Reflow soldering positioning device

Abstract

The invention discloses a reflow soldering positioning device, which comprises a first functional part, a second functional part, a plurality of soldering tables, a plurality of first accommodating spaces, a plurality of second functional parts and a plurality of second functional parts, and is characterized in that a substrate is provided with a plurality of soldering tables, and the first accommodating spaces are used for accommodating to-be-soldered parts; a plurality of second containing spaces are formed in the second functional part, and the second containing spaces are used for containing welding tables; and the pressure applying piece is detachably assembled to the first functional piece, the pressure applying piece is provided with a plurality of pressure applying parts, the pressure applying parts are used for applying preset acting force to the to-be-welded piece located in the first containing space, and the preset acting force extends in the first direction. Compared with the prior art, the reflow soldering positioning device provided by the invention can limit the horizontal position of each TPAK power module by arranging the first functional part, the second functional part and the pressure applying part, ensures the consistency of the horizontal positions of the TPAK power modules after soldering, can effectively control the splashing and overflowing degree of soldering flux, and improves the welding quality of the TPAK power modules. And the flatness of each TPAK power module in the gravity direction is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of reflow soldering devices, in particular to a reflow soldering positioning device. Background Art

[0002] Currently, when the TPAK power module is undergoing formic acid reflow soldering, the TPAK power module plane is in direct contact with the substrate, and the reflow soldering of the solder layer is achieved through heat conduction.

[0003] Because TPAK power modules are relatively heavy, thicker solder sheets are usually used as solder for welding. This will cause undesirable phenomena such as solder splashing, overflow, and single tube drift and tilt during welding, which greatly affects the consistency of product quality and production qualification rate. Summary of the Invention

[0004] The purpose of the present invention is to provide a reflow soldering positioning device to solve the technical problems of random position drift and tilting, as well as solder splashing and overflowing of TPAK power modules during formic acid reflow soldering in the prior art.

[0005] The present invention provides a reflow soldering positioning device, comprising:

[0006] A first functional component is detachably assembled on a substrate, the substrate is provided with a plurality of soldering stations, and the first functional component is formed with a plurality of first accommodating spaces, the first accommodating spaces being used to accommodate parts to be welded;

[0007] a second functional component detachably assembled to the first functional component, wherein a plurality of second accommodating spaces are formed on the second functional component, and the second accommodating spaces are used to accommodate the soldering pads. When the first functional component is assembled to the substrate, the second functional component is located between the first functional component and the substrate, and along a first direction, the plurality of first accommodating spaces, the plurality of second accommodating spaces, and the plurality of soldering pads correspond one to one;

[0008] A pressure piece can be detachably assembled onto the first functional piece, and the pressure piece has a plurality of pressure parts. When the first functional piece is assembled onto the substrate, the pressure piece is located on the side of the first functional piece away from the substrate. The plurality of pressure parts correspond one-to-one to the plurality of first accommodating spaces. The pressure parts are used to apply a preset force to the workpiece to be welded located in the first accommodating space, and the preset force extends along the first direction.

[0009] A reflow soldering positioning device as described above, wherein preferably, along the first direction, the first functional part is provided with a through groove, a plurality of first limit blocks are provided in the through groove, the first limit blocks extend along the second direction, and a plurality of first limit blocks are arranged at intervals along the third direction, the first direction is perpendicular to the plane formed by the second direction and the third direction, and along the second direction, each first limit block is provided with a plurality of second limit blocks, and the second limit blocks and the first limit blocks together form the first accommodating space.

[0010] A reflow soldering positioning device as described above, wherein preferably, two first accommodating spaces are formed between two adjacent first limiting blocks, the two first accommodating spaces are distributed in sequence along the second direction, and a first gap is provided between two corresponding second limiting blocks between two adjacent first accommodating spaces.

[0011] A reflow soldering positioning device as described above, wherein preferably, two third accommodating spaces are formed between two adjacent first limiting blocks, along the second direction, two first accommodating spaces are located between two third accommodating spaces, and a second gap is provided between two corresponding second limiting blocks between the first accommodating space and the third accommodating space.

[0012] A reflow soldering positioning device as described above, wherein preferably, the second functional part includes a first partition bar and a second partition bar, the first partition bar and the second partition bar both extend along the second direction, the second partition bar is located on opposite sides of the first partition bar along the third direction, and a plurality of limiting protrusions are provided on the side of the second partition bar facing the first partition bar, and the plurality of limiting protrusions are arranged at intervals along the second direction, and the limiting protrusions, the first partition bar and the second partition bar together form the second accommodating space.

