Novel optomagnetic coupling polishing device and method for inner surface of non-straight micro-pore channel

Abstract

The invention relates to a novel non-straight micro-pore inner surface optomagnetic coupling polishing device, which relates to the technical field of ultra-precision machining, and comprises a main body frame, and two magnetic field generators, a liquid storage tank and a polishing liquid acceleration unit which are arranged in the main body frame, and a to-be-polished workpiece is arranged on a mounting frame between the magnetic field generators; the magnetic field generator is further connected with a rolling device, one end of the polishing solution acceleration unit is connected with a workpiece, the other end of the polishing solution acceleration unit is connected with the liquid storage pool, an optical excitation device is further arranged between the output end of the liquid storage pool and the polishing solution acceleration unit, the other end of the workpiece to be polished is connected with the liquid storage pool, and polishing solution stored in the liquid storage pool comprises abrasive materials and magnetic fluid. In the machining process, the magnetic field of the magnetic field generator is adjusted through action of the rolling device. According to the invention, through an electromagnetic driving mechanism and in combination with a photochemical strengthening effect, the inner pore channel of the polished workpiece is Rad; and the production cost is remarkably reduced, and the high-standard requirement for polishing the inner surface of the annular micro pipeline is met.

Description

Technical Field

[0001] The present invention relates to the technical field of ultra-precision machining, and in particular to a novel optical-magnetic coupling polishing device and method for the inner surface of a non-straight micro-channel. Background Art

[0002] Laser gyroscope is an indispensable device for launch vehicles, cruise missiles, ships, satellite spacecraft and other equipment. Figure 5 As shown, the quadrilateral or triangular ring-shaped gyro cavity, the precision core of the new generation of laser gyroscopes, faces unprecedented manufacturing challenges. This unique shape not only tests the limits of processing technology, but also, due to the hard and brittle nature of the material, scratches, defects, and roughness become insurmountable obstacles. These tiny flaws can trigger a chain reaction of scattering, reflection, and absorption, interfering with the sensor output and hindering accurate navigation.

[0003] For high-precision processing of the inner surface of annular micro-pipes, the industry currently generally uses advanced technologies such as laser polishing and ion beam polishing. Although these methods can achieve surface finishes close to the atomic level, they inevitably face bottlenecks such as high cost investment and low processing efficiency. Summary of the Invention

[0004] In response to the technical problems raised above, a novel optical-magnetic coupling polishing device and method for the inner surface of a non-straight micro-channel is provided.

[0005] The technical means adopted in the present invention are as follows: A novel optical-magnetic coupling polishing device for the inner surface of a non-straight micro-channel includes a main frame and a first magnetic field generator, a second magnetic field generator, a liquid reservoir, and a polishing liquid acceleration unit installed inside the main frame. The workpiece to be polished is installed on a mounting frame between the first magnetic field generator and the second magnetic field generator. The first magnetic field generator is also connected to a rolling device. One end of the polishing liquid acceleration unit is connected to the workpiece, and the other end is connected to the liquid reservoir. A light excitation device is also provided between the output end of the liquid reservoir and the polishing liquid acceleration unit. The other end of the workpiece to be polished is connected to the liquid reservoir. The polishing liquid stored in the liquid reservoir includes abrasive and magnetic fluid. During the processing, the magnetic field of the first magnetic field generator is adjusted by the action of the rolling device.

[0006] Furthermore, the polishing liquid acceleration unit includes an acceleration device body and a base, wherein the bottom of the acceleration device body is mounted on the main frame through the base, and the interior of the acceleration device body is provided with a plurality of holes for mounting coils and a center hole provided at the center of the acceleration device body along its axial direction; An accelerating liquid guide tube is provided in the central hole; The output end of the light excitation device is connected to the accelerating liquid guide tube through the accelerating liquid guide tube inlet tube, and the output end of the accelerating liquid guide tube is connected to the workpiece to be polished through the accelerating liquid guide tube outlet tube.

