Vacuum adsorption head of LED die bonder and LED die bonder

Abstract

The present invention discloses a vacuum adsorption head of an LED crystal bonding machine and an LED crystal bonding machine, belonging to the technical field of crystal bonding machines. The vacuum adsorption head of the LED crystal bonding machine includes: a bracket, a suction nozzle, a material picking pipeline and a fixed pipeline. The bracket is connected to a robotic arm and moves synchronously with the robotic arm; the suction nozzle is detachably connected to the bracket, and the suction nozzle includes a nozzle body and a material suction tube, and the material suction tube is fixedly installed on the nozzle body; the material picking pipeline is installed on the bracket, one end of the material picking pipeline is connected to the material suction tube, and the other end is connected to the suction end of a vacuum pump, and the material suction tube sucks LED chips through the vacuum suction provided by the material picking pipeline; the fixed pipeline is installed on the bracket, one end of the fixed pipeline is connected to the nozzle body, and the other end is connected to the suction end of a vacuum pump, and the vacuum suction of the fixed pipeline attracts the nozzle body to fit the bracket. According to the present application, when the vacuum of the crystal bonding machine is interrupted, the connection between the suction nozzle and the bracket can be maintained, thereby preventing the suction nozzle from falling.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonding machines, and more particularly to a vacuum adsorption head of an LED die bonding machine and the LED die bonding machine. Background Art

[0002] LED die bonders are key equipment used in LED product packaging. They pick up LED chips from wafers and place them precisely on substrates, and then achieve electrical and mechanical connections through conductive glue or solder.

[0003] Among them, the component for picking up LED chips is called a vacuum adsorption head, which is roughly composed of a bracket, a vacuum pipeline and a suction nozzle. The vacuum pipeline is fixedly installed in the bracket, and the suction nozzle is set at the end of the bracket and connected to the bracket through the vacuum suction in the vacuum pipeline. It has a simple structure and is therefore widely used.

[0004] Moreover, during the operation of the LED die bonder, a variety of different LED chips are generally used. These chips are equipped with special nozzles due to their different shapes. When different LED chips need to be picked up, the corresponding nozzle only needs to be connected to the bracket. When these nozzles are replaced, most of them are done by breaking the vacuum line, then removing the installed nozzle, and then aligning the nozzle to be replaced with the bracket and reconnecting the vacuum to complete the replacement. It has the advantages of simple operation and easy control.

[0005] However, the above-mentioned vacuum adsorption head still has certain defects, namely:

[0006] When the equipment fails or stops suddenly, its vacuum system will also stop running synchronously. In this way, the suction nozzle connected to the bracket will fall due to the loss of vacuum, which increases the difficulty of resetting the machine. If the fallen suction nozzle is stuck in the moving parts inside the machine, it may also cause damage to the equipment. Summary of the Invention

[0007] In order to overcome the above-mentioned defects of the prior art, the present invention provides a vacuum adsorption head of an LED die-bonding machine and an LED die-bonding machine to solve the problems existing in the above-mentioned background technology.

[0008] The present invention provides the following technical solution: a vacuum adsorption head of an LED die bonder, which can be installed on the main body of the LED die bonder, wherein the main body of the LED die bonder includes a robotic arm and a vacuum pump, and the vacuum adsorption head of the LED die bonder includes:

[0009] a bracket, which is connected to the robotic arm and moves synchronously with the robotic arm;

[0010] A suction nozzle, which is detachably connected to the bracket, comprises a nozzle body and a suction pipe, wherein the suction pipe is fixedly mounted on the nozzle body;

[0011] The material picking pipeline is installed on the bracket, one end of the material picking pipeline is connected to the material suction pipe, and the other end is connected to the suction end of the vacuum pump, and the material suction pipe sucks the LED chip through the vacuum suction provided by the material picking pipeline;

[0012] A fixed pipeline is installed on the bracket, one end of the fixed pipeline is connected to the nozzle body, and the other end is connected to the suction end of the vacuum pump, and the vacuum suction force of the fixed pipeline attracts the nozzle body to fit with the bracket;

[0013] After the vacuum suction of the fixed pipeline attracts the nozzle body to fit the bracket, the nozzle is set so that when the vacuum pump stops, the nozzle and the bracket remain in contact, and the outlet of the picking pipeline on the bracket is aligned with the suction pipe and connected.

