of the phase change material and the phase change point to obtain the heat absorption state of the phase change material module; integrate the temperature distribution map of the heat pipe array with the heat absorption state of the phase change material module, and generate the temperature distribution information of the heat dissipation system through the central processing unit to obtain the temperature distribution information of the heat pipe array structure and the phase change material heat dissipation module. The activation module is used to activate the working fluid inside the heat pipe array structure according to the temperature distribution information, so that the working fluid absorbs heat and obtains a heat transfer path. A conduction module is used to conduct heat from the area surrounding the layered heat dissipation substrate to the condensation section through the heat pipe array structure. The absorption module is used to absorb the peak heat during temperature fluctuations using a phase change material heat dissipation module, thereby achieving a heat buffering effect. The release module is used to release heat to the external environment via the heat sink fin assembly of the peripheral passive heat dissipation structure.

2. The solid-state drive with an internal circulation system according to claim 1, characterized in that, Activation module, used for: The temperature data of the heat pipe array structure in the temperature distribution information is compared with the preset threshold to determine whether the temperature of the eight micro-pulsating heat pipes in the heat pipe array exceeds the boiling point of the working fluid, and the heat pipe activation signal is obtained. Based on the heat pipe activation signal, a micro-current is applied to the modified alcohol compound working fluid inside the micro-pulsating heat pipe for preheating treatment, so that the working fluid temperature reaches close to the boiling point, thus obtaining a pre-activated working fluid. The pre-activated working fluid is guided to the contact area between the heat pipe evaporation section and the chip. The heat generated by the heating element of the circuit board is absorbed by the gold-plated middle of the heat pipe, resulting in a heat-carrying working fluid. The heat-carrying working fluid is driven by capillary force within the microporous core structure, allowing the working fluid to flow through the sintered copper powder microporous channels with a pore size of 50 micrometers and a porosity of 75%, thus obtaining a directional fluid. The directional fluid is guided to the condensation zone at both ends of the heat pipe. The heat exchange area is increased through the fish-scale-like microstructure, which causes the working fluid to release heat and change its state to obtain condensed liquid. By applying a combination of gravity and capillary force to the condensate, it flows back along the inner wall of the heat pipe to the evaporation section, forming an internal circulation loop and thus obtaining a heat transfer path.

3. The solid-state drive with an internal circulation system according to claim 1, characterized in that, Conductive module, used for: The heat conduction network formed by the three-layer structure of high thermal conductivity copper plate, three-dimensional graphene aerogel layer and nano-ceramic coating in the layered heat dissipation substrate is in contact with the heat-generating elements on the circuit board. Heat is absorbed through the high thermal conductivity of the contact surface to obtain the heat load distribution of the heat dissipation substrate. The heat load distribution of the heat dissipation substrate is carried out in stages, and the heat is transferred laterally to the heat pipe array mounting slot through a high thermal conductivity copper plate to obtain the heat source input of the heat pipe slot. The heat source input at the heat pipe slot is transferred to the evaporation section of the heat pipe array. The heat is then transferred to the internal working fluid through the evaporation section of the heat pipe, which is 30 mm long, thus obtaining heat-carrying working fluid. The heat-carrying working fluid is driven by a pressure difference inside the heat pipe, and the heat is distributed through a heat network structure formed by two transverse copper plates connected in the heat pipe, resulting in a uniformly distributed heat flow. The uniformly distributed heat flow is guided to the condensation section formed by extending 10 mm at each end of the heat pipe. The heat is transferred through the heat-conducting copper pipe wall of the condensation section to obtain the temperature field on the outer surface of the condensation section. Based on the temperature field on the outer surface of the condensation section, heat conduction is carried out on the contact surface between the heat pipe condensation section and the copper base. The heat is transferred to the external heat dissipation structure through a 0.05 mm thick contact layer formed by thermal grease, thus obtaining the conduction path for heat to be transported outward.

4. The solid-state drive with an internal circulation system according to claim 1, characterized in that, Absorption module, used for: The data collected by the temperature monitoring network system is processed to determine whether the solid-state drive temperature exceeds the preset threshold of the phase change temperature of the phase change material, and a phase change start trigger signal is obtained. The phase change start-up trigger signal is transmitted to the phase change material heat dissipation module, and the phase change material is contacted through the porous copper mesh heat conduction structure inside the module to obtain a heat conduction channel; Heat is applied to the phase change material to bring its internal temperature to the phase change point. The heat is converted into phase change energy through the latent heat of phase change of 200 joules / gram, resulting in a phase change process from solid to liquid. The heat released during the phase change process is dispersed through the serpentine microchannel structure inside the module. The heat exchange area is increased by the channels with a total length of 200 mm, resulting in a uniform heat distribution. Phase change materials with uniform heat distribution are subjected to heat transfer-assisted treatment with carbon nanotubes. The heat conduction rate is improved by a carbon nanotube network with a mass fraction of 3%, resulting in an enhanced heat conduction field. The heat from the enhanced thermal conductivity field is transferred from the phase change material to the aluminum alloy shell. The heat is then slowly released to the heat dissipation substrate through the black microporous heat dissipation layer on the surface of the shell, thus achieving a heat buffering effect.

