Pixel defining layer preparation method

Abstract

The purpose of the present invention is to improve the reliability and lifetime of a display having not only a bright color but also a high resolution by implementing a color pattern on an electrode substrate. The present invention is a method for manufacturing a pixel defining layer, which is characterized by including the steps of applying and coating a photosensitive composition, pre-baking, exposing, developing, and post-baking, in which, after the post-baking step, the long axis length of a Red pixel is 15.8-19.8 [mu] m, the short axis length is 11.0-15.0 [mu] m, the conversion aperture ratio of the Red pixel is more than 25%, and the conversion aperture ratio of the Red pixel is more than 25%. Pixels having a size within the range of the present invention can achieve high resolution through a black PDL, and can produce a high brightness and long life display according to a driving voltage and current.

Description

Technical Field

[0001] The invention relates to a method for preparing a pixel defining layer of a light-emitting display device by utilizing a photosensitive composition. Background Art

[0002] Flat panel display devices widely use liquid crystal display devices (LCDs) and organic light emitting display devices (OLEDs). Organic light emitting display devices have advantages such as low power consumption, fast response speed, high color reproduction rate, high brightness, and a wide viewing angle.

[0003] The purpose of using polarizing films in organic light-emitting display devices is to shield light reflected from the panel after incident external light. However, the disadvantage is that due to the lack of bending properties, the polarizing films are not suitable for use in flexible devices.

[0004] To address this issue, methods have been proposed that utilize color filters, black matrices, and light-shielding inorganic films formed on the upper substrate. However, these methods have limitations in achieving the desired level of anti-reflection effect, and no specific alternative to polarizing films has been proposed.

[0005] In addition, colored patterns are used as red, green, and blue color filters not only in liquid crystal displays but also in organic light-emitting displays.

[0006] When preparing the colored pattern, various organic pigments, carbon black, and inorganic pigments are used as colorants, and the dispersed pigment dispersion is mixed with other compositions to form the pattern. The organic light-emitting display device made of the pixels formed in this way can achieve clearer colors. Summary of the Invention

[0007] Issues to be addressed

[0008] The inventors discovered that when forming a colored pattern, if the pixel size is smaller than the standard size for red, green, and blue pixels, the brightness decreases at the same drive voltage. Achieving equal brightness requires a higher drive voltage, which can shorten the lifespan. Conversely, increasing the pixel size increases the brightness and reduces the current and drive voltage. This improves the device's characteristics and lifespan, but it also has the disadvantage of making it difficult to achieve high definition. This led to the completion of the present invention.

[0009] In order to solve the above-mentioned drawbacks of the conventional technology, an embodiment of the present invention aims to provide a method for forming a coloring pattern of desired pixels of a certain size on an electrode substrate.

[0010] Make colors clearer, improve the reliability and extend the life of high-definition display devices.

[0011] Yet another embodiment aims to provide an organic light-emitting display device including a pixel defining layer prepared by the method.

[0012] Yet another embodiment aims to provide an electronic device including the organic light-emitting display device.

[0013] Problem Solutions

[0014] According to the present invention, the pixel defining layer preparation method includes: applying and coating a photosensitive composition; prebaking; exposure; development; and a post-baking treatment step. After the post-baking treatment step, the major axis length of the Red pixel is 15.8 to 19.8 μm, preferably 16.2 to 18.5 μm, and the minor axis length is 11.0 to 15.0 μm, preferably 11.6 to 14.5 μm. At this time, preferably, the converted aperture ratio of the Red pixel exceeds 25%.

[0015] Preferably, after the post-baking process, the major axis length of the Green pixel is 9.8 to 12.4 μm, and the minor axis length is 6.2 to 8.3 μm.

[0016] Preferably, after the post-baking process, the major axis length of the Blue pixel is 21.3 to 25.0 μm, and the minor axis length is 15.6 to 18.5 μm.

[0017] Preferably, after the post-baking process, the shape of the pixel can show the size of the major axis and the minor axis.

[0018] Preferably, the shape of the pixel is one or more of a rhombus, a square, a rectangle, an ellipse, a hexagon, an octagon and a circle.

[0019] Preferably, the oven temperature of the post-baking step is 210 to 300°C, more preferably 250 to 270°C.

[0020] More preferably, the post-baking step is performed for 30 to 120 minutes, and more preferably, for 60 to 120 minutes.

[0021] Preferably, the photosensitive composition comprises a colorant.

[0022] Preferably, the colorant comprises one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

[0023] Preferably, the content of the colorant in the total amount of the photosensitive composition is 1 to 40 wt %.

[0024] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0025] Preferably, the average particle size of the colorant is 20 nm to 110 nm.

[0026] Preferably, the photosensitive composition comprises a photolithography resin, and the photolithography resin comprises an acrylic binder resin, a cardo binder resin, or a combination thereof.

[0027] Preferably, the acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

[0028] Preferably, the cardo-based binder resin includes a repeating structure represented by the following Chemical Formula 1:

[0029] <Chemical Formula 1>

[0030]

[0031] In the chemical formula 1,

[0032] 1) R1 and R2 are independently hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0033] 2) R1 and R2 can form a ring between adjacent groups,

[0034] 3) m or n is independently an integer from 0 to 4,

[0035] 4) A1 and A2 are independently represented by the following Chemical Formula 2 or Chemical Formula 3,

[0036] <Chemical Formula 2>

[0037]

[0038] <Chemical Formula 3>

[0039]

[0040] In the chemical formula 2 and chemical formula 3,

[0041] 4-1) * indicates connected parts,

[0042] 4-2) R3 to R6 are independently hydrogen; deuterium; halogen; C6 to C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0043] 4-3) R3 to R6 can form a ring between adjacent groups,

[0044] 4-4)Y 1 and Y 2 Independently of each other, they are the following chemical formulas: Chemical Formula 6 or Chemical Formula 7,

[0045] <Chemical Formula 6>

[0046]

[0047] <Chemical Formula 7>

[0048]

[0049] In the chemical formula 6 and chemical formula 7,

[0050] 4-4-1)* indicates the bonding position,

[0051] 4-4-2) R9 is hydrogen or methyl ester;

[0052] 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 an alkoxycarbonyl group,

[0053] 4-4-4) L1 to L3 are independently: a single bond; a fluorenyl group; C2 to C 30 Alkylene; C6~C 30 arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group,

[0054] 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3,

[0055] 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein the ratio of A1 to A2 in the polymer chain is 9:1 to 1:9,

[0056] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0057] 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 an alkoxycarbonyl group,

[0058] 6-2) R' and R" may form a ring between adjacent groups,

[0059] <Chemical Formula 4>

[0060]

[0061] <Chemical Formula 5>

[0062]

[0063] In the chemical formula 4 and chemical formula 5,

[0064] 6-3)* indicates the bonding position,

[0065] 6-4) R7 to R8 are independently hydrogen; deuterium; halogen; C6 to C 30an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0066] 6-5) o and p are independently integers from 0 to 4,

[0067] 7) X2 is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0068] 8) The R', R", X2, L1 to L3, R1 to R8 and R 10 ~R13 Each of the following may be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; C6~C 30 aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 Alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0069] Preferably, the cardo-based resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

[0070] Preferably, the content of the cardo resin in the total amount of the photosensitive composition is 1 to 30 wt %.

