Packaging Module and Manufacturing Method

Abstract

This application provides a packaging module and its manufacturing method. The packaging module includes a substrate with a metal conductive layer on one side surface; a first terminal, which is a three-dimensional terminal including a first surface, a second surface, and a side surface, the first surface being electrically connected to the metal conductive layer; a first encapsulation member covering one side surface of the substrate and the side surface of the first terminal, the first encapsulation member having a groove corresponding to the first terminal for exposing the second surface; a second terminal including a first end electrically connected to the second surface of the first terminal; and a second encapsulation member covering the second surface of the first terminal, the first end of the second terminal, and at least a portion of the second terminal. The packaging module of this application increases the electrical clearance and creepage distance between the terminals of the packaging module through the second encapsulation member, achieving the same protective force as a packaging module without connected terminals on the upper surface, thereby improving the reliability of the packaging module.

Description

Technical Field

[0001] This application relates primarily to the field of semiconductor technology, and in particular to a packaging module and its manufacturing method. Background Technology

[0002] In common package modules, the substrate is electrically connected to several power terminals and signal terminals, both of which extend from the edge of the package module. A certain gap needs to be maintained between these terminals to meet sufficient electrical clearance and creepage distance requirements. By placing power terminals and signal terminals perpendicular to the package module on its upper surface, electrical clearance and creepage distance can be effectively increased, allowing for a more optimized pinout design for the semiconductor device.

[0003] However, placing power and signal terminals on the top surface of the package module increases the design complexity. The package module needs to have pre-drilled holes for these terminals, but these holes are prone to blockage during molding due to adhesive leakage. Blockage prevents proper electrical connection between the terminals and the substrate, reducing the yield rate of the package module. Furthermore, the exposed metal surfaces of the power and signal terminals on the top surface of the package module are susceptible to corrosion, leading to lower reliability.

[0004] Therefore, there is an urgent need for a new type of packaging module that can increase the electrical clearance and creepage distance between the terminals of the packaging module, achieve the same protective force as a packaging module without connecting terminals on the upper surface, and improve the reliability of the packaging module. Summary of the Invention

[0005] To address the aforementioned technical problems, this application provides a packaging module and its manufacturing method, which can increase the electrical clearance and creepage distance between the terminals of the packaging module, achieve the same protective force as a packaging module without connecting terminals on the upper surface, and improve the reliability of the packaging module.

[0006] To address the aforementioned technical problems, this application provides a packaging module, including a substrate with a metal conductive layer on one side surface; a first terminal, which is a three-dimensional terminal, including a first surface, a second surface, and a side surface, the first surface being electrically connected to the metal conductive layer; a first package covering one side surface of the substrate and the side surface of the first terminal, the first package having a groove corresponding to the first terminal for exposing the second surface; a second terminal including a first end electrically connected to the second surface of the first terminal; and a second package covering the second surface of the first terminal, the first end of the second terminal, and at least a portion of the second terminal.

[0007] In some embodiments, the depth of the groove is greater than or equal to 0.5 mm.

[0008] In some embodiments, the encapsulation module further includes a sleeve that is fitted onto the second terminal and forms an annular space with the second terminal; the bottom of the sleeve extends into the groove, the second encapsulation fills the annular space, and covers a portion of the circumferential surface of the second terminal.

[0009] In some embodiments, the depth of the groove is greater than or equal to 1 mm.

[0010] In some embodiments, the first end of the second terminal is a flange.

[0011] In some embodiments, the second package includes a protrusion surrounding the circumferential surface of the second terminal, and the protrusion is conical or dome-shaped.

[0012] In some embodiments, the first surface is electrically connected to the metal conductive layer by any one or more combinations of sintering, brazing, and ultrasonic welding.

[0013] In some embodiments, the first end of the second terminal is electrically connected to the second surface of the first terminal by any one or more combinations of sintering, brazing, and laser welding.

[0014] To address the aforementioned technical problems, this application also provides a method for manufacturing a packaging module, used to manufacture the packaging module as described above. The method for manufacturing the packaging module includes: electrically connecting a first surface of a first terminal to a metal conductive layer; forming a first package on one side surface of a molding substrate and the side surface of the first terminal, the first package having a groove corresponding to the first terminal, the groove for exposing a second surface; electrically connecting a first end of a second terminal to the second surface of the first terminal; and potting resin to form a second package, the second package covering the second surface of the first terminal, the first end of the second terminal, and at least a portion of the second terminal.

