Charged particle beam device

Abstract

This charged particle beam device is provided with: a sample chamber in which the interior is in a vacuum state; a stage provided inside the sample chamber and holding a sample; a table driving device for driving the table; a charged particle beam irradiation optical system that irradiates the sample held on the stage with a charged particle beam; a probe that holds a sample piece picked up from the sample by the charged particle beam; and a manipulator for driving the probe, the manipulator being provided with: a gripping mechanism for gripping the probe; and an attachment / detachment drive device for driving the gripping mechanism to attach / detach the probe.

Description

Technical Field

[0001] The present invention relates to charged particle beam devices such as FIB devices and FIB-SEMs. Background Art

[0002] There is known a charged particle beam device that extracts a minute specimen piece, which is processed into a shape suitable for observation with a transmission electron microscope, from a specimen such as a semiconductor wafer. The charged particle beam device irradiates a specimen with a charged particle beam composed of electrons or ions, cuts out a portion of interest for observation to produce a specimen piece, and transfers the specimen to a specimen piece holder. When transferring the specimen piece to the specimen piece holder, the specimen piece is adhered, for example, by a deposition gas to the tip of a probe (also called a detector) mounted on a manipulator, and is transported from the specimen to the specimen piece holder by the manipulator (Patent Document 1, etc.).

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2009-59516 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In order to hold a minute specimen piece, the probe has a thin and sharp tip on the order of μm, and there are cases where it is damaged due to interference with the specimen caused by misoperation, etc. Also, since the specimen piece is generally adhered to the tip of the probe by a deposition gas, there are cases where the tip of the probe is deformed or contaminated during repeated adhesion of the specimen piece. Since it is difficult to repair the tip of an extremely thin and sharp probe, it is necessary to replace the probe that has become contaminated, etc.

[0008] However, during the operation of the charged particle beam device, the specimen chamber using the probe is in a vacuum state. Generally, the charged particle beam device is stopped and the specimen chamber is opened to the atmosphere, and an operator or a worker such as an attendant replaces the probe by manual operation. In this case, the replacement operation not only burdens the worker, but also, after replacing the probe, in order to operate the charged particle beam device, it is necessary to return the specimen chamber to a vacuum state again, which requires a lot of labor and time until restarting the operation, and the operation rate of the charged particle beam device is also reduced.

[0009] An object of the present invention is to provide a charged particle beam device that can reduce the labor and time required for replacing a probe and improve the operation rate.

[0010] Means for Solving the Problems

[0011] To achieve the above object, the present invention provides a charged particle beam apparatus, comprising: a specimen chamber with a vacuum inside; a stage disposed inside the specimen chamber for holding a specimen; a stage driving device for driving the stage; a charged particle beam irradiation optical system for irradiating a charged particle beam onto the specimen held on the stage; a probe for holding a specimen piece extracted from the specimen by the charged particle beam; and a manipulator for driving the probe, wherein the manipulator includes: a gripping mechanism for gripping the probe; and a loading / unloading driving device for driving the gripping mechanism to load and unload the probe.

[0012] The effects of the invention are as follows.

[0013] According to the present invention, the labor and time required for replacing the probe can be reduced, and the operation rate can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of a charged particle beam apparatus according to an embodiment of the present invention.

[0015] Figure 2 It is a schematic diagram of a probe included in a charged particle beam apparatus according to an embodiment of the present invention.

[0016] Figure 3 It is a schematic diagram of a manipulator included in a charged particle beam apparatus according to an embodiment of the present invention.

[0017] Figure 4 It is a schematic diagram of a probe gripping mechanism of a manipulator included in a charged particle beam apparatus according to an embodiment of the present invention.

[0018] Figure 5 It is a schematic top view of a probe carrier included in a charged particle beam apparatus according to an embodiment of the present invention.

[0019] Figure 6 It is a schematic side view of a probe carrier included in a charged particle beam apparatus according to an embodiment of the present invention.

[0020] Figure 7 It is a schematic diagram showing the positional relationship between the manipulator and the probe carrier when replacing the probe.

[0021] Figure 8A It is an explanatory diagram of the operation of transferring a used probe from the manipulator to a probe holder.

[0022] Figure 8B It is an explanatory diagram of the operation of transferring a used probe from the manipulator to a probe holder.

[0023] Figure 8CIt is an explanatory diagram of the operation of transferring a used probe from a manipulator to a probe stage.

[0024] Figure 8D It is an explanatory diagram of the operation of transferring a used probe from a manipulator to a probe stage.

[0025] Figure 8E It is an explanatory diagram of the operation of transferring a used probe from a manipulator to a probe stage.

[0026] Figure 9A It is an explanatory diagram of the operation of assembling a replacement probe of the probe stage to the manipulator.

[0027] Figure 9B It is an explanatory diagram of the operation of assembling a replacement probe of the probe stage to the manipulator.

[0028] Figure 9C It is an explanatory diagram of the operation of assembling a replacement probe of the probe stage to the manipulator.

[0029] Figure 10 It is a flowchart showing the steps of computer-controlled loading and unloading of a probe included in a charged particle beam apparatus according to an embodiment of the present invention. Detailed Embodiment

[0030] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0031] [Charged Particle Beam Apparatus]

[0032] The charged particle beam apparatus of the present invention is an apparatus for cutting out a minute specimen piece from a specimen such as a semiconductor wafer using a charged particle beam. In the present embodiment, a FIB-SEM in which a focused ion beam apparatus that irradiates a specimen with a focused ion beam (FIB) and a scanning electron microscope that irradiates a specimen with an electron beam (EB) are combined is taken as an example of the charged particle beam apparatus for description. Among them, as long as it is a charged particle beam apparatus having a probe for holding a specimen piece, the present invention can also be applied to other apparatuses. For example, the present invention can also be applied to a focused ion beam apparatus that does not have a scanning electron microscope.