[0071] Preferably, the photosensitive composition includes the reactive unsaturated compound in an amount of 1 to 40 wt % based on the total amount of the photosensitive composition.

[0072] Preferably, the photosensitive composition comprises: a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

[0073] In yet another specific example, preferably, the present invention provides a pixel defining layer prepared by the preparation method.

[0074] In yet another specific example, preferably, the present invention provides an organic light emitting display device comprising the pixel defining layer.

[0075] In yet another specific example, preferably, the present invention provides an electronic device, which includes the display device and a control unit for driving the display device.

[0076] Effects of the Invention

[0077] The present invention aims to achieve a color pattern on an electrode substrate, thereby improving the reliability and lifespan of a display device with clear colors and high definition. Specifically, forming pixels within the size range described in the present invention enables high-definition BlackPDL, and depending on the driving voltage and current, a display device with high brightness and long lifespan can be produced. BRIEF DESCRIPTION OF THE DRAWINGS

[0078] Figure 1 This is a schematic diagram of capturing red, green, and blue pixels.

[0079] Preferred embodiments of the present invention

[0080] According to the present invention, the pixel defining layer preparation method includes: applying and coating a photosensitive composition; prebaking; exposure; development; and a post-baking treatment step. After the post-baking treatment step, the major axis length of the Red pixel is 15.8 to 19.8 μm, preferably 16.2 to 18.5 μm, and the minor axis length is 11.0 to 15.0 μm, preferably 11.6 to 14.5 μm. At this time, preferably, the converted aperture ratio of the Red pixel exceeds 25%. DETAILED DESCRIPTION

[0081] Hereinafter, some embodiments of the present invention will be described in detail with reference to the accompanying drawings. When components of the drawings are denoted by reference numerals, the same components will be given the same numerals as much as possible even if they are shown in other drawings.

[0082] When describing the present invention, if a detailed description of a known component or function is deemed obscure to the main point of the present invention, such detailed description may be omitted. When the present invention uses the phrases "including," "having," "comprising," and "consisting of," other components may be added unless "to only" is used. When a component is expressed in the singular, the plural is also included unless otherwise specified.

[0083] Furthermore, terms such as first, second, A, B, (a), and (b) may be used in describing the components of the present invention. These terms are only used to distinguish one component from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0084] When describing the positional relationship between constituent elements, when mentioning that two or more constituent elements are "connected," "combined," or "accessed," it should be understood that the two or more constituent elements may be directly "connected," "combined," or "accessed," but may also be further "included" with the two or more constituent elements and other constituent elements to achieve "connection," "combination," or "access." The other constituent elements may include one or more of the two or more constituent elements that are "connected," "combined," or "accessed" to each other.

[0085] Furthermore, when a component such as a layer, film, region, or plate is located "on" or "above" another component, this should be understood to include not only being located "directly above" another component, but also being located between another component and another component. Conversely, when a component is located "directly above" another component, this should be understood to mean that there is no other component located between them.

[0086] When describing the time flow relationship related to constituent elements, working methods, or preparation methods, for example, when describing time sequence relationships or process sequence relationships such as "after", "followed by", "then", and "before", since "immediately" or "directly" is not used, discontinuous situations can be further included.

[0087] In addition, when referring to the numerical value of a constituent element or the corresponding information, even if not clearly stated separately, it should be interpreted that the numerical value or the corresponding information includes: the error range caused by various factors (for example, engineering factors, internal or external impact, noise, etc.).

[0088] Unless otherwise described, the terms used in this specification and the appended claims are as follows without departing from the scope of the present invention.

[0089] Unless otherwise stated, the term "halo" or "halogen" as used herein includes fluorine (F), chlorine (Cl), bromine (Br) and iodine (I).

[0090] Unless otherwise specified, the term "alkyl" or "alkyl group" used in this application contains 1 to 60 carbon atoms connected by single bonds, and refers to a free radical of a saturated aliphatic functional group represented by a straight-chain alkyl group, a branched-chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, or a cycloalkyl-substituted alkyl group.

[0091] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" used in the present application refers to an alkyl group substituted with halogen.

[0092] Unless otherwise specified, the term "alkenyl" or "alkynyl" used in this application respectively has a double bond or a triple bond, contains a linear or side chain group, and has 2 to 60 carbon atoms, but is not limited thereto.

[0093] Unless otherwise described, the term "cycloalkyl" used in the present application refers to a cyclic alkane having 3 to 60 carbon atoms, but is not limited thereto.

[0094] The term "alkoxy group" or "alkyloxy group" used herein refers to an alkyl group bonded to an oxygen radical and, unless otherwise specified, has 1 to 60 carbon atoms, but is not limited thereto.

[0095] The term "alkenoxyl group," "alkenoxy group," "alkenyloxyl group," or "alkenyloxy group" used herein refers to an alkenyl group to which an oxygen radical is attached, and unless otherwise specified, has 2 to 60 carbon atoms, but is not limited thereto.

[0096] Unless otherwise described, the terms "aryl group" and "arylene group" used in this application have 6 to 60 carbon atoms, respectively, but are not limited thereto. In this application, aryl group or arylene group include monocyclic, cyclopolymer, and fused polycyclic compounds. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a monovalent functional group of naphthalene, a fluorenyl group, and a substituted fluorenyl group. An arylene group may include a fluorenyl group and a substituted fluorenyl group.

[0097] As used herein, the term "ring assemblies" refers to rings composed of two or more ring systems (monocyclic or fused ring systems) directly linked by a single bond or a double bond, indicating that the number of directly linked rings is one less than the total number of ring systems contained in the compound. Ring assemblies can be composed of the same or different ring systems directly linked by a single bond or a double bond.

[0098] In the present application, the term "aryl group" includes cyclopolymers. Thus, the term "aryl group" includes biphenyl and terphenyl, which are monocyclic aromatic rings connected by single bonds to benzene rings. Furthermore, the term "aryl group" also includes compounds in which an aromatic ring system combined with an aromatic monocyclic ring is connected by a single bond. Thus, for example, the term "aryl group" also includes compounds in which an aromatic ring system combined with a benzene ring, i.e., fluorene, is connected by a single bond to an aromatic monocyclic ring.

[0099] The term "fused polycyclic ring system" as used in this application refers to a fused ring that shares at least two atoms, including: a fused form of two or more hydrocarbon ring systems and a fused form of at least one heterocyclic ring system containing at least one heteroatom. The fused polycyclic ring system can be an aromatic ring, an aromatic heterocyclic ring, an aliphatic ring, or a combination of such rings. For example, an aryl group can be a naphthyl group, a phenanthrenyl group, a fluorenyl group, etc., but is not limited thereto.

