Thermal management system, control method, electronic equipment, storage medium and vehicle

Abstract

The invention relates to a thermal management system, a control method, electronic equipment, a storage medium and a vehicle, the thermal management system comprises a first temperature detection device and a second temperature detection device, the first temperature detection device and the second temperature detection device are suitable for detecting temperatures of different parts, and the different parts are different in heat conduction efficiency. And the different parts exchange heat with the to-be-cooled part. According to the heat management system, through the first temperature detection device and the second temperature detection device, dual-temperature detection can be achieved, detection results of the first temperature detection device and the second temperature detection device can be redundant for temperature detection of different parts, and overheating damage or safety problems of the part to be cooled are avoided.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation management, and in particular, to a thermal management system and control method, electronic equipment, storage medium, and vehicle. Background Art

[0002] The thermal management system of the heat dissipation component in related technologies often only detects the temperature of one position or component, which is prone to errors and may lead to failure to adjust in time, which may cause overheating and damage to the heat dissipation component or safety hazards. Summary of the Invention

[0003] The purpose of the present disclosure is to provide a thermal management system and control method, an electronic device, a storage medium and a vehicle to solve the problems in the above-mentioned related technologies.

[0004] In order to achieve the above objectives, one aspect of the present disclosure provides a thermal management system, comprising: a first temperature detection device; a second temperature detection device; The first temperature detection device and the second temperature detection device are suitable for detecting the temperatures of different components, the different components have different thermal conductivity efficiencies, and the different components exchange heat with the heat element to be dissipated.

[0005] Optionally, the different components further include a heat dissipation device, which is connected to the heat dissipation element to be cooled, and is suitable for dissipating heat from the heat dissipation element to be cooled.

[0006] Optionally, the second temperature detection device is suitable for being connected to the heat dissipation device, and the second temperature detection device is suitable for detecting the temperature of the heat dissipation device.

[0007] Optionally, the second temperature detection device is provided with a second detection end, and the second detection end is connected to the heat dissipation device.

[0008] Optionally, the heat dissipation device includes a phase change material, and the phase change material is suitable for heat exchange with the heat dissipation element.

[0009] Optionally, the heat dissipation device further includes a container, the container is connected to the heat element to be dissipated and is capable of heat exchange, and the phase change material is filled in the container.

[0010] Optionally, the second temperature detection device is arranged in the container.

[0011] Optionally, the container is configured as a pipe.

[0012] Optionally, the pipe is in an S-shape.

[0013] Optionally, the thermal management system further includes a conductivity sensor, which is connected to the phase change material and is suitable for detecting the conductivity of the phase change material.

[0014] Optionally, the different components further include a heat conducting member; The heat dissipation device exchanges heat with the heat conducting member; The first temperature detection device is connected to the heat conducting member, and is suitable for detecting the temperature of the heat conducting member.

[0015] Optionally, the heat dissipation component is an electronic component, and the electronic component exchanges heat with the heat conducting component.

[0016] Optionally, the first temperature detection device is provided with a first detection end, and the first detection end is connected to the heat conducting member.

[0017] Optionally, the heat conducting member is provided with a first surface and a second surface which are arranged opposite to each other, the first surface is provided with a mounting portion, the heat dissipation device is connected to the mounting portion, and the second surface is connected to the electronic component.

[0018] Optionally, the thermal management system further comprises a control unit, and the first temperature detection device, the second temperature detection device and the heat element to be dissipated are all electrically connected to the control unit; The control unit controls the opening or closing of the heat dissipation element according to the temperature detected by the first temperature detection device and / or the second temperature detection device.

[0019] A second aspect of the present disclosure further provides a method for controlling a thermal management system, comprising the following steps: Based on the detected temperature, the heat dissipation component is controlled to be turned on or off; The detected temperature is a temperature value detected from different components in the thermal management system. The different components have different thermal conductivity efficiencies, and the different components exchange heat with the heat dissipation element.

[0020] Optionally, the temperature value includes a first temperature; When the first temperature is lower than a first preset temperature, controlling the heat dissipation element to be turned on; And / or, when the first temperature is greater than or equal to the first preset temperature, the heat dissipation element is controlled to be closed.

[0021] Optionally, the first preset temperature is set to a peak temperature of the electronic component.

[0022] Optionally, the first preset temperature is 150°C-170°C.