[0033] Figure 1 It is a schematic diagram of a charged particle beam apparatus according to an embodiment of the present invention. Figure 1 The shown charged particle beam apparatus 10a is configured to include a specimen chamber 11, a worktable 12, a worktable drive device 13, a specimen piece holder P, and a focused ion beam irradiation optical system 14. Further, the charged particle beam apparatus 10a includes an electron beam irradiation optical system 15, a detector 16, an air gun 17, a probe 18, a manipulator 19, a preliminary specimen chamber 11a, a probe carrier 30, and a computer 21.

[0034] The charged particle beam apparatus 10a irradiates a focused ion beam (charged particle beam) while scanning the surface of an object, and can perform various processes (such as etching processes) based on sputtering and the formation of a deposited film. The charged particle beam apparatus 10a irradiates a focused ion beam onto the specimen S, and can extract a specimen piece Q (a thin specimen, a needle-shaped specimen, etc.) for transmission observation using a transmission electron microscope, for example. Further, the charged particle beam apparatus 10a uses the probe 18 to transfer the extracted specimen piece Q to the specimen piece holder P, and processes the specimen piece Q provided on the specimen piece holder P to be thinned to a desired thickness (for example, 10 - 20 nm) suitable for transmission observation. At this time, the charged particle beam apparatus 10a irradiates the focused ion beam FIB or the electron beam EB while scanning the surface of an object such as the specimen piece Q and the probe 18, and can observe the surface of the object.

[0035] [Specimen chamber 11]

[0036] The specimen chamber 11 is a chamber with a closed structure, configured to be evacuated by a vacuum pump (not shown) during the operation of the charged particle beam apparatus 10a so that the inside becomes a desired vacuum state, and to be able to maintain this desired vacuum state.

[0037] [Workbench 12]

[0038] The workbench 12 is a table for fixing and holding a specimen holder (not shown), and is provided inside the specimen chamber 11. The specimen S and the specimen piece holder P are fixed to the specimen holder. The specimen piece holder P is detachable from the specimen holder. For example, after setting the specimen piece Q extracted from the specimen S on the specimen piece holder P, the specimen holder is removed from the workbench 12 and carried out of the specimen chamber 11 to the preliminary specimen chamber 11a. The specimen piece holder P carried out to the preliminary specimen chamber 11a together with the specimen holder is detached from the specimen holder and, for example, placed in a transmission electron microscope for detailed observation of the specimen piece Q.

[0039] [Workbench drive device 13]

[0040] The workbench drive device 13 is a device for driving the workbench 12, and is housed inside the specimen chamber 11 together with the workbench 12, and displaces the workbench 12 according to a control signal from the computer 21. The workbench drive device 13 includes a translation mechanism 13a, a tilt mechanism 13b, and a rotation mechanism 13c. The translation mechanism 13a is a mechanism for translating the workbench 12 in three-dimensional directions along the X-axis, Y-axis, and Z-axis. The X-axis and Y-axis are two horizontal and mutually orthogonal axes, and the Z-axis is an axis orthogonal to the X-axis and Y-axis at the intersection of the X-axis and Y-axis. The tilt mechanism 13b is a mechanism for rotating the workbench 12 around an axis parallel to the X-axis or Y-axis to tilt it with respect to the horizontal plane. The rotation mechanism 13c is a mechanism for rotating (self-rotating) the workbench 12 around an axis parallel to the Z-axis.

[0041] [Focused Ion Beam Irradiation Optical System 14]

[0042] The focused ion beam irradiation optical system (charged particle beam irradiation optical system) 14 is a unit that irradiates an object in a predetermined irradiation area (its own scanning range) inside the specimen chamber 11 with a focused ion beam FIB (charged particle beam). The objects irradiated by the focused ion beam FIB of the focused ion beam irradiation optical system 14 are the specimen S held by the stage 12, the specimen piece Q, and the probe 18 that enters the irradiation area, etc. The focused ion beam irradiation optical system 14 is fixed to the specimen chamber 11 in a posture where the beam emission part (not shown) faces the inside of the specimen chamber 11 and the optical axis is vertical. The beam emission part of the focused ion beam irradiation optical system 14 faces the upper side of the stage 12. In this way, it is configured to irradiate the object such as the specimen S fixed to the stage 12 with the focused ion beam FIB vertically from above.

[0043] In addition, specifically, the focused ion beam irradiation optical system 14 includes an ion source 14a that generates ions and an ion optical system 14b that focuses and deflects the ions drawn from the ion source 14a. The ion source 14a uses, for example, a liquid metal ion source using liquid gallium or the like, a plasma type ion source, or a gas field ionization type ion source. The ion optical system 14b is configured to include, for example, a first electrostatic lens using a condenser lens or the like, an electrostatic deflector, and a second electrostatic lens using an objective lens or the like. The above-mentioned ion source 14a and ion optical system 14b are controlled according to a control signal from the computer 21. The irradiation position and irradiation conditions of the focused ion beam FIB are controlled by the computer 21.

