Laser

Abstract

A laser (10) comprises a substrate (101), a first frame body (102), at least one packaging structure (103), at least one light-emitting chip (104), a target optical element, a first cover body (106) and a target side wall B. The first frame body (102) is fixed with the substrate (101) so as to define a first accommodating space (11). The packaging structure (103) is located in the first accommodating space (11), and the packaging structure (103) forms a second accommodating space (12). The light-emitting chip (104) is located in the second accommodation space (12) and is configured to emit laser light. The target optical element is located in the first accommodation space (11). The first cover body (106) is fixed to the side, away from the substrate (101), of the first frame body (102) and is configured to seal the first accommodating space (11). The target side wall B is located on the light-emitting side of the light-emitting chip (104) and transmits light, the laser emitted by the light-emitting chip (104) transmits the target side wall B to the target optical element, and the target optical element is configured to emit the received laser out of the first accommodating space (11).

Description

laser

[0001] This application claims priority to Chinese patent application No. 202310033082.9 filed on January 10, 2023; and priority to Chinese patent application No. 202310033068.9 filed on January 10, 2023; and priority to Chinese patent application No. 202310033081.4 filed on January 10, 2023, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optoelectronic technology, and in particular to a laser. Background Art

[0003] With the development of optoelectronic technology, lasers are widely used, and the requirements for the luminous effects of lasers are becoming higher and higher.

[0004] Summary of the Invention

[0005] A laser is provided. The laser includes a substrate, a first frame, at least one packaging structure, at least one light-emitting chip, a target optical element, a first cover, a target sidewall, and the light-emitting chip. The first frame is fixed to the substrate to define a first accommodation space. The packaging structure is located in the first accommodation space, and the packaging structure forms a second accommodation space. The light-emitting chip is located in the second accommodation space and is configured to emit laser light. The target optical element is located in the first accommodation space. The first cover is fixed to a side of the first frame away from the substrate and is configured to seal the first accommodation space. The target sidewall is located on the light-emitting side of the light-emitting chip and is light-transmissive. The laser light emitted by the light-emitting chip transmits through the target sidewall and is emitted toward the target optical element. The target optical element is configured to emit the received laser light out of the first accommodation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG1 is a structural diagram of a laser according to some embodiments;

[0007] FIG2 is a structural diagram of another laser according to some embodiments;

[0008] FIG3 is a structural diagram of a packaging structure of a laser according to some embodiments;

[0009] FIG4 is a structural diagram of yet another laser according to some embodiments;

[0010] FIG5 is a structural diagram of yet another laser according to some embodiments;

[0011] FIG6 is a structural diagram of yet another laser according to some embodiments;

[0012] FIG7 is a structural diagram of yet another laser according to some embodiments;

[0013] FIG8 is a structural diagram of yet another laser according to some embodiments;

[0014] FIG9 is a structural diagram of yet another laser according to some embodiments;

[0015] FIG10 is a structural diagram of yet another laser according to some embodiments;

[0016] FIG11 is a structural diagram of yet another laser according to some embodiments;

[0017] FIG12 is a structural diagram of yet another laser according to some embodiments;

[0018] FIG13 is a partial structural diagram of yet another laser according to some embodiments;

[0019] FIG14 is a structural diagram of yet another laser according to some embodiments;

[0020] FIG15 is a top view of the laser in FIG14 ;

[0021] FIG16 is a structural diagram of yet another laser according to some embodiments;

[0022] FIG17 is a top view of the laser in FIG16;

[0023] FIG18 is a structural diagram of yet another laser according to some embodiments;

[0024] FIG19 is a top view of the laser in FIG18 ;

[0025] FIG20 is a structural diagram of yet another laser according to some embodiments;

[0026] FIG21 is a top view of the laser in FIG20;

[0027] FIG22 is a structural diagram of yet another laser according to some embodiments;

[0028] FIG23 is a structural diagram of another laser packaging structure according to some embodiments;

[0029] FIG24 is a structural diagram of yet another laser according to some embodiments;

[0030] FIG25 is a structural diagram of yet another laser according to some embodiments;

[0031] FIG26 is a structural diagram of yet another laser according to some embodiments;

[0032] FIG27 is a structural diagram of yet another laser according to some embodiments;

[0033] FIG28 is a structural diagram of yet another laser according to some embodiments;

[0034] FIG29 is a structural diagram of yet another laser according to some embodiments;

[0035] FIG30 is a structural diagram of yet another laser according to some embodiments;

[0036] FIG31 is a structural diagram of yet another laser according to some embodiments;

[0037] FIG32 is a structural diagram of yet another laser according to some embodiments;

[0038] FIG33 is a structural diagram of yet another laser according to some embodiments;

[0039] FIG34 is an exploded view of the laser in FIG33 ;

[0040] FIG35 is a structural diagram of yet another laser according to some embodiments;

[0041] FIG36 is an exploded view of the laser in FIG35 ;

[0042] FIG37 is a block diagram of yet another laser according to some embodiments;

[0043] FIG38 is a perspective view of yet another laser according to some embodiments;

[0044] FIG39 is a block diagram of yet another laser according to some embodiments;

[0045] FIG40 is a block diagram of yet another laser according to some embodiments;

[0046] FIG41 is a perspective view of the laser in FIG40;

[0047] FIG42 is an exploded view of the laser in FIG40;

[0048] FIG43 is a block diagram of yet another laser according to some embodiments;

[0049] FIG44 is a block diagram of yet another laser according to some embodiments;

[0050] FIG45 is a block diagram of yet another laser according to some embodiments;

[0051] FIG46 is a block diagram of yet another laser according to some embodiments;

[0052] FIG47 is a block diagram of yet another laser according to some embodiments;

[0053] FIG48 is a block diagram of a laser assembly according to some embodiments;

[0054] 49 is a block diagram of another laser assembly according to some embodiments. DETAILED DESCRIPTION

[0055] The following will be combined with the accompanying drawings to clearly and completely describe some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0056] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0057] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0058] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0059] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0060] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0061] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0062] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0063] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0064] Some embodiments of the present disclosure provide a projection device, which may include a light source assembly, a light valve, and a lens. The laser emitted by the above-mentioned light source assembly can be directed to the light valve, modulated by the light valve, and then directed to the lens, and then the lens can project the received laser to form a projection picture. The light source assembly includes a laser, a light uniformity component (such as a light pipe), a shaping component, and a converging lens. The light uniformity component is configured to uniformize the laser light emitted by the laser; the shaping component can shape the laser spot into the shape required to form a projection picture; and the converging lens can converge the laser to subsequent components.

[0065] In related technologies, a laser consists of a base plate, a frame, a light-emitting chip, and a reflective component. The base plate and frame are fixed together to form a housing. The light-emitting chip and reflective component are located within this housing and fixed to the base plate. The light-emitting chip emits laser light toward a corresponding reflective component (such as a reflective prism), which then reflects the received laser light away from the base plate. The mounting accuracy of the reflective component directly affects the laser's light output.

[0066] To prevent damage to the light-emitting chip from moisture and other environmental factors during laser operation, the laser housing must be sealed after the light-emitting chip and reflective prism are mounted. For example, the laser also includes a sealing cover. This cover is located on the side of the frame away from the base plate and is configured to seal the housing.

[0067] If the light-emitting chip is powered on and lit before the accommodation space is sealed, the moisture in the environment will accelerate the aging of the light-emitting chip and even cause catastrophic optical damage (COD) to the light-emitting chip. Therefore, in the related art, the light-emitting chip and the reflective component are both passively mounted.

[0068] During laser fabrication, the light-emitting chip and reflective component are mounted directly on the baseplate according to pre-set positions. A sealing cap is then used to seal the space. During the mounting process, the positions of the light-emitting chip and reflective component are fine-tuned based on the set distance. The light-emitting chip is then illuminated, emitting laser light toward the reflective component, which then reflects the laser light away from the baseplate.

[0069] However, errors are inevitable in the component placement process. For example, if there is an error in the placement position of the reflective component in the laser, the path of the laser emitted by the light-emitting chip will deviate from the required path after being reflected by the reflective component, making the actual laser emitted by the laser unable to meet the requirements, thereby affecting the laser's luminous effect.

[0070] In this mounting method, if the illumination of the laser light emitted by the light-emitting chip on the reflective component (such as the laser illumination position, the size and shape of the resulting light spot, etc.) deviates significantly from the desired illumination, it will be difficult to readjust the mounting position of the reflective component due to the laser being already packaged, and the process is relatively complicated. If the reflective component is not adjusted, the laser light emitted by the laser may not be effectively utilized, and subsequent assembly with other components will also be difficult.

[0071] To solve the above problems, some embodiments of the present disclosure provide a laser.

[0072] 1 and 2 , the laser 10 includes a substrate 101 , a first frame 102 , a packaging structure 103 (first packaging structure), a light emitting chip 104 , a wavelength conversion component 105 and a first cover 106 (eg, a sealing cover).

[0073] The substrate 101 and the first frame 102 are fixed together to define a first accommodating space 11 between the substrate 101 and the first frame 102. The substrate 101 forms the bottom of the first accommodating space 11, and the first frame 102 forms a portion of the sidewalls of the first accommodating space 11. Here, the structure composed of the substrate 101 and the first frame 102 can be referred to as a tube shell.

[0074] The first cover 106 is fixed to a side of the first frame 102 away from the substrate 101 and is configured to seal the first accommodating space 11 .

[0075] The light-emitting chip 104 is disposed in the packaging structure 103. The packaging structure 103 and the wavelength conversion component 105 are respectively disposed in the first accommodating space 11. The substrate 101, the first frame 102, and the first cover 106 can be configured into a packaging structure (a second packaging structure) to encapsulate the components in the first accommodating space 11.

[0076] In this way, it is possible to prevent external substances such as water and oxygen from corroding the various components in the first accommodating space 11, thereby ensuring the working reliability of the various components and thus helping to extend the life of the laser.

[0077] In some embodiments, the packaging structure 103 is configured to form a second accommodating space 12, and the light-emitting chip 104 is located in the second accommodating space 12. Solder (e.g., gold-tin solder) can be pre-applied to the bottom edge of the first cover 106, and the first cover 106 is fixed to the first frame 102 by high-temperature soldering to seal the second accommodating space 12.

