Circuit board processing method

Abstract

The invention relates to the technical field of circuit board processing, and discloses a circuit board processing method which comprises the following steps: S1, a design stage; s2, preparing raw materials; s3, treatment before plate making; s4, circuit manufacturing; s5, etching and manufacturing a solder mask layer: etching a part which is not electroplated with copper by using an etching solution to form a complete circuit, then coating the solder mask layer, and performing exposure and development treatment; s6, manufacturing a character layer and performing surface treatment: coating the character layer on the solder mask layer, performing curing treatment, and performing surface treatment such as gold plating, tin plating and tin spraying according to requirements; and S7, quality detection and packaging. According to the circuit board processing method, through specific design stage steps including demand analysis, layout design, element arrangement, circuit wiring, simulation verification and the like, it is ensured that circuit board design meets actual application requirements, and design accuracy and reliability are improved. Meanwhile, professional circuit board design software is adopted, the design efficiency is improved, and the product development period is shortened.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board processing method. Background Art

[0002] A circuit board, also known as a printed circuit board, is a plate-like structural component that is made into printed circuits, printed components or a combination of the two according to a predetermined design on an insulating substrate and has an electrical connection function. The circuit board is mainly composed of a substrate, a conductor layer, an insulating layer, a solder mask layer and a text layer.

[0003] Traditional circuit board processing methods often have problems such as complicated processing steps, low production efficiency, and difficult quality control. For example, during the design stage, if customer needs and working environment are not accurately understood, the circuit board design may be unreasonable and unable to meet actual application needs; during the raw material preparation and pre-processing stages of board making, improper material selection or incomplete cleaning may affect the electrical performance and reliability of the circuit board; in key steps such as circuit production, etching and solder mask production, improper process control may lead to problems such as insufficient circuit accuracy and incomplete solder mask, thereby affecting the overall quality of the product. Summary of the Invention

[0004] The object of the present invention is to provide a circuit board processing method to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention provides the following technical solutions: A circuit board processing method, comprising the following steps: S1: Design stage: clarifying the functional requirements, size requirements, working environment, etc. of the circuit board, and drawing the layout diagram, component arrangement diagram, circuit routing diagram, etc. of the circuit board;

[0006] S2: Raw material preparation: Select the appropriate circuit board substrate according to the design requirements and cut the substrate into the required size;

[0007] S3: Pre-processing of board making: clean the oil, dust and other impurities on the surface of the substrate, and drill the required through holes, blind holes, etc. on the substrate according to the design drawings;

[0008] S4: Circuit fabrication: Coating photoresist on the substrate surface, performing exposure and development processes, and removing the photoresist after copper electroplating to form a circuit pattern;

[0009] S5: Etching and solder mask production: Use etching solution to etch the unplated copper part to form a complete circuit, then apply solder mask and perform exposure and development;

[0010] S6: Text layer production and surface treatment: Coat the text layer on the solder mask layer, perform curing treatment, and perform surface treatment such as gold plating, tin plating, and tin spraying as needed;

[0011] S7: Quality inspection and packaging: Conduct quality inspection on the circuit boards and package the qualified ones.

[0012] Preferably, the S1 design stage steps specifically include S11, demand analysis: communicate with customers or internal teams to clarify the functional requirements of the circuit board such as signal transmission and power distribution; S12, layout design: use professional circuit board design software such as Altium Designer, Eagle, PADS, etc. to draw the layout diagram of the circuit board according to the functional connection requirements of the components, and determine the position and arrangement of the components; S13, component arrangement: on the basis of the layout diagram, further refine the arrangement of the components, considering factors such as electrical connection, heat dissipation, and mechanical support between components; S14, circuit routing: design a circuit routing diagram based on the component arrangement diagram, determine the connection lines between components, and consider factors such as signal integrity, impedance matching, and current capacity; S15, simulation and verification: use circuit simulation software to perform electrical rule checking, signal integrity analysis, power integrity analysis, etc. on the design to ensure that the design meets the requirements.