[0007] Furthermore, the first magnetic field generator is used to provide a controllable magnetic field centripetal force to control the polishing liquid to perform controllable circular motion; the second magnetic field generator is used to provide a controllable transverse magnetic field to the polishing area of the workpiece.

[0008] Furthermore, the first magnetic field generator includes a centripetal magnetic wheel, on which a fixed magnet is mounted, and one end of the centripetal magnetic wheel is connected to the driving roller.

[0009] Furthermore, the rolling device includes a roller and two rollers mounted on the roller, the rollers are respectively in contact with two centripetal magnetic wheels of the first magnetic field generator, the rollers are mounted on the roller, and the roller is driven by a motor.

[0010] The present invention also discloses a novel optical-magnetic coupling polishing method for the inner surface of a non-straight micro-channel, comprising the following steps: placing a workpiece to be polished on a mounting frame, connecting the inner pipe of the workpiece to a liquid reservoir via a guide pipe, and forming a complete closed loop after passing through a polishing liquid acceleration unit; Start preheating of the light excitation device; Start control system and polishing liquid acceleration unit; The polishing liquid after the abrasive and magnetic fluid are excited by light flows into the polishing liquid acceleration unit; The polishing liquid is accelerated through the accelerating tube and enters the pipe inside the workpiece for polishing; After polishing, check whether the polishing requirements are met. If not, continue the polishing process until the preset polishing accuracy is achieved.

[0011] Compared to existing technologies, this invention offers the following advantages: It addresses the precise removal of hard and brittle quartz materials by cleverly integrating photochemical energy fields with fluid abrasive loading technology. Due to the unique fluidity and mechanical properties of magnetic fluids, they can easily penetrate deep into microchannels. Through electromagnetic drive and photochemical enhancement, the internal pore size Ra of the polished workpiece can be reduced to less than 3μm, significantly reducing production costs and significantly improving the efficiency of batch processing, precisely meeting the high standards required for polishing the inner surface of annular microchannels. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0013] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0014] Figure 2 This is a structural schematic diagram of the present invention from another perspective.

[0015] Figure 3 for Figure 2 main view.

[0016] Figure 4 This is a schematic diagram of the polishing liquid acceleration device of the present invention.

[0017] Figure 5 This is a pressure simulation diagram of the workpiece to be polished.

[0018] Figure 6 This is a simulation diagram of the speed of the workpiece to be polished.

[0019] Figure 7 Schematic diagram of the magnetic field during the machining process (instantaneous).

[0020] Figure 8 Schematic diagram of a first magnetic field generator for providing a centripetal magnetic field according to the present invention.

[0021] Figure 9 Schematic diagram of a first magnetic field generator with a coil inside according to the present invention.

[0022] In the figure: 1. Main frame; 2. Roller; 3. Accelerating liquid guide tube outlet pipe; 4. Accelerating device magnetic field providing coil; 5. Roller; 6. Accelerating liquid guide tube; 7. Mounting frame; 8. First magnetic field generator inner bracket; 9. Second magnetic field generator loading device; 10. Centripetal magnetic wheel; 11. Second magnetic field generator; 12. Second magnetic field generator stabilizing bracket; 13. Accelerating liquid guide tube inlet pipe; 14. Light excitation device; 15. Liquid storage tank; 16. Liquid guide tube outlet pipe; 17. Accelerating device body; 18. Base; 19. Toothed belt; 20. Clamp contact plate; 21. Clamp adjustment device; 22. Inlet end of the workpiece to be polished; 23. Motor. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0025] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the context clearly indicates otherwise, the singular form is intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0026] Unless otherwise specifically stated, the relative arrangement of the parts and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be clear that, for ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be considered as part of the specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following figures, and therefore, once an item is defined in one figure, it does not need to be further discussed in subsequent figures.

