A grinding device for semiconductor production and processing

Abstract

The present invention belongs to the field of semiconductor wafer processing technology, and specifically relates to a polishing device for semiconductor production and processing, which includes a workbench, a protective cover, a moving component and a liquid spraying component, wherein the moving component drives the polishing adjustment component to move; the polishing adjustment component includes a box cover and a polishing box, an adjustment motor is installed on the box cover, the adjustment motor is connected to a transmission shaft and a reciprocating screw, and the transmission shaft drives the polishing box to rotate intermittently through the liquid spraying component. The present invention drives the polishing block to press and fit the wafer disc through the polishing adjustment component, drives the polishing box to rotate intermittently through the adjustment drive component, and then switches to the next group of polishing blocks, cooperates with the insert block to move down again to press the pressure plate, and realizes that each group of polishing blocks fits the wafer disc. The present invention adjusts the polishing blocks one by one through the polishing adjustment component, so that each group of polishing blocks can fit the uneven surface of the wafer disc, improves the efficiency of the polishing of the polishing blocks, ensures the uniform thickness of the wafer disc, and avoids uneven stress distribution of the wafer disc.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor wafer processing, and in particular relates to a polishing device for semiconductor production and processing. Background Art

[0002] After semiconductor wafers undergo processes such as cutting and etching, many defects such as cracks and unevenness may remain on their surfaces. These defects will affect the stability of subsequent chips and circuit products. Polishing can effectively remove these defects, thereby improving device performance and removing uneven parts on the surface of semiconductor materials so that their surface flatness, smoothness, and dimensional accuracy meet the requirements, thereby obtaining better surface quality.

[0003] The polishing method of the existing technology often uses a polishing sheet to polish by laminating the polishing sheet to the wafer. For example, the invention patent with publication number CN117961688A. However, in the actual production process, since the wear of the polishing sheet is difficult to control, the degree of wear of different parts of the polishing sheet is different, and the amount of material removed by the polishing sheet on the wafer surface is not the same, resulting in uneven wafer thickness. The uneven thickness of the wafer will cause uneven stress distribution during subsequent processing and use, which can easily lead to wafer breakage or device performance degradation. Summary of the Invention

[0004] The purpose of the present invention is to provide a semiconductor production and processing polishing device to address the shortcomings of the prior art and solve the technical problems in the prior art.

[0005] The objectives of the present invention can be achieved through the following technical solutions: a polishing device for semiconductor production and processing, which includes a workbench and a protective cover installed on the workbench, a moving component and a liquid spraying component installed on the protective cover, the moving component drives the polishing adjustment component to move, the polishing table is installed on the workbench, and the wafer disk is fixedly placed on the polishing table; the polishing adjustment component includes a box cover and a polishing box, the box cover is installed with an adjustment drive component and a polishing drive component, the polishing box is rotatably installed on the box cover, and an adjustment motor is installed on the box cover, the output end of the adjustment motor is coaxially connected to the transmission shaft and the reciprocating screw respectively, and the transmission shaft drives the polishing box to rotate intermittently through the adjustment drive assembly; the reciprocating screw is transmission-connected to the lifting sleeve, and the lifting sleeve is installed with an insert block; a locking piece is installed in the polishing box, and a pressure plate is slidably installed in the locking piece; the insert block presses the pressure plate, and the pressure plate presses the guide plate and the polishing block through the pressure table, and the polishing block fits the wafer disk.

[0006] As a further optimization or improvement of this solution, the locking part includes a slide plate, the slide plate is installed in the polishing box, a pressure groove is opened inside the slide plate, a socket is opened on the top of the pressure groove, a pressure plate is slidably installed in the pressure groove, and the insert block is inserted into the pressure groove through the socket to push the pressure plate to move; a metal plate is installed inside the slide plate, and an electromagnetic suction cup is installed on the pressure plate, which adsorbs the metal plate.

