Shell assembly and electronic equipment

Abstract

According to the shell assembly and the electronic equipment, the joint part is arranged on the side, facing the rear cover, of the middle frame, the joint part is made to avoid the bottleneck part of the middle frame, the joint part is sunken towards the side deviating from the rear cover, the joint part is used as a bearing foundation of the bonding layer, and the bonding layer is not prone to falling off. And the bonding layer between the middle frame and the rear cover passes through the area where the joint part is located. Therefore, on the basis of avoiding the bottleneck part of the middle frame and ensuring the structural strength of the middle frame, the inwards sunken joint part is arranged on the middle frame to bear the bonding layer, so that the bonding layer does not occupy the thickness space of the electronic equipment independently any more, but can be accommodated by utilizing at least part of the wall thickness space of the middle frame, and therefore, the thickness of the middle frame is reduced. The gap between the rear cover and the middle frame is reduced, the thickness of the whole machine is reduced on the basis of ensuring the waterproof effect of the electronic equipment, and the light and thin development of the electronic equipment is facilitated.

Description

Housing components and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on April 11, 2023, with application number 202310431629.0 and application name “Housing assembly and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to the field of electronic equipment, and in particular to a housing assembly and electronic equipment. Background Art

[0003] With the development of science and technology, the design of electronic devices such as mobile phones and tablets is becoming increasingly thinner and lighter to meet the needs of consumers.

[0004] Taking a mobile phone as an example, the battery cover of an electronic device is bonded to the middle frame with adhesive. The middle frame, adhesive, and battery cover together define the thickness of the phone. As electronic devices become thinner, certain structures on the middle frame have become bottlenecks in reducing the thickness of the entire device, especially for folding devices. Because the adhesive covers the parts of the middle frame corresponding to these structures, the adhesive occupies a large amount of space between the middle frame and the battery cover due to the size of these structures, making it impossible to further reduce the gap between the battery cover and the middle frame, resulting in the inability to reduce the thickness of the entire electronic device.

[0005] Summary of the Invention

[0006] The present application provides a shell assembly and an electronic device. The adhesive layer of the shell assembly avoids the bottleneck of the middle frame, which can reduce the thickness of the entire device while ensuring the waterproof effect, and is conducive to the lightweight and thinning of the electronic device.

[0007] In one aspect, the present application provides a housing assembly, comprising:

[0008] Back cover;

[0009] The middle frame has a joint portion on a side facing the back cover, the joint portion avoids the bottleneck portion of the middle frame, and the joint portion is recessed toward a side away from the back cover compared to the bottleneck portion;

[0010] The adhesive layer is provided between the back cover and the middle frame and passes through the area where the joint is located.

[0011] The housing assembly provided by the present application provides a joint portion on the side of the middle frame facing the back cover, so that the joint portion avoids the bottleneck of the middle frame and is recessed toward the side away from the back cover. The joint portion serves as a support for the adhesive layer, so that the adhesive layer between the middle frame and the back cover passes through the area where the joint portion is located. In this way, while avoiding the bottleneck of the middle frame and ensuring the structural strength of the middle frame, the inwardly recessed joint portion is provided on the middle frame to support the adhesive layer. This means that the adhesive layer no longer occupies the thickness space of the electronic device alone, but can instead utilize at least a portion of the wall thickness of the middle frame itself to accommodate the adhesive layer. This reduces the gap between the back cover and the middle frame, and while ensuring the waterproof effect of the electronic device, the thickness of the entire device is reduced, which is conducive to the development of lightweight and thin electronic devices.

[0012] In a possible embodiment, the bottleneck is located in an edge region of the middle frame, and the joint is adjacent to a side of the bottleneck facing away from the edge of the middle frame.

[0013] The bottleneck of the middle frame is usually located in the edge area of ​​the middle frame. By arranging the joint part on the side of the bottleneck part away from the edge of the middle frame, the joint part is avoided from the bottleneck part. Moreover, by making the joint part adjacent to the bottleneck part, the joint part is still kept in the area close to the edge of the middle frame, so that the adhesive layer connected to the joint part can firmly connect the back cover and the middle frame, thereby ensuring the connection strength between the back cover and the middle frame and the waterproof effect of the electronic device.

[0014] In a possible embodiment, the side surface of the bottleneck facing the back cover is the first positioning surface, the side surface of the joint facing the back cover is the second positioning surface, and the distance between the second positioning surface and the first positioning surface is greater than or equal to 1 / 2 of the thickness of the adhesive layer.

[0015] By making the distance between the first positioning surface of the joint part and the second positioning surface of the bottleneck part ≥ 1 / 2 of the thickness of the adhesive layer, at least 1 / 2 of the thickness of the adhesive layer is located within the thickness space of the border part of the middle frame, and the protruding part of the adhesive layer on the border part is less than 1 / 2 of its thickness, the distance between the back cover and the border part of the middle frame can be reduced by at least 1 / 2 of the thickness of the adhesive layer.

[0016] In a possible embodiment, the middle frame includes a middle plate portion and a frame portion, the frame portion is arranged around the circumference of the middle plate portion, and the middle plate portion, the frame portion and the back cover together form a receiving cavity;

[0017] The joint part and the bottleneck part are both located on the frame part.

[0018] The back cover is bonded to the frame portion of the middle frame through an adhesive layer. A joint portion is provided on the frame portion in an area avoiding the bottleneck portion, so that the joint portion is recessed in the bottleneck portion, and the adhesive layer is connected to the joint portion. This allows the adhesive layer to reuse the space of the frame portion in the thickness direction of the electronic device. The adhesive layer at least partially occupies the wall thickness of the frame portion, thereby reducing the thickness space of the electronic device occupied by the adhesive layer, narrowing the gap between the back cover and the frame portion, and thereby reducing the overall thickness of the electronic device.

[0019] In one possible embodiment, along the thickness direction of the middle frame, the wall thickness of the bottleneck area is greater than or equal to a predetermined thickness. In other words, the bottleneck area has a thickness requirement, and the wall thickness of the bottleneck area must not be less than the predetermined thickness. The predetermined thickness can be the minimum thickness required by the design to ensure sufficient strength in the bottleneck area and the reliability of the frame.

[0020] In a possible embodiment, the housing assembly includes a first housing and a second housing, each of the first housing and the second housing includes a back cover, a middle frame, and an adhesive layer;

[0021] The housing assembly also includes:

[0022] The rotating shaft is connected between the middle frame of the first shell and the middle frame of the second shell, and the joint part and the bottleneck part are both located in the area of ​​the frame part corresponding to the rotating shaft.

[0023] In a possible embodiment, the frame portion includes a side wall and an extension wall sequentially connected to the middle plate portion, the side wall extends toward the back cover, and the extension wall extends toward the edge of the back cover along the plane direction of the back cover;

[0024] The extended wall has a joint portion and a bottleneck portion.

[0025] In a possible embodiment, the frame portion is provided with a plug hole, an interface device is installed in the plug hole, and the interface device is configured to be connected to an external device;

[0026] Wherein, a hole wall on one side of the plug-in hole facing the rear cover has a bottleneck portion and a joint portion.

[0027] In one possible embodiment, the interface device includes a device body. From the receiving cavity to the plug hole, the device body includes a power connection end and a plug end connected in sequence. The power connection end is connected to a circuit board disposed in the receiving cavity, and the plug end is used to connect to an external device.

[0028] The bottleneck portion corresponds to the area where the plug end is located; the joint portion corresponds to the area where the connection portion between the plug end and the power end is located, or the joint portion corresponds to the area where the power end is located.

[0029] In the hole wall on one side of the plug hole facing the back cover, the area corresponding to the area where the plug end of the device body is located is the bottleneck area. By setting the joint part correspondingly in the area where the connection part between the plug end and the power connection end of the device body is located, or setting the joint part correspondingly in the area where the power connection end of the device body is located, the joint part can avoid the bottleneck area.

[0030] In a possible implementation, an outer wall surface of the plug-in end and a hole wall of the plug-in hole form a plug-in cavity, and the plug-in cavity is used for plugging in an external device.

[0031] By directly inserting the device body into the plug hole, the outer frame around the device body is eliminated, so that the outer wall surface of the plug end of the device body and the hole wall of the plug hole directly form a plug cavity. There is no need to expand the opening size of the plug hole, and further, there is no need to increase the thickness of the frame, which is conducive to reducing the overall thickness of the electronic device.

