Auxiliary positioning device for semiconductor part processing

Abstract

The invention provides an auxiliary positioning device for semiconductor part processing, and the device comprises a support which is assembled on a semiconductor part processing machine tool through a bolt; a first threaded rod is rotatably connected to the middle of the support, a threaded block is in threaded connection with the outer portion of the first threaded rod, connecting rods are hinged to the two sides of the threaded block, a sliding rod is fixedly embedded in the front end of the support in a penetrating mode, and two symmetrically-arranged sliding blocks are slidably connected to the outer side of the sliding rod in a penetrating mode. According to the auxiliary positioning device for semiconductor part processing, the two positioning clamping blocks are matched to carry out auxiliary clamping and positioning on a semiconductor part, meanwhile, the two positioning clamping blocks are matched to carry out auxiliary clamping and positioning on the semiconductor part, and meanwhile, the two positioning clamping blocks are matched to carry out auxiliary clamping and positioning on the semiconductor part. In order to adapt to clamping and positioning of the cylindrical semiconductor part, an arc-shaped groove is formed in the positioning clamping block to clamp the conventional cylindrical semiconductor part.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing auxiliary tools, and in particular to an auxiliary positioning device for semiconductor part processing. Background Art

[0002] Semiconductors refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. When processing semiconductor parts, auxiliary positioning devices are used to fix the semiconductor parts to ensure their stability.

[0003] The authorization announcement number is: CN220331120U, and the name is an auxiliary positioning device for semiconductor parts processing. This device not only achieves the purpose of adjusting the height, thereby improving the application range of the positioning device, but also achieves the purpose of positioning and placing the positioning device, and also achieves the purpose of facilitating the rapid positioning of semiconductor parts.

[0004] The clamping blocks of the above-mentioned existing auxiliary positioning devices are mostly fixed, while the shapes and specifications of semiconductor parts are diverse. It is difficult for fixed clamping blocks to fully fit all types and specifications of semiconductor parts, making it impossible for the auxiliary positioning device to ensure stable fixation of various semiconductor parts, thereby affecting their subsequent processing effects. Summary of the Invention

[0005] The present invention provides an auxiliary positioning device for semiconductor part processing, which is used to solve the problem that the clamping blocks of the auxiliary positioning devices in the prior art are mostly fixed, while the shapes and specifications of semiconductor parts are diverse. It is difficult for the fixed clamping blocks to completely fit all types and specifications of semiconductor parts, so that the auxiliary positioning device cannot ensure stable fixation of various semiconductor parts, thereby affecting their subsequent processing effects.

[0006] In one aspect, the present invention provides an auxiliary positioning device for semiconductor part processing, comprising: A bracket, wherein the bracket is assembled on a semiconductor parts processing machine tool by bolts; The middle part of the bracket is rotatably connected to a threaded rod 1, and the external thread of the threaded rod 1 is connected to a threaded block, and both sides of the threaded block are hinged with connecting rods, and a sliding rod is embedded in the front end of the bracket, and the outer side of the sliding rod is penetrated and slidably connected to two symmetrically arranged sliders, and the two sliders are equipped with positioning clamps through elastic connecting rods, and arc grooves are provided on the opposite sides of the two positioning clamps. The auxiliary positioning device for semiconductor part processing adopts two positioning clamps to cooperate to assist in clamping and positioning semiconductor parts. At the same time, in order to adapt to the clamping and positioning of cylindrical semiconductor parts, conventional cylindrical semiconductor parts are clamped by providing arc grooves in the positioning clamps.

[0007] The two positioning clamps are each equipped with an adjustment assembly, which includes: Multiple L-shaped rods extend through and slidably connect to the interior of the positioning clamp. Each L-shaped rod is rotatably connected to a rubber wheel at its base. A spring is secured between each L-shaped rod and the positioning clamp. Each rubber wheel is located within an arcuate groove, and a U-shaped frame is secured to the top of each L-shaped rod. By providing an adjustment assembly, the multiple rubber wheels can contact the semiconductor component when clamping a special-shaped semiconductor component. Because the rubber wheels are movably connected to the positioning clamp via the L-shaped rods, the multiple rubber wheels can better accommodate special-shaped semiconductor components. Furthermore, when clamping a conventional flat semiconductor component, the rectangular latch rod can be moved by rotating the second threaded rod, which in turn controls the rotation of the pressure plate via gears until it is level with the positioning clamp, thereby clamping the conventional flat semiconductor component.

