Universal intelligent driving domain hardware platform and intelligent driving automobile

Abstract

The invention discloses a universal intelligent driving domain hardware platform and an intelligent driving automobile, and relates to the technical field of intelligent driving automobiles, and the universal intelligent driving domain hardware platform comprises a main board and an auxiliary board; a microcontroller and a plurality of communication modules are arranged on the mainboard; a system-on-chip is arranged on the auxiliary board; the main board is connected with the auxiliary board through a connector, the microcontroller is respectively connected with the system-on-chip and the plurality of communication modules, and the system-on-chip is connected with the plurality of communication modules; and the communication module is used for interacting with the microcontroller and the system-on-chip through bus signals. In order to meet the requirement for carrying different system-level chips of vehicle types of different levels, the same bottom plate (main plate) is matched with different system-level chips (auxiliary plates), repeated development can be avoided, the iteration period of software and hardware is shortened, and meanwhile the development cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of intelligent driving vehicle technology, and in particular to a universal intelligent driving domain hardware platform and an intelligent driving vehicle. Background Art

[0002] At present, national and local policies and regulations provide support for the development and implementation of autonomous driving technology from multiple aspects such as standard systems, regulatory requirements, and market access, gradually opening up autonomous driving commercial pilot projects and promoting high-level intelligent driving applications.

[0003] The penetration rate of intelligent driving in China is increasing rapidly, and intelligence has become a key factor in winning the second half. Major manufacturers have accelerated their product launches in the field of intelligence. Since 2023, automatic parking and L2 intelligent driving have penetrated into low-level models, and high-speed NOA (Navigate On Autopilot) has become popular among mid-level models, and urban NOA has begun to be installed on high-end models.

[0004] To meet the requirements of different vehicle classes, intelligent driving domain controllers urgently need to be platform-based. Furthermore, current SOC (System on Chip) brands vary in functionality, pin definitions, compatible power chips, and memory chips. Peripheral circuits also vary significantly, leading to inconsistent hardware platforms. This results in long and costly iterative development cycles. Changing SOCs whenever new project requirements arise can lead to significant development costs and cycles. Summary of the Invention

[0005] The main purpose of this application is to provide a universal intelligent driving domain hardware platform and an intelligent driving car, aiming to solve the problem that different levels of vehicles are equipped with different SOCs, and the iterative development of the hardware platform and the replacement of the SOC will cause high development costs and cycles.

[0006] To achieve the above objectives, the present application proposes a universal intelligent driving domain hardware platform, which includes: a main board and a sub-board;

[0007] The mainboard is provided with a microcontroller and a plurality of communication modules;

[0008] The sub-board is provided with a system-level chip;

[0009] The main board is connected to the sub-board via a connector, the microcontroller is connected to the system-level chip and the plurality of communication modules respectively, and the system-level chip is connected to the plurality of communication modules;

[0010] The communication module is used to interact with the microcontroller and the system-on-chip through bus signals.

[0011] Optionally, the universal intelligent driving domain hardware platform further includes: a power supply module;

[0012] The power supply module is respectively connected to the microcontroller, the plurality of communication modules and the system-on-chip;

[0013] The power supply module is used to receive a voltage signal from a power supply and reduce the voltage to a power supply signal, which is then sent to the microcontroller, the plurality of communication modules and the system-on-chip.

[0014] Optionally, the universal intelligent driving domain hardware platform further includes: a plurality of peripheral devices;

[0015] A plurality of the peripheral devices are respectively connected to the communication module;

[0016] The plurality of peripheral devices are used to receive control instructions from the microcontroller, obtain corresponding information according to the control instructions from the microcontroller, and feed back the corresponding information to the microcontroller.

[0017] Optionally, the power supply module includes: a microcontroller power supply module, a chip power supply module, a communication power supply module and a peripheral power supply module;

[0018] The microcontroller power supply module is connected to the microcontroller, the chip power supply module is connected to the system-on-chip, the communication power supply module is connected to the plurality of communication modules, and the peripheral power supply module is connected to the plurality of peripheral devices;

[0019] The microcontroller power supply module is configured to supply power to the microcontroller upon receiving a first power supply signal;

[0020] The chip power supply module is configured to supply power to the system-on-chip upon receiving a second power supply signal;

[0021] The communication power supply module is configured to supply power to the communication module upon receiving a third power supply signal;

[0022] The peripheral power supply module is used to supply power to the plurality of peripheral devices when receiving a fourth power supply signal.

