Method for replacing novel design method of glass substrate to reduce power consumption of super-computing chip

Abstract

The invention belongs to the technical field of super-computing chip power consumption reduction, and particularly relates to a novel design method for replacing a glass substrate to reduce super-computing chip power consumption, which comprises the following specific steps: step 1, setting a base material of an ultrathin organic matter core material, performing laser, cutting and appearance inspection on the basic material to obtain an organic core material; 2, the organic matter core material is pre-baked, and a cover is attached to the surface of the pre-baked organic matter core material; and 3, inversely mounting the chip on the organic matter core material, aligning the chip with the organic matter core material, and welding the chip and the organic matter core material. The power supply integrity of the AI chip is greatly improved, and the energy consumption is greatly reduced while the computing power is improved; the electrical performance is improved, the power consumption is reduced, and the problem of fragile mechanical structure is overcome; while the electrical performance is improved and the power consumption is reduced, the heat dissipation capability still keeps the optimal exposed state of the silicon body.

Description

Technical Field

[0001] The present invention relates to the technical field of reducing the power consumption of supercomputer chips, and specifically to a method for reducing the power consumption of supercomputer chips by replacing a glass substrate with a new design method. Background Art

[0002] Some chip manufacturers produce system-in-package (SiP) systems for data centers, featuring dozens of small tiles that can consume thousands of watts of power. These SiPs require dense interconnections between the chiplets, while ensuring that the entire package does not warp due to heat during production or use. To address the stress matching and deformation issues between increasingly large chips and the organic substrate, while also providing improved heat dissipation, the fiberglass fabric substrate is directly replaced with glass without changing the overall structure. Glass-based (printed) boards have a coefficient of thermal expansion (CTE) very close to that of the components (for example, borosilicate glass has a CTE of approximately 3.3) and a zero humidity coefficient, making them ideal as IC substrates.

[0003] like Figure 2 As shown, the fiberglass cloth substrate is replaced with a glass substrate, the structure remains unchanged, and the chip body is exposed to the air as a whole, which can be directly convected for heat dissipation, or directly attached to a heat sink for heat dissipation during the subsequent assembly process. In the packaging of ultra-large AI / CPU / GPU chips, this structure of ultra-thick substrate (generally >800um) + large exposed chip has almost become standard. This structure achieves a balance between mechanical stress and heat dissipation. In order to dissipate heat, the entire chip is directly exposed to the air. As the size of the chip becomes larger and larger, the mechanical matching between the organic carrier board and the chip becomes worse and worse. Therefore, companies such as Intel and Nvidia use glass with a thermal expansion coefficient closer to silicon (CTE=2.8) as a substrate to solve mechanical and thermal problems. Therefore, the core material in the current substrate uses a fiberglass cloth substrate and a glass substrate to improve electrical performance, with a thickness of at least 800-1200 μm. Laser drilling followed by acid and alkaline etching provides more reliable mechanical properties than organic substrates. Heat dissipation is also addressed because the chip itself is exposed to air and the silicon thermal conductivity is 153 W / m·K. However, with the current solution, the 800-1200 μm core thickness leads to poor power integrity as computing power continues to increase. This poses a significant threat to power supply as demand for AI computing power continues to accelerate. Summary of the Invention

[0004] The purpose of the present invention is to provide a new design method to replace the glass substrate to reduce the power consumption of supercomputer chips, so as to solve the problems raised in the above background technology.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a novel design method for replacing a glass substrate to reduce the power consumption of a supercomputer chip. The specific steps of the novel design method for replacing a glass substrate to reduce the power consumption of a supercomputer chip are as follows: Step 1: Set the base material of the ultra-thin organic core material, and obtain the organic core material after the base material undergoes laser cutting, cutting, and appearance inspection; Step 2: pre-bake the organic core material and apply a cover to the surface of the pre-bake organic core material; Step 3: Flip the chip onto the organic core material, align it with the organic core material, and solder it.

[0006] Preferably, before the chip and the organic core material are aligned, soldering flux is pre-set on the organic core material, and after soldering, the soldering flux on the organic core material is cleaned.

[0007] Preferably, the flux is cleaned by plasma cleaning.

[0008] Preferably, after the chip and the organic core material are welded, the bottom of the chip is filled and the filler is cured.

[0009] Preferably, after the filler is cured, the chip and the organic core material are subjected to quality inspection, drying and packaging.

[0010] Preferably, the organic core material is pre-plated with copper.

[0011] Preferably, after the chip is welded to the organic core material, the surface of the organic core material is covered with a heat dissipation mixture, and the heat dissipation mixture covers the surface of the chip.

[0012] Preferably, the heat dissipation mixture is a mixture of silicon dioxide particles and organic matter.

[0013] Preferably, the heat dissipation mixture is a mixture of aluminum oxide particles and organic matter.

[0014] Preferably, the upper surface of the heat dissipation mixture is covered with a soft film, and the soft film is pressed onto the upper surface of the heat dissipation mixture by a pressing mold.

