Perforation detection device and method for TGV glass substrate

Abstract

The invention discloses a perforation detection device for a TGV glass substrate, which is characterized in that a first depth-of-field camera and a first collimation light source which are arranged on the glass substrate directly face the upper surface of the glass substrate, and a second depth-of-field camera and a second collimation light source which are arranged below the glass substrate directly face the lower surface of the glass substrate. The first collimation light source and the second collimation light source emit a first collimation light beam and a second collimation light beam to the glass substrate respectively, the light wave band of the first collimation light beam is the same as or different from the light wave band of the second collimation light beam, and the first depth-of-field camera and the second depth-of-field camera are used for obtaining a first image and a second image respectively. And the microcontroller unit of the perforation detection device of the TGV glass substrate is used for obtaining at least one detection result of at least one glass substrate perforation of the glass substrate according to the first image and the second image.

Description

Technical Field

[0001] A TGV (Through Glass Via) glass substrate perforation detection device and method, in particular, a TGV glass substrate perforation detection device and method using two depth-of-field cameras and two collimated light sources located above and below the glass substrate to obtain glass substrate perforation detection results. Background Art

[0002] Previous two-dimensional (2D) chip packaging technology is no longer able to meet current demands for chip speed, performance, and thinness. Consequently, two-and-a-half-dimensional (2.5D) and three-dimensional (3D) chip packaging technologies have been proposed. These technologies require the use of an interposer with through-silicon vias (TSVs) to electrically connect different chips. Traditionally, silicon substrates with through-silicon vias (TSVs) (also known as TSV silicon substrates) have been used as interposers. However, silicon is a Group IV-A semiconductor material, so surrounding charge carriers can freely migrate under the influence of electric or magnetic fields, potentially affecting adjacent circuits or signals and severely impacting chip performance. However, glass, unlike silicon, lacks freely mobile charges, exhibits excellent dielectric properties, and has a coefficient of thermal expansion (CTE) similar to that of silicon. Therefore, glass substrates with through-glass vias (TGVs) (also known as TGV glass substrates) have been proposed as an alternative to silicon substrates as interposers.

[0003] The manufacturing method of the glass substrate with a through hole is to first irradiate the predetermined position of the glass substrate where the through hole is to be formed on the glass substrate to modify it, and then use immersion etching to form the through hole in the predetermined position. Figure 1 and Figure 2 , Figure 1 is a schematic plan view of a glass substrate having a glass substrate through-hole, and Figure 2 Yes Figure 1 A three-dimensional schematic diagram of a side view of a section of Figure 2 The cross section is Figure 1 A cross section along section line AA shows a glass substrate 1 having a plurality of glass substrate through-holes 12 extending through the upper and lower surfaces 10, 12 of the glass substrate 1. Each glass substrate through-hole 12 has an upper opening 121 on the upper surface 10 and a lower opening 123 on the lower surface 11. The through-hole 122 is formed in the waistline between the upper and lower surfaces 10, 11. The upper and lower openings 121, 123 have opening diameters Rt and Rb, respectively, and the through-hole 122 in the waistline has a through-hole diameter Rm.

[0004] Parameter information such as the opening diameter Rt, Rb, and the perforation diameter Rm must be tested in order to evaluate whether the glass substrate 1 meets the requirements. One of the current existing technologies is to use X-rays for detection, but the detection speed of X-ray detection is too slow (even slower than microscopic inspection), which is not in line with production efficiency. Another current existing technology is to use a microscope for detection, but microscopic inspection is still very time-consuming and difficult to be economical. Another existing technology is to first fill the glass substrate perforation 12 with non-destructive plastic material, and then remove the non-destructive plastic material to measure the above information, but this method requires filling with non-destructive plastic material. In addition to the cost and detection time issues, there may also be the problem of non-destructive plastic material remaining in the glass substrate perforation 12. In view of this, there is still a need to propose a novel glass substrate perforation detection technology to avoid the above technical problems. Summary of the Invention

[0005] In accordance with any of the above objectives, the present invention provides a device for detecting perforations in TGV glass substrates. The device comprises a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, a second collimated light source, and a microcontroller unit. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one glass substrate perforation and face the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and face the lower surface of the glass substrate. The microcontroller unit is electrically connected to the first depth-of-field camera, the first collimated light source, the second collimated light source, and the second collimated light source. The first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward the glass substrate. The first collimated light beam has a different wavelength than the second collimated light beam. The first depth-of-field camera and the second depth-of-field camera are respectively configured to acquire a first image and a second image. The microcontroller unit is configured to obtain at least one detection result of at least one glass substrate perforation based on the first image and the second image.

