Processing equipment for chip scribing dissociation

Abstract

The invention relates to the technical field of chip scribing equipment, in particular to processing equipment for chip scribing dissociation, which comprises a processing platform, a scribing processing shell and a regulation and control box, and is characterized in that the scribing processing shell and the regulation and control box are both fixedly mounted on the processing platform; the scribing control mechanism is connected with the machining platform, the scribing machining shell and the regulation and control box, and the scribing control mechanism comprises a machining placement table, a station switching assembly and a scribing driving assembly; according to the processing equipment for chip scribing dissociation, waste chips can be prevented from remaining in the cutting groove, so that physical damage to the edge of the chip in the subsequent dissociation or carrying process can be avoided, the attractiveness of the chip can be guaranteed, and meanwhile, the electrical performance can be prevented from being reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip dicing equipment, and in particular to processing equipment for chip dicing and dissociation. Background Art

[0002] With the rapid advancement of semiconductor technology, dicing machine technology has evolved from manual to semi-automatic to fully automated, becoming an indispensable and critical piece of equipment in semiconductor manufacturing. The primary function of a dicing machine is to precisely separate the multiple chips on a wafer, ensuring the integrity and performance of each chip during subsequent packaging and testing. Its operating principle relies on high-precision cutting tools such as diamond saw blades, lasers, or water jets to cut along predetermined paths on the wafer. Diamond blade dicing is a commonly used physical cutting method, particularly suitable for wafers thicker than 100 microns. During the dicing process, the diamond blade rotates at high speed while moving along the dicing path, completely cutting through the wafer. To reduce thermal damage and remove cutting debris, water is often used to cool the blade and wafer. Furthermore, before dicing, a UV film or blue film is often applied to the back of the wafer to protect the wafer and facilitate chip removal after dicing.

[0003] Existing chip scribing and separation processing equipment may leave some debris in the cutting grooves during the chip scribing process. This debris mainly comes from material fragments, powder, or particles generated during the cutting process. The residual debris may cause physical damage to the chip edges during subsequent separation or handling, such as cracks, chips, or breakage. This not only affects the chip's appearance, but can also lead to degraded electrical performance or even complete failure, making it inconvenient to use. Therefore, in response to the above situation, there is an urgent need to develop a chip scribing and separation processing equipment to overcome the shortcomings of current practical applications. Summary of the Invention

[0004] The object of the present invention is to provide a processing device for chip dicing and dissociation to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A processing device for chip dicing and dissociation, comprising a processing platform and:

[0007] A dicing processing housing and a control box, both of which are fixedly mounted on the processing platform;

[0008] and a dicing control mechanism, the dicing control mechanism being connected to the processing platform, the dicing processing housing and the control box respectively, wherein the dicing control mechanism includes a processing placement table, a station switching component and a dicing drive component;

[0009] The dicing drive assembly is connected to the processing platform, the station switching assembly is respectively connected to the dicing processing shell and the control box, and a processing placement table is also installed on the station switching assembly, and the processing placement table is detachably connected to the dicing processing shell.

[0010] As a further solution of the present invention: further comprising: a cleaning support plate, the cleaning support plate being fixedly mounted on the end of the processing platform, and a plurality of flushing heads being fixedly mounted on the cleaning support plate;

[0011] and a feeding table, which is fixedly mounted on the processing platform.

[0012] As a further solution of the present invention: further comprising: a scribing device, the scribing device being detachably mounted on the scribing processing housing and being mounted in conjunction with the processing placement table;

[0013] and an inspection cover plate, wherein the inspection cover plate is detachably mounted on the control box.

[0014] As a further solution of the present invention: an adsorption clamping device is fixedly installed on the processing placement table, and an adsorption portion is further provided on the processing placement table, and the adsorption portion is connected to the output end of the adsorption clamping device;

[0015] The processing placement table is further provided with a limiting groove, in which a plurality of leakage holes are provided. A protective baffle is further fixedly installed at one end of the processing placement table, and the protective baffle is detachably connected to the control box.

[0016] As a further solution of the present invention: the dicing drive assembly includes:

[0017] A workstation conversion notch, the workstation conversion notch being provided on the processing platform;

[0018] Supports, the number of the supports is two, both of the supports are fixedly mounted on the processing platform and are respectively located at the two ends of the station conversion slot;

[0019] And a driving device is fixedly installed on each of the supports;

[0020] and a driving member, wherein the number of the driving members is two, and the two driving members are rotatably mounted on the two supports and are fixedly connected to the output ends of the two driving devices respectively;

[0021] Wherein, the two driving members are connected via a transmission member, and the transmission member is detachably connected to the workstation switching assembly.

