Circuit board clamp PIN drilling technology, circuit board target drilling machine and production line

Abstract

The invention belongs to the technical field of circuit board processing, and discloses a circuit board clamp PIN drilling process, a circuit board target drilling machine and a production line. The circuit board clamping PIN drilling technology comprises the following steps that S1, four actual targets at the positions of the four corners of a circuit board are recognized, and the actual gravity center position P1 of the circuit board and the offset distances R1, R2, R3 and R4 between the positions of the four actual targets and the position of a theoretical target are calculated; s2, rotating the circuit board by taking the actual gravity center position P1 as a center, monitoring and comparing the maximum value RX of R1, R2, R3 and R4 in real time in the rotating process, and stopping rotating when the RX is minimum; s3, two positioning targets are processed on the rotated circuit board, and PINs are installed on the circuit board; and S4, the circuit board is transferred into a drilling machine tool, and drilling is carried out after PIN clamping and positioning.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a circuit board PIN drilling process, a circuit board target drilling machine and a production line. Background Art

[0002] The circuit board needs to be positioned before drilling. There are generally two positioning methods in the industry. One is bakelite positioning, that is, drilling holes at the four corners of the bakelite, and then installing pins; when clamping, pins are inserted into the positioning holes at the four corners of the circuit board to achieve positioning; the other is PIN positioning, that is, holes are drilled at intervals at the center line of the circuit board, PINs are installed in the holes, and then two PINs are clamped with a fixture to complete the positioning.

[0003] Prior art methods for positioning pins use fewer holes and require fewer pins, resulting in faster positioning than bakelite and higher clamping efficiency. However, due to the irregular expansion and contraction of circuit boards, if the board's four corner targets are simply transferred to the centerline using theoretical calculations to set two pin positioning targets, if the board is not a regular rectangle, the alignment between the inner layer pattern and the drilled hole positions in the fan-shaped area farthest from the center of gravity will be poor, resulting in severe internal shorts and scrapping. Summary of the Invention

[0004] The purpose of the present invention is to provide a circuit board clamp PIN drilling process, a circuit board target drilling machine and a production line to solve the problem of slow positioning speed of bakelite boards in the prior art, which affects production efficiency, and improve the production efficiency and hole opening accuracy of circuit boards.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] In a first aspect, a circuit board clip PIN drilling process is provided, comprising the following steps:

[0007] S1. Identify four actual targets at the four corners of the circuit board, and calculate the actual center of gravity position P1 of the circuit board and the offset distances R1, R2, R3 and R4 between the positions of the four actual targets and the positions of the theoretical targets;

[0008] S2, rotating the circuit board around the actual center of gravity position P1, monitoring and comparing the maximum value RX among R1, R2, R3, and R4 in real time during the rotation process, and stopping the rotation when RX is the minimum;

[0009] S3, processing two positioning targets on the rotated circuit board and installing PINs;

[0010] S4, transferring the circuit board to a drilling machine, positioning it with PINs, and then drilling holes.

[0011] As an optional technical solution for the circuit board clip PIN drilling process, in step S2, bubble sort or selection sort is used among R1, R2, R3 and R4 to determine RX.

[0012] As an optional technical solution for the circuit board clamp PIN drilling process, in step S1, the four actual targets are copper round PADs.

[0013] As an optional technical solution for the circuit board clamp PIN drilling process, in step S3, an anti-fool target can be processed and a PIN can be installed on the rotated circuit board. The two positioning targets and the anti-fool target are distributed in an L shape to avoid directional errors of the circuit board during processing.

[0014] In the second aspect, a circuit board target drilling rig is provided, which applies the circuit board clamp PIN drilling process, including an X-RAY generator, a carrier and a camera. The X-RAY generator is used to see through the circuit board to obtain targets at the four corners of the circuit board; the carrier is used to carry the circuit board; the camera is arranged above the carrier to receive the pattern of the target.

[0015] As an optional technical solution for the circuit board target drilling rig, a carrying plate is provided on the carrier, and the circuit board is placed on the carrying plate. The carrying plate can rotate relative to the carrier to drive the circuit board to rotate, thereby adjusting the position of the actual target.

[0016] As an optional technical solution for the circuit board target drilling rig, the circuit board target drilling rig further includes a rotary motor, which is connected to the camera to drive the camera to rotate, thereby changing the position of the theoretical target.

[0017] As an optional technical solution for the circuit board target drilling rig, the circuit board target drilling rig further includes a robotic arm, an adsorption member is provided at the end of the robotic arm, and the robotic arm absorbs and transfers the circuit board through the adsorption member.

[0018] As an optional technical solution for the circuit board target drilling rig, the camera component is an image intensifier and a CCD.

[0019] In a third aspect, a production line is provided, including a circuit board target drilling rig.

