Pick ball processing equipment and Pick ball

Abstract

The invention discloses a Pick ball machining device and a Pick ball, the Pick ball machining device comprises a ball body positioning mechanism and a laser trepanning mechanism, the ball body positioning mechanism is used for positioning a ball body, and the laser trepanning mechanism is used for emitting a laser beam to the ball body positioned on the ball body positioning mechanism; and the ball body positioned on the ball body positioning mechanism is perforated. According to the Pick ball machining equipment, the ball body is positioned through the ball body positioning mechanism, the laser beam is emitted to the ball body through the laser trepanning mechanism, the micron-level machining precision is achieved through the laser trepanning technology, the high-precision requirements of the Pick ball for the hole diameter and the hole position are met, and standard round holes without chamfers and fillets can be machined in the Pick ball.

Description

Technical Field

[0001] The present invention relates to the technical field of pickle balls, and in particular to a pickle ball processing device and a pickle ball. Background Art

[0002] Currently, the pickle balls on the market are mainly made using the injection molding process. The plastic particles are melted by an injection molding machine and injected into the mold. After cooling and molding, two halves of the ball are obtained. The two halves of the ball are then melted together by a hot melt machine.

[0003] However, pickle balls made using the injection molding process are limited by the mold demolding structure, and the openings on the sphere often have chamfers or rounded corners. When such pickle balls are hit, they may suffer uneven force due to the chamfered or rounded corners, resulting in a poor user experience. Summary of the Invention

[0004] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a pickle ball processing equipment and pickle ball to solve the technical problem that pickle balls made by injection molding are limited by the mold demolding structure, and the openings on the sphere often have chamfers or rounded corners. When such pickle balls are hit, they may cause uneven force due to the chamfered or rounded corner structure, resulting in poor user experience.

[0005] To achieve the above object, the present invention adopts the following technical solutions: In a first aspect, the present invention provides a pickle ball processing device, comprising: a sphere positioning mechanism and a laser hole opening mechanism, wherein the sphere positioning mechanism is used to position a sphere, and the laser hole opening mechanism is used to emit a laser beam toward the sphere positioned in the sphere positioning mechanism to open a hole in the sphere positioned in the sphere positioning mechanism.

[0006] Wherein, the ball positioning mechanism includes a positioning block, the positioning block is provided with a positioning groove matching the spherical surface of the ball, and the ball positioning mechanism carries the ball through the positioning groove.

[0007] The ball positioning mechanism further includes an air suction device and an air suction hole provided in the positioning groove, wherein the air suction device is used to provide suction force for the air suction hole so that the air suction hole is connected to the opening of the positioning groove and has negative pressure adsorption force.

[0008] It also includes a ball rotating mechanism, which is used to drive the ball to rotate so that different points of the ball positioned on the ball positioning mechanism are exposed to the laser beam irradiation position of the laser opening mechanism.

[0009] The sphere rotation mechanism includes a first drive assembly and a second drive assembly. The first drive assembly is used to drive the sphere to rotate in a first direction, and the second drive assembly is used to drive the sphere to rotate in a second direction. The first direction and the second direction are both horizontal and vertical.

[0010] In which, the groove body of the positioning groove is provided with a first rotating groove along the first direction; the first driving assembly includes a first rotating member, a second rotating member and a first synchronous transmission belt wound around the first rotating member and the second rotating member, the first rotating member and the second rotating member are respectively close to the two sides of the first rotating groove in the first direction, and part of the first synchronous transmission belt is located in the positioning groove; the first rotating member and / or the second rotating member are equipped with a first driving member, the first driving member is used to drive the first rotating member and / or the second rotating member to rotate, so that the part of the first synchronous transmission belt located in the positioning groove moves toward the first direction.

[0011] In which, the groove body of the positioning groove is provided with a second rotating groove along the second direction; the second driving assembly includes a third rotating member, a fourth rotating member and a second synchronous transmission belt wound around the third rotating member and the fourth rotating member, the third rotating member and the fourth rotating member are respectively close to the two sides of the second rotating groove in the second direction, and part of the second synchronous transmission belt is located in the positioning groove; the third rotating member and / or the fourth rotating member are equipped with a second driving member, and the second driving member is used to drive the third rotating member and / or the fourth rotating member to rotate so that the part of the second synchronous transmission belt located in the positioning groove moves toward the second direction.