[0044] [Electron Beam Irradiation Optical System 15]

[0045] The electron beam irradiation optical system 15 (charged particle beam irradiation optical system) is a unit that irradiates an object in a predetermined irradiation area (its own scanning range) inside the specimen chamber 11 with an electron beam EB (charged particle beam). The objects irradiated by the electron beam EB of the electron beam irradiation optical system 15 are the specimen S held by the stage 12, the specimen piece Q, and the probe 18 that enters the irradiation area, etc. The electron beam irradiation optical system 15 is fixed to the specimen chamber 11 in a posture where the beam emission part (not shown) faces the inside of the specimen chamber 11 and the optical axis is inclined with respect to the horizontal plane. In this way, it is configured to irradiate the object such as the specimen S fixed to the stage 12 with the electron ion beam obliquely.

[0046] In addition, specifically, the electron beam irradiation optical system 15 includes an electron source 15a that generates electrons and an electron optical system 15b that focuses and deflects the electrons emitted from the electron source 15a. The electron optical system 15b is configured to include, for example, an electromagnetic lens, a deflector, and the like. The electron source 15a and the electron optical system 15b are controlled according to a control signal from the computer 21. The irradiation position, irradiation conditions, etc. of the electron ion beam are controlled by the computer 21.

[0047] Furthermore, the electron beam irradiation optical system 15 can also be replaced with the focused ion beam irradiation optical system 14, with the electron beam irradiation optical system 15 being vertical and the focused ion beam irradiation optical system 14 being disposed obliquely.

[0048] [Detector 16]

[0049] The detector 16 is a unit that detects secondary charged particles R (secondary ions, secondary electrons, etc.) generated from an object by the irradiation of a charged particle beam (i.e., the focused ion beam FIB or the electron beam EB). The detector 16 detects the intensity of the secondary charged particles R (i.e., the amount of the secondary charged particles R) emitted from the object when the charged particle beam is irradiated onto an object such as the specimen S, and outputs data on the detected amount of the secondary charged particles R. The detector 16 is fixed to the specimen chamber 11 in such a manner that the incident portion of the secondary charged particles R is located at a position where the amount of the secondary charged particles R can be detected inside the specimen chamber 11, for example, at a position obliquely above the irradiation region.

[0050] [Gas gun 17]

[0051] The gas gun 17 is a unit that supplies a gas G to the surface of the object. The gas gun 17 is fixed to the specimen chamber 11 in such a manner that the gas ejection portion (not shown) faces the irradiation region of the charged particle beam inside the specimen chamber 11. The gas gun 17 can supply an etching gas, a deposition gas, etc. to the specimen S. The etching gas is a gas used to selectively promote the etching of the specimen S based on the focused ion beam FIB according to the material of the specimen S. The deposition gas is a gas used to form a deposition film obtained by deposits of metals, insulators, etc. on the surface of the specimen S. For example, by supplying the etching gas while irradiating the focused ion beam FIB, for a Si-based specimen S, it is xenon fluoride, and for an organic-based specimen S, it is water, etc., to promote etching. For example, when a deposition gas containing phenanthrene, platinum, carbon, or tungsten is supplied to the specimen S while irradiating the focused ion beam FIB, the solid components decomposed from the deposition gas adhere to the surface of the specimen S to form a deposition film.

[0052] [Preparatory specimen chamber 11a]

[0053] The preliminary sample chamber 11a is a chamber for sample replacement with a sealed structure for carrying in and out a sample S or the like with respect to the sample chamber 11 without reducing the vacuum degree of the sample chamber 11, and is provided adjacent to the sample chamber 11. Similar to the sample chamber 11, the preliminary sample chamber 11a is configured to be evacuated so that the inside can be brought into a desired vacuum state. The internal volume of the preliminary sample chamber 11a is smaller than the internal volume of the sample chamber 11. A first gate valve 11b and a second gate valve 11c are provided in the preliminary sample chamber 11a. The space inside the preliminary sample chamber 11a is separated from the space outside the charged particle beam apparatus 10a via the first gate valve 11b. Further, the space inside the preliminary sample chamber 11a is separated from the space inside the sample chamber 11 via the second gate valve 11c.

[0054] In the case of replacing the sample S, in the space outside the charged particle beam apparatus 10a, the sample S stored in a sample housing (not shown) is taken out by a sample transfer robot (not shown) and placed on a sample holder placed inside the preliminary sample chamber 11a via the first gate valve 11b. Further, a sample piece holder P stored in a cassette housing (not shown) is taken out by a cassette transfer robot (not shown) and assembled to the sample holder placed inside the preliminary sample chamber 11a. After that, with the first gate valve 11b and the second gate valve 11c closed, the preliminary sample chamber 11a is evacuated, and after the inside of the preliminary sample chamber 11a reaches a predetermined vacuum state, the second gate valve 11c is opened. Then, the sample holder on which the sample S and the sample piece holder P are fixed is transferred from the preliminary sample chamber 11a into the sample chamber 11 by a transfer device (not shown) and fixed to the workbench 12. The transfer of the sample holder from the sample chamber 11 to the preliminary sample chamber 11a is performed in the reverse steps of the transfer in.

[0055] [Probe 18]

[0056] Figure 2 is a schematic view of the probe 18. As Figure 2 shown, the probe 18 is a member for holding a sample piece Q picked out from the sample S by a focused ion beam FIB, and is configured to include a probe main body 18a and a clamping portion 18b. The probe main body 18a is an elongated member having no irregularities on the outer peripheral surface and a sharp tip, and the sample piece Q is bonded to the tip of the probe main body 18a. The material of the probe main body 18a is metal, Si, glass, or the like. The clamping portion 18b is a portion held by the robot hand 19 and is assembled to the base end (the end opposite to the sharp tip) of the probe main body 18a.

