Processing carrier plate module, CSP lamp bead processing method and LED light-emitting device

Abstract

The invention relates to the technical field of LED manufacturing auxiliary tools, in particular to a processing carrier plate module, a CSP lamp bead processing method and an LED light-emitting device. The processing support plate module comprises a support plate, the support plate is provided with a plurality of die bonding positions used for fixing LED chips, and the periphery of each die bonding position is provided with at least two leakage holes; the negative pressure mechanism is arranged below the carrier plate; when the protective glue is sprayed, part of the protective glue located above the leakage hole is leaked from the leakage hole, and the protective glue wrapping the fluorescent glue forms a wrapping body under the tension of the protective glue. According to the invention, by arranging the processing carrier plate module, the forming shape of the protection glue can be improved and the LED light-emitting projection efficiency can be improved when CSP lamp bead processing is carried out.

Description

Technical Field

[0001] The present invention relates to the technical field of LED manufacturing auxiliary tools, and particularly to a processing carrier module, a CSP lamp bead processing method, and an LED lighting device. Background Art

[0002] Currently, when manufacturing CSP lamp beads on a large-sized FPC (Flexible Printed Circuit Board), it is necessary to perform operations of spraying phosphor and protective glue in sequence. As Figure 5 shown, an LED chip is fixed on the FPC5, and then phosphor and protective glue are sprayed; the protective glue is transparent silica gel. Due to the insufficient operation accuracy of the dispensing machine or the spraying machine, when spraying phosphor or protective glue, it cannot be accurately sprayed onto the exact center of the light-emitting chip, resulting in inconsistent projection ranges of the CSP lamp beads on the flexible circuit board and different color temperatures projected by the CSP lamp beads after production. When applied to lighting devices with requirements for color temperature, the yield is low.

[0003] To improve the color temperature consistency of CSP lamp beads on the FPC, currently, CSP lamp beads are manufactured separately and then soldered to the FPC in the form of a patch. However, during the process of manufacturing CSP lamp beads, the LED chip needs to be fixed on the carrier plate, and then phosphor and protective glue are sprayed on it in sequence; after spraying the protective glue, the light emitted by the LED chip passes through the phosphor and the protective glue in sequence. It is found through detection that the shape of the protective glue after molding has poor light transmittance performance, as Figure 9 shown; resulting in low light utilization rate of the LED chip. Summary of the Invention

[0004] The purpose of the present invention is to provide a processing carrier module, a CSP lamp bead processing method, and an LED lighting device in view of the deficiencies of the prior art.

[0005] In one aspect of the present invention, a processing carrier module is provided, which can improve the shape and size of the formed protective glue, enhance the light transmittance, and the light utilization rate of the LED.

[0006] In the second aspect of the present invention, a CSP lamp bead processing method is provided. In the process of spraying the protective glue, the above-mentioned processing carrier module is applied to improve the light extraction efficiency of the CSP lamp beads.

[0007] In one aspect of the present invention, an LED lighting device is provided. By screening the above-mentioned CSP lamp beads, the color temperature of the light emission can be made consistent.

[0008] A processing carrier module, which includes: a carrier board, the carrier board is provided with a plurality of die bonding positions for fixing LED chips, and at least two leakage holes are provided around the die bonding positions; it also includes a negative pressure mechanism arranged below the carrier board; when spraying the protective glue, part of the protective glue above the leakage holes leaks from the leakage holes, and the protective glue covering the phosphor glue forms a covering body under its own tension.

[0009] Further, the number of leakage holes can be 3, 4, 5 or 6; the shape of the leakage holes can be L-shaped, cross-shaped, arc-shaped, etc.

[0010] Further, the carrier board is connected with a temperature adjustment component for adjusting the temperature of the carrier board.

[0011] Further, the temperature adjustment component includes a number of heat conducting rods or heat conducting tubes, and a groove is provided on the lower end surface of the carrier board, and the groove abuts against the upper ends of the heat conducting rods or heat conducting tubes.

[0012] Further, the carrier board is connected with a temperature measuring unit, and the temperature adjustment component is connected with a temperature control module.

[0013] Further, the temperature adjustment component includes a number of heat conducting rods or heat conducting tubes, and a number of heat dissipation plates are connected to the lower end of the carrier board, and the heat dissipation plates are provided with through holes adapted to the heat conducting rods or heat conducting tubes.

