Optical system and lithography system

Abstract

The invention relates to an optical system (200) for a lithographic system (1), comprising a plurality of optical elements (202) for guiding radiation (204), a support device (208) for supporting the optical elements (202), and a plurality N of active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 111, 111, 111 4) wherein the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 111, 111 4) are arranged in at least two different planes (E1-E9) on the support device (208), wherein the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 111, 111, 111) are arranged on a side (212) of the support device (208).

Description

Technical Field

[0001] The present invention relates to an optical system and a lithographic apparatus having such an optical system.

[0002] The content of the priority application DE 10 2023 200 235.3 is incorporated herein by reference in its entirety. Background Art

[0003] Microlithography is used to produce microstructured component parts, such as integrated circuits. Microlithography processes are performed using a lithography apparatus comprising an illumination system and a projection system. An image of a mask (reticle) illuminated by the illumination system is projected by means of the projection system onto a substrate (e.g., a silicon wafer) coated with a photosensitive layer (photoresist) and arranged in the image plane of the projection system, in order to transfer the mask structure to the substrate's photosensitive coating.

[0004] Driven by the desire for ever-smaller structures in the production of integrated circuits, EUV lithography equipment is currently being developed that uses light with a wavelength in the range of 0.1 nm to 30 nm, particularly 13.5 nm. Since most materials absorb light at this wavelength, such EUV lithography equipment requires the use of reflective optical elements, i.e. mirrors, rather than the refractive optical elements, i.e. lens elements, used previously.

[0005] The use of so-called MEMS mirrors in the illumination systems of lithographic apparatuses is known. "MEMS" stands for "micro-electromechanical systems." Such MEMS mirrors consist of optical elements (referred to as micromirrors) and actuators. The actuators allow the alignment of the optical elements to be varied. During operation of the lithographic apparatus, working light (particularly EUV light) is incident on and reflected from the surfaces of the optical elements. Changing the alignment of the optical elements influences the path taken by the EUV light through the illumination system.

[0006] Such MEMS mirrors are typically manufactured in an integrated manner on a substrate. Advantageously, such systems require very little space. However, this often results in considerable space constraints for the electronics in the area behind the MEMS mirror, i.e., on the side facing away from the operating light. Furthermore, a significant amount of heat is generated in this area and must be regularly dissipated to reduce or prevent thermal deformation in the area of the MEMS mirror. Summary of the Invention

[0007] Against this background, it is an object of the present invention to provide an improved optical system.

[0008] According to a first aspect, an optical system for a lithographic apparatus is provided. The optical system comprises:

[0009] multiple optical elements for directing the radiation,

[0010] a supporting device for supporting the optical element, and

[0011] multiple, N, active and / or passive components,

[0012] Therein, the active components and / or the passive components are arranged in at least two different planes on or in the supporting device.

[0013] Advantageously, the arrangement of active and / or passive components in two different planes results in an improved, in particular three-dimensional, utilization of the installation space.

[0014] In particular, it can be provided that the active and / or passive components are arranged in at least two different planes on the support device, the active and / or passive components being arranged on one side of the support device.

[0015] These measures or measures result in a high packing density of active and / or passive components and good accessibility for mounting purposes.

[0016] In other words, the active and / or passive components are arranged on the same side of the support device. For example, all or only a subset of the active and / or passive components may be arranged on the same side of the support device. Thus, in some embodiments, the active and / or passive components are arranged one after another or one above the other on the same side of the support device, perpendicularly relative to the main surface plane of the support device. This side (having the active and / or passive components in at least two different planes) is, in particular, the side of the support device facing away from the optical element. This side may be bounded by a continuous material layer of the support device and another side (in particular, having the optical element). In other words, the active and / or passive components are located in at least two different planes on one side of the continuous material layer (in particular, a substrate layer), and the optical element is located on the other side of the continuous material layer. The active and / or passive components may be arranged next to the support device and / or directly adjacent to (i.e., in contact with) the support device, in particular, the material layer. For example, a first subset of active and / or passive components can be arranged in a first plane directly adjacent to a support device (or a continuous material layer thereof), while a second subset of active and / or passive components can be arranged in a second plane adjacent to the support device (or a continuous material layer thereof) and, if appropriate, indirectly connected to the support device (e.g., via a bridge or support arm located therebetween). The second subset of active and / or passive components is preferably arranged adjacent to the first subset of active and / or passive components. The first and / or second subsets (like the other subsets described above) can, for example, each include ≥ 1, 2, 10, or 100 active and / or passive components.

[0017] There may be ≥ 1, 2, 10 or 100 optical elements. For example, the optical elements are mirrors, in particular faceted mirrors and / or micromirrors, or lens elements. The guided radiation may be EUV or DUV light.

[0018] (In particular each) optical element is preferably assigned at least one actuator / sensor device (short form of "actuator and / or sensor device"), the respective actuator / sensor device being configured to displace the assigned optical element and / or to measure a parameter of the assigned optical element, in particular the position of the assigned optical element or the temperature in the region of the assigned optical element.

[0019] The actuator / sensor device (particularly each) is, for example, an actuator element (or actuator) for actuating an optical element, a sensor for sensing a parameter (e.g., position or temperature) of an optical element or a surrounding area within an optical system, or an actuator and sensor device for actuating and sensing within an optical system. Preferably, the actuator is an actuator utilizing the electrostrictive effect or an actuator utilizing the piezoelectric effect, such as a PMN actuator (PMN; lead magnesium niobate) or a PZT actuator (PZT; lead zirconate titanate).

[0020] The support device may be in the form of a substrate. The substrate may, in particular, comprise a ceramic, such as aluminum nitride. The support device supports the optical element. Furthermore, it may have one or more further functions. For example, the support device may have electrical connections. For example, the electrical connections may be in the form of through-holes. One or more of the through-holes may be arranged to ensure vacuum tightness of the support device (e.g., there are no through-holes through the support device, but rather blind and / or buried through-holes). (In particular, each) of the aforementioned actuator / sensor devices may be electrically coupled via the electrical connections (through-holes) of the support device. However, the actuators and / or sensors do not absolutely need to be coupled via the support device.

[0021] "On a support device" should be understood to mean that the active and / or passive components are indirectly or directly fastened to the support device. "Indirectly" means that the active and / or passive components are fastened, in particular electrically contacted, with the interposition of at least one additional element (e.g., a bridge or a cantilever, as described in more detail later). "Directly" means that one or more active and / or passive components are fastened, in particular electrically contacted, adjacent to the support device, i.e., without the interposition of additional elements. "In" the support device means that the support device forms an open or closed interior space in which one or more active and / or passive components are arranged. An example of an open interior space is a pocket formed in a side surface of the support device. An example of a closed interior space is a closed chamber or a closed housing formed in the support device. In addition to one or more active and / or passive components, the interior space may also include a free volume in which a vacuum or ambient pressure (atmospheric pressure) prevails.

[0022] The number N of active and / or passive components is ≥ 1, 2, 5 or 10. Active and / or passive components may also be referred to as active and / or passive component parts, silicon-based elements, electronic components or electronic parts.

[0023] At least two planes can differ from one another in that they are spaced apart in space and / or arranged at an angle relative to one another (i.e., not equal to 0°). For example, the planes can be arranged at an angle of 0° to 90° (inclusive). The respective planes preferably relate to areas where the respective active and / or passive components have electrical connectors for electrical connection to the periphery. These electrical connectors can be in the form of contacts, contact pins, solder points, SMD (surface mount device) contacts, etc. Therefore, the arrangement of the active and / or passive components in at least two different planes is not simply a result of the components having, for example, different heights. Rather, the focus should be on the height or angular offset between the respective, particularly flat, contact connection planes.

[0024] According to one embodiment, the at least two different planes are parallel to each other.

[0025] In this case, the parallel planes differ in being offset from each other in a direction perpendicular to the two planes.

[0026] According to a further embodiment, at least two of the active and / or passive components overlap.

[0027] As viewed in a direction perpendicular to at least one of the two different planes, at least two active and / or passive components preferably overlap. Such an overlap allows for particularly high utilization of the installation space.

[0028] According to another embodiment, the plurality of optical elements is arranged on the first side (or further side or another side) of the supporting device.

[0029] In the present case, the first side is also referred to as the “front side.” This is the side of the support device that faces the radiation (working light).

[0030] According to another embodiment, at least a subset of the active components and / or passive components are arranged on the second (or one side) of the support device, on or below a bridge on the second (or one side) of the support device, on or below a cantilever on the second (or one side) of the support device, or in the inner space of the support device.

[0031] The second (or one) side surface can be the back side surface of the support device. "Back side surface" refers to the side surface opposite and facing away from the front side surface. In some embodiments, the second side surface can also be a side surface of the support device that is perpendicular to the front side surface or arranged at a different angle.