[0014] Furthermore, a first limit frame is fixedly installed at the end of the bracket close to the suction nozzle, and a second limit frame is fixedly installed on the suction nozzle. When the suction nozzle is in contact with the bracket, the second limit frame frames the first limit frame and enables the suction nozzle to move only in the direction away from the bracket. At the same time, the contact surface between the first limit frame and the second limit frame is a wedge-shaped surface.

[0015] Furthermore, the fixed pipeline is equipped with a limit rod, which is rotatably installed in the middle of the fixed pipeline. A limit protrusion is provided on the surface of the suction nozzle, and the limit protrusion is fixedly installed on the suction pipe. When the suction nozzle moves toward the bracket, the limit protrusion will first push the limit rod away from the limit protrusion until the suction nozzle is in contact with the bracket, and the end of the limit rod rotates to the bottom of the limit protrusion and presses against the limit protrusion.

[0016] Furthermore, the limit rod is equipped with a slide, a sleeve, a compression spring, a connecting rod, a first limit ring and a second limit ring. The first limit ring and the second limit ring are both fixedly installed in the fixed pipeline. The slide seal is slidingly installed in the fixed pipeline and is between the first limit ring and the second limit ring. The slide can only slide between the first limit ring and the second limit ring. The sleeve is fixedly connected to the slide, and the compression spring is connected between the second limit ring and the slide. One end of the connecting rod is rotatably connected to the surface of the sleeve, and the other end is rotatably connected to the end of the limit rod away from the limit protrusion.

[0017] Furthermore, a vent hole is provided on the surface of the skateboard, and the vacuum in the fixed pipeline can pass through the middle of the first limiting ring, then through the vent hole, and finally through the middle of the second limiting ring to attract the suction nozzle to fit with the bracket. A sealing cover is rotatably installed on the upper surface of the skateboard, which covers the vent hole when it fits with the surface of the skateboard, and the sealing cover rotates and moves away from the vent hole when subjected to vacuum suction.

[0018] Furthermore, the contact surface between the limiting protrusion and the limiting rod is a conical surface, and the narrow end is away from the bracket. Under the action of the connecting rod, the limiting rod will slide from the narrow end of the conical surface to the wide end when in contact with the limiting protrusion, and make the suction nozzle fit with the bracket.

[0019] Furthermore, the suction tube is installed in the middle of the nozzle body, the outlet of the picking pipeline on the bracket is located in the middle of the end of the bracket, there are two groups of limit rods, and they are symmetrically arranged on both sides of the outlet of the picking pipeline on the bracket. At the same time, when the two limit rods press against the limit protrusion, the limit protrusion drives the suction tube to align with the outlet of the picking pipeline on the bracket and conduct.

[0020] Furthermore, a guide rod is fixedly installed at the end of the limit rod near the limit protrusion, which is away from the end of the limit rod and contacts the limit protrusion. At the same time, the guide rod and the limit rod are arranged at an angle. When the bracket approaches the suction nozzle under the drive of the robotic arm, the limit protrusion contacts the side of the guide rod away from the limit rod, and pushes the limit rod to rotate away from the limit protrusion until the suction nozzle is fitted with the bracket. The limit rod drives the guide rod to contact the limit protrusion again under the action of the connecting rod.

[0021] Furthermore, a plurality of vibration protrusions are provided on the side of the guide rod away from the limiting rod, and when they come into contact with the limiting protrusion, they push the limiting rod to swing back and forth to hit the limiting protrusion. A plurality of vibration depressions are provided on the contact surface between the limiting protrusion and the guide rod, and when they come into contact with the guide rod, they drive the guide rod to swing back and forth to hit the limiting protrusion.

[0022] The present application also provides a die bonding machine, comprising the above-mentioned vacuum adsorption head of the LED die bonding machine, which is used for bonding LED chips.