[0013] In the reflow soldering positioning device as described above, preferably, a first preset gap is provided between the inner contour surfaces of the limiting protrusion, the first spacer bar, the second spacer bar, and the outer contour surface of the soldering sheet.

[0014] In the reflow soldering positioning device as described above, preferably, a second preset gap is provided between the top surfaces of the limiting protrusion, the first spacer bar, and the second spacer bar and the bottom surface of the workpiece to be soldered.

[0015] A reflow soldering positioning device as described above, wherein preferably, the pressure member includes a first pressure block and a second pressure block, the first pressure block and the second pressure block both extend along the second direction, the first pressure block and the second pressure block are spaced apart along the third direction, and the weight of the first pressure block is greater than the weight of the second pressure block.

[0016] In the reflow soldering positioning device as described above, preferably, the centers of gravity of the first pressure block and the second pressure block are both deviated from the center line.

[0017] In the reflow soldering positioning device as described above, preferably, the first pressure block and the second pressure block are both provided with a plurality of hollow portions, and the plurality of hollow portions are spaced apart along the second direction.

[0018] Compared with the prior art, the reflow soldering positioning device provided by the present invention is provided with a first functional part, a second functional part and a pressure part. The first functional part is used to position the workpiece to be soldered (TPAK power module), and can limit the horizontal position of each TPAK power module to ensure the consistency of the horizontal position of each TPAK power module after soldering. The second functional part is used to position the soldering piece, which can effectively control the splashing and overflow of the solder. The pressure part is used to apply pressure to the TPAK power module to ensure the flatness of each TPAK power module in the direction of gravity, while improving the spreadability of the molten solder and the stability of the welding process, which is conducive to improving the welding qualification rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 1. It is a schematic diagram of the exploded structure of the reflow soldering positioning device provided by an embodiment of the present invention in an assembled state;

[0020] Figure 2 This is a three-dimensional diagram of a workpiece to be welded and fixed on a substrate provided by an embodiment of the present invention;

[0021] Figure 3 is a three-dimensional diagram of the welding piece and the second functional component in the embodiment of the present invention in a mating state;

[0022] Figure 4 is a three-dimensional diagram of a reflow soldering positioning device provided by an embodiment of the present invention;

[0023] Figure 5 Schematic diagram of the exploded structure of the reflow soldering positioning device provided by an embodiment of the present invention;

[0024] Figure 6 is a three-dimensional diagram of a first functional component provided by an embodiment of the present invention;

[0025] Figure 7 is a three-dimensional diagram of a second functional component provided by an embodiment of the present invention;

[0026] Figure 8 is a three-dimensional diagram of a pressure member provided by an embodiment of the present invention;

[0027] Figure 9This is a schematic diagram of the overlapping state of the parts to be welded provided by an embodiment of the present invention;

[0028] Figure 10 Schematic diagram of the matching position of the second functional component and the soldering station provided in an embodiment of the present invention;

[0029] Figure 11 is a partial schematic diagram of a first functional component provided by an embodiment of the present invention;

[0030] Figure 12 is a schematic diagram of the positions of the soldering piece and the second functional component provided by an embodiment of the present invention;

[0031] Figure 13 Schematic diagram of the positions of the workpiece to be welded and the second functional component provided by an embodiment of the present invention;

[0032] Figure 14 Schematic diagram of the dimensional relationship of the pressure member provided in the embodiment of the present invention.

[0033] Description of reference numerals:

[0034] 10 - first functional component, 11 - first accommodating space, 12 - through slot, 121 - first side wall, 122 - second side wall, 13 - first limiting block, 14 - second limiting block, 141 - first notch, 142 - second notch, 15 - third accommodating space, 16 - first positioning column, 17 - third positioning column;

[0035] 20 - second functional component, 21 - second accommodating space, 22 - first partition bar, 23 - second partition bar, 24 - second positioning hole, 25 - limiting protrusion;

[0036] 30-pressure member, 31-pressure portion, 32-first pressure block, 33-second pressure block, 34-hollow portion, 35-third positioning hole;

[0037] 40- second positioning column;

[0038] 100-substrate, 101-soldering platform, 102-first positioning hole;

[0039] 200-parts to be welded;

[0040] 300-soldering piece;

[0041] D1-first direction;

[0042] D2-second direction;

[0043] D3-Third direction. DETAILED DESCRIPTION

[0044] The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

[0045] As mentioned in the background art, in the prior art, TPAK power modules have problems such as tin overflow, splashing, deviation, and tilt during formic acid reflow soldering.