[0020] Beneficial effects of the present invention:

[0021] The present application discloses a circuit board PIN drilling process, a circuit board target drilling machine and a production line. The circuit board PIN drilling process includes the following steps: S1, identifying the four actual targets at the four corners of the circuit board, calculating the actual center of gravity position P1 of the circuit board and the offset distances R1, R2, R3 and R4 between the positions of the four actual targets and the positions of the theoretical targets; S2, rotating the circuit board with the actual center of gravity position P1 as the center, monitoring and comparing the maximum value RX among R1, R2, R3 and R4 in real time during the rotation process, and stopping the rotation when RX is the minimum; S3, processing two positioning targets on the rotated circuit board and installing PIN; S4, transferring the circuit board to the drilling machine, clamping the PIN for positioning and then drilling. By rotating the circuit board, RX is made to be the minimum value compared during the rotation process, thereby reducing the distance between the actual target position at the farthest corner of the circuit board and the theoretical target position, thereby improving the hole opening accuracy of the circuit board and improving the production efficiency of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0023] Figure 1 The present invention provides a flowchart of a circuit board clip PIN drilling process. DETAILED DESCRIPTION

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It will be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all structures.

[0025] In the description of the present invention, unless otherwise expressly specified or limited, the terms "connected," "connected," and "fixed" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention in specific circumstances.

[0026] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0027] In the description of this embodiment, the terms "upper," "lower," "right," and other orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely for ease of description and simplified operation. They do not indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used solely for descriptive purposes and have no special meanings.

[0028] Prior art methods for positioning pins use fewer holes and require fewer pins, resulting in faster positioning than bakelite and higher clamping efficiency. However, due to the irregular expansion and contraction of circuit boards, if the board's four corner targets are simply transferred to the centerline using theoretical calculations to set two pin positioning targets, if the board is not a regular rectangle, the alignment between the inner layer pattern and the drilled hole positions in the fan-shaped area farthest from the center of gravity will be poor, resulting in severe internal shorts and scrapping.

[0029] To solve the above problems, this embodiment provides a circuit board clip PIN drilling process, see Figure 1 , including the following steps:

[0030] S1. Identify the four actual targets at the four corners of the circuit board, calculate the actual center of gravity position P1 of the circuit board, and the offset distances R1, R2, R3, and R4 between the positions of the four actual targets and the theoretical target positions;

[0031] S2. Rotate the circuit board around the actual center of gravity P1. During the rotation, monitor and compare the maximum value RX among R1, R2, R3, and R4 in real time. When RX is the minimum, stop the rotation.

[0032] S3, processing two positioning targets on the rotated circuit board and installing PINs;

[0033] S4. Transfer the circuit board to the drilling machine, clamp the PIN to position it, and then drill holes.

[0034] By rotating the circuit board, RX is made the minimum value compared during the rotation process, thereby reducing the distance between the actual target position and the theoretical target position at the farthest corner of the circuit board, thereby improving the opening accuracy of the circuit board and improving the production efficiency of the circuit board.

[0035] For example, when R1=1, R2=2, R3=3, and R4=4, the maximum value is 4; after rotating the circuit board, R1=1.8, R2=2.5, R3=3.3, and R4=3.5, and the maximum value is 3.5; comparing 3.5 and 4, RX=3.5, so the rotated circuit board is in the optimal position.

[0036] Furthermore, in step S2 , bubble sort or selection sort is used among R1 , R2 , R3 and R4 to determine RX.

[0037] Specifically, Bubble Sort is a simple sorting algorithm that repeatedly traverses the array to be sorted, compares each pair of adjacent elements, and swaps their positions when necessary, so that larger elements gradually "bubble" to the end of the array. This process continues until the entire array is sorted.

[0038] Bubble sort consists of the following steps:

[0039] Step 1: Starting from the first element of the array, compare two adjacent elements;

[0040] Step 2: If the previous element is greater than the next element, swap their positions;

[0041] Step 3: Repeat steps 1 and 2 until the end of the array;

[0042] Step 4: Repeat steps 1 to 3 for the remaining elements until the entire array is sorted.

[0043] Selection Sort is a simple and intuitive sorting algorithm. Its basic idea is to select the smallest (or largest) element from the unsorted part each time and put it at the end of the sorted sequence. This process is repeated until all elements are sorted.

[0044] Selection sort involves the following steps:

[0045] Step 1: Divide the array to be sorted into two parts, the sorted part and the unsorted part. Initially, the sorted part is empty and the unsorted part is the entire array.

[0046] Step 2: Select the smallest element: Find the smallest element in the unsorted part;

[0047] Step 3: Exchange the minimum value found with the first element of the unsorted part;

[0048] Step 4: Enlarge the sorted part by one and reduce the unsorted part by one;

[0049] Step 5: Repeat steps 1 to 4 until all elements are sorted.

