A flat panel phased array antenna and communication device

Abstract

The application discloses a flat plate phased array antenna and communication equipment, the flat plate phased array antenna comprises a phased array chip layer, a cold plate layer and a control layer arranged in sequence from top to bottom; wherein the phased array chip layer comprises a plurality of phased array chips, the phased array chips are in contact with the upper surface of the cold plate layer through silicon grease, the cold plate layer comprises a cold plate body, a cold pipe embedded in the cold plate body and a sawtooth type heat dissipation tooth, the control layer comprises a main control board, a plurality of power supply chips and a conductive connecting piece arranged on the main control board, the power supply chips are in contact with the lower surface of the cold plate layer, the conductive connecting piece vertically penetrates the cold plate layer to connect the phased array chip layer and the control layer, the output end of the power supply chip is connected with the conductive connecting piece, and the first voltage direct current and the second voltage direct current are provided for the phased array chips through the conductive connecting piece, so that the heat dissipation efficiency can be effectively improved, and high-power current transmission of the phased array antenna is realized.

Description

Technical Field

[0001] This invention relates to the field of communication antenna technology, and in particular to a planar phased array antenna and communication equipment. Background Technology

[0002] Existing phased array antenna technologies often rely on multi-layer board technology and methods such as compressing the number of antenna layers and signal transmission layers to integrate the entire phased array antenna. In such phased array antennas, the phased array chip, power module, and control circuit are usually integrated on the same PCB board. However, having the phased array chip and power chip on the same layer leads to heat concentration during high-power current transmission, which is difficult to dissipate and has low heat dissipation efficiency. Ultimately, the only solution to the overheating problem is to reduce the power, which in turn affects the antenna performance and makes it impossible to effectively achieve high-power current transmission in phased array antennas. Summary of the Invention

[0003] The purpose of this invention is to at least solve one of the technical problems existing in the prior art. This invention proposes a planar phased array antenna and a communication device. By isolating the phased array chip layer and the control layer where the power chip is located through a cold plate layer for heat dissipation, and by connecting the phased array chip and the power chip through conductive connectors for power supply, high-power current transmission of the phased array antenna can be effectively realized.

[0004] In a first aspect, embodiments of the present invention provide a planar phased array antenna, comprising a phased array chip layer, a cold plate layer, and a control layer arranged sequentially from top to bottom; wherein, the phased array chip layer includes a plurality of phased array chips, the phased array chips being in contact with the upper surface of the cold plate layer via silicone grease, the cold plate layer including a cold plate body, a cold pipe embedded in the cold plate body, and serrated heat dissipation teeth, the control layer including a main control board, a plurality of power chips disposed on the main control board, and conductive connectors, the power chips being in contact with the lower surface of the cold plate layer, the conductive connectors penetrating vertically through the cold plate layer to connect the phased array chip layer and the control layer, the output terminal of the power chips being connected to the conductive connectors for providing a first voltage DC and a second voltage DC to the phased array chips through the conductive connectors.

[0005] In some embodiments, the conductive connector includes a first copper pillar, a second copper pillar, and a third copper pillar, which are arranged in a triangular distribution.

[0006] In some embodiments, the first voltage of the first DC voltage is greater than the second voltage of the second DC voltage. The power chip includes a first power chip, a second power chip, and a third power chip. The output terminal of the first power chip is connected to the first copper pillar and is used to provide the first DC voltage to the phased array chip. The output terminals of the second power chip and the third power chip are respectively connected to the second copper pillar and the third copper pillar and are used to provide the second DC voltage to the phased array chip respectively.

[0007] In some embodiments, in the triangular arrangement, the first copper pillar, the second copper pillar, and the third copper pillar are located at the three vertices of the triangle, and the spacing between adjacent copper pillars is equal. The first copper pillar is located on one side of the planar phased array antenna and the communication device, and the second and third copper pillars are located on the other side of the planar phased array antenna and the communication device.