[0046] The inventors discovered that this is because the TPAK power module is not constrained in the X, Y, and Z directions. Therefore, during the solder reflow process, when the solder melts, the TPAK power module drifts randomly, making it difficult to ensure positional consistency. This can lead to unreliable connections between the module and the circuit board, affecting the stability of the electrical connection. Furthermore, because the solder tabs are unobstructed, solder spatter during the reflow process is uncontrollable. This solder spillage and spatter not only contaminates the circuit board but can also cause electrical faults such as short circuits, impacting product reliability and performance.

[0047] For this purpose, refer to Figures 1 to 14 As shown, the embodiment of the present invention provides a reflow soldering positioning device to solve the problems of tin overflow, splashing, offset and tilt in the formic acid reflow soldering process of TPAK power module. For better description of the device structure, refer to Figure 1 As shown, the embodiment of the present invention defines a first direction D1, a second direction D2 and a third direction D3. The first direction D1, the second direction D2 and the third direction D3 together constitute a three-dimensional coordinate system. The first direction D1 is the Z-axis extension direction, the second direction D2 is the X-axis extension direction, and the third direction D3 is the Y-axis extension direction. The first direction D1 extends along the direction of gravity.

[0048] Reference Figure 1 as well as Figure 5 As shown, the reflow soldering positioning device includes a first functional component 10, a second functional component 20, and a pressure member 30, which are used to position the component to be soldered 200 (e.g., a TPAK power module) and the soldering tab 300 on the substrate 100 for subsequent reflow soldering operations. In the initial state, the component to be soldered 200, the substrate 100, and the soldering tab 300 are separate entities. By assembling the reflow soldering positioning device, these components are fixed in appropriate positions to ensure that they will not deviate or tilt during the soldering process.

[0049] The first functional component 10 can be detachably assembled on the substrate 100. In the embodiment provided by the present invention, referring to Figure 1 as well as Figure 6As shown, the substrate 100 is a plate structure extending along the second direction D2 and the third direction D3. The substrate 100 has a certain thickness in the first direction D1. A plurality of first positioning holes 102 are dispersedly arranged on the substrate 100. The first functional component 10 is also a plate structure extending along the second direction D2 and the third direction D3. The first functional component 10 has a certain thickness in the first direction D1. A plurality of first positioning posts 16 are dispersedly arranged on the first functional component 10. The positions of the first positioning posts 16 correspond to the positions of the first positioning holes 102. A through hole is passed through the axial direction of the first positioning posts 16. A feasible implementation In this method, one end of the first positioning column 16 is fixed to the first functional part 10, and the other end extends toward the direction of gravity. When the first functional part 10 is assembled with the substrate 100, multiple first positioning columns 16 are aligned with multiple first positioning holes 102, and then the second positioning column 40 is passed through the through hole on the first positioning column 16 and extended into the first positioning hole 102. Through the positioning cooperation between the second positioning column 40 and the first positioning hole 102, the first functional part 10 can be positioned and assembled on the substrate 100. The position of the substrate 100 is fixed relative to the position of the first functional part 10, and no relative displacement will occur during transportation and reflow soldering.

[0050] Reference Figure 1 As shown, a plurality of soldering stations 101 are provided on the surface of the substrate 100. The soldering stations 101 are used as soldering stations 101. Soldering pieces 300 are placed on the soldering stations 101. The soldering pieces 300 serve as solder to realize the welding and fixation between the workpiece 200 to be welded and the substrate 100. The soldering stations 101 are convex pieces convexly provided on the surface of the substrate 100. The size and shape of the soldering pieces 300 correspond to the size and shape of the soldering stations 101 and are not limited here.

[0051] A plurality of first accommodating spaces 11 are formed on the first functional part 10. The first accommodating spaces 11 penetrate the first functional part 10 in the first direction D1. The first accommodating spaces 11 are used to accommodate the workpiece 200 to be welded. The inner contour surface of the first accommodating space 11 is adapted to the outer contour surface of the workpiece 200 to be welded. In the embodiment provided by the present invention, the workpiece 200 to be welded is a TPAK power module. Each workpiece 200 to be welded corresponds to a first accommodating space 11. The workpiece 200 to be welded is limited in the first accommodating space 11. The first accommodating space 11 can limit the horizontal movement of the workpiece 200 to be welded, so that the workpiece 200 to be welded will not shift horizontally during the reflow soldering process, thereby preventing the occurrence of random drift and ensuring the position consistency of each TPAK power module. Those skilled in the art can know that the number and distribution of the first accommodating spaces 11 can be determined according to actual needs and are not limited here.

