Electronic device with mainboard, power converter module, processor module, memory module and heat sink

Abstract

An electronic device (100) includes a main board (102), a power converter module (104), a processor module (106), a memory module (108), and a heat sink (110), in which at least one of the power converter module (104), the processor module (106), and the memory module (108) is mounted on the main board (102) for signal transmission and power supply, in which the processor module (106) is mounted on the main board (102) and the memory module (108) is mounted on the main board (102). The heat sink (110) is thermally coupled with at least the processor module (106) and the memory module (108) for removing heat, and wherein the power converter module (104), the processor module (106) and the memory module (108) are arranged between the mainboard (102) and the heat sink (110).

Description

Field of the Invention

[0001] The present invention relates to an electronic device, a vehicle, and a method of manufacturing an electronic device. Background Art

[0002] Against the background of the increasing product functions of a component carrier equipped with one or more components, the ever-shrinking size of such components, and the increasing number of components or component carriers to be connected to a component carrier such as a printed circuit board, more and more powerful array-shaped components or packages having multiple components are being adopted. The array-shaped components or packages have multiple contact parts or connection parts, and the pitch between these contact parts is getting smaller and smaller. In particular, the component carrier should be mechanically stable and electrically reliable so as to be operable even under harsh conditions.

[0003] The component carrier may also form the basis for more complex electronic devices. However, the electrical, mechanical, and thermal reliability of such electronic devices may be a problem. Summary of the Invention

[0004] There may be a need to form an electronic device with high electronic functionality and high thermal reliability.

[0005] According to an exemplary embodiment of the present invention, there is provided an electronic device including a main board, a power converter module, a processor module, a memory module, and a heat sink. At least one of the power converter module, the processor module, and the memory module is mounted on the main board for signal transmission and power supply. The heat sink is thermally coupled to at least the processor module and the memory module for removing heat. The power converter module, the processor module, and the memory module are arranged between the main board and the heat sink.

[0006] According to another exemplary embodiment of the present invention, there is provided a vehicle including the electronic device having the above characteristics.

[0007] According to still another exemplary embodiment of the present invention, there is provided a method of manufacturing an electronic device. The method includes connecting a main board, a power converter module, a processor module, a memory module, and a heat sink; mounting at least one of the power converter module, the processor module, and the memory module on the main board for signal transmission and power supply; thermally coupling the heat sink to at least the processor module and the memory module for removing heat; and arranging the power converter module, the processor module, and the memory module between the main board and the heat sink.

[0008] In the context of the present application, the term "electronic device" may particularly denote a device that provides electronic functionality and includes multiple electrically and / or thermally interconnected modules.

[0009] In the context of the present application, the term "main board" may particularly denote the system board of an electronic device, on and / or above which multiple components of the electronic device may be mounted. In particular, the main board may be the mounting base of the electronic device, such as a printed circuit board (PCB). The main board may provide mechanical support, may be involved in the transmission of electrical signals with at least one other component of the electronic device, and may be involved in supplying electrical energy to at least one other component of the electronic device.

[0010] In the context of the present application, the term "power converter module" may particularly denote a module that converts electrical energy from one form to another. In particular, the power converter module may convert the supplied direct current into a converted higher direct current. Such a power converter module may be implemented as a DC (direct current)-DC converter. The DC-DC converter may include multiple electronic components (such as, a controller, at least one transistor (such as, a field effect transistor, for example, a MOSFET), at least one capacitor, and / or at least one inductor), and the multiple electronic components may be interconnected to provide a direct current conversion function. In other embodiments, the power converter module may also convert alternating current (AC) into direct current, and / or the power converter module may also convert direct current into alternating current, and / or the power converter module may also change the current value, voltage value, and / or frequency value.

[0011] In the context of the present application, the term "processor module" may particularly denote a module that includes at least one processor. The processor may be an electronic component (especially a digital circuit) configured to perform operations on external data sources, such as operations on data streams. For example, the processor may be a microprocessor, a GPU, an FPGA, a semiconductor architecture for high-performance computing. The processor may be implemented as a semiconductor chip. In particular, the processor may use built-in transistors.

[0012] In the context of the present application, the term "memory module" may particularly denote a module that includes at least one memory component. The memory component may be an electronic component (especially a semiconductor chip) capable of being configured for data storage, especially digital data storage. In particular, such a memory component may be implemented as a metal oxide semiconductor (MOS) memory, where data is stored in MOS memory cells located on a silicon integrated circuit memory chip.

[0013] In the context of the present application, the term "heat sink" may particularly denote (e.g., passive) a heat exchanger that transfers heat generated by an electronic module (in particular a processor module and / or a memory module) to a fluid medium such as air or a liquid coolant such as water, wherein the heat is dissipated away from the electronic module. For example, a heat sink may include a high heat-conducting body (e.g., made of copper or aluminum), the high heat-conducting body including a plate thermally coupled to the electronic module to be cooled, wherein a plurality of cooling fins may extend from the plate and dissipate heat to the environment. Alternatively, the heat sink may include a liquid cooling module, such as a water cooling module.

[0014] In the context of the present application, the term "module" may particularly denote an electronic component of an electronic device (in particular at least one of the above-mentioned processor module, memory module, power converter module), the electronic component may include at least one electronic component (e.g., a semiconductor chip), and the at least one electronic component is preferably encapsulated in a packaging material and / or surface-mounted on a support structure. The electronic function provided by the module may be implemented in a hard-wired manner. In addition, the electronic function of the module may be provided partially or entirely by software. In particular, the module may be a laminated module, a molded module, or a module based on an inorganic carrier. For example, any module may be a component carrier such as a printed circuit board (PCB) or an integrated circuit (IC) substrate, the component carrier having at least one embedded electronic component and / or at least one surface-mounted electronic component. Alternatively, the corresponding module may include at least one electronic component encapsulated in a molded composite. The corresponding module may also be formed based on an inorganic carrier such as a ceramic plate or a glass plate.

[0015] In the context of the present application, the term "component carrier" may particularly denote any support structure capable of accommodating one or more components thereon and / or therein to provide mechanical support and / or electrical connection. In other words, the component carrier may be configured as a mechanical and / or electronic carrier for components. In particular, the component carrier may be one of a printed circuit board, an organic interposer, and an IC (integrated circuit) substrate. The component carrier may also be a hybrid board that combines different types of the above-mentioned component carriers. In particular, the component carrier may include a stack including a plurality of electrically conductive layer structures and / or electrically insulating layer structures.

[0016] In the context of the present application, the term "stack" may particularly denote a flat or planar sheet-like body. For example, a stack may be a laminated stack, and in particular, a stack may be a laminated stack or a laminate. Such a laminate may be formed by joining a plurality of layer structures by applying mechanical pressure and / or heat. Preferably, the (especially laminated) layers may be displaced parallel to each other in space (in the direction of the thickness of the stack).

[0017] In the context of the present application, the term "layer structure" may particularly denote a continuous layer, a patterned layer, or a plurality of non-continuous islands in a common plane.

[0018] In the context of the present application, the term "vehicle" may particularly denote any machine that transports people or goods. For example, a vehicle may be configured as an automobile, an aircraft, a spacecraft, a ship, or an orbital vehicle. In particular, vehicles include motor vehicles (such as motorcycles, cars, trucks, buses, scooters), orbital vehicles, ships, amphibious vehicles, aircraft, and spacecraft.

[0019] In the context of the present application, the "main surface" of a body may particularly denote one of the two opposite largest surfaces of the body. The main surfaces may be connected by circumferential sidewalls. The thickness of a body such as a stack may be defined by the distance between two opposite main surfaces.

[0020] According to an exemplary embodiment of the present invention, an electronic device includes a power converter module for providing a power conversion function, a processor module for providing a data processing function, and a memory module for providing a data storage function. At least one of the power converter module, the processor module, and the memory module may be mounted directly (i.e., without one or more modules and / or one or more layer structures between the power converter module, the processor module, and the memory module) or indirectly (i.e., with at least one module and / or at least one layer structure between the power converter module, the processor module, and the memory module) on a main board. Preferably, two of the power converter module, the processor module, and the memory module may be mounted directly (i.e., without one or more modules and / or one or more layer structures between the power converter module, the processor module, and the memory module) or indirectly (i.e., with at least one module and / or at least one layer structure between the power converter module, the processor module, and the memory module) on the main board. The electrical interconnection between the main board, the power converter module, the processor module, and the memory module may enable: electrical signal transmission for providing electronic functions and power supply for supplying power to at least the processor module and / or the memory module. In addition, a heat sink may be thermally coupled to at least the processor module and the memory module for removing heat generated during operation of the electronic device. Advantageously, the power converter module, the processor module, and the memory module are arranged between the main board and the heat sink. This architecture may allow for creating a single-sided cooling path from the centrally arranged power converter module, processor module, and memory module towards the heat sink. At the same time, signal transmission and power supply may be managed along another path spatially separated between the main board on one hand and the power converter module, processor module, and memory module on the other hand. This architecture is particularly highly advantageous for vehicle applications (e.g., for autonomous driving control or electric motor control) where there is not enough space available for two-sided cooling and multiple modules with different functions are required. The architecture can be compatible with the limitations of a single-sided cooling environment while ensuring high thermal reliability and high electrical reliability.

