Integrated device for copper plating of air conditioner pipe

Abstract

The invention discloses an integrated device for copper plating of an air conditioner pipe. A conductive assembly is mounted on a lifting frame of the integrated device; the conductive assembly comprises a mounting rod, a conductive electrode and a conductive ring; the conductive ring is electrically connected to the conductive electrode; the lifting frame is provided with clamping air cylinders on the two sides of the mounting rod. The integrated device for copper plating of the air conditioner pipe further comprises a gluing assembly. The gluing assembly comprises lifting rods arranged oppositely and an adjusting air cylinder installed at the lifting end of the lifting frame. A glue box is mounted at the telescopic end below the adjusting cylinder; a gluing brush is telescopically mounted on one side, facing the air conditioner pipe, of the glue box; the integrated device for copper plating of the air conditioner pipe controls the lifting frame and the gluing assembly to conduct multiple times of gluing and multiple times of copper plating on the periphery of the air conditioner pipe, and the gluing operation and the copper plating operation are sequentially and alternately conducted. The integrated device for copper plating of the air conditioner pipe not only can effectively improve the copper plating precision and enhance the stability of a copper plating structure, but also can ensure the copper plating efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of surface treatment of air-conditioning pipes, and in particular to an integrated device and process for multi-layer copper plating of air-conditioning pipes. Background Art

[0002] In air-conditioning systems, the surface treatment of air-conditioning pipes is crucial to improving their corrosion resistance and thermal conductivity. Traditional copper plating processes usually use single-layer copper plating. Although it can provide certain protection and performance improvements, the durability and performance of single-layer copper plating are still insufficient in certain harsh environments. In addition, the traditional copper plating process has certain limitations in controlling the copper plating position of the copper layer, making it difficult to meet high-precision requirements. The copper plating process and structure of air-conditioning pipes are simple, resulting in a light copper plating structure and easy separation of structural layers, which affects the structural function. In other words, although the traditional copper plating process for air-conditioning pipes is simple to operate and low in cost, it has certain limitations in terms of plating uniformity, corrosion resistance, and production efficiency. Summary of the Invention

[0003] The present invention provides an integrated device for copper plating of air conditioning pipes to solve the above-mentioned technical problems, specifically adopting the following technical solutions:

[0004] An integrated device for copper plating of air-conditioning pipes, comprising: a plurality of arranged copper plating pools filled with reaction liquid, and a lifting frame for lifting the air-conditioning pipes so as to insert the air-conditioning pipes into the corresponding copper plating pools in sequence; the copper plating pools are provided with a first temperature control structure to control the reaction temperature of the reaction liquid in the copper plating pools, and are provided with a concentration detector to detect the concentration of the reaction liquid in real time; a conductive component for inserting into the interior of the air-conditioning pipe to electrically connect the conductive air-conditioning pipe to the negative electrode of a power supply is installed on the lifting frame; the conductive component comprises: a mounting rod, a conductive electrode mounted in a cavity formed in the mounting rod, and a conductive ring mounted on the outer circumference of the mounting rod to dock with a designated position of the air-conditioning pipe for conducting electricity; the conductive ring is electrically connected to the conductive electrode; the lifting frame is provided with a clamping cylinder for clamping the end of the air-conditioning pipe on both sides of the mounting rod; the end of the clamping cylinder is provided with a clamping block for adapting to the outer circumferential shape of the air-conditioning pipe to clamp the air-conditioning pipe; The integrated device for copper plating of adjusting pipes also includes: a glue coating assembly for coating the outer periphery of the air-conditioning pipe with glue; the glue coating assembly includes: relatively arranged lifting rods, and an adjusting cylinder installed on the lifting end of the lifting frame; a glue box for storing glue liquid is installed at the telescopic end below the adjusting cylinder; a glue coating brush is telescopically installed on the side of the glue box facing the air-conditioning pipe; one side of the glue outlet cavity of the glue coating brush is connected to the glue box through a connecting pipe, and the other side is connected to the brush layer through a connecting hole; a control pump for controlling the glue output amount of the glue coating brush is provided in the glue outlet cavity; the integrated device for copper plating of air-conditioning pipes is provided with a glue tank for replenishing glue liquid to the glue tank; the glue tank is connected to the glue hose through a connecting pipe; a second temperature control structure is provided in the glue outlet cavity to control the temperature of the glue liquid in the glue outlet cavity; the integrated device for copper plating of air-conditioning pipes controls the lifting frame and the glue coating assembly to perform multiple glue coating and multiple copper plating on the outer periphery of the air-conditioning pipe, and the glue coating and copper plating operations are performed alternately in sequence.

