Positioning device and using method thereof

Abstract

The invention relates to the technical field of mechanical positioning, and particularly discloses a positioning device and a use method thereof.The positioning device comprises a mounting base, a first detection assembly, a crimping assembly, a driving assembly and a positioning assembly; the mounting base is provided with a positioning station, and the suction cup can suck the wafer body to the positioning station; the first detection assembly is arranged on the mounting base; the crimping assembly, the driving assembly and the positioning assembly are all arranged on the mounting base; the crimping assembly, the driving assembly and the positioning assembly are distributed in a triangular shape, and the wafer body can be located among the crimping assembly, the driving assembly and the positioning assembly. According to the positioning device, the positioning position of the notch of the wafer body and the opening direction of the notch can be determined, so that accurate positioning of the notch of the wafer body is realized, the positioning device can accurately position the notch, and the position of the wafer body and the required position are not different, so that the subsequent process is not influenced.

Description

Technical Field

[0001] The present invention relates to the technical field of mechanical positioning, and in particular to a positioning device and a method of using the same. Background Art

[0002] Wafers are the fundamental material for manufacturing semiconductor devices and are made by slicing. The wafer's crystal orientation is crucial to the performance and processing of semiconductor devices. Wafer surfaces with different crystal orientations have different physical and chemical properties, which have varying effects on the device's electrical performance and etching process. Therefore, correct crystal orientation identification must be ensured during processing. Currently, the wafer's flat edge or notch is generally used to quickly determine its specific crystal orientation, thereby guiding subsequent wafer processing operations. The wafer's flat edge or notch also facilitates mechanical positioning of the wafer during the manufacturing process.

[0003] Due to the combined demands of large-sized wafers for production efficiency, material utilization, and process precision, wafer positioning is typically performed by the wafer's notch. In existing technology, when positioning the wafer's notch using a positioning device, an optical sensor is used to identify the notch. However, due to the small size of the wafer notch, the optical sensor cannot accurately locate the notch, resulting in a discrepancy between the wafer's position and the desired position, which in turn affects subsequent processes. Summary of the Invention

[0004] The purpose of the present invention is to provide a positioning device and a method for using the same, so as to solve the problem in the prior art that the notch of the wafer is identified by an optical sensor, but due to the small size of the notch of the wafer, the optical sensor cannot achieve accurate positioning, resulting in a difference between the position of the wafer and the required position, which in turn affects the subsequent process.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] In one aspect, the present invention provides a positioning device for positioning a notch of a wafer body sucked by a suction cup, the positioning device comprising:

[0007] A mounting base, wherein the mounting base has a positioning position, and the suction cup can suck the wafer body to the positioning position;

[0008] a first detection component, the first detection component being provided on the mounting base and being used for detecting the notch of the wafer body;

[0009] A crimping assembly, a driving assembly and a positioning assembly, wherein the crimping assembly, the driving assembly and the positioning assembly are all arranged on the mounting base; the crimping assembly, the driving assembly and the positioning assembly are distributed in a triangle, and the wafer body can be located between the crimping assembly, the driving assembly and the positioning assembly; the crimping assembly is used to crimp the wafer body toward the side close to the driving assembly and the positioning assembly; the driving assembly is used to drive the wafer body to rotate so that the positioning assembly can be embedded in the notch of the wafer body.

[0010] As an optional solution to the above-mentioned positioning device, the crimping assembly includes a crimping motor, a swing rod and a roller. The crimping motor is arranged on the mounting base, one end of the swing rod is connected to the driving end of the crimping motor, and the other end of the swing rod is rotatably connected to the roller; the crimping motor is used to drive the swing rod to swing so that the roller is crimped to the wafer body.

[0011] As an optional solution to the above-mentioned positioning device, the positioning component includes a support seat and a positioning shaft rotatably arranged on the support seat, the support seat is arranged on the mounting base, and the positioning shaft can be embedded in the notch of the wafer body.

[0012] As an optional solution to the above-mentioned positioning device, the driving assembly includes a driving motor and a driving wheel fixed to the driving end of the driving motor. The driving motor is arranged on the mounting base and is used to drive the driving wheel to drive the wafer body to rotate.

