Electronic device and flexible circuit board
By setting deformation joints and deformation holes at the plug-in holes of the flexible circuit board, the problems of lifting and tearing during welding are solved, and efficient welding quality and low-cost production are achieved.
Patent Information
- Application Number
- CN202510702729.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-27
- Publication Date
- 2025-08-01
AI Technical Summary
In the prior art, flexible circuit boards are prone to rebound and lift during welding, resulting in dummy welding and tearing, affecting welding quality and production efficiency.
Deformation joints and deformation holes are provided at the plug-in holes of the flexible circuit board, and the deformation joints are inserted into the welding pins through interference fit, and deformation space is provided to avoid lifting and tearing, ensuring welding quality.
Improves welding quality, reduces rework and material scrapping rates, improves production efficiency and reduces costs.
Smart Images
Figure CN120417233A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of electronic equipment, and in particular to an electronic equipment and a flexible circuit board. Background Art
[0002] To improve the wearing comfort of electronic products, the market is currently moving towards lightweight designs that minimize size and weight. This trend is further driving the use of thin and lightweight FPCs (Flexible Printed Circuits) for internal circuit connections in electronic products. Electrical connections are achieved by inserting the solder pins of the electronic product into the FPC's sockets and then soldering them. However, if the FPC's solder pins bounce or warp during insertion, this can cause quality issues such as cold solder joints. Summary of the Invention
[0003] The main purpose of the present invention is to provide an electronic device and a flexible circuit board, aiming to ensure the welding reliability of welding feet and conductive areas.
[0004] To achieve the above-mentioned objectives, the electronic device proposed in the present invention includes a device body and a flexible circuit board, the device body is provided with a welding foot, the flexible circuit board includes a conductive area and a solder resist area surrounding the conductive area, the flexible circuit board has a plug hole provided in the conductive area and a deformation seam connected to the plug hole, the welding foot is plugged into the plug hole and welded to the conductive area.
[0005] In one embodiment, the soldering foot is interference-fitted into the plug hole.
[0006] In one embodiment, the interference fit between the plug hole and the welding foot in the width direction is less than or equal to 0.1 mm.
[0007] In one embodiment, the width of the deformation gap is less than or equal to 0.1 mm.
[0008] In one embodiment, the flexible circuit board is further provided with a deformation hole, one end of the deformation slot is connected to the plug hole, and the other end is connected to the deformation hole, and the diameter of the deformation hole is larger than the width of the deformation slot.
[0009] In one embodiment, the diameter of the deformation hole is 0.1 mm to 1 mm.
[0010] In one embodiment, the deformation hole is provided in the solder resist area.
[0011] In one embodiment, the plug-in hole and the welding leg are correspondingly configured as strips, and the deformation seam is connected to the end of the plug-in hole and is arranged at an angle to the plug-in hole.
[0012] In one embodiment, a plurality of deformation joints are provided. The two deformation joints communicate with the same end of the insertion hole and extend away from each other along the width direction of the insertion hole.
[0013] In one embodiment, the two ends of the insertion hole communicate with different deformation joints respectively.
[0014] In one embodiment, the width ratio of the deformation joint to the insertion hole is 0.5 to 0.8.
[0015] In one embodiment, when the flexible circuit board is further provided with a deformation hole, the ratio of the aperture of the deformation hole to the width of the insertion hole is 1.5 to 3.
[0016] In one embodiment, the insertion hole and the welding leg are correspondingly configured to be circular. A plurality of deformation joints are provided and are spaced along the circumference of the insertion hole.
[0017] In one embodiment, the plurality of deformation joints are evenly spaced along the circumference of the insertion hole.
[0018] In one embodiment, the number of the deformation joints is 3 to 6.
[0019] In one embodiment, the width ratio of the deformation joint to the insertion hole is 0.02 to 0.1.
[0020] In one embodiment, when the flexible circuit board is further provided with a deformation hole, the aperture ratio of the deformation hole to the insertion hole is 0.1 to 0.2.
[0021] The present invention further provides a flexible circuit board, which includes a conductive area and a solder mask area surrounding the conductive area. The flexible circuit board has an insertion hole provided in the conductive area and a deformation joint communicating with the insertion hole. The insertion hole is used for inserting a welding leg.
