A heat spreader and electronic equipment

Abstract

This application provides a vapor chamber and an electronic device, relating to the field of electronic device technology. It addresses the problem that a vapor chamber with high thermal resistance results in poor heat dissipation, leading to poor heat dissipation of internal components in electronic devices. The vapor chamber includes a shell, a first absorbent core, and at least one second absorbent core. The shell includes a first cover plate and a second cover plate. The first cover plate includes an evaporation region and a condensation region. The first absorbent core is disposed within the shell, attached to the first cover plate and spaced apart from the second cover plate, covering both the evaporation and condensation regions. The second absorbent core is disposed within the shell and covers the evaporation region, stacked on top of the first absorbent core.

Description

[0001] This application is a divisional application of the original application with the application number 202311777226.8 and the original filing date of December 21, 2023, and the entire contents of the original application are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic devices, in particular to a vapor chamber and an electronic device. BACKGROUND

[0003] With the continuous development of electronic devices (for example, mobile phones), the heat generated by some components inside the electronic devices also increases. Therefore, a vapor chamber is arranged inside the electronic device to dissipate heat for the components with large heat generation. However, the existing vapor chamber has a large thermal resistance, resulting in poor heat dissipation performance, which leads to poor heat dissipation effect of the components inside the electronic device. SUMMARY

[0004] The embodiments of the present application provide a vapor chamber and an electronic device, which are used to solve the problem of large thermal resistance of the vapor chamber, resulting in poor heat dissipation performance, which leads to poor heat dissipation effect of the components inside the electronic device.

[0005] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0006] In a first aspect, a vapor chamber is provided, which includes an outer shell, a first wick, and at least one second wick. The outer shell includes a first cover plate and a second cover plate, and the first cover plate includes an evaporation area and a condensation area. The first wick is arranged in the outer shell, and the first wick is attached to the first cover plate and spaced apart from the second cover plate. The first wick covers the evaporation area and the condensation area. The second wick is arranged in the outer shell and covers the evaporation area. The second wick is stacked with the first wick.

[0007] The vapor chamber provided in the first aspect of the present application has at least one second wick arranged in the outer shell at a position corresponding to the evaporation area, that is, a plurality of wicks are stacked in the evaporation area, so as to increase the liquid storage capacity corresponding to the evaporation area, thereby being able to absorb more heat and improve the heat dissipation performance. Moreover, since the multiple wicks are all arranged in the outer shell, the thermal resistance is small during heat transfer, thereby further improving the heat dissipation performance.

[0008] In a possible implementation manner of the first aspect of the present application, the outer shell further includes a plurality of support columns, and the support columns are all arranged on the second cover plate and abut against the first wick. In this structure, the support columns abut between the first wick and the second cover plate, thereby being able to form support to avoid the space between the first wick and the second cover plate being reduced and affecting the flow of steam.

[0009] In a possible implementation of the first aspect of the present application, the support columns include first support columns and second support columns, a vertical projection of the first support columns on the first cover plate is located in the evaporation region, and a vertical projection of the second support columns on the first cover plate is located in the condensation region; a spacing distance between two adjacent first support columns is greater than a spacing distance between two adjacent second support columns. In this structure, liquid working medium evaporates to form steam, and the steam flows from the area where the first support columns are located to the area where the second support columns are located. Since the spacing distance of the first support columns is greater than the spacing distance of the second support columns, the cross-sectional area of the steam flow channel decreases, thereby increasing the flow rate of the steam flow and improving the steam flow efficiency.

[0010] In a possible implementation of the first aspect of the present application, the diameter of the first support column is greater than the diameter of the second support column. In this structure, the support effect and support reliability of the first support column on the first wick and the second wick in the evaporation region can be improved.

[0011] In a possible implementation of the first aspect of the present application, the length of the first support column is greater than the length of the second support column. In this structure, the space corresponding to the evaporation region is increased, thereby being able to accommodate more steam and further improving the evaporation efficiency.

[0012] In a possible implementation of the first aspect of the present application, the second wick includes a first region and a second region, the first region covers the evaporation region, the second region is attached to the condensation region, and the second region extends to one end of the condensation region away from the evaporation region; the second support column is arranged in a region outside the vertical projection of the second region on the second cover plate. In this way, a steam channel can be formed between the second region and the second cover plate to enable the steam to quickly flow to the condensation region. Moreover, the second region can increase the wicking capacity of the condensation region, thereby improving the heat dissipation performance of the vapor chamber.

[0013] In a possible implementation of the first aspect of the present application, the distance between the evaporation region and the second cover plate is a first distance, the distance between the condensation region and the second cover plate is a second distance, the first distance is greater than the second distance; the first cover plate further includes a transition region, the transition region is connected between the evaporation region and the condensation region, and an included angle formed by the transition region and the second cover plate is an acute angle. In this structure, the transition region is inclined, which is beneficial to reducing the resistance of the part of the first wick attached to the transition region, so that the liquid working medium in the first wick can quickly flow to the evaporation region, thereby improving the heat dissipation efficiency.

[0014] In one possible implementation of the first aspect of this application, the support column further includes a third support column, the vertical projection of which onto the first cover plate lies within the transition region. In this structure, the third support column abuts against the first absorbent core that is attached to the transition region, thereby ensuring a tight fit between the first absorbent core and the transition region.

[0015] In one possible implementation of the first aspect of this application, the surface of the third support column facing the transition region is an abutment surface, and the abutment surface and the transition region are arranged parallel to each other. In this structure, the third support column and the first absorbent core form a surface-to-surface contact, which increases the contact area between them and improves the reliability of the support.

[0016] In one possible implementation of the first aspect of this application, the contact surface extends from the edge of the transition region near the evaporation region to the edge of the transition region near the condensation region. This structure further increases the contact area between the contact surface and the first absorbent core, thereby further improving the support reliability.