[0050] Furthermore, in step S1, the four actual targets are copper round PADs. The copper round PAD is a circular PAD structure made of circular metal (usually copper foil) on the circuit board. Since X-rays have strong penetrating power, different materials absorb X-rays to different degrees, thereby forming different grayscale images on the detector, which is used to accurately capture the images and positions of the four actual targets in the inner layer. Specifically, among the four actual targets, the diameter of the actual target located in the lower right corner of the circuit board is 1.5mm, and the diameters of the other three actual targets are 1mm. The difference in diameter can avoid directional errors of the circuit board when processing the positioning targets.

[0051] Furthermore, in step S3, anti-fool targets can be processed and PINs can be installed on the rotated circuit board. The two positioning targets and the anti-fool targets are distributed in an L shape to avoid directional errors of the circuit board during processing.

[0052] This embodiment also provides a production line, including a circuit board target drilling rig. The circuit board target drilling rig applies a circuit board clamp PIN drilling process and includes an X-RAY generator, a carrier, and a camera. The X-RAY generator is used to see through the circuit board to obtain targets at the four corners of the circuit board; the carrier is used to carry the circuit board; and the camera is provided above the carrier to receive the target pattern. Specifically, a carrier plate is provided on the carrier, and the circuit board is placed on the carrier plate. The carrier plate can rotate relative to the carrier plate to drive the circuit board to rotate, thereby adjusting the position of the actual target. In other embodiments, the circuit board target drilling rig also includes a rotary motor, which is connected to the camera to drive the camera to rotate, thereby changing the position of the theoretical target. Whether changing the position of the actual target or the theoretical target, the requirements of changing R1, R2, R3, and R4 can be achieved, so they are not limited here. Specifically, the camera is an image intensifier and a CCD to improve the quality of the received target pattern.

[0053] Furthermore, the circuit board target drilling rig includes a robotic arm with a suction element at its end, which the robotic arm uses to absorb and transfer the circuit board. The robotic arm uses the suction element to lift the circuit board and then moves it to the drilling equipment for drilling. Specifically, the suction element is a vacuum pump and a suction nozzle. It should be noted that since vacuum pumps and suction nozzles are well-established technologies in the prior art, they are not limited here.

[0054] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A circuit board clip PIN drilling process, characterized in that: The following steps are involved: S1. Identify four actual targets at the four corners of the circuit board, and calculate the actual center of gravity position P1 of the circuit board and the offset distances R1, R2, R3 and R4 between the positions of the four actual targets and the positions of the theoretical targets; S2, rotating the circuit board around the actual center of gravity position P1, monitoring and comparing the maximum value RX among R1, R2, R3, and R4 in real time during the rotation process, and stopping the rotation when RX is the minimum; S3, processing two positioning targets on the rotated circuit board and installing PINs; S4, transferring the circuit board to a drilling machine, positioning it with PINs, and then drilling holes.

2. The circuit board clip PIN drilling process according to claim 1, characterized in that: In step S2, bubble sort or selection sort is used among R1, R2, R3 and R4 to determine RX.

3. The circuit board clip PIN drilling process according to claim 1, characterized in that: In step S1, the four actual targets are copper round PADs.

4. The circuit board clip PIN drilling process according to claim 1, characterized in that: In step S3, foolproof targets can be processed and PINs can be installed on the rotated circuit board. The two positioning targets and the foolproof targets are distributed in an L shape to avoid directional errors of the circuit board during processing.

5. A circuit board target drilling machine, using the circuit board clip PIN drilling process according to any one of claims 1 to 4, characterized in that: It includes an X-RAY generator, a carrier and a camera. The X-RAY generator is used to see through the circuit board to obtain targets at the four corners of the circuit board; the carrier is used to carry the circuit board; the camera is located above the carrier and is used to receive the pattern of the target.

6. The circuit board target drilling machine according to claim 5, characterized in that: A carrying plate is provided on the carrier, and the circuit board is placed on the carrying plate. The carrying plate can rotate relative to the carrier to drive the circuit board to rotate, thereby adjusting the position of the actual target.

7. The circuit board target drilling machine according to claim 5, characterized in that: The circuit board target drilling machine further includes a rotary motor connected to the camera to drive the camera to rotate, thereby changing the position of the theoretical target.

8. The circuit board target drilling machine according to claim 5, characterized in that: The circuit board target drilling rig further includes a robotic arm, an end of which is provided with a suction piece, and the robotic arm absorbs and transfers the circuit board through the suction piece.

9. The circuit board target drilling machine according to claim 5, characterized in that: The camera element is an image intensifier and a CCD.

10. A production line, characterized in that: It comprises the circuit board target drilling rig as described in any one of claims 5-9.

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