[0013] As an optional solution of the above positioning device, the driving wheel is a rubber wheel.

[0014] As an optional solution of the above-mentioned positioning device, the first detection assembly includes a first bracket and a first detection head, the first bracket is rotatably arranged on the mounting base, and the first detection head is movably arranged on the first bracket along the extension direction of the first bracket.

[0015] As an optional solution for the above-mentioned positioning device, when the crimping assembly, the driving assembly and the positioning assembly all abut against the edge of the wafer body, the contact points of the crimping assembly and the wafer body, the contact points of the driving assembly and the wafer body, and the contact points of the positioning assembly and the wafer body are distributed in an acute-angled triangle.

[0016] As an optional solution of the above positioning device, the positioning device further includes a second detection component, which is provided on the mounting base and is used to detect whether the positioning component is embedded in the notch of the wafer body.

[0017] As an optional solution of the above-mentioned positioning device, the mounting base includes a first base, a second base and a connecting base, one end of the connecting base is connected to the first base, and the other end of the connecting base is connected to the second base; the first detection component and the crimping component are both arranged on the first base, and the driving component and the positioning component are both arranged on the second base.

[0018] In another aspect, the present invention provides a method for using a positioning device, using the positioning device as described above, the method for using the positioning device comprises the following steps:

[0019] The wafer body is driven to rotate at the positioning station by rotating the suction cup, and the notch of the wafer body is preliminarily positioned by the first detection component;

[0020] The wafer body is driven to rotate at the positioning station by rotating the suction cup, and the notch is adjusted to a position close to the positioning assembly according to the positioning data of the first detection assembly;

[0021] Pressing the wafer body with a press-fitting assembly so that the press-fitting assembly, the driving assembly, and the positioning assembly all abut against the edge of the wafer body;

[0022] The wafer body is driven to rotate by the driving component, and the wafer body is pressed by the pressing component, so that the positioning component can be embedded in the notch.

[0023] The beneficial effects of the present invention are:

[0024] The positioning device includes a mounting base, a first detection assembly, a crimping assembly, a drive assembly, and a positioning assembly. The mounting base has a positioning station, and the suction cup can suck the wafer body to the positioning station to facilitate the subsequent positioning of the notch of the wafer body at the positioning station. The first detection assembly is provided on the mounting base and is used to detect the notch of the wafer body. After the suction cup rotates the wafer body, the first detection assembly can be used to preliminarily locate the notch of the wafer body. The use of the first detection assembly in this process can improve the efficiency of the positioning device in locating the notch and reduce the time required for subsequent precise positioning. Among them, the crimping assembly, the driving assembly and the positioning assembly are all arranged on the mounting base, and the crimping assembly, the driving assembly and the positioning assembly are distributed in a triangle. The wafer body can be located between the crimping assembly, the driving assembly and the positioning assembly, and the crimping assembly is used to crimp the wafer body toward the side close to the driving assembly and the positioning assembly, so that under the abutment of the crimping assembly, the edge of the wafer body can abut against the driving assembly and the positioning assembly, so that the crimping assembly, the driving assembly and the positioning assembly can perform three-point positioning of the wafer body to improve the position positioning accuracy of the wafer body, and at the same time the driving assembly is used to drive the wafer body to rotate so that the positioning assembly can be embedded It is arranged in the notch of the wafer body, that is, in the process of the driving component driving the wafer body to rotate, the relative position of the wafer body with respect to the mounting base will not change, only the position of the notch will rotate, and in the continuous crimping process of the crimping component, when the wafer body rotates to the positioning component corresponding to the notch, the wafer body will be displaced, so that the positioning component is embedded in the notch, so that the positioning position of the notch and the opening direction of the notch are determined, thereby realizing the precise positioning of the notch of the wafer body. The positioning device accurately positions the notch, and there will be no difference between the position of the wafer body and the required position, so it will not affect the subsequent process.