[0007] As a further optimization or improvement of this solution, a slider is installed on the pressing plate, and a slide frame is installed on the pressing table, and the slider and the slide frame are slidably matched.

[0008] As a further optimization or improvement of this solution, the guide plate is connected to the press table through a spring, a grinding block is installed at the bottom of the guide plate, an inclined groove is opened on the grinding box, a slider is installed on the guide plate, and the slider slides in cooperation with the inclined groove.

[0009] As a further optimization or improvement of this solution, a guide platform is installed on the polishing box, a longitudinal groove is opened in the guide platform, the longitudinal groove is slidably connected to the connecting shaft, the pressing platform is connected to the connecting shaft through a pressing rod, the connecting shaft is connected to the clamping block through a push rod, and the guide plate clamps the polishing block.

[0010] As a further optimization or improvement of this solution, the adjustment drive assembly includes a bevel gear disk, the adjustment motor is connected to the bevel gear disk through a transmission shaft, a fixing rod is installed inside the box cover, a partial gear is installed on the fixing rod, the partial gear is coaxially connected to the bevel gear, and a transmission gear is fixedly installed on the polishing box, the transmission gear is engaged with the partial gear, and the bevel gear is engaged with the bevel gear disk.

[0011] As a further optimization or improvement of this solution, the grinding drive assembly includes a grinding motor, the grinding motor is fixedly installed on the box cover, the output end of the grinding motor is connected to the grinding gear, the inner gear ring is installed on the grinding box, and the grinding gear is meshed with the inner gear ring.

[0012] As a further optimization or improvement of this solution, the moving component includes a motor and a guide rail, the guide rail is installed on the top of the protective cover, a screw is rotatably installed in the guide rail, the motor drives the screw to rotate, a transmission platform is slidably installed in the guide rail, the transmission platform is connected to the screw, and a box cover is fixedly installed on the transmission platform; the liquid spraying component includes a liquid storage tank, a nozzle is installed on the liquid storage tank, and the nozzle is facing the wafer disk; a drain port is opened on the protective cover.

[0013] Beneficial effects of the present invention:

[0014] (1) The present invention uses a grinding adjustment component to drive the grinding blocks to press and fit the wafer disc, and uses an adjustment drive component to drive the intermittent rotation of the grinding box, thereby switching to the next group of grinding blocks, and cooperating with the insert block to move down again to press the pressure plate, so that each group of grinding blocks fits the wafer disc. The present invention uses a grinding adjustment component to adjust the grinding blocks one by one, so that each group of grinding blocks can fit the uneven surface of the wafer disc, improve the grinding efficiency of the grinding blocks, ensure the uniform thickness of the wafer disc, and avoid uneven stress distribution on the wafer disc.

[0015] (2) The present invention adjusts the grinding blocks twice so that the severely worn grinding blocks are moved closer to the center of the wafer disk, thereby reducing the wear of the severely worn grinding blocks, balancing the wear of each group of grinding blocks, ensuring that the wear of each group of grinding blocks is equal, avoiding the appearance of shallow and deep wear marks on the surface of the wafer disk, reducing the fluctuation of the surface roughness (Ra value) of the wafer disk, and improving the grinding stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0018] Figure 2 Schematic diagram of the internal structure of the protective cover.

[0019] Figure 3 This is a front view of the internal structure of the protective cover.

[0020] Figure 4 Schematic diagram of the grinding block structure.

[0021] Figure 5 This is a cross-sectional view of the overall structure of the grinding adjustment component.

[0022] Figure 6 for Figure 5 A magnified view of the structure of part A.

[0023] Figure 7 for Figure 5 A magnified view of the structure of part B.

[0024] Figure 8 This is the matching diagram of the locking part and the pressure plate.

[0025] Figure 9 Transmission connection diagram of the pressure rod and push rod.

[0026] Figure 10 Diagram of the sliding connection between the inclined slot and the slider.

[0027] Figure 11 Schematic diagram of the structure of the adjustment drive component and the polishing drive component.

