Rotation holding unit, bonding platform and bonding device

Abstract

The present invention discloses a rotating holding unit, a bonding platform and a bonding device, which belong to the technical field of semiconductor material processing equipment. The rotating holding unit includes a holding assembly, a driving assembly and a connecting assembly. The holding assembly includes a first holding member and a second holding member arranged in a stacked manner, the first holding member includes a first side and a second side arranged opposite to each other, the first side is configured to carry semiconductor materials, and the second side is configured to receive external force. The second holding member includes a through area, and the through area satisfies the requirement that external force can be applied to the second side of the first holding member. The driving assembly drives the second holding member to rotate around the axis. The connecting assembly is used to connect the first holding member and the second holding member, and the elastic member is configured so that when an external force is applied to the second side of the first holding member, the elastic member tends to compress to reduce the force transmitted by the connecting assembly to the second holding member. The present invention can reduce the possibility of the pressurizing device affecting the motion mechanism and improve the bonding yield.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor material processing equipment, and in particular to a rotation holding unit, a bonding platform and a bonding device. Background Art

[0002] In the field of semiconductor manufacturing, the bonding platform realizes the three-dimensional interconnection between chips and wafers through precision motion control. The bonding platform usually includes two supporting areas, in which the chip and wafer are fixed respectively. The chip and wafer can be bonded by applying pressure.

[0003] Typically, the two bearing areas of the bonding platform are arranged relative to each other, and the bonding process can be achieved by simply lifting and lowering. However, the relative arrangement of the two bearing areas is not conducive to the placement of semiconductor materials, and it is easy for the materials to collide with the structure on the bonding platform when they are manually or mechanically placed. Therefore, a motion mechanism is added to the bonding platform to drive the movement of the bearing area to avoid the problem of collision with the bonding platform during manual or mechanical placement of materials. However, during the bonding process, the bearing area needs to withstand a large pressure, and the pressure will be transmitted to the motion mechanism through the bearing area, which will cause the accuracy of the motion mechanism to be reduced or even damaged, reducing the service life and reliability of the bonding platform.

[0004] This section provides background information related to the present application which is not necessarily prior art. Summary of the Invention

[0005] The object of the present invention is to provide a rotation holding unit, a bonding platform and a bonding device, which can reduce the possibility of a pressurizing device affecting a motion mechanism and improve the bonding yield.

[0006] To achieve the above objectives, the following technical solutions are provided:

[0007] A rotation holding unit, comprising:

[0008] A holding assembly comprising a first holding member and a second holding member stacked together, wherein the first holding member comprises a first side and a second side disposed opposite to each other, the first side being disposed away from the second holding member and configured to support semiconductor material, and the second side being disposed toward the second holding member and configured to receive an external force;

[0009] The second retaining member includes a through area, and the through area satisfies the requirement of allowing the external force to be applied to the second side of the first retaining member;

[0010] a driving assembly, drivingly connected to the second retaining member, and configured to drive the second retaining member to rotate about an axis;

[0011] A connecting component is used to connect the first retaining member and the second retaining member, and the connecting component includes an elastic member, which is configured so that when the external force is applied to the second side of the first retaining member, the elastic member tends to compress to reduce the force transmitted by the connecting component to the second retaining member.

[0012] As an optional solution for the rotation holding unit, the connecting assembly further includes a guide rod, a first end of the guide rod is located on a side of the second holding member facing away from the first holding member, and a second end of the guide rod is fixedly connected to the first holding member.

[0013] As an optional solution of the rotation holding unit, the elastic member is sleeved between the first end of the guide rod and the second holding member.

[0014] As an optional solution of the rotation holding unit, the second holding member includes a through hole, the guide rod is passed through the through hole, and the guide rod is movably arranged relative to the second holding member.

[0015] As an optional solution for the rotation holding unit, the first holding member includes a first main body and a frame, the first main body and the frame are detachably connected, the first main body includes a first side and a second side, and the first main body is connected to the second holding member through the frame.

[0016] As an optional solution of the rotation holding unit, the second holding member includes a second main body portion and the through area, and the second main body portion is used to connect with the driving assembly.

