A sensor chip package structure

Abstract

The application provides a sensor chip packaging structure, and belongs to the technical field of intelligent chip packaging. The sensor chip packaging structure comprises a packaging shell and a substrate. The substrate is connected with a pin. The inside of the packaging shell is provided with an aggregation plate, a heat conduction pad and a chip. The sensor chip packaging structure further comprises a transmission assembly and a packaging assembly. The transmission assembly is used for reducing vibration damage of the chip. The packaging assembly is used for reinforcing protection of the chip. The application has the following beneficial effects: gas is injected into the piston cavity through the gas injection nozzle, so that the limiting plate is inserted into the inside of the plug-in slot hole, thereby completing the fixed connection between the packaging seat and the packaging shell, improving the packaging efficiency, increasing the sealing property of the connection between the packaging shell and the packaging seat through the gas and the inflatable air bag, and making the buffer air bag generate a squeezing action on the chip through the gas. When the chip is subjected to external vibration or impact, the buffer air bag can be rapidly compressed and deformed to absorb the energy transmitted from the outside, thereby reducing the influence of vibration and impact on the chip and the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of intelligent chip packaging, in particular to a sensor chip packaging structure. BACKGROUND

[0002] The semiconductor packaging technology is mainly to package the bare chip designed and manufactured by the integrated circuit in a structure, which has the functions of inputting and outputting signals, power supply and mechanical support for the bare chip, and guarantees the heat dissipation and stability of the chip. As the bridge of information transmission between the intelligent chip and the circuit board, the packaging technology directly affects the electrical, thermal, optical and mechanical properties of the device and integrated circuit, and directly determines the size, weight, application, life, performance and cost of the electronic product. The intelligent sensor chip is widely used in mobile phone photography, digital camera, medical treatment, automobile electronics, monitoring and other fields due to its advantages of low power consumption, high integration, random access and fast imaging. With the rapid development of image sensor, it will play an important role in the field of space technology, such as space remote sensing.

[0003] The intelligent chip packaging equipment usually uses high-temperature melted resin as the packaging filler. The high temperature of the resin will cause certain damage to the circuit and components of the chip, resulting in reduced reliability of the packaged chip. Moreover, the resin filling structure is relatively complex. Since the viscosity of the high-temperature resin is relatively large, the resin filling structure can only be filled when the resin filling head and the chip placement groove are aligned in turn, which is low in working efficiency. Moreover, the array state electrode contact points made on the bottom surface of the packaging structure and the circuit board are electrically and mechanically connected. In some environments with relatively large vibration, vibration will cause some chip contact points to be disconnected from the circuit board, resulting in failure of the circuit board and poor anti-vibration effect of the circuit board. Therefore, how to invent a sensor chip packaging structure to solve these problems has become a problem to be solved by the technical personnel in the field. SUMMARY

[0004] In order to make up for the above shortcomings, the present application provides a sensor chip packaging structure, which aims to solve the problems of low chip packaging work efficiency and disconnection of some chip contact points from the circuit board in some environments with relatively large vibration, resulting in failure of the circuit board.

[0005] The present application is implemented as follows:

[0006] The present application provides a sensor chip packaging structure, which comprises a packaging shell and a substrate, the substrate is connected with a pin, the inside of the packaging shell is provided with an aggregation plate, a heat-conducting pad and a chip, and further comprises:

[0007] A transmission assembly is fixedly connected with the aggregation plate, and the transmission assembly is used to reduce the vibration damage of the chip.

[0008] The packaging assembly is fixedly connected with the substrate, and is used for reinforcing protection of the chip.

[0009] Preferably, the internal of the substrate is provided with a plurality of linear array distribution of the air holes, one end of the air hole is provided with a conductive hole one.

[0010] Preferably, the packaging assembly comprises a packaging seat, the packaging seat is fixedly connected with the side wall of the substrate, the packaging seat is provided with a mounting groove away from the substrate, the two ends of the packaging seat are provided with a piston cavity, and the side wall of the packaging seat is fixedly connected with a gas injection nozzle.

[0011] Preferably, the internal of the piston cavity is slidably connected with a piston plate, the cross section of the piston plate is arranged in a stepped shape, one end of the piston plate is fixedly connected with a limiting plate, the end of the limiting plate away from the piston plate is slidably connected with the inner wall of the piston cavity, the other end of the piston plate is fixedly connected with a reset spring, and the end of the reset spring away from the piston plate is fixedly connected with the inner wall of the piston cavity.