[0023] Optionally, the communication module includes: a plurality of CAN transceivers;

[0024] A plurality of the CAN transceivers are connected to the microcontroller and the plurality of the peripheral devices;

[0025] The plurality of CAN transceivers are configured to interact with the microcontroller via a first bus signal;

[0026] The multiple CAN transceivers are further configured to communicate with the multiple peripheral devices via a second bus signal.

[0027] Optionally, the communication module further comprises: a plurality of serializers;

[0028] The plurality of serializers are respectively connected to the system-on-chip and the plurality of peripheral devices;

[0029] a plurality of the serializers, configured to interact with the system-on-chip via a third bus signal and convert the parallel data stream of the system-on-chip into a serial data stream;

[0030] The plurality of serializers are further configured to communicate with the plurality of peripheral devices via a fourth bus signal.

[0031] Optionally, the peripheral device includes: a radar module;

[0032] The radar modules are respectively connected to the communication modules;

[0033] The radar module is configured to send obstacle information to the microcontroller when obstacle information is detected;

[0034] The microcontroller is further configured to adjust the vehicle distance when obstacle information is received.

[0035] Optionally, the peripheral device further includes: a camera module;

[0036] The camera modules are respectively connected to the communication modules;

[0037] The camera module is configured to send the road information to the microcontroller when detecting the road information;

[0038] The microcontroller is further configured to adjust the vehicle speed upon receiving road information.

[0039] Optionally, the peripheral device further includes: a navigation module;

[0040] The navigation module is connected to the communication module;

[0041] The navigation module is configured to send the vehicle position information to the microcontroller when detecting the vehicle position information;

[0042] The microcontroller is also used to control the vehicle's driving path when receiving vehicle position information.

[0043] In addition, to achieve the above objectives, the present application also proposes an intelligent driving car, which includes the universal intelligent driving domain hardware platform described in any of the above items.

[0044] One or more technical solutions proposed in this application have at least the following effects:

[0045] The present application discloses a universal intelligent driving domain hardware platform and an intelligent driving car, wherein the universal intelligent driving domain hardware platform comprises: a main board and a sub-board; a microcontroller and a plurality of communication modules are provided on the main board; a system-level chip is provided on the sub-board; the main board is connected to the sub-board via a connector, the microcontroller is respectively connected to the system-level chip and the plurality of communication modules, and the system-level chip is connected to the plurality of communication modules; the communication module is used to interact with the microcontroller and the system-level chip via bus signals. In order to cope with the different system-level chip requirements of different levels of vehicles, the same set of baseboards (main boards) are used to adapt different system-level chips (sub-boards), which can avoid repeated development, accelerate the software and hardware iteration cycle, and reduce development costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0047] Figure 1 This is a schematic diagram of the structure of the first embodiment of the universal intelligent driving domain hardware platform proposed in the embodiments of this application;

[0048] Figure 2 This is a side view of the main board and sub-board of the universal intelligent driving domain hardware platform for this application;

[0049] Figure 3 This is a schematic diagram of the structure of the second embodiment of the universal intelligent driving domain hardware platform proposed in the embodiments of this application;

[0050] Figure 4 This is a structural diagram of the third embodiment of the universal intelligent driving domain hardware platform proposed in the embodiments of this application.

[0051] Description of Figure Numbers:

[0052] Label name Label name 1 motherboard 2 Vice board 3 Peripheral devices 11 microcontroller 12 Communication module 21 System-on-a-Chip

[0053] The purpose, features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0054] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not intended to limit the present application.

[0055] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0056] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0057] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0058] The main solution of the embodiment of the present application is: by adapting different system-level chips 21 (sub-boards 2) through the same set of baseboards (main board 1), repeated development can be avoided, the software and hardware iteration cycle can be accelerated, and development costs can be reduced.

[0059] The present application provides a solution. The present application proposes a universal intelligent driving domain hardware platform and an intelligent driving car. The universal intelligent driving domain hardware platform includes: a main board 1 and a sub-board 2; the main board 1 is provided with a microcontroller 11 and multiple communication modules 12; the sub-board 2 is provided with a system-level chip 21; the main board 1 is connected to the sub-board 2 via a connector, the microcontroller 11 is respectively connected to the system-level chip 21 and the multiple communication modules 12, and the system-level chip 21 is connected to the multiple communication modules 12; the communication module 12 is used to interact with the microcontroller 11 and the system-level chip 21 via bus signals. In order to meet the requirements of different levels of vehicles to be equipped with different system-level chips 21, the same set of baseboards (main board 1) are used to adapt different system-level chips 21 (sub-board 2), which can avoid repeated development, accelerate the software and hardware iteration cycle, and reduce development costs.