[0025] The method for using the positioning device provided by the present invention uses the positioning device as described above. The method for using the positioning device is simple, convenient and quick to operate. First, the notch of the wafer body is preliminarily positioned by the first detection component to improve the overall positioning efficiency. Then, the wafer body is positioned at three points by the crimping component, the driving component and the positioning component, so that the position of the wafer body is positioned. Then, the positioning component is embedded in the notch to achieve precise positioning of the position and opening direction of the notch of the wafer body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A first structural diagram of a positioning device provided in an embodiment of the present invention;

[0027] Figure 2 A second structural diagram of the positioning device provided in an embodiment of the present invention;

[0028] Figure 3A first structural diagram of a positioning device provided in an embodiment of the present invention for positioning a wafer body;

[0029] Figure 4 A second structural diagram of the positioning device provided in an embodiment of the present invention positioning a wafer body;

[0030] Figure 5 A flowchart of a method for using a positioning device provided in an embodiment of the present invention is provided.

[0031] In the picture:

[0032] 1. Mounting base; 11. First base; 12. Second base; 13. Connecting base; 2. First detection assembly; 21. First bracket; 22. First detection head; 3. Crimping assembly; 31. Crimping motor; 32. Swing rod; 33. Roller; 4. Driving assembly; 41. Driving motor; 42. Driving wheel; 5. Positioning assembly; 51. Support base; 52. Positioning shaft; 6. Second detection assembly; 61. Second bracket; 62. Second detection head; 7. Wafer body; 71. Notch. DETAILED DESCRIPTION

[0033] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0036] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0037] Example 1

[0038] like Figures 1 to 4 As shown, this embodiment provides a positioning device for positioning the notch 71 of the wafer body 7 sucked by the suction cup.

[0039] The positioning device includes a mounting base 1, a first detection assembly 2, a crimping assembly 3, a drive assembly 4, and a positioning assembly 5. The mounting base 1 has a positioning station, and a suction cup can suck the wafer body 7 to the positioning station to facilitate subsequent positioning of the notch 71 of the wafer body 7 at the positioning station. Specifically, the suction cup can be raised and lowered and rotated to adjust the height of the wafer body 7 and the position of the notch 71.

[0040] The first detection assembly 2 is disposed on the mounting base 1 and is used to detect the notch 71 of the wafer body 7. After the suction cup rotates the wafer body 7, the first detection assembly 2 can be used to perform preliminary positioning of the notch 71 of the wafer body 7. During this process, the use of the first detection assembly 2 can improve the efficiency of the positioning device in positioning the notch 71 and reduce the time required for subsequent precise positioning. After the notch 71 is initially positioned, the position of the notch 71 relative to the mounting base 1 can be adjusted according to the needs of subsequent precise positioning. Specifically, the first detection assembly 2 includes a first bracket 21 and a first detection head 22. The first bracket 21 is rotatably disposed on the mounting base 1. The first detection head 22 is movably disposed on the first bracket 21 along the extension direction of the first bracket 21. By adjusting the rotation angle of the first bracket 21 and the position of the first detection head 22 on the first bracket 21, the position of the first detection head 22 relative to the mounting base 1 can be adjusted, thereby meeting the requirements of the first detection head 22 for preliminary positioning of the notch 71 of the wafer body 7. That is, during the rotation of the wafer body 7, the signal feedback generated by the first detection head 22 at the notch 71 will be lost.

[0041] Among them, the crimping assembly 3, the driving assembly 4 and the positioning assembly 5 are all arranged on the mounting base 1, and the crimping assembly 3, the driving assembly 4 and the positioning assembly 5 are distributed in a triangle. The wafer body 7 can be located between the crimping assembly 3, the driving assembly 4 and the positioning assembly 5, and the crimping assembly 3 is used to crimp the wafer body 7 toward the side close to the driving assembly 4 and the positioning assembly 5, so that under the abutment of the crimping assembly 3, the edge of the wafer body 7 can abut against the driving assembly 4 and the positioning assembly 5, so that the crimping assembly 3, the driving assembly 4 and the positioning assembly 5 can perform three-point positioning on the wafer body 7 to improve the position positioning accuracy of the wafer body 7, and at the same time, the driving assembly 4 is used to drive the wafer body 7 to rotate so that the positioning assembly 5 can be embedded In the notch 71 of the wafer body 7, that is, in the process of the driving component 4 driving the wafer body 7 to rotate, the relative position of the wafer body 7 with respect to the mounting base 1 will not change, only the position of the notch 71 will rotate, and in the continuous crimping process of the crimping component 3, when the wafer body 7 rotates to the positioning component 5 corresponding to the notch 71, the wafer body 7 will be displaced, so that the positioning component 5 is embedded in the notch 71, so that the positioning position of the notch 71 and the opening direction of the notch 71 are determined, thereby realizing the precise positioning of the notch 71 of the wafer body 7. The positioning device accurately positions the notch 71, and there will be no difference between the position of the wafer body 7 and the required position, so it will not affect the subsequent process.