[0006] In accordance with any of the above-mentioned objectives, the present invention provides a device for detecting perforations in TGV glass substrates, the device comprising a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, a second collimated light source, a beam splitter module, a third depth-of-field camera, and a microcontroller unit. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one glass substrate perforation and face the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and face the lower surface of the glass substrate. The microcontroller unit is electrically connected to the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, the second collimated light source, and the third depth-of-field camera. The beam splitter module is disposed between the upper surface of the glass substrate and the first collimated light source. The third depth-of-field camera is disposed on one side of the beam splitter module. A first collimated light source and a second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward the glass substrate. The beam splitting prism module is configured to split the first collimated light beam directed toward the glass substrate, the first collimated light beam reflected by the glass substrate, and the second collimated light beam transmitted through the glass substrate. A portion of the second collimated light beam that passes through the through-hole of the glass substrate, a portion of the first collimated light beam that passes through the glass substrate, and a portion of the first collimated light beam that is reflected by the glass substrate are received by a third depth-of-field camera. Another portion of the second collimated light beam that passes through the through-hole of the glass substrate and another portion of the first collimated light beam that is reflected by the glass substrate are received by the first depth-of-field camera. Another portion of the first collimated light beam that passes through the through-hole of the glass substrate and another portion of the first collimated light beam that is reflected by the glass substrate are received by the first depth-of-field camera. The other portion of the first collimated light beam that passes through the glass substrate is irradiated onto the glass substrate. The wavelength band of the first collimated light beam is different from or the same as the wavelength band of the second collimated light beam. The first, second, and third depth-of-field cameras are configured to respectively acquire a first image, a second image, and a third image. The microcontroller unit is configured to obtain at least one detection result of at least one through-hole in the glass substrate based on the first, second, and third images.

[0007] Based on the above purpose, the present invention also provides a perforation detection method for a TGV glass substrate. The perforation detection method for a TGV glass substrate is performed in a perforation detection device for a TGV glass substrate. The perforation detection device for a TGV glass substrate includes a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one glass substrate perforation and facing the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and facing the lower surface of the glass substrate. The perforation detection method includes the following steps: The invention relates to a method for inspecting a perforation of a TGV glass substrate using a microcontroller unit to control a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and the second collimated light source, so that the first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward a glass substrate, and the first depth-of-field camera and the second depth-of-field camera are respectively used to obtain a first image and a second image, wherein a light wavelength range of the first collimated light beam is different from a light wavelength range of the second collimated light beam; and the microcontroller unit of the TGV glass substrate perforation inspection device obtains at least one inspection result of a perforation of at least one glass substrate based on the first image and the second image.

[0008] In summary, the present invention provides an optical device and method for detecting perforations in TGV glass substrates that does not require filling with non-destructive plastic materials. This device and method can reduce detection time and costs while also avoiding damage to the glass substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a schematic plan view of a glass substrate having a glass substrate through-hole;

[0010] Figure 2 Yes Figure 1 A three-dimensional schematic diagram of a side view of a cross section;

[0011] Figure 3 is a schematic top plan view of a TGV glass substrate perforation detection device detecting a glass substrate according to an embodiment of the present invention;

[0012] Figure 4 is a side cross-sectional schematic diagram of a TGV glass substrate perforation detection device detecting a glass substrate according to an embodiment of the present invention;

[0013] Figure 5 2 is a schematic diagram of a first depth-of-field camera and a first collimated light source implemented with a first telecentric lens imaging module according to an embodiment of the present invention;

[0014] Figure 6 is a schematic diagram of a first image and a second image according to an embodiment of the present invention;

[0015] Figure 7These are the types of defects that can be detected by the perforation detection device for a TGV glass substrate according to an embodiment of the present invention;

[0016] Figure 8A is a perspective schematic diagram of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention;

[0017] Figure 8B is a front view schematic diagram of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention;

[0018] Figure 8C is a schematic side view of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention; and

[0019] Figure 9 FIG1 is a side cross-sectional schematic diagram of a TGV glass substrate perforation detection device detecting a glass substrate according to another embodiment of the present invention.