[0012] Preferably, the inner wall of the mounting groove is fixedly provided with an expansion air bag, the inner wall of the mounting groove is provided with a conductive hole two, one end of the expansion air bag is communicated with one end of the conductive hole two, the other end of the conductive hole two is communicated with the air hole, and the end away from the air hole is communicated with the piston cavity.

[0013] Preferably, the packaging assembly further comprises a plug rod, one end of the plug rod is fixedly connected with the bottom wall of the substrate, one end of the plug rod is connected with the conductive hole one, the internal of the plug rod is provided with a through hole, the outer wall of the plug rod is fixedly connected with a buffer air bag and a supporting ring, and the buffer air bag is located above the supporting ring.

[0014] Preferably, the chip is located inside the packaging seat, the side wall of the chip is provided with a limiting hole matched with the plug rod, the chip is located below the heat conduction pad, and the upper end of the heat conduction pad is connected with the gathering plate.

[0015] Preferably, the transmission assembly comprises a telescopic sleeve, both ends of the telescopic sleeve are fixedly connected with a fixed plate, one of the fixed plates is fixedly connected with the side wall of the gathering plate, the side wall of the fixed plate is fixedly connected with a plurality of plug pins arranged in a circumferential array, and the plug pins and the heat conduction pad are mutually inserted.

[0016] Preferably, the internal of the telescopic sleeve is provided with a heat conduction column and a heat conduction cylinder, one end of the heat conduction column is slidably connected with the inner wall of the heat conduction cylinder, the end of the heat conduction column away from the heat conduction cylinder is fixedly connected with the side plate of one of the fixed plates, and the end of the heat conduction cylinder away from the heat conduction column is fixedly connected with the side plate of the other fixed plate.

[0017] Preferably, the packaging shell is connected with the mounting groove, both sides of the packaging shell are provided with plug-in slot holes, the size of the plug-in slot hole is larger than the size of the limiting plate, one end of the packaging shell is provided with a sealing groove, the sealing groove is arranged in a "back" shape, the inner side wall of the packaging shell is fixedly connected with a plurality of heat conduction rods corresponding to the plug rod, and the end of the heat conduction rod away from the packaging shell is provided with a butt joint groove.

[0018] The beneficial effects of the present application are:

[0019] When the chip works to generate heat, the heat is dispersed to the packaging shell through the plug rod and the heat conduction rod, heat dissipation is carried out by using the large surface area of the packaging shell, and the heat dissipation efficiency is further improved. In the packaging process, the gas is injected into the piston cavity through the gas injection nozzle to generate pressure to drive the piston plate to move, so that the limiting plate is inserted into the inside of the plug-in slot hole, thereby completing the fixed connection between the packaging seat and the packaging shell, and the packaging efficiency is improved. In the process of moving the piston plate, the gas pressure in the air hole changes, the gas enters the inflation air bag along the conducting hole two, and the inflation air bag gradually expands. The inflated air bag enters the inside of the sealing groove and tightly fills the gap between the packaging shell and the packaging seat, greatly increasing the sealing property of the connection between the packaging shell and the packaging seat, and guaranteeing the normal operation of the chip. At the same time, in addition to making the inflation air bag expand, the gas also enters the inside of the through hole through the air hole and the conducting hole one, and then makes the buffer air bag expand. The expanded buffer air bag exerts a pressing action on the chip, so that the two sides of the chip are in close contact with the buffer air bag and the supporting ring respectively. When the chip is subjected to external vibration or impact, the buffer air bag can be quickly compressed and deformed to absorb the energy transmitted from the outside, thereby reducing the influence of vibration and impact on the chip and the substrate, and guaranteeing the normal use of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0021] Figure 1 is a whole structure schematic diagram of a sensor chip packaging structure provided by the embodiment of the present application;

[0022] Figure 2 is a whole explosion top view structure schematic diagram of a sensor chip packaging structure provided by the embodiment of the present application;

[0023] Figure 3It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1.

[0024] Figure 4 It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1.

[0025] Figure 5 It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1.

[0026] Figure 6 It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1. Figure 5 It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1.

[0027] Figure 7 It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1.

[0028] Figure 8 It is the overall explosion of a sensor chip packaging structure provided by the embodiment of the application. The lower structure schematic diagram of the sensor chip packaging structure is shown in FIG. 1.

