Waterproof support and electronic device comprising same

Abstract

More specifically, a waterproof bracket and an electronic device including the same are disclosed. An electronic device including at least one electrical component of the present invention may include a button exposed to an outside of the electronic device and configured to receive an input from a user, a button cable electrically connected to the button and configured to transmit an input signal from the button, and a waterproof bracket having a first surface in a region exposed to moisture introduced from outside of the electronic device and a second surface in a region not exposed to moisture. The waterproof bracket may include a mounting portion formed such that the electrical component is disposed thereon, and a cable hole formed to extend through the waterproof bracket from the first surface to the second surface, and the button cable may extend through the cable hole to extend toward a location where the second surface is located.

Description

Technical Field

[0001] Various embodiments disclosed herein relate to an electronic device providing a waterproof function, and more particularly, to a waterproof bracket and an electronic device including the waterproof bracket. Background Art

[0002] When used in various environments, electronic devices may be exposed to moisture from the outside. Moisture may cause malfunctions or failures, such as short circuits in the electronic device's internal circuits, transmission errors, and corrosion. Therefore, various waterproofing methods have been applied to electronic devices.

[0003] An electronic device may include physical buttons for controlling various operations. For example, an electronic device may include buttons for operating certain functions, such as a volume adjustment button, a power button, and / or an AI assistant. In various embodiments, the physical buttons may incorporate various biometric signal sensors, such as a fingerprint sensor. Because the aforementioned physical buttons may allow moisture to enter from the outside, various waterproofing measures may be applied to address this issue. Summary of the Invention

[0004] Solution to the problem

[0005] To accommodate the aforementioned buttons, the electronic device may have a button mounting space provided therein. The button can be inserted into the electronic device from the inside through this space and assembled so that it is exposed to the outside through a button hole provided in a side surface of the electronic device housing. In this case, since this space remains empty after the button device is assembled, a waterproof bracket can be placed in this space to prevent liquid (e.g., water) introduced from outside the electronic device through the button hole from entering the interior of the electronic device. However, since the waterproof bracket has no function other than supporting the button and providing waterproofing, this waterproofing may create a dead space.

[0006] Various embodiments of the present disclosure may provide a structure configured to reduce the dead space in the housing caused by assembling a button device to the housing while maintaining the waterproofness of the housing. For example, the dead space generated in the housing may be reduced by minimizing the space used to assemble the button device.

[0007] In view of the foregoing, an electronic device according to the present disclosure may be an electronic device including at least one electrical component. The electronic device may include a button exposed to the outside of the electronic device and configured to receive input from a user, a button cable electrically connected to the button and configured to transmit the button's input signal, and a waterproof bracket having a first surface located in an area exposed to moisture introduced from the outside of the electronic device and a second surface located in an area not exposed to moisture. The waterproof bracket may include a mounting portion and a cable hole, the mounting portion being configured to allow the electrical component to be placed therein, and the cable hole being formed from the first surface through the waterproof bracket to the second surface. The button cable may extend through the cable hole toward a position on the second surface.

[0008] In various embodiments, the waterproof bracket may include a cable sealing member configured to seal the cable hole.

[0009] In various embodiments, the waterproof bracket may include a seal at a boundary between the first surface and the second surface.

[0010] In various embodiments, the mounting portion may include a recess having an opening on the second surface and configured to receive the electrical component.

[0011] In various embodiments, the electrical component may include a cable extending from the recess through the opening to the interior of the electronic device.

[0012] In various embodiments, the electrical component may include a directional antenna, which may be configured to radiate a signal toward the opening.

[0013] In various embodiments, at least a portion of a region of the mounting portion that contacts the electrical component may be made of a metal material.

[0014] In various embodiments, the electronic device may include a first thermal interface located on a surface of the mounting portion that contacts the electrical component.

[0015] In various embodiments, the electronic device may include a frame made of a metal material, and at least a portion of a region of the waterproof bracket facing the frame may be made of the metal material.

[0016] In various embodiments, the electronic device may include a second thermal interface located between the waterproof bracket and the frame in an area where the waterproof bracket faces the frame.

[0017] In various embodiments, the second thermal interface may include a thermally conductive adhesive tape.

[0018] According to various embodiments of the present disclosure, a waterproof bracket may be a waterproof bracket for an electronic device, the electronic device including at least one electrical component, a button, and a button cable located therein and providing a waterproof function. The waterproof bracket may include a first surface located in an area exposed to moisture introduced from outside the electronic device, a second surface located in an area not exposed to moisture, a mounting portion configured to allow the electrical component to be placed therein, and a cable hole provided through the waterproof bracket from the first surface to the second surface. The cable hole may be configured to allow the button cable to pass from the first surface to the second surface.

[0019] In various embodiments, the waterproof bracket may include a cable sealing member configured to seal the cable hole.

[0020] In various embodiments, the waterproof bracket may include a seal at a boundary between the first surface and the second surface.

[0021] In various embodiments, the mounting portion may include a recess having an opening on the second surface and configured to receive the electrical component.

[0022] In various embodiments, the electrical component may include a directional antenna, and the opening may be configured to provide a radiation path in a direction in which the directional antenna radiates a signal.

[0023] In various embodiments, at least a portion of a region of the mounting portion that contacts the electrical component may be made of a metal material.

[0024] In various embodiments, the waterproof bracket may include a first thermal interface located on a surface of the mounting portion that contacts the electrical component.

[0025] In various embodiments, the electronic device may include a frame made of a metal material, at least a portion of a region of the waterproof bracket facing the frame may be made of the metal material, and the waterproof bracket may include a second thermal interface located between the waterproof bracket and the frame in the region where the waterproof bracket faces the frame.

[0026] According to the present disclosure, the waterproof bracket can close the opening of the housing for placing the button, thereby maintaining the waterproofness of the housing. In addition, by placing the electrical components in the waterproof bracket, the dead space occupied by the waterproof bracket can be reduced.

[0027] Meanwhile, effects obtainable from the present disclosure are not limited to the above-mentioned effects, and those having ordinary skill in the art to which the present disclosure pertains may clearly understand other effects that are not mentioned from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In conjunction with the description of the drawings, the same or similar components may be denoted by the same or similar reference numerals.

[0029] Figure 1 is a block diagram of an electronic device according to an embodiment of the present disclosure in a network environment.