[0032] "On" the bridge means that one or more active and / or passive components can be located on any portion of the bridge, whether on its supports or spans. "Below" means that one or more active and / or passive components are located below the span of the bridge on the second side of the support device. In other words, the span of the bridge overlaps or is coincident with the corresponding active and / or passive component (when viewing the bridge from above).

[0033] The cantilever preferably has a foot portion, with which it is supported on the second side of the support device. The opposite end (i.e., the other end) of the cantilever is free. In the present context, "on" the cantilever means that one or more active and / or passive components can be arranged on any part of the cantilever, whether on its foot portion or on its self-supporting portion. "Below" means that one or more active and / or passive components are arranged below the self-supporting portion of the cantilever on the second side of the support device. In other words, the self-supporting portion of the cantilever overlaps or is coincident with the corresponding active and / or passive component (when the cantilever is viewed from above).

[0034] "Interior space" includes both open and closed interior spaces. An interior space may also be partially closed.

[0035] According to a further embodiment, at least a subset of the active and / or passive components is arranged on a top side of the bridge or the cantilever and / or on a bottom side of the bridge or the cantilever.

[0036] The "top side" of the bridge is the side of the bridge facing away from the second side of the support device; the "bottom side" of the bridge is the side of the bridge facing the second side of the support device. The same applies to the cantilever.

[0037] According to a further embodiment, a first active and / or passive component is arranged on the bridge or the cantilever and a second active and / or passive component is arranged below the bridge or the cantilever.

[0038] This provides a particularly compact design.

[0039] According to another embodiment, the supporting device is made of a composite material forming at least one housing containing at least one of the active components and / or the passive components.

[0040] This measure also provides a particularly compact design.

[0041] According to another embodiment, a first subset N1 of active and / or passive components is arranged on the second side (or the one side) of the supporting device, a second subset N2 of active and / or passive components is arranged on or below a bridge arranged on the second side (or the one side) of the supporting device, or on or below a cantilever arranged on the second side (or the one side) of the supporting device, and a third subset N3 of active and / or passive components is arranged in the internal space of the supporting device, wherein preferably N=N1+N2+N3.

[0042] According to another embodiment, the bridge or the cantilever is made of ceramic.

[0043] The ceramic may comprise aluminum nitride, for example. The bridge and / or the cantilever may be produced in an integrated manner together with the support device. This means that methods for producing microelectronic devices, such as vapor deposition methods, are used to produce, for example, the corresponding layer structures.

[0044] According to another embodiment, the N active and / or passive components include integrated circuits, processors, microprocessors, FPGAs, analog-to-digital converters, digital-to-analog converters, transistors (more particularly MOSFETs), capacitors, resistors, inductors and / or contact connection means (more particularly plugs or sockets).

[0045] The contact-connecting device is designed in particular for contact-connecting a printed circuit board or for electrically connecting the printed circuit board.

[0046] The circuit board preferably includes conductor tracks made of an electrically insulating material. The conductor tracks can be embedded in the electrically insulating material and / or adhered to the electrically insulating material. As explained in more detail later, one or more active and / or passive components can be provided on or in the circuit board. The circuit board is used to mechanically fasten and electrically connect these electronic components. The electrically insulating material can be, for example, fiber-reinforced plastic, cardboard, and / or (particularly sintered) ceramic. The conductor tracks can be etched from a thin copper layer. The electronic components can be soldered or pressed onto pads or soldering areas of the circuit board.

[0047] The circuit board can be rigid and / or flexible. In particular, it can be installed in the optical system in a warped state. To this end, the circuit board can be, for example, in the form of a rigid-flex board or a flexible board with or without reinforcement elements. This can be advantageous given the common space constraints of the installation.

[0048] The circuit board can be made of a composite material. In particular, the circuit board includes K plies forming a composite material, and includes two outer plies and M inner plies arranged between the two outer plies, for example, a housing can be formed in the area of the M inner plies. In some embodiments, the M inner plies are formed by an alternating sequence of metal layers and insulator layers. For example, the metal layers are made of copper. For example, the insulator layers are made of a fiberglass substrate and / or epoxy resin. For example, the outer plies are in the form of metal layers suitable for heat dissipation. The corresponding outer plies or outer layers can also be in the form of an insulating layer, preferably an anti-degassing plastic film or lacquer.

[0049] The circuit board can be in sheet form. For example, the thickness of the circuit board can be less than 1 cm, less than 0.5 cm, or less than 0.3 cm. The circuit board can also have different geometric shapes. For example, the circuit board can be in strip form and / or designed to have a rectangular, circular, or other cross-section.

[0050] The circuit board may for example extend perpendicularly relative to the main extent plane of the supporting device. In the present case, "perpendicularly" also includes deviations from the exact vertical up to 20°, preferably up to 10°, more preferably up to 5°.

[0051] The printed circuit board can be or in particular be electrically connected at one end thereof to a contact-connection device (in the present case also a "first" contact-connection device). At its other end, in particular the opposite end, the printed circuit board can be electrically connectable or electrically connected to another contact-connection device (hereinafter also referred to as a "second" contact-connection device).

[0052] According to another embodiment, the contact-connecting device can be electrically connected to the printed circuit board, wherein the contact-connecting device is arranged on the bridge or on the extension arm.

[0053] This produces a space-saving electrical connection between the printed circuit board and the supporting device.

[0054] According to one embodiment, the circuit board can be detachably electrically connected to the contact-connection device.

[0055] Accordingly, when the circuit board has a defect, the circuit board can be easily replaced.

[0056] According to a further embodiment, the contact connection device is in the form of a socket or a plug.

[0057] Such a plug-in connector can be easily connected.In particular, the circuit board can have a circuit board connector, also called a card edge connector, peripheral connector or edge connector.

[0058] According to a further embodiment, the contact-connection device has a plurality of springs and / or spring contact pins or contact points which can be contacted thereby.

[0059] One or more springs (or spring contact pins) secure the electrical contact by applying pressure or frictional engagement. Such a contact point may be referred to as a "landing pad." For example, the springs and / or spring contact pins may be attached to the circuit board, and the contact point may be attached to the supporting device, or vice versa. The former has the advantage that if one or more of the springs or spring contact pins fails, the circuit board containing the failed spring or pins can be easily replaced.

[0060] According to a further embodiment, the contact-connection device has an integral interface.

[0061] Such a contact connection device advantageously takes up only a small amount of structural space and has a high reliability. The integral interface can be in the form of a plug-in component and / or can be soldered to a circuit board or a supporting device.

[0062] According to a further embodiment, the circuit board has a plurality of active and / or passive components and / or can be electrically connected thereto.

[0063] Active or passive components can be arranged, in particular mounted, on or in a circuit board. There can be ≥1, 2, 5 or 10 active or passive components. In the present case, "mounting" can include, for example, soldering or gluing with a conductive adhesive.

[0064] According to a further embodiment, the optical system comprises a housing device, which is preferably thermally conductively connected to at least one of the active and / or passive components.

[0065] This allows the accumulated heat to be released efficiently.

[0066] A plurality of active and / or passive components may be arranged or mounted on the backside of the support device. These components may be thermally coupled to the housing device, particularly to the end faces of the housing device. To improve heat transfer, a thermally conductive material (referred to as a TIM—"thermal interface material"), particularly a thermally conductive paste, may be provided between each active and / or passive component and the housing device.

[0067] According to a further embodiment, the housing device is connected to the support device, in particular indirectly or directly.

[0068] The housing device is preferably made of a heat-conducting material, such as copper or aluminum or alloys thereof. High-alloy steel or ceramics are also conceivable.

[0069] According to another embodiment, the circuit board is routed through the housing device.

[0070] In some embodiments, the circuit board partially or completely extends through the cavity formed by the housing device. In the cavity, the housing device may have a bracket portion that supports the circuit board. The housing device may be specially designed to protect the circuit board from external forces.

[0071] According to a further embodiment, a gap between the housing device and the at least one active and / or passive component is filled with a thermally conductive material.

[0072] This improves heat dissipation and simplifies installation.

[0073] According to a further embodiment, a gap between the bridge or the cantilever and at least one of the active component and / or the passive component is filled with a thermally conductive material.

[0074] As an alternative or in addition, the gap between the bridge or the cantilever and the support device and / or the housing device can be filled with a thermally conductive material.

[0075] According to another embodiment, the thermally conductive material is a thermally conductive paste.

[0076] This allows for efficient compensation of offsets between components while ensuring high heat transfer.

[0077] In other embodiments, multiple active and / or passive components arranged on the circuit board are thermally connected to the housing device. This can also be achieved using a thermally conductive material, particularly thermally conductive paste. The thermally conductive material is specifically disposed in or fills a gap between one of the multiple passive and / or active components and the housing device.

