A multi-station electronic component processing pickup device

Abstract

The application discloses a kind of multi-station electronic component processing pickup device, including the patch of sticking semiconductor chip, conveying bed, operating platform, pickup robot and waste collection frame.The present application can detect whether chip exists by the first reflective optical fiber sensor on both sides of operating platform, the second and third reflective optical fiber sensor in pickup slot can judge chip type (ultra-thin or large chip), provide basis for subsequent adsorption strategy;When the lower block is pressed, it drives the press spike against the top end of the patch, and at the same time, the folding rod drives the shovel plate to shovel the bottom side of the chip, both of which cooperate to assist the chip and the patch to separate, improve the pickup success rate;Van der Waals composite suction nozzle suction nozzle is mushroom head-shaped, which increases the contact area with the chip surface, uses Van der Waals force to assist adsorption, combined with the vacuum negative pressure of vacuum pump, forms double adsorption mechanism, which not only enhances the adsorption reliability, but also reduces the damage to ultra-thin chip.

Description

TECHNICAL FIELD

[0001] The application relates to a part processing pickup device, in particular to a multi-station electronic part processing pickup device, and belongs to the technical field of part processing. BACKGROUND

[0002] During electronic part processing, different products can be formed through processing of the same basic part through different processes, and the basic part needs to be transferred to different stations for different processing.

[0003] Through the search, a multi-station electronic part processing pickup device is disclosed in Chinese Patent No. CN112850150B. By controlling the downward movement of the mechanical arm, the electronic chip is made to enter the pickup slot and press the elastic capsule. The bottom end of the elastic capsule is embedded with a suction cup. The suction cup is located on the upper side of the electronic chip. The suction cup improves the pickup efficiency of the pickup disc on the electronic chip. However, the pickup slot size in the above-mentioned patent product is fixed. In use, for electronic chips of different thicknesses, a fixed vacuum degree may cause unstable adsorption or damage to the components. SUMMARY

[0004] The purpose of the present application is to provide a multi-station electronic part processing pickup device to solve the above problems.

[0005] The application achieves the above-mentioned purpose through the following technical scheme. A multi-station electronic part processing pickup device comprises a patch with a semiconductor chip, a conveying bed, an operation table, a pickup robot and a waste collection frame. The operation table is provided with a conveying belt. The pickup robot is provided with a lifting piece, a pickup piece and an auxiliary sticking and separating piece. The lifting piece mainly consists of a ball screw and a lifting plate. The pickup piece consists of a pickup slot, a van der Waals composite suction nozzle and a vacuum pump. The pickup slot is arranged at the bottom end of the lifting plate. Visual sensors are arranged at the bottom end of the lifting plate on both sides. The bottom end of the conveying belt is provided with an illuminating piece. The illuminating piece is used to reflect the patch conveyed onto the conveying belt from the bottom end, and assist the visual sensor in finding the position of the patch.

[0006] A first suction nozzle is arranged at the middle of the pickup slot. A second suction nozzle is arranged outside the first suction nozzle. A plurality of van der Waals composite suction nozzles are arranged equidistantly on the first suction nozzle and the second suction nozzle. The auxiliary sticking and separating piece is arranged on both sides of the pickup slot. The auxiliary sticking and separating piece consists of a pressing block, a pressing spike, a folding rod and a shovel plate. When the pressing block is pressed down, the pressing spike is moved out of the bottom end of the lifting plate. When the van der Waals composite suction nozzle adsorbs the semiconductor chip, the pressing spike is pressed against the top end of the patch to assist the separation of the semiconductor chip and the patch.

[0007] The lower pressing block drives the synchronous belt to move downwards, and the folding rod drives the shovel plate to move downwards to shovel the semiconductor chip when the folding rod moves downwards, and the shovel plate cooperates with the pressing spike to further assist the separation of the semiconductor chip and the patch.

[0008] Second and third reflective optical fiber sensors are arranged on the two sides of the pickup groove.