[0030] Figure 2a is a front perspective view of an electronic device according to an embodiment of the present disclosure.

[0031] Figure 2b According to an embodiment of the present disclosure Figure 2a A rear perspective view of an electronic device.

[0032] Figure 3 According to an embodiment of the present disclosure Figure 2a An exploded perspective view of an electronic device.

[0033] Figures 4a to 4f A portable electronic device having an inner folder type housing structure according to an embodiment is shown.

[0034] Figure 5a is an exploded perspective view illustrating a portion of an electronic device according to various embodiments of the present disclosure.

[0035] Figure 5b is a cross-sectional view illustrating a portion of an electronic device according to various embodiments.

[0036] Figure 6a is a perspective view illustrating a waterproof bracket and electrical components according to various embodiments of the present disclosure.

[0037] Figure 6b is a cross-sectional view of an electronic device illustrating an arrangement of a waterproof bracket according to various embodiments of the present disclosure.

[0038] Figure 6c is a cross-sectional view illustrating a waterproof bracket according to various embodiments of the present disclosure.

[0039] Figure 6d is a cross-sectional view illustrating a waterproof bracket according to various embodiments of the present disclosure. DETAILED DESCRIPTION

[0040] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but rather include various changes, equivalents, or replacements for the corresponding embodiments.

[0041] For the description of the drawings, like reference numerals may be used to refer to like or related elements. It will be understood that singular forms of nouns corresponding to terms may include one or more items unless the relevant context clearly indicates otherwise.

[0042] As used herein, each of phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B, and C,” and “at least one of A, B, or C” may include all possible combinations of items listed together with a corresponding one of the plurality of phrases. As used herein, terms such as “first” and “second” or “first” and “second” may be used to simply distinguish a corresponding component from another component and do not limit the components in other respects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with another element (e.g., a second element)”, “coupled to another element (e.g., a second element)”, “connected with another element (e.g., a second element)”, or “connected to another element (e.g., a second element)”, with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0043] Figure 1 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Figure 1 In the network environment 100, the electronic device 101 can communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or can communicate with at least one of the electronic device 104 and the server 108 via a second network 199 (e.g., a long-range wireless communication network). Depending on the embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. Depending on the embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the aforementioned components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) may be implemented as a single integrated component (eg, display module 160 ).

[0044] The processor 120 may execute, for example, software (e.g., program 140) to control at least one other component of the electronic device 101 connected to the processor 120 (e.g., a hardware component or a software component), and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the commands or data stored in the volatile memory 132, and store the resulting data in the non-volatile memory 134. Depending on the embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or integrated with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121 or be adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0045] When the main processor 121 is inactive (e.g., sleeping), the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). Alternatively, when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 may work with the main processor 121 to control at least some of the functions or states associated with at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component functionally related to the auxiliary processor 123 (e.g., the camera module 180 or the communication module 190). Depending on the embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0046] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134.

[0047] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0048] The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0049] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0050] The display module 160 can visually provide information to the outside of the electronic device 101 (e.g., a user). The display device 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. Depending on the embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of the force caused by the touch.

[0051] The audio module 170 can convert sound into an electrical signal, and vice versa. Depending on the embodiment, the audio module 170 can obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0052] The sensor module 176 can detect the operating state of the electronic device 101 (e.g., power or temperature) or the environmental state outside the electronic device 101 (e.g., the state of the user), and then generate an electrical signal or data value corresponding to the detected state. Depending on the embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0053] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the interface 177 may include, for example, a High-Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

[0054] The connection end 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102). Depending on the embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0056] The camera module 180 may capture still images or moving images. Depending on the embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

[0057] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0058] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module 190 can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and support direct (e.g., wired) communication or wireless communication. Depending on the embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 may identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0060] The wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (e.g., New Radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance in high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0061] Antenna module 197 can transmit or receive signals or power to or from an external device (e.g., an external electronic device) outside of electronic device 101. Depending on the embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). Depending on the embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for the communication scheme used in a communication network (e.g., first network 198 or second network 199) may be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. Depending on the embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may also be formed as part of antenna module 197.

[0062] According to various embodiments, antenna module 197 may form a millimeter wave antenna module. According to embodiments, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., array antennas). The RFIC is disposed on or adjacent to a first surface (e.g., the bottom surface) of the printed circuit board and is capable of supporting a designated high-frequency band (e.g., the millimeter wave band). The multiple antennas are disposed on or adjacent to a second surface (e.g., the top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the designated high-frequency band.

[0063] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, general purpose input output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and communicatively transfer signals (e.g., commands or data) therebetween.

[0064] According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type than the electronic device 101. According to an embodiment, all or some operations to be executed on the electronic device 101 may be executed on one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or execute another function or service related to the request, and transmit the results of the execution to the electronic device 101. The electronic device 101 may provide the results as at least a partial response to the request, either with or without further processing. To this end, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technologies may be used, for example. Electronic device 101 may use distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server that utilizes machine learning and / or neural networks. Depending on the embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be used for intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0065] Figure 2a 1 is a perspective view showing a front surface of a mobile electronic device 200 according to an embodiment, Figure 2b Shown Shown Figure 2a 2 is a perspective view of the rear surface of the mobile electronic device 200 shown in FIG.

[0066] Reference Figure 2a and Figure 2bMobile electronic device 200 may include a housing 210, wherein housing 210 includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and side surfaces 210C surrounding the space between first and second surfaces 210A, 210B. Housing 210 may refer to a structure forming a portion of first, second, and side surfaces 210C. First surface 210A may be formed by a front panel 202, at least a portion of which is substantially transparent (e.g., a glass panel or polymer panel coated with various coatings). Second surface 210B may be formed by a substantially opaque rear panel 211. Rear panel 211 may be formed, for example, from coated or tinted glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. Side surfaces 210C may be formed by a side frame structure (or "side member") 218, which is bonded to front panel 202 and rear panel 211 and comprises metal and / or polymer. The rear panel 211 and the side frame structure 218 may be integrally formed and may be the same material (eg, a metal material such as aluminum).

