Cooling system and server
By introducing a composite heat dissipation system with liquid-cooled and air-cooled structures into the server, the difficulty of heat dissipation of high-power components is solved and a more efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202510599865.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-09
- Publication Date
- 2025-08-05
AI Technical Summary
The air-cooled system of existing servers is difficult to effectively dissipate heat, especially high-power HDD units, which leads to difficulty in dissipating heat.
Combined with the liquid-cooled structure and the air-cooled structure, the liquid-cooled structure cools the heating components through the coolant, and the air-cooled structure is used for the coolant liquid-cooled structure to form a composite heat dissipation system.
The heat dissipation efficiency of the heating components, especially the HDD unit, is improved, and the temperature consistency and heat dissipation effect are achieved.
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Figure CN120428831A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of server technology, and in particular to a heat dissipation system and a server. Background Art
[0002] Air cooling is a common cooling technology used to control server temperatures and maintain proper operation. This system typically consists of a fan and a radiator. The fan blows air through the server, cooling it through the radiator and lowering the server's temperature. Advantages of air cooling include low cost, ease of maintenance, and ease of installation.
[0003] However, as servers carry more and more functions, the power consumption of their components continues to increase, making heat dissipation more difficult. This is especially true for hard disk drive (HDD) units, which cannot be cooled solely by air cooling systems. Summary of the Invention
[0004] Based on this, it is necessary to provide a heat dissipation system and server to address the problem of heat dissipation difficulties of heat-generating components.
[0005] A heat dissipation system, comprising:
[0006] a box body, wherein a heat-generating component is provided in the box body;
[0007] a liquid cooling structure connected to the housing and configured to circulate cooling liquid into the housing to cool the heat-generating components;
[0008] An air cooling structure is provided on one side of the box body, and the air cooling structure forms an air flow for cooling the liquid cooling structure.
[0009] In one embodiment, the housing comprises:
[0010] a first box, wherein some of the heat-generating components are arranged in the first box;
[0011] The first box is connected to the second box, part of the liquid cooling structure is arranged in the second box, and part of the heat-generating components are arranged in the second box.
[0012] In one embodiment, the height of the first box is greater than the height of the second box.
[0013] In one embodiment, the second box is provided with an opening on one side away from the first box.
[0014] In one embodiment, a cooling liquid inlet is provided at the first end of the first box body, and a cooling liquid outlet is provided at the second end of the first box body. The cooling liquid cools the heat-generating component through the cooling liquid inlet and the cooling liquid outlet.
[0015] In one embodiment, the coolant inlet and the coolant outlet are arranged in the same plane.
[0016] In one embodiment, the liquid cooling structure includes:
[0017] A connecting pipe, one end of which is connected to the coolant inlet, and the other end of which is connected to the coolant outlet.
[0018] a drive assembly, the drive assembly being disposed on the connecting pipeline and configured to drive the coolant to flow in the connecting pipeline;
[0019] A heat exchange component is also arranged on the connecting pipeline. The heat exchange component is connected to the driving component. The coolant enters the heat exchange component through the driving component. The heat exchange component is used for heat dissipation.
[0020] In one embodiment, the driving component is a pump body, and the driving component includes a pump inlet and a pump outlet. The pump inlet is connected to the coolant outlet through the connecting pipe, and the pump outlet is connected to the heat exchange component through the connecting pipe.
[0021] In one embodiment, the heat exchange component is a tube-belt heat exchanger, which includes a heat exchange inlet and a heat exchange outlet. The heat exchange inlet is connected to the pump outlet through the connecting pipe, and the heat exchange outlet is connected to the coolant inlet through the connecting pipe.
[0022] In one embodiment, the air cooling structure is a fan, which is arranged on one side of the second box body and is used to dissipate heat for the heat exchange component.
[0023] A server includes the above-mentioned heat dissipation system.
[0024] In the above-mentioned heat dissipation system and server, the radiator is provided with a heat-generating component in the housing, and also includes a liquid cooling structure, which is connected to the housing. The liquid cooling structure is used to circulate cooling liquid into the housing, so that immersion heat dissipation can be used to obtain better temperature consistency, provide better heat dissipation for the heat-generating component, and improve the heat dissipation efficiency of the heat-generating component. Moreover, an air cooling structure is also provided in the present disclosure, and the air cooling structure is used to dissipate heat for the liquid cooling structure. With this arrangement, the air cooling structure can be used to cool the liquid cooling structure, thereby further improving the heat dissipation efficiency of the liquid cooling structure for the heat-generating component. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is an overall structural diagram of a heat dissipation system according to an embodiment of the present application.