[0057] The clamping portion 18b is provided with an annular groove around the outer peripheral surface as an engaging portion 18c that engages with a holding mechanism 19e (described below) of the robot hand 19. Figure 2In [the figure], an engaging portion 18c is illustrated as an example, and the cross section cut at a plane including the center line of the probe 18 is arcuate. However, the shape of the engaging portion 18c is not limited to the example shown in the figure, and any shape suitable for the loading and unloading performed by the holding mechanism 19e is acceptable. It can be appropriately changed together with the structure of the holding mechanism 19e.

[0058] Moreover, the clamping portion 18b is provided with a notch groove 18d that engages with an engaging portion 37 of a probe stage 32 (described below). The notch groove 18d only needs to be in a shape that engages with the engaging portion 37 of the probe stage 32 (described below), and its design can be appropriately changed. Figure 2 In [the figure], an example of an annular groove that encircles the outer peripheral surface is shown. In this example, the cross section of the notch groove 18d cut at a plane including the center line of the probe 18 is not a smooth shape but an angled shape, specifically a triangular shape.

[0059] In addition, in the following description, a member called a replacement probe 18' appears. This replacement probe 18' is replaced with the probe 18 currently assembled to the robot 19 and then assembled to the robot 19. For ease of explanation, it is described separately from the probe 18 as the replacement probe 18', but the structure of the replacement probe 18' is the same as that of the probe 18 described in Figure 2 [the relevant part].

[0060] [Robot 19]

[0061] Figure 3 is a schematic diagram of the robot 19, Figure 4 is a schematic diagram of the holding mechanism of the probe 18 of the robot 19.

[0062] The robot 19 is a unit that drives the probe 18 to transport the specimen wafer Q, and together with the probe 18, it constitutes a specimen wafer transfer device. The robot 19 includes an arm portion 19a that holds the probe 18, and is housed inside the specimen chamber 11 in a state where the probe 18 is assembled to the arm portion 19a. The robot 19 is fixed to the workbench 12 via a support member 19b and is displaced together with the workbench 12. For example, when the workbench 12 is tilted by the tilting mechanism 13b, the robot 19 also tilts relative to the horizontal plane integrally with the workbench 12. Among them, there are also cases where the robot 19 is fixed not to the workbench 12 but, for example, to the inner wall surface of the specimen chamber 11.

[0063] Further, the robot arm 19 is provided with a translation mechanism 19c and a rotation mechanism 19d, and displaces the probe 18 according to a control signal from the computer 21. The translation mechanism 19c and the rotation mechanism 19d are interposed between the support member 19b and the arm portion 19a. The arm portion 19a and the probe 18 attached to the arm portion 19a can be translated relative to the worktable 12 along the x-axis, y-axis, and z-axis by the translation mechanism 19c. Further, the arm portion 19a and the probe 18 attached to the arm portion 19a can swing relative to the worktable 12 about an axis parallel to the z-axis by the rotation mechanism 19d. When removing the sample wafer Q, the front end of the probe 18 is bonded to the removal target portion of the sample S fixed to the worktable 12 using the deposition gas, and the probe 18 is driven by the robot arm 19 to transport the removed sample wafer Q to the sample wafer holder P.

[0064] In addition, the x-axis and the y-axis are two horizontal and mutually orthogonal axes, and the z-axis is an axis orthogonal to the x-axis and the y-axis at the intersection of the x-axis and the y-axis. The xyz orthogonal coordinate system ( Figure 3 ) is independent of the XYZ orthogonal coordinate system ( Figure 1 ) formed by the X-axis, Y-axis, and Z-axis. Specifically, the XYZ orthogonal coordinate system is a coordinate system based on the sample chamber 11, and the xyz orthogonal coordinate system is a coordinate system based on the worktable 12. Therefore, the xyz coordinate system ( Figure 3 ) follows the worktable 12 and tilts or rotates relative to the XYZ coordinate system ( Figure 1 ).

[0065] Further, as Figure 4 shown, the robot arm 19 is provided with a holding mechanism 19e for holding the probe 18 and a loading / unloading drive device 19f for driving the holding mechanism 19e to load and unload the probe 18. An insertion hole 19i for inserting the clamping portion 18b of the probe 18 is formed at the front end of the arm portion 19a of the robot arm 19, Figure 4 and the holding mechanism 19e exemplified in

[0066] is provided on the inner peripheral surface of the insertion hole 19i. Figure 2 The holding mechanism 19e is a mechanism for fixing the probe 18 relative to the arm portion 19a by engaging with the engaging portion 18c ( Figure 4 ) of the probe 18 described above. In the present embodiment, a structure using a latch mechanism is exemplified.

[0067] The loading and unloading drive device 19f is, for example, a cylindrical solenoid, and is equipped on the arm portion 19a. The holding mechanism 19e is housed inside the cylindrical loading and unloading drive device 19f under the state of being subjected to a spring force, and is configured such that the tongue piece 19h protrudes radially inward of the insertion hole 19i from the inner circumferential surface of the insertion hole 19i of the arm portion 19a in the state where the loading and unloading drive device 19f is demagnetized. When the loading and unloading drive device 19f is excited, the holding mechanism 19e (i.e., together with the tongue piece 19h of the housing 19g) moves in the direction of overcoming the spring force, and the tongue piece 19h moves radially outward of the insertion hole 19i from the inside of the insertion hole 19i. When operating in this manner in the Figure 4 state, the tongue piece 19h of the holding mechanism 19e disengages from the engaging portion 18c of the probe 18, and the restriction of the probe 18 with respect to the arm portion 19a is released.

[0068] [Probe carrier 30]

[0069] Figure 5 is a schematic top view of the probe carrier 30, Figure 6 is a schematic side view of the probe carrier 30, Figure 7 is a schematic diagram showing the positional relationship between the robot 19 and the probe carrier 30 when replacing the probe.