[0023] The present application sets a fixed pipeline, which can continue to maintain the connection between the suction nozzle and the bracket when the vacuum of the crystal bonding machine is interrupted, thereby preventing the suction nozzle from falling, facilitating the subsequent startup and reset of the equipment, and also preventing the suction nozzle from falling into the motion unit of the LED crystal bonding machine and causing damage to the equipment. In addition, in the process of the fixed pipeline limiting the suction nozzle, it will also simultaneously ensure that the suction tube on the suction nozzle and the picking pipeline remain aligned and conductive, which will effectively ensure the suction stability of the suction nozzle, so that the suction nozzle can automatically return to the center when it is offset. In addition, in the fixed pipeline, the guide rod that limits the suction nozzle from falling will also knock on the suction nozzle to make it vibrate during the installation process of the suction nozzle, which can allow the suction nozzle to shake off the dirt stuck on its surface, thereby ensuring the suction stability of the suction nozzle. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the split structure of the present invention;

[0026] Figure 3 Schematic diagram of the internal structure of the present invention;

[0027] Figure 4 For the present invention Figure 3 A in the middle is an enlarged structural diagram;

[0028] Figure 5 For the present invention Figure 4 The enlarged structural diagram at B in the middle;

[0029] Figure 6 For the present invention Figure 4 Enlarged structural diagram at point C in the middle.

[0030] The accompanying drawings are:

[0031] 100. Bracket; 110. First limiting frame;

[0032] 200, suction nozzle; 210, nozzle body; 220, suction tube; 230, second limiting frame; 240, limiting protrusion; 241, vibration depression;

[0033] 300, material picking pipeline;

[0034] 400, fixed pipeline; 410, limit rod; 411, guide rod; 412, vibration protrusion; 420, slide plate; 430, sliding sleeve; 440, compression spring; 450, connecting rod; 460, first limit ring; 470, second limit ring; 480, vent; 490, sealing cover. DETAILED DESCRIPTION

[0035] The technical solutions of the present invention will be clearly and completely described below in conjunction with the drawings in the present invention. In addition, the forms of the various structures described in the following embodiments are merely examples and are not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0036] Reference Figure 1 、 Figure 2 and Figure 3The present invention provides a vacuum adsorption head of an LED crystal bonding machine, which can be installed on the main body of the LED crystal bonding machine. The main body of the LED crystal bonding machine includes a robotic arm and a vacuum pump. The vacuum adsorption head of the LED crystal bonding machine includes: a bracket 100, a suction nozzle 200, a material picking pipeline 300 and a fixed pipeline 400. The bracket 100 is connected to the robotic arm and moves synchronously with the robotic arm; the suction nozzle 200 is detachably connected to the bracket 100, and the suction nozzle 200 includes a nozzle body 210 and a material suction pipe 220, and the material suction pipe 220 is fixedly installed on the nozzle body 210; the material picking pipeline 300 is installed on the bracket 100, and one end of the material picking pipeline 300 is connected to the material suction pipe 220. The other end is connected to the suction end of the vacuum pump, and the suction pipe 220 sucks the LED chip through the vacuum suction provided by the picking pipe 300; the fixed pipe 400 is installed on the bracket 100, one end of the fixed pipe 400 is connected to the nozzle body 210, and the other end is connected to the suction end of the vacuum pump, and the vacuum suction of the fixed pipe 400 attracts the nozzle body 210 to fit with the bracket 100; after the vacuum suction of the fixed pipe 400 attracts the nozzle body 210 to fit with the bracket 100, the suction nozzle 200 is set: when the vacuum pump stops, the suction nozzle 200 remains in contact with the bracket 100, and the outlet of the picking pipe 300 on the bracket 100 is aligned with the suction pipe 220 and connected.

[0037] like Figure 2 As shown, a first limit frame 110 is fixedly installed at the end of the bracket 100 near the suction nozzle 200, and a second limit frame 230 is fixedly installed on the suction nozzle 200. When the suction nozzle 200 is in contact with the bracket 100, the second limit frame 230 frames the first limit frame 110 and enables the suction nozzle 200 to move only in the direction away from the bracket 100. At the same time, the contact surface between the first limit frame 110 and the second limit frame 230 is a wedge-shaped surface.