[0023] Optionally, the temperature value further includes a second temperature; When the first temperature is greater than or equal to a second preset temperature, controlling the power of the heat dissipation element to be dissipated to be reduced; or When the second temperature is greater than or equal to a third preset temperature, the power of the heat dissipation element is controlled to be reduced; and the first preset temperature is greater than the second preset temperature.

[0024] Optionally, the second preset temperature is set as a protection temperature of the electronic component.

[0025] Optionally, the second preset temperature is 120°C-140°C.

[0026] Optionally, the third preset temperature is set to the melting temperature of the phase change material.

[0027] Optionally, the third preset temperature is 100°C-130°C.

[0028] Optionally, the detected temperature is detected by the first temperature detection device and the second temperature detection device of the thermal management system mentioned above; The temperature detected by the first temperature detection device is set to a first temperature, and the temperature detected by the second temperature detection device is set to a second temperature.

[0029] A third aspect of the present disclosure further provides an electronic device for executing the above-mentioned control method of the thermal management system.

[0030] A fourth aspect of the present disclosure further provides a storage medium storing a computer program, which implements the steps of the above-mentioned control method of the thermal management system when executed by a processor.

[0031] A fifth aspect of the present disclosure further provides a vehicle comprising the above-mentioned thermal management system, or a control method for executing the above-mentioned thermal management system.

[0032] The above technical solution can realize dual temperature detection by setting up a first temperature detection device and a second temperature detection device. For the temperature detection of different components, the detection results of the first temperature detection device and the second temperature detection device can be made redundant, so that the two can complement each other, reduce detection errors, and improve accuracy. In addition, if one of them fails, the other can still ensure the detection temperature, and can make timely adjustments, thereby improving reliability, thereby avoiding overheating damage or safety problems of the heat dissipation component.

[0033] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following detailed description, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 is a schematic structural diagram of a thermal management system according to an embodiment of the present disclosure; Figure 2 It is a flowchart of a control method according to an embodiment of the present disclosure.

[0035] Description of Reference Numerals 1. First temperature detection device, 2. Second temperature detection device, 3. Heat dissipation device, 31. Container, 32. Phase change material, 4. Component to be dissipated heat, 41. Electronic component, 42. Heat-conducting component, 43. Mounting portion, 5. Control unit, 6. Housing. DETAILED DESCRIPTION

[0036] The following describes the specific embodiments of the present disclosure in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present disclosure and are not intended to limit the present disclosure.

[0037] In this disclosure, unless otherwise specified, "inside" and "outside" refer to the inside and outside of the relevant parts. In addition, the terms "first" and "second" are only used to distinguish and describe, and cannot be understood as indicating or implying relative importance.

[0038] It should also be noted that, in the description of this disclosure, unless otherwise expressly specified or limited, the terms "disposed" and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, a detachable connection, or an integral connection. They may be directly connected or indirectly connected through an intermediate medium, or they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this disclosure based on specific circumstances.

[0039] During operation, electronic components generate heat, which requires heat dissipation. The operating power of electronic components is different, and the heat generated will vary, and the heat dissipation requirements are also different. In order to protect electronic components and avoid overheating and damage, thermal management of electronic components is required.

[0040] Thermal management systems for electronic components in related technologies often only monitor the temperature of a single location or component, which can be prone to errors and result in low accuracy and reliability. This can lead to inability to adjust the temperature in a timely manner, potentially causing overheating and damage to the electronic component, or even safety hazards. This is because if the temperature measurement at that location or component is erroneous or a fault cannot be detected, the power to the electronic component cannot be adjusted in a timely manner, nor can the electronic component be shut down in a timely manner, thus failing to provide protection. If the temperature rise of the electronic component is too high, in severe cases, it can even cause ablation or fire of the electronic component, leading to a series of consequences such as short circuits and system failure.

[0041] For this reason, Figure 1 As shown, one aspect of the present disclosure provides a thermal management system, including a first temperature detection device 1 and a second temperature detection device 2 .

[0042] The first temperature detection device 1 and the second temperature detection device 2 are suitable for detecting the temperatures of different components. Different components have different thermal conductivity efficiencies, and different components exchange heat with the heat dissipation element 4 .

[0043] The first temperature detection device 1 and the second temperature detection device 2 can detect temperature respectively. It should be noted that the temperature detection of different components can also be understood as the temperature detection of different positions.