[0013] Preferably, the S2 raw material preparation step specifically includes S21, material selection: selecting a suitable circuit board substrate according to design requirements, such as FR-4 glass fiber epoxy resin board, aluminum substrate, ceramic substrate, etc.; S22, cutting: using a laser cutting machine or a mechanical cutting machine to cut the substrate into the required size to ensure dimensional accuracy and edge quality; S23, inspection: performing an appearance inspection on the cut substrate to ensure that there are no defects such as cracks, bubbles, stains, etc.

[0014] Preferably, the S3 board making pre-treatment step specifically includes S31, cleaning treatment: using an ultrasonic cleaner or a high-pressure water gun to clean the surface of the substrate from oil, dust and other impurities to ensure that the surface is clean; S32, drilling positioning: according to the design drawings, using a CNC drilling machine to drill and position the substrate, and mark the positions of through holes, blind holes, etc.; S33, drilling: using a CNC drilling machine to drill according to the marked positions, and control the drilling depth, hole diameter and hole wall quality; S34, deburring: using a grinder or deburring equipment to deburr the drilled edge to ensure that the hole wall is smooth.

[0015] Preferably, the S4 circuit production step specifically includes S41, coating photoresist: using a coating machine to evenly coat the photoresist on the surface of the substrate, and controlling the thickness and uniformity of the glue layer; S42, pre-baking: placing the substrate coated with the photoresist into an oven for pre-baking treatment to solidify the photoresist; S43, exposure: using an exposure machine to expose the substrate coated with the photoresist to form a circuit pattern according to the design drawing; S44, development: placing the exposed substrate into a developer to dissolve and remove the unexposed photoresist to form a negative of the circuit pattern; S45, copper electroplating: placing the developed substrate into an electroplating tank, and depositing a layer of copper on the circuit pattern by electroplating to form a conductive circuit; S46, debonding: using a debonding solution or stripping equipment to remove the remaining photoresist to expose the complete copper circuit.

[0016] Preferably, the S5 etching and solder mask making steps specifically include S51, etching: placing the debonded substrate into an etching tank, and using an etching solution to etch away the unplated copper portion to form a complete circuit pattern; S52, cleaning after etching: using a cleaning agent to clean the etched substrate to remove residual etching solution and copper ions; S53, applying a solder mask: using a coating machine to evenly apply solder mask ink on the circuit pattern to protect the circuit from corrosion and mechanical damage; S54, exposure and development: exposing and developing the substrate coated with solder mask ink to form a solder mask pattern; S55, curing: placing the developed substrate into an oven for curing treatment to completely cure the solder mask ink.

[0017] Preferably, the S6 text layer production and surface treatment steps specifically include S61, coating the text layer: using a silk screen printer or a coating machine to evenly coat the text ink on the solder mask layer to form text information such as component identification and direction identification; S62, curing: placing the substrate coated with the text layer into an oven for curing treatment to completely cure the text ink; S63, surface treatment: performing surface treatments such as gold plating, tin plating, and tin spraying as needed to improve the conductivity, corrosion resistance and solderability of the circuit board; S64, cleaning and drying: cleaning the surface-treated substrate to remove residual processing liquid and impurities, and performing drying treatment.

[0018] Preferably, the S7 quality inspection and packaging steps specifically include S71, electrical testing: using an electrical tester to perform electrical performance testing on the circuit board, including open circuit test, short circuit test, insulation resistance test, etc.; S72, appearance inspection: performing appearance inspection on the circuit board, including the integrity of the circuit pattern, the uniformity of the solder mask layer, the clarity of the text layer, etc.; S73, size measurement: using measuring tools to measure the size of the circuit board to ensure that it meets the design requirements; S74, packaging: the qualified circuit boards are packaged in anti-static packaging to ensure that they are not damaged during transportation and storage.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] First, this invention ensures that the circuit board design meets actual application requirements through a clear design phase, including requirements analysis, layout design, component arrangement, circuit routing, and simulation verification, thereby improving the accuracy and reliability of the design. Furthermore, the use of professional circuit board design software improves design efficiency and shortens the product development cycle.