[0017] In one possible implementation of the first aspect of this application, multiple third support columns are provided, and these multiple third support columns are spaced apart along the length direction of the transition region. This structure can further improve the reliability of the support.

[0018] In one possible implementation of the first aspect of this application, the portion of the first absorbent core that adheres to the transition region is fixedly connected to the transition region. For example, the first absorbent core and the transition region can be spot-welded together.

[0019] In one possible implementation of the first aspect of this application, a plurality of heat dissipation holes are provided on the outer wall of the second cover plate, with each heat dissipation hole corresponding to a support column and extending along the axial direction of the support column. This increases the contact area between the second cover plate and the external air, thereby improving heat dissipation efficiency.

[0020] In a second aspect, an electronic device is provided, comprising a housing, a heating element, and a heat spreader, wherein the heat spreader is as described in any of the above technical solutions, the heating element and the heat spreader are both disposed within the housing, the heating element is attached to a first cover plate of the heat spreader and is located within the evaporation area of ​​the first cover plate.

[0021] The electronic device provided in the second aspect of this application, by including the heat spreader as described in any of the above technical solutions, is able to solve the same technical problem and achieve the same technical effect. Attached Figure Description

[0022] Figure 1 A structural diagram of an electronic device provided in an embodiment of this application;

[0023] Figure 2An exploded view of an electronic device provided in an embodiment of this application;

[0024] Figure 3 A structural diagram of a heat spreader provided in an embodiment of this application;

[0025] Figure 4 This is a structural diagram of a multilayer heat exchanger assembly provided in an embodiment of this application;

[0026] Figure 5 A structural diagram of another stacked heat exchanger assembly provided in an embodiment of this application;

[0027] Figure 6 A structural diagram of another heat spreader provided in an embodiment of this application;

[0028] Figure 7 A structural diagram of another heat spreader provided in the embodiments of this application;

[0029] Figure 8 A structural diagram of another heat spreader provided in the embodiments of this application;

[0030] Figure 9 A schematic diagram showing the density of the first and second absorbent cores provided in the embodiments of this application;

[0031] Figure 10 A schematic diagram showing the spacing between the first and second support columns provided in an embodiment of this application;

[0032] Figure 11 A structural diagram of a second absorbent core provided in an embodiment of this application;

[0033] Figure 12 A structural diagram of a second cover plate provided in an embodiment of this application;

[0034] Figure 13 A structural diagram of a first cover plate provided in an embodiment of this application;

[0035] Figure 14 A structural diagram of another first cover plate provided in an embodiment of this application;

[0036] Figure 15 A partial structural diagram showing one connection method between the transition region and the first absorbent core provided in an embodiment of this application;

[0037] Figure 16 A partial structural diagram illustrating another connection method between the transition region and the first absorbent core provided in an embodiment of this application;

[0038] Figure 17 This is a partial structural diagram illustrating another connection method between the transition region and the first absorbent core provided in an embodiment of this application.

[0039] Reference numerals: 10-Electronic device; 100-Display module; 110-Light-transmitting cover; 120-Display screen; 200-Housing; 210-Back cover; 220-Frame; 230-Middle plate; 300-Heat distribution plate; 300a-First heat distribution plate; 300b-Second heat distribution plate; 301-Lower cover; 301a-First lower cover; 301b-Second lower cover; 302-Upper cover; 302a-First upper cover; 302b-Second upper cover; 303-Liquid suction core; 303a-Liquid suction core one; 303b- Liquid absorbent core 2; 304 - Double-sided adhesive; 305 - Middle cover plate; 309 - Outer shell; 310 - First cover plate; 311 - Evaporation zone; 312 - Condensation zone; 313 - Transition zone; 320 - Second cover plate; 321 - Heat dissipation hole; 330 - First liquid absorbent core; 340 - Second liquid absorbent core; 341 - First area; 342 - Second area; 350 - Support column; 351 - First support column; 352 - Second support column; 353 - Third support column; 353a - Contact surface; 400 - Circuit board. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0041] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature.

[0042] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0043] In this application, unless otherwise expressly specified and limited, the term "connection" shall be interpreted broadly. For example, "connection" may be a fixed connection, a detachable connection, or an integral part; it may be a direct connection or an indirect connection through an intermediate medium.

[0044] This application provides an electronic device. Specifically, the electronic device can be a portable electronic device or other types of electronic devices. For example, the electronic device can be a mobile phone, tablet personal computer, laptop computer, personal digital assistant (PDA), monitor, camera, personal computer, laptop computer, wearable device, etc. For ease of explanation, the following description uses a mobile phone as an example.

[0045] Please see Figure 1 and Figure 2 , Figure 1 This is a structural diagram of the electronic device 10 provided in the embodiments of this application. Figure 2 This is an exploded view of the electronic device 10 provided in an embodiment of this application. It is understood that... Figure 1 and Figure 2 The electronic device 10 is shown only schematically, and the actual shape, size, location, and construction of these components are not subject to change. Figure 1 and Figure 2 Restrictions.

[0046] As described above, in this embodiment, the electronic device 10 is a mobile phone, and the electronic device 10 can have an approximately rectangular plate-like structure. The electronic device 10 may include a display module 100, a housing 200, a circuit board 400, and components.

[0047] The aforementioned display module 100 is used to display images, videos, etc. The display module 100 may include a light-transmitting cover 110 and a display screen 120 (also known as a display panel), with the light-transmitting cover 110 and the display screen 120 stacked together. The material of the light-transmitting cover 110 includes, but is not limited to, glass. For example, the light-transmitting cover 110 can be a common light-transmitting cover 110, used to protect the display screen 120 from damage caused by external forces and to provide dust protection. Alternatively, the light-transmitting cover 110 can also be a touch-enabled light-transmitting cover 110, enabling the electronic device 10 to have touch functionality, thus making it more convenient for users. Therefore, this application does not impose any special limitations on the specific material of the light-transmitting cover 110.

