Heat dissipation device and electronic equipment

Abstract

The invention discloses a heat dissipation device and electronic equipment, and relates to the technical field of heat dissipation. The heat dissipation device comprises a liquid cooling plate, the liquid cooling plate is internally provided with a heat dissipation flow channel, the heat dissipation flow channel comprises a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are two different openings in the same surface of the liquid cooling plate, and the heat dissipation flow channel is internally provided with cooling liquid; the liquid inlet and the liquid outlet are respectively connected with the driving pump, the driving pump comprises a liquid storage cavity, and the liquid storage cavity and the heat dissipation flow channel form an annular flow channel; under the condition that the driving pump is in a first state, the driving pump sucks the cooling liquid from the heat dissipation flow channel to the liquid storage cavity through the liquid outlet; and under the condition that the driving pump is in the second state, the driving pump discharges the cooling liquid in the liquid storage cavity into the heat dissipation flow channel through the liquid inlet.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and an electronic device. Background Art

[0002] As a common heat dissipation component, the heat dissipation module is widely used in various heat dissipation scenarios. With the continuous development of technologies such as the fifth generation mobile communication technology (5G) and artificial intelligence, the performance of various products has been continuously improved, and accordingly, the requirements for the heat dissipation capacity of the heat dissipation module have become increasingly higher. In the current mainstream technology, heat dissipation is mainly achieved by using structures such as heat pipes, heat spreaders or graphite sheets as heat dissipation modules. Since the development of heat dissipation technology has been in a bottleneck period for a long time and it is difficult to make major breakthroughs, it has resulted in the heat dissipation capacity of the heat dissipation module being difficult to significantly improve, which in turn leads to the heat dissipation module being difficult to meet the heat dissipation needs of the product in some scenarios. It can be seen that in the related technology, there is a problem of poor heat dissipation capacity of the heat dissipation module. Summary of the Invention

[0003] The embodiments of the present application provide a heat dissipation device and an electronic device, which can solve the problem of poor heat dissipation capability of the heat dissipation module in the related art.

[0004] In a first aspect, a heat dissipation device is provided, comprising:

[0005] A liquid cooling plate, wherein a heat dissipation channel is provided in the liquid cooling plate, and the heat dissipation channel includes a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are two different openings on the same surface of the liquid cooling plate, and coolant is provided in the heat dissipation channel;

[0006] A driving pump, wherein the liquid inlet and the liquid outlet are respectively connected to the driving pump, and the driving pump includes a liquid storage cavity, and the liquid storage cavity and the heat dissipation flow channel form an annular flow channel;

[0007] When the driving pump is in the first state, the driving pump draws the coolant from the heat dissipation channel into the liquid storage chamber through the liquid outlet;

[0008] When the driving pump is in the second state, the driving pump discharges the coolant in the liquid storage chamber into the heat dissipation channel through the liquid inlet.

[0009] In a second aspect, an electronic device is provided, comprising the heat dissipation device described in the first aspect.

[0010] In the embodiment of the present application, during the heat dissipation process of the heat dissipation device, since the driving pump can draw the coolant from the heat dissipation channel to the liquid storage chamber through the liquid outlet, and discharge the coolant in the liquid storage chamber into the heat dissipation channel through the liquid inlet, the driving pump can control the liquid storage chamber to alternately absorb and discharge liquid, so that the coolant can circulate in the annular flow channel, which is beneficial to improving the heat dissipation efficiency of the heat dissipation device, and further beneficial to improving the heat dissipation capacity of the heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 Schematic diagram of the structure of the heat dissipation device provided in an embodiment of the present application;

[0012] Figure 2 yes Figure 1 Schematic cross-sectional view of the DD section in FIG;

[0013] Figure 3 This is the second cross-sectional schematic diagram of the heat dissipation device provided in an embodiment of the present application;

[0014] Figure 4 This is the third cross-sectional schematic diagram of the heat dissipation device provided in an embodiment of the present application;

[0015] Figure 5 This is a structural exploded diagram of the heat dissipation device provided in an embodiment of the present application;

[0016] Figure 6 Schematic diagram of the energizing principle of the driving coil in the embodiment of the present application;

[0017] Figure 7 Schematic diagram of the structure of the liquid cooling plate in the embodiment of the present application;

[0018] Figure 8 is a structural exploded view of the valve plate assembly in an embodiment of the present application;

[0019] Figure 9 Schematic diagram of the structure of the valve plate assembly in the embodiment of the present application;

[0020] Figure 10 is a cross-sectional schematic diagram of the valve plate assembly in an embodiment of the present application;

[0021] Figure 11 is a schematic diagram of the internal structure of an electronic device in an embodiment of the present application;

[0022] Figure 12 yes Figure 11 Structural breakdown diagram. DETAILED DESCRIPTION

[0023] The following will be combined with the accompanying drawings in the embodiments of this application to clearly describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0024] The terms "first," "second," and the like in this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable, where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein. Furthermore, the objects distinguished by "first" and "second" generally refer to a class and do not limit the number of objects. For example, the first object can be one or more. Furthermore, "or" in this application represents at least one of the connected objects. For example, the scope of protection for "A or B" covers at least three options: Option 1: includes A but not B; Option 2: includes B but not A; and Option 3: includes both A and B. Furthermore, the terms "A and / or B," "at least one of A and B," and "at least one of A or B" also cover at least the above three options, respectively. The character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0025] The heat dissipation device and electronic device provided in the embodiments of the present application are described in detail below through some embodiments and their application scenarios in combination with the accompanying drawings.