[0015] In some embodiments, the manufacturing method further includes: sleeved onto the second terminal, forming an annular space between the sleeve and the second terminal, the bottom of the sleeve extending into a groove, wherein the second encapsulation further fills the annular space and covers a portion of the circumferential surface of the second terminal.

[0016] In the packaging module of this application, the first package covers one side surface of the substrate and the side surface of the first terminal, and the second package covers the second surface of the first terminal and the first end of the second terminal and at least part of the second terminal. This can effectively protect the first terminal and the second terminal, prevent the first terminal and the second terminal from being corroded, achieve the same protection force as the packaging module without connected terminals on the upper surface, and improve the reliability of the packaging module. The second package can also increase the electrical clearance and creepage distance between the terminals of the packaging module.

[0017] Therefore, the packaging module of this application can extend terminals with electrical characteristics on the upper surface of the packaging module, and increase the electrical clearance and creepage distance between the terminals of the packaging module through the second packaging member, thereby achieving the same protective force as the packaging module without connecting terminals on the upper surface and improving the reliability of the packaging module. Attached Figure Description

[0018] The accompanying drawings are included to provide a further understanding of this application; they are incorporated into and constitute a part of this application. The drawings illustrate embodiments of this application and, together with this specification, serve to explain the principles of this application. In the drawings:

[0019] Figure 1 This is a perspective view of a packaging module provided in an embodiment of this application;

[0020] Figure 2 This is a schematic diagram of a packaging module after removing the first packaging component, provided in an embodiment of this application;

[0021] Figure 3 This is a schematic diagram of a packaging module including a substrate and a first terminal provided in an embodiment of this application;

[0022] Figure 4 This is a schematic diagram of a packaging module including a substrate, a first terminal, and a first package according to an embodiment of this application;

[0023] Figure 5 This is a schematic diagram of another encapsulation module after removing the first encapsulation component, provided in one embodiment of this application;

[0024] Figure 6 This is a schematic diagram of a packaging module after removing the second packaging component, provided in an embodiment of this application;

[0025] Figure 7 This is a perspective view of another packaging module provided in one embodiment of this application;

[0026] Figure 8 yes Figure 7 A schematic diagram of the packaged module after the first package component has been removed;

[0027] Figure 9 This is a schematic diagram showing the connection between the first terminal, the second terminal, the second package, and the sleeve.

[0028] Figure 10 This is a flowchart of a method for manufacturing a packaging module according to an embodiment of this application.

[0029] Figure Labels

[0030] Package module, 100;

[0031] substrate, 110;

[0032] Metal conductive layer, 111;

[0033] Bond wire, 112;

[0034] Substrate circuit, 113;

[0035] Electronic components, 114;

[0036] One side surface of the substrate, 115;

[0037] First terminal, 120;

[0038] First surface, 121;

[0039] Side view, 122;

[0040] Second surface, 123;

[0041] Second terminal, 130;

[0042] First end, 131;

[0043] Flange, 132;

[0044] Connection terminal, 133;

[0045] Shaft, 134;

[0046] First package, 140;

[0047] Second package, 150;

[0048] Groove, 160;

[0049] Sleeve, 170;

[0050] Protrusion, 171;

[0051] Annular space, 172;

[0052] First direction, x;

[0053] The second direction, y. Detailed Implementation

[0054] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this application. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0055] As indicated in this application, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0056] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this application. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0057] In the description of this application, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this application; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0058] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0059] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this application. In addition, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application's specification may have been chosen by the applicant according to his or her judgment, and their detailed meanings are explained in the relevant sections of this description. Moreover, this application should be understood not only through the actual terms used, but also through the meaning implied by each term.

[0060] Flowcharts are used in this application to illustrate the operations performed by the system according to embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, various steps can be processed in reverse order or simultaneously. Furthermore, other operations may be added to these processes, or one or more steps may be removed from these processes.

