Electronic device

By designing sensor layers and sensor drivers in multimedia electronic devices and using differential amplifiers and analog-to-digital converters to process signals, the noise interference problem when sensing pen input is solved, and identification accuracy and reliability are improved.

CN120447768APending Publication Date: 2025-08-08SAMSUNG DISPLAY CO LTD
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Patent Information

Application Number
CN202411908840.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2024-02-06
Filing Date
2024-12-24
Publication Date
2025-08-08

AI Technical Summary

Technical Problem

Existing multimedia electronic devices are susceptible to noise interference when sensing pen input, making it difficult to accurately identify pen input.

Method used

Using the design of a sensor layer and a sensor driver, the sensor layer includes a plurality of first electrode groups and a second electrode groups, the electrode groups are arranged in different directions and the signals are processed by differential amplifiers and analog-to-digital converters to distinguish between touch and pen inputs.

Benefits of technology

Improves the accuracy of identification of pen input, reduces noise interference, and enhances the reliability of electronic devices when sensing pen input.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to an electronic device. The electronic device includes a sensor layer and a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing a touch input and a second mode for sensing a pen input. The sensor layer includes: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction crossing the first direction, and each including a first sensing electrode and a second sensing electrode. A plurality of coupling capacitors are between the first sensing electrode and the second sensing electrode.
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Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority from Korean Patent Application No. 10-2024-0018144, filed on February 6, 2024, the disclosure of which is hereby incorporated by reference in its entirety. Technical Field

[0003] The present disclosure relates to an electronic device capable of sensing input from a pen. Background Art

[0004] Multimedia electronic devices such as televisions, mobile phones, tablet computers, laptop computers, navigation devices, and game consoles include display devices for displaying images. The electronic devices may include a touch-based input system that enables users to input information or commands intuitively and conveniently, unlike general input systems such as buttons, keyboards, or mice.

[0005] The sensor layer of a touch-based input system can sense the touch or pressure of an object (e.g., a finger or pen). For example, a pen can be used for sketching or drawing. However, it can be difficult to sense the pen due to noise. Summary of the Invention

[0006] The present disclosure provides an electronic device capable of sensing input from a pen.

[0007] An embodiment of the present inventive concept provides an electronic device comprising a sensor layer and a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing touch input and a second mode for sensing pen input. For example, the sensor driver can selectively operate in the first mode or the second mode. The sensor layer comprises: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction, intersecting the plurality of first electrode groups, and each comprising a first sensing electrode and a second sensing electrode. The first sensing electrode comprises: a first separating electrode; and a first crossing electrode electrically connected to the first separating electrode. The second sensing electrode comprises: a second separating electrode spaced apart from the first separating electrode in the first direction; and a second crossing electrode electrically connected to the second separating electrode. At least a portion of the first crossing electrode overlaps with the second separating electrode, and at least a portion of the second crossing electrode overlaps with the first separating electrode.

[0008] In an embodiment, in the second mode, the sensor driver may be configured to receive a first signal from the first sensing electrode and receive a second signal from the second sensing electrode.

[0009] In an embodiment, the sensor layer may further include a first crossing trace electrically connected to the first sensing electrode and a second crossing trace electrically connected to the second sensing electrode. The first crossing trace may be connected to the first separation electrode, and the second crossing trace may be connected to the second separation electrode.

[0010] In an embodiment, the first crossing trace may be connected to one end of the first separating electrode, and the second crossing trace may be connected to one end of the second separating electrode.

[0011] In an embodiment, a length of the first intersecting electrode in the first direction may be smaller than a length of the second separating electrode in the first direction, and a length of the second intersecting electrode in the first direction may be smaller than a length of the first separating electrode in the first direction.

[0012] In an embodiment, a maximum width of the first intersecting electrode in the second direction may be smaller than a maximum width of the second separating electrode in the second direction, and a maximum width of the second intersecting electrode in the second direction may be smaller than a maximum width of the first separating electrode in the second direction.

[0013] In an embodiment, the sensor driver may include a differential amplifier, and in the second mode, an inverting terminal of the differential amplifier may be electrically connected to the first sensing electrode, and a non-inverting terminal of the differential amplifier may be electrically connected to the second sensing electrode.

[0014] In an embodiment, the sensor driver may include a first differential amplifier, a second differential amplifier, and a third differential amplifier, and in a second mode, each of the first differential amplifier and the second differential amplifier may receive a signal from a plurality of second electrode groups, an inverting terminal of the third differential amplifier may receive a signal output from the first differential amplifier, and a non-inverting terminal of the third differential amplifier may receive a signal output from the second differential amplifier.

[0015] In an embodiment, the plurality of second electrode groups may include a 2-1 electrode group and a 2-2 electrode group spaced apart from the 2-1 electrode group in a second direction, and in the second mode, the inverting terminal of the first differential amplifier may be electrically connected to the first sensing electrode of the 2-1 electrode group, and the non-inverting terminal of the first differential amplifier may be electrically connected to the second sensing electrode of the 2-1 electrode group, and in the second mode, the inverting terminal of the second differential amplifier may be electrically connected to the first sensing electrode of the 2-2 electrode group, and the non-inverting terminal of the second differential amplifier may be electrically connected to the second sensing electrode of the 2-2 electrode group.

[0016] In an embodiment, the plurality of second electrode groups may include a 2-1 electrode group and a 2-2 electrode group spaced apart from the 2-1 electrode group in a second direction, and in the second mode, the inverting terminal of the first differential amplifier may be electrically connected to the first sensing electrode of the 2-2 electrode group, and the non-inverting terminal of the first differential amplifier may be electrically connected to the first sensing electrode of the 2-1 electrode group, and in the second mode, the inverting terminal of the second differential amplifier may be electrically connected to the second sensing electrode of the 2-1 electrode group, and the non-inverting terminal of the second differential amplifier may be electrically connected to the second sensing electrode of the 2-2 electrode group.

[0017] In an embodiment, the sensor driver may include a plurality of differential amplifiers and an analog-to-digital converter, and in the second mode, the plurality of differential amplifiers may be connected to a plurality of first sensing electrodes and a plurality of second sensing electrodes of a plurality of second electrode groups in a one-to-one correspondence, the analog-to-digital converter may receive a plurality of signals from the plurality of differential amplifiers, and the sensor driver may perform a differential operation on the data output from the analog-to-digital converter.

[0018] In an embodiment, each of the plurality of first electrode groups may include a third sensing electrode and a fourth sensing electrode, the third sensing electrode may include a third separation electrode and a third cross-electrode electrically connected to the third separation electrode, the fourth sensing electrode may include a fourth separation electrode spaced apart from the third separation electrode in the second direction and a fourth cross-electrode electrically connected to the fourth separation electrode, at least a portion of the third cross-electrode may overlap with the fourth separation electrode, and at least a portion of the fourth cross-electrode may overlap with the third separation electrode.

[0019] In an embodiment, in the second mode, the sensor driver may be configured to receive a first signal from the first sensing electrode, receive a second signal from the second sensing electrode, receive a third signal from the third sensing electrode, and receive a fourth signal from the fourth sensing electrode.

[0020] In an embodiment, the first partition electrode may include a plurality of 1-1th sensing patterns and 1-1th bridge patterns, and the first cross electrode may include a plurality of 1-2th sensing patterns and 1-2th bridge patterns, the second partition electrode may include a plurality of 2-1st sensing patterns and 2-1st bridge patterns, and the second cross electrode may include a plurality of 2-2nd sensing patterns and 2-2nd bridge patterns, the third partition electrode may include a plurality of 3-1st sensing patterns and 3-1st bridge patterns, and the third cross electrode may include a plurality of 3-2nd sensing patterns and 3-2nd bridge patterns, and the fourth partition electrode may include a plurality of 4-1st sensing patterns and 4-1 bridge patterns, and the fourth cross electrode may include a plurality of 4-2nd sensing patterns and 4-2 bridge patterns.

[0021] In an embodiment, a plurality of 1-1st sensing patterns, a 1-1st bridge pattern, a 1-2nd bridge pattern, a plurality of 2-1st sensing patterns, a 2-1st bridge pattern, a 2-2 bridge pattern, a plurality of 3-1st sensing patterns, and a plurality of 4-1st sensing patterns may be arranged on the same first layer, and a plurality of 1-2nd sensing patterns, a plurality of 2-2nd sensing patterns, a plurality of 3-2nd sensing patterns, a 3-1st bridge pattern, a 3-2 bridge pattern, a plurality of 4-2nd sensing patterns, a 4-1st bridge pattern, and a 4-2 bridge pattern may be arranged on the same second layer.

[0022] In an embodiment, a plurality of 1-2th sensing patterns may overlap with some 2-1st sensing patterns among a plurality of 2-1st sensing patterns, and a plurality of 2-2nd sensing patterns may overlap with some 1-1st sensing patterns among a plurality of 1-1st sensing patterns, and a plurality of 3-2nd sensing patterns may overlap with some 4-1st sensing patterns among a plurality of 4-1st sensing patterns, and a plurality of 4-2nd sensing patterns may overlap with some 3-1st sensing patterns among a plurality of 3-1st sensing patterns.

[0023] In an embodiment, the sensor layer may further include a dummy electrode, which includes a plurality of first dummy patterns and a plurality of second dummy patterns, the first dummy pattern may include a pattern having a shape identical to that of at least a portion of the 1-2nd sensing pattern, the 2-2nd sensing pattern, the 3-2nd sensing pattern, and the 4-2nd sensing pattern, and the second dummy pattern may include a pattern having a shape identical to that of at least a portion of the 1-2nd bridge pattern, the 2-2nd bridge pattern, the 3-2nd bridge pattern, and the 4-2nd bridge pattern.

[0024] In an embodiment, the sensor layer may further include: a plurality of auxiliary electrodes respectively overlapping the plurality of first electrode groups; and connection traces connecting the plurality of auxiliary electrodes to each other.

[0025] In an embodiment, the sensor layer may further include a plurality of first traces electrically connected to the plurality of first electrode groups in a one-to-one correspondence, and the plurality of first traces may be spaced apart from the connecting traces with the plurality of first electrode groups therebetween.

[0026] In an embodiment, the first separation electrode may include a plurality of 1-1th sensing patterns and 1-1th bridge patterns, and the first cross electrode may include a plurality of 1-2th sensing patterns and 1-2 bridge patterns, the second separation electrode may include a plurality of 2-1st sensing patterns and 2-1 bridge patterns, and the second cross electrode may include a plurality of 2-2 sensing patterns and 2-2 bridge patterns, each of the plurality of first electrode groups may include a plurality of third sensing patterns and a third bridge pattern, the plurality of 1-1st sensing patterns, the 1-1st bridge pattern, the 1-2 bridge pattern, the plurality of 2-1st sensing patterns, the 2-1 bridge pattern, the 2-2 bridge pattern, and the plurality of third sensing patterns may be arranged on the same first layer, and the plurality of 1-2 sensing patterns, the plurality of 2-2 sensing patterns, the third bridge pattern, and the plurality of auxiliary electrodes may be arranged on the same second layer.

[0027] In an embodiment, the plurality of third sensing patterns may overlap with a corresponding one of the plurality of auxiliary electrodes, and the at least one hole surrounding the third bridge pattern may be in the one auxiliary electrode.

[0028] In an embodiment, the sensor layer may further include a plurality of annular traces electrically connected to the plurality of auxiliary electrodes, the second mode may include a charging drive mode and a pen sensing drive mode, the sensor driver may be configured to apply a first signal to the connecting trace and at least one line among the plurality of annular traces in the charging drive mode, and apply a second signal to the connecting trace and at least another line among the plurality of annular traces, and in the pen sensing drive mode, all of the plurality of annular traces may be electrically floating.

[0029] In an embodiment, the sensor driver may include a differential amplifier, and in the first mode, an inverting terminal of the differential amplifier may be electrically connected to the first sensing electrode and the second sensing electrode.

[0030] In an embodiment, the sensor driver may include a first differential amplifier, a second differential amplifier, a first analog-to-digital converter, and a second analog-to-digital converter, wherein in a first mode, the inverting terminal of the first differential amplifier may be electrically connected to the first sensing electrode, and the inverting terminal of the second differential amplifier may be electrically connected to the second sensing electrode, the first analog-to-digital converter may receive a signal from the first differential amplifier, and the second analog-to-digital converter may receive a signal from the second differential amplifier, and the sensor driver may sum data output from the first analog-to-digital converter and data output from the second analog-to-digital converter.

[0031] In an embodiment, in the first mode, the sensor driver may provide the same signal to the first sensing electrodes and the second sensing electrodes, and receive signals provided from the plurality of first electrode groups.

[0032] In an embodiment of the present inventive concept, an electronic device includes: a sensor layer; and a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing touch input and a second mode for sensing pen input. The sensor layer includes: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction and intersecting the plurality of first electrode groups, wherein each of the plurality of second electrode groups includes a first sensing electrode and a second sensing electrode, and a plurality of coupling capacitors are provided between the first sensing electrodes and the second sensing electrodes.

[0033] In an embodiment, the first sensing electrode may include a first separating electrode and a first interdigitated electrode electrically connected to the first separating electrode, the second sensing electrode may include a second separating electrode spaced apart from the first separating electrode in a first direction and a second interdigitated electrode electrically connected to the second separating electrode, and the plurality of coupling capacitors may include: a first coupling capacitor defined between the first separating electrode and the second interdigitated electrode; and a second coupling capacitor defined between the second separating electrode and the first interdigitated electrode.

[0034] In an embodiment, in the second mode, the sensor driver may be configured to receive a first signal from the first sensing electrode and to receive a second signal from the second sensing electrode.

[0035] In an embodiment of the present inventive concept, an electronic device includes: a sensor layer; and a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing touch input and a second mode for sensing pen input. The sensor layer includes: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction and intersecting the plurality of first electrode groups. Each of the plurality of second electrode groups includes a first separator electrode and a second separator electrode spaced apart from each other in the first direction. In the second mode, the sensor driver is configured to receive a first signal from the first separator electrode and a second signal from the second separator electrode.

