CO2 laser processing device for cutting ceramic substrate and processing method thereof

Abstract

The invention discloses a CO2 laser processing device for cutting a ceramic substrate, which is characterized by comprising a set of light path system, and the light path system comprises a radio frequency CO2 laser, a circular polarizer, a beam expander module, a beam splitter, a first reflector, a second reflector, a third reflector, a first laser cutting head and a second laser cutting head, a circular polarizer is arranged at the light path output end of the radio frequency CO2 laser, and a first reflector, a beam expander module, a second reflector, a beam splitter and a third reflector are sequentially arranged on an output light path of the circular polarizer. According to the optical path device system, a beam of light emitted by the radio frequency CO2 laser device is finally divided into two beams to form two paths of laser, the two paths of laser are focused through the two sets of laser cutting heads to form two-station machining, and the set of optical path design device can improve the cutting efficiency and the machining quality of the ceramic substrate and improve the cutting process effect of the ceramic substrate; and particularly, the unique beam expander module design can make different adjustments according to the ceramic substrates with different thicknesses so as to achieve a good scribing effect.

Description

Technical Field

[0001] The invention relates to a CO2 laser processing device for cutting ceramic substrates, belonging to the technical field of laser ceramic substrate processing. Background Art

[0002] The advent of the new century and the new millennium, especially the past two decades, has brought rapid development and progress in science and technology, with the electronics industry experiencing rapid growth. This has also led to rapid advancements in the application of materials. Ceramic substrates, as a material, are becoming increasingly widely used. Compared to metal and resin substrates, ceramic substrates offer many advantages as electronic device substrates, including outstanding electrical insulation properties, excellent high-frequency characteristics, good thermal conductivity, low thermal expansion, strong hardness, compatibility with electronic components, and stable chemical properties. Therefore, the future application of ceramics is immeasurable. Alumina and aluminum nitride ceramic substrates are currently the two most widely used ceramic substrates.

[0003] Alumina ceramics are the most mature ceramic substrate materials in terms of manufacturing and processing technology. Its main component is α-Al2O3. Alumina substrates have a very high cost-effectiveness and are currently mainly used in medium and low power fields, such as general power electronics, concentrated solar energy, Peltier components (thermoelectric semiconductor cooling devices), automotive semiconductor modules, thick film circuits, and chip component packaging. In 2013, the global ceramic substrate market size was approximately US$157 million (approximately RMB 1.07 billion). The global ceramic substrate market sales scale maintained a growth of about 4%, reaching a scale of approximately US$184 million (approximately RMB 1.2 billion) in 2017. The annual demand for alumina substrates in my country has exceeded 10 7 m 2, and is growing at a rate of 10-20% annually. Similarly, with the development and advancement of the electronics industry, the requirements for alumina substrate processing precision and efficiency are also becoming increasingly stringent. Traditional alumina substrate processing methods abound, including etching, diamond wheel cutting, wire cutting, and diamond cutting. Each of these traditional alumina substrate cutting methods presents its own challenges, such as large kerfs, low cutting precision, a large deteriorated layer of material in the processing area, surface contamination, and surface breakage, resulting in low yield rates. The most significant challenge is the inability to perform special-shaped cutting and drilling. It is precisely in this context that laser technology for ceramic substrate processing is gaining popularity. Laser ceramic cutting offers a range of advantages, including non-contact operation, small kerfs, high cutting speed, high efficiency, smooth cut surfaces, minimal damage, high yield, high precision, and ease of digital control. Lasers can also be used to scribing and half-cutting alumina substrates, significantly improving alumina substrate processing efficiency. While many laser types are essential for laser processing, RF CO2 lasers remain the primary choice for thermal processing of ceramics, based on low processing costs, beam quality, high laser absorption by materials, and adaptability to industrial development needs. Alumina ceramic substrates have a very high absorption rate for 10.6μm CO2 lasers, exceeding 80%.

