Waterproof adsorption carrying table of Micro-LED product edge grinding machine and waterproof method

Abstract

The invention discloses a waterproof adsorption platform deck of a Micro-LED product edge grinding machine and a waterproof method. Electrostatic chucks are embedded in the periphery of the adsorption surface of a vacuum adsorption platform deck, the upper end faces of the electrostatic chucks are flush with the upper end face of the vacuum adsorption platform deck, and adsorption holes in the vacuum adsorption platform deck are located in the inner sides of the electrostatic chucks; a sinking groove is formed in the periphery of the adsorption face of the vacuum adsorption carrying table and located on the outer side of the electrostatic chuck, a plurality of air blowing grooves communicated with the atmosphere are formed in the outer wall of the sinking groove, compressed air is introduced into the sinking groove, and the compressed air is blown out through the air blowing grooves. Cooling water can be effectively prevented from entering a vacuum area, the vacuum adsorption effect of the carrying table is guaranteed, and the machining precision of a glass substrate in the chamfering process is improved. And meanwhile, long-term stable operation of equipment is ensured through convenient vacuum hole dredging and gas-liquid separator maintenance measures, and reliable equipment support is provided for production and processing of Micro-LED products.

Description

Technical Field

[0001] The present invention relates to a waterproof adsorption carrier platform and a waterproof method for a Micro-LED product edge grinding machine. Background Art

[0002] Glass-based Micro LEDs are typically used for large-scale display products. The front is the display surface, while the back is used to mount the driver chip. The back and front wiring are connected via side routing. To ensure the reliability of the side routing, the edges of the glass substrate need to be chamfered. During the chamfering process, the finished wafer needs to be attached to the processing platform. During the grinding process, cooling water is used to cool the grinding rod. As a result, some moisture is absorbed into the vacuum platform, reducing the platform vacuum value and the adsorption force, which in turn causes the product to shift or vibrate, affecting the processing accuracy of the glass. Summary of the Invention

[0003] The present invention aims to solve the problems existing in the above-mentioned prior art and provides a waterproof adsorption carrier and a waterproof method for a Micro-LED product edge grinding machine.

[0004] The technical solutions adopted in the present invention are:

[0005] A waterproof adsorption carrier for a Micro-LED product edge grinding machine includes a base plate and a vacuum adsorption carrier assembled on the base plate and connected to a ventilation pipe. The adsorption surface of the vacuum adsorption carrier is inlaid with electrostatic suction cups. The upper end surface of the electrostatic suction cup is flush with the upper end surface of the vacuum adsorption carrier, and the adsorption hole on the vacuum adsorption carrier is located on the inner side of the electrostatic suction cup. A sink groove is provided around the adsorption surface of the vacuum adsorption carrier and on the outside of the electrostatic suction cup. A number of blowing grooves connected to the atmosphere are provided on the outer wall of the sink groove. The sink groove is connected to compressed air and the compressed air is blown out through the blowing groove.

[0006] Furthermore, an air inlet hole communicating with the sink is provided on the side of the vacuum adsorption carrier, and the air inlet hole is used to connect to an air pipe for introducing compressed air.

[0007] Furthermore, the gaps such as the blowing groove are arranged on the outer wall of the sink, and the upper end notch of the blowing groove extends to the upper end surface of the vacuum adsorption carrier.

[0008] Furthermore, the inner slot width of the blowing slot is greater than the outer slot width.

[0009] Furthermore, the ventilation pipeline includes a main air circuit, a back-blowing air circuit, a negative pressure air circuit, a first two-position two-way solenoid valve and a second two-position two-way solenoid valve. The main air circuit is connected to the adsorption air channel on the vacuum adsorption carrier, and the back-blowing air circuit and the negative pressure air circuit are both connected to the main air circuit. The first two-position two-way solenoid valve and the second two-position two-way solenoid valve are respectively connected to the back-blowing air circuit and the negative pressure air circuit; the back-blowing air circuit is connected to the air compressor, and the negative pressure air circuit is connected to the vacuum pump.