[0078] 3 to 5 , the second accommodating space 12 may be formed solely by the packaging structure 103 ; or, may be formed together with the packaging structure 103 and components such as the substrate 101 and the first frame 102 , which will be described later.

[0079] In some embodiments, package structure 103 includes a target sidewall B. Target sidewall B is located on the light-emitting side of light-emitting chip 104. Target sidewall B is light-transmissive. Light-emitting chip 104 is configured to emit laser light toward target sidewall B. The laser light is adapted to pass through target sidewall B and exit package structure 103.

[0080] The wavelength conversion component 105 is located on the transmission path of the laser transmitted from the packaging structure 103. After the laser is emitted to the wavelength conversion component 105, it can stimulate the wavelength conversion component 105 to emit light with a wavelength different from the laser, thereby achieving wavelength conversion of the laser.

[0081] In some embodiments of the present disclosure, the wavelength conversion component 105 is formed of a fluorescent material. The wavelength conversion component 105 can emit fluorescence under the excitation of laser light, and the color of the fluorescence is different from the color of the laser light.

[0082] For example, the laser may be a blue laser, and the fluorescent light may be a yellow laser, a green laser, or a red laser. The wavelength conversion component 105 is a Yttrium Aluminum Garnet (YAG) fluorescent material. The wavelength conversion component 105 may be in the form of a sheet, a plate, or a block.

[0083] 1 , the fluorescence emitted by the wavelength conversion component 105 passes through a transparent side wall of the first frame 102 and then exits the first accommodating space 11. Of course, the laser 10 may also have other light emission modes (described below).

[0084] In the prior art, fluorescence is typically achieved by using an optical path shaping component to focus blue laser light from a laser onto a fluorescence wheel, thereby stimulating the wheel to emit fluorescence. However, this fluorescence stimulation system requires a large number of lenses and components, resulting in a complex optical path and a large system size.

[0085] In some embodiments, the laser 10 can use the wavelength conversion component 105 to convert the wavelength of the laser light so that the laser 10 emits fluorescence with a color different from the color of the laser light, thereby improving the flexibility of use of the laser 10 .

[0086] This eliminates the need for additional lenses and components, simplifies the fluorescence emission method, and reduces the size of the fluorescence emitting components. Furthermore, by placing the wavelength conversion component 105 within the housing of the laser 10, the wavelength conversion component 105 is protected, thereby improving its operational reliability.

[0087] In some embodiments, the substrate 101, the first frame 102, and the first cover 106 together form the overall package for the laser 10. After the packaging structure 103 performs a primary package on the light-emitting chip 104, the first cover 106, the substrate 101, and the first frame 102 can perform a secondary package on the light-emitting chip 104, as well as package components such as the packaging structure 103, the wavelength conversion component 105, or the reflective component 108. When assembling the laser 100, the light-emitting chip 104 can first be packaged in the first accommodating space 11 using the packaging structure 103, followed by mounting the wavelength conversion component 105, and then securing the first cover 106 to the side of the first frame 102 away from the substrate 101.

[0088] In the related art, the airtightness level of the sealed space after sealing is required to reach 10 -8 Pa·m 3 The airtightness requirement is high, and the requirements for the packaging process and the packaging materials used are also high, so the packaging of the second accommodating space 12 of the laser 10 is relatively difficult.

[0089] In some embodiments of the present disclosure, the airtightness level of the second accommodation space 12 formed by the packaging structure 103 can reach 10 -5 Pa cubic meter per second, an airtightness rating lower than that of sealed spaces in related art. Subsequently, the first cover 106 is configured to encapsulate the first accommodating space 11. This encapsulation achieves an airtightness rating lower than that of sealed spaces in related art. For example, the first cover 106 can be secured using a medium-quality sealing glue. The encapsulation of the first accommodating space 11 and the second accommodating space 12 can ensure that the environment surrounding the light-emitting chip 104 meets airtightness requirements. This allows the airtightness requirements of the laser 10 to be met while lowering the requirements for the packaging process and reducing the packaging difficulty.

[0090] In some embodiments, the light emitting chip 104 can be illuminated during the mounting process of the wavelength conversion component 105. Since the packaging structure 103 seals the light emitting chip 104, the light emitting chip 104 will not be damaged by external contaminants when it is illuminated, and the operating reliability of the light emitting chip 104 can still be guaranteed.

[0091] After lighting up the light-emitting chip 104, the wavelength conversion component 105 can be adjusted to a more appropriate position based on the irradiation conditions of the laser emitted by the light-emitting chip 104 (such as the irradiation position of the laser, and the size and shape of the formed light spot, etc.), thereby ensuring the laser excitation effect on the wavelength conversion component 105.

[0092] If the first accommodation space 11 of the laser 10 also contains components through which the laser light must pass (such as a reflective component or a collimating lens), the placement positions of these components can also be determined based on the irradiation of the laser light emitted by the light-emitting chip 104. This allows for active adjustment of the components of the laser 10 that require laser irradiation, thereby improving the placement accuracy of these components and enhancing the light-emitting effect of the laser 10.

[0093] 1 , the laser 10 further includes a heat sink 107. The heat sink 107 corresponds to the light-emitting chip 104. For example, if the laser 10 includes multiple light-emitting chips 104 and multiple heat sinks 107, each light-emitting chip 104 is located on a corresponding heat sink 107, so that the heat sink 107 dissipates heat for the corresponding light-emitting chip 104.

[0094] It should be noted that since the heat generated by the light-emitting chip 104 is transmitted and dissipated vertically downward, the heat sink 107 can assist the corresponding light-emitting chip 104 in dissipating heat. Even if the light-emitting chip 104 is located in the second accommodation space 12, heat can still be dissipated normally, and the packaging structure 103 will not affect the heat dissipation effect of the light-emitting chip 104. The heat sink 107 can also assist in the electrical connection of the corresponding light-emitting chip 104.

[0095] The heat sink 107 has a coefficient of thermal expansion close to that of the light-emitting chip 104, which can alleviate stress generated during material temperature fluctuations. For example, the heat sink 107 can be made of ceramic, etc. The light-emitting chip 104 and the heat sink 107 can be formed by eutectic soldering. The upper surface of the light-emitting chip 104 and the lower surface of the heat sink 107 can each be provided with a gold-plated layer. Solder can be pre-applied to the mounting surfaces of the light-emitting chip 104 and the heat sink 107, enabling mounting of the light-emitting chip 104 and the heat sink 107.

[0096] In some embodiments, the substrate 101 includes a first surface 1011 and a second surface 1012 arranged along the thickness direction. The first surface 1011 is parallel to the second surface 1012 and is closer to the first accommodating space 11 than the second surface 1012. Referring to Figures 1 and 2, the first frame 102 includes an annular plate 1021 and a plurality of first side walls 1022. The plurality of first side walls are disposed on the annular plate 1021 and are fixedly connected to the annular plate 1021 in sequence. The plurality of first side walls 1022 enclose the first accommodating space 11.

[0097] The first frame 102 includes four first sidewalls 1022 connected in sequence, and the annular plate 1021 is square and annular. The base plate 101 is rectangular and includes four side surfaces. The annular plate 1021 of the first frame 102 can surround the base plate 101, and the inner annular surface of the annular plate 1021 is fixed to the side surface of the base plate 101.

[0098] The light emitting chip 104 is located on the substrate 101, and the orthographic projection of the light emitting chip 104 can be located on the substrate 101. The substrate 101 has good thermal conductivity, so the substrate 101 can assist the light emitting chip 104 in heat dissipation.

[0099] For example, the substrate 101 may be made of oxygen-free copper or a composite material of diamond and copper (also referred to as diamond copper). The first frame 102 may be made of ceramic, aluminum oxide, aluminum nitride, or the like. Since the thermal expansion coefficients of aluminum oxide and diamond copper are relatively close, soldering the substrate 101 to the first frame 102 may improve assembly performance.

[0100] In some embodiments, at least a portion of the package structure 103 is located on the substrate 101. For example, the entire orthographic projection of the package structure 103 is located on the substrate 101, or a portion of the orthographic projection of the package structure 103 is located on the annular plate 1021. In some embodiments, the laser 10 further includes a first conductive structure. Referring to FIG. 2 , the first conductive structure W is disposed within the annular plate 1021. FIG. 2 illustrates the exposed portion of the first conductive structure W located outside the enclosed area of ​​the first frame 102.

[0101] The light emitting chip 104 may be electrically connected to one end of the first conductive structure W. The other end of the first conductive structure W may be electrically connected to an external circuit, so that current may be transmitted to the light emitting chip 104 through the first conductive structure W to excite the light emitting chip 104 to emit laser light.

[0102] In some embodiments, the material of the annular plate 1021 includes ceramic. The first conductive structure may be embedded in the annular plate 1021. In some embodiments, the first conductive structure may also be disposed in the side wall 1022 of the first frame 102 near the light emitting chip 104.

[0103] In some embodiments, the first accommodation space 11 may be surrounded by a plurality of first side walls 1022 and the substrate 101. The plurality of first side walls 1022 may be provided on the upper surface of the substrate 101 to surround the first accommodation space 11.

[0104] In some embodiments, a plurality of first sidewalls 1022 may also be disposed on the outer side of the substrate 101 to enclose the first accommodating space 11 .

[0105] In some embodiments, referring to FIG. 1 to FIG. 3 , the packaging structure 103 in the laser 10 is configured to seal the light-emitting chip 104 , and the packaging structure 103 can define the second accommodating space 12 alone.

[0106] In some embodiments, the packaging structure 103 may further define a second accommodation space 12 together with other components. For example, referring to FIG4 , the packaging structure 103 and the substrate 101 may define a second accommodation space 12 together. Referring to FIG5 , the packaging structure 103 and the first frame 102 and the substrate 101 may define a second accommodation space 12 together.

[0107] Various embodiments of the second accommodating space 12 are described below.

[0108] 1 and 3 , the packaging structure 103 alone forms a second accommodating space 12 for placing the light emitting chip 104 .