[0061] like Figures 1-4 As shown, this application provides a packaging module 100, including a substrate 110, one side surface 115 of the substrate 110 having a metal conductive layer 111; a first terminal 120, the first terminal 120 being a three-dimensional terminal, the first terminal 120 including a first surface 121, a second surface 123 and a side surface 122, the first surface 121 being electrically connected to the metal conductive layer 111; a first package 140, covering one side surface 115 of the substrate 110 and the side surface 122 of the first terminal 120, the first package 140 having a groove 160 corresponding to the first terminal 120, the groove 160 being used to expose the second surface 123; a second terminal 130, the second terminal 130 including a first end 131, the first end 131 being electrically connected to the second surface 123 of the first terminal 120; and a second package 150, covering the second surface 123 of the first terminal 120, the first end 131 of the second terminal 130 and at least a portion of the second terminal 130.

[0062] refer to Figures 2-3 As shown, the first surface 121 of the first terminal 120 is electrically connected to the metal conductive layer 111 of the substrate 110, and is provided with a certain height in the first direction x. (Reference) Figures 1-3 As shown, the first end 131 of the second terminal 130 is disposed within the groove 160, and the first end 131 is electrically connected to the second surface 123, thereby electrically connecting the second terminal 130 to the metal conductive layer 111 of the substrate 110. Figure 1 As shown, the second terminal 130 extends along the first direction x and can be electrically connected to an external circuit (not shown), thereby electrically connecting the external circuit to the package module 100. Figure 2As shown, the first terminal 120 and the second terminal 130 can be disposed at different positions on the metal conductive layer 111 to connect the circuit of the metal conductive layer 111 and form the shortest path for circuit connection. The first terminal 120 and the second terminal 130 can be connected to the power circuit of the metal conductive layer 111 to form a power terminal; or they can be connected to the signal circuit of the metal conductive layer 111 to form a signal terminal. By disposing the first terminal 120 and the second terminal 130 in the first direction x, the area of ​​the substrate 110 can be fully utilized, which is beneficial for the pin arrangement of the package module 100; the electrical clearance and creepage distance between the package pins can be increased; and the impedance and parasitic inductance between the substrate circuit and the second terminal 130 can be reduced.

[0063] Continue to refer to Figure 2 As shown, the substrate 110 has a substrate circuit 113 on its metal conductive layer 111, which is a substrate circuit 113 obtained by patterning the metal conductive layer 111. In some embodiments, the packaging module 100 further includes electronic components 114, which are electrically connected to the metal conductive layer 111. The electronic components 114 can be various chips and power semiconductors, etc., and the number of electronic components 114 is greater than or equal to one. The electronic components 114 can be connected to the metal conductive layer 111 through a lead frame (not shown), a connecting metal strip (not shown), or a bonding wire 112.

[0064] In some embodiments, the substrate 110 may be a DBC (Direct Bonded Copper) ceramic substrate or an AMB (Active Metal Brazing) ceramic substrate. The DBC ceramic substrate is a composite substrate formed by directly sintering copper foil onto the surface of Al2O3 and AlN ceramics at high temperature using a hot-melt bonding method. The AMB ceramic substrate is developed based on DBC technology. At a high temperature of approximately 800°C, AgCu solder containing active elements Ti and Zr wets and reacts at the interface between the ceramic and metal, thereby achieving heterogeneous bonding between the ceramic and metal.

[0065] In some embodiments, such as Figure 3 The first terminal 120 shown is a solid three-dimensional terminal, and the material of the first terminal 120 is metal or metal alloy, such as copper or copper alloy. The shape of the first terminal 120 can be a cube, cuboid, cylinder, or polygonal prism. Setting the first terminal 120 as a solid three-dimensional terminal can improve the robustness of the first terminal 120 and prevent the first terminal 120 from deforming during subsequent processes, which would cause the first terminal 120 to malfunction.

[0066] In some embodiments, such as Figure 3As shown, the first surface 121 of the first terminal 120 is electrically connected to the metal conductive layer 111 by sintering. The sintering material used is nano-silver paste, nano-silver powder, or nano-copper paste, etc. The sintering process is divided into pressure sintering and pressureless sintering. Under pressure sintering, pressure needs to be applied to the first terminal 120 and the substrate 110, with a pressure range between 10-30 MPa, a sintering temperature range between 210-280 degrees Celsius, and a sintering time between 5-15 minutes. After pressure sintering, the bonding force is strong, reaching up to 60 kgf at the contact interface between the first surface 121 and the metal conductive layer 111. Under pressureless sintering, no pressure is required between the first terminal 120 and the metal conductive layer 111, and the sintering time is between 2-4 hours. The bonding force formed by pressureless sintering is weaker, reaching only 20 kgf. If the first terminal 120 and the substrate 110 can withstand the pressure applied by pressure sintering, pressure sintering is preferably used to achieve the electrical connection between the first terminal 120 and the metal conductive layer 111.

