Dual-mode heat dissipation device and heat dissipation method

Abstract

The invention discloses a dual-mode heat dissipation device and a heat dissipation method, and relates to the technical field of heat dissipation equipment, and the dual-mode heat dissipation device comprises a shell which is provided with an insertion port of a part to be cooled; the heat exchange cover is arranged in the shell, and a closed liquid flow channel is formed between the heat exchange cover and the shell; the separator divides the liquid flow channel into a first flow channel and a second flow channel, the second end of the first flow channel is connected with the first end of the second flow channel, and the flow directions of liquid flows in the first flow channel and the second flow channel are opposite; the power source comprises a liquid power source and a gas power source, the liquid power source is connected with the first end of the first flow channel, the gas power source is connected with the second end of the second flow channel and used for conveying airflow into the second flow channel, and the flow direction of the airflow in the second flow channel is opposite to the flow direction of the liquid flow. By arranging the heat exchange cover, the separator and the power source, a double-channel heat dissipation path with opposite liquid flow directions and an air flow and liquid flow convection heat dissipation path are formed, the heat dissipation efficiency is high, and stable operation of a heat-dissipated part under high power consumption is met.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation devices, and in particular to a dual-mode heat dissipation device and a heat dissipation method. Background Art

[0002] Generally, electronic devices such as communication and network devices, industrial automation and control devices, power and energy devices, etc. need a heat dissipation cabinet to maintain stable operation during use. These electronic devices usually have the characteristics of high power density or being sensitive to environmental temperature.

[0003] Existing heat dissipation cabinets generally only adopt one heat dissipation mode, that is, liquid cooling or air cooling. The above single-mode heat dissipation can meet the heat dissipation requirements when the electronic device (the component to be cooled) operates at low power. However, when the electronic device operates at high power for a short time and the heat generation increases, the single-mode heat dissipation cannot meet the heat dissipation requirements and the heat dissipation efficiency is low. Summary of the Invention

[0004] The present application provides a dual-mode heat dissipation device and a heat dissipation method to at least solve the problem that the single-mode heat dissipation in the related art cannot meet the heat dissipation requirements of the component to be cooled with high power operation and increased heat generation, and the low heat dissipation efficiency.

[0005] In a first aspect, the present application provides a dual-mode heat dissipation device, including: A housing, formed with an insertion port for the component to be cooled; A heat exchange cover, arranged in the housing and a sealed liquid flow channel is formed between its side wall and the inner wall of the housing. An installation groove for the component to be cooled is formed on the heat exchange cover, and the installation groove corresponds to the insertion port; A partition member, separating the liquid flow channel into a first flow channel and a second flow channel, and the second end of the first flow channel is connected to the first end of the second flow channel, and the liquid flows in the first flow channel and the second flow channel are in opposite directions; A power source, including a liquid power source and a gas power source. The liquid power source is connected to the first end of the first flow channel, the gas power source is connected to the second end of the second flow channel and is used to convey air flow into the second flow channel, and the air flow direction in the second flow channel is opposite to the liquid flow direction.

[0006] As a preference of the above solution, a plurality of heat exchange covers are arranged at intervals in a first direction in a staggered manner. The first flow channel and the second flow channel respectively include a plurality of main flow channels and connecting flow channels distributed at intervals, and a connecting flow channel is formed between adjacent heat exchange covers; The first end of the heat exchange cover in a second direction abuts against the inner wall of the housing, and a main flow channel is formed between the second end of the heat exchange cover in the second direction and the inner wall of the housing. The main flow channels corresponding to adjacent heat exchange covers are connected through corresponding connecting flow channels; The flow direction of the liquid in the main flow channel is along the first direction, the first direction is along the height direction of the housing, the flow direction of the liquid in the connecting flow channel is along the second direction, and the second direction is along the length direction of the housing.

[0007] As a preference of the above solution, the separator includes: A first separation part that separates the main flow channels corresponding to the first flow channel and the second flow channel and abuts against the heat exchange cover and the housing; A second separation part that separates the connecting flow channels corresponding to the first flow channel and the second flow channel and abuts against the heat exchange cover; Adjacent first separation parts are connected through corresponding second separation parts.

[0008] As a preference of the above solution, the first flow channel and the second flow channel further respectively include edge flow channels formed between the side wall of the heat exchange cover facing away from the connecting flow channel and the inner wall of the end of the housing. The second end of the first flow channel and the first end of the second flow channel are located in the edge flow channels; The separator further includes a third separation part that separates the edge flow channels corresponding to the first flow channel and the second flow channel and abuts against the heat exchange cover and the housing; The third separation part includes a connecting part and a communicating part. The second end of the connecting part is connected to the first separation part, and the first end is connected to the communicating part. The connecting part extends along the second direction. A communicating groove is formed in the communicating part, and one end of the communicating groove is connected to the second end of the first flow channel; A notch communicating with the communicating groove is formed on the side wall of the communicating part. The notch, the communicating groove, and the communicating part all extend along the third direction, and the third direction is along the width direction of the housing. The notch is connected to the first end of the second flow channel. A diversion groove is formed on the side wall of the heat exchange cover corresponding to the second flow channel. The diversion groove extends along the second direction and communicates with the communicating groove, the notch, and the edge flow channel, the main flow channel, and the connecting flow channel of the second flow channel.

[0009] As a preference of the above solution, the dual-mode heat dissipation device further includes a monitoring mechanism that monitors the heat generation amount of the component to be cooled, and the monitoring mechanism is connected to and controls the liquid power source and the gas power source.

[0010] As a preference of the above solution, the dual-mode heat dissipation device further includes an air outlet mechanism. An air flow port for the air flow to pass through is formed on the side wall of the housing away from the gas power source. The air outlet mechanism includes a covering part. When there is no air flow at the air flow port, the covering part covers the air flow port. When the air flow reaches the air flow port, the air flow blows the covering part away from the air flow port.