[0017] There is also provided a bonding platform comprising a plate configured with a main holding unit and a rotation holding unit according to any of the aforementioned embodiments;

[0018] The main holding unit is used to hold the first semiconductor material; the rotating holding unit is used to hold the second semiconductor material;

[0019] The bonding platform includes at least a first state and a second state;

[0020] The first state is that the positions of the main holding unit and the rotating holding unit are such that the angle between the first semiconductor material and the second semiconductor material held by them is maintained between 170° and 180°;

[0021] The second state is that the positions of the main holding unit and the rotating holding unit satisfy that the first semiconductor material and the second semiconductor material held by them are parallel and opposite to each other.

[0022] As an optional solution for the bonding platform, in the second state, the first side of the first retaining member and the main retaining unit are used to maintain one side of the first semiconductor material in parallel and opposite to each other; the first side and the main retaining unit are used to maintain the distance between the side of the first semiconductor material is less than the limit deformation distance of the elastic member.

[0023] A bonding apparatus is also provided, comprising a process chamber and a bonding chamber connected to each other; the bonding apparatus further comprising a bonding platform and a guide rail as described in any of the aforementioned embodiments. The guide rail is used to carry the bonding platform and to transport the bonding platform between the process chamber and the bonding chamber.

[0024] As an alternative to the bonding device, it includes a third state and a fourth state;

[0025] The third state is when the bonding platform is in the process chamber and the bonding platform is in the first state;

[0026] The fourth state is when the bonding platform is in the bonding chamber and the bonding platform is in the second state.

[0027] As an optional solution of the bonding device, a pressure member is further included, at least one of which can pass through the penetration area of ​​the second retaining member when the bonding device is in the fourth state to apply external force to the second side of the first retaining member.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The bonding platform and bonding device provided by the present invention have a retaining assembly capable of retaining semiconductor materials. After the driving assembly drives the retaining assembly to rotate to a preset position, an external pressure member applies pressure to the first retaining member to cause the first retaining member to move in a direction away from the second retaining member, thereby driving the elastic member to undergo elastic deformation with a compression trend. A portion of the pressure load transmitted from the pressure member to the second retaining member via the first retaining member is converted into elastic potential energy, while simultaneously reducing the peak force transmitted to the driving assembly. This in turn reduces the pressure load transmitted from the pressure member to the second retaining member via the first retaining member, thereby reducing the possibility of deformation or even damage to the second retaining member and / or the driving assembly under the action of the pressure load, thereby improving the bonding yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0031] Figure 1 This is a simplified schematic diagram of a bonding platform in a first state according to an embodiment of the present invention;

[0032] Figure 2 is a simplified schematic diagram of a bonding platform in a second state according to an embodiment of the present invention;

[0033] Figure 3 This is a schematic structural diagram of a rotation holding unit in an embodiment of the present invention;

[0034] Figure 4 for Figure 3 A schematic diagram of an amplified structure of P;

[0035] Figure 5 2 is a bottom view structural diagram of a rotation holding unit according to an embodiment of the present invention;

[0036] Figure 6 for Figure 5 A schematic diagram of a cross-sectional structure of AA;

[0037] Figure 7 for Figure 5 Another cross-sectional structural diagram of AA;

[0038] Figure 8 is a simplified schematic diagram of a bonding device in a third state according to an embodiment of the present invention;

[0039] Figure 9 is a simplified schematic diagram of a bonding device in a fourth state according to an embodiment of the present invention;

[0040] Figure 10 This is a simplified schematic diagram of a bonding device in an embodiment of the present invention.

[0041] Reference numerals:

[0042] 1000, bonding equipment; 100, bonding platform; 110, plate; 120, main holding unit; 130, rotation holding unit; 200, guide rail; 300, process chamber; 400, bonding chamber; 500, pressurizing member; C1, first semiconductor material; C2, second semiconductor material;

[0043] 10. Holding assembly; 11. First holding member; 111. First main body; 112. Frame; 12. Second holding member; 121. Through-area; 122. Second main body; S1. First side; S2. Second side; 20. Driving assembly; 30. Connecting assembly; 31. Elastic member; 32. Guide rod; 321. Rod body; 322. Connecting portion; 33. Linear guide member; 34. Limiting member; X, first direction. DETAILED DESCRIPTION