[0020] Explanation of symbols:

[0021] 1: Glass substrate

[0022] 10: Upper surface

[0023] 11: Lower surface

[0024] 12: Glass substrate perforation

[0025] 121: Upper opening

[0026] 122: Perforation

[0027] 123: Lower opening

[0028] 21: First telecentric mirror imaging module

[0029] 211: First Depth of Field Camera

[0030] 212: First collimated light source

[0031] 213: Light receiving lens module

[0032] 214: Telecentric lens module

[0033] 215: Imaging Module

[0034] 22: Second telecentric mirror imaging module

[0035] 221: Second Depth of Field Camera

[0036] 222: Second collimated light source

[0037] 23: Microcontroller unit

[0038] 24: Base structure

[0039] 240: Common Base

[0040] 241a: First Pedestal

[0041] 241b: Second base

[0042] 25: Beam splitter prism module

[0043] 26: Second telecentric mirror imaging module

[0044] 261: Third Depth of Field Camera

[0045] 262: Third collimated light source

[0046] Rt: upper opening diameter

[0047] Rb: bottom opening diameter

[0048] Rm: perforation diameter

[0049] AA, BB: hatching

[0050] L0: Beam

[0051] L1: first collimated beam

[0052] L2: Second collimated beam

[0053] L2': first sensing beam. DETAILED DESCRIPTION

[0054] Please refer to Figure 3 and Figure 4 , Figure 3 is a schematic top plan view of a TGV glass substrate perforation detection device detecting a glass substrate according to an embodiment of the present invention, and Figure 4 FIG is a side cross-sectional schematic diagram of a TGV glass substrate perforation detection device detecting a glass substrate according to an embodiment of the present invention, wherein Figure 4 The cross-sectional view of the glass substrate 1 is based on Figure 3 The cross section is obtained by cutting along the section line BB. The TGV glass substrate perforation detection device includes a first depth-of-field camera 211, a first collimated light source 212, a second depth-of-field camera 221, a second collimated light source 222, and a microcontroller unit 23. The first depth-of-field camera 211 and the first collimated light source 212 can be integrated into a first telecentric imaging module 21, and the second depth-of-field camera 221 and the second collimated light source 222 can be integrated into a second telecentric imaging module 22, but the present invention is not limited thereto.

[0055] A first depth-of-field camera 211 and a first collimated light source 212 are disposed on a glass substrate 1 having at least one glass substrate through-hole 12, and face the upper surface 10 of the glass substrate 1. Herein, the first depth-of-field camera 211 and the first collimated light source 212 face the upper surface 10 of the glass substrate 1, meaning that the imaging end of the first depth-of-field camera 211 and the emitting end of the first collimated light source 212 extend in directions perpendicular to the upper surface 10 of the glass substrate 1. A second depth-of-field camera 221 and a second collimated light source 222 are disposed below the glass substrate 1, and face the lower surface 11 of the glass substrate 1. Herein, the second depth-of-field camera 221 and the second collimated light source 222 face the lower surface 11 of the glass substrate 1, meaning that the imaging end of the second depth-of-field camera 221 and the emitting end of the second collimated light source 222 extend in directions perpendicular to the lower surface 11 of the glass substrate 1.

[0056] The microcontroller unit 23 is electrically connected to the first depth-of-field camera 211, the first collimated light source 212, the second depth-of-field camera 221, and the second collimated light source 222. The microcontroller unit 23 controls the first collimated light source 212 and the second collimated light source 222 to emit a first collimated light beam L1 and a second collimated light beam L2, respectively, toward the glass substrate 1. The wavelength of the first collimated light beam L1 is the same as or different from the wavelength of the second collimated light beam L2. The wavelength of the first collimated light beam L1 being the same as or different from the wavelength of the second collimated light beam L2 also means that the beam color of the first collimated light beam L1 is the same as or different from the beam color of the second collimated light beam L2. For example, the beam colors of the first collimated light beam L1 and the second collimated light beam L2 are each selected from red, green, blue, and white. It should be noted that the collimation of the first collimated beam L1 and the second collimated beam L2 is related to the depth of the glass substrate through hole 12, that is, the thickness of the glass substrate 1. The first depth camera 211 and the second depth camera 221 can be black and white or color cameras depending on actual use.

[0057] After the first collimated light beam L1 and the second collimated light beam L2 illuminate the glass substrate 1, they generate a second sensing light beam and a first sensing light beam, respectively, which are transmitted to the first depth-of-field camera 211 and the second depth-of-field camera 221. The first depth-of-field camera 211 and the second depth-of-field camera 221 thereby obtain a first image and a second image. The microcontroller unit 23 is then configured to obtain at least one detection result of at least one glass substrate through-hole 12 based on the first image and the second image. It should be noted that the maximum detection depth of the first depth-of-field camera 211 and the second depth-of-field camera 221 is related to the depth of the glass substrate through-hole 12, that is, the thickness of the glass substrate 1.