[0011] As a preference of the above solution, the dual-mode heat dissipation device further includes: A liquid storage cavity formed between the inner wall of the heat exchange cover and the housing. The second end of the second flow channel and the liquid power source are located in the liquid storage cavity; A liquid level detection mechanism arranged in the liquid storage cavity; A water source, connected to the liquid storage chamber; An inlet control member, connected to the liquid level detection mechanism and the water source. When the liquid level detection mechanism detects that the liquid level in the liquid storage chamber is too low, the inlet control member controls the water source to supply water to the liquid storage chamber.

[0012] As an optimization of the above solution, the liquid level detection mechanism includes: A floating member, movably arranged along the liquid level height direction; A telescopic member, whose telescopic direction is along the liquid level height direction, and its second end is fixedly connected to the floating member, and the first end is fixedly connected to the housing; A detection member, used to detect the position of the floating member along the liquid level height direction and connected to the inlet control member.

[0013] As an optimization of the above solution, the floating member is formed with a connected air inlet, air inlet chamber and air outlet. The air outlet is located above the liquid level. An air passage is formed in the telescopic member. The second end of the air passage is connected to the gas power source, and the first end is connected to the air inlet.

[0014] In a second aspect, a heat dissipation method applied to the dual-mode heat dissipation device as above is provided, including the following steps: Place the component to be cooled into the placement groove of the heat exchange cover through the insertion port; When the heat generation amount of the component to be cooled is less than the heat generation threshold, execute the first heat dissipation mode: the liquid power source operates alone and drives the liquid flow to flow along the first flow channel first, and then along the second flow channel, so as to take away the heat transferred from the component to be cooled to the heat exchange cover. Among them, the liquid flows in the first flow channel and the second flow channel in opposite directions; When the heat generation amount of the component to be cooled is greater than or equal to the heat generation threshold, execute the second heat dissipation mode: while executing the first heat dissipation mode, the gas power source operates. The gas power source drives the air flow to flow along the second flow channel, so as to dissipate heat from the liquid flow and promote the evaporation of the liquid flow at the same time. Among them, the air flow in the second flow channel flows in the opposite direction to the liquid flow.

[0015] Through this application, due to the setting of the heat exchange cover and the partition member, a sealed liquid flow channel is formed between the heat exchange cover and the housing for the liquid to flow to dissipate heat from the component to be cooled in the heat exchange cover. The partition member divides the liquid flow channel into a first flow channel and a second flow channel with opposite liquid flow directions, thus forming a double-flow channel heat dissipation path for the liquid flow. When the component to be cooled operates at low power and has a small heat generation amount, the liquid power source operates alone, driving the liquid flow to flow bidirectionally along the first flow channel and the second flow channel, directly taking away the heat of the heat exchange cover by liquid cooling, with high heat dissipation efficiency and avoiding the operation of the gas power source, reducing energy consumption; when the component to be cooled operates at high power and has a large heat generation amount, the liquid power source and the gas power source operate simultaneously, and an air flow flowing in the opposite direction to the liquid flow is introduced into the second flow channel. Thus, the air flow and the liquid flow flow reversely on the surface of the heat exchange cover to form convection. The air flow dissipates heat from the liquid flow and promotes the evaporation of the liquid flow at the same time, further enhancing the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings required in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0017] Figure 1 FIG. Figure 2 is a schematic structural diagram of the dual-mode heat dissipation device according to Embodiment 1 of the present application; Figure 3 is an exploded structural diagram of the dual-mode heat dissipation device according to Embodiment 1 of the present application; Figure 4 is a schematic structural diagram of the interior of the housing of the dual-mode heat dissipation device according to Embodiment 1 of the present application; Figure 5 is a schematic structural diagram of the dividing member of the dual-mode heat dissipation device according to Embodiment 1 of the present application; Figure 6 is a schematic structural diagram of the housing of the dual-mode heat dissipation device according to Embodiment 1 of the present application; Figure 7 is a flowchart of the dual-mode heat dissipation method according to Embodiment 2 of the present application.

[0018] Among them, the above-mentioned drawings include the following reference numerals: Housing 1; Insertion port 11; Accommodation cavity 12; Liquid storage cavity 121; Front plate 13; Back plate 14; Intersection port 141; Top plate 15; Air flow port 151; Bottom plate 16; Through hole 161; Left side plate 17; Right side plate 18; Support leg 19; Heat exchange cover 2; Placement groove 21; Upper side wall 22; Lower side wall 23; Side wall 24; Opening 25; Diversion groove 26; Partition member 3; First partition portion 31; Flange 311; Connecting pipe 312; Second partition portion 32; Third partition portion 33; Connecting portion 331; Communication portion 332; Communication groove 333; Notch 334; Power source 4; Liquid power source 41; Gas power source 42; Liquid flow channel 5; First flow channel 51; Second flow channel 52; Main flow channel 53; Connecting flow channel 54; Edge flow channel 55; Air outlet mechanism 6; Covering member 61; Rotating shaft 62; Rotating shaft support 63; Liquid level detection mechanism 7; Floating member 71; Air inlet 711; Air inlet cavity 712; Air outlet 713; Guide groove 714; Telescopic member 72; Guide rod 73; Heat exchange mechanism 8; Heat exchanger 81; Heat exchange plate 811; Heat exchange fin 812; Main body portion 813; Support portion 814; Installation through groove 815; Heat pipe 82; Heat dissipation fin 83. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0019] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0020] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application. The terms "mounted", "connected" and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements. The terms "parallel", "perpendicular", "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the error associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range of approximate parallelism may be, for example, within 5° deviation; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range of approximate perpendicularity may also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality may be, for example, that the difference between the two equal ones is less than or equal to 5% of any one of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0021] As described in the background art, when an electronic device is in use, a heat dissipation cabinet is required to maintain stable operation.