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0045] In the description of the present invention, it should be noted that the terms "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, or are the orientation or position relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0046] In the description of the present invention, it should be noted that, unless otherwise specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0047] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0048] Figure 1 FIG. 4 is a simplified schematic diagram of a bonding platform in a first state according to an embodiment of the present invention. Figure 2 FIG. 4 is a simplified schematic diagram of a bonding platform in a second state according to an embodiment of the present invention. Figure 3 Schematic diagram of the structure of a rotation holding unit in an embodiment of the present invention. Figure 4 for Figure 3 Schematic diagram of an amplified structure of P. Figure 5 2 is a bottom view structural diagram of a rotation holding unit in an embodiment of the present invention. Figure 6 for Figure 5 Schematic diagram of a cross-sectional structure of AA. Figure 7 for Figure 5 Another cross-sectional structural diagram of AA. Figure 8 This is a simplified schematic diagram of a bonding device in a third state according to an embodiment of the present invention. Figure 9 This is a simplified schematic diagram of a bonding device in a fourth state according to an embodiment of the present invention. Figure 10 This is a simplified schematic diagram of a bonding device in an embodiment of the present invention. Figures 3 to 7 The drive assembly is not shown. Figure 6 is a schematic diagram of the cross-sectional structure when the pressure member does not apply pressure to the first retaining member, Figure 7 is a schematic cross-sectional view of the pressure member applying pressure to the first retaining member, and Figure 6 and Figure 7 The pressurizing member is not shown. Figure 10 The process chamber, bonding chamber, plate, and drive assembly are not shown.

[0049] See also Figures 1 to 10 The embodiment of the present invention provides a rotation holding unit 130, which includes a holding assembly 10, a driving assembly 20, and a connecting assembly 30. The holding assembly 10 includes a first holding member 11 and a second holding member 12 arranged in a stacked manner. The first holding member 11 includes a first side S1 and a second side S2 arranged opposite to each other. The first side S1 is arranged opposite to the second holding member 12 and is configured to support semiconductor materials. The second side S2 is arranged toward the second holding member 12 and is configured to receive external force. The second holding member 12 includes a through region 121. The through region 121 satisfies the requirement that an external force can be applied to the second side S2 of the first holding member 11. The driving assembly 20 is transmission-connected to the second holding member 12 and is used to drive the second holding member 12 to rotate around an axis. The connecting assembly 30 is used to connect the first holding member 11 and the second holding member 12. The connecting assembly 30 includes an elastic member 31. The elastic member 31 is configured so that when an external force is applied to the second side S2 of the first holding member 11, the elastic member 31 is compressed to reduce the force transmitted from the connecting assembly 30 to the second holding member 12.

[0050] The retaining assembly 10 includes a first retaining member 11 and a second retaining member 12 arranged in a stacked manner. The first retaining member 11 and the second retaining member 12 are stacked in sequence along a first direction X. The first retaining member 11 includes a first side S1 and a second side S2 arranged in opposite directions along the first direction X. The first side S1 is the side facing the semiconductor material and is capable of directly or indirectly supporting the semiconductor material. "Bearing" here refers to the ability to fix the semiconductor material to the first side S1. The second side S2 is the side facing the second retaining member 12. Optionally, a portion of the surface of the second side S2 can abut the second retaining member 12; alternatively, a connecting assembly 30 is provided between the second side S2 and the second retaining member 12. The pressure head of the pressurizing member 500 can directly abut the second side S2. Of course, the pressure head of the pressurizing member 500 can also abut the second side S2 through an intermediate mechanism. Optionally, the intermediate mechanism includes an elastic material.

[0051] The drive assembly 20 is connected to the second retaining member 12 to drive the second retaining member 12 to rotate about its axis. Since the second retaining member 12 is connected to the first retaining member 11 via the connecting assembly 30, the retaining assembly 10 as a whole rotates about its axis, driving the semiconductor material to a predetermined position. Once the semiconductor material has rotated to the predetermined position, the pressure member 500 abuts the second side S2 to apply pressure to the first retaining member 11, thereby achieving the semiconductor material bonding process. When the first retaining member 11 is subjected to pressure, the elastic member 31 compresses and elastically deforms to offset the pressure load, thereby reducing the pressure load transmitted to the second retaining member 12 and the drive assembly 20, thereby reducing the risk of deformation or even damage to the second retaining member 12 and the drive assembly 20 under the action of the pressure load.