[0036] In an embodiment, each of the plurality of second electrode groups may further include: a first interdigitated electrode electrically connected to the first separating electrode; and a second interdigitated electrode electrically connected to the second separating electrode, and at least a portion of the first interdigitated electrode may overlap with the second separating electrode, and at least a portion of the second interdigitated electrode may overlap with the first separating electrode. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other objects and features of the present disclosure will become apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings. In the accompanying drawings:

[0038] Figure 1Ais a perspective view of an electronic device according to an embodiment of the present inventive concept;

[0039] Figure 1B is a rear perspective view of an electronic device according to an embodiment of the present inventive concept;

[0040] Figure 2 is a perspective view of an electronic device according to an embodiment of the present inventive concept;

[0041] Figure 3 is a schematic cross-sectional view of a display panel according to an embodiment of the present inventive concept;

[0042] Figure 4 is a diagram illustrating an operation of an electronic device according to an embodiment of the present inventive concept;

[0043] Figure 5A is a diagram illustrating a pen according to an embodiment of the present inventive concept;

[0044] Figure 5B is a diagram illustrating a pen according to an embodiment of the present inventive concept;

[0045] Figure 5C is a diagram illustrating a pen according to an embodiment of the present inventive concept;

[0046] Figure 5D is a diagram illustrating an input device according to an embodiment of the present inventive concept;

[0047] Figure 6 is a cross-sectional view of a display panel according to an embodiment of the present inventive concept;

[0048] Figure 7 is a plan view of a sensor layer according to an embodiment of the present inventive concept;

[0049] Figure 8 is a diagram illustrating an operation of a sensor driver according to an embodiment of the present inventive concept;

[0050] Figure 9 is a diagram illustrating an operation of a sensor driver according to an embodiment of the present inventive concept;

[0051] Figure 10A is a diagram illustrating a portion of a sensor driver and one electrode group according to an embodiment of the present inventive concept;

[0052] Figure 10B is a diagram illustrating a portion of one electrode group according to an embodiment of the present inventive concept;

[0053] Figure 11 is an equivalent circuit diagram illustrating a relationship between one electrode group and a pen according to an embodiment of the present inventive concept;

[0054] Figure 12 is a graph showing the relationship between the magnitude of the current and the position of the pen relative to one channel;

[0055] Figure 13 is a graph showing the relationship between the amplitude of the output signal and the position of the pen relative to one channel;

[0056] Figure 14 is a diagram illustrating a portion of a sensor driver and four electrode groups according to an embodiment of the present inventive concept;

[0057] Figure 15 is a diagram illustrating a portion of a sensor driver and four electrode groups according to an embodiment of the present inventive concept;

[0058] Figure 16A is a graph showing currents sensed in a plurality of electrode groups;

[0059] Figure 16B is a graph showing currents obtained from differential pairs of a plurality of electrode groups;

[0060] Figure 17 is a diagram illustrating a portion of a sensor driver and four electrode groups according to an embodiment of the present inventive concept;

[0061] Figure 18 is a plan view illustrating a portion of a sensor layer according to an embodiment of the present inventive concept;

[0062] Figure 19 is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;

[0063] Figure 20A is a plan view illustrating a second conductive layer of a sensing unit according to an embodiment of the present inventive concept;

[0064] Figure 20B is a plan view illustrating a first conductive layer of a sensing unit according to an embodiment of the present inventive concept;

[0065] Figure 20C is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;

[0066] Figure 21 is a plan view illustrating a portion of a sensor layer according to an embodiment of the present inventive concept;

[0067] Figure 22 is a schematic diagram illustrating a channel according to an embodiment of the present inventive concept;

[0068] Figure 23is an equivalent circuit diagram illustrating a relationship between one channel and a pen according to an embodiment of the present inventive concept;

[0069] Figure 24A is a graph showing the relationship between the magnitude of the current and the position of the pen relative to one channel;

[0070] Figure 24B is a graph showing the relationship between the amplitude of a signal and the position of a pen relative to one channel;

[0071] Figure 25 is a plan view illustrating four sensing units according to an embodiment of the present inventive concept;

[0072] Figure 26A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept;

[0073] Figure 26B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept;

[0074] Figure 27 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the present inventive concept;

[0075] Figure 28 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the present inventive concept;

[0076] Figure 29 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the present inventive concept; and

[0077] Figure 30 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver according to an embodiment of the inventive concept. DETAILED DESCRIPTION

[0078] In this specification, it will be understood that when an element (or region, layer, portion, etc.) is referred to as being "on," "connected to" or "coupled to" another element, the element can be directly disposed on, directly connected to or directly coupled to the other element, or intervening elements may be disposed therebetween.

[0079] The same reference numerals or symbols refer to the same elements. The term "and / or" includes all of the one or more combinations that can be defined by the relevant elements. The singular form also includes the plural form unless the context clearly indicates otherwise.

[0080] The terms "part" and "unit" mean a software component or a hardware component for performing a specific function. A hardware component may include, for example, a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC). A software component may refer to executable code and / or data used by the executable code in an addressable storage medium. Thus, a software component may be, for example, an object-oriented software component, a class component, and a task component, and may include a process, a function, a property, a procedure, a subroutine, a program code segment, a driver, firmware, microcode, a circuit, data, a database, a data structure, a table, an array, or a variable.

[0081] Hereinafter, embodiments of the present inventive concept will be described with reference to the accompanying drawings.

[0082] Figure 1A is a perspective view of an electronic device 1000 according to an embodiment of the inventive concept. Figure 1B is a rear perspective view of an electronic device 1000 according to an embodiment of the inventive concept.

[0083] refer to Figure 1A and Figure 1B , the electronic device 1000 can be activated in response to an electrical signal. For example, the electronic device 1000 can display an image and sense an input applied from the outside. The external input can be an input from a user. The user's input can include various forms of external input such as a part of the user's body, a pen PN, light, heat, or pressure.

[0084] The electronic device 1000 may include a first display panel DP1 and a second display panel DP2. The first display panel DP1 and the second display panel DP2 may be separate panels. The first display panel DP1 may be referred to as a main display panel, and the second display panel DP2 may be referred to as an auxiliary display panel or an external display panel.

[0085] The first display panel DP1 may include a first display portion DA1-F, and the second display panel DP2 may include a second display portion DA2-F. The area of the second display panel DP2 may be smaller than that of the first display panel DP1. Corresponding to the sizes of the first and second display panels DP1 and DP2, the area of the first display portion DA1-F may be larger than that of the second display portion DA2-F.

[0086] In the unfolded state of the electronic device 1000, the first display portion DA1-F can be arranged in a plane substantially parallel to the first direction DR1 and the second direction DR2. The thickness direction of the electronic device 1000 can be parallel to a third direction DR3 that intersects the first direction DR1 and the second direction DR2. Therefore, the front surface (or upper surface) and the rear surface (or lower surface) of the components constituting the electronic device 1000 can be defined based on the third direction DR3.

[0087] The first display panel DP1 or the first display portion DA1-F may include a foldable and expandable folding area FA and a plurality of non-folding areas NFA1 and NFA2 spaced apart from each other, with the folding area FA located between the non-folding areas NFA1 and NFA2. The second display panel DP2 may overlap with any of the plurality of non-folding areas NFA1 and NFA2. For example, the second display panel DP2 may overlap with the first non-folding area NFA1.

[0088] The display direction of the first image IM1a displayed in a portion of the first display panel DP1 (e.g., the second non-folding area NFA2) and the display direction of the second image IM2a displayed in the second display panel DP2 may be opposite to each other. For example, the first image IM1a may be displayed in a third direction DR3, and the second image IM2a may be displayed in a fourth direction DR4 that is the opposite direction of the third direction DR3.

[0089] In an embodiment of the present inventive concept, the folding area FA can be bent relative to a folding axis extending in a direction parallel to the long side of the electronic device 1000 (e.g., a direction parallel to the second direction DR2). When the electronic device 1000 is folded, the folding area FA has a predetermined curvature and curvature radius. The electronic device 1000 can be folded inward so that the first non-folding area NFA1 and the second non-folding area NFA2 face each other and the first display portion DA1-F is not exposed to the outside.

[0090] In an embodiment of the present invention, the electronic device 1000 may be folded outward so that the first display portion DA1-F is exposed to the outside. In an embodiment of the present invention, the electronic device 1000 may be folded inward or outward in the unfolded state, but the embodiment of the present invention is not limited thereto.

[0091] Figure 1A Although one folding area FA is defined in the electronic device 1000 as an example, the embodiments of the present inventive concept are not limited thereto. For example, a plurality of folding axes and a plurality of folding areas corresponding to the folding axes may be defined in the electronic device 1000, and the electronic device 1000 may be folded inward or outward in each of the plurality of folding areas in the unfolded state.

[0092] According to an embodiment of the present inventive concept, at least one of the first display panel DP1 and the second display panel DP2 can sense input from the pen PN even without a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, the increase in thickness, weight, and flexibility of the electronic device 1000 caused by the addition of a digitizer can be avoided. Therefore, the second display panel DP2 as well as the first display panel DP1 can be designed to sense the pen PN.

[0093] Figure 2 is a perspective view of an electronic device 1000 - 1 according to an embodiment of the inventive concept.

[0094] Figure 2 It is exemplarily shown that the electronic device 1000 - 1 is a mobile phone, and the electronic device 1000 - 1 may include a display panel DP.

[0095] In an embodiment of the present invention, the display panel DP may sense an input applied from the outside. The external input may be a user's input. The user's input may include a part of the user's body, a pen PN (see Figure 1A ), various forms of external inputs such as light, heat or pressure.

[0096] According to an embodiment of the present inventive concept, the display panel DP can sense the input of the pen PN even without including a digitizer. Therefore, since the digitizer for sensing the pen PN can be omitted, the thickness and weight of the electronic device 1000-1 caused by adding the digitizer can be prevented from increasing.

[0097] Figure 1A A foldable electronic device 1000 is shown as an example, and Figure 2 A bar-shaped electronic device 1000-1 is exemplarily shown, but the embodiments of the present inventive concept described below are not limited thereto. For example, the description below can be applied to various electronic devices such as rollable electronic devices, slidable electronic devices, and stretchable electronic devices.

[0098] Figure 3 is a schematic cross-sectional view of a display panel DP according to an embodiment of the inventive concept.

[0099] refer to Figure 3 , the display panel DP may include a display layer 100 and a sensor layer 200 .

[0100] The display layer 100 may be a component that generates an image. The display layer 100 may be an emissive display layer, and for example, the display layer 100 may be an organic light-emitting display layer, an inorganic light-emitting display layer, an organic-inorganic light-emitting display layer, a quantum dot display layer, a micro-LED display layer, or a nano-LED display layer. The display layer 100 may include a base layer 110, a circuit layer 120, a light-emitting element layer 130, and an encapsulation layer 140.

[0101] The base layer 110 may be a member that provides a base surface on which the circuit layer 120 is disposed. The base layer 110 may have a multi-layer structure or a single-layer structure. The base layer 110 may be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, etc., but is not limited thereto.

[0102] The circuit layer 120 may be provided on the base layer 110. The circuit layer 120 may include at least one of an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer may be formed on the base layer 110 by coating, deposition, or the like, and the insulating layer, the semiconductor layer, and the conductive layer may be selectively patterned by performing a photolithography process multiple times.

[0103] The light emitting element layer 130 may be disposed on the circuit layer 120. The light emitting element layer 130 may include a light emitting element. For example, the light emitting element layer 130 may include an organic light emitting material, an inorganic light emitting material, an organic-inorganic light emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0104] The encapsulation layer 140 may be disposed on the light emitting element layer 130. The encapsulation layer 140 may protect the light emitting element layer 130 from moisture, oxygen, and foreign substances such as dust particles.

[0105] The sensor layer 200 may be provided on the display layer 100. The sensor layer 200 may sense external input applied from the outside. The sensor layer 200 may be an integrated sensor formed continuously in the manufacturing process for the display layer 100, or the sensor layer 200 may be an external sensor attached to the display layer 100. The sensor layer 200 may be referred to as a sensor, an input sensing layer, an input sensing panel, or an electronic device for sensing input coordinates.

[0106] According to an embodiment of the present inventive concept, the sensor layer 200 can sense both input from a passive input device such as a user's body and input from an input device that generates a magnetic field having a predetermined resonant frequency. The input device may be referred to as a pen, input pen, magnetic pen, stylus, or electromagnetic resonance pen.

[0107] Figure 4 is a diagram illustrating an operation of the electronic device 1000 according to an embodiment of the inventive concept.

[0108] refer to Figure 4 , the electronic device 1000 may include a display layer 100, a sensor layer 200, a display driver 100C (e.g., a first driver circuit), a sensor driver 200C (e.g., a second driver circuit), a main driver 1000C (e.g., a third driver circuit) and a power circuit 1000P.

[0109] The sensor layer 200 can sense a first input 2000 or a second input 3000 applied from the outside. Each of the first input 2000 and the second input 3000 can be from an input device capable of providing a change in capacitance of the sensor layer 200 or an input device capable of inducing an induced current in the sensor layer 200. For example, the first input 2000 can be from a passive input device such as the user's body. The second input 3000 can be an input from a pen PN or an input from a radio frequency identification (RFIC) tag. For example, the pen PN can be a passive pen or an active pen.

[0110] In an embodiment of the present inventive concept, the pen PN may be a device that generates a magnetic field having a predetermined resonant frequency. The pen PN may be configured to transmit an output signal based on an electromagnetic resonance method. The pen PN may be referred to as an input device, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0111] The pen PN may include an RLC resonant circuit, and the RLC resonant circuit may include an inductor L and a capacitor C. In an embodiment of the present invention, the RLC resonant circuit may be a variable resonant circuit that changes the resonant frequency. In this case, the inductor L may be a variable inductor and / or the capacitor C may be a variable capacitor, but the embodiments of the present invention are not limited thereto.

[0112] The inductor L generates a current due to the magnetic field formed in the sensor layer 200. However, the embodiments of the present invention are not particularly limited thereto. For example, if the pen PN operates as an active type, the pen PN can generate a current even if the pen PN is not provided with a magnetic field from the outside. The generated current is transmitted to the capacitor C. The capacitor C is charged with the current input from the inductor L and discharges the charged current to the inductor L. Then, the inductor L can emit a magnetic field having a resonant frequency. The induced current can flow in the sensor layer 200 due to the magnetic field emitted by the pen PN, and the induced current can be transmitted to the sensor driver 200C as a received signal (or sensed signal).

[0113] The main driver 1000C can control the overall operation of the electronic device 1000. For example, the main driver 1000C can control the operation of the display driver 100C and the sensor driver 200C. The main driver 1000C may include at least one microprocessor and may also include a graphics controller. The main driver 1000C may be an application processor, a central processing unit, or a main processor.

[0114] The display driver 100C can drive the display layer 100. The display driver 100C can receive image data and control signals from the main driver 1000C. The control signals may include various signals. For example, the control signals may include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock signal (e.g., a clock signal), and a data enable signal.

[0115] The sensor driver 200C can drive the sensor layer 200. The sensor driver 200C can receive a control signal from the main driver 1000C. The control signal may include a clock signal for the sensor driver 200C. In addition, the control signal may also include a mode determination signal that determines the driving mode of the sensor driver 200C and the sensor layer 200.

[0116] The sensor driver 200C may be implemented as an integrated circuit (IC) and electrically connected to the sensor layer 200. For example, the sensor driver 200C may be directly mounted in a predetermined area of the display panel, or mounted on a separate printed circuit board using a chip on film (COF) method and electrically connected to the sensor layer 200.