[0027] In the description of the present invention, it should be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "horizontal, vertical, vertical, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the scope of protection of the present invention: the directional words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0028] For ease of description, spatially relative terms such as "above," "above," "on the upper surface of," and "above" may be used herein to describe the spatial positional relationship of a device or feature to other devices or features as shown in the figures. It should be understood that spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is inverted, a device described as "above" or "on top of" another device or structure would then be positioned as "below" or "below" the other device or structure. Thus, the exemplary term "above" may include both the orientations of "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used herein should be interpreted accordingly.

[0029] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the present invention.

[0030] like Figures 1-3 As shown, an embodiment of the present invention discloses a novel optical-magnetic coupling polishing device for the inner surface of a non-straight micro-channel, comprising a main frame 1 and a first magnetic field generator, a second magnetic field generator, a liquid reservoir 15, and a polishing liquid acceleration unit installed inside the main frame. The workpiece to be polished is mounted on a mounting frame 7 between the first magnetic field generator and the second magnetic field generator 11. The first magnetic field generator is also connected to a rolling device. One end of the polishing liquid acceleration unit is connected to the workpiece, and the other end is connected to the liquid reservoir. A light excitation device 14 is also provided between the output end of the liquid reservoir and the polishing liquid acceleration unit. The other end of the workpiece to be polished is connected to the liquid reservoir through a liquid outlet pipe 16. The polishing liquid stored in the liquid reservoir includes abrasives and magnetic fluid. During the processing, the magnetic field of the first magnetic field generator is adjusted by the action of the rolling device.

[0031] The liquid outlet pipe 16 is connected to the liquid storage tank and adopts segmented gravity reflux. A U-shaped liquid seal section is provided on the pipe section to prevent gas backflow, and its end is connected to the liquid storage tank.

[0032] The light excitation device can be a xenon light source. In this embodiment, the light excitation device is arranged inside the liquid reservoir. Specifically, at least one section of the polishing liquid tube, that is, the polishing liquid tube between the liquid reservoir and the polishing liquid acceleration unit is transparent, and the light excitation device is connected to a power supply. The xenon light source lamp tube rotates and directly shines on the transparent pipe to perform photocatalysis. The wavelength range, light intensity threshold and irradiation time of the xenon light source are adjusted according to the actual application scenario. In this embodiment, 250-400nm ultraviolet rays are used. As an optional embodiment, the xenon light source can be a ring array light source surrounding the transparent pipe to ensure uniform lighting.

[0033] In this embodiment, the polishing liquid used can be a common polishing liquid in the prior art. Specifically, by weight, it contains 2-5% cerium oxide, 5-7% ferrosoferric oxide, 0.5-1% sodium cellulose, and the remainder is deionized water. During the polishing process, the workpiece is not completely filled with the polishing liquid, but rather distributed in segments. By controlling the outflow rate of the polishing liquid, it can be evenly distributed throughout the workpiece. Ultraviolet light excites the cerium oxide to produce reactive oxygen free radicals, thereby increasing the chemical mechanical polishing rate.

[0034] Further, if Figure 4 As shown, the polishing liquid acceleration unit includes an acceleration device body 17 and a base 18. The bottom of the acceleration device body is installed on the main frame 1 through the base. The interior of the acceleration device body is provided with a plurality of holes for installing the acceleration device magnetic field providing coil 4 and a center hole provided at the center of the acceleration device body along its axial direction. In this embodiment, the number of holes for installing the acceleration device magnetic field providing coil is 6, and the spacing between adjacent holes is the same, that is, the angle between the axes of adjacent holes is 60°. The acceleration process accelerates the polishing liquid in the center hole through the coils in the six holes, and the current size is controlled by program setting to make the initial velocity of the magnetic fluid meet the requirements. Specifically, after the current size is calculated by a conventional controller, the current can be controlled by a 51 single-chip microcomputer in combination with a three-stage tube.