[0067] In some embodiments, the first terminal 120 and the metal conductive layer 111 are electrically connected by brazing. Brazing is classified into soft soldering and hard soldering depending on the type of solder used. Soft soldering refers to a welding method that uses a solder with a melting point below 260°C to connect metal components. The solder is a tin-based alloy, such as solder paste. Due to the lower welding temperature, soft soldering can effectively protect heat-sensitive components within the packaged module. Hard soldering refers to a method that uses a solder with a melting point above 450°C to connect two or more metal components together. The solder can be a silver-based solder or a copper-based solder. Hard soldering provides a stronger joint and a reliable connection between the first terminal 120 and the metal conductive layer 111.

[0068] In some embodiments, the first terminal 120 and the metal conductive layer 111 are electrically connected by ultrasonic welding. This involves transmitting high-frequency vibration waves to the surfaces of the two objects to be welded, and under pressure, causing the surfaces to rub against each other, resulting in fusion between the molecular layers. Ultrasonic welding eliminates the need for solder paste and filler metal, resulting in low production costs and high joint strength. However, the high-frequency vibration may cause the substrate 110 to crack.

[0069] In some embodiments, such as Figure 3 As shown, the second surface 123 of the first terminal 120 is opposite to the first surface 121, and the side surface 122 refers to the circumferential surface of the first terminal 120. Figure 2 As shown, one side surface 115 of the substrate refers to the upper surface of the substrate 110, that is, the side that is electrically connected to the first terminal 120. For example... Figure 2 and Figure 4As shown, the first package 140 covers one side surface 115 of the substrate 110 and the first surface 121 and side surface 122 of the first terminal 120. The first package 140 has a groove 160 corresponding to the first terminal 120, the groove 160 for exposing the second surface 123.

[0070] In some embodiments, a molding die (not shown) can be used to manufacture the packaged module 100. The molding die is used to encapsulate the substrate 110, the first terminal 120, the electronic component 114, the bonding wire 112, and the metal strip. The molding die includes an upper die and a lower die, the lower die being used to support the substrate 110, the first terminal 120, the electronic component 114, the bonding wire 112, and the metal strip. A limiting structure may also be provided in the lower die to position the substrate 110 at a specific location within the lower die.

[0071] In some embodiments, the upper mold includes an upper mold body and a moving pin, and the upper and lower molds together form an injection molding cavity. The moving pin may be a metal post, connected to the upper mold, corresponding to the position of the first terminal 120, and in close contact with the second surface 123. The number and position of the moving pins correspond one-to-one with the number and position of the first terminals 120, for forming a groove 160 during molding. The groove 160 corresponds to the first terminal 120, for exposing the second surface 123 of the first terminal 120. The upper mold may also include an upper mold body and a pin, with the pin fixed to the upper mold. The number and position of the pins correspond one-to-one with the number and position of the first terminals 120, for forming the groove 160.

[0072] By positioning the recess 160 above the first terminal 120, excess adhesive can be prevented from covering the metal conductive layer 111 corresponding to the recess 160 during the molding of the first package 140. Without the first terminal 120, adhesive would directly cover the metal conductive layer 111 corresponding to the recess 160, affecting the electrical connection of subsequent terminals. With the first terminal 120, excess adhesive will not cover the metal conductive layer 111 corresponding to the recess 160. Even if excess adhesive occurs, it only remains on the second surface 123. Furthermore, the first terminal 120 has a certain height, making it easy to remove excess adhesive from the second surface 123, thus improving the yield of the package module 100.