[0100] The term "spiro compound" as used herein refers to a 'spiro union,' where two rings share only one atom. In this case, the atom shared by the two rings is referred to as the 'spiro atom,' and compounds are designated as 'monospiro-, 'dispiro-, or 'trispiro-' compounds, depending on the number of spiro atoms present.

[0101] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group", and "fluorene-triyl group" used in this application respectively represent monovalent, divalent, or trivalent functional groups in which R, R', R", and R'" are all hydrogen in the following structures; "substituted fluorenyl group", "substituted fluorenylene group", or "substituted fluorene-triyl group" means that at least one of the substituents R, R', R", and R'" is a substituent other than hydrogen, including the case where R and R' are bonded to each other and form a spiro compound together with the carbon atoms to which they are bonded. In this specification, the fluorenyl group, fluorenylene group, and fluorene-triyl group are all named as fluorenyl group, regardless of the number of monovalent, divalent, or trivalent equivalents.

[0102]

[0103] Furthermore, R, R', R" and R'" may be independently an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclyl group having 2 to 30 carbon atoms. For example, the aryl group may be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclyl group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzofuran, or the like. furan), quinazoline or quinoxaline. For example, the substituted fluorenyl group and fluorenylene group can be monovalent or divalent functional groups of 9,9-dimethylfluorene, 9,9-diphenylfluorene and 9,9'-spirobi[9H-fluorene], respectively.

[0104] The term "heterocyclyl group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylenel group", but also non-aromatic rings. Unless otherwise specified, each refers to a ring containing one or more heteroatoms and having 2 to 60 carbon atoms, but is not limited thereto. Unless otherwise specified, the term "heteroatom" used in this application refers to N, O, S, P or Si, and a heterocyclyl group refers to a monocyclic ring, a cyclopolymer, a fused polycyclic system, a spiro compound, etc. containing a heteroatom.

[0105] For example, a "heterocyclyl group" may also replace a cyclic carbon, including the following compounds, and compounds containing heteroatom terminal groups such as SO2 and P=O.

[0106]

[0107] The term "ring" as used herein includes monocyclic and polycyclic rings, and of course, hydrocarbon rings include heterocyclic rings containing at least one heteroatom, and include aromatic and non-aromatic rings.

[0108] The term "polycyclic" as used in this application includes ring assemblies such as biphenyl and terphenyl and fused polycyclic rings and spiro compounds, including not only aromatic but also non-aromatic rings. Of course, hydrocarbon rings include heterocyclic rings containing at least one heteroatom.

[0109] As used herein, the term "aliphatic cyclo group" refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic rings, cyclopolymers, fused polycyclic rings, spiro compounds, and the like. Unless otherwise specified, this refers to a ring having 3 to 60 carbon atoms, but is not limited thereto. For example, the fused aromatic rings benzene and non-aromatic cyclohexane are also equivalent to aliphatic rings.

[0110] Furthermore, when prefixes are used consecutively, the substituents are arranged in the order in which they are described. For example, an arylalkoxy group represents an alkoxy group substituted with an aryl group, an alkoxycarbonyl group represents a carbonyl group substituted with an alkoxy group, and an arylcarbonylalkenyl group represents an alkenyl group substituted with an arylcarbonyl group. An arylcarbonyl group is a carbonyl group substituted with an aryl group.

[0111] Furthermore, unless otherwise specified, in the term "substituted or unsubstituted" used in this application, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C1-C 30 Alkyl group, C1~C 30 Alkoxy group, C1~C 30 Alkylamine group, C1~C 30 alkyl thiophene group, C6~C 30 arylthiophene group, C2~C 30 Alkenyl group, C2~C 30 Alkinyl group, C3~C 30 Cycloalkyl group, C6~C 30 aryl group, C6~C 30 aryl group, C8~C 30 aryl alkenyl group, silane group, boron group, germanium group and C2~C 30 The heterocyclic group, the C2~C 20 The heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si and P. The heterocyclic group is not limited by the substituents thereof.

[0112] In this application, the "functional group name" corresponding to the aryl group, arylenel group, heterocyclyl group, etc. described in each label and its substituent examples can be recorded as the "functional group name reflecting the valence" or as the "name of the parent compound." For example, "phenanthrene," as an aryl group, can be recorded as the name of the "group" according to the valence, such as "phenanthrene" for a monovalent "group" as "phenanthryl (group)" and "phenanthrylene (group)" for a divalent "group." However, it can also be recorded as the name of the parent compound, "phenanthrene," regardless of the valence.

[0113] Similarly, pyrimidone can be recorded as "pyrimidone" regardless of valence, or as "pyrimidinyl" (group) when monovalent, and as "group name" of the corresponding valence when divalent, such as "pyrimidinylene" (group). Therefore, in this application, when the type of substituent is recorded as the name of the parent compound, it can represent: an n-valent "group" formed by the withdrawal of hydrogen atoms bonded to carbon atoms and / or heteroatoms of the parent compound.

[0114] In addition, in this specification, when describing the names of compounds or substituents, numbers or alphabets indicating positions may be omitted. For example, pyrido[4,3-d]pyrimidone may be described as pyridopyrimidone, benzofuran[2,3-d]pyrimidone may be described as benzofuranpyrimidone, and 9,9-dimethyl-9H-fluorene may be described as dimethylfluorene. Therefore, benzo[g]quinoxaline or benzo[f]quinoxaline may both be described as benzoquinoxaline.

[0115] Furthermore, unless otherwise specified, the chemical formulae used in this application are also subject to the definitions of substituents according to the index definitions of the following chemical formulae.

[0116]

[0117] When a is an integer of 0, it represents a substituent R 1 When a is 0, the carbon atoms forming the benzene ring are all bonded to hydrogen atoms. In this case, the symbol of the hydrogen atoms bonded to the carbon atoms can be omitted and the chemical formula or compound can be described. 1 When a is an integer of 2 or 3, the bonding can be as follows. When a is an integer of 4 to 6, a similar method can be used to bond to the carbon of the benzene ring. When a is an integer of 2 or more, R 1 Can be the same or different.

[0118]

[0119] In the present application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a monocyclic ring or fused polycyclic rings. The monocyclic ring and the fused polycyclic rings include not only hydrocarbon rings but also heterocyclic rings. The heterocyclic ring contains at least one heteroatom and may include aromatic and non-aromatic rings.

[0120] In this specification, unless otherwise specified, when referring to a condensed ring, the number in the phrase "number-condensed ring" indicates the number of condensed rings. For example, a condensed ring containing three rings is represented as a 3-condensed ring, such as anthracene, phenanthrene, and benzoquinozoline.

[0121] In addition, unless otherwise specified, the term "bridged bicyclic compound" used herein refers to a compound in which two rings share three or more atoms to form a ring. In this case, the shared atoms may include carbon or heteroatoms.

[0122] In the present application, an organic electrical element refers to a component(s) between an anode and a cathode, or refers to an organic light emitting diode including an anode and a cathode and a component(s) therebetween.

