A semiconductor product packaging bonding elastic fixture

Abstract

The present invention discloses an elastic jig for packaging and bonding semiconductor products, which relates to the field of semiconductor processing technology. According to the specifications of the semiconductor products, the present invention opens an adaptive through-groove on an inner plate, and connects a pressure block with a downwardly protruding bottom end in the through-groove through an elastic strip. With the elastic deformation ability of the elastic strip and the protruding structure of the lower end of the pressure block, when the pressure plate is pressed on the top of the semiconductor product, the pressure block can be adaptively and tightly pressed on the top of the semiconductor product, thereby compensating for the height tolerance of the semiconductor product. Through elastic deformation, the semiconductor product is compacted, and the bonding position on the semiconductor product is accurately positioned, which can effectively improve the accuracy and stability of the semiconductor product during subsequent packaging and bonding operations.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to an elastic jig for semiconductor product packaging and bonding. Background Art

[0002] In semiconductor packaging processing, a bonding process is required to electrically connect the chip to carriers such as substrates and lead frames. During the bonding process, the packaging fixture is the core component that supports and fixes the semiconductor product. Its performance and structure play a vital role in the quality of semiconductor product packaging and bonding.

[0003] At present, traditional semiconductor packaging bonding jigs usually adopt a rigid clamping structure, and the semiconductor product is fixed on the jig surface through a clamping structure such as a mechanical pressure block. In actual production, due to the limitations of the semiconductor product manufacturing process, there will inevitably be height tolerances on the top of the semiconductor product. Such tolerances will not affect the quality of the product. However, when using a rigid jig to press and fix the semiconductor product, these height differences will cause the product to not be completely fitted with the jig surface, causing the semiconductor to wobble slightly in the vertical direction. This wobble will cause the relative position between the bonding equipment's welding head and the chip bonding point to deviate from the preset parameters, making it easy for defects such as bonding position offset and bonding wire breakage to occur, thereby affecting the accuracy and stability of the semiconductor product during bonding and packaging.

[0004] Therefore, a semiconductor product packaging bonding elastic jig is proposed to solve some problems existing in the above-mentioned prior art. Summary of the Invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art in which, due to the height tolerance on the top of the semiconductor product during packaging and bonding, the rigid jig cannot fully fit the semiconductor product during press-fitting and fixing, and is prone to slight shaking, which in turn affects the accuracy and stability of the semiconductor product during bonding and packaging. A flexible jig for semiconductor product packaging and bonding is proposed to solve the problem.

[0006] In order to solve the problems existing in the prior art, the present invention adopts the following technical solutions:

[0007] The cam is provided with a plurality of symmetrically arranged elastic strips on the left and right sides of the through-slots, and a downwardly protruding pressure block is fixed at the end of the elastic strip near the middle position in the through-slots. A top plate is provided above the pressure plate, and a window adapted to fit the inner plate is provided through the top plate. A vertically arranged first electric push rod is fixed at the left and right ends of the top plate, and the telescopic end below the first electric push rod is fixedly connected to the pressure plate. A base is provided below the pressure plate, and a support block adapted to fit the inner plate is installed on the base. A first clamping mechanism and a second clamping mechanism are respectively provided on the left and right sides of the pressure plate, the first clamping mechanism comprises a first connecting plate connected to the left side of the pressure plate, and a first frame is provided at the bottom of the first connecting plate, and two first rollers symmetrically arranged up and down are longitudinally rotated in the first frame, and the second clamping mechanism comprises a second connecting plate connected to the right side of the pressure plate, and a second frame is provided at the bottom of the second connecting plate, and two second rollers symmetrically arranged up and down are longitudinally rotated in the second frame.

[0008] Preferably, a first mounting groove is provided in the middle of the pressure plate, the inner plate is movably embedded in the first mounting groove and is fastened by bolts, and a second mounting groove is provided on the base, the support block is movably embedded in the second mounting groove and is fastened by bolts.

[0009] Preferably, the first frame and the second frame are both equipped with a ratchet mechanism for limiting the unidirectional rotation of the first roller and the second roller, a horizontally arranged linear rail is fixed to the left side of the pressure plate, the first connecting plate is slidingly connected to the pressure plate through the linear rail, and symmetrically arranged second electric push rods are fixed on the front and rear sides of the top plate, a vertically arranged slide frame is fixed on the first frame, and a longitudinally arranged plug rod is fixed at the end of the telescopic end of the second electric push rod, and the plug rod is movably inserted in the slide frame.

[0010] Preferably, a vertically arranged first column is slidably inserted into the first connecting plate, the first frame is fixed to the bottom of the first column, and the outer movable sleeve of the first column is provided with a first spring elastically supported between the first connecting plate and the first frame, and a vertically arranged second column is slidably inserted into the second connecting plate, the second frame is fixed to the bottom of the second column, and the outer movable sleeve of the second column is provided with a second spring elastically supported between the second connecting plate and the second frame.