[0070] The probe carrier 30 is a member for replacing the probe, and is a member that can be assembled to the workbench 12 in the same manner as the specimen holder having the specimen piece holder P. Of course, the probe carrier 30 can also be manufactured from scratch as a dedicated product, but since the loading and unloading mechanism with respect to the workbench 12 is common to the specimen holder, the specimen holder can also be used as a base for manufacturing. Figure 5 and Figure 6 The probe carrier 30 exemplified in

[0071] is configured to include a base 31, a probe stage 32, a support member 33, and a stage drive device 34.

[0072] The probe holder 32 has a first socket 32a that serves as an empty socket for receiving the used probe 18, and a second socket 32b in which a replacement probe 18' that is to be assembled to the manipulator 19 is placed instead of the used probe. At least one of the first socket 32a and the second socket 32b is provided in the probe holder 32 (in this embodiment, one is provided for each). The above-mentioned first socket 32a and second socket 32b are insertion holes for the probe 18 (including the replacement probe 18'), and can hold the inserted probe 18. Hereinafter, in this paragraph and the next two paragraphs, when the probe 18 is mentioned, it is considered to include the replacement probe 18'. As Figure 8A shown, stoppers 36 for restricting the insertion position of the probe 18 and engaging portions 37 that engage with the probe 18 are provided in the first socket 32a and the second socket 32b.

[0073] The probe 18 is inserted into the first socket 32a or the second socket 32b from the front end side (opposite to the clamping portion 18b) of the probe body 18a. The stopper 36 exemplified in this embodiment is a step provided on the inner wall surface of the first socket 32a and the second socket 32b. When the probe 18 is inserted into the first socket 32a or the second socket 32b, the end surface of the clamping portion 18b facing the front end direction of the probe body 18a abuts against the stopper 36. In this embodiment, the case where the stopper 36 is constituted by a step is exemplified, but the stopper 36 may be any structure that can restrict the movement of the probe 18 in the insertion direction in the first socket 32a and the second socket 32b and can receive the probe 18, and the design can be appropriately changed.

[0074] The engaging portion 37 is an element that engages with the cutout groove 18d of the probe 18 when the probe 18 is removed from the manipulator 19, and is constituted by a claw-shaped protrusion in this embodiment. When the probe 18 is removed from the manipulator 19, the probe 18 is driven by the manipulator 19 and inserted into the first socket 32a or the second socket (empty socket). Thereafter, the holding mechanism 19e is driven by the loading and unloading driving device 19f to release the restriction of the probe 18, and before and after that, the probe 18 is driven by the manipulator 19 and the cutout groove 18d is hooked on the engaging portion 37. In this state, when the arm portion 19a of the manipulator 19 retreats from the probe holder 32, the probe 18 hooked on the engaging portion 37 is pulled out from the manipulator 19 and remains on the probe holder 32.

[0075] In addition, Figure 8A the claw-shaped protrusion is shown as an example of the engaging portion 37, but for example, a latch mechanism such as the holding mechanism 19e of the manipulator 19 can also be used as the engaging portion 37.

[0076] The stage driving device 34 is a device (such as a motor) that rotates the probe stage 32 relative to the support 33. Although not particularly illustrated, a power transmission mechanism and electrical contacts are provided on the base 31. Electrical contacts (not illustrated) connected to the computer 21 are provided on the worktable 12. When the stage driving device 34 is assembled to the worktable 12, the electrical contacts of the stage driving device 34 and the worktable 12 are connected. Thus, when the stage driving device 34 is assembled to the worktable 12, the probe carrier 30 is electrically connected to the computer 21 via the electrical contacts, and can receive a control signal and power supply from the computer 21. The stage driving device 34 is driven by the power supplied in this way, and the power of the stage driving device 34 is transmitted to the rotating shaft 35 via the power transmission mechanism, and the probe stage 32 rotates about the rotating shaft 35.

[0077] In addition, when viewed in the axial direction of the rotating shaft 35, the probe stage 32 has a shape that is longer in the extending direction of the first socket 32a and the second socket 32b. The basic angle of the probe stage 32 is an angle that suppresses the height of the probe stage 32 by tilting to a posture in which the first socket 32a and the second socket 32b become horizontal ( Figure 6 ). When replacing the probe, the probe stage 32 is driven by the stage driving device 34 and erected at a predetermined tilt angle ( Figure 7 ). The predetermined tilt angle is an angle at which the tilt angles of the first socket 32a and the second socket 32b coincide with the tilt angle of the probe 18 mounted on the robot 19.

[0078] [Computer 21]

[0079] The computer 21 is a control device that controls the stage driving device 13, the robot 19, the display device 20, and the stage driving device 34, is disposed outside the specimen chamber 11, and has a function of loading and unloading the probe 18 with respect to the robot 19. A display device 20 that displays image data and the like based on secondary charged particles R detected by the detector 16, and input devices 22 such as a mouse and a keyboard that output signals corresponding to the input operations of the operator are connected to the computer 21. The computer 21 comprehensively controls the operation of the charged particle beam device 10a according to the signals output from the input device 22 or an automatically operating control program stored in advance.

