Chip encapsulation and preparation of embedded chip conveyor belt

Abstract

The present application relates to the field of chip encapsulation, and particularly relates to a chip encapsulation and a preparation of an embedded chip conveying belt, wherein natural rubber and butadiene rubber are put into a torque rheometer, then an activator, a composite wave-transparent agent, modified rice husk and paraffin oil are sequentially added, mixing is carried out, standing is performed, sulfur, a scorch retarder and an accelerator are added, mixing is carried out, a mill is used to press a sheet, cooling is performed, and a chip encapsulation is obtained; lignin and silicon dioxide are extracted and precipitated from the rice husk by using an alkali extraction and an acid co-precipitation method, a nano-sized spherical lignin-silica hybrid material is obtained by self-assembly through intermolecular hydrogen bonds as a pretreated rice husk, the aldehyde group of the pretreated rice husk is modified, and then a phosphorus-amine ionic liquid is grafted; silicon nitride, glass fiber and aramid fiber are compounded as a wave-transparent agent, the wave-transparent agent is epoxidized first, and then the phosphorus-amine ionic liquid is grafted.

Description

Technical Field

[0001] This invention relates to the field of chip encapsulation technology, specifically to a chip encapsulation and the embedded chip conveyor belt prepared therefrom. Background Technology

[0002] On belt conveyors, the conveyor belt is a key component used to transport objects. Its basic shape is flat. Because the conveyor belt has a long service life, the maintenance of conveyor belt information has always been a difficult problem. The promotion of embedded chip conveyor belts helps to solve the problem of difficult maintenance of conveyor belt information. With the embedding of special chip tags, maintenance personnel only need to use the corresponding machine to scan out the information of the corresponding conveyor belt.

[0003] Existing embedded chip conveyor belts are mostly divided into two types: plastic surface and rubber surface. Traditional embedded chip rubber conveyor belts also have problems such as limited flame retardancy and corrosion resistance. The addition of a large amount of flame retardant filler will affect the mechanical strength of the rubber belt. At the same time, the material itself has a large interference with chip signals. Summary of the Invention

[0004] The purpose of this invention is to provide a chip encapsulation and the embedded chip conveyor belt prepared therefrom, so as to solve the problems in the prior art.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] A method for preparing chip encapsulation includes the following steps:

[0007] Natural rubber and butadiene rubber are put into a torque rheometer, and then activator, composite microwave transparent agent, modified rice husk and paraffin oil are added in sequence. The mixture is then mixed and allowed to stand. Sulfur, anti-scorching agent and accelerator are added and mixed. The mixture is then pressed into sheets using a two-roll mill and cooled to obtain a chip-coated rubber.

[0008] Furthermore, the activator is a mixture of zinc oxide, stearic acid, and lauric acid in a mass ratio of 1:1:1.

[0009] Furthermore, the accelerator is one or a combination of sulfenamide accelerators and thiuram accelerators.

[0010] Furthermore, by weight, the raw materials for the chip encapsulation are: 80 parts natural rubber, 20 parts butadiene rubber, 3-6 parts activator, 6-12 parts composite microwave transparent agent, 8-16 parts modified rice husk, 5-10 parts paraffin oil, 1-3 parts sulfur, 0.8-1 parts anti-scorching agent, and 0.5-1 parts accelerator.

[0011] Furthermore, the preparation of the composite wave-transmitting agent includes the following steps:

[0012] (1) Silicon nitride, glass fiber and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a microwave-transparent agent; the microwave-transparent agent, 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane and ethanol are mixed and ultrasonically treated for 20-30 min, deionized water and ammonia are added and ultrasonically dispersed for 2-3 h to obtain an epoxy microwave-transparent agent;

[0013] (2) Mix the epoxidized microwave-transparent agent, phosphorus-amine ionic liquid, N,N-dimethylformamide and triethylamine, heat to 70-80℃ and keep warm for 5-6 hours, cool and dry to obtain the composite microwave-transparent agent.