[0052] Optionally, the driving assembly 20 includes a rotating mechanism, which drives the holding assembly 10 to rotate to a preset position. Optionally, the preset position can be a position where two semiconductor materials to be bonded face each other and the distance between them is within a preset range.

[0053] Optionally, the number of connection components 30 includes one or more.

[0054] Optionally, the semiconductor material includes a wafer, a chip, or other receptor substrate.

[0055] In these optional embodiments, the retaining assembly 10 is capable of retaining semiconductor material. When an external force is applied to the second side S2 of the first retaining member 11, the first retaining member 11 moves away from the second retaining member 12, thereby causing the elastic member 31 to undergo elastic deformation in a compressive trend. A portion of the pressure load transmitted from the pressurizing member 500 to the second retaining member 12 via the first retaining member 11 is converted into elastic potential energy, while simultaneously reducing the peak force transmitted to the driving assembly 20. This, in turn, reduces the pressure load transmitted from the pressurizing member 500 to the second retaining member 12 via the first retaining member 11, thereby reducing the possibility of deformation or even damage to the second retaining member 12 and / or the driving assembly 20 under the action of the pressure load, thereby improving the bonding yield.

[0056] In some optional embodiments, the connecting assembly 30 further includes a guide rod 32 , a first end of the guide rod 32 is located on a side of the second retaining member 12 facing away from the first retaining member 11 , and a second end of the guide rod 32 is fixedly connected to the first retaining member 11 .

[0057] When the first retaining member 11 and the second retaining member 12 move relative to each other (separate from or approach each other), the guide rod 32 can play a guiding role, thereby reducing the possibility of misalignment of the first retaining member 11 and the second retaining member 12 after the relative movement, and improving the movement accuracy of the first retaining member 11 and the second retaining member 12.

[0058] In some optional embodiments, the elastic member 31 is sleeved between the first end of the guide rod 32 and the second retaining member 12 .

[0059] Optionally, the elastic member 31 includes a spring.

[0060] Optionally, the guide rod 32 may include a rod body 321 and a connecting portion 322. The connecting portion 322 is located at a first end of the guide rod 32, and the radial dimension of the guide rod 32 is smaller than the radial dimension of the connecting portion 322. The connecting portion 322 and a portion of the rod body 321 are located on a side of the second retaining member 12 facing away from the first retaining member 11. The elastic member 31 is disposed between the connecting portion 322 and a side of the second retaining member 12 facing the connecting portion 322. The rod body 321 is fixedly connected to the first retaining member 11.

[0061] The elastic member 31 applies pressure to the second retaining member 12 under the restriction of the guide rod 32, so that the elastic member 31 and the first retaining member 11 clamp the second retaining member 12, so that the first retaining member 11 moves with the second retaining member 12, thereby achieving the overall movement of the retaining assembly 10. When the pressure member 500 applies pressure to the first retaining member 11, the first retaining member 11 will separate from the second retaining member 12 when it is under pressure. The first retaining member 11 drives the guide rod 32 to move. When the guide rod 32 moves, the connecting portion 322 of the guide rod 32 applies pressure to the elastic member 31, causing the elastic member 31 to be elastically compressed. The elastic member 31 can buffer the pressure load, avoid a rigid connection between the pressure member 500 and the drive assembly 20, and reduce the possibility of fracture at the connection between the drive assembly 20 and the second retaining member 12.

[0062] In some optional embodiments, the second retaining member 12 includes a through hole, the guide rod 32 passes through the through hole, and the guide rod 32 is movably arranged relative to the second retaining member 12 .

[0063] Optionally, a portion of the rod body 321 of the guide rod 32 (the second end and the portion close to the second end) passes through the through hole and is fixedly connected to the first retaining member 11 .

[0064] The above-mentioned arrangement in the embodiment of the present application is conducive to reducing the overall size of the first retaining member 11, thereby reducing the overall size of the retaining assembly 10 and improving the integration of the retaining unit.

[0065] In some other examples, the projection of the second retaining member 12 along the first direction X falls within the projection of the first retaining member 11 along the first direction X, and a through hole may not be provided on the second retaining member 12, and the guide rod 32 is connected only in the area where the first retaining member 11 exceeds the second retaining member 12.