[0123] Furthermore, depending on the circumstances, the display device of this application refers to an organic electrical element, an organic light-emitting diode, and a panel including the same, or an electronic device including a panel and a circuit. For example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (e.g., smartphones, tablets, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer monitors, etc., but is not limited to this. As long as it includes the aforementioned (several) components, any device in any form may be used.

[0124] Hereinafter, implementation examples of the present invention will be described in detail. However, these are merely examples and the present invention is not limited thereto but is defined solely by the scope of the following claims.

[0125] According to an embodiment of the present invention, a composition comprising a colorant may be used to prepare a red pattern, a green pattern, a blue pattern or a black matrix, or a pixel definition layer (PDL).

[0126] According to an implementation example of the present invention, the black pixel defining layer (PDL) may further include an additional colorant in addition to the colorant contained in the colorant, that is, an organic black pigment or a black dye. For example, the organic pigment can be used alone or in a mixture of an organic pigment and a coloring pigment. The advantage at this time is that, due to the insufficient light-shielding coloring pigment, even if the amount of the colorant is relatively increased, the strength of the film (layer) or the adhesion of the substrate will not decrease. According to an implementation example of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may include an additional colorant, that is, a black pigment or a black dye, to replace the colorant contained in the colorant.

[0127] Hereinafter, each component is described in detail.

[0128] 1. The preparation process of the negative pixel definition layer is as follows.

[0129] (1) Coating and coating steps

[0130] The photosensitive composition is a low-viscosity liquid reagent. To form a coating of a certain thickness after application to a substrate, a spin coater or slit coater is used. The advantage of a spin coater is that the higher the number of rotations, the thinner the coating, but the flatness deviation over the area decreases. For forming a coating on a large substrate, a slit coater is preferred over a spin coater. However, a disadvantage is that after the coating is formed, the surface becomes fluid due to residual solvent, resulting in a decrease in flatness. To overcome this drawback, a VCD (vacuum chamber dry) is used to locally remove the solvent to reduce surface fluidity.

[0131] (2) Pre-baking step

[0132] This process heats the coated substrate using a hot plate or oven at a specific temperature and time to partially remove the solvent contained in the coating film. If the surface or deep areas of the coating film are not dry, they can cause contamination of the photomask during the subsequent exposure process. When exposed to ultraviolet light, the exposed areas may not cure properly. If they are not cured, the development process will not form the pattern and will remove it.

[0133] (3) Exposure step

[0134] After the pre-bake process is complete, the film is cured by irradiating it with actinic radiation (ultraviolet light) through a patterned photomask. Actinic radiation can be generated by LEDs or metal (mercury) lamps, with wavelengths ranging from g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm). These can be used individually or in combination.

[0135] (4) Development step

[0136] During the exposure step, actinic radiation is irradiated, and the mask is divided into exposed and unexposed areas. In positive-type photoresist, the exposed areas are dissolved by the developer, while the unexposed areas resist the developer, leaving a pattern. In negative-type photoresist, the exposed areas are cured and resistant to the developer, while the unexposed areas are developed. The black pixel defining layer (Black PDL) prepared using a composition containing the colorant of the present invention is negative-type and can be divided into exposed (cured) and unexposed (developed) areas to form a pattern.

[0137] (5) Post-baking step

[0138] This process heats the developed substrate at temperatures above 210°C to remove residual solvent and moisture. If this process does not completely remove the solvent and moisture, residual solvent and moisture can affect the device after post-baking, resulting in dark spots or pixel shrinkage.

[0139] Preferably, the oven temperature of the post-baking step is 210 to 300°C, more preferably 250 to 270°C.

[0140] More preferably, the post-baking step is performed for 30 to 120 minutes, and more preferably, for 60 to 120 minutes.

[0141] After the post-baking step, the major axis length of the Red pixel is 15.8 to 19.8 μm, preferably 16.2 to 18.5 μm, and the minor axis length is 11.0 to 15.0 μm, preferably 11.6 to 14.5 μm. At this time, preferably, the converted aperture ratio of the Red pixel exceeds 25%.

[0142] Preferably, after the post-baking process, the major axis length of the Green pixel is 9.8 to 12.4 μm, and the minor axis length is 6.2 to 8.3 μm.

[0143] Preferably, after the post-baking process, the major axis length of the blue pixel is 21.3 to 25.0 μm, and the minor axis length is 15.6 to 18.5 μm.

[0144] After the post-baking process, the shape of the pixel is not limited as long as the size of the major axis or minor axis can be shown. Specifically, it can be a diamond, square, rectangle, ellipse, hexagon, octagon, circle, etc.

[0145] 2. The composition for forming the negative pixel defining layer containing the colorant is as follows.

[0146] (1) Resins for photolithography

[0147] According to an embodiment of the present invention, the photolithography resin may include a cardo-based binder resin.

[0148] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0149] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The first ethylenically unsaturated monomer may be present in an amount of 5% to 50% by weight, for example, 10% to 40% by weight, relative to the total amount of the acrylic binder resin.

[0150] The second ethylenically unsaturated monomer can be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, and vinylbenzyl methyl ether; an unsaturated carboxylic acid ester compound such as methyl (meta)acrylate, ethyl (meta)acrylate, butyl (meta)acrylate, 2-hydroxyethyl (meta)acrylate, 2-hydroxybutyl (meta)acrylate, benzyl (meta)acrylate, cyclohexyl (meta)acrylate, and benzene (meta)acrylate; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meta)acrylate and 2-dimethylaminoethyl (meta)acrylate; a carboxylic acid vinyl ester compound such as vinyl acetate; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meta)acrylate; a vinyl cyanide compound such as (meta)acrylonitrile; an unsaturated amide compound such as (meta)acrylamide; etc., and the like can be used alone or in combination of two or more.

[0151] Specific examples of the acrylic binder resin include: (m-) acrylic acid / benzyl methacrylate copolymer, (m-) acrylic acid / benzyl methacrylate / styrene copolymer, (m-) acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (m-) acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but are not limited thereto. They can also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin can be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0152] The cardo-based resin includes a repeating structure represented by the following Chemical Formula 1.

[0153] <Chemical Formula 1>

[0154]

[0155] In the chemical formula 1,

[0156] 1) R1 and R2 are independently hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0157] 2) R1 and R2 can form a ring between adjacent groups,

[0158] 3) m or n is independently an integer from 0 to 4,

[0159] 4) A1 and A2 are independently represented by the following Chemical Formula 2 or Chemical Formula 3,

[0160] <Chemical Formula 2>

[0161]

[0162] <Chemical Formula 3>

[0163]

[0164] In the chemical formula 2 and chemical formula 3,

[0165] 4-1) * indicates connected parts,

[0166] 4-2) R3 to R6 are independently hydrogen; deuterium; halogen; C6 to C 30an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0167] 4-3) R3 to R6 can form a ring between adjacent groups,

[0168] 4-4) Y1 and Y2 are independently represented by the following chemical formula: Chemical Formula 6 or Chemical Formula 7,

[0169] <Chemical Formula 6>

[0170]

[0171] <Chemical Formula 7>

[0172]