[0022] In the technical solution of the present invention, after the welding leg of the device main body is inserted into the insertion hole of the flexible circuit board, the welding leg and the conductive area are welded and fixed by solder. The welding leg can be electrically connected to the conductive area, thereby enabling the device main body and the flexible circuit board to be electrically connected. Further, by providing a deformation joint communicating with the insertion hole, a deformation space is provided when the flexible circuit board in the area near the insertion hole is stressed, so that the flexible circuit board in this area can adaptively deform when stressed, avoiding its rebound or warping, thereby ensuring the welding quality between the welding leg and the conductive area, reducing the situation of rework welding or material scrapping, and moreover, can largely avoid the flexible circuit board from being torn, thereby reducing the scrap rate of the flexible circuit board. Thus, it is beneficial to improve the production efficiency of the electronic device and reduce the production cost of the electronic device. Description of the Drawings
[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0024] Figure 1 It is a schematic structural diagram formed after the welding pins of the electronic device provided by the present invention are welded to the flexible circuit board of the first embodiment;
[0025] Figure 2 For Figure 1 the partial enlarged view at A in;
[0026] Figure 3 It is a schematic structural diagram when the welding pins of the electronic device provided by the present invention are inserted into the insertion holes of the flexible circuit board of the first embodiment;
[0027] Figure 4 For Figure 3 the partial enlarged view at B in;
[0028] Figure 5 It is a schematic structural diagram of the flexible circuit board of the first embodiment provided by the present invention;
[0029] Figure 6 For Figure 5 the partial enlarged view at C in;
[0030] Figure 7 It is a schematic structural diagram of the flexible circuit board of the second embodiment provided by the present invention.
[0031] Explanation of the reference numerals in the drawings:
[0032] 100, speaker frame; 110, welding pins;
[0033] 200, flexible circuit board; 201, conductive area; 202, solder mask area;
[0034] 210, insertion holes; 220, deformation seams; 230, deformation holes; 240, elastic tongues;
[0035] 300, solder.
[0036] The realization of the objectives, functional features, and advantages of the present invention will be further described with reference to the embodiments and the accompanying drawings. Detailed embodiments
[0037] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.
[0038] It should be noted that if there are directional indications (such as up, down, left, right, front, back...) involved in the embodiments of the present invention, the directional indications are only used to explain the relative position relationship and movement conditions between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0039] In addition, if there are descriptions such as "first", "second", etc. involved in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution where A and B are satisfied simultaneously. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.
[0040] The present invention provides an electronic device.
[0041] Please refer to Figures 1 to 6 , in an embodiment of the present invention, the electronic device includes a device main body and a flexible circuit board 200. The device main body is provided with a welding pin 110. The flexible circuit board 200 includes a conductive region 201 and a solder mask region 202 surrounding the conductive region 201. The flexible circuit board 200 has a plug hole 210 provided in the conductive region 201 and a deformation seam 220 communicating with the plug hole 210. The welding pin 110 is inserted into the plug hole 210 and welded to the conductive region 201.
[0042] Among them, the electronic device can be a sound generating device, Figures 1 to 4It is a schematic diagram of the cooperation between the flexible circuit board 200 and the welding foot 110 on the chassis 100 of the sound generating device. In the related technology of the sound generating device, the welding foot 110 is formed on the chassis 100. Of course, the setting position of the welding foot 110 can also be adjusted to other positions according to needs, but the cooperation method between the welding foot 110 and the flexible circuit board 200 can be referred to.
[0043] In the technical solution of the present invention, please refer to Figure 2 and Figure 4 After the welding foot 110 of the device body is inserted into the insertion hole 210 of the flexible circuit board 200, the welding foot 110 and the conductive area 201 are welded and fixed by solder 300. The welding foot 110 can be electrically connected to the conductive area 201, thereby enabling the device body and the flexible circuit board 200 to be electrically connected.
[0044] When the welding foot 110 is inserted into the insertion hole 210, situations such as misalignment or the size of the welding foot 110 being larger than the size of the insertion hole 210 may occur. In such cases, the flexible circuit board 200 will have adverse phenomena such as rebound and warping, which will affect the welding quality between the welding foot 110 and the conductive area 201, and may even be torn due to excessive force, resulting in an increase in the scrap rate of the flexible circuit board 200.