[0067] The front panel 202 may include two first regions 210D, respectively arranged at its long edges, that curve and extend seamlessly from the first surface 210A toward the rear panel 211. Similarly, the rear panel 211 may include two second regions 210E, respectively arranged at its long edges, that curve and extend seamlessly from the second surface 210B toward the front panel 202. The front panel 202 (or rear panel 211) may include only one of the first regions 210D (or second regions 210E). Either the first region 210D or the second region 210E may be partially omitted. When viewed from the side of the mobile electronic device 200, the side frame structure 218 may have a first thickness (or width) on the side not including the first region 210D or the second region 210E, and may have a second thickness, which is less than the first thickness, on the other side including the first region 210D or the second region 210E.

[0068] The mobile electronic device 200 may include at least one of the following items: a display 201, audio modules 203, 207, and 214, sensor modules 204, 216, and 219, camera modules 205, 212, and 213, a key input device 217, a light emitting device, and connector holes 208 and 209. The mobile electronic device 200 may omit at least one of the above components (for example, the key input device 217 or the light emitting device), or may further include other components.

[0069] For example, the display 201 may be exposed through a majority of the front panel 202. At least a portion of the display 201 may be exposed through the front panel 202 forming the first area 210D of the first surface 210A and the side surface 210C. The outline (i.e., edges and corners) of the display 201 may have substantially the same shape as the outline of the front panel 202. The spacing between the outline of the display 201 and the outline of the front panel 202 may be substantially constant, thereby expanding the exposed area of the display 201.

[0070] A recess or opening may be formed in a portion of the display area of the display 201 to accommodate at least one of the audio module 214, sensor module 204, camera module 205, and a light-emitting device. At least one of the audio module 214, sensor module 204, camera module 205, fingerprint sensor 216, and light-emitting element may be disposed on the backside of the display area of the display 201. The display 201 may be combined with or adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. At least a portion of the sensor modules 204 and 219 and / or at least a portion of the key input device 217 may be disposed in the first area 210D and / or the second area 210E.

[0071] Audio modules 203, 207, and 214 may correspond to microphone hole 203 and speaker holes 207 and 214, respectively. Microphone hole 203 may include a microphone for capturing external sound, and in this case, may include multiple microphones for sensing the direction of the sound. Speaker holes 207 and 214 may be categorized as an external speaker hole 207 and a call receiver hole 214. Microphone hole 203 and speaker holes 207 and 214 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without speaker holes 207 and 214.

[0072] Sensor modules 204, 216, and 219 can generate electrical signals or data corresponding to the internal operating state of the mobile electronic device 200 or external environmental conditions. Sensor modules 204, 216, and 219 may include a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on the first surface 210A of the housing 210, and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module 216 (e.g., a fingerprint sensor) disposed on the second surface 210B of the housing 210. The fingerprint sensor may be disposed on both the second surface 210B and the first surface 210A (e.g., the display 201) of the housing 210. The electronic device 200 may also include at least one of the following sensors: a gesture sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0073] The camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the electronic device 200, and a second camera device 212 and / or a flash 213 disposed on a second surface 210B. The camera module 205 or the camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. The flash 213 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one side of the electronic device 200.

[0074] The key input device 217 may be arranged on the side surface 210C of the housing 210. The mobile electronic device 200 may not include some or all of the key input devices 217 described above, and the key input devices 217 not included may be implemented in another form such as soft keys on the display 201. The key input device 217 may include a sensor module 216 arranged on the second surface 210B of the housing 210.

[0075] A light emitting device may be disposed on the first surface 210A of the housing 210. For example, the light emitting device may provide status information of the electronic device 200 in an optical form. The light emitting device may provide a light source associated with the operation of the camera module 205. The light emitting device may include, for example, a light emitting diode (LED), an IR LED, or a xenon lamp.

[0076] The connector holes 208 and 209 may include a first connector hole 208 and / or a second connector hole 209, wherein the first connector hole 208 is suitable for a connector for sending power and / or data to an external electronic device and receiving power and / or data from an external electronic device (e.g., a USB connector), and the second connector hole 209 is suitable for a connector for sending audio signals to an external electronic device and receiving audio signals from an external electronic device (e.g., a headphone jack).

[0077] Some of the sensor modules 205 among the camera modules 205 and 212, some of the sensor modules 204 and 219, or indicators may be arranged to be exposed through the display 201. For example, the camera module 205, the sensor module 204, or the indicator may be arranged in the interior space of the electronic device 200 so as to be in contact with the external environment through an opening punched through the front plate 202 of the display 201. In another embodiment, some of the sensor modules 204 may be arranged to perform their functions in the interior space of the electronic device without being visually exposed through the front plate 202. In this case, for example, the area of the display 201 facing the sensor modules may not require a punched opening.

[0078] According to an embodiment, the electronic device 200 has a bar-type or plate-type appearance, but the present disclosure is not limited thereto. For example, the electronic device 200 shown may be part of a foldable electronic device, a slidable electronic device, an extendable electronic device, and / or a rollable electronic device. The terms "foldable electronic device," "slidable electronic device," "extendable electronic device," and / or "rollable electronic device" may refer to electronic devices that have a display (e.g., Figure 3 Bending deformation of the display 330 in the display is possible, so that the display can be at least partially folded, rolled or rolled, at least partially expanded in area, and / or accommodated in a housing (e.g., Figure 2a and Figure 2b The foldable electronic device, the slidable electronic device, the stretchable electronic device, and / or the rollable electronic device may allow the user to use the screen display area in the expanded state by unfolding the display or exposing a larger area of the display to the outside, depending on the user's needs.

[0079] Figure 3 This is a diagram showing an embodiment of the present disclosure. Figure 1 An exploded perspective view of an electronic device.

[0080] Reference Figure 3 , the electronic device 300 (eg, Figure 1The electronic device 100 may include a side frame structure 310, a first support member 311 (e.g., a bracket), a front panel 320, a display 330 (e.g., the display 101), a printed circuit board (PCB) 340, a battery 350, a second support member 360 (e.g., a back cover), an antenna 370, and a back panel 380. In various embodiments, the electronic device 300 may omit at least one of the above components (e.g., the first support member 311 or the second support member 360), or may further include another component. Some components of the electronic device 300 may be identical to those of the display 101. Figure 1 2. The components of the electronic device 100 are the same as or similar to those of the electronic device 100 shown in FIG. 2, and thus description thereof is omitted below.