[0032] In a possible implementation, a sealing member is provided on the outer wall surface of the device body, and the sealing member is in close contact with the hole wall of the plug hole.

[0033] By arranging a sealing member on the outer wall surface of the device body, the sealing member is in close contact with the hole wall of the plug hole, and the sealing member is used to seal the gap between the device body and the plug hole, preventing foreign matter such as water vapor and dust from entering the receiving cavity through the gap between the plug hole and the device body, thereby ensuring the waterproof effect of the entire electronic device.

[0034] In a possible embodiment, a positioning boss extends inwardly from the hole wall of the plug hole, and the sealing member is in close contact with the positioning boss.

[0035] By setting an inwardly extending positioning boss on the hole wall of the plug hole, the positioning boss is used to reduce the gap between the plug hole at this position and the device body, ensuring that the positioning boss can contact and squeeze the seal, thereby ensuring the sealing effect of the seal.

[0036] In a possible implementation manner, the positioning boss is located in the area where the joint portion is located.

[0037] By arranging the positioning boss in the area where the joint is located, it can be ensured that the positioning boss avoids the bottleneck of the plug hole, and the thickness of the area where the joint is located can be increased, thereby enhancing the structural strength of the area where the joint is located.

[0038] In a possible implementation manner, the interface device further includes a fixing frame, which is sleeved on the device body and connected to the circuit board.

[0039] A fixing frame is arranged outside the device body and connected to the circuit board to position the device body and ensure that the power connection end of the device body and the circuit board are firmly connected.

[0040] In a possible implementation manner, the adhesive layer has a concave section at the location of the plug hole, which protrudes toward the receiving cavity.

[0041] Since the bottleneck of the plug-in hole extends inward from the outer edge of the frame portion, and the joint portion is located on the side of the frame portion close to the receiving cavity, the adhesive layer forms a concave section at the location of the plug-in hole, and the concave section is concave inward from the outer edge of the frame portion, that is, the concave section convexes toward the receiving cavity.

[0042] In a possible implementation, the adhesive layer is a solid film layer or a liquid solidified layer.

[0043] On the other hand, the present application provides an electronic device, including a display screen and a housing assembly as described above, wherein the display screen is connected to the housing assembly.

[0044] The electronic device provided in the present application includes a display screen and a housing assembly. The display screen is supported and fixed on the housing assembly. The housing assembly is provided with a joint portion on the side of the middle frame facing the back cover, so that the joint portion avoids the bottleneck of the middle frame and is recessed toward the side away from the back cover. The joint portion serves as a support for the adhesive layer, so that the adhesive layer between the middle frame and the back cover passes through the area where the joint portion is located. In this way, while avoiding the bottleneck of the middle frame and ensuring the structural strength of the middle frame, the inwardly recessed joint portion is provided on the middle frame to support the adhesive layer. The adhesive layer no longer occupies the thickness space of the electronic device alone, but can instead utilize at least a portion of the wall thickness of the middle frame itself to accommodate the adhesive layer. Thus, the gap between the back cover and the middle frame is reduced, and while ensuring the waterproof effect of the electronic device, the thickness of the entire device is reduced, which is conducive to the development of lightweight and thin electronic devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] FIG1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0046] FIG2 is an exploded structural diagram of the electronic device shown in FIG1 ;

[0047] FIG3 is a schematic structural diagram of another electronic device provided by an embodiment of the present application in an unfolded state;

[0048] FIG4 is a schematic structural diagram of the electronic device in FIG3 in a folded state;

[0049] FIG5 is a schematic structural diagram of the electronic device in FIG3 in a semi-expanded state;

[0050] FIG6 is an exploded structural diagram of the electronic device in FIG3 ;

[0051] FIG7 is a partial structural diagram of a housing assembly in the related art;

[0052] FIG8 is a cross-sectional view of the housing assembly at AA in FIG7 ;

[0053] FIG9 is a partial structural diagram of a housing assembly provided in an embodiment of the present application;

[0054] FIG10 is a cross-sectional view of the housing assembly in FIG9 taken at position BB;

[0055] FIG11 is a partial enlarged view of point A of the housing assembly in FIG10 ;

[0056] FIG12 is a schematic structural diagram of the housing assembly in FIG9 with the rear cover removed;

[0057] FIG13 is an exploded structural diagram of the housing assembly in FIG12;

[0058] FIG14 is a partial structural diagram of another housing assembly provided in an embodiment of the present application;

[0059] FIG15 is a cross-sectional view of the housing assembly at CC in FIG14 . DETAILED DESCRIPTION

[0060] The terms used in the implementation section of this application are only used to explain the specific embodiments of this application and are not intended to limit this application.

[0061] An embodiment of the present application provides an electronic device, which may be a consumer electronic product. Exemplary electronic devices include, but are not limited to, mobile phones, tablet computers (portable Android devices, PADs), notebook computers (NoteBook computers, abbreviated as NoteBooks), ultra-mobile personal computers (UMPCs), walkie-talkies, netbooks, POS (Point of Sales) machines, personal digital assistants (PDAs), wearable devices, virtual reality (VR) devices, augmented reality (AR) devices, and the like.

[0062] Figure 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application. Referring to Figure 1, taking the electronic device 1 as an example of a straight-type electronic device, for example, the electronic device 1 is a straight-type mobile phone, the electronic device 1 may include a shell assembly 10 and a display screen 20. One side surface of the display screen 20 is used to display image information. This side surface of the display screen 20 is usually defined as its front side, and the other side surface opposite to its front side is its back side. The shell assembly 10 is arranged around the side and back of the display screen 20 to support, fix, and protect the display screen 20. The front side of the display screen 20 is exposed outside the shell assembly 10 for the user to view the content displayed on the display screen 20 or perform input operations on the electronic device 1.

[0063] Taking the straight-bar electronic device shown in the figure as an example, the display screen 20 of the electronic device 1 can be a rigid screen, and the display screen 20 can be an LCD (Liquid Crystal Display) display screen 20 or an OLED (Organic Light-Emitting Diode) display screen 20.

[0064] FIG2 is a diagram of the exploded structure of the electronic device shown in FIG1 . Referring to FIG2 , taking a straight-type electronic device as an example, the housing assembly 10 of the electronic device 1 includes a middle frame 100 and a back cover 200 . The middle frame 100 is connected between the display screen 20 and the back cover 200 . The display screen 20 is supported on one side surface of the middle frame 100 , and the back cover 200 is connected to the other side surface of the middle frame 100 . The display screen 20 is usually supported as a whole on the middle frame 100 to ensure the strength and stability of the display screen 20 and meet the use requirements of the display screen 20 . The back cover 200 is usually connected to the middle frame 100 in an overlapping manner. The middle frame 100 and the back cover 200 together form a receiving cavity. The receiving cavity is used to install circuit boards (not shown in the figure), batteries (not shown in the figure), interface devices (not shown in the figure), camera modules (not shown in the figure), microphones (not shown in the figure) and other devices.

[0065] The middle frame 100 may include a middle plate portion 110 and a frame portion 120. The middle plate portion 110 is located between the display screen 20 and the back cover 200 and is generally arranged parallel to the display screen 20 and the back cover 200. The frame portion 120 is arranged around the periphery of the middle plate portion 110. For example, the frame portion 120 may extend perpendicular to the plate surface of the middle plate portion 110 to both sides of the middle plate portion 110. For example, the frame portion 120 and the middle plate portion 110 may be an integrally formed structure.

[0066] The display screen 20 is typically mounted on the middle plate portion 110 of the middle frame 100 using a monolithic bonding method. For example, the display screen 20 is entirely bonded to the middle plate portion 110. The middle plate portion 110 provides support for the display screen 20, ensuring a stable and secure support. This provides the display screen 20 with sufficient strength to withstand frequent pressure. The frame portion 120 surrounds the display screen 20, protecting its edges and shielding it from damage, such as collisions and falls.

