A dispensing device for integrated circuit board production and processing

Abstract

The present invention discloses a dispensing device for the production and processing of integrated circuit boards, which relates to the technical field of circuit board processing. The device comprises a base, a support frame fixedly connected to the top of the rear side of the base, a control frame slidably connected to the support frame, a fixed frame slidably connected to the lower end of the control frame, a dispensing head fixedly connected to the front side of the fixed frame, and a guide rail fixedly connected to the top of the base. The device also comprises: a positioning and anti-deflection mechanism and a preheating monitoring mechanism. Through the setting of the preheating monitoring mechanism, during the preheating of the heating tube in the preheating box, the design of the memory alloy wire, the through rod, the sealing plate, the through hole and the heat dissipation hole is utilized. When the actual preheating temperature exceeds the preheating temperature of the circuit board, the memory alloy wire will change from a contracted state to an extended state, and the sealing plate will be pushed backward synchronously, so that the through hole and the heat dissipation hole are connected, so that the hot air inside the preheating box can be dissipated to the outside through the heat dissipation hole and the through hole, thereby reducing the preheating temperature inside the preheating box.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and in particular to a glue dispensing device used for the production and processing of integrated circuit boards. Background Art

[0002] In the field of modern electronic manufacturing, the production and processing of integrated circuit boards is a highly precise process, in which the dispensing process is one of the key steps. The dispensing process is mainly used to apply glue on the circuit board to fix components, seal interfaces or realize other functions.

[0003] In order to ensure that the glue can cure quickly and achieve the ideal adhesion effect, the circuit board usually needs to be preheated. However, when the preheating temperature exceeds the set value, the existing preheating method often cannot obtain timely feedback to reduce the preheating temperature in the preheating box and reduce the heat transfer to the circuit board. This will make it difficult for the hot air inside the preheating box to dissipate, thereby causing heat to accumulate and be transferred to the circuit board. Long-term high-temperature transfer will further aggravate the thermal damage of the circuit board, causing damage to the circuit board, thereby affecting the processing quality of the circuit board and reducing the service life of the circuit board.

[0004] In view of this, the present invention proposes a dispensing device for integrated circuit board production and processing to compensate for and improve the shortcomings of the prior art. Summary of the Invention

[0005] In order to solve the above technical problems, the present invention provides a dispensing device for the production and processing of integrated circuit boards to solve the corresponding technical problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a dispensing device for integrated circuit board production and processing, comprising a base, a support frame fixedly connected to the top of the rear side of the base, a control frame slidably connected to the support frame, a fixed frame slidably connected to the lower end of the control frame, a dispensing head fixedly connected to the front side of the fixed frame, a guide rail fixedly connected to the top of the base, and further comprising: a positioning anti-deflection mechanism and a preheating monitoring mechanism;

[0007] The positioning and anti-deflection mechanism includes a preheating box, a fixed frame, a heat conducting plate and a positioning plate. The preheating box is slidably connected to the guide rail, the fixed frame is fixedly connected to the top of the preheating box, the heat conducting plate is symmetrically slidably connected to the upper end of the fixed frame, and the positioning plate is symmetrically arranged above the fixed frame.

[0008] The preheating monitoring mechanism includes a memory alloy wire, a sealing plate, a through hole and a heat dissipation hole. The memory alloy wire and the sealing plate are symmetrically arranged on both sides of the preheating box. The through hole is opened on the sealing plate, and the heat dissipation holes are symmetrically opened on both sides of the preheating box.

[0009] Preferably, the positioning and anti-deviation mechanism also includes a central axis that passes through and is rotatably connected to the middle of the fixed frame, and the outer surfaces at both ends of the central axis are symmetrically fixedly connected with linkage plates, and vertical rods are symmetrically fixedly connected on both sides of the positioning plate, and a driven plate is rotatably connected between the vertical rod and the linkage plate.

[0010] Preferably, a first sliding groove is symmetrically provided on both sides of the fixed frame, a slider is slidably connected in the first sliding groove, and the slider is fixedly connected to the vertical rod, a center plate is fixedly connected to the upper end of the middle part of the fixed frame, the heat conduction plate is slidably connected between the center plate and the fixed frame, and the center axis is arranged below the center plate.

[0011] Preferably, an L-shaped frame plate is fixedly connected to the lower front end of the preheating box, the central shaft is rotatably connected to the upper end of the L-shaped frame plate, a knob is fixedly connected to the front side of the central shaft, a ratchet is fixedly connected to the outer surface of one end of the central shaft close to the knob, a torsion spring shaft is rotatably connected to the upper front end of the L-shaped frame plate, a pawl is fixedly connected to the outer surface of the torsion spring shaft, and the pawl cooperates with the ratchet.

