Flexible circuit board and electronic equipment

Abstract

The invention relates to the technical field of circuit boards, and discloses a flexible circuit board and electronic equipment, and the flexible circuit board comprises a substrate which is provided with a plurality of wiring layers; wherein the plurality of wiring layers comprise a device layer, and the device layer is provided with a device installation area used for accessing a device; covering copper is arranged at the position, except for the device installation area, of the device layer and / or at least one wiring layer except for the device layer. The substrate is provided with a plurality of side edges, and at least one side edge is coated with copper. According to the invention, copper can be coated on the device layer except the device mounting area in the wiring layer, and / or copper can be coated on at least one wiring layer except the device layer, and copper can be coated on at least one side edge of the substrate, so that heat generated by the wiring layer can be dissipated through the copper, and the reliability of the wiring layer is improved. Therefore, the heat dissipation capability of the flexible circuit board is improved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to a flexible circuit board and an electronic device. Background Art

[0002] With the advancement of electronic information technology, electronic products are developing towards higher performance, miniaturization, and density. Flexible printed circuit boards (FPCs) are widely used in modern electronic products due to their unique flexibility, lightness, and high density.

[0003] Existing FPCs are often used in closed or confined spaces, where natural heat dissipation is limited. Excessive temperatures can cause FPC material aging, performance degradation, and even damage. Therefore, how to dissipate heat from FPCs is a pressing technical issue. Summary of the Invention

[0004] The main purpose of this application is to provide a flexible circuit board and an electronic device, aiming to solve the existing technical problem of how to dissipate heat from an FPC.

[0005] To achieve the above objectives, the present application provides a flexible circuit board, comprising:

[0006] a substrate having a plurality of wiring layers;

[0007] The plurality of wiring layers include a device layer, and the device layer is provided with a device mounting area for accessing devices;

[0008] Copper cladding is provided on the device layer except the device mounting area, and / or on at least one of the wiring layers except the device layer;

[0009] The substrate has a plurality of side edges, and copper cladding is provided on at least one side edge.

[0010] In one embodiment, the copper-clad surface is at least partially provided with a gold layer.

[0011] In one embodiment, the copper pad is a ground copper pad or a power copper pad.

[0012] In one embodiment, the copper clad is provided with at least one via hole, and the via hole is filled with a thermal conductive material.

[0013] In one embodiment, the via is a metal via.

[0014] In one embodiment, the plurality of wiring layers include a top wiring layer and a bottom wiring layer;

[0015] Wherein, a copper clad layer is provided on the top wiring layer, a covering film is provided on the copper clad layer, and a window area is provided on the covering film; and / or,

[0016] A copper clad layer is provided on the bottom wiring layer, a covering film is provided on the copper clad layer, and a window area is provided on the covering film.

[0017] In one embodiment, the edge of the window area is spaced apart from the outer sidewall of the wiring layer.

[0018] In one embodiment, the copper cladding at least partially protrudes from the window area.

[0019] In one embodiment, the substrate is provided with a bending area, and the window area is spaced apart from the bending area.

[0020] In one embodiment, a heat conducting member is provided in the window area.

[0021] In one embodiment, the edge of the heat conducting element is spaced apart from the bending area.

[0022] In one embodiment, the heat conducting member completely covers the window area.

[0023] In one embodiment, a groove is provided on a side of the heat conducting member close to the window area.

[0024] In one embodiment, the device layer is provided on the top wiring layer or the bottom wiring layer, and a reinforcing plate is provided on the other wiring layer at a position corresponding to the device mounting area of the device layer.

[0025] In addition, to achieve the above objectives, the present application also provides an electronic device, which includes the flexible circuit board as described above.

[0026] The present application provides a flexible circuit board and an electronic device, the flexible circuit board comprising: a substrate having multiple wiring layers; wherein the multiple wiring layers include a device layer, and the device layer is provided with a device mounting area for connecting devices; copper cladding is provided on the device layer except for the device mounting area, and / or on at least one of the wiring layers except the device layer; the substrate has multiple side edges, and copper cladding is provided on at least one side edge.