[0010] Furthermore, the negative pressure air circuit is also connected to a gas-liquid separator and a two-position three-way solenoid valve, and the three valve ports of the two-position three-way solenoid valve are respectively connected to the negative pressure air circuit, a vacuum pump and an air compressor.

[0011] Furthermore, the liquid outlet of the gas-liquid separator is connected to a one-way valve.

[0012] The present invention also discloses a waterproof method for an adsorption carrier, wherein a glass substrate is placed on a vacuum adsorption carrier, and a first two-position two-way solenoid valve is adjusted to close a back-blowing air path;

[0013] Open the second two-position two-way solenoid valve and adjust the two-position three-way solenoid valve so that the vacuum pump is connected to the negative pressure air circuit, and the glass substrate is adsorbed onto the vacuum adsorption carrier by the negative pressure;

[0014] Open the electrostatic chuck and further fix the glass substrate on the vacuum adsorption stage through electrostatic adsorption;

[0015] When the tool chamfers the glass substrate along the circumference of the glass substrate, the air compressor connected to the air inlet is turned on to continuously blow compressed air into the sink. The cooling water continuously sprayed out for cooling the tool is blown away by the compressed air blown out of the blowing groove to prevent the cooling water from entering the vacuum area. The electrostatic field formed by the electrostatic chuck further prevents the cooling water from entering the vacuum area.

[0016] Furthermore, when it is necessary to clear the vacuum hole on the vacuum adsorption carrier, adjust the second two-position two-way solenoid valve to close the negative pressure air path, adjust the first two-position two-way solenoid valve to open the back-blowing air path, start the air compressor connected to the back-blowing air path, and clear the vacuum hole by blowing compressed air into the vacuum adsorption carrier.

[0017] Furthermore, during the chamfering process of the glass substrate, if water vapor is adsorbed into the negative pressure air path, the water vapor will enter the gas-liquid separator; during regular maintenance, close the first two-position two-way solenoid valve and the second two-position two-way solenoid valve, start the air compressor connected to the two-position three-way solenoid valve, and discharge the liquid in the gas-liquid separator.

[0018] The present invention has the following beneficial effects:

[0019] This invention effectively prevents cooling water from entering the vacuum zone, ensuring the vacuum absorption of the carrier and improving the processing accuracy of glass substrates during chamfering. Furthermore, convenient vacuum hole dredging and gas-liquid separator maintenance ensure long-term stable operation of the equipment, providing reliable equipment support for the production and processing of Micro-LED products. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of the adsorption platform of the present invention.

[0021] Figure 2 Schematic diagram of the adsorption platform of the present invention.

[0022] Figure 3 Schematic diagram of the connection of the ventilation pipeline of the present invention.

[0023] Figure 4 Schematic diagram of negative pressure adsorption of glass substrate.

[0024] Figure 5 This is a diagram of the vacuum hole dredging process.

[0025] Figure 6 is a schematic diagram of the maintenance process. DETAILED DESCRIPTION

[0026] The present invention will be further described below with reference to the accompanying drawings.

[0027] like Figure 1 and Figure 2 The present invention provides a waterproof adsorption carrier for a Micro-LED product edge grinding machine, which is used to solve the problem that cooling water easily enters the interior of the vacuum carrier during chamfering of the glass substrate, resulting in reduced adsorption force and affecting processing accuracy. The specific structure is as follows.

[0028] A base plate 2 and a vacuum adsorption platform 1 assembled on the base plate 2 and connected to a ventilation pipe, the adsorption surface of the vacuum adsorption platform 1 is inlaid with electrostatic suction cups 3, the upper end surface of the electrostatic suction cups 3 is flush with the upper end surface of the vacuum adsorption platform 1, and the adsorption hole on the vacuum adsorption platform is located on the inner side of the electrostatic suction cup 3, and a sinking groove 11 is provided around the adsorption surface of the vacuum adsorption platform 1 and on the outside of the electrostatic suction cup 3, and a plurality of blowing grooves 12 connected to the atmosphere are provided on the outer wall of the sinking groove 11, the sinking groove 11 is connected to compressed air, and the compressed air is blown out through the blowing groove 12.