[0026] Figure 2 This is a structural diagram of a heat dissipation system according to an embodiment of the present application without the side wall.
[0027] Figure 3 This is a side view of a heat dissipation system according to an embodiment of the present application.
[0028] Figure 4 for Figure 3 Cross-sectional view along the AA direction.
[0029] Description of reference numerals:
[0030] 100, housing; 110, first housing; 111, coolant inlet; 112, coolant outlet; 120, second housing;
[0031] 200. Heating components;
[0032] 300, liquid cooling structure; 310, connecting pipeline; 320, driving component; 330, heat exchange component;
[0033] 400. Air-cooled structure. DETAILED DESCRIPTION
[0034] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.
[0035] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.
[0036] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.
[0037] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.
[0038] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.
[0039] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.
[0040] An HDD unit refers to a hard disk drive (HDD). A HDD is a crucial component for storing data in computers and other devices. It primarily consists of a platter, a magnetic head, a motor, and control circuitry. The platter is the medium for storing data, with the magnetic head reading and writing data on the platter surface. The motor drives the platter's high-speed rotation, enabling rapid data access. In servers, desktop computers, laptops, and other devices, HDD units are often used for long-term storage of operating systems, applications, and user data (such as documents, images, and videos). As technology advances, HDD unit power requirements are increasing, necessitating a new solution to address HDD unit cooling requirements.
[0041] See Figure 1 and Figure 2 As shown, a heat dissipation system provided in one embodiment of the present application includes: a box body 100, in which a heat-generating component 200 is provided; a liquid cooling structure 300, which is used to circulate cooling liquid into the box body 100 to cool the heat-generating component 200; and an air cooling structure 400, which is arranged on one side of the box body 100 and forms an air flow for cooling the liquid cooling structure 300.
[0042] In this embodiment, a plurality of heat-generating components 200 are provided in the housing 100, specifically including an HDD unit, and a liquid cooling structure 300 is also provided. The liquid cooling structure 300 is connected to the housing 100 and is used to circulate cooling liquid into the housing 100, thereby enabling immersion heat dissipation to achieve better temperature consistency. The higher specific heat capacity and thermal conductivity of the immersion cooling liquid compared to air can also be utilized to provide better heat dissipation for the heat-generating components 200, thereby improving the heat dissipation efficiency of the heat-generating components 200. Moreover, in this embodiment, an air cooling structure 400 is also provided, and the air cooling structure 400 is used to dissipate heat for the liquid cooling structure 300. With this arrangement, the air cooling structure 400 can be used to cool the liquid cooling structure 300, thereby further improving the heat dissipation efficiency of the liquid cooling structure 300.
[0043] Specifically, the housing 100 includes: a first housing 110, in which some heat-generating components 200 are arranged; and a second housing 120, in which the first housing 110 and the second housing 120 are connected, in which some liquid cooling structures 300 are arranged, and in which some heat-generating components 200 are also arranged. In this embodiment, the housing 100 includes a first housing 110 and a second housing 120, and an HDD unit is arranged in the first housing 110. In servers, HDD units are usually arranged in a front-to-back array in the front-to-back direction of the chassis to achieve better performance. In this embodiment, the front-to-back array characteristics of the HDD unit can be utilized to allow the coolant to enter the first housing 110, thereby achieving a good cooling effect.
[0044] Devices containing HDD units are typically also equipped with electronic components such as network cards and HBAs. A network interface card (NIC), also known as a network adapter, is a crucial hardware device in computer networks, primarily used to facilitate data communication between computers and the network. An HBA (Host Bus Adapter) is a hardware component that provides connectivity between servers and storage devices, primarily used to connect servers to storage area networks. NICs and HBAs typically consume low power, ranging from a few watts to over ten watts. Compared to HDD units, these electronic components inherently have better heat dissipation performance and lack array characteristics. Therefore, a second housing 120 is provided to house the NIC and HBA. The air cooling structure 400 is disposed within the second housing 120, enabling the cooling of the NIC and HBA within the second housing 120.
[0045] Furthermore, the height of the first housing 110 is greater than that of the second housing 120. The first housing 110 is 4U tall, while the second housing 120 is 1U tall. In the server field, "U" is a unit representing the external dimensions of a server, and is the abbreviation of "Unit." A 1U is approximately 44.45 mm (1.75 inches), while a 4U is 177.8 mm. In this embodiment, the first housing 110 is used to accommodate HDD units. Therefore, a 4U height allows for the first housing 110 to accommodate both a network interface card (NIC) and an HBA. The 1U height, however, is shorter and has limited space, making it more suitable for accommodating NICs and HBAs. Furthermore, a 4U height allows for more space for the liquid cooling structure 300, providing better heat dissipation for the higher-power HDD units. In contrast, since the second housing 120 only requires the air cooling structure 400 to dissipate the lower-power NICs and HBAs, a 1U height is more suitable.