[0008] On the other hand, the adjustment assembly further comprises a threaded rod 2 threadedly connected to the interior of the positioning clamp block, the front end of the threaded rod 2 being rotatably connected to a rectangular gear rod, and the rectangular gear rod is passed through and slidably connected to the positioning clamp block.

[0009] On the other hand, the adjustment assembly further comprises a pressure plate hinged to the interior of the positioning clamp block via a rotating rod, a gear is fixed to the middle of the rotating rod, and the gear is engaged with the rectangular gear rod.

[0010] On the other hand, a T-shaped rod is fixed to the top end of the rectangular latch rod, and special-shaped plates are fixed to both sides of the top end of the T-shaped rod.

[0011] On the other hand, the upper surface of the special-shaped plate is an inclined surface, and any one of the special-shaped plates passes through the three U-shaped frames.

[0012] On the other hand, grooves are provided on both sides of the pressing plate, and an arc-shaped extrusion plate is fixed inside each groove.

[0013] On the other hand, the inner front end of the positioning clamp is equipped with a flexible contact component.

[0014] On the other hand, the flexible contact assembly includes a hydraulic chamber symmetrically fixed in the positioning clamp and two elastic hollow sacs mounted on the side of the positioning clamp near the arc groove. One end of each hydraulic chamber is fixed and connected to an elastic liquid storage sac, and the other end of the hydraulic chamber is connected to the elastic hollow sac via a connecting tube. When the arc-shaped extrusion plate completely squeezes the elastic liquid storage sac, the rotation angle of the pressure plate is approximately degrees, so the pressure plate does not affect the elastic hollow sac's ability to clamp thinner semiconductor parts. By setting up a flexible contact assembly to clamp thinner semiconductor parts, the arc-shaped extrusion plate on the side of the pressure plate squeezes the elastic liquid storage sac, causing the liquid inside the sac to enter the elastic hollow sac through the hydraulic chamber and the connecting tube, causing it to expand. The expanded elastic hollow sac is then used to contact and clamp the thinner semiconductor parts, preventing clamping damage to the thinner semiconductor parts.

[0015] The benefits of this application are: (1) The auxiliary positioning device for semiconductor parts processing adopts two positioning clamps to assist in clamping and positioning semiconductor parts. At the same time, in order to adapt to the clamping and positioning of cylindrical semiconductor parts, arc grooves are provided in the positioning clamps to clamp conventional cylindrical semiconductor parts.

[0016] (2) The auxiliary positioning device for semiconductor parts processing can contact the semiconductor parts through multiple rubber wheels when clamping special-shaped semiconductor parts by setting an adjustment component. Since the rubber wheels are movably connected to the positioning clamp block through an L-shaped rod, the multiple rubber wheels can better adapt to the special-shaped semiconductor parts. At the same time, when clamping conventional flat semiconductor parts, the rectangular clamping rod can be driven to move by rotating the threaded rod 2, and then the pressure plate can be controlled to rotate until it is level with the positioning clamp block to clamp the conventional flat semiconductor parts.

[0017] (3) The auxiliary positioning device for semiconductor parts processing clamps thinner semiconductor parts by setting a flexible contact component, and squeezes the elastic liquid storage sac through the arc-shaped squeezing plate on the side of the pressure plate, so that the internal liquid enters the elastic hollow sac through the hydraulic tank and the connecting pipe, causing it to expand. The expanded elastic hollow sac is used to contact and clamp the thinner semiconductor parts, thereby preventing the thinner semiconductor parts from being damaged by clamping. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 This is a schematic diagram of the overall appearance structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention Figure 1 ; Figure 3 This is a schematic diagram of the structure of part of the present invention Figure 2 ; Figure 4 This is a schematic diagram of the structure of the present invention Figure 3 ; Figure 5 It is a schematic cross-sectional view of part of the structure of the present invention; Figure 6 This invention Figure 5 Enlarged view of point A in the middle; Figure 7 It is a schematic diagram of the structure of the regulating component of the present invention; Figure 8 It is a schematic structural diagram of the flexible contact component of the present invention.