[0015] Compared with the prior art, the present invention has the following beneficial effects: Significantly improve the power integrity of AI chips, significantly reducing energy consumption while increasing computing power; Improve electrical performance, reduce power consumption, and overcome the problem of fragile mechanical structure; While improving electrical performance and reducing power consumption, the heat dissipation capability still maintains the optimal state of silicon body exposure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of the present invention; Figure 2 It is a structural diagram of the prior art.

[0017] In the figure: 1. Press mold; 2. Soft film; 3. Heat dissipation mixture; 4. Full copper plating; 5. Organic core material. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0020] Example 1: See also Figure 1-2 The present invention provides a technical solution: a new design method for replacing glass substrates to reduce the power consumption of supercomputer chips. The specific steps of the new design method for replacing glass substrates to reduce the power consumption of supercomputer chips are as follows: Step 1: Setting the base material of the ultra-thin organic core material 5, and obtaining the organic core material 5 after the base material undergoes laser cutting, cutting, and appearance inspection; Step 2: pre-bake the organic core material 5 and cover the surface of the pre-bake organic core material 5. The organic core material 5 is pre-plated with copper 4. Step 3: Flip the chip onto the organic core material 5, align it with the organic core material 5, and solder it.

[0021] Using an ultra-thin organic core material 5 instead of a glass substrate significantly improves power integrity, but this approach leads to significant mechanical fragility. In the current model, the silicon core is exposed above the ultra-thin organic core material 5, making the chip carrier extremely susceptible to fracture. Therefore, mechanical reinforcement is required to protect the chip carrier and chip reliability, while also leaving the silicon core exposed for heat dissipation.

[0022] illustrate: Using an ultra-thin organic core material 5 instead of a glass substrate improves power integrity by an order of magnitude, significantly contributing to reducing the power consumption of AI chips. Because the ultra-thin organic core material 5 is so thin, its mechanical aperture can be fully plated with copper. Assuming a 200µm aperture, fully plated with copper, the flow area is 31,400µm². However, with an 800µm glass substrate or 800µm fiberglass cloth substrate with a 200µm aperture, the hole depth is too deep, and the copper plating process can only cover 10-15µm, resulting in a maximum flow area of 706.5µm² (when the copper thickness is 15µm). This new method allows the core material's flow area to be 44 times larger than that of the glass substrate, significantly reducing power supply impedance. As AI chips grow in size, the ultra-thin organic core material 5 used is too thin, resulting in a fragile mechanical structure and easy breakage. Therefore, in order to strengthen the mechanical structure, a customized mechanical reinforcement structure for AI chips is developed to complement the electrical performance design with improved power integrity.

[0023] This mechanical reinforcement structure can be a mixture of organic matter and silica particles, or a mixture of organic matter and other high-heat dissipation particles. If heat dissipation is to be enhanced, it can also be a mixture of aluminum oxide particles. These organic and inorganic mixtures are bonded to the organic chip carrier and surround the AI chip, making its mechanical structure very strong, but at the same time it must be ensured that the top of the AI chip body is exposed to the air.

[0024] Example 2: See also Figure 1-2 The present invention provides a technical solution based on the first embodiment: before the chip and the organic core material 5 are aligned, a soldering flux is pre-set on the organic core material 5, and after soldering, the soldering flux on the organic core material 5 is cleaned. The soldering flux is cleaned by plasma cleaning.

[0025] Analysis of the above content: The main functions of cleaning flux are as follows: Corrosion Prevention: If certain components of the flux remain after soldering, they may react with moisture and oxygen in the air, corroding the soldering area and surrounding metal materials, affecting the long-term stability and reliability of electronic equipment. For example, some acidic flux residues may gradually corrode the copper foil traces on the circuit board, causing disconnection or short circuits.

[0026] Improved Insulation: Residual flux can reduce the insulation resistance between different circuits on a circuit board. This reduced insulation can easily lead to faults like leakage and short circuits, impacting the normal operation of electronic equipment. Removing flux ensures good insulation between circuits on the circuit board.

[0027] Ensure appearance quality: Flux residue often forms a layer of stains or residue on the soldering area, affecting the appearance of the circuit board. For electronic devices with high requirements for appearance, such as consumer electronics, cleaning the flux can make the circuit board surface clean and tidy, improving the overall quality image of the product.

[0028] Easier inspection and repair: After removing the flux, the circuit board surface is clean, making subsequent electrical inspection and troubleshooting easier. During inspection, it is more accurate to determine whether solder joints have problems such as cold solder joints and short circuits. During repairs, it is also easier to re-solder soldered parts or replace components. Excessive flux residue can mask soldering defects, making inspection and repair more difficult.

[0029] Plasma cleaning uses a high-frequency electric field generated by an RF power supply in a vacuum environment to ionize gases into plasma. Plasma contains a large number of high-energy particles, such as electrons, ions, and free radicals. These particles have high energy and activity, and can react physically and chemically with flux residues.