[0044] In the above technical solution, dual temperature detection can be achieved by setting up the first temperature detection device 1 and the second temperature detection device 2. For the temperature detection of different components, the detection results of the first temperature detection device 1 and the second temperature detection device 2 can be redundant with each other, so that the two can complement each other, reduce detection errors, and improve accuracy. In addition, if one of them fails, the other can still ensure the detection temperature, and can make timely adjustments, thereby improving reliability, thereby avoiding overheating damage or safety problems of the heat dissipation component 4.

[0045] Optionally, in one embodiment of the present disclosure, the different components include a heat sink 3, which is connected to a heat dissipation element 4 to be dissipated, and the heat sink 3 is suitable for dissipating heat from the heat dissipation element 4. By dissipating heat from the heat dissipation element 4 through the heat dissipation device 3, it is possible to ensure that the heat dissipation element 4 operates within a normal operating temperature range, thereby preventing the heat dissipation element 4 from being overheated and damaged. The heat dissipation element 4 to be dissipated may be an electronic component 41, which may include a chip and a circuit board. The chip is connected to the circuit board, and the heat sink 3 dissipates heat from the chip and the circuit board. Of course, in other examples, the electronic component 41 may also be other power structures.

[0046] Optionally, in one embodiment of the present disclosure, the second temperature detection device 2 is adapted to be connected to the heat sink 3, and the second temperature detection device 2 is adapted to detect the temperature of the heat sink 3. By detecting the temperature of the heat sink 3 by the second temperature detection device 2, the heat dissipation performance of the heat sink 3 can be directly understood, and thus timely adjustments can be made based on the heat dissipation performance of the heat sink 3 to prevent the heat generated by the heat sink 4 from not being dissipated through the heat sink 3 in a timely manner, thereby controlling the heat generated by the heat sink 4.

[0047] Optionally, in one embodiment of the present disclosure, the second temperature detection device 2 is provided with a second detection end, and the second detection end is connected to the heat dissipation device 3. This arrangement facilitates temperature detection of the heat dissipation device 3.

[0048] Optionally, in one embodiment of the present disclosure, the heat dissipation device 3 includes a container 31 and a phase change material 32. The phase change material 32 is suitable for heat exchange with the heat dissipation element 4. The container 31 is connected to the heat dissipation element 4 and is capable of heat exchange. The phase change material 32 is filled in the container 31. The container 31 is configured to accommodate the phase change material 32. The phase change of the phase change material 32 absorbs heat. Compared with the heat absorption method of a medium such as flowing water or coolant, the phase change material 32 can absorb more heat and improve the heat dissipation effect.

[0049] Phase change material 32 is a material that can transform from one phase to another within a specific temperature range, absorbing or releasing a large amount of latent heat during the phase change process. These materials typically transition between solid and liquid states, but solid-to-solid phase changes can also occur. A key characteristic of phase change material 32 is that its temperature remains nearly constant during the phase change. This is because the energy required for the phase change is primarily used to change the material's state rather than raising or lowering its temperature. Therefore, the presence of phase change material 32 can leverage the enormous latent heat of the phase change material 32 during the phase change process, absorbing a large amount of heat at the same temperature, thereby achieving cooling and temperature control of the heat dissipation element 4 under the same operating conditions. Furthermore, using solid phase change material 32 as the cooling medium eliminates the need for existing circulation systems using liquid coolants, reducing costs and saving space. Latent heat refers to the energy absorbed or released by a substance during a phase change, i.e., from one physical state to another, such as solid to liquid or liquid to gas. During this transition, the temperature of the substance remains constant, and this energy is therefore referred to as "latent heat." Sensible heat refers to the energy absorbed or released by a substance as its temperature increases or decreases without undergoing a phase change.

[0050] In some examples, the phase change material 32 includes paraffin, phase change metal material, inorganic salt, hydrated salt, composite phase change material 32, polymer-based phase change material 32, eutectic alloy, paraffin nanocomposite material, liquid metal material (indium metal, etc.).

[0051] Container 31 can accommodate phase change material 32. It is understood that phase change material 32 undergoes a phase change within container 31 without leaking. The thermal conductivity of container 31 ensures heat transfer and dissipation. In some examples, container 31 is sealed and can be welded shut after being filled with phase change material 32. Container 31 can be made of copper or aluminum, which have high thermal conductivity.