[0021] Second, the present invention lays a solid foundation for subsequent circuit production and etching steps by optimizing raw material preparation and board pre-treatment; by improving circuit production and etching accuracy, the integrity and accuracy of the circuit pattern are ensured; by enhancing the text layer production and surface treatment effect, the readability and aesthetics of the circuit board are improved.

[0022] Second, the present invention ensures the quality and reliability of the circuit board through steps such as electrical testing, appearance inspection, dimensional measurement and anti-static packaging. At the same time, the anti-static packaging also effectively protects the safety of the circuit board during transportation and storage. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a flow chart of the overall implementation of the present invention;

[0024] Figure 2 Implementation flow chart for the design phase of the present invention;

[0025] Figure 3 Flow chart for preparing raw materials for implementation of the present invention;

[0026] Figure 4 This is a flow chart of the pre-treatment process before plate making according to the present invention;

[0027] Figure 5 Create a flow chart for implementing the circuit of the present invention;

[0028] Figure 6 This is a flowchart of the etching and solder mask manufacturing process of the present invention;

[0029] Figure 7 This is a flowchart of the text layer production and surface treatment implementation of the present invention;

[0030] Figure 8 This is a flow chart of the quality inspection and packaging implementation of the present invention. DETAILED DESCRIPTION

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0032] The present invention provides the following technical solutions:

[0033] Example

[0034] like Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, a circuit board processing method includes the following steps: S1: design stage: clarify the functional requirements, size requirements, working environment, etc. of the circuit board, and draw the layout diagram, component arrangement diagram, circuit routing diagram, etc. of the circuit board;

[0035] S2: Raw material preparation: Select the appropriate circuit board substrate according to the design requirements and cut the substrate into the required size;

[0036] S3: Pre-processing of board making: clean the oil, dust and other impurities on the surface of the substrate, and drill the required through holes, blind holes, etc. on the substrate according to the design drawings;

[0037] S4: Circuit fabrication: Coating photoresist on the substrate surface, performing exposure and development processes, and removing the photoresist after copper electroplating to form a circuit pattern;

[0038] S5: Etching and solder mask production: Use etching solution to etch the unplated copper part to form a complete circuit, then apply solder mask and perform exposure and development;

[0039] S6: Text layer production and surface treatment: Coat the text layer on the solder mask layer, perform curing treatment, and perform surface treatment such as gold plating, tin plating, and tin spraying as needed;

[0040] S7: Quality inspection and packaging: Conduct quality inspection on the circuit boards and package the qualified ones.

[0041] Specifically, the steps of the S1 design phase include S11, demand analysis: communicate with customers or internal teams to clarify the functional requirements of the circuit board such as signal transmission and power distribution; S12, layout design: use professional circuit board design software such as Altium Designer, Eagle, PADS, etc. to draw the layout diagram of the circuit board according to the functional connection requirements of the components, and determine the position and arrangement of the components; S13, component arrangement: based on the layout diagram, further refine the arrangement of the components, considering factors such as electrical connection, heat dissipation, and mechanical support between components; S14, circuit routing: design the circuit routing diagram according to the component arrangement diagram, determine the connection lines between components, and consider factors such as signal integrity, impedance matching, and current capacity; S15, simulation and verification: use circuit simulation software to perform electrical rule checking, signal integrity analysis, power integrity analysis, etc. on the design to ensure that the design meets the requirements.

[0042] Specifically, the S2 raw material preparation steps include S21. Material selection: Select a suitable circuit board substrate according to design requirements, such as FR-4 glass fiber epoxy resin board, aluminum substrate, ceramic substrate, etc.; S22. Cutting: Use a laser cutting machine or mechanical cutting machine to cut the substrate into the required size to ensure dimensional accuracy and edge quality; S23. Inspection: Perform an appearance inspection on the cut substrate to ensure that there are no defects such as cracks, bubbles, stains, etc.