[0029] Base plate 2, the fundamental support structure for the entire apparatus, possesses sufficient strength and stability to withstand the weight of vacuum stage 1 and glass substrate 100, as well as the various forces generated during processing. Vacuum stage 1 is tightly assembled onto base plate 2 and secured with bolts and other fasteners, ensuring a secure connection that prevents displacement or loosening during processing.

[0030] Electrostatic suction cups 3 are embedded around the adsorption surface of the vacuum adsorption platform 1, and their upper end surfaces are flush with the upper end surface of the vacuum adsorption platform 1. This flush design ensures that the bottom of the glass substrate 100 is evenly stressed during placement and adsorption, and does not cause stress concentration or local deformation due to height differences. The adsorption holes in the vacuum adsorption platform 1 are located on the inner side of the electrostatic suction cups 3. When the glass substrate 100 is placed on the vacuum adsorption platform 1, the electrostatic suction cups 3 can generate electrostatic adsorption force, which works together with the negative pressure adsorption force of the vacuum adsorption platform 1 to enhance the fixing effect of the glass substrate 100. The distribution of the electrostatic adsorption force is relatively uniform, which can effectively compensate for the problem of insufficient adsorption force in certain edge areas of negative pressure adsorption, thereby improving the stability of the glass substrate 100 during the chamfering process.

[0031] A groove 11 is machined around the adsorption surface of the vacuum adsorption platform 1 and outside the electrostatic chuck 3. An air blowing groove 12 is arranged on the outer wall of the groove 11, and the upper end of the air blowing groove 12 extends to the upper end surface of the vacuum adsorption platform 1.

[0032] The inner slot width of the blowing slot 12 is greater than the outer slot width. This wide-inner-narrow-outer structural design has significant advantages. As compressed air is ejected from the sink 11 through the blowing slot 12, the wide-inner-narrow-outer structure increases the airflow pressure at the outlet of the blowing slot 12, creating a stronger airflow impact force, thereby more effectively blowing away the cooling water and preventing it from entering the vacuum area.

[0033] An air inlet 13 connected to the sink 11 is processed on the side of the vacuum adsorption carrier 1. The air inlet 13 is connected to the air compressor through an air pipe. The compressed air provided by the air compressor enters the sink 11 smoothly through the air inlet 13 and is ejected from the blowing groove 12, forming a continuous and stable airflow, providing reliable power support for the waterproof function.

[0034] The main air path 41 is the core channel of the entire ventilation system, directly connecting to the suction air channels on the vacuum adsorption stage 1. These suction air channels are evenly distributed within the vacuum adsorption stage 1 and effectively transmit negative pressure to each adsorption hole on the stage surface, ensuring that the glass substrate 100 is evenly adsorbed over a large area.

[0035] The back-blowing air circuit 42 and the negative pressure air circuit 43 are both connected to the main air circuit 41. The back-blowing air circuit 42 is mainly used to introduce compressed air when the vacuum hole needs to be unblocked. Its pipeline design can withstand high air pressure, and the connection with the air compressor is equipped with a corresponding sealing device to prevent gas leakage.

[0036] like Figure 3 The negative pressure gas path 43 is responsible for transmitting the negative pressure generated by the vacuum pump to the main gas path 41 , and then acting on the adsorption gas channel of the vacuum adsorption carrier 1 .

[0037] A first, two-position, two-way solenoid valve 44 is connected to the back-blowing air path 42, and a second, two-position, two-way solenoid valve 45 is connected to the negative-pressure air path 43. The electrical signals sent by the control system can quickly and accurately control the opening and closing of the solenoid valves, thereby achieving on-off control of the back-blowing air path 42 and the negative-pressure air path 43.