[0004] At present, conventional CO2 laser ceramic processing devices in China are all single-beam and can only realize single-station processing. The processing efficiency of the processing device needs to be further improved to meet the needs of mass production. At the same time, according to the needs of different application fields of application products, the thickness of ceramic substrates is also various, and the process requirements of ceramic cutting processing are also diverse. The quality requirements for scribing, cutting and punching are also getting higher and higher. The CO2 laser cutting ceramic device and method of the present invention can perfectly meet the above requirements. Summary of the Invention

[0005] The purpose of the present invention is to overcome the shortcomings of the existing technology and provide a CO2 laser processing device for cutting ceramic substrates, aiming to improve the processing efficiency of alumina ceramic substrates and reduce the processing cost of alumina substrates. At the same time, it can be compatible with the process requirements of scribing, cutting and punching of ceramic substrates of different thicknesses, and improve the cutting and scribing process effects of alumina substrates, thereby improving the processing quality of ceramic substrates.

[0006] The purpose of the present invention is achieved through the following technical solutions: A CO2 laser processing device for cutting ceramic substrates is characterized in that: it comprises a set of optical path systems, the optical path system comprises a radio frequency CO2 laser, a circular polarizer, a beam expander module, a beam splitter, a first reflector, a second reflector, a third reflector, a first laser cutting head and a second laser cutting head, a circular polarizer is arranged at the optical path output end of the radio frequency CO2 laser, and the first reflector, the beam expander module, the second reflector, the beam splitter, the third reflector and the first laser cutting head and the second laser cutting head are arranged in sequence on the output optical path of the circular polarizer, an X / Y platform fixture is arranged below the optical path output end of the first laser cutting head and the second laser cutting head; a CO2 laser focusing lens is provided inside the first laser cutting head and the second laser cutting head, a protective lens is installed below the CO2 laser focusing lens, an aperture is installed above the CO2 laser focusing lens, a nozzle is installed at the lower mechanism of the first laser cutting head and the second laser cutting head, and an air blowing interface is provided on the outside of the cutting head, and the air flow can pass through the outside The interface is passed into the internal cavity of the cutting head and finally ejected through the nozzle. The optical path device system ultimately divides a beam of light emitted by the RF CO2 laser into two beams to form two lasers. After focusing through the first laser cutting head and the second laser cutting head, two-station processing is formed. The platform for processing the product is an X / Y platform fixture. Two ceramic substrate products can be placed on the X / Y motion platform fixture at the same time. The two stations can process products at the same time. This set of optical path design devices can improve the processing efficiency and processing quality of ceramic substrates, and improve the cutting and scribing process effects of ceramic substrates. In particular, its unique beam expander module design can easily adjust the distance between the incident lens and the output lens of the beam expander module, thereby adjusting the focusing effect of the light spot to cope with the scribing and cutting of substrates of different thicknesses with good process quality. The beam expander module consists of an incident lens, an output lens, an output lens fixing slider, a first metal slide rod, a second metal slide rod, a light outlet, an incident lens fixing block, a light outlet module and a connecting base plate.

[0007] Furthermore, the RF CO2 laser is a laser that emits a beam of laser light which is eventually split into two beams of light, and two workstations are processed simultaneously.

[0008] Furthermore, the laser light emitted by the RF CO2 laser first enters the circular polarizer, and the installation position of the circular polarizer is between 10 cm and 20 cm from the laser outlet, and the entrance of the circular polarizer is directly opposite to the laser outlet.

[0009] Furthermore, the wavelength of the RF CO2 laser is 10.6µm, and the power range of the CO2 laser transmitter is 200W to 300W.

[0010] Furthermore, a reflective lens is arranged behind the circular polarizer, and a beam expander module is arranged behind the reflective mirror. The distance between the beam expander module and the outlet of the circular polarizer is between 30 cm and 40 cm.

[0011] Furthermore, the beam expander module is composed of a metal component and two CO2 focusing lenses. One metal component contains two metal modules. The two CO2 focusing lenses are installed in the two metal modules front and back. The front and back distance of the two metal modules with lenses installed can be adjusted by sliding on two support guide rods.