[0022] As a type of electronic device, a server has high-speed CPU computing power, long-term reliable operation, strong I / O external data throughput capacity, and better scalability, and provides computing or application services (loads) for other client machines (such as PC machines, smart phones, ATMs, etc. terminals or even large devices such as train systems) in the network.

[0023] The existing heat dissipation cabinets of servers generally adopt single-mode heat dissipation, which can meet the heat dissipation requirements when the servers operate at low power. However, when the servers operate at high power for a short time (sudden increase in load) and the heat generation increases, the single-mode heat dissipation cannot meet the heat dissipation requirements, and the heat dissipation efficiency is low, affecting the stable operation of the servers.

[0024] The dual-mode heat dissipation device and heat dissipation method provided by this application adopt dual-mode heat dissipation. When the servers operate at low power and the heat generation is small, the liquid cooling mode is adopted alone, and the liquid flow flows bidirectionally along the first flow channel and the second flow channel to achieve effective heat dissipation of the servers. When the servers operate at high power and the heat generation is large, the dual-mode of liquid cooling and air cooling is adopted, and the air flow in the second flow channel forms a convection with the liquid flow, further enhancing the heat dissipation effect of the servers to ensure the stable operation of the servers under high power.

[0025] To enable those skilled in the art of this technical field to better understand the solution of this application, the following further elaborates on this application in conjunction with the accompanying drawings and specific embodiments.

[0026] Embodiment 1 This application provides a dual-mode heat dissipation device, as Figure 1 , Figure 2 , Figure 3 , Figure 6 shown, including a housing 1, a heat exchange cover 2, a partition member 3, and a power source 4. The housing 1 is formed with an insertion port 11 for the component to be cooled. The housing 1 may include a front plate 13, a back plate 14, a top plate 15, a bottom plate 16, a left side plate 17, and a right side plate 18 that enclose to form an accommodation cavity 12. The insertion port 11 may be formed on the front plate 13 and communicate with the accommodation cavity 12. A plurality of feet 19 may be formed on the bottom plate 16 to raise the bottom of the housing 1. As Figure 2 shown, the first direction is along the height direction of the housing 1 (i.e., the up and down direction in Figure 2 ), the second direction is along the length direction of the housing 1 (i.e., the left and right direction in Figure 2 ), and the third direction is along the width direction of the housing 1 (i.e., the front and back direction in Figure 2 ).

[0027] As Figure 2As shown, the heat exchange cover 2 is disposed within the housing 1, and a sealed liquid flow channel 5 is formed between the side wall of the heat exchange cover 2 and the inner wall of the housing 1. The heat exchange cover 2 can be made of a heat-conducting material. An installation groove 21 for the component to be cooled is formed on the heat exchange cover 2. The installation groove 21 corresponds to the insertion port 11. A heat-conducting medium such as thermal grease or thermal pad (not shown) can be closely attached to the inner wall of the installation groove 21. When installing the server, the server is inserted into the installation groove 21 from the insertion port 11. The server is attached to the heat exchange cover 2 through the heat-conducting medium. At the same time, the heat exchange cover 2 is immersed in the liquid in the accommodation cavity 12 while the server does not come into contact with the liquid. This can not only improve the heat dissipation efficiency of the server but also prevent the server from being damaged due to contact with the liquid. As Figure 4 As shown, the heat exchange cover 2 is disposed within the accommodation cavity 12 and can be in a "C" shape. The heat exchange cover 2 can include an upper side wall 22, a lower side wall 23, side wall portions 24 located on the left and right sides respectively, and an opening 25. The opening 25 faces left or right, and the opening 25 communicates with the installation groove 21. The front ends of the upper side wall 22, the lower side wall 23, and the side wall portions 24 are hermetically abutted against the front plate 13 in the axial direction of the insertion port 11, and the rear ends of the upper side wall 22, the lower side wall 23, and the side wall portions 24 are hermetically abutted against and fixed to the back plate 14.

[0028] As Figure 4 As shown, a plurality of heat exchange covers 2 are arranged at staggered intervals along a first direction, that is, the heat exchange covers 2 are not aligned in the first direction. At the same time, the openings 25 of adjacent heat exchange covers 2 face in opposite directions. The staggered arrangement of the heat exchange covers 2 up and down can increase the area of the liquid flow channel 5, increase the contact area between the liquid and the heat exchange covers 2, and improve the heat exchange efficiency. The number of heat exchange covers 2 can be flexibly increased or decreased according to the number of servers configured. As Figure 6 As shown, a plurality of insertion ports 11 are formed at staggered intervals along the first direction on the front plate 13, and the insertion ports 11 correspond to the heat exchange covers 2 one by one.

[0029] As Figure 2 As shown, the partition member 3 divides the liquid flow channel 5 into a first flow channel 51 and a second flow channel 52, and the second end of the first flow channel 51 is connected to the first end of the second flow channel 52. The second end of the first flow channel 51 is the end point of the first flow channel 51, and the first end of the second flow channel 52 is the starting point of the second flow channel 52. The liquid flows in opposite directions in the first flow channel 51 and the second flow channel 52. The first flow channel 51 can be the part of the liquid flow channel 5 surrounded by the back plate 14 and the partition member 3, and the second flow channel 52 can be the part of the liquid flow channel 5 surrounded by the front plate 13 and the partition member 3. The partition member 3 can be a partition plate and can be disposed at the rear side of the liquid flow channel 5 near the back plate 14, that is, the area of the second flow channel 52 can be much larger than the area of the first flow channel 51.

[0030] As Figure 4As shown, the first flow channel 51 and the second flow channel 52 respectively include a plurality of main flow channels 53 distributed at intervals and connecting flow channels 54. The connecting flow channels 54 are formed between adjacent heat exchange covers 2. The arrangement of the main flow channels 53 and the connecting flow channels 54 increases the heat exchange area of the liquid flow channel 5.