[0005] Furthermore, an adjustment component for adjusting the position of the conductive electrode and the conductive ring is provided in the mounting rod; the adjustment component includes: a first motor, an adjustment gear installed at the output end of the first motor and a toothed belt installed in the cavity through a rotating support frame; the toothed belt and the adjustment gear are engaged; a conductive electrode is fixed to the outside of the toothed belt; the conductive electrode slides up and down in a slide groove formed on the rotating support frame under the drive of the toothed belt; the rotating support frame is a conductor electrically connecting the conductive electrode and the negative pole of the power supply; the adjustment component also includes: several second motors, a reel installed at the output end of the second motor; the reel is wound with a lifting wire having one end fixedly connected to the conductive ring for lifting the conductive ring.

[0006] Furthermore, the conductive electrode and the conductive ring are both provided with distance sensors for detecting their respective lifting heights; the distance sensors control the first motor and the second motor to rotate respectively according to their respective detection data, thereby keeping the conductive electrode and the conductive ring at the same height.

[0007] Furthermore, the conductive ring includes: a shell and a telescopic ring telescopically installed in the shell; a guiding slope for guiding the installation rod to be inserted into the air conditioning pipe is formed on the lower side of the telescopic ring.

[0008] Furthermore, the rod body of the mounting rod, which is used to extend into the interior of the air-conditioning pipe, is made of a conductive resistance material; the rod body is provided with a heating circuit module for controlling the rod body to generate heat.

[0009] Furthermore, a temperature sensor is installed on the outer periphery of the mounting rod; the conductive electrode and the conductive ring are in electrical contact with the rod body; a connecting circuit module is provided between the conductive electrode and the negative pole of the power supply; a unidirectional conduction switch for directing the current of the connecting circuit module to the heating circuit module is provided between the heating circuit module and the connecting circuit module; the integrated device for copper plating of air-conditioning pipes controls the closing and opening of the unidirectional conduction switch according to the detected temperature of the temperature sensor, and controls the current size in the heating circuit module of the rod body.

[0010] Furthermore, the integrated device for copper plating of air conditioning pipes controls the method for copper plating of air conditioning pipes as follows:

[0011] First copper plating: Place the air conditioning pipe in the first copper plating tank and perform the first copper plating at a temperature of T1 for a time of t1 to form the first copper plating layer;

[0012] First glue coating: Place the air conditioning pipe that has undergone the first copper plating into the first glue coating tank and apply the first layer of glue at a temperature of T2 for a time of t2;

[0013] Second copper plating: Place the air conditioning pipe that has been coated with glue for the first time into the second copper plating tank and perform the second copper plating at a temperature of T3 for a time of t3 to form a second copper plating layer;

[0014] Second glue coating: Place the air-conditioning pipe that has undergone the second copper plating into the second glue coating tank, and apply the second layer of glue at a temperature of T4 for a time of t4.

[0015] Furthermore, the copper plating time of the integrated device for copper plating of air conditioning pipes can be calculated by the following formula:

[0016]

[0017] Where: t is the copper plating time, m is the mass of copper to be plated, F is the Faraday constant, I is the current during electroplating, and η is the current efficiency;

[0018] The integrated device for copper plating of air-conditioning pipes adjusts the corresponding copper plating time according to the above calculated value.

[0019] Furthermore, a thickness detector for detecting the thickness of the copper plating is provided at the lower end of the clamping block; the integrated device for copper plating of air-conditioning pipes adjusts the response time in real time according to the monitoring data of the thickness detector.

[0020] Furthermore, a stirring device is installed at the bottom of the copper plating pool; a filter layer structure for filtering the stirred reaction liquid is provided on both sides of the stirring device to adsorb and filter impurities and insoluble particles in the reaction liquid.