[0027] Since the present application can provide copper cladding on the device layer in the wiring layer except for the device mounting area, and / or provide copper cladding on at least one wiring layer other than the device layer, and can also provide copper cladding on at least one side of the substrate, the heat generated by the wiring layer can be dissipated through the copper cladding, thereby improving the heat dissipation capacity of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0029] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] Figure 1 This is a side view of the flexible circuit board in the first embodiment of the flexible circuit board of this application;

[0031] Figure 2 This is a schematic diagram of copper cladding on the side of the first embodiment of the flexible circuit board of the present application;

[0032] Figure 3 This is a top view of the copper-clad via after the copper-clad via in the first embodiment of the flexible circuit board of the present application;

[0033] Figure 4 This is a top view of the window area in the second embodiment of the flexible circuit board of this application;

[0034] Figure 5 This is a top view of the heat conducting member in the third embodiment of the flexible circuit board of this application;

[0035] Figure 6 This is a schematic structural diagram of a groove in the third embodiment of the flexible circuit board of this application;

[0036] Figure 7 This is a schematic structural diagram of another groove in the third embodiment of the flexible circuit board of this application.

[0037] Description of Figure Numbers:

[0038] Label name Label name 1 substrate 32 Select plating area 11 base 4 pads 12 wiring layer 5 reinforcement plate 12a Top wiring layer 6 Covering film 12b Bottom wiring layer 7 Window area 2 Device 8 bending zone 3 Copper Pour 9 Thermal Conductors 31 Via 91 groove

[0039] The realization of the objectives, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0040] It should be understood that the specific embodiments described herein are merely used to explain the technical solutions of the present application and are not intended to limit the present application.

[0041] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] It should be noted that all directional indications in the embodiments of the present application (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0043] In addition, the descriptions of "first", "second", etc. in this application are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0044] As is understandable, with the advancement of electronic information technology, electronic products are trending towards higher performance, miniaturization, and higher density. Flexible printed circuit boards (FPCs) are widely used in modern electronic products due to their unique flexibility, lightness, and high density.

[0045] Existing FPCs are often used in closed or confined spaces, where natural heat dissipation is limited. Excessive temperatures can cause FPC material aging, performance degradation, and even damage. Therefore, how to dissipate heat from FPCs is a pressing technical issue.

[0046] Therefore, in order to solve the above-mentioned defects, the present embodiment provides a flexible circuit board. Since the present application can provide copper cladding 3 on the device layer in the wiring layer 12 except for the device mounting area, and / or provide copper cladding 3 on at least one wiring layer 12 other than the device layer, and can also provide copper cladding 3 on at least one side of the substrate 1, the heat generated by the wiring layer 12 can be dissipated through the copper cladding 3, thereby improving the heat dissipation capacity of the flexible circuit board.

[0047] For ease of understanding, the following Figures 1 to 7 The flexible circuit board provided in the embodiment of the present application is described in detail.

[0048] Reference Figure 1 , Figure 1 This is a side view of the flexible circuit board in the first embodiment of the flexible circuit board of this application, as shown Figure 1 As shown, in this embodiment, the flexible circuit board includes:

[0049] A substrate 1 includes a plurality of wiring layers 12 .

[0050] It should be noted that in this embodiment, the substrate 1 may be a substrate 1 having a base 11 and multiple wiring layers 12. The base 11 may be made of a flexible insulating material (e.g., polyimide), and the wiring layers 12 may be attached to the surface of the base 11, either on one side or on both sides, without limitation in this embodiment. The wiring layers 12 may be conductive layers for placing devices 2 and setting circuit traces, and may be made of conductive materials such as copper foil. Devices 2 may be placed thereon, circuit patterns may be etched thereon, or copper cladding 3 may be used to achieve electrical connections between devices 2.