[0011] Preferably, the middle position of the cylindrical surface of the first roller located above is recessed toward the central axis thereof, and the middle position of the cylindrical surface of the second roller located above is also recessed toward the central axis thereof.

[0012] Preferably, the distance between the upper and lower first rollers, and the distance between the upper and lower second rollers are adapted to the thickness of the semiconductor product substrate to be bonded, the cylindrical surface of the first roller is provided with first air holes distributed in a surrounding manner, the cylindrical surface of the second roller is provided with second air holes distributed in a surrounding manner, the back of the first frame is fixed with a first adapter box that is rotatably connected to the interior of the first roller, and the back of the second frame is fixed with a second adapter box that is rotatably connected to the interior of the second roller.

[0013] Preferably, the ratchet mechanism includes gears fixed at the end positions of the first roller and the second roller, the upper and lower gears are engaged with each other, the end positions of the first roller and the second roller located above are fixed with ratchet bodies, and pawls adapted to the ratchet bodies are rotated on the first frame and the second frame, and a third spring for elastically supporting the pawl is fixed on the first frame and the second frame.

[0014] Preferably, thermoelectric cooling sheets are embedded on both sides of the top of the pressing plate, and the top of the thermoelectric cooling sheets is covered with a radiator. The cooling surface of the thermoelectric cooling sheets is tightly fitted to the pressing plate, and the heat dissipation surface of the thermoelectric cooling sheets is tightly fitted to the radiator.

[0015] Preferably, symmetrically arranged air boxes are fixed on the left and right sides of the window, and evenly distributed jet channels are provided in the air boxes. The jet channels in the air boxes on the left and right sides are staggered, and a guide plate is fixed at the upper position in the air box, and the side of the guide plate close to the window is set to a downward inclined structure.

[0016] Preferably, a vacuum generator is fixed on the top plate, and the air inlet of the vacuum generator is connected to an external air pump, the negative pressure suction port of the vacuum generator is connected to the first adapter box and the second adapter box, and the air outlet of the vacuum generator is connected to the interior of the left and right air boxes.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] 1. In the present invention, a through-groove adapted to the specifications of the semiconductor product is provided on the inner plate, and a pressing block with a downwardly protruding bottom end is connected to the through-groove via an elastic strip. Leveraging the elastic deformation capability of the elastic strip and the protruding structure at the bottom end of the pressing block, when the pressing plate is pressed against the top of the semiconductor product, the pressing block can adaptively and tightly press against the top of the semiconductor product, compensating for the height tolerance of the semiconductor product. Through elastic deformation, the semiconductor product is compacted, and the bonding position on the semiconductor product is precisely located, effectively improving the accuracy and stability of the subsequent packaging and bonding operations of the semiconductor product.

[0019] 2. In the present invention, by installing the ratchet mechanism on the first frame and the second frame, the rotation direction of the first roller and the second roller are restricted respectively, and then the first clamping mechanism is set to be able to move left and right relative to the pressure plate through the linear rail, and the drive of the second electric push rod is cooperated, so that after the package bonding of the same vertical row on the semiconductor product is completed, the first clamping mechanism can be driven by the second electric push rod to drive the semiconductor product to move horizontally to the right. Only by controlling the reciprocating length of the telescopic end of the second electric push rod, the rightward movement distance of the semiconductor product can be accurately controlled, making the movement control more accurate, which is conducive to further ensuring the accuracy and stability of the semiconductor product packaging and bonding process;

[0020] 3. In the present invention, by setting the distance between the upper and lower first rollers and the distance between the upper and lower second rollers to be consistent with the thickness of the semiconductor product substrate, the semiconductor product substrate can be prevented from being damaged by excessive roller pressure during transportation. At the same time, by distributing the first air holes around the first roller and the second air holes around the second roller, and providing air suction at the first and second air holes, a negative pressure adsorption connection is formed by the air suction, which ensures the stability of the connection between the first and second rollers and the semiconductor product substrate, thereby ensuring the stability of the semiconductor product when it is transported to the right between the upper and lower first rollers and the upper and lower second rollers.