[0012] In which, the laser opening mechanism includes an adjustment component and a laser, the laser is connected to the movable end of the adjustment component, the laser is used to emit a laser beam toward the sphere positioned in the sphere positioning mechanism, and the adjustment component is used to drive the laser to approach or move away from the sphere positioned in the sphere positioning mechanism along its laser emission direction.

[0013] The adjustment component is used to drive the laser to rise or fall in the vertical direction, the laser emission direction of the laser is vertically downward, and the laser beam emitted by the laser points to the center of the sphere positioned in the sphere positioning mechanism.

[0014] In a second aspect, the present invention provides a pickle ball made by the pickle ball processing equipment described in the first aspect, wherein the pickle ball is provided with a plurality of standard round holes without chamfers and rounded corners.

[0015] The pickle ball processing equipment of the present invention positions the ball through a ball positioning mechanism, emits a laser beam toward the ball through a laser hole opening mechanism, and utilizes laser hole opening technology to achieve micron-level processing accuracy, meeting the high-precision requirements of pickle balls for hole diameter and hole position, and can process standard round holes without chamfers and rounded corners on pickle balls.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic structural diagram of a pickle ball processing device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the positioning block structure of the pickle ball processing equipment according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the internal structure of the positioning block of the pickle ball processing equipment according to an embodiment of the present invention; Figure 4 Schematic diagram of the ball rotation mechanism of the pickle ball processing equipment according to an embodiment of the present invention.

[0018] Description of reference numerals: 1. Ball positioning mechanism; 11. Positioning block; 12. Positioning groove; 13. Air suction hole; 14. First rotating groove; 15. Second rotating groove; 2. Laser opening mechanism; 21. Adjustment component; 22. Laser; 3. Ball rotation mechanism; 31. First drive assembly; 311. First rotating member; 312. Second rotating member; 313. First synchronous transmission belt; 314. First drive member; 32. Second drive assembly; 321. Third rotating member; 322. Fourth rotating member; 323. Second synchronous transmission belt; 324. Second drive member; 4. Gas assist mechanism; 41. Gas source; 42. Ventilation pipe; 43. Gas nozzle; 5. Sphere; 51. Standard round hole. DETAILED DESCRIPTION

[0019] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making any creative efforts shall fall within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "resin", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0022] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0023] In the present invention, unless otherwise expressly specified or limited, terms such as "mounted," "connected," "connect," and "fixed" should be understood broadly. For example, they may refer to connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0024] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0025] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. Throughout this specification, the schematic representations of these terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0026] See also Figure 1 , Figure 1 The figure is a schematic diagram of the structure of a pickle ball processing device according to an embodiment of the present invention. The device comprises a ball positioning mechanism 1 and a laser hole-forming mechanism 2. The ball positioning mechanism 1 is used to position a ball 5, and the laser hole-forming mechanism 2 is used to emit a laser beam toward the ball 5 positioned in the ball positioning mechanism 1 to create a hole in the ball 5 positioned in the ball positioning mechanism 1. The balls 5 described in this embodiment and the following embodiments are balls to be processed and formed into pickle balls.

[0027] It should be explained that the pickle balls currently on the market are mainly divided into two types: roto-molded balls and injection-molded balls. Roto-molded balls are commonly known as competitive balls, and are generally made of PE plastic. They can also be called one-piece balls. Injection-molded balls are commonly known as hot-melt balls, and are generally made of TPE thermoplastic elastomer. In terms of processing technology, roto-molded balls use a roto-molding process. PE plastic powder is placed in a mold. While heating, the mold rotates and revolves around a vertical axis. After plasticization and molding, the mold is cooled to form. Then, drilling equipment is used to drill holes in sequence to obtain a one-piece pickle ball. Injection-molded balls use an injection molding process. Plastic particles are melted by an injection molding machine and injected into the mold. After cooling and molding, two halves of the ball are obtained. The two halves of the ball are then melted together by a hot-melt machine. The pickle ball processing equipment proposed in the present invention can replace the drilling processing equipment in the roto-molded ball processing technology, and use laser hole opening technology to achieve micron-level processing accuracy, meeting the high-precision requirements of pickle balls for hole diameter and hole position. The pickle ball processing equipment proposed in the present invention can also serve as a finishing device in the injection-molded ball manufacturing process to further process the holes on the injection-molded balls to eliminate the original chamfers or rounded corners.