[0012] Furthermore, the specifications of the two CO2 focusing lenses in the beam expander module are different. The lens diameters are 25.4mm and 38.1mm respectively, the focal lengths of the lenses are 50.8mm and 127mm respectively, and the adjustment range of the distance between the two lenses is 50mm to 200mm.

[0013] Furthermore, the installation arrangement order of the two CO2 focusing lenses in the beam expander module is that the lens with a smaller diameter serves as the front incident mirror of the laser, and the lens with a larger diameter serves as the rear output mirror of the laser.

[0014] Furthermore, the CO2 laser is expanded and collimated by the beam expander module and then passes through the reflector to enter the beam splitter, which splits the laser beam into two laser beams with equal power.

[0015] Furthermore, the CO2 laser of the RF CO2 laser is expanded and collimated by the beam expander module and then passes through the reflector to enter the beam splitter. The beam splitter splits the laser beam into two laser beams with equal power.

[0016] Furthermore, the CO2 laser of the RF CO2 laser is divided into two laser beams with equal power through a beam splitter. Finally, the two beams are focused by the first laser cutting head and the second laser cutting head, forming a dual-station function for simultaneously cutting ceramic substrates.

[0017] Furthermore, an aperture is installed above the first laser cutting head and the second laser cutting head, a CO2 laser focusing lens is arranged in the middle, and a protective lens is installed below the CO2 laser focusing lens.

[0018] Furthermore, the aperture range of the aperture inside the first laser cutting head and the second laser cutting head is between 13 mm and 18 mm.

[0019] Furthermore, a nozzle is installed under the first laser cutting head and the second laser cutting head. The outside of the cutting head is connected to compressed air. When cutting the ceramic substrate, the laser and compressed air are coaxially emitted. The nozzle aperture range is 1mm to 4mm.

[0020] Furthermore, below the nozzles of the first laser cutting head and the second laser cutting head is an X / Y platform fixture, which can place two ceramic substrates at the same time. The ceramic cutting process is achieved through the movement of the platform's X-axis and Y-axis. The first laser cutting head and the second laser cutting head can only move in the up and down direction of the Z-axis.

[0021] The specific process of the CO2 laser processing method for ceramic substrates of the present invention is as follows: the radio frequency CO2 laser emits a laser beam with a wavelength of 10.6um, which first enters the circular polarizer closest to the laser outlet. The circular polarizer converts the linear polarized light into circular polarized light, and then passes through the first reflector to enter the beam expander device. The beam expander collimates and expands the laser, improving the collimation of the laser and increasing the diameter of the emitted light beam. At the same time, the beam expander device can adjust the divergence angle of the laser beam to adjust the laser focusing effect, and can be applied to the scribing of ceramic substrates of different thicknesses to achieve good results. After passing through the beam expander, the laser beam reaches the second reflector, and then enters the beam splitter after reflection. The beam splitter splits a laser beam into two beams with the same laser power, and the emission directions of the two laser beams are 90 degrees. 0 One laser beam directly enters the first laser cutting head device, then passes through the aperture, CO2 laser focusing lens and protective lens inside the first laser cutting head in sequence, and finally emerges from the center of the nozzle of the first laser cutting head. The focal position of the laser beam after focusing is near the surface of the ceramic substrate on the X / Y platform fixture. In order to ensure good processing results for ceramic substrates of different thicknesses, the focal position can be adjusted by moving the overall height of the first laser cutting head up and down. At the same time, the first laser cutting head is equipped with a coaxial air blowing function. During the cutting, marking and drilling of ceramic substrates, external compressed air is introduced into the first laser cutting head. Finally, the air flow will be coaxial with the laser beam and emerge through the center of the first laser nozzle. The air pressure of the auxiliary coaxial air blowing reaches above 0.1MPa, which can completely blow out the slag formed after the laser high-temperature melting of the ceramic substrate from the blind hole or from the bottom of the ceramic substrate. After passing through the beam splitter, the other beam will pass through the third reflector again and then enter the second laser cutting head. After shaping and focusing, it forms a good processing beam output. This set of ceramic substrate CO2 laser processing equipment has two laser cutting heads working simultaneously during the processing process. Two ceramic substrates of the same size are placed on the platform accordingly, and the processing patterns of the two ceramic substrates are also the same.