[0117] The sensor driver 200C and the sensor layer 200 can selectively operate in a first mode or a second mode. For example, the first mode can be a mode for sensing touch input (e.g., first input 2000). The second mode can be a mode for sensing input from a pen PN (e.g., second input 3000). The first mode can be referred to as a touch sensing mode, and the second mode can be referred to as a pen sensing mode.

[0118] The switching between the first mode and the second mode can be performed in various ways. For example, the sensor driver 200C and the sensor layer 200 can be driven in the first mode and the second mode in a time-division manner, and sense the first input 2000 and the second input 3000. Alternatively, the switching between the first mode and the second mode can be caused by the user's selection or a specific action of the user, or either of the first mode and the second mode can be activated or deactivated by the activation or deactivation of a specific application or can be switched to another mode. Alternatively, when the sensor driver 200C and the sensor layer 200 operate alternately in the first mode and the second mode, when the first input 2000 is sensed, the first mode can be maintained, or when the second input 3000 is sensed, the second mode can be maintained.

[0119] The sensor driver 200C can calculate the input coordinate information based on the signal received from the sensor layer 200 and provide a coordinate signal containing the coordinate information to the main driver 1000C. The main driver 1000C performs an operation corresponding to the user's input based on the coordinate signal. For example, the main driver 1000C can operate the display driver 100C so that a new application image is displayed on the display layer 100.

[0120] The power circuit 1000P may include a power management integrated circuit (PMIC). The power circuit 1000P may generate a plurality of driving voltages for driving the display layer 100, the sensor layer 200, the display driver 100C, and the sensor driver 200C. For example, the plurality of driving voltages may include a gate high voltage, a gate low voltage, a first driving voltage, a second driving voltage, an initialization voltage, etc., but the embodiment is not limited thereto.

[0121] Figure 5A is a diagram illustrating a pen PN according to an embodiment of the inventive concept.

[0122] refer to Figure 4 and Figure 5A The pen PN may include a housing PN-H, a pen tip PN-T, an inductor L, a capacitor C, a resistor R, an elastomer PN-ED, a pressure capacitor CP, a switch SW-B, and a button capacitor CB. The pen PN may not include active components such as a power supply, a transistor, or a diode, except for the switch SW-B connected to the button capacitor CB. The components included in the pen PN are not limited to those described above. At least some of the components described above may be omitted, and other components may be added.

[0123] In an embodiment of the present inventive concept, the pen tip PN-T may include a non-conductive material. The pen tip PN-T may have a structure protruding from the outside of the housing PN-H. The pen tip PN-T may be detachably coupled to the housing PN-H and may be a replaceable component.

[0124] In an embodiment of the present invention, the resistor R, inductor L, and capacitor C of the RLC resonant circuit can be connected in series. Therefore, the pen PN can have a resonant frequency and a selective structure that exhibit the characteristics of an RLC resonant circuit. In this case, the frequency of the signal provided to the sensor layer 200 when the sensor layer 200 is charged and driven can correspond to the resonant frequency of the pen PN. The capacitor C, the pressure capacitor CP, and the button capacitor CB can be connected in parallel. For reference, when the switch SW-B is turned on, the button capacitor CB can be connected in parallel to the capacitor C.

[0125] In an embodiment of the present inventive concept, the button capacitor CB can be electrically connected to or separated from the capacitor C, depending on whether the switch SW-B is turned on or off. That is, the pen PN can be configured to react to a different resonant frequency by turning the switch SW-B on or off. For example, the button can be provided on the outer peripheral surface of the housing PN-H. When the button is pressed, the switch SW-B can be turned on, and the button capacitor CB can be electrically connected to the capacitor C, thereby increasing the total capacitance of the pen PN.

[0126] In an embodiment of the present inventive concept, the capacitor C may be provided by cutting portions of a plurality of capacitors connected in parallel. For example, in order to achieve a target resonant frequency in a process of manufacturing a pen PN, portions of a plurality of capacitors may be cut so that the capacitor C of the pen PN can be tuned.

[0127] In an embodiment of the present invention, when a portion of the pen tip PN-T is inserted into the housing PN-H due to pen pressure, the area size, distance, or both of the area size and distance that form the capacitance of the pressure capacitor CP can be changed. Thus, the capacitance of the pressure capacitor CP can be changed. For example, when pen pressure is applied to the pen PN, the capacitance of the pressure capacitor CP can increase, and the resonant frequency of the pen PN can be reduced based on the increased capacitance. Then, when the pen pressure disappears, the capacitance of the pressure capacitor CP can be restored by the elastic body PN-ED having elastic properties.

[0128] Figure 5B is a diagram illustrating a pen PN-1 according to an embodiment of the present invention. For example, Figure 4 The pen PN can be Figure 5B This is achieved with the PN-1 pen.

[0129] In reference Figure 5BWhen describing, refer to Figure 5A The described components will be denoted by the same reference numerals or symbols, and description thereof will be omitted.

[0130] refer to Figure 4 and Figure 5B ,and Figure 5A Compared to the pen PN shown in FIG, the pen PN-1 may further include a power unit PN-BT and a control unit PN-IC. The power unit PN-BT may include a battery or a high-capacitance capacitor. The control unit PN-IC may be supplied with power from the power unit PN-BT and may adjust the frequency of the signal output from the pen PN-1.

[0131] According to an embodiment of the present invention, since the pen PN-1 can include an RLC resonant circuit, a power unit PN-BT, and a control unit PN-IC, the pen PN-1 can operate in both an active and passive mode. Therefore, even if no magnetic field is provided from the sensor layer 200, the pen PN-1 can emit a magnetic field. Therefore, the sensor layer 200 can sense input from the pen PN-1 outputting a magnetic field without a charging mode in which a magnetic field is formed.

[0132] Figure 5C : is a diagram showing a pen PN-2 according to an embodiment of the present invention. For example, Figure 4 The pen PN can be Figure 5C This is achieved with the PN-2 pen.

[0133] refer to Figure 4 and Figure 5C , the pen PN-2 does not include an RLC resonant circuit. For example, the pen PN-2 may include a housing PN-H, a pen tip PN-T, an inductor L, a power unit PN-BT, and a control unit PN-IC (e.g., a control circuit). The power unit PN-BT may include a battery or a high-capacitance capacitor. The control unit PN-IC may be supplied with power from the power unit PN-BT and may adjust the frequency of a signal output from the pen PN-2.

[0134] According to an embodiment of the present inventive concept, the pen PN- 2 may operate as an active type. Therefore, even if no magnetic field is provided from the sensor layer 200 , the pen PN- 2 may emit a magnetic field.

[0135] Figure 5D is a diagram illustrating an input device TAG according to an embodiment of the inventive concept.

[0136] refer to Figure 4 and Figure 5DThe sensor layer 200 can sense input from an input device TAG. The input device TAG can be an electronic tag, a smart tag, or an electronic sign. The input device TAG can include a controller TAG-IC (e.g., a controller circuit) and an antenna TAG-CI connected to the controller TAG-IC. The antenna TAG-CI can emit radio waves with a unique code. The sensor layer 200 can detect the code of the input device TAG.

[0137] Figure 6 is a cross-sectional view of a display panel DP according to an embodiment of the inventive concept. Figure 6 It can be shown Figure 3 An embodiment of the display panel DP shown in FIG.

[0138] refer to Figure 6 At least one buffer layer (BFL) is formed on the upper surface of the base layer 110. The buffer layer (BFL) can increase the bonding strength between the base layer 110 and the semiconductor pattern. The buffer layer (BFL) can be formed of multiple layers. Alternatively, the display layer 100 can further include a barrier layer. The buffer layer (BFL) can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer (BFL) can have a structure in which silicon oxide layers and silicon nitride layers are alternately stacked.

[0139] A semiconductor pattern including a source region SC, an active region AL, a drain region DR, and a connection signal line SCL may be disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, embodiments of the present inventive concept are not limited thereto, and the semiconductor pattern may include amorphous silicon, low-temperature polysilicon, or an oxide semiconductor.

[0140] Figure 6 A portion of the semiconductor pattern is shown, but other semiconductor patterns may also be provided in another region. The semiconductor pattern may be arranged across pixels according to specific rules. The semiconductor pattern may have different electrical characteristics depending on whether the semiconductor pattern is doped. The semiconductor pattern may include a first region having high conductivity including a source region SC, a drain region DR, and a connection signal line SCL, and a second region having low conductivity including an active region AL. The first region may be doped with an N-type dopant or a P-type dopant. The display panel DP may include a transistor 100PC. A P-type transistor may include a doped region doped with a P-type dopant, and an N-type transistor may include a doped region doped with an N-type dopant. For example, the transistor 100PC may be a P-type transistor or an N-type transistor. The second region may be an undoped region or a region doped at a lower concentration than the first region.

[0141] The first region may have a higher conductivity than the second region and may be substantially used as an electrode or signal line. The second region may substantially correspond to the active region AL (or channel) of the transistor 100PC. In other words, a portion of the semiconductor pattern may be the active region AL of the transistor 100PC, another portion of the semiconductor pattern may be the source region SC or the drain region DR of the transistor 100PC, and yet another portion of the semiconductor pattern may be a connection electrode or a connection signal line SCL.

[0142] Each of the pixels may have an equivalent circuit including seven transistors, one capacitor, and one light emitting element, and the equivalent circuit diagram of the pixel may be changed in various forms. Figure 6 One transistor 100PC and one light emitting element 100PE included in a pixel are exemplarily shown.

[0143] The source region SC, the active region AL, and the drain region DR of the transistor 100PC may be formed of a semiconductor pattern. The source region SC and the drain region DR may extend from the active region AL in opposite directions in a cross-sectional view. Figure 6 A portion of a connection signal line SCL formed of a semiconductor pattern is shown. The connection signal line SCL may be connected to the drain region DR of the transistor 100PC in a plan view.

[0144] The first insulating layer 10 may be provided on the buffer layer BFL. The first insulating layer 10 may overlap with a plurality of pixels in common and cover the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In this embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. The insulating layers other than the first insulating layer 10 of the circuit layer 120 to be described later may also be inorganic layers and / or organic layers and may have a single-layer structure or a multi-layer structure. The inorganic layer may include at least one of the materials described above, but the embodiments of the present invention are not limited thereto.

[0145] The gate GT of the transistor 100PC is disposed on the first insulating layer 10. The gate GT may be part of a metal pattern. The gate GT overlaps with the active area AL. The gate GT may be used as a mask in the process of doping or reducing the semiconductor pattern.

[0146] The second insulating layer 20 may be provided on the first insulating layer 10 and cover the gate electrode GT. The second insulating layer 20 may overlap with the pixel in common. The second insulating layer 20 may be an inorganic layer and / or an organic layer and may have a single-layer structure or a multi-layer structure. The second insulating layer 20 may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In this embodiment, the second insulating layer 20 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0147] The third insulating layer 30 may be provided on the second insulating layer 20. The third insulating layer 30 may have a single layer structure or a multi-layer structure. For example, the third insulating layer 30 may have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0148] The first connection electrode CNE1 may be disposed on the third insulating layer 30. The first connection electrode CNE1 may be connected to the connection signal line SCL via a contact hole CNT-1 passing through the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0149] The fourth insulating layer 40 may be disposed on the third insulating layer 30. The fourth insulating layer 40 may be a single-layer silicon oxide layer. The fifth insulating layer 50 may be disposed on the fourth insulating layer 40. The fifth insulating layer 50 may be an organic layer.

[0150] The second connection electrode CNE2 may be disposed on the fifth insulating layer 50. The second connection electrode CNE2 may be connected to the first connection electrode CNE1 via a contact hole CNT-2 passing through the fourth insulating layer 40 and the fifth insulating layer 50.

[0151] The sixth insulating layer 60 may be disposed on the fifth insulating layer 50 and cover the second connection electrode CNE2. The sixth insulating layer 60 may be an organic layer.

[0152] The light-emitting element layer 130 may be disposed on the circuit layer 120. The light-emitting element layer 130 may include a light-emitting element 100PE. For example, the light-emitting element layer 130 may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, the light-emitting element 100PE will be described as an organic light-emitting element as an example, but embodiments of the present inventive concept are not limited thereto.

[0153] The light emitting element 100PE may include a first electrode AE, an emission layer EL, and a second electrode CE.

[0154] The first electrode AE may be disposed on the sixth insulating layer 60. The first electrode AE may be connected to the second connection electrode CNE2 via a contact hole CNT-3 passing through the sixth insulating layer 60.

[0155] The pixel defining film 70 may be disposed on the sixth insulating layer 60 and cover a portion of the first electrode AE. An opening 70-OP is defined in the pixel defining film 70. The opening 70-OP of the pixel defining film 70 exposes at least a portion of the first electrode AE.

[0156] The first display part DA1-F (see Figure 1A ) may include a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-light emitting region NPXA may surround the light emitting region PXA. In this embodiment, the light emitting region PXA is defined to correspond to a portion of the first electrode AE exposed by the opening 70-OP.

[0157] The emission layer EL may be disposed on the first electrode AE. The emission layer EL may be disposed in a region corresponding to the opening 70-OP. That is, the emission layer EL may be formed separately in each of the pixels. If the emission layer EL is formed separately in each of the pixels, each emission layer EL may emit at least one of blue light, red light, and green light. However, embodiments of the present invention are not limited thereto, and the emission layer EL may be connected to the pixels and commonly included in the pixels. In this case, the emission layer EL may provide blue light or may provide white light.

[0158] The second electrode CE may be disposed on the emission layer EL. The second electrode CE may have an integral shape and may be commonly included in a plurality of pixels.

[0159] In an embodiment of the present invention, a hole control layer may be provided between the first electrode AE and the emission layer EL. The hole control layer may be provided in common in the emission region PXA and the non-emission region NPXA. The hole control layer may include a hole transport layer and may also include a hole injection layer. An electron control layer may be provided between the emission layer EL and the second electrode CE. The electron control layer may include an electron transport layer and may also include an electron injection layer. The hole control layer and the electron control layer may be formed in common in multiple pixels using an open mask or an inkjet process.

[0160] The encapsulation layer 140 may be provided on the light-emitting element layer 130. The encapsulation layer 140 may include an inorganic layer, an organic layer, and an inorganic layer stacked sequentially, but the layers included in the encapsulation layer 140 are not limited thereto. The inorganic layer may protect the light-emitting element layer 130 from moisture and oxygen, and the organic layer may protect the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include an acrylic organic layer, but is not limited thereto.

[0161] The sensor layer 200 may include a base layer 201 , a first conductive layer 202 , an intermediate insulating layer 203 , a second conductive layer 204 , and a cover insulating layer 205 .

[0162] The base layer 201 may be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 may be an organic layer including epoxy resin, acrylic resin, or imide-based resin. The base layer 201 may have a single-layer structure or a multi-layer structure in which layers are stacked along the third direction DR3.

[0163] Each of the first conductive layer 202 and the second conductive layer 204 may have a single-layer structure or a multi-layer structure in which layers are stacked along the third direction DR3 .