[0012] Preferably, the preheating monitoring mechanism also includes a monitoring frame symmetrically fixedly connected to both sides of the front end of the preheating box, a heating tube is fixedly connected to the inside of the preheating box, a telescopic column is fixedly connected to the front inner wall of the monitoring frame, a push plate is fixedly connected to the rear side of the telescopic column, the memory alloy wire is fixedly connected between the front inner wall of the monitoring frame and the push plate, and the memory alloy wire is sleeved on the outside of the telescopic column.

[0013] Preferably, a through rod is slidably connected to the rear side of the monitoring frame, a fixed block is fixedly connected to the side of the through rod away from the push plate, and the fixed block is fixedly connected to the sealing plate on the side away from the through rod. Second sliding grooves are symmetrically provided on both sides of the preheating box, and a sliding bar is symmetrically fixedly connected to the side of the sealing plate facing the preheating box, and the sliding bar is slidably connected to the second sliding groove.

[0014] Preferably, exhaust holes are symmetrically provided on both sides of the rear end of the preheating box, the sealing plate is in contact with the outer wall of the preheating box, and the through holes are not initially connected to the heat dissipation holes.

[0015] Preferably, the upper end of the sealing plate is fixedly connected with a first connecting shaft at equal distances, the opposite side of the heat conducting plate is fixedly connected with a second connecting shaft, through grooves are symmetrically and equidistantly provided on both sides of the fixed frame, support plates are symmetrically and fixedly connected to the lower ends of the inner walls on both sides of the fixed frame, springs are fixedly connected with equal distances between the support plates and the heat conducting plates, the second connecting shaft is slidably connected to the through grooves, and a connecting plate is rotatably connected between the second connecting shaft and the first connecting shaft.

[0016] Preferably, switches are symmetrically provided on both sides of the rear end of the preheating box, a cylinder is fixedly connected to the lower end of the rear side of the fixing frame, and the cylinder is electrically connected to the switch.

[0017] Preferably, the front lower end of the fixing frame is symmetrically fixedly connected with side plates, a blocking plate is slidably connected between the side plates, and the blocking plate is fixedly connected to the output end of the cylinder.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] (1) Through the setting of the preheating monitoring mechanism, during the preheating process of the heating tube in the preheating box, the design of the memory alloy wire, the through rod, the sealing plate, the through hole and the heat dissipation hole is used. When the actual preheating temperature exceeds the preheating temperature of the circuit board, the memory alloy wire will change from a contracted state to an extended state, and the sealing plate will be pushed backward synchronously, so that the through hole and the heat dissipation hole are connected, so that the hot air inside the preheating box can be dissipated to the outside through the heat dissipation hole and the through hole, thereby reducing the preheating temperature inside the preheating box and reducing unnecessary heat accumulation in the preheating box, thereby reducing heat transfer to the circuit board, avoiding damage to the circuit board due to overheating, and thus extending the service life of the circuit board and improving product quality.

[0020] (2) By setting up the preheating monitoring mechanism and utilizing the design of the first connecting shaft, the second connecting shaft and the connecting plate, when the sealing plate is pushed backward by the through rod, the heat conducting plate is simultaneously driven to move downward between the center plate and the fixed frame, so that a gap is formed between the heat conducting plate and the bottom of the circuit board, thereby reducing the contact area between the heat conducting plate and the circuit board and reducing the heat transfer, thereby avoiding damage to the circuit board caused by excessive temperature, and further reducing the temperature in the preheating box to ensure the safety of the preheating process;

[0021] In addition, by using the switches set on both sides of the rear end of the preheating box, when the sealing plate is pushed backward, the switches can be touched synchronously to trigger the cylinder, pushing the blocking plate to seal the glue dispensing head, thereby automatically sealing the glue dispensing head when the temperature is abnormal, avoiding glue dripping, reducing glue waste, reducing production costs, and keeping the working environment clean.

[0022] (3) By setting up the positioning anti-deviation mechanism, after the circuit board is placed on the upper surface of the heat conduction plate and before the circuit board is glued, the circuit board placed on the upper surface of the heat conduction plate can be pushed to the center above the fixed frame by utilizing the design of the linkage plate, the driven plate, the vertical rod and the positioning plate, so as to define the position of the circuit board, avoid the circuit board from being offset during the subsequent processing and affecting the processing accuracy of the circuit board, thereby ensuring that the glue head can accurately align with the glue dispensing position on the circuit board during the subsequent glue dispensing operation, thereby improving the glue dispensing accuracy, avoiding the circuit board from being offset during the processing, maintaining the stability of the circuit board, and ensuring the uniformity and consistency of glue dispensing;

[0023] Among them, the coordinated design of the ratchet and pawl can effectively prevent the loosening and separation between the positioning plate and the circuit board during the circuit board dispensing operation, further consolidate the positioning plate's definition of the circuit board position, and thus improve the stability of circuit board processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic diagram of the overall structure of a preferred embodiment of the present invention;

[0025] Figure 2 This is a structural diagram of the connection between the preheating box and the fixed frame shown in the present invention;

[0026] Figure 3 The present invention shows Figure 2 A in the middle is an enlarged structural diagram;

[0027] Figure 4 The present invention shows Figure 2 The enlarged structural diagram at B in the middle;

[0028] Figure 5 This is a schematic structural diagram of the sealing plate connection shown in the present invention;

[0029] Figure 6 The present invention shows Figure 5 The enlarged structural diagram at C in the middle;

[0030] Figure 7 This is a schematic structural diagram of the blocking plate connection shown in the present invention.