[0048] Furthermore, the aforementioned display screen 120 can be a flexible display screen or a rigid display screen. For example, the display screen 120 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode (MLED) display screen, a micro organic light-emitting diode (MLED) display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0049] The aforementioned housing 200 is used to protect the electronic components inside the electronic device 10. The housing 200 may include a rear cover 210 and a frame 220. The rear cover 210 is located on the side of the display screen 120 away from the light-transmitting cover 110 and is stacked with the light-transmitting cover 110 and the display screen 120. The frame 220 is located between the light-transmitting cover 110 and the rear cover 210. The frame 220 is fixed to the rear cover 210. Exemplarily, the frame 220 can be fixed to the rear cover 210 by means of adhesive bonding, threaded connection, welding, snap-fit, etc.; alternatively, the frame 220 can also be integrally formed with the rear cover 210, that is, the frame 220 and the rear cover 210 form a single structural component. The light-transmitting cover 110 can be glued to the frame 220, so that the light-transmitting cover 110, the rear cover 210, and the frame 220 form a receiving cavity inside the electronic device 10, within which the aforementioned circuit board assembly and electronic components are disposed.

[0050] In some embodiments, the housing 200 may further include a middle plate 230, which is disposed within the accommodating cavity and located on the side of the display screen 120 away from the light-transmitting cover 110. The middle plate 230 is fixedly connected to the frame 220 to form the mid-frame of the electronic device 10. Exemplarily, the middle plate 230 and the frame 220 can be fixedly connected by adhesive, threaded connection, welding, snap-fit, or other methods; alternatively, the middle plate 230 and the frame 220 can be an integrally formed structure, i.e., the middle plate 230 and the frame 220 form a single structural component. The middle plate 230 divides the accommodating cavity into two independent spaces. One space is located between the light-transmitting cover 110 and the middle plate 230, and the display screen 120 is located within this space. The other space is located between the middle plate 230 and the rear cover 210, and the circuit board assembly is located within this space.

[0051] The aforementioned circuit board 400 is used to house the internal components of the electronic device 10 and to achieve electrical connections between the components. The circuit board 400 can be fixed to the middle plate 230 by means of adhesive bonding, threaded connection, soldering, snap-fit, etc. Therefore, this application does not impose any special limitations on the fixing method of the circuit board 400.

[0052] The aforementioned components are used to implement various functions of the electronic device 10. For example, the components can be control chips (e.g., system-on-chip, SOC), graphics processing units (GPUs), universal flash storage (UFS), camera modules, flash modules, as well as capacitors, resistors, inductors, etc.

[0053] Some components generate heat during operation, such as SOC chips. These heat-generating components can also be called heat-generating elements, and will be referred to as heat-generating elements in the following embodiments. To reduce the risk of damage to heat-generating elements due to excessive heat generation, a heat spreader 300 can be provided inside the housing 200 to dissipate heat from the heat-generating elements.

[0054] Specifically, please refer to Figure 3 , Figure 3 This is a structural diagram of a heat spreader 300 provided in an embodiment of this application. The heat spreader 300 may include a housing 309 and a liquid-absorbing core 303. The housing 309 includes a lower cover 301 and an upper cover 302. The liquid-absorbing core 303 is disposed inside the housing 309 and is filled with a liquid working fluid. The heating element is attached to the outer surface of the housing 309, i.e., the outer wall of the lower cover 301 or the upper cover 302.

[0055] When the heating element generates heat, the liquid working medium inside the wick 303 absorbs the heat (i.e., the evaporation end). After evaporation, the liquid working medium leaves the wick 303 and forms vapor. The vapor can flow within the space inside the outer casing 309 and reach the area away from the heating element (i.e., the condensation end). After releasing heat in this area, the vapor condenses back into liquid (i.e., the liquid working medium) and is absorbed by the wick 303. Finally, the liquid working medium inside the wick 303 flows back to the area where the heating element is located, thus forming an evaporative cooling cycle (e.g., as shown in the image). Figure 3 (As indicated by the arrow) to achieve heat dissipation.

[0056] To further improve the heat dissipation performance of the heat exchanger 300, two heat exchangers 300 can be stacked on top of each other to form a stacked heat exchanger 300 assembly. This increases the heat storage capacity of the heat exchanger 300, thereby improving its heat dissipation performance. In some embodiments, the stacked heat exchanger assembly may include two heat exchangers 300, and the outer shells 309 of the two heat exchangers 300 are bonded and fixed together by double-sided adhesive 304.

[0057] For example, please refer to Figure 4 , Figure 4 This is a structural diagram of a stacked heat exchanger assembly provided in an embodiment of this application. Two heat exchangers 300 are respectively a first heat exchanger 300a and a second heat exchanger 300b. The first heat exchanger 300a includes a first lower cover 301a, a first upper cover 302a, and a first liquid-absorbing core 303a. The second heat exchanger 300b includes a second lower cover 301b, a second upper cover 302b, and a second liquid-absorbing core 303b. The heating element can be attached to the outer wall of the first upper cover 302a.

[0058] When the heating element generates heat, the heat transfer needs to pass through the first upper cover 302a, the first absorbent core 303a, the first lower cover 301a, the double-sided adhesive 304, the second upper cover 302b, the second absorbent core 303b, and the second lower cover 301b in sequence. That is, the total thermal resistance = thermal resistance of the first upper cover 302a + thermal resistance of the first absorbent core 303a + thermal resistance of the first lower cover 301a + thermal resistance of the double-sided adhesive 304 + thermal resistance of the second upper cover 302b + thermal resistance of the second absorbent core 303b + thermal resistance of the second lower cover 301b.