[0022] Compared with the prior art, the present invention has significant advantages and beneficial effects, which are specifically reflected in the following aspects: (1) In this CO2 laser processing device, a radio frequency CO2 laser is finally divided into two light paths to form a dual-station simultaneous processing, which improves the processing efficiency of a single device.

[0023] (2) The optical path includes a set of beam expander devices. The distance between the incident lens and the output lens of the beam expander device can be freely and conveniently adjusted within a certain range. By adjusting the distance between the two lenses, different depths of marking and cutting effects can be achieved for ceramic substrates of different thicknesses, ensuring good marking and cutting effects. Different marking depths have certain requirements on the focal depth and size of the light spot.

[0024] (3) A circular polarizer is designed and installed in the optical path. The laser emitted by the RF CO2 laser is linearly polarized light. The circular polarizer in the device can convert linearly polarized light into circularly polarized light. The polarization plane of circularly polarized light is always changing, and there will be no difference in cutting effect caused by changes in cutting direction. Ultimately, the cutting and marking effects in the X-axis and Y-axis directions are uniform and consistent.

[0025] (4) The two laser cutting heads are designed with an installed diaphragm inside. The aperture of the diaphragm is configured in a series of different sizes. It has two main functions. One is to optimize the roundness of the focused laser beam spot, which can improve the quality of the ceramic substrate marking. At the same time, by using two laser cutting heads with diaphragms of different inner diameters, the energy of the laser beam incident on the surface of the ceramic substrate after the beam is focused can be adjusted to maintain good consistency, so that the double-station processing effect maintains good consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 : Schematic diagram of the optical path structure of the present invention; Figure 2 : Schematic diagram of the structure of the beam expander module.

[0027] Figure 3 : Schematic diagram of the structure of the laser cutting head.

[0028] In the figure: 1 RF CO2 laser, 2 circular polarizer, 3 first reflector, 4 beam expander module, 5 second reflector, 6 beam splitter, 7 third reflector, 8 first laser cutting head, 9 second laser cutting head, 10 X / Y platform fixture, 11 incident lens, 12 output lens, 13 output lens fixing slider, 14 first metal slide bar, 15 second metal slide bar, 16 light outlet, 17 incident lens fixing block, 18 light outlet module, 19 connecting base plate, 20 aperture, 21 CO2 laser focusing lens, 22 protective lens, 23 compressed air interface, 24 nozzle. DETAILED DESCRIPTION

[0029] The following description will provide a clearer explanation of the specific embodiments of the present invention with reference to the accompanying drawings.

[0030] like Figure 1The CO2 laser processing device of the ceramic substrate shown includes a complete optical path system and a motion platform. The optical path system includes a radio frequency CO2 laser 1, a circular polarizer 2, a beam expander module 4, a beam splitter 6, a first reflector 3, a second reflector 5, a third reflector 7, a first laser cutting head 8 and a second laser cutting head 9. The circular polarizer 2 is arranged at the optical path output end of the radio frequency CO2 laser 1, and the first reflector 3, the beam expander module 4, the second reflector 5, the beam splitter 6, the third reflector 7 and the first laser cutting head 8 and the second laser cutting head 9 are arranged in sequence on the output optical path of the circular polarizer 2. An X / Y platform fixture 10 is provided below the optical path output end of the first laser cutting head 8 and the second laser cutting head 9; a CO2 laser focusing lens 21 is provided inside the first laser cutting head 8 and the second laser cutting head 9, a protective lens is installed below the CO2 laser focusing lens 21, an aperture 20 is installed above the CO2 laser focusing lens, and a nozzle 24 is installed on the lower mechanism of the first laser cutting head 8 and the second laser cutting head 9.