[0067] The edge of the back cover 200 is connected to the frame portion 120 of the middle frame 100, for example, the edge of the back cover 200 and the frame portion 120 are bonded together. There is a gap between the middle plate portion 110 of the middle frame 100 and the back cover 200, and the gap forms a receiving cavity as described above, so that components can be installed in the receiving cavity between the middle plate portion 110 of the middle frame 100 and the back cover 200. Exemplarily, the back cover 200 can be roughly flat, and the edge of the back cover 200 can be overlapped on the frame portion 120 of the middle frame 100, and the back cover 200 is entirely located in the area surrounded by the frame portion 120; alternatively, the back cover 200 is designed with a flange bent toward the middle frame 100, and the flange is arranged around the outside of the frame portion 120 of the middle frame 100, wrapping the middle frame 100 inside.

[0068] Figure 3 is a structural schematic diagram of another electronic device provided in an embodiment of the present application when it is in an unfolded state; Figure 4 is a structural schematic diagram of the electronic device in Figure 3 when it is in a folded state; Figure 5 is a structural schematic diagram of the electronic device in Figure 3 when it is in a semi-expanded state.

[0069] Referring to Figures 3 to 5, taking the electronic device 1 as a foldable electronic device, for example, a foldable mobile phone, the electronic device 1 can have different usage states in different usage scenarios. Figure 3 shows the electronic device 1 in an unfolded state, where the unfolding angle α of the electronic device 1 is, for example, 180°. In this case, the electronic device 1 can achieve a large screen display. Figure 4 shows the electronic device 1 in a folded state. In this case, the electronic device 1 is small and easy to carry. Figure 5 shows the electronic device 1 in a semi-expanded state. In this case, the electronic device 1 hovers at an angle between the unfolded state and the folded state. For example, the hovering angle β of the electronic device 1 can be 120°, 130°, 140°, or 150°, etc.

[0070] It should be noted that the angles illustrated in this embodiment are all allowed to have slight deviations. For example, when the unfolded angle α of the electronic device 1 is 180°, it means that the unfolded angle α can be 180° or approximately 180°, such as 170°, 175°, 185°, or 190°. The angles illustrated in the following examples should be understood in the same way.

[0071] In addition, it should be understood that the electronic device 1 shown in Figures 3 to 5 is an electronic device 1 that can be folded once, and the electronic device 1 includes two parts that can rotate relative to each other. When the two parts rotate to be coplanar, the electronic device 1 is in an unfolded state (as shown in Figure 3), when the two parts rotate to overlap each other, the electronic device 1 is in a folded state (as shown in Figure 4), and when the two parts rotate to hover at a certain angle between the unfolded state and the folded state, the electronic device 1 is in a semi-expanded state (as shown in Figure 5). In other embodiments, the electronic device 1 can also be an electronic device 1 that can be folded multiple times (more than twice). In this case, the electronic device 1 can include multiple parts that are connected by sequential rotation, and two adjacent parts can also be relatively far apart to unfold to the unfolded state, and two adjacent parts can be relatively close to fold to the folded state.

[0072] Figure 6 is an exploded structural diagram of the electronic device in Figure 3. As shown in Figure 6, for a foldable electronic device, electronic device 1 may also include a display screen 20 and a housing assembly 10. The front of display screen 20 is used to display image information, and housing assembly 10 is disposed around the sides and back of display screen 20 to support, secure, and protect display screen 20. Details thereof will not be repeated here.

[0073] The display screen 20 of the foldable electronic device may include a first area 21, a second area 22, and a bendable area 23, with the bendable area 23 located between the first area 21 and the second area 22. During use, the first area 21 and the second area 22 remain flat, while the bendable area 23 can bend to change the angle between the first area 21 and the second area 22, allowing the foldable screen to fold or unfold with the movement of the housing assembly 10, enabling the electronic device 1 to switch between a folded state and an unfolded state.

[0074] For example, in the display screen 20 of the foldable electronic device, at least the bendable region 23 is made of a flexible material, so that the bendable region 23 is bendable. The first region 21 and the second region 22 can be made of a flexible material, a rigid material, or partially of a rigid material and partially of a flexible material, which is not limited in this embodiment.

[0075] The display screen 20 of the foldable electronic device can be, but is not limited to, an organic light-emitting diode (OLED) display screen 20, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display screen 20, a mini organic light-emitting diode (MID) display screen 20, a micro organic light-emitting diode (MID) display screen 20, a micro organic light-emitting diode (MID) display screen 20, or a quantum dot light-emitting diode (QLED) display screen 20, etc.

[0076] As shown in Figures 3 and 6 , when the display screen 20 is in the unfolded state, the first area 21 and the second area 22 are in a relatively distant unfolded state, the bendable area 23 is in a flattened state without bending, and the first area 21, the second area 22, and the bendable area 23 face the same direction and are coplanar. At this time, the angle between the first area 21 and the second area 22 is 180°, and the display screen 20 can achieve a large-screen display, providing users with richer information and a better user experience. As shown in Figures 4 and 6 , when the display screen 20 is in the folded state, the first area 21 and the second area 22 are relatively stacked, and the bendable area 23 is in a bent state, with the bending angle of the bendable area 23 being, for example, 180°. At this time, the foldable electronic device 1 is small in size and easy to carry and store.

[0077] It should be noted that the figure takes the foldable electronic device as an inward-folding structure as an example. When the electronic device 1 is in the folded state, the first area 21 and the second area 22 of the display screen 20 are relatively fitted together, and the shell assembly 10 is arranged outside the display screen 20 to prevent the display screen 20 from being scratched by hard objects. Referring to Figure 4, if the inward-folding electronic device needs to realize the display function in the folded state, a display screen 20 can be added to the back of the shell assembly 10. The foldable electronic device 1 relies on the display screen 20 to realize the display function in the folded state. In other words, the display screen 20 of the inward-folding electronic device can include a first display screen 20a and a second display screen 20b. The first display screen 20a can be a folding screen installed on the front of the shell assembly 10. The first display screen 20a can switch between the unfolded state and the folded state. The second display screen 20b can be a single screen installed on the back of the shell assembly 10. The second display screen 20b displays when the electronic device 1 is in the folded state.

[0078] In other examples, the foldable electronic device may also have an outward-folding structure. When the electronic device 1 is in the folded state, the first area 21 and the second area 22 of the display screen 20 face each other, the housing assembly 10 is located between the first area 21 and the second area 22, and the display screen 20 is disposed outside the housing assembly 10. The display screen 20 is exposed and visible to the user, and the display function can be realized by the display screen 20. Therefore, there is no need to add a display screen 20 on the back of the housing assembly 10. In other words, the outward-folding electronic device may only include the display screen 20 mounted on the front of the housing assembly 10.

[0079] In addition, as shown in conjunction with Figures 5 and 6 , in some embodiments, a foldable electronic device, particularly an inward-folding electronic device, can rely on the damping force provided by the housing assembly 10 to allow the electronic device 1 to hover at an angle between the unfolded state and the folded state. For example, the hovering angle of the electronic device 1 can be 120°, 130°, 140°, or 150°. At this time, the bendable region 23 of the display screen 20 is also in a bent state, and the first region 21 and the second region 22 of the display screen 20 are relatively inclined. The angle between the first region 21 and the second region 22 is, for example, 120°, 130°, 140°, or 150°.

[0080] For a foldable electronic device, the housing assembly 10 not only supports and secures the display screen 20 but also needs to drive the display screen 20 between a folded state and an unfolded state. Referring to FIG6 , the housing assembly 10 of the foldable electronic device may include a first housing 10a, a second housing 10b, and a hinge 10c. The hinge 10c is connected between the first housing 10a and the second housing 10b. The first housing 10a and the second housing 10b are rotatably connected via the hinge 10c, thereby enabling relative rotation between the first housing 10a and the second housing 10b.

[0081] The first housing 10a supports and secures the first area 21 of the display screen 20, while the second housing 10b supports and secures the second area 22 of the display screen 20. In other words, the first area 21 of the display screen 20 is fixedly connected to the first housing 10a, and the second area 22 of the display screen 20 is fixedly connected to the second housing 10b. The flexible area 23 of the display screen 20 is positioned corresponding to the rotation axis 10c. When the rotation axis 10c drives the first and second housings 10a, 10b to rotate relative to each other, the first and second areas 21, 22 of the display screen 20 change their orientation accordingly, and the flexible area 23 of the display screen 20 bends or flattens as the orientation of the first and second areas 21, 22 changes.