[0026] See Figures 1 to 10 , an embodiment of the present application provides a heat dissipation device, comprising:

[0027] A liquid cooling plate 100 is provided with a heat dissipation channel 110 therein, wherein the heat dissipation channel 110 includes a liquid inlet 111 and a liquid outlet 112. The liquid inlet 111 and the liquid outlet 112 are two different openings on the same surface of the liquid cooling plate 100. Cooling liquid is provided in the heat dissipation channel 110.

[0028] The driving pump 200, the liquid inlet 111 and the liquid outlet 112 are respectively connected to the driving pump 200, the driving pump 200 includes a liquid storage chamber 210, and the liquid storage chamber 210 and the heat dissipation channel 110 form an annular channel;

[0029] When the driving pump 200 is in the first state, the driving pump 200 draws the coolant from the heat dissipation channel 110 into the liquid storage chamber 210 through the liquid outlet 112 ;

[0030] When the driving pump 200 is in the second state, the driving pump 200 discharges the coolant in the liquid storage chamber 210 into the heat dissipation channel 110 through the liquid inlet 111 .

[0031] The heat dissipation device described above can be applied to various heat dissipation scenarios. For example, the heat dissipation device can be used as a heat dissipation module within various electronic devices, such as mobile phones and tablets. For ease of understanding, the structure and operating principle of the heat dissipation device will be further described below using the heat dissipation device in an electronic device as an example.

[0032] The coolant may be a coolant for various heat dissipation scenarios, for example, water, fluorinated liquid, ethanol solution or other liquids.

[0033] The above-mentioned liquid cooling plate 100 can be an ultra-thin liquid cooling plate 100 composed of three layers of plastic films, namely, an "upper sealing layer", a "middle flow channel layer" and a "lower sealing layer", which are hot-pressed. The use of plastic film can minimize the thickness of the liquid cooling plate 100, so as to reduce the installation space required for the liquid cooling plate 100. Among them, the "middle flow channel layer" can be a flow channel layer formed by carving out a hollow flow channel on the plastic film using micro-cutting and etching processes. The roughness of the flow channel layer Ra ≤ 0.4μm ensures the efficiency and stability of the flow of the coolant. It can be understood that the hollow flow channel in the middle flow channel layer is the above-mentioned heat dissipation flow channel 110, and the above-mentioned liquid inlet 111 and liquid outlet 112 can be opened in the upper sealing layer or in the lower sealing layer.

[0034] The driving pump 200 may be any micro pump capable of achieving liquid suction and discharge functions.

[0035] The shape of the heat dissipation channel 110 can be set as needed. Specifically, the heat dissipation channel 110 can be set as a curved channel, so that the heat dissipation channel 110 can be turned back after extending to a specific position and return to the vicinity of the starting point, so that the liquid inlet 111 and the liquid outlet 112 can be set adjacent to each other, so as to facilitate the driving pump 200 to be connected to the liquid inlet 111 and the liquid outlet 112 at the same time, which is conducive to reducing the size space required to be occupied by the driving pump 200.

[0036] The driving pump 200 may be installed on the end surface of the liquid cooling plate 100 where the liquid inlet 111 and the liquid outlet 112 are provided, and the driving pump 200 may be fixedly connected to the liquid cooling plate 100 .

[0037] The liquid storage chamber 210 is sealedly connected to the liquid inlet 111 and the liquid outlet 112 respectively, and the annular flow channel formed by the combination of the two is a sealed flow channel.

[0038] It is understandable that, in the specific implementation process, a part of the heat dissipation device can be located in the heating area inside the electronic device, and another part of the area can be located in the heat dissipation area of the electronic device. In this way, the coolant can be controlled to circulate in the annular flow channel by driving the pump 200. When the coolant flows to the heating area, it can absorb the heat of the heating area, so that the coolant is heated. When the heated coolant flows to the heat dissipation area, it can dissipate heat to reduce the temperature of the coolant. In this way, the liquid cooling in the heating area can be continuously transported to the heat dissipation area to achieve heat dissipation of the electronic device. In this process, since the coolant can flow, active heat dissipation can be achieved. Compared with the passive heat dissipation solutions such as heat pipes, heat spreaders or graphite sheets used in related technologies, the use of active heat dissipation can improve the heat dissipation efficiency.

[0039] In some embodiments of the present application, since when the drive pump 200 is in the first state, the drive pump 200 draws the coolant from the heat dissipation channel 110 to the liquid storage chamber 210 through the liquid outlet 112; when the drive pump 200 is in the second state, the drive pump 200 discharges the coolant in the liquid storage chamber 210 into the heat dissipation channel 110 through the liquid inlet 111, therefore, the drive pump 200 can be controlled to work alternately between the first state and the second state, so that the drive pump 200 can draw the coolant from the heat dissipation channel 110 through the liquid outlet 112, and discharge the drawn coolant into the heat dissipation channel 110 through the liquid inlet 111, and the liquid storage chamber 210 and the heat dissipation channel 110 form an annular flow channel, therefore, the coolant can circulate in the annular flow channel to improve the efficiency of heat transfer, thereby improving the heat dissipation efficiency.

[0040] In this embodiment, during the heat dissipation process of the heat dissipation device, since the driving pump 200 can draw the coolant from the heat dissipation channel 110 to the liquid storage chamber 210 through the liquid outlet 112, and discharge the coolant in the liquid storage chamber 210 into the heat dissipation channel 110 through the liquid inlet 111, the driving pump 200 can control the liquid storage chamber 210 to alternately absorb and discharge liquid, so that the coolant can circulate in the annular flow channel, which is beneficial to improving the heat dissipation efficiency of the heat dissipation device, and further beneficial to improving the heat dissipation capacity of the heat dissipation device.