[0038] like Figure 4 As shown, the fixed pipeline 400 is equipped with a limiting rod 410, which is rotatably installed in the middle of the fixed pipeline 400. The surface of the suction nozzle 200 is provided with a limiting protrusion 240, and the limiting protrusion 240 is fixedly installed on the suction tube 220. When the suction nozzle 200 moves toward the bracket 100, the limiting protrusion 240 will first push the limiting rod 410 away from the limiting protrusion 240 until the suction nozzle 200 is in contact with the bracket 100. The end of the limiting rod 410 rotates to the bottom of the limiting protrusion 240 and presses against the limiting protrusion 240.

[0039] like Figure 4 、 Figure 5 as well as Figure 6As shown, the limit rod 410 is equipped with a slide 420, a sleeve 430, a compression spring 440, a connecting rod 450, a first limit ring 460 and a second limit ring 470. The first limit ring 460 and the second limit ring 470 are both fixedly installed in the fixed pipeline 400. The slide 420 is sealed and slidably installed in the fixed pipeline 400 and is located between the first limit ring 460 and the second limit ring 470. The slide 420 can only slide between the first limit ring 460 and the second limit ring 470. The sleeve 430 is fixedly connected to the slide 420, and the compression spring 440 is connected between the second limit ring 470 and the slide 420. One end of the connecting rod 450 is rotatably connected to the surface of the sleeve 430, and the other end is rotatably connected to the end of the limit rod 410 away from the limit protrusion 240.

[0040] like Figure 5 As shown, a vent hole 480 is provided on the surface of the skateboard 420, and the vacuum in the fixed pipe 400 can pass through the middle of the first limiting ring 460, then pass through the vent hole 480, and finally pass through the middle of the second limiting ring 470 to attract the suction nozzle 200 to fit with the bracket 100. A sealing cover 490 is rotatably installed on the upper surface of the skateboard 420, which covers the vent hole 480 when it fits with the surface of the skateboard 420, and the sealing cover 490 rotates and moves away from the vent hole 480 when subjected to vacuum suction.

[0041] like Figure 6 As shown, a guide rod 411 is fixedly installed at the end of the limit rod 410 near the limit protrusion 240, which is away from the end of the limit rod 410 and in contact with the limit protrusion 240. At the same time, the guide rod 411 and the limit rod 410 are arranged at an angle. When the bracket 100 approaches the suction nozzle 200 under the drive of the robotic arm, the limit protrusion 240 contacts the side of the guide rod 411 away from the limit rod 410, and pushes the limit rod 410 to rotate away from the limit protrusion 240, until the suction nozzle 200 is fitted with the bracket 100, and the limit rod 410 drives the guide rod 411 to contact the limit protrusion 240 again under the action of the connecting rod 450.

[0042] In this way, when using, you only need to fix the bracket 100 to the robotic arm, and then use the robotic arm to drive the bracket 100 to move above the suction nozzle 200, and align the bracket 100 with the suction nozzle 200, and then use the robotic arm to drive the bracket 100 to move downward until the end of the bracket 100 is in contact with the suction nozzle 200, and then start the vacuum pump. At this time, the vacuum suction force of the vacuum pump will be transmitted to the end of the bracket 100 through the fixed pipe 400 to attract the suction nozzle 200 to fit with the bracket 100. In this way, the installation of the suction nozzle 200 and the bracket 100 is completed.

[0043] When the suction nozzle 200 is close to the bracket 100, the suction nozzle 200 will push the guide rod 411 away from the limiting protrusion 240. During this process, the guide rod 411 will drive the sliding sleeve 430 to slide through the limiting rod 410 and the connecting rod 450 to drive the slide plate 420 to slide, and make the slide plate 420 squeeze the compression spring 440 until the suction nozzle 200 is in contact with the bracket 100. The end of the guide rod 411 close to the limiting protrusion 240 will be below the limiting protrusion 240. At this time, the compression spring 440 will rebound and drive the limiting rod 410 to reverse, thereby driving the end of the guide rod 411 to move to resist the limiting protrusion 240. In this way, in the subsequent use, if the vacuum is suddenly interrupted due to the guide rod 41 1 is against the limiting protrusion 240, so the suction nozzle 200 will not fall directly. It is necessary to introduce compressed air into the fixed pipeline 400 to drive the sealing cover 490 to rotate and cover the vent hole 480. At this time, the compressed air will push the slide plate 420 to move downward, and then drive the sliding sleeve 430 to move downward. The sliding sleeve 430 drives the limiting rod 410 to rotate through the connecting rod 450 until the guide rod 411 is separated from the limiting protrusion 240, and then the suction nozzle 200 can be separated from the bracket 100. This will prevent the suction nozzle 200 from falling when the vacuum of the entire LED die bonder suddenly stops, thereby facilitating the subsequent startup and reset of the equipment, and also prevent the suction nozzle 200 from falling into the motion unit of the LED die bonder and causing damage to the equipment.