[0028] Figure 12Exploded diagram of the overall structure of the regulating drive component.

[0029] The following are marked in the figure: 1. Workbench; 2. Protective cover;

[0030] 3. Moving assembly; 301. Motor; 302. Guide rail; 303. Transmission platform; 304. Screw; 4. Observation window;

[0031] 5. Liquid spray assembly; 501. Liquid storage tank; 502. Spray head;

[0032] 6. Grinding adjustment assembly; 601. Box cover; 602. Grinding box; 603. Grinding block; 604. Adjusting motor; 605. Drive shaft; 606. Reciprocating screw; 607. Lifting sleeve; 608. Insert block; 609. Locking piece; 6091. Socket; 6092. Sliding table; 6093. Pressing groove; 6094. Metal plate; 6095. Electromagnetic chuck; 610. Pressing plate; 611. Pressing table; 612. Guide plate; 613. Slider; 614. Sliding frame; 615. Spring; 616. Guide table; 617. Pressing rod; 618. Push rod; 619. Connecting shaft; 620. Longitudinal groove; 621. Clamping block; 622. Inclined groove; 623. Sliding block; 624. Fixing rod; 7. Drain port;

[0033] 8. Adjusting drive assembly; 801. Bevel gear; 802. Bevel gear; 803. Partial gear; 804. Transmission gear;

[0034] 9. Grinding drive assembly; 901. Grinding motor; 902. Grinding gear; 903. Internal gear ring; 10. Grinding table; 11. Wafer disk. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0036] See also Figures 1-9A polishing device for semiconductor production and processing includes a workbench 1 and a protective cover 2 installed on the workbench 1, a moving component 3 and a liquid spraying component 5 are installed on the protective cover 2, the moving component 3 drives the polishing adjustment component 6 to move, a polishing table 10 is installed on the workbench 1, and a wafer 11 is fixedly placed on the polishing table 10; the polishing adjustment component 6 includes a box cover 601 and a polishing box 602, an adjustment drive component 8 and a polishing drive component 9 are installed on the box cover 601, the polishing box 602 is rotatably installed on the box cover 601, and an adjustment motor 60 is installed on the box cover 601 4. The output end of the regulating motor 604 is coaxially connected to the transmission shaft 605 and the reciprocating screw 606, respectively. The transmission shaft 605 drives the polishing box 602 to rotate intermittently through the regulating drive component 8; the reciprocating screw 606 is transmission-connected to the lifting sleeve 607, and the insert block 608 is installed on the lifting sleeve 607; a locking piece 609 is installed in the polishing box 602, and a pressure plate 610 is slidably installed in the locking piece 609; the insert block 608 presses the pressure plate 610, and the pressure plate 610 presses the guide plate 612 and the polishing block 603 through the pressing platform 611, and the polishing block 603 fits the wafer disk 11.

[0037] Specifically, a slider 613 is installed on the pressing plate 610 , and a slide frame 614 is installed on the pressing platform 611 . The slider 613 and the slide frame 614 are slidably matched.

[0038] Specifically, the adjustment drive assembly 8 includes a bevel gear 801, the adjustment motor 604 is connected to the bevel gear 801 through a transmission shaft 605, a fixed rod 624 is installed inside the box cover 601, a partial gear 803 is installed on the fixed rod 624, the partial gear 803 is coaxially connected to the bevel gear 802, and a transmission gear 804 is fixedly installed on the polishing box 602, the transmission gear 804 is engaged with the partial gear 803, and the bevel gear 802 is engaged with the bevel gear 801.

[0039] Specifically, the grinding drive assembly 9 includes a grinding motor 901 , which is fixedly mounted on the box cover 601 , an output end of the grinding motor 901 is connected to a grinding gear 902 , an inner gear ring 903 is mounted on the grinding box 602 , and the grinding gear 902 is meshed with the inner gear ring 903 .