[0060] Based on this, an embodiment of the present application provides a universal intelligent driving domain hardware platform.

[0061] refer to Figure 1 , Figure 1 This is a structural diagram of the first embodiment of the universal intelligent driving domain hardware platform proposed in the embodiments of this application.

[0062] Considering that the same baseboard (mainboard 1) can be used to adapt different system-level chips 21 (sub-board 2), in order to avoid repeated development, accelerate the software and hardware iteration cycle, and reduce development costs. The universal intelligent driving domain hardware platform described in this embodiment includes: mainboard 1 and sub-board 2;

[0063] The mainboard 1 is provided with a microcontroller 11 and a plurality of communication modules 12;

[0064] The sub-board 2 is provided with a system-level chip 21;

[0065] The main board 1 is connected to the sub-board 2 via a connector, the microcontroller 11 is connected to the system-level chip 21 and the plurality of communication modules 12 respectively, and the system-level chip 21 is connected to the plurality of communication modules 12;

[0066] The communication module 12 is used to interact with the microcontroller 11 and the system-on-chip 21 through bus signals.

[0067] It should be noted that the mainboard 1 is also connected to all vehicle signals, including power supply module, ground signal, and several peripheral devices 3. Figure 1As shown, the mainboard 1 includes an MCU (microcontroller 11) primary power supply, an MCU, a peripheral power supply module, each communication power supply module, each communication module 12, and an SOC (system-on-chip 21) primary power supply. The MCU includes an MCU chip, a crystal oscillator, a memory and other related circuits. The mainboard 1 may also include temperature detection, UFS (Universal Flash Storage, embedded memory), and Flash memory. The sub-board 2 includes an SOC secondary power supply module, an SOC, and an SOC memory chip module (DDR (Double Data Rate, double data rate), eMMC (Embedded Multi Media Card, embedded memory)). The SOC memory chip module contains DDR, eMMC, Flash, UFS and other related circuits. The communication module 12 includes an Ethernet communication module, a Serdes (Serializer / Deserializer) module, an IMU (Inertial Measurement Unit) communication module, and interaction signals between the SOC and the Ethernet communication module, such as SGMII (Serial Gigabit Media Independent Interface) and RGMII (Reduced Gigabit Media Independent Interface); interaction signals between the SOC and the Serdes module, such as MIPI (Mobile Industry Processor Interface) and IIC (Inter-Integrated Circuit); interaction signals between the MCU and the SOC, such as GPIO (General Purpose Input Output), IIC, and SPI (Serial Peripheral Interface). The IMU communication module is used for IMU data transmission and configuration information transmission. The interaction processor of the IMU communication module is the SOC, and the interaction interface includes RESET reset and SPI, which are located on the main board 1.

[0068] It is understandable that if Figure 2 As shown, Figure 2 This is a side view of the mainboard and subboard of the universal intelligent driving domain hardware platform for this application. Mainboard 1 and subboard 2 each have a floating connector, through which interface cables are routed. Subboard 2 and mainboard 1 are fixed together by positioning posts. Subboard 2 includes a SOC secondary power supply, SOC memory chip module, and SOC secondary power supply. Mainboard 1 is a universal component, and the positioning posts can be adjusted according to actual conditions to accommodate SOC subboards 2 of different sizes.

[0069] In a specific implementation, the communication module 12 is used to interact with the microcontroller 11 and the system-level chip 21 through bus signals, that is, the component information of the main board 1 and the sub-board 2 is interacted. Most of the circuit modules are arranged on the main board 1, and the sub-board 2 can be used to be compatible with SOCs of different computing powers and different manufacturers, reducing the workload of redevelopment.

[0070] Furthermore, considering the power supply to the components in the main board 1 and the sub-board 2, the universal intelligent driving domain hardware platform of this embodiment further includes: a power supply module;

[0071] The power supply module is respectively connected to the microcontroller 11, the plurality of communication modules 12 and the system-on-chip 21;

[0072] The power supply module is used to receive a voltage signal from a power source and reduce the voltage to a power supply signal, which is then sent to the microcontroller 11 , the plurality of communication modules 12 and the system-on-chip 21 .

