Detection card, manufacturing method and method for applying detection card to chip manufacturing

Abstract

The invention relates to the technical field of chip manufacturing, a detection card is prepared based on a manufacturing method provided by the invention, the detection card comprises a probe, an elastic piece, a non-conductive probe guiding plate, a probe stabilizing plate and a top plate, the probe guiding plate is made of a transparent non-conductive material, so that the probe is conveniently aligned with an electrode on a chip, the probe stabilizing plate limits the probe, the probe is prevented from moving to scratch the chip, and the detection efficiency is improved. The elastic piece compensates for the distance difference between the probe and the electrode caused by the probe length error and the electrode thickness error, and stable contact between the probe and the electrode is guaranteed. The prepared probe card is applied to the chip manufacturing process, defective chips are detected, before the substrates are cut, the large whole substrates are electrified for aging detection, the defective chips are sorted out and are correspondingly removed during cutting, and the shipment defective product rate is reduced. A plurality of chips are simultaneously detected at one time, the workload is reduced, the time is saved, compared with aging detection after packaging, the method is simple, the overall process period is greatly shortened, and the cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a detection card, a production method, and a method of applying the detection card to chip production. Background Art

[0002] The chip manufacturing process includes epitaxial material growth, photolithography, ICP etching, wet oxygen oxidation, PECVD dielectric film deposition, RIE etching, electrode fabrication, thinning, and cleaving. During chip manufacturing, defects in the substrate, stress introduced by the oxidation process, stress introduced by the dielectric film, or impurities introduced by improper cleaning can easily lead to chip defects. These can cause sudden chip failure during operation, generate bit errors in data transmission, cause significant losses, and reduce chip reliability.

[0003] To prevent defective chips from entering equipment, existing technologies typically incorporate a Burn-In test into the chip manufacturing process. The general process is as follows: After chip production and testing, the chips are cut and sorted. The packaging manufacturer then packages the chips in a TO package. Then, a Burn-In test is performed, conducted under high temperature and power conditions, to screen out defective chips and prevent bit errors during data transmission caused by chip failure. While this method can screen out defective chips, it is labor-intensive and costly.

[0004] Based on the problems in the prior art, the present invention provides a detection card, a manufacturing method and a method of applying the detection card to chip manufacturing. Summary of the Invention

[0005] The purpose of the present invention is to provide a detection card, a manufacturing method and a method of applying the detection card to chip manufacturing, so as to solve the technical problems of large workload and high cost in the chip manufacturing and detection processes in the prior art.

[0006] The technical solution of the present invention is: a detection card, including a probe, a top plate and a pin lead plate and a pin stabilizing plate with consistent opening patterns, the probe is penetrated and arranged in the pinholes of the pin lead plate and the pin stabilizing plate; the pin lead plate is made of a non-conductive transparent material; a conductive metal coating is provided on one surface of the top plate, and an elastic part is provided on the probe, which is used to elastically compensate for the distance between the probe and the conductive contact point on the chip, so as to keep the conductive metal coating, the elastic part, the probe and the conductive contact point in contact and conductive when the power is turned on during detection.

[0007] Preferably, the needle stabilizing plate comprises a needle fixing plate and a sliding hole plate, the openings of which are consistent and aligned;

[0008] The fixed needle plate is made of non-conductive plate, and the pinhole apertures on the fixed needle plate are no larger than the pinhole apertures on the sliding hole plate and the needle guide plate to prevent the probe from moving in the horizontal direction;

[0009] The sliding plate is made of a non-conductive plate, and the inner wall of the pinhole on the sliding plate is smooth, so that the probe can move up and down along the pinhole of the sliding plate.

[0010] Preferably, the elastic member is fixedly connected to the bottom surface of the top plate, the probe is naturally suspended at the bottom of the elastic member, and the bottom of the probe extends out of the pin guide plate, and the extended length is not less than the maximum thickness of the conductive contact point.

[0011] Preferably, the elastic member is not fixed to the top plate, the elastic member and the probe droop naturally, and are naturally fixed by the needle fixing plate, and in the naturally fixed state, the length of the probe extending from the needle guide plate is not less than the distance between the elastic member and the top plate.

[0012] Preferably, an extension portion is provided on the top plate, the extension portion is connected to the conductive metal coating, the extension portion is connected to an external power supply device, and power is supplied to the elastic member and the probe through the conductive metal coating, thereby powering the detection card.