[0081] The first support member 311 is disposed within the electronic device 300 and may be connected to or integrated with the side frame structure 310. The first support member 311 may be formed, for example, of a metal material and / or a non-metallic material (e.g., a polymer). The first support member 311 may be coupled to the display 330 on one side and to the PCB 340 on the other side.

[0082] A processor, memory, and / or interface may be mounted on the PCB 340. The processor may include, for example, one or more of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP).

[0083] The memory may include, for example, volatile memory or non-volatile memory.

[0084] The interface may include, for example, a High-Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 300 to an external electronic device and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0085] The battery 350 is a device for supplying power to at least one component of the electronic device 300 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 350 may be disposed on substantially the same plane as the PCB 340. The battery 350 may be integrally disposed within the electronic device 300 and may be detachably disposed from the electronic device 300.

[0086] Antenna 370 may be disposed between rear panel 380 and battery 350. Antenna 370 may include, for example, a near-field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. Antenna 370 may perform short-range communication with external devices or transmit and receive power required for wireless charging. The antenna structure may be formed by a portion or a combination of the side frame structure 310 and / or the first support member 311.

[0087] Figures 4a to 4f A portable electronic device 400 having an inner folding housing structure according to an embodiment is shown. Specifically, Figure 4a and Figure 4b shows a front surface of a foldable portable electronic device (hereinafter, simply referred to as an electronic device) in an unfolded (or flat or open) state according to various embodiments, Figure 4c shows the rear surface of the electronic device in a folded (or closed) state, Figure 4d shows a rear view of the electronic device in an unfolded state, Figure 4e shows the front surface of the electronic device in a partially folded state (in other words, a partially unfolded state, or an intermediate state (free rest state) between the fully folded state and the fully unfolded state), Figure 4f It is an exploded perspective view of an electronic device.

[0088] Reference Figures 4a to 4f , the portable electronic device 400 (eg, Figure 1 The electronic device 101 in the embodiment may include a first housing 410, a second housing 420, a hinge assembly 440 interconnecting the first housing 410 and the second housing 420 so that the second housing 420 is rotatable relative to the first housing 410, a flexible or foldable display 499 provided in a space defined by the foldable housings 410 and 420, and a sensor module (e.g., Figure 1 sensor module 176 in).

[0089] The display 499 can be disposed from the first housing 410 to the second housing 420 across the hinge assembly 440. The display 499 can be divided into a first display area 411 disposed within the interior space of the first housing 410 and a second display area 421 disposed within the interior space of the second housing 420, with reference to the folding axis A. When viewing the front surface from the front, a sensor module (e.g., an illumination sensor) can be disposed below a sensor area (or light-transmitting area) 442a of the first display area 411. The position and / or size of the sensor area 442a in the first display area 411 can be determined by the position and / or size of the illumination sensor disposed therebelow. For example, the size (e.g., diameter) of the sensor area 442a can be determined based on the field of view (FOV) of the illumination sensor. In embodiments, the sensor area 442a can be configured to have a lower pixel density and / or wiring density than that in its surroundings to improve light transmittance. In some embodiments, the display 499 may include a transparent material and a protective layer 498 configured to protect the panel layers from external foreign matter and impact.

[0090] The hinge assembly 440 may be implemented as an inward folding type that enables the two display areas 411 and 421 to be hinged when the portable electronic device 400 is opened from an unfolded state (eg, Figure 4a ) to the collapsed state (e.g., Figure 4c The hinge assembly 440 can be configured to provide the foldable housings 410 and 420 with resistance to rotation. When an external force exceeding the resistance is applied to the foldable housings 410 and 420, the foldable housings 410 and 420 can rotate.

[0091] Based on the angle formed between the two display areas 411 and 421, the state of the electronic device 400 can be defined. For example, when the angle between the two display areas 411 and 421 is about 180 degrees, the state of the electronic device 400 can be defined as an unfolded (unfolded, flat, or open) state. When the angle between the two display areas 411 and 421 is between about 0 degrees and 10 degrees, the state of the portable electronic device 400 can be defined as a folded or closed state. When the two display areas 411 and 421 form an angle that is larger than the angle in the folded state and smaller than the angle in the unfolded state (for example, between about 10 degrees and 179 degrees), the state of the portable electronic device 400 can be defined as an intermediate state (in other words, a partially folded or partially unfolded state), such as Figure 4e shown.

[0092] The active area for displaying visual information (e.g., text, images, or icons) on the display 499 can be determined based on the state of the portable electronic device 400. For example, when the electronic device 400 is in the intermediate state, the active area can be determined as the first display area 411 or the second display area 421. The area with relatively less movement in the first display area 411 and the second display area 421 can be determined as the active area. For example, if a user holds one housing of the electronic device 400 with one hand and opens the other housing with a finger (e.g., thumb) of the same hand or another hand, the electronic device 400 can transition from the folded state to the intermediate state. As a result, the display area of the held housing (i.e., the housing with relatively less movement) can be determined as the active area. When the portable electronic device 400 is in the unfolded state, the entire area of the display 499 (e.g., both the first display area 411 and the second display area 421) can be determined as the active area.

[0093] According to various embodiments, in the unfolded state, the first housing 410 may include a first surface (first display area) 411 oriented in a first direction (e.g., the front direction) (z-axis direction) and a second surface 412 oriented in a second direction (e.g., the rear direction) (-z-axis direction), with the second surface facing away from the first surface 411. In the unfolded state, the second housing 420 may include a third surface (second display area) 421 oriented in the first direction (e.g., the z-axis direction) and a fourth surface 422 oriented in the second direction (e.g., the -z-axis direction). The electronic device 400 may be operated such that, in the unfolded state, the first surface 411 of the first housing 410 and the third surface 421 of the second housing 420 are oriented in the same first direction (e.g., the z-axis direction), and in the folded state, the first surface 411 and the third surface 421 face each other. The electronic device 400 can be operated so that in the unfolded state, the second surface 412 of the first shell 410 and the fourth surface 422 of the second shell 420 are oriented in the same second direction (-z axis direction), and in the folded state, the second surface 412 and the fourth surface 422 face away from each other.

[0094] According to various embodiments, the first housing 410 may include a first side surface frame 413 that defines at least a portion of the appearance of the electronic device 400, and a first rear surface cover 414 that is coupled to the first side surface frame 413 and defines at least a portion of the second surface 412 of the electronic device 400. According to an embodiment, the first side surface frame 413 may include a first side surface 413a, a second side surface 413b extending from one end of the first side surface 413a, and a third side surface 413c extending from the other end of the first side surface 413a. According to an embodiment, the first side surface frame 413 may have a rectangular (e.g., square or oval) shape configured with the first side surface 413a, the second side surface 413b, and the third side surface 413c.