[0030] Physical effect: The high-energy particles in the plasma collide with the surface of the flux residue, breaking the molecular bonds in the residue, turning it into small molecules, which are then pumped out by the vacuum pump.

[0031] Chemical action: The active particles in the plasma react chemically with the flux residue, converting it into volatile substances, thereby achieving the purpose of flux removal. For example, oxygen plasma can oxidize organic flux residue into carbon dioxide and water, which can be exhausted from the system through a vacuum pump.

[0032] advantage Efficient cleaning: It can quickly and thoroughly remove flux residues from the welding surface, improving welding quality and reliability.

[0033] No damage: Plasma cleaning is a non-contact cleaning method that does not cause mechanical or thermal damage to welded parts and is suitable for a variety of sensitive electronic components and materials.

[0034] Environmentally friendly and safe: No chemical solvents are required, which avoids the pollution of the environment and the harm to the health of operators. At the same time, the waste gas generated during the plasma cleaning process is mainly harmless substances such as carbon dioxide and water, which are easy to handle.

[0035] Good uniformity: Uniform plasma can be generated throughout the cleaning chamber to ensure consistent cleaning effects on the surface of the object being cleaned, and good cleaning effects can also be achieved for welded parts with complex shapes and structures.

[0036] Example 3: See also Figure 1-2 Based on the first embodiment, the present invention provides a technical solution: after soldering the chip to the organic core material 5, the bottom of the chip is filled and the filler is solidified. After the filler is solidified, the chip and the organic core material 5 are quality inspected, dried, and packaged.

[0037] Example 4: See also Figure 1-2 The present invention provides a technical solution based on the first embodiment: after the chip is welded to the organic core material 5, the surface of the organic core material 5 is covered with a heat dissipation mixture 3, and the heat dissipation mixture 3 covers the surface of the chip.

[0038] The heat dissipation mixture 3 includes the following two components: The first type: the heat dissipation mixture 3 is a mixture of silicon dioxide particles and organic matter.

[0039] The second type: the heat dissipation mixture 3 is a mixture of aluminum oxide particles and organic matter.

[0040] Embodiment 5: See also Figure 1-2 The present invention provides a technical solution based on the first embodiment: the upper surface of the heat dissipation mixture 3 is covered with a soft film 2, and the soft film 2 is pressed on the upper surface of the heat dissipation mixture 3 based on the lower pressing mold 1.

[0041] Analysis of the above content: The pressing mold 1 presses the soft film 2 downward, so that the soft film 2 is tightly attached to the upper surface of the heat dissipation mixture 3.

[0042] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is limited by the appended claims rather than the above description. Therefore, it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention, and any figure signs in the claims should not be regarded as limiting the claims involved.

[0043] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A novel design method for replacing glass substrates to reduce the power consumption of supercomputer chips, characterized in that: The specific steps of the new design method for replacing glass substrates to reduce the power consumption of supercomputer chips are as follows: Step 1: setting the base material of the ultra-thin organic core material (5), and obtaining the organic core material (5) after the base material is laser-cut, cut, and inspected for appearance; Step 2: pre-baking the organic core material (5), and covering the surface of the pre-baked organic core material (5); Step 3: Flip the chip onto the organic core material (5), align it with the organic core material (5), and weld it.

2. The method of claim 1, wherein: Before the chip and the organic core material (5) are aligned, soldering flux is set on the organic core material (5) in advance, and after soldering, the soldering flux on the organic core material (5) is cleaned.

3. The method of claim 2, wherein the novel design method for replacing glass substrates to reduce power consumption of supercomputer chips is characterized in that: Plasma cleaning is used to clean the flux.

4. The method of claim 1, wherein: After the chip and the organic core material (5) are welded, the bottom of the chip is filled and the filling is solidified.

5. The method of claim 4, wherein: After the filler is solidified, the chip and the organic core material (5) are subjected to quality inspection, drying and packaging as a whole.

6. The method of claim 1, wherein: The organic core material (5) is pre-plated with copper (4).

7. The method of claim 1, wherein: After the chip and the organic core material (5) are welded, the surface of the organic core material (5) is covered with a heat dissipation mixture (3), and the heat dissipation mixture (3) covers the surface of the chip.

8. The method of claim 7, wherein: The heat dissipation mixture (3) is a mixture of silicon dioxide particles and organic matter.

9. The method of claim 7, wherein: The heat dissipation mixture (3) is a mixture of aluminum oxide particles and organic matter.

10. The method for reducing the power consumption of supercomputer chips by using a novel design method for replacing glass substrates according to claim 7, 8 or 9, characterized in that: The upper surface of the heat dissipation mixture (3) is covered with a soft film (2), and the soft film (2) is pressed onto the upper surface of the heat dissipation mixture (3) based on the lower pressing mold (1).

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