[0041] Optionally, the driving pump 200 includes an elastic shell 220 and a driving assembly 230, wherein the driving assembly 230 is fixedly connected to the elastic shell 220 to drive the elastic shell 220 to deform, and the liquid storage chamber 210 includes an internal cavity of the elastic shell 220;

[0042] When the driving pump 200 is in the first state, the driving assembly 230 drives the elastic shell 220 to deform in a first direction, so that the volume of the internal cavity of the elastic shell 220 increases;

[0043] When the driving pump 200 is in the second state, the driving assembly 230 drives the elastic shell 220 to deform in a second direction, so that the volume of the internal cavity of the elastic shell 220 is reduced.

[0044] The elastic housing 220 may be a shell-like structure made of various elastic materials, for example, a shell-like structure made of a deformable rubber material. The liquid storage chamber 210 may be a cavity formed by the elastic housing 220 alone, or a cavity formed by the elastic housing 220 and other components of the driving pump 200.

[0045] It is understandable that the elastic shell 220 may include a fixed portion and a deformable portion. The elastic shell 220 may be fixedly connected to other structures in the drive pump 200 via the fixed portion. At the same time, the elastic shell 220 may be fixedly connected to the driving end of the drive assembly 230 via the deformable portion. In this way, during the movement of the driving end of the drive assembly 230, a pulling force or a pushing force will be generated on the deformable portion. Since the position of the fixed portion of the elastic shell 220 remains unchanged, the elastic shell 220 will be deformed under the action of the force of the driving end. When the shape of the elastic shell 220 changes, the volume of its internal space will also change accordingly, so that the volume of the internal cavity of the elastic shell 220 increases or decreases. For example, see Figure 2 and Figure 4 In some embodiments of the present application, when the driving component 230 drives the elastic shell 220 to Figure 2 The position shown is deformed toward the first end surface 120. Figure 4 In the position shown, the volume of the internal cavity of the elastic shell 220 is reduced, and accordingly, the volume of the liquid storage cavity 210 is also reduced. At this time, the coolant inside the liquid storage cavity 210 can flow into and out of the heat dissipation channel 110 through the liquid inlet 111.

[0046] Accordingly, see Figure 2 and Figure 3 In some embodiments of the present application, when the driving component 230 drives the elastic shell 220 to Figure 2 The position shown is deformed to the side facing away from the first end face 120. Figure 3When in the position shown, the volume of the internal cavity of the elastic shell 220 increases, and accordingly, the volume of the liquid storage chamber 210 also increases. At this time, negative pressure can be generated inside the liquid storage chamber 210, so that the coolant can be drawn from the heat dissipation channel 110 to the liquid storage chamber 210 through the liquid inlet 111.

[0047] The first direction may be any direction that can increase the volume of the liquid storage chamber 210. For example, the first direction may be a direction that pulls the elastic shell 220 outward. Correspondingly, the second direction may be any direction that can decrease the volume of the liquid storage chamber 210. For example, the second direction may be a direction that presses the elastic shell 220 inward.

[0048] In some embodiments of the present application, the first direction and the second direction can be two opposite directions. Accordingly, the above-mentioned driving component 230 can be various driving components 230 that can output reciprocating motion, for example, it can be an electromagnetic driving component 230, or a piezoelectric driving component 230 and other micro-driving structures for various scenarios. In this way, the reciprocating motion can be output by the driving component 230, which can drive the elastic shell 220 to deform in the first direction and the second direction respectively.

[0049] In this embodiment, the elastic shell 220 is deformed by the driving assembly 230 to increase or decrease the volume of the liquid storage chamber 210 , thereby realizing the liquid suction and discharge functions of the driving pump 200 .

[0050] Optionally, the driving pump 200 further includes a mounting bracket 260, the driving assembly 230 includes a magnetic member 231, a driving coil 232, and a circuit board 233, the elastic housing 220 is located inside the mounting bracket 260, and the mounting bracket 260 is fixedly connected to the liquid cooling plate 100, and the circuit board 233 is electrically connected to the driving coil 232;

[0051] One of the magnetic member 231 and the driving coil 232 is fixedly connected to the elastic housing 220 , and the other is fixedly connected to the mounting bracket 260 , and the magnetic member 231 is opposite to the driving coil 232 .

[0052] The mounting bracket 260 can be any type of support structure, for example, Figure 2In some embodiments of the present application, the mounting bracket 260 may be a cover, and the mounting bracket 260 covers the first end surface 120 of the liquid cooling plate 100, wherein the mounting bracket 260 may form a shell of the driving pump 200 to protect the internal components of the driving pump 200. The mounting bracket 260 may have a mounting hole at one end away from the first end surface 120, and the driving coil 232 may be embedded in the mounting hole. The circuit board 233 is attached to the end surface of the mounting bracket 260 facing away from the liquid cooling plate 100. In this way, the circuit board 233 can be electrically connected to the driving coil 232, and the circuit board 233 can be electrically connected to other control circuits in the electronic device.

[0053] The magnetic member 231 may be any type of magnetic member 231, for example, a permanent magnet or an electromagnet, etc. The circuit board 233 may be a flexible printed circuit (FPC).

[0054] It should be noted that, in some other embodiments of the present application, the magnetic component 231 may be fixedly connected to the mounting bracket 260 , and the driving coil 232 may be fixedly connected to the elastic housing 220 .

[0055] In this embodiment, the electromagnetic drive component 230 can drive the elastic shell 220 to reciprocate along the first direction and the second direction by changing the power supply direction of the drive coil 232 to achieve the liquid absorption and discharge functions of the liquid storage chamber 210.

[0056] Optionally, the liquid inlet 111 and the liquid outlet 112 are respectively opened on the first end surface 120 of the liquid cooling plate 100 , and the mounting bracket 260 is fixedly connected to the first end surface 120 ;

[0057] The magnetic member 231 is fixedly connected to the end of the elastic shell 220 facing away from the first end surface 120 . The driving coil 232 is located on the side of the magnetic member 231 away from the first end surface 120 . The driving coil 232 is fixedly connected to the mounting bracket 260 .