[0022] As a further solution of the present invention: the station switching component includes:

[0023] a mounting seat, the mounting seat being detachably connected to the transmission member;

[0024] A sliding frame, the sliding frame being fixedly connected to the mounting seat, and the sliding frame also passing through the station conversion slot and being slidably connected to the station conversion slot;

[0025] A guide sleeve, wherein the guide sleeve is fixedly mounted on the sliding frame;

[0026] A Y-shaped bracket, the Y-shaped bracket is fixedly connected to the processing placement table, and a push-pull cylindrical rod is fixedly installed on the Y-shaped bracket, the push-pull cylindrical rod passes through the guide sleeve and is rotatably connected to the guide sleeve;

[0027] and a state regulating unit, wherein the state regulating unit is connected to the regulating box and the push-pull cylindrical rod respectively.

[0028] As a further solution of the present invention: the state adjustment unit includes:

[0029] A movable column, the movable column is fixedly mounted on the push-pull cylindrical rod, and a regulating sliding column is also fixedly mounted on the movable column;

[0030] and a regulating chute, wherein the regulating chute is provided on the inner wall of the regulating box, and one end of the regulating slide is inserted into the regulating chute and is slidably connected to the regulating chute;

[0031] Among them, the regulating chute is composed of three parts: a regulating straight chute, a flipping chute and a positioning straight chute. The flipping chute is located between the regulating straight chute and the positioning straight chute, and is respectively connected to the regulating straight chute and the positioning straight chute, and the regulating straight chute and the positioning straight chute are arranged in parallel.

[0032] As a further solution of the present invention: further comprising: a thickness detector, wherein the thickness detector is fixedly mounted on the control box;

[0033] and an auxiliary scribing mechanism, the auxiliary scribing mechanism being connected to the processing platform and the scribing processing housing, and connected to the scribing drive assembly, and the auxiliary scribing mechanism being also electrically connected to the thickness detector;

[0034] The auxiliary scribing mechanism includes a water cooling control component and a feed speed control component, wherein the water cooling control component is respectively connected to the processing platform and the scribing processing housing, and is also connected to the scribing drive component;

[0035] The feed speed control component is connected to the processing platform and the dicing drive component respectively.

[0036] As a further solution of the present invention: the water cooling control component includes:

[0037] An L-shaped support rod, one end of which is connected to the scribing drive assembly, and a clamping slider is fixedly mounted on the L-shaped support rod, and the clamping slider is slidably connected to a guide rail fixedly mounted on the processing platform;

[0038] An elastic pressure plate, the elastic pressure plate being fixedly mounted on the other end of the L-shaped support rod;

[0039] A water flow control valve component, the water flow control valve component is fixedly connected to the dicing processing housing, and the water flow control valve component is also provided with a connecting pipe, one end of the connecting pipe is fixedly installed with a flow distribution chamber, and the flow distribution chamber is fixedly installed on the dicing processing housing;

[0040] The distribution chamber is further provided with a plurality of water-cooling nozzles, and the plurality of water-cooling nozzles are all located in the dicing processing housing;

[0041] and a detection head, which is inserted into the water control valve component and is detachably connected to the elastic pressure plate, and is also electrically connected to the thickness detector.

[0042] As a further solution of the present invention: the feed speed control component includes:

[0043] a speed reduction detection unit, the speed reduction detection unit being located on the scribing drive assembly;

[0044] A U-shaped bracket, the U-shaped bracket is fixedly connected to the processing platform, and two telescopic parts are fixedly installed on the U-shaped bracket, each of the telescopic parts is fixedly installed with a lifting connecting rod, and the lifting connecting rod passes through the U-shaped bracket and is slidably connected to the U-shaped bracket;

[0045] A lifting control plate, the lifting control plate is fixedly connected to the lifting connecting rod, and a detection roller is rotatably mounted on the lifting control plate, the detection roller is electrically connected to the telescopic member, and the detection roller is also rollingly connected to the deceleration detection portion;

[0046] and a deceleration wear-resistant sheet, wherein the number of the deceleration wear-resistant sheet is multiple, the multiple deceleration wear-resistant sheets are evenly distributed on the lifting control plate, and are detachably connected to the deceleration detection part;

[0047] Wherein, the height between the bottom end of the deceleration wear-resistant plate and the lower surface of the lifting control plate is less than the height between the lowest end of the detection roller and the lower surface of the lifting control plate.