[0013] Preferably, the extension portion is configured as a conductive metal coating, which is distributed at least on the bottom surface of the top plate, around the side wall of the top plate to the edge area of the upper surface of the top plate through one of metal evaporation, magnetron sputtering, electroplating, and chemical plating. The edge metal coating on the top of the top plate is used to power the detection card.

[0014] A method for manufacturing a detection card, used to manufacture the probe card, the manufacturing method comprising:

[0015] Prepare probes;

[0016] Prepare a pin lead plate; the pin lead plate is a non-conductive transparent plate with holes;

[0017] Prepare a fixed needle plate, which is a non-conductive plate with holes;

[0018] Prepare a sliding orifice plate, which is a non-conductive plate with holes, and the inner wall of the hole on the sliding orifice plate is smooth;

[0019] preparing a top plate, and preparing a conductive metal coating on the surface of the top plate in contact with the probe;

[0020] The probe, top plate, sliding hole plate, fixed needle plate and needle guide plate are assembled into one body to form a probe card.

[0021] Preferably, when preparing the pin guide plate, the pin fixing plate and the sliding hole plate, holes are regularly opened on the non-conductive base plate, and the arrangement positions of the holes and the distances between the holes are consistent with the arrangement rules and spacing of the metal contact points used as electrodes on the chip;

[0022] The top plate, the sliding hole plate, the fixed needle plate and the needle guide plate are stacked in order from top to bottom, and the needle holes on the sliding hole plate, the fixed needle plate and the needle guide plate are aligned one by one;

[0023] The probe is set through the holes of the sliding plate, the fixed needle plate and the lead needle plate. A metal conductive spring is installed on the top of the probe. When detecting the chip, the conductive metal coating, the spring, the probe and the metal contact points on the chip used as electrodes are connected in series.

[0024] A method for using a detection card, wherein the detection card is used to detect defective chips during chip production, comprises the following steps:

[0025] A1. Perform epitaxial growth, photolithography, and ICP etching on the chip substrate to produce a semiconductor layer to form a wafer substrate.

[0026] A2. Performing operations including PECVD dielectric film deposition, RIE etching, and electrode fabrication on the wafer substrate to obtain a semi-finished substrate;

[0027] A3. Provide the inspection card, inspect each chip area on the semi-finished substrate in turn, and mark the defective chip area;

[0028] A4. Thinning of semi-finished substrates, including rough grinding, fine grinding or polishing, chemical mechanical polishing;

[0029] A5. Cut the semi-finished substrate into chip boards of several target specifications according to the target chip specifications;

[0030] A6. Sort out defective chip boards and send qualified chip boards to downstream for packaging.

[0031] Preferably, the probes of the detection card are provided with radio frequency tags, and each chip area of the target specification is provided with a corresponding radio frequency tag, and the radio frequency tags of a group of probes are identified with the radio frequency tags of the chip areas they are correspondingly detected;

[0032] The radio frequency tags corresponding to the unqualified chip areas are marked. When the substrate is cut, the unqualified chip areas are screened out and are not processed in subsequent steps.

[0033] Compared with the prior art, the advantages of the present invention are:

[0034] (1) The present invention prepares a test card through a test card preparation method, and the test card includes a probe, an elastic member, a non-conductive pin guide plate, a pin stabilizing plate and a top plate. The pin guide plate is made of a transparent material, which is convenient for aligning the probe with the electrode on the chip. The pin stabilizing plate limits the probe, keeps the probe in contact with the electrode on the chip while preventing the probe from moving and scratching the chip. The elastic member compensates for the distance difference between the probe and the electrode caused by the probe length error and the electrode thickness error, ensuring stable contact between the probe and the electrode. The pin stabilizing plate limits the probe and can keep the probe moving up and down to adaptively adjust the distance difference.

[0035] (2) The probe card prepared based on the present invention is used in the chip manufacturing process to detect defective chips. The chip process sequence is changed. Before the substrate is cut, the large integrated substrate is first subjected to power aging testing to sort out the performance degradation and defective chips. During cutting, the corresponding chips are removed, thereby reducing the defective product rate. Since the defective semi-finished chips are sorted out in advance, defective products are prevented from entering the market, providing quality assurance for the entire chip manufacturing market.