[0031] As Figure 4 shown, the first end of the heat exchange cover 2 along the second direction abuts against the inner wall of the housing 1. It can be that one end of the upper side wall 22, the lower side wall 23 corresponding to the opening 25 is hermetically abutted against the left side plate 17 or the right side plate 18. A main flow channel 53 is formed between the second end of the heat exchange cover 2 along the second direction and the inner wall of the housing 1, that is, a main flow channel 53 is formed between the side wall 24 and the inner wall of the housing 1. The main flow channels 53 corresponding to adjacent heat exchange covers 2 are connected by corresponding connecting flow channels 54, that is, the main flow channels 53 adjacent to each other on the first flow channel 51 are connected by corresponding connecting flow channels 54, and the main flow channels 53 adjacent to each other on the second flow channel 52 are connected by corresponding connecting flow channels 54.

[0032] The liquid flow direction in the main flow channel 53 is along the first direction, and the liquid flow directions in the corresponding main flow channels 53 of the first flow channel 51 and the second flow channel 52 are opposite. That is, the liquid flow direction in the main flow channel 53 of the first flow channel 51 can be upward or downward, and then the liquid flow direction in the corresponding main flow channel 53 of the second flow channel 52 can be downward or upward. The liquid flow direction in the connecting flow channel 54 is along the second direction, and the liquid flow directions in the corresponding connecting flow channels 54 of the first flow channel 51 and the second flow channel 52 are opposite. That is, the liquid flow direction in the connecting flow channel 54 of the first flow channel 51 can be leftward or rightward, and the liquid flow direction in the corresponding connecting flow channel 54 of the second flow channel 52 is then rightward or leftward.

[0033] The first flow channel 51 and the second flow channel 52 also respectively include edge flow channels 55. The edge flow channels 55 are formed between the side wall of the heat exchange cover 2 facing away from the connecting flow channel 54 and the inner wall of the end of the housing 1. The second end of the first flow channel 51 and the first end of the second flow channel 52 are located in the edge flow channels 55. The edge flow channels 55 can be part of the liquid flow channel 5 surrounded by the top plate 15 and the uppermost heat exchange cover 2. The liquid flow direction in the edge flow channel 55 of the first flow channel 51 can be leftward or rightward, and the liquid flow direction in the corresponding edge flow channel 55 of the second flow channel 52 is then rightward or leftward. The arrangement of the edge flow channels 55 facilitates the connection of the first flow channel 51 and the second flow channel 52 and the conversion of the flow channel direction.

[0034] As Figure 5As shown, the separator 3 includes a plurality of first separating portions 31 and second separating portions 32. The first separating portion 31 separates the main flow channels 53 corresponding to the first flow channel 51 and the second flow channel 52 and abuts against the heat exchange cover 2 and the housing 1. The first separating portion 31 can extend in the first direction. The second separating portion 32 separates the connecting flow channels 54 corresponding to the first flow channel 51 and the second flow channel 52 and abuts against the heat exchange cover 2. The second separating portion 32 can extend in the second direction. Adjacent first separating portions 31 are connected by corresponding second separating portions 32. The number of the first separating portions 31 and the second separating portions 32 can be adaptively increased or decreased according to the number of the heat exchange covers 2.

[0035] As Figure 5 shown, the separator 3 further includes a third separating portion 33. The third separating portion 33 separates the edge flow channels 55 corresponding to the first flow channel 51 and the second flow channel 52 and abuts against the heat exchange cover 2 and the housing 1. The separator 3, the first flow channel 51 and the second flow channel 52 can be approximately serpentine.

[0036] As Figure 5 shown, the third separating portion 33 includes a connecting portion 331 and a communicating portion 332. The second end of the connecting portion 331 is connected to the first separating portion 31, and the first end is connected to the communicating portion 332. The connecting portion 331 can extend in the second direction. A communicating groove 333 is formed in the communicating portion 332. One end of the communicating groove 333 is connected to the second end of the first flow channel 51. The setting of the third separating portion 33 facilitates the natural connection and conversion of the first flow channel 51 and the second flow channel 52.

[0037] As Figure 5 shown, a notch 334 communicating with the communicating groove 333 is formed on the side wall of the communicating portion 332. The notch 334, the communicating groove 333 and the communicating portion 332 can all extend in the third direction. The notch 334 is connected to the first end of the second flow channel 52. The notch 334 can be opened at the bottom of the communicating portion 332. A diversion groove 26 is formed on the side wall of the heat exchange cover 2 corresponding to the second flow channel 52. The diversion groove 26 can extend in the second direction and communicate with the communicating groove 333, the notch 334, and the edge flow channel 55, the main flow channel 53 and the connecting flow channel 54 of the second flow channel 52. The diversion groove 26 can be provided in multiple numbers and be spaced apart and distributed on the top surface of the upper side wall 22. The setting of the diversion groove 26 can prevent the liquid flow from converging into strands due to tension and adhesion force, ensure that the liquid flow evenly covers the surface of the heat exchange cover 2, and further improve the heat exchange efficiency.

[0038] As Figure 2As shown, the power source 4 includes a liquid power source 41 and a gas power source 42. The liquid power source 41 is connected to the first end of the first flow channel 51, and the first end of the first flow channel 51 is the starting end of the first flow channel 51. The gas power source 42 is connected to the second end of the second flow channel 52 and is used to convey air flow into the second flow channel 52, and the air flow direction in the second flow channel 52 is opposite to the liquid flow direction. The second end of the second flow channel 52 is the end point of the second flow channel 52. The liquid power source 41 can be a water pump, the liquid in the liquid flow channel 5 can be a coolant or water, and the gas power source 42 can be a blower. The area of the second flow channel 52 is much larger than that of the first flow channel 51, so that the convection area between the air flow and the liquid flow in the second flow channel 52 can be increased, and the heat exchange efficiency can be further improved.