[0028] It is understood that the ball positioning mechanism 1 and the laser hole-making mechanism 2 can automate the processing of pickleballs, reducing manual operations and improving production efficiency and consistency. The laser hole-making mechanism 2 utilizes a high-energy-density laser beam to illuminate the surface of the ball 5, causing the material to instantly vaporize or melt, thereby forming a hole. By precisely controlling the parameters of the laser beam (such as power, pulse width, and frequency), different apertures can be processed. A standard circular hole 51 without chamfers or fillets can be machined on the pickleball. The resulting pickleball will not experience uneven force when struck due to the chamfers or fillets, thus improving the user experience.

[0029] See also Figure 2 , Figure 2 The figure is a schematic diagram of the structure of the positioning block 11 of the pickle ball processing equipment according to an embodiment of the present invention. In some embodiments, the ball positioning mechanism 1 includes a positioning block 11, which is provided with a positioning groove 12 that matches the spherical surface of the ball 5. The ball positioning mechanism 1 supports the ball 5 through the positioning groove 12. It can be understood that by providing the positioning groove 12 that matches the spherical surface of the ball 5, the ball 5 can be positioned more accurately, ensuring the stability of the ball 5 during the processing process and preventing the ball 5 from moving or shaking during the processing, thereby improving the processing quality and efficiency.

[0030] In other embodiments, the ball positioning mechanism 1 may also utilize a mechanical claw or other clamping device to position the ball 5. These devices utilize various principles (e.g., mechanical clamping, vacuum adsorption, magnetic adsorption) to secure the ball 5 in a predetermined position, providing a stable clamping force to prevent the ball 5 from moving or shaking during processing, thereby improving processing accuracy and quality. For example, a mechanical claw can provide a stable clamping force by gripping the surface of the ball 5, securing the ball 5 in a predetermined position and ensuring the stability of the ball 5 during processing.

[0031] In some embodiments, in order to make the sphere 5 more stable in the positioning groove 12 and to prevent the sphere 5 from unnecessary movement or rotation in the positioning groove 12, the sphere positioning mechanism 1 also includes an air suction device and an air suction hole 13 provided in the positioning groove 12. The air suction device is used to provide suction force for the air suction hole 13 so that the air suction hole 13 is connected to the opening of the positioning groove 12 and has a negative pressure adsorption force. It can be understood that the negative pressure adsorption force of the air suction hole 13 can adsorb the sphere 5 placed in the positioning groove 12, so that the sphere 5 placed in the positioning groove 12 can maintain a stable position when it does not need to move or rotate. It should be explained that there should be a plurality of air suction holes 13 distributed in different positions of the positioning groove 12 to avoid the air suction holes 13 and the standard circular holes 51 opened on the sphere 5 from coinciding with each other and failing to adsorb the sphere 5.

[0032] It is worth mentioning that the adsorption holes in this embodiment can not only be used for adsorption to position the sphere 5 in the positioning groove 12, but can also be used to adsorb the dust generated during the processing. Specifically, the suction device may include an air suction pump and a collection container, and the air suction pump and the air suction hole 13 are respectively connected to the collection container, and a filter screen is provided in the collection container for blocking dust. When the air suction pump is working, the dust entering the collection container through the air suction hole 13 will remain in the collection container under the obstruction of the filter screen, thereby keeping the processing environment clean. Among them, the collection container can be designed as a detachable structure, that is, the collection container can be removed from between the air suction pump and the air suction hole 13 to facilitate dumping the dust collected therein and cleaning it.

[0033] In some embodiments, the angle of the sphere 5 in the positioning slot 12 can be manually adjusted to achieve laser drilling at different locations on the sphere 5. It is understood that when the sphere 5 is stationary, the point at which the laser beam emitted by the laser drilling mechanism 2 on the sphere 5 is fixed remains unchanged. Manually adjusting the angle of the sphere 5 in the positioning slot 12 can change the point at which the laser beam is dropped on the sphere 5, thereby creating standard circular holes 51 at different locations on the sphere 5.