[0040] It should be noted that the semiconductor wafer disk 11 is typically manufactured using a single crystal silicon growth process. During the growth of single crystal silicon, the solidification of molten silicon is affected by various factors, such as temperature gradient and crystal orientation, resulting in an uneven surface of the grown single crystal silicon rod. Therefore, before polishing the wafer disk 11, the surface of the wafer disk 11 is uneven.

[0041] When in use, the wafer 11 is placed only on the polishing table 10. The motor 301 drives the screw 304 to rotate, and the screw 304 drives the transmission platform 303 and the box cover 601 to move toward the center of the wafer 11. When the polishing box 602 moves to the top of the wafer 11, the motor 301 stops.

[0042] The present invention makes the first adjustment to the grinding block 603. The adjustment motor 604 is started, and the adjustment motor 604 drives the transmission shaft 605 and the reciprocating screw 606 to rotate synchronously. When the reciprocating screw 606 rotates, under the action of the transmission connection between the reciprocating screw 606 and the lifting sleeve 607, the reciprocating screw 606 drives the lifting sleeve 607 and the insert block 608 to move downward. As the insert block 608 moves downward, Figure 6 , the insert block 608 is inserted into the slide table 6092 through the socket 6091, so that the insert block 608 pushes the pressure plate 610 inside the pressure groove 6093 to move downward, see Figure 7 The pressing plate 610 moves downward, driving the pressing platform 611 to move downward synchronously, so that the pressing platform 611 pushes the guide plate 612 and the grinding block 603 to move downward, so that the grinding block 603 presses and fits the wafer 11. In the process of the pressing plate 610 moving downward, see Figure 9 The pressing platform 611 pushes the connecting shaft 619 downward along the longitudinal groove 620 through the pressing rod 617, so that the connecting shaft 619 pushes the clamping block 621 through the push rod 618 to clamp the grinding block 603, fixing the position of the grinding block 603, and then fixing the pressing plate 610 by starting the electromagnetic suction cup 6095 to adsorb the metal plate 6094.

[0043] When the transmission shaft 605 rotates, it drives the bevel gear 801 to rotate synchronously. Through the transmission connection between the bevel gear 801 and the bevel gear 802, the bevel gear 801 drives the bevel gear 802 and the partial gear 803 to rotate synchronously. Through the transmission connection between the partial gear 803 and the transmission gear 804, the partial gear 803 intermittently drives the grinding box 602 to rotate. The rotation of the grinding box 602 switches to the next set of grinding blocks 603. The insert block 608 moves downward again, pressing the pressure plate 610, allowing the second set of grinding blocks 603 to adhere to the wafer disk 11. This operation is repeated until all sets of grinding blocks 603 can conform to the uneven surface of the wafer disk 11. After the first adjustment is completed, the present invention adjusts the grinding blocks 603 one by one through the grinding adjustment component 6, so that each group of grinding blocks 603 can fit the uneven surface of the wafer disk 11, thereby improving the grinding efficiency of the grinding blocks 603, ensuring the uniform thickness of the wafer disk 11, and avoiding uneven stress distribution of the wafer disk 11.

[0044] The wafer 11 is fixed by the polishing table 10, and the polishing motor 901 is started. The polishing motor 901 drives the polishing box 602 and the polishing block 603 at the bottom of the polishing box 602 to rotate through the polishing gear 902, and the polishing block 603 is used to polish the uneven surface of the wafer 11.

[0045] Specifically, during the polishing process, because the surface of the wafer disk 11 is uneven, the wear of each group of polishing blocks 603 varies as the polishing blocks 603 polish the wafer disk 11, with some groups experiencing severe wear. When polishing blocks 603 with different wear levels polish the wafer disk 11, the material removal rate of the severely worn polishing blocks 603 decreases. Consequently, the severely worn polishing blocks 603 polish less of the wafer disk 11, while the normally worn polishing blocks 603 polish more of the wafer disk 11. As the two groups alternately polish the wafer disk 11, shallow and deep wear marks appear on the surface of the wafer disk 11, causing large fluctuations in the surface roughness (Ra value) of the wafer disk 11 and making scratches, pits, or corrosion marks more likely to appear in localized areas of the wafer disk 11.