[0043] During the cutting process, the dimensional accuracy of the substrate must be strictly controlled. For example, for FR-4 fiberglass epoxy resin boards, the dimensional tolerance after cutting is usually controlled within ±0.1mm. At the same time, there are strict requirements for the thickness of the substrate. Common FR-4 board thicknesses include 0.4mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm and other specifications. The appropriate thickness must be selected according to the design requirements, and the thickness tolerance of the substrate after cutting must be within the allowable range.

[0044] Specifically, the S3 plate making pre-treatment step specifically includes S31, cleaning treatment: using an ultrasonic cleaning machine or a high-pressure water gun to clean the surface of the substrate from oil, dust and other impurities to ensure that the surface is clean;

[0045] S32. Drilling Positioning: Use a CNC drilling machine to drill holes in the substrate according to the design drawings, and mark the positions of through holes, blind holes, etc.; S33. Drilling: Use a CNC drilling machine to drill holes according to the marked positions, and control the drilling depth, hole diameter and hole wall quality; S34. Deburring: Use a grinder or deburring equipment to deburr the edges of the drilled holes to ensure smooth hole walls.

[0046] Among them, during the cleaning process, the ultrasonic cleaning machine usually uses ultrasonic waves with a frequency of more than 40kHz, which can penetrate into the tiny pores of the substrate to clean and ensure that the surface is clean and free of residue. The surface of the substrate after cleaning should meet certain cleanliness standards, such as ISO level 7 or higher, to ensure the smooth progress of subsequent processes; during the drilling positioning process, a CNC high-precision CNC drilling machine is used to drill and position the substrate. The CNC drilling machine usually uses laser or mechanical positioning methods with an accuracy of ±0.05mm or even higher; during the drilling process, the drilling depth is usually determined according to the requirements of the design drawings, and the error is controlled within ±0.1mm. The aperture needs to be determined according to the component pin diameter or design requirements. Common apertures include 0.3mm, 0.5mm, 0.8mm, 1.0mm and other specifications.

[0047] Specifically, the S4 circuit production steps include S41, photoresist coating: using a coating machine to evenly coat the photoresist on the surface of the substrate, controlling the thickness and uniformity of the glue layer; S42, pre-baking: placing the substrate coated with photoresist in an oven for pre-baking treatment to solidify the photoresist; S43, exposure: using an exposure machine to expose the substrate coated with photoresist to form a circuit pattern according to the design drawing; S44, development: placing the exposed substrate into a developer to dissolve and remove the unexposed photoresist to form a negative of the circuit pattern; S45, copper electroplating: placing the developed substrate into an electroplating tank, and depositing a layer of copper on the circuit pattern by electroplating to form a conductive circuit; S46, debonding: using a debonding solution or stripping equipment to remove the remaining photoresist to expose the complete copper circuit.

[0048] Among them, the thickness of the coated photoresist is generally controlled between several microns and tens of microns (such as 5-20μm), and the specific value is determined according to the design requirements; in the pre-baking process, the temperature of the oven is generally set between 80-120℃, and the time depends on the type of photoresist and the material of the substrate, usually tens of minutes. It is necessary to ensure that the photoresist is completely cured, but excessive baking should be avoided to cause deformation of the substrate or cracking of the photoresist.

[0049] Specifically, the S5 etching and solder mask production steps include S51, etching: placing the debonded substrate into an etching tank, and using an etching solution to etch away the unplated copper portion to form a complete circuit pattern; S52, cleaning after etching: using a cleaning agent to clean the etched substrate to remove residual etching solution and copper ions; S53, applying a solder mask: using a coating machine to evenly apply solder mask ink on the circuit pattern to protect the circuit from corrosion and mechanical damage; S54, exposure and development: exposing and developing the substrate coated with solder mask ink to form a solder mask pattern; S55, curing: placing the developed substrate into an oven for curing treatment to completely cure the solder mask ink.

[0050] Among them, during the process of coating the solder mask layer, the thickness of the solder mask ink layer is generally controlled between several microns and tens of microns (such as 10-30μm). During coating, it is necessary to ensure that the solder mask ink is evenly distributed without obvious bubbles and impurities; during the curing process, the oven temperature is generally set between 120-150℃, and the time depends on the type of solder mask ink, usually tens of minutes to several hours. It is necessary to ensure that the solder mask ink is completely cured to improve its corrosion resistance and mechanical strength.