[0042] Specifically, the mounting base 1 includes a first base 11, a second base 12 and a connecting base 13. One end of the connecting base 13 is connected to the first base 11, and the other end of the connecting base 13 is connected to the second base 12. The first detection component 2 and the crimping component 3 are both arranged on the first base 11, and the driving component 4 and the positioning component 5 are both arranged on the second base 12. By dividing the mounting base 1 into three parts, the production and manufacturing of the mounting base 1 can be facilitated, and the difficulty of assembling the positioning device can be reduced.

[0043] Furthermore, the crimping assembly 3 includes a crimping motor 31, a swing arm 32 and a roller 33. The crimping motor 31 is arranged on the mounting base 1, one end of the swing arm 32 is connected to the driving end of the crimping motor 31, and the other end of the swing arm 32 is rotatably connected to the roller 33. The crimping motor 31 is used to drive the swing arm 32 to swing so that the roller 33 is crimped to the wafer body 7. The crimping motor 31 drives the swing arm 32 to drive the roller 33 to swing, which can conveniently adjust the position and force direction of the roller 33 so that the roller 33 applies force to the wafer body 7 toward the side close to the driving assembly 4 and the positioning assembly 5, thereby realizing three-point positioning, and through the rotation of the roller 33 on the swing arm 32, the roller 33 contacts the wafer body 7 roller 33, reducing the difficulty of rotating the wafer body 7, reducing the friction of the wafer body 7 during rotation, and thereby reducing the wear of the wafer body 7.

[0044] Furthermore, the positioning assembly 5 includes a support seat 51 and a positioning shaft 52 rotatably arranged on the support seat 51. The support seat 51 is arranged on the mounting base 1. The positioning shaft 52 can be embedded in the notch 71 of the wafer body 7, so that the roller 33 can be brought into contact with the roller 33 of the wafer body 7 through the rotation of the positioning shaft 52 on the support seat 51, thereby reducing the difficulty of rotating the wafer body 7. When the positioning shaft 52 is embedded in the notch 71, the rolling positioning shaft 52 can effectively avoid collision damage to the wafer body 7 by optimizing the distribution of impact energy and reducing local force.

[0045] Furthermore, the drive assembly 4 includes a drive motor 41 and a drive wheel 42 fixed to the drive end of the drive motor 41. The drive motor 41 is provided on the mounting base 1 and is used to drive the drive wheel 42 to drive the wafer body 7 to rotate, thereby applying force to the wafer body 7 through the rotation of the drive wheel 42. This can ensure stability when the crimping assembly 3, the drive assembly 4, and the positioning assembly 5 perform three-point positioning on the wafer body 7, and avoid dislocation of the wafer body 7 during rotation, which affects the positioning accuracy of the notch 71. Optionally, the drive wheel 42 is a rubber wheel. The rubber wheel has excellent friction performance, excellent wear resistance, good oil resistance, and excellent anti-aging performance. It can meet the driving requirements of the wafer body 7, prevent slipping, and has a long service life.