[0021] The benefit of the present invention is that the provided integrated device for copper plating of air-conditioning pipes can not only effectively improve the copper plating accuracy and enhance the stability of the copper plating structure, but also ensure the copper plating efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0023] Figure 1 Schematic diagram of an integrated device for copper plating of air-conditioning pipes according to the present invention;

[0024] Figure 2 yes Figure 1 A schematic diagram of a partial structure of an integrated device for copper plating of air conditioning pipes;

[0025] Figure 3 yes Figure 1 A partially enlarged schematic diagram of an integrated device for copper plating of air-conditioning pipes;

[0026] Figure 4 yes Figure 1 Another partially enlarged schematic diagram of the integrated device for copper plating of air-conditioning pipes;

[0027] An integrated device 10 for copper plating of air conditioning pipes, a copper plating pool 11, an air conditioning pipe 12, a lifting frame 13, a first temperature control structure 14, a concentration detector 15, a conductive component 16, a mounting rod 161, a cavity 162, a conductive electrode 163, a conductive ring 164, a housing 165, a telescopic ring 166, a guide slope 1661, a clamping cylinder 17, a clamping block 171, a glue coating component 18, a lifting rod 181, an adjustment cylinder 182, a glue box 183, a glue coating brush 184, and a glue outlet cavity 184. 1, brush layer 1842, control pump 185, second temperature control structure 186, glue tank 19, adjustment component 20, first motor 201, adjustment gear 202, rotating support frame 203, slide 2031, toothed belt 204, second motor 205, reel 206, lifting wire 207, distance sensor 208, temperature sensor 209, heating circuit module (not shown), connecting circuit module (not shown), thickness detector 21, stirring device 22, filter layer structure 23. DETAILED DESCRIPTION

[0028] The following describes in detail embodiments of the present application. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0029] like Figures 1 to 4 As shown, an integrated device 10 for copper plating air conditioning pipes of the present application comprises: a plurality of copper plating tanks 11 arranged in an array and filled with a reaction solution, and a lifting frame 13 mounted above the plurality of copper plating tanks 11. The lifting frame 13 is used to clamp an air conditioning pipe 12 and then lift and lower the air conditioning pipe 12 to insert the air conditioning pipe 12 into the copper plating tank 11 for copper plating. The copper plating tank 11 is provided with a first temperature control structure 14 to control the reaction temperature of the reaction solution within the copper plating tank 11, and is provided with a concentration detector 15 to detect the concentration of the reaction solution in real time. The concentration of the reaction solution is adjusted according to the concentration detector 15 to ensure copper plating efficiency.

[0030] Furthermore, a conductive component 16 is mounted on the lifting frame 13. The conductive component 16 can be inserted into the interior of the air conditioning pipe 12 to electrically connect the conductive air conditioning pipe 12 to the negative electrode of the power supply, thereby energizing the air conditioning pipe 12 and causing the reaction liquid on the surface of the air conditioning pipe 12 to be electrolytically copper-plated. The conductive component 16 includes: a mounting rod 161, the mounting rod 161 forming a cavity 162, and a conductive electrode 163 mounted in the cavity 162. A conductive ring 164 is mounted on the outer periphery of the mounting rod 161, and the conductive ring 164 is electrically connected to the conductive electrode 163. In this way, when the conductive ring 164 is docked with a specified position of the air conditioning pipe 12, a specified range of the air conditioning pipe 12 can be conductive. By controlling the conductive range of the air conditioning pipe 12, it is possible to control the copper plating of a portion of the specified range of the air conditioning pipe 12. That is, when the conductive electrode 163 and the conductive ring 164 are adjusted to a specified height of the air conditioning pipe 12, the portion below the height can be conductive to decompose the reaction liquid, thereby copper plating the portion below the height. In this way, there is no need to move the air conditioning pipe 12 up and down, and there is no need to consider the influence of the fluctuation of the reaction liquid level. The copper plating position is more accurate and the adjustment of the copper plating position is more convenient and accurate, thereby improving the copper plating quality and efficiency.

[0031] Furthermore, the lifting frame 13 is provided with clamping cylinders 17 on both sides of the mounting rod 161. The clamping cylinders 17 can clamp the ends of the air conditioning pipe 12, thereby moving the air conditioning pipe 12 and inserting the air conditioning pipe 12 into the copper plating tank 11. The ends of the clamping cylinders 17 are provided with clamping blocks 171 for adapting to the outer peripheral shape of the air conditioning pipe 12 to clamp the air conditioning pipe 12.

