Chip packaging equipment and chip packaging method

Abstract

The invention discloses chip packaging equipment and a chip packaging method, and belongs to the technical field of chip packaging. Chip packaging equipment comprises a base, a dispensing machine is fixedly installed on the base through a support, the chip packaging equipment further comprises a supporting column rotationally connected to the base, the top of the supporting column is fixedly connected with a rotating disc, through holes distributed in the circumference are formed in the rotating disc, and a driving part for driving the rotating disc to rotate intermittently is arranged on the base; the two cylinders are symmetrically arranged up and down and are arranged on the base, pressurizing drying assemblies are arranged on the cylinders, and an opening and closing part for driving the two cylinders to move oppositely is arranged on the base; according to the invention, the glue can be more tightly adhered to the surface of the chip under the action of pressure, so that the packaging quality of the chip can be effectively guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and particularly to a chip packaging device and a chip packaging method. Background Art

[0002] Chip packaging is an important step in the semiconductor manufacturing process. It involves packaging tiny integrated circuit (IC) chips in a protective case for subsequent installation and use. The packaging not only provides physical protection for the chips but also helps with heat dissipation and ensures the reliability of electrical connections.

[0003] Before the chip is packaged in the protective case, a chip packaging dispenser is also used. It is mainly used to pre-install the chip on the PCB board to protect the chip from the external environment. After the dispensing process, the glue needs to be dried and cured. During this period, it is found that since the surface of the chip is not completely flat, there may be tiny gaps between the glue and the chip surface after dispensing, which will affect the packaging quality of the chip. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem in the prior art that since the surface of the chip is not completely flat, there may be tiny gaps between the glue and the chip surface after dispensing, and to propose a chip packaging device and a chip packaging method.

[0005] To achieve the above purpose, the present invention adopts the following technical solutions:

[0006] A chip packaging device includes a base. A dispenser is fixedly installed on the base through a bracket. It further includes: a pillar rotatably connected to the base. The top of the pillar is fixedly connected to a turntable. The turntable is provided with through holes distributed circumferentially. A driving part for driving the turntable to rotate intermittently is provided on the base; two cylinders symmetrically arranged up and down are arranged on the base. A pressurizing and drying assembly is provided on the cylinder. An opening and closing part for driving the two cylinders to move towards each other is provided on the base.

[0007] To drive the turntable to rotate indirectly, preferably, the driving part includes a driving motor fixedly installed on the base. A short shaft is rotatably connected to the base. The driving motor and the short shaft are connected by a worm and worm gear. A first incomplete gear is fixedly installed on the short shaft. A first driven gear meshing with the first incomplete gear is fixedly installed on the outer wall of the pillar.

[0008] In order to automatically pressurize and dry the glue on the chip, further, the pressurization and drying assembly includes a piston longitudinally and slidably installed in a cylinder. A vertical pipe is fixedly connected to the piston. The lower end of the vertical pipe penetrates to the lower end of the piston. The outer wall of the lower end of the cylinder is fixedly connected with a circulation pipe communicated with it. The top of the vertical pipe is fixedly connected with an end cover. The end of the circulation pipe is fixedly connected with a return pipe extending into the end cover. A hot air blower is fixedly installed in the vertical pipe, and a filter element is installed in the return pipe.

[0009] In order to automatically realize the opening and closing actions of the two cylinders, further, the opening and closing part includes a vertical shaft rotatably connected to the base. Reciprocating lead screws are fixedly installed at both ends of the vertical shaft. A guide rod parallel to the vertical shaft is fixedly connected to the base. Lifting plates slidably connected to the guide rod are installed on the outer walls of the two reciprocating lead screws. The two end covers are respectively rotatably connected to the two lifting plates.

[0010] In order to facilitate the automatic driving of the reciprocating lead screw to rotate, further, a second incomplete gear is fixedly installed on the short shaft. A second driven gear cooperating with the second incomplete gear is fixedly installed at the bottom of the vertical shaft. When the first incomplete gear meshes with the first driven gear, the second incomplete gear does not mesh with the second driven gear.

[0011] In order to improve the reset efficiency of the piston, further, a limiting plate is fixedly connected to the upper port of the cylinder. A reset spring is installed between the piston and the limiting plate.