[0164] The first conductive layer 202 and the second conductive layer 204, each having a single-layer structure, may each include a metal layer or a transparent conductive layer. The metal layer may include molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The transparent conductive layer may include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition, the transparent conductive layer may include a conductive polymer such as poly(3,4-ethylenedioxythiophene) (PEDOT), metal nanowires, or graphene.

[0165] The first conductive layer 202 and the second conductive layer 204, each having a multi-layer structure, may each include a metal layer. For example, the metal layer may have a three-layer structure of titanium / aluminum / titanium. The multi-layer conductive layer may include at least one metal layer and at least one transparent conductive layer.

[0166] In an embodiment of the present inventive concept, the thickness of the first conductive layer 202 is greater than or equal to the thickness of the second conductive layer 204. If the thickness of the first conductive layer 202 is greater than the thickness of the second conductive layer 204, the resistance of the components included in the first conductive layer 202 can be reduced. In addition, even if the thickness of the first conductive layer 202 increases, since the first conductive layer 202 can be disposed lower than the second conductive layer 204, the possibility of the pattern of the first conductive layer 202 being viewed due to external light reflection can be lower than the possibility of the pattern of the second conductive layer 204 being viewed.

[0167] In an embodiment of the present invention, the width of the first mesh lines included in the first conductive layer 202 is less than or equal to the width of the second mesh lines included in the second conductive layer 204. Figure 1A ), since the first mesh lines may have a smaller width than the second mesh lines, the probability that the first mesh lines will be viewed by the user may be reduced.

[0168] At least one of the intermediate insulating layer 203 and the capping insulating layer 205 may include an inorganic film. The inorganic film may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0169] At least one of the intermediate insulating layer 203 and the cover insulating layer 205 may include an organic film. The organic film may include at least one of acrylic resin, methacrylic acid-based resin, polyisoprene-based resin, ethylene-based resin, epoxy-based resin, polyurethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin.

[0170] As an example, the sensor layer 200 is described above as including the first conductive layer 202 and the second conductive layer 204, ie, two conductive layers in total, but embodiments of the present inventive concept are not particularly limited thereto. For example, the sensor layer 200 may include three or more conductive layers.

[0171] Figure 7 is a plan view of a sensor layer 200 according to an embodiment of the present inventive concept. Figure 7 The sensor layer 200 can be connected with Figure 6 Corresponding to the sensor layer 200.

[0172] refer to Figure 7 , a sensing region 200A and a peripheral region 200NA adjacent to the sensing region 200A may be defined in the sensor layer 200 .

[0173] The sensor layer 200 may include a plurality of first electrode groups 210G and a plurality of second electrode groups 220G disposed in the sensing region 200A. Each of the first electrode groups 210G may intersect with the second electrode groups 220G. Each of the first electrode groups 210G may extend along the second direction DR2, and the first electrode groups 210G may be arranged to be spaced apart from each other in the first direction DR1. Each of the second electrode groups 220G may extend along the first direction DR1, and the second electrode groups 220G may be arranged to be spaced apart from each other in the second direction DR2.

[0174] Figure 7 Six first electrode groups 210G and ten second electrode groups 220G are exemplarily shown, but the number of the first electrode groups 210G and the number of the second electrode groups 220G are not limited thereto.

[0175] The sensor layer 200 may further include a plurality of first traces 210 t and a plurality of second traces 220 t disposed in the peripheral area 200NA.

[0176] In an embodiment of the present inventive concept, the first traces 210t can be electrically connected to the first electrode group 210G in a one-to-one correspondence. That is, one first trace 210t can be electrically connected to one first electrode group 210G. In an embodiment of the present inventive concept, the second traces 220t can be electrically connected to the second electrode group 220G in a two-to-one correspondence. That is, two second traces 220t1 and 220t2 can be electrically connected to one second electrode group 220G. One of the second traces 220t1 and 220t2 can be referred to as a first intersecting trace 220t1, and the other can be referred to as a second intersecting trace 220t2. Since the second traces 220t can be electrically connected to the second electrode group 220G in a two-to-one correspondence, the number of second traces 220t can be twice the number of second electrode groups 220G.

[0177] Figure 8 FIG. 2 is a diagram showing a sensor driver 200C according to an embodiment of the present inventive concept (see FIG. Figure 4 ) operation.

[0178] refer to Figure 4 and Figure 8 , the sensor driver 200C may be configured to be selectively driven in any one of the first operation mode DMD1 , the second operation mode DMD2 , and the third operation mode DMD3 .

[0179] The first operating mode DMD1 may be referred to as a touch and pen standby mode, the second operating mode DMD2 may be referred to as a touch-activated and pen standby mode, and the third operating mode DMD3 may be referred to as a pen-activated mode. The first operating mode DMD1 may be a mode for waiting for the first input 2000 and the second input 3000. The second operating mode DMD2 may be a mode for sensing the first input 2000 and waiting for the second input 3000. The third operating mode DMD3 may be a mode for sensing the second input 3000.

[0180] In an embodiment of the present inventive concept, the sensor driver 200C may be first driven in the first operating mode DMD1. When a first input 2000 is sensed in the first operating mode DMD1, the sensor driver 200C may be switched (or changed) to the second operating mode DMD2. Alternatively, when a second input 3000 is sensed in the first operating mode DMD1, the sensor driver 200C may be switched (or changed) to the third operating mode DMD3.

[0181] In an embodiment of the present inventive concept, when the second input 3000 is sensed in the second operating mode DMD2, the sensor driver 200C may be switched to the third operating mode DMD3. When the first input 2000 is released (or not sensed) in the second operating mode DMD2, the sensor driver 200C may be switched to the first operating mode DMD1. When the second input 3000 is released (or not sensed) in the third operating mode DMD3, the sensor driver 200C may be switched to the first operating mode DMD1.

[0182] Figure 9 FIG. 2 is a diagram showing a sensor driver 200C according to an embodiment of the present inventive concept (see FIG. Figure 4 ) operation.

[0183] refer to Figure 4 、 Figure 8 and Figure 9 , exemplarily showing operations in the first operation mode DMD1 , the second operation mode DMD2 , and the third operation mode DMD3 in sequence of time t.

[0184] In the first operating mode DMD1, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1-d. During the second mode MD2-d, the sensor layer 200 may be scan-driven to detect the second input 3000. During the first mode MD1-d, the sensor layer 200 may be scan-driven to detect the first input 2000. Figure 9 It is exemplarily shown that the sensor driver 200C is driven in the second mode MD2 - d and then continuously driven in the first mode MD1 - d , but the driving order is not limited thereto.

[0185] In the second operating mode DMD2, the sensor driver 200C may be repeatedly driven in the second mode MD2-d and the first mode MD1. During the second mode MD2-d, the sensor layer 200 may be scan-driven to detect the second input 3000. During the first mode MD1, the sensor layer 200 may be scan-driven to detect coordinates based on the first input 2000.

[0186] In the third operating mode DMD3, the sensor driver 200C may be driven in the second mode MD2. During the second mode MD2, the sensor layer 200 may be scan-driven to detect coordinates based on the second input 3000. In the third operating mode DMD3, the sensor driver 200C does not operate in the first mode MD1-d or MD1 until the second input 3000 is released (or not sensed).

[0187] Figure 10A1 is a diagram showing a portion of a sensor driver 200C and one electrode group according to an embodiment of the present inventive concept. For example, Figure 10A One electrode group of the sensor layer 200 may be shown. Figure 10B is a diagram illustrating a portion of one electrode group according to an embodiment of the present inventive concept.

[0188] refer to Figure 7 、 Figure 9 、 Figure 10A and Figure 10B , the plurality of second electrode groups 220G may have substantially the same structure. Figure 10A and Figure 10B A second electrode set 220G is depicted.

[0189] The second electrode group 220G may include a first sensing electrode 220e1 and a second sensing electrode 220e2. The first sensing electrode 220e1 may include a first separator electrode 220de1 and a first interdigitated electrode 220ce1, and the second sensing electrode 220e2 may include a second separator electrode 220de2 and a second interdigitated electrode 220ce2. The first separator electrode 220de1 and the second separator electrode 220de2 may be referred to as a first sub-electrode and a second sub-electrode, or a first electrode and a second electrode. The first interdigitated electrode 220ce1 and the second interdigitated electrode 220ce2 may be referred to as a third sub-electrode and a fourth sub-electrode, or a third electrode and a fourth electrode.

[0190] The first separation electrode 220de1 may extend in the first direction DR1. The second separation electrode 220de2 may extend in the first direction DR1. The first separation electrode 220de1 and the second separation electrode 220de2 may be disposed to be spaced apart from each other in the first direction DR1.

[0191] The first interdigitated electrode 220ce1 can be connected to the first separator electrode 220de1. In an embodiment, a portion of the first interdigitated electrode 220ce1 overlaps with the first separator electrode 220de1 and can be connected to the first separator electrode 220de1. In an embodiment, another portion of the first interdigitated electrode 220ce1 overlaps with the second separator electrode 220de2. The second interdigitated electrode 220ce2 can be connected to the second separator electrode 220de2. In an embodiment, a portion of the second interdigitated electrode 220ce2 overlaps with the second separator electrode 220de2 and can be connected to the second separator electrode 220de2. In an embodiment, another portion of the second interdigitated electrode 220ce2 overlaps with the first separator electrode 220de1.

[0192] Coupling capacitors Cc1 and Cc2 may be defined in the first sensing electrode 220e1 and the second sensing electrode 220e2. One or more first coupling capacitors Cc1 may be defined between the first separation electrode 220de1 and the second intersecting electrode 220ce2. One or more second coupling capacitors Cc2 may be defined between the second separation electrode 220de2 and the first intersecting electrode 220ce1. Figure 10B It is exemplarily shown that two first coupling capacitors Cc1 are defined between the first separation electrode 220de1 and the second intersection electrode 220ce2 , and two second coupling capacitors Cc2 are defined between the second separation electrode 220de2 and the first intersection electrode 220ce1 , but the embodiment is not limited thereto.

[0193] In an embodiment of the present inventive concept, the first separator electrode 220de1 and the second separator electrode 220de2 are disposed on the same layer (e.g., the first layer) or height (e.g., the first height), and the first interdigitated electrode 220ce1 and the second interdigitated electrode 220ce2 are disposed on the same layer (e.g., the second layer) or height (e.g., the second height). The first separator electrode 220de1 and the second separator electrode 220de2 may be disposed on a layer different from the layer on which the first interdigitated electrode 220ce1 and the second interdigitated electrode 220ce2 are disposed. For example, the first conductive layer 202 (see Figure 6 ) may include a first cross electrode 220ce1 and a second cross electrode 220ce2, and the second conductive layer 204 (see Figure 6 ) may include a first separation electrode 220de1 and a second separation electrode 220de2. In this case, the first separation electrode 220de1 and the first crossing electrode 220ce1 may be formed on the intermediate insulating layer 203 (see Figure 6 ) are electrically connected to each other, and the second separation electrode 220de2 and the second cross electrode 220ce2 can be formed through the through holes in the intermediate insulating layer 203 (see Figure 6 ) are electrically connected to each other.

[0194] In an embodiment, the length of the first intersecting electrode 220ce1 in the first direction DR1 is smaller than the length of the second separating electrode 220de2 in the first direction DR1. In an embodiment, the length of the second intersecting electrode 220ce2 in the first direction DR1 is smaller than the length of the first separating electrode 220de1 in the first direction DR1.

[0195] In an embodiment, the maximum width of the first intersecting electrode 220ce1 in the second direction DR2 is smaller than the maximum width of the second separating electrode 220de2 in the second direction DR2. In an embodiment, the maximum width of the second intersecting electrode 220ce2 in the second direction DR2 is smaller than the maximum width of the first separating electrode 220de1 in the second direction DR2.

[0196] The first intersecting trace 220t1 can be electrically connected to the first separating electrode 220de1, and the second intersecting trace 220t2 can be electrically connected to the second separating electrode 220de2. For example, the first intersecting trace 220t1 can be directly connected to one of the two ends of the first separating electrode 220de1, which end is spaced further from the second separating electrode 220de2. The second intersecting trace 220t2 can be directly connected to one of the two ends of the second separating electrode 220de2, which end is spaced further from the first separating electrode 220de1.

[0197] The second mode MD2-d or the second mode MD2 may include a pen sensing driving mode. In the pen sensing driving mode, the sensor layer 200 and the sensor driver 200C may sense an induced current generated by a magnetic field emitted from the pen PN. In the pen sensing driving mode, the sensor driver 200C may be configured to receive a first signal SG1 from the first separator electrode 220de1 and a second signal SG2 from the second separator electrode 220de2.

[0198] The sensor driver 200C may include a differential amplifier DAP. An inverting terminal of the differential amplifier DAP may be electrically connected to the first partition electrode 220de1, and a non-inverting terminal of the differential amplifier DAP may be electrically connected to the second partition electrode 220de2. The differential amplifier DAP may amplify a signal proportional to the difference between the first signal SG1 and the second signal SG2 to output an output signal Sout.

[0199] When the same noise is included in the first signal SG1 and the second signal SG2, the noise can be removed by the differential amplifier DAP. In an embodiment, the direction of the current of the first signal SG1 and the direction of the current of the second signal SG2 can be opposite to each other. Therefore, when the first signal SG1 and the second signal SG2 are differentiated, the amplitude of the composite signal can be increased. Therefore, the signal-to-noise ratio can be increased, thereby providing a sensor driver 200C and an electronic device 1000 with increased sensing sensitivity (see Figure 1A ).

[0200] Figure 11 is an equivalent circuit diagram illustrating a relationship between one electrode group and a pen PN according to an embodiment of the inventive concept. Figure 12is a graph showing the relationship between the magnitude of the current and the position of the pen relative to one channel. Figure 13 is a graph showing the relationship between the amplitude of the output signal and the position of the pen relative to one channel.

[0201] refer to Figures 10A to 11 , the first sensing electrode 220e1 may be electrically connected to the sensor driver 200C through the first node ND1, and the second sensing electrode 220e2 may be electrically connected to the sensor driver 200C through the fourth node ND4. The first node ND1 may be a left node of the first separation electrode 220de1, and the fourth node ND4 may be a right node of the second separation electrode 220de2.

[0202] Figure 11 In the exemplary embodiment, six first basic capacitors Cb11 and Cb12 are defined in first sensing electrode 220e1, and six second basic capacitors Cb21 and Cb22 are defined in second sensing electrode 220e2. The number of first basic capacitors Cb11 and Cb12 may correspond to the number of sensing patterns included in first sensing electrode 220e1, and the number of second basic capacitors Cb21 and Cb22 may correspond to the number of sensing patterns included in second sensing electrode 220e2. The sensing patterns included in first sensing electrode 220e1 and the sensing patterns included in second sensing electrode 220e2 will be described later.