[0052] Reference Figure 1 as well as Figure 7As shown, the second functional component 20 can be detachably assembled to the first functional component 10, and second positioning holes 24 are dispersedly arranged on the second functional component 20. The position of the second positioning hole 24 is adapted to the position of the first positioning column 16. Before the first functional component 10 is assembled to the substrate 100, the first functional component 10 and the second functional component 20 are arranged relative to each other, and a plurality of first positioning columns 16 are aligned one by one with a plurality of second positioning holes 24. Through the positioning cooperation between the first positioning columns 16 and the second positioning holes 24, the second functional component 20 can be positioned and assembled on the first functional component 10. When the substrate 100 is assembled to the first functional component 10, the second positioning column 40 passes through the through hole on the first positioning column 16 and extends through the first positioning hole 102. The second functional component 20 is located between the first functional component 10 and the substrate 100.

[0053] A plurality of second accommodating spaces 21 are formed on the second functional component 20. The second accommodating spaces 21 penetrate the second functional component 20 in the first direction D1. The second accommodating spaces 21 are used to accommodate the soldering station 101. The inner contour surface of the second accommodating space 21 is adapted to the outer contour surface of the soldering station 101. After the soldering piece 300 is placed on the soldering station 101, it is always accommodated in the second accommodating space 21. The movement of the soldering piece 300 in the horizontal direction is restricted to prevent the position of the soldering piece 300 from shifting during transportation or welding.

[0054] Reference Figure 1 as well as Figure 5 As shown, along the first direction D1, a plurality of first accommodating spaces 11, a plurality of second accommodating spaces 21 and a plurality of soldering stations 101 correspond one to one, each soldering station 101 is provided with a soldering piece 300, and each part to be soldered 200 corresponds to a soldering piece 300. The part to be soldered 200 is soldered to the soldering station 101 by the soldering piece 300 using a reflow soldering method, thereby completing the soldering assembly of the part to be soldered 200 (such as a TPAK power module) and the substrate 100.

[0055] Reference Figure 8 As shown, the pressure member 30 can be detachably assembled to the first functional member 10. When the first functional member 10 is assembled to the substrate 100, the pressure member 30 is located on the side of the first functional member 10 facing away from the substrate 100. A plurality of third positioning holes 35 are dispersedly provided on the pressure member 30, and a plurality of third positioning columns 17 are dispersedly provided on the first functional member 10. The pressure member 30 is positioned and assembled to the first functional member 10 through the positioning cooperation between the third positioning columns 17 and the third positioning holes 35.

[0056] The pressure piece 30 has a plurality of pressure parts 31, and the plurality of pressure parts 31 correspond one-to-one to the plurality of first accommodating spaces 11. The pressure parts 31 are used to apply a preset force to the workpiece 200 to be welded located in the first accommodating space 11. The preset force extends along the first direction D1. The pressure piece 30 applies a certain preset force on the workpiece 200 to be welded. On the one hand, the pressure piece 30 cooperates with the first functional part 10 to give position constraints in the three directions of XYZ to the workpiece 200 to be welded, which can better ensure the position consistency of the workpiece 200 to be welded after welding and improve the qualified rate; on the other hand, it can provide stable pressure during the reflow soldering process, improve the spreadability of the molten solder and the stability of the welding process, which is conducive to improving the welding qualified rate.

[0057] In actual use, the first functional component 10 and the second functional component 20 are pre-assembled to form a product component, and then the product component is snapped onto the substrate 100. The soldering piece 300 is installed on the soldering station 101 of the second accommodating space 21 manually or by a placement machine. Then, the TPAK power module is installed into the first accommodating space 11 and pressed against the soldering piece 300. Finally, the pressure piece 30 is installed, and the entire reflow soldering positioning device can be placed in the formic acid reflow soldering equipment for soldering.

[0058] In the embodiments provided by the present invention, reference is made to Figure 6 As shown, the first functional part 10 is made of high-temperature resistant metal and has a frame-like structure as a whole. Along the first direction D1, the first functional part 10 is penetrated by a through groove 12. The through groove 12 is preferably a square groove. The through groove 12 has two first side walls 121 arranged opposite to each other along the second direction D2 and two second side walls 122 arranged opposite to each other along the third direction D3.

[0059] A plurality of first limit blocks 13 are provided in the through groove 12, and the first limit blocks 13 extend along the second direction D2. The opposite ends of the first limit block 13 are respectively connected to the two first side walls 121. The plurality of first limit blocks 13 are arranged at intervals along the third direction D3. Preferably, the first limit blocks 13 are arranged at equal intervals. Along the second direction D2, each first limit block 13 is provided with a plurality of second limit blocks 14, and a plurality of second limit blocks 14 are also provided on the second side wall 122. The positions of the plurality of second limit blocks 14 on different first limit blocks 13 and the plurality of second limit blocks 14 on the second side wall 122 are consistent.