[0021] Detailed Description of Exemplary Embodiments

[0022] Hereinafter, further exemplary embodiments of the electronic device, the vehicle, and the method will be described.

[0023] In an embodiment, different modules may be physically and / or electrically connected by pads, bumps, and / or balls.

[0024] In an embodiment, the main board is connected for transmitting signals to the processor module and the memory module and for transmitting power to the power converter module. High-speed data transfer can be performed between the processor module and the memory module. Thus, the main board can supply electrical signals to both the processor module and the memory module. For example, such signal supply can be directly from the main board to the processor module and the memory module, or directly from the main board to the processor module and then from the processor module to the memory module. Additionally, the main board can supply a power supply current to the power converter module, which can perform power conversion and then supply the converted power to the processor module. The memory module can receive power as provided by the main board, or can receive power as converted by the power converter module. Generally, the processor and the memory can have their own low-voltage power supply devices. In an embodiment, the main board can deliver a higher voltage to the power supply modules for the processor module and the memory module. The advantage of supplying electrical signals and power to the above modules is that it is easier to define the electrical connections, thereby achieving a compact and simple connection layout, because of the well-defined positioning of multiple modules each having a specific function and / or specific (e.g., electrical) requirements.

[0025] In an embodiment, the main board and the memory module can have the same current and / or voltage. However, the processor module can operate at different currents and / or voltages. The main board can have different currents and / or voltages relative to the memory module and relative to the processor module. Thus, three different current and / or voltage regimes can be involved. Therefore, the processor module can have one input and two different outputs, or two processor modules can be used for conversion.

[0026] In an embodiment, the power converter module is configured to convert an input current and an input voltage into a larger output current and a smaller output voltage. For example, the power converter module can be configured to provide an output current of at least 10 A or at least 30 A. In particular, the power converter module can be configured to provide an output current of at least 50 A. For example, the power converter module can be configured to provide an output current in the range of 100 A to 500 A. The input current provided from the main board to the power converter module can, for example, be in the range of 5% to 50% of the output current provided at the output of the power converter module. For example, the conversion can be from 5 V to 1 V, from 12 V to 1 V, or from 48 V to 1 V. For this purpose, a DC-DC converter can form part of the power converter module. The integration of the power converter module in the electronic device provides a compact electronic device in which a plurality of functional modules are integrated, each functional module having specific electrical requirements (such as a specific power supply value, i.e., a specific current value and voltage value), and these functional modules are appropriately connected to each other to enable a proper and short-distance electrical connection.

[0027] In an embodiment, the power converter module is a plate-shaped board. For example, the plate-shaped board can be a component carrier such as a printed circuit board. This can contribute to a flattened and compact design of the electronic device as a whole. The DC-DC converter can form part of the power converter module and can include a plurality of electronic components (such as active components, for example MOSFETs, and / or passive components, for example capacitors and / or inductors), which can be embedded in the component carrier of the power converter module.

[0028] In an embodiment, the processor module and the memory module are configured to cooperate to provide a common function. In particular, the processor module can be configured to process data stored in the memory module in its original form and / or in a processed form. Thus, the processor module and the memory module can cooperate functionally. For example, the processor module and the memory module can jointly provide a high-performance computing (HPC) function, for example for automotive applications such as autonomous driving. More generally, the processor module can be a computing module, while the memory module can be a data memory module coupled for data exchange with the processor module.

[0029] In an embodiment, the heat sink is configured to remove heat from the processor module and the memory module along thermally separated heat removal paths such that the processor module and the memory module are thermally decoupled from each other. During operation of the electronic device, the processor module may be the strongest heat source of the electronic device, such that cooling of the processor module may be crucial. At the same time, the memory module may be very sensitive to temperature. For example, the memory module may have to operate reliably at a temperature not exceeding 85 °C. Therefore, cooling of the memory module may be an important task. When sharing the same heat sink (which would be advantageous considering a compact design), the heat removal path for removing heat from the processor module can thus be spatially and thermally separated from another heat removal path for removing heat from the memory module. By taking this measure, an undesired cross-flow of heat from the processor module to the memory module can be reliably prevented. In addition, the power converter module can be directly or indirectly connected to the heat sink to dissipate heat, thereby ensuring more efficient operation of the memory module and the processor module.

[0030] In an embodiment, the electronic device is functionally divided into a signal processing region on the bottom side (including the main board and the electrically connected portions of the processor module, the memory module, and the converter module) and a heat removal region on the top side (including the heat sink and the thermally coupled portions of the processor module, the memory module, and the converter module). By this spatial separation of electrical and thermal tasks, application-related limitations for heat removal through only one side of the electronic device can be met. In addition, any undesired effects of overheating on signal and power management can be reliably prevented.

[0031] In an embodiment, the electronic device is configured for single-sided cooling via the heat sink. Thus, one or more heat paths towards the heat sink can be configured to enable heat removal with a much lower thermal resistance than other potential heat removal paths. Therefore, a clear spatial separation of the current and heat flow can be ensured by unevenly adjusting the thermal conductivity over the entire extent of the electronic device.

[0032] In an embodiment, the processor module and the memory module are mounted side by side (i.e., adjacent to each other laterally - with respect to the vertical extension direction of the electronic device, preferably perpendicular to the vertical extension direction of two opposite main surfaces) on the main board or the power converter module. In particular, the processor module and the memory module are embedded in a common disk-shaped board. Preferably, the processor module and the memory module may not be in direct physical contact. For example, Figures 1 to 3 Such an embodiment is shown. Alternatively, the processor module and the memory module may be in direct physical contact. This can achieve a high degree of compactness in the vertical direction and can simplify the independent cooling of the processor module and the memory module.

[0033] In another embodiment, the processor module and the memory module are vertically stacked on top of each other. For example, Figure 4 and Figure 5 such an embodiment is shown in. This can simplify the manufacture of the electronic device because the processor module and the memory module can be inserted into a common (in particular, stepped) cavity. In addition, this design can shorten the electrical path between the processor module and the memory module, and thus can reduce signal loss and improve signal quality.

[0034] In an embodiment, a Peltier element can be provided to direct heat to protect, for example, the memory module from overheating. The Peltier cooler may add additional power to the system, which may then need to be removed by a heat sink. This may be an option for a memory module that may be more temperature-sensitive and may operate at a lower power compared to the processor module.

[0035] In an embodiment, the processor module is mounted above the memory module. Thus, the processor module can be closer to the heat sink on the top side compared to the memory module. Since the processor module is in many cases a more significant heat source than the memory module, more efficient heat removal can be ensured by the above design rule.

[0036] In an embodiment, the processor module and the memory module are housed in a cavity inside the electronic device. The cavity can be a hollow volume in the electronic device (e.g., formed by a blind hole or a through hole), and in particular, the cavity can be a hollow volume in the power converter module. Thereby, the processor module and the memory module can be reliably protected inside the electronic device. In addition, a dielectric material, in particular a thermal interface material (TIM), can be housed in the cavity, and the dielectric material is configured to fill the empty space between at least one wall (e.g., the side wall) of the cavity and at least one wall (e.g., the side wall) of the processor module and / or the memory module.

[0037] In an embodiment, the cavity has a narrower section and a wider section, which are respectively used to house the memory module and the processor module having different lateral extension amounts. The width of the corresponding section can correspond to the width of the corresponding module (i.e., the processor module or the memory module) housed therein. Such a stepped cavity - especially in the power converter module - can enable simple and space-efficient assembly of the processor module and the memory module while avoiding excessive voids inside the electronic device.

[0038] In an embodiment, the electronic device includes a thermal bypass structure that thermally couples one of the lower ones of the processor module and the memory module to the heat sink, and the thermal bypass structure extends around one of the upper ones of the processor module and the memory module. When the processor module and the memory module are vertically stacked between the motherboard and the heat sink, the vertical spacing between one of the lower ones of the processor module and the memory module (preferably the memory module, which generally has lower requirements in terms of heat removal performance compared to the processor module) and the heat sink may be significant. To improve the thermal coupling between the lower module and the heat sink, a thermal bypass structure can be formed that is connected to the bottom side of the lower module through a high thermal conductivity structure, and the thermal bypass structure extends around the upper module among the modules in the horizontal direction (preferably, there is no thermal connection between the thermal bypass structure and the upper module among the modules) and towards the heat sink. For example, the thermal coupling at the bottom side can be achieved through a metal plate such as a clamping piece (preferably, the clamping piece refers to a metal plate mounted, associated, and / or connected to the lower module, and the rest of the bypass structure is connected to the heat sink). The thermally conductive structure extending around in the horizontal direction can be created by one or more thermal vias, which can be thermally connected to the metal plate. An optional thermal interface material (TIM) can be provided between the upper end of the corresponding thermal via and the heat sink. Through the above architecture, proper cooling of the vertically stacked processor module and memory module can be ensured.