[0046] Therefore, the present invention performs a secondary adjustment on the grinding block 603. First, the grinding drive assembly 9 is turned off. After the grinding box 602 stops rotating, the regulating motor 604 is started again to adjust the grinding block 603 for the second time. The insert block 608 pushes the pressing plate 610, the pressing platform 611, the guide plate 612 and the grinding block 603 downward. Figure 10 , with the cooperation of the slider 623 and the bevel 622, the severely worn grinding block 603 moves closer to the center of the wafer disk 11. As the grinding drive assembly 9 runs again, the grinding block 603 grinds the wafer disk 11. Since the linear speed of the center of the wafer disk 11 is low, the wear of the grinding block 603 near the center of the wafer disk 11 is reduced. The present invention adjusts the grinding block 603 a second time to move the severely worn grinding block 603 closer to the center of the wafer disk 11, thereby reducing the wear of the severely worn grinding block 603, balancing the wear of each group of grinding blocks 603, ensuring that the wear of each group of grinding blocks 603 is equal, avoiding the appearance of shallow and deep wear marks on the surface of the wafer disk 11, reducing the fluctuation of the surface roughness (Ra value) of the wafer disk 11, and improving the grinding stability.

[0047] It should be noted that the linear velocity at the center of wafer disk 11 is low: during the polishing process, the linear velocity of polishing block 603 varies at different points in contact with wafer disk 11. For polishing block 603, the linear velocity at the center is relatively low because this area has a smaller radius during rotation. According to the principles of friction and wear, when the linear velocity is low, the number of frictions with wafer disk 11 per unit time is relatively small, resulting in relatively less wear.

[0048] High linear velocity at the edge of wafer 11: When polishing block 603 is near the edge of wafer 11, the linear velocity is higher due to the larger rotation radius. This higher linear velocity results in more frequent friction between polishing block 603 and wafer 11. For the same polishing time, polishing block 603 near the edge of wafer 11 experiences greater wear than polishing block 603 near the center of wafer 11.

[0049] It should be noted that during the polishing process, the polishing adjustment assembly 6 can be driven by the movable assembly 3 to move along the wafer disk 11 to improve the polishing efficiency. The wafer disk 11 can be offset on the polishing table 10 and polished by rotating the polishing table 10.

[0050] See also Figure 5-Figure 6 The locking member 609 includes a slide table 6092, which is installed in the polishing box 602. A pressing groove 6093 is provided inside the slide table 6092, and a socket 6091 is provided on the top of the pressing groove 6093. A pressing plate 610 is slidably installed in the pressing groove 6093. The insert block 608 is inserted into the pressing groove 6093 through the socket 6091 to push the pressing plate 610 to move; a metal plate 6094 is installed inside the slide table 6092, and an electromagnetic suction cup 6095 is installed on the pressing plate 610, which adsorbs the metal plate 6094.

[0051] It should be noted that the present invention fixes the pressing plate 610 by activating the electromagnetic chuck 6095 to adsorb the metal plate 6094. When the grinding block 603 needs to be adjusted again, the electromagnetic chuck 6095 is closed and opened again after the adjustment is completed.

[0052] See also Figure 5 and Figure 7 The guide plate 612 is connected to the pressing platform 611 through a spring 615. A grinding block 603 is installed at the bottom of the guide plate 612. An inclined groove 622 is opened on the grinding box 602. A slider 623 is installed on the guide plate 612. The slider 623 slides in cooperation with the inclined groove 622.

[0053] It should be noted that the pressing plate 610 slides with the sliding frame 614 on the pressing platform 611 through the slider 613. Therefore, during the secondary adjustment of the grinding block 603, when the grinding block 603 moves toward the center position of the grinding box 602, the sliding cooperation between the slider 613 and the sliding frame 614 can provide moving space for the grinding block 603.