5. The solid-state drive with an internal circulation system according to claim 1, characterized in that, Release module, used for: The heat from the condensation section of the heat pipe is transferred to the copper base of the heat sink fin assembly, and a heat conduction channel is formed through the thermally conductive silicone grease layer on the contact surface to obtain the initial heat input of the heat sink fin assembly. The initial heat input of the heat sink assembly is dispersed, and the heat is conducted from the base to each heat sink through parallel high thermal conductivity aluminum alloy heat sinks, thereby expanding the heat dissipation area. The surface microstructure treatment of the extended heat dissipation area increases the air contact area through the microgroove structure on the surface of the heat sink, thereby obtaining enhanced convective heat transfer conditions. By combining enhanced convective heat transfer conditions with black anodizing treatment on the surface of the heat sink, a composite heat dissipation mechanism is obtained by enhancing the thermal radiation effect through high emissivity. Heat is conducted through graphite heat sinks installed on the top and bottom surfaces of the solid-state drive. The heat from the inner surface of the cover plate is dissipated through graphite material with high thermal conductivity, thus creating an auxiliary heat dissipation channel. The auxiliary heat dissipation channel is connected to the ventilation network formed by the micro heat dissipation holes on the side of the casing. The heat dissipation holes and the trapezoidal airflow channels create natural convection driven by the temperature difference between the inside and outside, thereby achieving the process of temperature reduction.

6. The solid-state drive with an internal circulation system according to claim 1, characterized in that, Also includes: The monitoring module is used to adjust the heat dissipation process parameters based on continuous monitoring results through the central processing unit of the temperature monitoring network system. Specifically, the monitoring module is used for: The temperature monitoring network system continuously monitors the data collected by the central processing unit, and stores and processes the data to record the temperature change trends of each temperature measuring point of the main control chip, flash memory chip array, DRAM cache module, phase change material module and heat pipe condensation section, thus obtaining a temperature history database. The data in the temperature history database is analyzed and processed, and the temperature change pattern of each region of the solid-state drive is calculated by the fuzzy neural network algorithm to obtain a temperature prediction model. The working state of the phase change material module is adjusted based on the temperature prediction model. The phase change point is controlled by micro-current heating to change the heat absorption capacity of the phase change material, and the dynamic control parameters of the phase change material are obtained. The hard drive workload is monitored and analyzed based on dynamic control parameters. The dynamic power management module adjusts the start-up timing of the cooling system under different load conditions to obtain the cooling system operation strategy. The heat dissipation system operation strategy is converted into control commands, and the heat dissipation method of the heat dissipation fin assembly is optimized and adjusted through an adaptive temperature control algorithm to obtain a heat dissipation efficiency control scheme. The heat dissipation efficiency control scheme is adjusted based on feedback. The temperature status and the health status of the heat dissipation system are reported to the host via the SMART protocol. Combined with the self-diagnostic function to detect the sensor status and abnormal conditions of the heat dissipation system, dynamic control of the internal temperature of the solid-state drive is obtained.

7. A heat dissipation control method for a solid-state drive with a self-assembled internal circulation system based on any one of claims 1 to 6, characterized in that, The heat dissipation methods for solid-state drives with self-assembled internal circulation systems include: The system detects digital temperature sensor data from a temperature monitoring network system to obtain temperature distribution information for heat pipe array structures and phase change material heat dissipation modules. The working fluid inside the heat pipe array structure is activated based on the temperature distribution information, so that the working fluid absorbs heat and obtains a heat transfer path. The heat pipe array structure conducts heat from the area surrounding the layered heat dissipation substrate to the condensation section; the phase change material heat dissipation module absorbs the peak heat during temperature fluctuations, thus achieving a heat buffering effect. Heat is released to the external environment through the heat dissipation fins of the external passive heat dissipation structure.

8. The heat dissipation method for a solid-state drive with a self-assembled internal circulation system according to claim 7, characterized in that, Also includes: The central processing unit of the temperature monitoring network system adjusts the heat dissipation process parameters based on continuous monitoring results.

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