[0109] 3 , the package structure 103 includes a bottom plate 1031 , a second frame 1032 , and a second cover 1033 . The second frame 1032 includes a second sidewall. The bottom plate 1031 , the second frame 1032 , and the second cover 1033 define a second accommodating space 12 for accommodating the light emitting chip 104 .

[0110] Here, the bottom plate 1031, the second frame 1032 and the second cover 1033 can be three separate components, or the bottom plate 1031, the second cover 1033 and the second frame 1032 can be formed as an integral part.

[0111] The base plate 1031 and the second cover 1033 are plate-shaped. The second frame 1032 includes four second sidewalls, and the area enclosed by these four second sidewalls is generally rectangular. The base plate 1031 and the second frame 1032 are fixed together. The light-emitting chip 104 is located on the base plate 1031 and surrounded by the second frame 1032. The second cover 1033 is fixed to the side of the second frame 1032 away from the base plate 1031. The components of the package structure 103 can be fixed together using a sealant.

[0112] In some embodiments, the second frame 1032 includes a target sidewall B. One of the four second sidewalls located on the light-emitting side of the light-emitting chip 104 is configured as the target sidewall B. In other words, the target sidewall B in the second frame 1032 is located on the light-emitting side of the light-emitting chip 104 .

[0113] In addition, the target sidewall B needs to be transparent. The target sidewall B may be made of glass, sapphire, quartz or transparent ceramic.

[0114] 4 , the second frame 1032 includes a frame-shaped portion and a light-transmitting portion. An opening is formed on one side of the frame-shaped portion, which is adjacent to the light-emitting side of the light-emitting chip 104. The light-transmitting portion is positioned at the opening. The sidewall of the frame-shaped portion with the opening is the aforementioned target sidewall B. One end of the frame-shaped portion is secured to the surface formed by the substrate 101 and the annular plate 1021, while the other end is secured to the second cover 1033.

[0115] In some embodiments, the second cover 1033, the target side wall B and the frame portion can be three independent components respectively; or, the second cover 1033 and the target side wall B can also be an integral piece; the second cover 1033 can also be formed as an integral piece with the frame portion.

[0116] The frame portion and the light-transmitting portion may be made of different materials. The light-transmitting portion may be made of a light-transmitting material, and the frame portion may be made of a light-opaque material. For example, the frame portion may be made of metal or ceramic.

[0117] Alternatively, the material of the frame-shaped portion may be the same as that of the target side wall B, and the frame-shaped portion may also be made of a light-transmitting material, which is not limited in the present disclosure.

[0118] In some embodiments, the surface of the package structure 103 other than the target sidewall B may be coated with a light absorbing material layer, so as to absorb stray light mixed into the package structure 103 , thereby improving the light extraction effect of the laser 10 .

[0119] The laser further includes a second conductive structure, which is disposed in the bottom plate 1031 or the second frame 1032 and communicates with the inside and outside of the second accommodating space 12 .

[0120] 2 , the positive and negative electrodes of the light-emitting chip 104 need to be connected to a second conductive structure respectively. In this case, the laser includes two second conductive structures, which can be arranged on the side of the light-emitting chip 104 away from the target side wall B, or respectively arranged on both sides of the light-emitting chip 104 in the y direction.

[0121] In some embodiments, during the assembly of the laser 10 containing the package structure 103, the second frame 1032 can be first secured to the base plate 1031, and then the light-emitting chip 104 can be mounted on the base plate 1031. After the light-emitting chip 104 is mounted on the base plate 1031, the electrode of the light-emitting chip 104 can be connected to one end of the second conductive structure located within the second accommodating space 12, thereby allowing the light-emitting chip 104 to communicate with the outside of the second accommodating space 12 enclosed by the package structure 103. The second cover 1033 can then be secured to the side of the second frame 1032 away from the base plate 1031 to seal the light-emitting chip 104. Thereafter, the package structure 103 with the light-emitting chip 104 mounted thereon can be secured as a whole to the substrate 101, and the end of the second conductive structure located outside the second accommodating space 12 can be connected to the end of the first conductive structure located within the first accommodating space 11, thereby providing power to the light-emitting chip 104.

[0122] Afterwards, power is supplied to the light-emitting chip 104 to illuminate it. The mounting position of the component through which the laser beam is to pass is adjusted based on the illumination conditions of the laser beam emitted by the light-emitting chip 104. Once the appropriate mounting position is determined, the component is mounted. For example, to mount the wavelength conversion component 105, a target can be placed at the desired location. The target's position is then adjusted based on the illumination conditions of the laser beam emitted by the light-emitting chip 104 on the target. When the illumination conditions of the laser beam on the target meet the desired illumination conditions for the wavelength conversion component 105, the target's position is determined as the mounting position for the wavelength conversion component 105. The target is then removed and the wavelength conversion component 105 is placed at that location.

[0123] In some embodiments of the present disclosure, the light-emitting chip 104 is primarily described as being disposed on a heat sink 107. In some embodiments, when the package structure 103 has a base plate 1031 made of ceramic, the light-emitting chip 104 can also be disposed directly on the base plate 1031 without disposing a heat sink 107.

[0124] In some embodiments, referring to FIG4 , the difference from the laser in FIG1 lies in the different form of the second accommodation space 12. The package structure 103 includes a second frame 1032 and a second cover 1033 . The second frame 1032 is fixed to the substrate 101 at its end surface adjacent to the substrate 101 . The substrate 101, the second frame 1032, and the second cover 1033 enclose the second accommodation space 12 for sealing the light-emitting chip 104 .

[0125] In some embodiments, in the laser 10 where the packaging structure 103 shown in Figure 4 is located, a second conductive structure can be provided in the second frame 1032, and one end of the second conductive structure located within the enclosed area of ​​the second frame 1032 is connected to the light-emitting chip 104, and the other end located outside the enclosed area is connected to the first conductive structure.

[0126] 23 , the second conductive structures J in the package structure 103 are located on both sides of the light-emitting chip 104 in the y-direction. For example, the upper surface of the light-emitting chip 104 can serve as the cathode, and the upper surface of the heat sink 107 can serve as the anode. Here, the upper surface refers to the surface of the light-emitting chip 104 or the heat sink 107 in the z-direction.

[0127] In some embodiments, the packaging structure 103 may cover a portion of the annular plate 1021 , one end of the first conductive structure in the annular plate 1021 is located in the enclosed space of the packaging structure 103 , and the light-emitting chip 104 may be directly connected to the first conductive structure to connect to an external circuit.

[0128] During the assembly process of the laser 10 in which the package structure 103 shown in FIG4 is located, the light-emitting chip 104 can first be mounted on the substrate 101, and the electrodes of the light-emitting chip 104 can be electrically connected to the second conductive structure or the first conductive structure. Then, an adhesive (such as silver glue or other adhesive) is placed around the light-emitting chip 104, and the second frame 1032 is fixed to the substrate 101 using the adhesive, surrounding the light-emitting chip 104. Finally, the second cover 1033 is fixed to the second frame 1032 to seal the light-emitting chip 104.

[0129] 5 , the package structure 103, substrate 101, and first frame 102 together form a second accommodation space 12 for accommodating the light emitting chip 104. The package structure 103 can be fixed to the three first sidewalls 1022 of the first frame 102 to form the second accommodation space 12.

[0130] Referring to Figure 5 , the light-emitting chip 104 is positioned on the substrate 101. The package structure 103 is L-shaped and includes a target sidewall B and a second cover 1033. The end of the target sidewall B closest to the substrate 101 (e.g., the end in the z-direction) is fixed to the substrate 101, and the end of the target sidewall B away from the substrate 101 is connected to the second cover 1033. The other edges of the package structure 103 are fixed to the corresponding first sidewalls 1022 of the first frame 102.

[0131] 6 , the first sidewall 1022 distal from the wavelength conversion component 105 has a sealing step T protruding into the first accommodating space 11. The second cover 1033 of the package structure 103 is fixed to the sealing step T. For example, a region of the surface of the second cover 1033 proximal to the substrate 101 and distal to the target sidewall B is fixed to a surface of the sealing step T distal from the substrate 101. The sealing step T may be strip-shaped, with both ends of the sealing step T in the y-direction contacting the two first sidewalls 1022, respectively.

[0132] In some embodiments, the sealing step T is located at one end of the second sidewall close to the annular plate 1021, and the bottom of the sealing step T is fixed to the annular plate 1021. Alternatively, a gap may exist between the sealing step T and the annular plate 1021.

[0133] In some embodiments, the target side wall B and the second cover 1033 may be an integral piece, and the target side wall B and the second cover 1033 may be made of the same material.

[0134] It should be noted that the packaging structure 103 can be formed by a molding process. For example, the packaging structure 103 can be fixed to the substrate 101 and the first frame 102 by bonding (such as ultraviolet curing glue or thermosetting glue).

[0135] During the assembly process of the laser 10 in which the packaging structure 103 shown in FIG. 6 is located, the light emitting chip 104 is directly connected to the external circuit through the first conductive structure in the annular plate 1021 to achieve current transmission to the light emitting chip 104 .

[0136] In some embodiments, the laser 10 further includes a soldering station, which can be located together with the light-emitting chip 104 in the second accommodation space 12 formed by the packaging structure 103. The soldering station is located between the light-emitting chip 104 and the sealing step T. The soldering station is electrically connected to the first conductive structure and is configured to assist in electrically connecting the light-emitting chip 104 to the first conductive structure.

[0137] It should be noted that the electrodes of the light-emitting chip 104 can be connected to the soldering station via wires, and then electrically connected to the first conductive structure via the soldering station. In some embodiments, the second accommodation space 12 formed by the packaging structure 103 of the laser 10 can accommodate multiple light-emitting chips 104. The laser light emitted by multiple light-emitting chips 104 can be directed toward the same wavelength conversion component 105. This can improve the fluorescence light extraction efficiency of the laser 10.

[0138] For example, the lasers emitted by the multiple light emitting chips 104 are directed toward the same region of the wavelength conversion component 105 to stimulate the region to emit fluorescence.