[0073] It is understandable that the voltage signal can be 12V or 3.3V, and can also be set according to actual conditions, which is not limited in this embodiment. The power supply signal includes a first power supply signal, a second power supply signal, a third power supply signal and a fourth power supply signal.

[0074] In a specific implementation, the power supply module is used to receive the voltage signal of the power supply and step down the voltage into a power supply signal to power the components on the main board 1 and the sub-board 2.

[0075] Furthermore, the power supply module described in this embodiment includes: a microcontroller power supply module, a chip power supply module, a communication power supply module and a peripheral power supply module;

[0076] The microcontroller power supply module is connected to the microcontroller 11, the chip power supply module is connected to the system-on-chip 21, the communication power supply module is connected to the plurality of communication modules 12, and the peripheral power supply module is connected to the plurality of peripheral devices 3;

[0077] The microcontroller power supply module is used to supply power to the microcontroller 11 upon receiving a first power supply signal;

[0078] The chip power supply module is configured to supply power to the system-on-chip 21 upon receiving a second power supply signal;

[0079] The communication power supply module is configured to supply power to the communication module 12 upon receiving a third power supply signal;

[0080] The peripheral power supply module is used to supply power to the plurality of peripheral devices 3 when receiving a fourth power supply signal.

[0081] It should be noted that the microcontroller power supply module is the MCU primary power supply. The MCU primary power supply includes a PMIC (Power Management IC) and a power management chip, which is used to provide power for the MCU, for example: 5V, 3.3V or 1.8V. The interactive processor of the MCU primary power supply is the MCU. The interactive interface includes enable, power acquisition, diagnosis, watchdog, RESET, etc., which are located on the main board 1. The peripheral power supply module includes an ultrasonic radar power supply module and a camera power supply module. Each communication power supply module includes a CAN communication power supply module, an Ethernet communication power supply module, a Serdes power supply module, an ultrasonic communication power supply module, an IMU power supply module, and a GNSS (Global Navigation Satellite System) power supply module. The ultrasonic radar power supply module is used to power the ultrasonic radar and the communication module 12, for example: 12V, 5V, 3.3V. The interactive processor of the ultrasonic radar power supply module is the MCU. The interactive interface includes enable, power acquisition, diagnosis, etc., which are located on the main board 1. The camera power supply module supplies power to the camera, for example: 12V. The interactive processor of the camera power supply module is an MCU. The interactive interface includes enable, power acquisition, diagnosis, etc., and is located on the main board 1. The CAN communication power supply module is used to provide power to the CAN transceiver, for example: 12V, 5V, 3.3V. The interactive processor of the CAN communication power supply module is an MCU. The interactive interface includes enable, power acquisition, diagnosis, etc., and is located on the main board 1. The Ethernet communication power supply module is used to supply power to the Ethernet, for example: 3.3V, 1.8V, 1.5V, 1.05V. The interactive processor of the Ethernet communication power supply module is an MCU. The interactive interface includes enable, power acquisition, diagnosis, etc., and is located on the main board 1. The Serdes power supply module is used to supply power to the Serdes module (serializer in this embodiment), generally 3.3V, 1.8V, 1.2V, 1.0V. The interactive processor of the Serdes power supply module is an MCU. The interactive interface includes enable, power acquisition, diagnosis, etc., and is located on the main board 1. The ultrasonic communication power supply module provides power to the ultrasonic communication chip. Its interactive processor is an MCU, and its interactive interfaces include enable, power collection, and diagnostics. It is located on Mainboard 1. The IMU power supply module provides power to the IMU communication module. For example, it uses a 3.3V supply. Its interactive processor is an SoC, and its interactive interfaces include enable, power collection, and diagnostics. It is located on Mainboard 1. The GNSS power supply module provides power to the GNSS module. For example, it uses a 3.3V supply. Its interactive processor is an SoC, and its interactive interfaces include enable, power collection, and diagnostics. It is located on Mainboard 1.The SOC primary power supply is located on the main board 1, and the SOC secondary power supply is located on the sub-board 2. The chip power supply module includes the SOC primary power supply and the SOC secondary power supply. The SOC primary power supply supplies power to the SOC secondary power supply, generally converting 12V to 5V. The SOC secondary power supply module supplies power to the SOC and storage chip, generally 3.3V, 1.8V, 1.1V, 0.8V, etc.