[0173] In the chemical formula 6 and chemical formula 7,

[0174] 4-4-1)* indicates the bonding position,

[0175] 4-4-2) R9 is hydrogen or methyl ester;

[0176] 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 an alkoxycarbonyl group,

[0177] 4-4-4) L1 to L3 are independently: a single bond; a fluorenyl group; C2 to C 30 Alkylene; C6~C 30 arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group,

[0178] 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3,

[0179] 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein the ratio of A1 to A2 in the polymer chain is 9:1 to 1:9,

[0180] 6) X1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0181] 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 an alkoxycarbonyl group,

[0182] 6-2) R' and R" may form a ring between adjacent groups,

[0183] <Chemical Formula 4>

[0184]

[0185] <Chemical Formula 5>

[0186]

[0187] In the chemical formula 4 and chemical formula 5,

[0188] 6-3)* indicates the bonding position,

[0189] 6-4) R7 to R8 are independently hydrogen; deuterium; halogen; C6 to C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0190] 6-5) o and p are independently integers from 0 to 4,

[0191] 7) X2 is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group,

[0192] 8) The R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 Each of the following may be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C1~C 30 Alkylthio group; C1~C 30Alkoxy group; C6~C 30 aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 Alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0193] The R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 When it is an aryl group, it is preferably C6 to C 30 The aryl group, more preferably, may be C6 to C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, or the like.

[0194] The R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 When it is a heterocyclic group, it is preferably C2 to C 30 The heterocyclic group (heterocyclyl group), further preferably, can be C2~C 18The heterocyclyl group may be, for example, dibenzofuran, dibenzothiophene, naphthobenzothiophene, naphthobenzofuran, or the like.

[0195] The R', R", R1 to R8 and R 10 ~R 13 When it is a fluorenyl group, preferably, it may be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, or the like.

[0196] When the L1 to L3 are arylene groups, preferably, they can be C6 to C 30 The arylene group, more preferably, may be C6 to C 18 The arylene group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, or the like.

[0197] The R', R", X2, R1 to R8 and R 10 ~R 13 When it is an alkyl group, it can be preferably C1 to C 10 The alkyl group may be, for example, a methyl group, a t-butyl group, or the like.

[0198] The R', R", X2, R1 to R8 and R 10 ~R 13 When it is an alkoxy group, it can be preferably C1 to C 20 The alkoxy group, more preferably, can be C1 to C 10 The alkoxy group may be, for example, a methoxy group, a t-butyloxy group, or the like.

[0199] The R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 The ring formed by bonding between adjacent groups can be C6 to C 60Aromatic ring group; fluorenyl group; C2~C 60 heterocyclic group; or C3~C 60 For example, when adjacent groups are bonded to each other to form an aromatic ring, preferably, a C6 to C 20 The aromatic ring can further preferably form a C6 to C 14 The aromatic ring can form, for example, benzene, naphthalene, phenanthrene, etc.

[0200] For example, the cardo resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-oxiranemethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0201] The weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. If the weight average molecular weight of the resin is within the range, no residue is generated when the pattern layer is prepared, the pattern forming effect is good, and during development, there is no loss in film thickness, and a good pattern can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30 weight %, and more preferably, the content can be 3 to 20 weight %. When the content of the resin is within the range, excellent sensitivity, developability and adhesion (tightness) can be obtained.

[0202] (2) Reactive unsaturated compounds

[0203] Reactive unsaturated compounds are essential components of negative patterns. They have ethylene unsaturated double bonds. Therefore, when exposed during the pattern formation process, they can initiate sufficient polymerization to form patterns with excellent heat resistance, light resistance, and chemical resistance.

[0204] Specific examples of the reactive unsaturated compound include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0205] Examples of commercially available products of the reactive unsaturated compound are as follows.

[0206] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Chemical Co., Ltd.; V-260, V-312, V-335HP, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0207] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. from Nippon Chemical Co., Ltd.; V-295, V-300, V-360, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0208] The above products can be used alone or in combination of two or more.

[0209] To achieve even better developability, the reactive unsaturated compound may be treated with an acid anhydride before use. The content of the reactive unsaturated compound in the total amount of the photosensitive resin composition may be 1 to 40% by weight, for example, 1 to 20% by weight. When the content of the reactive unsaturated compound is within this range, sufficient curing is initiated during exposure during the pattern forming process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the resulting pattern, and excellent clarity and adhesion.

[0210] (3) Photoinitiator

[0211] In order to present a negative pattern through a photolithography machine, a photoradical initiator is required. The molar absorption coefficient of the photoinitiator in the 330 to 380 nm region is 10,000 (L / mol·cm) or more, and the temperature at which the photoinitiator undergoes a 5% weight loss is 200°C or less. The molar absorption coefficient can be calculated using the beer-Lambert Law. In addition, TGA was used to detect the weight loss in a nitrogen atmosphere at a rate of 5°C per minute to 300°C.

[0212] The photopolymerization initiator is generally used in a photosensitive resin composition, and for example, acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoic acid ketone compounds, triazine compounds, etc. may be used.

[0213] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane-1-one, etc.

[0214] For example, the benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0215] For example, the thioxanthone compounds include thioxanthone, 2-chlorothiazolone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like.

[0216] For example, the benzoyl ketone compounds include benzoyl ketone, benzoyl ketone methyl ether, benzoyl ketone ethyl ether, benzoyl ketone isopropyl ether, benzoyl ketone isobutyl ether, benzyl dimethyl ketal, and the like.

[0217] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, (Trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylethylene-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl (piperonyl)-6-triazine, 2-4-trichloromethyl (4'-methoxyphenylethylene)-6-triazine, etc.

[0218] In addition to compounds, the photoinitiator may also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, and the like.

[0219] The photoinitiator as a free radical polymerization initiator may be a peroxide compound, an azobis compound, or the like.

[0220] For example, the peroxide compounds include: ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methylcyclohexanone peroxide, acetylacetone peroxide, etc.; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, di-3,5,5-trimethylhexanoyl peroxide, etc.; hydrogen peroxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, isopropylbenzene hydroperoxide, t-butyl hydroperoxide, etc.; diisopropylbenzene peroxide, 2,5-dimethyl-2,5-di(t-butylperoxide) dialkyl peroxides such as butyl peroxy(2,4,4-trimethylpentylperoxyphenoxyacetate, α-peroxyneodecanoate cumyl, t-butylperoxybenzoic acid, di-t-butylperoxytrimethyladipic acid, etc.; percarbonates such as di-3-methoxybutyl peroxydicarbonate, di-2-ethylhexyl peroxydicarbonate, bis-4-t-cyclohexyl butyl peroxydicarbonate, diisopropyl peroxydicarbonate, acetyl peroxycyclohexylsulfonyl, t-butylperoxycarbonate, etc.

[0221] For example, the azobis compounds include: 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2,-azobis(methyl isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile) and 4,4'-azobis(4-cyanovaleric acid).