[0035] As an expandable implementation method, the inner wall of the central hole is provided with a tapered guide groove with a contraction angle of 5 to 8 degrees to further reduce fluid turbulence.

[0036] An accelerating liquid guide tube is provided in the central hole; The output end of the light excitation device is connected to the accelerating liquid guide tube 6 through the accelerating liquid guide tube inlet tube 13, and the output end of the accelerating liquid guide tube 6 is connected to the inlet end 22 of the workpiece to be polished through the accelerating liquid guide tube outlet tube 3.

[0037] The coil provides a transverse magnetic field in the axial direction determined by the right-hand rule. The following is used to calculate the magnitude of the magnetic force on the polishing liquid, where u0 is a constant, I is the current, R is the radius of the solenoid, n is the number of turns, and X is the distance.

[0038] A magnetic object can be considered to have a magnetic moment If the dipole is located in the far field of the solenoid (X>>solenoid length and radius), the magnetic force it receives is:

[0039] in, is the magnetic field gradient.

[0040] For a distance X along the axial direction (direction of the solenoid axis), the magnetic field gradient is approximately:

[0041] The magnitude of the magnetic force is: .

[0042] Based on the relationship between current and the magnitude of the force, the acceleration distance is very short, and the magnitude of the force can be approximately regarded as unchanged. The magnitude of the current passing through the coil is obtained from the kinetic energy theorem.

[0043] Furthermore, the first magnetic field generator is used to provide a controllable magnetic field centripetal force to control the polishing liquid to perform controllable circular motion; the second magnetic field generator is used to provide a controllable transverse magnetic field to the polishing area of the workpiece.

[0044] In this embodiment, Figure 9 As shown, the second magnetic field generator includes two coaxially arranged second magnetic field generator loading devices 9, and a hole for installing the coil is opened at the center position of the two second magnetic field generator loading devices. A vertically arranged second magnetic field generator stabilizing bracket 12 is connected to the outer side surface of the two second magnetic field generator loading devices, and is installed on the main frame 1 through the second magnetic field generator stabilizing bracket 12.

[0045] The magnetic field generator generates a controllable magnetic field force on the magnetic fluid through the generated magnetic field to control the direction and polishing of the magnetic fluid polishing liquid.

[0046] In this embodiment, Figure 8 As shown, the first magnetic field generator includes two centripetal magnetic wheels 10, on which fixed magnets are mounted. Specifically, the fixed magnets are transversely arranged first magnetic field generator inner brackets 8 respectively connected to the upper and lower sides of the centripetal magnetic wheels. A coil is arranged on the side of the first magnetic field generator inner bracket facing the center of the centripetal magnetic wheel.

[0047] One end of the centripetal magnetic wheel is connected to the roller 5 serving as the driving end.

[0048] In this embodiment, the workpiece to be polished is set at a preset work position by a fixture, and the fixture includes a main support frame and end plates arranged at the upper and lower ends of the main support frame, and the upper and lower end plates are both provided with fixtures, wherein the lower end plate is connected to the support plate at the middle position of the two second magnetic field generator loading devices, and the fixture includes at least a support mechanism and an ejection mechanism arranged on the support mechanism. In this embodiment, the ejection mechanism is a motor-driven fixture adjustment device 21, and a fixture contact plate 20 is provided at its end. The workpiece to be polished is limited to a position coaxial with the coil of the second magnetic field generator through the fixture contact plate.

[0049] In this embodiment, the support mechanism has at least three support legs, and four support legs are shown in the figure.

[0050] In this embodiment, the magnetic centripetal wheel, the inner bracket of the first magnetic field generator, and the loading device of the second magnetic field generator are all made of high-strength non-magnetic conductors, such as 304 stainless steel or other materials.