[0082] It can be understood that the first power supply signal, the second power supply signal, the third power supply signal and the fourth power supply signal are voltage signals, which can be set according to actual conditions and are not limited in this embodiment.

[0083] In a specific implementation, the corresponding modules are powered by a microcontroller power supply module, a chip power supply module, a communication power supply module and a peripheral power supply module.

[0084] Furthermore, in order to enhance the functions of the car and thus improve driving safety, the universal intelligent driving domain hardware platform of this embodiment further includes: a plurality of peripheral devices 3;

[0085] The plurality of peripheral devices 3 are respectively connected to the communication module 12;

[0086] The plurality of peripheral devices 3 are configured to receive control instructions from the microcontroller 11 , obtain corresponding information according to the control instructions from the microcontroller 11 , and feed the corresponding information back to the microcontroller 11 .

[0087] It should be noted that the peripheral device 3 includes CAN (Controller Area Network), Ethernet, IMU, GNSS, ultrasonic radar, camera, high-side driver, low-side driver, GPIO input and output, etc. High-side driver (HSD) refers to a controllable switch connected to the power supply end of the circuit, which controls the on-off of the circuit by turning on the power supply end, for example: control of seats, lighting, wipers and fans. Low-side driver (LSD) refers to a controllable switch connected to the ground end of the circuit, which controls the on-off of the circuit by turning on the ground wire, for example: commonly used for loads related to the powertrain (motor and heater).

[0088] In a specific implementation, the plurality of peripheral devices 3 are used to receive control instructions from the microcontroller 11, obtain corresponding information according to the control instructions of the microcontroller 11 and feed back the information to the microcontroller 11, thereby enhancing the functions of the vehicle and improving driving safety.

[0089] Furthermore, the peripheral device 3 includes: a radar module;

[0090] The radar modules are respectively connected to the communication modules 12;

[0091] The radar module is used to send obstacle information to the microcontroller 11 when obstacle information is detected;

[0092] The microcontroller 11 is further configured to adjust the vehicle distance when obstacle information is received.

[0093] It should be noted that the radar module is an ultrasonic radar communication module, including an ultrasonic radar transceiver, and communicates with the MCU. The interactive processor of the ultrasonic radar communication module is the MCU, and the interactive interfaces include DSI (Digital Signal Interface), SPI, and RESET, which are located on the main board 1. The microcontroller 11 in this embodiment can be understood as an electronic control unit ECU.

[0094] Ultrasonic radar transmits high-frequency ultrasonic waves (common frequencies include 40kHz, 48kHz, and 58kHz), receives the reflected signals from obstacles, and calculates the time difference between the round trip signals to measure distance. Obstacle information refers to obstacles that may affect the safe driving of the vehicle.

[0095] In a specific implementation, the radar module is used to send obstacle information to the microcontroller 11 when obstacle information is detected; the microcontroller 11 is also used to adjust the vehicle distance when obstacle information is received, thereby improving driving safety.

[0096] Furthermore, the peripheral device 3 further includes: a camera module;

[0097] The camera modules are respectively connected to the communication modules 12;

[0098] The camera module is used to send road information to the microcontroller 11 when detecting road information;

[0099] The microcontroller 11 is further configured to adjust the vehicle speed upon receiving road information.

[0100] It should be noted that the road information is road condition information. The microcontroller 11 in this embodiment can be understood as an electronic control unit ECU.

[0101] In a specific implementation, the camera module is used to send road information to the microcontroller 11 when detecting road information; the microcontroller 11 is also used to adjust the vehicle speed when receiving the road information, thereby improving driving safety.

[0102] Furthermore, the peripheral device 3 further includes: a navigation module;

[0103] The navigation module is connected to the communication module 12;

[0104] The navigation module is used to send the vehicle position information to the microcontroller 11 when detecting the vehicle position information;

[0105] The microcontroller 11 is further configured to control the vehicle's driving path upon receiving the vehicle's position information.

[0106] It should be noted that the vehicle location information includes the longitude and latitude of the vehicle. The microcontroller 11 in this embodiment can be understood as an electronic control unit ECU.

[0107] In a specific implementation, the navigation module is used to send the vehicle position information to the microcontroller 11 when detecting the vehicle position information; the microcontroller 11 is also used to control the vehicle's driving path when receiving the vehicle position information, thereby improving driving safety.