[0058] Further, refer to Figure 3 、4 and Figure 7 The inspection results include at least one of the upper and lower opening diameters Rt and Rb of the upper opening 121 and the lower opening 123 of the glass substrate through-hole 12 (which can be used to determine whether there is an aperture abnormality), opening coordinates, opening roundness (which can be used to determine whether there is a roundness abnormality), crack detection results, dirt detection results, point damage detection results, scratch detection results, impurity detection results and edge chipping detection results, the through-hole diameter Rm of the glass substrate through-hole 12, the hole plug detection result of the glass substrate through-hole 12 (which can be used to determine whether there is a hole plug abnormality), and the offset between the upper and lower openings (which can be used to determine whether there is an offset abnormality).

[0059] Please refer to Figure 5 , Figure 5 FIG2 is a schematic diagram illustrating an embodiment of the present invention, wherein a first depth-of-field camera and a first collimated light source are implemented using a first telecentric imaging module. The first telecentric imaging module 21 includes a light receiving lens module 213, a telecentric lens module 214, and an imaging module 215. The first telecentric imaging module 21 is T-shaped, with the imaging module 215 disposed at the top of the first telecentric imaging module 21, the light receiving lens module 213 disposed at a side of the first telecentric imaging module 21, and the telecentric lens module 214 disposed at the bottom of the first telecentric imaging module 21. The light receiving lens module 213 receives the initial light beam L0, the telecentric lens module 214 is configured to emit a first collimated light beam L1 and receive a first sensing light beam L2′ (generated by the second collimated light beam L2 irradiating the glass substrate 1), and the imaging module 215 is configured to generate a first image based on the first sensing light beam L2′.

[0060] Furthermore, similar to Figure 5 , Figure 4 The second telecentric imaging module 22 includes another light receiving lens module, another telecentric lens module and another imaging module. The second telecentric imaging module 22 has a T-shaped appearance, wherein the other imaging module is arranged at the top of the second telecentric imaging module 22, the other light receiving lens module is arranged at the side end of the second telecentric imaging module 22, the other telecentric lens module is arranged at the bottom end of the second telecentric imaging module 22, the other light receiving lens module receives the light beam of another initial light source, the other telecentric lens module is used to emit a second collimated light beam L2 and receive a second sensing light beam (generated by the first collimated light beam L1 irradiating the glass substrate 1), and the other imaging module is used to generate a second image according to the second sensing light beam.

[0061] Please refer to Figure 6 , Figure 6 is a schematic diagram of a first image and a second image according to an embodiment of the present invention, wherein Figure 6 The first image is on the left. Figure 6The right side shows the second image. The first image shows the upper opening 121 of at least one glass substrate through-hole 12 of the glass substrate 1, the through-hole 122 in the waist, and the portion of the upper surface 10 of the glass substrate 1 near the upper opening 121. The color of the through-hole is the beam color of the second collimated light beam L2, the color from the upper opening 121 to the through-hole 122 is black, and the color of the portion of the upper surface 10 of the glass substrate 1 near the upper opening 121 is a mixture of the beam colors of the first collimated light beam L1 and the second collimated light beam L2.

[0062] The second image presents an image of the lower opening 123 of at least one glass substrate through-hole 12 of the glass substrate 1, the through-hole 122 of the waist, and a portion of the lower surface 11 of the glass substrate 1 near the lower opening 123, wherein the color of the through-hole 122 is the beam color of the first collimated light beam L1, the color from the lower opening 123 to the through-hole 122 is black, and the color of the portion of the lower surface 11 of the glass substrate 1 near the lower opening 123 is a mixed color of the beam colors of the first collimated light beam L1 and the second collimated light beam L2.

[0063] Furthermore, the TGV glass substrate perforation detection device further includes a main frame (not shown) and a glass substrate supporting structure (not shown). The glass substrate supporting structure is disposed in the main frame and is used to contact at least a portion of the glass substrate 1 (such as the four corners, but not limited thereto) to support the glass substrate 1. In addition, please refer to Figures 8A to 8C , Figure 8A 1 is a perspective schematic diagram of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention. Figure 8B is a schematic front view of a partial structure of a perforation detection device for a TGV glass substrate according to an embodiment of the present invention, and Figure 8C This is a schematic side view of a portion of the structure of a TGV glass substrate perforation detection device according to an embodiment of the present invention. In addition to a main frame (not shown) and a glass substrate support structure (not shown), the TGV glass substrate perforation detection device further includes a base structure 24 for supporting and securing the first telecentric imaging module 21 and the second telecentric imaging module 22. The base structure 24 comprises a common base 240, a first base 241a, and a second base 241b. The first base 241a and the second base 241b are disposed on opposite sides of the common base 240 and are used to support and secure the first telecentric imaging module 21 and the second telecentric imaging module 22, respectively.