[0008] In some embodiments, the cold pipe is filled with a cooling medium to conduct the heat generated by the phased array chip and the power chip to the heat dissipation teeth.

[0009] In some embodiments, a fan is provided below the heat dissipation fins, and the start and stop of the fan are dynamically controlled by the main control board based on the real-time temperature feedback from the temperature sensor, which is integrated into the phased array chip layer or the cold plate layer.

[0010] In some embodiments, the planar phased array antenna and communication device further include a plurality of support pillars that penetrate vertically through the cold plate layer to connect the phased array chip layer and the control layer, wherein the plurality of support pillars and the conductive connectors are arranged at intervals on the outer side of the cold plate layer.

[0011] In some embodiments, the serrated heat dissipation teeth are wavy, the surface of the teeth is coated with a hydrophobic coating, and the spacing between adjacent teeth gradually decreases from the root to the top.

[0012] In some embodiments, the first voltage is 3.3V and the second voltage is 1.2V.

[0013] In a second aspect, embodiments of the present invention provide a communication device including a planar phased array antenna as described in any one of the first aspects.

[0014] According to embodiments of the present invention, a planar phased array antenna and a communication device are provided, which have at least the following beneficial effects: The present invention comprises a phased array chip layer, a cold plate layer, and a control layer from top to bottom. The phased array chip layer includes multiple phased array chips, which are in contact with the upper surface of the cold plate layer via silicone grease. The cold plate layer includes a cold plate body, a cold pipe embedded in the cold plate body, and serrated heat dissipation teeth. The control layer includes a main control board, multiple power chips disposed on the main control board, and conductive connectors. The power chips are in contact with the lower surface of the cold plate layer. The conductive connectors penetrate vertically through the cold plate layer to connect the phased array chip layer and the control layer. The output terminals of the power chips are connected to the conductive connectors to provide a first voltage DC and a second voltage DC to the phased array chips through the conductive connectors. The phased array antenna is designed with the phased array chip layer, cold plate layer, and control layer arranged from top to bottom. The cold plate layer physically isolates the phased array chip from the control layer. The cold plate layer contains embedded cold pipes and sawtooth heat dissipation teeth. Combined with the circulation of cooling medium in the cold pipes and the expanded surface area of ​​the heat dissipation teeth, heat dissipation efficiency can be effectively improved. Furthermore, the power chip and the phased array chip are directly connected through conductive connectors, which can effectively shorten the current transmission path, reduce resistance loss and Joule heat, and the vertical through-type structure can effectively enhance mechanical stability and ensure the reliability of current transmission. This enables the output of first voltage DC and second voltage DC to power the digital control circuit and radio frequency circuit in the phased array chip layer, effectively realizing high-power current transmission of the phased array antenna.

[0015] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the description, claims, and drawings. Attached Figure Description

[0016] The accompanying drawings are provided to further understand the technical solutions of the present invention and constitute a part of the specification. They are used together with the embodiments of the present invention to explain the technical solutions of the present invention, and do not constitute a limitation on the technical solutions of the present invention.

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0018] Figure 1 This is an exploded structural diagram of one side of a planar phased array antenna provided in an embodiment of the present invention;

[0019] Figure 2 This is an exploded structural diagram of the other side of a planar phased array antenna provided in an embodiment of the present invention;

[0020] Figure 3 This is an exploded structural diagram of the front of a planar phased array antenna provided in an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of the control layer in a planar phased array antenna provided in an embodiment of the present invention.

[0022] Figure label:

[0023] 101. Phased array chip layer; 102. Upper cold plate layer; 103. Cold pipe; 104. Lower cold plate layer; 105. Control layer; 106. Conductive connector; 107. Support pillar; 108. Serrated heat dissipation teeth; 109. Fan; 201. First copper pillar; 202. Second copper pillar; 203. Third copper pillar; 301. First power chip; 302. Second power chip; 303. Third power chip; 304. 24V high-voltage DC power supply. Detailed Implementation

[0024] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0025] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," "exceeding," etc. are understood to exclude the number itself, while "above," "below," "within," etc. are understood to include the number itself. "Any one" refers to one or more, and "at least one of the following" and similar expressions refer to any combination of these items, including any combination of single or multiple items. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the order of the indicated technical features.