[0051] Furthermore, the rolling device includes a roller 2 and two rollers mounted on the roller. The rollers are respectively in contact with the two centripetal magnetic wheels of the first magnetic field generator. The rollers are mounted on the roller, and the roller is driven by a motor 23. In this embodiment, the output end of the motor is provided with an axle, and a toothed belt 19 is sleeved on a synchronous pulley connected to the axle. The other synchronous pulley of the synchronous toothed belt is connected to the roller.

[0052] In this embodiment, the center position of the centripetal magnetic wheel of the first magnetic field generator is a hollow hole structure for the catheter to pass through, so as to prevent the centripetal magnetic wheel from interfering with the catheter when rolling.

[0053] As an expandable implementation method, the first magnetic field generator is installed on the main frame through an adjustable eccentric wheel bracket, and the adjustable eccentric wheel bracket is provided with a worm gear fine-tuning mechanism to achieve precise alignment of the magnetic field center and the workpiece axis.

[0054] Depending on the size of the workpiece to be polished, as an expandable implementation method, if the upper and lower clamps are difficult to clamp, radially retractable jaws can be added to the loading device of the second magnetic field generator. The two ends of the workpiece can be clamped by manually driving a screw, thereby achieving four-dimensional fixation of the workpiece.

[0055] The present invention also discloses a novel optical-magnetic coupling polishing method for the inner surface of a non-straight micro-channel, comprising the following steps: placing a workpiece to be polished on a mounting frame, and specifically, adjusting and fixing the vertical height of the workpiece to be polished by upper and lower clamps so that the center line of the helical line of the workpiece to be polished is highly adapted to the axis of the second magnetic field generator; The pipeline inside the workpiece is connected to the liquid storage tank through a guide tube, and a complete closed loop is formed after passing through the polishing liquid acceleration unit; specifically, a quick-change connector can be used to connect the acceleration guide tube outlet and the workpiece inlet, and the workpiece outlet to the liquid guide outlet tube and the liquid storage tank.

[0056] As a further expanded implementation method, the worm of the first magnetic field support is adjusted, and the micrometer is observed to maintain the coaxiality of the magnetic wheel and the workpiece at a preset accuracy.

[0057] Start the light excitation device to preheat; adjust the second magnetic field current knob to the rated value; After reaching the energy required for excitation, the control system and the polishing liquid acceleration unit are started; The polishing liquid after the abrasive and magnetic fluid are excited by light flows into the polishing liquid acceleration unit; as a specific implementation method, during the acceleration stage, the traveling wave magnetic field Lorentz force and the spiral coil generate a moving magnetic field, which pushes the magnetic fluid to perform axial acceleration, accelerating to about 30m / s (depending on the material being polished). According to the kinetic energy formula, the magnetic field size is controlled according to the initial and final velocities.

[0058] The polishing liquid is accelerated through the accelerating tube and enters the pipe inside the workpiece for polishing; Figure 7 As shown, during rotary polishing, the energized coil of the first magnetic field generator creates a magnetic field that, through the rotating centripetal magnetic wheel, forces the abrasive to rotate against the pipe wall. During axial propulsion, the coaxial coil generates an axial magnetic field gradient, driving the magnetic fluid forward to overcome friction against the pipe wall.

[0059] After polishing, check whether the polishing requirements are met. If not, continue the polishing process until the preset polishing accuracy is achieved.

[0060] After processing is completed, the diversion pipe in the device is cleaned. The pipe is removed from the device and placed vertically. The remaining polishing liquid in the pipe is recovered by gravity. After it is left there until it can no longer be recovered, the residue in the pipe is washed out with clean water, and finally the pipe is dried with hot air.

[0061] All parts of the device should be placed in a dry and cool place to extend their service life.