[0051] It should also be noted that the wiring layer 12 in this embodiment can be multiple, and each wiring layer 12 can be stacked, and the circuit pattern of each wiring layer 12 can be set according to actual conditions, and this embodiment does not limit this. Each wiring layer 12 can be arranged on one side of the substrate 11, or can be arranged on both sides of the substrate 11. In order to facilitate subsequent understanding, this embodiment uses two wiring layers 12 and a substrate 11 to form the above-mentioned substrate 1 (i.e., a double-layer flexible circuit board) for illustration, and one wiring layer 12 is arranged on one side of the substrate 11, and the other wiring layer 12 is arranged on the other side of the substrate 11. If there are three or more wiring layers 12, they can be arranged in a manner of arranging the wiring layers 12 between the two substrates 11.

[0052] like Figure 1 As shown, the substrate 1 in this embodiment may include: a base 11 and two wiring layers 12; the base 11 may be a base 11 made of a flexible insulating material, the wiring layer 12 on one side of the base 11 may be recorded as a top wiring layer 12a, and the wiring layer 12 on the other side of the base 11 may be recorded as a bottom wiring layer 12b.

[0053] Continue as Figure 1 As shown, in this embodiment, the plurality of wiring layers 12 include a device layer, and a device mounting area for accessing the device 2 is provided on the device layer.

[0054] It is understood that in this embodiment, the wiring layer 12 on which the device 2 is disposed can be referred to as the device layer. The device 2 can be any device that implements an electrical function, and this embodiment does not limit this. Furthermore, in this embodiment, the area for mounting the device 2 can be referred to as the device mounting area. Pads 4 can be disposed on this device mounting area, and soldering of the pads 4 to the pins of the device 2 can be performed to achieve electrical connection between the device 2 and the circuit.

[0055] It should be emphasized that the wiring layer 12 of the mounting device 2 in this embodiment can be any wiring layer 12, such as Figure 1 As shown, in this embodiment, the device 2 can be defined as being mounted on the top wiring layer 12a. Figure 1 In the embodiment, a pad 4 is provided on the top wiring layer 12a, and the device 2 is mounted on the pad 4. Of course, as another implementation, if there are three or more wiring layers 12, the device 2 can also be mounted on the middle wiring layer 12, that is, the middle wiring layer 12 is grooved and the device 2 is placed in the groove.

[0056] Continue as Figure 1 As shown, in order to dissipate heat for the FPC, in this embodiment, a copper clad 3 is provided on the device layer except for the device mounting area, and / or on at least one of the wiring layers 12 except for the device layer;

[0057] The substrate 1 has multiple sides, and a copper clad 3 is provided on at least one side.

[0058] It is understandable that, first, in this embodiment, a copper clad 3 can be provided on the device layer except for the device mounting area, that is, the copper clad 3 can be provided in any area of the device layer except for the device mounting area (such as Figure 1 As shown, it is arranged on the right side of the device 2). And / or, in this embodiment, copper cladding 3 can be arranged on other wiring layers 12 except the device layer. The specific wiring layer 12 can be arranged according to the actual situation. This embodiment is not limited to this. For example, Figure 1 Copper cladding 3 is provided on the bottom wiring layer 12b ( Figure 1 not shown).

[0059] It is also understandable that, in order to facilitate heat dissipation, a copper cladding 3 may be provided on at least one of the four sides of the substrate 1. Figure 2 , Figure 2 This is a schematic diagram of the first embodiment of the flexible circuit board of this application in which copper cladding 3 is provided on the side. Figure 2 As shown, copper cladding 3 may be provided on all sides, all sides or at least one side of the wiring layer 12 and the substrate 11 .

[0060] It should be emphasized that in this embodiment, the copper cladding 3 provided on the device layer except for the device mounting area and / or on at least one wiring layer 12 other than the device layer can be configured with an area that is customized based on actual conditions. For example, in this embodiment, it can be configured as large as possible without affecting flexibility and device 2. The copper cladding 3 provided on the side of the substrate 1 is provided on at least one side, and the area on this side can also be customized based on actual conditions. In this embodiment, it is preferred that all four sides be fully copper clad to improve heat dissipation.

[0061] It should also be emphasized that in order to provide copper cladding 3 on the device layer except for the device mounting area and / or on at least one wiring layer 12 other than the device layer, during the manufacturing process, this embodiment can etch the copper foil of the wiring layer 12, thereby retaining the copper in the area where the copper cladding 3 is required to be provided, thereby completing the installation of the copper cladding 3. In order to provide the copper cladding 3 on the side of the substrate 1, during the manufacturing process, this embodiment can copper plate the four sides of the substrate 1 to obtain the copper cladding 3.