[0064] In one embodiment, if the glass substrate 1 is not large, the first and second images of the entire glass substrate 1 can be captured without movement of the first and second telecentric imaging modules 21, 22. In this case, the common base 240 is fixed to the main frame, the glass substrate supporting structure is also fixed to the main frame, and the glass substrate 1 does not move relative to the first and second telecentric imaging modules 21, 22. If the glass substrate 1 is too large, the first and second telecentric imaging modules 21, 22 must be moved to capture the first and second images of the entire glass substrate 1. In this case, the glass substrate 1 needs to be designed to be movable relative to the first and second telecentric imaging modules 21, 22. In this case, the common base 240 can be fixed to the main frame, while the glass substrate supporting structure is movably disposed in the main frame, or the common base 240 can be movably disposed in the main frame, while the glass substrate supporting structure is fixed in the main frame. Furthermore, the TGV glass substrate perforation detection device further includes a transmission mechanism for connecting and moving the common base 240 or one of the glass substrate supporting structures, so that the glass substrate 1 can move relative to the first telecentric lens imaging module 21 and the second telecentric lens imaging module 22.

[0065] In addition, each of the first base 241a and the second base 241b includes an adjustment structure, such as but not limited to an adjustment gasket, an adjustment screw, an adjustment bearing or other adjustment components. The adjustment structure of the first base 241a and the second base 241b can be used to adjust the offset of the first telecentric mirror imaging module 21 and the second telecentric mirror imaging module 22 respectively. The offset can be, for example, an offset between the X-axis and the Y-axis, or an offset between the X-axis, the Y-axis and the Z-axis. In short, the present invention is not limited to the implementation method of the adjustment structure. In addition, it can be seen from the above that in the present invention, when the first telecentric mirror imaging module 21 and the second telecentric mirror imaging module 22 need to move relative to the glass substrate 1, the movement of the first telecentric mirror imaging module 21 and the second telecentric mirror imaging module 22 relative to the glass substrate 1 is designed to be a jointly linked movement. The advantage is that once the offset is adjusted, there is no need to readjust the offset caused by the individual movement of the first telecentric mirror imaging module 21 and the second telecentric mirror imaging module 22. Therefore, the measurement accuracy can be increased, or the time and labor cost of adjusting the offset can be reduced.

[0066] Furthermore, according to the above content, the present invention also provides a method for detecting perforations of a TGV glass substrate. The method for detecting perforations of a TGV glass substrate is performed in a perforation detection device for a TGV glass substrate. The perforation detection device includes a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and a second collimated light source. The first depth-of-field camera and the first collimated light source are disposed on a glass substrate having at least one glass substrate perforation and facing the upper surface of the glass substrate. The second depth-of-field camera and the second collimated light source are disposed below the glass substrate and facing the lower surface of the glass substrate. The method for detecting perforations of a TGV glass substrate includes the following steps: using a TGV to detect a perforation of a glass substrate; A microcontroller unit of a TGV glass substrate perforation detection device controls a first depth-of-field camera, a first collimated light source, a second depth-of-field camera, and the second collimated light source, so that the first collimated light source and the second collimated light source respectively emit a first collimated light beam and a second collimated light beam toward the glass substrate, and the first depth-of-field camera and the second depth-of-field camera are respectively used to obtain a first image and a second image, wherein the beam color of the first collimated light beam is different from the beam color of the second collimated light beam; and the microcontroller unit of the TGV glass substrate perforation detection device obtains at least one detection result of a perforation of at least one glass substrate based on the first image and the second image. Furthermore, when the glass substrate is relatively large and the first telecentric lens imaging module and the second telecentric lens imaging module must be moved to obtain the first and second images of the entire glass substrate, the perforation detection method further includes causing the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source of the TGV glass substrate perforation detection device to move relative to the glass substrate (i.e., the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source move together, while the glass substrate remains stationary; alternatively, the first depth-of-field camera, the first collimated light source, the second depth-of-field camera, and the second collimated light source remain stationary, while the glass substrate moves).