[0039] In an embodiment, the heat sink is thermally coupled to the processor module and the memory module via a thermal coupling layer of a thermal interface material (TIM) located between the heat sink and the processor module and the memory module and / or via a metal heat dissipation layer (e.g., a copper layer) located between the heat sink and the processor module and the memory module. In particular, the thermal coupling layer and / or the metal heat dissipation layer can form an integral body without empty spaces or cavities. For example, the thermal interface material can be a thermal conductive grease for improving the heat transfer between the heat sink and the thermally connected structures (such as the processor module and / or the memory module, the aforementioned thermal bypass structure, etc.). The heat dissipation layer may also have an impact on the direction of the heat flow and may particularly promote the heat flow in the horizontal direction.

[0040] In an embodiment, the thermal coupling layer and / or the metal heat dissipation layer are blocked (in the horizontal direction) between the processor module and the memory module. This blocking can reliably separate the heat removal path between the processor module and the heat sink and the heat removal path between the memory module and the heat sink. The blocking portion or gap of the thermal coupling layer and / or the heat dissipation layer between the processor module and the memory module (when the processor module and the memory module are arranged side by side) can suppress the horizontal heat flow, especially the horizontal heat flow from the processor module to the memory module.

[0041] When using a horizontally separated heat sink, the heat sink can be electrically disconnected. With this structure, the heat sink can be directly soldered to the module, and the configured thermal resistance can be reduced.

[0042] In an embodiment, the power converter module is vertically arranged between a processor module and a memory module on one hand and a heat sink on the other hand. For example, Figure 1 such an embodiment is shown, which can provide particularly advantageous power supply performance by the following means: dividing the thermal path from the signal path, so that the module of the electrical signal is located on the side opposite to the heat sink and has a corresponding thermal coupling.

[0043] In an embodiment, the processor module is connected to transfer power from the main board via the processor module and optionally via the memory module to the power converter module. In addition, the processor module and the power converter module can be connected to transfer the converted power from the power converter module to the processor module and optionally to the memory module. Therefore, the power provided from the main board can be guided to the power converter module through the processor module. After power conversion, the power can (preferably at a higher current value) be guided back to the processor module. Optionally, the memory module can also participate in the power management chain. Therefore, the resulting processor module allows for bidirectional management of power, thus on one hand transmitting power to other components, and on the other hand receiving the power after processing, so as to achieve efficient and compact management of power in a single electronic device.

[0044] In an embodiment, the electronic device includes a vertically extending thermal coupling arrangement located between the processor module and the heat sink and optionally between the memory module and the heat sink, which is used to thermally couple the processor module to the heat sink via the power converter module and optionally thermally couple the memory module to the heat sink. In this configuration, the power converter module can also provide a heat transfer and / or thermal coupling function between at least one module and the heat sink, thus achieving an optimized and compact layout of the electronic device. Preferably, the vertically extending thermal coupling arrangement may include high thermal conductivity blocks, which are preferably connected to each other vertically through a high thermal conductivity connection medium (for example, see Figure 1) In particular, the high - thermal - conductivity connection medium is a sintered deposit. Such a thermal coupling arrangement may be particularly advantageous in the following configuration: in this configuration, the power converter module is vertically placed between, on the one hand, the processor module and the memory module and, on the other hand, the heat sink. In such a configuration, the heat generated by the processor module and the memory module can be guided from the main board towards the heat sink along a short vertical heat path extending through the power converter module. The high - thermal - conductivity block can be, for example, a copper inlay interconnected with a thermal - conductive medium such as a sintered paste of a metal. The high - thermal - conductivity block can have an edged shape (e.g., rectangular) and / or a circular shape (e.g., cylindrical). The thermal - conductivity block can be larger than the chip size so as to enable heat dissipation and further reduction of the thermal resistance. Such an architecture can allow for the establishment of an efficient cooling path from the processor module and / or the memory module to the heat sink, even when the power converter module is vertically arranged between the processor module and the memory module. In addition, since the power converter module and the heat sink are very close spatially, in the above - mentioned embodiment, cooling the power converter module is an easy task.

[0045] In another embodiment, the power converter module is vertically arranged between, on the one hand, the main board and, on the other hand, the processor module and the memory module. A corresponding embodiment is shown, for example, in Figure 2 and Figure 3 . Such a position of the components of the electronic device can simplify the cooling of the processor module and the memory module and can also increase the compactness of the electronic device in the vertical direction. Cooling of the critical components can be facilitated by the spatial proximity between, on the one hand, the processor module and / or the memory module and, on the other hand, the heat sink. Since the manufacturing process can be compatible with the side - by - side arrangement of the processor module and the memory module, vertical compactness can be achieved. In addition, placing the processor module and the memory module on the side of the power converter module opposite to the side where the main board is located allows for testing of the assembled main board and power converter module (for reliability and / or functionality) before assembling the processor and memory modules - the processor and memory modules include expensive components - thus enabling the manufacture of an electronic device including multiple modules in an efficient, reliable, and low - cost manner.

[0046] In an embodiment, the processor module and the memory module can have the same thickness in the stacking direction. Alternatively, the processor module and the memory module can have different thicknesses in the stacking direction. In Figure 2 , the memory module and the processor module need to have the same height after being assembled to the power module in order to use a thin TIM layer. In Figure 3 , a planarization process can be performed after assembly and overmolding to achieve flatness.

[0047] In an embodiment, the power converter module includes a lower density connection area on the bottom side coupled to the motherboard and a higher density connection area on the top side coupled to the processor module and the memory module. In particular, the power converter module may include a redistribution structure disposed in a bonding area between the lower density connection area on the bottom side and the higher density connection area on the top side. Different areas of the power converter module may be provided with different densities of electrical conduction wiring elements, i.e., different numbers of wiring elements per unit volume or area. The lower density connection area of the power converter module at its bottom side may form a joint with the motherboard, and the wiring element density of the motherboard may be correspondingly smaller, especially the same. The higher density connection area of the power converter module located at its top side may form a joint with the processor module and / or the memory module, and the wiring element density of the processor module and / or the memory module may be correspondingly larger, especially the same. In particular, a redistribution layer (RDL) or another type of redistribution structure may be integrated or embedded in the power converter module to provide a conversion between lower density wiring elements and higher density wiring elements. Such a redistribution structure may provide a bond between a PCB technology with a larger pitch and a semiconductor technology with a smaller pitch.

[0048] In an embodiment, the lower density connection area on the bottom side is configured for power conversion (e.g., power of at least 80W, or even at least 200W or at least 500W), and the high density connection area on the top side is configured for signal supply. Thus, the above connection areas may be differently configured to specifically implement their intended functions. Therefore, a power converter module with a heterogeneous structure can be provided.

[0049] In an embodiment, the electronic device includes a vertically extending thermally coupled arrangement structure disposed beside the processor module and the memory module (i.e., not thermally connecting the processor module and the memory module) for thermally coupling the power converter module to a heat sink. For example, in Figure 2Such an embodiment is shown. When the processor module and the memory module are vertically disposed between the power converter module and the heat sink, sufficient cooling of the processor module and the memory module as well as favorable supply of signals and energy can be ensured. However, in such an embodiment, removing heat from the power converter module may be challenging because the power converter module is separated from the heat sink by the processor module and the memory module. To ensure that the power converter module is also properly cooled, a vertically extending thermal coupling arrangement, for example in the form of one or more metal posts (e.g., copper posts), can be provided for thermally connecting the power converter module to the heat sink (in particular via additional thermal interface material (TIM) at the bottom side of the heat sink). Such a thermal coupling arrangement may include a copper ring around the module, which is welded to the power converter module.

[0050] In an embodiment, the electronic device includes an embedded thermal coupling arrangement in the main board for removing heat from the power converter module via the main board. In addition to or instead of the above-described provision of the vertically extending thermal coupling arrangement, when the power converter module is vertically disposed between the main board on one hand and the processor module and the memory module on the other hand, the power converter module can also be cooled by one or more highly thermally conductive inlays embedded in the main board. The highly thermally conductive inlays (e.g., made of copper) are a preferred embodiment of the embedded thermal coupling arrangement. Such an embodiment may be advantageous in configurations where the design of a particular application allows for double-sided cooling.

[0051] In an embodiment, the electronic device includes a redistribution structure located in the main board and / or in the power converter module. In the context of the present application, the term "redistribution structure" may particularly denote an arrangement of interconnected patterned electrically conductive layers that connect a portion with a smaller pitch to another portion with a larger pitch. "Pitch" may denote the characteristic distance between adjacent electrically conductive elements such as trace elements and / or connection elements. For example, the pitch may be the center-to-center distance of the contact pads of a component, or may be the center-to-center distance of via connections in a substrate or PCB. By connecting spatially separated portions with different pitches, the redistribution structure can form an electrical junction between larger-sized electrical connection elements and smaller-sized electrical connection elements. In particular, the number of electrically conductive elements per unit area in the portion with the larger pitch may be less than the number of electrically conductive elements per unit area in the other portion with the smaller pitch. Such a conversion between different pitch technologies can be selectively achieved in the main board and / or in the power converter module.