[0060] In the embodiments provided by the present invention, reference is made to Figure 6As shown, two second limit blocks 14 adjacent in the second direction D2 constitute two opposite walls of the first accommodating space 11 in the second direction D2, two first limit blocks 13 adjacent in the third direction D3 constitute two opposite walls of the first accommodating space 11 in the third direction D3, or, the first limit blocks 13 adjacent in the third direction D3 and the second side wall 122 constitute two opposite walls of the first accommodating space 11 in the third direction D3.

[0061] The first limit block 13 or the second side wall 122 acts on the two side surfaces of the workpiece 200 to be welded in the third direction D3, and the second limit block 14 acts on the two side surfaces of the workpiece 200 to be welded in the second direction D2. The first limit block 13 and the second limit block 14 both have a large contact area with the workpiece 200 to be welded, which can restrain the drift of the workpiece 200 while avoiding stress concentration and damage to the workpiece 200.

[0062] In the embodiments provided by the present invention, reference is made to Figure 9 As shown, when the workpiece 200 to be welded is a TPAK power module, two first accommodating spaces 11 are formed between two adjacent first limiting blocks 13, and the two first accommodating spaces 11 are distributed in sequence along the second direction D2. Each first accommodating space 11 is used to accommodate a TPAK power module, and the two TPAK power modules overlap at the intersection of the two first accommodating spaces 11. Along the second direction D2, the TPAK power module has a first end and a second end, and the first end of one TPAK power module overlaps the first end of the other TPAK power module. To avoid interference at the overlap, a first notch 141 is provided between the two corresponding second limiting blocks 14 between the two adjacent first accommodating spaces 11, and the first ends of the two TPAK power modules overlap at the first notch 141. The inner wall surface of the first notch 141 can also constrain and limit the first end of the TPAK power module, which can effectively perform position constraint while avoiding interference between the TPAK power module and the second limiting block 14.

[0063] Furthermore, when the workpiece 200 to be welded is a TPAK power module, the second end of the TPAK power module is connected to a copper busbar. Figure 11 As shown, two third accommodating spaces 15 are formed between two adjacent first limiting blocks 13. Along the second direction D2, the two first accommodating spaces 11 are located between the two third accommodating spaces 15. Each third accommodating space 15 is used to accommodate a copper busbar of a TPAK power module. The first side wall 121 and the second limiting block 14 constitute two walls of the third accommodating space 15 in the third direction D3. Two adjacent first limiting blocks 13 constitute two walls of the third accommodating space 15 in the second direction D2, or the first limiting block 13 and the second side wall 122 constitute two walls of the third accommodating space 15 in the second direction D2.

[0064] There is a second gap 142 between the two corresponding second limit blocks 14 between the first accommodating space 11 and the third accommodating space 15 for the copper busbar to pass through. The inner contour surface of the third accommodating space 15 is adapted to the outer contour surface of the copper busbar. Preferably, there is a certain gap between the inner contour surface of the third accommodating space 15 and the outer contour surface of the copper busbar. This is because the cooling shrinkage rate of the copper busbar and the first functional component 10 is different. After welding and cooling, if there is no certain gap between the inner contour surface of the third accommodating space 15 and the outer contour surface of the copper busbar, the inner wall of the third accommodating space 15 will squeeze the copper busbar after welding and cooling, causing the copper busbar to deform. At the same time, the first functional component 10 cannot be smoothly separated from the TPAK power module, causing jamming.

[0065] In the embodiments provided by the present invention, reference is made to Figure 7 As shown, the second functional component 20 acts between the first functional component 10 and the substrate 100. The second functional component 20 is preferably composed of a high-flatness thin sheet made of high-temperature resistant metal. The second functional component 20 includes a first partition bar 22 and a second partition bar 23. The first partition bar 22 and the second partition bar 23 are both provided with a second positioning hole 24. The first partition bar 22 and the second partition bar 23 both extend along the second direction D2, and the second partition bar 23 is located on opposite sides of the first partition bar 22 along the third direction D3.

[0066] A plurality of limiting protrusions 25 are provided on the side of the second partition bar 23 facing the first partition bar 22. The plurality of limiting protrusions 25 are arranged at intervals along the second direction D2. The limiting protrusions 25, the first partition bar 22 and the second partition bar 23 together form the second accommodating space 21. Two adjacent limiting protrusions 25 constitute two walls of the second accommodating space 21 in the second direction D2, and the first partition bar 22 and the second partition bar 23 constitute two walls of the second accommodating space 21 in the third direction D3.