[0032] The integrated device 10 for copper plating of air conditioning pipes also includes a glue coating assembly 18, through which the outer periphery of the air conditioning pipe 12 can be coated with glue, thereby improving the adhesion and ductility of the copper plating layer and making the copper plating layer structure more stable. The glue coating assembly 18 includes: lifting rods 181 arranged in opposite directions, and an adjusting cylinder 182 is installed at the lifting end of the lifting frame 13. A glue box 183 for storing glue liquid is installed at the telescopic end below the adjusting cylinder 182. A glue brush 184 is telescopically installed on the side of the glue box 183 facing the air conditioning pipe 12. One side of the glue discharge cavity 1841 of the glue brush 184 is connected to the glue box 183 through a connecting pipe, and the other side is connected to the brush layer 1842 through a connecting hole, thereby ensuring smooth glue supply. A control pump 185 is provided in the glue discharge cavity 1841 to control the amount of glue discharged by the glue brush 184. The integrated device 10 for copper plating air conditioning pipes is equipped with a glue pool 19, which is connected to a rubber hose via a connecting pipe for replenishing glue liquid into a glue tank 183. A second temperature control structure 186 is provided within a glue outlet cavity 1841. The detection data from the second temperature control structure 186 can be used to control the temperature of the glue liquid within the glue outlet cavity 1841, thereby ensuring the coating viscosity of the glue layer and thus the structural strength of the copper plating layer. The integrated device 10 for copper plating air conditioning pipes controls the lifting frame 13 and the glue coating assembly 18 to apply glue and copper plating to the outer circumference of the air conditioning pipe 12 multiple times. The glue coating and copper plating operations are performed alternately, thus achieving efficient and high-quality copper plating of the air conditioning pipe 12.

[0033] The integrated device 10 for copper plating of air-conditioning pipes is provided with a controller, which analyzes the detection data of each electrical component and then sends control instructions to control the overall operation of the integrated device 10 for copper plating of air-conditioning pipes.

[0034] As a specific embodiment, an adjustment component 20 is also provided in the mounting rod 161, and the adjustment component 20 is used to adjust the position of the conductive electrode 163 and the conductive ring 164, so that the specific copper plating area of the air-conditioning pipe 12 can be adjusted according to the specific liquid level of the reaction liquid and the actual copper plating parameters, making the copper plating operation more accurate and efficient. The adjustment component 20 includes: a first motor 201, an adjustment gear 202 is installed at the output end of the first motor 201, a rotating support frame 203 is installed in the cavity 162, and a toothed belt 204 is rotatably supported on the outer periphery of the rotating support frame 203. The toothed belt 204 is engaged with the adjustment gear 202 to drive the toothed belt 204 to rotate under the drive of the first motor 201. The conductive electrode 163 is fixed to the outside of the toothed belt 204, and the rotating support frame 203 is formed with a slide groove 2031. Driven by the toothed belt 204, the conductive electrode 163 can drive the conductive electrode 163 to slide up and down in the slide groove 2031. The rotating support frame 203 is a conductor that electrically connects the conductive electrode 163 and the negative electrode of the power supply. In addition, the adjustment assembly 20 also includes: a plurality of second motors 205, and a reel 206 is installed at the output end of the second motor 205. The reel 206 reels a lifting wire 207, and one end of the lifting wire 207 is fixedly connected to the conductive ring 164, so that the conductive ring 164 is raised and lowered under the drive of the second motor 205 to adjust the position of the conductive ring 164. The adjustment assembly 20 can accurately move the conductive electrode 163 and the conductive ring 164 to the same position, thereby ensuring the conductive stability of the designated copper-plated position of the air conditioning pipe 12. The conductive electrode 163 and the conductive ring 164 are both equipped with a distance sensor 208. The distance sensor 208 can detect the respective lifting heights and then control the rotation of the first motor 201 and the second motor 205 based on the respective detection data, so that the conductive electrode 163 and the conductive ring 164 maintain the same height, with high control accuracy and high operational stability.

[0035] In a specific embodiment, the conductive ring 164 includes a housing 165 and a telescopic ring 166, which is telescopically mounted within the housing 165. A guide slope 1661 is formed on the underside of the telescopic ring 166 to guide the installation rod 161 into the air conditioning pipe 12. This facilitates insertion of the air conditioning pipe 12 and ensures stable electrical contact between the conductive ring 164 and the air conditioning pipe 12. The telescopic ring 166 can be formed by enclosing and splicing multiple telescopic blocks, which are electrically connected to each other and can conduct electricity to each other.