[0082] The rotating shaft 10c drives the first housing 10a and the second housing 10b to rotate relative to each other, so that the electronic device 1 switches between the folded state and the unfolded state. The first housing 10a and the second housing 10b can rotate away from each other until they are coplanar. At this time, the housing assembly 10 is in the unfolded state, and the display screen 20 is in the unfolded state as the housing assembly 10 unfolds, as shown in FIG3 . The first housing 10a and the second housing 10b can also rotate toward each other until they are relatively stacked. At this time, the housing assembly 10 is in the folded state, and the display screen 20 is in the folded state as the housing assembly 10 folds, as shown in FIG4 . The first housing 10a and the second housing 10b can also rotate relative to each other until they remain between the folded state and the unfolded state. At this time, the housing assembly 10 is in a semi-expanded state (hovering state), and the angle between the first housing 10a and the second housing 10b 200 is, for example, 120°, 130°, 140°, or 150°, and the display screen 20 is in the semi-expanded state as the housing assembly 10 folds, as shown in FIG5 .

[0083] Continuing with FIG6 , in the housing assembly 10 of the foldable electronic device, the first housing 10a and the second housing 10b may both include a middle frame 100, and the first and second regions 21 and 22 of the display screen 20 may be supported on the front surface of the middle frame 100. For an outward-folding electronic device or an inward-folding electronic device without an additional second display screen 20b, the first housing 10a and the second housing 10b of the electronic device 1 may both further include a back cover 200, which is connected to a side of the middle frame 100 facing away from the display screen 20. For an inward-folding electronic device with an additional second display screen 20b, one of the first housing 10a and the second housing 10b may not include the back cover 200, and instead may mount the second display screen 20b on the back surface of the middle frame 100.

[0084] Within the first and second housings 10a and 10b, the middle frame 100 and the back cover 200 (second display screen 20b) together form a receiving cavity, which is used to mount components such as a circuit board (not shown), a battery (not shown), interface components (not shown), a camera module (not shown), and a microphone (not shown). The middle frame 100 may include a middle plate 110 and a frame 120. The display screen 20 is integrally mounted on the middle plate 110. The frame 120 surrounds the middle plate 110. The back cover 200 (second display screen 20b) and the frame 120 are bonded together.

[0085] Whether it is a straight-type electronic device or a foldable electronic device, with the trend of electronic devices 1 becoming lighter and thinner, some structural designs of the shell assembly 10 of the electronic device 1 have become a bottleneck for reducing the thickness of the entire device. Especially in the application of foldable electronic devices, since the shell assembly 10 cannot be further thinned, the thickness of the entire device (especially in the folded state) is larger.

[0086] Figure 7 is a partial structural diagram of a housing assembly in the related art; Figure 8 is a cross-sectional view of the housing assembly of Figure 7 taken at point AA. Referring to Figures 7 and 8 , the middle plate portion 110a of the middle frame 100a is located on the side of the frame portion 120a facing away from the rear cover 200a. The gap between the middle plate portion 110a and the rear cover 200a forms a receiving cavity 11a. The figure shows the partial structure of the area where the plug hole 121a is located on the middle frame 100a. The plug hole 121a is provided on the frame portion 120a of the middle frame 100a and extends inward to communicate with the receiving cavity 11a.

[0087] The plug hole 121a is used to install the interface device 400a, which can be a USB (Universal Serial Bus) interface. The interface device 400a is connected to the circuit board 500a set in the receiving cavity 11a. The interface device 400a is used to connect to external devices. For example, by inserting a data cable into the plug hole 121a, the interface device 400a is connected to external devices such as an external power supply, headphones, storage devices, etc., to charge the electronic device or realize the interaction between the electronic device and the external device.

[0088] The back cover 200a is bonded to the frame portion 120a of the middle frame 100a via an adhesive layer 300a. The adhesive layer 300a is arranged around the frame portion, and the adhesive layer 300a passes through the area where the plug hole 121a is located. For standard components such as the interface component 400a, there are also requirements for the size of the plug hole 121a, which limits the size of the middle frame 100a. In other words, the size of the frame portion 120a of the middle frame 100a in the thickness direction of the electronic device (the Z direction shown in FIG. 8 ) is limited. The wall thickness of the frame portion 120a of the middle frame 100a at the location of the plug hole 121a (on the side facing the back cover 200a) must meet the structural strength requirements of the middle frame 100a.

[0089] Due to the thickness limitation of the frame portion 120a where the plug hole 121a is located, in the related art, the adhesive layer 300a stacked on the frame portion 120a is relatively far away from the interface device 400a. Specifically, the frame portion 120a (on the side facing the back cover 200a) has a bottleneck portion 122a in the area where the plug hole 121a is located. The bottleneck portion 122a is located in the standard size section of the plug hole 121a. The standard size section of the plug hole 121a is the hole section where the width of the plug hole 121a (in the Z direction in Figure 8) must meet design requirements and cannot be reduced. The adhesive layer 300a covers the bottleneck area of ​​the frame portion 120a, making the distance between the device and the interface device 400a relatively far.

[0090] On this basis, the back cover 200a is also stacked on the back glue layer 300a. For the back glue layer 300a covering the bottleneck area of ​​the frame portion 120a, the back glue layer 300a alone occupies the space between the frame portion 120a of the middle frame 100a and the back cover 200a. In the thickness direction of the electronic device 1, the position of the back cover 200a is further outward (closer to the back of the electronic device 1) than the frame portion 120a of the middle frame 100a. The gap between the back cover 200a and the middle frame 100a cannot be further reduced, resulting in the inability to reduce the overall thickness of the electronic device.

[0091] Continuing with reference to Figure 8, the interface device 400a in the related art generally includes an outer frame 420a in addition to the device body 410a. The outer frame 420a is arranged around the periphery of the device body 410a, and the outer frame 420a is mounted on the inner wall surface of the plug hole 121a. The space between the outer frame 420a and the device body 410a should meet the design requirements to achieve the connection between the interface device 400a and the external device. Therefore, regardless of the case where the hole wall of the plug hole 121a is a smooth wall surface and the wall thickness of the outer frame 420a is completely located within the area enclosed by the plug hole 121a (the outer frame 420a alone occupies the space within the plug hole 121a), or the case where a shallow groove is formed on the hole wall of the plug hole 121a and the outer frame 420a is partially embedded in the hole wall of the plug hole 121a (part of the wall thickness of the outer frame 420a occupies the space where the hole wall of the plug hole 121a is located), the size of the plug hole 121a in the thickness direction of the electronic device (Z direction in Figure 8) is expanded to a certain extent, which makes the distance between the side wall of the border portion 120a of the middle frame 100a facing the back cover 200a and the middle plate portion 110a larger, which is not conducive to thinning the overall thickness of the electronic device.

[0092] Since an outer frame 420a is provided around the outer periphery of the device body 410a, when sealing the plug hole 121a on the frame portion 120a, a sealing ring 600a is usually sleeved on the outer wall surface of the outer frame 420a. For example, the sealing ring 600a is bonded to the outer wall surface of the outer frame 420, and the sealing ring 600a is in close contact with the frame portion 120a. The sealing ring 600a is squeezed to seal the plug hole 121a to prevent external water vapor, dust and other foreign matter from entering the receiving cavity 11a through the gap between the interface device 400a and the plug hole 121a.

[0093] Among them, in the case where the outer frame 420a is mounted on the inner wall of the plug hole 121a, an avoidance groove 123a can be opened on the frame portion 120a at a position corresponding to the outer frame 420a, and the sealing ring 600a is arranged in the avoidance groove 123a. One side of the sealing ring 600a is fixed by a bracket 700a fixed to the outer wall surface of the outer frame 420, and the other side of the sealing ring 600a is in close contact with the groove wall of the avoidance groove 123a. The sealing ring 600a is squeezed between the bracket 700a and the groove wall of the avoidance groove 123a to seal the gap between the outer frame 420 and the plug hole 121a.

[0094] In view of this, this embodiment improves the connection structure between the back cover and the middle frame by providing a joint portion on the side of the middle frame facing the back cover, so that the joint portion avoids the bottleneck area of ​​the middle frame and is recessed toward the side away from the back cover. This joint portion serves as a support for the adhesive layer, so that the adhesive layer between the middle frame and the back cover passes through the area where the joint portion is located. In this way, while avoiding the bottleneck area of ​​the middle frame and ensuring the structural strength of the middle frame, the inwardly recessed joint portion is provided on the middle frame to support the adhesive layer. This ensures that the adhesive layer no longer occupies the thickness of the electronic device alone, but can instead utilize at least a portion of the wall thickness of the middle frame itself to accommodate the adhesive layer. This reduces the gap between the back cover and the middle frame, and while ensuring the waterproof performance of the electronic device, the thickness of the entire device is reduced, which is conducive to the development of lighter and thinner electronic devices.