[0036] Testing multiple chips on a substrate at the same time greatly reduces workload and saves time. Compared with aging testing after packaging, the method is simple, greatly shortens the overall process cycle and reduces costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0038] Figure 1 Schematic diagram of the probe card detection chip of the present invention;

[0039] Figure 2 A method for preparing the test card of the present invention;

[0040] Figure 3 The invention provides a method for applying the detection card in a chip preparation process;

[0041] Figure 4 This is a schematic structural diagram of the surface of the needle guide plate, the needle fixing plate, or the sliding hole plate of the present invention;

[0042] Figure 5 A schematic side view of the top plate of the present invention;

[0043] Figure 6 is a schematic top view of the top plate of the present invention;

[0044] Figure 7 This is a schematic diagram of the local structure of the insulating shell layer arranged in the extension portion of the present invention;

[0045] Among them: 1. Pin lead plate; 2. Pin fixing plate; 3. Sliding hole plate; 4. Top plate; 5. Conductive metal plating; 6. Probe; 7. Elastic part; 8. Chip; 9. Conductive contact point; 10. Extension part; 11. Electrically connected inner core layer; 12. Insulating shell layer; 30. Pinhole. DETAILED DESCRIPTION

[0046] The present invention will be described in further detail below with reference to specific embodiments:

[0047] like Figure 1 As shown, the present invention provides a test card comprising a probe 6, a top plate 4, and a pin-introduction plate 1 and a pin-stabilizing plate with uniform opening patterns. The probe 6 is disposed within the pinholes of the pin-introduction plate 1 and the pin-stabilizing plate. A conductive metal coating 5 is provided on one surface of the top plate 4. An elastic member 7 is provided on the probe 6 to elastically compensate for the distance between the probe 6 and a conductive contact point 9 on a chip 8. This ensures that the conductive metal coating 5, the elastic member 7, the probe 6, and the conductive contact point 9 maintain contact and continuity when power is applied to the test.

[0048] An extension portion 10 is provided on the top plate 4, and the extension portion 10 is connected to the conductive metal coating 5. The extension portion 10 is connected to an external power supply device and transmits power to the elastic member 7 and the probe 6 through the conductive metal coating 5, thereby powering the detection card.

[0049] In one embodiment or other implementations, the extension portion 10 is provided as a conductive metal coating, which is formed by metal evaporation, magnetron sputtering, electroplating, or chemical plating. Figure 5 The side view diagram provided is combined with the attached Figure 6 The top view schematic diagram provided shows that the conductive metal coating of the extension portion 10 is distributed at least on the bottom surface of the top plate 4, around the side wall of the top plate to the edge area of the upper surface of the top plate, and the edge metal coating on the top of the top plate 4 is used to power the detection card.

[0050] In another embodiment or other implementation, refer to the attached Figure 7 As shown, the extension portion 10 includes an electrically connected inner core layer 11, an insulating shell layer 12 is arranged outside the electrically connected inner core layer 11, one end of the electrically connected inner core layer 11 extending outward is connected to an external power supply device, and the electrically connected inner core layer 11 adopts one of a metal sheet, a metal block, and a metal plating with a certain thickness. The other end of the electrically connected inner core layer 11 is connected to the conductive metal plating 5, so that when the power is turned on, power is sent to the elastic member 7 and the probe 6 through the conductive metal plating 5 to detect the chip.

[0051] Specifically, the needle stabilizing plate includes a needle fixing plate 2 and a sliding hole plate 3 with openings having a consistent pattern and aligned openings.

[0052] The fixed needle plate 2 is made of non-conductive material, and the aperture of the pinhole on the fixed needle plate 2 is no larger than the aperture of the pinhole on the sliding hole plate 3 and the needle guide plate 1, so as to prevent the probe from moving in the horizontal direction; the sliding hole plate 3 is made of non-conductive material, and the inner wall of the pinhole 30 on the sliding hole plate 3 is smooth, so the probe 6 can move up and down along the pinhole 30 of the sliding hole plate 3.

[0053] In detail, the elastic member 7 is a metal spring, which can shrink in length when subjected to force and restore to its original length after the force is removed.

[0054] In one embodiment or other implementation manner, the elastic member 7 is arranged on the top of the probe 6 and is fixedly connected to the bottom surface of the top plate 4. The probe 6 is naturally suspended at the bottom of the elastic member 7, and the bottom of the probe 6 extends out of the pin guide plate 1. The extended length is not less than the maximum thickness of the conductive contact point 9, so that the probe 6 maintains good contact with the conductive contact point 9.