[0026] It should be noted that the terms "setting," "installing," and "connecting" in the embodiments of this invention should be interpreted broadly. Those skilled in the art can reasonably determine the specific meaning of the above terms in the embodiments of this invention in conjunction with the specific content of the technical solution. For example, the term "connection" can be a mechanical connection, an electrical connection, or a connection that allows for mutual communication; it can be a direct connection or an indirect connection through an intermediate medium.

[0027] It should be noted that the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0028] Currently, existing phased array antenna technologies often rely on multi-layer board technology and methods such as compressing the number of antenna layers and signal transmission layers to integrate the entire phased array antenna. In this type of phased array antenna, the phased array chip, power module, and control circuit are usually integrated on the same PCB board. However, having the phased array chip and power chip on the same layer leads to heat concentration during high-power current transmission, which is difficult to dissipate and has low heat dissipation efficiency. Ultimately, the only solution to the overheating problem is to reduce the power, which in turn affects the antenna performance and makes it impossible to effectively achieve high-power current transmission in the phased array antenna.

[0029] Based on this, the purpose of the present invention is to at least solve one of the technical problems existing in the prior art. The present invention proposes a planar phased array antenna and a communication device, which uses a cold plate layer to isolate the phased array chip layer from the control layer where the power chip is located for heat dissipation, and uses conductive connectors to connect the phased array chip and the power chip for power supply, which can effectively realize high power current transmission of the phased array antenna.

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0031] refer to Figures 1 to 4 , Figure 1 This is an exploded structural diagram of one side of a planar phased array antenna provided in an embodiment of the present invention; Figure 2 This is an exploded structural diagram of the other side of a planar phased array antenna provided in an embodiment of the present invention; Figure 3 This is an exploded structural diagram of the front of a planar phased array antenna provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of the control layer in a planar phased array antenna provided in an embodiment of the present invention. In a first aspect, the present invention provides a planar phased array antenna and a communication device, comprising a phased array chip layer 101, a cold plate layer, and a control layer 105 arranged sequentially from top to bottom. The phased array chip layer 101 includes multiple phased array chips, which are in contact with the upper surface of the cold plate layer via silicone grease. The cold plate layer includes a cold plate body, a cold pipe 103 embedded within the cold plate body, and serrated heat dissipation teeth 108. The control layer 105 includes a main control board, multiple power chips disposed on the main control board, and conductive connectors 106. The power chips are in contact with the lower surface of the cold plate layer. The conductive connectors 106 penetrate vertically through the cold plate layer to connect the phased array chip layer 101 and the control layer 105. The output terminals of the power chips are connected to the conductive connectors 106 to provide a first voltage DC power and a second voltage DC power to the phased array chips via the conductive connectors 106.

[0032] Among them, it is understandable that, such as Figure 1As shown, the phased array chip layer 101, cold plate layer, and control layer 105 are arranged from top to bottom. The phased array chip and control layer 105 are physically isolated by the cold plate layer. The cold plate layer consists of an upper cold plate layer 102 and a lower cold plate layer 104. The cold pipe 103 is located between the upper cold plate layer 102 and the lower cold plate layer 104, and the sawtooth heat dissipation teeth 108 are located in the lower cold plate layer 104. By embedding the cold pipe 103 and the sawtooth heat dissipation teeth 108 in the cold plate layer, combined with the circulation of the cooling medium in the cold pipe 103 and the expansion of the heat dissipation teeth, The increased surface area can effectively improve heat dissipation efficiency. Furthermore, by directly connecting the power chip and the phased array chip through the conductive connector 106, the current transmission path can be shortened, resistance loss and Joule heat can be reduced, and the vertical through-type structure can effectively enhance mechanical stability and ensure the reliability of current transmission. In this way, the first voltage DC and the second voltage DC can be output to power the digital control circuit and the radio frequency circuit in the phased array chip layer 101, effectively realizing the high-power current transmission of the phased array antenna.