[0045] In the technical solution of the present invention, by providing a deformation seam 220 communicating with the insertion hole 210, a deformation space is provided for the flexible circuit board 200 in the area near the insertion hole 210 when it is stressed, enabling the flexible circuit board 200 in this area to adaptively deform when stressed, avoiding its rebound or warping, thereby ensuring the welding quality between the welding foot 110 and the conductive area 201, reducing the situation of rework welding or material scrapping, and moreover, being able to largely avoid the flexible circuit board 200 from being torn, thus reducing the scrap rate of the flexible circuit board 200. Therefore, it is beneficial to improve the production efficiency of the electronic device and reduce the production cost of the electronic device.
[0046] It should be noted that this flexible circuit board 200 can be applied not only to the sound generating device in this embodiment but also to other circuit modules of other electronic devices, such as mobile phones, laptop computers, and wearable devices. Among them, wearable devices include head-mounted display devices such as VR glasses and AR glasses, as well as smart watches, etc.
[0047] In an embodiment, please refer to Figure 3 and Figure 4, the welding pin 110 is in interference fit with the insertion hole 210. That is, in a certain direction, for example, at least one of the width direction and the length direction, the size of the welding pin 110 is larger than the size of the insertion hole 210. In this way, after the welding pin 110 is inserted into the insertion hole 210, the interference fit between the two can prevent them from shifting easily, and the welding pin 110 is not likely to become loose in the insertion hole 210, thus ensuring the relative fixation of their positions in the subsequent welding process and guaranteeing the welding quality between the welding pin 110 and the flexible circuit board 200.
[0048] In the related art, it is required that the welding pin 110 and the insertion hole 210 are in clearance fit or mating fit. When the welding pin 110 is inserted into the insertion hole 210, the two to be welded subsequently are pre-fixed by the double-sided adhesive on the back of the conductive region 201. This method requires adding the raw material of double-sided adhesive, increasing the material cost. Moreover, it is necessary to manually remove the double-sided adhesive release film, and then manually align and apply it to the pad, resulting in low operation efficiency. In addition, this pre-fixation method is prone to problems such as product virtual soldering and de-soldering caused by the loosening of the FPC rebound force pad and the contamination of the PIN foot by the back adhesive.
[0049] In the technical solution of the present invention, due to the interference fit between the welding pin 110 and the insertion hole 210, the flexible circuit board 200 in the area near the hole wall of the insertion hole 210 is deformed. Due to the existence of the deformation seam 220, this deformation amount can be absorbed, protecting the flexible circuit board 200 from being torn. At the same time, the welding pin 110 can be resisted by the deformed part, and the welding pin 110 can be stably inserted into the insertion hole 210, and their relative positions are fixed to ensure the smooth progress of the subsequent welding process. In the technical solution of the present invention, the welding pin 110 and the flexible circuit board 200 can be pre-fixed after being inserted, without the need to rely on other materials or other operating procedures, and the welding quality between the two can be guaranteed.
[0050] Specifically, the interference fit amount between the insertion hole 210 and the welding pin 110 in the width direction is less than or equal to 0.1 mm. In this way, it can be ensured that after the welding pin 110 is inserted into the insertion hole 210, the deformation amount of the flexible circuit board 200 can be within a relatively appropriate range, avoiding excessive warping of the flexible circuit board 200 and affecting the welding quality between the welding pin 110 and the flexible circuit board 200. Among them, the interference fit amount between the insertion hole 210 and the welding pin 110 refers to the width difference between the insertion hole 210 and the welding pin 110 (that is, Figure 4 the d0 shown and Figure 6The difference obtained by subtracting d1 as shown. In this embodiment, the width difference can be 0.02 mm, 0.04 mm, 0.06 mm, 0.08 mm, 0.1 mm, etc. Of course, in other embodiments, when ensuring that the flexible circuit board 200 will not be overly warped, the width difference can also be greater than 0.1 mm, such as 0.12 mm, 0.15 mm, 0.18 mm, 0.2 mm, etc.
[0051] In one embodiment, the width of the deformation seam 220 is less than or equal to 0.1 mm. The width of the deformation seam 220 can refer to Figure 6 the marked d2. Similarly, Figure 7 in the width direction of the deformation seam 220 in Figure 6 the direction is referred to, and the width dimension of the corresponding deformation seam 220 also satisfies this range. For the dimensions of the same structure in the following text, the same reference applies and will not be elaborated. In this embodiment, the deformation absorbed by the deformation seam 220 can be controlled within a suitable range, making the direction and amount of deformation of the flexible circuit board 200 more controllable, which is beneficial to avoiding uncontrollable deformations such as the flexible circuit board 200 being overly warped or folded, so as to ensure the welding quality between the welding feet 110 and the flexible circuit board 200.