[0044] It should be noted that in actual use, the fixed pipeline 400 and the material picking pipeline 300 are not only connected to the suction end of the vacuum pump, but also synchronously connected to the compressed air. However, valves are provided in the two pipelines connected to the vacuum pump and compressed air. When vacuum is needed, the valve connected to the vacuum pump is opened to suck the material or the suction nozzle 200. When compressed air is needed, the valve connected to the compressed air is opened to break the vacuum, so as to facilitate the removal of the suction nozzle 200 and the LED chip.

[0045] In addition, when the suction nozzle 200 approaches the bracket 100, the limiting protrusion 240 will first push the guide rod 411 away, and then when the suction nozzle 200 is in contact with the bracket 100, the end of the guide rod 411 will rotate again to the bottom of the limiting protrusion 240 to resist the limiting protrusion 240. In this process, the rotation of the guide rod 411 is the rebound of the compression spring 440, and then is realized by the transmission of the sliding sleeve 430, the connecting rod 450 and the limiting rod 410, which are all rigidly connected. Therefore, the guide rod 411 When the guide rod 1 contacts the bottom of the limiting protrusion 240, it is achieved quickly, which will knock the surface of the limiting protrusion 240. Then the reaction force generated will be fed back to the compression spring 440, and the compression spring 440 will continue to rebound. In this way, the end of the guide rod 411 will continue to knock on the surface of the limiting protrusion 240, which may shake off the dirt stuck on the suction nozzle 200, thereby avoiding the occurrence of unstable material suction by the suction nozzle 200 and effectively ensuring the stable operation of the LED fixing machine.

[0046] like Figure 6 As shown, the contact surface between the limiting protrusion 240 and the limiting rod 410 is a conical surface, and the narrow end is away from the bracket 100. Under the action of the connecting rod 450, the limiting rod 410 will slide from the narrow end of the conical surface to the wide end when in contact with the limiting protrusion 240, and the suction nozzle 200 will fit with the bracket 100.

[0047] like Figure 4 and Figure 6 As shown, the suction tube 220 is installed in the middle of the nozzle body 210, and the outlet of the picking pipe 300 on the bracket 100 is located in the middle of the end of the bracket 100. There are two groups of limiting rods 410, which are symmetrically arranged on both sides of the outlet of the picking pipe 300 on the bracket 100. At the same time, when the two limiting rods 410 press against the limiting protrusion 240, the limiting protrusion 240 drives the suction tube 220 to align with the outlet of the picking pipe 300 on the bracket 100 and conduct.

[0048] In this way, when the limiting rod 410 is against the limiting protrusion 240, since the contact surface between the limiting protrusion 240 and it is a conical surface, it will continue to apply force to the limiting protrusion 240 under the action of the compression spring 440, and since the two sets of limiting rods 410 move synchronously under the action of the compression spring 440, this will enable the suction nozzle 200 to always have a pre-tightening force to fit with the bracket 100, further enhancing the fitting stability of the suction nozzle 200 and the bracket 100. At the same time, it can also ensure that the limiting protrusion 240 is always in the middle of the two limiting rods 410 to align with the outlet of the picking pipe 300 on the bracket 100, so that the vacuum suction force of the picking pipe 300 can stably enter the suction pipe 220 to suck the LED chip.

[0049] In the above solution, although the end of the limiting rod 410 strikes the limiting protrusion 240 to cause the suction nozzle 200 to vibrate, the vibration duration is relatively short and may not be able to shake off the dust adhering to the surface of the suction nozzle 200. In this regard, a more preferred solution is provided below:

[0050] like Figure 6 As shown, a plurality of vibration protrusions 412 are provided on the side of the guide rod 411 away from the limiting rod 410, and when they come into contact with the limiting protrusion 240, they push the limiting rod 410 to swing back and forth to strike the limiting protrusion 240. A plurality of vibration recesses 241 are provided on the contact surface between the limiting protrusion 240 and the guide rod 411, and when they come into contact with the guide rod 411, they drive the guide rod 411 to swing back and forth to strike the limiting protrusion 240.