[0055] In one embodiment or other implementation manner, the elastic member 7 is arranged on the top of the probe 6, and the elastic member 7 is not fixed to the top plate 4. The elastic member 7 and the probe 6 naturally droop and are naturally clamped by the needle plate 2. In the naturally clamped state, the length of the elastic member 7 extending out of the needle guide plate 1 is not less than the distance between the elastic member 7 and the top plate.

[0056] In one embodiment or other implementations, the elastic member 7 is disposed inside the probe 6 and becomes a part of the structure of the probe 6 along the length direction. The probe 6 as a whole becomes a conductive metal elastic structure with one end at the bottom being able to stretch and contract under force.

[0057] The present invention further provides a method for making a test card. Figure 2 , the preparation process of the test card includes:

[0058] Prepare probes;

[0059] The probe is flat on the top and pointed on the bottom, which is conducive to conductive contact. The length of the probe is determined according to actual needs. It is made of a good conductive material such as gold or alloy, and is equipped with a radio frequency tag.

[0060] Prepare the needle guide plate;

[0061] First, a transparent, non-conductive board is prepared. Small holes are regularly formed on the board. The arrangement of the holes aligns with the chip's P-pad, including their position and spacing. A chip-P-pad is a flat, circular or rectangular metal area on a chip that serves as a contact point for the chip's pins. It is typically covered by a solder pad and provides electrical connection and mechanical support. For ease of description, this embodiment of the present invention will refer to it as a conductive contact point 9, or "electrode."

[0062] Since the pin lead plate 1 is transparent, it is easy to align the small holes on the pin lead plate 1 with the conductive contact points 9 on the chip substrate, so that the probes can penetrate the electrodes of the chip through the small holes.

[0063] Prepare a fixed needle plate;

[0064] The fixed needle plate 2 is made of non-conductive material, and holes are opened on the fixed needle plate 2, and the hole opening pattern is consistent with that of the lead needle plate 1. The hole diameter on the fixed needle plate 2 just catches the probe 6, preventing the probe 6 from moving horizontally / radially and scratching the chip surface when touching the conductive contact point 9 or during the chip aging process, while at the same time not getting stuck in the probe 6, so that the probe 6 can move along the extension direction of the hole.

[0065] preparing a slip-hole plate;

[0066] The sliding hole plate 3 is made of non-conductive material, and holes are opened on the sliding hole plate 3, and the opening pattern is consistent with that of the pin guide plate 1.

[0067] There are thousands of probes on the probe card, and there are errors in the length of the probes; there are also height differences in the surface heights of the conductive contact points 9 on the chip. To ensure that all probes 6 are in perfect contact with the conductive contact points 9, the inner wall of the opening on the sliding plate 3 is smooth to reduce resistance, making it easy for the probes 6 to move up and down inside it to adapt to the position of the probes 6 and ensure contact with the conductive contact points 9 without excessive stress that damages the conductive contact points 9.

[0068] The needle guide plate 1, the fixed needle plate 2 and the sliding hole plate 3 are opened according to the consistency rule. The surface opening diagram is shown in the attached figure. Figure 4 shown.

[0069] preparing a top plate;

[0070] The top plate 4 is made of non-conductive material. A conductive metal coating 5 is prepared on the surface of the top plate 4 where it contacts the probe by electron beam evaporation or sputtering process. The top plate 4 is covered on the top of the sliding plate 3 to prevent the probe 6 from being exposed upward. In addition, the probe 6 contacts the conductive metal coating 5 on the surface of the top plate 4 through the elastic member 7 and can conduct electricity.

[0071] The probes and the board are assembled to form a probe card;

[0072] The top plate 4, sliding hole plate 3, fixed needle plate 2, and needle guide plate 1 are stacked in order from top to bottom, with the pinholes on the sliding hole plate 3, fixed needle plate 2, and needle guide plate 1 aligned one by one. Probe 6 is set through the holes in the sliding hole plate 3, fixed needle plate 2, and needle guide plate 1. When testing the chip, the conductive metal coating 5 acts as an external electrode and is connected to an external power supply device, thereby connecting the conductive metal coating 5, elastic member 7, probe 6, and conductive contact point 9 on the chip in series.

[0073] The elastic member 7 has good elasticity and conductivity, ensuring good contact between the probe 6 and the conductive contact point 9 without damaging the chip. The assembly method of the probe 6, the elastic member 7 and the top plate 4 adopts one or a combination of the three embodiments of the elastic member 7 mentioned above.