[0203] If the pen PN approaches the first sensing electrode 220e1 and the second sensing electrode 220e2, an electromotive force v(t) may be induced in each of the first sensing electrode 220e1 and the second sensing electrode 220e2 due to a magnetic field generated from the pen PN. Figure 11 It is shown as an example that the same induced electromotive force v(t) is generated in each of the first sensing electrode 220e1 and the second sensing electrode 220e2, but different induced electromotive forces v(t) may be generated.

[0204] Due to the induced electromotive force v(t), a first induced current Ia, a second induced current Ib, and a third induced current Ic may be generated in the first sensing electrode 220e1 and the second sensing electrode 220e2. The first signal SG1 may correspond to the sum of the first induced current Ia and the second induced current Ib, and the second signal SG2 may correspond to the negative value of the sum of the second induced current Ib and the third induced current Ic.

[0205] For example, assume that the capacitance of each of the first base capacitors Cb11 and Cb12 and the capacitance of each of the second base capacitors Cb21 and Cb22 are Cb, and assume that the capacitance of each of the first coupling capacitors Cc1 and the capacitance of each of the second coupling capacitors Cc2 are Cc.

[0206] The first node ND1 and the fourth node ND4 connected to the sensor driver 200C may be grounded. Furthermore, the voltage of the second node ND2 corresponding to the right end of the first partition electrode 220de1 may be -v(t), and the voltage of the third node ND3 corresponding to the left end of the second partition electrode 220de2 may be v(t). Therefore, since the voltages across the first and second base capacitors Cb11 and Cb22 may be grounded, current should not flow.

[0207] The first induced current Ia according to time can be expressed according to Equation 1.

[0208]

[0209] The second induced current Ib according to time can be expressed according to Equation 2.

[0210]

[0211] The third induction current Ic according to time can be expressed according to Equation 3.

[0212]

[0213] Here, dv(t) / dt represents the rate of change of voltage with respect to time, v(t) is the voltage as a function of time, and -v(t) represents the same signal as v(t) but with opposite polarity.

[0214] The first signal SG1 may correspond to Ia(t)+Ib(t)+noise, and the second signal SG2 may correspond to -Ib(t)-Ic(t)+noise.

[0215] refer to Figure 11 、 Figure 12 and Figure 13 When the position of the pen PN moves from the first node ND1 toward the second node ND2, the first sensing current Ia may gradually decrease. When the position of the pen PN moves from the fourth node ND4 toward the third node ND3, the third sensing current Ic may gradually decrease.

[0216] When the pen PN is located near the first node ND1 or the fourth node ND4 (or, near the first intersection trace 220t1 or the second intersection trace 220t2), the voltage across the first coupling capacitor Cc1 or the second coupling capacitor Cc2 can be v(t). When the pen PN is located near the second node ND2 or the third node ND3 (or, near the first intersection electrode 220ce1 or the second intersection electrode 220ce2), the voltage across the first coupling capacitor Cc1 or the second coupling capacitor Cc2 can be 2v(t). Therefore, when the pen PN is located near the second node ND2 or the third node ND3, the second induced current Ib can have a larger value than when the pen PN is located near the first node ND1 or the fourth node ND4. Therefore, even when the pen PN is located in the first separation electrode 220de1 away from the first intersection trace 220t1, an increased second induced current Ib can be generated by the coupling capacitors Cc1 and Cc2. Even when the pen PN is positioned away from the second intersecting trace 220t2 in the second partition electrode 220de2, the coupling capacitors Cc1 and Cc2 can generate an additional increased second induced current Ib. Therefore, in the present embodiment in which the coupling capacitors Cc1 and Cc2 are defined, a relatively increased total induced current can be generated even when the pen PN is positioned away from the second trace 220t, compared to a case in which the coupling capacitors Cc1 and Cc2 are not defined. The amplitude of the total induced current (or the amplitude of the signal) can be ensured to be equal to or greater than a predetermined value and sufficient to sense the input of the pen PN.

[0217] When the first signal SG1 and the second signal SG2 are differentiated by the differential amplifier DAP, noise included in the first signal SG1 and the second signal SG2 can be removed. In addition, since the two signals are differentiated, the amplitude of the output signal Sout can be output in a form in which the amplitude is constantly maintained regardless of the position of the pen PN.

[0218] Therefore, according to an embodiment of the present invention, one electrode group includes two separated electrodes, wherein the wiring directions of the two separated electrodes are different from each other. In this case, the directions of the currents of the signals received from the two separated electrodes can be opposite to each other, and the noise generated in the two separated electrodes can be substantially the same. If the output signal is generated by differentiating the two signals using a differential amplifier DAP, the noise can be removed and the amplitude of the output signal Sout can be increased. Therefore, the signal-to-noise ratio can be increased, thereby providing an electronic device 1000 with increased sensing sensitivity (see Figure 1A ).

[0219] Figure 14is a diagram illustrating a portion of a sensor driver 200C and four electrode groups according to an embodiment of the inventive concept.

[0220] refer to Figure 7 and Figure 14 , the sensor driver 200C may include a first differential amplifier DAP1 , a second differential amplifier DAP2 , and a third differential amplifier DAP3 .

[0221] In the pen sensing drive mode, each of the first differential amplifier DAP1 and the second differential amplifier DAP2 can receive a signal from the second electrode group 220G, the inverting terminal of the third differential amplifier DAP3 can receive the signal output from the first differential amplifier DAP1, the non-inverting terminal of the third differential amplifier DAP3 can receive the signal output from the second differential amplifier DAP2, and the third differential amplifier DAP3 can output the output signal Souta.

[0222] The second electrode group 220G may include a 2-1st electrode group 220G1 and a 2-2nd electrode group 220G2 spaced apart from the 2-1st electrode group 220G1 in the second direction DR2.

[0223] In the pen sensing driving mode, the inverting terminal of the first differential amplifier DAP1 may be electrically connected to the first sensing electrode 220e11 of the 2-1st electrode group 220G1 via the 1-1st crossing trace 220t11, and the non-inverting terminal of the first differential amplifier DAP1 may be electrically connected to the second sensing electrode 220e21 of the 2-1st electrode group 220G1 via the 2-1st crossing trace 220t21. That is, in the pen sensing driving mode, the inverting terminal of the first differential amplifier DAP1 may be electrically connected to the first separated electrode 220de11 and the first crossed electrode 220ce11 of the 2-1st electrode group 220G1, and the non-inverting terminal of the first differential amplifier DAP1 may be electrically connected to the second separated electrode 220de21 and the second crossed electrode 220ce21 of the 2-1st electrode group 220G1.

[0224] In the pen sensing driving mode, the inverting terminal of the second differential amplifier DAP2 can be electrically connected to the first sensing electrode 220e12 of the 2-2 electrode group 220G2 via the 1-2 crossing trace 220t12, and the non-inverting terminal of the second differential amplifier DAP2 can be electrically connected to the second sensing electrode 220e22 of the 2-2 electrode group 220G2 via the 2-2 crossing trace 220t22. That is, in the pen sensing driving mode, the inverting terminal of the second differential amplifier DAP2 can be electrically connected to the first separated electrode 220de12 and the first crossed electrode 220ce12 of the 2-2 electrode group 220G2, and the non-inverting terminal of the second differential amplifier DAP2 can be electrically connected to the second separated electrode 220de22 and the second crossed electrode 220ce22 of the 2-2 electrode group 220G2.

[0225] In the embodiment of the present inventive concept, the third differential amplifier DAP3 receives signals provided from two second electrode groups 220G1 and 220G2 that are most adjacent to each other in the second direction DR2 as an example, but the embodiment of the present inventive concept is not limited thereto. For example, the third differential amplifier DAP3 may receive signals provided from two second electrode groups, wherein one or more second electrode groups are provided between the two second electrode groups.

[0226] Figure 15 is a diagram illustrating a portion of a sensor driver 200C and four electrode groups according to an embodiment of the inventive concept.

[0227] refer to Figure 7 and Figure 15 , the sensor driver 200C may include a first differential amplifier DAP1a, a second differential amplifier DAP2a, and a third differential amplifier DAP3a.

[0228] In the pen sensing drive mode, each of the first differential amplifier DAP1a and the second differential amplifier DAP2a can receive a signal from the second electrode group 220G, the inverting terminal of the third differential amplifier DAP3a can receive the signal output from the first differential amplifier DAP1a, the non-inverting terminal of the third differential amplifier DAP3a can receive the signal output from the second differential amplifier DAP2a, and the third differential amplifier DAP3a can output the output signal Soutb.

[0229] The second electrode group 220G may include a 2-1st electrode group 220G1 and a 2-2nd electrode group 220G2 spaced apart from the 2-1st electrode group 220G1 in the second direction DR2.

[0230] In the pen sensing driving mode, the inverting terminal of the first differential amplifier DAP1a can be electrically connected to the first sensing electrode 220e12 of the 2-2 electrode group 220G2 via the 1-2 crossing trace 220t12, and the non-inverting terminal of the first differential amplifier DAP1a can be electrically connected to the first sensing electrode 220e11 of the 2-1 electrode group 220G1 via the 1-1 crossing trace 220t11. That is, in the pen sensing driving mode, the inverting terminal of the first differential amplifier DAP1a can be electrically connected to the first separated electrode 220de12 and the first crossed electrode 220ce12 of the 2-2 electrode group 220G2, and the non-inverting terminal of the first differential amplifier DAP1a can be electrically connected to the first separated electrode 220de11 and the first crossed electrode 220ce11 of the 2-1 electrode group 220G1.

[0231] In the pen sensing driving mode, the inverting terminal of the second differential amplifier DAP2a can be electrically connected to the second sensing electrode 220e21 of the 2-1st electrode group 220G1 via the 2-1st crossing trace 220t21, and the non-inverting terminal of the second differential amplifier DAP2a can be electrically connected to the second sensing electrode 220e22 of the 2-2nd electrode group 220G2 via the 2-2nd crossing trace 220t22. That is, in the pen sensing driving mode, the inverting terminal of the second differential amplifier DAP2a can be electrically connected to the second separated electrode 220de21 and the second crossed electrode 220ce21 of the 2-1st electrode group 220G1, and the non-inverting terminal of the second differential amplifier DAP2a can be electrically connected to the second separated electrode 220de22 and the second crossed electrode 220ce22 of the 2-2nd electrode group 220G2.

[0232] Figure 16A is a graph showing currents sensed in a plurality of electrode groups. Figure 16B is a graph showing currents obtained from differential pairs of multiple electrode groups.

[0233] refer to Figure 7 and Figure 16A , the directions of the currents sensed from the channels between the parts that are spaced apart from each other and in which the pen PN is positioned may be different. The channels may correspond to the second electrode groups 220G, respectively. Therefore, the directions of the currents flowing to the channels on the left and the channels flowing to the right may be different relative to the position of the pen PN. Therefore, the sensor driver 200C can sense currents flowing in directions different from each other relative to the position of the pen PN. If the pen PN is positioned exactly above one of the second electrode groups 220G, the signal sensed from one of the second electrode groups 220G may be "0". For example, as shown in reference Figure 10AAs described, if coordinates are calculated using the output signal Sout obtained from one second electrode group 220G, the amplitude of a signal received from one second electrode group 220G directly corresponding to the position of the pen PN may be “0”.

[0234] refer to Figure 14 、 Figure 15 and Figure 16B , the output signal Souta or Soutb is a signal obtained from two or more electrode groups 220G1 and 220G2. That is, current can be sensed through differential sensing of adjacent channels or channels spaced apart from each other. In this case, the coordinates of the pen PN can be relatively easily calculated using the centroid method or the maximum point of a trend line.

[0235] Figure 17 is a diagram illustrating a portion of a sensor driver 200C and four electrode groups according to an embodiment of the inventive concept.

[0236] refer to Figure 17 The sensor driver 200C may include a plurality of differential amplifiers DAPs, an analog-to-digital converter ADC, and a difference calculator CC. Some (e.g., a first group) of the differential amplifiers DAPs may be connected to a first one of the analog-to-digital converters ADC, and the remaining (e.g., a second group) of the differential amplifiers DAPs may be connected to a second one of the analog-to-digital converters ADC.

[0237] The differential amplifiers DAPs can be connected to the first sensing electrodes 220e1 and the second sensing electrodes 220e2 of the second electrode group 220G in a one-to-one correspondence. For example, each differential amplifier DAP in the first group can be connected to a corresponding one of the first sensing electrodes 220e1, and each differential amplifier DAP in the second group can be connected to a corresponding one of the second sensing electrodes 220e2. The analog-to-digital converter ADC can receive analog signals from the differential amplifiers DAPs and convert the received analog signals into digital signals. The difference calculator CC can perform a difference operation on the data provided by the analog-to-digital converter ADC and output output data DAT from which noise has been removed. For example, a first of the analog-to-digital converters ADC can receive the outputs of the differential amplifiers DAPs of the first group to generate first data, a second of the analog-to-digital converters ADC can receive the outputs of the differential amplifiers DAPs of the second group to generate second data, and the difference calculator CC can perform a difference operation on the first and second data to output output data DAT.

[0238] Figure 18 is a plan view illustrating a portion of a sensor layer according to an embodiment of the inventive concept.

[0239] refer to Figure 7 、 Figure 9 and Figure 18 , the sensor layer 200 may include a first electrode group 210Ga and a second electrode group 220Ga. Each of the first electrode group 210Ga and the second electrode group 220Ga may include two sensing electrodes. Therefore, two traces may be electrically connected to each of the first electrode group 210Ga and the second electrode group 220Ga. Figure 18 The connection relationship between the sensing electrodes and traces in the reference Figure 10A The descriptions made are the same, and therefore descriptions thereof are omitted.

[0240] Each of the second electrode groups 220Ga may include a first sensing electrode 220e1a and a second sensing electrode 220e2a. The first sensing electrode 220e1a may be electrically connected to the first intersecting trace 220t1, and the second sensing electrode 220e2a may be electrically connected to the second intersecting trace 220t2. The first sensing electrode 220e1a may include a first separator electrode 220de1a and a first intersecting electrode 220ce1a electrically connected to each other, and the second sensing electrode 220e2a may include a second separator electrode 220de2a and a second intersecting electrode 220ce2a electrically connected to each other.

[0241] Each of the first electrode groups 210Ga may include a third sensing electrode 210e1 and a fourth sensing electrode 210e2. The third sensing electrode 210e1 may be electrically connected to the third crossing trace 210t1, and the fourth sensing electrode 210e2 may be electrically connected to the fourth crossing trace 210t2. The third sensing electrode 210e1 may include a third separator electrode 210de1 and a third cross electrode 210ce1 electrically connected to each other, and the fourth sensing electrode 210e2 may include a fourth separator electrode 210de2 and a fourth cross electrode 210ce2 electrically connected to each other.

[0242] In an embodiment, the length of the first intersecting electrode 220ce1a in the first direction DR1 is smaller than the length of the second separating electrode 220de2a in the first direction DR1. In an embodiment, the length of the second intersecting electrode 220ce2a in the first direction DR1 is smaller than the length of the first separating electrode 220de1a in the first direction DR1.