[0020] Reference numerals: 100, bracket; 200, threaded rod 1; 300, threaded block; 400, connecting rod; 500, sliding rod; 600, slider; 610, elastic connecting rod; 700, positioning clamp; 800, arc groove; 900, adjustment assembly; 901, L-shaped rod; 902, rubber wheel; 903, U-shaped frame; 904, spring; 905, threaded rod (2); 906, rectangular latch rod; 907, rotating rod; 908, pressure plate; 909, gear; 910, T-shaped rod; 911, special-shaped plate; 1000, flexible contact component; 1001, arc-shaped extrusion plate; 1002, hydraulic chamber; 1003, elastic liquid storage sac; 1004, connecting pipe; 1005, elastic hollow sac. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0022] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchanged where appropriate to describe the embodiments of the present application here. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0023] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "center," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0024] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0025] Furthermore, the terms "installed," "disposed," "provided with," "connected," "connected," and "socketed" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0027] Example 1, see Figure 1-Figure 7 This embodiment provides an auxiliary positioning device for semiconductor parts processing, comprising: The bracket 100 is assembled on a semiconductor parts processing machine tool by bolts; The middle part of the bracket 100 is rotatably connected to a threaded rod 200, and the outer part of the threaded rod 200 is threadedly connected to a threaded block 300. Connecting rods 400 are hinged on both sides of the threaded block 300. A sliding rod 500 is embedded in the front end of the bracket 100. Two symmetrically arranged sliders 600 are inserted and slidably connected to the outer side of the sliding rod 500. Both sliders 600 are equipped with positioning clamps 700 through elastic connecting rods 610. The two positioning clamps 700 have arc-shaped grooves 800 on the facing sides. The two positioning clamps 700 are each equipped with an adjustment assembly 900, which includes: Multiple L-shaped rods 901 are inserted through and slidably connected to the interior of the positioning clamp 700. The bottom of each L-shaped rod 901 is rotatably connected to a rubber wheel 902. A spring 904 is fixed between each L-shaped rod 901 and the positioning clamp 700. Each rubber wheel 902 is located inside the arc-shaped groove 800. A U-shaped frame 903 is fixed to the top of each L-shaped rod 901. The adjustment component 900 also includes a threaded rod 905 threadedly connected to the inside of the positioning clamp 700, and the front end of the threaded rod 905 is rotatably connected to a rectangular gear rod 906, and the rectangular gear rod 906 passes through and is slidably connected to the positioning clamp 700. The adjustment component 900 also includes a pressure plate 908 hinged to the inside of the positioning clamp 700 through a rotating rod 907, and a gear 909 is fixed to the middle of the rotating rod 907, and the gear 909 is engaged with the rectangular gear rod 906. A T-shaped rod 910 is fixed to the top of the rectangular gear rod 906, and special-shaped plates 911 are fixed on both sides of the top of the T-shaped rod 910. The upper surface of the special-shaped plate 911 is an inclined surface, and any special-shaped plate 911 passes through the three U-shaped frames 903. The present application uses two positioning clamps 700 to assist in clamping and positioning semiconductor parts. At the same time, in order to adapt to the clamping and positioning of cylindrical semiconductor parts, an arc groove 800 is opened in the positioning clamp 700 to clamp conventional cylindrical semiconductor parts. At the same time, by setting an adjustment component 900, when clamping special-shaped semiconductor parts, multiple rubber wheels 902 can contact the semiconductor parts. Since the rubber wheels 902 are movably connected to the positioning clamp 700 through the L-shaped rod 901, the multiple rubber wheels 902 can better adapt to special-shaped semiconductor parts. At the same time, when clamping conventional flat semiconductor parts, the rectangular gear rod 906 can be driven to move by rotating the threaded rod 2 905, and then the pressure plate 908 can be controlled to rotate by the gear 909 until it is level with the positioning clamp 700 to clamp conventional flat semiconductor parts.