[0078] According to a further embodiment, the housing device has a cylindrical shape, said housing device being connected to the support device on one of its end faces.

[0079] For example, the cylindrical shape may have a circular, rectangular, oval or other cross section.The end faces of the cylindrical shape may be inserted into a support device and / or glued or welded thereto.

[0080] According to a further embodiment, at least one heat pipe extends through the housing device.

[0081] This advantageously makes it possible to discharge heat from the supporting device, in particular towards the cooling device. In the present case, a "heat pipe" is understood to mean a heat exchanger that uses the evaporation enthalpy of the medium to allow a high heat flux density. The heat pipe can in particular be in the form of a heat conduit or a two-phase thermosyphon. Additionally or alternatively, the exterior (in particular the side surfaces) of the housing device (in particular of cylindrical shape) can be cooled. For this purpose, for example, a coolant can flow around the housing device, in particular in a pipe. The coolant under consideration is, for example, water or air. The pipe can be integrated into the cooling device surrounding the housing device, or can directly adjoin the side surface, i.e. completely adjoin the side surface, with the result that the coolant flows directly along the side surface.

[0082] According to a further embodiment, the circuit board forms a housing which contains a plurality of active and / or passive components.

[0083] The housing can be vacuum-tight. The housing can be formed within the interior region of the circuit board. Embedding the vacuum-tight housing within the interior region of the circuit board also allows active and / or passive components to be housed within the vacuum housing of the optical system without being affected by the adjacent / surrounding vacuum. For example, the composite material (and / or ceramic) of the printed circuit board can form a vacuum-tight housing that encloses multiple active and / or passive component parts, particularly those filled with air and those depleted of air.

[0084] According to one embodiment, the plurality of optical elements, the support device and the circuit board form a pre-mountable or pre-mounted unit, which may be a holding device or mounted on a holding device.

[0085] This makes it easier to mount the optical system, in particular when forming a plurality of such pre-mounted units. The holding device can in particular be a cooling device for cooling one or more pre-mounted units and / or a current and / or voltage supply device for supplying current and / or voltage to one or more pre-mounted units.

[0086] According to another embodiment, the optical system has a plurality, J, of devices, each device having a corresponding number of optical elements, a corresponding support device and a corresponding circuit board.

[0087] This results in a modular design that can be easily installed and maintained. J is ≥2, preferably ≥5, more preferably ≥10.

[0088] According to a further embodiment, the optical system has a holding device into which the J devices can be inserted or plugged.

[0089] As mentioned above, the holding device can in particular be in the form of a cooling device and / or a current and / or voltage supply device.The devices can also be fastened or secured on or in the holding device in another way (rather than by insertion).

[0090] This cooling device can include means for removing heat from the housing devices of the J devices. In particular, the heat is removed by at least one heat pipe of the housing device. In particular, the holding device can have a cylindrical opening into which the J devices can be inserted. Each cylindrical opening can have, in particular, a circular, rectangular, oval, or other cross-sectional shape.

[0091] According to another embodiment, the optical system includes a vacuum housing that accommodates a plurality of optical elements. For example, the vacuum housing is designed for use in an interior space thereof at a pressure of 1013.25 hPa to 10 -3 hPa, preferably 10 -3 to 10 -8 hPa, and more preferably 10 -8 to 10 -11 In some embodiments, the support device, the circuit board and / or the housing device can also be arranged in a vacuum. In other embodiments, the optical system has a housing that contains a plurality of optical elements and in which there is excess pressure.

[0092] According to a further embodiment, the optical system is in the form of an illumination optics unit or a projection optics unit of a lithographic apparatus.

[0093] According to a second aspect, there is provided a lithographic apparatus, in particular an EUV or DUV lithographic apparatus, comprising an optical system as described above.

[0094] The lithographic apparatus or projection exposure apparatus may be an EUV lithographic apparatus. EUV stands for "extreme ultraviolet" and indicates that the wavelength of the working light is between 0.1 nm and 30 nm. The lithographic apparatus or projection exposure apparatus may also be a DUV lithographic apparatus. DUV stands for "deep ultraviolet" and indicates that the wavelength of the working light is between 30 nm and 250 nm.

[0095] According to a third aspect, there is provided a method for producing an optical system for a lithographic apparatus, the method comprising:

[0096] a) providing a plurality of optical elements on a support device;

[0097] b) providing at least two active and / or passive components in different planes on or in the supporting device, one of the passive and / or active components preferably being a contact connection means; and preferably

[0098] c) Electrically connecting the circuit board to the contact connection means.

[0099] List items a), b) and c) do not imply a specific order of the method steps. Instead, they can also be performed in another order, for example, step a) is performed after step b).

[0100] According to one embodiment, the method further comprises:

[0101] pre-mounting the plurality of optical elements, the supporting device, the at least two active and / or passive components and / or the circuit board to form a pre-mounted unit; and

[0102] The pre-assembled unit is mounted on a holding device.

[0103] This makes installation easier.

[0104] According to another aspect, there is provided an optical system for a lithographic apparatus, comprising:

[0105] multiple optical elements for directing the radiation,

[0106] a supporting device for supporting the optical element, and

[0107] multiple, N, active and / or passive components,

[0108] wherein the active components and / or the passive components are arranged in at least two different planes in the supporting device,

[0109] Therein, at least a subset of the active components and / or passive components are arranged in a closed inner space of the support device, and the closed inner space is a closed chamber or a closed housing.

[0110] This measure also results in a high packing density of active and / or passive components and good accessibility for installation purposes.

[0111] Features, improvements and advantages described with respect to the first aspect apply mutatis mutandis to the other aspects, and vice versa.

[0112] In this context, "a" or "an" is not necessarily to be considered as limiting to exactly one element. On the contrary, a plurality of elements, for example two, three or more, may also be provided. Any other number used herein should not be understood as limiting to the exact stated number of elements. On the contrary, unless otherwise indicated, upward and downward deviations of the numerical values are possible. A "second" element does not necessarily presuppose a "first" element.

[0113] Other possible implementations of the present invention also include combinations not explicitly mentioned of features or embodiments described above or below with respect to the exemplary embodiments. Those skilled in the art will also add individual aspects as improvements or supplements to the corresponding basic forms of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0114] Further advantageous configurations and aspects of the invention are the subject matter of the dependent claims and of exemplary embodiments of the invention described below.The invention is explained in detail below on the basis of preferred embodiments with reference to the drawings.

[0115] Figure 1 shows a schematic meridional cross section of a projection exposure apparatus for EUV projection lithography;

[0116] Figure 2 shows a cross-sectional view of a first embodiment of an optical system;

[0117] Figure 3 shows a perspective schematic diagram of a second embodiment of an optical system;

[0118] Figure 4 shows a perspective view of a circuit board according to one embodiment;

[0119] Figure 5 Schematically shows details of the contact connection of a circuit board via a contact connection island according to one embodiment;

[0120] Figure 6 Also schematically shown are details of a variant for the contact connection of a circuit board, in this case using a spring according to one embodiment;

[0121] Figure 7 According to a variant, a Figure 2 a cross-sectional view of a detail of region VII;

[0122] Figure 8 shows a cross-sectional view of a region of a printed circuit board having a housing formed therein according to one embodiment;

[0123] Figure 9 Shown based on Figure 2 A perspective view of a contact connection device on a bridge member of an embodiment;

[0124] Figure 10 Various possible variations for the arrangement of active and / or passive components on or below the bridge or cantilever are schematically shown;

[0125] Figure 11 shows a partial cross-sectional view of a support apparatus according to one embodiment; and

[0126] Figure 12 A flow chart of a method according to one embodiment is shown.

[0127] Unless indicated to the contrary, identical or functionally identical elements are provided with the same reference numerals in the figures. It should also be noted that the representations in the figures are not necessarily true to scale. DETAILED DESCRIPTION

[0128] Figure 1 An embodiment of a projection exposure apparatus 1 (lithography apparatus), in particular an EUV lithography apparatus, is shown. In addition to a light source or radiation source 3, the embodiment of an illumination system 2 of the projection exposure apparatus 1 comprises an illumination optical unit 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 can also be provided as a module separate from the rest of the illumination system 2. In this case, the illumination system 2 does not include the light source 3.

[0129] A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8. The reticle holder 8 is displaceable by a reticle displacement drive 9, in particular in a scanning direction.

[0130] Figure 1 By way of illustration, a Cartesian coordinate system is shown with an x-direction x, a y-direction y and a z-direction z. The x-direction x extends vertically into the plane of the drawing. The y-direction y extends horizontally and the z-direction z extends vertically. The scanning direction is along Figure 1 The z direction z extends perpendicular to the object plane 6.

[0131] The projection exposure apparatus 1 comprises a projection optical unit 10. The projection optical unit 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 extends parallel to the object plane 6. Alternatively, angles between the object plane 6 and the image plane 12 other than 0° are also possible.