[0222] The photoinitiator absorbs light and transitions to an excited state, where it transfers energy, allowing it to be used in conjunction with a photosensitizer that undergoes a chemical reaction. Examples of such photosensitizers include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0223] The photoinitiator content can be 0.01 to 10% by weight, for example, 0.1 to 5% by weight, of the total amount of the photosensitive composition. When the photoinitiator content is within this range, sufficient curing is initiated during exposure during the pattern formation process, resulting in excellent reliability, excellent heat resistance, light resistance, and chemical resistance of the resulting pattern, and excellent clarity and adhesion. Furthermore, a decrease in transmittance caused by unreacted initiator can be prevented.

[0224] (4) Colorant

[0225] Both organic pigments and inorganic pigments and dyes can be used as the colorant.

[0226] The colorant may be a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, or the like.

[0227] For example, the red pigments include CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89, and the like.

[0228] For example, the green pigment includes halogen-substituted copper phthalocyanine pigments, such as CI Green Pigment 36, CI Green Pigment 7, and the like.

[0229] For example, the blue pigment includes copper phthalocyanine pigments such as CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, and CI blue pigment 16.

[0230] For example, the yellow pigments include isoindoline pigments such as CI Yellow Pigment 139, quinophthalone pigments such as CI Yellow Pigment 138, and nickel composite pigments such as CI Yellow Pigment 150.

[0231] For example, the black pigment includes lactam black, aniline black, perylene black, titanium black, carbon black, and the like.

[0232] Furthermore, according to an embodiment, the colorant in the photosensitive resin composition may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine compound.

[0233] The above components can be used as the pigment and dye alone or in combination of two or more, and are not limited thereto.

[0234] The black pigment in the above components can be used to effectively shield the light-shielding layer. When using the black pigment, it can also be used together with a color-correcting agent such as anthraquinone pigments, perylene pigments, phthalocyanine pigments, and azo pigments.

[0235] In order to disperse the pigment on the photosensitive resin composition, a dispersant may be used together. Specifically, the pigment may be surface-pretreated with a dispersant before use, or a dispersant may be added together with the pigment during the preparation of the photosensitive resin composition.

[0236] The dispersant may be a nonionic dispersant, a negative ionic dispersant, a positive ionic dispersant, etc. Specific examples of the dispersant include polyalkylene glycol and its esters, polyoxyalkylene, oxyalkylene polyol ester additives, alcohol alkylene oxide additives, sulfonic acid esters, sulfonic acid salts, carboxylic acid esters, carboxylates, oxyalkylene alkylamide additives, and alkylamines. These may be used alone or in combination of two or more.

[0237] The dispersant products on sale include, for example, DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemicals; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000, etc.; or PB711, PB821, etc. from Ajinomoto.

[0238] The dispersant may be present in an amount of 0.1 to 15 wt % of the total weight of the photosensitive resin composition. When the dispersant content is within this range, the composition exhibits excellent dispersibility, resulting in excellent stability, developability, and patterning when a light-shielding layer is prepared.

[0239] The pigment can also be pre-treated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is used after the pre-treatment, the average particle size of the pigment can be refined.

[0240] The pretreatment is achieved by kneading the pigment together with a water-soluble inorganic salt and a wetting agent; and then filtering and washing the pigment obtained in the kneading step.

[0241] The kneading may be performed at a temperature of 40° C. to 100° C., and the filtering and washing may be performed by washing the inorganic salt with water or the like and filtering.

[0242] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0243] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby serving as a medium for easily crushing the pigment. Examples of the wetting agent include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; and alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol. These can be used alone or in combination of two or more.

[0244] The pigment after the kneading step may have an average particle size of 100 nm or less. When the average particle size of the pigment is within the above range, not only heat resistance and light resistance are excellent, but also fine patterns can be effectively formed.

[0245] The content of the pigment in the total amount of the photosensitive resin composition may be 1 to 40 weight %, more specifically 2 to 30 weight %. When the pigment is included within this range, color reproduction is excellent, and the curability and adhesion of the pattern are also excellent.

[0246] (5) Solvent

[0247] The solvent is compatible with the cardo resin, the reactive unsaturated compound, the pigment, the cardo compound, and the initiator, and a non-reactive substance may be used.

[0248] For example, the solvents include: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, anisole, and tetrahydrofuran; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; glycol ethyl acetate such as methoxyethyl acetate, ethoxyethyl acetate, and diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol. Propylene glycol alkyl ether acetates such as methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-di-n-amyl ketone, 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate; lactic acid esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, methyl oxyacetate, butyl oxyacetate; methoxy Alkoxyacetic acid alkyl esters such as methyl acetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate, ethyl 3-oxopropionate, etc.; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, propyl 2-oxopropionate, etc.; 2-oxopropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-oxopropionate, etc. 2-alkoxypropionic acid alkyl esters such as ethyl 2-methoxypropionate and methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, and methyl 2-hydroxy-3-methylbutanoate; keto acid esters such as ethyl pyruvate, etc.

[0249] In addition, high-boiling-point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol phenyl ether acetate can be used.

[0250] Taking into account the compatibility and reactivity of the solvent, glycol ethers such as ethylene glycol monoethyl ether; glycol acetate alkoxy ethers such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0251] The solvent may be included in the total amount of the photosensitive resin composition as a balance, specifically, in an amount of 40 to 90% by weight. When the solvent content is within the above range, the photosensitive resin composition can have an appropriate viscosity, thereby achieving excellent processability when preparing a pattern layer.

[0252] (6) Other additives

[0253] In order to prevent the occurrence of marks or spots, improve the leveling performance, and prevent the generation of residues due to undevelopment when applying the photosensitive composition, the composition may further contain additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl group or a (meth)acryloxy group; a leveling agent; a fluorine-based surfactant; and a free radical polymerization initiator.

[0254] For example, in order to improve adhesion to a substrate, the photosensitive resin composition may further contain a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloyl group, an isocyanate group, or an epoxy group.

[0255] For example, the silane coupling agent includes trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltrioxysilane, γ-glycidoxypropyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, etc., which can be used alone or in combination of two or more.

[0256] The weight of the silane coupling agent can be 0.01 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the weight of the silane coupling agent is within the above range, excellent adhesion and storage properties are achieved.

[0257] Furthermore, the photosensitive resin composition may further include a surfactant, such as a fluorine-based surfactant, as needed. The surfactant has the effects of improving coating properties and preventing defects.

[0258] The fluorine-based surfactant can use the following fluorine-based surfactants on the market: BM Chemie's BM- ,BM- etc.; Dainippon Ink & Chemicals Co., Ltd.'s Mecha Pack F 、Same style F 、Same style F 、Same style F etc.; Sumitomo 3M Co.'s lard FC- 、Same FC- 、Same FC- 、Same FC- etc.; Asahi Glass Co., Ltd.'s Saffron S- , same style S- , same style S- , same style S- 、Same model etc.; SH- 、Same Style- 、Same Style- 、SZ- , SF- wait.