[0052] In an embodiment, at least one of the main board, the power converter module, the processor module, and the memory module includes a laminated and / or plate-shaped component carrier, in particular, at least some of the main board, the power converter module, the processor module, and the memory module include a laminated and / or plate-shaped component carrier, and more particularly, each of the main board, the power converter module, the processor module, and the memory module includes a laminated and / or plate-shaped component carrier. Optionally, the laminated and / or plate-shaped component carrier has at least one embedded component. Advantageously, one, some, or all of the above components of the electronic device can be implemented as a laminated component carrier, such as being implemented as a printed circuit board (PCB). In such a configuration, the electronic device can be manufactured with high vertical compactness and in a simple manner. In addition, when the individual modules are made of very similar materials, the CTE (coefficient of thermal expansion) mismatch will be small, and the thermal reliability and mechanical reliability will be excellent. At the same time, PCB technology is highly suitable for embedded components, such as semiconductor chips. Such semiconductor chips can be used as one or more processor chips of the processor module, such semiconductor chips can be used as one or more memory chips of the memory module, and / or such semiconductor chips can be used to construct a DC-DC converter (or another power converter circuit) of the power converter module.

[0053] In an embodiment, the component carrier includes a stack-up that includes at least one electrically insulating layer structure and at least one electrically conductive layer structure. For example, the component carrier can be a laminate of the one or more electrically insulating layer structures and the one or more electrically conductive layer structures mentioned, in particular, a laminate of the one or more electrically insulating layer structures and the one or more electrically conductive layer structures formed by applying mechanical pressure and / or thermal energy. The stack-up mentioned can provide a plate-shaped component carrier that can provide a large mounting surface for other components and is still very thin and compact.

[0054] In an embodiment, the component carrier is shaped like a plate. This contributes to a compact design, in which, nevertheless, the component carrier still provides a large substrate for the mounting components on the component carrier. In addition, in particular, a die, as an example of an embedded electronic component, can be conveniently embedded in a thin plate such as a printed circuit board due to its small thickness.

[0055] In an embodiment, the component carrier is configured as one of a printed circuit board, a substrate (in particular an IC substrate), and an interposer.

[0056] In the context of the present application, the term "printed circuit board (PCB)" can particularly denote a board-shaped component carrier formed by laminating a plurality of electrically conductive layer structures with a plurality of electrically insulating layer structures, for example, by applying pressure and / or by supplying heat energy. As a preferred material for PCB technology, the electrically conductive layer structures are made of copper, while the electrically insulating layer structures can include resin and / or glass fiber, a so-called prepreg, or FR4 material. The individual electrically conductive layer structures can be connected to one another in a desired manner by forming holes through the laminate, for example, by laser drilling or mechanical drilling, and by partially or completely filling these holes with an electrically conductive material (especially copper), thereby forming vias or any other through-hole connections. The filled holes connect the entire stack (i.e., through-hole connections extending through multiple layers or the entire stack), or the filled holes connect at least two electrically conductive layers, i.e., so-called vias. Similarly, optical interconnects can be formed through the individual layers of the stack to receive an electro-optical circuit board (EOCB). In addition to one or more components that can be embedded in the printed circuit board, the printed circuit board is generally configured to accommodate one or more components on one surface or on two opposite surfaces of the board-shaped printed circuit board. The one or more components can be connected to the respective main surfaces by soldering. The dielectric part of the PCB can include a resin with reinforcing fibers (such as glass fibers).

[0057] In an embodiment, the component carrier is an integrated circuit substrate. In the context of the present application, the term "integrated circuit substrate" (IC substrate) may in particular denote a component carrier having dimensions and a pitch adapted to the requirements of integrated circuit components (in particular semiconductor chips) to be mounted thereon. The IC substrate may be a relatively small component carrier with respect to a PCB, on which one or more integrated circuit components may be mounted, and which may serve as a connection body between one or more chips and the PCB. For example, the IC substrate may have approximately the same dimensions as the electronic components to be mounted on the IC substrate (e.g., in the case of a chip scale package (CSP)). In another embodiment, the IC substrate may be larger than the components allocated thereto (e.g., in a flip chip ball grid array FCBGA configuration). More specifically, the IC substrate may be understood as a carrier for electrical connectors or electrical grids, and a component carrier comparable to a printed circuit board (PCB) but having a connection portion with a relatively high density of lateral and / or vertical arrangements. The lateral connection portions are, for example, conduction paths, and the vertical connection portions may be, for example, drilled holes. These lateral connection portions and / or vertical connection portions are arranged within the IC substrate and may be used to provide electrical, thermal, and / or mechanical connections between accommodated or non-accommodated components (such as bare wafers), in particular IC chips, and the printed circuit board or the interposer. The dielectric portion of the IC substrate may include a resin having reinforcing particles (such as reinforcing spheres, in particular glass spheres). The pitch of the IC substrate, i.e., the distance between the corresponding edges of two adjacent metal structures of the IC substrate, may not exceed 150 μm, and in particular, the pitch of the IC substrate, i.e., the distance between the corresponding edges of two adjacent metal structures of the IC substrate, may not exceed 100 μm. In comparison, the pitch of some types of PCBs may be at least 200 μm, and in particular, the pitch of some types of PCBs may be at least 300 μm.

[0058] The substrate or the interposer may include or consist of a layer of at least one of the following: glass; silicon (Si) and / or a photoimageable or dry-etchable organic material, such as an epoxy-based stack material (such as an epoxy-based stack film); or a polymer compound (the polymer compound may or may not include photosensitive and / or thermosensitive molecules), such as polyimide or polybenzoxazole.

[0059] In an embodiment, the at least one electrically insulating layer structure comprises at least one of the following: a resin or polymer, such as an epoxy resin, a cyanate resin, a benzocyclobutene resin, a bismaleimide-triazine resin, a polyphenylene derivative (e.g., based on polyphenylene ether, PPE), a polyimide (PI), a polyamide (PA), a liquid crystal polymer (LCP), a polytetrafluoroethylene (PTFE), and / or a combination thereof. Reinforcement structures such as meshes, fibers, spherical parts, or other kinds of filler particles made of, for example, glass (multi-layer glass) can also be used to form composites. A semi-cured resin combined with a reinforcement, for example, a fiber impregnated with the above resin, is called a prepreg. These prepregs are usually named after their properties, such as FR4 or FR5, and the properties of these prepregs describe their flame retardant properties. Although prepregs, especially FR4, are generally preferred for rigid PCBs, other materials, especially epoxy-based stack materials (such as stack films) or photosensitive dielectric materials, can also be used. For high-frequency applications, high-frequency materials such as polytetrafluoroethylene, liquid crystal polymers, and / or cyanate resins can be preferred. In addition to these polymers, low-temperature co-fired ceramics (LTCC) or other low, very low, or ultra-low DK materials can be used as the electrically insulating structure in the component carrier.

[0060] In an embodiment, the at least one electrically conductive layer structure comprises at least one of the following: copper, aluminum, nickel, silver, gold, palladium, tungsten, and magnesium. Although copper is generally preferred, other materials or their coated variants, especially variants coated with a superconducting material or a conductive polymer, are also possible, such as graphene or poly(3,4-ethylenedioxythiophene) (PEDOT) for the superconducting material or the conductive polymer, respectively.

[0061] At least one additional component can be embedded in the stack-up and / or surface-mounted on the stack-up. The at least one additional component can be selected from at least one of the following: a non-conductive inlay, a conductive inlay (such as a metal inlay, preferably including copper or aluminum), a heat transfer unit (e.g., a heat pipe), an optical guiding element (e.g., an optical waveguide or an optical conductor connection), an electronic component, or a combination thereof. The inlay can be, for example, a metal block (IMS-inlay) with or without an insulating material coating, which can be embedded or surface-mounted for the purpose of promoting heat dissipation. Suitable materials are defined according to the thermal conductivity of the material, and the thermal conductivity should be at least 2 W / mK. Such materials are typically based on but not limited to metals, metal oxides, and / or ceramics, such as copper, aluminum oxide (Al2O3), or aluminum nitride (AlN). To improve the heat exchange capacity, other geometries with an increased surface area are also often used. In addition, the component can be an active electronic component (implementing at least one p-n junction), a passive electronic component such as a resistor, an inductor, or a capacitor, an electronic chip, a storage device (e.g., a DRAM or other data memory), a filter, an integrated circuit (such as a field programmable gate array (FPGA), a programmable array logic (PAL), a generic array logic (GAL), and a complex programmable logic device (CPLD)), a signal processing component, a power management component (such as a field effect transistor (FET), a metal oxide semiconductor field effect transistor (MOSFET), a complementary metal oxide semiconductor (CMOS), a junction field effect transistor (JFET), or an insulated gate field effect transistor (IGFET), all of which are based on a semiconductor material, such as silicon carbide (SiC), gallium arsenide (GaAs), gallium nitride (GaN), gallium oxide (Ga2O3), indium gallium arsenide (InGaAs), and / or any other suitable inorganic compound), an optoelectronic interface element, a light-emitting diode, an optical coupler, a voltage converter (e.g., a DC / DC converter or an AC / DC converter), a cryptographic component, a transmitter and / or a receiver, an electromechanical transducer, a sensor, an actuator, a microelectromechanical system (MEMS), a microprocessor, a capacitor, a resistor, an inductor, a battery, a switch, a camera, an antenna, a logic chip, and an energy harvesting unit. However, other components can also be embedded on the component carrier. For example, a magnetic element can be used as a component. Such a magnetic element can be a permanent magnetic element (such as a ferromagnetic element, an antiferromagnetic element, a multiferroic element, or a ferrimagnetic element, e.g., a ferrite core) or can be a paramagnetic element. However, the additional component can also be an IC substrate, an interposer, or another component carrier, for example, in a board-in-board configuration. The additional component can be surface-mounted on the component carrier and / or can be embedded inside the component carrier.