[0014] Further, a plurality of mounting holes are provided in the middle of the carrier board, an annular counterbore is formed on the side surface of the mounting hole, the mounting hole is connected with a fixing plate, a protrusion is provided in the middle of the lower end surface of the fixing plate, the outer side of the fixing plate is inserted into the counterbore, the protrusion is inserted into the mounting hole, the middle of the fixing plate forms the die bonding position, and the leakage holes are arranged on the fixing plate.

[0015] Further, the processing carrier module further includes a box body with an open upper end, the box body forms an accommodation space, the carrier board is detachably connected above the box body, the side surface or the bottom surface of the box body is open and connected with the negative pressure mechanism, and the side surface of the box body is provided with through holes and is connected with the root heat conducting rod or heat conducting tube.

[0016] A CSP lamp bead processing method, which includes the following steps: Die bonding, uniformly fixing a plurality of LED chips on the carrier board in the above-mentioned processing carrier module; Spraying phosphor powder, forming a layer of phosphor glue on the LED chips, and the phosphor glue wraps the LED chips; Spraying protective glue, spraying the protective glue on the surface of the phosphor glue, and part of the protective glue flows out from the leakage holes on the carrier board before solidifying, and the protective glue covers the phosphor glue and forms LED lamp beads; Unloading, unloading the LED lamp beads from the carrier board and forming CSP lamp beads.

[0017] An LED lighting device, which includes an FPC, on which a plurality of SMD patches are provided, and CSP lamp beads are soldered to the SMDs.

[0018] Advantages of the present invention: By providing a processing carrier board module, when processing CSP lamp beads, the forming shape of the protective glue can be improved, and the LED lighting projection efficiency can be increased. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of a processing carrier board module of this embodiment.

[0020] Figure 2 It is a second schematic structural diagram of a processing carrier board module of this embodiment.

[0021] Figure 3 It is a schematic diagram of another perspective of the fixing plate.

[0022] Figure 4 For Figure 2 a schematic exploded structural diagram.

[0023] Figure 5 It is a schematic diagram of forming LED lamp beads on an FPC in the prior art.

[0024] Figure 6 It is a schematic diagram of the first step of manufacturing CSP lamp beads.

[0025] Figure 7 It is a schematic diagram of the second step of manufacturing CSP lamp beads.

[0026] Figure 8 It is a schematic diagram of the third step of manufacturing CSP lamp beads.

[0027] Figure 9 It is a schematic diagram of spraying protective glue when manufacturing CSP lamp beads using a non-leaking hole carrier board.

[0028] Figure 10 It is a schematic diagram of spraying protective glue when manufacturing CSP lamp beads using a non-leaking hole carrier board.

[0029] Reference numerals include: 1 - protective glue; 2 - fluorescent glue; 3 - LED chip; 4 - pad; 5 - FPC; 6 - carrier board; 7 - transfer film; 8 - SMD patch; 9 - leak hole; 10 - box body; 11 - air extraction hole; 12 - counterbore; 13 - fixing plate; 14 - heat conduction tube; 15 - groove; 16 - mounting hole. Detailed Embodiments

[0030] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0031] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0032] It should be understood that the orientation or positional relationship indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0033] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, "a plurality of" means two or more, unless otherwise specifically defined.

[0034] The present invention will be described in detail below with reference to the accompanying drawings. As Figures 1 to 10 shown.

[0035] Embodiment 1: Refer to Figures 1 to 4 , a processing carrier module, which includes: a carrier 6, the carrier 6 is provided with a plurality of die bonding positions for fixing LED chips 3, and at least 2 leakage holes 9 are provided around the die bonding positions; it also includes a negative pressure mechanism disposed below the carrier 6; when spraying the protective glue 1, a part of the protective glue 1 above the leakage hole 9 leaks out from the leakage hole 9, and after the protective glue 1 covering the phosphor glue 2 solidifies, a coating body is formed; refer to Figure 10 .