[0052] Optionally, in one embodiment of the present disclosure, the second temperature detection device 2 is disposed within the container 31. It is understood that the entire second temperature detection device 2 is disposed within the container 31, and can directly detect the temperature of the phase change material 32, thereby facilitating understanding of the state and heat absorption of the phase change material 32 and enabling timely adjustment of the power of the heat element 4 to be dissipated.

[0053] Alternatively, in another embodiment of the present disclosure, the second temperature detection device 2 is disposed outside the container 31, and the second detection end penetrates into the container 31 and contacts the phase change material 32. It is understood that the main body of the second temperature detection device 2 is outside the container 31, and the detection end of the second temperature detection device 2 penetrates into the container 31 to detect the temperature of the phase change material 32. This arrangement can also detect the temperature of the phase change material 32 and facilitate maintenance of the second temperature detection device 2.

[0054] Optionally, in one embodiment of the present disclosure, container 31 is configured as an S-shaped pipe. This configuration increases the contact area and improves heat dissipation while eliminating the need for excessive phase change material 32, reducing costs. In some examples, multiple containers 31 may be provided, each filled with phase change material 32. Multiple containers 31 may be positioned at different locations of the heat element 4 to be dissipated as needed, and may be configured accordingly based on the varying amounts of heat generated at different locations of the heat element 4 to be dissipated. This is not intended to be limiting.

[0055] Alternatively, in another embodiment of the present disclosure, the container 31 may be a flat plate structure with a cavity provided therein for accommodating the phase change material 32. The container 31 may be entirely laid flat on the heat dissipation element 4 to improve the heat dissipation effect.

[0056] Since the phase change material 32 maintains a constant temperature during the phase change process and is a solid-liquid mixture, as the phase change material 32 continues to absorb heat, the solid-liquid ratio changes, and its resistance changes accordingly. Optionally, in one embodiment of the present disclosure, the thermal management system further includes a conductivity sensor connected to the phase change material 32, and the conductivity sensor is suitable for detecting the conductivity of the phase change material 32. The conductivity sensor is configured to detect the conductivity of the phase change material 32, and thus, based on the time-varying curve of the solid-liquid ratio and conductivity of the phase change material 32, the specific state of the solid-liquid mixture of the phase change material 32 during the phase change process can be determined, thereby achieving more accurate state monitoring and realizing higher temperature prediction accuracy.

[0057] Optionally, in one embodiment of the present disclosure, the various components further include a heat conductor 42. The heat dissipation device 3 is connected to the heat conductor 42 and is capable of heat exchange. The heat conductor 42 exchanges heat with the heat dissipation element 4. The first temperature detection device 1 is connected to the heat conductor 42 and is suitable for detecting the temperature of the heat conductor 42.

[0058] The heat conducting member 42 is used to achieve heat transfer, which can increase the contact area with the heat dissipation device 3 and improve the heat dissipation effect. It is also convenient to connect with the first temperature detection device 1 to perform temperature detection.

[0059] In some examples, the heat dissipation element 4 is an electronic component 41, which exchanges heat with a heat conductor 42. The electronic component 41 may include a chip and a circuit board. Since heat is mainly generated by the chip, and heat detection of the chip is not easy to implement, the heat conductor 42 is provided to achieve heat transfer and temperature detection. The heat conductor 42 may be a plate-shaped structure. It is understandable that although the heat conductor 42 may have a certain thermal resistance, its thermal resistance is fixed. Therefore, the fixed thermal resistance of the heat conductor 42 can clearly obtain the temperature relationship between the heat conductor 42 and the chip, and the temperature of the chip can be directly obtained by detecting the temperature of the heat conductor 42.

[0060] Optionally, the first temperature detection device 1 is provided with a first detection end, which is connected to the heat conductor 42. The first detection end of the first temperature detection device 1 can be connected to the higher temperature position of the heat conductor 42, thereby better protecting the heat element 4 to be dissipated. It should be noted that the higher temperature position of the heat conductor 42 can be determined by infrared temperature detection. Different electronic components 41 may cause different higher temperature positions of the heat conductor 42, and different higher temperature positions of different heat conductors 42 may also be different. The higher temperature position can be determined based on actual conditions.

[0061] Optionally, in one embodiment of the present disclosure, the heat conducting member 42 is provided with a first surface and a second surface arranged opposite to each other, the first surface is provided with a mounting portion 43, the heat sink 3 is connected to the mounting portion 43, and the second surface is connected to the electronic component 41. This arrangement facilitates the connection of the heat conducting member 42 to the heat sink 3 and the electronic component 41, thereby facilitating heat transfer.