[0058] See Figure 2 In some embodiments of the present application, the end of the elastic shell 220 facing the liquid cooling plate 100 can be an open end, and the open end of the liquid cooling plate 100 can be fixedly connected to other components in the driving pump 200, that is, during the process of elastic deformation of the elastic shell 220, the position of the open end of the elastic shell 220 remains unchanged.

[0059] In this embodiment, since the magnetic member 231 is disposed at the end of the elastic housing 220 facing away from the first end face 120, when the magnetic member 231 moves toward the first end face 120, the volume of the internal cavity of the elastic housing 220 decreases, thereby pushing the coolant in the liquid storage chamber 210 to flow toward the first end face 120. The liquid inlet 111 is located on the first end face 120, thus facilitating the coolant to quickly enter the heat dissipation channel 110 through the liquid inlet 111. Accordingly, when the magnetic member 231 moves away from the first end face 120, the volume of the internal cavity of the elastic housing 220 increases, generating a negative pressure within the liquid storage chamber 210, thereby allowing the coolant to be drawn from the heat dissipation channel 110 through the liquid outlet 112, thereby achieving the liquid suction and discharge functions of the drive pump 200.

[0060] Optionally, the driving pump 200 further includes a valve plate assembly 240, the valve plate assembly 240 being located between the elastic housing 220 and the first end surface 120 of the liquid cooling plate 100, the elastic housing 220 including an open end facing the valve plate assembly 240, the valve plate assembly 240 being fixedly connected to the open end, and the elastic housing 220 and the valve plate assembly 240 enclose the liquid storage chamber 210;

[0061] The valve plate assembly 240 includes a liquid inlet channel 252 and a liquid outlet channel 251 , the liquid storage chamber 210 is connected to the liquid outlet 112 via the liquid inlet channel 252 , and the liquid storage chamber 210 is connected to the liquid inlet 111 via the liquid outlet channel 251 ;

[0062] The valve plate assembly 240 further includes: a first valve plate 2411 for opening and closing the liquid inlet channel 252 , and a second valve plate 2421 for opening and closing the liquid outlet channel 251 .

[0063] The first valve plate 2411 and the second valve plate 2421 can each form a one-way valve with the corresponding channel group 250. The first valve plate 2411 can unidirectionally guide the heat dissipation channel 110 to the liquid storage chamber 210, thereby facilitating the pump 200 to draw liquid through the liquid outlet 112. The second valve plate 2421 can unidirectionally guide the liquid storage chamber 210 to the heat dissipation channel 110, thereby facilitating the pump 200 to discharge liquid through the liquid inlet 111.

[0064] It is understandable that when the driving pump 200 is in the first state, the first valve plate 2411 can open the liquid inlet channel 252, and at the same time, the second valve plate 2421 can close the liquid outlet channel 251. In this way, it can be ensured that the coolant is prevented from flowing out of the liquid outlet channel 251 during the process of drawing coolant through the liquid outlet 112. Correspondingly, when the driving pump 200 is in the second state, the first valve plate 2411 can close the liquid inlet channel 252, and at the same time, the second valve plate 2421 can open the liquid outlet channel 251. In this way, it can be ensured that the coolant is prevented from being discharged from the liquid inlet channel 252 into the heat dissipation channel 110 during the process of discharging coolant through the liquid inlet 111. The coolant can only enter the liquid storage chamber 210 from the liquid outlet 112, and the coolant in the liquid storage chamber 210 can only be discharged into the heat dissipation channel 110 through the liquid inlet 111, thereby facilitating the circulation of the coolant in the annular channel.

[0065] In this embodiment, by making the driving pump 200 also include a valve plate assembly 240, the conduction state between the liquid storage chamber 210 and the liquid inlet 111 and the liquid outlet 112 can be controlled based on the valve plate assembly 240, so that in the process of sucking coolant through the liquid outlet 112, the coolant is prevented from flowing out of the liquid outlet channel 251, and in the process of discharging coolant through the liquid inlet 111, the coolant is prevented from being discharged into the heat dissipation channel 110 from the liquid inlet channel 252, so that the coolant can only enter the liquid storage chamber 210 from the liquid outlet 112, and the coolant in the liquid storage chamber 210 can only be discharged into the heat dissipation channel 110 through the liquid inlet 111, which is conducive to the circulation of the coolant in the annular channel.

[0066] Optionally, the valve plate assembly 240 includes a first plate body 241 and a second plate body 242. The first plate body 241 defines a first through hole 2413 and a first valve hole 2412. The second plate body 242 defines a second through hole 2422 and a second valve hole 2423. The first plate body 241 and the second plate body 242 are stacked, and the second plate body 242 is located between the first plate body 241 and the first end surface 120. The first through hole 2413 and the second valve hole 2423 are oppositely arranged, and the first through hole 2413 and the second valve hole 2423 are combined to form the liquid outlet channel 251. The first valve hole 2412 and the second through hole 2422 are oppositely arranged, and the first valve hole 2412 and the second through hole 2422 are combined to form the liquid inlet channel 252.

[0067] The first valve disc 2411 is located on an end surface of the first plate 241 facing away from the second plate 242, and the first valve disc 2411 closes the first valve hole 2412. The first valve disc 2411 includes a first connecting portion, through which the first valve disc 2411 is fixedly connected to the first plate 241. The first valve disc 2411 can be deformed around the first connecting portion toward the side of the elastic housing 220 to open the liquid inlet channel 252.