[0059] Alternatively, please see Figure 5 , Figure 5 This is a structural diagram of another stacked heat exchanger assembly provided in an embodiment of this application. The stacked heat exchanger assembly may include a lower cover 301, a middle cover 305, and an upper cover 302. A sealed cavity is formed between the lower cover 301 and the middle cover 305, and a sealed cavity is formed between the upper cover 302 and the middle cover 305. Liquid absorption core 1 303a and liquid absorption core 2 303b are respectively provided in the two sealed cavities and filled with liquid working fluid, thereby forming a stacked structure.

[0060] For example, the heating element is attached to the outer wall of the upper cover 302. When the heating element generates heat, the heat needs to be transferred sequentially through the upper cover 302, the first absorbent core 303a, the middle cover 305, the second absorbent core 303b, and the lower cover 301. That is, during the heat transfer process, the total thermal resistance = thermal resistance of the upper cover 302 + thermal resistance of the first absorbent core 303a + thermal resistance of the middle cover 305 + thermal resistance of the second absorbent core 303b + thermal resistance of the lower cover 301.

[0061] Therefore, it can be seen that the heat transfer of the above-mentioned stacked heat spreader 300 assembly has a large thermal resistance during operation, which will affect the overall heat dissipation capacity and result in poor heat dissipation of the heat-generating components inside the electronic device 10.

[0062] To resolve the above issues, please refer to [link / reference]. Figure 6 , Figure 6 This is a structural diagram of another heat spreader 300 provided in an embodiment of this application. The heat spreader 300 can be applied to the aforementioned electronic device 10. The heat spreader 300 can be fixed to the middle frame of the electronic device 10 by methods such as dispensing adhesive, dispensing adhesive plus backing adhesive, or large-area backing adhesive plus local dispensing adhesive; this application does not impose any special limitations on these methods. The heat spreader 300 includes a housing 309, a first liquid-absorbing core 330, and at least one second liquid-absorbing core 340.

[0063] The outer casing 309 includes a first cover plate 310 and a second cover plate 320, which are fastened together to form a cavity. The first cover plate 310 includes an evaporation region 311 and a condensation region 312. A first absorbent core 330 is disposed inside the outer casing 309, adhering to the first cover plate 310 and spaced apart from the second cover plate 320, covering the evaporation region 311 and the condensation region 312. A second absorbent core 340 is disposed inside the outer casing 309, covering the evaporation region 311, and is stacked on top of the first absorbent core 330.

[0064] In some embodiments, please continue reading Figure 6 The second absorbent core 340 can also be located on the side of the first absorbent core 330 away from the first cover plate 310. Alternatively, please refer to... Figure 7 , Figure 7 This is a structural diagram of another heat spreader 300 provided in an embodiment of this application. The second absorbent core 340 can be disposed between the first absorbent core 330 and the first cover plate 310. There can be one second absorbent core 340, or multiple second absorbent cores can be provided according to actual needs. Therefore, this application does not impose any special limitations on this. In the following embodiments, the example provided is that there is one second absorbent core 340 disposed between the first absorbent core 330 and the first cover plate 310.

[0065] In this way, based on the first liquid-absorbing core 330 disposed inside the outer casing 309, at least one second liquid-absorbing core 340 is disposed at the position corresponding to the evaporation region 311. That is, multiple layers of liquid-absorbing cores 303 are stacked in the evaporation region 311 to increase the liquid storage capacity corresponding to the evaporation region 311, thereby absorbing more heat and improving heat dissipation performance. Furthermore, since the multiple layers of liquid-absorbing cores 303 are all disposed inside the outer casing 309, the thermal resistance is small during heat transfer, thereby further improving heat dissipation performance. At the same time, since the multiple layers of liquid-absorbing cores 303 are disposed only in the space corresponding to the evaporation region 311, only the thickness of the evaporation region 311 on the first cover plate 310 needs to be increased, and the size of the condensation region 312 does not need to be increased.

[0066] In some embodiments, please continue reading Figure 7 When the first cover plate 310 and the second cover plate 320 are interlocked to form the outer shell 309, the distance between the evaporation region 311 of the first cover plate 310 and the second cover plate 320 is a first distance H1, and the distance between the condensation region 312 of the first cover plate 310 and the second cover plate 320 is a second distance H2. The first distance H1 is greater than the second distance H2. That is, the evaporation region 311 and the condensation region 312 are connected by a transition region 313 (see the embodiment below for details).

[0067] In this way, multiple layers of second liquid-absorbing cores 340 can be stacked in the evaporation area 311 of the first cover plate 310, thereby increasing the liquid storage capacity of the liquid-absorbing core 303 in the evaporation area 311, which is conducive to improving the heat absorption capacity and heat dissipation performance.

[0068] For example, the first cover plate 310 and the second cover plate 320 can be formed by stamping, that is, a stamping process is performed on the inner surfaces of the first cover plate 310 and the second cover plate 320 to form a groove structure on the inner surfaces of the first cover plate 310 and the second cover plate 320. When the two are fastened together, an outer shell 309 with an internal cavity can be formed. When the first cover plate 310 is stamped, the depth of the groove structure formed in the evaporation region 311 can be greater than the depth of the groove in the condensation region 312, so that when the first cover plate 310 and the second cover plate 320 are fastened together, the first distance can be greater than the second distance.

[0069] Furthermore, the first cover plate 310 and the second cover plate 320 can be fixed by laser welding. For example, the first cover plate 310 and the second cover plate 320 can be made of stainless steel and fixed by laser welding.