[0062] In an embodiment, the component carrier is a laminated component carrier. In such an embodiment, the component carrier is a composite of a multi-layer structure that is stacked and joined together by applying pressure and / or heat.

[0063] After processing the internal layer structure of the component carrier, one or more additional electrically insulating layer structures and / or electrically conductive layer structures (in particular, by lamination) can symmetrically or asymmetrically cover one major surface or the opposite two major surfaces of the processed layer structure. In other words, stacking can continue until the desired number of layers is obtained.

[0064] After the formation of the stack having the electrically insulating layer structure and the electrically conductive layer structure is completed, the obtained layer structure or component carrier can be surface-treated.

[0065] In particular, in terms of surface treatment, an electrically insulating solder resist can be applied to one major surface or the opposite two major surfaces of the layer stack or component carrier. For example, such a solder resist can be formed over the entire major surface and then the layer of the solder resist can be patterned to expose one or more electrically conductive surface portions that will be used to electrically couple the component carrier to an electronic periphery. The surface portions of the component carrier that are kept covered by the solder resist, in particular the copper-containing surface portions, can be effectively protected against oxidation or corrosion.

[0066] In terms of surface treatment, a surface finish can also be selectively applied to the exposed electrically conductive surface portions of the component carrier. Such a surface finish can be an electrically conductive covering material on the exposed electrically conductive layer structures (such as pads, conductive traces, etc., in particular including copper or consisting of copper) on the surface of the component carrier. If the exposed electrically conductive layer structures are not protected, the exposed electrically conductive component carrier material (in particular copper) will be oxidized, resulting in a lower reliability of the component carrier. In addition, the surface finish can be formed as, for example, a joint between a surface-mounted component and the component carrier. The surface finish has the function of protecting the exposed electrically conductive layer structures (in particular copper circuits), and the surface finish can, for example, enable the joining process with one or more components by soldering. Examples of suitable materials for the surface finish are organic solderability preservatives (OSP), electroless nickel immersion gold (ENIG), electroless nickel immersion palladium immersion gold (ENIPIG), gold (in particular hard gold), chemical tin, nickel gold, nickel palladium, etc.

[0067] In an embodiment, the component carrier-related body is a laminated component carrier. In this embodiment, the component carrier is a composite of a plurality of layer structures that are stacked and joined together by applying pressure and / or heat.

[0068] The above-defined aspects and further aspects of the invention will become apparent and will be elucidated with reference to the examples of embodiments described hereinafter. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Figure 1 A cross-sectional view of an electronic device according to an exemplary embodiment of the invention is shown.

[0070] Figure 2 A cross-sectional view of an electronic device according to another exemplary embodiment of the invention is shown.

[0071] Figure 3 A cross-sectional view of an electronic device according to yet another exemplary embodiment of the invention is shown.

[0072] Figure 4 A cross-sectional view of an electronic device according to yet another exemplary embodiment of the invention is shown.

[0073] Figure 5 A cross-sectional view of an electronic device according to yet another exemplary embodiment of the invention is shown.

[0074] Figure 6 A vehicle including an electronic device according to an exemplary embodiment of the invention is shown. DETAILED DESCRIPTION

[0075] The illustrations in the drawings are schematic. In different drawings, similar or identical elements are provided with the same reference numerals.

[0076] Before the exemplary embodiments will be described in more detail with reference to the drawings, some basic considerations on which the exemplary embodiments of the invention are developed will be summarized.

[0077] Traditionally, high density integration (HDI) applications could be realized by assembled memory components (commonly using surface mount device (SMD) technology). Additionally, processor packages could be soldered onto a motherboard. Electrical and thermal reliability of such electronic devices and losses during the transmission of electrical signals could be issues.

[0078] According to an exemplary embodiment of the present invention, there is provided an electronic device, which is particularly suitable for vehicle applications and other applications where in many cases cooling can only be performed on one side of the electronic device while having strict requirements in terms of electronic performance. The electronic device according to an exemplary embodiment of the present invention meets these conflicting requirements by providing high thermal reliability combined with high electronic performance. At the same time, the electronic device can be manufactured in a highly compact manner. The corresponding electronic components may include a main board, a power converter module, a processor module, a memory module, and a heat sink as components, for example, as the main or only components. Advantageously, one or more of the power converter module, the processor module, and the memory module are mounted on the main board in a manner capable of transmitting electrical signals and supplying power. In addition, the heat sink can be thermally coupled to at least the processor module and the memory module to remove heat from these heat sources of the electronic device. Advantageously, the power converter module, the processor module, and the memory module can be arranged between the main board and the heat sink. With this arrangement structure, the heat flow can be made to move away from the processor module and the memory module and mainly flow towards the heat sink. In addition, the electronic path can be spatially separated from the thermal path so that excessive heat can also be prevented from propagating towards the signal propagation path and the energy supply path.

[0079] According to an exemplary embodiment, there is provided an electronic device, which is configured as a modular package of components, and the components include a processor module, a memory module, and a power conversion and power supply module. In addition, passive components such as inductors, capacitors, etc. can also be provided. The electronic device according to an exemplary embodiment of the present invention can be configured as a single-sided cooling package, and the single-sided cooling package can be adjusted or even optimized in terms of interconnection mainly concerned with power demand, power demand, cooling demand, or supply chain demand.

[0080] The electronic device according to an exemplary embodiment of the present invention can be manufactured by using an embedded component to perform a module bonding process. In particular, such electronic components can be embedded in a substrate and / or a PCB. Therefore, a modular package highly suitable for high-performance computing (HPC) applications can be provided. Therefore, the electronic device according to an exemplary embodiment of the present invention can be configured for vehicle applications, preferably for HPC devices with artificial intelligence (AI) functions for autonomous driving.

[0081] Using the connection architecture of an electronic device according to an exemplary embodiment of the present invention, intelligent compilation of the upper structure can be achieved. This can enable high-bandwidth data transmission. In addition, the number of involved complexes can be reduced. The connection length between different modules of the electronic device can be significantly shortened. This can have a positive impact on signal loss, signal distortion, and the amount of heat generated. In addition, the electronic device according to an exemplary embodiment of the present invention can provide an arrangement structure of the modules of the electronic device, thereby enabling efficient cooling of the modules and components (e.g., memory modules and processor modules) of the electronic device. In addition, an effective balance between the cooling requirement and the conductor length can be achieved. The manufacturing technology according to an exemplary embodiment of the present invention can keep the conductor length small and can achieve a small thermal resistance considering the spatial and modular arrangement. In addition, by shortening the line, signal loss will be reduced.

[0082] The electronic device according to an exemplary embodiment of the present invention provides a modular structure for high-data-bandwidth transmission and is thus highly applicable to applications such as high-performance computing (HPC). Therefore, the electronic device of the embodiment can achieve an extremely high bandwidth for digital data transmission between the processor module and the memory module and has excellent thermal cooling performance. More specifically, this can be achieved for a single-sided cooling architecture to meet the stringent boundary conditions that may occur, for example, in automotive applications such as autonomous driving applications.

[0083] The electronic device according to an exemplary embodiment of the present invention can be configured as a package for automotive applications, with an emphasis on efficiency while allowing optimization of power and cooling performance. The exemplary embodiment of the present invention can provide an arrangement structure of a motherboard, a power converter module, a processor module, a memory module, and a radiator for efficiently guiding power and electrical signals, and each can efficiently guide power and electrical signals through a defined path in the electronic device. The corresponding connection architecture can provide a shorter communication line between the memory module and the processor module while enabling high-power transmission and proper cooling.

[0084] The exemplary embodiment provides a board for power conversion (i.e., the power converter module) and another board for power and signal supply (i.e., the motherboard), and also provides a radiator for efficiently cooling the electronic device. The processor module and the memory module can be assembled between the above components of the electronic device. The processor module and the memory module can consume the supplied power, the processor module and the memory module can process signals and can dissipate waste heat to the radiator. The functional and structural separation between heat- and electricity-related tasks provides a basis for spatially separating the power and signal propagation paths from another heat dissipation path. In other words, the heat removal area of the electronic device can be separated from the signal and power areas of the electronic device.

[0085] Figure 1 FIG. 3 shows a cross-sectional view of an electronic device 100 according to an exemplary embodiment of the present invention.

[0086] The illustrated electronic device 100 may be configured as an autonomous driving controller in a vehicle and may perform high-performance computing tasks for this purpose. In such an application scenario in a vehicle, one limitation to consider may be that only one-sided cooling meets the specifications. At the same time, efficient cooling of the main heat source of the electronic device 100 and efficient power and signal distribution may be the greatest advantages.