[0033] In some embodiments, it is worth noting that the planar phased array antenna and communication device provided by the present invention can systematically solve the problems of heat dissipation efficiency, current carrying capacity and signal stability in high-power scenarios through a layered structure. In this embodiment, multiple phased array chips of the phased array chip layer 101 are in contact with the upper surface of the cold plate layer through high thermal conductivity silicone grease. The thickness of the silicone grease layer can be controlled within the micrometer range to ensure that the thermal interface contact resistance is minimized. At the same time, the cold plate body is made of copper-aluminum alloy material, and the cold pipe 103 embedded inside it can adopt a spiral closed loop design, which is evenly distributed along the edge of the cold plate body. The two ends of the cold pipe are respectively connected to the root and top of the sawtooth heat dissipation teeth 108 to form a circulating heat dissipation channel.

[0034] In some embodiments, the cold pipe 103 can be filled with a phase change cooling medium. When the phased array chip is working, heat is quickly conducted to the cold plate body through the silicone grease. After absorbing heat, the cooling medium in the cold pipe flows to the heat dissipation tooth 108 area. Heat exchange with the external environment is carried out through the expanded surface area of ​​the sawtooth heat dissipation tooth. The tooth plates of the heat dissipation tooth can be designed with a wave-shaped structure. The surface of the tooth plates can be coated with a hydrophobic coating to increase the heat dissipation area and prevent dust or condensation from accumulating, thereby further improving the heat dissipation efficiency.

[0035] In some embodiments, the main control board of the control layer 105 is provided with multiple independent power chips (first power chip 301, second power chip 302, and third power chip 303), whose input terminals are uniformly connected to a 24V high-voltage DC power supply 304, and whose output terminals provide DC power of different voltages to the phased array chip through conductive connectors 106 respectively; the conductive connectors 106 are composed of a first copper pillar 201, a second copper pillar 202, and a third copper pillar 203, whose axes can intersect at the geometric center of the cold plate layer and are arranged in a triangular distribution. The diameter of the copper pillars is on the order of millimeters, and the surface is silver-plated to reduce contact resistance. They are also directly connected to the pads of the phased array chip layer 101 by laser welding, penetrating vertically through the cold plate layer.

[0036] In some embodiments, the conductive connector 106 includes a first copper pillar 201, a second copper pillar 202, and a third copper pillar 203. The first copper pillar 201, the second copper pillar 202, and the third copper pillar 203 are arranged in a triangular distribution. It is understood that the triangular distribution of the copper pillars can evenly distribute mechanical stress and avoid connection failure due to single-point pressure. At the same time, the contact surface between the copper pillars and the cold plate layer is filled with thermally conductive adhesive to further conduct the heat generated by the power chip to the cold plate layer.

[0037] Understandably, in practical applications, phased array power can reach 100W, while the main power voltage of the chip is 1.2V, resulting in a current of over 80A. According to Joule's law, Q=I²Rt, W=I²R, under this current condition, the resistance of a conventional jumper is approximately 0.01Ω, yielding a power of 36W, which is clearly too high and carries the risk of burnout. Therefore, this invention uses copper pillars as high-power, low-impedance connectors. According to the formula for resistance: R=ρL / S, a copper pillar with a diameter of approximately 3cm and a length of 7cm has a resistance of 1.3e-6Ω and a heat dissipation power of 4.9e-3W, proving that it can carry high-power current with extremely low loss, effectively achieving high-power current transmission in phased array antennas.