[0014] Furthermore, the preparation of modified rice husks includes the following steps:

[0015] 1) Mix rice husks and sulfuric acid solution, heat to 98-100℃ and keep warm for 3-4 hours, filter, wash until neutral, and dry to obtain pretreated rice husks; mix pretreated rice husks and NaOH solution, boil and reflux for 4 hours, filter to separate, and obtain extract; mix extract, deionized water and ethanol in a volume ratio of 2:1:1, add sulfuric acid solution to adjust pH to 9 while stirring, add polyethylene glycol, sonicate for 2-3 minutes, add sulfuric acid solution to adjust pH to 3, let stand for 20-30 minutes, filter, wash and dry for 24 hours to obtain pretreated rice husks;

[0016] 2) Mix pretreated rice husks, sodium periodate, and isopropanol, keep warm at 50-60℃ for 8-10 hours in the dark, add ethylene glycol solution and continue to keep warm for 20-30 minutes, wash and freeze dry to obtain aldehyde-modified rice husks.

[0017] 3) Mix phosphorus-amine ionic liquid, acetic acid, and N,N-dimethylformamide, stir at 18-25℃ for 20-30 min, add aldehyde-modified rice husk and N,N-dimethylformamide mixture, keep warm at 58-62℃ for 18-20 h, cool, filter, wash and dry to obtain modified rice husk.

[0018] Furthermore, the preparation of phosphorus-amine ionic liquids includes the following steps:

[0019] A. Under a nitrogen atmosphere, acrylamide, imidazole, and toluene were mixed, triethylamine was added, the mixture was heated to 108-111℃ and kept at that temperature for 23-24 hours, and then filtered, washed, and dried to obtain 1-(3-amino-3-oxopropyl)-imidazolium;

[0020] B. Mix 1-(3-amino-3-oxypropyl)-imidazolium and anhydrous ethanol, add 1-bromopropane at 18-25℃, heat to 68-72℃ and keep at that temperature for 23-24 hours, rotary evaporate, add acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide;

[0021] C. Mix 1-(3-amino-3-oxopropyl)-3-propyl-imidazolium bromide, sodium hypophosphite, and deionized water, heat to 78-82℃ and keep at that temperature for 23-24 hours, distill under reduced pressure, transfer to anhydrous methanol and soak for 3-4 hours, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0022] Furthermore, an embedded chip conveyor belt is prepared by chip encapsulation, the preparation of which includes the following steps:

[0023] The core is immersed in PVC impregnation material for treatment and plasticization to obtain a plasticized core. The chip is then extruded and wrapped on the plasticized core, followed by vulcanization to obtain an embedded chip conveyor belt.

[0024] Furthermore, by weight, the composition of the PVC impregnation compound is: 100 parts polyvinyl chloride paste resin, 30-35 parts environmentally friendly plasticizer, 9-19 parts epoxidized soybean oil, 5-10 parts modified rice husk, and 2-4 parts calcium-zinc composite stabilizer.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] This invention provides a chip encapsulation and the embedded chip conveyor belt prepared therefrom. Through formulation and process optimization, a chip encapsulation with high flame retardancy, high wear resistance and good mechanical strength is prepared, thereby significantly improving the various performance characteristics of the embedded chip conveyor belt.

[0027] In this invention, natural rubber with high elasticity, high tensile strength and insulation is used as the main rubber. Butadiene rubber with good wear resistance is selected for blending to prepare a chip coating with both high tensile strength and wear resistance. Zinc oxide, stearic acid and lauric acid are compounded as activators. A certain amount of paraffin oil is added to adjust the hardness of the chip coating. Sulfur is used as a vulcanizing agent. A certain amount of anti-scorching agent and accelerator are added as additives to improve the performance of the chip coating.

[0028] Based on green production, inexpensive and readily available biomass raw material rice husks were selected as a reinforcing agent. To improve the performance of the reinforcing agent, lignin and silica were extracted and precipitated from the rice husks using alkaline extraction and acid co-precipitation. Through intermolecular hydrogen bond self-assembly, nano-sized spherical lignin-silica hybrid materials were obtained as pretreated rice husks. To improve the uniformity of dispersion of the pretreated rice husks in the chip encapsulation and to enhance the bonding strength between the pretreated rice husks and the base material in the chip encapsulation, the pretreated rice husks were first treated with sodium periodate to aldehyde-formaldehyde. Then, phosphorus-amine ionic liquid was grafted onto them using the aldehyde-amino reaction, endowing them with high flame retardancy, antistatic properties, and multiple active sites. When added to the chip encapsulation, it can firmly adhere to the chip encapsulation, giving the chip encapsulation excellent mechanical strength, aging resistance, high flame retardancy, antistatic properties, and wear resistance, thereby reducing the use of non-renewable carbon black fillers, which is in line with current green and environmentally friendly concepts.