[0052] In one embodiment, please refer to Figure 6 and Figure 7 together. The flexible circuit board 200 is further provided with a deformation hole 230. One end of the deformation seam 220 communicates with the insertion hole 210, and the other end communicates with the deformation hole 230. The aperture d3 of the deformation hole 230 is greater than the width d2 of the deformation seam 220. That is to say, the deformation hole 230 will be correspondingly located at the end of the deformation seam 220 far from the insertion hole 210, and the size of the deformation hole 230 is relatively larger, which can reduce the possibility of tearing at this end of the deformation seam 220, improve the ability of the flexible circuit board 200 to adapt to deformation, and thus reduce the scrap rate of the flexible circuit board 200. Of course, in other embodiments, multiple diverging slits can also be provided at this end of the deformation hole 230.
[0053] Among them, it is advisable that the aperture of the deformation hole 230 is 0.1 mm to 1 mm, which is beneficial to balancing the deformation ability and tear resistance of the flexible circuit board 200. Specifically, the aperture of the deformation hole 230 can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc. Of course, in other embodiments, it can also be adjusted to a value less than 0.1 mm or greater than 1 mm according to the dimensions of the insertion hole 210 and the deformation seam 220, such as 0.05 mm, 0.06 mm, 0.08, etc., or 1.2 mm, 1.5 mm, etc.
[0054] In one embodiment, please refer toFigure 6 and Figure 7 The deformation hole 230 is provided in the solder mask area 202. In this way, the tearing of the conductive area 201 can be effectively restricted, thereby ensuring the electrical connection stability between the welding pin 110 and the flexible circuit board 200. Of course, in other embodiments, the deformation hole 230 can also be provided at the junction of the solder mask area 202 and the conductive area 201, or can be provided in the conductive area 201 when ensuring that there is no risk of tearing in the conductive area 201.
[0055] In the first embodiment, please refer to Figure 6 , the insertion hole 210 and the welding pin 110 are correspondingly configured as strips, and the deformation slit 220 communicates with the end of the insertion hole 210 and is arranged at an angle with the insertion hole 210. For the insertion hole 210 with such a structure, its end is an area with a relatively high risk of tearing, and it is easy to tear due to the deformation in the width direction. By providing the deformation slit 220 extending from here and forming an angle with the insertion hole 210, a buffer space can be provided for the deformation of the insertion hole 210 in the width direction, thereby greatly reducing the tearing risk here and enhancing the ability of the flexible circuit board 200 to adapt to deformation, thus reducing the scrap rate of the flexible circuit board 200. Of course, in other embodiments, the deformation slit 220 can also communicate with the middle area in the length direction of the insertion hole 210.
[0056] Furthermore, please refer to Figure 4 and Figure 6 , both ends of the insertion hole 210 communicate with different deformation slits 220 respectively to enhance the anti-tearing ability of the flexible circuit board 200. In particular, when the two deformation slits 220 respectively communicating with the insertion hole 210 are on the same side in the width direction of the insertion hole 210 and the extending directions are symmetric with respect to the central axis of the insertion hole 210, an elastic tongue 240 can be formed on the flexible circuit board 200 of the insertion hole 210 on this side between the two deformation slits 220. The elastic tongue 240 can deform uniformly in the length direction of the insertion hole 210, so that one side of the welding pin 110 can receive a uniform abutting force, which is beneficial to keeping the position of the welding pin 110 fixed in the insertion hole 210. Further, when two deformation slits 220 communicate with the same end of the insertion hole 210 and the two deformation slits 220 are on the opposite sides in the width direction of the insertion hole 210 and are axially symmetrically arranged, thus, an elastic tongue 240 is formed on each side of the insertion hole 210 in the width direction, so that both opposite sides of the welding pin 110 can receive a uniform abutting force, which is more beneficial to keeping the welding pin 110 fixed in the insertion hole 210.