[0046] Furthermore, the second housing 120 is provided with an opening on one side away from the first housing 110. This arrangement facilitates air circulation, allowing outside air to enter the air-cooling structure 400 to dissipate heat from the liquid-cooling structure 300, thereby improving the heat dissipation effect of the liquid-cooling structure 300 on the heat-generating components 200. Furthermore, since the air-cooling structure 400, the network card, and the HBA are all provided on the second housing 120, the air-cooling structure 400 can be used to dissipate heat from the network card and the HBA, thereby meeting their heat dissipation requirements.
[0047] Specifically, a cooling liquid inlet 111 is provided at a first end of the first housing 110, and a cooling liquid outlet 112 is provided at a second end of the first housing 110. Cooling liquid flows through the cooling liquid inlet 111 and the cooling liquid outlet 112 to cool the heat-generating component 200. The cooling liquid inlet 111 and the cooling liquid outlet 112 are arranged on the same plane. In this embodiment, cooling liquid can enter through the cooling liquid inlet 111 and flow out through the cooling liquid outlet 112, thereby cooling the entire HDD unit.
[0048] Furthermore, since the coolant inlet 111 and coolant outlet 112 are positioned on the same plane, the HDD unit can be fully immersed, achieving the best cooling effect. By rationally designing the inlet and outlet positions on the same plane and the internal flow-guiding structure, the coolant can be more evenly distributed across the surface of the cooling object, improving heat exchange efficiency and, in turn, the cooling effect, ensuring stable operation of the device.
[0049] Specifically, the liquid cooling structure 300 includes: a connecting pipe 310, one end of which is connected to the coolant inlet 111 and the other end of which is connected to the coolant outlet 112; a drive assembly 320, which is disposed on the connecting pipe 310 and is used to drive the coolant to flow in the connecting pipe 310; and a heat exchange assembly 330, which is also disposed on the connecting pipe 310 and is connected to the drive assembly 320. The coolant enters the heat exchanger through the drive assembly 320 and is used to dissipate heat. In this embodiment, a closed liquid cooling circulation loop is formed by the coolant inlet 111, the connecting pipe 310, the drive assembly 320, the heat exchange assembly 330, and the coolant outlet 112. The coolant enters the coolant inlet 111, cools the heat-generating component 200 in the first housing 110, and then flows out of the coolant outlet 112 through the connecting pipe 310 driven by the drive assembly 320. The coolant then flows through the heat exchange assembly 330, where the heated coolant exchanges heat with the air. The cooled coolant then flows through the connecting pipe 310 again into the coolant inlet 111, thus forming a complete heat dissipation cycle. With the above arrangement, heat can be dissipated from the heat-generating component 200 through the connecting pipe 310, the drive assembly 320, and the heat exchange assembly 330.
[0050] Furthermore, the drive assembly 320 is a pump body. It includes a pump inlet and a pump outlet. The pump inlet is connected to the coolant outlet 112 via a connecting pipe 310, and the pump outlet is connected to the heat exchange assembly 330 via a connecting pipe 310. The pump body in this embodiment is used to provide power for the circulation of the coolant throughout the entire circulation loop. The pump body pumps the coolant, after cooling it in the first housing 110, into the heat exchange assembly 330, providing driving force for the coolant flow within the heat exchange assembly 330. This allows the coolant to continuously circulate within the circulation loop formed by the first housing 110, the pump body, and the radiator, achieving uninterrupted cooling and heat dissipation of the HDD unit. Furthermore, the pump body's speed can be adjusted to match the server's cooling and heat dissipation requirements. Specifically, the pump body's speed can be increased when the server's cooling demand increases, while the pump body's speed can be reduced when the server's cooling demand decreases. This allows the pump body's power consumption to be adjusted in real time based on demand, thereby reducing energy consumption.
[0051] Specifically, heat exchange assembly 330 is a tube-and-belt heat exchanger. Heat exchange assembly 330 includes a heat exchange inlet and a heat exchange outlet. The heat exchange inlet is connected to the pump outlet via a connecting pipe 310, and the heat exchange outlet is connected to the coolant inlet 111 via a connecting pipe 310. A tube-and-belt radiator is a common type of heat exchange equipment, primarily consisting of two parts: tubes and belts. The "tubes" are typically thin tubes made of metal materials (such as copper, aluminum, etc.). These tubes serve as channels for fluid flow, and the coolant flows within the tubes. The "belts" refer to finned belts, which are typically wavy or have other special shapes and fit tightly around the outside of the tubes. The finned belts increase the surface area of the heat exchanger, enhancing the heat transfer effect and enabling more efficient heat exchange between the fluid in the tubes and the external environment or another fluid. Based on the working principles of heat conduction and heat convection, when the coolant flows in the tube, the cold air contacts the fins outside the tube. The heat of the coolant is conducted to the fins through the tube wall, and then the heat is transferred to the cold air through convection heat exchange between the fins and the cold air, realizing heat exchange between the cold air and the coolant.