[0051] Specifically, the S6 text layer production and surface treatment steps include S61, coating the text layer: using a silk screen printer or a coating machine to evenly coat the text ink on the solder mask layer to form component identification, direction identification and other text information; S62, curing: placing the substrate coated with the text layer into an oven for curing treatment to completely cure the text ink; S63, surface treatment: performing gold plating, tin plating, tin spraying and other surface treatments as needed to improve the conductivity, corrosion resistance and solderability of the circuit board; S64, cleaning and drying: cleaning the substrate after surface treatment to remove residual processing liquid and impurities, and performing drying treatment.

[0052] Among them, during the process of coating the text layer, the thickness of the text ink layer is generally controlled between several microns and tens of microns (such as 5-15μm). During coating, it is necessary to ensure that the text ink is evenly distributed without obvious bubbles and impurities; during the curing process, the oven temperature is generally set between 80-120℃, and the time depends on the type of text ink, usually tens of minutes. It is necessary to ensure that the text ink is completely cured to improve its wear resistance and clarity.

[0053] Specifically, the S7 quality inspection and packaging steps include S71, electrical testing: using an electrical tester to perform electrical performance tests on the circuit board, including open circuit test, short circuit test, insulation resistance test, etc.; S72, appearance inspection: performing appearance inspection on the circuit board, including the integrity of the circuit pattern, the uniformity of the solder mask layer, the clarity of the text layer, etc.; S73, size measurement: using measuring tools to measure the size of the circuit board to ensure that it meets the design requirements; S74, packaging: the qualified circuit boards are packaged in anti-static packaging to ensure that they are not damaged during transportation and storage.

[0054] During the size measurement process, vernier calipers, micrometers, etc. are used to measure the size of the circuit board to ensure that the size and shape of the circuit board meet the design requirements and ensure assembly accuracy and stability; during the packaging process, relevant documents such as quality inspection reports and certificates of conformity must be attached.

[0055] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and alterations may be made to the embodiments without departing from the principles and spirit thereof, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board processing method, characterized in that: The following steps are involved: S1: Design stage: clarify the functional requirements, size requirements, working environment, etc. of the circuit board, and draw the layout diagram, component arrangement diagram, circuit routing diagram, etc. of the circuit board; S2: Raw material preparation: Select the appropriate circuit board substrate according to the design requirements and cut the substrate into the required size; S3: Pre-processing of board making: clean the oil, dust and other impurities on the surface of the substrate, and drill the required through holes, blind holes, etc. on the substrate according to the design drawings; S4: Circuit fabrication: Coating photoresist on the substrate surface, performing exposure and development processes, and removing the photoresist after copper electroplating to form a circuit pattern; S5: Etching and solder mask production: Use etching solution to etch the unplated copper part to form a complete circuit, then apply solder mask and perform exposure and development; S6: Text layer production and surface treatment: Coat the text layer on the solder mask layer, perform curing treatment, and perform surface treatment such as gold plating, tin plating, and tin spraying as needed; S7: Quality inspection and packaging: Conduct quality inspection on the circuit boards and package the qualified ones.

2. A circuit board processing method according to claim 1, characterized in that: The steps of the S1 design phase specifically include S11, demand analysis: communicate with customers or internal teams to clarify the functional requirements of the circuit board such as signal transmission and power distribution; S12, layout design: use professional circuit board design software such as Altium Designer, Eagle, PADS, etc. to draw the layout diagram of the circuit board according to the functional connection requirements of the components, and determine the position and arrangement of the components; S13, component arrangement: based on the layout diagram, further refine the arrangement of the components, considering factors such as electrical connection, heat dissipation, and mechanical support between components; S14, circuit routing: design the circuit routing diagram according to the component arrangement diagram, determine the connection lines between components, and consider factors such as signal integrity, impedance matching, and current capacity; S15, simulation and verification: use circuit simulation software to perform electrical rule checking, signal integrity analysis, power integrity analysis, etc. on the design to ensure that the design meets the requirements.