[0031] The numbers in the figure are:

[0032] 1. Base; 2. Support frame; 3. Control frame; 4. Fixed frame; 5. Dispensing head; 6. Guide rail;

[0033] 7. Positioning and anti-deflection mechanism; 701. Preheating box; 702. Fixed frame; 703. Center plate; 704. Heat conducting plate; 705. L-shaped frame; 706. Linkage plate; 707. Driven plate; 708. Vertical rod; 709. Slider; 710. First slide; 711. Positioning plate; 712. Knob; 713. Center shaft; 714. Ratchet; 715. Torsion spring shaft; 716. Pawl;

[0034] 8. Preheating monitoring mechanism; 801. Heating tube; 802. Monitoring frame; 803. Telescopic column; 804. Memory alloy wire; 805. Push plate; 806. Through rod; 807. Fixing block; 808. Closing plate; 809. Through hole; 810. Sliding bar; 811. Second slide groove; 812. Heat dissipation hole; 813. Switch; 814. Exhaust hole; 815. First connecting shaft; 816. Connecting plate; 817. Second connecting shaft; 818. Through groove; 819. Blocking plate; 820. Side plate; 821. Cylinder. DETAILED DESCRIPTION

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0036] Embodiment 1 of the present invention:

[0037] Please refer to Figures 1 to 7 As shown, a dispensing device for integrated circuit board production and processing includes a base 1, a support frame 2 is fixedly connected to the top of the rear side of the base 1, a control frame 3 is slidably connected to the support frame 2, a fixing frame 4 is slidably connected to the lower end of the control frame 3, a dispensing head 5 is fixedly connected to the front side of the fixing frame 4, a guide rail 6 is fixedly connected to the top of the base 1, and further includes: a positioning anti-deflection mechanism 7 and a preheating monitoring mechanism 8;

[0038] The positioning and anti-deflection mechanism 7 includes a preheating box 701, a fixed frame 702, a heat conducting plate 704, and a positioning plate 711. The preheating box 701 is slidably connected to the guide rail 6, the fixed frame 702 is fixedly connected to the top of the preheating box 701, the heat conducting plate 704 is symmetrically slidably connected to the upper end of the fixed frame 702, and the positioning plate 711 is symmetrically arranged above the fixed frame 702.

[0039] The preheating monitoring mechanism 8 includes a memory alloy wire 804, a sealing plate 808, a through hole 809, and a heat dissipation hole 812. The memory alloy wire 804 and the sealing plate 808 are symmetrically arranged on both sides of the preheating box 701. The through hole 809 is opened on the sealing plate 808, and the heat dissipation hole 812 is symmetrically opened on both sides of the preheating box 701.

[0040] The positioning and anti-deflection mechanism 7 further includes a central shaft 713 that passes through and is rotatably connected to the middle of the fixed frame 702. Linkage plates 706 are symmetrically fixedly connected to the outer surfaces of both ends of the central shaft 713. Vertical rods 708 are symmetrically fixedly connected to both sides of the positioning plate 711. A driven plate 707 is rotatably connected between the vertical rods 708 and the linkage plate 706.

[0041] First sliding grooves 710 are symmetrically provided on both sides of the fixed frame 702. Sliders 709 are slidably connected in the first sliding grooves 710. The slides 709 are fixedly connected to the vertical rods 708. A center plate 703 is fixedly connected to the upper end of the middle portion of the fixed frame 702. The heat conducting plate 704 is slidably connected between the center plate 703 and the fixed frame 702. The center shaft 713 is provided below the center plate 703.

[0042] An L-shaped frame plate 705 is fixedly connected to the lower front end of the preheating box 701, and a central shaft 713 is rotatably connected to the upper end of the L-shaped frame plate 705. A knob 712 is fixedly connected to the front side of the central shaft 713, and a ratchet 714 is fixedly connected to the outer surface of one end of the central shaft 713 close to the knob 712. A torsion spring shaft 715 is rotatably connected to the upper front end of the L-shaped frame plate 705, and a pawl 716 is fixedly connected to the outer surface of the torsion spring shaft 715, and the pawl 716 cooperates with the ratchet 714.