[0048] Compared with the prior art, the present invention has the following beneficial effects:

[0049] The present application starts the dicing drive component, which can drive the processing placement table to move through the workstation switching component and move the processing placement table into the dicing processing shell. After the processing placement table enters the dicing processing shell, it will be inserted into the groove opened on the side wall of the dicing processing shell to support the processing placement table and avoid vibration or jitter when the dicing equipment dices the chip on the processing placement table. Other limiting methods can also be used, which will not be elaborated here. In addition, the dicing drive component and the workstation switching component are coordinated to work The operation can make the processing placement table switch between three working states, namely the loading and unloading station, the scribing station and the waste chip removal station. In the initial state of chip processing, the processing placement table is at the loading and unloading station and is set close to the feed table. As the scribing drive component drives the station switching component to move, the processing placement table can be moved from the loading and unloading station to the scribing station in the scribing processing shell for scribing operation. During the chip scribing operation, cooling water can be continuously sprayed to the chip on the processing placement table to reduce the temperature during the scribing process and to clean the waste chips. At this time, the The protective baffle and the leakage hole can prevent a large amount of cooling water from being sprayed to the outside of the equipment. At the same time, the waste water can be made to flow downward for collection. I will not elaborate on this. In addition, during the scribing operation at the scribing station, the processing placement table can be reciprocated by the reciprocating drive of the scribing drive assembly, so that different parts of the chip can be scribed. After the chip is scribed, the processing placement table can be driven by the scribing drive assembly to reach the top of the rinsing head through the station switching assembly, and the chip on the processing placement table (which has been scribed) can be moved back and forth. The chip is finished and the direction is upward, which is flipped to the direction downward and is located above multiple flushing heads and is directly opposite to the multiple flushing heads. At this time, through the flushing effect of multiple flushing heads, the waste chips remaining in the cutting groove can be fully cleaned before subsequent dissociation or transportation work (transported to the loading and unloading station again). The operation is simple, which can avoid residual waste chips in the cutting groove, thereby avoiding physical damage to the chip edge during the subsequent dissociation or transportation process, which is beneficial to ensuring the beauty of the chip, and at the same time can avoid the degradation of electrical performance, providing convenience for subsequent processing work. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It is a schematic diagram of the three-dimensional structure of the front side of the processing equipment in an embodiment of the present invention.

[0051] Figure 2 It is a schematic diagram of the three-dimensional structure of the rear side of the processing equipment in an embodiment of the present invention.

[0052] Figure 3 It is a schematic diagram of the main structure of the processing equipment in an embodiment of the present invention.

[0053] Figure 4Schematic diagram of the three-dimensional structure of the distribution position of the water-cooling nozzles in an embodiment of the present invention.

[0054] Figure 5 Schematic diagram of the three-dimensional structure of the processing platform in an embodiment of the present invention.

[0055] Figure 6 Schematic diagram of the three-dimensional structure of the speed reduction detection unit in an embodiment of the present invention.

[0056] Figure 7 Schematic diagram of the three-dimensional structure of the lifting control panel in an embodiment of the present invention.

[0057] Figure 8 Schematic diagram of the three-dimensional structure of the U-shaped bracket in an embodiment of the present invention.

[0058] Figure 9 This is a bottom-up structural schematic diagram of the distribution of the deceleration wear-resistant plates in an embodiment of the present invention.

[0059] Figure 10 Schematic diagram of the cross-sectional structure of the control box in an embodiment of the present invention.

[0060] Figure 11 Schematic diagram of the three-dimensional structure of the processing placement table in an embodiment of the present invention.

[0061] Figure 12 Schematic diagram of the three-dimensional structure of the push-pull cylindrical rod in an embodiment of the present invention.

[0062] Figure 13 Schematic diagram of the three-dimensional structure of the Y-shaped bracket in an embodiment of the present invention.

[0063] In the figure: 1-processing platform, 2-station conversion slot, 3-dicing processing shell, 4-dicing equipment, 5-control box, 6-feeding table, 7-cleaning support plate, 8-rinsing head, 9-thickness detector, 10-inspection cover, 11-water control valve, 12-guide slide, 13-flow distribution chamber, 14-connecting pipe, 15-detection head, 16-driving equipment, 17-support, 18-transmission part, 19-driving part, 20-water cooling nozzle, 21-protective baffle, 22-mounting seat, 23-elastic pressure plate, 24-L-shaped support rod , 25- card-mounted slider, 26- speed reduction detection unit, 27- U-shaped bracket, 28- telescopic part, 29- lifting link, 30- lifting control panel, 31- deceleration wear-resistant plate, 32- detection roller, 33- regulating straight slide, 34- flip slide, 35- positioning straight slide, 36- processing placement table, 37- limiting groove, 38- adsorption part, 39- leakage hole, 40- push-pull cylindrical rod, 41- sliding frame, 42- guide sleeve, 43- moving column, 44- regulating slide, 45- adsorption clamping device, 46- Y-shaped bracket. DETAILED DESCRIPTION

[0064] The following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0065] The specific implementation of the present invention is described in detail below with reference to specific embodiments.