[0073] In some embodiments, reference Figure 2 and Figure 4 As shown, Figure 2 The second encapsulation 150 is obtained by filling the groove 160, therefore from Figure 2 as well as Figure 4The shape of the groove 160 is shown. The cross-sectional area of ​​the groove 160 along the second direction y gradually increases from the side closer to the substrate 110 to the side farther away from the substrate 110. For example, the groove 160 has a frustum shape, with a smaller cross-sectional area closer to the substrate 110 and a larger cross-sectional area farther away from the substrate 110. This shape facilitates the flow of the adhesive and reduces the formation of air bubbles, thereby improving the encapsulation quality. After the first package 140 is formed by molding, the unmolding operation is also easier, preventing damage to the first package 140 during the unmolding process.

[0074] In some embodiments, such as Figure 2 As shown, the second terminal 130 includes a first end 131, which is disposed near the second surface 123 of the first terminal 120 and electrically connected to the second surface 123. The electrical connection between the first end 131 and the second surface 123 can be achieved through sintering, brazing, and laser welding. Laser welding, also known as laser welding, is an advanced welding technology that uses a high-energy-density laser beam as a heat source. It offers high welding speed and precision. Laser welding melts the joining materials in a short time, and as the laser beam moves, the materials cool and solidify, thus completing the weld.

[0075] In some embodiments, the first end 131 of the second terminal 130 is a straight end (not shown). Figure 2 As shown, the first end 131 of the second terminal 130 is a flange 132. The cross-sectional area of ​​the flange 132 is larger than the cross-sectional area when the first end 131 is a straight end. The cross-sectional area refers to the cross-sectional area of ​​the flange 132 and the first end 131 intercepted in the second direction y. The purpose of providing the flange 132 is to increase the current-carrying capacity of the second terminal 130, preventing excessive current from causing insufficient current conduction between the first terminal 120 and the second terminal 130; it also increases the contact area between the second terminal 130 and the first terminal 120, thus improving the connection stability between the first terminal 120 and the second terminal 130.

[0076] In some embodiments, the material of the second terminal 130 is metal or metal alloy, such as copper or copper alloy. The flange 132 of the first end 131 is a solid three-dimensional component, and its shape can be a cube, cuboid, cylinder, or polygonal prism.

[0077] In some embodiments, the second terminal 130 may be made as a single piece, with the flange 132 and the second terminal 130 being integrally die-cast. The second terminal 130 may also be composed of two or more pieces, for example, with the flange 132 provided on the second terminal 130.

[0078] In some embodiments, such as Figures 1-2The second terminal 130 also includes a shaft 134 with a rectangular or circular outer periphery, such as a circular needle-shaped shaft 134. The shaft 134 may extend along a first direction x and be electrically connected to an external circuit. The shaft may be electrically connected to the external circuit in a manner including physical bonding, sintering, and brazing, wherein physical bonding includes insertion and fusion. In some embodiments, the shaft 134 may be a hollow shaft or a solid shaft.

[0079] In some embodiments, such as Figure 1 and Figure 5 As shown, the second terminal 130 also includes a connecting terminal 133, which is located at the end of the second terminal 130 away from the second surface 123. The connecting terminal 133 includes a spring-loaded pin connector, a sealed annular contact terminal, and a fish-eye contact terminal. The fish-eye terminal consists of a root, two elastic portions, and a pin portion. The elastic portions are arc-shaped, and the two elastic portions face each other to form a fish-eye hole. During installation, the elastic portions are compressed and elastically contract, thus perfectly fitting with the conductive holes of the external circuit. The connecting terminal 133 can be integrally formed with the second terminal 130, for example, by die-casting, or it can be a separate component, with the connecting terminal 133 mounted on the second terminal 130. The connecting terminal allows the second terminal 130 to be connected more stably to an external circuit (not shown).

[0080] In some embodiments, such as Figure 1 and Figure 6 As shown, the height of the first end 131 (flange 132) is lower than the depth of the groove 160 so that it can be disposed within the groove 160 and encapsulated by the second encapsulator 150. The depth of the groove 160 should not be too low, but should be sufficient to accommodate the first end 131 (flange 132). (Reference) Figure 4As shown, the depth of the groove 160 is greater than or equal to 0.5 mm, for example, 0.5, 0.6, 0.7, 0.8, and 0.9 mm. The groove 160 is a shallow groove, and its depth refers to the height between the upper surface of the first package 140 where the groove 160 is located and the second surface 123 of the first terminal 120. The second package 150 covers the second surface 123 of the first terminal 120, the first end 131 (flange 132) of the second terminal 130, and at least a portion of the second terminal 130. In these embodiments, by placing the first end 131 (flange 132) within the groove 160, and by covering the first end 131 (flange 132), the second surface 123, and a portion of the second terminal 130 with the second package 150, encapsulation insulation can be provided for the first end 131 (flange 132) of the first terminal 120 and the first end 131 (flange 132) of the second terminal 130. The second package 150 can also prevent the first terminal 120 and the first end 131 (flange 132) from external corrosion and other possible damage, and can also prevent bending between the first terminal 120 and the second terminal 130, thereby improving physical strength and the reliability of the package module 100.