[0095] A portion of the first side surface frame 413 may be formed of a conductor. Figure 4b , a portion of the first side surface 413a , a portion of the second side surface 413b and a portion of the third side surface 413c The conductors can be made of a metal material. The conductors can be electrically connected to grip sensors (not shown), which are disposed in the internal space of the first housing 410 adjacent to the conductors. The processor can measure the capacitance formed between the conductors and ground (e.g., the ground of the main printed circuit board) via the grip sensors, and can identify, based on the measured capacitance value, whether a dielectric body (e.g., a finger, palm, or face) is close to (or in contact with) the first housing 410, as well as the location in the first housing 410 (e.g., the first side surface 413a, the second side surface 413b, or the third side surface 413c) that is in contact with the dielectric body.

[0096] According to various embodiments, the second housing 420 may include a second side surface frame 423 that defines at least a portion of the appearance of the electronic device 400 and a second rear surface cover 424 that is coupled to the second side surface frame 423 and defines at least a portion of the fourth surface 422 of the electronic device 400. According to an embodiment, the second side surface frame 423 may include a fourth side surface 423a, a fifth side surface 423b extending from one end of the fourth side surface 423a, and a sixth side surface 423c extending from the other end of the fourth side surface 423b. According to an embodiment, the second side surface frame 423 may be provided in a rectangular shape by the fourth side surface 423a, the fifth side surface 423b, and the sixth side surface 423c.

[0097] A portion of the first side surface frame 423 may be formed of a conductor. Figure 4b , a portion of the fourth side surface 423a , a portion of the fifth side surface 423b and a portion of the sixth side surface 423c The conductors may be formed of a metal material. The conductors may be electrically connected to grip sensors (not shown) disposed in an internal space adjacent to the conductors of the second housing 420. The processor may measure the capacitance formed between the conductors and a ground (e.g., a ground of the main printed circuit board) via the grip sensors, and may identify, based on the measured capacitance values, the dielectric body approaching (or in contact with) the second housing 420 and the location in the second housing 420 in contact with the dielectric body (e.g., the fourth side surface 423a, the fifth side surface 423b, or the sixth side surface 423c).

[0098] According to various embodiments, the pair of housing structures 410 and 420 are not limited to the shapes and components shown, but can be implemented by other shapes or other combinations of components and / or components. For example, the first side surface frame 413 and the first rear surface cover 414 can be configured as a whole, and the second side surface frame 423 and the second rear surface cover 424 can be configured as a whole.

[0099] According to various embodiments, the first and second rear surface covers 414 and 424 may be made of, for example, at least one of coated or colored glass, ceramic, polymer, or metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials.

[0100] According to various embodiments, the electronic device 400 may include a first protective cover 415 (e.g., a first protective frame or a first decorative member) coupled along the periphery of the first housing 410. The electronic device 400 may include a second protective cover 425 (e.g., a second protective frame or a second decorative member) coupled along the periphery of the second housing 420. Depending on the embodiment, the first protective cover 415 and the second protective cover 425 may be made of metal or a polymer material.

[0101] According to various embodiments, the electronic device 400 may include a sub-display 431 provided separately from the display 499. According to an embodiment, the sub-display 431 is provided so as to be at least partially exposed on the second surface 412 of the first housing 410, so that when the electronic device 400 is in the folded state, the sub-display 231 can display status information of the electronic device 200. According to an embodiment, the sub-display 431 may be provided so as to be visible from the outside through at least a portion of the first rear surface cover 414. In some embodiments, the sub-display 431 may be provided on the fourth surface 424 of the second housing 420. In this case, the sub-display 431 may be provided so as to be visible from the outside through at least a portion of the second rear surface cover 424.

[0102] According to various embodiments, the electronic device 400 may include at least one of an input device 403, a sound output device 401 or 402, a camera module 405 or 408, a key input device 406, a connector port 407, and a sensor module (not shown). In an embodiment, when the front surface is viewed from the front side, the sensor module (e.g., Figure 1 The sensor module 176) and the camera 405 can be set below the display 499.

[0103] According to various embodiments, the electronic device 400 may be operated to maintain the intermediate state via the hinge assembly 440. In this case, the electronic device 400 may control the display 499 to display different contents on the display area corresponding to the first surface 411 and the display area corresponding to the third surface 421, respectively.

[0104] Reference Figure 4f According to various embodiments, the electronic device 400 may include a first side surface frame 413, a second side surface frame 423, and a hinge assembly 440 that rotatably connects the first side surface frame 413 and the second side surface frame 423 to each other. According to an embodiment, the electronic device 400 may include a first support plate 4131 extending at least partially from the first side surface frame 413 and a second support plate 4231 extending at least partially from the second side surface frame 423. According to an embodiment, the first support plate 4131 may be integrally formed with the first side surface frame 413 or may be structurally coupled to the first side surface frame 413. Similarly, the second support plate 4231 may be integrally formed with the second side surface frame 423 or may be structurally coupled to the second side surface frame 423. According to an embodiment, the electronic device 400 may include a display 499 that is provided to be supported by the first support plate 4131 and the second support plate 4231. According to an embodiment, the electronic device 400 may include a first rear surface cover 414 and a second rear surface cover 424, the first rear surface cover 414 being coupled to the first side surface frame 413 and providing a first space with the first support plate 4131, and the second rear surface cover 424 being coupled to the second side surface frame 423 and providing a second space with the second support plate 4231. In some embodiments, the first side surface frame 413 and the first rear surface cover 414 may be integral. In some embodiments, the second side surface frame 423 and the second rear surface cover 424 may be integrally formed. According to an embodiment, the electronic device 400 may include a first housing 410 provided via the first side surface frame 413, the first support plate 4131, and the first rear surface cover 414. According to an embodiment, the electronic device 400 may include a second housing 420 provided via the second side surface frame 423, the second support plate 431, and the second rear surface cover 424.