[0028] The above equipment is divided into the following two situations when used: First, the bracket 100 is installed on the semiconductor parts processing equipment by bolts, and then, The first type is that when clamping and positioning special-shaped semiconductor parts or cylindrical semiconductor parts, the motor connected to the threaded rod 200 is used to control the rotation of the threaded rod 200, and the rotation of the threaded block 300 is used to control the movement of the threaded block 300. The threaded block 300 drives the two sliders 600 to move toward each other on the slide rod 500 through the connecting rod 400 on its side. The movement of the two sliders 600 will simultaneously drive the two positioning clamps 700 to move toward each other through the two elastic connecting rods 610. At this time, multiple rubber wheels 902 will contact the special-shaped semiconductor parts or cylindrical semiconductor parts in turn, and will be squeezed in turn. Since the rubber wheels 902 are movably connected to the positioning clamp 700 through the L-shaped rod 901, the multiple rubber wheels 902 can better adapt to the clamping of special-shaped semiconductor parts or cylindrical semiconductor parts.

[0029] The second method is to clamp conventional flat-plate semiconductor parts. First, the threaded rod 905 is rotated. The rotation of the threaded rod 905 will push the rectangular tooth rod 906 to move, and the movement of the rectangular tooth rod 906 will drive the gear 909 to rotate. As the gear 909 rotates, the rotating rod 907 fixedly connected to it will drive the pressure plate 908 to rotate until the pressure plate 908 and the positioning clamp 700 are in a horizontal state. At the same time, as the rectangular tooth rod 906 moves, it drives the special-shaped plates 911 on both sides to move through the T-shaped rod 910. The special-shaped plates 911 are movably plugged into the U-shaped top of each independent L-shaped rod 901. shaped frame 903, so the movement of the special-shaped plate 911 will synchronously push all the L-shaped rods 901 to move upward, and the rubber wheel 902 will be retracted into the interior of the arc-shaped groove 800. At this time, the motor external to the threaded rod 200 is used to control the rotation of the threaded rod 200, and the movement of the threaded block 300 is controlled by the rotation of the threaded rod 200. The threaded block 300 drives the two sliders 600 to move toward each other on the slide rod 500 through the connecting rod 400 on its side. The movement of the two sliders 600 will simultaneously drive the two positioning clamps 700 to move toward each other through the two elastic connecting rods 610 until the conventional flat-plate semiconductor parts are clamped and positioned.

[0030] Example 2, see Figures 1-8, based on the first embodiment, the present application has grooves on both sides of the pressure plate 908, and an arc-shaped extrusion plate 1001 is fixed inside each groove, and the internal front end of the positioning clamp 700 is equipped with a flexible contact component 1000, and the flexible contact component 1000 includes a hydraulic reservoir 1002 symmetrically fixed in the positioning clamp 700, and two elastic hollow sacs 1005 assembled on the side of the positioning clamp 700 near the arc groove 800. One end of the interior of each hydraulic reservoir 1002 is fixed and connected to an elastic liquid storage sac 1003, and the other end of the hydraulic reservoir 1002 is connected to the elastic hollow sac 1005 through a connecting tube 1004. When the arc-shaped extrusion plate 1001 completely squeezes the elastic liquid storage sac 1003, the rotation angle of the pressure plate is approximately 45 degrees. Therefore, the pressure plate 908 will not affect the elastic hollow sac 1005 from clamping thinner semiconductor parts. The present application sets up a flexible contact component 1000 to clamp semiconductor parts with thinner specifications, and uses the arc-shaped extrusion plate 1001 on the side of the pressure plate 908 to squeeze the elastic liquid storage capsule 1003, so that the internal liquid enters the elastic hollow capsule 1005 through the hydraulic tank 1002 and the connecting tube 1004, causing it to expand. The expanded elastic hollow capsule 1005 is used to contact and clamp semiconductor parts with thinner specifications, thereby preventing clamping damage to the thinner semiconductor parts.