[0039] The dual-mode heat dissipation device further includes a monitoring mechanism (not shown). The monitoring mechanism monitors the heat generation amount of the component to be cooled, and the monitoring mechanism is connected to and controls the liquid power source 41 and the gas power source 42. The monitoring mechanism can be a heat generation amount measuring device of the server. It can also be a load monitoring software of the server. The monitoring mechanism monitors the heat generation amount of the server by monitoring the load change of the server, that is, when the load amount of the server increases, the power consumption and heat generation amount of the server increase accordingly, and vice versa.

[0040] As Figure 1 、 Figure 2 As shown, the dual-mode heat dissipation device further includes an air outlet mechanism 6. An air flow port 151 for air flow to pass through is formed on the side wall of the housing 1 away from the gas power source 42. The air outlet mechanism 6 includes a covering member 61. When there is no air flow at the air flow port 151, the covering member 61 covers the air flow port 151. When the air flow reaches the air flow port 151, the air flow blows the covering member 61 away from the air flow port 151.

[0041] As Figure 2 As shown, the air flow port 151 can be formed on the top plate 15. The air outlet mechanism 6 can further include a rotating shaft 62 and a pair of rotating shaft supports 63. The rotating shaft supports 63 are fixed on the top surface of the top plate 15, and both ends of the rotating shaft 62 are rotatably connected to the rotating shaft supports 63. The covering member 61 can be a lightweight plate, and one end of the covering member 61 away from the air flow port 151 is inserted and fixed on the rotating shaft 62. The air flow port 151, the covering member 61, and the rotating shaft 62 can all extend along the third direction. When the gas power source 42 is not operating, the covering member 61 covers the air flow port 151 to prevent impurities from falling into the accommodation cavity 12 of the housing 1. When the gas power source 42 operates and when the air flow reaches the air flow port 151, the air flow pushes the covering member 61 away, and one end of the covering member 61 rotates around the rotating shaft 62, so that the air flow can leave the housing 1 from the air flow port 151 and take away heat.

[0042] In this application, the air outlet mechanism 6 can be linked with the gas power source 42. When the gas power source 42 works, the covering member 61 is automatically opened under the action of air flow, forming a top air flow heat dissipation channel, accelerating the discharge of hot air in the accommodation cavity 12, further improving the heat dissipation efficiency, and at the same time reducing the opening and closing control of the covering member 61 by mechanical control components, thus reducing costs.

[0043] As Figure 2 , Figure 4 shown, the dual-mode heat dissipation device further includes a liquid storage cavity 121, a liquid level detection mechanism 7, a water source (not shown), and a water inlet control member (not shown). The liquid storage cavity 121 is formed between the heat exchange cover 2 and the inner wall of the housing 1. The second end of the second flow channel 52 and the liquid power source 41 are located in the liquid storage cavity 121. The liquid storage cavity 121 belongs to the bottommost part of the accommodation cavity 12. By providing the liquid storage cavity 121, the first flow channel 51 and the second flow channel 52 can form an efficient circulation loop. The main flow direction of the liquid flow in the first flow channel 51 is upward, and the liquid flow absorbs the heat conducted from the server to the heat exchange cover 2 during the upward process. The main flow direction of the liquid flow in the second flow channel 52 is downward, and the main flow direction of the air flow in the second flow channel 52 is upward. Thus, the liquid flow forms a convection with the air flow during the downward process, and the air flow dissipates heat from the liquid flow through air cooling and promotes the evaporation of the liquid flow, thereby enhancing the heat dissipation process.

[0044] As Figure 5 shown, the bottom of the lowermost first partition portion 31 can extend into the liquid storage cavity 121 and can form an L-shaped folded edge 311. One end of the folded edge 311 abuts against the inner wall of the liquid storage cavity 121. The side wall of the folded edge 311 facing the first flow channel 51 is in communication with the first flow channel 51. The side wall of the folded edge 311 facing the liquid storage cavity 121 can form a connecting pipe 312. One end of the connecting pipe 312 is in communication with the first flow channel 51, and the other end is connected to the liquid power source 41. The liquid power source 41 can be fixed to the inner wall of the liquid storage cavity 121. The power of the liquid power source 41 enables a circulation loop of the liquid flow to be formed in the accommodation cavity 12.

[0045] The liquid level detection mechanism 7 is arranged in the liquid storage cavity 121. The water source is connected to the liquid storage cavity 121. The water inlet control member is connected to the liquid level detection mechanism 7 and the water source. When the liquid level detection mechanism 7 detects that the liquid level in the liquid storage cavity 121 is too low, the water inlet control member controls the water source to supply water to the liquid storage cavity 121. The water source can include a pipeline, and the pipeline is connected to the water inlet (not shown) on the liquid storage cavity 121. The water inlet control member can be a valve connected to the pipeline.

[0046] As Figure 2As shown, the liquid level detection mechanism 7 includes a floating member 71, a telescopic member 72, and a detection member (not shown). The floating member 71 is movably arranged along the liquid level height direction. The telescopic direction of the telescopic member 72 is along the liquid level height direction, and its second end is fixedly connected to the floating member 71, and the first end is fixedly connected to the housing 1. The detection member is used to detect the position of the floating member 71 along the liquid level height direction and is connected to the water inlet control member. Specifically, the detection member is used to detect whether the floating member 71 is at an overly low liquid level position. When the detection member detects the floating member 71, it triggers the water inlet control member to control the water source to supply water to the liquid storage chamber 121, thus realizing automatic liquid replenishment and avoiding liquid shortage in the accommodation chamber 12.