[0057] In the first embodiment, please refer to Figure 4 and Figure 6The deformation slits 220 are provided in multiple configurations, with two deformation slits 220 connected to the same end of the insertion hole 210 and extending in opposite directions along the width of the insertion hole 210. This improves the tear resistance of that end of the insertion hole 210, particularly the tear resistance along the width of the insertion hole 210. Furthermore, the two deformation slits 220 are combined with deformation holes 230 at opposite ends to further enhance the tear resistance of the flexible circuit board 200. When both ends of the insertion hole 210 have two such deformation slits 220, the insertion hole 210 and the surrounding gaps form an I-shaped structure with a high degree of symmetry, which helps ensure uniform deformation. This allows the soldering foot 110 to be subjected to uniform and balanced force, facilitating the soldering foot 110 to be securely plugged into the insertion hole 210.
[0058] In the first embodiment, see Figure 6 The width ratio of the deformation slit 220 to the insertion hole 210 (i.e., d2 / d1) is 0.5 to 0.8. When the insertion hole 210 is configured as a strip-shaped hole, setting the width ratio of the deformation slit 220 to the insertion hole 210 within this range can control the deformation absorbed by the deformation slit 220 within an appropriate range, making the deformation direction and amount of the flexible circuit board 200 more controllable. This helps prevent uncontrollable deformation such as excessive warping or folding of the flexible circuit board 200, thereby ensuring the welding quality between the soldering foot 110 and the flexible circuit board 200. Specifically, the width ratio of the deformation slit 220 to the insertion hole 210 can be 0.5, 0.6, 0.7, 0.8, etc. Of course, in other embodiments, while ensuring that the deformation of the flexible circuit board 200 is controllable, the above width ratio can be a value less than 0.5, such as 0.3, 0.4, 0.45, etc., and the above width ratio can also be a value greater than 0.8, such as 0.85, 0.9, 0.95, etc.
[0059] In the first embodiment, see Figure 6 When the flexible circuit board 200 is further provided with a deformable hole 230, the ratio between the diameter of the deformable hole 230 and the width of the plug hole 210 (i.e., d3 / d1) is 1.5 to 3. Specifically, the deformable hole 230 is configured as a circular hole, and the diameter of the deformable hole 230 is also the diameter. By setting the ratio between the diameter of the deformable hole 230 and the width of the plug hole 210 within this range, it is beneficial to balance the deformability and tear resistance of the flexible circuit board 200. The ratio between the diameter of the deformable hole 230 and the width of the plug hole 210 can be 1.5, 1.8, 2, 2.2, 2.4, 2.6, 2.8, 3, etc. Of course, in other embodiments, this ratio can be adjusted to a value less than 1.5, such as 1, 1.2, 1.4, etc., as needed. This ratio can also be adjusted to a value greater than 3, such as 3.2, 3.3, 3.5, etc.
[0060] In the second embodiment, please refer to Figure 7 , the plug holes 210 and the welding pins 110 are correspondingly configured to be circular, and a plurality of deformation seams 220 are provided and are spaced along the circumferential direction of the plug holes 210. In this way, an elastic tongue 240 can be formed between every two adjacent deformation seams 220 of the flexible circuit board 200. After the welding pin 110 is inserted into the plug hole 210, a plurality of elastic tongues 240 in the circumferential direction will be deformed, and thus the welding pin 110 is subjected to the abutting forces distributed along the circumferential direction of the plurality of elastic tongues 240, which is beneficial to keeping the welding pin 110 fixed in the position of the plug hole 210. Further, the plurality of deformation seams 220 are evenly spaced along the circumferential direction of the plug holes 210, so that the welding pin 110 is uniformly stressed in the circumferential direction, which is more beneficial to keeping the welding pin 110 fixed in the plug hole 210. Among them, the number of the deformation seams 220 is preferably 3 to 6, specifically, it may be 3, 4, 5 or 6. Of course, in other embodiments, other numbers of deformation seams 220 may also be set according to requirements, such as 2, 7, 8, etc.
[0061] In the second embodiment, the width ratio of the deformation seam 220 to the plug hole 210 is 0.02 to 0.1. Similarly, when the welding pin 110 and the plug hole 210 are correspondingly arranged to be circular, setting the width ratio of the deformation seam 220 to the plug hole 210 within this range can control the deformation absorbed by the deformation seam 220 within a proper range, making the direction and amount of deformation of the flexible circuit board 200 more controllable, which is beneficial to avoiding uncontrollable deformations such as excessive warping or folding of the flexible circuit board 200, so as to ensure the welding quality of the welding pin 110 and the flexible circuit board 200. Specifically, the width ratio may be 0.02, 0.04, 0.06, 0.08, 1, etc. Of course, in other embodiments, on the premise of ensuring the controllability of the deformation of the flexible circuit board 200, the above width ratio may be a value less than 0.02, such as 0.01, 0.015, 0.018, etc., and the above width ratio may also be a value greater than 0.1, such as 0.2, 0.3, 0.4, etc.