[0132] The structures on the reticle 7 are imaged onto the photosensitive layer of a wafer 13, which is arranged in the region of the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 can be displaced, in particular in the y-direction y, by a wafer displacement drive 15. The movement of the reticle 7 by the reticle displacement drive 9 on the one hand and the movement of the wafer 13 by the wafer displacement drive 15 on the other hand can be performed synchronously with one another.

[0133] Light source 3 is an EUV radiation source. Light source 3 specifically emits EUV radiation 16, hereinafter also referred to as used radiation, illumination radiation, or illumination light. Used radiation 16 particularly has a wavelength in the range between 5 nm and 30 nm. Light source 3 can be a plasma source, such as an LPP (Laser Produced Plasma) source or a DPP (Discharge Produced Plasma) source. It can also be a synchrotron-based radiation source. Light source 3 can be a FEL (Free Electron Laser).

[0134] The illumination radiation 16 emitted by the light source 3 is focused by a light collector 17. The light collector 17 can be a light collector having one or more ellipsoidal and / or hyperbolic reflective surfaces. The illumination radiation 16 can be incident on at least one reflective surface of the light collector 17 at grazing incidence (GI) (i.e., at an angle of incidence greater than 45°) or at normal incidence (NI) (i.e., at an angle of incidence less than 45°). The light collector 17 can be structured and / or coated to optimize its reflectivity for the radiation being used and to suppress extraneous light.

[0135] Downstream of the light collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 may represent a separation between the radiation source module comprising the light source 3 and the light collector 17 and the illumination optics unit 4.

[0136] The illumination optical unit 4 comprises a deflecting mirror 19 and a first facet mirror 20 arranged downstream of the deflecting mirror 19 in the beam path. The deflecting mirror 19 can be a plane deflecting mirror or, alternatively, a mirror with a beam-influencing effect that goes beyond a pure deflection effect. As an alternative or in addition, the deflecting mirror 19 can be in the form of a spectral filter, which separates the used light wavelength of the illumination radiation 16 from extraneous light with a wavelength deviating therefrom. If the first facet mirror 20 is arranged in a plane of the illumination optical unit 4 which is optically conjugate to the object plane 6 as a field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a plurality of individual first facets 21, which can also be referred to as field facets. Only some of these first facets 21 are Figure 1 It is shown in the example.

[0137] The first facets 21 can be implemented as macro facets, in particular rectangular facets or facets with an arc or edge profile of a portion of a circle.The first facets 21 can be in the form of planar facets or alternatively facets with convex or concave curvature.

[0138] As is known, for example, from DE 10 2008 009 600 A1, the first facets 21 themselves can also each consist of a plurality of individual mirrors, in particular a plurality of micromirrors. The first facet mirrors 20 can in particular be in the form of a microelectromechanical system (MEMS system). For details, reference is made to DE 10 2008 009 600 A1.

[0139] The illuminating radiation 16 travels horizontally (ie along the y-direction y) between the light collector 17 and the deflecting mirror 19 .

[0140] In the beam path of the illumination optical unit 4, the second facet mirror 22 is arranged downstream of the first facet mirror 20. If the second facet mirror 22 is arranged in the pupil plane of the illumination optical unit 4, it is also called a pupil facet mirror. The second facet mirror 22 can also be arranged at a certain distance from the pupil plane of the illumination optical unit 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also called a specular reflector. Specular reflectors are known from US 2006 / 0132747 A1, EP 1 614 008 B1 and US 6,573,978.

[0141] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also called pupil facets.

[0142] The second facets 23 can likewise be macroscopic facets, which can have, for example, circular, rectangular or hexagonal boundaries, or alternatively facets consisting of micromirrors. In this respect, reference is likewise made to DE 10 2008 009 600 A1.

[0143] The second facet 23 may have a planar reflective surface or alternatively a reflective surface with a convex or concave curvature.

[0144] The illumination optical unit 4 thus forms a two-facet system. This basic principle is also known as a fly's eye condenser (or fly's eye integrator).

[0145] It may be advantageous to arrange the second facet mirror 22 not exactly in a plane optically conjugate to the pupil plane of the projection optical unit 10. In particular, the second facet mirror 22 can be arranged tilted relative to the pupil plane of the projection optical unit 10, as described, for example, in DE 10 2017 220 586 A1.

[0146] The second facet mirror 22 serves to image the individual first facets 21 into the object field 5 . The second facet mirror 22 is the last beam-shaping mirror in the beam path upstream of the object field 5 or indeed the last mirror for the illumination radiation 16 .

[0147] In another embodiment (not shown) of the illumination optical unit 4, a transfer optical unit, which in particular contributes to the imaging of the first facet 21 into the object field 5, can be arranged in the beam path between the second facet mirror 22 and the object field 5. The transfer optical unit can have exactly one mirror or, alternatively, two or more mirrors, which are arranged one behind the other in the beam path of the illumination optical unit 4. The transfer optical unit can in particular comprise one or two normal incidence mirrors (NI mirrors) and / or one or two grazing incidence mirrors (GI mirrors).

[0148] exist Figure 1 In the embodiment shown, the illumination optical unit 4 has exactly three mirrors downstream of the light collector 17 , specifically a deflection mirror 19 , a first facet mirror 20 and a second facet mirror 22 .

[0149] In another embodiment of the illumination optical unit 4 , the deflecting mirror 19 can also be omitted, and the illumination optical unit 4 can therefore then have exactly two mirrors downstream of the light collector 17 , specifically a first facet mirror 20 and a second facet mirror 22 .

[0150] The imaging of the first facet 21 into the object plane 6 by means of the second facet 23 or using the second facet 23 and the transfer optics is usually only an approximate imaging.

[0151] The projection optical unit 10 comprises a plurality of mirrors Mi, which are numbered consecutively according to their arrangement in the beam path of the projection exposure apparatus 1 .

[0152] exist Figure 1 In the example shown, the projection optical unit 10 includes six mirrors M1 to M6. Alternative solutions with four, eight, ten, twelve, or a different number of mirrors Mi are also possible. The projection optical unit 10 is a double-shading optical unit. The penultimate mirror M5 and the last mirror M6 each have a through-opening for the illumination radiation 16. The projection optical unit 10 has an image-side numerical aperture that is greater than 0.5 and can also be greater than 0.6, and can be, for example, 0.7 or 0.75.

[0153] The reflective surface of the reflector Mi can be in the form of a free-form surface without an axis of rotational symmetry. Alternatively, the reflective surface of the reflector Mi can be designed as an aspherical surface with exactly one axis of rotational symmetry of the reflective surface shape. Like the reflectors of the illumination optical unit 4, the reflector Mi can have a highly reflective coating for the illumination radiation 16. These coatings can be designed as multilayer coatings, in particular with alternating layers of molybdenum and silicon.

[0154] The projection optical unit 10 has a large object-image offset in the y direction y between the y coordinate of the center of the object field 5 and the y coordinate of the center of the image field 11. This object-image offset in the y direction y can have approximately the same magnitude as the z distance between the object plane 6 and the image plane 12.

[0155] The projection optical unit 10 can be configured in various ways. It can have different imaging ratios βx and βy in the x-direction and the y-direction. The two imaging ratios βx and βy of the projection optical unit 10 are preferably (βx, βy) = (+ / - 0.25, + / - 0.125). A positive imaging ratio β means imaging without image inversion. A negative imaging ratio β means imaging with image inversion.

[0156] The projection optical unit 10 thus results in a size reduction in the x-direction x (ie in a direction perpendicular to the scanning direction) by a ratio of 4:1.

[0157] The projection optical unit 10 results in a size reduction of 8:1 in the y-direction y, ie in the scanning direction.

[0158] Other imaging ratios are also possible. Imaging ratios with the same sign and the same absolute value in the x-direction x and the y-direction y are also possible, for example with an absolute value of 0.125 or 0.25.

[0159] The number of intermediate image planes in the x-direction x and in the y-direction y in the beam path between the object field 5 and the image field 11 may be the same or different, depending on the embodiment of the projection optical unit 10. Examples of projection optical units with a different number of such intermediate images in the x-direction x and in the y-direction y are known from US 2018 / 0074303 A1.

[0160] In each case, one of the second facets 23 is assigned to exactly one of the first facets 21 in order to form an illumination channel for illuminating the object field 5. This can, in particular, produce illumination according to the Köhler principle. The far field is decomposed into a plurality of object fields 5 by means of the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 respectively assigned to them.

[0161] The first facets 21 are each imaged onto the reticle 7 via the assigned second facets 23 and overlap with each other for the purpose of illuminating the object field 5. The illumination of the object field 5 is particularly uniform, preferably with a uniformity error of less than 2%. Field uniformity can be achieved by overlapping the different illumination channels.