[0034] See also Figures 2 to 4 , Figure 3 This is a schematic diagram of the internal structure of the positioning block 11 of the pickle ball processing equipment according to an embodiment of the present invention. Figure 4 The figure is a schematic diagram of the ball rotating mechanism 3 of the pickle ball processing equipment of an embodiment of the present invention. In some embodiments, in order to avoid potential hidden dangers of manual operation, the pickle ball processing equipment of the present application further includes a ball rotating mechanism 3, which is used to drive the ball 5 to rotate so that different points of the ball 5 positioned on the ball positioning mechanism 1 are exposed to the laser beam irradiation position of the laser hole opening mechanism 2. Through the ball rotating mechanism 3, the ball 5 can be driven to rotate quickly and accurately so that different points of the ball 5 are exposed to the laser beam irradiation position of the laser hole opening mechanism 2, thereby achieving all-round hole opening processing of the ball 5, which can significantly improve production efficiency and reduce the time and error of manual operation. It should be explained that the ball rotating mechanism 3 can be a robot or other implementation method, and the adjustment of the ball 5 by the robot to rotate the ball 5 is not described in detail here.

[0035] In a feasible implementation process, the sphere 5 is placed in the positioning groove 12 of the sphere positioning mechanism 1 during use, and the negative pressure adsorption force provided by the suction device and the suction hole 13 enables the sphere 5 to be firmly adsorbed in the positioning groove 12. The laser 22 of the laser hole opening mechanism 2 emits a laser beam to the sphere 5 positioned in the sphere positioning mechanism 1 to perform hole opening processing. When the laser hole opening mechanism 2 completes the hole processing of the current position of the sphere 5, the sphere rotation mechanism 3 is started to expose different points of the sphere 5 to the laser beam irradiation position of the laser hole opening mechanism 2. It can be understood that the synergistic effect of the sphere rotation mechanism 3 and the sphere positioning mechanism 1 realizes the stable fixation and multi-angle adjustment of the sphere 5 during the processing process, ensuring that the hole positions are evenly distributed.

[0036] In some embodiments, the ball rotation mechanism 3 includes a first drive assembly 31 and a second drive assembly 32. The first drive assembly 31 is used to drive the ball 5 to rotate in a first direction, and the second drive assembly 32 is used to drive the ball 5 to rotate in a second direction. The first direction and the second direction are both horizontal and vertical. By setting the first drive assembly 31 and the second drive assembly 32, the ball 5 can be driven to rotate in two perpendicular horizontal directions respectively, thereby achieving all-round processing of the ball 5. It should be explained that the first direction and the second direction refer to the direction of travel of the ball 5 when rolling. That is, when the first drive assembly 31 drives the ball 5 to rotate, the direction of travel of the ball 5 is the first direction. However, due to the limitation of the ball positioning mechanism 1, the rotation of the ball 5 does not produce horizontal displacement, but rotates in the positioning slot 12.

[0037] In some embodiments, the positioning groove 12 has a first rotating groove 14 formed in the groove body along the first direction; the first driving assembly 31 includes a first rotating member 311, a second rotating member 312, and a first synchronous transmission belt 313 wound around the first rotating member 311 and the second rotating member 312. The first rotating member 311 and the second rotating member 312 are respectively close to the two sides of the first rotating groove 14 in the first direction, and a portion of the first synchronous transmission belt 313 is located in the positioning groove 12; the first rotating member 311 and / or the second rotating member 312 are configured with a first driving member 314, and the first driving member 314 is used to drive the first rotating member 311 and / or the second rotating member 312 to rotate, so that the portion of the first synchronous transmission belt 313 located in the positioning groove 12 moves in the first direction. Optionally, the first rotating member 311 and the second rotating member 312 can be rotating rollers or rotating wheels. It is understood that the first rotating member 311 and the second rotating member 312 in the first driving assembly 31 are connected by the first synchronous transmission belt 313. When the first driving member 314 drives the first rotating member 311 and / or the second rotating member 312 to rotate, the portion of the first synchronous transmission belt 313 located in the positioning groove 12 will move in the first direction, thereby driving the ball 5 to rotate in the positioning groove 12. Preferably, the groove body of the positioning groove 12 is provided with two first rotating grooves 14 along the first direction. The first rotating grooves 14 described in this embodiment should be provided along the first direction to adapt to the shape of the groove body of the positioning groove 12, that is, the first rotating grooves 14 are provided along the curved surface of the groove body of the positioning groove 12 in the first direction.