[0062] In actual use, since this embodiment can provide copper cladding 3 on the device layer in the wiring layer 12 except for the device mounting area, and / or provide copper cladding 3 on at least one wiring layer 12 other than the device layer, and can also provide copper cladding 3 on at least one side of the substrate 1, the heat generated by the wiring layer 12 can be dissipated through the copper cladding 3, thereby improving the heat dissipation capacity of the flexible circuit board.

[0063] Furthermore, in order to shield external interference and improve the anti-electromagnetic interference (EMI) capability of the flexible circuit board, in this embodiment, at least a portion of the surface of the copper clad 3 is provided with a gold layer.

[0064] It should be noted that, in this embodiment, after obtaining the copper clad 3, it can be subjected to gold treatment. As an implementation method, a layer of nickel can be deposited on the surface of the copper clad 3, and then a thin layer of gold can be deposited on the surface of the nickel layer to form the above-mentioned gold layer (not shown in the figure).

[0065] It is understandable that in this embodiment, a copper clad 3 can be provided on the device layer in the wiring layer 12 except for the device mounting area, and / or a gold layer can be provided outside the copper clad 3 provided on at least one wiring layer 12 except the device layer. A gold layer can also be provided on the copper clad 3 on the side of the substrate 1. Of course, a gold layer can also be provided in both places, and this embodiment does not limit this.

[0066] It should be emphasized that the thickness of the gold layer in this embodiment can be set according to actual conditions, and this embodiment does not impose any restrictions on this.

[0067] In actual use, since this embodiment provides a gold layer on the outside of the copper clad 3, the anti-electromagnetic interference capability of the flexible circuit board can be improved, and the heat of the flexible circuit board can be quickly conducted to the outside, further improving the heat dissipation.

[0068] Furthermore, in order to expand the grounding area, improve the overcurrent capacity, and thereby reduce the heat generated by the device 2 during operation and improve the chip operating efficiency, the copper cladding 3 in this embodiment can be a grounding copper cladding.

[0069] As another implementation, in order to dissipate heat for the power supply network, the copper cladding 3 in this embodiment may also be power supply copper cladding.

[0070] It should be understood that when the copper clad 3 is a grounding copper clad, it can be understood that the copper clad 3 is consistent with the grounding network in the circuit and both are set to grounding properties. Since the copper clad 3 is set to grounding properties, the grounding area in the circuit can be increased, the overcurrent capacity can be improved, and thus heat generation can be reduced. When the copper clad 3 is a power copper clad, it can be understood that it is set to the power network. Since the power supply generates more heat, setting the copper clad 3 as the power network can further improve heat dissipation.

[0071] It should be emphasized that the copper clad 3 disposed on the wiring layer 12 and the copper clad 3 disposed on the side of the substrate 1 in this embodiment can both be power copper clad or ground copper clad. This embodiment uses the ground copper clad for illustration.

[0072] Furthermore, in order to improve the heat dissipation capability, in this embodiment, the copper clad 3 is provided with at least one via hole 31 , and the via hole 31 is filled with a heat conducting material.

[0073] Reference Figure 3 , Figure 3 This is a top view of the copper clad 3 after the copper clad 3 via 31 in the first embodiment of the flexible circuit board of this application, as shown Figure 3 As shown, in this embodiment, at least one via 31 can be provided on the copper clad 3. The number of the vias 31 can be set according to actual conditions, for example, it can correspond to the number of holes drilled in the ground network or power network corresponding to the copper clad 3.

[0074] It should be emphasized that, when multiple wiring layers 12 are provided with copper clad 3, the vias 31 of the copper clad 3 on each wiring layer 12 can be aligned through. Figure 1 In the embodiment where copper cladding 3 is provided not only on the top wiring layer 12a but also on the bottom wiring layer 12b, the via 31 in this embodiment can pass through the middle substrate 11 from the copper cladding 3 of the top wiring layer 12a to the copper cladding 3 of the bottom wiring layer 12b.