[0139] For another example, the lasers emitted by the multiple light-emitting chips 104 can be directed toward different regions of the wavelength conversion component 105. The lasers emitted by each light-emitting chip 104 excite the corresponding region to emit fluorescence. The multiple light-emitting chips 104 can be arranged in a row, and the light emission directions of the multiple light-emitting chips 104 are parallel to each other.

[0140] In some embodiments, the laser 10 may include multiple packaging structures 103. One or more light-emitting chips 104 are disposed within the second housing space 12 enclosed by each packaging structure 103. The one or more light-emitting chips 104 are configured to emit laser light toward the wavelength conversion component 105. The laser light emitted by the one or more light-emitting chips 104 is directed toward the same area within the wavelength conversion component 105, or toward the central area of ​​the wavelength conversion component 105, or toward the entire area within the wavelength conversion component 105. In this way, the consistency of the laser light spot emitted by each light-emitting chip 104 can be improved, thereby enhancing the fluorescence excitation effect on the wavelength conversion component 105.

[0141] It should be noted that the arrangement positions of the multiple packaging structures 103 in the first accommodating space 11 of the laser 10 can be symmetrical about the target axis. The wavelength conversion component 105 is in the form of a sheet or a plate, and the target axis is a straight line passing through the center of the wavelength conversion component 105 and parallel to the substrate 101. The multiple packaging structures 103 are symmetrically arranged according to the target axis, and the lasers emitted by the multiple packaging structures 103 are irradiated onto the wavelength conversion component 105. The energy of the laser irradiation received by each position of the wavelength conversion component 105 is relatively uniform. In this way, it is beneficial to improve the uniformity of the energy received by the laser irradiation at each position on the wavelength conversion component 105, and ensure the fluorescence excitation effect of the wavelength conversion component 105.

[0142] In some embodiments, when the wavelength conversion component 105 is arranged perpendicular to the substrate 101 , such as the thickness direction of the wavelength conversion component 105 is parallel to the surface of the substrate 101 , the target axis is the central axis of the wavelength conversion component 105 .

[0143] In some embodiments, referring to FIG. 7 , the laser 10 includes two packaging structures 103 and two light-emitting chips 104. The two packaging structures 103 are arranged obliquely on the substrate 101, and the arrangement positions of the two packaging structures 103 are symmetrical about the target axis h. For example, the wavelength conversion component 105 is located on a light-transmissive first sidewall 1022 of the first frame 102, and the target axis h is the central axis of the wavelength conversion component 105.

[0144] It should be noted that the laser 10 can have multiple light emission modes.

[0145] In some embodiments, the fluorescent light can be emitted from the side of the laser 10, that is, the side where the first side wall 1022 of the first frame 102 is located. Alternatively, the fluorescent light can be emitted from the top of the laser 10, that is, the fluorescent light is emitted from the first cover 106.

[0146] In different light emission modes, the structure of the first frame 102 in the laser 10 may be different, and the location and arrangement of the wavelength conversion component 105 may also be different. The following mainly describes the first frame 102 as a square frame with four first side walls 1022 as an example.

[0147] In some embodiments, referring to Figures 4 and 7, a first sidewall of the first frame 102 located on the light-emitting side of the light-emitting chip 104 is provided with an opening K. The laser further includes a light-transmitting layer C, and the opening K is covered by the light-transmitting layer C. The laser light emitted from the packaging structure 103 is directed toward the light-transmitting layer C, which is configured to transmit the received laser light. The wavelength conversion component 105 is located between the packaging structure 103 and the light-transmitting layer C. The material of the first cover 106 can be a light-transmitting material or an opaque material (for example, metal or ceramic).

[0148] In some embodiments, the wavelength conversion component 105 is disposed on the light-transmitting layer. For example, the wavelength conversion component 105 can be attached to the surface of the light-transmitting layer C near the package structure 103. In this way, the laser light emitted from the package structure 103 can excite the wavelength conversion component 105 to emit fluorescence, and the fluorescence can directly pass through the light-transmitting layer C and exit the laser 10.

[0149] In some embodiments, the light-transmitting layer C can be made of a light-transmitting material with good light-conducting properties (e.g., sapphire). When the wavelength conversion component 105 is excited to emit fluorescence, it generates heat. The light-transmitting layer C can help dissipate the heat generated by the wavelength conversion component 105 more quickly, thereby improving the fluorescent laser effect of the wavelength conversion component 105.

[0150] In some embodiments, the wavelength conversion component 105 may also be fixed on the substrate 101 and spaced apart from the packaging structure 103 and the light-transmitting layer C.

[0151] The divergence angle of the fluorescence emitted by the wavelength conversion component 105 when it is excited is relatively large. In the manner in which the wavelength conversion component 105 is arranged on the light-transmitting layer C, the wavelength conversion component 105 is located at the very end of the optical path in the laser 10. The light spot formed by the fluorescence emitted by the laser 10 can be reduced, and the energy of the fluorescence can be relatively concentrated. In addition, in this manner, the thickness of the wavelength conversion component 105 can be relatively small, and there is no need to reserve a setting position for the wavelength conversion component 105 in the first accommodating space 11, which is conducive to the miniaturization design of the laser 10. In addition, there is no need to additionally set up a structure for fixing the wavelength conversion component 105, thereby simplifying the fixing method of the wavelength conversion component 105.

[0152] In some embodiments, the size of the wavelength conversion component 105 can be smaller than that of the light-transmitting layer C. For example, the wavelength conversion component 105 and the light-transmitting layer C can both be rectangular, and the area of ​​the wavelength conversion component 105 can be smaller than that of the light-transmitting layer C. In this way, the laser can be irradiated onto the smaller wavelength conversion component 105, which is beneficial for improving the fluorescence excitation effect of the wavelength conversion component 105 and also helps save costs.

[0153] Since light will inevitably suffer certain losses when passing through any component, the laser 10 in some embodiments of the present disclosure can help improve the light extraction efficiency of the laser 10 by reducing the components through which the laser or fluorescence passes.

[0154] In some embodiments, referring to FIG8 , the laser 10 further includes a reflective component 108 (e.g., a reflective prism). The reflective component 108 is located in the first accommodating space 11 enclosed by the substrate 101 and the first frame 102 . The reflective component 108 is disposed on the light-emitting side of the light-emitting chip 104 and away from the target sidewall B. The wavelength conversion component 105 is located between the target sidewall B and the reflective component 108 ; alternatively, the wavelength conversion component 105 is located between the reflective component 108 and the first cover 106 . The reflective component 108 is fixed to at least one of the substrate 101 or the first frame 102 .

[0155] For example, the first cover 106 can be made of hard glass (such as K9 glass or sapphire glass). The laser or fluorescence reflected by the reflective component 108 is directed toward the first cover 106 and transmits through the first cover 106. The first cover 106 can be fixed to the surface of the first frame 102 away from the substrate 101 by welding or bonding. If eutectic welding is used for fixing, solder can be pre-plated on the edge of the first cover 106, and then the first cover 106 can be placed on the surface of the first frame 102 away from the substrate 101. The solder is then heated to melt the solder, thereby achieving welding of the first cover 106 to the first frame 102.

[0156] 8 and 9 , in some embodiments, the laser emitted from the package structure 103 is emitted toward the reflective component 108 , and the reflective component 108 is configured to reflect the received light (laser or fluorescent light) toward the first cover 106 along a direction away from the substrate 101 (eg, the z direction).

[0157] It should be noted that the reflective component 108 can be prismatic and have an inclined surface facing the light-emitting chip 104. The inclined surface serves as a light-reflecting surface and can be coated with a reflective film. The reflective film can reflect light across the entire wavelength range or only the received light. The base material of the reflective component can be glass or silicon.

[0158] 8 , in some embodiments, the wavelength conversion component 105 is located between the target sidewall B and the reflective component 108. The wavelength conversion component 105 is fixed to the substrate 101 and is spaced apart from the target sidewall B and the reflective component 108, respectively. The wavelength conversion component 105 is in the form of a sheet or plate, and the thickness direction of the wavelength conversion component 105 is parallel to the surface of the substrate 101.

[0159] In some embodiments, referring to Figures 9 and 18 , the wavelength conversion component 105 may also be fixed to the inclined surface of the reflective component 108, or to the surface of the target sidewall B close to the reflective component 108. When the wavelength conversion component 105 is fixed to the inclined surface of the reflective component 108, the size of the wavelength conversion component 105 may be smaller than the size of the inclined surface (for example, the orthographic projection of the wavelength conversion component 105 on the inclined surface is located within the inclined surface), and only the area of ​​the inclined surface covered by the wavelength conversion component 105 may be coated with a reflective film.

[0160] 9 , the wavelength conversion component 105 is located between the reflective component 108 and the first cover 106. The wavelength conversion component 105 is fixed to a surface of the first cover 106 close to the substrate 101. The first cover 106 can assist the wavelength conversion component 105 in dissipating heat.

[0161] It should be noted that the wavelength conversion component 105 can also be disposed on the optical path of the laser light reflected by the reflective component 108 by other fixing components, and be spaced apart from the reflective component 108 and the first cover 106. For example, the fixing components can clamp the wavelength conversion component 105 to fix the wavelength conversion component 105 and the reflective component 108 away from the surface of the substrate 101.

[0162] It should be noted that during the process of mounting the reflective component 108 in the laser 10, the mounting position of the reflective component 108 can be actively adjusted to determine an appropriate mounting position. For example, the mounting position of the reflective component 108 can be determined based on whether the shape and size of the light spot formed on the reflective component 108 by the laser light emitted by the light-emitting chip 104 meet the requirements.

[0163] To ensure fluorescence excitation of wavelength conversion component 105, the laser energy distribution on wavelength conversion component 105 needs to be relatively concentrated. Furthermore, the laser light emitted by light-emitting chip 104 has a certain divergence angle. Therefore, laser 10 may also be provided with a first collimating component to collimate the laser light. Collimating the laser light means limiting the divergence angle of the laser light to make it close to parallel light. This ensures that the laser light energy is relatively concentrated and the laser spot formed is reduced, facilitating laser transmission.