[0021] 4. In the present invention, by embedding the thermoelectric cooling sheet in the pressing plate and closely fitting the cooling surface of the thermoelectric cooling sheet to the pressing plate, when the thermoelectric cooling sheet is powered on and started to cool, the cold energy can be quickly transferred to the pressing block through the pressing plate, the inner plate and the elastic strip. By pressing the pressing block on the position to be bonded on the semiconductor product, the cold energy is transferred to the semiconductor product, and the bonding position on the semiconductor product is actively cooled. This can prevent the normal packaging and bonding process of the semiconductor product from being affected by the high temperature during bonding, and to a certain extent ensure the stability of the staff when using the device to package semiconductor products. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0023] Figure 1 A three-dimensional diagram of the pressing plate, through groove, elastic strip and pressing block of the present invention;

[0024] Figure 2 A perspective view of the present invention in operation;

[0025] Figure 3 For the present invention Figure 2Split diagram of the structure in the middle;

[0026] Figure 4 A three-dimensional diagram of the pressing plate, the first clamping mechanism, and the second clamping mechanism from the left side of the present invention;

[0027] Figure 5 A three-dimensional diagram of the pressing plate, the first clamping mechanism, and the second clamping mechanism according to the present invention from the right side perspective;

[0028] Figure 6 For the present invention Figure 2 Top view of the structure;

[0029] Figure 7 For the present invention Figure 6 Cross-sectional view at AA in the middle;

[0030] Figure 8 For the present invention Figure 7 Enlarged view of point B in the middle;

[0031] Figure 9 For the present invention Figure 2 Front view of the middle structure;

[0032] Figure 10 For the present invention Figure 9 Cross-sectional view at CC;

[0033] Figure 11 For the present invention Figure 9 Cross-sectional view at DD in the middle.

[0034] Serial number in the picture:

[0035] 1. Pressing plate; 101. Inner plate; 102. Through slot; 103. Elastic strip; 104. Pressing block; 105. First mounting slot;

[0036] 2. Top plate; 201. Window; 202. First electric push rod; 203. Base; 204. Support block; 205. Second mounting slot;

[0037] 3. First connecting plate; 301. First column; 302. First frame; 303. First spring; 304. First roller; 305. First air hole; 306. First adapter box;

[0038] 4. Second connecting plate; 401. Second column; 402. Second frame; 403. Second spring; 404. Second roller; 405. Second air hole; 406. Second adapter box;

[0039] 5. Gear; 501. Ratchet body; 502. Pawl; 503. Third spring;

[0040] 6. Linear rail; 601. Second electric push rod; 602. Slide rack; 603. Insert rod;

[0041] 7. Thermoelectric cooling chip; 701. Radiator; 702. Gas box; 703. Jet channel; 704. Guide plate;

[0042] 8. Vacuum generator. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0044] Example: This embodiment provides a semiconductor product packaging bonding elastic fixture, see Figures 1-11 Specifically, it includes a pressing plate 1, an inner plate 101 is installed in the middle position of the pressing plate 1, and a number of evenly distributed through grooves 102 are arranged side by side in the inner plate 101, and symmetrically arranged elastic strips 103 are fixed on the left and right sides of the through grooves 102, and a downwardly protruding pressing block 104 is fixed at the end of the elastic strip 103 near the middle position of the through groove 102, a top plate 2 is provided above the pressing plate 1, and a window 201 adapted to the inner plate 101 is opened through the top plate 2, a vertically arranged first electric push rod 202 is fixed on the left and right ends of the top plate 2, and the telescopic end below the first electric push rod 202 is fixedly connected to the pressing plate 1, and a bottom of the pressing plate 1 is provided A base 203 is provided, and a support block 204 adapted to the inner plate 101 is installed on the base 203. A first clamping mechanism and a second clamping mechanism are respectively provided on the left and right sides of the pressure plate 1. The first clamping mechanism includes a first connecting plate 3 connected to the left side of the pressure plate 1, and a first frame 302 is provided at the bottom of the first connecting plate 3. Two first rollers 304 are symmetrically arranged in the upper and lower parts for longitudinal rotation in the first frame 302. The second clamping mechanism includes a second connecting plate 4 connected to the right side of the pressure plate 1, and a second frame 402 is provided at the bottom of the second connecting plate 4. Two second rollers 404 are symmetrically arranged in the upper and lower parts for longitudinal rotation in the second frame 402.

[0045] When performing packaging and bonding processing on semiconductor products, the device can be used to perform adaptive elastic compression on the semiconductor products, thereby performing precise positioning and ensuring the precise stability of the semiconductor products during packaging and bonding. During operation, the semiconductor products to be packaged and bonded are inserted between the first clamping mechanism and the second clamping mechanism on the left and right sides, and are restricted by the first clamping mechanism and the second clamping mechanism, which makes the semiconductor products between the pressure plate 1 and the base 203. Before preparing for packaging and bonding, the first electric push rod 202 is powered on and started, driving the pressure plate 1 to move downward, and driving the semiconductor products to move downward synchronously through the first clamping mechanism and the second clamping mechanism. The semiconductor product is moved and finally pressed onto the support block 204. Since the semiconductor product has a height tolerance during the production process, when the device is used to clamp and restrict the semiconductor product, after the pressure plate 1 is installed on the semiconductor product, it is affected by the elastic deformation ability provided by the elastic strip 103 and the protrusion of the bottom end of the pressure block 104 below the pressure plate 1. This allows the elastic strip 103 to elastically deform and drive the pressure block 104 to adaptively and tightly press on the top of the semiconductor product, thereby compensating for the height tolerance of the semiconductor product and compacting the semiconductor product through elastic deformation, making it convenient for subsequent precise and stable bonding and packaging operations.