[0087] To meet the above requirements, the electronic device 100 includes a main board 102 on the bottom side, which serves as an electronic and mechanical mounting base and is used to provide power and electrical signals. In addition, the electronic device 100 includes a power converter module 104, which is used to convert the power to an appropriate level (specifically, to a high current level). In addition, the electronic device 100 includes a processor module 106, which is used to process signals when supplied with sufficiently high power. In addition, a memory module 108 is provided for temporarily and / or permanently storing data corresponding to the processed signals and / or the results of signal processing. As Figure 1 shown, the processor module 106 and the memory module 108 may be mounted side by side on the main board 102. Preferably, the processor module 106 and the memory module 108 are configured to cooperate to provide a common electronic function, such as the above-mentioned autonomous driving function. In addition, the electronic device 100 includes a heat sink 110 on the top side, which is used to remove the heat mainly generated by the processor module 106 and additionally generated by the memory module 108 and the power converter module 104. According to Figure 1 , the power converter module 104 is vertically arranged between the processor module 106 and the memory module 108 and the heat sink 110. Optionally, the empty gaps between the components of the electronic device 100 may be overmolded (not shown).

[0088] In the illustrated embodiment, the main board 102 is implemented as a printed circuit board (PCB). Therefore, Figure 1The main board 102 as shown can be highly compact in the vertical direction. More specifically, the main board 102 can include a stack-up 162, which includes a conductive layer structure 164 and an electrically insulating layer structure 166 (see detail 168). The conductive layer structure 164 can include a patterned metal layer (such as a patterned copper foil or a patterned deposited copper layer) and vertical through-connections, such as copper-filled vias, which can be formed by drilling and plating. The electrically insulating layer structure 166 can include a corresponding resin (such as a corresponding epoxy resin), and preferably, the resin includes reinforcing particles (such as glass fibers or glass spheres). For example, the electrically insulating layer structure 166 can be made of FR4. The electrically insulating layer structure 166 can also include a resin layer without glass fibers.

[0089] On top of the main board 102, the processor module 106 and the memory module 108 are connected by soldering using a solder structure 160 (such as micro solder balls). The gaps or empty spaces at the bottom side of the processor module 106 and the gaps or empty spaces at the bottom side of the memory module 108 can be filled with a dielectric underfill 176.

[0090] In the illustrated embodiment, each of the processor module 106 and the memory module 108 is configured as a component carrier (in particular a PCB, which can be configured for the main board 102 as described above, for example). The processor module 106 includes a processor semiconductor chip 170, which is embedded in a packaging material (in the illustrated embodiment, the packaging material is a laminate, alternatively, the packaging material is a molding compound). A plurality of processor semiconductor chips 170 can also form the processor module 106 (not shown). The memory module 108 includes a plurality of memory semiconductor chips 172, which are embedded in a packaging material (in the illustrated embodiment, the packaging material is a laminate, alternatively, the packaging material is a molding compound). Only a single memory semiconductor chip 172 can also be present in the memory module 108 (not shown). In the illustrated embodiment, the processor semiconductor chip 170 and the memory semiconductor chip 172 are implemented as embedded components 152. Alternatively, the processor semiconductor chip 170 and the memory semiconductor chip 172 can also be surface-mounted components. Preferably, one or more processor semiconductor chips 170 and / or one or more memory semiconductor chips 172 can be known good chips that have been successfully tested before assembly. This can improve the yield of manufacturing the electronic device 100, especially when performing post-chip manufacturing processes.

[0091] A power converter module 104 is assembled on top of the processor module 106 and on top of the memory module 108, wherein the processor module 106 and the memory module 108 can be arranged side by side at the same vertical height. Preferably, the processor module 106 and the memory module 108 can be spaced apart from each other so as to prevent heat from transferring from one module to the other. The power converter module 104 can also be implemented as a component carrier (such as a PCB, which is configured for the motherboard 102 as described above). Although not shown, the power converter module 104 can include a DC-DC converter for converting an input current into a larger output current. Such a DC-DC converter can include a plurality of embedded components, such as at least one controller chip, at least one transistor chip, at least one capacitor, and at least one inductor.

[0092] The top layer of the motherboard 102 can be configured for connecting power and signals and is denoted by reference numeral 190 in Figure 1 The wiring structure (preferably made of copper) in the power converter module 104 can be thick enough to conduct large currents and can be thicker than the finer signal lines for coupling signals into the processor module 106. Signal transmission between the processor module 106 and the memory module 108 can be performed through the wiring structure in the top portion of the motherboard 102 located in Figure 1

[0093] In addition, Figure 1 the power converter module 104 of Figure 1As shown, a vertically extending thermally coupled arrangement structure 130 extends between the processor module 106 and the heat sink 110 and extends parallel between the memory module 108 and the heat sink 110. This is used to thermally couple the processor module 106 and the memory module 108 to the heat sink 110 through the power converter module 104, and the heat removal path from the processor module 108 to the heat sink 110 is thermally separated from the parallel heat removal path from the memory module 106 to the heat sink 110. This avoids the undesirable cross-flow of heat from the processor module 106 to the temperature-sensitive memory module 108. Also as shown, the vertically extending thermally coupled arrangement structure 130 includes high thermal conductivity blocks 132-135, which are vertically connected to each other by high thermal conductivity connection media 136, 138, where the high thermal conductivity connection media 136, 138 are implemented as sintered deposits. The high thermal conductivity blocks 132, 134 are surface-mounted on the component carrier stack of the power converter module 104, while the high thermal conductivity blocks 133, 135 are embedded in the component carrier stack of the power converter module 104. The corresponding surface-mounted high thermal conductivity blocks 132, 134 are thermally coupled to the processor semiconductor chip 170 or the memory semiconductor chip 172, respectively. The vertically stacked pairs of high thermal conductivity blocks 132, 133 and 134, 135 are vertically interconnected by the corresponding high thermal conductivity connection media in the high thermal conductivity connection media 136, 138, such as sintered deposits. A metal heat dissipation layer 128 (e.g., a copper layer) is arranged on the top of the corresponding upper high thermal conductivity blocks 133, 135 in the high thermal conductivity blocks. The top side of the metal heat dissipation layer 128 is thermally coupled to the heat sink 110 via a thermal coupling layer 126 (such as a thermal interface material, TIM). Therefore, the heat sink 110 is thermally coupled to the processor module 106 and the memory module 108 via the thermal coupling layer 126 of the thermal interface material, via the metal heat dissipation layer 128 between the heat sink 110 and the processor module 106 and the memory module 108, and via the vertically extending thermally coupled arrangement structure 130 between the heat sink 110 and the processor module 106 and the memory module 108. An additional heat transfer coupling layer 174 can be arranged between the memory semiconductor chip 172 of the memory module 108 and the surface-mounted high thermal conductivity block 134 to further promote heat transfer. Through the above heat path, the heat sink 110 is thermally coupled to the processor module 106 and the memory module 108 to remove heat. In addition, the heat sink 110 is thermally coupled to the power converter module 104 via the thermal coupling layer 126 of the thermal interface material and via the metal heat dissipation layer 128 to efficiently dissipate the heat also from the power converter module 104.

[0094] In this embodiment, the processor module 106, the memory module 108, and the conductive connection media 136, 138, and the high heat conduction blocks 132, 133, 134, 135, and the metal heat dissipation layer 128 may respectively have the same thickness in the stack thickness direction. If the memory module 108 and the processor module 106 do not have the same thickness, at least one of the conductive connection media 136, 138, the high heat conduction blocks 132, 133, 134, 135, the metal heat dissipation layer 128, or the thermal coupling layer 126 may compensate for the thickness difference to reach the same height and then be connected to the heat sink 110.

[0095] Now referring to the heat sink 110, the heat sink 110 may be made of a high heat conduction material, such as copper or aluminum. In the context of the present application, the high heat conduction material may have a thermal conductivity of at least 50 W / mK, and preferably, the high heat conduction material may have a thermal conductivity of at least 100 W / mK. The heat sink 110 is only schematically shown in the figure and may be implemented as a component that efficiently removes heat, particularly from the processor module 106 (the processor module 106 may be the main heat source of the electronic device 100), and additionally from the memory module 108 and the power converter module 104 (the memory module 108 and the power converter module 104 may also generate a large amount of heat during operation). For example, the heat sink 110 may be implemented as a high heat conduction plate having a plurality of integrated cooling fins. The heat sink 110 may also include a liquid cooling device, such as a water cooling device. Many other embodiments for the heat sink 110 are also possible.

[0096] The electrical conduction contact portion 180 at the top side of the processor module 106 can be electrically coupled to the electrical conduction contact portion 178 at the bottom side of the power converter module 104. Through the electrical conduction contact portions 178 and 180, power can be transmitted from the main board 102 via the processor module 106 to the power converter module 104 for subsequent power conversion. The processor module 106 is mounted on the main board 102 to contribute to signal transmission and power supply. For example, signal lines and power lines can be arranged between the main board 102 and the power converter module 104. The processor module 106 is connected to transmit power from the main board 102 via the processor module 106 to the power converter module 104. In addition, the processor module 106 and the power converter module 104 are connected to transmit the converted power from the power converter module 104 back to the processor module 106, and optionally also back to the memory module 108. Through the electrical conduction contact portions 178 and 180, power can be transmitted from the main board 102 via the processor module 106 (optionally via the memory module 108) to the power converter module 104 (the power converter module 104 can also be referred to as the power supply module).