[0068] The second valve disc 2421 is located on the end face of the second plate body 242 facing away from the first plate body 241, and the second valve disc 2421 closes the second valve hole 2423. The second valve disc 2421 includes a second connecting portion, and the second valve disc 2421 is fixedly connected to the second plate body 242 through the second connecting portion. The second valve disc 2421 can be deformed around the second connecting portion toward the side of the first end face 120 to open the liquid outlet channel 251.

[0069] The first plate 241 may cover the first end surface 120 , the second through hole 2422 may be opposite to the liquid outlet 112 , and the second valve hole 2423 may be opposite to the liquid inlet 111 .

[0070] It is understood that when the first valve disc 2411 closes the first valve hole 2412, due to the blocking effect of the first plate 241, the first valve disc 2411 cannot deform toward the first end surface 120 and can only deform along the side facing away from the first end surface 120. Therefore, when the drive pump 200 is in the second state, the liquid in the liquid storage chamber 210 cannot push the first valve disc 2411 to deform toward the first end surface 120, so that the first valve disc 2411 always remains in the state of closing the first valve hole 2412, thereby preventing the coolant in the liquid storage chamber 210 from entering the heat dissipation channel 110 through the liquid inlet channel 252 and the liquid outlet 112 during the liquid discharge process. In other words, the coolant in the liquid storage chamber 210 can only be discharged into the heat dissipation channel 110 through the liquid outlet channel 251.

[0071] Accordingly, when the second valve disc 2421 closes the second valve hole 2423, due to the blocking effect of the second plate 242, the second valve disc 2421 cannot deform toward the first plate 241 and can only deform along the side facing away from the first plate 241. Therefore, when the drive pump 200 is in the first state, the negative pressure in the liquid storage chamber 210 cannot cause the second valve disc 2421 to deform toward the first plate 241, so that the second valve disc 2421 always remains in the state of closing the second valve hole 2423, thereby preventing the coolant in the heat dissipation channel 110 from entering the liquid storage chamber 210 through the liquid inlet 111 and the liquid outlet channel 251 in sequence during the liquid suction process. In other words, the coolant in the heat dissipation channel 110 can only enter the liquid storage chamber 210 through the liquid inlet channel 252.

[0072] In some embodiments of the present application, the above-mentioned drive pump 200 may further include a third state, wherein when the drive pump 200 is in the third state, the drive assembly 230 is in a non-working state. At this time, the first valve plate 2411 closes the first valve hole 2412, and the second valve plate 2421 closes the second valve hole 2423.

[0073] See Figure 6 When the drive pump 200 is in the third state, the drive coil 232 is not energized, the drive pump 200 does not work, the first valve plate 2411 closes the first valve hole 2412, and the second valve plate 2421 closes the second valve hole 2423. When the drive pump 200 is in the first state, a positive current passes through the drive coil 232, the drive coil 232 attracts the magnetic part 231, the volume of the liquid storage chamber 210 increases, the first valve plate 2411 opens the first valve hole 2412, and the liquid storage chamber 210 absorbs liquid from the heat dissipation channel 110. When the drive pump 200 is in the second state, a negative current passes through the drive coil 232, the drive coil 232 repels the magnetic part 231, the volume of the liquid storage chamber 210 decreases, the second valve plate 2421 opens the second valve hole 2423, and the coolant in the liquid storage chamber 210 is discharged. During the operation of the drive pump 200, it can be operated according to Figure 6 The waveform curve in the figure alternately passes positive current and negative current into the driving coil 232, so that the liquid storage chamber 210 of the driving pump 200 alternately absorbs and discharges liquid, thereby realizing the circulation of the coolant in the annular flow channel, which is beneficial to improving the heat dissipation efficiency of the heat dissipation device, and further beneficial to improving the heat dissipation capacity of the heat dissipation device.

[0074] In this embodiment, the valve plate assembly 240 includes a first plate body 241 and a second plate body 242, the first plate body 241 is provided with a first through hole 2413 and a first valve hole 2412, the second plate body 242 is provided with a second through hole 2422 and a second valve hole 2423, the first valve disc 2411 is located on the end surface of the first plate body 241 opposite to the second plate body 242, and the first valve disc 2411 closes the first valve hole 2412, the first valve disc 2411 includes a first connecting portion, the first valve disc 2411 is fixedly connected to the first plate body 241 through the first connecting portion, the second valve disc 2421 is located on the end surface of the second plate body 242 opposite to the first plate body 241, and the second valve disc 2421 closes the second valve hole 2423, the second valve disc 2421 includes a second connecting portion, the second valve disc 2421 is fixedly connected to the first plate body 241 through the first connecting portion The second connecting portion is fixedly connected to the second plate body 242. In this way, when the driving pump 200 is in the first state, the negative pressure in the liquid storage chamber 210 cannot cause the second valve plate 2421 to deform toward the side of the first plate body 241, so that the second valve plate 2421 always remains in a state of closing the second valve hole 2423, thereby preventing the coolant in the heat dissipation channel 110 from entering the liquid storage chamber 210 through the liquid inlet 111 and the liquid outlet channel 251 in sequence during the liquid suction process; accordingly, when the driving pump 200 is in the second state, the liquid in the liquid storage chamber 210 cannot push the first valve plate 2411 to deform toward the side of the first end face 120, so that the first valve plate 2411 always remains in a state of closing the first valve hole 2412, thereby preventing the coolant in the liquid storage chamber 210 from entering the heat dissipation channel 110 through the liquid inlet channel 252 and the liquid outlet 112 in sequence during the liquid discharge process.