[0051] In this way, in the process of pushing the guide rod 411 away from itself, the limiting protrusion 240 will continuously slide over the vibration protrusion 412 above the limiting protrusion 240, thereby driving the limiting rod 410 to swing back and forth to continuously squeeze the compression spring 440, thereby increasing the time length of the guide rod 411 hitting the limiting protrusion 240, and when the end of the guide rod 411 is against the conical surface of the limiting protrusion 240, it will also slide over the vibration recess 241, which will also drive the limiting rod 410 to swing back and forth, thereby further increasing the vibration time length, effectively increasing the possibility of shaking off dirt on the surface of the suction nozzle 200, and further improving the stability of the suction nozzle 200 in sucking materials, and due to the short stroke, the frequency of this vibration will also be relatively high, which can also increase the possibility of shaking off dirt on the surface of the suction nozzle 200.

[0052] The present application also provides a die bonding machine, including the vacuum adsorption head of the above-mentioned LED die bonding machine, which is used for bonding LED chips. The use of this die bonding machine can perfectly match the advantages of the above-mentioned vacuum adsorption head.

[0053] Finally, it should be noted that the drawings of the embodiments disclosed herein only relate to structures related to the embodiments disclosed herein. Other structures may refer to conventional designs. The same embodiment and different embodiments of the present invention may be combined with each other without conflict.

[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. The vacuum adsorption head of the LED die bonder can be installed on the main body of the LED die bonder. The main body of the LED die bonder includes a robotic arm and a vacuum pump, and is characterized in that: The vacuum adsorption head of the LED die bonding machine includes: a bracket (100) connected to the robotic arm and moving synchronously with the robotic arm; A suction nozzle (200) is detachably connected to the bracket (100), and the suction nozzle (200) includes a nozzle body (210) and a suction pipe (220), wherein the suction pipe (220) is fixedly mounted on the nozzle body (210); A material picking pipeline (300) is installed on the bracket (100), one end of the material picking pipeline (300) is connected to the material suction pipe (220), and the other end is connected to the suction end of the vacuum pump, and the material suction pipe (220) sucks the LED chip through the vacuum suction provided by the material picking pipeline (300); A fixed pipeline (400) is installed on the bracket (100), one end of the fixed pipeline (400) is connected to the nozzle body (210), and the other end is connected to the suction end of the vacuum pump, and the vacuum suction force of the fixed pipeline (400) draws the nozzle body (210) and the bracket (100) into contact; After the vacuum suction force of the fixed pipeline (400) attracts the nozzle body (210) to fit with the bracket (100), the suction nozzle (200) is configured so that when the vacuum pump stops, the suction nozzle (200) and the bracket (100) remain in contact, and the outlet of the material picking pipeline (300) on the bracket (100) is aligned with the material suction pipe (220) and is connected.

2. The vacuum adsorption head of the LED die bonding machine according to claim 1, characterized in that: A first limiting frame (110) is fixedly mounted on the end of the bracket (100) close to the suction nozzle (200), and a second limiting frame (230) is fixedly mounted on the suction nozzle (200). When the suction nozzle (200) is in contact with the bracket (100), the second limiting frame (230) frames the first limiting frame (110) and enables the suction nozzle (200) to move only in a direction away from the bracket (100), and at the same time, the contact surface between the first limiting frame (110) and the second limiting frame (230) is a wedge-shaped surface.

3. The vacuum adsorption head of the LED die bonding machine according to claim 2, characterized in that: The fixed pipeline (400) is provided with a limiting rod (410), which is rotatably installed in the middle of the fixed pipeline (400). The surface of the suction nozzle (200) is provided with a limiting protrusion (240), and the limiting protrusion (240) is fixedly installed on the suction pipe (220). When the suction nozzle (200) moves toward the bracket (100), the limiting protrusion (240) will first push the limiting rod (410) away from the limiting protrusion (240) until the suction nozzle (200) is in contact with the bracket (100), and the end of the limiting rod (410) rotates to the bottom of the limiting protrusion (240) and presses against the limiting protrusion (240).