[0046] Furthermore, when the crimping assembly 3, the driving assembly 4, and the positioning assembly 5 are all in contact with the edge of the wafer body 7, the contact points of the crimping assembly 3 and the wafer body 7, the contact points of the driving assembly 4 and the wafer body 7, and the contact points of the positioning assembly 5 and the wafer body 7 are distributed in an acute-angled triangle, thereby rationally controlling the contact positions and contact angles of the crimping assembly 3, the driving assembly 4, and the positioning assembly 5 with the wafer body 7, respectively, to ensure that the crimping assembly 3, the driving assembly 4, and the positioning assembly 5 can achieve three-point positioning of the wafer body 7. Optionally, when the crimping assembly 3, the driving assembly 4, and the positioning assembly 5 are all in contact with the edge of the wafer body 7, the contact points of the crimping assembly 3 and the wafer body 7, the contact points of the driving assembly 4 and the wafer body 7, and the contact points of the positioning assembly 5 and the wafer body 7 are distributed in an equilateral triangle.

[0047] Furthermore, the positioning device also includes a second detection assembly 6, which is disposed on the mounting base 1 and is used to detect whether the positioning assembly 5 is embedded in the notch 71 of the wafer body 7, ensuring that the positioning device can position the notch 71 of the wafer body 7, and preventing the wafer body 7 from directly entering the next process without being positioned in the notch 71, thereby affecting production. Specifically, the second detection assembly 6 includes a second bracket 61 and a second detection head 62, the second bracket 61 is disposed on the mounting base 1, and the second detection head 62 is disposed on the first bracket 21. Optionally, the first detection head 22 and the second detection head 62 are both laser detection heads.

[0048] Example 2

[0049] The present invention also provides a method for using a positioning device, using the positioning device in the first embodiment.

[0050] like Figure 5 As shown, the method for using the positioning device includes the following steps:

[0051] The wafer body 7 is driven to rotate at the positioning station by the rotation of the suction cup, and the notch 71 of the wafer body 7 is preliminarily positioned by the first detection component 2;

[0052] The wafer body 7 is driven to rotate at the positioning station by the rotation of the suction cup, and the notch 71 is adjusted to a position close to the positioning component 5 according to the positioning data of the first detection component 2;

[0053] The wafer body 7 is crimped by the crimping assembly 3 so that the crimping assembly 3, the driving assembly 4 and the positioning assembly 5 are all in contact with the edge of the wafer body 7;

[0054] The wafer body 7 is driven to rotate by the driving assembly 4 , and the wafer body 7 is pressed by the pressing assembly 3 , so that the positioning assembly 5 can be embedded in the notch 71 .

[0055] The method of using the positioning device is simple, convenient and quick. First, the notch 71 of the wafer body 7 is preliminarily positioned by the first detection component 2 to improve the overall positioning efficiency. Then, the wafer body 7 is positioned at three points by the crimping component 3, the driving component 4 and the positioning component 5, so that the position of the wafer body 7 is positioned. Then, the positioning component 5 is embedded in the notch 71 to achieve precise positioning of the position and opening direction of the notch 71 of the wafer body 7.

[0056] Furthermore, after the wafer body 7 is crimped by the crimping assembly 3 and before the positioning assembly 5 is embedded in the notch 71, it is also included that the second detection assembly 6 is used to judge whether the positioning assembly 5 is embedded in the notch 71 of the wafer body 7, that is, when the notch 71 of the wafer body 7 is aligned with the positioning assembly 5, the crimping assembly 3 can push the wafer body 7 to move as a whole, so that the positioning assembly 5 is embedded in the notch 71 of the wafer body 7. At this time, due to the overall movement of the wafer body 7, the second detection assembly 6 can detect the signal feedback generated by the overall movement of the wafer body 7 to determine that the positioning assembly 5 is embedded in the notch 71 of the wafer body 7. At the same time, the second detection assembly 6 is communicatively connected to the drive assembly 4. When the positioning assembly 5 is embedded in the notch 71 of the wafer body 7, the second detection assembly 6 feeds back a signal to the drive assembly 4 to control the drive assembly 4 to stop working.