[0029] In this invention, silicon nitride, glass fiber, and aramid fiber are compounded as a wave-transmitting agent to reduce the absorption of electromagnetic waves in rubber materials, thereby increasing the communication distance. In order to improve the uniformity of the wave-transmitting agent in the chip coating, it is first epoxidized with 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane, and then grafted with phosphorus-amine ionic liquid using an epoxy-amine reaction. By controlling its mass ratio, the polarity of its surface is reduced, thereby improving the uniformity of the wave-transmitting agent in the chip coating. At the same time, the modified rice husk is used to improve the wear resistance and flame retardancy of the chip coating. Detailed Implementation

[0030] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0031] It should be noted that if the embodiments of the present invention involve directional indicators such as up, down, left, right, front, and back, these directional indicators are only used to explain the relative positional relationship and movement of components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0032] The technical solution of the present invention will be further described in detail below with reference to specific embodiments. It should be understood that the following embodiments are only used to explain the present invention and are not intended to limit the present invention.

[0033] Example 1: A method for preparing chip encapsulation, comprising the following steps:

[0034] Natural rubber and butadiene rubber are put into a torque rheometer, and then activator, composite wave-transmitting agent, modified rice husk and paraffin oil are added in sequence. The mixture is then mixed and allowed to stand. Sulfur, anti-scorching agent and accelerator are added and mixed. The mixture is then pressed into sheets using a two-roll mill and cooled to obtain a chip-coated rubber.

[0035] The activator is a mixture of zinc oxide, stearic acid, and lauric acid in a mass ratio of 1:1:1.

[0036] The accelerator is a mixture of sulfenamide accelerator and thiuram-type accelerator in a mass ratio of 1:1.

[0037] The raw materials for the chip encapsulation, by weight, are: 80 parts natural rubber, 20 parts butadiene rubber, 3 parts activator, 6 parts composite microwave transparent agent, 8 parts modified rice husk, 5 parts paraffin oil, 1 part sulfur, 0.8 parts anti-scorching agent, and 0.5 parts accelerator.

[0038] The preparation of the composite wave-transmitting agent includes the following steps:

[0039] (1) Silicon nitride, glass fiber and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a microwave-transparent agent; 3g of microwave-transparent agent, 1mL of 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane and 30mL of ethanol are mixed and ultrasonically treated for 20min. Then, 1mL of deionized water and 2 drops of ammonia are added and ultrasonically dispersed for 2h to obtain an epoxy microwave-transparent agent.

[0040] (2) Mix 3g of epoxidized microwave-transparent agent, 0.2g of phosphorus-amine ionic liquid, 20mL of N,N-dimethylformamide and 3mL of triethylamine, heat to 70℃ and keep warm for 6h, cool and dry to obtain composite microwave-transparent agent;

[0041] The preparation of the modified rice husk includes the following steps:

[0042] 1) Mix 2g of rice husks with 10mL of 3.6% sulfuric acid solution, heat to 98℃ and keep warm for 4h, filter, wash until neutral, and dry to obtain pretreated rice husks; mix 10g of pretreated rice husks with 70mL of 8% NaOH solution, boil and reflux for 4h, filter to separate, and obtain extract. Mix extract, deionized water and ethanol in a volume ratio of 2:1:1, add 1mol / L sulfuric acid solution to adjust pH to 9 while stirring, add 1g of polyethylene glycol, sonicate for 2min, add 1mol / L sulfuric acid solution to adjust pH to 3, let stand for 20min, filter, wash and dry for 24h to obtain pretreated rice husks;

[0043] 2) Mix 2g of pretreated rice husk, 150mL of 0.1mol / L sodium periodate and 6mL of isopropanol, keep warm at 50℃ for 10h in the dark, add 1mL of 0.1mol / L ethylene glycol solution and keep warm for another 20min, wash and freeze dry to obtain aldehyde-modified rice husk.