[0075] It should be noted that, to further improve heat dissipation, this embodiment can also fill the via 31 with a thermally conductive material. This thermally conductive material can be any material with thermal conductivity. In this embodiment, copper is used for illustration. That is, after the via 31 is formed, the via 31 can be filled with copper to improve heat dissipation.

[0076] Furthermore, in order to reduce the ground impedance, in this embodiment, the via hole 31 is a metal via hole.

[0077] It should be noted that in this embodiment, after the via 31 is provided, copper plating can be performed, thereby forming a conductive layer on the inner wall of the via 31 for electrical connection, thereby obtaining a metal via. Furthermore, if the copper cladding 3 is a grounding copper cladding, and if the filling material has both thermal and electrical properties, that is, a conductive material that is both thermally conductive, filling the metal via can reduce ground impedance.

[0078] It should also be noted that the specific thickness of the copper clad 3 on the side of the substrate 1 in this embodiment can be 0.35 mm. Furthermore, when setting the via 31 on the copper clad 3 on the side of the substrate 1, the via 31 with a diameter of at least 0.35 mm can be set, thereby improving the anti-electromagnetic interference capability.

[0079] In this embodiment, copper cladding 3 may be provided on the device layer in the wiring layer 12 except for the device mounting area, and / or copper cladding 3 may be provided on at least one wiring layer 12 except the device layer, and copper cladding 3 may also be provided on at least one side of the substrate 1. The heat generated by the wiring layer 12 can be dissipated through the copper cladding 3, thereby improving the heat dissipation capacity of the flexible circuit board.

[0080] Reference Figure 4 , Figure 4 This is a top view of the window area 7 in the second embodiment of the flexible circuit board of the present application. Based on the above-mentioned first embodiment, the second embodiment of the flexible circuit board of the present application is proposed.

[0081] like Figure 4 As shown, in this embodiment, in order to expose at least part of the copper clad 3 to improve heat dissipation, in this embodiment, the plurality of wiring layers 12 include a top wiring layer 12a and a bottom wiring layer 12b;

[0082] Wherein, a copper clad 3 is provided on the top wiring layer 12a, a covering film 6 is provided on the copper clad 3, and a window area 7 is provided on the covering film 6; and / or,

[0083] A copper clad layer 3 is provided on the bottom wiring layer 12 b , a cover film 6 is provided on the copper clad layer 3 , and a window area 7 is provided on the cover film 6 .

[0084] It should be noted that the above-mentioned covering film 6 can be any film with protective capabilities, such as a film made of materials such as polyimide. The covering film 6 can reduce physical damage, chemical corrosion and oxidation of the circuit and improve the service life.

[0085] It should also be noted that, when the wiring layer 12 is a single layer, the cover film 6 can be arranged on the side of the wiring layer 12 away from the substrate 11 in this embodiment. Figure 1 In the case of a double-layer wiring layer 12 shown, in this embodiment, the cover film 6 can be disposed on the side of the top wiring layer 12a facing away from the substrate 11, and on the side of the bottom wiring layer 12b facing away from the substrate 11. When multiple wiring layers 12 are stacked, in this embodiment, the cover film 6 can be disposed on the topmost wiring layer 12. The specific arrangement can be customized according to actual circumstances and is not limited in this embodiment.

[0086] It is understandable that in this embodiment, a window area 7 can be provided on the cover film 6. When the cover film 6 is covered on the wiring layer 12, the position of the window area 7 can be set at the copper clad 3. The size of the window area 7 can be set according to actual conditions. Part of the copper clad 3 can be exposed, or the entire copper clad 3 can be exposed to improve heat dissipation. Figure 4 Schematic diagram showing the entire copper clad 3 being exposed.

[0087] During the production process, the covering film 6 can be opened according to the setting position of the copper clad 3 on the wiring layer 12 to obtain the window area 7, and then the covering film 6 can be set on the wiring layer 12 to expose at least part of the copper clad 3.