[0097] According to Figure 1 , the power converter module 104, the processor module 106, and the memory module 108 are arranged between the main board 102 and the heat sink 110. By taking this measure, the electronic device 100 can be functionally divided into a bottom-side power supply and signal processing area 112 and a top-side heat removal area 114. By configuring the main board 102 to have a thermal conductivity much smaller than that of the heat sink 110, a large amount of heat flow to the Figure 1 bottom side can be suppressed. In view of this configuration, the electronic device 100 is configured to be cooled unidirectionally only by the heat sink 110.

[0098] As described above, the motherboard 102 is connected to transmit signals to the processor module 106 and the memory module 108, and to transmit power to the power converter module 104. In addition, the DC-DC converter of the power converter module 104 can be configured to convert the input current (e.g., 20 A) and input voltage (e.g., 5 V) obtained from the motherboard 102 into a larger output current (e.g., 100 A) and a smaller output voltage (e.g., 0.85 V). Preferably, the large output current of the power converter module 104 can be supplied to the processor module 106, but not to the memory module 108. The memory module 108 can operate with a lower current. For example, the memory module 108 can operate with the input current of the motherboard 102. The memory module 108 can include its own power supply device (such as, PIMIC), and can also include a memory controller, just as the memory controller can be used for DDR5 RAM. In another embodiment, the memory module 108 can also be supplied with a higher output current.

[0099] Advantageously, the heat sink 110 is configured to remove heat from the processor module 106 and the memory module 108 along thermally separated heat removal paths, such that the processor module 106 and the memory module 108 are thermally decoupled from each other. The processor module 106 may generate a large amount of heat during operation. Although the amount of heat generated by the memory module 108 may be small, the memory module 108 should also be cooled by thermally connecting the memory module 108 to the heat sink 110. In addition, the memory module 108 may be very sensitive to overheating. For example, a specific type of memory module 108 may not be heated above 85 °C. To ensure that the processor module 106 and the memory module 108 are properly cooled by the same heat sink 110 and thus cooled in a compact manner, a gap 182 can be formed as a blocking portion in the heat dissipation layer 128 (and / or in the thermal coupling layer 126 and / or in the heat sink 110, not shown) to thermally decouple the heat removal path of the processor module 106 and the heat removal path of the memory module 108. Thus, the metal heat dissipation layer 128 is blocked laterally between the processor module 106 and the memory module 108. Therefore, the undesired lateral heat flow from the processor module 106 to the memory module 100 can be strongly suppressed.

[0100] According to Figure 1 , the electrically conductive high-speed lines can extend along the upper portion of the motherboard 102. In addition, both the processor module 106 and the memory module 108 can be connected to one or more power supply terminals of the power converter module 104.

[0101] Figure 1The implementation mode corresponds to the side-by-side arrangement structure of the processor module 106 and the memory module 108. In addition, Figure 1 the electronic device 100 is configured for single-sided cooling and is optimized for efficient power supply.

[0102] Figure 2 FIG. shows a cross-sectional view of an electronic device 100 according to another exemplary implementation mode of the present invention.

[0103] Figure 2 The implementation mode of Figure 1 is particularly different from the implementation mode of Figure 2 in that, according to Figure 2 , the power converter module 104 is vertically arranged between the main board 102 on the bottom side and the processor module 106 and the memory module 108 on the top side of the power converter module 104. Therefore, according to Figure 2 , the heat removal paths from the processor module 106 to the radiator 110 and from the memory module 108 to the radiator 110 are very short. Also as shown in

[0104] In addition, Figure 2 the power converter module 104 of

[0105] Figure 2The electronic device 100 further includes a vertically extending thermal coupling arrangement 146 disposed laterally beside the processor module 106 and the memory module 108 for thermally coupling the power converter module 104 to the heat sink 110 without having the processor module 106 and the memory module 108 located between the thermal coupling arrangement 146 and the heat sink 110. In the illustrated embodiment, the vertically extending thermal coupling arrangement 146 is implemented as a group of two metal posts (specifically copper posts). As shown, the vertically extending thermal coupling arrangement 146 thermally connects the upper main surface of the power converter module 104 to a thermal coupling layer 126 located directly below the heat sink 110. This enables efficient dissipation of heat from the power converter module 104 to the heat sink 110 even when there is a large vertical spacing between the power converter module 104 and the heat sink 110. Additionally or alternatively, the vertically extending thermal coupling arrangement 146 can provide mechanical stability to the electronic device 100.

[0106] Additionally or alternatively, Figure 2 An embodiment of the electronic device 100 may have a thermal coupling arrangement 148 embedded in the motherboard 102 for removing heat from the power converter module 104 via the motherboard 102. For example, the thermal coupling arrangement 148 can be implemented as a group of metal posts (specifically copper posts) that are embedded in the motherboard 102 as inlays. The thermal coupling arrangement 148 integrated in the motherboard 102 would be a suitable solution that enables two-sided cooling through a specific design. If the design rules for the electronic device 100 require one-sided cooling, the thermal coupling arrangement 148 can be omitted, and heat removal from the power converter module 104 can be achieved only through the thermal coupling arrangement 146.

[0107] Furthermore, Figure 2 An embodiment of the electronic device 100 relies on a side-by-side arrangement of the processor module 106 and the memory module 108 and is configured for one-sided cooling (unless an optional thermal coupling arrangement 148 is foreseen).

[0108] Figure 2 An embodiment of the electronic device 100 is optimized for cooling, i.e., it can provide high thermal performance.

[0109] Figure 3 FIG. shows a cross-sectional view of an electronic device 100 according to a preferred embodiment of the present invention.

[0110] Figure 3 An embodiment of the electronic device 100 is different from Figure 2 an embodiment of the electronic device 100 particularly in that, according to Figure 3, the processor module 106 and the memory module 108 mounted side by side on the power converter module 104 are embedded in a common disk-shaped board 116. For example, the disk-shaped board 116 can be manufactured separately and then connected to the power converter module 104. However, it is also possible to manufacture the power converter module 104 and then assemble the wafer components, underfill, overmold, align the chips, and copper plate on the top side. The disk-shaped board 116 can be a laminated component carrier or can include molded packaging material. This design helps to achieve a compact configuration in the vertical direction. Advantageously, Figure 3 In certain embodiments, the DC-DC converter of the power converter module 104 may be spatially close to the processor module 108 .

[0111] Figure 3 The side-by-side arrangement is also designed for single-sided cooling. In addition, this embodiment is optimized for the supply chain. This means that the wafers used are designed so that they can be used for microball assembly. This is how the wafers used can be used to make flip-chip BGA packages. Figure 3 , the packaging architecture of electronic device 100 includes a power supply that is provided directly to the die of processor module 106 and memory module 108. The power supply is directly coupled to the components.

[0112] Since the vertical distance between power converter module 104 and (e.g., plated) heat sink layer 128 is small, it is sufficient to remove heat from power converter module 104 even if thermal coupling arrangement 146 and / or 148 is omitted (however, thermal coupling arrangement 146 and / or 148 may be omitted). Figure 3 For example, the heat dissipation layer 128 can be formed by sputtering or by a chemical deposition process.

[0113] Figure 4 A cross-sectional view of an electronic device 100 according to yet another exemplary embodiment of the present invention is shown.

[0114] Figure 4 The embodiment of Figure 4 , the processor module 106 and the memory module 108 are stacked vertically on top of each other. More specifically, according to Figure 4, the processor module 106 is mounted above the memory module 108. As shown, the processor module 106 and the memory module 108 are housed in a common cavity 118, which is located inside the power converter module 104. In this embodiment, the cavity 118 has a narrow lower section and a wider upper section. The narrow lower section is shaped and sized to house the memory module 108, and the wider upper section is shaped and sized to house the processor module 106. This single stepped cavity design is suitable and allows for simple manufacturing because the processor module 106 has a greater lateral extent than the memory module 108.

[0115] According to Figure 4 , heat can be efficiently removed from the processor module 106, which is thermally most critical, through the heat dissipation layer 128 and the thermal coupling layer 126. To further facilitate heat removal from the memory module 108 on the bottom side, Figure 4 the electronic device 100 of

[0116] includes a thermal bypass structure 124 that thermally couples the memory module 108 to the heat sink 110 and extends laterally around the upper processor module 106. More specifically, the thermal bypass structure 124 includes a bottom-side metal sheet member 184 (such as a clamping member), which is thermally coupled to the memory module 108 (e.g., through an additional thermal coupling layer 126 and through an additional heat dissipation layer 128). The horizontal sheet member 184 is thermally coupled to the thermal vias 188 through a thermally conductive welding structure 186, and the thermal vias 188 extend to the heat dissipation layer 128 and the thermal coupling layer 126 located at the bottom of the heat sink 110.

[0117] In Figure 4 the embodiment, the processor module 106 is positioned at a very small distance from the memory module 108 and also at a very small distance from the heat sink 110. This combines low signal loss, high signal quality, and high thermal performance.