[0044] 3) Mix 1.5g of phosphorus-amine ionic liquid, 30mL of 10% acetic acid, and 10mL of N,N-dimethylformamide, stir at 18℃ for 30min, add 0.9g of aldehyde-modified rice husk and 10mL of N,N-dimethylformamide mixture, keep warm at 58℃ for 20h, cool, filter, wash, and dry to obtain modified rice husk;

[0045] The preparation of the phosphorus-amine ionic liquid includes the following steps:

[0046] A. Under a nitrogen atmosphere, 3.5 g acrylamide, 3.4 g imidazole, and 75 mL toluene were mixed, and 0.6 mL triethylamine was added. The mixture was heated to 108 °C and kept at that temperature for 24 h. After filtration, washing, and drying, 1-(3-amino-3-oxypropyl)-imidazolium was obtained.

[0047] B. Mix 7g of 1-(3-amino-3-oxypropyl)-imidazolium and 50mL of anhydrous ethanol, add 7.4g of 1-bromopropane at 18℃, heat to 68℃ and keep warm for 24h, rotary evaporate, add 50mL of acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide;

[0048] C. Mix 13.1g of 1-(3-amino-3-oxopropyl)-3-propyl-imidazolium bromide, 4.4g of sodium hypophosphite, and 50mL of deionized water, heat to 78-82℃ and keep warm for 23h, distill under reduced pressure, transfer to 50mL of anhydrous methanol and soak for 3h, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0049] Example 2: A method for preparing chip encapsulation, comprising the following steps:

[0050] Natural rubber and butadiene rubber are put into a torque rheometer, and then activator, composite wave-transmitting agent, modified rice husk and paraffin oil are added in sequence. The mixture is then mixed and allowed to stand. Sulfur, anti-scorching agent and accelerator are added and mixed. The mixture is then pressed into sheets using a two-roll mill and cooled to obtain a chip-coated rubber.

[0051] The activator is a mixture of zinc oxide, stearic acid, and lauric acid in a mass ratio of 1:1:1.

[0052] The accelerator is a mixture of sulfenamide accelerator and thiuram-type accelerator in a mass ratio of 1:1.

[0053] The raw materials for the chip encapsulation, by weight, are: 80 parts natural rubber, 20 parts butadiene rubber, 4 parts activator, 9 parts composite microwave transparent agent, 12 parts modified rice husk, 7 parts paraffin oil, 2 parts sulfur, 0.9 parts anti-scorching agent, and 0.8 parts accelerator.

[0054] The preparation of the composite wave-transmitting agent includes the following steps:

[0055] (1) Silicon nitride, glass fiber and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a microwave-transparent agent; 3g of microwave-transparent agent, 1mL of 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane and 30mL of ethanol are mixed and ultrasonically treated for 25min. Then, 1mL of deionized water and 2 drops of ammonia are added and ultrasonically dispersed for 2.5h to obtain an epoxy microwave-transparent agent.

[0056] (2) Mix 3g of epoxidized microwave-transparent agent, 0.2g of phosphorus-amine ionic liquid, 20mL of N,N-dimethylformamide and 3mL of triethylamine, heat to 75℃ and keep warm for 5.5h, cool and dry to obtain composite microwave-transparent agent;

[0057] The preparation of the modified rice husk includes the following steps:

[0058] 1) Mix 2g of rice husks with 10mL of 3.6% sulfuric acid solution, heat to 99℃ and keep warm for 3.5h, filter, wash until neutral, and dry to obtain pretreated rice husks; mix 10g of pretreated rice husks with 70mL of 8% NaOH solution, boil and reflux for 4h, filter to separate, and obtain extract. Mix extract, deionized water and ethanol in a volume ratio of 2:1:1, add 1mol / L sulfuric acid solution to adjust pH to 9 while stirring, add 1g of polyethylene glycol, sonicate for 2.5min, add 1mol / L sulfuric acid solution to adjust pH to 3, let stand for 25min, filter, wash and dry for 24h to obtain pretreated rice husks;

[0059] 2) Mix 2g of pretreated rice husk, 150mL of 0.1mol / L sodium periodate and 6mL of isopropanol, keep warm at 55℃ for 9h in the dark, add 1mL of 0.1mol / L ethylene glycol solution and keep warm for another 25min, wash and freeze dry to obtain aldehyde-modified rice husk.