[0074] The probe card prepared by the above-mentioned manufacturing method has a transparent material for the pin plate 1 at the bottom, which facilitates the one-to-one alignment of the test card with the conductive contact points 9 on the chip, and the alignment is more precise. The probe 6 connected to the elastic part 7 can compensate for the length error between the fixed-length probes 6 in the existing technology and the height (thickness) error of the conductive contact point 9, ensuring that each probe 6 can make good contact with the corresponding conductive contact point 9.

[0075] Furthermore, the present invention provides an application method of a detection card, which is used to detect defective chips during chip production. Figure 3 , including the following steps:

[0076] A1. Perform epitaxial growth, photolithography, and ICP etching on the chip substrate to produce a semiconductor layer to form a wafer substrate.

[0077] A2. Performing operations including PECVD dielectric film deposition, RIE etching, and electrode fabrication on the wafer substrate to obtain a semi-finished substrate;

[0078] A3. Use the inspection card provided above to inspect each chip area on the semi-finished substrate in turn and mark the defective chip areas;

[0079] A4. Thinning of semi-finished substrates, including rough grinding, fine grinding or polishing, chemical mechanical polishing;

[0080] A5. Cut the semi-finished substrate into chip boards of several target specifications according to the target chip specifications;

[0081] A6. Sort out defective chip boards and send qualified chip boards to downstream for packaging.

[0082] A corresponding RFID tag is set for each chip area of the target specification. The RFID tags of a group of probes are identified with the RFID tags of the chip areas they are detecting. The RFID tags corresponding to unqualified chip areas are marked. When cutting the substrate, the unqualified chip areas are screened out and are not processed in subsequent steps.

[0083] In existing technology, after semi-finished chips are manufactured, they are first diced into individual chips of the target size, packaged, and then tested. After packaging, each chip undergoes a burn-in test. Large substrates are diced and divided into individual chips, producing hundreds of thousands of chips per day. Each chip is then individually packaged into a leaded package (TO) package, wire bonded, powered, and heated. Failed chips are then sorted out through a burn-in period. This individual, individual process is both costly and labor-intensive.

[0084] Compared with the existing technology, the probe card prepared based on the present invention first performs power-on aging testing on the large overall substrate before substrate cutting, sorts out the chips with performance degradation and defects, marks the sorted defective chip areas, and does not perform any subsequent operations. During cutting, the corresponding chips are removed to reduce the defective rate.

[0085] For merchants involved in the entire chip production and packaging process, since the large substrate is first tested through the test card and then the chips are divided into slices, multiple chips on a substrate can be tested at one time, and multiple chip areas can be tested at the same time, which greatly reduces the workload and saves time. Compared with aging testing after packaging, which requires a long period of one week or even one month, the present invention can complete the production of the same number of chips in 24 hours or 48 hours, shortening the overall process cycle and reducing costs.

[0086] For chip manufacturers, they can pick out defective chip semi-finished products in advance to prevent defective products from entering the market. For downstream chip packaging factories, the raw materials received (qualified semi-finished products that have passed the test card inspection and flowed out from the upstream) are all qualified products, so they only need to carry out chip packaging operations and related packaging inspections, shortening the process cycle, saving costs and improving efficiency. Since packaging is performed on fully qualified products, the yield rate is higher than packaging first and then inspecting.

[0087] The above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with this technology to understand the content of the present invention and implement it accordingly, and they are not intended to limit the scope of protection of the present invention. For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A detection card, characterized in that: It comprises a probe (6), a top plate (4), a needle guide plate (1) and a needle stabilizing plate with consistent opening patterns, wherein the probe (6) is arranged through the needle holes of the needle guide plate (1) and the needle stabilizing plate; the needle guide plate (1) is made of a non-conductive transparent material; A conductive metal coating (5) is provided on one surface of the top plate (4), and an elastic member (7) is provided on the probe (6) for elastically compensating the distance between the probe (6) and the conductive contact point (9) on the chip (8), so as to maintain contact and conduction between the conductive metal coating (5), the elastic member (7), the probe (6) and the conductive contact point (9) when detecting power-on.