[0095] The housing assembly 10 of the electronic device 1 of this embodiment will be described in detail below with reference to the accompanying drawings.

[0096] FIG9 is a partial structural diagram of a housing assembly provided in an embodiment of the present application; FIG10 is a cross-sectional view of the housing assembly in FIG9 at position BB. Referring to FIG9 and FIG10 , the partial structure of the housing assembly 10 at the location of the plug-in hole 123 on the middle frame 100 is shown. Regardless of whether the electronic device 1 is a bar-type electronic device or a foldable electronic device, in this embodiment, the housing assembly 10 of the electronic device 1 includes a middle frame 100 and a back cover 200. The middle plate portion 110 of the middle frame 100 is connected to the side of the frame portion 120 facing away from the back cover 200. The frame portion 120 of the middle frame 100 and the back cover 200 are bonded together by an adhesive layer 300. The middle plate portion 110, the frame portion 120 and the back cover 200 together form a receiving cavity 11.

[0097] The adhesive layer 300 may be a solid film layer, and its initial state may be a solid film. Before connecting the middle frame 100 and the back cover 200, the adhesive layer 300 is first affixed to the middle frame 100 or the back cover 200. Then, the middle frame 100 and the back cover 200 are relatively abutted, and the adhesive layer 300 is bonded between the middle frame 100 and the back cover 200 by pressure. Alternatively, the adhesive layer 300 may be a liquid solidified layer, and its initial state before curing may be liquid glue. The liquid glue may be sprayed onto the middle frame 100 or the back cover 200 through a dispensing process. Then, the middle frame 100 and the back cover 200 are relatively abutted, and the liquid glue solidifies to form a solid adhesive layer 300, stably and reliably connecting the middle frame 100 and the back cover 200.

[0098] The figure shows a circuit board 500 disposed within the receiving cavity 11. The circuit board 500 is disposed near the plug hole 123, that is, the circuit board 500 is disposed near the frame portion 120 of the middle frame 100. Exemplarily, the circuit board 500 disposed within the receiving cavity 11 of the electronic device 1 may include a main circuit board (referred to as the main board) and a sub-circuit board (referred to as the sub-board). The main circuit board and the sub-circuit board may be electrically connected to each other. The main board may be provided with components such as a system-on-a-chip (SOC), memory, radio frequency components, and power chips. The sub-board may be provided near the frame portion 120 of the middle frame 100. The sub-board is used to carry components that need to be disposed near the frame portion 120 or components that cannot be integrated on the main board. For example, the sub-board may be provided with components such as a microphone, a speaker, an interface component 400, and a spring. In this regard, the circuit board 500 shown in the figure may be a sub-board.

[0099] The interface device 400 is installed in the plug hole 123 opened on the frame portion 120 of the middle frame 100. The interface device 400 can be the aforementioned USB interface. For example, the interface device 400 is a Type-C interface or a Micro USB interface. The interface device 400 is connected to the circuit board 500 (for example, a sub-board) near the frame portion 120 in the receiving cavity 11. Exemplarily, the interface device 400 can be connected to the pads on the circuit board 500 through pins. In actual applications, the interface device 400 can be connected to external devices such as external power supplies, headphones, and storage devices by inserting a data cable that matches the interface device 400 into the plug hole 123.

[0100] As mentioned above, for standard devices such as the interface device 400, there are corresponding fixed requirements for the size of the plug-in hole 123. The portion of the frame portion 120 of the middle frame 100 where the plug-in hole 123 is located, and the hole wall on the side of the plug-in hole 123 facing the back cover 200 form the wall thickness of the frame portion 120 at this portion. When the size of the plug-in hole 123 is fixed, the wall thickness of the hole wall on the side of the plug-in hole 123 facing the back cover 200 should be ensured to meet the structural strength requirements of the frame portion 120 of the middle frame 100.

[0101] In this regard, the hole wall on one side of the plug hole 123 facing the back cover 200 usually has a bottleneck portion 121. The existence of the bottleneck portion 121 is because this portion needs to meet the size of the plug hole 123 in the thickness direction of the electronic device 1 (the Z direction shown in Figure 10), and this portion also needs to meet the structural strength requirements of the border portion 120 of the middle frame 100. Therefore, the distance between the bottleneck portion 121 of the hole wall on this side of the plug hole 123 and the interface device 400 cannot be reduced, and the wall thickness of the bottleneck portion 121 cannot be excessively reduced.

[0102] In other words, in this example, a required clearance must be maintained between the inner wall surface of the bottleneck portion 121 of the plug hole 123 and the corresponding surface of the interface device 400 to meet the operational requirements of the plug hole 123. Furthermore, the wall thickness of the bottleneck portion 121 must be greater than or equal to a predetermined thickness, which is the minimum thickness required by the design, to ensure sufficient wall thickness at the location of the plug hole 123 and to maintain the structural strength of the frame portion 120 at the location of the plug hole 123.

[0103] As shown in FIG10 , in order to reduce the gap between the back cover 200 and the frame portion 120 of the middle frame 100 , in this embodiment, a joint portion 122 is designed on the hole wall on the side of the plug hole 123 facing the back cover 200, avoiding the bottleneck portion 121. As the name suggests, the joint portion 122 is the portion on the frame portion 120 of the middle frame 100 where the adhesive layer 300 is provided. In other words, the section of the adhesive layer 300 passing through the plug hole 123 on the frame portion 120 is located on the joint portion 122. Compared to the bottleneck portion 121, the joint portion 122 is recessed toward the side away from the back cover 200. In the thickness direction of the housing assembly 10 (the Z direction shown in the figure), the surface of the joint portion 122 facing the back cover 200 is located between the inner wall surface of the plug hole 123 and the surface of the bottleneck portion 121 facing the back cover 200.

[0104] In this embodiment, a joint portion 122 is provided on the side wall of the plug hole 123 facing the back cover 200, and the joint portion 122 is recessed in the bottleneck portion 121 of the side wall of the plug hole 123, so that the section of the adhesive layer 300 corresponding to the plug hole 123 is connected to the joint portion 122. In this way, the adhesive layer 300 avoids the bottleneck portion 121 of the plug hole 123, and the recessed joint portion 122 provides more space for the adhesive layer 300. The adhesive layer 300 at least partially occupies the wall thickness of the frame portion 120 of the middle frame 100. In other words, the adhesive layer 300 can reuse the space of the frame portion 120 in the thickness direction of the electronic device 1 (the Z direction shown in FIG. 10 ), thereby reducing the thickness space of the electronic device 1 occupied by the adhesive layer 300, narrowing the gap between the back cover 200 and the frame portion 120, and further reducing the thickness of the electronic device 1.

[0105] Furthermore, because the joint 122 avoids the area where the bottleneck 121 is located, it does not affect the section of the plug hole 123 that needs to maintain the required size, thus ensuring that the plug hole 123 can connect to the external device. Furthermore, because the structural strength of the frame portion 120 on the side of the plug hole 123 facing the rear cover 200 is primarily determined by the bottleneck 121, the recessed joint 122 does not affect the structural strength of the frame portion 120.

[0106] In summary, this embodiment designs a recessed joint portion 122 at a position corresponding to the plug hole 123 on the frame portion 120 of the middle frame 100, on the hole wall on the side of the plug hole 123 facing the back cover 200, avoiding the bottleneck portion 121. By using the joint portion 122 as the bearing portion of the adhesive layer 300, the thickness of the entire device can be reduced while ensuring that the middle frame 100 and the back cover 200 are firmly connected and the waterproof effect of the entire device is ensured. For example, the thickness of the entire device can be reduced by 0.2-0.3 mm, which contributes to the lightweight development of the electronic device 1.