[0036] In a specific embodiment, the rod body of mounting rod 161, which extends into air conditioning pipe 12, is made of a conductive resistive material. A heating circuit module is installed within the rod body, which controls the rod body to generate heat, thereby heating the reaction liquid surrounding air conditioning pipe 12. A temperature sensor 209 is mounted on the outer periphery of mounting rod 161. The current flowing through the heating circuit module is adjusted based on the temperature sensor 209, thereby achieving more precise temperature control.

[0037] Furthermore, the conductive electrode 163 and the conductive ring 164 are both in electrical contact with the rod body. A connecting circuit module is provided between the conductive electrode 163 and the negative pole of the power supply. A unidirectional conduction switch is provided between the heating circuit module and the connecting circuit module. The unidirectional conduction switch can be used to direct the current of the connecting circuit module to the heating circuit module, so that the electrolytic current can be used for resistance heating, thereby achieving temperature control, which can effectively save energy. The integrated device 10 for copper plating of air conditioning pipes controls the closing and opening of the unidirectional conduction switch according to the detected temperature of the temperature sensor 209, and controls the current in the heating circuit module of the rod body. In this way, when the heat generation of the electrolytic current is insufficient, the current is increased by controlling the current in the heating circuit module, thereby increasing the heat generation. In this way, through the cooperation of the two circuit modules, energy saving can be achieved while achieving precise temperature control. The temperature regulation method of diffusing heat outward from the surface of the air conditioning pipe 12 is more energy-efficient and convenient to use. Furthermore, by controlling the temperature within the conditioning tube 12, not only the reaction solution can be temperature-controlled, but also the temperature of the conditioning tube 12 can be controlled, thereby enhancing the adhesion of the copper plating and adhesive coating on the conditioning tube 12. Furthermore, after electroplating, the temperature control of the heating structure within the conditioning tube 12 can buffer the cooling of the conditioning tube 12 and achieve appropriate annealing temperature control, thereby improving the internal stress and crystal structure of the coating, and improving the uniformity and adhesion of the coating.

[0038] As a specific embodiment, a stirring device 22 is installed at the bottom of the copper plating pool 11, and a filter layer structure 23 is provided on both sides of the stirring device 22 for filtering the stirred reaction liquid, thereby adsorbing and filtering impurities and insoluble particles in the reaction liquid, and promoting the flow of the electrolyte, ensuring that the electrolyte components are evenly distributed, and reducing the concentration gradient.

[0039] Based on the above structure, the method of controlling the copper plating of the air conditioning pipe 12 by the integrated device 10 for copper plating of the air conditioning pipe is as follows:

[0040] First copper plating: The air conditioning pipe 12 is placed in the first copper plating pool 11 and copper plating is performed for the first time at a temperature of T1 for a time of t1 to form a first copper plating layer.

[0041] First glue coating: The air-conditioning pipe 12 that has undergone the first copper plating is lifted up. During the lifting process, the first glue layer is coated at a temperature of T2 through the corresponding glue coating component 18 for a time of t2.

[0042] Second copper plating: The air conditioning pipe 12 coated with glue for the first time is placed in the second copper plating pool 11 and copper plating is performed for the second time at a temperature of T3 for a time of t3 to form a second copper plating layer.

[0043] Second glue coating: The air-conditioning pipe 12 that has undergone the second copper plating is lifted up. During the lifting process, the corresponding glue coating component 18 is used to coat the second glue layer at a temperature of T4 for a time of t4.

[0044] Through the above-mentioned operation method, the copper plating of the air-conditioning pipe 12 is more efficient. When the reaction liquid can be replenished, only one copper plating pool 11 can be set up. The air-conditioning pipe 12 is repeatedly inserted into the copper plating pool 11 for multiple copper plating. The structure is simple, the device size is small, and the operation is more efficient and convenient.

[0045] As a specific embodiment, the copper plating time of the integrated device 10 for copper plating of air conditioning pipes can be calculated by the following formula:

[0046]

[0047] Where: t is the copper plating time (unit: seconds), m is the mass of copper to be plated (unit: grams), F is the Faraday constant (F ≈ 96485 coulombs / mole), I is the current during electroplating (unit: ampere), and η is the current efficiency (usually expressed as a percentage, which needs to be determined based on the actual electroplating solution and conditions).