[0009] Preferably, one side of the lower pressing block is provided with an L-shaped connecting rod, the L-shaped connecting rod is connected with the folding rod, and rotating rods are arranged at the connecting positions of the folding rod and the shovel plate and the L-shaped connecting rod.

[0010] Preferably, the first suction nozzle is arranged at the center of the pickup groove and arranged in a 4*4 array, and a plurality of second suction nozzles are arranged outside the first suction nozzle in a rectangular shape.

[0011] Preferably, the size of the first suction nozzle is smaller than that of the second suction nozzle, and the van der Waals composite suction nozzle is arranged in a mushroom head shape with a narrow upper part and a wide lower part.

[0012] Preferably, a pressing plate is arranged in the pickup groove, and the top end of the first suction nozzle and the second suction nozzle is provided with a folding bellows at the bottom end of the pressing plate.

[0013] Preferably, positive electrode plates are arranged at the top end of the first suction nozzle and the second suction nozzle and on the two sides of the folding bellows, and negative electrode plates are arranged at the position corresponding to the positive electrode plates at the bottom end of the pressing plate.

[0014] Preferably, the operation table is arranged at the output end of the conveying bed, the bottom end of the conveying bed is provided with a cleaning member, the cleaning member is composed of a cleaning roller and a scraper, three cleaning rollers are arranged at one side of the bottom end of the conveying bed, and the bottom end of the cleaning roller is provided with a scraper.

[0015] Preferably, the rotating direction of the cleaning roller is opposite to the conveying direction of the conveying bed, and the scraper is arranged in an inclined shape.

[0016] Preferably, side plates are arranged on the two sides of the operation table, a plurality of first reflective optical fiber sensors are arranged on the side plates, and the number of the first reflective optical fiber sensors is consistent with the number of the semiconductor chips on the same side.

[0017] The present application has the following beneficial effects:

[0018] 1. The illumination member at the bottom end of the conveying belt reflects the patch from below, assisting the visual sensor at the bottom end of the lifting plate to accurately capture the position of the semiconductor chip, and improving the positioning efficiency and accuracy.

[0019] 2. The first reflective fiber optic sensors on both sides of the operating table can detect the presence of the chip, and the second and third reflective fiber optic sensors in the pickup slot can determine the chip type (ultra-thin or large chip), providing a basis for subsequent adsorption strategies.

[0020] 3. When the pressure block is pressed down, it drives the pressure spike to press against the top of the chip, and at the same time, the folding rod drives the spatula to scrape the bottom side of the chip. The two work together to help separate the chip from the chip and improve the success rate of picking.

[0021] 4. The van der Waals composite nozzle has a mushroom-shaped nozzle that is narrow at the top and wide at the bottom, which increases the contact area with the chip surface. It uses van der Waals force to assist adsorption, combined with the vacuum negative pressure of the vacuum pump, to form a dual adsorption mechanism, which not only enhances the reliability of adsorption, but also reduces damage to the ultra-thin chip.

[0022] 5. The cleaning components at the bottom of the conveyor bed consist of a cleaning roller and a scraper. The cleaning roller rotates in the opposite direction to the conveying direction of the conveyor bed, which can effectively remove dust and impurities from the conveyor belt. The scraper is tilted to intercept impurities on the cleaning roller, achieving self-cleaning and ensuring the cleanliness of the conveying process.

[0023] 6. The fiber optic sensor detects the presence of the chip; if it is missing, an alarm is triggered to alert staff and prevent abnormalities in subsequent processing. Pressure and force sensors monitor vacuum and adsorption forces in real time, and automatically adjust when thresholds are exceeded to ensure the safety of the pickup process. Attached Figure Description

[0024] Figure 1 This is a perspective view of the overall structure of a pickup device for multi-station electronic component processing proposed in this invention;

[0025] Figure 2 This is a perspective view of the overall structure of a pickup device for multi-station electronic component processing proposed in this invention;

[0026] Figure 3 This is a perspective view of the pickup slot structure of a pickup device for multi-station electronic component processing proposed in this invention;