[0164] In some embodiments, referring to Figures 10 and 11, the laser 10 includes a first collimating component (such as a collimating lens 109). The collimating lens 109 is located in the first accommodating space 11 surrounded by the substrate 101 and the first frame 102. The collimating lens 109 is provided on the side of the target side wall B away from the light-emitting chip 104. The laser emitted from the packaging structure 103 is directed toward the collimating lens 109, and the collimating lens 109 is configured to collimate the received laser and then direct it toward the wavelength conversion component 105. The laser light collimated by the collimating lens 109 is directed toward the reflecting component 108, and is reflected by the reflecting component 108 and then directed toward the wavelength conversion component 105. In this way, the divergence angle of the laser light can be reduced by the first collimating component, so that the laser light is close to parallel light, the energy of the laser light is more concentrated, the light spot formed by the laser light is reduced, and the transmission of the laser light is facilitated.

[0165] In some embodiments, by designing the target sidewall B of the package structure 103, a portion of the target sidewall B can be configured as a first collimating component to collimate the laser light after it passes through the target sidewall B. For example, referring to FIG12 , the surface of the target sidewall B away from the light-emitting chip 104 is configured as a convex curved surface. The laser light emitted by the light-emitting chip 104 can be collimated after passing through the convex curved surface of the target sidewall B.

[0166] In some embodiments, the surface of the target side wall B close to the light emitting chip 104 may be a convex arc surface.

[0167] In some embodiments, the target sidewall B of the package structure 103 may have a convex curved surface that projects into or out of the second accommodating space 12 enclosed by the package structure 103, thereby collimating the received laser light before emitting it. This eliminates the need for an additional collimating lens, reduces the number of components, and facilitates a miniaturized design of the laser 10.

[0168] In some embodiments, the laser 10 includes multiple light emitting chips 104 , and the number of collimating lenses 109 is the same as the number of light emitting chips 104 . Each light emitting chip 104 corresponds to a collimating lens 109 , and the laser light emitted by each light emitting chip 104 is collimated by the corresponding collimating lens 109 .

[0169] It should be noted that during the mounting process of collimating lens 109, the mounting position of collimating lens 109 can be actively adjusted. For example, the mounting position of collimating lens 109 can be determined based on whether the shape and size of the light spot formed by the laser light emitted by light-emitting chip 104 after passing through collimating lens 109 meet the requirements. In this way, the shape and size of the light spot formed by the laser light collimated by collimating lens 109 after mounting can be ensured to meet the requirements, thereby improving the light output quality of laser 10.

[0170] Referring to Figure 11 , during the mounting process of collimating lens 109 and reflective component 108, first ensure that the light-emitting chip 104, collimating lens 109, and reflective component 108 are aligned. Next, the position of collimating lens 109 is adjusted so that the shape and size of the light spot formed on reflective component 108 by the laser light emitted by the light-emitting chip 104 after passing through collimating lens 109 substantially meet the requirements. After the position of collimating lens 109 is determined, the position of reflective component 108 can also be adjusted to a certain extent to ensure that the shape and size of the light spot on reflective component 108 after mounting meet the requirements, thereby also ensuring that the laser light emitted by reflective component 108 meets the requirements.

[0171] Referring to Figure 13 , one or more limiting bosses N can be provided on the end of the heat sink 107 near the target sidewall B. These limiting bosses N are located outside the area where the light-emitting chip 104 is located to avoid blocking the laser light emitted by the light-emitting chip 104. For example, if two limiting bosses N are provided on the end of the heat sink 107 near the target sidewall B, the two limiting bosses N are located on either side of the light-emitting chip 104. The protruding distance L of each limiting boss N is equal to the sum of the distance L1 between the light-emitting chip 104 and the target sidewall B and the distance L2 that the light-emitting chip 104 extends from the heat sink 107. In this way, when the heat sink 107 is mounted, the limiting bosses N can be directly abutted against the target sidewall B, thereby ensuring that the target sidewall B has a good collimation effect on the laser light.

[0172] In some embodiments, a converging lens may be further provided outside the first accommodating space 11 of the laser 10 to converge the fluorescent light emitted by the laser 10 .

[0173] 14 and 15 , the substrate 101 is fixed to the first frame 102, and the light emitting chip 104, the reflective component 108, and the wavelength conversion component 105 are respectively located on the substrate 101 and surrounded by the first frame 102. It should be noted that FIG15 does not illustrate the first cover 106.

[0174] The encirclement described in the embodiments of the present disclosure may be a semi-encirclement or a full encirclement.

[0175] For example, referring to Figure 14 , the first frame 102 completely surrounds all components on the substrate 101. The substrate 101 and the first frame 102 enclose a first accommodating space 11. The substrate 101 is configured to form the bottom of the first accommodating space 11, and the first frame 102 forms the sidewalls of the first accommodating space 11. The light-emitting chip 104, the reflective component 108, and the wavelength conversion component 105 are all located within the first accommodating space 11.

[0176] 15 , the light emitting chip 104 is located on the substrate 101 , and the orthographic projection of the light emitting chip 104 may be located on the substrate 101 . In this way, the heat generated by the light emitting chip 104 may be dissipated through the substrate 101 .

[0177] 14 and 15 , the reflective component 108 is located on the light-emitting side of the light-emitting chip 104, and the light-emitting chip 104 and the reflective component 108 are sequentially arranged along the light-emitting direction (e.g., the x-direction) of the light-emitting chip 104. The reflective component 108 can be prism-shaped, and the arrangement direction of the upper and lower bases of the prism (i.e., the height direction, e.g., the opposite direction of the z-direction) can be perpendicular to the light-emitting direction of the light-emitting chip 104.

[0178] In some embodiments, the side surface of the reflective component 108 near the light-emitting chip 104 is an inclined surface, which faces the light-emitting chip 104 and is away from the substrate 101. The angle between the inclined surface and the first surface 1011 of the substrate 101 is an acute angle, for example, 45 degrees. The inclined surface can serve as a light-reflecting surface.

[0179] 14 and 15 , the wavelength conversion component 105 is located between the light emitting chip 104 and the reflective component 108. For example, the wavelength conversion component 105 is located on the inclined surface of the reflective component 108. For example, the wavelength conversion component 105 is in the form of a sheet or plate and is attached to the inclined surface.

[0180] In some embodiments, the laser light emitted by the light-emitting chip 104 is directed toward the wavelength conversion component 105. Once the laser light is directed toward the wavelength conversion component 105, it can stimulate the wavelength conversion component 105 to emit light having a wavelength different from the laser light, thereby converting the wavelength of the laser light. This improves the flexibility of the laser 10 and enriches its application scenarios.

[0181] It should be noted that the fluorescence generated by the wavelength conversion component 105 can be emitted toward the first cover 106 and pass through the first cover 106, thereby achieving light emission of the laser 10. The surface of the wavelength conversion component 105 close to the inclined surface is a reflective surface.

[0182] 14 and 16 , the reflective surface is configured to emit the fluorescent light in a direction away from the substrate 101 (eg, z-direction) and then toward the first cover 106 .

[0183] In some embodiments, a reflective film may be plated on the inclined surface to achieve the light reflecting effect of the inclined surface.

[0184] It should be noted that the reflective film may be a reflective film for light of all wavelengths, or may be a reflective film for only fluorescence.

[0185] In some embodiments, the reflective film may cover the entire area of ​​the inclined surface, or may only cover the area of ​​the inclined surface where the wavelength conversion component 105 is provided.

[0186] For example, the area of ​​the wavelength conversion component 105 can be smaller than the area of ​​the inclined surface of the reflective component 108. In this way, the laser is evenly irradiated onto the smaller wavelength conversion component 105, which is beneficial to improving the fluorescence excitation effect of the wavelength conversion component 105 and avoiding material waste.

[0187] In some embodiments, referring to Figures 16 and 17 , the first frame 102 does not include the annular plate 1021, but only includes a plurality of first sidewalls 1022. The first frame 102 can be located on the substrate 101, with one end face of the first frame 102 in the axial direction (e.g., the z-direction) being fixed to the first surface 1011 of the substrate 101. This approach is equivalent to also providing the annular plate 1021 in Figure 14 as the substrate 101.

[0188] For example, the plurality of first side walls 1022 in the first frame body 102 may directly surround the substrate 101 , and the inner wall surface of each first side wall 1022 may be fixed to the outer surface of the substrate 101 .

[0189] It should be noted that the reflective component 108 and the substrate 101 can be independent of each other. When assembling the laser 10 , the reflective component 108 needs to be mounted on the substrate 101 .

[0190] Referring to Figures 16 and 17 , in some embodiments, the substrate 101 and the reflective component 108 are integrally formed. The reflective component 108 is located on the first surface 1011 of the substrate 101, at an edge on the light-emitting side of the light-emitting chip 104. The substrate 101 may be rectangular and have four edges. The reflective component 108 may be located at one of the four edges on the light-emitting side of the light-emitting chip 104.

[0191] 17 , the reflective component 108 may be strip-shaped, and its length in the y direction may be equal to the length of the edge. The side of the reflective component 108 away from the light emitting chip 104 is flush with the side of the substrate 101 away from the light emitting chip 104 .

[0192] In some embodiments, referring to FIG. 16 , the material of the reflective component 108 can be the same as that of the substrate 101. The wavelength conversion component 105 is disposed on the inclined surface of the reflective component 108. When excited to emit fluorescence, the wavelength conversion component 105 generates heat. This heat can be transferred to the substrate 101 through the reflective component 108, allowing the heat to be dissipated more quickly, thereby ensuring the fluorescence excitation effect of the wavelength conversion component 105.

[0193] It should be noted that there may not be a fixed interface between the reflective component 108 and the substrate 101 , and the heat transfer between the reflective component 108 and the substrate 101 will not be hindered by the interface, thereby increasing the heat dissipation speed.

[0194] In some embodiments, referring to Figures 16 and 17, the first frame 102, the substrate 101 and the reflective component 108 enclose a first accommodating space 11. The first frame 102 can semi-enclose the light-emitting chip 104, the reflective component 108 and the wavelength conversion component 105. Referring to Figure 17, the first frame 102 includes a first first side wall (such as D1), a second first side wall (such as D2) and a third first side wall (such as D3) connected in sequence. The second first side wall is opposite to the reflective component 108, and the first first side wall and the third first side wall are respectively fixed to two side surfaces of the reflective component 108 on opposite sides of the inclined surface, such as being fixed to two side surfaces of the reflective component 108 opposite to each other in the y direction.