[0031] like Figure 2 The diagram shows the structure of the beam expander module 4 in a CO2 laser processing device for ceramic substrates. The structure primarily consists of an incident lens 11, an exit lens 12, an exit lens fixing slider 13, a first metal slide 14, a second metal slide 15, a light outlet 16, an incident lens fixing block 17, a light outlet module 18, and a connecting base plate 19. The incident lens 11 and the exit lens 12 are positive focusing lenses with different focal lengths. The incident lens 11 is fixed in position, while the exit lens 12 can move freely along the first and second metal slides 14, 15, following the exit lens fixing slider 13. The ends of the first and second metal slides 14, 15 are fixed to the incident lens fixing module 17 and the light outlet module 18. The incident lens fixing block 17 and the light outlet module 18 are fixed to the connecting base plate 19.

[0032] like Figure 3 The diagram shows the structure of two laser cutting heads in a CO2 laser processing device for ceramic substrates. The main components of the two laser cutting heads, arranged from top to bottom, are the aperture 20, CO2 laser focusing lens 21, protective lens 22, compressed air port 23, and nozzle 24. The aperture 20, CO2 laser focusing lens 21, protective lens 22, and nozzle 24 are removable and replaceable. The compressed air port 23 is typically connected to an external compressed air pipe to provide coaxial air blowing during cutting.

[0033] The specific implementation process of the CO2 laser processing device for ceramic substrates is as follows: the radio frequency CO2 laser 1 emits a laser with a wavelength of 10.6μm. The laser is linearly polarized light. Different cutting effects will appear when the polarization plane of the laser is parallel to or perpendicular to the cutting direction. The CO2 laser can convert linearly polarized light into circularly polarized light after passing through the circular polarizer 2. The polarization plane of circularly polarized light always changes, and there will be no difference in cutting effect caused by changes in the cutting direction. Therefore, it can ensure that the consistency of the cutting and scribing effects in the X-axis and Y-axis directions is good. Therefore, a circular polarizer 2 is arranged 10-20cm from the exit of the CO2 laser 1 beam. The laser passes through the circular polarizer 2 and reaches the first reflector 3 through 45 0 The light reflected by the lens reaches the beam expander module 4. The function of the beam expander module 4 is to collimate and expand the CO2 laser beam. After the laser beam is emitted from the laser, it is not an ideal parallel beam and will have a certain divergence angle. The divergence angle of the laser beam can be improved by the beam expander module 4. Beam expansion is to magnify the diameter of the laser beam several times. The ultimate function is to obtain a good focused light spot, so that the marking and cutting of the ceramic substrate can be realized.

[0034] The beam expander module 4 is composed of a group of metal structural parts and two convex mirror groups. The two convex mirrors are the incident lens 11 and the output lens 12. The incident lens 11 is installed on the incident lens fixing block 17, and the output lens 12 is installed on the output lens fixing slider 13. The first and second metal slides 14, 15 are fixed to the vertical surfaces of the incident lens fixing block 17 and the light outlet module 18. The incident lens fixing block 17 and the light outlet module 18 are fixed to the connecting base plate 19. Two through-holes are provided in the vertical surface of the output lens fixing slider 13. The first and second metal slides 14, 15 pass through these through-holes to support the output lens fixing slider 13, allowing the output lens fixing slider 13 to slide freely on the first and second metal slides 14, 15. This sliding movement adjusts the distance between the incident lens 11 and the output lens 12. The adjustment range of the distance between the two lenses is 50mm to 200mm. Adjusting this distance can adjust the beam diameter and collimation of the output light, thereby adjusting the final laser focus spot effect. The spot effect mainly includes the spot size and the spot depth. Different spot effects can achieve good processing results for marking and cutting ceramic substrates of different thicknesses.