[0080] The computer 21 converts the detection amount of the secondary charged particles R detected by the detector 16 while scanning the irradiation position of the charged particle beam into a luminance signal corresponding to the irradiation position. The computer 21 generates image data showing the shape of the object based on the two-dimensional position distribution of the detection amount of the secondary charged particles R. And, for example, in the absorption current image mode, the computer 21 detects the absorption current flowing into the probe 18 while scanning the irradiation position of the charged particle beam, and thereby generates absorption current image data showing the shape of the probe 18 based on the two-dimensional position distribution of the absorption current. And, the computer 21 displays on the display device 20 a screen for performing operations such as magnification, reduction, movement, and rotation of each image data together with the generated each image data. In addition, the computer 21 displays on the display device 20 a screen for performing various settings such as mode selection and processing setting in the automatic sequence control.

[0081] [Probe replacement step]

[0082] Figures 8A - 8E It is an explanatory diagram of the operation of transferring the used probe 18 from the manipulator 19 to the probe stage 32. Figures 9A - 9C It is an explanatory diagram of the operation of assembling the replacement probe 18' of the probe stage 32 to the manipulator 19. Figure 10 It is a flowchart showing the steps of the computer 21 controlling the loading and unloading of the probe 18.

[0083] In the case of replacing the probe 18, for example, the probe carrier 30 having the replacement probe 18' placed in the second socket 32b is placed inside the preliminary specimen chamber 11a via the first gate valve 11b ( Figure 1 ). After that, the computer 21 starts the process represented by the Figure 10 flow using the signal indicating the execution of the probe replacement as a trigger. The process of Figure 10 is executed while maintaining a predetermined vacuum state inside the specimen chamber 11.

[0084] - Step S101 - S105 -

[0085] When starting the Figure 10 flow, the computer 21 closes the first gate valve 11b and the second gate valve 11c, and evacuates the preliminary specimen chamber 11a (step S101). After the preliminary specimen chamber 11a becomes a predetermined vacuum state, the computer 21 opens the second gate valve 11c to connect the internal space of the preliminary specimen chamber 11a with the internal space of the specimen chamber 11 (step S102).

[0086] After that, the computer 21 controls the workbench 12 and the transfer device (not shown), removes the sample holder from the workbench 12, and moves the sample holder from the sample chamber 11 to the preliminary sample chamber 11a (step S103). After moving out the sample holder, the computer 21 controls the transfer device (not shown), moves the probe carrier 30 from the preliminary sample chamber 11a into the sample chamber 11, and assembles the probe carrier 30 to the workbench 12 (step S104). When the probe carrier 30 moves between the sample chamber 11 and the preliminary sample chamber 11a, the computer 21 controls the stage driving device 34 to tilt the probe stage 32 to lower the height of the probe carrier 30. Thus, the probe carrier 30 can pass through the second gate valve 11c with a smaller height dimension of the opening. After that, the computer 21 controls the stage driving device 34 to tilt the probe stage 32 upright, and makes the angle of the probe stage 32 coincide with the assembly angle of the probe 18 relative to the robot 19 as shown in Figure 7 shown (step S105).

[0087] - Step S106 -

[0088] After tilting the probe stage 32 upright, the computer 21 controls the robot 19 and the loading / unloading driving device 19f to remove the used probe 18 from the robot 19 (step S106).

[0089] Specifically, first, the computer 21 drives the robot 19 to insert the probe into the first socket 32a of the probe stage 32 ( Figure 8A ), and makes the clamping portion 18b of the probe 18 contact the stopper 36 of the first socket 32a ( Figure 8A ). When the workbench 12 is configured to be relatively movable with respect to the robot 19, the insertion operation of inserting the probe into the first socket 32a can also be performed in combination with the movement of the workbench 12 performed by the workbench driving device 13.

[0090] Next, the computer 21 drives the robot 19 to engage the engaging portion 37 of the first socket 32a with the notch groove 18d of the probe 18 ( Figure 8C ). When the workbench 12 is configured to be relatively movable with respect to the robot 19, the engaging operation of the engaging portion 37 with the notch groove 18d can also be performed in combination with the movement of the workbench 12 performed by the workbench driving device 13.

[0091] After the notch groove 18d is hooked on the engaging portion 37, the computer 21 controls the loading / unloading driving device 19f and the robot 19 to release the restriction of the holding mechanism 19e on the probe 18, and makes the robot 19 retreat from the probe stage 32 ( Figure 8D)。When the robot arm 19 moves away from the probe holder 32 in the axial direction of the probe 18, the probe 18 hooked to the engaging portion 37 is pulled out from the robot arm 19, so that the probe 18 is removed from the robot arm 19 and remains in the first socket 32a( Figure 8E )。In the case where the workbench 12 is configured to be relatively movable with respect to the robot arm 19, the pulling-out operation of the probe 18 can also be performed in combination with the movement of the workbench 12 performed by the workbench driving device 13.

[0092] - Step S107 -

[0093] After removing the used probe 18 from the robot arm 19, the computer 21 controls the robot arm 19 and the loading / unloading driving device 19f to assemble the replacement probe 18' to the robot arm 19 (step S107).

[0094] Specifically, first, the computer 21 controls the robot arm 19 to cover the insertion hole 19i of the robot arm on the clamping portion 18b of the replacement probe 18' placed in the second socket 32b of the probe holder 32( Figure 9A )。When the clamping portion 18b caught by the stopper 36 is inserted into the insertion hole 19i by a predetermined distance, the tongue piece 19h of the holding mechanism 19e is engaged with the engaging portion 18c of the replacement probe 18' due to the spring force, and the replacement probe 18' is assembled to the robot arm 19( Figure 9B )。After assembling the replacement probe 18' to the robot arm 19, the computer 21 controls the robot arm 19 to retract the robot arm 19 from the probe holder 32 and pull out the replacement probe 18' from the second socket 32b( Figure 9C )。In the case where the workbench 12 is configured to be relatively movable with respect to the robot arm 19, the operations of assembling and pulling out the replacement probe 18' can also be performed in combination with the movement of the workbench 12 performed by the workbench driving device 13.