[0027] Figure 4 This is a schematic diagram of the pickup slot structure of a pickup device for multi-station electronic component processing proposed in this invention;

[0028] Figure 5 This is a perspective view of the conveyor bed structure of a pickup device for multi-station electronic component processing proposed in this invention;

[0029] Figure 6 This is a schematic diagram of the conveyor bed structure of a pickup device for multi-station electronic component processing proposed in this invention;

[0030] Figure 7A multi-station electronic component processing pickup device picks up parts, and the structure of the auxiliary adhesive separation part is shown in the perspective view;

[0031] Figure 8 A multi-station electronic component processing pickup device picks up parts, and the structure of the auxiliary adhesive separation part is shown in the perspective view;

[0032] Figure 9 A multi-station electronic component processing pickup device picks up parts, and the structure of the auxiliary adhesive separation part is shown in the perspective view;

[0033] Figure 10 A multi-station electronic component processing pickup device picks up parts, and the structure of the auxiliary adhesive separation part is shown in the perspective view;

[0034] Figure 11 A multi-station electronic component processing pickup device picks up parts, and the structure of the auxiliary adhesive separation part is shown in the perspective view;

[0035] Figure 12 A multi-station electronic component processing pickup device picks up parts, and the structure of the auxiliary adhesive separation part is shown in the perspective view.

[0036] In the figure: 1, conveying bed; 101, limit protruding rod; 2, cleaning roller; 201, scraper; 202, conveying chain; 203, drive motor; 3, operation table; 301, conveying belt; 302, side plate; 303, first reflective optical fiber sensor; 4, LED lamp plate; 401, battery block; 402, visual sensor; 5, pickup robot; 6, execution motor; 601, ball screw; 602, lifting plate; 7, pickup groove; 701, first suction nozzle; 702, second suction nozzle; 703, vacuum hole; 704, connecting pipe; 705, first vacuum pump; 706, second vacuum pump; 707, van der Waals composite suction nozzle; 8, electric control telescopic rod; 801, pressing plate; 802, folding bellows; 803, positive electrode sheet; 804, second reflective optical fiber sensor; 805, third reflective optical fiber sensor; 806, negative electrode sheet; 9, electric telescopic rod; 901, lower pressing block; 902, pressing spike; 903, L-shaped connecting rod; 904, rotating rod; 905, folding rod; 906, shovel plate; 10, waste collection frame. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all.

[0038] Embodiment one:

[0039] Reference Figures 1-12The utility model provides a kind of multi-station electronic component processing pickup device, including the patch that sticks semiconductor chip, conveying bed 1, operating platform 3, pickup robot 5 and waste collection frame 10, conveying belt 301 is equipped on operating platform 3, pickup robot 5 is equipped with lifting piece, pickup piece and auxiliary sticking separation piece, lifting piece is mainly composed of ball screw 601 and lifting plate 602, pickup piece is composed of pickup groove 7, van der waals complex suction nozzle 707 and vacuum pump, pickup groove 7 is arranged at the bottom end of lifting plate 602.

[0040] First suction nozzle 701 is equipped in the middle of pickup groove 7, second suction nozzle 702 is arranged outside first suction nozzle 701, a plurality of van der waals complex suction nozzle 707 are equidistantly arranged on the first suction nozzle 701 and the second suction nozzle 702, auxiliary sticking separation piece is arranged on both sides of pickup groove 7, auxiliary sticking separation piece is composed of down pressure block 901, press spike 902, folding rod 905 and shovel plate 903, down pressure block 901 drives press spike 902 to move out of the bottom end of lifting plate 602 when it is pressed down, press spike 902 abuts against the top end of patch to assist the separation of semiconductor chip and patch when van der waals complex suction nozzle 707 adsorbs semiconductor chip, down pressure block 901 drives folding rod 905 to move downward synchronously when it is pressed down, folding rod 905 drives shovel plate 906 to approach the bottom side of semiconductor chip to shovel semiconductor chip when it moves downward, shovel plate 906 further assists the separation of semiconductor chip and patch in cooperation with press spike 902.