[0036] In the prior art, when spraying the phosphor glue 2 on the LED chip 3 and then spraying the protective glue 1, since the protective glue 1 needs to cover the phosphor glue 2, generally a large-area spraying method is adopted, such as Figure 8; The protective glue 1 is also sprayed in the area between adjacent LED chips 3, causing the protective glue 1 to form a trough in this area. Due to the van der Waals force of the liquid itself, the glue of the protective glue 1 in the trough area has an adsorption force on the protective glue 1 in the covering area. As a result, when the protective glue 1 in the covering area condenses from a liquid into a solid state, the surface curvature of the protective glue 1 is relatively smooth, and the transition from the peak area to the trough area of the protective glue 1 is a curve, and the surface tension reaches an optimal value; in this way, when the LED chip emits light, when the light is projected onto this surface, the light-emitting angle is relatively large. Even if the angle between the light and the surface is small, most of the light is reflected or refracted, and the utilization rate of the light is relatively low.

[0037] When using Figure 10 structural carrier 6, before the liquid glue of the protective glue 1 in the trough area solidifies, it will pass through the leakage holes 9 under its own gravity, especially quickly under the adsorption of the negative pressure mechanism. The negative pressure mechanism can be a vacuum pumping device or others. This makes the liquid glue in the covering area basically have no trough area, and at the same time, the glue of the protective glue 6 opposite to each LED chip is relatively independent and will not be pulled by the glue molecules of the protective glue 1 in other areas. The surface of the protective glue 6 roughly forms a spherical surface, and the angle between this surface and the light emitted by the LED chip is relatively large, and most of the light will be transmitted vertically or approximately vertically. See Figure 10 .

[0038] In specific settings, the number of leakage holes 9 can be 3, 4, 5 or 6; the shape of the leakage holes 9 can be L-shaped, cross-shaped, arc-shaped, etc.

[0039] The number of leakage holes 9 is related to the total length of the leakage holes 9 accounting for the area of the projection of the protective glue 6 on the carrier 6. When the length of the leakage holes 9 is relatively long, the number of leakage holes 9 can be relatively small; vice versa. The shape of the leakage holes 9 can be set according to... The shape of the leakage holes has little influence on the shape of the solidified protective glue 6.

[0040] See Figure 1 、 Figure 2 Figure 4 And Figure 4 the carrier 6 is connected with a temperature adjustment component for adjusting the temperature of the carrier 6.

[0041] By setting the temperature adjustment component, the temperature of the carrier 6 can be adjusted. The shape of the protective glue 1 is related to the tension of the liquid molecules, and at the same time, this tension is related to the temperature. Therefore, the shape of the formed protective glue 1 is related to the tension. Different tensions will form different shapes of the protective glue 1. By adjusting the temperature, a better shape of the protective glue 1 can be formed, which has a better transmission surface and improves the light extraction efficiency.

[0042] Secondly, when applying the protective glue 1, the protective glue 1 covers the surface of the fluorescent glue 2, which will increase the temperature of the fluorescent glue 2 and cause it to expand, resulting in deformation of the LED chip. When fixing the CSP lamp bead to the FPC, there is a possibility of poor connection between the LED chip light source and the pad 4 on the FPC circuit board, causing product failure. Therefore, this phenomenon can be avoided by adjusting the temperature. Temperature adjustment not only includes high-temperature adjustment but also low-temperature adjustment. By setting up a temperature adjustment component, the fluorescent glue 2 can be kept at a relatively high temperature all the time. After the protective glue 1 is sprayed, they cool down together, avoiding the fluorescent glue 2 from solidifying first and then being heated and expanded by the protective glue 1, which may damage the LED chip. This reduces the expansion process. The protective glue 1 can be silicone, etc., and forms a transparent layer after solidification.

[0043] Preferably, the carrier board 6 is connected with a temperature measuring unit, and the temperature adjustment component is connected with a temperature control module. The temperature measuring unit can be a thermocouple, etc., and the temperature control module can be a control center, a processor, etc. The temperature of the carrier board 6 is obtained through the temperature measuring unit. The temperature control module is connected with the temperature adjustment component to control the temperature adjustment component to heat up or cool down the carrier board. Generally speaking, it is mainly for cooling.

[0044] See Figures 1 to 4 , the temperature adjustment component includes a number of heat conduction rods or heat conduction tubes 14, and a groove 15 is provided on the lower end surface of the carrier board 6, and the groove 15 abuts against the upper ends of the heat conduction rods or heat conduction tubes 14.