[0081] In some embodiments, such as Figures 1-2 As shown, the second encapsulation 150 includes a protrusion 171 surrounding a portion of the circumferential surface of the second terminal 130. The protrusion 171 is conical or dome-shaped. During potting to form the second encapsulation 150, adhesive is poured in from the opening of the recess 160 and flows towards the bottom of the recess 160, filling the entire recess 160. (Continue to refer to...) Figures 1-2 As shown, the second package 150 includes a plurality of protrusions 171 located at the top of the second package 150, that is, slightly higher than the upper surface of the first package 140, so that the portion of the second package 150 exposed in the recess 160 has a volcano-like shape. The protrusions 171 are formed by the cohesive force of the adhesive and surround the circumferential surface of the second terminal 130. The protrusions 171 are conical or dome-shaped. The protrusions 171 can provide stronger encapsulation insulation and physical strength to the first terminal 120 and the second terminal 130, making the joint between the first terminal 120 and the second terminal 130 less susceptible to corrosion and preventing the second terminal 130 from bending.

[0082] In some embodiments, such as Figures 7-8As shown, the encapsulation module 100 also includes a sleeve 170, which is fitted onto the second terminal 130 and forms an annular space 172 with the second terminal 130. The bottom of the sleeve 170 extends to the groove 160, and the second encapsulation component 150 extends to fill the annular space 172 and covers part of the circumferential surface of the second terminal 130. The sleeve is made of insulating material and is hollow, with a hollow diameter larger than the width or diameter of the second terminal 130, so that it can be fitted onto the second terminal 130. The purpose of the sleeve 170 is to allow the second encapsulation component 150 to cover the circumferential surface of the second terminal 130 along the annular space 172, thereby providing a greater creepage distance to meet the creepage distance requirements of high-voltage applications. Creepage distance refers to the shortest path length between two conductive components along the surface of an insulating material. Its core function is to ensure that no leakage current or dielectric breakdown occurs along the surface of the insulator under humid, contaminated, or high-voltage conditions. In these embodiments, creepage distance refers to the creepage distance between multiple second terminals 130, ensuring that no leakage current or dielectric breakdown occurs between the second terminals 130.

[0083] In some embodiments, the lengths of the sleeve 170 and the second encapsulation 150 can be adapted to meet creepage distance design requirements. (See reference...) Figure 7 As shown, without the sleeve, the original creepage distance between the second terminals A and B is the line connecting the second terminals A and B along the surface of the package, assuming an original creepage distance of 3 mm. Under certain conditions, to enhance the insulation between the first terminal A and the second terminal B, the creepage distance needs to be set to 6 mm. In this case, a 4 mm long sleeve 170 can be provided on the second terminal A, with the bottom (1 mm) of the sleeve 170 extending into the groove 160. Adhesive is then applied to the annular space 172 between the sleeve 170 and the second terminal A, increasing the creepage distance by 3 mm. At this point, the creepage distance between the second terminals A and B is 6 mm, including the length of the sleeve 170 above the upper surface of the first package 140 (3 mm) and the original creepage distance (3 mm). Increasing the creepage distance more reliably ensures the insulation between multiple second terminals 130, resulting in higher reliability of the package module 100.

[0084] In these embodiments, such as Figures 7-8 As shown, the depth of the groove 160 is greater than or equal to 1 mm, such as 1, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, and 1.8 mm. The bottom of the sleeve 170 needs to extend into the groove 160 to better secure the sleeve 170 and facilitate the subsequent formation of the second package 150. If the groove 160 is too shallow, the sleeve 170 cannot be stably positioned at the second terminal 130, affecting subsequent encapsulation and potting.