[0062] For the polishing fluid, a photoexcitation device triggers a photoexcitation reaction in the liquid reservoir, producing the desired polishing fluid. The fluid then passes through an accelerator, where the current is adjusted to achieve a calculated acceleration, reaching the inlet pipe connected to the workpiece. The polishing fluid then enters the workpiece at this initial velocity. In the control system, a motor drives the roller, which in turn rotates the centripetal magnetic wheel. As the centripetal magnetic wheel rotates, a fixed magnet generates a centripetal force, forcing the magnetic fluid abrasive particles to move in a circular motion against the wall. A controllable current is applied to the coaxial coil of the second magnetic field generator, creating a controllable transverse magnetic field on the workpiece through a transversely positioned coil. This controls the polishing fluid's pull toward the workpiece outlet, driving the magnetic fluid's axial motion.

[0063] As an optional implementation, the rotation speed of the magnetic wheel is monitored by an encoder, and the PID controller dynamically adjusts the motor speed to ensure synchronization with the angular velocity of the polishing liquid.

[0064] Because the energy lost by the polishing fluid during the polishing process is replenished by the transverse magnetic field, the speed and angular velocity remain unchanged. Once the initial velocity is determined, the motor speed can be determined. The only thing that changes is the direction of the centripetal magnetic field, while the transverse magnetic field remains unchanged. The direction of the centripetal magnetic field is determined by the coil mounted on the ring, which rotates synchronously with the polishing fluid under the control of the motor.

[0065] Finally, the polishing fluid flows into the polishing fluid return pipe after polishing the desired portion of the workpiece. Finally, gravity flows back into the reservoir. This process is repeated until the workpiece reaches a Ra of less than 3 μm for a 3 mm diameter channel. The device is then shut down and all polishing fluid is recovered.

[0066] As an optional implementation, a centrifugal filter device may be added to the liquid storage tank to separate the wear debris and the polishing liquid in real time.

[0067] The present invention utilizes a continuous polishing liquid output system, continuously delivering the polishing liquid to an accelerator. The polishing liquid flows into a control system at a stable flow rate. Through effective control of the control system, the polishing liquid can be effectively and efficiently polished. This continuous polishing system effectively improves the continuity of the polishing liquid within the control system, thereby enhancing polishing efficiency and effectiveness.

[0068] This invention provides the necessary chemical and physical conditions for the polishing process through the reaction between the magnetic fluid and the abrasive under light stimulation. Simultaneously, the flexible variation of the magnetic field becomes the key to controlling the behavior of the polishing fluid. This variation is achieved by adjusting the current supplied by the magnetic field coil and the speed of the polishing fluid. The system can precisely control the changes in current, thereby guiding the adjustment of the magnetic field, thereby achieving precise control of the polishing fluid flow and the polishing effect.

[0069] On this basis, simulation is carried out as follows Figure 5 The results show that: through the pressure simulation results, it can be seen that when the incident velocity is constant, the force on the outside of the tube is greater than that on the inside, resulting in different wear on the inside and outside of the inner tube, which may cause buckling and deformation on both sides. The present invention uses a magnetic field generator to balance the force on both sides of the tube, thereby providing a better polishing effect of the polishing liquid.

[0070] As follows Figure 6 The results show that: through the speed simulation results, it can be seen that when polishing starts, the friction coefficient inside the tube is large, resulting in serious speed attenuation. Therefore, a magnetic field generator is used to obtain axial force to keep the speed unchanged at the entrance and exit and when moving inside the tube.

[0071] The direction of the magnetic field is controlled by controlling the coil, which is achieved by controlling the movement of the coil on the track. The angular velocity of the coil's rotation is the same as the angular velocity of the magnetic fluid; the size of the magnetic field is changed by controlling the current size through the algorithm set in the control system.

[0072] Adjustments are made during the actual polishing process because the actual roughness coefficient is different, and the axial magnetic field force is required to do work to offset the kinetic energy loss caused by friction, thereby ensuring that the polishing effect remains unchanged.