[0066] In some optional embodiments, a linear guide 33 is provided in the through hole, and the guide rod 32 is passed through the linear guide 33. The linear guide 33 can improve the movement accuracy of the guide rod 32, reduce the possibility of the guide rod 32 shaking, and improve the movement accuracy of the first holding member under the action of the pressure member 500.

[0067] Optionally, the linear guide 33 comprises a linear bearing.

[0068] Optionally, the connecting assembly 30 also includes a limit member 34, which is arranged on the side of the second retaining member 12 facing away from the first retaining member 11. The limit member 34 is arranged above the through hole. The limit member 34 limits the axial movement of the linear guide member 33. At the same time, the setting of the limit member 34 can also make part of the linear guide member 33 located outside the second retaining member 12, thereby reducing the thickness of the second retaining member 12 and reducing the overall weight.

[0069] In some optional embodiments, the first retaining member 11 includes a first main body 111 and a frame 112, the first main body 111 and the frame 112 are detachably connected, the first main body 111 includes a first side S1 and a second side S2, and the first main body 111 is connected to the second retaining member 12 through the frame 112.

[0070] Optionally, when it is necessary to place the semiconductor material on the first side S1 of the first main body 111, the first main body 111 and the frame 112 can be separated first. After the semiconductor material is placed on the first side S1 of the first main body 111, the first main body 111 can be connected to the frame 112, thereby reducing the difficulty of placing the semiconductor material. At the same time, the first main body 111 is connected to the second retaining member 12 through the frame 112 and the connecting assembly 30. The pressure exerted on the first main body 111 is transmitted to the second retaining member 12 through the frame 112 and the connecting assembly 30. When the pressure exerted on the first main body 111 is too great, the frame 112 and the connecting assembly 30 preferably undergo plastic deformation relative to the second retaining member 12, thereby reducing the possibility of damage to the drive assembly 20. Moreover, maintenance can be achieved by simply replacing the retaining assembly 10, reducing the difficulty of maintenance.

[0071] In some optional embodiments, the second retaining member 12 includes a second main body portion 122 and a through region 121 , and the second main body portion 122 is used to connect with the driving assembly 20 .

[0072] Optionally, the second main body portion 122 may be a frame structure.

[0073] Optionally, the second main body portion 122 and the first retaining member 11 are connected via a connecting assembly 30. Optionally, the second main body portion 122 and the frame 112 are connected via a connecting assembly 30.

[0074] Optionally, the penetrating region 121 is provided along the first direction X and penetrates the second main body portion 122 .

[0075] When the pressurizing member 500 needs to abut against and pressurize the first retaining member 11 , the pressurizing member 500 can pass through the through area 121 , thereby reducing the possibility of interference between the second retaining member 12 and the pressurizing member 500 .

[0076] Exemplarily, the projection of the second main body 122 along the first direction X is a continuous closed shape. The second main body 122 encloses the through-region 121, which is a through-hole structure. This allows the middle of the second retaining member 12 to allow the pressure member 500 to pass through to apply pressure to the first retaining member 11. At the same time, the edge of the second retaining member 12 is connected to the driving assembly 20 to reduce the possibility of interference between the driving assembly 20 and the pressure member 500. Furthermore, the connecting assembly 30 can connect the second main body 122 and the frame 112 to improve the uniformity of the pressure load borne by the second retaining member 12.

[0077] See also Figures 1 to 10 An embodiment of the present invention provides a bonding platform 100, which includes a plate 110. The plate 110 is provided with a main holding unit 120 and a rotation holding unit 130 of any of the above-mentioned embodiments. The main holding unit 120 is used to hold a first semiconductor material C1. The rotation holding unit 130 is used to hold a second semiconductor material C2. The bonding platform 100 includes at least a first state and a second state. In the first state, the positions of the main holding unit 120 and the rotation holding unit 130 satisfy that the angle between the first semiconductor material C1 and the second semiconductor material C2 they hold is maintained between 170° and 180°. In the second state, the positions of the main holding unit 120 and the rotation holding unit 130 satisfy that the first semiconductor material C1 and the second semiconductor material C2 they hold are parallel and opposite.

[0078] Since the bonding platform 100 provided in the embodiment of the present application includes the rotation holding unit 130 of any of the above embodiments, the bonding platform 100 provided in the embodiment of the present application has the beneficial effects of the rotation holding unit 130 of any of the above embodiments, which will not be repeated here.