[0105] Although not shown, the hinge assembly 440 may include a first arm structure coupled to the first housing 410 (e.g., the first support plate 4231), a second arm structure coupled to the second housing 420 (e.g., the second support plate 4232), and a detent structure that physically contacts the first and second arm structures so that the first and second housings 410 and 420 have resistance to rotation. The foldable housings 410 and 420 may have resistance to rotation due to the contact force of the detent structure (e.g., a force pushing the first and second arm structures).

[0106] According to various embodiments, the electronic device 400 may include a first board assembly 461 (e.g., a main printed circuit board), a camera assembly 463, a first battery 471, or a first bracket 451 disposed in a first space between the first side surface frame 413 and the first rear surface cover 414. According to embodiments, the camera assembly 463 may include a plurality of cameras (e.g., Figure 4a and Figure 4c 405 and 408 in the hinge assembly 440) and can be electrically connected to the first board assembly 461. Depending on the embodiment, the first bracket 451 can provide a support structure for supporting the first board assembly 461 and / or the camera assembly 463, as well as improved rigidity. Depending on the embodiment, the electronic device 400 can include a second board assembly 462 (e.g., a sub-printed circuit board), an antenna 490 (e.g., a coil assembly), a second battery 472, or a second bracket 452 disposed in the second space between the second side frame 423 and the second rear cover 424. Depending on the embodiment, the electronic device 400 can include a wiring member 480 (e.g., a flexible printed circuit board (FPCB)) that is disposed across the hinge assembly 440, extending from the first board assembly 461 to a plurality of electronic components (e.g., the second board assembly 462, the second battery 472, or the antenna 490) disposed between the second side frame 423 and the second rear cover 424, and providing electrical connections.

[0107] According to various embodiments, the electronic device 400 may include a hinge cover 441 configured to support the hinge assembly 440, which is exposed to the outside when the electronic device 400 is in a folded state, and is introduced into the first space and the second space when the electronic device 200 is in an unfolded state so as not to be visible from the outside.

[0108] According to various embodiments, the electronic device 400 may include a first protective cover 415 coupled along an edge of the first side surface frame 413. According to embodiments, the electronic device 400 may include a second protective cover 425 coupled along an edge of the second side surface frame 423. In the display 499, the edge of the first display area 411 may be protected by the first protective cover 415. The edge of the second display area 421 may be protected by the second protective cover 425. A protective cap 435 may be provided in an area corresponding to the hinge assembly 440 to protect the curved portion of the edge of the display 499.

[0109] Figure 5a is an exploded perspective view illustrating a portion of an electronic device 500 according to various embodiments of the present disclosure.

[0110] Figure 5b is a cross-sectional view illustrating a portion of an electronic device 500 according to various embodiments of the present disclosure.

[0111] Reference Figure 5a and Figure 5b , according to various embodiments of the present disclosure, electronic devices (e.g., Figure 1 electronic device 101, Figures 2a to 3 The electronic device 200 and Figures 4a to 4f The electronic device 400 may include a button 510 and a waterproof bracket 520. The button 510 may include an input device that is physically operated by a user to adjust various functions, such as the power, volume, or AI assistant of the electronic device 500. In various embodiments, the button 510 may be integrated with a biometric sensor (such as a fingerprint sensor). For example, as shown in the drawings described later, the button 510 may be a button module 510 in which components such as a key 511, a fingerprint sensor 513 provided on the surface of the key 511, a circuit board 514 that drives the fingerprint sensor 513, a switch 515, and a button cable 512 are modularized and integrated. In various embodiments, the button module 510 may be waterproof to prevent internal components from being damaged by moisture.

[0112] In various embodiments, the housing 501 of the electronic device 500 (eg, Figures 2a to 3 The housing 501 of the electronic device 500 may have a button hole 502. During assembly of the electronic device 500, the button 510 can be inserted from the interior of the electronic device and exposed to the exterior of the housing 501 of the electronic device 500 through the button hole 502. For example, because the button module 510 integrates each component into a single module, it may be difficult to separately assemble keys and switches from inside and outside the housing 501 of the electronic device 500. Therefore, the button module 510 can be assembled from the interior of the electronic device 500.

[0113] The waterproof bracket 520 may be a member that blocks or reduces the inflow of liquid impurities (such as moisture) introduced through the button hole 502. In various embodiments, the waterproof bracket 520 may be fixed to the housing 501 and / or the frame 503 of the electronic device 500 by a fixing member 504. The detailed configuration of the waterproof bracket 520 will be described later.

[0114] Figure 6a is a perspective view illustrating a waterproof bracket 520 and an electric component 530 according to various embodiments of the present disclosure.

[0115] Figure 6b is a cross-sectional view of an electronic device 500 illustrating the arrangement of a waterproof bracket 520 according to various embodiments of the present disclosure.

[0116] Figure 6c is a cross-sectional view illustrating a waterproof bracket 520 according to various embodiments of the present disclosure.

[0117] Figure 6d is a cross-sectional view illustrating a waterproof bracket 520 according to various embodiments of the present disclosure.

[0118] Figure 6b and Figure 6c The cross section corresponds to the Figure 5b The cutting plane intercepted by the direction A-A', Figure 6d The cross section corresponds to the Figure 6a The cutting plane intercepted in the direction BB'.

[0119] Reference Figure 6a and Figure 6b The electronic device 500 may include a waterproof bracket 520. The waterproof bracket 520 may be a member that blocks or reduces the inflow of liquid impurities (such as moisture) introduced through the button hole 502. In various embodiments, the electronic device 500 may have a floodable area 508, which allows the inflow of liquid from the outside, and a watertight area 509, which blocks the inflow of liquid. The waterproof bracket 520 may be located between the floodable area 508 and the watertight area 509 and may serve as a member that blocks or reduces the penetration of external liquid introduced through the button hole 502 into the watertight area 509. The waterproof bracket 520 may have a first surface 520a, which is exposed to external liquid, and a second surface 520b, which is an area not exposed to external liquid, depending on whether the waterproof bracket is exposed to external liquid. For example, the first surface 520 a may be located in the floodable area 508 of the electronic device 500 , and the second surface 520 b may be located in the watertight area 509 of the electronic device 500 .

[0120] In various embodiments, the waterproof bracket 520 may include a seal 521. The seal 521 may be provided on the periphery of the waterproof bracket 520 along the boundary between the first surface 520a and the second surface 520b. The seal 521 may be provided with, for example, the housing 501 and the frame 503 (e.g., Figure 3 The electronic device 500 may be in contact with the first support member 311 and / or the second support member 360 , and may serve as a member that blocks or prevents liquid from flowing from the floodable area 508 into the watertight area 509 of the electronic device 500 .