[0046] After the package bonding of the same vertical column on the semiconductor product is completed, the first electric push rod 202 controls its telescopic end to retract upward, driving the pressure plate 1 and the semiconductor product inserted between the first clamping mechanism and the second clamping mechanism below to move upward synchronously. Since the semiconductor product is inserted between the first roller 304 symmetrically arranged up and down in the first frame 302 and the second roller 404 symmetrically arranged up and down in the second frame 402, and the first roller 304 and the second roller 404 can rotate, this allows the device to release the pressing of the semiconductor product. The semiconductor product can move laterally between the first clamping mechanism and the second clamping mechanism. After the semiconductor product is laterally translated, the device controls the pressure plate 1 and the semiconductor product to move down again, and re-extrudes and presses the semiconductor product to facilitate the package bonding of another vertical column. With the help of the rolling guidance of the upper and lower first rollers 304 in the first clamping mechanism and the rolling guidance of the upper and lower second rollers 404 in the second clamping mechanism, the lateral movement of the semiconductor product during package bonding is smoother and more stable, which is beneficial to improving the accuracy of semiconductor product package bonding and facilitating the overall processing efficiency.

[0047] In the specific implementation process, Figure 3 and Figure 7As shown, a first mounting groove 105 is provided in the middle of the pressing plate 1, and the inner plate 101 is movably embedded in the first mounting groove 105 and is fastened by bolts. A second mounting groove 205 is provided on the base 203, and the support block 204 is movably embedded in the second mounting groove 205 and is fastened by bolts. During the operation of the device, the inner plate 101 is connected to the pressing plate 1 by being movably embedded in the first mounting groove 105 and then fastened by bolts. This allows the inner plate 101 installed on the pressing plate 1 to be flexibly replaced according to the specifications of the actual semiconductor product. Similarly, the support block 204 is fastened by By being movably embedded in the second mounting groove 205, it is connected to the base 203 and then fastened by bolts. This allows the support block 204 to be flexibly replaced as needed. The staff can process the through groove 102, elastic strip 103 and pressure block 104 in accordance with the actual specifications of the semiconductor product, and replace the inner plate 101 with a suitable position and quantity, so that semiconductor products of different specifications can share the main structure of the device. When elastically pressing and clamping semiconductor products of different batches and specifications, it is only necessary to replace the inner plate 101 that is adapted thereto, which is conducive to reducing production costs.

[0048] In the specific implementation process, Figure 2-Figure 6 and Figure 9 As shown, the first frame 302 and the second frame 402 are both equipped with a ratchet mechanism for limiting the unidirectional rotation of the first roller 304 and the second roller 404. The ratchet mechanism includes a gear 5 fixed at the end position of the first roller 304 and the second roller 404. The upper and lower gears 5 are engaged with each other. The end positions of the first roller 304 and the second roller 404 located above are both fixed with a ratchet body 501. The first frame 302 and the second frame 402 are equipped with a pawl 502 adapted to the ratchet body 501. A third spring 503 for elastically supporting the pawl 502 is fixed on the first frame 302 and the second frame 402, a horizontally arranged linear rail 6 is fixed on the left side of the pressure plate 1, the first connecting plate 3 is slidingly connected to the pressure plate 1 through the linear rail 6, and a symmetrically arranged second electric push rod 601 is fixed on the front and back sides of the top plate 2, a vertically arranged slide frame 602 is fixed on the first frame 302, and a longitudinally arranged plug rod 603 is fixed at the end of the telescopic end of the second electric push rod 601, and the plug rod 603 is movably inserted in the slide frame 602.

[0049] During the operation of the device, the upper and lower gears 5 engage with each other, which can ensure the synchronous relative rotation of the upper and lower first rollers 304 and the synchronous relative rotation of the upper and lower second rollers 404. When the ratchet mechanism is in operation, the elastic support of the third spring 503 will cause the pawl 502 to engage with the helical teeth distributed around the outside of the ratchet body 501. The cooperation between the pawl 502 and the helical teeth limits the rotation direction of the ratchet body 501, which makes the ratchet body 501 only able to rotate in one direction. In the ratchet mechanism on the front side of the first frame 302, the ratchet body 501 is fixedly connected to the first roller 304 located above, which limits the clockwise rotation of the first roller 304 located above and the counterclockwise rotation of the first roller 304 located below. Similarly, under the influence of the ratchet mechanism installed on the front side of the second frame 402, the clockwise rotation of the second roller 404 located above is limited and the counterclockwise rotation of the second roller 404 located below is limited.