[0012] In order to enable the cylinder to rotate automatically, further, a transmission shaft is rotatably connected to the lifting plate. A third driven gear is fixedly connected to the lower end of the transmission shaft. A long rod-shaped gear meshing with the third driven gear is fixedly connected to the vertical shaft. The transmission shaft is connected to the end cover through a chain drive.

[0013] In order to reduce the frictional resistance between the cylinder and the turntable, further, the lower port of the cylinder is rotatably connected with a rotating ring, and an annular sealing ring is fixedly connected to the lower port of the rotating ring.

[0014] In order to facilitate the positioning of the chip, preferably, an annular groove is provided at the upper port of the through hole, and the axis of the annular groove is collinear with the axis of the through hole.

[0015] A chip packaging method, the operation steps are as follows:

[0016] Step 1: Place the chip to be dispensed on the upper port of the through hole, and then start the entire device;

[0017] Step 2: When the chip is directly below the dispenser, complete the dispensing work through the dispenser;

[0018] Step 3: When the chip is located below the cylinder, press the two cylinders against the upper and lower sides of the turntable respectively, and place the chip inside the cylinder.

[0019] Step 4: Generate flowing hot air inside the cylinder and create a high-pressure environment inside the cylinder.

[0020] Step 5: Then move the two cylinders away from each other and remove the chip on the upper port of the through hole.

[0021] Compared with the prior art, the present invention provides a chip packaging device, which has the following beneficial effects:

[0022] 1. In this chip packaging device, the two lifting plates drive the cylinders to press against the upper and lower sides of the turntable, and the chip is placed inside the cylinder. At this time, the lifting plates that continue to approach each other will drive the pistons at the ends of the struts to press towards the surface of the turntable, and the pressure inside the cylinder will increase. At this time, the glue will adhere more tightly to the surface of the chip under the action of the pressure, so as to ensure the packaging quality of the chip.

[0023] 2. In this chip packaging device, the hot air blower conveys hot air to the inner bottom of the cylinder, and the air at the inner bottom of the cylinder is discharged into the return pipe from the circulation pipe, then discharged into the end cover from the return pipe, and then returns to the vertical pipe from the end cover, realizing the circulation of the hot air, ensuring the drying efficiency of the glue on the chip. The upper and lower cylinders keep the glue in a high-pressure and high-temperature environment continuously, so that the solidification efficiency of the glue can be higher.

[0024] 3. In this chip packaging device, the vertical shaft drives the long rod-shaped gear to rotate, and the transmission shaft drives the end cover to rotate through chain drive. The end cover drives the cylinder at the bottom to rotate, and the cylinder drives the circulation pipe to revolve around the axis of the cylinder. Thus, the hot air can blow the surface of the chip more comprehensively, ensuring the drying effect.

[0025] 4. In this chip packaging device, the driving motor drives the short shaft to rotate, and the first driven gear drives the turntable to rotate indirectly through the strut. The turntable drives the chip to stay below the dispensing machine and between the two cylinders in turn, so as to automatically realize the feeding work of the chip. Description of the Drawings

[0026] Figure 1 It is a first perspective axonometric structure diagram of a chip packaging device proposed by the present invention;

[0027] Figure 2 It is a second perspective axonometric structure diagram of a chip packaging device proposed by the present invention;

[0028] Figure 3 It is a partial axonometric structure diagram of a chip packaging device proposed by the present invention;

[0029] Figure 4 Isometric structural schematic diagram of a turntable shaft of a chip packaging device proposed by the present invention;

[0030] Figure 5 Isometric structural schematic diagram of a drive motor shaft of a chip packaging device proposed by the present invention;

[0031] Figure 6 Isometric structural schematic diagram of a cylinder of a chip packaging device proposed by the present invention;

[0032] Figure 7 Isometric sectional structural schematic diagram of a cylinder of a chip packaging device proposed by the present invention;

[0033] Figure 8 Isometric structural schematic diagram of a piston of a chip packaging device proposed by the present invention.

[0034] In the figure: 1, base; 2, bracket; 3, dispensing machine; 4, support pillar; 5, turntable; 6, through hole; 7, annular groove; 8, cylinder; 9, rotating ring; 10, piston; 11, vertical pipe; 12, limiting plate; 13, return spring; 14, hot air blower; 15, circulation pipe; 16, end cover; 17, filter element; 18, return pipe; 19, short shaft; 20, drive motor; 21, worm and worm gear; 22, first driven gear; 23, first incomplete gear; 24, vertical shaft; 25, reciprocating lead screw; 26, guide rod; 27, lifting plate; 28, second driven gear; 29, second incomplete gear; 30, transmission shaft; 31, chain drive; 32, third driven gear; 33, long rod-shaped gear. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments.