2. A test card according to claim 1, characterized in that: The needle stabilizing plate comprises a needle fixing plate (2) and a sliding hole plate (3) with openings having a consistent pattern and aligned openings; The fixed needle plate (2) is made of a non-conductive plate, and the pinhole apertures on the fixed needle plate (2) are no larger than the pinhole apertures on the sliding hole plate (3) and the needle guide plate (1), thereby preventing the probe (6) from moving in the horizontal direction; The sliding plate (3) is made of a non-conductive plate, and the inner wall of the pinhole (30) on the sliding plate (3) is smooth, and the probe (6) can move up and down along the pinhole (30) of the sliding plate (3).

3. A detection card according to claim 2, characterized in that: The elastic member (7) is fixedly connected to the bottom surface of the top plate (4), and the probe (6) is naturally suspended at the bottom of the elastic member (7), and the bottom of the probe (6) extends out of the pin guide plate (1), and the extended length is not less than the maximum thickness of the conductive contact point (9).

4. A detection card according to claim 2, characterized in that: The elastic member (7) is not fixed to the top plate (4), and the elastic member (7) and the probe (6) droop naturally and are naturally fixed by the needle fixing plate (2). In the naturally fixed state, the length of the elastic member (7) extending from the needle guide plate (1) is not less than the distance between the elastic member (7) and the top plate (4).

5. A detection card according to claim 1, characterized in that: An extension portion (10) is provided on the top plate (4), the extension portion (10) is connected to the conductive metal coating (5), the extension portion (10) is connected to an external power supply device, and transmits power to the elastic member (7) and the probe (6) through the conductive metal coating (5), thereby powering the detection card.

6. A test card according to claim 1, characterized in that: The extension portion (10) is configured as a conductive metal coating, which is distributed at least on the bottom surface of the top plate (4), around the side wall of the top plate to the edge area on the top surface of the top plate by one of metal evaporation, magnetron sputtering, electroplating, and chemical plating. The edge metal coating on the top of the top plate (4) is used to power the detection card.

7. A method for manufacturing a detection card, used for manufacturing the probe card according to any one of claims 1 to 6, characterized in that: The preparation method comprises: Prepare probes; Prepare a pin lead plate; the pin lead plate is a non-conductive transparent plate with holes; Prepare a fixed needle plate, which is a non-conductive plate with holes; Prepare a sliding orifice plate, which is a non-conductive plate with holes, and the inner wall of the hole on the sliding orifice plate is smooth; preparing a top plate, and preparing a conductive metal coating on the surface of the top plate in contact with the probe; The probe, top plate, sliding hole plate, fixed needle plate and needle guide plate are assembled into one body to form a probe card.

8. The method for making a test card according to claim 7, wherein: When preparing the pin guide plate, pin fixing plate and sliding hole plate, holes are regularly opened on the non-conductive substrate. The arrangement position and distance between the holes are consistent with the arrangement and spacing of the metal contact points used as electrodes on the chip. The top plate, the sliding hole plate, the fixed needle plate and the needle guide plate are stacked in order from top to bottom, and the needle holes on the sliding hole plate, the fixed needle plate and the needle guide plate are aligned one by one; The probe is set through the holes of the sliding plate, the fixed needle plate and the lead needle plate. The probe is connected to an elastic part made of metal conductive material. When detecting the chip, the conductive metal plating, the elastic part, the probe and the metal contact point used as the electrode on the chip are connected in series.

9. A method for using a test card, wherein the test card is used to detect defective chips during chip production, characterized in that: The steps include: A1. Perform epitaxial growth, photolithography, and ICP etching on the chip substrate to produce a semiconductor layer to form a wafer substrate. A2. Performing operations including PECVD dielectric film deposition, RIE etching, and electrode fabrication on the wafer substrate to obtain a semi-finished substrate; A3. Provide the test card according to any one of claims 1 to 6, sequentially test each chip area on the semi-finished substrate, and mark the defective chip area; A4. Thinning of semi-finished substrates, including rough grinding, fine grinding or polishing, chemical mechanical polishing; A5. Cut the semi-finished substrate into chip boards of several target specifications according to the target chip specifications; A6. Sort out defective chip boards and send qualified chip boards to downstream for packaging.

10. The method for using a detection card according to claim 9, characterized in that: The probes of the detection card are provided with radio frequency tags, and each chip area of the target specification is correspondingly provided with a radio frequency tag, and the radio frequency tags of a group of probes are identified with the radio frequency tags of the chip area they are correspondingly detected; The radio frequency tags corresponding to the unqualified chip areas are marked. When the substrate is cut, the unqualified chip areas are screened out and are not processed in subsequent steps.

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