[0062] The heat sink 3 and the electronic components 41 are located on either side of the heat conductor 42. Heat from the electronic components 41 is transferred through the heat conductor 42 and then dissipated into the external environment through the heat sink 3. In some examples, the mounting portion 43 may be a groove, which can be used to position and fix the heat sink 3, thereby improving the connection strength.

[0063] Optionally, in one embodiment of the present disclosure, the heat dissipation element further includes a housing 6 , the housing 6 has a receiving groove, the electronic component 41 is disposed in the receiving groove, and the heat conducting element 42 is connected to the notch of the receiving groove.

[0064] In order to automatically reduce the power of the heat dissipation element 4 or shut down the electronic components, optionally, in one embodiment of the present disclosure, the thermal management system further includes a control unit 5, and the first temperature detection device 1, the second temperature detection device 2, and the heat dissipation element 4 are all electrically connected to the control unit 5. The control unit 5 controls the opening or closing of the heat dissipation element 4 according to the temperature detected by the first temperature detection device 1 and / or the second temperature detection device 2.

[0065] It is understood that the temperature detected by the first temperature detection device 1 and the temperature detected by the second temperature detection device 2 can both be transmitted to the control unit 5. The control unit 5 can then make adjustments and controls based on the temperatures detected by the first temperature detection device 1 and / or the second temperature detection device 2, so that the power to the heat dissipation element 4 can be reduced, reducing the heat dissipation of the heat dissipation element 4 to avoid damage caused by overheating. In addition, the heat dissipation element 4 can also be directly shut down to protect the heat dissipation element 4. The dual temperature feedback paths achieved by the first temperature detection device 1 and the second temperature detection device 2 can be redundant, improving accuracy and reliability, and not using a single temperature detection feedback path as an indicator, thereby improving the protection of the heat dissipation element 4.

[0066] Optionally, in one embodiment of the present disclosure, the temperature detected by the first temperature detection device 1 is set to a first temperature, and the temperature detected by the second temperature detection device 2 is set to a second temperature.

[0067] The first temperature is compared with the second preset temperature. If the first temperature is greater than or equal to the second preset temperature, the control unit 5 controls the power of the heat dissipation element 4 to be dissipated to be reduced. Alternatively, the second temperature is compared with the third preset temperature. If the second temperature is greater than or equal to the third preset temperature, the control unit 5 controls the power of the heat dissipation element 4 to be dissipated to be reduced. By monitoring the temperatures detected by the first temperature detection device 1 and the second temperature detection device 2, the real-time temperatures of the heat conducting element 42 and the heat dissipation device 3 can be monitored. The data is then transmitted to the control unit 5 for data processing and feedback, thereby achieving thermal management of the heat dissipation element 4 to be dissipated.

[0068] It can be understood that when the first temperature is greater than or equal to the second preset temperature, or when the second temperature is greater than or equal to the third preset temperature, it means that the heat component 4 to be cooled is in a state of too high temperature, and there is a certain risk. Therefore, the control unit 5 controls the power reduction of the heat component 4 to be cooled, reduces the heat generated by the heat component 4 to be cooled, and protects the heat component 4 to be cooled. Only at least one of the two conditions needs to be met to control the power reduction of the heat component 4 to be cooled, thereby achieving the effect of dual redundancy.

[0069] Since heat transfer has a certain delay, in order to reduce the feedback delay due to the failure temperature, optionally, in one embodiment of the present disclosure, the second preset temperature is set to the protection temperature of the heat dissipation component 4. In some examples, the second preset temperature is 120°C-140°C. It should be noted that the range of the second preset temperature is determined according to the specific situation of the heat dissipation component 4. In this example, the heat dissipation component 4 may be an electronic component 41, and the electronic component 41 may be a chip. The protection temperature of the chip is generally set to 120°C-140°C. Therefore, the second preset temperature can be set accordingly according to the different heat dissipation components 4, and there are no excessive restrictions here.

[0070] By setting this, the power of the heat dissipation element 4 can be reduced in advance according to the protection temperature of the heat dissipation element 4, which can effectively protect the heat dissipation element 4. This avoids the situation where the judgment delay occurs due to the delay of heat transfer when setting the failure temperature, and can protect the heat dissipation element 4 in time.