[0036] In the description of the present invention, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0037] Embodiment 1:

[0038] Refer to Figures 1 - 8, A chip packaging device, including a base 1 for supporting the entire device. A dispenser 3 for dispensing glue on the chip is fixedly installed on the base 1 through a bracket 2. It further includes: a cylindrical pillar 4, rotatably connected to the base 1. Among them, the top of the pillar 4 is fixedly connected to a disc-shaped turntable 5. The turntable 5 is provided with through holes 6 distributed in a circumferential manner. The number of through holes 6 is 3 to 12. In this application, the preferred number is 6. An annular groove 7 is provided at the upper port of the through hole 6. The axis of the annular groove 7 is collinear with the axis of the through hole 6. The annular groove 7 is used to limit the position of the chip. A driving part for driving the intermittent rotation of the turntable 5 is provided on the base 1. The driving part includes a driving motor 20 fixedly installed on the base 1. A short shaft 19 is rotatably connected to the base 1. The driving motor 20 and the short shaft 19 are connected through a worm and worm gear 21. A first incomplete gear 23 is fixedly installed on the short shaft 19. Only half or less than half of the teeth are on the first incomplete gear 23. A first driven gear 22 meshingly connected with the first incomplete gear 23 is fixedly installed on the outer wall of the pillar 4; two cylinders 8 symmetrically arranged up and down are provided on the base 1. Among them, a pressurizing and drying assembly is provided on the cylinder 8. An opening and closing part for driving the two cylinders 8 to move towards each other is provided on the base 1.

[0039] Specifically, during use, the chip to be dispensed is placed at the upper port of the through hole 6. Then, the driving motor 20 is started. The driving motor 20 will drive the short shaft 19 to rotate through the worm and worm gear 21. The short shaft 19 will drive the first incomplete gear 23 and the second incomplete gear 29 to rotate. The first incomplete gear 23 will indirectly drive the first driven gear 22 to rotate. The first driven gear 22 will drive the turntable 5 to rotate indirectly through the pillar 4. The turntable 5 will drive the chip to stay below the dispenser 3 and between the two cylinders 8 in turn, thus automatically realizing the feeding work of the chip. When the chip is directly below the dispenser 3, the dispensing work is completed by the dispenser 3; when the first incomplete gear 23 is not meshing with the first driven gear 22, the opening and closing part will drive the two cylinders 8 to approach each other and press tightly against the upper and lower sides of the turntable 5, and the chip is located inside the cylinder 8. At the same time, the pressure inside the cylinder 8 will increase. At this time, the glue will adhere more tightly to the chip surface under the action of the pressure to ensure the packaging quality of the chip. After drying is completed, the opening and closing part will drive the two cylinders 8 away from the turntable 5 and the chip.

[0040] Embodiment Two:

[0041] Refer to Figures 1 - 3 And Figures 6 - 8 , which is basically the same as Embodiment One. Furthermore, the specific implementation scheme of the pressurizing and drying assembly is specifically disclosed.

[0042] The above-mentioned pressurized drying assembly includes a piston 10 longitudinally and slidably installed in a cylinder 8. The piston 10 can only slide up and down in the cylinder 8. A vertical pipe 11 is fixedly connected to the piston 10. The lower end of the vertical pipe 11 penetrates to the lower end of the piston 10. The outer wall of the lower end of the cylinder 8 is fixedly connected with a circulation pipe 15 communicating with it. The top of the vertical pipe 11 is fixedly connected with an end cover 16. The end of the circulation pipe 15 is fixedly connected with a return pipe 18 extending into the end cover 16. A hot air blower 14 is fixedly installed in the vertical pipe 11, and a filter element 17 for filtering particulate matter is installed in the return pipe 18.