[0066] See also Figures 1-13 The embodiment of the present invention provides a processing device for chip dicing and dissociation, comprising a processing platform 1, and further comprising:

[0067] A scribing processing housing 3 and a control box 5, both of which are fixedly mounted on the processing platform 1;

[0068] and a scribing control mechanism, which is respectively connected to the processing platform 1, the scribing processing housing 3 and the control box 5, wherein the scribing control mechanism includes a processing placement table 36, a station switching component and a scribing drive component;

[0069] The dicing drive assembly is connected to the processing platform 1, and the station switching assembly is respectively connected to the dicing processing shell 3 and the control box 5, and a processing placement table 36 is also installed on the station switching assembly, and the processing placement table 36 is detachably connected to the dicing processing shell 3.

[0070] See also Figures 1-13 , further comprising: a cleaning support plate 7, the cleaning support plate 7 being fixedly mounted on the end of the processing platform 1, and a plurality of flushing heads 8 being fixedly mounted on the cleaning support plate 7;

[0071] And a feeding table 6, which is fixedly installed on the processing platform 1.

[0072] It also includes: a scribing device 4, which is detachably mounted on the scribing processing housing 3 and is installed in conjunction with the processing placement table 36;

[0073] And an inspection cover plate 10 , which is detachably mounted on the control box 5 .

[0074] See also Figures 1-12 , an adsorption clamping device 45 is fixedly installed on the processing placement table 36, and an adsorption portion 38 is also provided on the processing placement table 36, and the adsorption portion 38 is connected to the output end of the adsorption clamping device 45;

[0075] The processing placement table 36 is further provided with a limiting groove 37 , in which a plurality of leakage holes 39 are provided. A protective baffle 21 is further fixedly mounted on one end of the processing placement table 36 , and the protective baffle 21 is detachably connected to the control box 5 .

[0076] When the chip is being diced, first, the chip to be cut can be transported to the processing platform 1 via the feed table 6, wherein the processing platform 1 is fixed to other components or a steel base by bolt connection, and the feed table 6 can use existing transportation equipment, such as a conveyor belt, etc. After the chip to be diced arrives at the designated position, the chip to be diced on the feed table 6 can be transported to the processing placement table 36 by existing handling equipment, such as a suction cup, etc., and placed in the limiting groove 37. At the same time, the adsorption clamping device 45 is started to generate a negative pressure state at the adsorption part 38, so that the chip can be adsorbed and clamped. Of course, other existing clamping methods can also be used to firmly fix the chip to be diced on the processing placement table 36 to ensure stability during subsequent dicing operations. I will not go into details here.

[0077] Then, start the dicing drive component, which can drive the processing placement table 36 to move through the workstation switching component, and move the processing placement table 36 into the dicing processing shell 3. After the processing placement table 36 enters the dicing processing shell 3, it will be inserted into the groove opened on the side wall of the dicing processing shell 3 to support the processing placement table 36 and avoid vibration or jitter when the dicing equipment 4 dices the chip on the processing placement table 36. Other limiting methods can also be used, which will not be elaborated here. In addition, by setting the dicing drive component and the workstation switching component together, By cooperating with each other, the processing placement table 36 can be converted into three working states, namely, the loading and unloading station, the scribing station and the waste chip removal station. In the initial state of chip processing, the processing placement table 36 is at the loading and unloading station and is arranged close to the feed table 6. As the scribing drive component drives the station switching component to move, the processing placement table 36 can be moved from the loading and unloading station to the scribing station in the scribing processing shell 3 to perform scribing operations. During the chip scribing operation, cooling water can be continuously sprayed onto the chip on the processing placement table 36 to reduce the temperature during the scribing process and to clean up the waste chips. At this time, the protective baffle 21 and the leak hole 39 are provided to prevent a large amount of cooling water from being sprayed to the outside of the equipment. At the same time, the waste water can be made to flow downward for collection. No further details are given here. In addition, during the dicing operation at the dicing station, the processing placement table 36 can be reciprocated by the reciprocating drive of the dicing drive assembly, so that dicing operations can be performed on different parts of the chip. After the chip is diced, the processing placement table 36 can be driven by the dicing drive assembly to reach the top of the rinsing head 8 through the station switching assembly, and the processing placement table 36 can be moved back and forth. The chip (which has been diced and is in the upward direction) is flipped to the downward direction and is located above multiple flushing heads 8, and is directly opposite to the multiple flushing heads 8. At this time, through the flushing effect of multiple flushing heads 8, the waste chips remaining in the cutting groove can be fully cleaned before subsequent dissociation or transportation work (transported to the loading and unloading station again). The operation is simple, and waste chips can be avoided from remaining in the cutting groove, thereby avoiding physical damage to the chip edge during the subsequent dissociation or transportation process, which is conducive to ensuring the beauty of the chip, and at the same time can avoid the degradation of electrical performance, providing convenience for subsequent processing work.