[0162] The illumination of the entrance pupil of the projection optical unit 10 can be geometrically defined by the arrangement of the second facets 23. The intensity distribution in the entrance pupil of the projection optical unit 10 can be set by selecting the illumination channels for guiding the light, in particular the subset of the second facets 23. This intensity distribution is also referred to as illumination setting or illumination pupil filling.

[0163] A likewise preferred pupil homogeneity in the region of the portion of the illumination pupil of the illumination optical unit 4 that is illuminated in a defined manner can be achieved by redistributing the illumination channels.

[0164] Further aspects and details of the illumination of the object field 5 and in particular the entrance pupil of the projection optical unit 10 are described below.

[0165] The projection optical unit 10 may in particular have a concentric entrance pupil. The latter may be accessible. It may also be inaccessible.

[0166] The entrance pupil of the projection optical unit 10 often cannot be accurately illuminated using the second facet mirror 22. When imaging the projection optical unit 10 (which telecentrically images the center of the second facet mirror 22 onto the wafer 13), the aperture rays generally do not intersect at a single point. However, it is possible to find a region where the separation between pairs of aperture rays is minimized. This region represents the entrance pupil or a region in real space conjugate thereto. In particular, this region has a finite curvature.

[0167] It may be the case that the projection optical unit 10 has different postures of the entrance pupil for the tangential beam path and for the sagittal beam path. In this case, an imaging element, in particular an optical component part of the transfer optical unit, should be provided between the second facet mirror 22 and the reticle 7. With the help of this optical element, the different postures of the tangential and sagittal entrance pupils can be taken into account.

[0168] exist Figure 1 In the illustrated arrangement of the components of the illumination optical unit 4, the second facet mirror 22 is arranged in a region conjugate to the entrance pupil of the projection optical unit 10. The first facet mirror 20 is arranged tilted relative to the object plane 6. The first facet mirror 20 has an inclination relative to the arrangement plane defined by the deflection mirror 19. The first facet mirror 20 has an inclination relative to the arrangement plane defined by the second facet mirror 22.

[0169] Figure 2 A lithographic apparatus or projection exposure apparatus 1 (e.g. Figure 1 ) is a cross-sectional view of an embodiment of an optical system 200. In addition, Figure 2 The optical system 200 in FIG. 2 can also be used in a DUV lithography apparatus, for example.

[0170] The optical system 200, in particular the illumination optical unit 4 ( Figure 1 ) or may comprise the illumination optical unit 4. For example, the optical system 200 may be a component of one of the facet reflectors 20, 22 or include one of the facet reflectors 20, 22.

[0171] Figure 2 The optical system 200 shown in the cross-sectional view in FIG includes a plurality of optical elements 202. By way of example, two of these optical elements are given reference numerals. In some embodiments, only a single optical element 202 may be provided, or more than two, for example more than 100, or more than 500 such optical elements 202 may be provided.

[0172] Optical element 202 directs radiation 204 through lithographic apparatus 1. Radiation 204 may be, for example, Figure 1The optical element 202 may be in the form of a lens element or a reflector. In particular, the optical element 202 may be in the form of a micromirror, as in Figure 2 As in the exemplary embodiment of the present invention. The reflector or micro-mirror can be formed from Figure 1 The first facet 21 or the second facet 23 .

[0173] One or each optical element 202 may be assigned an actuator and / or sensor unit 206, which is indicated only schematically. One or each actuator and / or sensor unit 206 may comprise an actuator and / or sensor, which is not shown in FIG. Figure 2 . The actuator can be configured to adjust the position of the corresponding optical element 202. The purpose is in particular to guide the radiation 204 in a suitable manner. The sensor can, for example, be in the form of a position sensor and be configured to detect the position of the assigned optical element 202. Alternatively or additionally, the sensor can be in the form of a temperature sensor.

[0174] Similar to the actuator and / or sensor unit 206, the optical element 202 may be in the form of a so-called MEMs system (micro-electromechanical system). Specifically, the optical element 202 and the actuator and / or sensor unit 206 may be manufactured in an integrated manner. This means, for example, that they are manufactured on a substrate, particularly a semiconductor substrate such as silicon or gallium arsenide. For example, the sensor or actuator may have a maximum dimension of 1 μm. For example, the diameter, diagonal, or other maximum dimension of one of the micromirrors may be less than 5 mm or less than 1 mm.

[0175] The optical system 200 further comprises a support device 208. A (first) side 210 of the support device 208 supports one or more optical elements 202. In the present case, the side 210 is also referred to as the front side. The support device 208 can even form the aforementioned substrate for providing the MEMS components (optical elements 202 and actuator and / or sensor units 206). The support device 208 is preferably made of ceramic, in particular aluminum nitride. The support device 208 can, for example, be flat. To this end, it can, for example, have Figure 2 As shown, the support device 208 has a rectangular cross-section with two long sides and two short sides. As viewed perpendicularly relative to its main range plane 226, the support device 208 can have a rectangular shape (e.g., as shown in FIG. Figure 3), and circular, elliptical or other shapes are also conceivable. One or more optical elements 202 can be indirectly fastened (for example, via an actuator or a hinge, such as a flexure) to the front side 210 of the support device 208. As an alternative or in addition, one or more optical elements 202 can be directly attached to the front side 210 of the support device 208. For example, one or more optical elements 202 can be adhesively bonded to the front side 210 (the electrical connection of the optical elements 202, i.e., the linking, can be established by a conductive adhesive or welding). In another embodiment, one or more optical elements 202 are applied to the front side 210 in the form of a (if appropriate, corresponding) layer.

[0176] The support device 208 also has a second side 212 (hereinafter also referred to as the "back side"). The side 212 can be located opposite the side 210 and thus opposite the optical element 202. On the side 212, the support device 208 has a contact connection device 214, that is, the contact connection device 214 is particularly mounted (for example, glued or welded) on the side 212 and electrically contacted. Figure 2 In the exemplary embodiment of FIG. 2 , the contact-connecting means 214 are arranged on a bridge 250 . The bridge 250 extends over the active and / or passive components 252 . The active and / or passive components are fastened directly to the back side 212 of the support device 208 .

[0177] Figure 9 A possible structure of the contact connection device 214, the bridge 250 and the active and / or passive components 252 is shown in FIG. Figure 2 For clarity, Figure 2 The adjacent components in Figure 9 Shown in.

[0178] Bridge 250 (similar to support device 208) is preferably made of ceramic (e.g., aluminum nitride). Bridge 250 can be manufactured in one piece, that is, in a single piece (i.e., in a primary forming step), and / or manufactured integrally with support device 208. Alternatively, bridge 250 can be mechanically and / or electrically connected to support device 208 via a joining method (welding, use of a conductive adhesive, bonding, etc.). As another alternative, bridge 250 can be connected to support device 208 via a plug-in connector or another contact-connecting device (in this case, the statements regarding contact-connecting device 214 apply mutatis mutandis). Furthermore, a special thermal connection can be provided.

[0179] The bridge 250 may have two opposing legs 900, 902 that are positioned Figure 9The bridge 250 protrudes upward from the back side 212 of the support device 208. The spanning portion 904 of the bridge 250 extends between the pillars 900, 902. Active and / or passive components, in this case in the form of contact connection means 214, are arranged on its top side 906. The top side 906 is the side of the bridge 250 that faces away from the back side 212 of the support device 208.

[0180] The spanning portion 904 of the bridge 250 spans active and / or passive components, in this example the microprocessor 252. The microprocessor 252 is disposed directly on the side 212.

[0181] Generally speaking, the active or passive components 214, 252 are arranged in two different planes E1, E2. The planes E1, E2 can correspond to the respective bottom sides of the respective components 214, 252. The "bottom" side is understood to be the side closest to the back side 212, i.e. the side with the smallest distance to the back side 212. In particular, the planes E1, E2 can pass through the respective contact connection planes of the components 214, 252. The plane E1 can, for example, extend through the contact connection plane of the component 214, electrically contacting the bridge 250 through the contact connection plane of the component 214, i.e. the top side 906 of the bridge. The corresponding electrical contact points on the bottom side of the component 214 are not located on the Figure 9 . Similarly, plane E2 may extend on the bottom side of component 252 (the side facing support device 208, i.e., its rear side 212) through the contact connection points of component 252. The corresponding contact connection points are also not shown. The contact connection points of components 214, 252 may be formed by electrical contacts, contact pins, solder points, and / or SMD contact connection points.

[0182] Figure 9 It is also shown that the components 214, 252 overlap in a direction R perpendicular to the planes E1, E2. In other words, Figure 9 The components 214, 252 in FIG. overlap as seen from top to bottom. Figure 9 In the exemplary embodiment of FIG. 5 , the planes E1 , E2 are parallel to each other.