[0029] In the figure: 1, packaging shell; 101, plug slot hole; 102, heat conduction rod; 103, butt joint groove; 104, sealing groove; 2, substrate; 21, pin; 22, conduction hole one; 23, air hole; 24, conduction hole two; 3, transfer assembly; 31, telescopic sleeve; 32, fixed plate; 33, plug; 34, heat conduction column; 35, heat conduction cylinder; 4, gathering plate; 5, heat conduction pad; 6, chip; 61, limiting hole; 7, packaging assembly; 71, packaging seat; 72, plug rod; 73, through hole; 74, buffer air bag; 75, supporting ring; 76, expansion air bag; 77, piston plate; 78, gas injection nozzle; 79, piston cavity; 710, limiting plate; 711, mounting groove; 712, reset spring. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0031] Example one

[0032] Reference Figures 1-8The utility model provides a sensor chip packaging structure, including package shell 1 and base plate 2, and base plate 2 is connected with pin 21, the inside of package shell 1 is equipped with the gathering plate 4, the heat conduction pad 5 and chip 6, further include:

[0033] Delivery assembly 3 is fixedly connected with the gathering plate 4, and delivery assembly 3 is used to reduce the vibration damage of chip 6;

[0034] Packaging assembly 7 is fixedly connected with base plate 2, and packaging assembly 7 is used to reinforce the protection of chip 6.

[0035] Further;Chip 6 is located in the inside of package seat 71, and the side wall of chip 6 is provided with the limiting hole 61 matched with the inserting rod 72, and chip 6 is located below the heat conduction pad 5, and the upper end of heat conduction pad 5 is connected with the gathering plate 4;Package shell 1 is connected with mounting groove 711, and both sides of package shell 1 are provided with the inserting slot hole 101, and the size of inserting slot hole 101 is greater than the size of limiting plate 710, one end of package shell 1 is provided with sealing groove 104, and sealing groove 104 is arranged in the shape of "back", and the inner side wall of package shell 1 is fixedly connected with a plurality of heat conduction rods 102 corresponding with inserting rod 72, and the end, away from package shell 1, of heat conduction rod 102 is provided with the butt joint groove 103, and the inner diameter of butt joint groove 103 is greater than the outer diameter of inserting rod 72.

[0036] The heat transfer of the package shell 1 to the insertion rod 72: when the package shell 1 is installed, one end thereof can be inserted into the installation groove 711, and in this process, the heat conduction rod 102 can be connected with the insertion rod 72. After the heat generated by the work of the chip 6 is conducted to the heat conduction rod 102 through the insertion rod 72, the through hole 73 inside the insertion rod 72 helps the heat to be evenly distributed inside. Since the heat conduction rod 102 on the inner side wall of the package shell 1 corresponds to the insertion rod 72, and the heat conduction rod 102 is provided with the butt joint groove 103 away from one end of the package shell 1, the insertion rod 72 can be inserted into the butt joint groove 103, and the heat can be transferred from the insertion rod 72 to the heat conduction rod 102. The heat conduction rod 102 disperses the heat to the package shell 1, and uses the large surface area of the package shell 1 to dissipate heat, further improves the heat dissipation efficiency of the entire packaging structure, ensures the operation of the chip 6 in a stable temperature environment, and the package shell 1 can be made of a metal material with good heat conductivity and certain mechanical strength, such as aluminum alloy. The aluminum alloy not only has a high thermal conductivity and can effectively conduct heat, but also has a small density, which can reduce the overall weight of the packaging structure, has good corrosion resistance, can protect the internal chip 6 in different environments, and can be anodized on the surface to enhance wear resistance and insulation. The insertion rod 72 can use glass fiber reinforced plastic (FRP), which has high strength and low thermal expansion coefficient, can stably support the chip 6 and effectively transfer heat, and the heat conduction rod 102 can use aluminum-based silicon carbide composite material, which combines the good heat conductivity of metal aluminum and the high hardness and low thermal expansion coefficient of silicon carbide. It has high mechanical strength and low thermal expansion coefficient, can effectively conduct heat while improving the structural stability of the heat conduction rod 102, reducing deformation caused by thermal expansion, and ensuring the reliability of the chip 6 packaging structure.