[0088] Furthermore, in order to ensure that the copper cladding 3 can be fully exposed in the window area 7 and to protect other areas on the wiring layer 12 , in this embodiment, the edge of the window area 7 is spaced apart from the outer side wall of the wiring layer 12 .

[0089] It should be understood that in this embodiment, a certain distance may be present between the edge of the window area 7 and the outer sidewall of the wiring layer 12. Therefore, when the copper cladding 3 is provided, a certain distance may be present between the copper cladding 3 and the outer sidewall of the wiring layer 12 while ensuring that the copper cladding 3 is as large as possible, thereby ensuring that a certain distance is present between the window area 7 and the outer sidewall of the wiring layer 12. The specific distance may be set according to actual conditions and is not limited in this embodiment.

[0090] Furthermore, in order to improve heat dissipation, e.g. Figure 1 As shown, in this embodiment, the copper cladding 3 at least partially protrudes from the window area 7 .

[0091] It should be noted that, in this embodiment, the copper clad 3 arranged on the wiring layer 12 can be at least partially protruded from the window area 7, and of course can be fully protruded from the window area 7. The specific protrusion size and protrusion height can be set according to actual conditions, and this embodiment does not limit this.

[0092] Furthermore, during assembly, the side of the copper clad 3 facing away from the substrate 11 can be attached to an external heat dissipation material, such as the inner wall of the device casing, so that heat can be dissipated with the help of external heat dissipation materials, further improving the heat dissipation effect.

[0093] Furthermore, in order to ensure the bendability of the flexible circuit board, in this embodiment, the substrate 1 is provided with a bending area 8 , and the window area 7 is spaced apart from the bending area 8 .

[0094] It is understood that the bending zone 8 can be a region for bending, and the device 2 is generally not disposed within the bending zone 8. In this embodiment, the bending zone 8 can be located anywhere on the substrate 1 that is not a device mounting area. Furthermore, when the copper clad 3 is disposed, the copper clad 3 can be spaced apart from the bending zone 8. That is, while spaced apart from the bending zone 8, the copper clad 3 can be made as large as possible. Specifically, the bending zone 8 can be disposed between the device mounting area and the copper clad 3. If the window area 7 exposes the entire copper clad 3, the window area 7 can also be spaced apart from the bending zone 8 to ensure the bendability of the flexible circuit.

[0095] Furthermore, in order to reinforce the device mounting area of the flexible circuit board, as Figure 1 as well as Figure 2 As shown, in this embodiment, the device layer is provided on the top wiring layer 12a or the bottom wiring layer 12b, and a reinforcing plate 5 is provided on the other wiring layer 12 corresponding to the device mounting area of the device layer.

[0096] It should be understood that the reinforcing plate 5 in this embodiment can be any plate with enhanced hardness. Furthermore, the reinforcing plate 5 can be made of a material with heat dissipation capabilities (e.g., stainless steel). This can dissipate heat from the flexible printed circuit board and direct it to the outside.

[0097] It should also be understood that the reinforcing plate 5 in this embodiment can be arranged at a position corresponding to the device mounting area, such as Figure 1 as well as Figure 2 As shown, if the device layer is provided on the top wiring layer 12a in this embodiment, the reinforcing plate 5 can be provided on the side of the bottom wiring layer 12b away from the substrate 11; if the device layer is provided on the bottom wiring layer 12b, the reinforcing plate 5 can be provided on the side of the top wiring layer 12a away from the substrate 11.

[0098] In this embodiment, the window area 7 is provided on the copper clad 3, so that at least a portion of the copper clad 3 can be exposed, thereby further improving the heat dissipation effect.

[0099] Reference Figure 5 , Figure 5 This is a top view of the heat conducting member 9 in the third embodiment of the flexible circuit board of the present application. In combination with the above embodiments, the third embodiment of the flexible circuit board of the present application is proposed.

[0100] like Figure 5 As shown, in this embodiment, in order to further conduct heat, the window area 7 is provided with a heat conducting member 9.

[0101] It should be noted that in this embodiment, the thermally conductive member 9 can be any device 2 having a heat-conducting function. Furthermore, in this embodiment, to facilitate attachment of the copper clad 3 to an external heat dissipation material, the thermally conductive member 9 can be a thermally conductive adhesive, etc., although this embodiment does not impose any limitations thereto. Furthermore, the size of the thermally conductive member 9 can be customized based on actual conditions.