[0035] The CO2 laser beam is expanded and collimated by the beam expander module 4 and then reaches the second reflector 5. The second reflector 5 reflects the laser beam 90 0 Change the direction and move forward to the beam splitter 6, which splits the laser beam into two beams, one of which is 90 degrees to the original beam. 0The reflected laser beam is transmitted vertically downward to the first laser cutting head 8, and the other laser beam is transmitted forward in the original direction through the beam splitter 6. After being reflected by the third reflector 7, it is 90 degrees to the original light path. 0 The reflected light is vertically transmitted downward to the second laser cutting head 9. The power of the two laser beams split by the beam splitter 6 is equal to half of the power of the original beam, and the diameters of the two beams are the same as the diameter of the original beam.

[0036] After the two laser beams split by the beam splitter 6 reach the first laser cutting head 8 and the second laser cutting head 9, the first laser cutting head 8 and the second laser cutting head 9 are cutting heads with exactly the same structure. The split laser beams reach the top of the two laser cutting heads and first pass through the aperture 20 inside the two laser cutting heads. The aperture range of the aperture 20 varies from 13mm to 18mm, mainly matching the diameter size of the CO2 laser beam after expansion by the beam expander module 4. The function of the aperture 20 is mainly to filter out the weaker energy and a small part of the divergent beam around the laser beam. This function can further optimize the roundness and spot size of the final focused spot, thereby improving the processing quality of ceramic scribing and cutting. After passing through the aperture 20, the laser beam reaches the CO2 laser focusing lens 21, which focuses the beam with a diameter of the millimeter level after expansion and collimation into a small spot of less than 100um, thereby enabling laser ceramic cutting, scribing and drilling. After being focused by the CO2 laser focusing lens 21, the laser beam continues to pass through the protective lens 22 below, and finally passes through the nozzle 24 to reach the ceramic substrate placed on the X / Y platform fixture 10. The energy density of the focused laser spot is very high. The spot is irradiated on the surface of the ceramic substrate, causing the ceramic substrate material at the irradiated area to melt and vaporize rapidly. At the same time, with the help of the high-pressure air flow introduced from the compressed air interfaces 23 on the left and right sides of the bottom of the two laser cutting heads, the coaxial high-speed air blowing formed by the nozzle 24 and the light beam is used to blow away the molten material. At the same time, the X / Y platform fixture 10 moves in two dimensions, thereby realizing the marking, cutting and punching of the ceramic substrate.

[0037] Furthermore, the beam splitter 6 forms two laser beams after beam splitting. After passing through the same first laser cutting head 8 and second laser cutting head 9, a dual-station processing function is achieved. The two laser beams emit and shut off light simultaneously. The two stations process the same graphics and ceramic substrates. The two ceramic substrates are placed on the X / Y motion platform fixture 10. The two laser cutting heads are fixed during processing. The processing graphics (such as straight lines, circular holes, and other special shapes) are formed by the movement of the X / Y motion platform fixture 10. The X / Y platform fixture 10 is a dual-axis superimposed structure. The coordinated movement of the two axes enables the processing of circular holes and special shapes. The dual-station processing method formed by the above dual-optical path system significantly improves the processing effect of ceramic substrates.

Claims

1. A CO2 laser processing device for cutting ceramic substrates, characterized by: It comprises a set of optical path systems, which include RF CO2 laser, circular polarizer, beam expander module, beam splitter, first reflector, second reflector, third reflector, first laser cutting head and second laser cutting head. The circular polarizer is arranged at the optical path output end of the RF CO2 laser, and the first reflector, beam expander module, second reflector, beam splitter, third reflector and first laser cutting head and second laser cutting head are arranged in sequence on the output optical path of the circular polarizer. An X / Y platform fixture is arranged below the optical path output end of the first laser cutting head and the second laser cutting head; CO2 laser focusing lenses are arranged inside the first laser cutting head and the second laser cutting head, a protective lens is installed below the CO2 laser focusing lens, and an aperture is installed above the CO2 laser focusing lens. The lower mechanism of the first laser cutting head and the second laser cutting head is installed with a nozzle, and there is an air blowing interface on the outside of the cutting head, and the air flow can pass into the internal cavity of the cutting head through the external interface. Finally, it is ejected through the nozzle. The optical path device system ultimately divides a beam of light emitted by the RF CO2 laser into two beams to form two laser beams. After focusing through the first laser cutting head and the second laser cutting head, it forms a two-station processing. The platform for processing the product is an X / Y platform fixture. Two ceramic substrate products can be placed on the X / Y motion platform fixture at the same time. The two stations can process products at the same time. This set of optical path design devices can improve the processing efficiency and processing quality of ceramic substrates, and improve the cutting and scribing process effects of ceramic substrates. In particular, its unique beam expander module design can easily adjust the distance between the incident lens and the output lens of the beam expander module, thereby adjusting the focusing effect of the light spot to cope with the scribing and cutting of substrates of different thicknesses with good process quality. The beam expander module consists of an incident lens, an output lens, an output lens fixing slider, a first metal slide rod, a second metal slide rod, a light outlet, an incident lens fixing block, a light outlet module and a connecting base plate.