[0243] In an embodiment, the length of the third intersecting electrode 210ce1 in the second direction DR2 is smaller than the length of the fourth separating electrode 210de2 in the second direction DR2. In an embodiment, the length of the fourth intersecting electrode 210ce2 in the second direction DR2 is smaller than the length of the third separating electrode 210de1 in the second direction DR2.

[0244] In an embodiment, the maximum width of the first intersecting electrode 220ce1a in the second direction DR2 is smaller than the maximum width of the second separating electrode 220de2a in the second direction DR2. In an embodiment, the maximum width of the second intersecting electrode 220ce2a in the second direction DR2 is smaller than the maximum width of the first separating electrode 220de1a in the second direction DR2.

[0245] In an embodiment, the maximum width of the third intersecting electrode 210ce1 in the first direction DR1 is smaller than the maximum width of the fourth separating electrode 210de2 in the first direction DR1. In an embodiment, the maximum width of the fourth intersecting electrode 210ce2 in the first direction DR1 is smaller than the maximum width of the third separating electrode 210de1 in the first direction DR1.

[0246] The second mode MD2-d or the second mode MD2 may include a pen sensing driving mode. In the pen sensing driving mode, the sensor layer 200 and the sensor driver 200C may sense an induced current generated by a magnetic field emitted from the pen PN. In the pen sensing driving mode, the sensor driver 200C may be configured to receive a first signal SG1 from the first sensing electrode 220e1a, receive a second signal SG2 from the second sensing electrode 220e2a, receive a third signal SG3 from the third sensing electrode 210e1, and receive a fourth signal SG4 from the fourth sensing electrode 210e2. In the pen sensing driving mode, the sensor driver 200C may process the data as described in reference to FIG. Figure 10A 、 Figure 14 、 Figure 15 or Figure 17 Described are the first signal SG1, the second signal SG2, the third signal SG3 and the fourth signal SG4.

[0247] Figure 19 is a plan view illustrating four sensing units (or four sensors) according to an embodiment of the inventive concept. Figure 20A is a plan view illustrating a second conductive layer of a sensing unit according to an embodiment of the inventive concept. Figure 20B is a plan view illustrating a first conductive layer of a sensing unit according to an embodiment of the inventive concept. Figure 20C is a plan view illustrating four sensing units according to an embodiment of the inventive concept.

[0248] refer to Figure 18 、 Figure 19 、 Figure 20A and Figure 20BEach of the first sensing electrodes 220e1a may include a first separation electrode 220de1a and a first interdigitated electrode 220ce1a, and each of the second sensing electrodes 220e2a may include a second separation electrode 220de2a and a second interdigitated electrode 220ce2a. The first separation electrode 220de1a may include a 1-1st sensing pattern 221sp1 and a 1-1st bridge pattern 221bp1. The first interdigitated electrode 220ce1a may include a 1-2nd sensing pattern 221sp2 and a 1-2nd bridge pattern 221bp2. The second separation electrode 220de2a may include a 2-1st sensing pattern 222sp1 and a 2-1st bridge pattern 222bp1. The second interdigitated electrode 220ce2a may include a 2-2nd sensing pattern 222sp2 and a 2-2nd bridge pattern 222bp2.

[0249] Each of the third sensing electrodes 210e1 may include a third partition electrode 210de1 and a third interdigitated electrode 210ce1, and each of the fourth sensing electrodes 210e2 may include a fourth partition electrode 210de2 and a fourth interdigitated electrode 210ce2. The third partition electrode 210de1 may include a 3-1st sensing pattern 211sp1 and a 3-1st bridge pattern 211bp1. The third interdigitated electrode 210ce1 may include a 3-2nd sensing pattern 211sp2 and a 3-2nd bridge pattern 211bp2. The fourth partition electrode 210de2 may include a 4-1st sensing pattern 212sp1 and a 4-1st bridge pattern 212bp1. The fourth interdigitated electrode 210ce2 may include a 4-2nd sensing pattern 212sp2 and a 4-2nd bridge pattern 212bp2.

[0250] In an embodiment, the 1-1st sensing pattern 221sp1, the 1-1st bridge pattern 221bp1, the 1-2nd bridge pattern 221bp2, the 2-1st sensing pattern 222sp1, the 2-1st bridge pattern 222bp1, the 2-2nd bridge pattern 222bp2, the 3-1st sensing pattern 211sp1, and the 4-1st sensing pattern 212sp1 are disposed on the same layer (or at a first height) and may be included in the second conductive layer 204 (see FIG. Figure 6 In an embodiment, the 1-2nd sensing pattern 221sp2, the 2-2nd sensing pattern 222sp2, the 3-2nd sensing pattern 211sp2, the 3-1st bridge pattern 211bp1, the 3-2nd bridge pattern 211bp2, the 4-2nd sensing pattern 212sp2, the 4-1st bridge pattern 212bp1, and the 4-2nd bridge pattern 212bp2 are disposed on the same layer (or at a second height), and may be included in the first conductive layer 202 (see FIG. 2 ). Figure 6 )middle.

[0251] The 1-1st sensing patterns 221sp1 may be spaced apart from each other in the first direction DR1. The 1-1st sensing patterns 221sp1 spaced apart from each other in the first direction DR1 may be electrically connected to each other via a 1-1st bridge pattern 221bp1. In an embodiment of the present inventive concept, the 1-1st sensing patterns 221sp1 spaced apart from each other in the first direction DR1 and the 1-1st bridge pattern 221bp1 connecting the 1-1st sensing patterns 221sp1 have an integral shape, and the 1-1st bridge pattern 221bp1 may be referred to as a first connection pattern, a first intermediate pattern, or a first extension pattern.

[0252] The 2-1st sensing patterns 222sp1 may be spaced apart from each other in the first direction DR1. The 2-1st sensing patterns 222sp1 spaced apart from each other in the first direction DR1 may be electrically connected to each other via a 2-1st bridge pattern 222bp1. In an embodiment of the present inventive concept, the 2-1st sensing patterns 222sp1 spaced apart from each other in the first direction DR1 and the 2-1st bridge pattern 222bp1 connecting the 2-1st sensing patterns 222sp1 have an integral shape, and the 2-1st bridge pattern 222bp1 may be referred to as a second connection pattern, a second intermediate pattern, or a second extension pattern.

[0253] The 3-1st sensing patterns 211sp1 may be spaced apart from each other in the second direction DR2. The 3-1st sensing patterns 211sp1 spaced apart from each other in the second direction DR2 may be electrically connected to each other through the 3-1st bridge pattern 211bp1. In an embodiment of the present inventive concept, the 3-1st sensing patterns 211sp1 spaced apart from each other in the second direction DR2 and the 3-1st bridge pattern 211bp1 connecting the 3-1st sensing patterns 211sp1 may be disposed on different layers and formed by being defined in the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the through-hole connection.

[0254] The 4-1st sensing patterns 212sp1 may be spaced apart from each other in the second direction DR2. The 4-1st sensing patterns 212sp1 spaced apart from each other in the second direction DR2 may be electrically connected to each other through the 4-1st bridge pattern 212bp1. In an embodiment of the present inventive concept, the 4-1st sensing patterns 212sp1 spaced apart from each other in the second direction DR2 and the 4-1st bridge pattern 212bp1 connecting the 4-1st sensing patterns 212sp1 are disposed on different layers and are electrically connected to each other by being defined in the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the through-hole connection.

[0255] Figure 19 The four sensing units shown in FIG. 5 may be repeatedly arranged along the first direction DR1 and the second direction DR2 . Figure 19 A portion in which the partition electrodes 220de1a, 220de2a, 210de1, and 210de2 and the intersecting electrodes 220ce1a, 220ce2a, 210ce1, and 210ce2 are disposed to overlap with each other is exemplarily shown.

[0256] The first interdigitated electrode 220ce1a can be electrically connected to the first separator electrode 220de1a and arranged to overlap with the second separator electrode 220de2a. The second interdigitated electrode 220ce2a can be electrically connected to the second separator electrode 220de2a and arranged to overlap with the first separator electrode 220de1a. The third interdigitated electrode 210ce1 can be electrically connected to the third separator electrode 210de1 and arranged to overlap with the fourth separator electrode 210de2. The fourth interdigitated electrode 210ce2 can be electrically connected to the fourth separator electrode 210de2 and arranged to overlap with the third separator electrode 210de1.

[0257] The 1-2 sensing patterns 221sp2 may be spaced apart from each other in the first direction DR1. The 1-2 sensing patterns 221sp2 spaced apart from each other in the first direction DR1 may be electrically connected to each other through the 1-2 bridge pattern 221bp2. In an embodiment of the present inventive concept, the 1-2 sensing patterns 221sp2 spaced apart from each other in the first direction DR1 and the 1-2 bridge pattern 221bp2 connecting the 1-2 sensing patterns 221sp2 are disposed on different layers and are electrically connected to each other by the 1-2 bridge pattern 221bp2 defined in the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the through-hole connection.

[0258] The 2-2 sensing patterns 222sp2 may be spaced apart from each other in the first direction DR1. The 2-2 sensing patterns 222sp2 spaced apart from each other in the first direction DR1 may be electrically connected to each other through the 2-2 bridge pattern 222bp2. In an embodiment of the present inventive concept, the 2-2 sensing patterns 222sp2 spaced apart from each other in the first direction DR1 and the 2-2 bridge pattern 222bp2 connecting the 2-2 sensing patterns 222sp2 are disposed on different layers and are electrically connected to each other by the 2-2 bridge pattern 222bp2 defined in the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the through-hole connection.

[0259] The 3-2nd sensing patterns 211sp2 may be spaced apart from each other in the second direction DR2. The 3-2nd sensing patterns 211sp2 spaced apart from each other in the second direction DR2 may be electrically connected to each other via a 3-2nd bridge pattern 211bp2. In an embodiment of the present inventive concept, the 3-2nd sensing patterns 211sp2 spaced apart from each other in the second direction DR2 and the 3-2nd bridge pattern 211bp2 connecting the 3-2nd sensing patterns 211sp2 have an integral shape, and the 3-2nd bridge pattern 211bp2 may be referred to as a third connection pattern, a third intermediate pattern, or a third extension pattern.

[0260] The 4-2nd sensing patterns 212sp2 may be spaced apart from each other in the second direction DR2. The 4-2nd sensing patterns 212sp2 spaced apart from each other in the second direction DR2 may be electrically connected to each other via a 4-2nd bridge pattern 212bp2. In an embodiment of the present inventive concept, the 4-2nd sensing patterns 212sp2 spaced apart from each other in the second direction DR2 and the 4-2nd bridge pattern 212bp2 connecting the 4-2nd sensing patterns 212sp2 have an integral shape, and the 4-2nd bridge pattern 212bp2 may be referred to as a fourth connection pattern, a fourth intermediate pattern, or a fourth extension pattern.

[0261] The 1-1 sensing pattern 221sp1 of the first separation electrode 220de1a and the 1-2 sensing pattern 221sp2 of the first crossing electrode 220ce1a included in one second electrode group 220Ga may be formed by defining the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 The 2-1 sensing pattern 222sp1 of the second separation electrode 220de2a and the 2-2 sensing pattern 222sp2 of the second crossing electrode 220ce2a included in one second electrode group 220Ga can be formed by forming a through hole in the intermediate insulating layer 203 (see FIG. Figure 6 ) in the through-hole connection.

[0262] The 3-1st sensing pattern 211sp1 of the third separation electrode 210de1 and the 3-2nd sensing pattern 211sp2 of the third intersecting electrode 210ce1 included in one first electrode group 210Ga may be formed by defining a plurality of electrodes on the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the through-hole connection. The 4-1 sensing pattern 212sp1 of the fourth separation electrode 210de2 and the 4-2 sensing pattern 212sp2 of the fourth crossing electrode 210ce2 included in one first electrode group 210Ga can be formed by defining a through-hole in the intermediate insulating layer 203 (see FIG. Figure 6 ) in the through-hole connection.

[0263] refer to Figure 20C, the sensor layer 200 according to an embodiment of the present inventive concept may further include a dummy electrode DME. The dummy electrode DME may include a first dummy pattern 222sp2_d and a second dummy pattern 222bp2_d. In an embodiment, the first dummy pattern 222sp2_d is disposed on the same layer (or at the same height) as the layer on which the 2-2 sensing pattern 222sp2 is disposed, and is included in the first conductive layer 202 (see Figure 6 In an embodiment, the second dummy pattern 222bp2_d is provided on the same layer (or at the same height) as the layer on which the 2-2 bridge pattern 222bp2 is provided, and is included in the second conductive layer 204 (see Figure 6 )middle.

[0264] The first dummy pattern 222sp2_d may be spaced apart from the 2-2 sensing pattern 222sp2 in the first direction DR1. The first dummy patterns 222sp2_d may be arranged to be spaced apart from each other in the first direction DR1. The second dummy pattern 222bp2_d may be disposed between the first dummy patterns 222sp2_d spaced apart from each other in the first direction DR1 in a plan view. In an embodiment, the second dummy pattern 222bp2_d is not electrically connected to the first dummy pattern 222sp2_d. Therefore, the first dummy patterns 222sp2_d spaced apart from each other in the first direction DR1 are not electrically connected to each other. Each of the first dummy pattern 222sp2_d and the second dummy pattern 222bp2_d may be a floating electrode.

[0265] In an embodiment, the first dummy pattern 222sp2_d and the 2-2 sensing pattern 222sp2 have the same or substantially the same shape. In an embodiment, the second dummy pattern 222bp2_d and the 2-2 bridge pattern 222bp2 have the same or substantially the same shape. Since the first dummy pattern 222sp2_d can be disposed on the first conductive layer 202 (see Figure 6 ), and the second dummy pattern 222bp2_d may be provided in the blank space of the second conductive layer 204 (see Figure 6 ), so the possibility that a specific pattern will be viewed due to external light reflection can be reduced. That is, it is possible to provide an electronic device 1000 (see FIG. 1 ) that can suppress visibility degradation due to external light reflection. Figure 1A ).

[0266] Figure 20COnly the first dummy pattern 222sp2_d overlapping the 1-1 sensing pattern 221sp1 and the second dummy pattern 222bp2_d disposed between the first dummy patterns 222sp2_d are exemplarily shown in a plan view, but in an embodiment of the present inventive concept, a first dummy pattern overlapping the 2-1 sensing pattern 222sp1, the 3-1 sensing pattern 211sp1, or the 4-1 sensing pattern 212sp1 and a second dummy pattern disposed between the first dummy patterns may be further included. Therefore, referring to Figure 20A and Figure 20C The first dummy pattern 222sp2_d may include a pattern having the same shape as at least a portion of the 1st-2nd sensing pattern 221sp2, the 2nd-2nd sensing pattern 222sp2, the 3rd-2nd sensing pattern 211sp2, and the 4th-2nd sensing pattern 212sp2, and the second dummy pattern 222bp2_d may include a pattern having the same shape as at least a portion of the 1st-2nd bridge pattern 221bp2, the 2nd-2nd bridge pattern 222bp2, the 3rd-2nd bridge pattern 211bp2, and the 4th-2nd bridge pattern 212bp2.