[0078] In one embodiment of the present invention, see Figures 1-13 , the dicing drive assembly includes:

[0079] A workstation conversion slot 2 is provided on the processing platform 1;

[0080] Supports 17, there are two supports 17, both of which are fixedly mounted on the processing platform 1 and are respectively located at two ends of the station conversion slot 2;

[0081] And a driving device 16 is fixedly mounted on each of the supports 17;

[0082] and a driving member 19, wherein the number of the driving members 19 is two, and the two driving members 19 are rotatably mounted on the two supports 17 and are fixedly connected to the output ends of the two driving devices 16 respectively;

[0083] The two driving members 19 are connected via a transmission member 18 , and the transmission member 18 is detachably connected to the station switching assembly.

[0084] See also Figures 1-13 , the station switching component includes:

[0085] A mounting seat 22 detachably connected to the transmission member 18 ;

[0086] A sliding frame 41 is fixedly connected to the mounting seat 22 and passes through the station conversion slot 2 and is slidably connected to the station conversion slot 2;

[0087] A guide sleeve 42, the guide sleeve 42 is fixedly mounted on the sliding frame 41;

[0088] A Y-shaped bracket 46 is fixedly connected to the processing placement table 36, and a push-pull cylindrical rod 40 is fixedly mounted on the Y-shaped bracket 46. The push-pull cylindrical rod 40 passes through the guide sleeve 42 and is rotatably connected to the guide sleeve 42;

[0089] and a state regulating unit, wherein the state regulating unit is connected to the regulating box 5 and the push-pull cylindrical rod 40 respectively.

[0090] The state adjustment unit includes:

[0091] A movable column 43, which is fixedly mounted on the push-pull cylindrical rod 40, and a regulating sliding column 44 is also fixedly mounted on the movable column 43;

[0092] and a regulating chute, the regulating chute being provided on the inner wall of the regulating box 5, one end of the regulating slide 44 being inserted into the regulating chute and being slidably connected with the regulating chute;

[0093] Among them, the regulating chute is composed of three parts: a regulating straight chute 33, a flipping chute 34 and a positioning straight chute 35. The flipping chute 34 is located between the regulating straight chute 33 and the positioning straight chute 35, and is respectively connected to the regulating straight chute 33 and the positioning straight chute 35, and the regulating straight chute 33 and the positioning straight chute 35 are arranged in parallel.

[0094] When the chip is placed on the processing placement table 36 located at the loading and unloading station, the driving device 16 is started, wherein the driving device 16 can be in the form of a forward and reverse motor, which can drive the driving member 19 to rotate and drive the transmission member 18 to move synchronously, wherein the cooperation mode of the transmission member 18 and the driving member 19 can be in the form of gears and internal toothed belts, or in the form of chains and sprockets to ensure the efficiency of the transmission. During the movement of the transmission member 18, the mounting seat 22 can be driven to move synchronously, thereby driving the sliding frame 41 to slide in the station conversion slot 2. Under the action of the coordinated sliding of the two, the stability of the movement of the processing placement table 36 can be ensured. Under the driving action of the sliding frame 41, the push-pull cylindrical rod 40 can be pulled by the Y-shaped bracket 46 to pull the processing placement table 36 toward the direction of the dicing processing shell 3, and finally move to the groove set in the dicing processing shell 3 to support the processing placement table 36, so that the processing placement table 36 can perform the chip dicing operation in a stable state. During the chip processing, By driving the transmission member 18 to move clockwise or counterclockwise through the driving device 16, the processing placement table 36 can be reciprocated on the horizontal plane (at this time, the regulating slide 44 reciprocates in the regulating straight slide groove 33, thereby ensuring the stability of the movement of the processing placement table 36), so that the dicing operation can be performed on multiple parts of the chip. When the processing is completed, as the transmission member 18 drives the processing placement table 36 to move away from the dicing processing housing 3, when the processing placement table 36 passes the loading and unloading station, the regulating slide 44 is The chip enters the flip chute 34 from the regulating straight slide 33, and under the guidance of the flip chute 34, where the flip chute 34 is a spiral structure, the regulating slide 44 will drive the push-pull cylindrical rod 40 to rotate in the guide sleeve 42 until the regulating slide 44 reaches the positioning straight slide 35. The processing placement table 36 drives the chip to flip 180°, so that the chip originally located on the upper side of the processing placement table 36 can be rotated to the lower side, so that the flushing head 8 can flush the cut groove. No more details will be given here.