[0050] After the package bonding of the same vertical column on the semiconductor product is completed, it is necessary to control the semiconductor product to move horizontally to the right. In the process of switching the position to be packaged and bonded, the second electric push rod 601 is energized and started to control the first clamping mechanism to move to the left. Since the clockwise rotation of the second roller 404 located above is restricted, and the counterclockwise rotation of the second roller 404 located below is restricted, under the clamping restriction of the upper and lower second rollers 404, the semiconductor product inserted between the upper and lower second rollers 404 can only move horizontally to the right and cannot move horizontally to the left. In the process of the first clamping mechanism being controlled to move to the left by the second electric push rod 601, the counterclockwise rotation of the first roller 304 located above and the clockwise rotation of the first roller 304 located below are not restricted. With the help of the rolling of the upper and lower first rollers 304, the first clamping mechanism can move smoothly to the left relative to the semiconductor product, and the distance the first clamping mechanism moves to the left is controlled according to the distance between the adjacent vertical column bonding positions on the semiconductor product.

[0051] Then the telescopic end of the second electric push rod 601 moves to the right, pulling the first clamping mechanism to move to the right to the initial position. During this process, since the clockwise rotation of the first roller 304 located above is restricted, the counterclockwise rotation of the first roller 304 located below is restricted. This makes it impossible for the first clamping mechanism to move to the right relative to the semiconductor product when the semiconductor product is inserted between the upper and lower first rollers 304. Therefore, during the movement of the first clamping mechanism to the right, the semiconductor product inserted therein can be driven to move to the right synchronously. In the second clamping mechanism located on the right, due to the counterclockwise rotation of the second roller 404 located above and the clockwise rotation of the second roller 404 located below, The rotation is not restricted. With the help of the rolling of the upper and lower second rollers 404, the second clamping mechanism will not restrict the rightward movement of the semiconductor product. Under the cooperation of each other, the semiconductor product can be smoothly, stably and accurately controlled to move to the right by the first clamping mechanism, thereby completing the switching operation of the adjacent vertical column packaging bonding positions on the semiconductor product. During this switching process, the left and right movement distance of the first clamping mechanism is controlled by the movement of the telescopic end of the second electric push rod 601, thereby realizing the control of the rightward movement of the semiconductor product. Compared with the existing technology of realizing the rightward movement operation of the semiconductor product by rotating transportation, the movement control is more precise, which is conducive to ensuring the precise stability during the packaging and bonding process of the semiconductor product.

[0052] In the process of controlling the left and right movement of the first clamping mechanism by the second electric push rod 601, the plug rod 603 with a fixed position at the telescopic end of the second electric push rod 601 is movably inserted into the vertically arranged slide frame 602, so that the plug rod 603 and the slide frame 602 can slide up and down relative to each other, so that when the first clamping mechanism moves up and down following the pressure plate 1, the left and right push of the first clamping mechanism by the second electric push rod 601 will not be affected, which can ensure the stability of the device during operation.

[0053] In the specific implementation process, Figure 4 、 Figure 5 、 Figure 7 and Figure 10-11 As shown, a vertically arranged first column 301 is slidably inserted into the first connecting plate 3, the first frame 302 is fixed to the bottom of the first column 301, and the outer movable sleeve of the first column 301 is provided with a first spring 303 elastically supported between the first connecting plate 3 and the first frame 302, and a vertically arranged second column 401 is slidably inserted into the second connecting plate 4, the second frame 402 is fixed to the bottom of the second column 401, and the outer movable sleeve of the second column 401 is provided with a second spring 403 elastically supported between the second connecting plate 4 and the second frame 402.

[0054] During the operation of the device, the first column 301 is vertically inserted into the first connecting plate 3, so that the first frame 302 fixed at the bottom of the first column 301 can be lifted up and down relative to the first connecting plate 3, and the second column 401 is vertically inserted into the second connecting plate 4, so that the second frame 402 fixed at the bottom of the second column 401 can be lifted up and down relative to the second connecting plate 4. With the help of the elastic support of the first spring 303 arranged between the first connecting plate 3 and the first frame 302, and the elastic support of the second spring 403 arranged between the second connecting plate 4 and the second frame 402, when the pressure plate 1 is controlled to move upward to release the pressure on the semiconductor product below, the first frame 302 and the second frame 402 will automatically move downward a distance relative to the pressure plate 1, realizing the automatic separation operation of the bottom of the pressure plate 1 and the top of the semiconductor product, and completely releasing the stop of the pressure plate 1 and the pressure block 104 on the top of the circuit board product, which is conducive to ensuring the smoothness and stability of the circuit board product when it moves horizontally to the right during processing.