[0107] Figure 11 is a partial enlarged view of point A of the housing assembly in Figure 10. Referring to Figure 11, for ease of explanation, in this embodiment, the surface of the hole wall on the side of the plug hole 123 facing the rear cover 200, the bottleneck portion 121 facing the rear cover 200 is defined as a first positioning surface 1211, and the surface of the side of the engaging portion 122 facing the rear cover 200 is defined as a second positioning surface 1221. The second positioning surface 1221 is recessed in the first positioning surface 1211, and the second positioning surface 1221 is further away from the rear cover 200 than the first positioning surface 1211. There is a space between the second positioning surface 1221 and the plane where the first positioning surface 1211 is located for disposing the adhesive layer 300. Thus, the adhesive layer 300 is able to reuse the space of the frame portion 120 in the thickness direction of the electronic device 1. The adhesive layer 300 at least partially occupies the wall thickness of the frame portion 120, reducing the thickness of the adhesive layer 300 protruding on the first positioning surface 1211. The adhesive layer 300 can even be completely located in the wall thickness space of the frame portion 120, and the adhesive layer 300 is flush with or recessed in the first positioning surface 1211.

[0108] In some embodiments, the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 can be ≥ 1 / 2 of the thickness of the adhesive layer 300, that is, at least 1 / 2 of the thickness of the adhesive layer 300 is located within the thickness space of the border portion 120 of the middle frame 100, and the portion of the adhesive layer 300 protruding on the border portion 120 is less than 1 / 2 of its thickness. In this way, compared with the related art in which the adhesive layer 300 alone occupies the thickness space of the electronic device 1, this embodiment designs the joint 122 to carry the adhesive layer 300, so that the distance between the back cover 200 and the border portion 120 of the middle frame 100 can be reduced by at least 1 / 2 of the thickness of the adhesive layer 300.

[0109] For example, the distance between the second positioning surface 1221 of the joint portion 122 and the first positioning surface 1211 of the bottleneck portion 121 may be greater than or equal to 2 / 3, 3 / 4 or 4 / 5 of the thickness of the adhesive layer 300 .

[0110] It should be noted that the distance between the second positioning surface 1221 of the joint 122 and the first positioning surface 1211 of the bottleneck portion 121 should be ≤ the thickness of the adhesive layer 300. In other words, the maximum limit of the distance between the second positioning surface 1221 and the first positioning surface 1211 is the thickness of the adhesive layer 300. When the distance between the second positioning surface 1221 and the first positioning surface 1211 is equal to the thickness of the adhesive layer 300, when the back cover 200 is bonded to the frame portion 120 of the middle frame 100, the back cover 200 precisely abuts the bottleneck portion 121 of the frame portion 120.

[0111] Continuing with FIG. 10 , and taking the location of the plug hole 123 on the middle frame 100 as an example, for the plug hole 123 for inserting devices such as data cables, the hole section of the plug hole 123 with the required size typically extends from the outer wall surface of the frame portion 120 toward the middle plate portion 110. Therefore, in the hole wall of the plug hole 123 on the side facing the back cover 200, the bottleneck portion 121 can be located at the edge area of ​​the middle frame 100, while the joint portion 122 is located on the side of the bottleneck portion 121 facing away from the edge of the middle frame 100. In other words, the bottleneck portion 121 extends inward from the outer wall surface of the frame portion 120, and the joint portion 122 can be located on the side of the bottleneck portion 121 facing away from the outer wall surface of the frame portion 120.

[0112] On this basis, the joint 122 can be adjacent to the bottleneck portion 121. In this way, when the space of the frame portion 120 is limited, the area adjacent to the bottleneck portion 121 is sufficient to set the joint 122, and the joint 122 is still maintained in the area close to the edge of the middle frame 100, so that the adhesive layer 300 connected to the joint 122 can firmly connect the back cover 200 and the middle frame 100, ensure the connection strength between the back cover 200 and the middle frame 100, and ensure the waterproof effect of the electronic device 1.

[0113] Exemplarily, the joint portion 122 is located at the edge area of ​​the hole wall on the side of the plug-in hole 123 facing the rear cover 200. In other words, the joint portion 122 can be located at the edge area on the side of the frame portion 120 extending toward the receiving cavity 11. The joint portion 122 extends toward the receiving cavity 11, and the side of the joint portion 122 facing the receiving cavity 11 can be in communication with the receiving cavity 11. For the joint portion 122 used to carry the adhesive layer 300, the area where the joint portion 122 is located can be processed into a flat plate structure to facilitate pasting the adhesive layer 300 between the joint portion 122 and the rear cover 200. By arranging the joint portion 122 at the edge of the frame portion 120 and extending it to communicate with the receiving cavity 11, the processing of the frame portion 120 is facilitated. The joint portion 122 can be formed by processing a plane recessed in the top surface of the edge of the frame portion 120 extending toward the receiving cavity 11.

[0114] Continuing with FIG. 10 , the interface device 400 includes a device body 410. In the direction from the receiving cavity 11 to the plug hole 123 (opposite to the Y direction shown in the figure), the device body 410 may include a power connection terminal 411 and a plug connection terminal 412, which are connected in sequence. The power connection terminal 411 of the device body 410 extends into the receiving cavity 11 and connects to the circuit board 500 (e.g., a sub-board). For example, pins of the device body 410 extend from the power connection terminal 411 and connect to pads on the circuit board 500, thereby connecting the device body 410 to the circuit board 500. The plug connection terminal 412 of the device body 410 is located within the plug hole 123 and extends from the plug hole 123 toward the exterior of the electronic device 1. The device body 410 is connected to an external device via the plug connection terminal 412. For example, a data cable extends into the plug hole 123 and plugs into the plug connection terminal 412 of the device body 410, thereby connecting the device body 410 to the external device via the data cable.

[0115] Because the area within the plug hole 123 corresponding to the plug end 412 of the device body 410 needs to be connected to an external device, this area of ​​the plug hole 123 has size requirements. The area of ​​the hole wall on the side of the plug hole 123 facing the rear cover 200 where the plug end 412 of the device body 410 is located corresponds to the bottleneck area 121. Therefore, when designing the joint 122 on this side of the hole wall of the plug hole 123, the joint 122 can correspond to the area where the connection between the plug end 412 of the device body 410 and the power terminal 411 is located, or the joint 122 can correspond to the area where the power terminal 411 is located, so that the joint 122 avoids the bottleneck area 121.

[0116] For example, when the width of the frame portion 120 of the middle frame 100 (the dimension in the Y direction in the figure) is limited, the power connection end 411 of the device body 410 can be entirely located within the receiving cavity 11, and the plug hole 123 is primarily used to accommodate the plug end 412 of the device body 410. In this case, the connection portion between the power connection end 411 and the plug end 412 of the device body 410 is located at the edge of the frame portion 120 facing the receiving cavity 11. In other words, the joint portion 122 can be located at the edge region of the frame portion 120 facing the receiving cavity 11, and the joint portion 122 can correspond to the connection portion between the plug end 412 and the power connection end 411 of the device body 410.

[0117] In addition, continuing to refer to Figure 10, compared with the interface device 400a in the related art (see Figure 8), the interface device 400 in this embodiment cancels the outer frame 420a. In other words, the device body 410 of the interface device 400 is directly inserted into the plug hole 123, and there is no outer frame 420a surrounding the periphery of the device body 410. The outer wall surface of the plug end 412 of the device body 410 and the hole wall of the plug hole 123 form a plug cavity, and the connection between the device body 410 and the external device is realized through the plug cavity. For example, the data cable is inserted into the plug cavity and connected to the device body 410.

[0118] Since there is no restriction of the outer frame, the outer wall surface of the device body 410 and the hole wall of the plug hole 123 directly form a plug cavity. The opening size of the plug hole 123 only needs to meet the connection requirements with the external device. There is no need to expand the size of the plug hole 123 in order to set the outer frame. Furthermore, there is no need to increase the size of the border portion 120 of the middle frame 100 in the thickness direction of the electronic device 1 (Z direction in Figure 10). The middle frame 100 can maintain a smaller thickness, which is conducive to reducing the overall thickness of the electronic device 1.

[0119] Furthermore, since there is no outer frame around the device body 410, a gap connected to the receiving cavity 11 is formed between the outer wall surface of the device body 410 and the hole wall of the plug hole 123. Therefore, when sealing the plug hole 123, a sealing member 600 can be provided on the outer wall surface of the device body 410. The sealing member 600 is in close contact with the hole wall of the plug hole 123 to achieve sealing of the plug hole 123, preventing external water vapor, dust and other foreign matter from entering the receiving cavity 11 through the gap between the plug hole 123 and the device body 410, thereby ensuring the waterproof effect of the entire electronic device 1.