[0041] One side of down pressure block 901 is equipped with L-shaped connecting rod 903, L-shaped connecting rod 903 is connected with folding rod 905, rotating rod 904 is equipped at the connection between folding rod 905 and shovel plate 906 and the connection between folding rod 905 and L-shaped connecting rod 903, first suction nozzle 701 is arranged at the center position of pickup groove 7, and is arranged in 4x4 array, a plurality of second suction nozzle 702 are connected to be arranged in rectangular shape outside first suction nozzle 701.

[0042] Visual sensor 402 is equipped on both sides of the bottom end of lifting plate 602, and illuminating piece is equipped at the bottom end of conveying belt 301, the illuminating piece is used for reflecting the patch conveyed to the conveying belt 301 from the bottom end to assist visual sensor 402 to find the position of the patch.

[0043] In the embodiment, it needs to be explained that waste collection frame 10 is equipped at the end of operating platform 3 away from conveying bed 1, and executing motor 6 is equipped at the top end of pickup robot 5, ball screw 601 is equipped at the executing end of executing motor 6, and lifting plate 602 is connected with the nut of ball screw 601.

[0044] The emitting end and the receiving end of first reflective optical fiber sensor 303 are both arranged in inclined shape, and the light of the emitting end is reflected to the receiving end after contacting semiconductor chip.

[0045] The first reflective optical fiber sensor 303, the second reflective optical fiber sensor 804, and the third reflective optical fiber sensor 805 are connected to the PLC controller of the type "Siemens S7-1200" through an analog module (such as a 4-20 mA signal), and the motor 6, the picking robot 5, the driving motor 203, the first vacuum pump 705, the second vacuum pump 706, the electric telescopic rod 8, and the electric telescopic rod 9 are all electrically connected to the PLC controller of the type "Siemens S7-1200".

[0046] The semiconductor chip formed by cutting the semiconductor wafer into small quadrilaterals is pasted on the patch during transportation, and the patch drives the semiconductor chip to be transported on the conveying bed 1 until it is transported to the operation table 3. The conveying cloth belt 301 pauses after conveying the patch to the intermediate position. The LED lamp plate 4 is connected with the battery block 401, and the light source of the LED lamp plate 4 irradiates upward from the bottom end inside the conveying cloth belt 301, so as to illuminate the shadow of the semiconductor chip. The vision sensor 402 at the bottom end of the lifting plate 602 of the picking robot 5 captures the position of the semiconductor chip and transmits the electrical signal to the picking robot 5. The bottom end of the picking robot 5 is provided with universal wheels, the picking robot 5 adjusts the position, so that the picking groove 7 at the bottom end of the lifting plate 602 is aligned with the semiconductor chip. At this time, the first reflective optical fiber sensor 303 emits infrared light (wavelength 850 nm) from the optical fiber, if the chip exists, the light is reflected to the receiving optical fiber, and converted into an electrical signal (voltage value ≥ threshold value V1, such as 3V); if the chip is missing, the reflected light intensity is insufficient, and the electrical signal is lower than the threshold value (such as <1V).

[0047] If the optical fiber signal confirms the existence of the chip, the lifting plate 602 is lowered, and the suction nozzle inside the picking groove 7 performs the picking action on the chip; if the detection result is "missing", the system triggers an alarm (such as a buzzer + screen prompt), reminding that the chip is missing. At this time, the conveying cloth belt 301 continues to convey, and the patch without the chip is conveyed into the waste collection frame 10.

[0048] The top end of the pressing plate 801 is provided with the electric telescopic rod 8. When the lifting plate 602 is pressed down and the picking groove 7 holds the semiconductor chip, the electric telescopic rod 8 drives the pressing plate 801 to press down at this time. At this time, the suction nozzle contacts the chip for adsorption. With the continuous pressing of the pressing plate 801, the corrugated pipe 802 is folded, and the positive electrode sheet 803 and the negative electrode sheet 806 are in contact at this time. The internal circuit is connected, and the electric telescopic rod 8 stops to avoid crushing the chip.