[0267] In an embodiment, Figures 19 to 20C Each of the patterns shown in the figure has a mesh structure. The mesh structures may each include a plurality of mesh lines. The plurality of mesh lines may each have a straight shape extending in a predetermined direction and may be connected to each other. However, this is merely an example. For example, at least a portion of each of the plurality of mesh lines may have a curved shape.

[0268] Figure 21 is a plan view illustrating a portion of a sensor layer according to an embodiment of the inventive concept.

[0269] refer to Figure 7 and Figure 21 The sensor layer 200 may further include a plurality of auxiliary electrodes 230s respectively overlapping the first electrode groups 210Gb. In addition, the sensor layer 200 may further include connection traces 230ct connecting the auxiliary electrodes 230s of the sensor layer 200 to each other.

[0270] In an embodiment, the connection trace 230ct and the first trace 210t are spaced apart from each other with the first electrode group 210Gb and the auxiliary electrode 230s therebetween. That is, in an embodiment, the wiring direction of the first electrode group 210Gb and the wiring direction of the auxiliary electrode 230s are different.

[0271] Each of the first electrode groups 210Gb may include a third sensing pattern 210sp and a third bridge pattern 210bp. The third sensing patterns 210sp may be spaced apart from each other in the second direction DR2. The third sensing patterns 210sp spaced apart from each other in the second direction DR2 may be electrically connected to each other through the third bridge pattern 210bp.

[0272] According to an embodiment of the present inventive concept, each of the first separator electrode 220de1a and the second separator electrode 220de2a intersects one first electrode group 210Gb and one auxiliary electrode 230s. That is, one first separator electrode 220de1a may intersect one first electrode group 210Gb and one auxiliary electrode 230s, and one second separator electrode 220de2a may intersect another first electrode group 210Gb and another auxiliary electrode 230s.

[0273] Figure 22 is a schematic diagram illustrating one channel according to an embodiment of the present inventive concept. Figure 23 is an equivalent circuit diagram illustrating a relationship between one channel and a pen PN according to an embodiment of the inventive concept.

[0274] refer to Figure 21 、 Figure 22 and Figure 23 , one first electrode group 210Gb and one auxiliary electrode 230s are shown. In an embodiment, when viewed in the third direction DR3, the first electrode group 210Gb and the auxiliary electrode 230s overlap each other.

[0275] In an embodiment, one end of the auxiliary electrode 230s is floating, and the other end of the auxiliary electrode 230s is grounded. For example, the other end of the auxiliary electrode 230s may be electrically connected to a connection trace 230ct, and the connection trace 230ct may be grounded. However, embodiments of the present inventive concept are not limited thereto. For example, the connection trace 230ct may be grounded via a bias capacitor.

[0276] Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be defined in the first electrode group 210Gb. Capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may be referred to as parasitic capacitors or basic capacitors. According to an embodiment of the inventive concept, capacitors Cbc1, Cbc2, Cbc3, and Cbc4 may also be used to increase the amplitude of a signal.

[0277] If the pen PN approaches the first electrode group 210Gb, a first electromotive force Vs(t) may be induced in the first electrode group 210Gb due to the magnetic field generated by the pen PN, and a second electromotive force Va(t) may be induced in the auxiliary electrode 230s. A first induced current IN-M and a third induced current IN-B may be generated due to the first electromotive force Vs(t), and a second induced current IN-A may be generated due to the second electromotive force Va(t). Therefore, the total induced current IN input to the input terminal IT may correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B.

[0278] For example, it is assumed that the capacitance of each of the capacitors Cbc1 , Cbc2 , Cbc3 , and Cbc4 is Cb, and it is assumed that the capacitance of each of the first coupling capacitors Ccp11 , Ccp12 , Ccp13 , and Ccp14 is Cc.

[0279] The first induction current IN-M according to time can be expressed according to Equation 4.

[0280]

[0281] The second induction current IN-A according to time can be expressed according to Equation 5.

[0282]

[0283] The third induction current IN-B according to time can be expressed according to Equation 6.

[0284]

[0285] Here, dVs(t) / dt represents a rate of change of the first electromotive force Vs(t) with respect to time, and dVa(t) / dt represents a rate of change of the second electromotive force Va(t) with respect to time.

[0286] Figure 24A is a graph showing the relationship between the magnitude of the current and the position of the pen relative to one channel. Figure 24B is a graph showing the relationship between the amplitude of a signal and the position of the pen relative to one channel.

[0287] refer to Figure 22 、 Figure 23 and Figure 24ASince the voltage across the capacitors Cbc1, Cbc2, Cbc3, and Cbc4 between the input terminal IT and the position of the pen PN is grounded, current may not flow. Therefore, if the position of the pen PN moves from the first point PP1 to the second point PP2, the first induced current IN-M may gradually decrease. Furthermore, the second induced current IN-A may gradually increase, and the third induced current IN-B may gradually decrease.

[0288] refer to Figure 22 、 Figure 23 and Figure 24B If the position of the pen PN moves from the first point PP1 to the second point PP2, the total induced current IN may gradually decrease. However, as described above, the total induced current IN may correspond to the sum of the first induced current IN-M, the second induced current IN-A, and the third induced current IN-B, and the magnitude of the total induced current IN at the second point PP2 may be ensured to be equal to or greater than a predetermined value.

[0289] Figure 25 is a plan view illustrating four sensing units according to an embodiment of the inventive concept. Figure 26A is a plan view illustrating a second conductive layer of four sensing units according to an embodiment of the inventive concept. Figure 26B is a plan view illustrating a first conductive layer of four sensing units according to an embodiment of the inventive concept.

[0290] refer to Figure 21 、 Figure 25 、 Figure 26A and Figure 26B Each of the second electrode groups 220Ga may include a first partition electrode 220de1a, a second partition electrode 220de2a, a first interdigitated electrode 220ce1a, and a second interdigitated electrode 220ce2a. The first partition electrode 220de1a may include a 1-1st sensing pattern 221sp1 and a 1-1st bridge pattern 221bp1, and the second partition electrode 220de2a may include a 2-1st sensing pattern 222sp1 and a 2-1st bridge pattern 222bp1. The first interdigitated electrode 220ce1a may include a 1-2nd sensing pattern 221sp2 and a 1-2nd bridge pattern 221bp2, and the second interdigitated electrode 220ce2a may include a 2-2nd sensing pattern 222sp2 and a 2-2nd bridge pattern 222bp2. Each of the first electrode groups 210Gb may include a third sensing pattern 210sp and a third bridge pattern 210bp.

[0291] In an embodiment, the 1-1st sensing pattern 221sp1, the 1-1st bridge pattern 221bp1, the 1-2nd bridge pattern 221bp2, the 2-1st sensing pattern 222sp1, the 2-1st bridge pattern 222bp1, the 2-2nd bridge pattern 222bp2, and the third sensing pattern 210sp are disposed on the same layer (or at the same height), and, for example, may be included in the second conductive layer 204 (see Figure 6 In an embodiment, the 1-2 sensing pattern 221sp2, the 2-2 sensing pattern 222sp2, the third bridge pattern 210bp, and the auxiliary electrode 230s are provided on the same layer and may be included in the first conductive layer 202 (see Figure 6 )middle.

[0292] The third sensing patterns 210sp may be spaced apart from each other in the second direction DR2. The third sensing patterns 210sp spaced apart from each other in the second direction DR2 may be electrically connected to each other through a third bridge pattern 210bp. In an embodiment of the present inventive concept, the third sensing patterns 210sp spaced apart from each other in the second direction DR2 and the third bridge pattern 210bp connecting the third sensing patterns 210sp are disposed on different layers (or at different heights), and are electrically connected to each other by a third bridge pattern 210bp defined in the intermediate insulating layer 203 (see FIG. 2 ). Figure 6 ) in the through-hole connection.

[0293] Each of the auxiliary electrodes 230s may extend along the second direction DR2. The third sensing pattern 210sp included in one of the first electrode groups 210Gb may overlap with a corresponding one of the auxiliary electrodes 230s. A hole 230s-h may be defined in each of the auxiliary electrodes 230s. Each of the third bridging patterns 210bp may be surrounded by a corresponding hole 230s-h and insulated from the auxiliary electrode 230s.

[0294] The sensor layer 200 according to an embodiment of the present inventive concept further includes a dummy electrode DME. The dummy electrode DME may include a first dummy pattern 222sp2_d and a second dummy pattern 222bp2_d. In an embodiment, the first dummy pattern 222sp2_d is disposed on the same layer as the layer on which the 2-2 sensing pattern 222sp2 is disposed, and may be included in the first conductive layer 202 (see FIG. Figure 6 In an embodiment, the second dummy pattern 222bp2_d is disposed on the same layer as the layer on which the 2-2 th bridge pattern 222bp2 is disposed, and may be included in the second conductive layer 204 (see Figure 6 The description of the first dummy pattern 222sp2_d and the second dummy pattern 222bp2_d is basically the same as that of the reference Figure 20CThe descriptions made are the same, and therefore no description overlapping with the above description will be provided.

[0295] Figure 25 Only the first dummy pattern 222sp2_d overlapping the 1-1th sensing pattern 221sp1 and the second dummy pattern 222bp2_d arranged between the first dummy patterns 222sp2_d in the plan view are exemplarily shown, but in an embodiment of the present inventive concept, the first dummy pattern overlapping the 2-1th sensing pattern 222sp1 and the second dummy pattern arranged between the first dummy patterns may also be included.

[0296] In an embodiment, Figure 26A and Figure 26B Each of the patterns shown in the figure has a mesh structure. The mesh structures may each have a plurality of mesh lines. The plurality of mesh lines may each have a straight shape extending in a predetermined direction and may be connected to each other. However, this is merely an example, and at least a portion of each of the plurality of mesh lines may have a curved shape.

[0297] Figure 27 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver 200C according to an embodiment of the inventive concept.

[0298] refer to Figure 7 and Figure 27 , the sensor layer 200 may further include a plurality of annular traces 230rt electrically connected to the plurality of auxiliary electrodes 230s. Figure 27 The auxiliary electrodes 230s and the annular trace 230rt are exemplarily shown to be electrically connected in a one-to-one correspondence, but embodiments of the present inventive concept are not limited thereto. For example, two or more auxiliary electrodes 230s may be electrically connected to one annular trace 230rt.

[0299] The second mode MD2 (see Figure 9 ) can include a charging driving mode and a pen sensing driving mode. Figure 27 2 is a diagram illustrating a charging driving mode. The sensor driver 200C may include a first switch SSW1 and a second switch SSW2. The first signal CSG1 may be transmitted to the sensor layer 200 through the first switch SSW1, and the second signal CSG2 may be transmitted to the sensor layer 200 through the second switch SSW2.

[0300] Each of the first signal CSG1 and the second signal CSG2 may be a sine wave signal or a square wave signal. In an embodiment, each of the first signal CSG1 and the second signal CSG2 is in anti-phase relationship. Therefore, the direction of the current can be periodically changed in the charge drive mode. In another embodiment of the present inventive concept, one of the first signal CSG1 and the second signal CSG2 may be a sine wave signal or a square wave signal, and the other may have a predetermined constant voltage.

[0301] In the charge driving mode, the first switch SSW1 and the second switch SSW2 may be electrically connected to at least one and at least the other of the connection trace 230ct and the ring trace 230rt. Figure 27 In the example shown, the first signal CSG1 is provided to the connection trace 230ct, and the second signal CSG2 is provided to a ring trace 230rt, but the embodiments of the present inventive concept are not limited thereto. For example, the first signal CSG1 may be provided to two or more lines, and the second signal CSG2 may also be provided to two or more different lines.

[0302] In an embodiment of the pen sense drive mode, the entire ring trace 230rt is electrically floating, and the connecting trace 230ct is grounded.

[0303] Figure 28 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver 200C according to an embodiment of the inventive concept.

[0304] refer to Figure 7 and Figure 28 , schematically shows the sensor layer 200 in the first mode MD1 (see Figure 9 ) below.

[0305] The sensor driver 200C may include a differential amplifier DAP. In the first mode MD1, the inverting terminal of the differential amplifier DAP may be electrically connected to the first sensing electrode 220e1a and the second sensing electrode 220e2a. Specifically, in the first mode MD1, the inverting terminal of the differential amplifier DAP may be electrically connected to the first separation electrode 220de1a, the first interdigital electrode 220ce1a, the second separation electrode 220de2a, and the second interdigital electrode 220ce2a. The non-inverting terminal of the differential amplifier DAP may be grounded or have a reference voltage applied thereto.

[0306] In an embodiment of the present inventive concept, in the first mode MD1, both a signal received from the first sensing electrode 220e1a and a signal received from the second sensing electrode 220e2a are input to the inverting terminal of the differential amplifier DAP, where the second sensing electrode 220e2a is included in the same group as the group in which the first sensing electrode 220e1a is included, and the signal for sensing touch should not be reduced.

[0307] Figure 29 is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver 200C according to an embodiment of the inventive concept.

[0308] refer to Figure 7 and Figure 29 , schematically shows the sensor layer 200 in the first mode MD1 (see Figure 9 ) below.

[0309] The sensor driver 200C may include a plurality of differential amplifiers DAPb, a plurality of analog-to-digital converters ADCb, and an adder CCb.

[0310] The differential amplifier DAPb may include a first differential amplifier DAP1b and a second differential amplifier DAP2b. Figure 9 ), the inverting terminal of the first differential amplifier DAP1b can be electrically connected to the first sensing electrode 220e1a (or the first separation electrode 220de1a and the first cross electrode 220ce1a). The non-inverting terminal of the first differential amplifier DAP1b can be grounded or applied with a reference voltage. Figure 9 ), the inverting terminal of the second differential amplifier DAP2b may be electrically connected to the second sensing electrode 220e2a (or the second separation electrode 220de2a and the second intersecting electrode 220ce2a). The non-inverting terminal of the second differential amplifier DAP2b may be grounded or applied with a reference voltage.

[0311] The analog-to-digital converter ADCb may include a first analog-to-digital converter ADC1b and a second analog-to-digital converter ADC2b. The first analog-to-digital converter ADC1b may receive a first analog signal from a first differential amplifier DAP1b and convert the received signal into a first digital signal. The second analog-to-digital converter ADC2b may receive a second analog signal from a second differential amplifier DAP2b and convert the received signal into a second digital signal. The adder CCb may sum the first and second digital signals provided from the analog-to-digital converter ADCb to output output data.