[0045] As a deformation of another structure, the temperature adjustment component includes a number of heat conduction rods or heat conduction tubes 14, and a number of heat dissipation plates are connected to the lower end of the carrier board 6, and the heat dissipation plates are provided with through holes adapted to the heat conduction rods or heat conduction tubes 14.

[0046] Heat transfer is carried out by using heat conduction rods, heat conduction tubes 14, etc. for temperature adjustment. For example, the heat conduction rod is connected with a temperature heating device, and the heat conduction tube 14 is connected with a constant temperature fluid supply device. Of course, the heat conduction rod can also be connected with a cooling device for cooling. The carrier board 6 is preferably made of a metal plate, such as a steel plate, etc.

[0047] See Figure 3 , Figure 4 , a plurality of mounting holes 16 are provided in the middle of the carrier board 6, an annular counterbore 12 is formed on the side of the mounting hole 16, the mounting hole 16 is connected with a fixing plate 13, a protrusion is provided in the middle of the lower end surface of the fixing plate 13, the outer side of the fixing plate 13 is inserted into the counterbore 12, the protrusion is inserted into the mounting hole 16, the middle of the fixing plate 13 forms the die bonding position, and the leakage hole 9 is arranged on the fixing plate 13.

[0048] See Figure 3 , Figure 4The processing carrier 6 module also includes a box body 10 with an open upper end, the box body 10 forms a accommodating space, the top of the box body 10 is detachably connected to the carrier plate 6, the side or bottom of the box body 10 is open and connected to the negative pressure mechanism, and the side of the box body 10 is provided with a perforation and connected to the root heat-conducting rod or heat-conducting pipe 14.

[0049] A plurality of LED chip 3 fixing positions are provided on the carrier board 6, so that a plurality of LED chips 3 can be solidified on the carrier board 6, and a plurality of leakage holes 9 are formed around the fixing positions of the LED chips 3. The box body 10 is made of a heat-conducting material, preferably a metal material; the carrier board 6 covers the box body 10 to form an end cover, and the carrier board 6 is connected to the box body 10 in a cooperative manner; specifically, it can be adopted that: the upper end of the box body 10 forms a rectangular frame, and the rectangular frame abuts the end cover; of course, the upper end of the box body 10 can also form a frame of various shapes such as a square frame and an elliptical frame; due to process problems, it is difficult to form a seal between the rectangular frame and the end cover in this way, that is, the sealing performance is poor; for this reason, in this embodiment, an inner annular groove is provided on the upper end surface of the rectangular frame, the inner annular groove is adapted to the carrier board 6, and the carrier board 6 is snapped into the inner annular groove, and the contact cross-section of the carrier board 6 and the box body 10 is L-shaped or Z-shaped, which can effectively improve the sealing performance; when the negative pressure mechanism evacuates the inside of the box body 10, part of the protective glue 1 can be quickly drawn away through the leakage hole 9.

[0050] Taking into account the effect of temperature on molecular tension, which in turn affects the shape of the protective glue 1, it is necessary to adjust the temperature to obtain a more suitable shape of the protective glue 1; when adjusting, a number of heat-conducting rods and heat-conducting pipes 14 are connected to the side of the box body 10, and the heat-conducting rods or heat-conducting pipes 14 cross the interior of the box body 10. The heat-conducting rods or heat-conducting pipes 14 release heat, and the carrier plate 6 obtains heat and reaches a predetermined temperature. When the heat-conducting rod can be connected to a heat transfer structure, the heat transfer structure can be a heater, and the heater heats the end of the heat-conducting rod. The heat-conducting rod itself can also be a heating unit, such as if the heat-conducting rod is a heating resistor, which is directly energized to generate heat. The heat-conducting pipe 14 can be connected to a structure for transporting a heat flow medium, such as a constant temperature heating structure that provides hot water or hot oil. The heat flow medium circulates through the heat-conducting pipe 14, and the temperature of the heat flow medium is maintained under a small temperature fluctuation, such as a fluctuation of 0.1-0.5 degrees, basically maintaining a constant temperature. A heat conducting rod or heat conducting tube 14 extends out of the box body 10 . An air extraction hole 11 is provided on the side of the box body 10 . The air extraction hole 11 is connected to the negative pressure mechanism through a pipeline.