[0038] In a feasible implementation process, the sphere 5 is placed in the positioning groove 12, and the adsorption holes adsorb the bottom of the sphere 5 so that it is pressed against the first synchronous transmission belt 313. When the first driving member 314 is started, it drives the first rotating member 311 and / or the second rotating member 312 to rotate, and the first synchronous transmission belt 313 starts to move under the drive of the first rotating member 311 and / or the second rotating member 312. The portion located in the positioning groove 12, that is, the portion pressed by the sphere 5 in the positioning groove 12, moves in the first direction. Then, through the contact and friction between the first synchronous transmission belt 313 and the sphere 5, the sphere 5 is driven to rotate in the first direction in the positioning groove 12, thereby achieving exposure of different points of the sphere 5 to the laser beam irradiation position of the laser opening mechanism 2.

[0039] In some embodiments, the groove body of the positioning groove 12 is provided with a second rotating groove 15 along the second direction; the second driving assembly 32 includes a third rotating member 321, a fourth rotating member 322 and a second synchronous transmission belt 323 wound around the third rotating member 321 and the fourth rotating member 322, the third rotating member 321 and the fourth rotating member 322 are respectively close to the two sides of the second rotating groove 15 in the second direction, and part of the second synchronous transmission belt 323 is located in the positioning groove 12; the third rotating member 321 and / or the fourth rotating member 322 are configured with a second driving member 324, and the second driving member 324 is used to drive the third rotating member 321 and / or the fourth rotating member 322 to rotate, so that the part of the second synchronous transmission belt 323 located in the positioning groove 12 moves toward the second direction.

[0040] Optionally, the third rotating member 321 and the fourth rotating member 322 can be rotating rollers or rotating wheels. It can be understood that the third rotating member 321 and the fourth rotating member 322 in the first drive assembly 31 are connected by the second synchronous transmission belt 323. When the first drive member 314 drives the third rotating member 321 and / or the fourth rotating member 322 to rotate, the portion of the second synchronous transmission belt 323 located in the positioning groove 12 will move in the second direction, thereby driving the ball 5 to rotate in the positioning groove 12. Preferably, the groove body of the positioning groove 12 is provided with two second rotating grooves 15 along the second direction. The second rotating groove 15 described in this embodiment is provided along the second direction to adapt to the shape of the groove body of the positioning groove 12, that is, the second rotating groove 15 is provided along the curved surface of the groove body of the positioning groove 12 in the second direction.

[0041] In a feasible implementation process, the sphere 5 is placed in the positioning groove 12, and the adsorption holes adsorb the bottom of the sphere 5 so that it is pressed against the second synchronous transmission belt 323. When the first driving member 314 is started, it drives the third rotating member 321 and / or the fourth rotating member 322 to rotate, and the second synchronous transmission belt 323 starts to move under the drive of the third rotating member 321 and / or the fourth rotating member 322. The portion located in the positioning groove 12, that is, the portion pressed by the sphere 5 in the positioning groove 12, moves in the second direction. Then, through the contact and friction between the second synchronous transmission belt 323 and the sphere 5, the sphere 5 is driven to rotate in the second direction in the positioning groove 12, thereby achieving exposure of different points of the sphere 5 to the laser beam irradiation position of the laser opening mechanism 2.

[0042] In some embodiments, the laser opening mechanism 2 includes an adjustment component 21 and a laser 22, the laser 22 is connected to the movable end of the adjustment component 21, the laser 22 is used to emit a laser beam to the sphere 5 positioned in the sphere positioning mechanism 1, and the adjustment component 21 is used to drive the laser 22 along its laser emission direction to approach or move away from the sphere 5 positioned in the sphere positioning mechanism 1. It can be understood that by adjusting the distance between the laser 22 and the sphere 5 by the adjustment component 21, the focal length of the laser can be precisely controlled, thereby adapting to the processing requirements of spheres 5 of different materials and sizes, and ensuring high precision of aperture and hole position. Specifically, the laser beam emitted by the laser 22 forms a focus after passing through the focusing lens. By adjusting the distance between the laser 22 and the sphere 5, the position of the focus on the surface of the sphere 5 can be changed to achieve precise opening.