[0055] In the specific implementation process, Figure 4-Figure 5 and Figure 10-11 As shown, the middle position of the cylindrical surface of the first roller 304 located above is recessed toward its central axis, and the middle position of the cylindrical surface of the second roller 404 located above is also recessed toward its central axis. During the operation of the device, the position where the semiconductor product needs to be bonded and packaged protrudes upward. By setting the middle position of the cylindrical surface of the first roller 304 above and the second roller 404 above to an inwardly recessed structure, the first roller 304 above and the second roller 404 above can avoid the protruding structure on the top of the semiconductor product during the rolling process, which is beneficial to ensure the smooth movement of the semiconductor product between the upper and lower first rollers 304 and between the upper and lower second rollers 404.

[0056] In the specific implementation process, Figure 10 and Figure 11As shown, the distance between the upper and lower first rollers 304 and the distance between the upper and lower second rollers 404 are adapted to the thickness of the substrate of the semiconductor product to be bonded, the cylindrical surface of the first roller 304 is provided with first air holes 305 distributed in a circumferential manner, and the cylindrical surface of the second roller 404 is provided with second air holes 405 distributed in a circumferential manner, the back of the first frame 302 is fixed with a first adapter box 306 that is rotatably connected to the inside of the first roller 304, and the back of the second frame 402 is fixed with a second adapter box 406 that is rotatably connected to the inside of the second roller 404. During the operation of the device, since the distance between the upper and lower first rollers 304 and the distance between the upper and lower second rollers 404 are set to be consistent with the thickness of the substrate of the semiconductor product, when the semiconductor product moves between the upper and lower first rollers 304 and the upper and lower second rollers 404, the upper and lower first rollers 304 and the upper and lower second rollers 404 will not cause excessive extrusion to the substrate of the semiconductor product, thereby avoiding damage to the semiconductor product substrate due to excessive rolling pressure during transportation.

[0057] During the movement of the semiconductor product, in order to ensure the stability of the upper and lower first rollers 304 and the upper and lower second rollers 404 in grasping the semiconductor product substrate, air suction will be provided in the first transfer box 306 and the second transfer box 406. A channel connected to the numerous first air holes 305 is opened in the first roller 304, and a channel connected to the numerous second air holes 405 is opened in the second roller 404. The air suction acts on the first air holes 305 and the second air holes 405 through the channel. The negative pressure adsorption connection formed by the air suction can ensure the stability of the connection between the first roller 304, the second roller 404 and the semiconductor product substrate, thereby ensuring the stability of the semiconductor product when it is transported to the right between the upper and lower first rollers 304 and the upper and lower second rollers 404.

[0058] In the specific implementation process, Figure 3-Figure 5As shown, thermoelectric cooling sheets 7 are embedded on both sides of the top of the pressure plate 1, and the top of the thermoelectric cooling sheet 7 is covered with a radiator 701. The cooling surface of the thermoelectric cooling sheet 7 is tightly fitted with the pressure plate 1, and the heat dissipation surface of the thermoelectric cooling sheet 7 is tightly fitted with the radiator 701. The left and right sides of the window 201 are fixed with symmetrically arranged air boxes 702, and the air boxes 702 are provided with evenly distributed jet channels 703. The jet channels 703 in the air boxes 702 on the left and right sides are staggered. A guide plate 704 is fixed at the upper position of the air box 702, and the side of the guide plate 704 close to the window 201 is set to be inclined downward. The device has an inclined structure. During the operation of the device, the thermoelectric cooling sheet 7 is powered on and started, and the cooling surface of the thermoelectric cooling sheet 7 will perform a cooling operation. With the help of the pressure plate 1, the inner plate 101 and the elastic strip 103, the cold energy is quickly transferred to the pressing block 104. The pressing block 104 presses the position to be bonded on the semiconductor product, and the cold energy is transferred to the semiconductor product. The bonding position on the semiconductor product is actively cooled, which can prevent the normal packaging and bonding process of the semiconductor product from being affected by the high temperature during bonding, and to a certain extent ensure the stability of the staff when using the device to package semiconductor products.

[0059] During operation, the airflow is received by the air boxes 702 on the left and right sides, and then ejected outward through the numerous jet channels 703 evenly distributed within the air boxes 702 on both sides. Due to the symmetrical arrangement of the left and right air boxes 702, the airflow ejected from the numerous jet channels 703 on the left and right sides passes through the pressure block 104 in the middle. The airflow ejected from the left jet channel 703 passes through the pressure block 104 and is then ejected toward the heat sink 701 on the right. The airflow ejected from the right jet channel 703 passes through the pressure block 104 and is then ejected toward the heat sink 701 on the left. By staggering the numerous jet channels 703 on the left and right sides, the probability of the airflows from the left and right sides colliding and canceling each other out can be reduced. The presence of the guide plate 704 can better guide the airflow to the heat sink 701 in the corresponding direction. After passing through the pressure block 104, the airflow removes the excess cooling energy from the pressure block 104. This not only allows the cooling energy to be efficiently distributed to the entire semiconductor product through the airflow, but also accelerates the heat dissipation at the heat sink 701, ensuring the stability of the thermoelectric cooling chip 7 during operation.