[0043] During use, place the chip to be dispensed at the upper port of the through hole 6, and then start the driving motor 20. The driving motor 20 will drive the short shaft 19 to rotate through the worm and worm gear 21. The short shaft 19 will drive the first incomplete gear 23 and the second incomplete gear 29 to rotate. The first incomplete gear 23 will indirectly drive the first driven gear 22 to rotate. The first driven gear 22 will drive the turntable 5 to rotate indirectly through the support column 4. The turntable 5 will drive the chip to stay below the dispenser 3 and between the two cylinders 8 in turn, thus automatically realizing the feeding work of the chip. When the cylinder 8 covers the chip, turn on the hot air blower 14. The hot air blower 14 will send hot air to the inner bottom of the cylinder 8. The air at the inner bottom of the cylinder 8 will be discharged into the return pipe 18 from the circulation pipe 15, then discharged into the end cover 16 from the return pipe 18, and then flow back into the vertical pipe 11 from the end cover 16, realizing the circulation work of the hot air, ensuring the drying efficiency of the glue. And during the drying process, the upper and lower cylinders 8 will keep the glue in a high-pressure and high-temperature environment continuously, so that the solidification efficiency of the glue can be higher. When the two cylinders 8 are pressed against the upper and lower sides of the turntable 5, the lifting plate 27 that continues to approach each other at this time will drive the piston 10 at the end of the support column 4 to press towards the surface of the turntable 5, and the pressure in the cylinder 8 will increase. At this time, the glue will adhere more tightly to the chip surface under the action of the pressure to ensure the packaging quality of the chip.

[0044] A limiting plate 12 is fixedly connected to the upper port of the above-mentioned cylinder 8. A return spring 13 is installed between the piston 10 and the limiting plate 12. When the two cylinders 8 move away from each other, the return spring 13 will drive the piston 10 to reset to the initial state.

[0045] Embodiment Three:

[0046] Refer to Figures 1 - 6 , which is basically the same as Embodiment Two. Further, the specific implementation scheme of the opening and closing part is specifically disclosed.

[0047] The above-mentioned opening and closing part includes a vertical shaft 24 rotatably connected to the base 1. Reciprocating lead screws 25 are fixedly installed at both ends of the vertical shaft 24, and the two reciprocating lead screws 25 are symmetrically arranged at both ends of the vertical shaft 24. A guide rod 26 parallel to the vertical shaft 24 is fixedly connected to the base 1. Lifting plates 27 slidably connected to the guide rod 26 are installed on the outer walls of the two reciprocating lead screws 25. Two end caps 16 are respectively rotatably connected to the two lifting plates 27; a second incomplete gear 29 is fixedly installed on the short shaft 19. The teeth of the second incomplete gear 29 also account for only half or less than half. A second driven gear 28 cooperating with the second incomplete gear 29 is fixedly installed at the bottom of the vertical shaft 24. When the first incomplete gear 23 meshes with the first driven gear 22, the second incomplete gear 29 does not mesh with the second driven gear 28.

[0048] Specifically, when the first incomplete gear 23 does not mesh with the first driven gear 22, the second incomplete gear 29 will drive the second driven gear 28 to rotate. The second driven gear 28 will drive the vertical shaft 24 to rotate. The vertical shaft 24 will drive the reciprocating lead screws 25 at both ends to rotate synchronously. The two groups of reciprocating lead screws 25 will drive the two lifting plates 27 to approach each other and then move away from each other and reset. When the two lifting plates 27 approach each other, the two lifting plates 27 will drive the cylinder 8 to tightly press against the upper and lower sides of the turntable 5 and make the chip located inside the cylinder 8. At this time, the continuously approaching lifting plates 27 will drive the piston 10 at the end of the support column 4 to press towards the surface of the turntable 5. The pressure inside the cylinder 8 will increase. At this time, the glue will be more tightly adhered to the chip surface under the action of the pressure to ensure the packaging quality of the chip. When the two lifting plates 27 move away from each other, they will drive the two cylinders 8 away from the turntable 5 and the chip.

[0049] In practice, in order to ensure the drying effect, the teeth of the second incomplete gear 29 can be divided into two sections, and there is a gap between the two sections of teeth. So after the reciprocating lead screw 25 drives the two lifting plates 27 to approach each other, the two lifting plates 27 can stay for a period of time and then move away from each other and reset. Thus, the hot air can stay on the surface of the chip for a longer time to ensure the drying effect.

[0050] Embodiment 4:

[0051] Refer to Figures 6 - 8 , which is basically the same as Embodiment 3. Furthermore, a specific implementation scheme for rotating the cylinder 8 is specifically added.