[0038] like Figure 4 When normal adsorption operation is required, the first two-position two-way solenoid valve 44 closes the back-blowing air path 42, and the second two-position two-way solenoid valve 45 opens the negative pressure air path 43, so that the vacuum pump can work normally and generate the negative pressure required for adsorption. Figure 5 When the vacuum hole needs to be dredged, the first two-position two-way solenoid valve 44 is opened, the second two-position two-way solenoid valve 45 is closed, and the back-blowing air path 42 is connected to compressed air to back-blow and dredge the vacuum hole.

[0039] like Figure 6 The negative pressure gas circuit 43 is also connected to a gas-liquid separator 46 and a two-position three-way solenoid valve 47. The three valve ports of the two-position three-way solenoid valve 47 are respectively connected to the negative pressure gas circuit 43, a vacuum pump and an air compressor.

[0040] Gas-liquid separator 46 effectively separates any moisture that may be present in negative-pressure air path 43, preventing it from entering the vacuum pump and affecting its performance and lifespan. Gas-liquid separator 46 separates the liquid from the gas-liquid mixture and collects it at the bottom of the separator. (Gas-liquid separator 46 is a purchased component, and its structural principles are well-known, so this application does not elaborate on them.) A one-way valve 48 is connected to the liquid outlet of gas-liquid separator 46 to ensure that the separated liquid can only be discharged in a specified direction, preventing it from flowing back into gas-liquid separator 46 or negative-pressure air path 43.

[0041] During regular maintenance, the first two-position two-way solenoid valve 44 and the second two-position two-way solenoid valve 45 are closed, and the air compressor connected to the two-position three-way solenoid valve 47 is started. The compressed air enters the gas-liquid separator 46 through the two-position three-way solenoid valve 47, and the liquid in the separator is discharged smoothly, ensuring the normal operation of the gas-liquid separator 46 and maintaining the stability and reliability of the entire ventilation pipeline system.

[0042] The waterproofing method of the present application is further described below.

[0043] The chamfering tool 200 is mounted on the tool spindle of the edge grinding machine, and the glass substrate 100 to be processed is gently placed on the vacuum adsorption stage 1, with the bottom of the glass substrate 100 flatly attached to the adsorption surface of the vacuum adsorption stage 1. The control system sends a signal to adjust the first two-position two-way solenoid valve 44 to the closed state, thereby disconnecting the backflush air path 42 from the air compressor, ensuring that the backflush airflow does not interfere with the adsorption effect during the adsorption process.

[0044] Open the second two-position, two-way solenoid valve 45, and simultaneously adjust the two-position, three-way solenoid valve 47, connecting the vacuum pump to the negative-pressure air path 43. The vacuum pump begins operating, extracting air from the suction channel on the vacuum adsorption stage 1 through the negative-pressure air path 43 and the main air path 41, creating a negative pressure environment. Under the influence of atmospheric pressure, the glass substrate 100 is firmly attached to the vacuum adsorption stage 1.

[0045] When electrostatic chuck 3 is turned on, it generates an electrostatic field through an electrostatic generator, creating an electrostatic attraction force between the bottom of glass substrate 100 and electrostatic chuck 3. This electrostatic attraction force complements the negative pressure attraction force, further strengthening the fixation of glass substrate 100 on vacuum adsorption stage 1 and ensuring that glass substrate 100 does not move or vibrate during the chamfering process.

[0046] During the process of the tool 200 chamfering the glass substrate 100 along the circumference, the chamfering tool 200 rotates at high speed and contacts the edge of the glass substrate 100, generating a large amount of cutting heat. In order to cool the tool 200 and the processing area, cooling water needs to be continuously sprayed.

[0047] At this point, the air compressor connected to the air inlet 13 is turned on, and compressed air enters the sink 11 through the air inlet 13 and is ejected from the air blowing slot 12. The compressed air ejected from the air blowing slot 12 forms a powerful air curtain, which can promptly blow the ejected cooling water away from the surface of the carrier and the edge of the glass substrate 100, effectively preventing the cooling water from entering the vacuum area, thereby avoiding the problem of reduced carrier vacuum value and reduced adsorption force due to water ingress.