[0195] For example, the ends of the first and third first side walls that are distal to the second first side wall are fixed to the two side surfaces. Alternatively, portions of the inner wall surfaces of the first and third first side walls that are distal to the second first side wall are fixed to the two side surfaces. Here, the inner wall surface refers to the surface of the corresponding first side wall that is adjacent to the first accommodating space 11.

[0196] It should be noted that the inner wall surfaces of the first first side wall, the second first side wall, and the third first side wall can also be fixed to the three side surfaces of the substrate 101. Partial edge areas of the first cover 106 can be fixed to the surfaces of the first first side wall, the second first side wall, and the third first side wall. There is also a possibility that partial edge areas of the first cover 106 are fixed to the surface of the reflective component 108 away from the substrate 101.

[0197] 18 and 19 , in some embodiments, the laser 10 further includes a first connecting portion (e.g., a sealing block R). The sealing block R has two ends connected to the first first side wall (e.g., D1) and the third first side wall (e.g., D3), and a surface of the sealing block R close to the reflective component 108 (e.g., the surface in the opposite direction of the z-direction) is fixed to a surface of the reflective component 108 away from the substrate 101.

[0198] It should be noted that the surface of the sealing block R away from the reflective component 108 (such as the surface in the z direction) and the surface of the first first side wall, the second first side wall (such as D2) and the side surface of the third first side wall away from the substrate 101 form a flat annular surface. In this way, the sealing effect of the contact area between the annular surface and the first cover body 106 can be ensured to be better.

[0199] In some embodiments, referring to Figures 20 and 21, the first frame 102 includes a second connecting portion (such as a plate-shaped portion F), and the second first side wall (such as D2) is located on the plate-shaped portion F. The bottom surfaces of the first first side wall (such as D1) and the third first side wall (such as D3) can be flush with the bottom surface of the plate-shaped portion F. The side surface of the substrate 101 close to the second second side wall is fixed to the side surface of the plate-shaped portion F, and the two side surfaces of the substrate 101 connected to the side surface are respectively fixed to the first first side wall and the third first side wall. For example, based on Figures 16 and 17, the first frame 102 can also include a plate-shaped portion F, etc.

[0200] The plate-shaped portion F may be provided with a conductive structure W that connects the inside and outside of the enclosed area of ​​the first frame body 102. The light-emitting chip 104 is electrically connected to one end of the conductive structure W located within the enclosed area of ​​the first frame body 102. Figure 21 only illustrates the exposed portion of the conductive structure W located outside the enclosed area of ​​the first frame body 102. This facilitates circuit connection of the light-emitting chip 104. For details about this circuit structure W, please refer to the above description of the circuit structure in the annular plate 1021 and will not be repeated here.

[0201] Based on any of the above lasers 10 , the structure and function of the packaging structure 103 in the laser 10 shown in FIG22 are similar to those of the packaging structures shown in FIG1 and FIG3 , and are not described in detail here.

[0202] In some embodiments, the packaging structure 103 may also not include the base plate 1031. Referring to Figure 24, the packaging structure 103 includes a second frame body 1032 and a second cover body 1033. The second frame body 1032 is fixed to the first surface 1011. The substrate 101, the second frame body 1032 and the second cover body 1033 form a second accommodating space 12 for sealing the light-emitting chip 104.

[0203] It should be noted that the base plate 1031 is not required between the light emitting chip 104 and the substrate 101. The heat generated by the light emitting chip 104 can be directly transferred to the substrate 101 and then dissipated to the outside through the substrate 101. This can shorten the heat dissipation path and improve the heat dissipation effect of the laser 10.

[0204] In the laser 10 where this packaging structure 103 is located, a second conductive structure can be provided in the second frame 1032, and one end of the second conductive structure located within the enclosed area of ​​the second frame 1032 is connected to the light-emitting chip 104, and the other end located outside the enclosed area is connected to the first conductive structure.

[0205] Alternatively, the packaging structure 103 may cover a partial area of ​​the plate-shaped portion F of the first frame 102 , one end of the first conductive structure in the plate-shaped portion F is located in the enclosed space of the packaging structure 103 , and the light-emitting chip 104 may be directly connected to the first conductive structure to connect to an external circuit.

[0206] The assembly process of the laser 10 in which the packaging structure 103 shown in FIG24 is located is similar to that described above and will not be repeated here.

[0207] In some embodiments, referring to Figure 25 , the light emitting chip 104 is located on the substrate 101. The package structure 103 in Figure 25 is similar to that in Figure 4 and will not be described again.

[0208] 26 , the first sidewall 1022 of the first frame 102 away from the wavelength conversion component 105 has a sealing step T protruding toward the second accommodating space 12 . The second cover 1033 is fixed to the sealing step T.

[0209] For example, the area of ​​the second cover 1033 close to the first surface 1011 away from the target sidewall B is fixed to the surface of the sealing step T away from the substrate 101. The sealing step T can be strip-shaped, with both ends of the sealing step T in the y direction contacting the two first sidewalls 1022 respectively.

[0210] In some embodiments, the sealing step T is located at one end of the corresponding first side wall 1022 close to the plate-shaped portion F, and the bottom of the sealing step T is fixed to the plate-shaped portion F. Alternatively, there may be a gap between the sealing step T and the plate-shaped portion F, that is, the two are separated by a predetermined distance.

[0211] 25 and 26 , the target side wall B and the second cover 1033 may be an integral piece, and the target side wall B and the second cover 1033 may be made of the same material, such as a light-transmitting material such as glass or sapphire.

[0212] In the laser device 10 in which the packaging structure 103 is located, the light-emitting chip 104 is directly connected to the external circuit through the first conductive structure in the plate-shaped portion F, so as to achieve current transmission to the light-emitting chip 104 .

[0213] 27 , the laser 10 includes two package structures 103 and two light emitting chips 104. The two package structures 103 are tilted on the substrate 101, and the two package structures 103 are symmetrical about the target axis h.

[0214] 28 , a collimating lens 109 is positioned between the light emitting chip 104 and the wavelength conversion component 105. The laser light emitted by the light emitting chip 104 is directed toward the collimating lens 109, which is configured to collimate the received laser light before emitting it. The laser light directed toward the wavelength conversion component 105 is the collimated laser light.

[0215] 29 , the collimating lens 109 is disposed on the substrate 101 and located on a side of the target sidewall B away from the light emitting chip 104 . In this way, the laser light emitted from the package structure 103 can be directed toward the collimating lens 109 .

[0216] It should be noted that the process of mounting the collimating lens 109 in the laser 10 shown in FIG29 and the process of mounting the collimating lens 109 and the reflective component 108 are similar to those in FIG11 and will not be repeated here.

[0217] The packaging structure 103 in FIG30 is similar to the packaging structure in FIG12 and will not be described again here.

[0218] It should be noted that, similar to Figure 13, in the laser 10 shown in Figure 30, one or more limiting bosses N can be provided at one end of the heat sink 107 close to the target side wall B, and the limiting bosses N are located outside the setting area of ​​the light-emitting chip 104 to avoid blocking the laser emitted by the light-emitting chip 104.

[0219] Regarding the relative positional relationship between the limiting boss N, the light emitting chip 104 and the target side wall, reference may be made to the above-mentioned related contents, which will not be elaborated here.

[0220] It should be noted that the lasers shown in FIG. 31 to FIG. 49 do not include the wavelength conversion component 105 .

[0221] 31 , a first accommodating space 11 is defined between the substrate 101 and the first frame 102. The packaging structure 103, the light emitting chip 104, and the target optical element 15 are respectively located in the first accommodating space 11.

[0222] The first cover 106 is fixed to a side of the first frame 102 away from the substrate 101 . The first cover 106 is configured to seal the first accommodating space 11 .

[0223] In some embodiments, the first frame 102 is located on the first surface 1011, and one end surface of the first frame 102 is fixedly connected to the first surface 1011. The first frame 102 may be substantially square-shaped and include four first side walls connected in sequence.

[0224] The packaging structure 103 is configured to seal the light emitting chip 104 and can independently define the second accommodation space 12. It should be noted that the packaging structure 103 and packaging process in the laser 10 shown in FIG31 are similar to those in FIG1 and will not be described in detail here.

[0225] In some embodiments, the package structure 103 includes a light-transmitting target sidewall B located on the light-emitting side of the light-emitting chip 104. The light-emitting chip 104 is configured to emit laser light toward the target sidewall B. The laser light passes through the target sidewall B and is emitted toward the target optical element 15. The target optical element 15 is an element in the laser 10 that adjusts the laser light. The target optical element 15 is configured to emit the received laser light out of the first accommodating space 11 to achieve light emission of the laser 10.

[0226] 31 , the substrate 101, the first frame 102, and the first cover 106 together form the overall package for the laser 10. After the packaging structure 103 performs a primary package on the light-emitting chip 104, the first cover 106, the substrate 101, and the first frame 102 can perform a secondary package on the light-emitting chip 104, as well as package the packaging structure 103 and the target optical element 15.

[0227] When assembling the laser 10 , the light emitting chip 104 can be packaged once in the first accommodation space 11 through the packaging structure 103 , and then the target optical element 15 is mounted on the substrate 101 , and then the first cover 106 is fixed on the side of the first frame 102 away from the substrate 101 .

[0228] It should be noted that the light emitting chip 104 can be illuminated during the mounting process of the target optical element 15. Since the packaging structure 103 seals the light emitting chip 104, the light emitting chip 104 will not be damaged by external contaminants, and the operating reliability of the light emitting chip 104 can still be guaranteed.

[0229] After the light-emitting chip 104 is illuminated, the mounting position of the target optical element 15 can be adjusted based on the illumination of the laser light emitted by the light-emitting chip 104. This is to actively adjust the target optical element 15. For example, the position of the target optical element 15 can be adjusted based on the size and shape of the laser spot formed on the target optical element 15, or the size and shape of the laser spot formed at a specified position after passing through the target optical element 15.