[0051] Example 2: A CSP lamp bead processing method comprising the following steps: Solid crystal, multiple LED chips 3 are evenly fixed on the carrier 6 in the processing carrier 6 module; see Figure 6 ; Preferably, a flexible pyrolytic film is provided on the carrier plate 6; Spray phosphor powder to form a layer of phosphor glue 2 on the LED chip 3, and the phosphor glue 2 wraps the LED chip 3; see Figure 7 ; Spray protective glue 1, spray the protective glue 1 on the surface of the phosphor glue 2, and part of the protective glue 1 flows out from the leakage hole 9 on the carrier plate 6 before solidifying. The protective glue 1 coats the phosphor glue 2 to form an LED lamp bead; see Figure 6 、 Figure 10 ; Unload the materials, unload the LED lamp beads from the carrier plate 6 to form CSP lamp beads. When unloading the materials, the temperature control module can be externally connected to the processing carrier plate module to heat the carrier plate, and the flexible thermal decomposition film is thermally decomposed to prevent the LED chip from sticking to the carrier plate, which is inconvenient for unloading.

[0052] Embodiment 3: An LED lighting device, which includes an FPC 5, and a plurality of SMD patches 8 are provided on the FPC 5, and the CSP lamp beads are welded to the SMD.

[0053] Before welding the CSP lamp beads, color temperature screening can be performed, and CSP lamp beads within a certain range can be selected to make the lighting device have color temperature consistency.

[0054] The above content is only the preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. The content of this specification should not be construed as a limitation to the present invention.

Claims

1. A processing carrier module, characterized in that: It includes: A carrier board, which is provided with a plurality of die bonding positions for fixing LED chips, and at least two leakage holes are arranged around the die bonding positions; it also includes a negative pressure mechanism arranged below the carrier board; When spraying the protective glue, part of the protective glue above the leakage holes leaks from the leakage holes, and the protective glue covering the phosphor glue forms a covering body under its own tension.

2. The processing carrier module according to claim 1, wherein: The carrier board is connected with a temperature adjustment component for adjusting the temperature of the carrier board.

3. The processing carrier module according to claim 2, wherein: The temperature adjustment component includes a number of heat conduction rods or heat conduction tubes, and a groove is provided on the lower end surface of the carrier board, and the groove abuts against the upper ends of the heat conduction rods or heat conduction tubes.

4. The processing carrier module according to claim 2, wherein: The temperature adjustment component includes a number of heat conduction rods or heat conduction tubes, and a number of heat dissipation plates are connected to the lower end of the carrier board, and the heat dissipation plates are provided with through holes adapted to the heat conduction rods or heat conduction tubes.

5. The processing carrier board module according to claim 4, wherein: The carrier board is connected with a temperature measurement unit, and the temperature adjustment component is connected with a temperature control module.

6. The processing carrier module according to claim 1, wherein: A plurality of mounting holes are provided in the middle of the carrier board, an annular counterbore is formed on the side surface of the mounting hole, the mounting hole is connected with a fixing plate, a protrusion is provided in the middle of the lower end surface of the fixing plate, the outer side of the fixing plate is inserted into the counterbore, the protrusion is inserted into the mounting hole, the middle of the fixing plate forms the die bonding position, and the leakage holes are arranged on the fixing plate.

7. The processing carrier plate module according to claim 4, wherein: The processing carrier board module further includes a box body with an open upper end, the box body forms an accommodating space, the carrier board is detachably connected above the box body, the side surface or the bottom surface of the box body is open and connected to the negative pressure mechanism, and the side surface of the box body is provided with through holes and is connected to the root heat conduction rod or heat conduction tube.

8. A method for processing CSP lamp beads, characterized in that: It includes the following steps: [[ID=ID=10]]Die bonding, uniformly fixing a plurality of LED chips on the carrier board in the processing carrier board module according to any one of claims 1 to 7; Spraying phosphor powder, forming a layer of phosphor glue on the LED chips, and the phosphor glue wraps the LED chips; Spraying protective glue, spraying the protective glue on the surface of the phosphor glue, and part of the protective glue flows out of the leakage holes on the carrier board before solidifying, and the protective glue covers the phosphor glue and forms an LED lamp bead; Unloading, unloading the LED lamp beads from the carrier board and forming CSP lamp beads.

9. An LED lighting device, which includes an FPC, and a plurality of SMD patches are arranged on the FPC, characterized in that: The CSP lamp beads according to claim 8 are soldered to the SMD.

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