[0048] Specifically, the calculation steps are as follows:

[0049] (1) Determine the mass m of copper to be plated

[0050] Assume that a layer of copper with a thickness of d needs to be plated on the outer periphery of the air conditioning pipe 12. The outer periphery of the air conditioning pipe 12 is L and the length is H. Then the volume V of the copper to be plated is: V = L·H·d

[0051] The density of copper, ρ, is about 8.96 g / cm3, so the mass m of copper to be plated is: m = V·ρ = L·H·d·ρ

[0052] (2) Determine current density and current

[0053] Current density J is the current intensity per unit area and is usually determined by process requirements. Assuming the current density is J (unit: ampere / square centimeter), the outer circumference of the air conditioning pipe 12 is L, and the length is H, the total current I is: I = J·L·H

[0054] (3) Determine the current efficiency η

[0055] The current efficiency η is the ratio of the actual amount of copper deposited to the theoretical amount deposited, and is generally determined by the properties of the plating solution and the operating conditions. Assume the current efficiency is η (expressed as a decimal, e.g., 90% efficiency is expressed as 0.9).

[0056] (4) Calculate copper plating time t

[0057] Substituting the above parameters into the formula:

[0058]

[0059] Assume that a layer of copper with a thickness of 0.01 cm needs to be plated on the outer periphery of the air conditioning pipe 12, the outer periphery of the air conditioning pipe 12 is 10 cm, the length is 100 cm, the current density is 0.5 A / cm2, and the current efficiency is 90%.

[0060] Calculate the mass of copper that needs to be plated m V = L·H·d = 10·100·0.01 = 10 cubic centimeters m = V·ρ = 10·8.96 = 89.6 grams;

[0061] Calculate the total current I = J·L·H = 0.5·10·100 = 500 amperes;

[0062] Calculate the copper plating time t = m·F / I·η≈1838 seconds.

[0063] In a specific embodiment, a thickness detector 21, such as an optical sensor, is provided at the lower end of the clamping block 171 to detect the thickness of the copper plating. The integrated apparatus 10 for copper plating air conditioning pipes adjusts its response time in real time based on the data monitored by the thickness detector 21, thereby achieving precise copper plating thickness.

[0064] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the above embodiments do not limit the present invention in any form, and any technical solutions obtained by equivalent replacement or equivalent transformation fall within the scope of protection of the present invention.

Claims

1. An integrated device for copper plating of air conditioning pipes, comprising: A plurality of copper plating pools filled with reaction liquid are arranged in an array, and a lifting frame for lifting copper tubes so as to insert the copper tubes into the corresponding copper plating pools in sequence; characterized in that: The copper plating pool is provided with a first temperature control structure to control the reaction temperature of the reaction liquid in the copper plating pool, and is provided with a concentration detector to detect the concentration of the reaction liquid in real time; The lifting frame is provided with a conductive component for inserting into the air-conditioning pipe to electrically connect the conductive air-conditioning pipe to the negative electrode of the power supply; The conductive assembly includes: a mounting rod, a conductive electrode mounted in a cavity formed on the mounting rod, and a conductive ring mounted on the outer circumference of the mounting rod to connect with a designated position of the air conditioning pipe for conducting electricity; The conductive ring is electrically connected to the conductive electrode; The lifting frame is provided with clamping cylinders on both sides of the mounting rod for clamping the ends of the air conditioning pipe; The end of the clamping cylinder is provided with a clamping block for adapting to the outer peripheral shape of the air-conditioning pipe to clamp the air-conditioning pipe; The integrated device for copper plating of air conditioning pipes further comprises: a glue coating component for coating the outer periphery of the air conditioning pipe with glue; The glue coating assembly includes: lifting rods arranged opposite to each other, and an adjusting cylinder installed at the lifting end of the lifting frame; A glue box for storing glue liquid is installed at the telescopic end below the regulating cylinder; A glue brush is telescopically installed on one side of the glue box facing the air conditioning pipe; One side of the glue outlet cavity of the glue brush is connected to the glue box through a connecting pipe, and the other side is connected to the brush layer through a connecting hole; A control pump for controlling the glue output of the glue brush is provided in the glue output cavity of the glue coating brush; The integrated device for copper plating of air-conditioning pipes is provided with a glue tank for replenishing glue liquid to the glue box; The glue tank is connected to the glue hose through a connecting pipe; A second temperature control structure is provided in the glue discharging cavity to control the temperature of the glue liquid in the glue discharging cavity; The integrated device for copper plating of air-conditioning pipes controls the lifting frame and the glue coating assembly to perform multiple glue coating and multiple copper plating on the outer circumference of the air-conditioning pipes.