[0043] In some embodiments, the laser hole-opening mechanism 2 further includes: an adjustment component 21 for driving the laser 22 to rise or fall in the vertical direction, the laser emission direction of the laser 22 is vertically downward, and the laser beam emitted by the laser 22 is directed to the center of the sphere 5 positioned in the sphere positioning mechanism 1. It can be understood that by directing the laser beam emitted by the laser 22 to the center of the sphere 5, it can be ensured that a standard round hole 51 without chamfers or fillets is machined on the sphere 5, meeting the high-precision requirements of pickleball for aperture and hole position. In addition, the design of the laser beam pointing vertically downward and toward the center of the sphere provides an accurate reference position for the laser 22, facilitates the maintenance and correction of the laser 22, and reduces the downtime and maintenance costs of the equipment.

[0044] In some embodiments, the adjustment assembly 21 may include a linear motor, the laser 22 is connected to the moving end of the linear motor, and the moving end of the linear motor drives the laser 22 to move up and down in the vertical direction. In some embodiments, the adjustment assembly 21 may include a drive motor, a transmission screw, a transmission nut, and a limit seat, the transmission screw is connected to the output end of the drive motor, the transmission nut is threadedly engaged with the transmission screw, the laser 22 is connected to the transmission nut, and the limit seat is used to install the transmission screw and limit the movement of the transmission nut in the rotation direction, so that when the drive motor is working, the transmission screw rotates to cause the transmission nut to move up and down in the vertical direction, thereby driving the laser 22 to rise or fall in the vertical direction. In other embodiments, the adjustment assembly 21 can also adopt other driving methods, such as pneumatic drive, hydraulic drive, etc., to achieve precise movement of the laser 22. For example, a pneumatic cylinder or a hydraulic cylinder is used as a driving device, and precise movement of the moving end is achieved by controlling the air pressure or hydraulic pressure.

[0045] In some embodiments, a gas-assisted mechanism 4 is further included, which is used to deliver inert gas to the sphere 5 positioned in the sphere positioning mechanism 1. In some embodiments, the gas-assisted mechanism 4 includes a gas source 41 and a vent tube 42 disposed on one side of the sphere positioning mechanism 1. The vent tube 42 is provided with a gas nozzle 43 directed toward the sphere positioning mechanism 1. Optionally, the inert gas can be nitrogen, argon, or helium. Preferably, the inert gas is nitrogen. Optionally, the gas source 41 is the source of the inert gas and can be a high-pressure gas cylinder or a gas generator. It is understood that by delivering inert gas to the sphere 5, slag and debris generated during the laser drilling process can be effectively blown away, preventing these substances from interfering with or contaminating subsequent processing. In addition, the inert gas can also protect the surface of the sphere 5 to a certain extent, reducing the occurrence of adverse reactions such as oxidation, thereby improving the quality and stability of the hole. At the same time, the use of inert gas can also protect the lenses of the laser processing equipment from contamination or overheating.

[0046] In some embodiments, a control device and a visual detection device are also included. The visual detection device is used to obtain image information of the sphere 5 positioned on the sphere positioning mechanism 1. The control device controls the operation of the sphere positioning mechanism 1 and the laser opening mechanism 2 according to the image information of the visual detection device.

[0047] In some embodiments, the control device can control the operation of the sphere positioning mechanism 1, the laser drilling mechanism 2, and the sphere rotation mechanism 3 based on the image information from the visual inspection device. However, the control device is not limited to obtaining image information from the visual inspection device. It can also obtain other types of information through other sensor devices. For example, an optical sensor or laser displacement sensor can be used to monitor the processing depth of the hole in real time; for example, an integrated material detection sensor (such as spectral analysis) can be used to identify the material of the sphere 5 (such as PE, PP) in real time and automatically match laser power, pulse width, and other parameters. For example, a high-precision encoder can be embedded in the sphere rotation mechanism 3 to correct the position deviation of the sphere 5 in real time to ensure that the hole position is consistent with the preset coordinates.