[0060] 3) Mix 1.5g of phosphorus-amine ionic liquid, 30mL of 10% acetic acid, and 10mL of N,N-dimethylformamide, stir at 20℃ for 25min, add 0.9g of aldehyde-modified rice husk and 10mL of N,N-dimethylformamide mixture, keep warm at 60℃ for 19h, cool, filter, wash, and dry to obtain modified rice husk;

[0061] The preparation of the phosphorus-amine ionic liquid includes the following steps:

[0062] A. Under a nitrogen atmosphere, 3.5 g acrylamide, 3.4 g imidazole, and 75 mL toluene were mixed, and 0.6 mL triethylamine was added. The mixture was heated to 109 °C and kept at that temperature for 23.5 h. After filtration, washing, and drying, 1-(3-amino-3-oxypropyl)-imidazolium was obtained.

[0063] B. Mix 7g of 1-(3-amino-3-oxypropyl)-imidazolium and 50mL of anhydrous ethanol, add 7.4g of 1-bromopropane at 20℃, heat to 70℃ and keep warm for 23.5h, rotary evaporate, add 50mL of acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide;

[0064] C. Mix 13.1g of 1-(3-amino-3-oxopropyl)-3-propyl-imidazolium bromide, 4.4g of sodium hypophosphite, and 50mL of deionized water, heat to 80℃ and keep warm for 23.5h, distill under reduced pressure, transfer to 50mL of anhydrous methanol and soak for 3.5h, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0065] Example 3: A method for preparing chip encapsulation, comprising the following steps:

[0066] Natural rubber and butadiene rubber are put into a torque rheometer, and then activator, composite wave-transmitting agent, modified rice husk and paraffin oil are added in sequence. The mixture is then mixed and allowed to stand. Sulfur, anti-scorching agent and accelerator are added and mixed. The mixture is then pressed into sheets using a two-roll mill and cooled to obtain a chip-coated rubber.

[0067] The activator is a mixture of zinc oxide, stearic acid, and lauric acid in a mass ratio of 1:1:1.

[0068] The accelerator is a mixture of sulfenamide accelerator and thiuram-type accelerator in a mass ratio of 1:1.

[0069] The raw materials for the chip encapsulation, by weight, are: 80 parts natural rubber, 20 parts butadiene rubber, 6 parts activator, 12 parts composite microwave transparent agent, 16 parts modified rice husk, 10 parts paraffin oil, 3 parts sulfur, 1 part anti-scorching agent, and 1 part accelerator.

[0070] The preparation of the composite wave-transmitting agent includes the following steps:

[0071] (1) Silicon nitride, glass fiber and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a microwave-transparent agent; 3g of microwave-transparent agent, 1mL of 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane and 30mL of ethanol are mixed and ultrasonically treated for 30min. Then, 1mL of deionized water and 2 drops of ammonia are added and ultrasonically dispersed for 3h to obtain an epoxy microwave-transparent agent.

[0072] (2) Mix 3g of epoxidized microwave-transparent agent, 0.2g of phosphorus-amine ionic liquid, 20mL of N,N-dimethylformamide and 3mL of triethylamine, heat to 80℃ and keep warm for 5h, cool and dry to obtain composite microwave-transparent agent;

[0073] The preparation of the modified rice husk includes the following steps:

[0074] 1) Mix 2g of rice husks with 10mL of 3.6% sulfuric acid solution, heat to 100℃ and keep warm for 3h, filter, wash until neutral, and dry to obtain pretreated rice husks; mix 10g of pretreated rice husks with 70mL of 8% NaOH solution, boil and reflux for 4h, filter to separate, and obtain extract. Mix extract, deionized water and ethanol in a volume ratio of 2:1:1, add 1mol / L sulfuric acid solution to adjust pH to 9 while stirring, add 1g of polyethylene glycol, sonicate for 3min, add 1mol / L sulfuric acid solution to adjust pH to 3, let stand for 30min, filter, wash and dry for 24h to obtain pretreated rice husks;

[0075] 2) Mix 2g of pretreated rice husk, 150mL of 0.1mol / L sodium periodate and 6mL of isopropanol, keep warm at 60℃ for 8h in the dark, add 1mL of 0.1mol / L ethylene glycol solution and keep warm for another 30min, wash and freeze dry to obtain aldehyde-modified rice husk.