[0047] The floating member 71 can be a floating wind hood, the telescopic member 72 can be a telescopic tube, the position of the detection member corresponds to the position of the overly low liquid level, the detection member is fixedly installed at the position of the overly low liquid level pre-determined on the inner wall of the liquid storage chamber 121, and the detection member can be a proximity switch sensor, such as a photoelectric proximity switch sensor. When the liquid level in the liquid storage chamber 121 is overly low, the light beam of the photoelectric proximity switch sensor is blocked by the floating member 71, that is, the photoelectric proximity switch sensor detects the floating member 71.

[0048] As Figure 2 、 Figure 3 As shown, the floating member 71 is formed with a connected air inlet 711, an air inlet chamber 712, and an air outlet 713. The air outlet 713 is located above the liquid level. A ventilation passage (not shown) is formed in the telescopic member 72. The second end of the ventilation passage is connected to the gas power source 42, and the first end is connected to the air inlet 711. The floating member 71, the air inlet chamber 712, and the air outlet 713 can all extend along the third direction. The bottom plate 16 of the housing 1 can be formed with a through hole 161. The upper end of the telescopic member 72 can be fixedly connected to the middle of the bottom of the floating member 71. The lower end of the telescopic member 72 passes through the through hole 161 and is connected to the gas power source 42, and the gas power source 42 can be fixed to the bottom surface of the bottom plate 16.

[0049] The liquid level detection mechanism 7 can further include a guide rod 73 extending along the first direction. The guide rod 73 is formed at the bottom of the heat exchange hood 2 at the lowermost end, and the number of the guide rods 73 can be two. Guide grooves 714 can be formed on the opposite side walls of the floating member 71, and the guide grooves 714 are respectively inserted into the guide rods 73. The floating member 71 can float up and down adaptively to the liquid level change in the liquid storage chamber 121 through the guide rods 73, and at the same time the telescopic member 72 adapts to telescopic, so as to ensure that the air outlet 713 is always above the liquid surface and close to the liquid surface.

[0050] The arrangement of the floating member 71 and the telescopic member 72 in this application can not only cooperate with the detection member to detect the too-low liquid level in the liquid storage chamber 121, but also cooperate with the gas power source 42, so that the gas outlet position of the gas power source 42 is always above the liquid surface and close to the liquid surface, which can enhance the gas-liquid convection effect in the second flow channel 52.

[0051] As Figure 2 , Figure 3 shown, the dual-mode heat dissipation device may further include a heat exchange mechanism 8. The heat exchange mechanism 8 includes a heat exchanger 81, a heat pipe 82, and heat dissipation fins 83. The heat exchanger 81 may include a heat exchange plate 811 and a plurality of heat exchange fins 812 spaced apart from each other on the heat exchange plate 811. The heat exchange plate 811 may include a main body portion 813 and a support portion 814. The heat exchange fins 812 may be evenly inserted into the main body portion 813. The main body portion 813 and the heat exchange fins 812 are immersed in the liquid in the liquid storage chamber 121 to exchange heat with the liquid. The main body portion 813 and the heat exchange fins 812 transfer the heat of the liquid to the support portion 814. An installation through groove 815 penetrating the front side wall of the main body portion 813 may be formed in the middle of the main body portion 813. The middle of the heat exchange fin 812 is located on the installation through groove 815, so as to increase the heat exchange area of the heat exchange fin 812. An insertion opening 141 may be formed on the back plate 14 of the housing 1. The support portion 814 may be inserted and fixed in the insertion opening 141, and the rear end of the support portion 814 passes through the insertion opening 141 and is connected to one end of the heat pipe 82. The support portion 814 transfers the heat to the heat pipe 82. The heat pipe 82 and the heat dissipation fins 83 may be located outside the housing 1. The inside of the heat pipe 82 may be filled with a working fluid (such as water, ammonia), and the heat is quickly transferred by phase change (evaporation / condensation), and part of the heat is transferred to the heat dissipation fins 83. The other end of the heat pipe 82 is connected to the heat dissipation fins 83. The heat dissipation fins 83 may be fixed to the back plate 14. The heat dissipation fins 83 expand the heat dissipation surface area, and the heat transferred by the heat pipe 82 can be dissipated to the external environment through forced air cooling.

[0052] The above heat exchange mechanism 8 first transfers the heat in the liquid in the liquid storage chamber 121 to the heat pipe 82 through the heat exchanger 81, and then quickly releases the heat to the external environment through the heat pipe 82 and the heat dissipation fins 83, realizing three-stage heat dissipation of "liquid cooling - heat pipe - air cooling", avoiding the accumulation of heat in the accommodation chamber 12, and improving the heat dissipation capacity of the entire dual-mode heat dissipation device.

[0053] When the dual-mode heat dissipation device of the present application is in use, first insert the server into the placement groove 21 of the heat exchange cover 2 through the insertion port 11, and the server is in close contact with the heat-conducting medium on the inner wall of the placement groove 21. When the monitoring mechanism monitors that the load of the server is small, the server is operating at low power consumption and generates little heat. The monitoring mechanism controls the liquid power source 41 to operate alone. The liquid power source 41 drives the liquid in the liquid storage cavity 121 to enter the main flow channel 53 at the lowermost end of the first flow channel 51 through the connecting pipe 312 and the folded edge 311. The liquid flows upward along the main flow channel 53, then enters the connecting flow channel 54 at the lowermost end of the first flow channel 51 and flows left or right along the connecting flow channel 54, and then enters the next main flow channel 53. Repeating the above process, the liquid enters the edge flow channel 55 of the first flow channel 51 from the main flow channel 53 at the uppermost end of the first flow channel 51.

[0054] The liquid flows left or right along the edge flow channel 55 of the first flow channel 51, and finally enters the edge flow channel 55 of the second flow channel 52 through the communication groove 333 and the notch 334. The liquid flows right or left along the edge flow channel 55 of the second flow channel 52 and enters the main flow channel 53 at the uppermost end of the second flow channel 52. The liquid flows downward along the main flow channel 53, then enters the connecting flow channel 54 at the uppermost end of the second flow channel 52 and flows left or right along the connecting flow channel 54, and then enters the next main flow channel 53. Repeating the above process, the liquid enters the liquid storage cavity 121 from the main flow channel 53 at the lowermost end of the second flow channel 52. The above liquid flows under the guidance of the diversion groove 26 during the flow in the second flow channel 52.