[0054] See also Figure 9 A guide platform 616 is installed on the polishing box 602, and a longitudinal groove 620 is provided in the guide platform 616. The longitudinal groove 620 is slidably connected to the connecting shaft 619. The pressing platform 611 is connected to the connecting shaft 619 through a pressing rod 617. The connecting shaft 619 is connected to the clamping block 621 through a push rod 618. The guide plate 612 clamps the polishing block 603.

[0055] It should be noted that, during the downward movement of the pressing plate 610, Figure 9The press plate 611 pushes the connecting shaft 619 downward along the longitudinal groove 620 via the pressing rod 617, so that the connecting shaft 619 pushes the clamping block 621 via the push rod 618 to clamp the grinding block 603 and fix the position of the grinding block 603. The spring 615 can also be installed between the press plate 610 and the press plate 611 to prevent the clamping block 621 from excessively clamping the grinding block 603 during the secondary adjustment of the grinding block 603.

[0056] See also Figure 1-Figure 3 The moving component 3 includes a motor 301 and a guide rail 302. The guide rail 302 is installed on the top of the protective cover 2. The screw rod 304 is rotatably installed in the guide rail 302. The motor 301 drives the screw rod 304 to rotate. The transmission platform 303 is slidably installed in the guide rail 302. The transmission platform 303 is connected to the screw rod 304 for transmission. The box cover 601 is fixedly installed on the transmission platform 303; the liquid spraying component 5 includes a liquid storage tank 501, and a nozzle 502 is installed on the liquid storage tank 501. The nozzle 502 faces the wafer disk 11; a drain port 7 is provided on the protective cover 2.

[0057] It should be noted that during the polishing process of the wafer 11, the nozzle 502 sprays coolant toward the wafer 11, and the used coolant is discharged from the protective cover 2 through the drain port 7. The protective cover 2 is provided with an observation window 4 for observing the polishing status of the polishing adjustment assembly 6.

[0058] Working Principle of the Present Invention: When in use, the present invention places the wafer 11 solely on the polishing table 10. The motor 301 drives the screw 304 to rotate, which in turn drives the transmission platform 303 and the box cover 601 toward the center of the wafer 11. When the polishing box 602 reaches the top of the wafer 11, the motor 301 stops.

[0059] The present invention makes the first adjustment to the grinding block 603. The adjustment motor 604 is started, and the adjustment motor 604 drives the transmission shaft 605 and the reciprocating screw 606 to rotate synchronously. When the reciprocating screw 606 rotates, under the action of the transmission connection between the reciprocating screw 606 and the lifting sleeve 607, the reciprocating screw 606 drives the lifting sleeve 607 and the insert block 608 to move downward. As the insert block 608 moves downward, Figure 6 , the insert block 608 is inserted into the slide table 6092 through the socket 6091, so that the insert block 608 pushes the pressure plate 610 inside the pressure groove 6093 to move downward, see Figure 7 The pressing plate 610 moves downward, driving the pressing platform 611 to move downward synchronously, so that the pressing platform 611 pushes the guide plate 612 and the grinding block 603 to move downward, so that the grinding block 603 presses and fits the wafer 11. In the process of the pressing plate 610 moving downward, see Figure 9The pressing platform 611 pushes the connecting shaft 619 downward along the longitudinal groove 620 through the pressing rod 617, so that the connecting shaft 619 pushes the clamping block 621 through the push rod 618 to clamp the grinding block 603, fixing the position of the grinding block 603, and then fixing the pressing plate 610 by starting the electromagnetic suction cup 6095 to adsorb the metal plate 6094.