[0071] It can be understood that when the temperature of the heat conductor 42 reaches the protection temperature of the heat dissipation component 4 or is greater than the protection temperature of the heat dissipation component 4, the power of the heat dissipation component 4 can be controlled to be reduced so that the temperature of the heat conductor 42 is lower than the protection temperature of the heat dissipation component 4, thereby protecting the heat dissipation component 4.

[0072] Optionally, in one embodiment of the present disclosure, the third preset temperature is set to the melting temperature of the phase change material 32, and the third preset temperature is 100°C-130°C. It should be noted that the range of the third preset temperature is determined by the specific phase change material 32. In this example, the phase change material 32 may be an inorganic salt or a hydrated salt, and its melting temperature is set to 120°C-130°C. Therefore, the third preset temperature can be set accordingly depending on the phase change material 32, and no further restrictions are imposed herein.

[0073] Among them, when the temperature of the phase change material 32 reaches the melting temperature, it indicates that the phase change material 32 begins to melt. After the phase change process, the latent heat of the phase change material 32 increases and the temperature remains stable. After the phase change, the material is in a liquid state. At this time, the sensible heat of the material is smaller than that of the solid state. Therefore, when absorbing the same amount of heat, the temperature of the liquid phase change material 32 rises more and the temperature rise rate is faster. Therefore, it is necessary to control the power of the heat dissipation element 4 to be cooled to reduce it to avoid the problem of overheating caused by the temperature of the heat dissipation element 4 being too high. It is understandable that when the temperature of the phase change material 32, that is, the temperature detected by the second temperature detection device 2, is greater than or equal to the third preset temperature, it indicates that the phase change material 32 begins to melt. At this time, it is necessary to reduce the power of the heat dissipation element 4 to be cooled to avoid the problem of overheating caused by the temperature of the heat dissipation element 4 being too high.

[0074] Optionally, in one embodiment of the present disclosure, the temperature detected by the first temperature detection device 1 is set to a first temperature, and the first temperature is compared with a first preset temperature. If the first temperature is greater than or equal to the first preset temperature, the control unit 5 controls the heat dissipation element 4 to be closed. By setting the first preset temperature, the heat dissipation element 4 can be controlled to be closed in a timely manner to avoid direct damage to the heat dissipation element 4 due to excessive temperature.

[0075] The first preset temperature determination process can be performed after the second or third preset temperature determination process, further protecting the heat dissipation element 4. Of course, the first preset temperature determination process can also be used as a separate determination process to directly shut down the heat dissipation element 4 to protect it. In some examples, the first preset temperature is greater than the second preset temperature, and the second preset temperature can provide a buffer zone before the heat dissipation element 4 reaches its peak temperature.

[0076] Optionally, in one embodiment of the present disclosure, the first preset temperature is set to the peak temperature of the heat dissipation element 4 to be dissipated, and the first preset temperature is 150°C-170°C. It should be noted that the range of the first preset temperature is determined based on the specific conditions of the heat dissipation element 4 to be dissipated. In this example, the heat dissipation element 4 to be dissipated may be an electronic component 41, which may be a chip, and the peak temperature of the chip is generally set to 150°C-170°C. Therefore, the second preset temperature can be set accordingly based on the different heat dissipation elements 4 to be dissipated, and no further restrictions are imposed herein.

[0077] By setting this, the heat dissipation element 4 can be operated below the peak temperature. The peak temperature is the highest safe temperature of the heat dissipation element 4 during operation, which can effectively protect the heat dissipation element 4 and prevent damage to the heat dissipation element 4. It should be noted that the first preset temperature can be set accordingly according to the different heat dissipation elements 4, and no further restrictions are imposed here.

[0078] It is understood that when the heat element 4 to be cooled is not operating, the temperature detected by the first temperature detection device 1 is the initial temperature. When the heat element 4 to be cooled is operating, the temperature detected by the first temperature detection device 1 is the first temperature. The first temperature changes at any time according to the different heat generated by the power of the heat element 4 to be cooled. The first temperature is transmitted to the control unit 5, which analyzes and processes it and compares it with the second preset temperature, thereby controlling the power of the heat element 4 to be cooled. The second temperature detected by the second temperature detection device 2 is transmitted to the control unit 5, which analyzes and processes it and compares it with the third preset temperature, thereby controlling the power of the heat element 4 to be cooled. If the temperature of the heat element 4 to be cooled continues to rise and the first temperature is greater than or equal to the first preset temperature, the heat element 4 to be cooled is turned off, causing the temperature of the heat element 4 to be cooled to decrease. When the temperature of the heat element 4 to be cooled drops below the second preset temperature, the heat element 4 to be cooled can be turned on again.