[0102] During the manufacturing process, after the covering film 6 is covered on the copper clad 3 , the heat conducting member 9 can be arranged at the window area 7 of the covering film 6 .

[0103] Furthermore, in order to improve the heat conduction effect, as Figure 5 As shown, in this embodiment, the heat conducting member 9 completely covers the window area 7 .

[0104] It is understandable that the heat conducting member 9 in this embodiment can completely cover the window area 7 without affecting the bending area 8, thereby improving the heat dissipation effect while also improving the ability to adhere to external materials.

[0105] Furthermore, in order to prevent the heat conducting member 9 from affecting the bending of the bending zone 8, as shown in FIG. Figure 5 As shown, in this embodiment, the edge of the heat conducting member 9 is spaced apart from the bending area 8 .

[0106] It is understandable that in this embodiment, the edge of the heat conducting member 9 close to the bending zone 8 can be spaced apart from the bending zone 8. Specifically, Figure 5 As shown, if the distance between the edge of the heat conductor 9 close to the bending zone 8 and the edge of the bending zone 8 close to the heat conductor 9 is recorded as d1, the distance between the edge of the heat conductor 9 close to the wiring layer 12 and the edge of the wiring layer 12 close to the heat conductor 9 is recorded as d2, the distance between the edge of the heat conductor 9 close to the copper cladding 3 and the edge of the window area 7 close to the heat conductor 9 is recorded as d3, and the distance between the edge of the heat conductor 9 close to the bending zone 8 and the edge of the window area 7 close to the bending zone 8 is recorded as d4.

[0107] Furthermore, in this embodiment, in order to completely cover the window area 7 with the heat conductive member 9 and taking into account the processing error, in this embodiment, d3≥the covering film 6 fitting tolerance+the heat conductive member 9 attachment tolerance, wherein the covering film 6 fitting tolerance and the heat conductive member 9 attachment tolerance can be specifically set according to the process accuracy, and this embodiment does not limit this.

[0108] In order to set a spacing between the heat conductor 9 and the wiring layer 12, in this embodiment, d2 ≥ the attachment tolerance of the heat conductor 9 + the FPC board manufacturing tolerance + the first preset threshold; wherein the FPC board manufacturing tolerance can be specifically set according to the process accuracy, and the first preset threshold can be a threshold to ensure the spacing setting, for example, 0.1 mm can be used in this embodiment.

[0109] In order to completely cover the window area 7 with the heat conducting member 9 and taking into account the processing error, in this embodiment, d4≥the fitting tolerance of the covering film 6+the attachment tolerance of the heat conducting member 9.

[0110] In order to set the distance between the heat conducting member 9 and the bending area 8, in this embodiment, d1≥d4+the second preset threshold value,

[0111] The second preset threshold may be a threshold for ensuring interval setting, for example, 0.5 mm may be used in this embodiment.

[0112] Furthermore, in order to increase the contact area between the copper clad 3 and the heat conducting member 9, as shown in FIG. Figure 3 As shown, in this embodiment, a selective plating area 32 may be provided at the hole ring on one side of the via hole 31 close to the heat conducting member 9 .

[0113] It should be understood that the above-mentioned selective plating area 32 can be an area for selective plating on the hole ring. After the selective plating area 32 is selectively plated, the surrounding area of the hole ring will protrude from the non-hole ring area (i.e., the non-selective plating area) on the copper clad 3, thereby increasing the roughness of the side of the copper clad 3 close to the heat conductor 9, thereby increasing the contact area and improving the heat dissipation effect.

[0114] It should be emphasized that in this embodiment, the roughness of the side of the copper clad 3 close to the heat conductor 9 can also be increased by, for example, zigzag copper plating, etc., which is not limited in this embodiment.

[0115] Furthermore, in order to increase the contact area between the heat conducting member 9 and the copper cladding 3, refer to Figure 6 as well as Figure 7 , Figure 6 This is a structural diagram of a groove 91 in the third embodiment of the flexible circuit board of this application. Figure 7 This is a schematic structural diagram of another groove 91 in the third embodiment of the flexible circuit board of this application.