[0048] At the same time, the electrostatic field generated by the electrostatic chuck 3 also serves to prevent cooling water from entering the vacuum region to a certain extent. This is because the electrostatic field exerts both attractive and repulsive forces on water molecules, making it more difficult for them to cross the boundary of the electrostatic field and enter the interior of the carrier. The dual waterproofing measures of compressed air blown from the air blowing slot 12 and the electrostatic field provide reliable waterproofing for the entire chamfering process, ensuring the processing accuracy and quality of the glass substrate 100.

[0049] When it is necessary to dredge the vacuum hole on the vacuum adsorption carrier 1, first adjust the second two-position two-way solenoid valve 45 to be in a closed state, thereby cutting off the connection between the negative pressure air path 43 and the vacuum pump and stopping the negative pressure adsorption. Next, adjust the first two-position two-way solenoid valve 44 to be in a conducting state, and connect the back-blowing air path 42 to the air compressor. Start the air compressor connected to the back-blowing air path 42, and the compressed air enters the adsorption air channel of the vacuum adsorption carrier 1 through the back-blowing air path 42 and the main air path 41, and is ejected from the vacuum hole. This high-pressure airflow can effectively blow out dust, impurities and other foreign matter that may block the adsorption air channel and the vacuum hole, thereby achieving the dredging of the vacuum hole. The time and frequency of the back-blowing dredging operation can be adjusted according to the actual processing conditions and the degree of blockage. Generally, the dredging operation is performed after each processing is completed or when the adsorption force is found to have dropped significantly, so as to ensure the normal working performance of the vacuum adsorption carrier 1.

[0050] During the chamfering process of the glass substrate 100, some water vapor may be absorbed into the negative pressure air path 43 along with the airflow. This water vapor enters the gas-liquid separator 46, where it is separated and accumulates at the bottom of the separator. During regular maintenance, the first two-position, two-way solenoid valve 44 and the second two-position, two-way solenoid valve 45 are first closed to cut off the airflow in the entire ventilation piping system and ensure the safety of maintenance operations.

[0051] Then, the air compressor connected to the two-position three-way solenoid valve 47 is started, and the compressed air enters the gas-liquid separator 46 through the two-position three-way solenoid valve 47, thereby pressurizing and discharging the liquid in the separator. The discharged liquid can be guided to a dedicated collection container through a drain pipe connected to the outlet of the one-way valve 48 for centralized treatment, thereby preventing the indiscriminate discharge of liquid from causing environmental pollution or equipment corrosion.

[0052] Regular maintenance of the gas-liquid separator 46 and draining of accumulated liquid can prevent the liquid from breeding bacteria inside the separator, generating odor, or corroding the separator's internal structure, ensuring the normal operation of the gas-liquid separator 46. At the same time, this also ensures the smooth flow of the negative pressure air path 43, preventing liquid from flowing back into the negative pressure air path 43 and affecting the efficiency and adsorption effect of the vacuum pump, thereby extending the service life of the entire ventilation pipeline system and vacuum adsorption carrier 1 and ensuring the smooth progress of the chamfering process.

[0053] The above description is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements can be made without departing from the principles of the present invention. These improvements should also be regarded as the scope of protection of the present invention.

Claims

1. A waterproof adsorption carrier for a Micro-LED product edge grinding machine, comprising a base plate (2) and a vacuum adsorption carrier (1) mounted on the base plate (2) and connected to a ventilation pipe, characterized in that: The adsorption surface of the vacuum adsorption platform (1) is inlaid with an electrostatic suction cup (3) around the periphery, the upper end surface of the electrostatic suction cup (3) is flush with the upper end surface of the vacuum adsorption platform (1), and the adsorption hole on the vacuum adsorption platform is located on the inner side of the electrostatic suction cup (3), and a sinking groove (11) is provided around the adsorption surface of the vacuum adsorption platform (1) and on the outer side of the electrostatic suction cup (3), and a plurality of blowing grooves (12) connected to the atmosphere are provided on the outer wall of the sinking groove (11), and the compressed air is connected to the sinking groove (11) and the compressed air is blown out through the blowing groove (12).

2. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 1, characterized in that: An air inlet (13) communicating with the sink (11) is provided on the side of the vacuum adsorption platform (1), and the air inlet (13) is used to connect to an air pipe for introducing compressed air.

3. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 1, characterized in that: The air blowing groove (12) is arranged at equal intervals on the outer wall of the sink (11), and the upper end notch of the air blowing groove (12) extends on the upper end surface of the vacuum adsorption platform (1).

4. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 3, characterized in that: The inner slot width of the blowing slot (12) is greater than the outer slot width.

5. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 1, characterized in that: The ventilation pipeline includes a main air path (41), a back-blowing air path (42), a negative pressure air path (43), a first two-position two-way solenoid valve (44) and a second two-position two-way solenoid valve (45). The main air path (41) is connected to the adsorption air path on the vacuum adsorption carrier (1). The back-blowing air path (42) and the negative pressure air path (43) are both connected to the main air path (41). The first two-position two-way solenoid valve (44) and the second two-position two-way solenoid valve (45) are respectively connected to the back-blowing air path (42) and the negative pressure air path (43). The back-blowing air path (42) is connected to an air compressor, and the negative pressure air path (43) is connected to a vacuum pump.

6. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 5, characterized in that: The negative pressure gas circuit (43) is also connected to a gas-liquid separator (46) and a two-position three-way solenoid valve (47), and the three valve ports of the two-position three-way solenoid valve (47) are respectively connected to the negative pressure gas circuit (43), a vacuum pump, and an air compressor.

7. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 6, characterized in that: The liquid outlet of the gas-liquid separator (46) is connected to a one-way valve (48).

8. A waterproofing method for an adsorption carrier according to any one of claims 1 to 7, characterized in that: Placing the glass substrate (100) on the vacuum adsorption carrier (1), and adjusting the first two-position two-way solenoid valve (44) so that the back-blowing air path (42) is closed; Open the second two-position two-way solenoid valve (45), and adjust the two-position three-way solenoid valve (47) so that the vacuum pump is connected to the negative pressure air path (43), and the glass substrate (100) is adsorbed onto the vacuum adsorption platform (1) by the negative pressure; Opening the electrostatic chuck (3) and further adsorbing and fixing the glass substrate (100) on the vacuum adsorption platform (1) through electrostatic adsorption; During the process of chamfering the glass substrate (100) along the circumference of the glass substrate by the tool (200), the air compressor connected to the air inlet (13) is turned on to continuously blow compressed air into the sink (11). The cooling water continuously ejected for cooling the tool is blown away by the compressed air blown out of the blowing groove (12), thereby preventing the cooling water from entering the vacuum area. The electrostatic field formed by the electrostatic suction cup (3) further prevents the cooling water from entering the vacuum area.

9. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 8, characterized in that: When the vacuum hole on the vacuum adsorption carrier (1) needs to be unblocked, the second two-position two-way solenoid valve (45) is adjusted to close the negative pressure air path (43), and the first two-position two-way solenoid valve (44) is adjusted to open the back-blowing air path (42). The air compressor connected to the back-blowing air path (42) is started, and the vacuum hole is unblocked by blowing compressed air into the vacuum adsorption carrier (1).

10. The waterproof adsorption carrier for a Micro-LED product edge grinding machine according to claim 8, characterized in that: During the chamfering process of the glass substrate (100), if water vapor is adsorbed into the negative pressure air path (43), the water vapor will enter the gas-liquid separator (46); during regular maintenance, the first two-position two-way solenoid valve (44) and the second two-position two-way solenoid valve (45) are closed, and the air compressor connected to the two-position three-way solenoid valve (47) is started to discharge the liquid in the gas-liquid separator (46).

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