[0043] The effects achieved by this embodiment are as follows: compared with the prior art, through the setting of the positioning anti-deflection mechanism 7, after the circuit board is placed on the upper surface of the heat conducting plate 704 and before the circuit board is subjected to the glue dispensing operation, the design of the linkage plate 706, the driven plate 707, the vertical rod 708 and the positioning plate 711 can push the circuit board placed on the upper surface of the heat conducting plate 704 to the center above the fixed frame 702, so as to define the position of the circuit board, avoid the circuit board from being offset during the subsequent processing and affecting the processing accuracy of the circuit board, thereby ensuring that during the subsequent glue dispensing operation, the glue dispensing head 5 can accurately align with the glue dispensing position on the circuit board, thereby improving the glue dispensing accuracy, avoiding the circuit board from being offset during the processing, maintaining the stability of the circuit board, and ensuring the uniformity and consistency of glue dispensing;

[0044] Among them, the coordinated design of the ratchet 714 and the pawl 716 can effectively prevent the positioning plate 711 from loosening and separating from the circuit board during the circuit board dispensing operation, further consolidating the positioning plate 711's definition of the circuit board position, thereby improving the stability of circuit board processing.

[0045] Embodiment 2 of the present invention:

[0046] Please refer to Figures 1 to 7 As shown, the preheating monitoring mechanism 8 also includes a monitoring frame 802 symmetrically fixedly connected to both sides of the front end of the preheating box 701, a heating tube 801 is fixedly connected to the interior of the preheating box 701, a telescopic column 803 is fixedly connected to the front inner wall of the monitoring frame 802, a push plate 805 is fixedly connected to the rear side of the telescopic column 803, and a memory alloy wire 804 is fixedly connected between the front inner wall of the monitoring frame 802 and the push plate 805, and the memory alloy wire 804 is sleeved on the outside of the telescopic column 803;

[0047] A through rod 806 is slidably connected to the rear side of the monitoring frame 802. A fixed block 807 is fixedly connected to the side of the through rod 806 away from the push plate 805. The side of the fixed block 807 away from the through rod 806 is fixedly connected to the sealing plate 808. Second sliding grooves 811 are symmetrically opened on both sides of the preheating box 701. A sliding bar 810 is symmetrically fixedly connected to the side of the sealing plate 808 facing the preheating box 701, and the sliding bar 810 is slidably connected to the second sliding groove 811.

[0048] Exhaust holes 814 are symmetrically opened on both sides of the rear end of the preheating box 701. The sealing plate 808 is in contact with the outer wall of the preheating box 701. The through hole 809 is not connected to the heat dissipation hole 812 at the beginning.

[0049] The upper end of the sealing plate 808 is fixedly connected to a first connecting shaft 815 at equal intervals. The opposite side of the heat conducting plate 704 is fixedly connected to a second connecting shaft 817. Through slots 818 are symmetrically and equidistantly formed on both sides of the fixed frame 702. Support plates are symmetrically and equidistantly fixed to the lower ends of the inner walls of both sides of the fixed frame 702. Springs are fixedly connected to the support plates and the heat conducting plate 704 at equal intervals. The second connecting shaft 817 is slidably connected to the through slots 818. A connecting plate 816 is rotatably connected between the second connecting shaft 817 and the first connecting shaft 815.

[0050] Switches 813 are symmetrically provided on both sides of the rear end of the preheating box 701. A cylinder 821 is fixedly connected to the lower end of the rear side of the fixing frame 4, and the cylinder 821 is electrically connected to the switch 813.

[0051] The lower end of the front side of the fixing frame 4 is symmetrically fixedly connected with a side plate 820, and a blocking plate 819 is slidably connected between the side plates 820, and the blocking plate 819 is fixedly connected to the output end of the cylinder 821.

[0052] The effects achieved by this embodiment are as follows: Compared with the prior art, through the provision of the preheating monitoring mechanism 8, during the preheating process of the heating tube 801 in the preheating box 701, the design of the memory alloy wire 804, the through rod 806, the sealing plate 808, the through hole 809 and the heat dissipation hole 812 is utilized. When the actual preheating temperature exceeds the preheating temperature of the circuit board, the memory alloy wire 804 changes from a contracted state to an extended state, and simultaneously pushes the sealing plate 808 backward, so that the through hole 809 and the heat dissipation hole 812 are connected, thereby facilitating the hot air inside the preheating box 701 to dissipate to the outside through the heat dissipation hole 812 and the through hole 809, thereby lowering the preheating temperature inside the preheating box 701 and reducing unnecessary heat accumulation in the preheating box 701, thereby reducing heat transfer to the circuit board, avoiding damage to the circuit board due to overheating, and thereby extending the service life of the circuit board and improving product quality.

[0053] The design of the first connecting shaft 815, the second connecting shaft 817, and the connecting plate 816 allows the sealing plate 808 to be pushed backward by the through rod 806, thereby simultaneously driving the heat conducting plate 704 to move downward between the center plate 703 and the fixed frame 702, thereby forming a gap between the heat conducting plate 704 and the bottom of the circuit board. This reduces the contact area between the heat conducting plate 704 and the circuit board, reduces heat transfer, and prevents damage to the circuit board caused by excessive temperatures. This further reduces the temperature in the preheating box 701, ensuring the safety of the preheating process.