[0048] In some embodiments, the pickle ball processing equipment may include the following steps when performing work: S100 , collecting images of the sphere 5 in real time through a visual detection device and performing pre-processing operations.

[0049] In some embodiments, the preprocessing operations include denoising, contrast enhancement and binarization. Denoising can use Gaussian filtering or median filtering to eliminate image noise; contrast enhancement can use histogram equalization or adaptive contrast enhancement to highlight the edge of the sphere 5; binarization can use Otsu algorithm or adaptive threshold segmentation to convert the image into a black and white binary image to facilitate subsequent edge detection.

[0050] S200 , detecting and locating the sphere 5 according to the preprocessed image to obtain the posture data of the sphere 5 .

[0051] In some embodiments, the Canny or Sobel operator can be used to extract the outline of the sphere 5, the center and radius of the sphere 5 can be detected by circular Hough transform, and the three-dimensional posture of the sphere 5 can be calculated based on the multi-view image or depth camera data obtained by the visual detection device.

[0052] S300: Generate a laser processing path based on the 5-position data of the sphere and the preset hole position distribution.

[0053] In some embodiments, generating a laser processing path includes hole distribution modeling, coordinate transformation, path optimization, and dynamic adjustment. Hole distribution modeling includes generating a standard hole distribution map based on pickleball design requirements. Coordinate transformation includes converting preset hole positions from the coordinate system of the sphere 5 to the device coordinate system. Path optimization includes optimizing the laser processing sequence using a greedy algorithm or a genetic algorithm to reduce idle stroke time. Dynamic adjustment includes dynamically correcting the processing path based on real-time position deviations of the sphere 5.

[0054] S400 , controlling the sphere rotating mechanism 3 to drive the sphere 5 to rotate according to the generated laser processing path.

[0055] In some embodiments, this embodiment includes analyzing the laser processing path and decomposing the generated laser processing path into a series of discrete points; according to the discrete points, controlling the sphere rotation mechanism 3 to drive the sphere 5 to rotate so that each point is exposed to the laser beam irradiation position in turn; during the rotation of the sphere 5, continuously collecting images of the sphere 5, detecting the position change of the sphere 5, and ensuring the accuracy and stability of the rotation of the sphere 5.

[0056] It should be noted that the above steps S100-S400 are only used as a reference method for execution of the pickle ball processing equipment of this application. Users can configure other personalized execution methods according to actual equipment requirements, and no limitation is made here.

[0057] The embodiment of the present invention provides a pickle ball, which is made by the pickle ball processing equipment described above, and is provided with a plurality of standard round holes 51 without chamfers or fillets. The edges of the standard round holes 51 are not chamfered or filleted, and the hole walls are straight without taper or curvature. In some embodiments, the number of standard round holes 51 provided on the pickle ball is 26 or 40.

[0058] In some embodiments, the number of standard round holes 51 provided on the pickle ball is 26, and the average hole diameter should be 10.9±1.0 mm. In some embodiments, the number of standard round holes 51 provided on the pickle ball is 40, and the average hole diameter should be 7.1±0.5 mm. It can be understood that a larger hole diameter helps reduce air resistance, making the ball 5 more stable in flight in an indoor environment; a smaller hole diameter helps resist the influence of wind in an outdoor environment and maintain a stable flight trajectory. Therefore, a pickle ball with 26 standard round holes 51 is more suitable for indoor use, while a pickle ball with 40 standard round holes 51 is more suitable for outdoor use.

[0059] In some embodiments, the standard circular holes 51 are evenly distributed on the surface of the pickle ball. It is understandable that the pickle ball needs to move quickly in the air and maintain a stable trajectory. Evenly distributed holes can disperse the airflow and avoid local turbulence.

[0060] In some embodiments, the pickleball weighs between 0.78 ounces and 0.935 ounces (22.1 grams and 26.5 grams). This weight range allows the pickleball to be neither too light nor too heavy when struck, making it suitable for players of all ages and abilities.