[0052] In this embodiment, the air-cooling structure 400 is a fan, located at the first end of the housing 100, and is used to dissipate heat from the heat exchanger. The fan has an air inlet and an air outlet. Air enters through the air inlet, and the movement of the blades causes the air to gain velocity and pressure, before being accelerated and blown out of the fan's air outlet. The heat exchange assembly 330 is located at the fan's air outlet, thereby rapidly pushing air to dissipate heat from the heat exchange assembly 330. In other embodiments, heat dissipation from the heat exchange assembly 330 can also be achieved by providing an air deflector. The air deflector, with its specific design, can guide air along a predetermined path, allowing air to flow more efficiently through the heat exchange assembly 330.
[0053] The present disclosure also provides a server including the above-mentioned heat dissipation system. Through the combined arrangement of the liquid cooling structure 300 and the air cooling structure 400, the heat dissipation effect of the heat-generating component 200 can be maximized, solving the problem that the existing technology cannot meet the heat dissipation requirements of the heat-generating component 200.
[0054] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0055] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.
Claims
1. A heat dissipation system, characterized in that: The heat dissipation system comprises: A box body (100), wherein a heating component (200) is provided in the box body (100); a liquid cooling structure (300), the liquid cooling structure (300) being connected to the box (100), and the liquid cooling structure (300) being used to circulate cooling liquid into the box (100) to cool the heat-generating component (200); An air cooling structure (400) is provided on one side of the box body (100), and the air cooling structure (400) forms an air flow for cooling the liquid cooling structure (300).
2. The heat dissipation system according to claim 1, characterized in that: The box (100) includes: a first box (110), wherein part of the heating component (200) is arranged in the first box (110); A second box (120), wherein the first box (110) is connected to the second box (120), part of the liquid cooling structure (300) is arranged in the second box (120), and part of the heating component (200) is arranged in the second box (120).
3. The heat dissipation system according to claim 2, characterized in that: The height of the first box body (110) is greater than the height of the second box body (120).
4. The heat dissipation system according to claim 2, characterized in that: A cooling liquid inlet (111) is provided at the first end of the first box body (110), and a cooling liquid outlet (112) is provided at the second end of the first box body (110); the cooling liquid cools the heat-generating component (200) via the cooling liquid inlet (111) and the cooling liquid outlet (112).
5. The heat dissipation system according to claim 4, characterized in that: The cooling liquid inlet (111) and the cooling liquid outlet (112) are arranged on the same plane.
6. The heat dissipation system according to claim 5, characterized in that: The liquid cooling structure (300) comprises: a connecting pipe (310), one end of the connecting pipe (310) being in communication with the coolant inlet (111), and the other end of the connecting pipe (310) being in communication with the coolant outlet (112), a driving component (320), the driving component (320) being arranged on the connecting pipeline (310), and the driving component (320) being used to drive the coolant to flow in the connecting pipeline (310); A heat exchange component (330) is also provided on the connecting pipe (310), the heat exchange component (330) is in communication with the drive component (320), the coolant enters the heat exchange component (330) via the drive component (320), and the heat exchange component (330) is used for heat dissipation.
7. The heat dissipation system according to claim 6, characterized in that: The drive assembly (320) is a pump body, and the drive assembly (320) includes a pump inlet and a pump outlet. The pump inlet is connected to the coolant outlet (112) through the connecting pipe (310), and the pump outlet is connected to the heat exchange assembly (330) through the connecting pipe (310).
8. The heat dissipation system according to claim 7, characterized in that: The heat exchange component (330) is a tube-and-belt heat exchanger, comprising a heat exchange inlet and a heat exchange outlet, wherein the heat exchange inlet is connected to the pump outlet via the connecting pipe (310), and the heat exchange outlet is connected to the coolant inlet (111) via the connecting pipe (310).
9. The heat dissipation system according to claim 8, characterized in that: The air cooling structure (400) is a fan, which is arranged on one side of the second box (120) and is used to dissipate heat for the heat exchange component.
10. A server, characterized in that: A heat dissipation system comprising any one of claims 1 to 9.