[0067] Please refer to Figure 9 , Figure 9 FIG. 1 is a side cross-sectional schematic diagram of a TGV glass substrate perforation detection device detecting a glass substrate according to another embodiment of the present invention. Figure 4In this embodiment, the perforation detection device further includes a beam splitter prism module 25 disposed between the upper surface 10 of the glass substrate 1 and the first telecentric imaging module 21, and a third telecentric imaging module 26 located on one side (e.g., the right side) of the beam splitter prism module 25. The third telecentric imaging module 26 includes a third depth-of-field camera 261 and a third collimated light source 262. However, the third collimated light source 262 is disabled here, i.e., does not emit a third collimated light beam. The third depth-of-field camera 261 is electrically connected to the microcontroller unit 23. The second collimated light beam L2 passes through the glass substrate 1 in a collimated manner. The second collimated light beam L2 passes through the portion of the glass substrate 1 outside the through-hole 122 and the upper opening 121 (if the upper opening diameter Rt is greater than or equal to the lower opening diameter Rb), or the second collimated light beam L2 passes through the portion of the glass substrate 1 outside the through-hole 122 and the lower opening 123 (if the upper opening diameter Rt is less than the lower opening diameter Rb). The beam splitter prism module 25 is used to split the second collimated light beam L2 that passes through the glass substrate 1, and is also used to split the first collimated light beam L1 that is emitted toward the glass substrate 1 and the first collimated light beam L1 that is reflected by the glass substrate 1.

[0068] A portion of the split second collimated light beam L2 that passes through the glass substrate 1, a portion of the split first collimated light beam L1 that is directed toward the glass substrate 1, and a portion of the split first collimated light beam L1 that is reflected by the glass substrate 1 are received by the third depth-of-field camera 261, forming a third image. Another portion of the split second collimated light beam L2 that passes through the glass substrate 1 and another portion of the split first collimated light beam L1 that is reflected by the glass substrate 1 are received by the first depth-of-field camera 211, forming a first image. Therefore, compared to the first image, the third image may be brighter and have a color that is more similar to that of the first collimated light beam L1. Another portion of the split first collimated light beam L1 that passes through the glass substrate 1 and is reflected by the glass substrate 1 partially passes through the glass substrate 1 and is partially reflected by the glass substrate 1. Therefore, the second depth-of-field camera 221 receives the first collimated light beam L1 that passes through the glass substrate 1 and the second collimated light beam L2 that is reflected by the glass substrate 1, forming a second image.

[0069] In this embodiment, the first, second, and third images are used to more accurately detect the glass substrate through-hole 12. Furthermore, in this embodiment, the beam colors of the first collimated light beam L1 and the second collimated light beam L2 can be the same or different. For example, the beam colors of the first collimated light beam L1 and the second collimated light beam L2 can each be selected from one of white, red, green, and blue. Furthermore, depending on practical needs, the first depth-of-field camera 211, the second depth-of-field camera 221, and the third depth-of-field camera 261 can be color or black-and-white cameras.

[0070] The present invention provides an optical device and method for detecting perforations in TGV glass substrates that does not require filling with non-destructive plastic material. These devices can detect the diameters of the upper and lower openings of the glass substrate perforations, their coordinates, their roundness, crack detection results, impurity detection results, and edge chipping detection results, as well as the diameter of the glass substrate perforations, the results of hole plug detection, and at least one of the offset between the upper and lower openings. Furthermore, the device and method for detecting perforations in TGV glass substrates of the present invention not only reduces detection time and costs, but also avoids damage to the glass substrate.

Claims

1. A TGV glass substrate perforation detection device, characterized in that: include: A first depth-of-field camera (211) and a first collimated light source (212) are disposed on a glass substrate (1) having at least one glass substrate through-hole (12) and facing an upper surface (10) of the glass substrate (1); A second depth-of-field camera (221) and a second collimated light source (222) are disposed below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1); and a microcontroller unit (23) electrically connected to the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222); The first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1); a light band of the first collimated light beam (L1) is the same as or different from a light band of the second collimated light beam (L2); the first depth-of-field camera (211) and the second depth-of-field camera (221) are respectively used to obtain a first image and a second image; and the microcontroller unit (23) is used to obtain at least one detection result of the at least one glass substrate perforation (12) based on the first image and the second image.

2. The TGV glass substrate perforation detection device according to claim 1, wherein: The detection result includes an opening diameter (Rt, Rb) of an upper opening (121) and a lower opening (123) of the glass substrate through-hole (12), an opening coordinate, an opening roundness, a crack detection result, a dirt detection result, a point damage detection result, a scratch detection result, an impurity detection result and a chipping detection result, a through-hole diameter (Rm) of the glass substrate through-hole (12), a hole plug detection result of the glass substrate through-hole (12) and at least one of an upper and lower opening offset.