[0073] τ ≈ μ * (u / δ) Where: τ is the shear stress (i.e., shear force per unit area); μ is the dynamic viscosity of the fluid; u is the fluid velocity; δ is the boundary layer thickness. Based on this formula, the wall shear force is estimated to predict the wear uniformity, and then the following is obtained: Figure 5 Pressure simulation data shown.

[0074] The material removal rate is quantified by the following formula, and the polishing time is set. V = (k * τ * h * f) / G Where: V is the cutting volume (unit volume / minute); τ is the shear stress (N / m 2 ); h is cutting depth (m); f is feed speed (m / min); G is shear modulus of material (N / m 2 ); k is a proportional constant, which is related to the processing conditions, k=0.8-1.2.

[0075] The implementation of this invention significantly reduces the roughness of the inner wall of the quartz capillary tube, effectively minimizing the refraction and reflection of the laser during transmission within the tube, significantly reducing energy dissipation and improving system performance. This breakthrough is not only applicable to the aerospace industry but is also expected to be expanded to other fields such as semiconductors, medical equipment, and precision instrument manufacturing, demonstrating broad application prospects and commercial value.

[0076] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A novel optical-magnetic coupling polishing device for the inner surface of non-straight micro-channels, characterized in that: It includes a main frame and a first magnetic field generator, a second magnetic field generator, a liquid reservoir, and a polishing liquid acceleration unit installed inside the main frame. The workpiece to be polished is installed on the mounting frame between the first magnetic field generator and the second magnetic field generator. The first magnetic field generator is also connected to a rolling device. One end of the polishing liquid acceleration unit is connected to the workpiece, and the other end is connected to the liquid reservoir. A light excitation device is also provided between the output end of the liquid reservoir and the polishing liquid acceleration unit. The other end of the workpiece to be polished is connected to the liquid reservoir. The polishing liquid stored in the liquid reservoir includes abrasive and magnetic fluid. During the processing, the magnetic field of the first magnetic field generator is adjusted by the action of the rolling device.

2. The polishing device according to claim 1, characterized in that The polishing liquid acceleration unit includes an acceleration device body and a base. The bottom of the acceleration device body is mounted on the main frame through the base. The interior of the acceleration device body is provided with a plurality of holes for mounting coils along its axial direction and a center hole provided at the center of the acceleration device body. An accelerating liquid guide tube is provided in the central hole; The output end of the light excitation device is connected to the accelerating liquid guide tube through the accelerating liquid guide tube inlet tube, and the output end of the accelerating liquid guide tube is connected to the workpiece to be polished through the accelerating liquid guide tube outlet tube.

3. The polishing device according to claim 1, characterized in that The first magnetic field generator is used to provide a controllable magnetic field centripetal force to control the polishing liquid to make a controllable circular motion; the second magnetic field generator is used to provide a controllable transverse magnetic field to the polishing area of the workpiece.

4. The polishing device according to claim 1, characterized in that The first magnetic field generator includes a centripetal magnetic wheel, a fixed magnet is mounted on the centripetal magnetic wheel, and one end of the centripetal magnetic wheel is connected to the driving roller.

5. The polishing device according to claim 1, characterized in that The rolling device includes a roller and two rollers mounted on the roller, the rollers are respectively in contact with two centripetal magnetic wheels of the first magnetic field generator, the rollers are mounted on the roller, and the roller is driven by a motor.

6. A polishing method for the polishing device according to any one of claims 1 to 5, characterized in that: The following steps are involved: Place the workpiece to be polished on the mounting frame, connect the pipe inside the workpiece to the liquid reservoir through the guide pipe, and form a complete closed loop after passing through the polishing liquid acceleration unit; Start preheating of the light excitation device; Start control system and polishing liquid acceleration unit; Abrasive and magnetic fluid flow into the polishing liquid acceleration unit after being excited by light; The polishing liquid is accelerated into the pipe inside the workpiece for polishing; After polishing, check whether the polishing requirements are met. If not, continue the polishing process until the preset polishing accuracy is achieved.

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