[0116] like Figure 6 as well as Figure 7As shown, in this embodiment, a groove 91 is provided on a side of the heat conducting member 9 close to the window area 7 .

[0117] It should be noted that, in this embodiment, a groove 91 may be provided on one side of the heat conducting member 9 close to the window area 7, wherein the number, position and specific shape of the groove 91 may be set according to actual conditions, such as Figure 6 As shown, in this embodiment, Z-shaped grooves 91 can be arranged at certain intervals, such as Figure 7 As shown, in this embodiment, wavy grooves 91 can also be provided at regular intervals. Of course, other shapes are also possible, such as triangular, circular, annular, or square, and this embodiment is not limited thereto. Since grooves 91 can be provided on the side of the heat conducting member 9 near the window area 7 in this embodiment, the surface of the heat conducting member 9 can be roughened, increasing the contact area, improving heat conduction, and increasing the firmness of adhesion.

[0118] Similarly, a groove 91 may be provided on the side of the heat conducting member 9 close to the external heat dissipation material to increase the contact area, thereby improving heat conduction and increasing the firmness of adhesion. The specific grooves 91 may refer to the above description and will not be elaborated in this embodiment.

[0119] In addition, to achieve the above-mentioned purpose, an embodiment of the present application further provides an electronic device, which includes the flexible circuit board as described above.

[0120] Since the implementation of the electronic device in this embodiment can refer to the various embodiments of the flexible circuit board described above, and thus has the beneficial effects of the various embodiments of the flexible circuit board described above, this embodiment will not elaborate on this.

[0121] The above are only preferred embodiments of the present application and do not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A flexible circuit board, characterized in that: The flexible circuit board comprises: a substrate having a plurality of wiring layers; The plurality of wiring layers include a device layer, and the device layer is provided with a device mounting area for accessing devices; Copper cladding is provided on the device layer except the device mounting area, and / or on at least one of the wiring layers except the device layer; The substrate has a plurality of side edges, and copper cladding is provided on at least one side edge.

2. The flexible circuit board according to claim 1, wherein: The copper-clad surface is at least partially provided with a gold layer.

3. The flexible circuit board according to claim 1, wherein: The copper cladding is grounding copper cladding or power supply copper cladding.

4. The flexible circuit board according to claim 1, wherein: The copper clad is provided with at least one via hole, and the via hole is filled with a heat conducting material.

5. The flexible circuit board according to claim 4, wherein: The via hole is a metal via hole.

6. The flexible circuit board according to claim 1, wherein: The plurality of wiring layers include a top wiring layer and a bottom wiring layer; Wherein, a copper clad layer is provided on the top wiring layer, a covering film is provided on the copper clad layer, and a window area is provided on the covering film; and / or, A copper clad layer is provided on the bottom wiring layer, a covering film is provided on the copper clad layer, and a window area is provided on the covering film.

7. The flexible circuit board according to claim 6, wherein: The edge of the window area is spaced apart from the outer side wall of the wiring layer.

8. The flexible circuit board according to claim 6, wherein: The copper cladding at least partially protrudes from the window area.

9. The flexible circuit board according to claim 8, wherein: The substrate is provided with a bending area, and the window area is spaced apart from the bending area.

10. The flexible circuit board according to claim 9, wherein: The window area is provided with a heat conducting member.

11. The flexible circuit board according to claim 10, wherein: The edge of the heat conducting member is spaced apart from the bending area.

12. The flexible circuit board according to claim 10, wherein: The heat conducting member completely covers the window area.

13. The flexible circuit board according to claim 10, wherein: A groove is provided on one side of the heat conducting member close to the window area.

14. The flexible circuit board according to claim 6, wherein: The device layer is arranged on the top wiring layer or the bottom wiring layer, and a reinforcing plate is arranged on the other wiring layer at a position corresponding to the device mounting area of the device layer.

15. An electronic device, characterized in that: The electronic device includes the flexible circuit board according to any one of claims 1 to 14.

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