[0055] The above first flow channel 51 and second flow channel 52 form a double-flow heat dissipation path for the liquid flow, with high heat dissipation efficiency. At the same time, the liquid in the liquid storage cavity 121 is heat-exchanged by the heat exchanger 81 and then driven by the liquid power source 41 to re-enter the first flow channel 51, thereby realizing the circulation loop of the liquid flow.

[0056] When the monitoring mechanism monitors that the load of the server suddenly increases, the server is operating at high power consumption and the heat generation increases. The monitoring mechanism controls the liquid power source 41 and the gas power source 42 to operate simultaneously. The gas power source 42 drives the air flow to enter the liquid storage cavity 121 and enter the second flow channel 52 from the liquid storage cavity 121. The main body of the air flow flows upward and forms a convection with the liquid flow in the second flow channel 52. The air flow dissipates heat from the liquid flow and promotes the evaporation of the liquid flow. The air flow carrying heat and steam blows the covering member 61 and leaves the housing 1 from the air flow port 151. The liquid power source 41 and the gas power source 42 work together to form a "liquid cooling + air cooling" hybrid heat dissipation, further enhancing the heat dissipation effect to ensure the stable operation of the server under high power consumption.

[0057] Through the above, the dual-mode cooling device of the present application can constitute a dynamic dual-mode cooling mechanism for a server that is adaptive, highly efficient, and low in energy consumption, which can adapt to the load changes of the server and enable the server to operate stably.

[0058] Embodiment 2 The present application provides a cooling method applied to the dual-mode cooling device as in Embodiment 1, as Figure 7 shown, including the following steps: S1: Place the component to be cooled into the placement groove of the heat exchange cover through the insertion port.

[0059] Specifically, insert the server into the placement groove of the heat exchange cover through the insertion port, and the server is in close contact with the heat-conducting medium on the inner wall of the placement groove.

[0060] S2: When the heat generation of the component to be cooled is less than the heat generation threshold, execute the first cooling mode: the liquid power source operates alone and drives the liquid flow to first flow along the first flow path and then along the second flow path to take away the heat transferred from the component to be cooled to the heat exchange cover, where the liquid flows in opposite directions in the first flow path and the second flow path.

[0061] Specifically, the heat generation threshold refers to the heat generation of the server that can meet the cooling requirements when the liquid power source operates alone, that is, when liquid cooling is performed alone. The heat generation threshold can be obtained by measurement during the preliminary operation and debugging of the dual-mode cooling device.

[0062] When it is monitored by the monitoring mechanism that the heat generation of the server is less than the heat generation threshold, execute the first cooling mode: the monitoring mechanism controls the liquid power source to operate alone, and the liquid power source drives the liquid flow to first flow upward along the main body of the first flow path and then downward along the main body of the second flow path to take away the heat transferred from the server to the heat exchange cover.

[0063] S3: When the heat generation of the component to be cooled is greater than or equal to the heat generation threshold, execute the second cooling mode: while executing the first cooling mode, the gas power source operates, and the gas power source drives the gas flow to flow along the second flow path to cool the liquid flow and promote the evaporation of the liquid flow at the same time, where the gas flow in the second flow path flows in the opposite direction to the liquid flow.

[0064] Specifically, when it is monitored by the monitoring mechanism that the heat generation of the server is greater than or equal to the heat generation threshold, execute the second cooling mode: the monitoring mechanism controls the liquid power source and the gas power source to operate simultaneously. The liquid power source drives the liquid flow to first flow upward along the main body of the first flow path and then downward along the main body of the second flow path to take away the heat transferred from the server to the heat exchange cover. The gas power source drives the gas flow to flow upward along the main body of the second flow path to form a convection with the liquid flow and cool the liquid flow and promote the evaporation of the liquid flow at the same time, strengthening the cooling effect on the server.

[0065] The dual-mode heat dissipation method of the present application can constitute a dynamic dual-mode heat dissipation mechanism for an adaptive, high-efficiency, and low-power server, which can adapt to the load changes of the server and enable the server to operate stably.

[0066] The above has introduced in detail a dual-mode heat dissipation device and a heat dissipation method provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art of this technology, without departing from the principle of the present application, several improvements and modifications can still be made to the present application, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. A dual-mode heat dissipation device, characterized in that, Comprising: A housing (1) formed with an insertion opening (11) for the heat dissipating component; A heat exchange cover (2) disposed within the housing (1), and a sealed liquid flow channel (5) is formed between the side wall of the heat exchange cover (2) and the inner wall of the housing (1). An accommodation groove (21) for the heat dissipating component is formed on the heat exchange cover (2), and the accommodation groove (21) corresponds to the insertion opening (11); A partition member (3) that divides the liquid flow channel (5) into a first flow channel (51) and a second flow channel (52), and the second end of the first flow channel (51) is connected to the first end of the second flow channel (52). The liquid flows in opposite directions in the first flow channel (51) and the second flow channel (52); A power source (4) including a liquid power source (41) and a gas power source (42). The liquid power source (41) is connected to the first end of the first flow channel (51), and the gas power source (42) is connected to the second end of the second flow channel (52) and is used to convey air flow into the second flow channel (52). The air flow direction in the second flow channel (52) is opposite to the liquid flow direction.