[0230] This ensures that the laser light emitted by the light-emitting chip 104 meets the requirements for irradiation on the target optical element 15, and accordingly, the laser light emitted after passing through the target optical element 15 also meets the requirements, without the need to re-mount the target optical element 15 after packaging. Furthermore, it can be ensured that the beam quality and the resulting spot shape of the laser light emitted by the laser 10 meet the requirements, ensuring that the light-emitting effect of the laser 10 is good. It should be noted that the arrangement and packaging process of the light-emitting chip 104 and the heat sink 107 of the laser 10 shown in FIG31 are similar to those of the light-emitting chip 104 and the heat sink 107 shown in FIG1 , and will not be further described here.

[0231] In some embodiments, the packaging structure 103 may further define a second accommodation space 12 together with other components. For example, referring to FIG32 , the packaging structure 103 and the substrate 101 may define a second accommodation space 12 together. The packaging structure 103 and the packaging process in the laser 10 shown in FIG32 are similar to those of the packaging structure 103 in FIG4 and are not further described here.

[0232] Referring to Figures 33 and 34, Figure 34 is an exploded view of the laser 10 shown in Figure 33. In some embodiments, referring to Figure 33, the packaging structure 103, the first frame 102, and the substrate 101 collectively define a second accommodating space 12. The packaging structure 103 and packaging process in the laser 10 shown in Figure 33 are similar to those of the packaging structure 103 in Figure 5 and are not further described here.

[0233] In some embodiments, referring to Figures 35 and 36 , Figure 36 is an exploded view of the laser 10 shown in Figure 35 . The sealing step T and packaging structure 103 of the laser 10 shown in Figure 35 are similar in location and composition to the sealing step T and packaging structure 103 in Figure 6 , and are not described again herein.

[0234] It should be noted that the substrate 101 with the conductive structure or the first frame 102 may be made of high-temperature co-fired ceramic (HTCC) or low-temperature co-fired ceramic (LTCC). The substrate 101 and the first frame 102 may be an integral part.

[0235] In some embodiments, referring to FIG37 , the laser in FIG37 differs from the laser in FIG35 in that a welding station H is further provided within the second accommodating space 12 of the laser 10 shown in FIG37 . The position and connection method of the welding station H of the laser 10 shown in FIG37 are similar to those of the welding station in FIG6 , and the packaging structure 103 of the laser 10 shown in FIG37 is similar to that in FIG6 , and thus will not be described in detail here.

[0236] In some embodiments, referring to FIG. 38 , a plurality of light-emitting chips 104 arranged in a row along the y direction are disposed in the second accommodation space formed by the packaging structure 103 of the laser 10 .

[0237] It should be noted that FIG38 takes six light-emitting chips 104 disposed in the second accommodation space as an example. Accordingly, the laser 10 includes six target optical elements 15 corresponding to the six light-emitting chips 104.

[0238] In some embodiments of the present disclosure, each laser 10 includes one packaging structure 103. In some embodiments, the laser 10 may include multiple packaging structures 103, and multiple light-emitting chips 104 are respectively located in one or more second accommodation spaces surrounded by the one or more packaging structures 103.

[0239] The above describes an embodiment in which the laser includes a plurality of different light emitting modes. Under different light emitting modes, the structure of the first frame 102 in the laser 10 will be different to some extent, and accordingly, the target optical element 15 will also be different.

[0240] In some embodiments, the target optical element 15 includes at least one of a reflective component or a collimating lens. For example, the target optical element 15 includes a reflective prism, or includes a reflective prism and a collimating lens, or includes a collimating lens.

[0241] In some embodiments, referring to FIG38 , target optical element 15 is a reflective prism. Laser light emitted by light-emitting chip 104 is reflected by the corresponding reflective prism before exiting laser 10. The function and installation process of the reflective prism shown in FIG38 are similar to those of reflective component 108 in FIG8 or FIG9 , and will not be further described here.

[0242] It should be noted that, in this type of laser 10 , the structure and function of the first cover 106 are similar to those of the first cover 106 in FIG. 8 , and are not described in detail herein.

[0243] 39 , in some embodiments, the laser 10 includes a second collimating component (eg, a convex curved surface 110 ). The convex curved surface provided on one side of the first cover 106 can constitute the second collimating component.

[0244] For example, the convex surface 110 is located on a side of the first cover 106 away from the substrate 101 . The laser reflected by the target optical element 15 passes through the first cover 106 and then travels toward the convex surface 110 , so as to be collimated by the convex surface 110 and then emitted.

[0245] 39 illustrates the light emission of a light emitting chip 104. It should be noted that when the laser 10 includes multiple light emitting chips 104, the number of convex arc surfaces 110 is the same as the number of light emitting chips 104 and they are arranged accordingly.

[0246] Each light-emitting chip 104 corresponds to a convex curved surface 110, and the laser light emitted by each light-emitting chip 104 is collimated by the corresponding convex curved surface 110. The multiple convex curved surfaces 110 can be a single piece. The first cover 106 is provided with multiple convex curved surfaces 110 on a side away from the substrate 101. Each convex curved surface 110 collimates the laser light emitted by the corresponding light-emitting chip 104 before emitting it.

[0247] In some embodiments, referring to Figure 40, based on the above-mentioned laser 10, the structure of the target side wall B of the packaging structure 103 is changed so that the target side wall B serves as a second collimating component. In this way, the laser can be collimated when passing through the target side wall B.

[0248] 40 to 42 , the surface of the target sidewall B close to the light emitting chip 104 may be a convex curved surface protruding toward the light emitting chip 104. The laser light emitted by the light emitting chip 104 may be collimated after passing through the convex curved surface of the target sidewall B.

[0249] In some embodiments, referring to Figures 43 and 38, the difference between Figure 43 and Figure 38 is that the surface of the target side wall B close to the light-emitting chip 104 can be a convex arc surface protruding toward the light-emitting chip 104, and the lasers emitted by multiple light-emitting chips 104 can be collimated after passing through the convex arc surface of the target side wall B.

[0250] In some embodiments, the surface of the target side wall B away from the light emitting chip 104 may be a convex arc surface convex toward the side away from the light emitting chip 104 . In this way, the target side wall B may also collimate the laser.

[0251] For example, as shown in FIG44 , based on the laser 10 shown in FIG31 , the surface of the target sidewall B of the package structure 103 away from the light-emitting chip 104 may be a convex curved surface. As shown in FIG45 , based on the laser 10 shown in FIG32 , the surface of the target sidewall B of the package structure 103 away from the light-emitting chip 104 may be a convex curved surface.

[0252] In this way, the laser is collimated by the target side wall B, and there is no need to provide a second collimating component on the first cover 106 , thereby reducing the height of the laser 10 and facilitating miniaturization of the laser 10 .

[0253] In some embodiments, referring to FIG. 46 , the target optical element 15 includes a second collimating component (such as a collimating lens 109 ) and a reflecting component 108 (such as a reflecting prism) located on the substrate 101 , and the light-emitting chip 104 , the collimating lens 109 and the reflecting component 108 are arranged in sequence along the x direction.

[0254] The process of mounting the collimating lens 109 in the laser 10 shown in FIG46 and the process of mounting the collimating lens 109 and the radiation component 108 are similar to those in FIG11 and will not be repeated here.

[0255] In some embodiments, referring to FIG. 47 , the structure and function of the opening K of the laser 10 shown in FIG. 47 are similar to those of the opening K in FIG. 4 , and are not described again herein.

[0256] 47 , the target optical element 15 may be a second collimating component (e.g., a collimating lens). Laser light emitted by the light-emitting chip 104 passes through the target sidewall B of the package structure 103 and then travels toward the collimating lens. After being collimated by the collimating lens, the laser light travels toward the light-transmitting layer C and is emitted from the light-transmitting layer C.

[0257] During the mounting process of the collimating lens of the laser 10, the mounting position of the collimating lens can be determined based on whether the shape and size of the light spot formed at the opening K of the first frame body 102 after the laser light emitted by the light-emitting chip 104 passes through the collimating lens meets the requirements. This ensures that the shape and size of the light spot formed by the laser light collimated by the mounted collimating lens meet the requirements, thereby improving the light output quality of the laser 10.

[0258] In some embodiments, if the optical power of a single laser 10 cannot meet the light source requirements, multiple lasers 10 can be used to form a laser assembly, which can be used as a light source to provide a higher optical power. Referring to FIG48 , the example of a laser assembly in which the laser 10 includes a single light-emitting chip 104 is used. Referring to FIG49 , the laser 10 in the laser assembly includes multiple light-emitting chips 104.

[0259] 48 and 49 , the laser assembly includes a carrier plate 20 and a plurality of lasers 10 located on the carrier plate 20. The plurality of lasers 10 can be arranged in a row (as shown in FIG49 ) or in multiple rows and columns (as shown in FIG48 ) on the carrier plate 20. The laser assembly employs the packaging method shown in FIG49 , which can reduce the package volume to a certain extent and increase the number of light-emitting chips that can be packaged.

[0260] Here, the material of the carrier plate 20 may include metal (such as copper plate). A circuit may be set on the carrier plate 20, and the multiple lasers 10 can be connected through the circuit on the carrier plate 20. For example, an insulating material can be sprayed outside the area where the lasers 10 are mounted on the carrier plate, and a circuit can be set on the insulating material, and then an insulating material can be sprayed on the circuit. The carrier plate 20 can also assist the laser 10 in dissipating heat. The insulating material can also be a heat dissipation material.

[0261] For example, multiple lasers 10 in a laser assembly can emit laser light of the same color to meet the high-power requirements of the light source. Alternatively, different lasers 10 can emit laser light of different colors. For example, a laser assembly can include a red laser, a green laser, and a blue laser to emit red laser light, green laser light, and blue laser light, respectively, to ensure that the laser assembly meets the requirements of a red, green, and blue light source.

[0262] The lasers 10 in the laser assembly can be combined arbitrarily. The assembly of the lasers 10 is relatively flexible and can adapt to the needs of different usage scenarios.