[0079] like Figure 2 As shown, the second aspect of the present disclosure further provides a control method for a thermal management system, comprising the following steps: Based on the detected temperature, controlling the opening or closing of the heat dissipation element 4; The detected temperature is a temperature value detected from different components in the thermal management system. Different components have different thermal conductivity efficiencies, and different components exchange heat with the heat dissipation element 4 .

[0080] Among them, the temperature values of different components are different, which can serve as mutual redundancy to improve accuracy and reliability.

[0081] Optionally, in one embodiment of the present disclosure, the temperature value includes a first temperature and a second temperature.

[0082] Wherein, when the first temperature is greater than or equal to the second preset temperature, the power of the heat dissipation element 4 to be dissipated is controlled to be reduced; or, When the second temperature is greater than or equal to the third preset temperature, the power of the heat element 4 to be cooled is controlled to be reduced.

[0083] By monitoring the temperatures detected by the first temperature detection device 1 and the second temperature detection device 2, the real-time temperatures of the heat conductor 42 and the heat sink 3 can be transmitted to the control unit 5 for data processing and feedback, thereby achieving thermal management of the heat sink 4.

[0084] It can be understood that when the first temperature is greater than or equal to the second preset temperature, or when the second temperature is greater than or equal to the third preset temperature, it means that the heat component 4 to be cooled is in a state of too high temperature, and there is a certain risk. Therefore, the control unit 5 controls the power reduction of the heat component 4 to be cooled, reduces the heat generated by the heat component 4 to be cooled, and protects the heat component 4 to be cooled. Only at least one of the two conditions needs to be met to control the power reduction of the heat component 4 to be cooled, thereby achieving the effect of dual redundancy.

[0085] Optionally, in one embodiment of the present disclosure, the second preset temperature is set to a protection temperature of the heat element 4. In some examples, the first preset temperature is 120°C-140°C.

[0086] Optionally, in one embodiment of the present disclosure, the third preset temperature is set to the melting temperature of the phase change material 32, and the third preset temperature is 100° C.-130° C. It should be noted that the third preset temperature can be set accordingly according to different phase change materials 32, and no further restrictions are imposed here.

[0087] Optionally, in one embodiment of the present disclosure, when the first temperature is less than a first preset temperature, the heat dissipation element 4 is controlled to be turned on, and when the first temperature is greater than or equal to the first preset temperature, the control unit 5 controls the heat dissipation element 4 to be turned off. By setting the first preset temperature, the heat dissipation element 4 can be controlled to be turned off in a timely manner to avoid direct damage to the heat dissipation element 4 due to excessive temperature.

[0088] Optionally, in one embodiment of the present disclosure, the first preset temperature is set to the peak temperature of the heat element 4 to be dissipated, and the first preset temperature is 150°C-170°C.

[0089] Optionally, in one embodiment of the present disclosure, the detected temperature is detected by the first temperature detection device 1 and the second temperature detection device 2 of the thermal management system described above; The temperature detected by the first temperature detection device 1 is set as a first temperature, and the temperature detected by the second temperature detection device 2 is set as a second temperature.

[0090] A third aspect of the present disclosure further provides an electronic device for executing the above-mentioned control method of the thermal management system.

[0091] A fourth aspect of the present disclosure further provides a storage medium storing a computer program, which implements the steps of the above-mentioned control method of the thermal management system when executed by a processor.

[0092] A fifth aspect of the present disclosure further provides a vehicle comprising the above-mentioned thermal management system, or a control method for executing the above-mentioned thermal management system.

[0093] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details of the above embodiments. Within the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the scope of protection of the present disclosure.

[0094] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0095] In addition, the various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A thermal management system, characterized in that: include: a first temperature detection device; a second temperature detection device; The first temperature detection device and the second temperature detection device are suitable for detecting the temperatures of different components, the different components have different thermal conductivity efficiencies, and the different components exchange heat with the heat dissipation element.

2. The thermal management system according to claim 1, characterized in that The different components include a heat dissipation device, which is connected to the heat dissipation element to be cooled, and is suitable for dissipating heat from the heat dissipation element to be cooled.