2. The dual-mode heat dissipation device according to claim 1, wherein A plurality of the heat exchange covers (2) are arranged at intervals in a first direction. The first flow channel (51) and the second flow channel (52) respectively include a plurality of main flow channels (53) and connecting flow channels (54) distributed at intervals, and the connecting flow channels (54) are formed between adjacent heat exchange covers (2); The first end of the heat exchange cover (2) in a second direction abuts against the inner wall of the housing (1), and the main flow channel (53) is formed between the second end of the heat exchange cover (2) in the second direction and the inner wall of the housing (1). The main flow channels (53) corresponding to adjacent heat exchange covers (2) are connected through the corresponding connecting flow channels (54); The liquid flow direction in the main flow channel (53) is along the first direction, the first direction is along the height direction of the housing (1), the liquid flow direction in the connecting flow channel (54) is along the second direction, and the second direction is along the length direction of the housing (1).

3. The dual-mode heat dissipation device according to claim 2, wherein The partition member (3) includes: A first partition portion (31) that separates the main flow channels (53) corresponding to the first flow channel (51) and the second flow channel (52) and abuts against the heat exchange cover (2) and the housing (1); A second partition portion (32) that separates the connecting flow channels (54) corresponding to the first flow channel (51) and the second flow channel (52) and abuts against the heat exchange cover (2); Adjacent first partition portions (31) are connected through the corresponding second partition portions (32).

4. The dual-mode heat dissipation device according to claim 3, wherein The first flow channel (51) and the second flow channel (52) also respectively include edge flow channels (55), and the edge flow channels (55) are formed between the side wall of the heat exchange cover (2) facing away from the connecting flow channel (54) and the inner wall of the end of the housing (1). The second end of the first flow channel (51) and the first end of the second flow channel (52) are located in the edge flow channels (55); The separator (3) further includes a third separation part (33), and the third separation part (33) separates the edge flow channels (55) corresponding to the first flow channel (51) and the second flow channel (52) and abuts against the heat exchange cover (2) and the housing (1); The third separation part (33) includes a connecting part (331) and a communicating part (332). The second end of the connecting part (331) is connected to the first separation part (31), the first end is connected to the communicating part (332), the connecting part (331) extends along the second direction, a communicating groove (333) is formed in the communicating part (332), and one end of the communicating groove (333) is connected to the second end of the first flow channel (51); A notch (334) communicating with the communicating groove (333) is formed on the side wall of the communicating part (332). The notch (334), the communicating groove (333) and the communicating part (332) all extend along the third direction, and the third direction is along the width direction of the housing (1). The notch (334) is connected to the first end of the second flow channel (52). A diversion groove (26) is formed on the side wall of the heat exchange cover (2) corresponding to the second flow channel (52). The diversion groove (26) extends along the second direction and communicates with the communicating groove (333), the notch (334), the edge flow channel (55), the main flow channel (53) and the connecting flow channel (54) of the second flow channel (52); 5. The dual-mode heat dissipation device according to claim 1, wherein, It further includes a monitoring mechanism, which monitors the heat generation amount of the heat dissipation part, and the monitoring mechanism is connected to and controls the liquid power source (41) and the gas power source (42); 6. The dual-mode heat dissipation device according to claim 1, characterized in that, It further includes an air outlet mechanism (6). An air flow port (151) for air flow to pass through is formed on the side wall of the housing (1) far away from the gas power source (42). The air outlet mechanism (6) includes a covering part (61). When there is no air flow at the air flow port (151), the covering part (61) covers the air flow port (151). When the air flow reaches the air flow port (151), the air flow blows the covering part (61) away from the air flow port (151); 7. The dual-mode heat dissipation device according to claim 1, characterized in that, It further includes: A liquid storage cavity (121) is formed between the inner wall of the heat exchange cover (2) and the housing (1). The second end of the second flow channel (52) and the liquid power source (41) are located in the liquid storage cavity (121); A liquid level detection mechanism (7) is arranged in the liquid storage cavity (121); A water source is connected to the liquid storage cavity (121); A water inlet control part is connected to the liquid level detection mechanism (7) and the water source. When the liquid level detection mechanism (7) detects that the liquid level in the liquid storage cavity (121) is too low, the water inlet control part controls the water source to supply water to the liquid storage cavity (121); 8. The dual-mode heat dissipation device according to claim 7, wherein, The liquid level detection mechanism (7) includes: A floating part (71) is movably arranged along the liquid level height direction; The telescopic member (72) has a telescopic direction along the liquid level height direction, and its second end is fixedly connected to the floating member (71), and the first end is fixedly connected to the housing (1). The detecting member is used to detect the position of the floating member (71) along the liquid level height direction and is connected to the water inlet control member.

9. The dual-mode heat dissipation device according to claim 8, wherein The floating member (71) is formed with a connected air inlet (711), an air inlet chamber (712) and an air outlet (713). The air outlet (713) is located above the liquid level. A ventilation channel is formed in the telescopic member (72). The second end of the ventilation channel is connected to the gas power source (42), and the first end is connected to the air inlet (711).

10. A heat dissipation method applied to the dual-mode heat dissipation device according to any one of claims 1-9, characterized in that, Comprising the following steps: Place the component to be cooled through the insertion port (11) into the placement groove (21) of the heat exchange cover (2). When the heat generation amount of the component to be cooled is less than the heat generation amount threshold, the first heat dissipation mode is executed: the liquid power source (41) operates alone and drives the liquid flow to flow along the first flow channel (51) first and then along the second flow channel (52) to take away the heat transferred from the component to be cooled to the heat exchange cover (2), wherein the liquid flows in the first flow channel (51) and the second flow channel (52) in opposite directions. When the heat generation amount of the component to be cooled is greater than or equal to the heat generation amount threshold, the second heat dissipation mode is executed: while the first heat dissipation mode is executed, the gas power source (42) operates. The gas power source (42) drives the air flow to flow along the second flow channel (52) to dissipate heat from the liquid flow and promote evaporation of the liquid flow at the same time, wherein the air flow in the second flow channel (52) flows in the opposite direction to the liquid flow.

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