[0054] In addition, by using the switches 813 set on both sides of the rear end of the preheating box 701, when the sealing plate 808 is pushed backward, the switch 813 can be touched synchronously to trigger the cylinder 821, pushing the blocking plate 819 to block the glue dispensing head 5, thereby automatically blocking the glue dispensing head 5 when the temperature is abnormal, avoiding glue dripping, reducing glue waste, reducing production costs, and keeping the working environment clean.

[0055] The complete usage steps and working principle of the above embodiment are as follows:

[0056] It should be noted in advance that if Figure 1 and Figure 2 As shown, the control frame 3 can move horizontally on the support frame 2, and the fixed frame 4 can move vertically on the control frame 3, and while the fixed frame 4 moves, it synchronously drives the dispensing head 5 to move vertically to dispense glue on the circuit board below, and the guide rail 6 is fixedly set on the base 1, and the preheating box 701 in the positioning anti-deviation mechanism 7 can slide on the guide rail 6. When processing the circuit board, the circuit board is first placed on the upper surface of the heat conducting plate 704, and then the position of the circuit board can be adjusted by moving the preheating box 701 on the guide rail 6, and in conjunction with the horizontal movement of the control frame 3 on the support frame 2 and the vertical movement of the fixed frame 4 on the control frame 3, the dispensing head 5 is aligned with the circuit board for dispensing processing. It should also be noted that the above dispensing process for the circuit board is all existing technology and will not be elaborated on here.

[0057] The following is the working process of the positioning and anti-deviating mechanism 7 to center the circuit board to prevent deviation:

[0058] After placing the circuit board on the upper surface of the heat conducting plate 704, Figure 1 、 Figure 2 as well as Figure 3As shown, the staff can rotate the knob 712 fixed at one end of the central shaft 713 counterclockwise to drive the central shaft 713 to rotate at the upper end of the L-shaped frame 705. Because the upper end of the preheating box 701 is fixed with a fixed frame 702, and the central shaft 713 and the fixed frame 702 are connected through the rotation, and the outer surfaces of both ends of the central shaft 713 are symmetrically fixed with linkage plates 706, when the central shaft 713 rotates, the two linkage plates 706 can be driven to rotate synchronously on both sides of the fixed frame 702 with the central shaft 713 as the axis. Two positioning plates 711 are symmetrically arranged above the fixed frame 702, and vertical rods 708 are symmetrically fixed on both sides of the positioning plates 711. , the vertical rod 708 is slidably arranged on the outer wall of the fixed frame 702 through the first sliding groove 710 and the slider 709, and a driven plate 707 is rotatably arranged between the vertical rod 708 and the linkage plate 706. Therefore, when the linkage plate 706 rotates, the driven plate 707 can drive the two vertical rods 708 in the same horizontal direction to slide toward each other on the fixed frame 702, thereby driving the positioning plate 711 between the two vertical rods 708 in the same longitudinal direction to move toward each other synchronously, pushing the circuit board placed on the upper surface of the heat conducting plate 704 to the center above the fixed frame 702, so as to achieve the definition of the position of the circuit board, and avoid the circuit board from being offset during the subsequent processing and affecting the processing accuracy of the circuit board;

[0059] Among them, since the upper end of the L-shaped frame plate 705 is connected to the pawl 716 through the torsion spring shaft 715, and the pawl 716 is matched with the ratchet 714, and the ratchet 714 is fixedly set on the outer surface of the central shaft 713, it can be referred to Figure 3 As shown, when the ratchet 714 rotates counterclockwise, the pawl 716 does not block the ratchet 714. However, when the ratchet 714 rotates clockwise, the pawl 716 cooperates with and restricts the ratchet 714, preventing the ratchet 714 from rotating. This effectively prevents the positioning plate 711 from loosening or separating from the circuit board, further consolidating the positioning plate 711's control of the circuit board's position.

[0060] When the printed circuit board dispensing operation is completed and the processed printed circuit board needs to be removed, the staff can first push the pawl 716 to move the pawl 716 away from the ratchet 714 to release the restriction of the pawl 716 on the ratchet 714, and then rotate the knob 712 clockwise to drive the two positioning plates 711 to move in the opposite direction, thereby releasing the position restriction of the printed circuit board;

[0061] In the above process, by setting the positioning anti-deviation mechanism 7, after the circuit board is placed on the upper surface of the heat conducting plate 704, before the circuit board is subjected to the glue dispensing operation, the circuit board placed on the upper surface of the heat conducting plate 704 can be pushed to the center above the fixed frame 702 by utilizing the design of the linkage plate 706, the driven plate 707, the vertical rod 708 and the positioning plate 711, so as to define the position of the circuit board, avoid the circuit board from being offset during the subsequent processing and affecting the processing accuracy of the circuit board, thereby ensuring that the glue dispensing head 5 can accurately align with the glue dispensing position on the circuit board during the subsequent glue dispensing operation, thereby improving the glue dispensing accuracy, avoiding the circuit board from being offset during the processing, maintaining the stability of the circuit board, and ensuring the uniformity and consistency of glue dispensing;

[0062] The coordinated design of the ratchet 714 and the pawl 716 can effectively prevent the positioning plate 711 from loosening or separating from the circuit board during the circuit board dispensing operation, further consolidating the positioning plate 711's positional control of the circuit board, thereby improving the stability of circuit board processing.