[0118] Furthermore, according to Figure 4 the architecture can achieve single-sided cooling. Figure 4 the embodiment is optimized for interconnection and power. Only by way of example, the size of the power module can be 80mm x 80mm. According to Figure 4 , the processor can also be embedded in the substrate and direct the heat upward.

[0119] Figure 5 A cross-sectional view of an electronic device 100 according to another exemplary embodiment of the present invention is shown.

[0120] Figure 5 The implementation of Figure 4 differs particularly from the implementation of Figure 5 in that, according to

[0121] In Figure 5 , an exemplary and schematic current flow path from the main board 102 through the power converter module 104 into the processor module 106 and the memory module 108 is indicated by arrows.

[0122] Figure 5 The implementation of Figure 5 is also configured for single-sided cooling and optimized for interconnection and power. According to

[0123] Figure 6 A vehicle 200 (such as a car) is shown, which includes an electronic device 100 according to an exemplary implementation of the present invention (for example, the electronic device 100 is configured as Figures 1 to 5 one of the implementations shown in

[0124] It should be noted that the term "comprising" does not exclude other elements or steps, and "a" or "an" does not exclude a plurality. Also, elements described in connection with different implementations can be combined.

[0125] It should also be noted that the reference signs in the claims should not be construed as limiting the scope of the claims.

[0126] The implementation of the present invention is not limited to the preferred implementations shown in the figures and described above. On the contrary, even in the case of fundamentally different implementations, it is possible to use the solutions shown and various variations based on the principles of the present invention.

Claims

1. An electronic device (100), the electronic device (100) comprising: A main board (102); A power converter module (104); A processor module (106); A memory module (108); and A heat sink (110); Wherein at least one of the power converter module (104), the processor module (106), and the memory module (108) is mounted on the main board (102) for signal transmission and power supply; Wherein the heat sink (110) is at least thermally coupled to the processor module (106) and the memory module (108) for heat removal; and Wherein the power converter module (104), the processor module (106), and the memory module (108) are arranged between the main board (102) and the heat sink (110).

2. The electronic device (100) according to claim 1, wherein, The main board (102) is connected to transmit signals to the processor module (106) and the memory module (108) and transmit power to the power converter module (104).

3. The electronic device (100) according to claims 1 to 2, wherein, The power converter module (104) is configured to convert an input current and an input voltage into a larger output current and a smaller output voltage.

4. The electronic device (100) according to any one of claims 1 to 3, wherein, The power converter module (104) is configured to provide an output current of at least 10 A, in particular, the power converter module (104) is configured to provide an output current of at least 50 A.

5. The electronic device (100) according to any one of claims 1 to 4, wherein, The power converter module (104) is a disk-shaped board.

6. The electronic device (100) according to any one of claims 1 to 5, wherein, The processor module (106) and the memory module (108) are configured to cooperate to provide a common function.

7. The electronic device (100) according to any one of claims 1 to 6, wherein, The heat sink (110) is configured to remove heat from the processor module (106) and the memory module (108) along a thermally separated heat removal path, such that the processor module (106) and the memory module (108) are thermally decoupled from each other.

8. The electronic device (100) according to any one of claims 1 to 7, the electronic device (100) being functionally divided into a signal processing area (112) on the bottom side and a heat removal area (114) on the top side.

9. The electronic device (100) according to any one of claims 1 to 8, the electronic device (100) being configured for single-sided cooling via the heat sink (110).

10. The electronic device (100) according to any one of claims 1 to 9, wherein, The processor module (106) and the memory module (108) are mounted side by side on the main board (102) or are mounted side by side on the power converter module (104), in particular, the processor module (106) and the memory module (108) are embedded in a common disk-shaped board (116).

11. The electronic device (100) according to any one of claims 1 to 9, wherein, The processor module (106) and the memory module (108) are vertically stacked on top of each other.

12. The electronic device (100) according to claim 11, wherein, The processor module (106) is mounted above the memory module (108).

13. The electronic device (100) according to claim 11 or 12, wherein, The processor module (106) and the memory module (108) are housed in a cavity (118) that is located inside the electronic device (100).

14. The electronic device (100) according to claim 13, wherein, The cavity (118) has a narrower section and a wider section for housing the memory module (108) and the processor module (106) having different lateral extents.

15. The electronic device (100) according to any one of claims 11 to 14, the electronic device (100) including a thermal bypass structure (124) that thermally couples a lower one of the processor module (106) and the memory module (108) to the heat sink (110), and the thermal bypass structure (124) extends around an upper one of the processor module (106) and the memory module (108).

16. The electronic device (100) according to any one of claims 1 to 15, wherein, The heat sink (110) is thermally coupled to the processor module (106) and the memory module (108) via a thermal coupling layer (126) of a thermal interface material located between the heat sink (110) and the processor module (106) and the memory module (108) and / or via a metal heat dissipation layer (128) located between the heat sink (110) and the processor module (106) and the memory module (108).

17. The electronic device (100) according to claim 16, wherein, The thermal coupling layer (126) and / or the metal heat dissipation layer (128) are blocked laterally between the processor module (106) and the memory module (108).

18. The electronic device (100) according to any one of claims 1 to 17, wherein, The power converter module (104) is vertically arranged between the processor module (106) and the memory module (108) on one hand and the heat sink (110) on the other hand.

19. The electronic device (100) according to any one of claims 1 to 18, wherein, The processor module (106) is connected to transfer power from the main board (102) through the processor module (106) and optionally through the memory module (108) to the power converter module (104).

20. The electronic device (100) according to claim 19, wherein, The processor module (106) and the power converter module (104) are connected to transfer converted power from the power converter module (104) to the processor module (106) and optionally to the memory module (108).

21. The electronic device (100) according to any one of claims 1 to 20, the electronic device (100) including a vertically extending thermal coupling arrangement structure (130) that is located between the processor module (106) and the heat sink (110) and optionally between the memory module (108) and the heat sink (110), the thermal coupling arrangement structure (130) for thermally coupling the processor module (106) to the heat sink (110) via the power converter module (104) and optionally thermally coupling the memory module (108) to the heat sink (Il0).

22. The electronic device (100) according to claim 21, wherein, The vertically extending thermal coupling arrangement (130) includes high thermal conductivity blocks (132-135) that are vertically connected to each other by high thermal conductivity connection media (136, 138), and in particular, the high thermal conductivity connection media (136, 138) are sintered deposits.

23. The electronic device (100) according to any one of claims 1 to 22, wherein, The power converter module (104) is vertically arranged between the main board (102) on one hand and the processor module (106) and the memory module (108) on the other hand.

24. The electronic device (100) according to any one of claims 1 to 23, wherein, The power converter module (104) includes a lower density connection area (140) on the bottom side coupled to the main board (102) and a higher density connection area (142) on the top side coupled to the processor module (106) and the memory module (108).

25. The electronic device (100) according to claim 24, wherein, The power converter module (104) includes a redistribution structure (144) located in the bonding area between the lower density connection area (140) on the bottom side and the higher density connection area (142) on the top side.

26. The electronic device (100) according to claim 24 or 25, wherein, The lower density connection area (140) on the bottom side is configured for power conversion, and the higher density connection area (142) on the top side is configured for signal supply.

27. The electronic device (100) according to any one of claims 1 to 26, the electronic device (100) includes a vertically extending thermal coupling arrangement (146) provided beside the processor module (106) and the memory module (108), the thermal coupling arrangement (146) for thermally coupling the power converter module (104) to the heat sink (110).

28. The electronic device (100) according to any one of claims 1 to 27, the electronic device (100) includes an embedded thermal coupling arrangement (148) located in the main board (102), the thermal coupling arrangement (148) for removing heat from the power converter module (104) via the main board (102).

29. The electronic device (100) according to any one of claims 1 to 28, the electronic device (100) includes a redistribution structure (144) located in the main board (102) and / or in the power converter module (104).

30. The electronic device (100) according to any one of claims 1 to 29, wherein, At least one of the motherboard (102), the power converter module (104), the processor module (106), and the memory module (108) includes a laminated and / or plate-shaped component carrier. In particular, at least some of the motherboard (102), the power converter module (104), the processor module (106), and the memory module (108) include a laminated and / or plate-shaped component carrier. More particularly, each of the motherboard (102), the power converter module (104), the processor module (106), and the memory module (108) includes a laminated and / or plate-shaped component carrier. Optionally, the laminated and / or plate-shaped component carrier has at least one embedded component (152).

31. A vehicle (200), the vehicle (200) including the electronic device (100) according to any one of claims 1 to 30.

32. The vehicle (200) according to claim 31, the vehicle (200) being configured as an automobile, an aircraft, a spacecraft, a ship, or a rail vehicle.

33. A method of manufacturing an electronic device (100), wherein, The method includes: Connecting the motherboard (102), the power converter module (104), the processor module (106), the memory module (108), and the radiator (110); Mounting at least one of the power converter module (104), the processor module (106), and the memory module (108) on the motherboard (102) for signal transmission and power supply; Thermally coupling the radiator (110) at least to the processor module (106) and the memory module (108) for heat removal; and Arranging the power converter module (104), the processor module (106), and the memory module (108) between the motherboard (102) and the radiator (110).

Images