[0031] When the above equipment is used, it will clamp and position thin semiconductor parts. Figure 3 and Figure 4 In the state, first rotate the threaded rod 2 905, and the rotation of the threaded rod 2 905 will push the rectangular gear rod 906 to move, and the movement of the rectangular gear rod 906 will drive the gear 909 to rotate. As the gear 909 rotates, the rotating rod 907 fixed to it will drive the pressure plate 908 to rotate. During the rotation of the pressure plate 908, the arc-shaped extrusion plate 1001 on its side will simultaneously squeeze the two groups of elastic liquid storage capsules 1003, so that the internal liquid enters the hydraulic tank 1002, and then enters the elastic hollow capsule 1005 through the connecting tube 1004, causing it to expand. The expanded elastic hollow capsule 1005 is used to contact and clamp thinner semiconductor parts to prevent clamping damage to thinner semiconductor parts. It is worth noting that when the arc-shaped extrusion plate 1001 completely squeezes the elastic liquid storage capsule 1003, the rotation angle of the pressure plate is approximately 45 degrees, so the pressure plate 908 will not affect the elastic hollow capsule 1005 from clamping thinner semiconductor parts.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An auxiliary positioning device for semiconductor parts processing, characterized in that: include: A bracket (100), wherein the bracket (100) is assembled on a semiconductor parts processing machine tool via bolts; The middle part of the bracket (100) is rotatably connected to a threaded rod (200), the outer surface of the threaded rod (200) is threadedly connected to a threaded block (300), both sides of the threaded block (300) are hinged with connecting rods (400), the front end of the bracket (100) is penetrated by an embedded sliding rod (500), the outer side of the sliding rod (500) is penetrated and slidably connected to two symmetrically arranged sliding blocks (600), the two sliding blocks (600) are both equipped with positioning clamps (700) through an elastic connecting rod (610), and the two positioning clamps (700) are each provided with an arc groove (800) on one side facing each other; The two positioning clamps (700) are both equipped with an adjustment assembly (900), and the adjustment assembly (900) includes: A plurality of L-shaped rods (901) are passed through and slidably connected to the interior of the positioning clamp (700), the bottom of each L-shaped rod (901) is rotatably connected to a rubber wheel (902), a spring (904) is fixed between each L-shaped rod (901) and the positioning clamp (700), each rubber wheel (902) is located inside the arc groove (800), and a U-shaped frame (903) is fixed to the top of each L-shaped rod (901).

2. The auxiliary positioning device for semiconductor parts processing according to claim 1, characterized in that: The adjustment assembly (900) further comprises a second threaded rod (905) threadedly connected to the interior of the positioning clamp (700), the front end of the second threaded rod (905) being rotatably connected to a rectangular latch rod (906), and the rectangular latch rod (906) passing through and slidably connected to the positioning clamp (700).

3. The auxiliary positioning device for semiconductor parts processing according to claim 2, characterized in that: The adjustment assembly (900) further comprises a pressure plate (908) hinged to the interior of the positioning clamp (700) via a rotating rod (907), a gear (909) being fixed to the middle of the rotating rod (907), and the gear (909) being engaged with the rectangular latch rod (906).

4. The auxiliary positioning device for semiconductor parts processing according to claim 3, characterized in that: A T-shaped rod (910) is fixed to the top end of the rectangular latch rod (906), and special-shaped plates (911) are fixed to both sides of the top end of the T-shaped rod (910).

5. The auxiliary positioning device for semiconductor parts processing according to claim 4, characterized in that: The upper surface of the special-shaped plate (911) is an inclined surface, and any one of the special-shaped plates (911) passes through the three U-shaped frames (903).

6. The auxiliary positioning device for semiconductor parts processing according to claim 3, characterized in that: Grooves are provided on both sides of the pressing plate (908), and an arc-shaped extrusion plate (1001) is fixed inside each groove.

7. The auxiliary positioning device for semiconductor parts processing according to claim 1, characterized in that: The inner front end of the positioning clamp (700) is equipped with a flexible contact component (1000).

8. The auxiliary positioning device for semiconductor parts processing according to claim 7, characterized in that: The flexible contact assembly (1000) comprises a hydraulic chamber (1002) symmetrically fixed in a positioning clamp (700), and two elastic hollow sacs (1005) mounted on the side of the positioning clamp (700) close to the arc groove (800), wherein one end of the interior of each hydraulic chamber (1002) is fixed and connected to an elastic liquid storage sac (1003), and the other end of the hydraulic chamber (1002) is connected to the elastic hollow sac (1005) via a connecting tube (1004).

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