[0037] With reference to Figures 2-7Further, the inner portion of the substrate 2 is provided with a plurality of linear array distributed air holes 23, one end of the air holes 23 is provided with a conducting hole one 22; the packaging assembly 7 comprises a packaging seat 71, the packaging seat 71 is fixedly connected with the side wall of the substrate 2, one end of the packaging seat 71 away from the substrate 2 is provided with a mounting groove 711, both ends of the packaging seat 71 are provided with a piston cavity 79, the side wall of the packaging seat 71 is fixedly connected with an air injection nozzle 78; the inner portion of the piston cavity 79 is slidably connected with a piston plate 77, the cross section of the piston plate 77 is arranged in a stepped shape, one end of the piston plate 77 is fixedly connected with a limiting plate 710, one end of the limiting plate 710 away from the piston plate 77 is slidably connected with the inner wall of the piston cavity 79, the other end of the piston plate 77 is fixedly connected with a return spring 712, one end of the return spring 712 away from the piston plate 77 is fixedly connected with the inner wall of the piston cavity 79; the inner wall of the mounting groove 711 is fixedly installed with an expansion air bag 76, the inner wall of the mounting groove 711 is provided with a conducting hole two 24, one end of the expansion air bag 76 is connected with one end of the conducting hole two 24, the other end of the conducting hole two 24 is connected with the air hole 23, one end away from the air hole 23 is connected with the piston cavity 79; the packaging assembly 7 further comprises a plug rod 72, one end of the plug rod 72 is fixedly connected with the bottom wall of the substrate 2, one end of the plug rod 72 is connected with the conducting hole one 22, the inner portion of the plug rod 72 is provided with a through hole 73, the outer wall of the plug rod 72 is fixedly connected with a buffer air bag 74 and a supporting ring 75, the buffer air bag 74 is located above the supporting ring 75.

[0038] The packaging process of the packaging assembly 7 to the chip 6: the packaging seat 71 is fixedly connected with the side wall of the substrate 2, which provides a solid foundation support for the entire packaging process, this connection mode not only ensures the stability of the packaging seat 71, but also builds a reliable platform for the installation of the chip 6, the limiting hole 61 of the side wall of the chip 6 perfectly matches the plug rod 72, when the chip 6 is installed, the limiting hole 61 on the chip 6 passes through the plug rod 72, realizing the accurate positioning of the chip 6, effectively preventing the displacement phenomenon of the chip 6 in the packaging, in actual production, this accurate positioning ensures the relative position accuracy between the chip 6 and other components, laying a foundation for subsequent electrical connection and performance stability;

[0039] In the process of packaging, the gas is injected into the piston cavity 79 through the gas injection nozzle 78, and after the gas enters the piston cavity 79, the pressure pushes the piston plate 77 to move. The piston plate 77 is stretched during movement, so that the piston plate 77 can move smoothly under the action of gas pressure and elastic force. At the same time, the limiting plate 710 slides in the inner wall of the piston cavity 79, ensuring that the piston plate 77 moves along the predetermined trajectory, avoiding deviation, ensuring the stability and reliability of the entire system, and finally making the limiting plate 710 inserted into the inside of the plug-in slot hole 101, so as to complete the fixed connection between the packaging seat 71 and the packaging shell 1. During the movement of the piston plate 77, the gas pressure in the vent hole 23 changes, and the gas enters the inflatable air bag 76 along the conducting hole two 24, so that it gradually expands. The inflated air bag will enter the inside of the sealing groove 104 and tightly fill the gap between the packaging shell 1 and the packaging seat 71, greatly increasing the sealing of the connection between the packaging shell 1 and the packaging seat 71, which can effectively prevent external moisture from entering the packaging inside. Once the external moisture enters, it may condense on the surface of the chip 6, causing short circuit or corrosion and other problems, which seriously affects the performance and service life of the chip 6. This sealing design creates a relatively stable and dry internal environment for the chip 6, ensuring the normal operation of the chip 6. In addition, the gas injection nozzle 78 can be connected to a high-precision gas flow control valve. This valve can accurately adjust the size of the gas flow. Before packaging, according to the volume, material elasticity and required expansion degree of the inflatable air bag 76 and the buffer air bag 74, the parameters of the flow control valve are preset to control the amount of gas flowing out of the gas injection nozzle 78 per unit time. Mass flow controller can be used to accurately measure and control the mass flow of gas, ensuring that the amount of gas flowing into the air bag is stable and consistent each time, avoiding insufficient or excessive inflation of the air bag due to excessive or insufficient gas flow.