[0075] The number of heat dissipation channels 110 included in the liquid cooling plate 100 can be set as needed. In some embodiments, the number of heat dissipation channels 110 included in the liquid cooling plate 100 can be 1. In other embodiments, the number of heat dissipation channels 110 included in the liquid cooling plate 100 can also be greater than 1. For ease of understanding, the structure of the heat dissipation device is further explained below when the number of heat dissipation channels 110 included in the liquid cooling plate 100 can also be greater than 1:

[0076] Optionally, the liquid cooling plate 100 includes at least two heat dissipation channels 110 , and the at least two heat dissipation channels 110 are distributed in different areas of the liquid cooling plate 100 ;

[0077] The driving pump 200 includes: at least two elastic shells 220 corresponding to the at least two heat dissipation channels 110 on a one-to-one basis, and at least two driving assemblies 230 corresponding to the at least two shells on a one-to-one basis;

[0078] The liquid storage cavity 210 in the elastic shell 220 is connected to the corresponding heat dissipation channel 110 to form the annular channel. The driving assembly 230 is fixedly connected to the corresponding elastic shell 220 to drive the corresponding elastic shell 220 to deform.

[0079] The valve plate assembly 240 includes at least two channel groups 250 corresponding one-to-one to the at least two heat dissipation channels 110, and the channel group 250 includes an inlet channel 252 and an outlet channel 251. Each inlet channel 252 is correspondingly provided with a first valve plate 2411, and each outlet channel 251 is correspondingly provided with a second valve plate 2421.

[0080] The number of heat dissipation channels 110 included in the liquid cooling plate 100 can be set as needed, for example, see Figure 7 In some embodiments of the present application, the structure of the heat dissipation device is further explained by taking the example of three heat dissipation channels 110 included in the liquid cooling plate 100 .

[0081] See Figure 2 The liquid storage cavity 210 in the elastic shell 220 is connected to the corresponding heat dissipation channel 110 to form an annular channel, which means that the input end and the output end of the heat dissipation channel 110 are respectively connected to the liquid storage cavity 210 in the elastic shell 220 to form an independent annular channel. It can be understood that Figure 1 In the embodiment shown, three independent annular flow channels can be formed in the heat dissipation device. Figure 1 The three annular flow channels have similar shapes but different sizes, and are arranged in sequence from the outside to the inside of the liquid cooling plate 100 .

[0082] The fixed connection between the driving assembly 230 and the corresponding elastic shell 220 means that: the driving assembly 230 and the corresponding elastic shell 220 are fixedly connected according to Figure 2 It is understood that each of the driving components 230 includes a set of magnetic components 231, a driving coil 232 and a circuit board 233, and each driving component 230 reuses the above-mentioned mounting bracket 260.

[0083] It is understood that each liquid inlet channel 252 includes only one first valve hole 2412 located in the first plate 241 and one second through hole 2422 located in the second plate 242. Correspondingly, each liquid outlet channel 251 includes only one first through hole 2413 located in the first plate 241 and one second valve hole 2423 located in the second plate 242. For example, see Figure 5,exist Figure 5 In the illustrated embodiment, the first plate 241 includes three first valve holes 2412 and three first through holes 2413, and the second plate 242 includes three second valve holes 2423 and three second through holes 2422. The first plate 241 and the second plate 242 can be two plates of identical structure. In this case, the valve plate assembly 240 can be formed by flipping and stacking two plates of identical structure. This simplifies the number of parts in the valve plate assembly 240 and reduces costs.

[0084] In some embodiments of the present application, when the heat dissipation device is applied to an electronic device, the at least two heat dissipation channels 110 correspond one-to-one to at least two heating areas in the electronic device. Among the at least two heating areas, each heating area is correspondingly provided with a temperature detection element, and the temperature detection element is electrically connected to the corresponding driving component 230. The driving component 230 is used to adjust the flow rate of the pumped coolant according to the detection result of the corresponding temperature detection element.

[0085] The drive assembly 230 is configured to adjust the flow rate of the pumped coolant according to the detection result of the corresponding temperature detection element, which may include: the circuit board 233 in the drive assembly 230 is configured to control the current supplied to the drive coil 232 in the drive assembly 230 according to the detection result of the corresponding temperature detection element, wherein the detection result indicates that the higher the temperature of the corresponding heating area, the greater the current supplied to the drive coil 232. When the current supplied to the drive coil 232 is greater, the relative force between the drive coil 232 and the corresponding magnetic member 231 is also greater, thereby increasing the deformation of the elastic shell 220 connected to the magnetic member 231. Accordingly, the flow rate of each liquid absorption and discharge of the elastic shell 220 is also greater, thereby accelerating the flow rate of the coolant in the annular flow channel, thereby improving the heat exchange efficiency, and achieving rapid heat dissipation of the heating area when the temperature of the heating area is high.

[0086] In this embodiment, since each driving component 230 can independently control the deformation of the connected elastic shell 220, the flow rate in each annular flow channel can be adjusted according to the actual temperature of the heating area corresponding to each heat dissipation channel 110 to achieve precise heat dissipation, ensuring better heat dissipation effect while reducing the power consumption of the driving pump 200.

[0087] Optionally, the thickness of the liquid cooling plate 100 ranges from 0.2 mm to 0.3 mm.

[0088] It is understood that the liquid cooling plate 100 is formed by processing a plastic film, so that the thickness of the liquid cooling plate 100 can be controlled to be 0.2 mm to 0.3 mm.

[0089] In this embodiment, by setting the thickness of the liquid cooling plate 100 to a value range of 0.2 mm to 0.3 mm, it is beneficial to reduce the installation space required for the liquid cooling plate 100, and since the thickness of the liquid cooling plate 100 is very thin, it is beneficial to improve the efficiency of heat exchange between the liquid cooling plate 100 and the outside world.

[0090] See Figure 11 and Figure 12 , an embodiment of the present application further provides an electronic device, which includes the heat dissipation device described in the above embodiment.

[0091] The electronic device may be a mobile phone, tablet or other terminal device.