[0038] In some embodiments, the first voltage of the first DC voltage is greater than the second voltage of the second DC voltage. The power supply chip includes a first power supply chip 301, a second power supply chip 302, and a third power supply chip 303. The input terminals of the first power supply chip 301, the second power supply chip 302, and the third power supply chip 303 are connected to a 24V high-voltage DC power supply. The output terminal of the first power supply chip 301 is connected to a first copper pillar 201 to provide the first DC voltage to the phased array chip. The output terminals of the second power supply chip 302 and the third power supply chip 303 are respectively connected to the second copper pillar 202 and the third copper pillar 203 to provide the second DC voltage to the phased array chip. It can be understood that by using 24V high-voltage DC for power supply and arranging the power supply chips around the high-hardness, high-transmission-power, low-impedance connector, the high-ampere current generated can quickly flow into the high-hardness, high-transmission-power, low-impedance connector. The high-hardness, high-transmission-power, low-impedance connector can also assist in heat dissipation of PCB wiring.

[0039] In some embodiments, the first power chip 301 outputs 3.3V DC power, which powers the digital control module and peripheral circuits of the phased array chip through the first copper pillar 201; the second and third power chips 302 and 303 respectively output 1.2V DC power, which powers the radio frequency signal processing unit through the second copper pillar 202 and the third copper pillar 203 in parallel. The dual 1.2V design distributes the total current equally to the two paths, thereby reducing the current density of a single path and reducing Joule heating.

[0040] In some embodiments, the lower surface of the cold plate layer is directly bonded to the PCB board of the power chip with a high thermal conductivity adhesive to form a second heat dissipation path. The heat of the power chip is not only conducted to the cold plate layer through the copper pillars, but can also be quickly diffused to the heat dissipation teeth 108 through the directly contacting cold plate body. In addition, an elastic silicone rubber buffer pad can be added between the cold plate layer and the phased array chip layer 101 to absorb mechanical stress and vibration impact during the assembly process, and to prevent the thermal conductivity of the silicone grease layer from decreasing due to compression deformation. The control layer 105 can also integrate a distributed temperature sensor array. The sensors can be embedded in the gaps between the phased array chips and the roots of the heat dissipation teeth to monitor the temperature of each area in real time and feed it back to the main control board. The main control board dynamically adjusts the speed of the cooling fan according to the temperature data, and automatically reduces the output power of the corresponding power chip when local overheating is detected, so as to realize intelligent thermal management.

[0041] In some embodiments, an annular electromagnetic shielding layer may be provided around the power chip of the control layer 105. The shielding layer is coated with conductive silver paste on the lower surface of the cold plate layer and grounded to the copper pillar through conductive adhesive, which effectively suppresses the interference of high-frequency electromagnetic noise on the radio frequency signal. Furthermore, an adjustable guide plate is installed on the top of the sawtooth heat dissipation teeth 108. The angle of the guide plate is automatically adjusted by the main control board according to the ambient wind speed signal to optimize the airflow direction and enhance the forced convection heat dissipation effect.

[0042] It is understood that in this invention, the heat of the phased array chip is conducted through a multi-stage process of silicone grease-cold plate-cold pipe-heat dissipation teeth, combined with the heat of the power chip being dissipated through a dual path of copper pillar-cold plate-heat dissipation teeth, thereby achieving heat source separation and efficient heat dissipation. At the same time, the triangularly distributed copper pillars can also solve the problem of poor pressure and shear resistance caused by the use of silicone grease connection.

[0043] In some embodiments, in the triangular arrangement, the first copper pillar 201, the second copper pillar 202, and the third copper pillar 203 are located at the three vertices of the triangle, with equal spacing between adjacent copper pillars. The first copper pillar 201 is located on one side of the planar phased array antenna and communication equipment, while the second copper pillar 202 and the third copper pillar 203 are located on the other side. It can be understood that in the triangular arrangement of copper pillars, the first copper pillar 201, the second copper pillar 202, and the third copper pillar 203 are located at the three vertices of an equilateral triangle. The first copper pillar 201 is arranged on the left edge of the equipment, while the second copper pillar 202 and the third copper pillar 203 are symmetrically distributed on the right edge to evenly distribute mechanical stress, optimize the symmetry of the current path, and reduce the impact of electromagnetic interference on radio frequency signals.