[0067] Reference Figure 10 As shown, the upper surfaces of the first spacer 22, the second spacer 23 and the limiting protrusion 25 in the first direction D1 are higher than the upper surface of the soldering platform 101 of the substrate 100. A soldering piece 300 is placed on the soldering platform 101, and the soldering piece 300 is accommodated in the second accommodating space 21. The movement of the soldering piece 300 in the horizontal direction will be restricted by the inner wall surface of the second accommodating space 21, which can prevent the positioning device from shifting the position of the soldering piece 300 during transportation. At the same time, the position of the soldering piece 300 can be controlled during welding to avoid the soldering piece 300 from shifting on the soldering platform 101, resulting in a technical problem of less tin on the welding edge.

[0068] In a feasible implementation, referring to Figure 12As shown, when the second functional component 20 is assembled to the substrate 100, a first preset gap L1 is provided between the inner contour surfaces of the limiting protrusion 25, the first spacer bar 22 and the second spacer bar 23 and the outer contour surface of the soldering station 101. The first preset gap L1 is used to accommodate solder overflowing during the soldering process, thereby controlling the length of the overflow tin and ensuring the insulation performance of the product. The value of the first preset gap L1 can be determined according to the actual size of the soldering piece 300. The first preset gap L1 is preferably 0.1-0.3 mm. If the first preset gap L1 is too small, it cannot accommodate enough overflowed solder. If the first preset gap L1 is too large, it will make it impossible to effectively limit the soldering piece 300. The soldering piece 300 is easily offset on the soldering station 101, resulting in poor welding.

[0069] During the welding process, the workpiece 200 to be welded is pressed against the welding piece 300. When the welding piece 300 melts into liquid, due to factors such as gravity, bubble escape, and vacuum, the workpiece 200 to be welded will show random fluctuations and tilts. After cooling, the tilted workpiece 200 to be welded is not conducive to the subsequent use and assembly of products. Therefore, it is necessary to control the flatness of the workpiece 200 to be welded after welding. In the embodiment of the present invention, reference is made to Figure 12 As shown, after the workpiece 200 to be welded is placed in the first accommodating space 11, a second preset gap L2 is provided between the top surfaces of the limiting protrusion 25, the first partition bar 22 and the second partition bar 23 and the bottom surface of the workpiece 200 to be welded, thereby preventing the workpiece 200 to be welded from tilting excessively toward one side and controlling its tilting degree within an acceptable range. When the workpiece 200 to be welded tilts more than a certain degree, the workpiece 200 to be welded will rest against the top surfaces of the limiting protrusion 25, the first partition bar 22 and the second partition bar 23, thereby limiting further tilting of the workpiece 200 to be welded.

[0070] The value of the second preset gap L2 can be determined according to actual conditions. The second preset gap L2 is preferably 0.1-0.3 mm. If the second preset gap L2 is too large, it will not be conducive to limiting the tilt degree of the welded part 200. If the second preset gap L2 is too small, the deformation requirements of the first partition bar 22 and the second partition bar 23 will be strict, and the process will be difficult to control.

[0071] The first spacer 22 and the second spacer 23 have the function of blocking solder, so a material that resists soldering must be selected. At the same time, if the first spacer 22 and the second spacer 23 are warped, an upward force will be applied to the workpiece 200 during welding, causing the workpiece 200 to lift up, resulting in welding failures such as cold solder joints, tin shrinkage, and tilting. Therefore, the materials used for the first spacer 22 and the second spacer 23 are high in hardness, not easy to deform, good in temperature shock resistance, and low in thermal stress, to ensure that they are not easily deformed by external forces during use and that the amount of thermal deformation during welding is small. Considering comprehensive processing performance and cost, in the embodiment of the present application, the first spacer 22 and the second spacer 23 are both made of stainless steel series materials.

[0072] In a feasible embodiment, the second functional part 20 includes a plurality of first spacers 22 and a plurality of second spacers 23. Figure 1 as well as Figure 7 As shown, along the second direction D2, there are two first partition bars 22 and four second partition bars 23, and every two second partition bars 23 are symmetrically arranged on opposite sides of the first partition bar 22. The number of the first partition bars 22 and the second partition bars 23 needs to be comprehensively considered with respect to the size of the weldment 200, the ease of operation, the amount of processing deformation and the amount of thermal deformation. In the embodiment provided by the present invention, the length of the first partition bar 22 and the second partition bar 23 does not exceed 150 mm, thereby reducing the possibility of processing deformation of a single partition bar and reducing the amount of deformation during welding heating.