[0079] Optionally, the plate 110 may include a hollow area, and the rotation holding unit 130 and the main holding unit 120 are both located in the hollow area.

[0080] Optionally, the positions of the main holding unit 120 and the rotating holding unit 130 satisfy that the angle between the first semiconductor material C1 and the second semiconductor material C2 they hold is 170°, 171°, 172°, 173°, 174°, 175°, 176°, 177°, 178°, 179° or 180°.

[0081] Optionally, the main holding unit 120 can be fixed in a preset position and not move. The main holding unit 120 can serve as a reference. When switching from the second state to the first state, the drive assembly 20 in the rotation holding unit 130 drives the rotation holding unit 130 to rotate until the angle between the first semiconductor material C1 and the second semiconductor material C2 is between 170° and 180°, thereby placing the bonding platform 100 in the first state. When switching from the first state to the second state, the drive assembly 20 in the rotation holding unit 130 drives the rotation holding unit 130 to rotate until the first semiconductor material C1 and the second semiconductor material C2 are parallel and opposite to each other, thereby placing the bonding platform 100 in the second state.

[0082] It should be noted that the angle between the first semiconductor material C1 and the second semiconductor material C2 can be the angle between the holding surface (first holding surface) of the main holding unit 120 holding the first semiconductor material C1 and the holding surface (second holding surface) of the rotating holding unit 130 holding the second semiconductor material C2. Alternatively, it can be the angle between the bonding surface of the first semiconductor material C1 and the bonding surface of the second semiconductor material C2. Accordingly, the first semiconductor material C1 and the second semiconductor material C2 being parallel and opposite can be understood as the first holding surface being parallel and opposite. Alternatively, the bonding surface of the first semiconductor material C1 and the bonding surface of the second semiconductor material C2 can be parallel and opposite.

[0083] In some optional embodiments, in the second state, the first side S1 of the first retaining member 11 and the main retaining unit 120 are used to maintain one side of the first semiconductor material C1 in parallel and opposite to each other; the first side S1 and the main retaining unit 120 are used to maintain a distance between one side of the first semiconductor material C1 that is less than the limit deformation distance of the elastic member 31.

[0084] It can be understood that the limit deformation distance may be the maximum elastic deformation of the elastic member. For example, if the maximum elastic deformation of the elastic member is 10 mm, then the limit deformation distance is 10 mm.

[0085] When the bonding platform 100 is in the second state, the first semiconductor material C1 and the second semiconductor material C2 are positioned opposite each other and spaced apart. After the first semiconductor material C1 and the second semiconductor material C2 are aligned, pressure is applied to the first semiconductor material C1 and the second semiconductor material C2. When pressure is applied to the first semiconductor material C1 and the second semiconductor material C2, the driving assembly 20 stops moving, and the pressure member 500 applies pressure to the first retaining member 11, bringing the first semiconductor material C1 and the second semiconductor material C2 closer together until bonding is completed. The distance between the first side S1 and the side of the main holding unit 120 used to hold the first semiconductor material C1 can be the distance that the first holding member 11 moves along the pressurizing direction during the pressurization process. The distance that the first holding member 11 moves along the pressurizing direction is set to be less than the limit deformation distance of the connecting component 30, so that the deformation of the connecting component 30 is still elastic deformation when the semiconductor material completes bonding, thereby reducing the pressure load transmitted to the second holding member 12 and the driving component 20, thereby reducing the possibility of the second holding member 12 and the driving component 20 being deformed or even damaged under the action of the pressure load.

[0086] It is understood that "holding" here refers to fixing the semiconductor material in a specific area. Optionally, the fixing method may include vacuum adsorption, bonding, or placing the semiconductor material on a supporting platform of a bonding device and relying on gravity or other load forces to achieve fixation.

[0087] See also Figures 1 to 10 An embodiment of the present invention provides a bonding apparatus 1000, comprising a process chamber 300 and a bonding chamber 400 that are connected. The bonding apparatus 1000 further comprises a bonding platform 100 according to any of the above embodiments and a guide rail 200, wherein the guide rail 200 is used to carry the bonding platform 100 and to transport the bonding platform 100 between the process chamber 300 and the bonding chamber 400.