[0063] Please refer to the above working process Figures 1 to 7 .

[0064] The following is a working process in which the preheating monitoring mechanism 8 preheats the circuit board, monitors the preheating temperature in real time, and performs cooling when the temperature exceeds the limit to reduce heat transfer to the circuit board and simultaneously seal the dispensing head 5 to stop dispensing:

[0065] Before dispensing glue on the circuit board, Figure 5 and Figure 6 As shown, a heating tube 801 is provided in the preheating box 701. By turning on the heating tube 801, the temperature inside the preheating box 701 is increased, and the heat is transferred to the circuit board in conjunction with the heat conducting plate 704 provided above the heating tube 801, so as to achieve preheating of the circuit board. After the preheating temperature is reached, the dispensing operation on the circuit board begins. During the preheating process, the air inside the preheating box 701 will expand due to the heat, causing the internal pressure of the preheating box 701 to increase, and even damage the preheating box 701. The expanded air inside the preheating box 701 can be discharged through the exhaust holes 814 symmetrically provided on both sides of the rear end of the preheating box 701 to avoid affecting the subsequent processing of the circuit board.

[0066] During the preheating process, if Figure 5 and Figure 6As shown, the monitoring frames 802 are symmetrically fixed and connected on both sides of the preheating box 701, and a push plate 805 is set in the monitoring frame 802. A telescopic column 803 and a memory alloy wire 804 are fixed between the push plate 805 and the front inner wall of the monitoring frame 802. The memory alloy wire 804 is spring-shaped and is sleeved on the outside of the telescopic column 803. A through rod 806 is fixed on the side of the push plate 805 close to the monitoring frame 802, and the through rod 806 is slidably connected to the monitoring frame 802. When the preheating temperature exceeds the memory alloy wire, the memory alloy wire 804 is fixed. When the phase transition temperature of 804 is reached, the memory alloy wire 804 will deform from a contracted state to an extended state, and push the push plate 805 toward the rear side of the monitoring frame 802. At this time, the telescopic column 803 will stretch synchronously to match the deformation of the memory alloy wire 804, and the push plate 805 will drive the through rod 806 to slide synchronously backward on the rear side of the monitoring frame 802 while moving. Because the side of the through rod 806 away from the push plate 805 is connected to the fixed block 807 set on the front side of the sealing plate 808, When the sealing plate 806 moves backward, the sealing plate 808 can be pushed backward synchronously by the fixed block 807, and the second sliding grooves 811 are symmetrically provided on both sides of the preheating box 701. The sealing plate 808 is symmetrically fixed with a slide bar 810 that is slidably connected to the second sliding groove 811 on one side of the preheating box 701. Therefore, when the sealing plate 808 is pushed, the sliding bar 810 and the second sliding groove 811 are provided, so that the sealing plate 808 can slide in contact with the two sides of the preheating box 701. Both have heat dissipation holes 812, and the sealing plate 808 has a through hole 809. Initially, the sealing plate 808 covers and fits the outer wall of the preheating box 701. The through hole 809 and the heat dissipation hole 812 are offset from each other and are not connected. When the sealing plate 808 is pushed backward, the position of the through hole 809 moves accordingly and is connected to the heat dissipation hole 812. At this time, the hot air inside the preheating box 701 can be dissipated to the outside through the heat dissipation holes 812 and the through hole 809, thereby reducing the preheating temperature inside the preheating box 701.

[0067] It should be noted that the preheating temperature of the circuit board is generally recommended to be controlled between 40°C and 60°C. Within this temperature range, the memory alloy wire 804 remains in a spring-like contracted state, ensuring the stability and efficiency of the preheating process. When the temperature exceeds 60°C, the memory alloy wire 804 deforms and becomes stretched, triggering a heat dissipation mechanism to reduce the temperature. Specifically, the memory alloy wire 804 is a two-way memory alloy, which is a type of alloy material with a special shape memory effect that can achieve two different shapes at different temperatures. The most common two-way memory effect alloy is nickel-titanium alloy, whose phase transition temperature can be adjusted according to the needs of specific applications. It should be noted that the shape memory process of the two-way memory alloy is reversible and can switch between high and low temperatures multiple times while maintaining the same memory effect. In this embodiment, the low-temperature phase of the memory alloy wire 804 is contracted, and the high-temperature phase automatically extends.