[0085] In some embodiments, such as Figure 7 and Figure 9 As shown, the second encapsulation 150 includes a protrusion 171, which is disposed at the junction of the bottom of the sleeve 170 and the first encapsulation 140. The protrusion 171 is conical or dome-shaped. During potting to form the second encapsulation 150, the adhesive is poured in from the opening at the top of the sleeve 170 and flows towards the bottom of the sleeve 170, filling the entire annular space 172 and the groove 160. (Continue to refer to...) Figures 7-9 As shown, the second encapsulation 150 includes multiple protrusions 171, which are located at the junction of the bottom of the sleeve 170 and the first encapsulation 140, giving the bottom of the encapsulated sleeve 170 a volcano-like shape. These protrusions 171 are formed by the adhesive force of the adhesive material and are conical or dome-shaped. The protrusions 171 provide stronger encapsulation insulation and physical strength to the first end 131 of the second terminal 130, making the first end 131 less susceptible to corrosion and bending.

[0086] In some embodiments, such as Figure 1 and Figure 7 As shown, the encapsulation module 100 has a plurality of first terminals 120, a plurality of recesses 160, a plurality of second encapsulations 150, a plurality of sleeves 170, and a plurality of second terminals 130.

[0087] In the encapsulation module 100 of this application, the first encapsulation 140 covers one side surface 115 of the substrate 110 and the side surface 122 of the first terminal 120, and the second encapsulation 150 covers the second surface 123 of the first terminal 120 and the first end 131 of the second terminal 130 and at least part of the second terminal 130. This can effectively protect the first terminal 120 and the second terminal 130, prevent the first terminal 120 and the second terminal 130 from corrosion, and improve reliability. The second encapsulation can also increase the electrical clearance and creepage distance between the terminals of the encapsulation module.

[0088] Therefore, the encapsulation module 100 of this application can increase the electrical clearance and creepage distance between the terminals of the encapsulation module 100, and can extend terminals with electrical characteristics on the upper surface of the encapsulation module 100. The second encapsulation member 150 increases the electrical clearance and creepage distance between the terminals of the encapsulation module 100, achieving the same protective force as an encapsulation module without connected terminals on the upper surface, and improving the reliability of the encapsulation module 100.

[0089] This application also provides a method for manufacturing a packaging module 100, used to manufacture the packaging module 100 as described above. Figure 10 As shown, the manufacturing method includes:

[0090] S901, Electrically connect the first surface 121 of the first terminal 120 to the metal conductive layer 111;

[0091] S902, one side surface of the molding substrate 110 and the side surface 122 of the first terminal 120 form a first package 140. The first package 140 has a groove 160 corresponding to the first terminal 120. The groove 160 is used to expose the second surface 123.

[0092] S903, Electrically connect the first end 131 of the second terminal 130 to the second surface 123;

[0093] S904. Potting is performed to form a second encapsulation 150, which covers the second surface 123, the first end 131 of the second terminal 130, and at least a portion of the second terminal 130.

[0094] The manufacturing method of this application is implemented using the components of the packaging module 100 as described above. Therefore, the description of the packaging module 100 above can be used to describe the manufacturing method of this application. The structure, shape and connection method of the components of the packaging module 100 will not be elaborated here.

[0095] In step S901, see Figure 2 and Figure 3 As shown, the first surface 121 of the first terminal 120 is electrically connected to the metal conductive layer 111. Electronic components are also disposed on the substrate 110, and these electronic components are electrically connected to the metal conductive layer 111 of the substrate 110 via lead frames, bonding wires, and metal strips. External terminals are also disposed on the substrate 110, extending around the perimeter of the substrate 110 and along the second direction y.

[0096] In step S902, see Figure 2 As shown, one side surface 115 of the molding substrate 110 refers to the side surface 115 that is electrically connected to the first surface 121 of the first terminal 120. The molding compound used is epoxy resin, silicone resin, polyurethane resin, etc.

[0097] In step S903, see Figure 1 , Figure 2 and Figure 5 As shown, the second terminal 130 includes a first end 131, which is a flange 132. The flange 132 is disposed within the groove 160 and electrically connected to the second surface 123. The surface area of ​​the flange 132 is similar to that of the second surface 123, providing a larger contact area for the connection between the first terminal 120 and the second terminal 130. The second terminal 130 also includes a shaft 134 with a rectangular or circular outer periphery and a connecting terminal 133.