[0060] When the transmission shaft 605 rotates, it drives the bevel gear 801 to rotate synchronously. Through the transmission connection between the bevel gear 801 and the bevel gear 802, the bevel gear 801 drives the bevel gear 802 and the partial gear 803 to rotate synchronously. Through the transmission connection between the partial gear 803 and the transmission gear 804, the partial gear 803 intermittently drives the grinding box 602 to rotate. The rotation of the grinding box 602 switches to the next set of grinding blocks 603. The insert block 608 moves downward again, pressing the pressure plate 610, allowing the second set of grinding blocks 603 to adhere to the wafer disk 11. This operation is repeated until all sets of grinding blocks 603 can conform to the uneven surface of the wafer disk 11. After the first adjustment is completed, the present invention adjusts the grinding blocks 603 one by one through the grinding adjustment component 6, so that each group of grinding blocks 603 can fit the uneven surface of the wafer disk 11, thereby improving the grinding efficiency of the grinding blocks 603, ensuring the uniform thickness of the wafer disk 11, and avoiding uneven stress distribution of the wafer disk 11.

[0061] The wafer 11 is fixed by the polishing table 10, and the polishing motor 901 is started. The polishing motor 901 drives the polishing box 602 and the polishing block 603 at the bottom of the polishing box 602 to rotate through the polishing gear 902, and the polishing block 603 is used to polish the uneven surface of the wafer 11.

[0062] Specifically, during the polishing process, because the surface of the wafer disk 11 is uneven, the wear of each group of polishing blocks 603 varies as the polishing blocks 603 polish the wafer disk 11, with some groups experiencing severe wear. When polishing blocks 603 with different wear levels polish the wafer disk 11, the material removal rate of the severely worn polishing blocks 603 decreases. Consequently, the severely worn polishing blocks 603 polish less of the wafer disk 11, while the normally worn polishing blocks 603 polish more of the wafer disk 11. As the two groups alternately polish the wafer disk 11, shallow and deep wear marks appear on the surface of the wafer disk 11, causing large fluctuations in the surface roughness (Ra value) of the wafer disk 11 and making scratches, pits, or corrosion marks more likely to appear in localized areas of the wafer disk 11.

[0063] Therefore, the present invention performs a secondary adjustment on the grinding block 603. First, the grinding drive assembly 9 is turned off. After the grinding box 602 stops rotating, the regulating motor 604 is started again to adjust the grinding block 603 for the second time. The insert block 608 pushes the pressing plate 610, the pressing platform 611, the guide plate 612 and the grinding block 603 downward. Figure 10, with the cooperation of the slider 623 and the bevel 622, the severely worn grinding block 603 moves closer to the center of the wafer disk 11. As the grinding drive assembly 9 runs again, the grinding block 603 grinds the wafer disk 11. Since the linear speed of the center of the wafer disk 11 is low, the wear of the grinding block 603 near the center of the wafer disk 11 is reduced. The present invention adjusts the grinding block 603 a second time to move the severely worn grinding block 603 closer to the center of the wafer disk 11, thereby reducing the wear of the severely worn grinding block 603, balancing the wear of each group of grinding blocks 603, ensuring that the wear of each group of grinding blocks 603 is equal, avoiding the appearance of shallow and deep wear marks on the surface of the wafer disk 11, reducing the fluctuation of the surface roughness (Ra value) of the wafer disk 11, and improving the grinding stability.

[0064] The basic principles, main features, and advantages of the present invention are shown and described above. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions are merely illustrative of the principles of the present invention. Various changes and modifications may be made to the present invention without departing from the spirit and scope of the present invention, and such changes and modifications fall within the scope of the invention as claimed.