[0312] Figure 30is a plan view illustrating a portion of a sensor layer and a portion of a sensor driver 200C according to an embodiment of the inventive concept.

[0313] refer to Figure 7 and Figure 30 , exemplarily showing the sensor layer 200 in the first mode MD1 (see Figure 9 The first mode MD1 may be a mutual capacitance detection mode.

[0314] In the first mode MD1, the sensor driver 200C may sequentially provide the transmission signal SG-md to the second electrode group 220Ga. For example, the transmission signal SG-md may be provided to each of the first sensing electrode 220e1a and the second sensing electrode 220e2a included in one second electrode group 220Ga.

[0315] The sensor driver 200C can detect the sensor signal based on the first input 2000 (see FIG. 21 ) by using the reception signal detected by the first electrode group 210Gb. Figure 4 For example, the sensor driver 200C may be configured to sense a change in mutual capacitance between the first electrode group 210Gb and the second electrode group 220Ga to calculate the input coordinates.

[0316] According to the above description, the input of the pen or the touch input can be sensed by using the sensor layer. Therefore, since it is not necessary to add an additional component (e.g., a digitizer) for sensing the pen to the electronic device, the increase in thickness, weight, and flexibility of the electronic device caused by the addition of the digitizer should not occur. In addition, at least one electrode group included in the sensor layer may include two separated electrodes with different wiring directions. In this case, the directions of the currents of the signals received from the two separated electrodes may be opposite to each other, and the noise generated in the two separated electrodes may be substantially the same. In the pen sensing drive mode, the sensor driver can generate an output signal by differentiating the two signals using a differential amplifier. In this case, noise can be removed and the amplitude of the output signal can be increased. Therefore, the signal-to-noise ratio can be increased, thereby providing an electronic device with increased sensing sensitivity. In addition, since at least one electrode group in the sensor layer can include two separated electrodes, both touch input and pen input can be sensed. Therefore, the design freedom of the electrodes in the sensor layer can be increased, and the fixation of the bandwidth can be facilitated.

[0317] Although various embodiments of the present inventive concept have been described, it is to be understood that the present inventive concept should not be limited to these embodiments, but various changes and modifications can be made by those skilled in the art within the spirit and scope of the present inventive concept.

Claims

1. An electronic device comprising: sensor layer; as well as a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing a touch input and a second mode for sensing a pen input, Wherein, the sensor layer comprises: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups, arranged along a second direction crossing the first direction, crossing the plurality of first electrode groups, and each including a first sensing electrode and a second sensing electrode; Wherein, the first sensing electrode includes: a first separator electrode; and a first interdigitated electrode electrically connected to the first separating electrode, Wherein, the second sensing electrode includes: a second separation electrode spaced apart from the first separation electrode in the first direction; and a second interdigitated electrode electrically connected to the second separator electrode, and At least a portion of the first interdigitated electrode overlaps the second separator electrode, and at least a portion of the second interdigitated electrode overlaps the first separator electrode.

2. The electronic device according to claim 1, wherein In the second mode, the sensor driver is configured to receive a first signal from the first sensing electrode and to receive a second signal from the second sensing electrode.

3. The electronic device according to claim 1, wherein The sensor layer further includes a first crossing trace electrically connected to the first sensing electrode and a second crossing trace electrically connected to the second sensing electrode, The first cross trace is connected to the first separator electrode, and The second crossing trace is connected to the second separation electrode.

4. The electronic device according to claim 3, wherein The first cross trace is connected to one end of the first separator electrode, and The second crossing trace is connected to one end of the second separating electrode.

5. The electronic device according to claim 1, wherein The length of the first intersecting electrode in the first direction is smaller than the length of the second separating electrode in the first direction, and A length of the second intersecting electrode in the first direction is smaller than a length of the first separating electrode in the first direction. The electronic device according to claim 1 , wherein: The maximum width of the first intersecting electrode in the second direction is smaller than the maximum width of the second separating electrode in the second direction, and A maximum width of the second intersecting electrode in the second direction is smaller than a maximum width of the first separating electrode in the second direction.

7. The electronic device according to claim 1, wherein The sensor driver includes a differential amplifier, and in the second mode, an inverting terminal of the differential amplifier is electrically connected to the first sensing electrode, and a non-inverting terminal of the differential amplifier is electrically connected to the second sensing electrode.

8. The electronic device according to claim 1, wherein The sensor driver includes a first differential amplifier, a second differential amplifier, and a third differential amplifier, and In the second mode, each of the first differential amplifier and the second differential amplifier receives a signal from the plurality of second electrode groups, the inverting terminal of the third differential amplifier receives a signal output from the first differential amplifier, and the non-inverting terminal of the third differential amplifier receives a signal output from the second differential amplifier.

9. The electronic device according to claim 8, wherein: The plurality of second electrode groups include a 2-1 electrode group and a 2-2 electrode group spaced apart from the 2-1 electrode group in the second direction. In the second mode, an inverting terminal of the first differential amplifier is electrically connected to the first sensing electrode of the 2-1 electrode group, and a non-inverting terminal of the first differential amplifier is electrically connected to the second sensing electrode of the 2-1 electrode group, and In the second mode, an inverting terminal of the second differential amplifier is electrically connected to the first sensing electrode of the 2-2 electrode group, and a non-inverting terminal of the second differential amplifier is electrically connected to the second sensing electrode of the 2-2 electrode group.

10. The electronic device according to claim 8, wherein The plurality of second electrode groups include a 2-1 electrode group and a 2-2 electrode group spaced apart from the 2-1 electrode group in the second direction. In the second mode, an inverting terminal of the first differential amplifier is electrically connected to the first sensing electrode of the 2-2 electrode group, and a non-inverting terminal of the first differential amplifier is electrically connected to the first sensing electrode of the 2-1 electrode group, and In the second mode, an inverting terminal of the second differential amplifier is electrically connected to the second sensing electrode of the 2-1 electrode group, and a non-inverting terminal of the second differential amplifier is electrically connected to the second sensing electrode of the 2-2 electrode group.

11. The electronic device according to claim 1, wherein The sensor driver includes a plurality of differential amplifiers and an analog-to-digital converter, In the second mode, the plurality of differential amplifiers are connected to the plurality of first sensing electrodes and the plurality of second sensing electrodes of the plurality of second electrode groups in a one-to-one correspondence. The analog-to-digital converter receives a plurality of signals from the plurality of differential amplifiers, and The sensor driver performs a difference operation on data output from the analog-to-digital converter.

12. The electronic device according to claim 1, wherein Each of the plurality of first electrode groups includes a third sensing electrode and a fourth sensing electrode, The third sensing electrode comprises: a third separator electrode; and a third interdigitated electrode electrically connected to the third separating electrode, The fourth sensing electrode includes: a fourth separating electrode spaced apart from the third separating electrode in the second direction; and a fourth interdigitated electrode electrically connected to the fourth separator electrode, and At least a portion of the third interdigitated electrode overlaps with the fourth separator electrode, and at least a portion of the fourth interdigitated electrode overlaps with the third separator electrode.

13. The electronic device according to claim 12, wherein: In the second mode, the sensor driver is configured to receive a first signal from the first sensing electrode, receive a second signal from the second sensing electrode, receive a third signal from the third sensing electrode, and receive a fourth signal from the fourth sensing electrode.

14. The electronic device according to claim 12, wherein: The first separation electrode includes a plurality of 1-1th sensing patterns and a 1-1th bridge pattern, and the first cross electrode includes a plurality of 1-2th sensing patterns and a 1-2th bridge pattern, The second separation electrode includes a plurality of 2-1st sensing patterns and a 2-1st bridge pattern, and the second cross electrode includes a plurality of 2-2nd sensing patterns and a 2-2nd bridge pattern, The third separation electrode includes a plurality of 3-1st sensing patterns and 3-1st bridge patterns, and the third cross electrode includes a plurality of 3-2nd sensing patterns and 3-2nd bridge patterns, and The fourth separation electrode includes a plurality of 4-1st sensing patterns and a 4-1st bridge pattern, and the fourth intersecting electrode includes a plurality of 4-2nd sensing patterns and a 4-2nd bridge pattern.

15. The electronic device according to claim 14, wherein The plurality of 1-1st sensing patterns, the 1-1st bridge pattern, the 1-2th bridge pattern, the plurality of 2-1st sensing patterns, the 2-1st bridge pattern, the 2-2nd bridge pattern, the plurality of 3-1st sensing patterns, and the plurality of 4-1st sensing patterns are disposed on the same first layer, and The plurality of 1-2th sensing patterns, the plurality of 2-2th sensing patterns, the plurality of 3-2th sensing patterns, the 3-1st bridge pattern, the 3-2nd bridge pattern, the plurality of 4-2nd sensing patterns, the 4-1st bridge pattern, and the 4-2nd bridge pattern are disposed on the same second layer.

16. The electronic device according to claim 14, wherein The plurality of 1-2 sensing patterns overlap with some 2-1 sensing patterns among the plurality of 2-1 sensing patterns, and the plurality of 2-2 sensing patterns overlap with some 1-1 sensing patterns among the plurality of 1-1 sensing patterns, and The plurality of 3-2nd sensing patterns overlap with some 4-1st sensing patterns among the plurality of 4-1st sensing patterns, and the plurality of 4-2nd sensing patterns overlap with some 3-1st sensing patterns among the plurality of 3-1st sensing patterns.

17. The electronic device according to claim 14, wherein: The sensor layer further includes a dummy electrode, wherein the dummy electrode includes a plurality of first dummy patterns and a plurality of second dummy patterns. The first dummy pattern includes a pattern having the same shape as at least a portion of the 1-2 sensing pattern, the 2-2 sensing pattern, the 3-2 sensing pattern, and the 4-2 sensing pattern, and The second dummy pattern includes a pattern having the same shape as at least a portion of the 1-2 bridge pattern, the 2-2 bridge pattern, the 3-2 bridge pattern, and the 4-2 bridge pattern.

18. The electronic device according to claim 1, wherein The sensor layer further comprises: a plurality of auxiliary electrodes, respectively overlapping the plurality of first electrode groups; and The connection traces connect the plurality of auxiliary electrodes to each other.

19. The electronic device according to claim 18, wherein The sensor layer further comprises: A plurality of first traces are electrically connected to the plurality of first electrode groups in a one-to-one correspondence, and the plurality of first traces are spaced apart from the connection traces with the plurality of first electrode groups between the plurality of first traces and the connection traces.

20. The electronic device according to claim 18, wherein The first separation electrode includes a plurality of 1-1th sensing patterns and a 1-1th bridge pattern, and the first cross electrode includes a plurality of 1-2th sensing patterns and a 1-2th bridge pattern, The second separation electrode includes a plurality of 2-1st sensing patterns and a 2-1st bridge pattern, and the second cross electrode includes a plurality of 2-2nd sensing patterns and a 2-2nd bridge pattern, Each of the plurality of first electrode groups includes a plurality of third sensing patterns and third bridge patterns, The plurality of 1-1st sensing patterns, the 1-1st bridge pattern, the 1-2th bridge pattern, the plurality of 2-1st sensing patterns, the 2-1st bridge pattern, the 2-2nd bridge pattern, and the plurality of third sensing patterns are disposed on the same first layer, and The plurality of 1-2 sensing patterns, the plurality of 2-2 sensing patterns, the third bridge pattern, and the plurality of auxiliary electrodes are disposed on the same second layer.

21. The electronic device according to claim 20, wherein The plurality of third sensing patterns overlap with a corresponding one of the plurality of auxiliary electrodes, and At least one hole surrounding the third bridge pattern is in the one auxiliary electrode.

22. The electronic device according to claim 18, wherein The sensor layer further includes a plurality of annular traces electrically connected to the plurality of auxiliary electrodes, The second mode includes a charging driving mode and a pen sensing driving mode, The sensor driver is configured to apply a first signal to at least one line among the connection trace and the plurality of ring traces and to apply a second signal to at least another line among the connection trace and the plurality of ring traces in the charge driving mode, and In the pen sensing drive mode, all of the plurality of ring traces are electrically floating.

23. The electronic device according to claim 18, wherein The sensor driver includes a differential amplifier, and In the first mode, an inverting terminal of the differential amplifier is electrically connected to the first sensing electrode and the second sensing electrode.

24. The electronic device according to claim 18, wherein The sensor driver includes a first differential amplifier, a second differential amplifier, a first analog-to-digital converter, and a second analog-to-digital converter. In the first mode, the inverting terminal of the first differential amplifier is electrically connected to the first sensing electrode, and the inverting terminal of the second differential amplifier is electrically connected to the second sensing electrode, The first analog-to-digital converter receives a signal from the first differential amplifier, and the second analog-to-digital converter receives a signal from the second differential amplifier, and The sensor driver sums data output from the first analog-to-digital converter and data output from the second analog-to-digital converter.

25. The electronic device according to claim 18, wherein In the first mode, the sensor driver provides the same signal to the first sensing electrodes and the second sensing electrodes, and receives signals provided from the plurality of first electrode groups.

26. An electronic device comprising: sensor layer; as well as a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing a touch input and a second mode for sensing a pen input, Wherein, the sensor layer comprises: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction and intersecting the plurality of first electrode groups, and Each of the plurality of second electrode groups includes a first sensing electrode and a second sensing electrode, and a plurality of coupling capacitors are between the first sensing electrode and the second sensing electrode.

27. The electronic device according to claim 26, in, The first sensing electrode comprises: a first separator electrode; and a first interdigitated electrode electrically connected to the first separating electrode, Wherein, the second sensing electrode includes: a second separation electrode spaced apart from the first separation electrode in the first direction; and a second interdigitated electrode electrically connected to the second separator electrode, and The plurality of coupling capacitors includes a first coupling capacitor between the first separating electrode and the second intersecting electrode and a second coupling capacitor between the second separating electrode and the first intersecting electrode.

28. The electronic device according to claim 26, wherein In the second mode, the sensor driver is configured to receive a first signal from the first sensing electrode and to receive a second signal from the second sensing electrode.

29. An electronic device comprising: sensor layer; as well as a sensor driver configured to drive the sensor layer and operate in one of a first mode for sensing a touch input and a second mode for sensing a pen input, Wherein, the sensor layer comprises: a plurality of first electrode groups arranged along a first direction; and a plurality of second electrode groups arranged along a second direction intersecting the first direction and intersecting the plurality of first electrode groups; Each of the plurality of second electrode groups includes a first separation electrode and a second separation electrode spaced apart from each other in the first direction, and In the second mode, the sensor driver is configured to receive a first signal from the first separation electrode and to receive a second signal from the second separation electrode.

30. The electronic device according to claim 29, wherein Each of the plurality of second electrode groups further comprises: a first interdigitated electrode electrically connected to the first separating electrode; and a second interdigitated electrode electrically connected to the second separator electrode, and At least a portion of the first interdigitated electrode overlaps the second separator electrode, and at least a portion of the second interdigitated electrode overlaps the first separator electrode.

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