[0098] In step S904, seeFigure 1 and Figure 6 Adhesive is poured into the groove 160 to form a second encapsulation 150. The second encapsulation 150 covers the second surface 123, the first end 131, and part of the second terminal 130. The adhesive used for potting can be epoxy resin, silicone resin, polyurethane resin, etc.

[0099] In some embodiments, the manufacturing method further includes: S905, sleeve 170 is sleeved on the second terminal 130, an annular space 172 is formed between the sleeve 170 and the second terminal 130, the bottom of the sleeve 170 extends to the groove 160, wherein the second encapsulation member 150 also fills the annular space 172 and covers the circumferential surface of the second terminal 130.

[0100] like Figure 7 and Figure 8 As shown, the sleeve 170 is a cylindrical sleeve 170, which is fitted onto the second terminal 130 and forms an annular space 172 with the second terminal 130. The bottom of the sleeve 170 extends to the groove 160, and the second encapsulation member 150 extends to fill the annular space 172 and covers part of the circumferential surface of the second terminal 130. Not all second terminals 130 need to be equipped with sleeves 170; the sleeve 170 is required according to the actual creepage distance of the second terminal 130.

[0101] This application uses specific terms to describe embodiments of the application. Terms such as "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that references to "an embodiment," "one embodiment," or "an alternative embodiment" in different locations throughout this specification do not necessarily refer to the same embodiment. Furthermore, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0102] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the present application requires more features than those mentioned. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0103] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in this application are approximate values, which may be changed according to the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit preservation. Although the numerical ranges and parameters used to confirm their breadth of range in some embodiments of this application are approximate values, in specific embodiments, such numerical values ​​are set as precisely as feasible.

Claims

1. A package module, characterized by, The package module comprises: a substrate, one side surface of the substrate having a metal conductive layer; a first terminal, the first terminal being a three-dimensional terminal, the first terminal comprising a first surface, a second surface and a side surface, the first surface being electrically connected with the metal conductive layer; a first encapsulant, the first encapsulant covering one side surface of the substrate and the side surface of the first terminal, the first encapsulant having a recess corresponding to the first terminal, the recess being used for exposing the second surface; a second terminal, the second terminal comprising a first end, the first end being electrically connected with the second surface of the first terminal; a second encapsulant, the second encapsulant covering the second surface of the first terminal, the first end of the second terminal and at least part of the second terminal; and a sleeve, the sleeve being sleeved on the second terminal and forming an annular space with the second terminal, a bottom of the sleeve extending to the recess, the second encapsulant filling the annular space and covering part of a circumferential surface of the second terminal. The depth of the recess is greater than or equal to 0.5 mm.

2. The package module of claim 1, wherein, The depth of the recess is greater than or equal to 1 mm.

3. The package module of claim 1, wherein, The first end of the second terminal is a flange.

4. The package module of claim 1, wherein, The second encapsulant comprises a protrusion, the protrusion surrounding the circumferential surface of the second terminal, and the protrusion being conical or dome-shaped.

5. The package module of claim 1, wherein, The way of electrically connecting the first surface with the metal conductive layer comprises a combination of any one or more of sintering, brazing and ultrasonic welding.

6. The package module of claim 1, wherein, The way of electrically connecting the first end of the second terminal with the second surface of the first terminal comprises a combination of any one or more of sintering, brazing and laser welding.

7. The package module of claim 1, wherein, The manufacturing method is used for manufacturing the package module according to any one of claims 1-7, the manufacturing method comprising:

8. A method of manufacturing a package module, characterized by, electrically connecting the first surface of the first terminal with the metal conductive layer; plastic packaging one side surface of the substrate and the side surface of the first terminal to form the first encapsulant, the first encapsulant having a recess corresponding to the first terminal, the recess being used for exposing the second surface; electrically connecting the first end of the second terminal with the second surface of the first terminal; forming the second encapsulant by glue pouring, the second encapsulant covering the second surface of the first terminal, the first end of the second terminal and at least part of the second terminal; and sleeving a sleeve on the second terminal, the sleeve forming an annular space with the second terminal, a bottom of the sleeve extending to the recess, wherein the second encapsulant also fills the annular space and covers part of a circumferential surface of the second terminal. ​

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