[0070] Alternatively, please see Figure 8 , Figure 8This is a structural diagram of another heat spreader 300 provided in an embodiment of this application. The first cover plate 310 and the second cover plate 320 can also be formed by etching, that is, etching is performed on the inner surfaces of the first cover plate 310 and the second cover plate 320 to form a groove structure on the inner surfaces of the first cover plate 310 and the second cover plate 320. When the two are fastened together, an outer shell 309 with an internal cavity can be formed. When etching the first cover plate 310, groove structures of different depths can be formed, so that when the first cover plate 310 and the second cover plate 320 are fastened together, the first distance can be greater than the second distance.

[0071] Furthermore, the first cover plate 310 and the second cover plate 320 can be fixedly connected by solder paste. For example, the first cover plate 310 and the second cover plate 320 can be made of copper and fixedly connected by solder paste.

[0072] Furthermore, the first absorbent core 330 and the second absorbent core 340 can be fixed to the first cover plate 310 by spot welding, which helps to further improve the overall structural strength. Also, the first absorbent core 330 and the second absorbent core 340 can be absorbent cores 303 with different densities (different mesh counts).

[0073] For example, please see Figure 9 , Figure 9 This diagram illustrates the density of the first absorbent core 330 and the second absorbent core 340 provided in this embodiment. The second absorbent core 340 can be a high-mesh absorbent core 303, while the first absorbent core 330 can be a low-mesh absorbent core 303. Because the second absorbent core 340 has a higher mesh count, the bubbles generated by the evaporation of the liquid working fluid within it are smaller, meaning its flow channel space is smaller. Conversely, the first absorbent core 330 has a lower mesh count, therefore, the bubbles generated by the evaporation of the liquid working fluid within it are larger, meaning its flow channel space is larger. Thus, the smaller bubbles generated within the second absorbent core 340 can compress the larger bubbles within the first absorbent core 330, thereby promoting the evaporation cycle and improving evaporation efficiency.

[0074] In other possible examples, the second absorbent core 340 can also be a low-mesh absorbent core 303, and the first absorbent core 330 can be a high-mesh absorbent core. In this case, since the permeability of the absorbent core 303 decreases with increasing mesh size (i.e., the high-mesh absorbent core has lower permeability), using a low-mesh second absorbent core 340 and a high-mesh first absorbent core 330 helps reduce flow resistance, thereby reducing the risk of the absorbent cores drying out.

[0075] Because the first absorbent core 330 and the second cover plate 320 are spaced apart, the liquid working fluid, after absorbing heat and forming vapor, can flow within the space between them. To prevent this space from gradually decreasing during use, please refer back to the previous section. Figure 7 and Figure 8 The temperature equalization plate 300 provided in this application embodiment also includes a plurality of support columns 350, which are disposed on the inner wall of the second cover plate 320, and the free ends of the support columns 350 abut against the first liquid absorption core 330.

[0076] Based on this, by providing multiple support pillars 350 between the second cover plate 320 and the first absorbent core 330, effective support can be formed between the second cover plate 320 and the first absorbent core 330, preventing the first cover plate 310 or the second cover plate 320 from becoming recessed, which would reduce the space between the first absorbent core 330 and the second cover plate 320. Furthermore, by having the support pillars 350 abut against the first absorbent core 330, it can be ensured that the first absorbent core 330 and the second absorbent core 340 are in close contact with the first cover plate 310, preventing them from separating and thus ensuring effective heat dissipation.

[0077] In some embodiments, the plurality of support columns 350 includes a plurality of first support columns 351 and a plurality of second support columns 352. The vertical projections of the plurality of first support columns 351 on the first cover plate 310 are located within the evaporation region 311, and the vertical projections of the plurality of second support columns 352 on the first cover plate 310 are located within the condensation region 312. The spacing between two adjacent first support columns 351 is greater than the spacing between two adjacent second support columns 352.

[0078] Please refer to this. Figure 10 , Figure 10 This diagram illustrates the spacing between the first support column 351 and the second support column 352 provided in this embodiment. When steam flows from the area containing the first support column 351 to the area containing the second support column 352, the larger spacing between the first and second support columns (i.e., the smaller cross-sectional area for steam flow) increases the steam velocity. Experiments have shown that this structure can increase the steam velocity by 85%. Therefore, heat can flow rapidly to the space corresponding to the condensation area 312. When the steam condenses into a liquid state, it is absorbed by the liquid-absorbing core 303, thus continuing the cycle.

[0079] Furthermore, the diameter of the first support column 351 can be larger than the diameter of the second support column 352. This structure helps to improve the support strength of the first support column 351, ensuring that the first liquid-absorbing core 330 and the second liquid-absorbing core 340 fit together and contact the first cover plate 310, thereby guaranteeing the heat absorption and evaporation efficiency.

[0080] Furthermore, the length of the first support column 351 can also be greater than the length of the second support column 352 (e.g., Figure 8 (As shown). Within the evaporation zone 311, the distance between the first wick 330 and the second cover plate 320 is the third distance H3; within the condensation zone 312, the distance between the first wick 330 and the second cover plate 320 is the fourth distance H4, and the third distance H3 is greater than the fourth distance H4. This structure allows for a larger space corresponding to the evaporation zone 311, enabling it to hold more steam and thus further improving evaporation efficiency.

[0081] In other embodiments, please refer to Figure 11 and Figure 12 , Figure 11 This is a structural diagram of a second absorbent core provided in an embodiment of this application. Figure 12 This is a structural diagram of a second cover plate 320 provided in an embodiment of this application. The aforementioned second liquid-absorbing core 340 may include a first region 341 and a second region 342. The first region 341 covers the evaporation region 311 of the first cover plate 310, and the second region 342 is attached to the condensation region 312, extending to the end of the condensation region 312 away from the evaporation region 311. The second support columns 352 are all disposed in the area of ​​the second region 342 outside the vertical projection on the second cover plate 320.