[0088] Since the bonding device 1000 provided in the embodiment of the present application includes the bonding platform 100 of any of the above embodiments, the bonding device 1000 provided in the embodiment of the present application has the beneficial effects of the bonding platform 100 of any of the above embodiments, which will not be repeated here.

[0089] Optionally, the process chamber 300 includes an activation chamber and a coating chamber. Optionally, the bonding apparatus 1000 also includes a loading chamber, which is optionally connected to the process chamber 300. The guide rail 200 can also carry the bonding platform 100 for transport between the loading chamber and the process chamber 300.

[0090] In some optional embodiments, the bonding apparatus 1000 includes a third state and a fourth state. The third state is when the bonding platform 100 is in the process chamber 300 and is in the first state. The fourth state is when the bonding platform 100 is in the bonding chamber 400 and is in the second state.

[0091] When the bonding platform 100 is in the process chamber 300 , the angle between the first holding surface of the main holding unit 120 and the second holding surface of the rotation holding unit 130 (ie, the first side S1 of the first holding member 11 ) in the bonding platform 100 is between 170° and 180°.

[0092] When the bonding platform 100 is in the bonding chamber 400 , the first holding surface of the main holding unit 120 and the second holding surface of the rotation holding unit 130 (ie, the first side S1 of the first holding member 11 ) in the bonding platform 100 are parallel and opposite to each other.

[0093] It is understood that the process of switching the bonding platform 100 from the first state to the second state can be performed after the semiconductor material completes the relevant process in the process chamber 300. Of course, the state can also be switched during the process of the guide rail 200 transporting the bonding platform 100 from the process chamber 300 to the bonding chamber 400. Alternatively, the state can be switched after the bonding platform 100 enters the bonding chamber 400. This embodiment of the present application is not limited to this.

[0094] In some optional embodiments, the bonding device 1000 further includes a pressure member 500 , and at least one of the pressure members 500 can pass through the through area 121 of the second retaining member 12 when the bonding device 1000 is in the fourth state to apply external force to the second side S2 of the first retaining member 11 .

[0095] It can be understood that the bonding of semiconductor materials is to bond two semiconductor materials together to form a new stacked structure. Both the main holding unit 120 and the rotating holding unit 130 require a pressure member 500 to apply pressure to them, so as to ensure that the force is uniform during the bonding process of the two semiconductor materials. Therefore, at least one of the pressure members 500 can be a pressure member 500 that applies pressure to the rotating holding unit 130. When the bonding platform 100 is in the bonding chamber 400 and the first semiconductor material C1 held by the main holding unit 120 and the second semiconductor material C2 held by the rotating holding unit 130 are parallel and opposite, the pressure member 500 can pass through the through area 121 of the second holding member 12 and abut against the first holding member 11, thereby applying pressure to the second side S2 of the first holding member 11. Optionally, the pressure member 500 can directly abut against the second side S2 of the first holding member 11, and can also transmit the pressure to the second side S2 of the first holding member 11 through an intermediate mechanism. Optionally, the intermediate mechanism includes an elastic structure.

[0096] The bonding platform provided by the present invention can simultaneously process two semiconductor materials under the same process environment in the same process chamber, such as surface activation treatment, coating treatment, etc., so that the surfaces of the two semiconductor materials are highly consistent, which is conducive to subsequent processing. At the same time, real-time synchronous monitoring can be carried out, and the bonding parameters of the two (such as interface temperature and stress distribution) can be synchronously monitored through external sensors, which facilitates the rapid location of process anomalies, eliminates chamber environment factors when single-piece semiconductor material bonding anomalies occur, focuses on material or parameter optimization, and improves the efficiency of anomaly processing.

[0097] The bonding equipment provided by the present invention can simultaneously process the surfaces of two semiconductor materials without leaving the equipment chamber, and can bond the two simultaneously processed semiconductor materials, avoiding adverse factors introduced by material exiting the cavity and improving the bonding quality.

[0098] The bonding device provided by the present invention can realize bonding of multiple layers of semiconductor materials in the same device chamber through the cooperation of the main holding unit and the rotation holding unit of the bonding platform.

[0099] Note that the above are only preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments, and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments and may include many other equivalent embodiments without departing from the concept of the present invention. The scope of the present invention is determined by the scope of the appended claims.