[0068] During the above process, by setting the preheating monitoring mechanism 8, during the preheating of the heating tube 801 in the preheating box 701, the design of the memory alloy wire 804, the through rod 806, the sealing plate 808, the through hole 809 and the heat dissipation hole 812 is utilized. When the actual preheating temperature exceeds the preheating temperature of the circuit board, the memory alloy wire 804 changes from a contracted state to an extended state, and simultaneously pushes the sealing plate 808 backward, so that the through hole 809 and the heat dissipation hole 812 are connected, thereby facilitating the hot air inside the preheating box 701 to dissipate to the outside through the heat dissipation hole 812 and the through hole 809, thereby lowering the preheating temperature inside the preheating box 701 and reducing unnecessary heat accumulation in the preheating box 701, thereby reducing heat transfer to the circuit board, avoiding damage to the circuit board due to overheating, and thus extending the service life of the circuit board and improving product quality.

[0069] like Figure 2 、 Figure 4As shown, since the upper end of the sealing plate 808 is fixedly provided with a first connecting shaft 815 at equal distances, the opposite side of the heat conducting plate 704 is fixedly provided with a second connecting shaft 817 at equal distances, the fixed frame 702 is provided with a through slot 818 at equal distances, and the second connecting shaft 817 is slidably connected with the fixed frame 702 through the through slot 818, and a connecting plate 816 is rotatably provided between the first connecting shaft 815 and the second connecting shaft 817. When the sealing plate 808 is pushed backward by the through rod 806, the position of the first connecting shaft 815 changes synchronously and is fixed on the connecting plate Under the connection action of 816, the second connecting shaft 817 can be driven to slide downward in the through slot 818 synchronously, so that the heat conducting plate 704 can be moved downward between the center plate 703 and the fixed frame 702. Since the circuit board is placed on the heat conducting plate 704 and clamped by the two positioning plates 711, when the heat conducting plate 704 moves downward, a gap can be formed between it and the bottom of the circuit board to prevent damage to the circuit board caused by excessive temperature. At the same time, increasing the gap and reducing the contact area with the circuit board can also further reduce the preheating temperature.

[0070] During the above process, the design of the first connecting shaft 815, the second connecting shaft 817, and the connecting plate 816 enables the sealing plate 808 to be pushed backward by the through rod 806, thereby simultaneously driving the heat conducting plate 704 to move downward between the center plate 703 and the fixed frame 702, thereby forming a gap between the heat conducting plate 704 and the bottom of the circuit board, thereby reducing the contact area between the heat conducting plate 704 and the circuit board, reducing heat transfer, thereby preventing damage to the circuit board caused by excessive temperature, and further reducing the temperature in the preheating box 701, thereby ensuring the safety of the preheating process;

[0071] like Figure 5 and Figure 7 As shown, since switches 813 are symmetrically provided on both sides of the rear end of the preheating box 701, a cylinder 821 electrically connected to the switch 813 is fixedly provided at the lower end of the rear side of the fixing frame 4. When the sealing plate 808 is pushed backward by the penetrating rod 806, it will also touch the switch 813, stopping the dispensing operation, and thereby opening the cylinder 821, driving the blocking plate 819 connected to its output end to slide between the two side plates 820 in the direction away from the cylinder 821, and finally move to the lower surface of the dispensing head 5 to block the dispensing head 5, thereby reducing the glue dripping from the dispensing head 5.

[0072] During the above process, the switches 813 provided on both sides of the rear end of the preheating box 701 can be used to synchronously touch the switches 813 when the sealing plate 808 is pushed backward to trigger the cylinder 821, thereby pushing the blocking plate 819 to block the glue dispensing head 5, thereby automatically blocking the glue dispensing head 5 when the temperature is abnormal, thereby preventing glue from dripping, reducing glue waste, lowering production costs, and keeping the working environment clean.

[0073] Please refer to the above working process Figures 1 to 7 .

[0074] The circuits and controls involved in the present invention are all prior art and will not be described in detail here.

[0075] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A dispensing device for producing and processing integrated circuit boards, comprising a base (1), a support frame (2) fixedly connected to the top of the rear side of the base (1), a control frame (3) slidably connected to the upper end of the support frame (2), a fixing frame (4) slidably connected to the lower end of the control frame (3), a dispensing head (5) fixedly connected to the front side of the fixing frame (4), and a guide rail (6) fixedly connected to the top of the base (1), characterized in that: It also includes: a positioning and anti-deflection mechanism (7) and a preheating monitoring mechanism (8); The positioning and anti-deflection mechanism (7) comprises a preheating box (701), a fixed frame (702), a heat conducting plate (704) and a positioning plate (711); the preheating box (701) is slidably connected to the guide rail (6); the fixed frame (702) is fixedly connected to the top of the preheating box (701); the heat conducting plate (704) is symmetrically slidably connected to the upper end of the fixed frame (702); and the positioning plate (711) is symmetrically arranged above the fixed frame (702); The preheating monitoring mechanism (8) comprises a memory alloy wire (804), a sealing plate (808), a through hole (809) and a heat dissipation hole (812), wherein the memory alloy wire (804) and the sealing plate (808) are symmetrically arranged on both sides of the preheating box (701), the through hole (809) is opened on the sealing plate (808), and the heat dissipation hole (812) is symmetrically opened on both sides of the preheating box (701).