2. A CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: The radio frequency CO2 laser is a laser that emits a beam of laser light which is eventually divided into two beams of light, and two workstations are processed simultaneously.

3. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: The laser light emitted by the radio frequency CO2 laser first enters the circular polarizer. The installation position of the circular polarizer is 10 cm to 20 cm away from the laser outlet, and the entrance of the circular polarizer faces the laser outlet.

4. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: The wavelength of the radio frequency CO2 laser is 10.6µm, and the power range of the CO2 laser transmitter is 200W to 300W.

5. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: A reflective lens is arranged behind the circular polarizer, and a beam expander module is arranged behind the reflector. The distance between the beam expander module and the outlet of the circular polarizer is between 30cm and 40cm.

6. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: The beam expander module is composed of a metal component and two CO2 focusing lenses. One metal component contains two metal modules. The two CO2 focusing lenses are installed in the two metal modules front and back respectively. The front and back distance of the two metal modules with lenses installed can be adjusted by sliding on two support guide rods.

7. A CO2 laser processing device for cutting ceramic substrates according to claim 6, characterized in that: The specifications of the two CO2 focusing lenses in the beam expander module are different. The lens diameters are 25.4mm and 38.1mm respectively, the focal lengths of the lenses are 50.8mm and 127mm respectively, and the adjustment range of the distance between the two lenses is 50mm to 200mm.

8. The CO2 laser processing device for cutting ceramic substrates according to claim 6, characterized in that: The two CO2 focusing mirrors in the beam expander module are installed in the following order: the lens with a smaller diameter is used as the front incident mirror of the laser, and the lens with a larger diameter is used as the rear exit mirror of the laser.

9. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: The CO2 laser of the RF CO2 laser is expanded and collimated by a beam expander module and then passes through a reflector to enter a beam splitter. The beam splitter splits one laser beam into two laser beams with equal power.

10. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: The CO2 laser of the RF CO2 laser is divided into two laser beams with equal power through a beam splitter. Finally, the two beams are focused by the first laser cutting head and the second laser cutting head to form a dual-station function of cutting ceramic substrates simultaneously.

11. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: A diaphragm is installed on the upper part of the first laser cutting head and the second laser cutting head, a CO2 laser focusing lens is arranged in the middle, and a protective lens is installed below the CO2 laser focusing lens.

12. A CO2 laser processing device for cutting ceramic substrates according to claim 11, characterized in that: The aperture range of the aperture inside the first laser cutting head and the second laser cutting head is between 13 mm and 18 mm.

13. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: A nozzle is installed below the first laser cutting head and the second laser cutting head. The outside of the cutting head is connected to compressed air. When cutting the ceramic substrate, the laser and the compressed air are coaxially emitted. The nozzle aperture range is 1mm to 4mm.

14. The CO2 laser processing device for cutting ceramic substrates according to claim 1, characterized in that: Below the nozzles of the first laser cutting head and the second laser cutting head is an X / Y platform fixture, which can place two ceramic substrates at the same time. The ceramic cutting process is achieved through the movement of the platform's X-axis and Y-axis. The first laser cutting head and the second laser cutting head can only move in the up and down direction of the Z-axis.

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