4. The vacuum adsorption head of the LED die bonding machine according to claim 3, characterized in that: The limiting rod (410) is equipped with a slide plate (420), a sliding sleeve (430), a compression spring (440), a connecting rod (450), a first limiting ring (460) and a second limiting ring (470). The first limiting ring (460) and the second limiting ring (470) are both fixedly installed in the fixed pipeline (400). The slide plate (420) is sealed and slidably installed in the fixed pipeline (400) and is located between the first limiting ring (460) and the second limiting ring. (470), and the slide plate (420) can only slide between the first limiting ring (460) and the second limiting ring (470), the sliding sleeve (430) is fixedly connected to the slide plate (420), the compression spring (440) is connected between the second limiting ring (470) and the slide plate (420), one end of the connecting rod (450) is rotatably connected to the surface of the sliding sleeve (430), and the other end is rotatably connected to the end of the limiting rod (410) away from the limiting protrusion (240).

5. The vacuum adsorption head of the LED die bonding machine according to claim 4, characterized in that: A vent hole (480) is provided on the surface of the slide plate (420), and the vacuum in the fixed pipe (400) can pass through the middle of the first limiting ring (460), then pass through the vent hole (480), and finally pass through the middle of the second limiting ring (470) to attract the suction nozzle (200) to fit with the bracket (100). A sealing cover (490) is rotatably installed on the upper surface of the slide plate (420), which covers the vent hole (480) when it fits with the surface of the slide plate (420), and the sealing cover (490) rotates and moves away from the vent hole (480) when it is subjected to vacuum suction.

6. The vacuum adsorption head of the LED die bonder according to any one of claims 3 to 5, characterized in that: The contact surface between the limiting protrusion (240) and the limiting rod (410) is a conical surface, and the narrow end is away from the bracket (100). Under the action of the connecting rod (450), the limiting rod (410) contacts the limiting protrusion (240) and slides from the narrow end to the wide end of the conical surface, thereby making the suction nozzle (200) fit with the bracket (100).

7. The vacuum adsorption head of the LED die bonding machine according to claim 6, characterized in that: The suction pipe (220) is installed in the middle of the nozzle body (210), and the outlet of the material picking pipeline (300) on the bracket (100) is located in the middle of the end of the bracket (100). There are two groups of limit rods (410), which are symmetrically arranged on both sides of the outlet of the material picking pipeline (300) on the bracket (100). At the same time, when the two limit rods (410) press against the limit protrusion (240), the limit protrusion (240) drives the suction pipe (220) to align with the outlet of the material picking pipeline (300) on the bracket (100) and conduct.

8. The vacuum adsorption head of the LED die bonding machine according to claim 7, characterized in that: The end of the limiting rod (410) close to the limiting protrusion (240) is fixedly mounted with a guide rod (411), which is away from the end of the limiting rod (410) and contacts the limiting protrusion (240). At the same time, the guide rod (411) and the limiting rod (410) are arranged at an angle. When the bracket (100) approaches the suction nozzle (200) under the drive of the robot arm, the limiting protrusion (240) contacts the side of the guide rod (411) away from the limiting rod (410) and pushes the limiting rod (410) to rotate away from the limiting protrusion (240) until the suction nozzle (200) and the bracket (100) are in contact. Then, the limiting rod (410) drives the guide rod (411) to contact the limiting protrusion (240) again under the action of the connecting rod (450).

9. The vacuum adsorption head of the LED die bonding machine according to claim 8, characterized in that: The guide rod (411) is provided with a plurality of vibration protrusions (412) on a side away from the limiting rod (410), and when the guide rod (411) contacts the limiting protrusion (240), it pushes the limiting rod (410) to swing back and forth to strike the limiting protrusion (240); a plurality of vibration recesses (241) are provided on the contact surface between the limiting protrusion (240) and the guide rod (411), and when the guide rod (411) contacts the limiting protrusion (240), it drives the guide rod (411) to swing back and forth to strike the limiting protrusion (240).

10. A die bonding machine, characterized in that: A vacuum adsorption head comprising the LED die bonding machine according to any one of claims 1 to 9.

Images