[0040] Meanwhile, during the gas injection process, the gas not only inflates the inflation air bag 76, but also enters the inside of the through hole 73 through the vent hole 23 and the conducting hole 22, thereby inflating the buffer air bag 74. The inflated buffer air bag 74 exerts a pressing action on the chip 6, so that the chip 6 is in close contact with the buffer air bag 74 and the supporting ring 75 on both sides, respectively. When the chip 6 is subjected to external vibration or impact, the buffer air bag 74 acts as an elastic buffer pad, which can quickly compress and deform to absorb the energy transmitted from the outside, thereby reducing the influence of vibration and impact on the chip 6. The supporting ring 75 provides additional support force for the chip 6 from below, ensuring that the chip 6 always maintains a stable placement state in the packaging structure. The presence of the supporting ring 75 disperses the weight of the chip 6, reduces the pressure on the local chip 6, and further enhances the stability of the chip 6 in the packaging structure. When the chip 6 is installed, the buffer air bag 74 is pre-attached to the surface of the insertion rod 72, and the chip 6 is installed by passing through the buffer air bag 74 through the limiting hole 61. After the chip 6 is installed in place, the contacts on the surface thereof are connected with the connecting points on the side wall of the substrate 2. This installation method not only further adjusts the position of the chip 6 by using the elasticity of the buffer air bag 74, so that the contacts and the connecting points can be more accurately connected, but also protects the chip 6 from collision damage during installation to a certain extent, ensuring the stability and reliability of electrical connection. The packaging seat 71 can be made of epoxy resin material. Epoxy resin has good insulation performance, mechanical strength and chemical corrosion resistance, which can effectively protect the chip 6. The inflation air bag 76 and the buffer air bag 74 can be made of silicone rubber material. Silicone rubber has the characteristics of high elasticity and good low and high temperature resistance, and can maintain good buffering and sealing performance in different temperature environments. In addition, the supporting ring 75 can be made of polycarbonate (PC). Polycarbonate has high mechanical strength and good toughness, which can effectively resist external impact when supporting the chip 6 and protect the chip 6 from damage. It has excellent forming and processing performance and can be made into various complex shapes of the supporting ring 75 through processes such as injection molding, meeting the needs of different chip 6 packaging structures. Polycarbonate has good electrical insulation performance and will not interfere with the electrical performance of the chip 6, ensuring stable operation of the chip 6. Moreover, its cost is relatively low, which can effectively control the cost in mass production.

[0041] Example Two

[0042] With reference to Figure 5 and Figure 8Further, the transmission assembly 3 comprises a telescopic sleeve 31, both ends of the telescopic sleeve 31 are fixedly connected with a fixed plate 32, one of the fixed plates 32 is fixedly connected with the side wall of the gathering plate 4, the side wall of the fixed plate 32 is fixedly connected with a plurality of plug-in connectors 33 arranged in a circumferential array, the plug-in connectors 33 are mutually plugged with the heat-conducting pad 5; the inside of the telescopic sleeve 31 is provided with a heat-conducting column 34 and a heat-conducting cylinder 35, one end of the heat-conducting column 34 is slidably connected with the inner wall of the heat-conducting cylinder 35, the end of the heat-conducting column 34 away from the heat-conducting cylinder 35 is fixedly connected with the side plate of one of the fixed plates 32, and the end of the heat-conducting cylinder 35 away from the heat-conducting column 34 is fixedly connected with the side plate of the other fixed plate 32.

[0043] The transmission assembly 3 buffers and dissipates heat of the chip 6: the telescopic sleeve 31 of the transmission assembly 3 is fixed with the fixed plate 32 at both ends, one of the fixed plates 32 is connected with the side wall of the gathering plate 4, and the plug-in connectors 33 of the side wall of the fixed plate 32 are plugged with the heat-conducting pad 5, so that the transmission assembly 3 is stably connected with the heat-conducting pad 5 and the gathering plate 4; when the chip 6 is displaced due to external vibration, the telescopic sleeve 31 can be elastically deformed to absorb vibration energy and reduce damage of the chip 6 caused by vibration; the heat-conducting column 34 and the heat-conducting cylinder 35 in the telescopic sleeve 31 cooperate with each other to effectively conduct heat while absorbing vibration; the heat generated by the chip 6 during operation is first transmitted to the heat-conducting pad 5, then transmitted to the fixed plate 32 through the plug-in connectors 33, and then transmitted to the heat-conducting column 34 and the heat-conducting cylinder 35, and finally the heat is transmitted to the gathering plate 4, so that the chip 6 is dissipated, ensuring that it works at an appropriate temperature and maintains stable performance; the telescopic sleeve 31, the heat-conducting column 34 and the heat-conducting cylinder 35 can be made of heat-conducting silica gel material, which has good flexibility and heat conductivity and can efficiently conduct heat while being elastically deformed; the fixed plate 32 is made of high-strength plastic material such as polycarbonate (PC), which has high mechanical strength and can ensure the structural stability of the transmission assembly 3, and has relatively light weight, so as not to increase the overall weight; the plug-in connectors 33 can be made of copper alloy material, which has good heat conductivity and can ensure rapid heat transmission, and its strength and flexibility can also meet the requirements of plugging with the heat-conducting pad 5.