[0263] Those skilled in the art will understand that the scope of the present invention is not limited to the above specific embodiments, and that certain elements of the embodiments may be modified and replaced without departing from the spirit of the present application. The scope of the present application is limited by the appended claims.

Claims

1. A laser comprising: substrate; a first frame body, the first frame body being fixed to the substrate to define a first accommodating space; at least one packaging structure, the packaging structure being located in the first accommodating space and forming a second accommodating space; at least one light-emitting chip, the light-emitting chip being located in the second accommodation space and configured to emit laser light; a target optical element, wherein the target optical element is located in the first accommodating space; a first cover, the first cover being fixed to a side of the first frame away from the substrate and configured to seal the first accommodating space; The packaging structure includes a target side wall, which is located on the light-emitting side of the light-emitting chip and is translucent. The laser emitted by the light-emitting chip transmits through the target side wall toward the target optical element, and the target optical element is configured to emit the received laser out of the first accommodating space.

2. The laser according to claim 1, further comprising: a wavelength conversion component, wherein the wavelength conversion component is located in the first accommodating space; The wavelength conversion component is located on a transmission path of the laser emitted from the packaging structure, and the wavelength conversion component is configured to emit fluorescence under the excitation of the laser, and the color of the fluorescence is different from the color of the laser.

3. The laser according to claim 2, wherein The first frame includes a plurality of first side walls connected in sequence, wherein one first side wall located on the light-emitting side of the light-emitting chip has an opening, and the laser further includes a light-transmitting layer, and the light-transmitting layer covers the opening; wherein the laser light emitted from the packaging structure is emitted toward the light-transmitting layer, and the light-transmitting layer is configured to transmit the received laser light; The wavelength conversion component is located between the packaging structure and the light-transmitting layer.

4. The laser according to claim 3, wherein The wavelength conversion component satisfies at least one of the following: The wavelength conversion component is connected to the light-transmitting layer; or, The area of ​​the wavelength conversion component is smaller than that of the light-transmitting layer.

5. The laser according to claim 3 or 4, wherein: The at least one packaging structure includes a plurality of packaging structures, the at least one light-emitting chip includes a plurality of light-emitting chips, and the plurality of packaging structures are arranged corresponding to the plurality of light-emitting chips; The multiple packaging structures are arranged in the first housing space in a symmetrical position with respect to a target axis, which is a straight line passing through the center of the wavelength conversion component and parallel to the substrate, and the multiple light-emitting chips are configured to emit laser light toward the wavelength conversion component.

6. The laser according to any one of claims 1 to 5, wherein The target optical element includes a reflective component, and the reflective component is located in the first accommodating space and on a side of the target sidewall away from the light-emitting chip; The laser light emitted from the packaging structure is emitted toward the reflective component, and the reflective component is configured to reflect the received laser light in a direction away from the substrate toward the first cover, and the first cover is further configured to transmit the received laser light; The wavelength conversion component satisfies one of the following conditions: The wavelength conversion component is located between the packaging structure and the reflective component; and The wavelength conversion component is located between the reflective component and the first cover.

7. The laser according to any one of claims 1 to 5, wherein: The packaging structure satisfies one of the following conditions: The packaging structure includes: a second frame, the second frame including the target side wall and a plurality of second side walls connected to the target side wall; the second frame is fixed to the substrate, the light-emitting chip is provided on the substrate and is surrounded by the second frame; and a second cover, the second cover being fixed to a side of the second frame away from the substrate; Wherein, the second accommodating space is defined by the packaging structure and the substrate; and The packaging structure includes: base plate; a second frame, the second frame being fixed to the bottom plate, the second frame comprising the target side wall and a plurality of second side walls connected to the target side wall, the light emitting chip being disposed on the bottom plate and surrounded by the second frame; and a second cover body, the second cover body being fixed to a side of the second frame body away from the bottom plate; Wherein, the second accommodating space is defined by the packaging structure.

8. The laser according to any one of claims 1 to 5, wherein The first frame includes an annular plate and a plurality of first side walls provided on the annular plate and connected in sequence, wherein the annular plate is provided with a conductive structure connecting the inside and outside of the area surrounded by the first frame; wherein the annular plate surrounds the base plate, and the inner annular surface of the annular plate is fixed to the side surface of the base plate; The light emitting chip is disposed on the substrate, and the light emitting chip is electrically connected to the conductive structure. 9 . The laser according to claim 1 , further comprising a first collimating component, wherein the first collimating component is configured to collimate the received laser light and direct the collimated laser light toward the wavelength conversion component.

10. The laser according to claim 9, wherein the first collimating component satisfies one of the following conditions: The first collimating component includes a collimating lens, which is located in the first accommodating space and on a side of the target sidewall away from the light-emitting chip; wherein, The laser emitted from the packaging structure is emitted toward the collimating lens; or, The first collimating component includes a convex arc surface, which is provided on the target side wall and is configured to bulge toward the inside of the second accommodating space or outside of the second accommodating space.

11. The laser according to any one of claims 1 to 10, further comprising a heat sink, wherein the heat sink is located in the second accommodation space, and the light-emitting chip is located on a side of the heat sink away from the substrate; in, A limiting boss is provided at one end of the heat sink close to the target side wall. The limiting boss abuts against the target side wall and is located outside the arrangement area of ​​the light emitting chip to avoid blocking the laser emitted by the light emitting chip.

12. The laser according to claim 1, wherein The target optical element includes a reflective component, and the laser further includes: a wavelength conversion component, wherein the reflective component and the wavelength conversion component are respectively located on the substrate and surrounded by the first frame; The reflective component is located on the light-emitting side of the light-emitting chip; the reflective component is prism-shaped, and the surface of the reflective component close to the light-emitting chip is an inclined surface, and the inclined surface faces the side away from the substrate; the wavelength conversion component is provided on the inclined surface; The laser light emitted by the light emitting chip is directed toward the wavelength conversion component. The wavelength conversion component is configured to emit fluorescence toward the first cover under the excitation of the laser light. The first cover is configured to transmit the fluorescence. The color of the fluorescence is different from that of the laser light.

13. The laser according to claim 12, further satisfying at least one of the following: The inclined surface is a reflective surface, or the surface of the wavelength conversion component close to the inclined surface is a reflective surface; wherein, The reflective surface is configured to emit the fluorescent light in a direction away from the substrate; or An area of ​​the wavelength conversion member is smaller than an area of ​​the inclined surface.

14. The laser according to claim 12 or 13, wherein: The substrate and the reflective component are integrated. The reflective component is arranged at an edge of the substrate located on the light-emitting side of the light-emitting chip. A surface of the reflective component away from the light-emitting chip is aligned with the edge of the substrate.

15. The laser according to claim 14, wherein The first frame includes a first first side wall, a second first side wall and a third first side wall connected in sequence; the second first side wall is opposite to the reflecting component, and the first first side wall and the third first side wall are respectively fixed to two side surfaces of the reflecting component located on opposite sides of the inclined surface.

16. The laser according to claim 15, wherein The first frame satisfies at least one of the following: The first frame further includes a first connecting portion, the first connecting portion connecting the first first side wall and the third first side wall, and being fixed to a surface of the reflective component away from the substrate; wherein the surface of the first connecting portion away from the reflective component and the surfaces of the first first side wall, the second first side wall, and the third first side wall away from the substrate form a flat annular surface, and the first cover is fixed to the annular surface; or, The first frame further includes a second connecting portion, the second second side wall is located on the second connecting portion; the side surface of the substrate close to the second first side wall is fixed to the side surface of the second connecting portion, and the two side surfaces of the substrate connected to the side surface are respectively fixed to the first first side wall and the third first side wall; The second connecting portion is provided with a conductive structure communicating with the inside and outside of the area surrounded by the first frame, and the light-emitting chip is electrically connected to the conductive structure.

17. The laser according to claim 1, wherein The packaging structure satisfies one of the following conditions: The packaging structure includes: a second frame, the second frame including the target side wall and a plurality of second side walls connected to the target side wall; the second frame is fixed to the substrate, the light-emitting chip is provided on the substrate and is surrounded by the second frame; and a second cover, the second cover being fixed to a side of the second frame away from the substrate; Wherein, the second accommodating space is defined by the packaging structure and the substrate; and The packaging structure includes: base plate; a second frame, the second frame being fixed to the bottom plate, the second frame comprising the target side wall and a plurality of second side walls connected to the target side wall, the light emitting chip being disposed on the bottom plate and surrounded by the second frame; and a second cover body, the second cover body being fixed to a side of the second frame body away from the bottom plate; Wherein, the second accommodating space is defined by the packaging structure; The first frame includes a plurality of first side walls connected in sequence, a first side wall opposite to the target side wall among the plurality of first side walls is provided with a sealing step protruding toward the first accommodating space, and a surface of the second cover body close to the substrate is fixed to the sealing step.

18. The laser according to claim 1 or 17, wherein: The target optical element includes a reflective component configured to reflect the received laser light in a direction away from the substrate; The laser also satisfies one of the following: The target sidewall is further configured to collimate the received laser and emit it toward the reflective component, wherein the target sidewall includes a convex arc surface, and the convex arc surface is configured to bulge toward the inside of the second accommodating space or outside of the second accommodating space; or, The laser further includes a second collimating component, which is located on a side of the first frame away from the substrate. The laser reflected by the reflecting component is emitted toward the second collimating component, and the second collimating component is configured to collimate the received laser and then emit it.

19. The laser according to claim 1 or 17, wherein: The target optical element includes a second collimating component and a reflecting component. The laser emitted by the light-emitting chip passes through the target side wall and is emitted toward the second collimating component. The second collimating component is configured to collimate the received laser and then emit it toward the reflecting component. The reflecting component is configured to reflect the received laser in a direction away from the substrate.

20. The laser according to claim 1 or 17, wherein The target optical element includes a second collimating component; a first side wall of the first frame located on a side of the target optical element away from the light-emitting chip is provided with an opening, and the laser further includes a light-transmitting layer covering the opening; The second collimating component is configured to collimate the received laser light and then emit it toward the light-transmitting layer, and the light-transmitting layer is configured to transmit the received laser light out of the first accommodating space.

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