[0108] Based on the first embodiment of the present application, in the second embodiment of the present application, the same or similar contents as those in the first embodiment can be referred to the above introduction and will not be described in detail later. Figure 3 , Figure 3 This is a structural diagram of the second embodiment of the universal intelligent driving domain hardware platform proposed in the embodiments of this application.

[0109] Considering the circuit that only interacts with the MCU (microcontroller 11), the communication module 12 in this embodiment includes: multiple CAN transceivers;

[0110] The plurality of CAN transceivers are connected to the microcontroller 11 and the plurality of peripheral devices 3;

[0111] The plurality of CAN transceivers are configured to interact with the microcontroller 11 via a first bus signal;

[0112] The multiple CAN transceivers are further configured to communicate with the multiple peripheral devices 3 via a second bus signal.

[0113] It should be noted that the CAN transceiver is a CAN communication module, and the interactive processor of the CAN communication module is the MCU. The interactive interfaces include CANTX (the transmit pin of the CAN transceiver), CANRX (the receive pin of the CAN transceiver), and SPI, which are located on Main Board 1. The CAN transceiver is located on Main Board 1 and interacts with the outside world through CANH (the high-level signal line in the CAN bus) and CANL (the low-level signal line in the CAN bus). At the same time, the CAN transceiver interacts with the MCU through signals such as SPI, RX (the receive pin of the CAN transceiver), TX (the transmit pin of the CAN transceiver), and GPIO. When replacing the SOC (sub-board 2), the circuit of Main Board 1 can be reused without change.

[0114] It is understandable that the first bus signal is an SPI bus, which can also be set according to actual conditions. The second bus signal is a CAN bus, which can also be set according to actual conditions.

[0115] In a specific implementation, the plurality of CAN transceivers are used to interact with the microcontroller 11 through a first bus signal; the plurality of CAN transceivers are also used to communicate with the plurality of peripheral devices 3 through a second bus signal. When the SOC (sub-board 2) is replaced, the circuit of the main board 1 can be reused without change, thereby avoiding repeated development, accelerating the software and hardware iteration cycle, and reducing development costs.

[0116] Based on the second embodiment of the present application, in the third embodiment of the present application, the same or similar contents as those in the second embodiment can be referred to the above introduction and will not be described in detail later. Figure 4 , Figure 4 This is a structural diagram of the third embodiment of the universal intelligent driving domain hardware platform proposed in the embodiments of this application.

[0117] Considering the circuits that only interact with the SOC (system on chip 21), the communication module 12 of this embodiment further includes: a plurality of serializers;

[0118] The plurality of serializers are respectively connected to the system-on-chip 21 and the plurality of peripheral devices 3;

[0119] The plurality of serializers are configured to interact with the system-on-chip 21 via a third bus signal and convert the parallel data stream of the system-on-chip 21 into a serial data stream;

[0120] The plurality of serializers are further configured to communicate with the plurality of peripheral devices 3 via a fourth bus signal.

[0121] It should be noted that the serializer belongs to the SerDes communication module. The interaction processor of the SerDes communication module is a SoC. Its interaction interfaces include MIPI and I2C (Inter-Integrated Circuit) and are located on Mainboard 1. Each serializer communicates with peripheral devices such as cameras and display devices via the GMSL (Gigabit Multimedia Serial Links) bus. The SerDes power supply module provides power to the serializer chip, for example, 3.3V, 1.8V, 1.2V, or 1.0V, with the specific setting depending on the serializer chip. The serializer communicates with the SoC on Sub-Board 2 via the MIPI bus, which is connected to Sub-Board 2 via a floating connector. The serializer (communication module) and SerDes power supply module are both located on Mainboard 1. When replacing the SoC, Sub-Board 2 is designed according to the interface definitions and signal types of Mainboard 1, and the circuitry of Mainboard 1 does not need to be modified.

[0122] It is understandable that the third bus signal is a MIPI bus, which can also be set according to actual conditions. The fourth bus signal is a GMSL bus, which can also be set according to actual conditions.

[0123] In a specific implementation, the plurality of serializers are used to interact with the system-on-chip 21 through a third bus signal and convert the parallel data stream of the system-on-chip 21 into a serial data stream; the plurality of serializers are also used to communicate with the plurality of peripheral devices 3 through a fourth bus signal. When replacing the SOC, the sub-board 2 is designed according to the interface definition and signal type of the main board 1, and the circuit of the main board 1 does not need to be changed, thereby avoiding repeated development, accelerating the software and hardware iteration cycle, and reducing development costs.