[0095] - Steps S108 - S112 -

[0096] After pulling out all of the replacement probes 18' from the second socket 32b, the computer 21 controls the stage driving device 34 to tilt the probe holder 32 to the horizontal as Figure 6 shown (step S108). Thereafter, the computer 21 controls the workbench 12 and the transfer device (not shown) to remove the probe carrier 30 from the workbench 12, and carry out the probe carrier 30 and the used probe 18 together from the specimen chamber 11 to the preliminary specimen chamber 11a (step S109). When the probe carrier 30 moves between the specimen chamber 11 and the preliminary specimen chamber 11a, the computer 21 controls the stage driving device 34 to tilt the probe holder 32 to lower the height of the probe carrier 30. Thus, the probe carrier 30 can pass through the second gate valve 11c having a relatively small height dimension of the opening.

[0097] After removing the probe carrier 30, the computer 21 controls a transfer device (not shown) to transfer the sample holder from the preliminary sample chamber 11a into the sample chamber 11 and assemble the sample holder onto the workbench 12 (step S110). After assembling the sample holder onto the workbench 12, the computer 21 closes the second gate valve 11c to separate the internal space of the preliminary sample chamber 11a from the internal space of the sample chamber 11 (step S111). Thereafter, the computer 21 releases the vacuum state of the preliminary sample chamber 11a and opens the first gate valve 11b to open the preliminary sample chamber 11a (step S112). Thus, the probe carrier 30 and the used probe 18 can be taken out from the preliminary sample chamber 11a.

[0098] As described above, the probe can be replaced inside the sample chamber 11 without releasing the vacuum state of the sample chamber 11.

[0099] [Effect]

[0100] (1) According to the present embodiment, since the manipulator 19 is equipped with a gripping mechanism 19e for gripping the probe 18 and a loading / unloading drive device 19f for driving the gripping mechanism 19e, the probe 18 can be replaced inside the sample chamber 11 while maintaining the vacuum state of the sample chamber 11 unchanged. Therefore, it is not necessary to open the sample chamber 11 to the atmosphere to stop the charged particle beam apparatus 10a for probe replacement, or for an operator to manually replace the probe. Also, when replacing the probe, since the vacuum state of the sample chamber 11 can be maintained, it is not necessary to restore the vacuum state of the sample chamber 11. Thus, the charged particle beam apparatus 10a according to the present embodiment can reduce the labor and time required for probe replacement and improve the operation rate.

[0101] (2) The probe carrier 30 includes a first socket 32a as an empty socket and a second socket 32b on which the replacement probe 18' is placed, and can be loaded and unloaded relative to the workbench 12. By assembling the probe carrier 30 on the workbench 12 and controlling the manipulator 19, the used probe 18 can be retrieved from the first socket 32a, and the replacement probe 18' in the second socket 32b can be assembled onto the manipulator 19. By using the probe carrier 30 that can be loaded and unloaded relative to the workbench 12 in this way, the used probe 18 and the replacement probe 18' can be taken in and out of the sample chamber 11 together with the probe carrier 30. The mechanism for loading and unloading the probe carrier 30 relative to the sample chamber 11 can effectively utilize the mechanism for loading and unloading the sample holder generally equipped in the charged particle beam apparatus, and can reasonably automate the probe replacement.

[0102] Moreover, since the loading and unloading mechanism with respect to the sample chamber 11 is shared between the sample holder and the probe carrier 30, part of the structures of the sample holder and the probe carrier 30 can also be made common. Therefore, by adopting some components and part of the design of the sample holder for the probe carrier 30, it can be manufactured efficiently and inexpensively.

[0103] In addition, as long as the above-described essential effect (1) is achieved, it is not necessarily required to use the probe carrier 30 dedicated to replacing the probe. For example, if the sample holder or the sample wafer holder P is provided with elements corresponding to the first socket 32a and the second socket 32b, the automation of replacing the probe can also be achieved by using the sample holder or the sample wafer holder P.

[0104] (3) Since the probe stage 32 of the probe carrier 30 is inclined, when the probe carrier 30 is loaded and unloaded with respect to the sample chamber 11, the probe stage 32 is tilted to the horizontal, enabling the probe carrier 30 to smoothly pass through the narrow opening of the second gate valve 11c. Then, in a state where the probe carrier 30 is assembled to the workbench 12, the probe stage 32 can be tilted and erected in accordance with the inclination of the arm 19a of the robot 19 under computer control. Therefore, it is not necessary to expand the movable area of the robot 19 for exchanging the probe 18 with the probe stage 32.

[0105] In particular, the observation position of the sample S is a narrow area close to the focused ion beam irradiation optical system 14, the electron beam irradiation optical system 15, the detector 16, and the gas gun 17. Therefore, when considering the access of the sample S to and from the observation position, a mechanism that tilts the probe stage 32 to the horizontal as in the present embodiment and can adopt a thin moving posture is reasonable.

[0106] Among them, as long as the above-described effects (1) and (2) are achieved, it is not necessarily required to have an inclination mechanism for the probe stage 32. For example, when there is sufficient space in terms of the height dimension of the opening of the second gate valve 11c in the preliminary sample chamber 11a and the space of the observation position of the sample S, and the probe carrier 30 will not interfere with other structures even in the erected state, the inclination mechanism of the probe stage 32 can be omitted.