[0095] In one embodiment of the present invention, see Figures 1-13 , further comprising: a thickness detector 9, said thickness detector 9 being fixedly mounted on said control box 5;

[0096] and an auxiliary scribing mechanism, the auxiliary scribing mechanism being connected to the processing platform 1 and the scribing processing housing 3, respectively, and being connected to the scribing drive assembly, and the auxiliary scribing mechanism being also electrically connected to the thickness detector 9;

[0097] The auxiliary scribing mechanism includes a water cooling control component and a feed speed control component. The water cooling control component is connected to the processing platform 1 and the scribing processing housing 3, and is also connected to the scribing drive component.

[0098] The feed speed control assembly is connected to the processing platform 1 and the scribing drive assembly respectively.

[0099] See also Figures 1-13 , the water cooling control component includes:

[0100] An L-shaped support rod 24, one end of which is connected to the scribing drive assembly, and a clamping slider 25 is fixedly mounted on the L-shaped support rod 24, and the clamping slider 25 is slidably connected to the guide rail 12 fixedly mounted on the processing platform 1;

[0101] An elastic pressure plate 23, the elastic pressure plate 23 is fixedly mounted on the other end of the L-shaped support rod 24;

[0102] A water flow control valve 11 is fixedly connected to the dicing processing housing 3, and a connecting pipe 14 is further provided on the water flow control valve 11. A flow distribution chamber 13 is fixedly mounted on one end of the connecting pipe 14, and the flow distribution chamber 13 is fixedly mounted on the dicing processing housing 3;

[0103] The distribution chamber 13 is further provided with a plurality of water-cooling nozzles 20, and the plurality of water-cooling nozzles 20 are all located in the dicing processing housing 3;

[0104] and a detection head 15 , which is inserted into the water control valve member 11 and is detachably connected to the elastic pressure plate 23 , and is also electrically connected to the thickness detector 9 .

[0105] The feed speed control component includes:

[0106] A speed reduction detection unit 26, the speed reduction detection unit 26 is located on the scribing drive assembly;

[0107] A U-shaped bracket 27 is fixedly connected to the processing platform 1, and two telescopic members 28 are fixedly mounted on the U-shaped bracket 27. Each telescopic member 28 is fixedly mounted with a lifting link 29. The lifting link 29 passes through the U-shaped bracket 27 and is slidably connected to the U-shaped bracket 27;

[0108] A lifting control plate 30 is fixedly connected to the lifting link 29 and a detection roller 32 is rotatably mounted on the lifting control plate 30. The detection roller 32 is electrically connected to the telescopic member 28 and is also in rolling connection with the deceleration detection unit 26.

[0109] and a deceleration wear-resistant sheet 31 , wherein the number of the deceleration wear-resistant sheet 31 is multiple, and the multiple deceleration wear-resistant sheets 31 are evenly distributed on the lifting control plate 30 and are detachably connected to the speed reduction detection unit 26 ;

[0110] The height between the bottom end of the deceleration wear-resistant plate 31 and the lower surface of the lifting control plate 30 is smaller than the height between the lowest end of the detection roller 32 and the lower surface of the lifting control plate 30 .

[0111] During the chip dicing process, different feeding speeds and cooling degrees are required for chips of different thicknesses. Generally, thicker chips require slower feeding speeds and higher cooling degrees when dicing, otherwise it will affect the quality of the dicing process. Therefore, in the process of the chip entering the dicing station from the loading and unloading station, the thickness of the chip is detected again by the thickness detector 9, wherein the thickness detector 9 can adopt an optical measurement method, such as a laser thickness gauge, a white light interferometer, etc. After accurately measuring the thickness of the chip, it will control the corresponding water control valve component 11 to move, and the water control valve component 11 will wait for the start signal of the detection head 15 after obtaining the data, wherein the water control valve component 11 can be in the form of an electromagnetic control valve, and the detection head 15 and the thickness detector 9 jointly control the opening and closing, so as to ensure that water is supplied and a certain amount of cooling water is given only when the processing placement table 36 accurately reaches the dicing station, which is beneficial to ensure the chip dicing process. Under the sufficient cooling effect, water resources are saved, and at the same time, the purpose of cleaning waste chips well can be achieved. I will not go into details here. When the transmission member 18 pushes the processing placement table 36 to move, the transmission member 18 will also drive the L-shaped support rod 24 to move, and make the L-shaped support rod 24 slide on the guide rail 12 through the clamping slider 25. When the elastic pressure plate 23 on the L-shaped support rod 24 contacts the detection head 15, it can produce a squeezing effect on the detection head 15. At this time, the pressure sensor on the detection head 15 will start working. When the specified set pressure value is reached, the detection head 15 will control the water control valve 11 to open, and the external water source connected to the connecting pipe 14 will enter the distribution chamber 13 through the connecting pipe 14, and finally be sprayed onto the chip on the processing placement table 36 through multiple water-cooling nozzles 20. At the same time, the detection head 15 can also feed back the detected value to the drive device 16 to ensure that the drive device 16 stops or reverses when it reaches the dicing station. I will not go into details here.