[0060] In the specific implementation process, Figure 2 and Figure 6As shown, a vacuum generator 8 is fixed on the top plate 2, and the air inlet of the vacuum generator 8 is connected to an external air pump, the negative pressure suction port of the vacuum generator 8 is connected to the first adapter box 306 and the second adapter box 406, and the air outlet of the vacuum generator 8 is connected to the inside of the left and right air boxes 702. During the operation of the device, the vacuum generator 8 is connected to the air outlet of the external air pump. After the high-speed airflow provided by the air pump passes through the vacuum generator 8, air suction is formed at the negative pressure suction port of the vacuum generator 8. This air suction is connected to the left and right air boxes 702 through a pipeline. The first adapter box 306 and the second adapter box 406 provide stable airflow suction for the first air hole 305 and the second air hole 405. The airflow ejected from the air outlet of the vacuum generator 8 is connected to the air boxes 702 on the left and right sides through the pipe to provide airflow injection for the jet channel 703. By providing the vacuum generator 8, the device allows the airflow at the first air hole 305, the second air hole 405 and the jet channel 703 to share an air pump, thereby optimizing the airflow pipeline and helping to reduce the use cost of the device.

[0061] Specifically, the working principle and operation method of the present invention are as follows:

[0062] The staff uses the device to elastically press the bonding position on the semiconductor product, adaptively supplement the height tolerance of the semiconductor product, and ensure the precise stability during the packaging and bonding of the semiconductor product. The semiconductor product is interspersed between the upper and lower first rollers 304 and the upper and lower second rollers 404. The position to be packaged and bonded on the semiconductor product is adjusted to be directly below the pressing block 104, and then the first electric push rod 202 is energized and started, driving the pressing plate 1 to drive the first clamping mechanism and the second clamping mechanism on the left and right sides to move downward synchronously, and cooperate with the base 203 set at the bottom to stop the first clamping mechanism and the second clamping mechanism, and the support block 204 to lift the semiconductor product. With the help of the elastic deformation of the elastic strip 103, the pressing block 104 is elastically pressed on the semiconductor product, and the bonding position is accurately positioned and clamped. Then, the semiconductor products are packaged and bonded in the same vertical column. After the bonding processing in the same vertical column is completed, the first electric push rod 202 drives the pressing plate 1 to move up and reset, and with the elastic support of the first spring 303 and the second spring 403, the first frame 302 and the second frame 402 drive the semiconductor product to move downward relative to the pressure plate 1, so that the top of the semiconductor product is completely separated from the bottom of the pressure plate 1 and the pressure block 104. Then, the second electric push rod 601 is powered on and started. With the help of the connection between the slide frame 602 and the insertion rod 603, the first clamping mechanism is driven to move left relative to the semiconductor product. With the help of the ratchet mechanism at the front end of the first frame 302 to limit the upper and lower first rollers 304, the second electric push rod 601 drives the first clamping mechanism to move right, which can drive the semiconductor product synchronously. Move right, and accurately switch the processing area to be bonded on the semiconductor product by horizontal movement, repeat the above operation to complete the packaging and bonding operation of the semiconductor product. During the packaging and bonding process, the thermoelectric cooling plate 7 is powered on and started, and the cold air is transferred to the pressing block 104 through the pressing plate 1, the inner plate 101 and the elastic strip 103. When the pressing block 104 elastically presses the top of the semiconductor product, an active cooling and cooling operation is performed to prevent the normal operation of the semiconductor product from being affected by the high temperature during bonding, thereby ensuring efficient and stable packaging and bonding operations of the semiconductor product.