[0120] It should be understood that the seal 600 should be positioned away from the plug end 412 of the device body 410 to avoid affecting the connection between the plug end 412 and the external device. For example, if the power connection end 411 of the device body 410 is entirely within the receiving cavity 11, the seal 600 can be positioned over the connection between the power connection end 411 and the plug end 412 on the device body 410. For example, if the joint 122 corresponds to the connection between the power connection end 411 and the plug end 412 of the device body 410, the seal 600 can be positioned corresponding to the joint 122.

[0121] For example, the seal 600 can be a separately molded sealing ring, for example, a silicone ring or a rubber ring. Alternatively, the seal 600 can be a sealing layer integrally molded on the surface of the device body 410. The sealing layer can be formed on the surface of the device body 410 through an injection molding process, for example, the seal 600 can be a silicone layer or a rubber layer.

[0122] To facilitate close contact between the sealing member 600 and the wall of the plug hole 123, as shown in FIG. 10 , in some embodiments, a positioning boss 1231 extends inward from the wall of the plug hole 123. The positioning boss 1231 may be a raised annular boss on the wall of the plug hole 123, and the positioning boss 1231 corresponds to the sealing member 600. The positioning boss 1231 is used to reduce the gap between the plug hole 123 at that location and the device body 410, ensuring that the positioning boss 1231 can contact and squeeze the sealing member 600, thereby ensuring the sealing effect of the sealing member 600.

[0123] Positioning boss 1231 should avoid bottleneck 121 of plug hole 123. For example, positioning boss 1231 can be positioned corresponding to joint 122. In other words, positioning boss 1231 is located in the region where joint 122 is located. This ensures that positioning boss 1231 avoids bottleneck 121 of plug hole 123, preventing it from interfering with the connection between interface device 400 and the external device. Furthermore, because positioning boss 1231 protrudes from the inner wall of plug hole 123, it increases the thickness of the inwardly recessed region where joint 122 is located, thereby enhancing the structural strength of the region where joint 122 is located.

[0124] Exemplarily, the joint 122 can be located in the area where the connection part between the plug end 412 and the power connection end 411 of the device body 410 is located, the seal 600 is sleeved on the part between the plug end 412 and the power connection end 411 of the device body 410, and the positioning boss 1231 is arranged corresponding to the seal 600, and the positioning boss 1231 protrudes on the side of the joint 122 facing the plug hole 123.

[0125] FIG12 is a schematic diagram of the structure of the housing assembly in FIG9 with the back cover removed. Referring to FIG12 , the structure of the adhesive layer 300 located between the frame portion 120 of the middle frame 100 and the back cover 200 at the location of the insertion hole 123 is shown. Because the bottleneck portion 121 of the frame portion 120 in the area where the insertion hole 123 is located extends inward from the outer edge of the frame portion 120, and the joint portion 122 is located on the side of the frame portion 120 close to the receiving cavity 11, the adhesive layer 300 at the location of the insertion hole 123 protrudes from the edge of the frame portion 120 toward the receiving cavity 11. The adhesive layer 300 forms an inwardly recessed section 310 in this area. The inwardly recessed section 310 is recessed inward from the outer edge of the frame portion 120. In other words, the inwardly recessed section 310 protrudes toward the receiving cavity 11.

[0126] As for the shape of the concave section 310, the figure takes the concave section 310 as an example of being roughly "U"-shaped. In other examples, the shape of the concave section 310 can also be an arc, semicircle, trapezoid, etc., and this embodiment does not impose specific restrictions on this.

[0127] FIG13 is an exploded structural diagram of the housing assembly 10 in FIG12 . As shown in FIG12 and FIG13 , in this embodiment, the interface device 400, in addition to the device body 410, also includes a fixing bracket 420. The fixing bracket 420 is mounted on the device body 410, specifically, on the power connection terminal 411 of the device body 410. For example, the fixing bracket 420 can be bonded to the outer wall surface of the power connection terminal 411. The fixing bracket 420 is connected to the circuit board 500 to position the device body 410, fix the power connection terminal 411 of the device body 410 on the surface of the circuit board 500, ensure the power connection terminal 411 of the device body 410 and the circuit board 500 are securely connected, and also position the plug-in terminal 412 of the device body 410.

[0128] As shown in Figures 12 or 13, in addition to the interface device 400, other devices are also provided on the circuit board 500 (e.g., a sub-board) near the frame portion 120 in the receiving cavity 11. For example, the circuit board 500 is also provided with devices such as a BTB (Board-to-board) connector, a coaxial cable 800, and a spring 900. The BTB connector 700 is used to connect the circuit board 500 to other components in the receiving cavity 11. For example, the circuit board 500 is connected to other circuit boards (e.g., a main board) via the BTB connector 700. The coaxial cable 800 can be connected between the circuit board 500 (e.g., a sub-board) and other circuit boards (e.g., a main board) to transmit signals between the two. The spring 900 is used to clamp and fix some devices on the circuit board 500.

[0129] Figure 14 is a partial structural diagram of another housing assembly provided in an embodiment of the present application; Figure 15 is a cross-sectional view of the housing assembly in Figure 14 taken at position CC. Referring to Figures 14 and 15 , the partial structure of the housing assembly 10 of a foldable electronic device near the hinge 10c is shown. While the figures use the first housing 10a or the second housing 10b on one side of the hinge 10c as an example, it should be understood that the structures of the first housing 10a and the second housing 10b can be symmetrical, and the structures of the connection portions of the first housing 10a and the second housing 10b to the hinge 10c can be identical.

[0130] Both the first shell 10a and the second shell 10b may include a middle frame 100 and a back cover 200 (see FIG6 ). For an inward-folding electronic device, the back cover 200 of the first shell 10a or the second shell 10b may also be replaced by a second display screen 20b. The back cover 200 is used as an example for illustration. The middle frame 100 may include a middle plate portion 110 and a frame portion 120. The middle plate portion 110 is connected to the side of the frame portion 120 facing away from the back cover 200. The frame portion 120 and the back cover 200 are bonded together by an adhesive layer 300. The middle plate portion 110, the frame portion 120, and the back cover 200 together form a receiving cavity 11. The adhesive layer 300 may be the aforementioned solid film layer or liquid solidified layer.

[0131] As shown in FIG14 , the side of the frame portion 120 of the middle frame 100 connected to the rotating shaft 10 c generally includes a side wall 124 and an extension wall 125 that are sequentially connected to the middle plate portion 110. The side wall 124 extends from the middle plate portion 110 toward the back cover 200. For example, the side wall 124 extends toward the back cover 200 in a direction perpendicular to the middle plate portion 110. The extension wall 125 extends along the plane of the back cover 200 and extends toward the edge of the back cover 200. The edge area of ​​the back cover 200 is supported on the extension wall 125 of the frame portion 120. The side wall 124 of the frame portion 120, the middle plate portion 110, and the back cover 200 together enclose the receiving cavity 11.

[0132] The middle frame 100 is connected to the hinge 10c via an extended wall 125 of its frame portion 120. Because of the need to connect to the hinge 10c, the extended wall 125 of the frame portion 120 typically also has a bottleneck portion 121. The bottleneck portion 121 exists because it needs to connect to the hinge 10c. The spacing between the bottleneck portion 121 and the front surface of the middle plate portion 110 (the side of the middle plate portion 110 facing away from the rear cover 200) must meet the connection space requirements of the hinge 10c. Furthermore, the wall thickness of the bottleneck portion 121 must meet structural strength requirements to ensure a secure connection between the middle frame 100 and the hinge 10c.

[0133] Therefore, sufficient spacing should be maintained between the bottleneck portion 121 and the front surface of the middle plate portion 110 to accommodate the installation space requirements for the hinge 10c. Furthermore, the bottleneck portion 121 should have sufficient wall thickness. The wall thickness of the bottleneck portion 121 should be ≥ a predetermined thickness, which is the minimum thickness required by the design. This ensures sufficient strength for the extension wall 125 and ensures the stability and reliability of the connection between the middle frame 100 and the hinge 10c.