[0112] In addition, during the movement of the transmission member 18, when the processing placement table 36 reaches the dicing station, it will drive the deceleration detection part 26 to move between the U-shaped bracket 27 and the lifting control plate 30, and in the whole process, since the detection roller 32 is located on the middle part of the lifting control plate 30, the detection roller 32 first rolls on the transmission member 18 and then rolls on the deceleration detection part 26, so that the speed of the entire processing placement table 36 movement process can be monitored, and the size of the equipment operation speed and whether it moves at a uniform speed can be judged. When an abnormality occurs, it is immediately fed back to the terminal device of the staff. During the normal movement of the processing placement table 36, since no processing work is performed on the chip, the change in moving speed will not affect the chip, and it is only necessary to feed back the speed change to the staff. At this time, since the distance between the deceleration wear-resistant plates 31 set on both sides of the detection roller 32 is greater than the width of the transmission member 18, it will not hinder the movement of the transmission member 18. 6, at this time, the dicing equipment 4 processes the chip, and when the detection roller 32 detects that the speed of the transmission member 18 is fast, the telescopic member 28 will be started, wherein the telescopic member 28 can be in the form of an electric push rod or a telescopic cylinder, and the telescopic member 28 will pull the lifting control plate 30 to move downward, and make the deceleration wear-resistant plate 31 contact with the speed reduction detection part 26, wherein the detection roller 32 can adopt an elastic structure, when the lifting control plate 30 moves downward, the detection roller 32 can be slightly deformed, and because the height of the bottom end of the deceleration wear-resistant plate 31 from the lower surface of the lifting control plate 30 is less than the height of the lowest end of the detection roller 32 from the lower surface of the lifting control plate 30, under normal working conditions, the deceleration wear-resistant plate 31 does not contact the speed reduction detection part 26, and when the lifting control plate 30 moves downward, the deceleration wear-resistant plate 31 can be made to contact the speed reduction detection part 26, so that under the action of friction braking, the moving speed of the transmission member 18 can be reduced to avoid affecting the effect and quality of chip dicing, which will not be described in detail here.

[0113] It should be noted that, in the present invention, unless otherwise expressly specified or limited, the terms "sliding," "rotating," "fixed," and "provided with," etc., should be understood in a broad sense. For example, they may refer to welded connections, bolted connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise expressly specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0114] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A processing device for chip dicing and dissociation, comprising a processing platform, characterized in that: Also includes: A dicing processing housing and a control box, both of which are fixedly mounted on the processing platform; and a dicing control mechanism, the dicing control mechanism being connected to the processing platform, the dicing processing housing and the control box respectively, wherein the dicing control mechanism includes a processing placement table, a station switching component and a dicing drive component; The dicing drive assembly is connected to the processing platform, the station switching assembly is respectively connected to the dicing processing shell and the control box, and a processing placement table is also installed on the station switching assembly, and the processing placement table is detachably connected to the dicing processing shell.

2. The processing equipment for chip dicing and dissociation according to claim 1, characterized in that: Also includes: Cleaning A support plate, wherein the cleaning support plate is fixedly mounted on the end of the processing platform, and a plurality of flushing heads are also fixedly mounted on the cleaning support plate; and a feeding table, which is fixedly mounted on the processing platform.

3. The processing equipment for chip dicing and dissociation according to claim 2, characterized in that: Also includes: A scribing device, which is detachably mounted on the scribing processing housing and is mounted in conjunction with the processing placement table; and an inspection cover plate, wherein the inspection cover plate is detachably mounted on the control box.

4. The processing equipment for chip dicing and dissociation according to any one of claims 1 to 3, characterized in that: The processing and placing table is fixedly installed with an adsorption clamping device, and the processing and placing table is also provided with an adsorption portion, and the adsorption portion is connected to the output end of the adsorption clamping device; The processing placement table is further provided with a limiting groove, in which a plurality of leakage holes are provided. A protective baffle is further fixedly installed at one end of the processing placement table, and the protective baffle is detachably connected to the control box.