[0183] Return to Figure 2 , also shows that in some embodiments, the contact connection device 214, the bridge member 250 (such as the cantilever 1010, which will be explained later and is not shown in FIG. Figure 2 ) and / or active and / or passive components 252 may be electrically connected to one or more of the actuator and / or sensor units 206. The corresponding conductive paths are Figure 2216 . Conductive path 216 may, for example, be in the form of a through-hole (e.g., a through-hole, a blind via, and / or a buried via, preferably ensuring vacuum tightness between sides 210 and 212 of support device 208 ). Additionally or alternatively, contact connection 214 may also be electrically connected to other active and / or passive components. These components may be arranged on side 210 or 212 or elsewhere. Active or passive components include, for example, integrated circuits, processors, microprocessors, FPGAs, analog-to-digital converters, digital-to-analog converters, transistors (more specifically, MOSFETs), capacitors, resistors, and / or inductors.

[0184] The optical system 200 further includes a circuit board 218. The circuit board 218 can be electrically connected to the contact connection device 214. Figure 2 The electrical connection state is shown. The electrical (and mechanical) connection can in particular be detachable. Accordingly, the circuit board 218 can be removed from the contact connection device 214, for example for maintenance purposes.

[0185] The circuit board 218 preferably connects the (first) contact-connection device 214 to a further (second) contact-connection device 220, which is assigned to a current and / or voltage supply device and is not shown in any further detail. In particular, one end 222 of the circuit board 218 can be electrically connected to the contact-connection device 214, and if appropriate, the other end 224 can be electrically connected to the contact-connection device 220.

[0186] exist Figure 2 In the embodiment shown, the contact-connection device 214 (the same applies to the contact-connection device 220 ) can be in the form of a socket (see also Figure 9 , but for the sake of clarity the circuit board 218 is not shown in this figure). An end 222 of the circuit board 218 , for example in the form of an edge connector, can be plugged (in particular removably) into a socket, Figure 2 The inserted state is shown.

[0187] The correspondingly designed circuit board 218 is Figure 4 , specifically in a perspective view. The circuit board 218 is made, in particular, of an electrically insulating material, to which the conductor tracks 400 are adhered or embedded. In the region of the ends 222, 224, the conductor tracks 400 are laid onto the edge of the circuit board 218, creating plug-in contacts that engage the socket-shaped contact connections 214 and 220. The corresponding contacts can be hard-gold plated, zinc plated, or provided with another coating, in particular to protect against oxidation.

[0188] like Figure 4As also shown, according to an exemplary embodiment, circuit board 218 is flat (in other words: in the form of a plate) and, as seen in a direction perpendicular to its main extent plane 402 , is also rectangular.

[0189] Back to Figure 2 , which shows that the main extent plane 402 of the circuit board 218 extends perpendicularly relative to the main extent plane 226 of the support device 208. In other embodiments, only a portion of the circuit board 218 extends perpendicularly relative to the support device 208 (i.e., its main extent plane 226), and another portion of the circuit board is arranged at an angle (e.g., 45°) relative to the support device 208 (i.e., its main extent plane 226). In other embodiments, the circuit board 218 may have a curved profile, for example, between its ends 222, 224. The circuit board 218 may be made of rigid and / or flexible materials. In particular, the circuit board is sometimes installed in a warped state.

[0190] In a variant not shown, the circuit board 218 is in the form of a strip, for example with a circular, polygonal or oval cross section. Since in this case the circuit board 218 does not have a main range plane but only a main range direction, the main range direction can in this case be oriented perpendicularly relative to the main range plane 226 of the support device 208.

[0191] Return to Figure 4 , which shows that the circuit board 218 can have one or more passive and / or active components. To this end, Figure 4 By way of example, a microprocessor 404 is shown which is electrically conductively connected to the conductor tracks 400 of the circuit board 218 .

[0192] exist Figure 4 In FIG, a microprocessor 404 (an example of an electronic active component) is arranged on the circuit board 218. Figure 8In the embodiment shown in the cross-section in FIG, the microprocessor 404 is arranged in an interior space 800 within the circuit board 218. To this end, the interior space 800 is enclosed by, in particular, a vacuum-tight housing 802. The vacuum-tight housing 802 is formed by the circuit board 218. In particular, to this end, the circuit board 218 has a layer structure with multiple layers 804 and 806. The respective layers 804 form the outer layer, and the respective layers 806 form the inner layer. The outer layer 804 can be, for example, a heat dissipation layer and, for this purpose, can be in the form of a metal layer. Alternatively, the outer layer can be in the form of an insulator layer, such as an anti-degassing plastic film or lacquer. The inner layer 806 can be in the form of an alternating sequence of metal layers and insulating layers. The metal layers can be made, for example, of copper, and the insulating layers can be made of a fiberglass substrate or epoxy resin. In particular, cutouts can be made in one or more of the inner layers 806 to form the interior space 800, i.e., the vacuum-tight housing 802. In all other respects, in some embodiments, the support device 208 (and / or the bridge 250 or the cantilever 1010 ) may itself be in the form of a circuit board, with the features of the circuit board 218 described herein being applicable mutatis mutandis to the support device 208 .

[0193] In the following, we will Figure 5 and Figure 6 Based on this, two different further exemplary embodiments of the contact-connection device 214 are described. These descriptions apply mutatis mutandis to the contact-connection device 220.

[0194] Figure 5 Schematically showing details of the end portion 222 of the circuit board 218, Figure 4 The short side is shown in FIG. The end 222 or the contact there (conductor track 400) is in conductive contact with the contact connection island, solder contact point or landing pad 500 of the contact connection device 214. The landing pad 500 is formed, for example, directly on the surface 906 ( Figure 9 ). In this case, the end 222 is not inserted into the socket. Instead, electrical contact is established by moving the end 222 or the contact (conductor track 400) at the end 222 against the landing pad 500, being held there, and possibly soldered there.

[0195] In accordance with Figure 6 In the exemplary embodiment of the present invention, the contact connection device 214 is in the form of a one-piece interface (or another spring connector), which is also Figure 9 The one-piece interface (or other spring connector) comprises a plurality of springs or spring contact pins 600 which resiliently bear against contacts formed by the conductor tracks 400 at the end 222 of the circuit board 218 to establish electrical contact. Figure 6 Shown from Figure 4The long side of the circuit board 218 is provided. In some embodiments, a spring or spring contact pin 600 can be attached to the circuit board 218 and contact its conductor track 400. In this case, in the mounted state of the circuit board 218, the spring or spring contact pin 600 can bear, for example, against a landing pad formed on the top side 906 (which can be, for example, hard gold-plated) to establish electrical contact.

[0196] Return to Figure 2 , it is also shown that a housing device 228 is arranged on the rear side 212. The housing device 228 can be provided with one or more functions described below.

[0197] Firstly, it can mechanically absorb the holding forces generated by the attachment of the support device 208. In particular, it can transmit these holding forces to the holding device 300, which is Figure 3 Shown in perspective view.

[0198] Another function of the housing function 228 may be to at least partially receive and protect the circuit board 218 in its interior space 230. The circuit board 218 may extend, for example, from one end 222 thereof through the interior space 230 to its other end 224. The housing device may have a support element 232 that supports the circuit board 218 within the cavity 230. The support element 232 may extend perpendicularly relative to the main range plane 402 of the circuit board 218.

[0199] Yet another function of the housing device 228 may be to transfer heat from the support device 208 to the cooling device. Figure 2 In FIG, the cooling device is represented by way of example by two heat sinks 234. The heat to be dissipated is generated, for example, by the portion of radiation 204 that is not reflected and therefore absorbed. In particular, in the case of EUV light, only some of the incident optical power is reflected by the optical element 202. The remainder is dissipated in the form of heat. In addition or as an alternative, the actuator / sensor unit 206 can also generate heat, which is dissipated. The active and passive components mentioned above and below, such as the microprocessor 404 ( Figure 4 ) or electronic components 252, 700, 702 arranged on the back side 212 of the support device 208 (which will be combined later) Figure 7 2 (explained in more detail) can also generate heat, which is at least partially dissipated by the housing device 228. There are various possible ways to do this. For example, the side surface 236 or another outer surface of the housing device 228 can be immersed in a coolant (such as air or water), which Figure 2 In particular, heat can be discharged from the side surface 236 via the air gap to a cooler and / or to a cooling member ( Figure 3 ).

[0200] according to Figure 2 In the illustrated variation, the housing device 228 includes one or more heat pipes 238 (particularly in the form of heat conduits). These extend through openings 240 in the housing 228. The openings 240 may be in the form of through-holes, pipes, etc. The heat pipes 238 extend from the support device 208 to the heat sink 234. At the support device 208, the heat pipes 238 may be disposed in pockets 242 (as shown), where they are thermally coupled to the heat sink 234.