[0259] The surfactant may be present in an amount of 0.001 to 5 parts by weight per 100 parts by weight of the photosensitive resin composition. When the surfactant is present within this range, coating uniformity is ensured, streaking is avoided, and wettability on the glass substrate is excellent. Furthermore, the photosensitive resin composition may contain a certain amount of other additives, such as antioxidants and stabilizers, without compromising its physical properties.

[0260] In another implementation example, the photosensitive resin composition may be used to perform photolithography on a pixel separation portion of an organic light-emitting element electrode.

[0261] Hereinafter, the synthesis examples and examples of the present invention will be described in detail, but the synthesis examples and examples of the present invention are not limited thereto.

[0262] (Preparation of Black Photosensitive Composition)

[0263] Synthesis Example 1: (Chemical Formula 8 represents the preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene)

[0264] 20 g of 9,9'-bisphenolfluorene (Sigma-Aldrich), 8.67 g of glycidol chloride (Sigma-Aldrich), 30 g of anhydrous potassium carbonate, and 100 ml of dimethylformamide were placed in a 300 ml three-necked round-bottom flask equipped with a distillation tube. The mixture was heated to 80°C and allowed to react for 4 hours. The temperature was then lowered to 25°C, and the reaction mixture was filtered. The filtrate was then added dropwise to 1000 ml of water with stirring. The precipitated powder was filtered, washed with water, reduced pressure at 40°C, and dried to obtain 25 g of 9,9-bis(4-glycidyloxy)phenyl]fluorene (Compound 8 below). HPLC analysis of the powder revealed a purity of 98%.

[0265] <Chemical Formula 8>

[0266]

[0267] Synthesis Example 2: Preparation of Cardo-based binder resin

[0268] 25 g (54 mmol) of Compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Oi Kakin Co., Ltd.), 0.2 g of triethylbenzyl ammonium chloride (Oi Kakin Co., Ltd.), 0.2 g of hydroquinone (Oi Kakin Co., Ltd.), and 52 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.) were placed in a 300 ml three-necked round-bottom flask equipped with a distillation tube and stirred at 110°C for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were further added, and the mixture was stirred at 110°C for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed, revealing a cardo-based binder resin having a molecular weight of 4,580 and a solid powder content of 45%.

[0269] Preparation Example 1: Preparation of black pigment dispersion

[0270] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK) and 8.5 g of SR-3613 (SMS) were mixed.

[0271] 6.5 g of propylene glycol methyl ether acetate, 70 g of zirconia beads with a diameter of 0.5 mm (Toray Co., Ltd.) were dispersed for 10 hours to obtain a dispersion.

[0272] The components in Table 1 below were used to prepare a photosensitive composition solution.

[0273] Specifically, an initiator is dissolved in a solvent, then stirred at room temperature. A binder resin and a polymerizable compound are then added, stirring at room temperature. A colorant and other additives are then added to the resulting reaction mixture, stirring at room temperature. The resulting mixture is then filtered three times to remove impurities, thereby preparing a photosensitive resin composition.

[0274]

Table 1

[0275] Composition ratio (%) Black pigment dispersion (Preparation Example 1) 23 Cardo binder (Synthesis Example 2) 15 Miraemer M600 (Mihara Chemical Co., Ltd.) 12.5 PBG-304(Trony) 0.5 Propylene glycol methyl ether acetate 49

[0276] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0277] (1) Coating and coating steps

[0278] A photosensitive composition was applied to a clean, metal-evaporated 10cm*10cm substrate using a spin coater to a predetermined thickness. The solvent was then partially removed using a vacuum chamber dryer (VCD) to form a film. The resulting film thickness after VCD ranged from 2.0 to 1.7 microns.

[0279] (2) Pre-baking step

[0280] The resulting coating is heated on a hot plate at 80°C to 120°C for 50 to 200 seconds to remove the solvent. This process removes a sufficient amount of solvent to minimize pixel mask contamination during the next process (exposure), resulting in a clean pattern.

[0281] (3) Exposure step

[0282] The coating film obtained above is interspersed with a mask of a given shape to form the desired pattern and a certain thickness. Then, an exposure machine is used to irradiate the film with actinic radiation of 190nm to 600nm. Preferably, a metal light source with ghi-line or an LED light source can be used to form the pattern. The exposure dose for pattern formation is 20 to 150mJ / cm 2 And negative type photosensitive resist material.

[0283] (4) Development step

[0284] After the exposure step, the film was developed by dipping using a 2.38 wt% TMAH (tetramethylammonium hydroxide) developer at 23±2°C for a predetermined time (minutes). The film was then rinsed with deionized water (DI water) to dissolve and remove the unexposed areas, leaving only the exposed areas, to form an image pattern. The film thickness ranged from 1.70 to 1.90 μm.

[0285] (5) Post-baking step

[0286] In order to obtain the image pattern obtained by the development, a post-baking process is performed in an oven at 210 to 300° C. for 30 to 120 minutes to completely remove the solvent. After the pattern is solidified to form a film, the size of each pixel is measured.

[0287] (6) Pixel size detection

[0288] After forming a pattern on a substrate using the photosensitive composition through steps (1) to (5) above, the pixel sizes of red, green, and blue were measured. During the exposure step, pixel size was adjusted based on the exposure dose. Under the same development conditions, lower exposure doses resulted in larger pixels, while higher exposure doses resulted in smaller pixels. The pixel size of the prepared substrate was measured using a Nikon ECLIPSE ME600 optical microscope.

[0289] (7) Component reliability evaluation

[0290] A patterned substrate with a pixel definition layer (PDL) of varying pixel sizes is formed. Then, to evaluate the reliability of the device, organic materials are evaporated to confirm reliability factors such as driving voltage (V), electric current, luminance, and lifespan.

[0291] Table 2 below discloses the component substrates prepared by the above method and their test results.

[0292]

Table 2

[0293]

[0294]

[0295] ※Brightness = based on 14.20J / ※Current density = based on 1000nit / ※Lifespan = based on 1000nit

[0296] ※Converted aperture ratio = convert the total of the actual aperture ratios of R / G / B to 100%

[0297] Conversion aperture ratio 100% ± 10% (90% & 110%) = [Red pixel conversion aperture ratio 25% ± 10% (22.5% & 27.5%)] + [Green pixel conversion aperture ratio 32% ± 10% (27.9% &

[0298] 34.1%)] + [Blue pixel conversion aperture ratio 43% ± 10% (37.8% & 46.2%)]

[0299] ※The total actual aperture ratio of R / G / B is 25% = [Red pixel aperture ratio 6.25%] +

[0300] [Green pixel aperture ratio 8%] + [Blue pixel aperture ratio 10.75%]

[0301] After the post-baking step, the pixel substrate obtained in the process was used to make components, and the brightness, current and lifespan were compared. Referring to Comparative Example 1 in Table 2 above, it can be confirmed that if the pixel size becomes smaller and the current value is fixed at 14.2J, the brightness is reduced from 1000nit to 833nit. Under the same brightness standard, the current density becomes higher and the lifespan is reduced. When the pixel size becomes larger, the brightness increases to 1250nit, and the lifespan tends to increase. However, as the pixel size becomes larger, the number of pixels achieved per unit area will decrease, and accordingly, the realization of high definition becomes difficult. It has been confirmed that, as shown in Table 2 above, when the converted aperture ratio is reduced to 80%, the lifespan will be reduced by more than 100 hours relative to the converted aperture ratio of 100%. It can be seen from this that as the aperture ratio decreases, the current amount will increase in order to present the same brightness, which will put pressure on the components and reduce their lifespan.