[0092] See Figure 11 In the embodiment of the present application, the heat dissipation device is powered by an electromagnetically driven pump 200. By rationally arranging the heat dissipation channels 110, the heat generated by the upper end of the electronic device, such as the motherboard 300, can be transferred to the lower end of the electronic device, so that the electronic device can quickly and evenly conduct and disperse heat, thereby preventing the electronic device from overheating and improving performance.

[0093] In this embodiment, since the electronic device includes the heat dissipation device described in the above embodiment, the electronic device can implement each process of the above heat dissipation device and has the same beneficial effects. To avoid repetition, they will not be described here.

[0094] Optionally, when the liquid cooling plate 100 includes at least two heat dissipation channels 110, and the drive pump 200 includes: at least two elastic shells 220 corresponding one-to-one to the at least two heat dissipation channels 110, and at least two drive components 230 corresponding one-to-one to the at least two shells, the at least two heat dissipation channels 110 correspond one-to-one to at least two heating areas in the electronic device, and each of the at least two heating areas is provided with a temperature detection element, and the temperature detection element is electrically connected to the corresponding drive component 230, and the drive component 230 is used to adjust the flow rate of the pumped coolant according to the detection result of the corresponding temperature detection element.

[0095] The liquid cooling plate 100 includes at least two heat dissipation channels 110, and the driving pump 200 includes: at least two elastic shells 220 corresponding to the at least two heat dissipation channels 110, and at least two driving components 230 corresponding to the at least two shells. The situation refers to: the liquid cooling plate 100 includes at least two heat dissipation channels 110, and the at least two heat dissipation channels 110 are distributed in different areas of the liquid cooling plate 100; the driving pump 200 includes: at least two elastic shells 220 corresponding to the at least two heat dissipation channels 110, and at least two driving components 230 corresponding to the at least two shells. 30; the liquid storage chamber 210 in the elastic shell 220 is connected to the corresponding heat dissipation channel 110 to form an annular channel, and the driving component 230 is fixedly connected to the corresponding elastic shell 220 to drive the corresponding elastic shell 220 to deform; the valve plate assembly 240 includes at least two channel groups 250 corresponding to the at least two heat dissipation channels 110, and the channel group 250 includes an inlet channel 252 and an outlet channel 251, and each of the inlet channels 252 is correspondingly provided with a first valve plate 2411, and each of the outlet channels 251 is correspondingly provided with a second valve plate 2421.

[0096] See Figure 11 In an embodiment of the present application, the heat dissipation device includes three independent annular flow channels, which can divide the mainboard 300 into three areas: area A, area B and area C. Different heating modules can be evenly arranged in different areas, and temperature sensors can be set in different areas to detect the temperature. By adjusting the flow rate of the pump and the detection feedback of the temperature sensor to form a closed-loop control, accurate heat dissipation can be achieved for different heating modules, while reducing the power consumption of the electromagnetic drive pump 200 and ensuring the heat dissipation effect. For example: for high-end flagship mobile phones, the mainboard 300 has three modules for heating, namely the system on chip (SoC), the graphics processing unit (GPU) and the imaging module. The above three modules can be respectively arranged in area A, area B and area C, and each area is provided with a temperature sensor, and the flow rates of the three groups of pumps are independently adjusted according to the detected temperature of the temperature sensor. Among them, the temperature sensor can be various types of temperature detection elements. For example, the temperature sensor can be a negative temperature coefficient (NTC) temperature sensor.

[0097] In this embodiment, since each driving component 230 can independently control the deformation of the connected elastic shell 220, the flow rate in each annular flow channel can be adjusted according to the actual temperature of the heating area corresponding to each heat dissipation channel 110 to achieve precise heat dissipation, ensuring better heat dissipation effect while reducing the power consumption of the driving pump 200.

[0098] See Figure 11 and Figure 12 In some embodiments of the present application, the driving pump 200 is integrated on the main board 300. In this case, the driving pump 200 is electrically connected to the main board 300. However, considering that the driving pump 200 generates heat when in operation, the driving pump 200 can also be installed on a sub-board of the electronic device.

[0099] Optionally, the electronic device includes a sub-board, and the driving pump 200 is provided on the sub-board.

[0100] The main board 300 is the circuit board 233 located at the top of the electronic device, and the sub-board is the circuit board 233 located at the bottom of the electronic device. In this embodiment, the drive pump 200 is integrated into the sub-board to avoid the problem of the main board 300 area being further heated due to the heat generated by the drive pump 200 during operation.

[0101] See Figure 12 In an embodiment of the present application, the electronic device further includes a middle frame 400 , and the mainboard 300 and the heat dissipation device are respectively arranged in the middle frame 400 .

[0102] It can be understood that when the driving pump 200 is integrated into the sub-board, the driving pump 200 is electrically connected to the sub-board.

[0103] In this embodiment, by arranging the driving pump 200 on the sub-board, compared with integrating the driving pump 200 into the main board 300, the problem of further increasing the temperature of the main board 300 area due to the heat generated during the operation of the driving pump 200 can be avoided, thereby helping to further improve the heat dissipation effect of the electronic equipment.

[0104] It should be noted that the heat dissipation device and electronic device provided in the embodiments of the present application have at least the following beneficial effects:

[0105] The heat dissipation device adopts an active heat dissipation solution, which can improve the heat dissipation capacity and has great room for development in the future.

[0106] By dividing the heat dissipation path in the heat dissipation device into three independent channels, precise heat dissipation can be performed for different heat dissipation modules such as chip SoC, imaging module, etc.