[0121] In various embodiments, the electronic device 500 may include an electrical component 530. The electrical component 530 may include various electrical components 530 disposed within the electronic device 500, such as a communication module (eg, Figure 1 communication module 190) and / or antenna 530 (e.g., Figure 1 antenna module 197).

[0122] In various embodiments, the electrical component 530 may include a directional antenna 530. The directional antenna 530 may include, for example, a patch antenna in which a feed structure and multiple radiating elements are printed on a dielectric substrate (e.g., a printed circuit board and / or a flexible printed circuit board). The directional antenna 530 may include, for example, an antenna 530 configured to communicate in the NR / FR2 (also known as mmWave) frequency band (e.g., the 28 GHz band) in which beamforming in accordance with 5G communication standards is performed. In another embodiment, the directional antenna 530 may include an antenna 530 configured to perform beamforming as defined by standards such as IEEE 802.11ac or IEEE 802.11ax. In various embodiments, the electrical component 530 may include a cable 531. The cable 531 may include, for example, a flexible printed circuit (FPC) cable.

[0123] Reference Figure 6c In various embodiments, the waterproof bracket 520 may include a mounting portion 522. The mounting portion 522 may be a portion of the waterproof bracket 520 configured to house the electrical component 530 therein. For example, the mounting portion 522 may include a recess 522 into which a portion of the waterproof bracket 520 is recessed. In various embodiments, the recess 522 may have an opening 523. The opening 523 may be provided to open toward a surface of the waterproof bracket 520 located in the watertight region 509 (i.e., located on the second surface).

[0124] Refer again Figure 6bAt least a portion of the area of the waterproof bracket 520 that contacts the electrical component 530 (e.g., the mounting portion 522) can be made of a metal material. The metal material can absorb and transfer heat generated by the electrical component 530, thereby suppressing the temperature increase caused by the heat generated by the electrical component 530. In some embodiments, a first thermal interface 524 can be located on the surface in contact with the electrical component 530 to transfer the heat generated by the electrical component 530 to the waterproof bracket 520. The first thermal interface 524 can include, for example, a thermally conductive tape or thermally conductive paste. In some embodiments, the thermally conductive member can include a thermally conductive adhesive tape, which can secure the electrical component 530 to the mounting portion 522.

[0125] In various embodiments, the waterproof bracket 520 may be in direct or indirect contact with the frame 503 of the electronic device 500. At least a portion of the area of the waterproof bracket 520 that contacts the frame 503 of the electronic device 500 may be made of a metal material. The metal material can disperse heat transferred from the electrical component 530 to the waterproof bracket 520 toward the frame 503, thereby suppressing the temperature increase caused by heat generation in the electrical component 530. In some embodiments, the waterproof bracket 520 may be made of a composite material of metal and a synthetic resin injection molding material. In other embodiments, the waterproof bracket 520 may be formed entirely of a metal material.

[0126] In various embodiments, a second thermal interface 524 can be located between the waterproof bracket 520 and the electronic device 500. The second thermal interface 524 can include, for example, a thermally conductive tape or thermally conductive paste. In some embodiments, the thermally conductive member can include a thermally conductive adhesive tape that can secure the waterproof bracket 520 to the frame 503.

[0127] In various embodiments, directional antenna 530 can be configured to transmit and / or receive radio waves in the direction of an opening 523 formed in mounting portion 522 (e.g., recess 522). Opening 523 can be provided to create a radiation path in the direction in which directional antenna 530 transmits and / or receives radio waves. When waterproof bracket 520 is made of metal, the metal material of waterproof bracket 520 may interfere with the transmission and reception of radio waves by antenna 530. However, when directional antenna 530 is arranged to point toward opening 523, interference with the transmission / reception of radio waves by antenna 530 by waterproof bracket 520 can be prevented or minimized.

[0128] Reference Figure 6d The waterproof bracket 520 may include a cable hole 526. The cable hole 526 may be provided to pass through the waterproof bracket 520 from the first surface to the second surface. The cable hole 526 may be configured to allow a cable (such as a button cable 512 of a button 510 located in the submersible area 508 of the electronic device 500) to pass therethrough.

[0129] In various embodiments, the waterproof button module 510 can be located in the submersible area 508 of the electronic device 500. The input signal (e.g., a power on / off signal and / or a fingerprint sensor signal) generated by the operation of the button module 510 can be electrically connected to another electrical component 530 (e.g., a fingerprint sensor signal) located in the watertight area of the electronic device 500 via a button cable 512. Figure 3 of plate 340).

[0130] In various embodiments, the waterproof bracket 520 may include a cable sealing member 527 configured to seal the cable hole 526. The cable sealing member 527 may include, for example, a waterproof tape that covers and seals the cable hole 526. Although not shown, in another embodiment, the sealing of the cable hole 526 may be achieved by applying a waterproof adhesive to the interior of the cable hole 526. Thus, it is possible to prevent or minimize the inflow of external liquid into the watertight area of the electronic device 500 through the cable hole 526.

[0131] The electronic device 500 according to various embodiments of the present disclosure may include at least one electrical component 530. The electronic device 500 may include a button 510 exposed to the outside of the electronic device 500 and configured to receive input from a user, a button cable 512 electrically connected to the button 510 and configured to transmit an input signal from the button 510, and a waterproof bracket 520 having a first surface 520a located in an area exposed to moisture introduced from outside the electronic device 500 and a second surface 520b located in an area not exposed to moisture. The waterproof bracket 520 may include a mounting portion 522 configured to accommodate the electrical component 530 therein and a cable hole 526 provided through the waterproof bracket 520 from the first surface 520a to the second surface 520b. The button cable 512 may extend through the cable hole 526 toward the second surface 520b.

[0132] In various embodiments, the waterproof bracket 520 may include a cable sealing member 527 that seals the cable hole 526 .

[0133] In various embodiments, the waterproof bracket 520 can include a seal at a boundary between the first surface 520a and the second surface 520b.

[0134] In various embodiments, the mounting portion 522 may include a recess 522 having an opening 523 on the second surface 520 b and configured to receive the electrical component 530 .