[0063] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A semiconductor product packaging bonding elastic jig, comprising a pressing plate (1), characterized in that: An inner plate (101) is installed in the middle of the pressure plate (1), and a plurality of evenly distributed through slots (102) are arranged side by side in the inner plate (101), symmetrically arranged elastic strips (103) are fixed on the left and right sides of the through slots (102), and a downwardly protruding pressure block (104) is fixed at the end of the elastic strip (103) near the middle position of the through slot (102), a top plate (2) is arranged above the pressure plate (1), and a window (201) adapted to the inner plate (101) is opened through the top plate (2), a vertically arranged first electric push rod (202) is fixed at the left and right ends of the top plate (2), and the telescopic end below the first electric push rod (202) is fixedly connected to the pressure plate (1), and a base is arranged below the pressure plate (1). (203), and a supporting block (204) adapted to the inner plate (101) is installed on the base (203), and a first clamping mechanism and a second clamping mechanism are respectively provided on the left and right sides of the pressure plate (1), the first clamping mechanism includes a first connecting plate (3) connected to the left side of the pressure plate (1), and a first frame (302) is provided at the bottom of the first connecting plate (3), and two first rollers (304) symmetrically arranged in the upper and lower parts are longitudinally rotated in the first frame (302), and the second clamping mechanism includes a second connecting plate (4) connected to the right side of the pressure plate (1), and a second frame (402) is provided at the bottom of the second connecting plate (4), and two second rollers (404) symmetrically arranged in the upper and lower parts are longitudinally rotated in the second frame (402); A first mounting groove (105) is provided in the middle of the pressure plate (1), the inner plate (101) is movably embedded in the first mounting groove (105) and is fastened by bolts, a second mounting groove (205) is provided on the base (203), the support block (204) is movably embedded in the second mounting groove (205) and is fastened by bolts; The first frame (302) and the second frame (402) are both equipped with a ratchet mechanism for limiting the unidirectional rotation of the first roller (304) and the second roller (404); a horizontally arranged linear rail (6) is fixed to the left side of the pressure plate (1); the first connecting plate (3) is slidably connected to the pressure plate (1) via the linear rail (6); symmetrically arranged second electric push rods (601) are fixed to the front and rear sides of the top plate (2); a vertically arranged chute frame (602) is fixed to the first frame (302); a longitudinally arranged plug rod (603) is fixed at the end of the telescopic end of the second electric push rod (601), and the plug rod (603) is movably inserted into the chute frame (602); A vertically arranged first column (301) is slidably inserted into the first connecting plate (3), the first frame (302) is fixed to the bottom of the first column (301), and an outer movable sleeve of the first column (301) is provided with a first spring (303) elastically supported between the first connecting plate (3) and the first frame (302), and a vertically arranged second column (401) is slidably inserted into the second connecting plate (4), the second frame (402) is fixed to the bottom of the second column (401), and an outer movable sleeve of the second column (401) is provided with a second spring (403) elastically supported between the second connecting plate (4) and the second frame (402); The middle position of the cylindrical surface of the first roller (304) located above is concave in the direction of its central axis, and the middle position of the cylindrical surface of the second roller (404) located above is also concave in the direction of its central axis.

2. The semiconductor product packaging bonding elastic jig according to claim 1, characterized in that: The distance between the upper and lower first rollers (304) and the distance between the upper and lower second rollers (404) are adapted to the thickness of the substrate of the semiconductor product to be bonded, the cylindrical surface of the first roller (304) is provided with first air holes (305) distributed in a circumferential manner, the cylindrical surface of the second roller (404) is provided with second air holes (405) distributed in a circumferential manner, the back surface of the first frame (302) is fixed with a first adapter box (306) that is rotatably connected to the interior of the first roller (304), and the back surface of the second frame (402) is fixed with a second adapter box (406) that is rotatably connected to the interior of the second roller (404).

3. The semiconductor product packaging bonding elastic jig according to claim 1, characterized in that: The ratchet mechanism comprises a gear (5) fixed at the end positions of the first roller (304) and the second roller (404), the upper and lower gears (5) meshing with each other, a ratchet body (501) fixed at the end positions of the first roller (304) and the second roller (404) located above, a pawl (502) adapted to the ratchet body (501) rotating on the first frame (302) and the second frame (402), and a third spring (503) for elastically supporting the pawl (502) fixed on the first frame (302) and the second frame (402).

4. The semiconductor product packaging bonding elastic jig according to claim 2, characterized in that: Thermoelectric cooling sheets (7) are embedded on both left and right sides of the top of the pressing plate (1), and the top of the thermoelectric cooling sheet (7) is covered with a radiator (701). The cooling surface of the thermoelectric cooling sheet (7) is tightly fitted with the pressing plate (1), and the heat dissipation surface of the thermoelectric cooling sheet (7) is tightly fitted with the radiator (701).

5. The semiconductor product packaging bonding elastic jig according to claim 4, characterized in that: Symmetrically arranged air boxes (702) are fixed on the left and right sides of the window (201), and evenly distributed air jet channels (703) are arranged in the air boxes (702). The air jet channels (703) in the air boxes (702) on the left and right sides are staggered. A guide plate (704) is fixed at an upper position in the air box (702), and the side of the guide plate (704) close to the window (201) is arranged to be a downwardly inclined structure.

6. The semiconductor product packaging bonding elastic jig according to claim 5, characterized in that: A vacuum generator (8) is fixed on the top plate (2), and the air inlet of the vacuum generator (8) is connected to an external air pump, the negative pressure suction port of the vacuum generator (8) is connected to the first adapter box (306) and the second adapter box (406), and the air outlet of the vacuum generator (8) is connected to the inside of the left and right air boxes (702).

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