[0044] It should be noted that the specific model specifications need to be selected and determined according to the actual specifications of the device, and the specific selection calculation method adopts the existing technology in the art, so it will not be described in detail.

[0045] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Those skilled in the art can make various modifications and changes to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A sensor chip packaging structure, comprising a packaging shell (1) and a substrate (2), wherein the substrate (2) is connected to pins (21), and the packaging shell (1) contains an aggregation plate (4), a thermal pad (5), and a chip (6), characterized in that, Also includes: The transfer component (3) is fixedly connected to the aggregation plate (4) and is used to reduce vibration damage to the chip (6); The packaging component (7) is fixedly connected to the substrate (2) and is used to reinforce and protect the chip (6). The substrate (2) has a plurality of linearly arrayed ventilation holes (23) inside, and a conduction hole (22) is provided at one end of each ventilation hole (23). The encapsulation assembly (7) includes an encapsulation base (71), which is fixedly connected to the side wall of the substrate (2). An installation groove (711) is provided at one end of the encapsulation base (71) away from the substrate (2). Piston chambers (79) are provided at both ends of the encapsulation base (71). An air injection nozzle (78) is fixedly connected to the side wall of the encapsulation base (71). A piston plate (77) is slidably connected inside the piston cavity (79). The cross-section of the piston plate (77) is stepped. A limiting plate (710) is fixedly connected to one end of the piston plate (77). The end of the limiting plate (710) away from the piston plate (77) is slidably connected to the inner wall of the piston cavity (79). A return spring (712) is fixedly connected to the other end of the piston plate (77). The end of the return spring (712) away from the piston plate (77) is fixedly connected to the inner wall of the piston cavity (79). An inflatable airbag (76) is fixedly installed on the inner wall of the mounting groove (711). A transmission hole (24) is opened on the inner wall of the mounting groove (711). One end of the inflatable airbag (76) is connected to one end of the transmission hole (24), and the other end of the transmission hole (24) is connected to the vent hole (23). The end of the vent hole (23) that is furthest away is connected to the piston chamber (79). The encapsulation assembly (7) also includes a plug (72), one end of which is fixedly connected to the bottom wall of the substrate (2), and the other end of which is connected to the conduction hole (22). The plug (72) has a through hole (73) inside, and a buffer airbag (74) and a support ring (75) are fixedly connected to the outer wall of the plug (72). The buffer airbag (74) is located above the support ring (75). The transfer component (3) includes a telescopic sleeve (31), both ends of which are fixedly connected to a fixing plate (32). One of the fixing plates (32) is fixedly connected to the side wall of the gathering plate (4). The side wall of the fixing plate (32) is fixedly connected to a plurality of plugs (33) arranged in a circular array. The plugs (33) are inter-inserted with the heat-conducting pad (5). The encapsulation shell (1) is connected to the mounting groove (711). The encapsulation shell (1) has insertion slots (101) on both sides. The size of the insertion slots (101) is larger than the size of the limiting plate (710). The encapsulation shell (1) has a sealing groove (104) at one end. The sealing groove (104) is arranged in a "U" shape. The inner wall of the encapsulation shell (1) is fixedly connected with several heat-conducting rods (102) corresponding to the plug rod (72). The end of the heat-conducting rod (102) away from the encapsulation shell (1) has a docking groove (103). The inner diameter of the docking groove (103) is larger than the outer diameter of the plug rod (72).

2. The sensor chip packaging structure according to claim 1, characterized in that, The chip (6) is located inside the package base (71). The side wall of the chip (6) is provided with a limiting hole (61) that matches the insertion rod (72). The chip (6) is located below the thermal pad (5). The upper end of the thermal pad (5) is connected to the aggregation plate (4).

3. The sensor chip packaging structure according to claim 2, characterized in that, The telescopic sleeve (31) is provided with a heat-conducting column (34) and a heat-conducting cylinder (35) inside. One end of the heat-conducting column (34) is slidably connected to the inner wall of the heat-conducting cylinder (35). The end of the heat-conducting column (34) away from the heat-conducting cylinder (35) is fixedly connected to the side plate of one of the fixed plates (32). The end of the heat-conducting cylinder (35) away from the heat-conducting column (34) is fixedly connected to the side plate of the other fixed plate (32).

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