[0044] In some embodiments, a fan 109 is disposed below the heat dissipation fins. The start and stop of the fan 109 are dynamically controlled by the main control board based on the real-time temperature feedback from the temperature sensor. The temperature sensor is integrated into the phased array chip layer 101 or the cold plate layer. It can be understood that the fan 109 disposed below the heat dissipation fins 108 is fixed to the cold plate layer by a bracket. The fan blades can be made of lightweight aluminum alloy. Its speed is dynamically adjusted by the main control board based on the real-time temperature feedback from the temperature sensor. The temperature sensor can be embedded in the gaps of the phased array chip layer 101 and the root of the heat dissipation fins in an array form. The monitoring points cover the areas with dense heat sources and areas with weak heat dissipation. When the sensor detects that the local temperature exceeds the threshold, the main control board gradually increases the fan speed and triggers an alarm signal. At the same time, the output power of the power chip can be dynamically adjusted through the PID algorithm to achieve closed-loop temperature control. In addition, the air inlet of the fan can be equipped with a removable filter to prevent dust from entering the heat dissipation channel and extend the life of the equipment.

[0045] Understandably, the fan can be positioned directly below the serrated heat sink, with its airflow directed towards the multiple heat dissipation channels formed by the serrated heat sink. A large amount of heat generated by the phased array chip and power chip is conducted to the serrated heat sink through a cold plate equipped with cold pipes. The temperature of the serrated heat sink rises and is naturally cooled. When the temperature remains too high, the main control board will activate the cooling fan to further increase the airflow speed within the heat dissipation channels. As the airflow speed increases, the Reynolds number increases, thereby thinning the boundary layer thickness of the serrated heat sink within the heat dissipation channels and improving the convective heat transfer coefficient of the serrated heat sink. Specifically, when the phased array antenna is in standby mode, the phased array chip is also in standby mode, resulting in lower overall heat generation. At this time, the temperature sensor of the phased array chip transmits the specific temperature to the main control board. Therefore, this invention allows the fan to start operating above 38 degrees Celsius and reach its maximum speed above 45 degrees Celsius, thus achieving temperature regulation of the flat-panel phased array antenna.

[0046] In some embodiments, the planar phased array antenna and communication device further include a plurality of support pillars 107 that vertically penetrate the cold plate layer to connect the phased array chip layer 101 and the control layer 105. The plurality of support pillars 107 and conductive connectors 106 are arranged at intervals on the outside of the cold plate layer. The support pillars are made of copper-aluminum alloy, vertically penetrate the cold plate layer and are arranged at intervals on the outside of the cold plate layer with the conductive connectors 106. The diameter of the support pillar is larger than that of the conductive connector. Its top and bottom are flexibly connected to each layer structure through elastic gaskets, thereby bearing the assembly pressure and absorbing vibration and shock, and preventing the silicone grease layer from cracking due to mechanical stress. In addition, the inside of the support pillar can be hollow and filled with phase change material, thereby absorbing heat and delaying the temperature rise in a high-temperature environment, and assisting the cold plate layer in heat dissipation.

[0047] In some embodiments, the serrated heat dissipation teeth 108 have wavy teeth, the surface of the teeth is coated with a hydrophobic coating, and the spacing between adjacent teeth gradually decreases from the root to the top.

[0048] In some embodiments, the first voltage is 3.3V and the second voltage is 1.2V; wherein, in terms of voltage configuration, the first voltage of 3.3V supplies power to the digital control module and peripheral logic circuits in the phased array chip layer, and the second voltage of 1.2V is used to supply power to the radio frequency signal processing unit in the phased array chip layer. The dual 1.2V design supplies power through the second copper pillar 202 and the third copper pillar 203 in parallel, so as to distribute the current equally to the two paths and reduce heat generation.