[0076] 3) Mix 1.5g of phosphorus-amine ionic liquid, 30mL of 10% acetic acid, and 10mL of N,N-dimethylformamide, stir at 25℃ for 20min, add 0.9g of aldehyde-modified rice husk and 10mL of N,N-dimethylformamide mixture, keep warm at 62℃ for 18h, cool, filter, wash, and dry to obtain modified rice husk;

[0077] The preparation of the phosphorus-amine ionic liquid includes the following steps:

[0078] A. Under a nitrogen atmosphere, 3.5 g acrylamide, 3.4 g imidazole, and 75 mL toluene were mixed, and 0.6 mL triethylamine was added. The mixture was heated to 111 °C and kept at that temperature for 23 h. After filtration, washing, and drying, 1-(3-amino-3-oxopropyl)-imidazolium was obtained.

[0079] B. Mix 7g of 1-(3-amino-3-oxypropyl)-imidazolium and 50mL of anhydrous ethanol, add 7.4g of 1-bromopropane at 25℃, heat to 72℃ and keep warm for 23h, rotary evaporate, add 50mL of acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide;

[0080] C. Mix 13.1g of 1-(3-amino-3-oxopropyl)-3-propyl-imidazolium bromide, 4.4g of sodium hypophosphite, and 50mL of deionized water, heat to 82℃ and keep warm for 23h, distill under reduced pressure, transfer to 50mL of anhydrous methanol and soak for 4h, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

[0081] Comparative Example 1: Example 3 was used as the control group. The modified rice husks were replaced with pretreated rice husks, and other processes were normal.

[0082] Comparative Example 2: Using Example 3 as the control group, the composite wave-transmitting agent was replaced with a wave-transmitting agent, while other processes were normal.

[0083] Comparative Example 3: Using Example 3 as the control group, no phosphorus-amine ionic liquid was prepared, and other processes were normal.

[0084] The chip encapsulation in the examples and comparative examples is used to prepare an embedded chip conveyor belt. The preparation method includes the following steps:

[0085] The core is immersed in PVC impregnation material for treatment and plasticization to obtain plasticized core. The chip is then extruded and coated onto the plasticized core, followed by vulcanization to obtain an embedded chip conveyor belt. By weight, the PVC impregnation material consists of: 100 parts polyvinyl chloride paste resin, 30 parts environmentally friendly plasticizer, 10 parts epoxidized soybean oil, 5 parts modified rice husk, and 3 parts calcium-zinc composite stabilizer.

[0086] Source of raw materials (for illustrative purposes only):

[0087] Natural rubber HC4760: Tianmen Hengchang Chemical Co., Ltd.; Butadiene rubber BR9000: Kandis Chemical (Hubei) Co., Ltd.; Paraffin oil XK0340: Hubei Xinkang Pharmaceutical Chemical Co., Ltd.; Sulfur S-80: Guangzhou Wanchun Chemical Co., Ltd.; Anti-scorching agent CTP: Shandong Ruiqi Chemical Co., Ltd.; Sulphamide accelerator 4979-32-2: Hubei Rishengchang New Material Technology Co., Ltd.; Thiuram-based accelerator TETD: Nanjing Bermuda Biotechnology Co., Ltd.; Polyvinyl chloride paste resin A00287: Wuhan Jiyesheng Chemical Co., Ltd.; Environmentally friendly plasticizer DPGDB (99%): Hubei Chengfeng Chemical Co., Ltd.; Epoxidized soybean oil S50881: Shanghai Yuanye Biotechnology Co., Ltd.; Calcium-zinc composite stabilizer (99%): Hubei Xinrunde Chemical Co., Ltd.; Aramid fiber (200 mesh, 99%): Nantong Runfeng Petrochemical Co., Ltd.; Rice husk: Commercially available; Zinc oxide Z111836, stearic acid S108289, lauric acid L305740, silicon nitride S431558, glass fiber F770994, 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane G134407, polyethylene glycol P103723, ethylene glycol E103319, acrylamide A108465, imidazole I108707: Aladdin reagent; Ethanol, ammonia, N,N-dimethylformamide, sodium hypophosphite, triethylamine, sulfuric acid, NaOH solution, sodium periodate, isopropanol, acetic acid, toluene, 1-bromopropane, acetonitrile, methanol, analytical grade: commercially available.

[0088] Performance testing: Performance testing was performed on the chip encapsulation prepared in the examples and comparative examples.