[0201] The housing device 228 may be made of a heat conductive material, such as copper or aluminum and alloys thereof. The housing device 228 may also have a cylindrical shape, such as Figure 3 According to an exemplary embodiment, it is a cylinder. Alternatively, the cylindrical shape can have a rectangular, oval or other cross-section.

[0202] Return to Figure 2 , shows one end face 244 of the cylindrical shape connected (directly connected in this exemplary embodiment) to the rear side 212 of the support device 208. The opposite end face 246 of the cylindrical shape (ie, the housing device 228) can abut Figure 3 In particular, the end side 246 of the housing device 228 can be screwed to the holding device 300. This is especially true in Figure 3 This is the case in the assembled state shown on the center right (with dashed lines).

[0203] Figure 3 The pre-installed unit 302 is shown in the upper left corner of FIG. Figure 2 , the pre-assembled unit 302 includes the optical element 202, the support device 208, the housing device 228, the circuit board 218 and the heat pipe 238. The pre-assembled unit 302 is inserted into the receiving portion 304 of the holding device 300. In particular, the receiving portion 304 can have a cylindrical opening corresponding to the cylindrical shape of the housing device 228. Figure 3 The inserted, i.e., installed, state is shown on the right side in dashed lines (as already mentioned above). In the installed state, the housing device 228 is (partially or completely) installed in, for example, the receptacle 304. In contrast, the optical element 202 is freely accessible from the top (if appropriate, in a vacuum). It can be provided that the electrical connection (and possibly also the thermal coupling) has already been established by the insertion operation. This means that by inserting the pre-assembled unit 302 into the receptacle 304, the lower end 224 of the circuit board 208 is inserted into the contact-connection device 220 at the lower end of the receptacle 304 ( Figure 2 Correspondingly, at the lower end of the accommodation portion 304 , the heat pipe 238 also establishes a thermal connection with the corresponding radiator 234 .

[0204] like Figure 3 As further shown, the holding device 300 can have a plurality of receptacles 304. Accordingly, a plurality of pre-assembled units 302, for example more than five, more than ten, or more than 100 units 302, can be mounted in the holding device 300. Advantageously, the units 302 can also be individually disassembled again for maintenance purposes. To this end, they are removed, in particular, upwards from the respective receptacles 304. Afterwards, for example, the circuit board 218 can be disconnected from its electrical connection to the contact-connection device 214 at its downwardly protruding free end 224 ( Figure 2 This can be done, for example, whenever the conductor track 400 ( Figure 4 ) or microprocessor 404 ( Figure 4 ) or one of the other active and / or passive components of the circuit board 218 is considered to be defective.

[0205] Figure 7 Another variation is shown Figure 2 VII. In this variant, the housing device 224 is not at least partially fastened directly to the back side 212 of the support device 208. Instead, one or more (in this example two) passive and / or active components 700, 702 are provided on the back side 212. The above statements regarding active and passive components apply. The components 700, 702 can, for example, be electrically connected to the actuator and / or sensor unit 206. There is a gap between the end face 244 of the housing device 228 and the components 700, 702, which gap can be filled with a thermally conductive filling material 704 (called TIM, in particular thermally conductive paste), such as Figure 7 As shown, or provided in the form of air or vacuum gap. In addition to the heat conduction function, the thermally conductive filler material 704 can also have a tolerance compensation function. In this case, the tolerance compensation occurs, for example, between the housing device 228 and the back side 212 of the support device 208.

[0206] In other embodiments, no thermally conductive filler material is provided, and the end surface 244 directly abuts the components 700, 702. In some variations, for example, the support element 232 or other portions of the housing device 228 may also thermally abut the microprocessor 404 or another passive and / or active component. This, in turn, may be accomplished using a thermally conductive filler material.

[0207] therefore, Figure 7 An example of an indirect arrangement of the housing device 228 or at least a portion thereof on the back side 212 of the support device 208 is shown. In some variants, the housing device 228 is also not arranged on the back side 212, but on another part of the support device 208.

[0208] Figure 10It shows how a number of possibly different active and / or passive components 1000 - 1008 may be arranged on the back side 212 of the support device 208 , on or below the bridge 250 , and on or below the cantilever 1010 . Figure 10 It also shows that Figure 9 The arrangement of components 214, 252 above and below the bridge 250 is known. In some exemplary embodiments, one or more of these components 214, 252, 1000-1008 may be provided in different combinations. The planes in which the active and / or passive components are arranged are designated E1-E7. These correspond to the respective bottom sides of each component 214, 252, 1000-1008.

[0209] The active and / or passive component 1000 is arranged in plane E2, ie on the back side 212. It is not underneath the bridge 250 or the cantilever 1010, but is laterally offset beside them.

[0210] Active and / or passive components 1002 are arranged in plane E3. Plane E3 is perpendicular to planes of symmetry E2 and E1. However, plane E3 may also be at another angle to plane E2. In particular, "perpendicular" also includes deviations from the exact perpendicular, such as up to 20°, up to 10°, or up to 5°. Active and / or passive components 1002 are arranged on the inner side of posts 902 of bridge 250.

[0211] Active and / or passive components 1004 are arranged in a plane E4 that is parallel to and offset from planes E1 and E2. Active and / or passive components 1004 are arranged on a bottom side 1012 of the bridge 250 or span 904. The bottom side 1012 faces the back side 212 of the support device 208.

[0212] The active and / or passive components 1005 are arranged in a plane E5, which may also extend perpendicularly relative to the planes E1, E2 and / or E4 or extend at an angle thereto. The active and / or passive components 1005 are arranged on the outer side of the bridge 250 or the pillar 900.

[0213] Active and / or passive components 1006 are arranged on the top side 1014 of the cantilever 1010. They are arranged in a plane E6 that is parallel to (and possibly offset from) planes E1, E2, and / or E4. Top side 1014 faces away from back side 212. Similarly, active and / or passive components 1006 can be arranged on the bottom side 1016 of the cantilever 1010, or additional active and / or passive components (not shown) can be arranged there. The cantilever 1010 can be composed of a self-supporting portion 1018 and a foot portion 1020 that connects the self-supporting portion 1018 on one side to the support device 208, namely, to the back side 212. The free end 1022 of the cantilever 1010 is free and not connected to the back side 212. The active and / or passive components 1006 are fastened to the self-supporting portion 1018 of the cantilever 1010, but could similarly be arranged on the inner or outer side of the foot portion 1020. In this case, the corresponding plane E6 would be perpendicular to the planes E1 and E2.

[0214] also, Figure 10 The use of thermally conductive material 1024 (referred to as TIM, specifically thermal paste) is shown. It is provided in the gap 254 between the component 252 and the bridge 250 (in Figure 2 208 ), ensuring improved heat transfer between them. In some embodiments, the region 1026 (i.e., the side 212) between the bridge 250 and the support device 208 can be partially or completely filled with a thermally conductive material 1024, in particular potted with the thermally conductive material 1024. Additionally or alternatively, the bridge 250 can be thermally attached to at least one of the housing device 228 and / or the heat pipe 238 by means of a thermally conductive material (not shown). It is also possible that the cantilever 1010 (such as the bridge 250) is also thermally connected to the component 1008 and / or another of the aforementioned objects (support device 208, housing device 228, and / or heat pipe 238) by means of a thermally conductive material (not shown).

[0215] Figure 11 A partial cross section of a support device 208 is shown, in particular according to one of the aforementioned exemplary embodiments. For a better understanding, the optical element 202 and the active and / or passive components 252 are also (partially) shown. For a better overview, Figure 11 Not shown are the remaining components which may be provided according to the previous figures.

[0216] The support device 208 may be made of a composite material, such as a combination of Figure 8 In particular, the support device 208 may comprise a layer structure having an outer layer 1104 and an inner layer 1106. Figure 8 The explanations given regarding the layers 804 , 806 apply mutatis mutandis.

[0217] By way of example, two interior spaces 1108, 1110 are provided within the support device 208, each containing active and / or passive components 1112, 1114. The interior spaces 1108, 1110 are in the form of closed housings, which may in particular be vacuum-tight. The active and / or passive components 1112 are arranged in a plane E8, and the active and / or passive components 1114 are arranged in a plane E9, purely by way of example, the planes being parallel to each other and offset (i.e., spaced apart) from each other in a direction perpendicular to the main range plane 226 of the support device 208. The active and / or passive components 1112 , 1114 can be connected via electrical contact connections (through-holes) to an actuator and / or sensor unit, which is assigned to one of the optical elements 202 (see conduction path 1118 ), and / or to an active and / or passive component 252 arranged on the back side 212 , wherein two electrical contact connections are indicated, for example, by the reference numerals 1116 , 1118 .

[0218] exist Figure 11 In the example in FIG, active and / or passive components 252 and 1112 overlap in direction R.