[0049] According to the position of the stop of the pressing plate 801, the second reflective optical fiber sensor 804 and the third reflective optical fiber sensor 805 emit infrared light from the optical fiber, the receiving end of the second reflective optical fiber sensor 804 is arranged on the side of the second suction nozzle 702, the receiving end of the third reflective optical fiber sensor 805 is arranged on the side of the pressing plate 801, and the receiving end of the receiving end is arranged on the side of the pressing plate 801. According to the reflected light received by the receiving end, it is judged whether the semiconductor chip is a super-thin chip or a large chip, and then the first vacuum pump 705 and the second vacuum pump 706 are selectively started to adsorb.

[0050] The top end of the lower pressing block 901 is provided with an electric telescopic rod 9. During adsorption, the electric telescopic rod 9 is executed, driving the lower pressing block 901 at the execution end to press down. A baffle is arranged between the L-shaped connecting block 903 and the pressing spike 902, so that when the lower pressing block 901 presses down, the L-shaped connecting block 903 is driven to move down on one side of the baffle. By default, the folding rod 905 is in a vertical state. The two sides of the pickup groove 7 are arranged with notches near the position of the shovel plate 906. When the folding rod 905 is pressed down, the shovel plate 906 is driven to move out of the notch, shoveling the bottom two sides of the semiconductor chip, and assisting the semiconductor chip to leave the patch;

[0051] At the same time, when the lower pressing block 901 presses down, the pressing spike 902 at the bottom end of the lower pressing block 901 moves out of the perforated position at the bottom end of the lifting plate 602 and abuts against the patch. When the lifting plate 602 is reset and rises, it assists the semiconductor chip to leave the patch.

[0052] Embodiment two:

[0053] Different from embodiment one, referring to Figures 3-4 、 Figures 7-8 and Figure 10 , the embodiment further has the following further contents: the inside of the pickup groove 7 is provided with a second reflective optical fiber sensor 804 and a third reflective optical fiber sensor 805 on both sides.

[0054] The pickup groove 7 is provided with a pressing plate 801, and the top ends of the first suction nozzle 701 and the second suction nozzle 702 are provided with a folding bellows 802 at the bottom end of the pressing plate 801. The top ends of the first suction nozzle 701 and the second suction nozzle 702 and the two sides of the folding bellows 802 are provided with positive electrode plates 803. The bottom end of the pressing plate 801 is provided with a negative electrode plate 806 corresponding to the position of the positive electrode plate 803.

[0055] The two sides of the operation table 3 are provided with side plates 302, and a plurality of first reflective optical fiber sensors 303 are arranged on the side plates 302. The number of first reflective optical fiber sensors 303 is consistent with the number of semiconductor chips on the same side.

[0056] The size of the first suction nozzle 701 is smaller than the size of the second suction nozzle 702, and the van der Waals composite suction nozzle 707 is arranged in the shape of a mushroom head with a narrow upper part and a wide lower part.

[0057] In this embodiment, it should be noted that the first suction nozzle 701 and the second suction nozzle 702 are made of elastic porous material (such as PDMS silica gel), the surface of the unit is nano-level velvet structure (height < 10 μm), and the adsorption is assisted by Van der Waals force to reduce the damage of vacuum negative pressure to the ultra-thin chip.

[0058] The Van der Waals composite suction nozzle 707 is in the shape of a mushroom head with narrow top and wide bottom, which can increase the contact area with the chip surface, so as to better utilize the Van der Waals force to achieve adsorption, and also helps to disperse the adsorption force, reduces the local pressure on the chip surface, and avoids damage to the chip.

[0059] The Van der Waals composite suction nozzle 707 is in the shape of a mushroom head with narrow top and wide bottom, which can increase the contact area with the chip surface, so as to better utilize the Van der Waals force to achieve adsorption, and also helps to disperse the adsorption force, reduces the local pressure on the chip surface, and avoids damage to the chip.