3. A circuit board processing method according to claim 1, characterized in that: The S2 raw material preparation step specifically includes S21. Material selection: selecting a suitable circuit board substrate according to design requirements, such as FR-4 glass fiber epoxy resin board, aluminum substrate, ceramic substrate, etc.; S22. Cutting: using a laser cutting machine or a mechanical cutting machine to cut the substrate into the required size to ensure dimensional accuracy and edge quality; S23. Inspection: performing an appearance inspection on the cut substrate to ensure that there are no defects such as cracks, bubbles, stains, etc.

4. A circuit board processing method according to claim 1, characterized in that: The S3 board pre-treatment steps specifically include S31, cleaning: using an ultrasonic cleaner or a high-pressure water gun to clean the surface of the substrate from oil, dust and other impurities to ensure a clean surface; S32, drilling positioning: according to the design drawings, using a CNC drilling machine to drill and position the substrate, marking the positions of through holes, blind holes, etc.; S33, drilling: using a CNC drilling machine to drill according to the marked positions, controlling the drilling depth, hole diameter and hole wall quality; S34, deburring: using a grinder or deburring equipment to deburr the drilled edge to ensure a smooth hole wall.

5. A circuit board processing method according to claim 1, characterized in that: The S4 circuit fabrication step specifically includes S41, coating photoresist: using a coating machine to evenly coat the photoresist on the surface of the substrate, controlling the thickness and uniformity of the adhesive layer; S42, pre-baking: placing the substrate coated with the photoresist in an oven for pre-baking treatment to solidify the photoresist; S43, exposing: using an exposure machine to expose the substrate coated with the photoresist to form a circuit pattern according to the design drawing; S44, development: placing the exposed substrate into a developer to dissolve and remove the unexposed photoresist, thereby forming a negative of the circuit pattern; S45, copper electroplating: placing the developed substrate into an electroplating tank to deposit a layer of copper on the circuit pattern by electroplating, thereby forming a conductive circuit; S46, degumming: Use degumming liquid or stripping equipment to remove the remaining photoresist to expose the complete copper circuit.

6. A circuit board processing method according to claim 1, characterized in that: The S5 etching and solder mask making steps specifically include S51, etching: placing the debonded substrate into an etching tank, and using an etching solution to etch away the non-electroplated copper portion to form a complete circuit pattern; S52, cleaning after etching: using a cleaning agent to clean the etched substrate to remove residual etching solution and copper ions; S53, applying a solder mask: using a coating machine to evenly apply solder mask ink on the circuit pattern to protect the circuit from corrosion and mechanical damage; S54, exposure and development: exposing and developing the substrate coated with solder mask ink to form a solder mask pattern; S55, curing: placing the developed substrate into an oven for curing treatment to completely cure the solder mask ink.

7. A circuit board processing method according to claim 1, characterized in that: The S6 text layer production and surface treatment steps specifically include S61, coating the text layer: using a silk screen printer or a coating machine to evenly coat the text ink on the solder mask layer to form text information such as component identification and direction identification; S62, curing: placing the substrate coated with the text layer into an oven for curing treatment to completely cure the text ink; S63, surface treatment: performing gold plating, tin plating, tin spraying and other surface treatments as needed to improve the conductivity, corrosion resistance and solderability of the circuit board; S64, cleaning and drying: cleaning the substrate after surface treatment to remove residual processing liquid and impurities, and performing drying treatment.

8. A circuit board processing method according to claim 1, characterized in that: The S7 quality inspection and packaging steps specifically include S71, electrical testing: using an electrical tester to perform electrical performance tests on the circuit board, including open circuit test, short circuit test, insulation resistance test, etc.; S72, appearance inspection: performing appearance inspection on the circuit board, including the integrity of the circuit pattern, the uniformity of the solder mask layer, the clarity of the text layer, etc.; S73, size measurement: using measuring tools to measure the size of the circuit board to ensure that it meets the design requirements; S74, packaging: the qualified circuit boards are packaged in anti-static packaging to ensure that they are not damaged during transportation and storage.

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