[0107] (4) The probe 18 (including the replacement probe 18') is equipped with a clamping portion 18b having an engaging portion 18c that engages with the holding mechanism 19e. The engaging portion 18c can be formed by a simple groove, for example, and together with a simple holding mechanism 19e such as a latch mechanism, an automatic loading and unloading mechanism of the probe 18 with respect to the robot 19 can be realized with a simple structure.

[0108] Among them, the structures of the engaging portion 18c, the holding mechanism 19e, and the loading and unloading drive device 19f are not limited to Figure 4 the examples shown, etc., and the design can be appropriately changed.

[0109] (5) Further, the second socket 32b of the probe stage 32 has an engaging portion 37 that engages with the probe 18 (including the replacement probe 18'). The engaging portion 37 and the notch groove 18d of the probe 18 that engages with the engaging portion 37 may be extremely simple structures as in the present embodiment. Although the engaging portion 37 and the notch groove 18d have such simple structures, the engaging portion 37 functions effectively when the probe 18 is pulled out from the robot 19.

[0110] Among them, the structures of the engaging portion 37 and the notch groove 18d are not limited to Figure 8A the examples shown, etc., and the design can be appropriately changed.

[0111] [Variant Example]

[0112] In the above embodiment, the case where the present invention is applied to the replacement of the probe 18 for picking up the specimen piece Q picked out from the specimen S has been described as an example, but the present invention can also be applied to the replacement of other probes, for example, probes for measuring the electrical characteristics of a specimen. Further, the present invention can also be applied to a charged particle beam apparatus that uses a plurality of probes inside the specimen chamber 11.

[0113] Further, the structure in which the probe carrier 30 is directly loaded and unloaded with respect to the workbench 12 has been described as an example, but for example, it may be configured to load and unload the probe carrier 30 with respect to the specimen holder instead of the specimen piece holder P, and load and unload the probe carrier 30 with respect to the workbench 12 via the specimen holder.

[0114] In addition, the present invention is not limited to the above embodiments and can include various variant examples. For example, the above embodiments have been described in detail for easy understanding of the present invention and are not necessarily limited to having all the structures described. It is also possible to add, delete, or replace a part of the structure of the above embodiments with other structures.

[0115] For example, some or all of the above structures, functions, processes, processing devices, etc. can also be implemented by hardware such as integrated circuits. It is also possible to implement the above structures, functions, etc. by software by a processor interpretively executing a program that realizes each function. Information such as programs for realizing each function can be stored in various storage media. As various storage media, for example, storage devices such as memories, hard disks, SSDs (Solid State Drives), or flash memory cards, DVDs (Digital Versatile Disks), etc. can be cited.

[0116] Further, in the above embodiment, the input / output lines of the signals show the input / output lines considered necessary for explanation and are not necessarily all shown in the product. In fact, it can be considered that substantially all the structures are connected to each other.

[0117] Symbol Explanation

[0118] 10a - Charged particle beam device, 11 - Specimen chamber, 11a - Preliminary specimen chamber, 11b - First gate valve, 11c - Second gate valve, 12 - Workbench, 13 - Workbench drive device, 14 - Focused ion beam irradiation optical system (charged particle beam irradiation optical system), 15 - Electron beam irradiation optical system (charged particle beam irradiation optical system), 18 - Probe, 18’ - Replaceable probe, 18c - Engaging portion, 19 - Manipulator, 19e - Gripping mechanism, 19f - Loading and unloading drive device, 21 - Computer, 30 - Probe carrier, 32 - Probe stage, 32a - First socket, 32b - Second socket, 33 - Support member, 34 - Stage drive device, 37 - Engaging portion, EB - Electron beam (charged particle beam), FIB - Focused ion beam (charged particle beam), Q - Specimen wafer, S - Specimen.

Claims

1. A charged particle beam device, comprising: A specimen chamber with a vacuum inside; A worktable disposed inside the specimen chamber for holding a specimen; A worktable drive device for driving the worktable; A charged particle beam irradiation optical system for irradiating a charged particle beam onto the specimen held by the worktable; A probe for holding a specimen piece extracted from the specimen by the charged particle beam; and A manipulator for driving the probe, The charged particle beam device is characterized in that The manipulator includes: A gripping mechanism for gripping the probe; and A loading and unloading drive device for driving the gripping mechanism to load and unload the probe.

2. The charged particle beam apparatus according to claim 1, characterized in that, It includes: A probe carrier having a first socket and a second socket and capable of being assembled to the worktable; A replacement probe placed in the second socket; and A computer for controlling the manipulator, The computer is configured to Control the manipulator to insert the probe into the first socket, Control the loading and unloading drive device to remove the probe from the manipulator and place it in the first socket, Control the manipulator to assemble the replacement probe to the manipulator, Control the manipulator to pull out the replacement probe from the second socket and perform probe replacement inside the specimen chamber.

3. The charged particle beam device according to claim 2, characterized in that The probe carrier includes: A probe stage having the first socket and the second socket; A support member for supporting the probe stage to be rotatable; and A stage drive device for rotating the probe stage relative to the support member, When replacing the probe, the computer controls the stage drive device to tilt and erect the probe stage in accordance with the assembly angle of the probe relative to the manipulator.

4. The charged particle beam device according to claim 3, characterized in that There is a preliminary specimen chamber adjacent to the specimen chamber, When the probe carrier moves between the specimen chamber and the preliminary specimen chamber, the computer controls the stage drive device to tilt the probe stage to reduce the height of the probe carrier.

5. The charged particle beam device according to claim 2, characterized in that The probe and the replacement probe have engaging portions that engage with the gripping mechanism.

6. The charged particle beam device according to claim 2, characterized in that The second socket has engaging portions that engage with the probe and the replacement probe.

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