[0052] A drive shaft 30 is rotatably connected to the lifting plate 27 described above. A third driven gear 32 is fixedly connected to the lower end of the drive shaft 30. A long rod-shaped gear 33 meshing with the third driven gear 32 is fixedly connected to the vertical shaft 24. The length of the long rod-shaped gear 33 needs to be greater than or equal to the length of the reciprocating lead screw 25. The drive shaft 30 is connected to the end cover 16 through a chain drive 31, and the chain drive 31 is mainly composed of two sprockets and a chain.

[0053] When the vertical shaft 24 rotates, the vertical shaft 24 will also drive the long rod-shaped gear 33 to rotate. The long rod-shaped gear 33 will drive the drive shaft 30 to rotate through the third driven gear 32. The drive shaft 30 will drive the end cover 16 to rotate through the chain drive 31. The end cover 16 will drive the cylinder 8 at the bottom to rotate. The cylinder 8 will drive the circulation pipe 15 to revolve around the axis of the cylinder 8. Thus, the hot air can blow the surface of the chip more comprehensively to ensure the drying effect.

[0054] A rotating ring 9 is rotatably connected to the lower port of the cylinder 8 described above, and an annular sealing ring is fixedly connected to the lower port of the rotating ring 9.

[0055] Specifically, when the two cylinders 8 approach each other and press tightly against the turntable 5, the rotating ring 9 will be attached to the turntable 5. Thus, when the cylinder 8 rotates, the cylinder 8 will rotate on the rotating ring 9 instead of on the turntable 5, thereby reducing the friction between the cylinder 8 and the turntable 5.

[0056] A method for chip packaging, the operation steps are as follows:

[0057] Step 1: Place the chip to be dispensed on the upper port of the through hole 6, and then start the entire device;

[0058] Step 2: When the chip is directly below the dispenser 3, complete the dispensing work through the dispenser 3;

[0059] Step 3: When the chip is below the cylinder 8, press the two cylinders 8 against the upper and lower sides of the turntable 5 respectively, and place the chip inside the cylinder 8;

[0060] Step 4: Generate flowing hot air inside the cylinder 8 and create a high-pressure environment inside the cylinder 8;

[0061] Step 5: Then move the two cylinders 8 away from each other and remove the chip on the upper port of the through hole 6.

[0062] When this chip packaging device is in use, place the chip to be dispensed on the upper port of the through hole 6, and then start the drive motor 20. The drive motor 20 will drive the short shaft 19 to rotate through the worm and worm gear 21. The short shaft 19 will drive the first incomplete gear 23 and the second incomplete gear 29 to rotate. The first incomplete gear 23 will indirectly drive the first driven gear 22 to rotate. The first driven gear 22 will indirectly drive the turntable 5 to rotate through the support column 4. The turntable 5 will successively drive the chip to stay below the dispenser 3 and between the two cylinders 8, thus automatically realizing the feeding work of the chip. When the chip is directly below the dispenser 3, the dispensing work is completed by the dispenser 3.

[0063] When the first incomplete gear 23 is not engaged with the first driven gear 22, the second incomplete gear 29 will drive the second driven gear 28 to rotate. The second driven gear 28 will drive the vertical shaft 24 to rotate. The vertical shaft 24 will drive the reciprocating lead screws 25 at both ends to rotate synchronously. The two groups of reciprocating lead screws 25 will drive the two lifting plates 27 to approach each other and then move away from each other and reset. When the two lifting plates 27 approach each other, the two lifting plates 27 will drive the cylinders 8 to press tightly against the upper and lower sides of the turntable 5 and place the chip inside the cylinders 8. At this time, the lifting plates 27 that continue to approach each other will drive the piston 10 at the end of the support column 4 to press towards the surface of the turntable 5. The pressure inside the cylinders 8 will increase. At this time, the glue will adhere more tightly to the chip surface under the action of the pressure to ensure the packaging quality of the chip. When the two lifting plates 27 move away from each other, they will drive the two cylinders 8 away from the turntable 5 and the chip.

[0064] When the cylinders 8 cover the chip, turn on the hot air blower 14. The hot air blower 14 will deliver hot air to the inner bottom of the cylinders 8. The air at the inner bottom of the cylinders 8 will be discharged into the return pipe 18 from the circulation pipe 15, then discharged into the end cap 16 from the return pipe 18, and then return to the vertical pipe 11 from the end cap 16 to realize the circulation work of the hot air and ensure the drying efficiency of the glue. During the drying process, the upper and lower two cylinders 8 will keep the glue in a high-pressure and high-temperature environment continuously, so that the solidification efficiency of the glue can be higher.