[0073] In the embodiments provided by the present invention, reference is made to Figure 8 As shown, the pressure piece 30 is hollowed out from a rectangular metal block, and the multiple pressure parts 31 of the pressure piece 30 press against the multiple parts to be welded 200 in the first accommodating space 11. The pressure parts 31 apply a preset force to the surface of each part to be welded 200 through gravity, thereby providing stable pressure to the parts to be welded 200 to overcome the surface tension of the molten solder during welding, so that the solder can be fully extended and spread in the entire welding area, thereby reducing the occurrence of defects such as voids, tin shrinkage, and cold solder joints.

[0074] The pressure portion 31 of the pressure piece 30 is a convex structure protruding from the pressure piece 30 along the first direction D1. There is a large contact area between the convex structure and the workpiece 200 to be welded. The pressure portion 31 can provide the workpiece 200 to be welded with a uniform preset force, preventing the workpiece 200 to be welded from warping on one side, while effectively controlling the height of each workpiece 200 to be welded in the first direction D1, thereby ensuring the overall consistency of the height of each workpiece 200 to be welded after welding.

[0075] In the embodiments provided by the present invention, reference is made to Figure 6 as well as Figure 8 As shown, along the third direction D3, the first functional part 10 includes two columns of first accommodating spaces 11, and each column of first accommodating spaces 11 has multiple first accommodating spaces 11 along the second direction D2. The pressure piece 30 includes a first pressure block 32 and a second pressure block 33. The first pressure block 32 and the second pressure block 33 both extend along the second direction D2. The first pressure block 32 and the second pressure block 33 are spaced apart along the third direction D3. The first pressure block 32 is used to apply pressure to the multiple parts to be welded 200 in the first column of the first accommodating spaces 11, and the second pressure block 33 is used to apply pressure to the multiple parts to be welded 200 in the second column of the first accommodating spaces 11. The first pressure block 32 and the second pressure block 33 are both provided with a third positioning hole 35 to form a positioning match with the third positioning column 17 on the first functional part 10.

[0076] Reference Figure 8as well as Figure 9 As shown, when the workpiece 200 to be welded is a TPAK power module, the first end of the TPAK power module in the first column and the first accommodating space 11 is overlapped on the first end of the TPAK power module in the second column and the first accommodating space 11. In order to prevent the TPAK power module above the overlap from generating a gap at the overlap, the weight of the first pressure block 32 is greater than the weight of the second pressure block 33, so that the preset force applied by the first pressure block 32 on the TPAK power module in the first column and the first accommodating space 11 is greater, thereby providing more downward pressure for the TPAK power module above the overlap during welding.

[0077] Furthermore, since the first end of the TPAK power module in the first storage space 11 of the first row is overlapped with the first end of the TPAK power module in the first storage space 11 of the second row, the height at the overlap is higher than the height of both sides, resulting in a higher overall middle overlap after vacuum formic acid reflow soldering. Therefore, the first pressure block 32 and the second pressure block 33 are both asymmetrically designed, and the center of gravity of the first pressure block 32 and the second pressure block 33 are both deviated from the center line. Figure 14 As shown, the side line of the first pressure block 32 away from the second pressure block 33 and the center line have a third preset distance L3, and the side line of the first pressure block 32 close to the second pressure block 33 and the center line have a fourth preset distance L4, L4 is greater than L3, and the center of gravity of the first pressure block 32 and the second pressure block 33 are both offset toward the overlap of the two TPAK power modules, so that the preset force received at the overlap is greater than that at other places, which can improve the flatness and fit of the TPAK power module after welding.

[0078] The weight of the first pressure block 32 and the second pressure block 33 is determined according to actual conditions. Preferably, the weight of each pressure portion 31 applied to the workpiece 200 to be welded is 3-5g. If the first pressure block 32 and the second pressure block 33 are too heavy, the solder will overflow during welding. If the first pressure block 32 and the second pressure block 33 are too light, they cannot provide stable pressure to the workpiece 200 to overcome the surface tension of the molten solder during welding.

[0079] In the embodiments provided by the present invention, reference is made to Figure 8 As shown, the first pressure block 32 and the second pressure block 33 are both provided with a plurality of hollow portions 34, and the plurality of hollow portions 34 are spaced apart along the second direction D2. In the first direction D1, the hollow portions 34 are provided through the first pressure block 32 and the second pressure block 33, and ribs are provided between adjacent hollow portions 34. The number of ribs on the first pressure block 32 is greater than the number of ribs on the second pressure block 33, so that the weight of the first pressure block 32 is greater than the weight of the second pressure block 33. During welding, the first pressure block 32 provides more downward pressure for the TPAK power module above the overlap, ensuring that the upper and lower layers of TPAK power modules are tightly overlapped without gaps.