[0089] The chip was coated with adhesive and vulcanized to prepare a sample. The vulcanization conditions were: 135℃ for 22 minutes.

[0090] Impact strength: The impact strength of the cantilever beam notched was measured, and a 60mm×13mm×4mm specimen was made with a V-shaped notch cut; Flame retardancy: The vertical burning performance was tested using a horizontal and vertical burning tester, referring to GB / T10707-2008.

[0091] Wear resistance: Refer to GB / T1689-2014. Fix it on the rubber wheel shaft, pre-grind it clockwise for 20 minutes and weigh it m1. After traveling 1.6km, weigh it m2 and calculate the wear volume.

[0092] Communication distance test of embedded chip conveyor belt: Embedded electronic chip specifications: size 3mm×100mm (including antenna), working frequency 860MHz-960MHz, sensitivity: -18dBm, standard recognition reading distance not less than 5 meters, repeated read and write cycles 100,000 times, embedded electronic chip is placed latitudinally, 10cm from the lateral edge of the conveyor belt, and 2mm from the working surface. When using a handheld card reader, it is considered qualified if it can accurately read the information inside the chip when it is 1 meter away from the working surface where the chip is embedded; otherwise, it is considered unqualified. The test results are shown in Table 1.

[0093] Table 1

[0094]

[0095] This invention provides a chip encapsulation and the embedded chip conveyor belt prepared therefrom. Through formulation and process optimization, a chip encapsulation with high flame retardancy, high wear resistance and good mechanical strength is prepared, thereby significantly improving the various performance characteristics of the embedded chip conveyor belt.

[0096] Comparing Example 3 with Comparative Examples 1 and 3, based on green production, inexpensive and readily available biomass raw material rice husk was selected as the reinforcing agent. To improve the performance of the reinforcing agent, lignin and silica were extracted and precipitated from the rice husk using alkaline extraction and acid co-precipitation. Through intermolecular hydrogen bond self-assembly, nano-sized spherical lignin-silica hybrid materials were obtained as pretreated rice husks. To improve the uniformity of dispersion of the pretreated rice husks in the chip coating and to improve the bonding strength between the pretreated rice husks and the base material in the chip coating, the pretreated rice husks were first treated with sodium periodate to aldehyde-modify them. Then, phosphorus-amine ionic liquid was grafted using the aldehyde-amino reaction to give it high flame retardancy and multiple active sites. When added to the chip coating, it can firmly adhere to the chip coating, giving the chip coating excellent mechanical strength, high flame retardancy, and wear resistance, thereby reducing the use of non-renewable carbon black fillers, which is in line with the current green and environmentally friendly concept.

[0097] Comparing Example 3 with Comparative Examples 2 and 3, this invention uses a composite of silicon nitride, glass fiber, and aramid fiber as a wave-transmitting agent to reduce the absorption of electromagnetic waves in rubber materials, thereby increasing the communication distance. To improve the uniformity of the wave-transmitting agent dispersion in the chip coating, it is first epoxidized with 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane, and then grafted with phosphorus-amine ionic liquid using an epoxy-amine reaction. By controlling its mass ratio, the polarity of its surface is reduced, thereby improving the uniformity of the wave-transmitting agent dispersion in the chip coating. At the same time, the modified rice husk is used to improve the wear resistance and flame retardancy of the chip coating.