Claims

1. A rotation holding unit, characterized in that: include: A holding assembly (10) comprises a first holding member (11) and a second holding member (12) arranged in a stacked manner, wherein the first holding member (11) comprises a first side (S1) and a second side (S2) arranged in opposite directions, the first side (S1) being arranged facing away from the second holding member (12) and being configured to support semiconductor material; and the second side (S2) being arranged facing the second holding member (12) and being configured to receive an external force. The second retaining member (12) comprises a through region (121), and the through region (121) satisfies the requirement of enabling the external force to be applied to the second side (S2) of the first retaining member (11); A driving assembly (20) is transmission-connected to the second retaining member (12) and is used to drive the second retaining member (12) to rotate about an axis; A connecting assembly (30) for connecting the first retaining member (11) and the second retaining member (12), wherein the connecting assembly (30) comprises an elastic member (31), wherein the elastic member (31) is configured such that when the external force is applied to the second side (S2) of the first retaining member (11), the elastic member (31) is compressed to reduce the force transmitted from the connecting assembly (30) to the second retaining member (12).

2. The rotation holding unit according to claim 1, characterized in that: The connecting assembly (30) further comprises a guide rod (32), wherein a first end of the guide rod (32) is located on a side of the second retaining member (12) facing away from the first retaining member (11), and a second end of the guide rod (32) is fixedly connected to the first retaining member (11).

3. The rotation holding unit according to claim 2, characterized in that: The elastic member (31) is sleeved between the first end of the guide rod (32) and the second retaining member (12).

4. The rotation holding unit according to claim 2, characterized in that: The second retaining member (12) comprises a through hole, the guide rod (32) is passed through the through hole, and the guide rod (32) is movably arranged relative to the second retaining member (12).

5. The rotation holding unit according to claim 1, characterized in that: The first retaining member (11) comprises a first main body (111) and a frame (112); the first main body (111) and the frame (112) are detachably connected; the first main body (111) comprises a first side (S1) and a second side (S2); the first main body (111) is connected to the second retaining member (12) via the frame (112). The rotation holding unit according to claim 1 , wherein: The second retaining member (12) comprises a second main body portion (122) and the through-region (121), and the second main body portion (122) is used for connecting to the drive assembly (20).

7. A bonding platform, characterized in that Comprising a plate (110), the plate (110) being provided with a main holding unit (120) and a rotation holding unit (130) according to any one of claims 1 to 6; The main holding unit (120) is used to hold the first semiconductor material (C1); the rotation holding unit (130) is used to hold the second semiconductor material (C2); The bonding platform (100) comprises at least a first state and a second state; The first state is that the positions of the main holding unit (120) and the rotation holding unit (130) satisfy the requirement that the angle between the first semiconductor material (C1) and the second semiconductor material (C2) held by them is maintained between 170° and 180°; The second state is that the positions of the main holding unit (120) and the rotation holding unit (130) satisfy the requirement that the first semiconductor material (C1) and the second semiconductor material (C2) held by them are parallel and opposite.

8. The bonding platform according to claim 7, wherein: In the second state, the first side (S1) of the first retaining member (11) and the main retaining unit (120) are used to maintain one side of the first semiconductor material (C1) in parallel and opposite to each other; the first side (S1) and the main retaining unit (120) are used to maintain a distance between the one side of the first semiconductor material (C1) that is less than the limit deformation distance of the elastic member (31).

9. A bonding device, characterized in that: It comprises a process chamber (300) and a bonding chamber (400) that are connected; The bonding device (1000) further comprises a bonding platform (100) as described in claim 7 or 8 and a guide rail (200), wherein the guide rail (200) is used to carry the bonding platform (100), and the guide rail (200) is used to transport the bonding platform (100) between the process chamber (300) and the bonding chamber (400).

10. The bonding device according to claim 9, wherein It includes a third state and a fourth state; The third state is when the bonding platform (100) is in the process chamber (300), and the bonding platform (100) is in the first state; The fourth state is when the bonding platform (100) is in the bonding chamber (400), and the bonding platform (100) is in the second state.

11. The bonding device according to claim 9, wherein It also includes a pressure member (500), at least one of which is capable of passing through the through area (121) of the second retaining member (12) when the bonding device (1000) is in the fourth state, and applying an external force to the second side (S2) of the first retaining member (11).

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