3. The TGV glass substrate perforation detection device according to claim 1, wherein: The first depth-of-field camera (211) and the first collimated light source (212) are integrated into a first telecentric imaging module (21). The first telecentric imaging module (21) includes a light receiving lens module (213), a telecentric lens module (214), and an imaging module (215). The first telecentric imaging module (21) has a T-shaped appearance. The imaging module (215) is arranged at a top end of the first telecentric imaging module (21). 3) is arranged at one side end of the first telecentric mirror imaging module (21), the telecentric lens module (214) is arranged at a bottom end of the first telecentric mirror imaging module (21), the light receiving lens module (213) receives a light beam (L0) of an initial light source, the telecentric lens module (214) is used to emit the first collimated light beam (L1) and receive a first sensing light beam (L2'), and the imaging module (215) is used to generate the first image according to the first sensing light beam (L2').

4. The TGV glass substrate perforation detection device according to claim 3, wherein: The second depth-of-field camera (221) and the second collimated light source (222) are integrated into a second telecentric imaging module (22), the second telecentric imaging module (22) comprising another light receiving lens module, another telecentric lens module and another imaging module, the outer shape of the second telecentric imaging module (22) being in a T-shape, wherein the another imaging module is arranged at a top end of the second telecentric imaging module (22), the another light receiving lens module is arranged at a side end of the second telecentric imaging module (22), the another telecentric lens module is arranged at a bottom end of the second telecentric imaging module (22), the another light receiving lens module receives a light beam from another initial light source, the another telecentric lens module is used to emit the second collimated light beam (L2) and receive a second sensing light beam, and the another imaging module is used to generate the second image according to the second sensing light beam.

5. The TGV glass substrate perforation detection device according to claim 4, wherein: include: a main frame; as well as A glass substrate supporting structure is arranged in the main frame and is used for contacting at least a portion of the glass substrate (1) to support the glass substrate (1).

6. The TGV glass substrate perforation detection device according to claim 5, wherein: include: A base structure (24) includes a common base (240), a first base (241a) and a second base (241b), wherein the first base (241a) and the second base (241b) are formed on opposite sides of the common base (240) and are respectively used to carry and fix the first telecentric lens imaging module (21) and the second telecentric lens imaging module (22), and the common base (240) is arranged in the main frame.

7. The TGV glass substrate perforation detection device according to claim 6, wherein: The common base (240) is fixed in the main frame, and the glass substrate supporting structure is movably arranged in the main frame, so that the glass substrate (1) moves relative to the first telecentric mirror imaging module (21) and the second telecentric mirror imaging module (22) through the movement of the glass substrate supporting structure; or, the common base (240) is movably arranged in the main frame, and the glass substrate supporting structure is fixed in the main frame, so that the glass substrate (1) moves relative to the first telecentric mirror imaging module (21) and the second telecentric mirror imaging module (22) through the movement of the common base (240).

8. The TGV glass substrate perforation detection device according to claim 1, wherein: A beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2) are each selected from one of red, green, blue and white.

9. The TGV glass substrate perforation detection device according to claim 1, wherein: The first image presents an upper opening (121) of the at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixed color of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2).

10. The TGV glass substrate perforation detection device according to claim 1, wherein: The second image presents images of a lower opening (123) of the at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixed color of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2).

11. A perforation detection device for a TGV glass substrate, characterized in that: include: A first depth-of-field camera (211) and a first collimated light source (212) are disposed on a glass substrate (1) having at least one glass substrate through-hole (12) and facing an upper surface (10) of the glass substrate (1); A second depth-of-field camera (221) and a second collimated light source (222) are disposed below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1); a microcontroller unit (23) electrically connected to the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222); a beam splitter prism module (25) disposed between the upper surface (10) of the glass substrate (1) and the first collimated light source (212); and a third depth-of-field camera (261), disposed on one side of the beam splitter prism module (25) and electrically connected to the microcontroller unit (23); The first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1); the beam splitting prism module (25) is used to split the first collimated light beam (L1) directed to the glass substrate (1), the first collimated light beam (L1) reflected by the glass substrate (1), and the second collimated light beam (L2) passing through the glass substrate through-hole (12); a portion of the first collimated light beam (L1) directed to the glass substrate (1), a portion of the first collimated light beam (L1) reflected by the glass substrate (1), and a portion of the second collimated light beam (L2) passing through the glass substrate through-hole (12) are received by the third depth-of-field camera (261); and the first collimated light beam reflected by the glass substrate (1) is received by the third depth-of-field camera (261). The first depth-of-field camera (221) receives another portion of the first collimated light beam (L1) after being split and another portion of the second collimated light beam (L2) after being split that passes through the glass substrate through-hole (12). The other portion of the first collimated light beam (L1) directed toward the glass substrate (1) after being split partially penetrates the glass substrate (1) and is partially reflected by the glass substrate (1). A light band of the first collimated light beam (L1) is the same as or different from a light band of the second collimated light beam (L2). The first depth-of-field camera (211), the second depth-of-field camera (221), and the third depth-of-field camera (261) are respectively used to obtain a first image, a second image, and a third image. The microcontroller unit (23) is used to obtain at least one detection result of the at least one glass substrate through-hole (12) based on the first image, the second image, and the third image.