[0098] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the present invention's specification under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A method for preparing chip encapsulation, characterized in that, Includes the following steps: Natural rubber and butadiene rubber are put into a torque rheometer, and then activator, composite wave-transmitting agent, modified rice husk and paraffin oil are added in sequence. The mixture is then mixed and allowed to stand. Sulfur, anti-scorching agent and accelerator are added and mixed. The mixture is then pressed into sheets using a two-roll mill and cooled to obtain a chip-coated rubber. The preparation of the composite wave-transmitting agent includes the following steps: (1) Silicon nitride, glass fiber and aramid fiber are compounded in a mass ratio of 1:1:1 to obtain a microwave-transparent agent; the microwave-transparent agent, 3-[(2,3)-epoxypropoxy]propylmethyldimethoxysilane and ethanol are mixed and ultrasonically treated for 20-30 min, deionized water and ammonia are added and ultrasonically dispersed for 2-3 h to obtain an epoxy microwave-transparent agent; (2) Mix the epoxidized microwave-transparent agent, phosphorus-amine ionic liquid, N,N-dimethylformamide and triethylamine, heat to 70-80℃ and keep warm for 5-6 hours, cool and dry to obtain the composite microwave-transparent agent; The preparation of the modified rice husk includes the following steps: 1) Mix rice husks and sulfuric acid solution, heat to 98-100℃ and keep warm for 3-4 hours, filter, wash until neutral, and dry to obtain pretreated rice husks; mix pretreated rice husks and NaOH solution, boil and reflux for 4 hours, filter to separate, and obtain extract; mix extract, deionized water and ethanol in a volume ratio of 2:1:1, add sulfuric acid solution to adjust pH to 9 while stirring, add polyethylene glycol, sonicate for 2-3 minutes, add sulfuric acid solution to adjust pH to 3, let stand for 20-30 minutes, filter, wash and dry for 24 hours to obtain pretreated rice husks; 2) Mix pretreated rice husks, sodium periodate, and isopropanol, keep warm at 50-60℃ for 8-10 hours in the dark, add ethylene glycol solution and continue to keep warm for 20-30 minutes, wash and freeze dry to obtain aldehyde-modified rice husks. 3) Mix phosphorus-amine ionic liquid, acetic acid, and N,N-dimethylformamide, stir at 18-25℃ for 20-30 min, add aldehyde-modified rice husk and N,N-dimethylformamide mixture, keep warm at 58-62℃ for 18-20 h, cool, filter, wash and dry to obtain modified rice husk; The preparation of phosphorus-amine ionic liquids includes the following steps: A. Under a nitrogen atmosphere, acrylamide, imidazole, and toluene were mixed, triethylamine was added, the mixture was heated to 108-111℃ and kept at that temperature for 23-24 hours, and then filtered, washed, and dried to obtain 1-(3-amino-3-oxopropyl)-imidazolium; B. Mix 1-(3-amino-3-oxypropyl)-imidazolium and anhydrous ethanol, add 1-bromopropane at 18-25℃, heat to 68-72℃ and keep at that temperature for 23-24 hours, rotary evaporate, add acetonitrile, filter, rotary evaporate, and dry to obtain 1-(3-amino-3-oxypropyl)-3-propyl-imidazolium bromide; C. Mix 1-(3-amino-3-oxopropyl)-3-propyl-imidazolium bromide, sodium hypophosphite, and deionized water, heat to 78-82℃ and keep at that temperature for 23-24 hours, distill under reduced pressure, transfer to anhydrous methanol and soak for 3-4 hours, filter, and distill under reduced pressure to obtain a phosphorus-amine ionic liquid.

2. The method for preparing a chip encapsulation according to claim 1, characterized in that, The activator is a mixture of zinc oxide, stearic acid, and lauric acid in a mass ratio of 1:1:

1.

3. The method for preparing a chip encapsulation according to claim 1, characterized in that, The accelerator is one or a combination of sulfenamide accelerators and thiuram-type accelerators.

4. The method for preparing a chip encapsulation according to claim 1, characterized in that, The raw materials for the chip encapsulation, by weight, are: 80 parts natural rubber, 20 parts butadiene rubber, 3-6 parts activator, 6-12 parts composite microwave transparent agent, 8-16 parts modified rice husk, 5-10 parts paraffin oil, 1-3 parts sulfur, 0.8-1 parts anti-scorching agent, and 0.5-1 parts accelerator.

5. A chip encapsulation method, characterized in that, It is prepared by the preparation method described in any one of claims 1-4.

6. An embedded chip conveyor belt, characterized in that, The chip is prepared by an encapsulation method as described in claim 5, and the preparation includes the following steps: The core is immersed in PVC impregnation material for treatment and plasticization to obtain a plasticized core. The chip is then extruded and wrapped on the plasticized core, and vulcanized to obtain an embedded chip conveyor belt.

7. The embedded chip conveyor belt according to claim 6, characterized in that, By weight, the composition of PVC impregnation compound is: 100 parts polyvinyl chloride paste resin, 30-35 parts environmentally friendly plasticizer, 9-19 parts epoxidized soybean oil, 5-10 parts modified rice husk, and 2-4 parts calcium-zinc composite stabilizer.

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