[0124] In addition, to achieve the above objectives, the present application also proposes an intelligent driving car, which includes the universal intelligent driving domain hardware platform described in any of the above items.

[0125] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A universal intelligent driving domain hardware platform, characterized by: The general intelligent driving domain hardware platform includes: a main board and a sub-board; The mainboard is provided with a microcontroller and a plurality of communication modules; The sub-board is provided with a system-level chip; The main board is connected to the sub-board via a connector, the microcontroller is connected to the system-level chip and the plurality of communication modules respectively, and the system-level chip is connected to the plurality of communication modules; The communication module is used to interact with the microcontroller and the system-on-chip through bus signals.

2. The universal intelligent driving domain hardware platform according to claim 1, characterized in that: The universal intelligent driving domain hardware platform further includes: a power supply module; The power supply module is respectively connected to the microcontroller, the plurality of communication modules and the system-on-chip; The power supply module is used to receive a voltage signal from a power supply and reduce the voltage to a power supply signal, which is then sent to the microcontroller, the plurality of communication modules and the system-on-chip.

3. The universal intelligent driving domain hardware platform according to claim 2, characterized in that: The general intelligent driving domain hardware platform also includes: a plurality of peripheral devices; A plurality of the peripheral devices are respectively connected to the communication module; The plurality of peripheral devices are used to receive control instructions from the microcontroller, obtain corresponding information according to the control instructions from the microcontroller, and feed back the corresponding information to the microcontroller.

4. The universal intelligent driving domain hardware platform according to claim 3, characterized in that: The power supply module includes: a microcontroller power supply module, a chip power supply module, a communication power supply module and a peripheral power supply module; The microcontroller power supply module is connected to the microcontroller, the chip power supply module is connected to the system-on-chip, the communication power supply module is connected to the plurality of communication modules, and the peripheral power supply module is connected to the plurality of peripheral devices; The microcontroller power supply module is configured to supply power to the microcontroller upon receiving a first power supply signal; The chip power supply module is configured to supply power to the system-on-chip upon receiving a second power supply signal; The communication power supply module is configured to supply power to the communication module upon receiving a third power supply signal; The peripheral power supply module is used to supply power to the plurality of peripheral devices when receiving a fourth power supply signal.

5. The universal intelligent driving domain hardware platform according to claim 3, characterized in that: The communication module includes: a plurality of CAN transceivers; A plurality of the CAN transceivers are connected to the microcontroller and the plurality of the peripheral devices; The plurality of CAN transceivers are configured to interact with the microcontroller via a first bus signal; The multiple CAN transceivers are further configured to communicate with the multiple peripheral devices via a second bus signal.

6. The universal intelligent driving domain hardware platform according to claim 3, characterized in that: The communication module further includes: a plurality of serializers; The plurality of serializers are respectively connected to the system-on-chip and the plurality of peripheral devices; a plurality of the serializers, configured to interact with the system-on-chip via a third bus signal and convert the parallel data stream of the system-on-chip into a serial data stream; The plurality of serializers are further configured to communicate with the plurality of peripheral devices via a fourth bus signal.

7. The universal intelligent driving domain hardware platform according to claim 3, characterized in that: The peripheral equipment includes: a radar module; The radar modules are respectively connected to the communication modules; The radar module is configured to send obstacle information to the microcontroller when obstacle information is detected; The microcontroller is further configured to adjust the vehicle distance when obstacle information is received.

8. The universal intelligent driving domain hardware platform according to claim 3, characterized in that: The peripheral device further includes: a camera module; The camera modules are respectively connected to the communication modules; The camera module is configured to send the road information to the microcontroller when detecting the road information; The microcontroller is further configured to adjust the vehicle speed upon receiving road information.

9. The universal intelligent driving domain hardware platform according to claim 3, characterized in that: The peripheral device further includes: a navigation module; The navigation module is connected to the communication module; The navigation module is configured to send the vehicle position information to the microcontroller when detecting the vehicle position information; The microcontroller is also used to control the vehicle's driving path when receiving vehicle position information.

10. An intelligent driving car, characterized in that: The intelligent driving car includes the universal intelligent driving domain hardware platform according to any one of claims 1 to 9.

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