[0080] The hollow design is beneficial in preventing the first pressure block 32 and the second pressure block 33 from deforming in terms of structural strength, which would cause uneven force between the multiple parts to be welded 200. At the same time, sufficient hollow parts 34 can ensure that during formic acid reflow soldering, formic acid gas can smoothly enter the welding layer, causing a reduction reaction and improving the weldability of the material.

[0081] The above describes in detail the structure, features and effects of the present invention based on the embodiments shown in the drawings. The above is only a preferred embodiment of the present invention, but the scope of implementation of the present invention is not limited to what is shown in the drawings. Any changes made in accordance with the concept of the present invention, or modifications to equivalent embodiments with equivalent changes, which do not exceed the spirit covered by the description and drawings, should be within the scope of protection of the present invention.

Claims

1. A reflow soldering positioning device, characterized in that: include: A first functional component is detachably assembled on a substrate, the substrate is provided with a plurality of soldering stations, and the first functional component is formed with a plurality of first accommodating spaces, the first accommodating spaces being used to accommodate parts to be welded; a second functional component detachably assembled to the first functional component, wherein a plurality of second accommodating spaces are formed on the second functional component, and the second accommodating spaces are used to accommodate the soldering stations. When the first functional component is assembled to the substrate, the second functional component is located between the first functional component and the substrate, and along a first direction, the plurality of first accommodating spaces, the plurality of second accommodating spaces, and the plurality of soldering stations correspond one to one; A pressure piece can be detachably assembled onto the first functional piece, and the pressure piece has a plurality of pressure parts. When the first functional piece is assembled onto the substrate, the pressure piece is located on the side of the first functional piece away from the substrate. The plurality of pressure parts correspond one-to-one to the plurality of first accommodating spaces. The pressure parts are used to apply a preset force to the workpiece to be welded located in the first accommodating space, and the preset force extends along the first direction.

2. The reflow soldering positioning device according to claim 1, wherein: Along the first direction, the first functional part is provided with a through groove, and a plurality of first limit blocks are provided in the through groove. The first limit block extends along the second direction, and the plurality of first limit blocks are arranged at intervals along the third direction. The first direction is perpendicular to the plane formed by the second direction and the third direction. Along the second direction, each first limit block is provided with a plurality of second limit blocks, and the second limit blocks and the first limit blocks together form the first accommodating space.

3. The reflow soldering positioning device according to claim 2, wherein: Two first accommodating spaces are formed between two adjacent first limiting blocks. The two first accommodating spaces are sequentially distributed along the second direction. A first gap is provided between two corresponding second limiting blocks between two adjacent first accommodating spaces.

4. The reflow soldering positioning device according to claim 3, wherein: Two third accommodating spaces are formed between two adjacent first limiting blocks. Along the second direction, two first accommodating spaces are located between two third accommodating spaces. A second gap is provided between two corresponding second limiting blocks between the first accommodating space and the third accommodating space.

5. The reflow soldering positioning device according to claim 3, wherein: The second functional component includes a first partition bar and a second partition bar, the first partition bar and the second partition bar both extend along the second direction, the second partition bar is located on opposite sides of the first partition bar along the third direction, and a plurality of limiting protrusions are provided on a side of the second partition bar facing the first partition bar, and the plurality of limiting protrusions are arranged at intervals along the second direction, and the limiting protrusions, the first partition bar and the second partition bar together form the second accommodating space.

6. The reflow soldering positioning device according to claim 5, wherein: A first preset gap is formed between the inner contour surfaces of the limiting protrusion, the first spacer bar, the second spacer bar, and the outer contour surface of the welding platform.

7. The reflow soldering positioning device according to claim 5, wherein: A second preset gap is formed between the top surfaces of the limiting protrusion, the first spacer bar, and the second spacer bar and the bottom surface of the workpiece to be welded.

8. The reflow soldering positioning device according to claim 3, wherein: The pressure member includes a first pressure block and a second pressure block, the first pressure block and the second pressure block both extend along the second direction, the first pressure block and the second pressure block are spaced apart along the third direction, and the weight of the first pressure block is greater than the weight of the second pressure block.

9. The reflow soldering positioning device according to claim 8, wherein: The centers of gravity of the first pressure block and the second pressure block are both offset from the midline.

10. The reflow soldering positioning device according to claim 8, wherein: The first pressure block and the second pressure block are both provided with a plurality of hollow portions, and the plurality of hollow portions are arranged at intervals along the second direction.

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