[0219] One or more of the inner spaces 1108, 1110 can also be partially or completely filled with a thermally conductive material (referred to as TIM; not shown), in particular potted. Figure 8 All other aspects of the interior space 800.

[0220] Figure 12 A flow chart of a method for producing an optical system 200 is shown, as described in the previous figures.

[0221] In step S1, one or more optical elements 202 are mechanically connected to a support device 208. One or a respective actuator / sensor unit 206 assigned to an optical element 202 may be electrically connected to the support device 208, i.e., electrically connected to contact connections formed on or in the support device 208. A housing device 228 may also be attached to the support device 208.

[0222] In step S2 , at least two active and / or passive components 214 , 252 , 700 , 702 , 1000 , 1002 , 1004 , 1005 , 1006 , 1008 , 1112 , 1114 are arranged in two different planes E1 to E9 on or in the support device 208 .

[0223] In an optionally provided step S3 , the printed circuit board 218 is electrically conductively connected to the contact-connection device 214 .

[0224] In step S4 , the unit 302 preassembled in this manner is optionally mounted on the holding device 300 .

[0225] Although the present invention has been described using exemplary embodiments, the present invention can be modified in many ways.

[0226] Reference Signs List

[0227] 1Projection exposure equipment

[0228] 2 Lighting system

[0229] 3 light sources

[0230] 4 Illumination optical unit

[0231] 5 physical field

[0232] 6 Object Plane

[0233] 7 Mask Master

[0234] 8-Reticle Holder

[0235] 9Mask displacement driver

[0236] 10 projection optical units

[0237] 11 image fields

[0238] 12 image planes

[0239] 13 chips

[0240] 14 Wafer Holder

[0241] 15-chip displacement driver

[0242] 16 Lighting Radiation

[0243] 17 light collector

[0244] 18 intermediate focal plane

[0245] 19 deflecting mirror

[0246] 20 first facet reflector

[0247] 21 First Facet

[0248] 22 Second facet reflector

[0249] 23 Second facet

[0250] 200 optical system

[0251] 202 optical elements

[0252] 204 Radiation

[0253] 206 actuator unit and / or sensor unit

[0254] 208 support equipment

[0255] 210 side

[0256] 212 side

[0257] 214 contact connection device

[0258] 216 conduction path

[0259] 218 circuit board

[0260] 220 contact connection device

[0261] 222 end

[0262] 224 end

[0263] 226 Main Range Plane

[0264] 228 shell equipment

[0265] 230 interior space

[0266] 232 bracket components

[0267] 234 Radiator

[0268] 236 side surface

[0269] 238 heat pipes

[0270] 240 openings

[0271] 242 bag-shaped part

[0272] 244 end face

[0273] 246 end face

[0274] 250 bridge piece

[0275] 252 parts

[0276] 254 gap

[0277] 300 holding equipment

[0278] 302 pre-installed unit

[0279] 304 accommodation unit

[0280] 400 conductor tracks

[0281] 402 Main Range Plane

[0282] 404 microprocessor

[0283] 500 solder contact points

[0284] 600 spring

[0285] 700 parts

[0286] 702 parts

[0287] 704 filling material

[0288] 800 interior space

[0289] 802 shell

[0290] 804th floor

[0291] 806th floor

[0292] 900 pillars

[0293] 902 Pillar

[0294] 904 spanning section

[0295] 906 top and side

[0296] 1000 parts

[0297] 1002 parts

[0298] 1004 parts

[0299] 1005 parts

[0300] 1006 parts

[0301] 1008 parts

[0302] 1010 Cantilever

[0303] 1012 bottom and side

[0304] 1014 top and side

[0305] 1016 bottom and side

[0306] 1018 self-supporting part

[0307] 1020 foot part

[0308] 1022 free end

[0309] 1024 thermal conductive material

[0310] 1026 area

[0311] 1104th floor

[0312] 1106th floor

[0313] 1108 Interior Space

[0314] 1110 interior space

[0315] 1112 parts

[0316] 1114 parts

[0317] 1116 contact connection

[0318] 1118 contact connection

[0319] M1 reflector

[0320] M2 reflector

[0321] M3 reflector

[0322] M4 reflector

[0323] M5 reflector

[0324] M6 reflector

[0325] R direction

[0326] E1 to E9 planes

[0327] Steps S1 to S4

Claims

1. An optical system (200) for a lithographic apparatus (1), comprising: a plurality of optical elements (202) for guiding radiation (204), a supporting device (208) for supporting the optical element (202), and a plurality, N, of active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114), The active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114) are arranged in at least two different planes (E1-E9) on the supporting device (208), and the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114) are arranged on a side surface (212) of the supporting device (208).

2. The optical system according to claim 1, wherein At least two of the different planes (E1-E9) are parallel to each other and / or wherein at least two of the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114) overlap.

3. The optical system according to claim 1 or 2, wherein: The plurality of optical elements (202) are arranged on another side (210) of the support device (208); and / or At least a subset of the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114) is arranged on or below a bridge (250), the bridge being arranged on the one side (212) of the support device (208), or on or below a cantilever (1010), the cantilever being arranged on the one side (212) of the support device (208).

4. The optical system according to claim 3, wherein: At least a subset of the active and / or passive components (214, 1004, 1006) is arranged on a top side (906, 1014) of the bridge (250) or the cantilever (1010) and / or on a bottom side (1012, 1016) of the bridge (250) or the cantilever (1010).

5. The optical system according to claim 3 or 4, wherein: A first active and / or passive component (214, 1002, 1004, 1005, 1006) is arranged on the bridge (250) or the cantilever (1110), and a second active and / or passive component (252, 1008) is arranged below the bridge (250) or the cantilever (1110).

6. The optical system according to any one of claims 1 to 5, wherein: The support device (208) is made of a composite material forming at least one housing (1108, 1110), at least one of the active and / or passive components (1112, 1114) being arranged in the housing (1108, 1110).

7. The optical system according to any one of claims 3 to 6, wherein: A first subset N1 of the active and / or passive components (252, 700, 702, 1000, 1008, 1112, 1114) is arranged on the first side (212) of the support device (208), a second subset N2 of the active and / or passive components (214, 252, 1002, 1004, 1005, 1006, 1008) is arranged on or below the bridge (250), and the bridge is arranged on the support device (208). The active and / or passive components (1112, 1114) are arranged on the side surface (212) of the support device (208), or the second subset N2 is arranged on or below the cantilever (1010), the cantilever is arranged on the side surface (212) of the support device (208), and the third subset N3 of the active and / or passive components (1112, 1114) is arranged in the inner space (1108, 1110) of the support device (208) or the corresponding inner space (1108, 1110).

8. The optical system according to any one of claims 3 to 7, wherein: The bridge member (250) and / or the cantilever (1010) are made of ceramic.

9. The optical system according to any one of claims 1 to 8, wherein: The N active and / or passive components ( 214 , 252 , 700 , 702 , 1000 , 1002 , 1004 , 1005 , 1006 , 1008 , 1112 , 1114 ) include integrated circuits, processors, microprocessors, FPGAs, analog-to-digital converters, digital-to-analog converters, transistors, more particularly MOSFETs, capacitors, resistors, inductors and / or contact connection devices, more particularly plugs or sockets.

10. The optical system according to claim 9, wherein: The contact connection device (214) can be electrically connected to the circuit board (218), preferably detachably electrically connected to the circuit board (218), and the contact connection device (214) is arranged on the bridge (250) or on the cantilever (1010).

11. The optical system according to any one of claims 1 to 10, further comprising a housing device (228), the circuit board (218) being routed through the housing device (228), the housing device (228) being thermally conductively connected to at least one of the active and / or passive components (700, 702).

12. The optical system according to claim 11, wherein: A gap between the housing device (228) and the at least one active and / or passive component (700, 702) is filled with a thermally conductive material (704).

13. The optical system according to claim 12, wherein: The thermally conductive material (704) is thermally conductive paste.

14. The optical system according to any one of claims 1 to 13, wherein: The optical system (200) is in the form of an illumination optical unit (4) or a projection optical unit (10) of the lithographic apparatus (1).

15. A lithographic apparatus (1), more particularly an EUV or DUV lithographic apparatus, comprising an optical system (200) according to any one of claims 1 to 14.

16. An optical system (200) for a lithographic apparatus (1), comprising: a plurality of optical elements (202) for guiding radiation (204), a supporting device (208) for supporting the optical element (202), and a plurality, N, of active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114), wherein the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114) are arranged in at least two different planes (E1-E9) in the support device (208), wherein at least a subset of the active and / or passive components (214, 252, 700, 702, 1000, 1002, 1004, 1005, 1006, 1008, 1112, 1114) are arranged in a closed interior space (1108, 1110) of the support device (208), the closed interior space (1108, 1110) being a closed chamber or a closed housing.

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