[0135] In various embodiments, the electrical component 530 may include a cable 531 extending from the recess 522 to the interior of the electronic device 500 through the opening 523 .

[0136] In various embodiments, electrical component 530 may include a directional antenna 530 , which may be configured to radiate signals toward opening 523 .

[0137] In various embodiments, at least a portion of the region of the mounting portion 522 that contacts the electrical component 530 may be made of a metal material.

[0138] In various embodiments, the electronic device 500 may include a first thermal interface 524 located on a surface of the mounting portion 522 that contacts the electrical component 530 .

[0139] In various embodiments, the electronic device 500 may include a frame 503 made of a metal material, and at least a portion of a region of the bracket facing the frame 503 may be made of a metal material.

[0140] In various embodiments, the electronic device 500 may include a second thermal interface 525 located between the bracket and the frame 503 in an area where the bracket faces the frame 503 .

[0141] In various embodiments, the second thermal interface 525 may include a thermally conductive adhesive tape.

[0142] The waterproof bracket 520 according to various embodiments of the present disclosure is a waterproof bracket 520 for an electronic device 500 that includes at least one electrical component 530, a button 510, and a button cable 512 therein and provides a waterproof function. The waterproof bracket 520 may include a first surface 520a located in an area exposed to moisture introduced from outside the electronic device 500, a second surface 520b located in an area not exposed to moisture, a mounting portion 522 configured to allow the electrical component 530 to be placed therein, and a cable hole 526 provided through the waterproof bracket 520 from the first surface 520a to the second surface 520b. The cable hole 526 may be configured to allow the button cable 512 to pass from the first surface 520a to the second surface 520b.

[0143] In various embodiments, the waterproof bracket 520 may include a cable sealing member 527 that seals the cable hole 526 .

[0144] In various embodiments, the waterproof bracket 520 can include a seal at a boundary between the first surface 520a and the second surface 520b.

[0145] In various embodiments, the mounting portion 522 may include a recess 522 having an opening 523 on the second surface 520 b and configured to receive the electrical component 530 .

[0146] In various embodiments, the electrical component 530 may include a directional antenna 530 , and the opening 523 may be configured to form a radiation path in a direction in which the directional antenna 530 radiates a signal.

[0147] In various embodiments, at least a portion of the region of the mounting portion 522 that contacts the electrical component 530 may be made of a metal material.

[0148] In various embodiments, the waterproof bracket 520 may include a first thermal interface 524 located on a surface of the mounting portion 522 that contacts the electrical component 530 .

[0149] In various embodiments, the electronic device 500 may include a frame 503 formed of a metal material, and at least a portion of a region of the waterproof bracket 520 facing the frame 503 may be made of a metal material. The waterproof bracket 520 may include a second thermal interface 525 located on a surface of the waterproof bracket facing the frame 503.

[0150] Meanwhile, effects obtainable from the present disclosure are not limited to the above-mentioned effects, and those having ordinary skill in the art to which the present disclosure pertains may clearly understand other effects that are not mentioned from the following description.

Claims

1. An electronic device comprising: at least one electrical component; a button exposed on the exterior of the electronic device and configured to receive input from a user; a button cable electrically connected to the button and configured to transmit an input signal of the button; as well as A waterproof bracket having a first surface and a second surface, wherein the first surface is located in a region exposed to moisture introduced from outside the electronic device, and the second surface is located in a region not exposed to moisture. Wherein, the waterproof bracket includes: a mounting portion configured so that the electrical component is placed therein; and a cable hole provided from the first surface through the waterproof bracket to the second surface, and The button cable extends through the cable hole toward the second surface.

2. The electronic device according to claim 1, wherein The waterproof bracket includes a cable sealing member that seals the cable hole.

3. The electronic device according to claim 1, wherein The waterproof bracket includes a seal at a boundary between the first surface and the second surface.

4. The electronic device according to claim 1, wherein The mounting portion includes a recess having an opening on the second surface and configured to receive the electrical component.

5. The electronic device according to claim 4, wherein: The electrical component includes a cable extending from the recess through the opening to the interior of the electronic device. The electronic device according to claim 4 , wherein: The electrical component includes a directional antenna configured to radiate a signal toward the opening.

7. The electronic device according to claim 4, wherein: At least a portion of a region of the mounting portion that contacts the electrical component is made of a metal material, and The electronic device includes a first thermal interface, which is located on a surface of the mounting portion that contacts the electrical component.

8. The electronic device according to claim 1, wherein The electronic device includes a frame made of a metal material, wherein at least a portion of the area of the waterproof bracket facing the frame is made of metal material, and The waterproof bracket includes a second thermal interface, and the second thermal interface is located between the waterproof bracket and the frame in an area where the waterproof bracket faces the frame.

9. A waterproof bracket for an electronic device, the electronic device including at least one electrical component, a button, and a button cable therein and providing a waterproof function, the waterproof bracket comprising: a first surface located in a region exposed to moisture introduced from outside the electronic device; a second surface located in an area not exposed to moisture; a mounting portion configured to allow the electrical component to be placed therein; as well as A cable hole is provided from the first surface through the waterproof bracket to the second surface, The cable hole is configured to allow the button cable to pass from the first surface to the second surface.

10. The waterproof bracket according to claim 9, wherein: The waterproof bracket includes a seal at a boundary between the first surface and the second surface.

11. The waterproof bracket according to claim 9, wherein: The mounting portion includes a recess having an opening on the second surface and configured to receive the electrical component.

12. The electronic device according to claim 11, wherein: The electrical component includes a cable extending from the recess through the opening to the interior of the electronic device.

13. The waterproof bracket according to claim 11, wherein: The electrical components include a directional antenna, and The opening is configured to provide a radiation path in the direction of the directional antenna radiating the signal.

14. The waterproof bracket according to claim 9, wherein: At least a portion of a region of the mounting portion that contacts the electrical component is made of a metal material, and The waterproof bracket includes a first thermal interface, and the first thermal interface is located on a surface of the mounting portion that contacts the electrical component.

15. The waterproof bracket according to claim 9, wherein: The electronic device includes a frame made of a metal material, wherein at least a portion of the area of the waterproof bracket facing the frame is made of metal material, and Wherein, the waterproof bracket includes a second thermal interface, and the second thermal interface is located on the surface of the waterproof bracket facing the frame.

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