[0082] In this way, by placing the second region 342 of the second liquid-absorbing core 340 in the condensation region 312, and without placing the second support column 352 in the corresponding region, a vapor channel can be formed between the second region 342 and the second cover plate 320. On the one hand, the liquid absorption capacity of the condensation region 312 can be improved through the second region 342; on the other hand, there is no vapor resistance in this vapor channel, which is conducive to rapid vapor flow, thereby improving the evaporative cooling cycle efficiency.

[0083] For example, please continue reading Figure 11 and Figure 12 The end of the second region 342 of the second liquid-absorbing core 340 that is connected to the first region 341 can be located at the position closest to the heat source (i.e. the heating element), so that some of the heat can flow quickly to the condensation region 312 through the steam channel formed between the second region 342 and the second cover plate 320 and be cooled into liquid to improve the circulation efficiency.

[0084] Based on this, since the evaporation region 311 and the condensation region 312 of the first cover plate 310 are not on the same plane, the first cover plate 310 also includes a transition region 313 (e.g., Figure 7 and Figure 8 As shown, the transition region 313 forms an acute angle with the second cover plate 320, i.e., 0 to 90°. Furthermore, the length of the transition region 313 is in the range of 0.3 mm to 5 mm along the direction from the evaporation region 311 to the condensation region 312.

[0085] For example, please refer to Figure 13 , Figure 13 This is a structural diagram of a first cover plate 310 provided in an embodiment of this application. The transition region 313 can form a straight line structure, that is, extend in one direction. Alternatively, please refer to... Figure 14 , Figure 14 This is a structural diagram of another first cover plate 310 provided in an embodiment of this application. The transition region 313 can also be a bent structure, that is, it extends in multiple directions. Thus, the first cover plate 310 can be divided into an evaporation region 311 and a condensation region 312 through the transition region 313. Therefore, the specific structure of the transition region 313 in this application is not particularly limited.

[0086] In this way, the transition region 313 is extended at an angle, so that the part of the first liquid-absorbing core 330 that is attached to the transition region 313 can better fit with the transition region 313, so as to ensure that the part of the first liquid-absorbing core 330 that is attached to the transition region 313 will not generate large resistance, so as to ensure that the liquid working fluid can flow normally.

[0087] Furthermore, to avoid a loose fit between the portion of the first absorbent core 330 and the transition region 313, please refer to [the relevant documentation] in some embodiments. Figure 15 , Figure 15 This is a partial structural diagram of a connection method between the transition region 313 and the first liquid-absorbing core 330 provided in the embodiment of this application. Spot welding can be performed between the transition region 313 and the first liquid-absorbing core 330 to ensure that the first liquid-absorbing core 330 and the transition region 313 are tightly fitted, so that the liquid working fluid in the first liquid-absorbing core 330 can absorb heat and evaporate normally.

[0088] In other embodiments, please refer to Figure 16 , Figure 16This is a partial structural diagram illustrating another connection method between the transition region 313 and the first absorbent core 330 provided in this embodiment. The plurality of support pillars 350 may further include a third support pillar 353, whose vertical projection on the first cover plate 310 is located within the transition region 313. That is, the third support pillar 353 abuts against the first absorbent core 330, thereby ensuring a tight fit between the first absorbent core 330 and the transition region 313. Simultaneously, the third support pillar 353 provides support to the transition region 313, which helps to further improve the reliability of the overall structure.

[0089] For example, the surface of the third support column 353 facing the transition region 313 is an abutment surface 353a, which can be arranged parallel to the transition region 313. That is, the third support column 353 and the first absorbent core 330 can form a surface-to-surface contact, which helps to increase the contact area between the third support column 353 and the first absorbent core 330, thereby helping to ensure that the first absorbent core 330 and the transition region 313 are tightly fitted.

[0090] Furthermore, the aforementioned third support column 353 can be provided as one or multiple. When only one third support column 353 is provided, it can be placed in the middle of the transition area 313 to ensure stable support. When multiple third support columns 353 are provided, they can be distributed at intervals.

[0091] In addition, please see Figure 17 , Figure 17 This is a partial structural diagram illustrating another connection method between the transition region 313 and the first absorbent core 330 provided in this embodiment. The contact surface 353a of the third support column 353 can extend from the edge of the transition region 313 near the evaporation region 311 to the edge of the transition region 313 near the condensation region 312. This further increases the contact area between the contact surface 353a and the first absorbent core 330, thereby further improving the support effect.

[0092] In other possible examples, the end of the third support column 353 that abuts against the first absorbent core 330 may also be a circular structure, a square structure, etc. Therefore, this application does not impose any special limitations on this.

[0093] Based on this, to further improve the heat dissipation effect of the aforementioned heat spreader 300, multiple heat dissipation holes 321 can be formed on the outer wall of the second cover plate 320. Each heat dissipation hole 321 corresponds to one of the support columns 350, and extends along the axial direction of the support columns 350. That is, each support column 350 has a hollow structure in its center, which helps to increase the contact area between the outer wall of the second cover plate 320 and the external air, thereby further improving heat dissipation efficiency and enhancing the heat dissipation performance of the heat spreader 300.

[0094] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0095] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A vapor chamber, characterized by, The shell comprises a first cover plate and a second cover plate fixed by welding; The first cover plate comprises a first region and a second region, the distance between the first region and the second cover plate is a first distance, and the distance between the second region and the second cover plate is a second distance; the first distance is greater than the second distance; The first region and the second region are connected by a transition region; A plurality of support columns are arranged on the second cover plate; The plurality of support columns comprise a plurality of first support columns, a plurality of second support columns, and a plurality of third support columns; the vertical projection of the plurality of first support columns on the first cover plate is located in the first region; the vertical projection of the plurality of second support columns on the first cover plate is located in the second region; the plurality of third support columns are distributed along the length direction of the transition region; the outer wall of the second cover plate is provided with a plurality of heat dissipation holes corresponding to the plurality of support columns, and the plurality of heat dissipation holes extend along the axial direction of the support columns. The plurality of third support columns are integrally formed with the second cover plate.