[0302] According to the present invention, after post-baking, the red pixel size of the panel is smaller than the range of 15.8 to 19.8 μm on the major axis and 11.0 to 15.0 μm on the minor axis. When the converted aperture ratio of the red pixel falls below 25%, brightness decreases, and the increased power and driving voltage shorten the lifespan. Furthermore, when the pixel size exceeds this range, while the increased aperture ratio improves efficiency, it is impossible to produce a high-definition panel.

[0303] According to the present invention, after post-baking, the green pixel size of the panel is smaller than 8.0 to 13.0 μm on the major axis and 6.0 to 9.0 μm on the minor axis. When the converted aperture ratio of the green pixel falls below 32%, brightness decreases, and the increase in power and driving voltage leads to a shortened lifespan. Furthermore, when the pixel size exceeds this range, while the increased aperture ratio improves efficiency, it is impossible to produce a high-definition panel.

[0304] According to the present invention, after post-baking, the blue pixel size of the panel is smaller than 20.5 to 25.5 μm on the major axis and 15.0 to 19.0 μm on the minor axis. When the converted aperture ratio of the blue pixel falls below 43%, brightness decreases, and the increase in power and driving voltage shortens the lifespan. Furthermore, when the pixel size exceeds this range, while the increased aperture ratio improves efficiency, it is impossible to produce a high-definition panel.

[0305] The above description is merely an example of the present invention, and anyone skilled in the art in the art can make various modifications without departing from the essential characteristics of the present invention.

[0306] Therefore, the embodiments disclosed in this specification are used to describe the present invention rather than to limit the present invention, and the concept and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be interpreted in accordance with the following claims and should be interpreted as including all technologies within the scope of the claims and equivalents thereof.

[0307]

Possibility of industrial application

[0308] The invention relates to a method for preparing a pixel defining layer of a light-emitting display device by utilizing a photosensitive composition.

Claims

1. A method for preparing a pixel definition layer, characterized in that: include: The steps of applying and coating the photosensitive composition; pre-baking; exposing; developing; and post-baking treatment, After the post-bake process, the major axis length of the red pixel is 15.8 to 19.8 μm, the minor axis length is 11.0 to 15.0 μm, and the converted aperture ratio of the red pixel exceeds 25%.

2. The method for preparing a pixel defining layer according to claim 1, wherein: After the post-baking process, the major axis length of the Red pixel is 16.2 to 18.5 μm, and the minor axis length is 11.6 to 14.5 μm.

3. The method for preparing a pixel defining layer according to claim 1, wherein: After the post-baking process, the major axis length of the Green pixel is 9.8 to 12.4 μm, and the minor axis length is 6.2 to 8.3 μm.

4. The method for preparing a pixel defining layer according to claim 1, wherein: After the post-baking process, the major axis length of the blue pixel is 21.3 to 25.0 μm, and the minor axis length is 15.6 to 18.5 μm.

5. The method for preparing a pixel defining layer according to claim 1, wherein: After the post-baking process, the shape of the pixel can show the size of the major axis and the minor axis.

6. The method for preparing a pixel defining layer according to claim 5, wherein: The pixel has one or more shapes selected from the group consisting of a diamond, a square, a rectangle, an ellipse, a hexagon, an octagon, and a circle.

7. The method for preparing a pixel defining layer according to claim 1, wherein: The oven temperature of the post-baking step is 250 to 270°C.

8. The method for preparing a pixel defining layer according to claim 1, wherein: The post-baking step is performed for 60 to 120 minutes.

9. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition includes a colorant.

10. The method for preparing a pixel defining layer according to claim 9, wherein: The colorant includes one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

11. The method for preparing a pixel defining layer according to claim 9, wherein: The content of the colorant in the total amount of the photosensitive composition is 1 to 40 wt %.

12. The method for preparing a pixel defining layer according to claim 9, wherein: The colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

13. The method for preparing a pixel defining layer according to claim 9, wherein: The average particle size of the colorant is 20 nm to 110 nm.

14. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition includes a photolithography resin, and the photolithography resin includes a cardo-based binder resin or a combination thereof.

15. The method for preparing a pixel defining layer according to claim 14, wherein: The cardo-based binder resin includes a repeating structure represented by the following Chemical Formula 1: <Chemical Formula 1> In the chemical formula 1, 1) R1 and R2 are independently hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 2) R1 and R2 can form a ring between adjacent groups, 3) m or n is independently an integer from 0 to 4, 4) A1 and A2 are independently represented by the following Chemical Formula 2 or Chemical Formula 3, <Chemical Formula 2> <Chemical Formula 3> In the chemical formula 2 and chemical formula 3, 4-1) * indicates connected parts, 4-2) R3 to R6 are independently hydrogen; deuterium; halogen; C6 to C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 4-3) R3 to R6 can form a ring between adjacent groups, 4-4) Y1 and Y2 are independently represented by the following chemical formula: Chemical Formula 6 or Chemical Formula 7, <Chemical Formula 6> <Chemical Formula 7> In the chemical formula 6 and chemical formula 7, 4-4-1)* indicates the bonding position, 4-4-2) R9 is hydrogen or methyl ester; 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 4-4-4) L1 to L3 are independently: a single bond; a fluorenyl group; C2 to C 30 Alkylene; C6~C 30 arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group, 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3, 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein the ratio of A1 to A2 in the polymer chain is 9:1 to 1:9, 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5, 6-1) R' and R" are independently hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 6-2) R' and R" may form a ring between adjacent groups, <Chemical Formula 4> <Chemical Formula 5> In the chemical formula 4 and chemical formula 5, 6-3)* indicates the bonding position, 6-4) R7 to R8 are independently hydrogen; deuterium; halogen; C6 to C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 6-5) o and p are independently integers from 0 to 4, 7) X2 is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A condensed ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 Alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 8) The R', R", X2, L1 to L3, R1 to R8 and R 10 ~R 13 Each of the following may be further substituted with one or more substituents selected from the group consisting of: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; C6~C 30 aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 Alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

16. The method for preparing a pixel defining layer according to claim 14, wherein: The cardo-based resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

17. The method for preparing a pixel defining layer according to claim 14, wherein: The content of the cardo resin in the total amount of the photosensitive composition is 1 to 30 weight %.

18. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition includes a reactive unsaturated compound in an amount of 1 to 40 wt % based on the total amount of the photosensitive composition.

19. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition comprises a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

20. A pixel defining layer prepared according to claim 1. 21 . An organic light emitting display device comprising the pixel defining layer according to claim 20 .

22. An electronic device, characterized in that: The invention comprises the display device according to claim 21 and a control unit for driving the display device.

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