Claims

1. A polishing device for semiconductor production and processing, characterized in that: It comprises a workbench (1) and a protective cover (2) mounted on the workbench (1), a moving component (3) and a liquid spraying component (5) mounted on the protective cover (2), the moving component (3) drives the grinding adjustment component (6) to move, a grinding table (10) is mounted on the workbench (1), and a wafer disk (11) is fixedly placed on the grinding table (10); The grinding adjustment assembly (6) comprises a box cover (601) and a grinding box (602), an adjustment drive assembly (8) and a grinding drive assembly (9) are mounted on the box cover (601), the grinding box (602) is rotatably mounted on the box cover (601), an adjustment motor (604) is mounted on the box cover (601), the output end of the adjustment motor (604) is coaxially connected to a transmission shaft (605) and a reciprocating screw (606), and the transmission shaft (605) drives the grinding through the adjustment drive assembly (8). The box (602) rotates intermittently; the reciprocating screw (606) is connected to the lifting sleeve (607) in a transmission manner, and the lifting sleeve (607) is mounted with an insert (608); a locking member (609) is mounted in the polishing box (602), and a pressure plate (610) is slidably mounted in the locking member (609); the insert (608) presses the pressure plate (610), and the pressure plate (610) presses the guide plate (612) and the polishing block (603) through the pressing platform (611), and the polishing block (603) is attached to the wafer disk (11); The guide plate (612) is connected to the pressing platform (611) via a spring (615), a grinding block (603) is installed at the bottom of the guide plate (612), an inclined groove (622) is provided on the grinding box (602), a slider (623) is installed on the guide plate (612), and the slider (623) is slidably matched with the inclined groove (622); The locking member (609) includes a slide table (6092), the slide table (6092) is installed in the polishing box (602), a pressing groove (6093) is provided inside the slide table (6092), a socket (6091) is provided at the top of the pressing groove (6093), a pressing plate (610) is slidably installed in the pressing groove (6093), and the insert (608) is inserted into the pressing groove (6093) through the socket (6091) to push the pressing plate (610) to move; a metal plate (6094) is installed inside the slide table (6092), and an electromagnetic suction cup (6095) is installed on the pressing plate (610), and the electromagnetic suction cup (6095) adsorbs the metal plate (6094); A slider (613) is installed on the pressing plate (610), and a slide frame (614) is installed on the pressing platform (611). The slider (613) and the slide frame (614) are in sliding cooperation.

2. A semiconductor production and processing polishing device according to claim 1, characterized in that: A guide platform (616) is installed on the polishing box (602), a longitudinal groove (620) is provided in the guide platform (616), and the longitudinal groove (620) is slidably connected to the connecting shaft (619). The pressing platform (611) is connected to the connecting shaft (619) via a pressing rod (617), and the connecting shaft (619) is connected to the clamping block (621) via a push rod (618). The guide plate (612) clamps the polishing block (603).

3. The semiconductor production and processing polishing device according to claim 1, characterized in that: The adjustment drive assembly (8) includes a bevel gear disc (801), an adjustment motor (604) is connected to the bevel gear disc (801) via a transmission shaft (605), a fixing rod (624) is installed inside the box cover (601), a partial gear (803) is installed on the fixing rod (624), the partial gear (803) is coaxially connected to the bevel gear (802), a transmission gear (804) is fixedly installed on the polishing box (602), the transmission gear (804) is meshed with the partial gear (803), and the bevel gear (802) is meshed with the bevel gear disc (801).

4. The semiconductor production and processing polishing device according to claim 1, characterized in that: The grinding drive assembly (9) comprises a grinding motor (901), the grinding motor (901) is fixedly mounted on the box cover (601), the output end of the grinding motor (901) is connected to a grinding gear (902), an inner gear ring (903) is mounted on the grinding box (602), and the grinding gear (902) is meshed with the inner gear ring (903).

5. The semiconductor production and processing polishing device according to claim 1, characterized in that: The moving assembly (3) includes a motor (301) and a guide rail (302), the guide rail (302) is installed on the top of the protective cover (2), the screw rod (304) is rotatably installed in the guide rail (302), the motor (301) drives the screw rod (304) to rotate, the transmission platform (303) is slidably installed in the guide rail (302), the transmission platform (303) is connected to the screw rod (304) in a transmission manner, and a box cover (601) is fixedly installed on the transmission platform (303); the liquid spraying assembly (5) includes a liquid storage tank (501), a nozzle (502) is installed on the liquid storage tank (501), and the nozzle (502) faces the wafer disk (11); and a liquid discharge port (7) is provided on the protective cover (2).

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