2. A dispensing device for integrated circuit board production and processing according to claim 1, characterized in that: The positioning anti-deflection mechanism (7) further comprises a central shaft (713) which passes through and is rotatably connected to the middle of the fixed frame (702); the outer surfaces of both ends of the central shaft (713) are symmetrically fixedly connected to linkage plates (706); vertical rods (708) are symmetrically fixedly connected to both sides of the positioning plate (711); and a driven plate (707) is rotatably connected between the vertical rods (708) and the linkage plate (706).

3. The dispensing device for integrated circuit board production and processing according to claim 2, characterized in that: The fixed frame (702) is symmetrically provided with first sliding grooves (710) on both sides, a slider (709) is slidably connected in the first sliding groove (710), and the slider (709) is fixedly connected to the vertical rod (708), a center plate (703) is fixedly connected to the upper end of the middle part of the fixed frame (702), the heat conducting plate (704) is slidably connected between the center plate (703) and the fixed frame (702), and the center axis (713) is arranged below the center plate (703).

4. The dispensing device for integrated circuit board production and processing according to claim 2, characterized in that: The lower end of the front side of the preheating box (701) is fixedly connected to an L-shaped frame plate (705), the central shaft (713) is rotatably connected to the upper end of the L-shaped frame plate (705), the front side of the central shaft (713) is fixedly connected to a knob (712), the outer surface of one end of the central shaft (713) close to the knob (712) is fixedly connected to a ratchet (714), the upper end of the front side of the L-shaped frame plate (705) is rotatably connected to a torsion spring shaft (715), the outer surface of the torsion spring shaft (715) is fixedly connected to a pawl (716), and the pawl (716) cooperates with the ratchet (714).

5. The dispensing device for integrated circuit board production and processing according to claim 1, characterized in that: The preheating monitoring mechanism (8) further comprises a monitoring frame (802) symmetrically fixedly connected to both sides of the front end of the preheating box (701); a heating tube (801) is fixedly connected inside the preheating box (701); a telescopic column (803) is fixedly connected to the front inner wall of the monitoring frame (802); a push plate (805) is fixedly connected to the rear side of the telescopic column (803); the memory alloy wire (804) is fixedly connected between the front inner wall of the monitoring frame (802) and the push plate (805), and the memory alloy wire (804) is sleeved on the outside of the telescopic column (803).

6. The dispensing device for integrated circuit board production and processing according to claim 5, characterized in that: The rear side of the monitoring frame (802) is slidably connected to a through rod (806), the through rod (806) is fixedly connected to a fixed block (807) on the side away from the push plate (805), the fixed block (807) is fixedly connected to the sealing plate (808) on the side away from the through rod (806), and the preheating box (701) is symmetrically provided with a second sliding groove (811), the sealing plate (808) is symmetrically fixedly connected to a sliding bar (810) on the side facing the preheating box (701), and the sliding bar (810) is slidably connected to the second sliding groove (811).

7. The dispensing device for integrated circuit board production and processing according to claim 1, characterized in that: Exhaust holes (814) are symmetrically provided on both sides of the rear end of the preheating box (701), the sealing plate (808) is in contact with the outer wall of the preheating box (701), and the through hole (809) is not initially connected to the heat dissipation hole (812).

8. The dispensing device for integrated circuit board production and processing according to claim 1, characterized in that: The upper end of the sealing plate (808) is fixedly connected to a first connecting shaft (815) at equal intervals, and the opposite side of the heat conducting plate (704) is fixedly connected to a second connecting shaft (817). Through grooves (818) are symmetrically and equidistantly provided on both sides of the fixed frame (702). Support plates are symmetrically and fixedly connected to the lower ends of the inner walls on both sides of the fixed frame (702). Springs are fixedly connected to the support plates and the heat conducting plate (704) at equal intervals. The second connecting shaft (817) is slidably connected to the through groove (818), and a connecting plate (816) is rotatably connected between the second connecting shaft (817) and the first connecting shaft (815).

9. The dispensing device for integrated circuit board production and processing according to claim 8, characterized in that: Switches (813) are symmetrically provided on both sides of the rear end of the preheating box (701), and a cylinder (821) is fixedly connected to the lower end of the rear side of the fixing frame (4), and the cylinder (821) is electrically connected to the switch (813).

10. The dispensing device for integrated circuit board production and processing according to claim 9, characterized in that: The front lower end of the fixing frame (4) is symmetrically fixedly connected to a side plate (820), a blocking plate (819) is slidably connected between the side plates (820), and the blocking plate (819) is fixedly connected to the output end of the cylinder (821).

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