[0060] When the lifting plate 602 is pressed down, the pickup groove 7 covers the semiconductor chip, at this time the electric control telescopic rod 8 drives the pressing plate 801 to press down, at this time the suction nozzle contacts the chip to adsorb, with the continuous pressing of the pressing plate 801, the folding bellows 802 is folded, at this time the positive electrode sheet 803 and the negative electrode sheet 806 are in contact, the internal circuit is connected, the electric control telescopic rod 8 stops to avoid damaging the chip.

[0061] According to the position of the pressing plate 801, the second reflective optical fiber sensor 804 and the third reflective optical fiber sensor 805 emit infrared light from the optical fiber, the receiving end of the second reflective optical fiber sensor 804 is arranged on the side of the second suction nozzle 702, and the receiving end of the third reflective optical fiber sensor 805 is arranged on the side of the pressing plate 801. If the receiving end of the second reflective optical fiber sensor 804 receives reflected light, it is converted into an electric signal (voltage value ≥ threshold value V1, such as 3V), and it is judged that the chip is an ultra-thin chip, at this time the first vacuum pump 705 connected with the first suction nozzle 701 is started to adsorb the center of the ultra-thin chip, reducing the edge stress; if the receiving end of the third reflective optical fiber sensor 805 receives reflected light, it is converted into an electric signal (voltage value ≥ threshold value V1, such as 3V), and it is judged that the chip is a larger chip, at this time the second vacuum pump 706 connected with the second suction nozzle 702 is started to adsorb the edge of the larger chip, improving the adsorption stability.

[0062] A pressure sensor and a vacuum pump power regulator are arranged at the position of the vacuum pump, the vacuum degree is adjusted in real time (50~95kPa step adjustment) according to the characteristics of the chip, and the adsorption force is monitored in real time by a force sensor. When the vertical force exceeds the threshold value (such as 0.1N for an ultra-thin chip), the vacuum degree is automatically reduced. For example: ultra-thin chip: -20~-50kPa (low pressure, damage prevention); large chip: -60~-100kPa (high pressure, strong adsorption).

[0063] The combination of Van der Waals composite suction nozzle 707 and vacuum pump improves reliability through a double adsorption mechanism: Van der Waals force: intermolecular force between microcolumn array and chip surface, providing basic adsorption force; vacuum negative pressure: local vacuum (usually -20~-100kPa) is generated through the internal air path of the suction nozzle, forming additional adsorption force.

[0064] Embodiment three:

[0065] Referring to Figures 1-2 And Figures 5-6 Compared with Embodiment One and Embodiment Two, in this embodiment: the operation table 3 is arranged at the output end of the conveying bed 1, the bottom end of the conveying bed 1 is provided with a cleaning member, the cleaning member is composed of a cleaning roller 2 and a scraper 201, the bottom end of the conveying bed 1 is provided with three cleaning rollers 2, the bottom end of the cleaning roller 2 is provided with a scraper 201, the rotation direction of the cleaning roller 2 is opposite to the conveying direction of the conveying bed 1, and the scraper 201 is arranged in an inclined manner.

[0066] In this embodiment, it should be noted that: the surface of the conveying bed 1 is provided with a plurality of limiting protruding rods 101 at equal intervals, the conveying bed 1 conveys the patch with the semiconductor chip to the operation table 3, the limiting protruding rod 101 enhances the friction to avoid displacement of the patch during conveying, when the conveying belt on the conveying bed 1 rotates to the bottom end, the cleaning roller 2 in the middle of the three cleaning rollers 2 is connected with a driving motor 203, the rotating rod of the driving motor 203 and the middle shaft of the two side cleaning rollers 2 are respectively staggered with conveying chains 202, so as to drive the three cleaning rollers 2 to rotate synchronously, clean the bottom end of the conveying belt of the conveying bed 1, the dust and impurities attached to the cleaning roller 2 are intercepted by the scraper 201, and the scraper 201 performs self-cleaning on the cleaning roller 2.