[0065] When the vertical shaft 24 rotates, the vertical shaft 24 will also drive the long rod-shaped gear 33 to rotate. The long rod-shaped gear 33 will drive the transmission shaft 30 to rotate through the third driven gear 32. The transmission shaft 30 will drive the end cap 16 to rotate through the chain drive 31. The end cap 16 will drive the cylinder 8 at the bottom to rotate. The cylinder 8 will drive the circulation pipe 15 to revolve around the axis of the cylinder 8. Thus, the hot air can blow the surface of the chip more comprehensively to ensure the drying effect.

[0066] The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, making equivalent substitutions or changes, shall be covered by the protection scope of the present invention.

Claims

1. A chip packaging device, comprising a base, on which a dispensing machine is fixedly installed through a bracket, characterized in that, It further includes: A support pillar rotatably connected to the base, wherein, a turntable is fixedly connected to the top of the support pillar, through holes are provided on the turntable in a circumferential distribution, and a driving part for driving the turntable to rotate intermittently is provided on the base; Two cylinders arranged symmetrically up and down, provided on the base, wherein, a pressurizing and drying assembly is provided on the cylinder, and an opening and closing part for driving the two cylinders to move towards each other is provided on the base.

2. The chip packaging device according to claim 1, wherein The driving part includes a driving motor fixedly installed on the base, a short shaft is rotatably connected to the base, the driving motor and the short shaft are connected through a worm and worm gear, a first incomplete gear is fixedly installed on the short shaft, and a first driven gear meshed with the first incomplete gear is fixedly installed on the outer wall of the support pillar.

3. A chip packaging device according to claim 2, characterized in that, The pressurizing and drying assembly includes a piston longitudinally slidably installed in the cylinder, a vertical pipe is fixedly connected to the piston, the lower end of the vertical pipe penetrates to the lower end of the piston, a circulation pipe communicated with the cylinder is fixedly connected to the outer wall of the lower end of the cylinder, an end cover is fixedly connected to the top of the vertical pipe, a return pipe extending into the end cover is fixedly connected to the end of the circulation pipe, a hot air blower is fixedly installed in the vertical pipe, and a filter element is installed in the return pipe.

4. A chip packaging device according to claim 3, characterized in that, The opening and closing part includes a vertical shaft rotatably connected to the base, reciprocating lead screws are fixedly installed at both ends of the vertical shaft, a guide rod parallel to the vertical shaft is fixedly connected to the base, lifting plates slidably connected to the guide rod are installed on the outer walls of the two reciprocating lead screws, and the two end covers are respectively rotatably connected to the two lifting plates.

5. A chip packaging device according to claim 4, characterized in that, A second incomplete gear is fixedly installed on the short shaft, a second driven gear matched with the second incomplete gear is fixedly installed at the bottom of the vertical shaft, and when the first incomplete gear meshes with the first driven gear, the second incomplete gear does not mesh with the second driven gear.

6. The chip packaging device according to claim 3, characterized in that, A limiting plate is fixedly connected to the upper port of the cylinder, and a return spring is installed between the piston and the limiting plate.

7. A chip packaging device according to claim 4, wherein A transmission shaft is rotatably connected to the lifting plate, a third driven gear is fixedly connected to the lower end of the transmission shaft, a long rod-shaped gear meshed with the third driven gear is fixedly connected to the vertical shaft, and the transmission shaft is connected to the end cover through a chain drive.

8. An integrated circuit packaging device according to claim 7, wherein, A rotating ring is rotatably connected to the lower port of the cylinder, and an annular sealing ring is fixedly connected to the lower port of the rotating ring.

9. A chip packaging device according to claim 1, characterized in that, An annular groove is provided at the upper port of the through hole, and the axis of the annular groove is collinear with the axis of the through hole.

10. A chip packaging method, comprising a chip packaging device according to any one of claims 1-9, characterized in that, The operation steps are as follows: Step 1: Place the chip to be dispensed on the upper port of the through hole, and then start the whole device; Step 2: When the chip is directly below the dispenser, complete the dispensing work through the dispenser; Step 3: When the chip is below the cylinder, make the two cylinders respectively abut against the upper and lower sides of the turntable, and make the chip located inside the cylinder; Step 4: Generate flowing hot air inside the cylinder and generate a high-pressure environment inside the cylinder; Step 5: Then move the two cylinders away from each other and remove the chip on the upper port of the through hole.

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