[0134] Similar to the joint portion 122 provided on the hole wall of the insertion hole 123 facing the back cover 200, as shown in Figure 14 or Figure 15, in order to reduce the gap between the back cover 200 and the frame portion 120 of the middle frame 100, in this embodiment, a joint portion 122 is designed on the extension wall 125 of the frame portion 120 in an area avoiding the bottleneck portion 121. The adhesive layer 300 is carried by the joint portion 122. In other words, the section of the adhesive layer 300 passing through the frame portion 120 (facing the side of the rotating shaft 10c) is located on the joint portion 122. Compared with the bottleneck portion 121, the joint portion 122 is recessed toward the side away from the back cover 200, and the surface of the joint portion 122 facing the back cover 200 is lower than the surface of the bottleneck portion 121 facing the back cover 200.

[0135] By providing a joint portion 122 recessed in the bottleneck portion 121, the adhesive layer 300 is connected to the joint portion 122, and the adhesive layer 300 at least partially occupies the wall thickness of the extended wall 125 of the frame portion 120. That is, the adhesive layer 300 can reuse the space of the extended wall 125 in the thickness direction of the electronic device 1 (the Z direction shown in Figure 15), thereby reducing the thickness space occupied by the adhesive layer 300 and the gap between the back cover 200 and the frame portion 120, thereby reducing the overall thickness of the electronic device 1.

[0136] Furthermore, because the joint 122 avoids the bottleneck portion 121 on the extended wall 125 of the frame portion 120, the joint 122 will not affect the connection between the frame portion 120 and the hinge 10c, and the bottleneck portion 121 can maintain the required wall thickness without affecting the structural strength of the extended wall 125, thereby ensuring a stable and secure connection between the frame portion 120 and the hinge 10c. Therefore, by providing the joint 122 on the extended wall 125 of the frame portion 120 as the bearing portion of the adhesive layer 300, the thickness of the entire device can be reduced while ensuring that the adhesive layer 300 securely connects the middle frame 100 and the back cover 200 and ensures the waterproof effect of the entire device. For example, the thickness of the entire device can be reduced by 0.2-0.3 mm, which contributes to the development of lighter and thinner electronic devices 1.

[0137] 15, similar to the location of the plug hole 123 on the frame portion 120, for a foldable electronic device, in this embodiment, the bottleneck portion 121 on the extended wall 125 of the frame portion 120 facing the back cover 200 is defined as a first positioning surface 1211, and the side surface of the joint portion 122 facing the back cover 200 is defined as a second positioning surface 1221. The second positioning surface 1221 is recessed in the first positioning surface 1211, and the second positioning surface 1221 is recessed in the first positioning surface 1211. Compared with the first positioning surface 1211, the adhesive layer 300 is away from the back cover 200, so that the adhesive layer 300 can reuse the space of the extension wall 125 in the thickness direction of the electronic device 1. The adhesive layer 300 at least partially occupies the wall thickness of the extension wall 125, reducing the thickness of the adhesive layer 300 protruding on the first positioning surface 1211, and even the adhesive layer 300 is completely located in the wall thickness space of the extension wall 125. The adhesive layer 300 is flush with the first positioning surface 1211 or recessed in the first positioning surface 1211.

[0138] The distance between the second positioning surface 1221 of the joint portion 122 and the first positioning surface 1211 of the bottleneck portion 121 should be ≤ the thickness of the adhesive layer 300. For example, the distance between the second positioning surface 1221 of the joint portion 122 and the first positioning surface 1211 of the bottleneck portion 121 can be ≥ 1 / 2 of the thickness of the adhesive layer 300. For example, the distance between the second positioning surface 1221 of the joint portion 122 and the first positioning surface 1211 of the bottleneck portion 121 can be ≥ 2 / 3, 3 / 4, or 4 / 5 of the thickness of the adhesive layer 300, etc., which will not be further described here.

[0139] Because the rotating shaft 10c is connected between the middle frame 100 of the first shell 10a and the middle frame 100 of the second shell 10b, the bottleneck portion 121 on the extended wall 125 of the frame portion 120 is generally located at the edge region, while the joint portion 122 is located on the side of the bottleneck portion 121 facing away from the edge of the extended wall 125. On this basis, the joint portion 122 can be adjacent to the bottleneck portion 121, and the side of the joint portion 122 facing the receiving cavity 11 can be in communication with the receiving cavity 11. For example, the area where the joint portion 122 is located can be processed into a flat plate-shaped structure, and the plane where the joint portion 122 is located extends to the side of the frame portion 120 that is in communication with the receiving cavity 11. This will not be further described here.

[0140] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0141] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of this application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

Claims

1. A housing assembly, It is characterized in that include: Back cover; The middle frame has a joint portion on a side facing the back cover, the joint portion avoids the bottleneck portion of the middle frame, and the joint portion is recessed toward a side away from the back cover compared to the bottleneck portion; The adhesive layer is arranged between the back cover and the middle frame and passes through the area where the joint is located.

2. The housing assembly according to claim 1, It is characterized in that The bottleneck portion is located at an edge region of the middle frame, and the joint portion is adjacent to a side of the bottleneck portion that is away from an edge of the middle frame.

3. The housing assembly according to claim 2, It is characterized in that The side surface of the bottleneck facing the back cover is a first positioning surface, the side surface of the joint facing the back cover is a second positioning surface, and the distance between the second positioning surface and the first positioning surface is greater than or equal to 1 / 2 of the thickness of the adhesive layer.

4. The housing assembly according to any one of claims 1 to 3, It is characterized in that The middle frame includes a middle plate portion and a frame portion, the frame portion is arranged around the periphery of the middle plate portion, and the middle plate portion, the frame portion and the back cover together form a receiving cavity; Wherein, the joint portion and the bottleneck portion are both located on the frame portion.

5. The housing assembly according to claim 4, It is characterized in that The housing assembly comprises a first housing and a second housing, wherein the first housing and the second housing both comprise the middle frame and the adhesive layer; The housing assembly further comprises: The rotating shaft is connected between the middle frame of the first shell and the middle frame of the second shell, and the joint portion and the bottleneck portion are both located in the area of ​​the frame portion corresponding to the rotating shaft.

6. The housing assembly according to claim 5, It is characterized in that The frame portion includes a side wall and an extension wall which are sequentially connected to the middle plate portion, the side wall extends toward the back cover, and the extension wall extends toward the edge of the back cover along the plane direction of the back cover; Wherein, the extended wall has the joint portion and the bottleneck portion.

7. The housing assembly according to any one of claims 4 to 6, It is characterized in that The frame portion is provided with a plug hole, an interface device is installed in the plug hole, and the interface device is configured to be connected to an external device; Wherein, a hole wall on one side of the plug hole facing the rear cover has the bottleneck portion and the joint portion.

8. The housing assembly according to claim 7, It is characterized in that The interface device comprises a device body, and in the direction from the receiving cavity to the plug hole, the device body comprises a power connection end and a plug connection end connected in sequence, the power connection end is connected to a circuit board arranged in the receiving cavity, and the plug connection end is used to connect to the external device; The bottleneck portion corresponds to the area where the plug-in terminal is located; the joint portion corresponds to the area where the connection portion between the plug-in terminal and the power terminal is located, or the joint portion corresponds to the area where the power terminal is located.

9. The housing assembly according to claim 8, It is characterized in that An inserting cavity is formed between the outer wall surface of the inserting end and the hole wall of the inserting hole, and the inserting cavity is used for inserting the external device.

10. The housing assembly according to claim 9, It is characterized in that A sealing member is provided on the outer wall surface of the device body, and the sealing member is in close contact with the hole wall of the plug hole.

11. The housing assembly according to claim 10, It is characterized in that A positioning boss is extended inwardly from the hole wall of the plug hole, and the sealing member is in close contact with the positioning boss.

12. The housing assembly according to claim 11, It is characterized in that The positioning boss is located in the area where the joint portion is located.

13. The housing assembly according to any one of claims 8 to 12, It is characterized in that The interface device also includes a fixing frame, which is sleeved on the device body and connected to the circuit board.

14. The housing assembly according to any one of claims 7 to 13, It is characterized in that The adhesive layer has a concave section protruding toward the receiving cavity at the location of the plug hole.

15. The housing assembly according to any one of claims 1 to 14, It is characterized in that The adhesive layer is a solid film layer or a liquid solidified layer.

16. An electronic device, It is characterized in that It comprises a display screen and a shell assembly according to any one of claims 1 to 15, wherein the display screen is connected to the shell assembly.

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