5. The processing equipment for chip dicing and dissociation according to claim 1, characterized in that: The dicing drive assembly includes: A workstation conversion notch, the workstation conversion notch being provided on the processing platform; Supports, the number of the supports is two, both of the supports are fixedly mounted on the processing platform and are respectively located at the two ends of the station conversion slot; And a driving device is fixedly installed on each of the supports; and a driving member, wherein the number of the driving members is two, and the two driving members are rotatably mounted on the two supports and are fixedly connected to the output ends of the two driving devices respectively; Wherein, the two driving members are connected via a transmission member, and the transmission member is detachably connected to the workstation switching assembly.

6. The processing equipment for chip dicing and dissociation according to claim 5, characterized in that: The station switching component includes: a mounting seat, the mounting seat being detachably connected to the transmission member; A sliding frame, the sliding frame being fixedly connected to the mounting seat, and the sliding frame also passing through the station conversion slot and being slidably connected to the station conversion slot; A guide sleeve, the guide sleeve being fixedly mounted on the sliding frame; A Y-shaped bracket, the Y-shaped bracket is fixedly connected to the processing placement table, and a push-pull cylindrical rod is fixedly installed on the Y-shaped bracket, the push-pull cylindrical rod passes through the guide sleeve and is rotatably connected to the guide sleeve; and a state regulating unit, wherein the state regulating unit is connected to the regulating box and the push-pull cylindrical rod respectively.

7. The processing equipment for chip dicing and dissociation according to claim 6, characterized in that: The state adjustment unit includes: A movable column, the movable column is fixedly mounted on the push-pull cylindrical rod, and a regulating sliding column is also fixedly mounted on the movable column; and a regulating chute, wherein the regulating chute is provided on the inner wall of the regulating box, and one end of the regulating slide is inserted into the regulating chute and is slidably connected to the regulating chute; Among them, the regulating chute is composed of three parts: a regulating straight chute, a flipping chute and a positioning straight chute. The flipping chute is located between the regulating straight chute and the positioning straight chute, and is respectively connected to the regulating straight chute and the positioning straight chute, and the regulating straight chute and the positioning straight chute are arranged in parallel.

8. The processing equipment for chip dicing and dissociation according to claim 1 or 7, characterized in that: Also includes: A thickness detector, the thickness detector being fixedly mounted on the control box; and an auxiliary scribing mechanism, the auxiliary scribing mechanism being connected to the processing platform and the scribing processing housing, and connected to the scribing drive assembly, and the auxiliary scribing mechanism being also electrically connected to the thickness detector; The auxiliary scribing mechanism includes a water cooling control component and a feed speed control component, wherein the water cooling control component is respectively connected to the processing platform and the scribing processing housing, and is also connected to the scribing drive component; The feed speed control component is connected to the processing platform and the dicing drive component respectively.

9. The processing equipment for chip dicing and dissociation according to claim 8, characterized in that: The water cooling control assembly includes: An L-shaped support rod, one end of which is connected to the scribing drive assembly, and a clamping slider is fixedly mounted on the L-shaped support rod, and the clamping slider is slidably connected to a guide rail fixedly mounted on the processing platform; An elastic pressure plate, the elastic pressure plate being fixedly mounted on the other end of the L-shaped support rod; A water flow control valve component, the water flow control valve component is fixedly connected to the dicing processing housing, and the water flow control valve component is also provided with a connecting pipe, one end of the connecting pipe is fixedly installed with a flow distribution chamber, and the flow distribution chamber is fixedly installed on the dicing processing housing; The distribution chamber is further provided with a plurality of water-cooling nozzles, and the plurality of water-cooling nozzles are all located in the dicing processing housing; and a detection head, which is inserted into the water control valve component and is detachably connected to the elastic pressure plate, and is also electrically connected to the thickness detector.

10. The processing equipment for chip dicing and dissociation according to claim 9, characterized in that: The feed speed control component includes: a speed reduction detection unit, the speed reduction detection unit being located on the scribing drive assembly; A U-shaped bracket, the U-shaped bracket is fixedly connected to the processing platform, and two telescopic parts are fixedly installed on the U-shaped bracket, each of the telescopic parts is fixedly installed with a lifting connecting rod, and the lifting connecting rod passes through the U-shaped bracket and is slidably connected to the U-shaped bracket; A lifting control plate, the lifting control plate is fixedly connected to the lifting connecting rod, and a detection roller is rotatably mounted on the lifting control plate, the detection roller is electrically connected to the telescopic member, and the detection roller is also rollingly connected to the deceleration detection portion; and a deceleration wear-resistant sheet, wherein the number of the deceleration wear-resistant sheet is multiple, the multiple deceleration wear-resistant sheets are evenly distributed on the lifting control plate, and are detachably connected to the deceleration detection part; Wherein, the height between the bottom end of the deceleration wear-resistant plate and the lower surface of the lifting control plate is less than the height between the lowest end of the detection roller and the lower surface of the lifting control plate.

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