2. The vapor chamber of claim 1, wherein, The plurality of third support columns are recessed from the second cover plate towards the first cover plate.

3. The vapor chamber of claim 2, wherein, Further comprising a first liquid absorption core arranged in the shell.

4. The vapor chamber of any one of claims 1-3, wherein, Further comprising at least one second liquid absorption core arranged in a stacked manner with the first liquid absorption core.

5. The vapor chamber of claim 4, wherein, The at least one second liquid absorption core is arranged between the first liquid absorption core and the first cover plate.

6. The vapor chamber of claim 5, wherein, The at least one second liquid absorption core is arranged at a position corresponding to the first region.

7. The vapor chamber of claim 6, wherein, The first liquid absorption core and the second liquid absorption core have different mesh counts.

8. The vapor chamber of any one of claims 5-7, wherein, The second liquid absorption core adopts a high-mesh liquid absorption core, and the first liquid absorption core adopts a low-mesh liquid absorption core.

9. The vapor chamber of claim 8, wherein, The diameter of the first support column is greater than the diameter of the second support column.

10. The uniform heat spreader of any of claims 1-3, 5-7, or 9, wherein, The diameter of the first support column is greater than the diameter of the second support column.

11. The vapor chamber of claim 4, wherein, The diameter of the first support column is greater than the diameter of the second support column.

12. The vapor chamber of claim 8, wherein, The length of the first support column is greater than the length of the second support column.

13. The vapor chamber of any one of claims 1-3, 5-7, 9, or 11-12, wherein, The length of the first support column is greater than the length of the second support column.

14. The vapor chamber of claim 4, wherein, The length of the first support column is greater than the length of the second support column.

15. The vapor chamber of claim 8, wherein, The length of the first support column is greater than the length of the second support column.

16. The vapor chamber of claim 10, wherein, The length of the first support column is greater than the length of the second support column.

17. The vapor chamber of claim 13, wherein, The length of the first support column is greater than the length of the second support column.

18. The vapor chamber of any one of claims 1-3, 5-7, 9, 11-12, or 14-17, wherein, The spacing between the plurality of first support columns is greater than the spacing between the plurality of second support columns.

19. The vapor chamber of claim 4, wherein, The spacing between the plurality of first support columns is greater than the spacing between the plurality of second support columns.

20. The vapor chamber of claim 8, wherein, The spacing between the plurality of first support columns is greater than the spacing between the plurality of second support columns.

21. The vapor chamber of claim 10, wherein, The spacing between the plurality of first support columns is greater than the spacing between the plurality of second support columns.

22. The vapor chamber of claim 13, wherein, The spacing between the plurality of first support columns is greater than the spacing between the plurality of second support columns.

23. The vapor chamber of any one of claims 5-7, wherein, The first liquid absorption core and the second liquid absorption core are fixed to the first cover plate by spot welding.

24. The vapor chamber of claim 8, wherein, The first liquid absorption core and the second liquid absorption core are fixed to the first cover plate by spot welding.

25. The vapor chamber of claim 12 or 15, wherein, The first wicking core and the second wicking core are fixed to the first cover plate by spot welding.

26. The vapor chamber of claim 4, wherein, An end of the third support column abutting against the first wicking core is in a circular structure or a square structure.

27. The vapor chamber of any one of claims 5-7, wherein, An end of the third support column abutting against the first wicking core is in a circular structure or a square structure.

28. The vapor chamber of claim 8, wherein, An end of the third support column abutting against the first wicking core is in a circular structure or a square structure.

29. The vapor chamber of any one of claims 9, 11-12, or 14-15, wherein, An end of the third support column abutting against the first wicking core is in a circular structure or a square structure.

30. The vapor chamber of any one of claims 1-3, 5-7, 9, 11-12, 14-17, 19-22, 24, 26, or 28, wherein, The first cover plate and the second cover plate are formed by stamping.

31. The vapor chamber of claim 4, wherein, The first cover plate and the second cover plate are formed by stamping.

32. The vapor chamber of claim 8, wherein, The first cover plate and the second cover plate are formed by stamping.

33. The vapor chamber of claim 10, wherein, The first cover plate and the second cover plate are formed by stamping.

34. The vapor chamber of claim 13, wherein, The first cover plate and the second cover plate are formed by stamping.

35. The vapor chamber of claim 18, wherein, The first cover plate and the second cover plate are formed by stamping.

36. The vapor chamber of claim 23, wherein, The first cover plate and the second cover plate are fixed by laser welding.

37. The vapor chamber of any one of claims 1-3, wherein, The first cover plate and the second cover plate are fixed by laser welding.

38. The vapor chamber of claim 8, wherein, The first cover plate and the second cover plate are fixed by laser welding.

39. The vapor chamber of claim 10, wherein, A surface of the third support column facing the second region is an abutting surface, which extends from an edge of the transition region close to the first region to an edge of the transition region close to the second region.

40. The vapor chamber of any one of claims 1-3, wherein, A surface of the third support column facing the second region is an abutting surface, which extends from an edge of the transition region close to the first region to an edge of the transition region close to the second region.

41. The vapor chamber of claim 4, wherein, A surface of the third support column facing the second region is an abutting surface, which extends from an edge of the transition region close to the first region to an edge of the transition region close to the second region.

42. The vapor chamber of claim 8, wherein, A surface of the third support column facing the second region is an abutting surface, which extends from an edge of the transition region close to the first region to an edge of the transition region close to the second region.