12. The TGV glass substrate perforation detection device according to claim 11, wherein: The detection result includes an opening diameter (Rt, Rb) of an upper opening (121) and a lower opening (123) of the glass substrate through-hole (12), an opening coordinate, an opening roundness, a crack detection result, a dirt detection result, a point damage detection result, a scratch detection result, an impurity detection result and a chipping detection result, a through-hole diameter (Rm) of the glass substrate through-hole (12), a hole plug detection result of the glass substrate through-hole (12) and at least one of an upper and lower opening offset.

13. The TGV glass substrate perforation detection device according to claim 11, wherein: Each of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2) is selected from one of white, red, green and blue.

14. The TGV glass substrate perforation detection device according to claim 11, wherein: Each of the first image and the third image presents an image of an upper opening (121) of at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixed color of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2).

15. The TGV glass substrate perforation detection device according to claim 11, wherein: The second image presents images of a lower opening (123) of the at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixed color of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2).

16. A method for detecting a perforation of a TGV glass substrate, executed in a device for detecting a perforation of a TGV glass substrate, characterized in that: The perforation detection device comprises a first depth-of-field camera (211), a first collimated light source (212), a second depth-of-field camera (221) and a second collimated light source (222); the first depth-of-field camera (211) and the first collimated light source (212) are arranged on a glass substrate (1) having at least one glass substrate perforation (12) and facing an upper surface (10) of the glass substrate (1); the second depth-of-field camera (221) and the second collimated light source (222) are arranged below the glass substrate (1) and facing a lower surface (11) of the glass substrate (1); and the perforation detection method comprises: A microcontroller unit (23) of the TGV glass substrate perforation detection device is used to control the first depth-of-field camera (211), the first collimated light source (212), the second depth-of-field camera (221), and the second collimated light source (222), so that the first collimated light source (212) and the second collimated light source (222) respectively emit a first collimated light beam (L1) and a second collimated light beam (L2) to the glass substrate (1), and the first depth-of-field camera (211) and the second depth-of-field camera (221) are used to obtain a first image and a second image, respectively, wherein a light band of the first collimated light beam (L1) is the same as or different from a light band of the second collimated light beam (L2); and The microcontroller unit (23) of the TGV glass substrate perforation detection device obtains at least one detection result of the at least one glass substrate perforation (12) according to the first image and the second image.

17. The method for detecting perforation of a TGV glass substrate according to claim 16, wherein: The detection result includes an opening diameter (Rt, Rb) of an upper opening (121) and a lower opening (123) of the glass substrate through-hole (12), an opening coordinate, an opening roundness, a crack detection result, a dirt detection result, a point damage detection result, a scratch detection result, an impurity detection result and a chipping detection result, a through-hole diameter (Rm) of the glass substrate through-hole (12), a hole plug detection result of the glass substrate through-hole (12) and at least one of an upper and lower opening offset.

18. The method for detecting perforation of a TGV glass substrate according to claim 16, wherein: A beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2) are selected from two of red, green and blue.

19. The method for detecting perforation of a TGV glass substrate according to claim 16, wherein: The first image presents an upper opening (121) of the at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the upper surface (10) of the glass substrate (1) near the upper opening (121), wherein the color of the perforation is a beam color of the second collimated light beam (L2), the color from the upper opening (121) to the perforation (122) is black, and the color of the portion of the upper surface (10) of the glass substrate (1) near the upper opening (121) is a mixed color of a beam color of the first collimated light beam (L1) and the beam color of the second collimated light beam (L2).

20. The method for detecting perforation of a TGV glass substrate according to claim 16, wherein: The second image presents images of a lower opening (123) of the at least one glass substrate perforation (12) of the glass substrate (1), a perforation (122) of a waist, and a portion of the lower surface (11) of the glass substrate (1) near the lower opening (123), wherein the color of the perforation (122) is a beam color of the first collimated light beam (L1), the color from the lower opening (123) to the perforation (122) is black, and the color of the portion of the lower surface (11) of the glass substrate (1) near the lower opening (123) is a mixed color of the beam color of the first collimated light beam (L1) and a beam color of the second collimated light beam (L2).

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