[0062] In the second embodiment, when the flexible circuit board 200 is further provided with a deformation hole 230, the aperture ratio of the deformation hole 230 to the insertion hole 210 is 0.1 to 0.2. That is to say, both the deformation hole 230 and the insertion hole 210 are circular holes, and the diameter ratio between the two is 0.1 to 0.2. Similarly, when the welding feet 110 and the insertion holes 210 are correspondingly arranged in a circular shape, by setting the aperture ratio within this range, it is beneficial to balance the deformation ability and tear resistance of the flexible circuit board 200. Among them, the aperture ratio can be 0.1, 0.12, 0.15, 0.18, 0.2, etc. Of course, in other embodiments, the aperture ratio can also be adjusted to a value less than 0.1 according to needs, such as 0.05, 0.06, 0.08, etc., and this ratio can also be adjusted to a value greater than 0.2, such as 0.22, 0.25, 0.28, etc.
[0063] The above are only exemplary embodiments of the present invention, and do not limit the patent scope of the present invention accordingly. Any equivalent structural transformation made under the technical concept of the present invention by using the content of the specification and drawings of the present invention, or direct / indirect application in other related technical fields is included in the patent protection scope of the present invention.
Claims
1. An electronic device, characterized in that, It includes a device body and a flexible circuit board. The device body is provided with welding pins. The flexible circuit board includes a conductive area and a solder mask area surrounding the conductive area. The flexible circuit board has a plug hole provided in the conductive area and a deformation slit communicating with the plug hole. The welding pins are inserted into the plug holes and welded to the conductive area.
2. The electronic device according to claim 1, wherein The welding pins are in interference fit with the plug holes.
3. The electronic device according to claim 2, wherein The interference fit amount in the width direction between the plug holes and the welding pins is less than or equal to 0.1 mm.
4. The electronic device according to claim 1, wherein The width of the deformation slit is less than or equal to 0.1 mm.
5. The electronic device according to claim 1, wherein, The flexible circuit board is further provided with a deformation hole. One end of the deformation slit communicates with the plug hole, and the other end communicates with the deformation hole. The aperture of the deformation hole is larger than the width of the deformation slit.
6. The electronic device according to claim 5, characterized in that, The aperture of the deformation hole is 0.1 mm to 1 mm; And / or, the deformation hole is provided in the solder mask area.
7. The electronic device according to any one of claims 1 to 6, characterized in that The plug holes and the welding pins are correspondingly configured as strips. The deformation slit communicates with the end of the plug hole and is arranged at an angle to the plug hole.
8. The electronic device according to claim 7, characterized in that There are multiple deformation slits. Two deformation slits communicate with the same end of the plug hole and extend away from each other in the width direction of the plug hole; and / or, both ends of the plug hole communicate with different deformation slits; And / or, the width ratio of the deformation slit to the plug hole is 0.5 to 0.8; And / or, when the flexible circuit board is further provided with a deformation hole, the ratio of the aperture of the deformation hole to the width of the plug hole is 1.5 to 3.
9. The electronic device according to any one of claims 1 to 6, characterized in that, The plug holes and the welding pins are correspondingly configured as circles. There are multiple deformation slits, which are spaced along the circumference of the plug hole.
10. The electronic device according to claim 9, wherein The multiple deformation slits are evenly spaced along the circumference of the plug hole; And / or, the number of the deformation slits is 3 to 6; And / or, the width ratio of the deformation slit to the plug hole is 0.02 to 0.1; And / or, when the flexible circuit board is further provided with a deformation hole, the aperture ratio of the deformation hole to the plug hole is 0.1 to 0.
2.
11. A flexible circuit board, characterized in that, It includes a conductive area and a solder mask area surrounding the conductive area. The flexible circuit board has a plug hole provided in the conductive area and a deformation slit communicating with the plug hole. The plug hole is used for inserting welding pins.