[0057] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A positioning device for positioning a notch (71) of a wafer body (7) sucked by a suction cup, characterized in that: The positioning device comprises: A mounting base (1), the mounting base (1) having a positioning station, the suction cup being capable of sucking the wafer body (7) to the positioning station; a first detection component (2), the first detection component (2) being arranged on the mounting base (1) and being used for detecting the notch (71) of the wafer body (7); A crimping assembly (3), a driving assembly (4) and a positioning assembly (5), wherein the crimping assembly (3), the driving assembly (4) and the positioning assembly (5) are all arranged on the mounting base (1); the crimping assembly (3), the driving assembly (4) and the positioning assembly (5) are distributed in a triangular shape, and the wafer body (7) can be located between the crimping assembly (3), the driving assembly (4) and the positioning assembly (5); the crimping assembly (3) is used to crimp the wafer body (7) toward a side close to the driving assembly (4) and the positioning assembly (5); and the driving assembly (4) is used to drive the wafer body (7) to rotate so that the positioning assembly (5) can be embedded in the notch (71) of the wafer body (7).

2. The positioning device according to claim 1, characterized in that The crimping assembly (3) comprises a crimping motor (31), a swing rod (32) and a roller (33); the crimping motor (31) is arranged on the mounting base (1); one end of the swing rod (32) is connected to the driving end of the crimping motor (31); the other end of the swing rod (32) is rotatably connected to the roller (33); the crimping motor (31) is used to drive the swing rod (32) to swing so that the roller (33) is crimped to the wafer body (7).

3. The positioning device according to claim 1, characterized in that The positioning assembly (5) comprises a support seat (51) and a positioning shaft (52) rotatably arranged on the support seat (51); the support seat (51) is arranged on the mounting base (1); and the positioning shaft (52) can be embedded in the notch (71) of the wafer body (7).

4. The positioning device according to claim 1, characterized in that The driving assembly (4) comprises a driving motor (41) and a driving wheel (42) fixedly arranged at a driving end of the driving motor (41); the driving motor (41) is arranged on the mounting base (1) and is used to drive the driving wheel (42) to drive the wafer body (7) to rotate.

5. The positioning device according to claim 4, characterized in that The driving wheel (42) is a rubber wheel.

6. The positioning device according to claim 1, characterized in that The first detection assembly (2) comprises a first bracket (21) and a first detection head (22); the first bracket (21) is rotatably mounted on the mounting base (1); and the first detection head (22) is movably mounted on the first bracket (21) along an extension direction of the first bracket (21).

7. The positioning device according to claim 1, characterized in that When the crimping assembly (3), the driving assembly (4) and the positioning assembly (5) all abut against the edge of the wafer body (7), the contact points of the crimping assembly (3) and the wafer body (7), the contact points of the driving assembly (4) and the wafer body (7), and the contact points of the positioning assembly (5) and the wafer body (7) are distributed in an acute-angle triangle.

8. The positioning device according to claim 1, characterized in that The positioning device further comprises a second detection component (6), which is arranged on the mounting base (1) and is used to detect whether the positioning component (5) is embedded in the notch (71) of the wafer body (7).

9. The positioning device according to any one of claims 1 to 8, characterized in that: The mounting base (1) comprises a first base (11), a second base (12) and a connecting base (13), one end of the connecting base (13) is connected to the first base (11), and the other end of the connecting base (13) is connected to the second base (12); the first detection component (2) and the crimping component (3) are both arranged on the first base (11), and the driving component (4) and the positioning component (5) are both arranged on the second base (12).

10. A method for using a positioning device, characterized in that: Using the positioning device according to any one of claims 1 to 9, the method for using the positioning device comprises the following steps: The wafer body (7) is driven to rotate at the positioning station by rotating the suction cup, and the notch (71) of the wafer body (7) is preliminarily positioned by the first detection component (2); The wafer body (7) is driven to rotate at the positioning station by the rotation of the suction cup, and the notch (71) is adjusted to a position close to the positioning component (5) according to the positioning data of the first detection component (2); The wafer body (7) is crimped by a crimping assembly (3), so that the crimping assembly (3), the driving assembly (4) and the positioning assembly (5) all abut against the edge of the wafer body (7); The wafer body (7) is driven to rotate by the driving component (4), and the wafer body (7) is pressed by the pressing component (3), so that the positioning component (5) can be embedded in the notch (71).

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