3. The thermal management system according to claim 2, characterized in that: The second temperature detection device is suitable for being connected to the heat dissipation device, and the second temperature detection device is suitable for detecting the temperature of the heat dissipation device.

4. The thermal management system according to claim 3, characterized in that: The second temperature detection device is provided with a second detection end, and the second detection end is connected to the heat dissipation device.

5. The thermal management system according to claim 2, characterized in that: The heat dissipation device includes a phase change material, and the phase change material is suitable for heat exchange with the heat dissipation element.

6. The thermal management system according to claim 5, characterized in that: The heat dissipation device further includes a container, which is connected to the heat dissipation element and capable of heat exchange, and the phase change material is filled in the container.

7. The thermal management system according to claim 6, characterized in that: The second temperature detection device is disposed in the container.

8. The thermal management system according to claim 6, wherein: The container is configured as a pipeline.

9. The thermal management system according to claim 8, characterized in that: The shape of the pipe is "S".

10. The thermal management system according to claim 5, characterized in that: The thermal management system further includes a conductivity sensor connected to the phase change material, and the conductivity sensor is suitable for detecting the conductivity of the phase change material.

11. The thermal management system according to claim 2, wherein: The different components also include a heat conducting member; The heat dissipation device exchanges heat with the heat conducting member; The first temperature detection device is connected to the heat conducting member, and is suitable for detecting the temperature of the heat conducting member.

12. The thermal management system according to claim 11, wherein: The heat dissipation component is an electronic component, and the electronic component exchanges heat with the heat conducting component.

13. The thermal management system according to claim 11, wherein: The first temperature detection device is provided with a first detection end, and the first detection end is connected to the heat conducting member.

14. The thermal management system according to claim 12, wherein: The heat conducting member is provided with a first surface and a second surface which are arranged opposite to each other. The first surface is provided with a mounting portion, the heat dissipation device is connected to the mounting portion, and the second surface is connected to the electronic component.

15. The thermal management system according to any one of claims 1 to 14, characterized in that: The thermal management system further includes a control unit, and the first temperature detection device, the second temperature detection device and the heat dissipation element are all electrically connected to the control unit; The control unit controls the opening or closing of the heat dissipation element according to the temperature detected by the first temperature detection device and / or the second temperature detection device.

16. A control method for a thermal management system, characterized in that: The following steps are involved: Based on the detected temperature, the heat dissipation component is controlled to be turned on or off; The detected temperature is a temperature value detected from different components in the thermal management system. The different components have different thermal conductivity efficiencies, and the different components exchange heat with the heat dissipation element.

17. The control method according to claim 16, characterized in that: The temperature value includes a first temperature; When the first temperature is lower than a first preset temperature, controlling the heat dissipation element to be turned on; And / or, when the first temperature is greater than or equal to the first preset temperature, the heat dissipation element is controlled to be closed.

18. The control method according to claim 17, characterized in that: The first preset temperature is set to the peak temperature of the heat dissipation element.

19. The control method according to claim 18, characterized in that: The first preset temperature is 150°C-170°C.

20. The control method according to claim 17, characterized in that: The temperature value also includes a second temperature; When the first temperature is greater than or equal to a second preset temperature, controlling the power of the heat dissipation element to be cooled to decrease; or, When the second temperature is greater than or equal to a third preset temperature, the power of the heat dissipation element is controlled to be reduced; and the first preset temperature is greater than the second preset temperature.

21. The control method according to claim 20, characterized in that: The second preset temperature is set as the protection temperature of the heat dissipation element.

22. The control method according to claim 21, characterized in that: The second preset temperature is 120°C-140°C.

23. The control method according to claim 20, characterized in that: The third preset temperature is set to the melting temperature of the phase change material.

24. The control method according to claim 23, characterized in that: The third preset temperature is 100°C-130°C.

25. The control method according to claim 16, characterized in that: The detected temperature is detected by a first temperature detection device and a second temperature detection device of the thermal management system according to any one of claims 1 to 15; The temperature detected by the first temperature detection device is set to a first temperature, and the temperature detected by the second temperature detection device is set to a second temperature.

26. An electronic device, characterized in that: A control method for executing a thermal management system according to any one of claims 16 to 25.

27. A storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the control method of the thermal management system according to any one of claims 16 to 25 are implemented.

28. A vehicle, characterized in that: The thermal management system comprises the thermal management system according to any one of claims 1 to 15, or is used to execute the control method of the thermal management system according to any one of claims 16 to 25.

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