[0049] In some embodiments, the input stage of the power chip can employ a multi-stage filtering circuit, such as an LC filter, to suppress the ripple noise of the 24V high-voltage DC power supply and ensure the purity of the RF unit power supply. In addition, the main control board can also integrate a redundant control module, which automatically switches to the backup path when any 1.2V power supply abnormality is detected, and indicates the fault location through LED indicators, facilitating rapid maintenance.

[0050] Secondly, embodiments of the present invention provide a communication device, including a planar phased array antenna as described in any of the first aspects. It is understood that previous high-power designs required placing the phased array elements, phased array chip, and power chip of the planar phased array antenna on the same PCB board, resulting in a large PCB board area and an excessively large overall antenna area, making miniaturized assembly impossible. The present invention reduces the PCB board area and increases maintainability by placing the power module separately. The feeding circuit of the planar phased array antenna consists of two PCB boards and a high-hardness, high-transmission-power, low-impedance conductive connector in the middle. The conductive connector can solve the problems of high power consumption and high heat generation caused by high current between PCBs, and also solves the problems of poor pressure and shear resistance caused by the use of silicone grease connection.

Claims

1. A planar phased array antenna, characterized in that, It includes, from top to bottom, a phased array chip layer, a cold plate layer, and a control layer; The phased array chip layer includes multiple phased array chips, which are in contact with the upper surface of the cold plate layer via silicone grease. The cold plate layer includes a cold plate body, cold pipes embedded in the cold plate body, and serrated heat dissipation teeth. The control layer includes a main control board, multiple power chips and conductive connectors disposed on the main control board. The power chips are in contact with the lower surface of the cold plate layer. The conductive connectors penetrate the cold plate layer vertically to connect the phased array chip layer and the control layer. The output terminal of the power chip is connected to the conductive connector to provide a first voltage DC and a second voltage DC to the phased array chip through the conductive connector.

2. The planar phased array antenna according to claim 1, characterized in that, The conductive connector includes a first copper pillar, a second copper pillar, and a third copper pillar, which are arranged in a triangular pattern.

3. The planar phased array antenna according to claim 2, characterized in that, The first voltage of the first DC voltage is greater than the second voltage of the second DC voltage. The power chip includes a first power chip, a second power chip, and a third power chip. The output terminal of the first power chip is connected to the first copper pillar and is used to provide the first DC voltage to the phased array chip. The output terminals of the second power chip and the third power chip are respectively connected to the second copper pillar and the third copper pillar and are used to provide the second DC voltage to the phased array chip respectively.

4. The planar phased array antenna according to claim 2, characterized in that, In the triangular arrangement, the first copper pillar, the second copper pillar, and the third copper pillar are located at the three vertices of the triangle, and the spacing between adjacent copper pillars is equal. The first copper pillar is located on one side of the flat panel phased array antenna and the communication equipment, and the second and third copper pillars are located on the other side of the flat panel phased array antenna and the communication equipment.

5. The planar phased array antenna according to claim 1, characterized in that, The cold pipe is filled with a cooling medium to conduct the heat generated by the phased array chip and the power chip to the heat dissipation teeth.

6. The planar phased array antenna according to claim 1, characterized in that, A fan is located below the heat dissipation fins. The start and stop of the fan are dynamically controlled by the main control board based on the real-time temperature feedback from the temperature sensor. The temperature sensor is integrated into the phased array chip layer or the cold plate layer.

7. The planar phased array antenna according to claim 1, characterized in that, The planar phased array antenna and communication equipment also include multiple support pillars that penetrate vertically through the cold plate layer to connect the phased array chip layer and the control layer. The multiple support pillars and the conductive connectors are arranged at intervals on the outside of the cold plate layer.

8. The planar phased array antenna according to claim 1, characterized in that, The sawtooth heat dissipation teeth are wavy, the surface of the teeth is coated with a hydrophobic coating, and the distance between adjacent teeth gradually decreases from the root to the top.

9. The planar phased array antenna according to claim 3, characterized in that, The first voltage is 3.3V, and the second voltage is 1.2V.

10. A communication device, characterized in that, Includes the planar phased array antenna as described in any one of claims 1 to 9.

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