43. The vapor chamber of claim 10, wherein, A surface of the third support column facing the second region is an abutting surface, which extends from an edge of the transition region close to the first region to an edge of the transition region close to the second region.

44. The vapor chamber of claim 13, wherein, A surface of the third support column facing the second region is an abutting surface, which extends from an edge of the transition region close to the first region to an edge of the transition region close to the second region.

45. The vapor chamber of claim 18, wherein, The abutting surface and the second region are arranged in parallel to each other.

46. The vapor chamber of any one of claims 1-3, wherein, An included angle between the transition region and the second cover plate is an acute angle.

47. The vapor chamber of any one of claims 1-3, wherein, The length of the transition region is in a range of 0.3mm-5mm.

48. The vapor chamber of any one of claims 1-3, wherein, The length of the transition region is in a range of 0.3mm-5mm.

49. The vapor chamber of claim 4, wherein, The length of the transition region is in a range of 0.3mm-5mm.

50. The vapor chamber of any one of claims 5-7, wherein, The length of the transition region is in a range of 0.3mm-5mm.

51. The vapor chamber of claim 13, wherein, The length of the transition region is in a range of 0.3mm-5mm.

52. The vapor chamber of claim 18, wherein, The length of the transition region is in a range of 0.3mm-5mm.

53. The vapor chamber of claim 27, wherein, The third support column corresponds to the heat dissipation hole, the transition region, part of the first region and part of the second region, respectively.

54. The vapor chamber of any one of claims 1-3, wherein, ​ 55. The vapor chamber of claim 4, wherein, The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively.

56. The vapor chamber of claim 10, wherein, The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively.

57. The vapor chamber of claim 13, wherein, The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively.

58. A vapor chamber, characterized by, Comprise: The shell comprises a first cover plate and a second cover plate, and the first cover plate and the second cover plate are fixed by welding; The first cover plate comprises a first area and a second area, and the first area and the second area are not in the same plane; The first area and the second area are connected through a transition area; A plurality of support columns are arranged on the second cover plate; The plurality of support columns comprise a plurality of first support columns, a plurality of second support columns and a plurality of third support columns, the vertical projection of the plurality of first support columns on the first cover plate is located in the first area; the vertical projection of the plurality of second support columns on the first cover plate is located in the second area; the plurality of third support columns are distributed along the length direction of the transition area, and the outer wall of the second cover plate is provided with a plurality of heat dissipation holes, the plurality of heat dissipation holes are arranged one by one corresponding to the plurality of support columns, and the plurality of heat dissipation holes extend along the axial direction of the support column.

59. The vapor chamber of claim 58, wherein, Further comprising a first liquid absorption core, the first liquid absorption core is arranged in the shell.

60. The vapor chamber of claim 59, wherein, Further comprising at least one second liquid absorption core, the at least one second liquid absorption core is arranged in the shell.

61. The vapor chamber of claim 60, wherein, The at least one second liquid absorption core is arranged between the first liquid absorption core and the first cover plate.

62. The vapor chamber of claim 60, wherein, The at least one second liquid absorption core is arranged in the first area.

63. The vapor chamber of any of claims 58-62, wherein, The first liquid absorption core and the second liquid absorption core have different mesh numbers.

64. The vapor chamber of any of claims 60-62, wherein, The second liquid absorption core adopts a high-mesh liquid absorption core, and the first liquid absorption core adopts a low-mesh liquid absorption core.

65. An electronic device, comprising: The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively.

66. The electronic device of claim 65, wherein, The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively. The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively. Comprise: The shell comprises a first cover plate and a second cover plate, and the first cover plate and the second cover plate are fixed by welding; The first cover plate comprises a first area and a second area, and the first area and the second area are not in the same plane; The first area and the second area are connected through a transition area; A plurality of support columns are arranged on the second cover plate; The plurality of support columns comprise a plurality of first support columns, a plurality of second support columns and a plurality of third support columns, the vertical projection of the plurality of first support columns on the first cover plate is located in the first area; the vertical projection of the plurality of second support columns on the first cover plate is located in the second area; the plurality of third support columns are distributed along the length direction of the transition area, and the outer wall of the second cover plate is provided with a plurality of heat dissipation holes, the plurality of heat dissipation holes are arranged one by one corresponding to the plurality of support columns, and the plurality of heat dissipation holes extend along the axial direction of the support column. Further comprising a first liquid absorption core, the first liquid absorption core is arranged in the shell. Further comprising at least one second liquid absorption core, the at least one second liquid absorption core is arranged in the shell. The at least one second liquid absorption core is arranged between the first liquid absorption core and the first cover plate. The at least one second liquid absorption core is arranged in the first area. The first liquid absorption core and the second liquid absorption core have different mesh numbers. The second liquid absorption core adopts a high-mesh liquid absorption core, and the first liquid absorption core adopts a low-mesh liquid absorption core. The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively. The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively. The heat dissipation hole corresponding to the third support column is opposite to the transition area, part of the first area and part of the second area respectively. Comprise: The shell comprises a first cover plate and a second cover plate, and the first cover plate and the second cover plate are fixed by welding; The first cover plate comprises a first area and a second area, and the first area and the second area are not in the same plane; The first area and the second area are connected through a transition area; A plurality of support columns are arranged on the second cover plate; The plurality of support columns comprise a plurality of first support columns, a plurality of second support columns and a plurality of third support columns, the vertical projection of the plurality of first support columns on the first cover plate is located in the first area; the vertical projection of the plurality of second support columns on the first cover plate is located in the second area; the plurality of third support columns are distributed along the length direction of the transition area, and the outer wall of the second cover plate is provided with a plurality of heat dissipation holes, the plurality of heat dissipation holes are arranged one by one corresponding to the plurality of support columns, and the plurality of heat dissipation holes extend along the axial direction of the support column.

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