[0061] In some embodiments, the diameter of the pickleball should be between 2.87 inches (7.29 cm) and 2.97 inches (7.54 cm). This size allows the ball 5 to have moderate speed and stability when flying in the air, while also being easy for the player to hit and control with a racket.

[0062] In some embodiments, the maximum roundness deviation of the pickle ball shall not exceed ±0.020 inches (0.51 mm). Good roundness can ensure the stability and consistency of the ball 5 when flying and rolling.

[0063] The above examples are merely provided to further illustrate the technical content of the present invention for easier understanding by the reader, but do not limit the embodiments of the present invention to these examples. Any extension or re-creation of the technology based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. A pickle ball processing device, characterized in that: include: A sphere positioning mechanism and a laser hole opening mechanism, wherein the sphere positioning mechanism is used to position the sphere, and the laser hole opening mechanism is used to emit a laser beam toward the sphere positioned in the sphere positioning mechanism to open a hole in the sphere positioned in the sphere positioning mechanism.

2. The pickle ball processing equipment according to claim 1, characterized in that: The ball positioning mechanism includes a positioning block, the positioning block is provided with a positioning groove matching the spherical surface of the ball, and the ball positioning mechanism carries the ball through the positioning groove.

3. The pickle ball processing equipment according to claim 2, characterized in that: The ball positioning mechanism also includes an air suction device and an air suction hole arranged in the positioning groove, and the air suction device is used to provide suction force for the air suction hole so that the air suction hole is connected to the hole opening of the positioning groove and has negative pressure adsorption force.

4. The pickle ball processing equipment according to claim 2, characterized in that: It also includes a ball rotating mechanism, which is used to drive the ball to rotate so that different points of the ball positioned on the ball positioning mechanism are exposed to the laser beam irradiation position of the laser opening mechanism.

5. The pickle ball processing equipment according to claim 4, characterized in that: The ball rotation mechanism includes a first drive assembly and a second drive assembly. The first drive assembly is used to drive the ball to rotate in a first direction, and the second drive assembly is used to drive the ball to rotate in a second direction. The first direction and the second direction are both horizontal and vertical.

6. The pickle ball processing equipment according to claim 5, characterized in that: The groove body of the positioning groove is provided with a first rotating groove along the first direction; the first driving assembly includes a first rotating member, a second rotating member and a first synchronous transmission belt wound around the first rotating member and the second rotating member, the first rotating member and the second rotating member are respectively close to the two sides of the first rotating groove in the first direction, and part of the first synchronous transmission belt is located in the positioning groove; the first rotating member and / or the second rotating member are equipped with a first driving member, and the first driving member is used to drive the first rotating member and / or the second rotating member to rotate so that the part of the first synchronous transmission belt located in the positioning groove moves toward the first direction.

7. The pickle ball processing equipment according to claim 5, characterized in that: The groove body of the positioning groove is provided with a second rotating groove along the second direction; the second driving assembly includes a third rotating member, a fourth rotating member and a second synchronous transmission belt wound around the third rotating member and the fourth rotating member, the third rotating member and the fourth rotating member are respectively close to the two sides of the second rotating groove in the second direction, and part of the second synchronous transmission belt is located in the positioning groove; the third rotating member and / or the fourth rotating member are equipped with a second driving member, and the second driving member is used to drive the third rotating member and / or the fourth rotating member to rotate so that the part of the second synchronous transmission belt located in the positioning groove moves toward the second direction.

8. The pickle ball processing equipment according to claim 1, characterized in that: The laser opening mechanism includes an adjustment component and a laser. The laser is connected to the movable end of the adjustment component. The laser is used to emit a laser beam toward the sphere positioned in the sphere positioning mechanism. The adjustment component is used to drive the laser to approach or move away from the sphere positioned in the sphere positioning mechanism along its laser emission direction.

9. The pickle ball processing equipment according to claim 8, characterized in that: The adjustment component is used to drive the laser to rise or fall in the vertical direction. The laser emission direction of the laser is vertically downward, and the laser beam emitted by the laser points to the center of the sphere positioned in the sphere positioning mechanism.

10. A pickle ball, characterized in that: Made by the pickle ball processing equipment according to any one of claims 1 to 9, the pickle ball is provided with a plurality of standard round holes without chamfers and rounded corners.

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