[0107] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A heat dissipation device, characterized in that: include: A liquid cooling plate, wherein a heat dissipation channel is provided in the liquid cooling plate, and the heat dissipation channel includes a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are two different openings on the same surface of the liquid cooling plate, and coolant is provided in the heat dissipation channel; A driving pump, wherein the liquid inlet and the liquid outlet are respectively connected to the driving pump, and the driving pump includes a liquid storage cavity, and the liquid storage cavity and the heat dissipation flow channel form an annular flow channel; When the driving pump is in the first state, the driving pump draws the coolant from the heat dissipation channel into the liquid storage chamber through the liquid outlet; When the driving pump is in the second state, the driving pump discharges the coolant in the liquid storage chamber into the heat dissipation channel through the liquid inlet.

2. The heat dissipation device according to claim 1, characterized in that: The driving pump includes an elastic shell and a driving assembly, wherein the driving assembly is fixedly connected to the elastic shell to drive the elastic shell to deform, and the liquid storage chamber includes an internal cavity of the elastic shell; When the driving pump is in the first state, the driving assembly drives the elastic shell to deform in a first direction, so that the volume of the internal cavity of the elastic shell increases; When the driving pump is in the second state, the driving assembly drives the elastic shell to deform in a second direction, so as to reduce the volume of the internal cavity of the elastic shell.

3. The heat dissipation device according to claim 2, characterized in that: The drive pump further includes a mounting bracket, the drive assembly includes a magnetic component, a drive coil and a circuit board, the elastic housing is located inside the mounting bracket, the mounting bracket is fixedly connected to the liquid cooling plate, and the circuit board is electrically connected to the drive coil; One of the magnetic member and the driving coil is fixedly connected to the elastic housing, and the other is fixedly connected to the mounting bracket, and the magnetic member is opposite to the driving coil.

4. The heat dissipation device according to claim 3, characterized in that: The liquid inlet and the liquid outlet are respectively provided on a first end surface of the liquid cooling plate, and the mounting bracket is fixedly connected to the first end surface; The magnetic component is fixedly connected to an end of the elastic shell facing away from the first end surface. The driving coil is located on a side of the magnetic component away from the first end surface, and the driving coil is fixedly connected to the mounting bracket.

5. The heat dissipation device according to claim 2, characterized in that: The driving pump further includes a valve plate assembly, the valve plate assembly being located between the elastic housing and the first end surface of the liquid cooling plate, the elastic housing including an open end facing the valve plate assembly, the valve plate assembly being fixedly connected to the open end, and the elastic housing and the valve plate assembly enclose the liquid storage chamber; The valve plate assembly includes a liquid inlet channel and a liquid outlet channel, the liquid storage chamber is connected to the liquid outlet via the liquid inlet channel, and the liquid storage chamber is connected to the liquid inlet via the liquid outlet channel; The valve plate assembly further includes: a first valve plate for opening and closing the liquid inlet channel, and a second valve plate for opening and closing the liquid outlet channel.

6. The heat dissipation device according to claim 5, characterized in that: The valve plate assembly includes a first plate body and a second plate body, the first plate body is provided with a first through hole and a first valve hole, the second plate body is provided with a second through hole and a second valve hole, the first plate body and the second plate body are stacked, and the second plate body is located between the first plate body and the first end surface, the first through hole and the second valve hole are arranged opposite to each other, and the first through hole and the second valve hole are combined to form the liquid outlet channel, the first valve hole and the second through hole are arranged opposite to each other, and the first valve hole and the second through hole are combined to form the liquid inlet channel; The first valve disc is located on an end surface of the first plate body facing away from the second plate body, and the first valve disc closes the first valve hole. The first valve disc includes a first connecting portion, and the first valve disc is fixedly connected to the first plate body via the first connecting portion. The first valve disc can be deformed around the first connecting portion toward one side of the elastic housing to open the liquid inlet channel. The second valve disc is located on the end surface of the second plate body facing away from one end of the first plate body, and the second valve disc closes the second valve hole. The second valve disc includes a second connecting portion, and the second valve disc is fixedly connected to the second plate body through the second connecting portion. The second valve disc can be deformed around the second connecting portion toward the side of the first end surface to open the liquid outlet channel.

7. The heat dissipation device according to claim 5, characterized in that: The liquid cooling plate comprises at least two heat dissipation channels, and the at least two heat dissipation channels are distributed in different areas of the liquid cooling plate; The driving pump comprises: at least two elastic shells corresponding to the at least two heat dissipation channels on a one-to-one basis, and at least two driving assemblies corresponding to the at least two shells on a one-to-one basis; The liquid storage cavity in the elastic shell is connected to the corresponding heat dissipation channel to form the annular channel, and the driving assembly is fixedly connected to the corresponding elastic shell to drive the corresponding elastic shell to deform; The valve plate assembly includes at least two channel groups corresponding one to one with the at least two heat dissipation channels, and the channel group includes an inlet channel and an outlet channel. Each inlet channel is correspondingly provided with a first valve plate, and each outlet channel is correspondingly provided with a second valve plate.

8. The heat dissipation device according to any one of claims 1 to 7, characterized in that: The thickness of the liquid cooling plate ranges from 0.2 mm to 0.3 mm.

9. An electronic device, characterized in that: A heat dissipation device comprising any one of claims 1 to 8.

10. The electronic device according to claim 9, characterized in that When the liquid cooling plate includes at least two heat dissipation channels, and the drive pump includes: at least two elastic shells corresponding one-to-one to the at least two heat dissipation channels, and at least two drive components corresponding one-to-one to the at least two shells, the at least two heat dissipation channels correspond one-to-one to at least two heating areas in the electronic device, and each of the at least two heating areas is correspondingly provided with a temperature detection element, and the temperature detection element is electrically connected to the corresponding drive component, and the drive component is used to adjust the flow rate of the pumped cooling liquid according to the detection result of the corresponding temperature detection element.

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