Claims

1. A multi-station electronic component processing pickup device comprising a die with a semiconductor chip adhered thereto, a transfer bed, an operation table, a pickup robot, and a waste collection frame, characterized by: The operation table is provided with a conveying belt, the picking robot is provided with a lifting piece, a picking piece and an auxiliary sticking separation piece, the lifting piece is mainly composed of a ball screw and a lifting plate, the picking piece is composed of a picking groove, a van der waals composite suction nozzle and a vacuum pump, the picking groove is arranged at the bottom end of the lifting plate, both sides of the bottom end of the lifting plate are provided with visual sensors, the bottom end of the conveying belt is provided with an illuminating piece, the illuminating piece is used for reflecting the patch conveyed to the conveying belt from the bottom end, and the visual sensor is assisted to find the position of the patch; A first suction nozzle is arranged at the middle of the picking groove, a second suction nozzle is arranged outside the first suction nozzle, a plurality of van der waals composite suction nozzles are arranged at equal intervals on the first suction nozzle and the second suction nozzle, the auxiliary sticking separation piece is arranged on both sides of the picking groove, the auxiliary sticking separation piece is composed of a pressing block, a pressing spike, a folding rod and a shovel plate, when the pressing block is pressed down, the pressing spike is driven out of the bottom end of the lifting plate, when the van der waals composite suction nozzle adsorbs the semiconductor chip, the pressing spike abuts against the top end of the patch to assist the separation of the semiconductor chip and the patch; When the pressing block is pressed down, the folding rod is synchronously driven to move downward, when the folding rod moves downward, the shovel plate is driven to move close to the bottom side of the semiconductor chip to shovel the semiconductor chip, the shovel plate cooperates with the pressing spike to further assist the separation of the semiconductor chip and the patch; Both sides of the picking groove are provided with a second reflective optical fiber sensor and a third reflective optical fiber sensor.

2. The pickup device for multi-station electronic component processing according to claim 1, characterized in that: One side of the pressing block is provided with an L-shaped connecting rod, the L-shaped connecting rod is connected with the folding rod, and the folding rod is connected with the shovel plate and the L-shaped connecting rod.

3. The pick-up device for multi-station electronic component processing according to claim 1, characterized in that: The first suction nozzle is arranged at the center position of the picking groove and arranged in a 4*4 array, and a plurality of second suction nozzles are connected and arranged in a rectangular shape outside the first suction nozzle.

4. The pick-up device for multi-station electronic component processing according to claim 1, characterized in that: The size of the first suction nozzle is smaller than that of the second suction nozzle, and the van der waals composite suction nozzle is arranged in a mushroom head shape with the upper part being narrow and the lower part being wide.

5. The pick-up device for multi-station electronic component processing according to claim 1, characterized in that: A pressing plate is arranged in the picking groove, and the top end of the first suction nozzle and the second suction nozzle is provided with a folding bellows at the bottom end of the pressing plate.

6. The pick-up device for multi-station electronic component processing according to claim 5, characterized in that: A positive electrode plate is arranged at the top end of the first suction nozzle and the second suction nozzle and located at both sides of the folding bellows, and a negative electrode plate is arranged at the position corresponding to the positive electrode plate at the bottom end of the pressing plate.

7. The pick-up device for multi-station electronic component processing according to claim 1, characterized in that: The operation table is arranged at the output end of the conveying bed, the bottom end of the conveying bed is provided with a cleaning piece, the cleaning piece is composed of a cleaning roller and a scraper, one side of the bottom end of the conveying bed is provided with three cleaning rollers, and the bottom end of the cleaning roller is provided with a scraper.

8. The pick-up device for multi-station electronic component processing according to claim 7, characterized in that: The rotating direction of the cleaning roller is opposite to the conveying direction of the conveying bed, and the scraper is arranged in an inclined shape.

9. The pick-up device for multi-station electronic component processing according to claim 1, characterized in that: Both sides of the operation table are provided with side plates, a plurality of first reflective optical fiber sensors are arranged on the side plates, and the number of the first reflective optical fiber sensors is consistent with the number of the semiconductor chips on the same side.

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