2. The integrated device for copper plating of air conditioning pipes according to claim 1, characterized in that: The mounting rod is further provided with an adjustment component for adjusting the positions of the conductive electrode and the conductive ring; The adjustment assembly includes: a first motor, an adjustment gear mounted on the output end of the first motor, and a toothed belt rotatably mounted in the cavity via a rotating support frame; The toothed belt is meshed with the adjusting gear; The conductive electrode is fixed to the outer side of the toothed belt; The conductive electrode slides up and down in the slide groove formed on the rotating support frame under the drive of the toothed belt; The rotating support frame is a conductor electrically connecting the conductive electrode and the negative electrode of the power supply; The adjustment assembly further includes: a plurality of second motors, and a reel mounted on the output end of the second motor; The reel reels in a lifting wire having one end fixedly connected to the conductive ring for lifting the conductive ring.

3. The integrated device for copper plating of air conditioning pipes according to claim 2, characterized in that: The conductive electrode and the conductive ring are both provided with distance sensors for detecting their respective lifting heights; The distance sensors control the first motor and the second motor to rotate respectively according to respective detection data, so that the conductive electrode and the conductive ring are kept at the same height.

4. The integrated device for copper plating of air conditioning pipes according to claim 1, characterized in that: The conductive ring comprises: a shell and a telescopic ring telescopically installed in the shell; A guiding slope for guiding the installation rod to be inserted into the air conditioning pipe is formed on the lower side of the telescopic ring.

5. The integrated device for copper plating of air conditioning pipes according to claim 1, characterized in that: The rod body of the mounting rod, which is used to extend into the interior of the air conditioning pipe, is made of a conductive resistance material; The rod body is provided with a heating circuit module for controlling the rod body to generate heat.

6. The integrated device for copper plating of air conditioning pipes according to claim 5, characterized in that: A temperature sensor is installed on the outer periphery of the mounting rod; The conductive electrode and the conductive ring are both in electrical contact with the rod; A connecting circuit module is provided between the conductive electrode and the negative electrode of the power supply; A unidirectional conduction switch is provided between the heating circuit module and the connecting circuit module for directing the current of the connecting circuit module to the heating circuit module; The integrated device for copper plating of air-conditioning pipes controls the closing and opening of the one-way conduction switch according to the detected temperature of the temperature sensor, and controls the current size in the heating circuit module of the rod body.

7. The integrated device for copper plating of air conditioning pipes according to claim 1, characterized in that: The method for controlling the copper plating of air-conditioning pipes by the integrated device for copper plating of air-conditioning pipes is as follows: First copper plating: placing the air-conditioning pipe into the first copper plating pool, performing the first copper plating at a temperature of T1 for a time of t1, to form a first copper plating layer. First glue coating: The air-conditioning pipe that has undergone the first copper plating is lifted up. During the lifting process, the first layer of glue is coated at a temperature of T2 through the corresponding glue coating component for a time of t2. Second copper plating: the air conditioning pipe coated with glue for the first time is placed in the second copper plating pool, and copper plating is performed for the second time at a temperature of T3 for a time of t3 to form a second copper plating layer. Second glue coating: The air-conditioning pipe that has undergone the second copper plating is lifted up. During the lifting process, the second glue layer is coated at a temperature of T4 through the corresponding glue coating component for a time of t4.

8. The integrated device for copper plating of air conditioning pipes according to claim 7, characterized in that: The copper plating time of the integrated device for copper plating of air conditioning pipes can be calculated by the following formula: Where: t is the copper plating time, m is the mass of copper to be plated, F is the Faraday constant, I is the current during electroplating, and η is the current efficiency; The integrated device for copper plating of air-conditioning pipes adjusts the corresponding copper plating time according to the above calculated value.

9. The integrated device for copper plating of air conditioning pipes according to claim 8, characterized in that: The lower end of the clamping block is provided with a thickness detector for detecting the thickness of the copper plating; The integrated device for copper plating of air-conditioning pipes adjusts the reaction time in real time according to the monitoring data of the thickness detector.

10. The integrated device for copper plating of air conditioning pipes according to claim 1, characterized in that: A stirring device is installed at the bottom of the copper plating pool; A filter layer structure for filtering the stirred reaction liquid is provided on both sides of the stirring device to absorb and filter impurities and insoluble particles in the reaction liquid.

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