Rapid and automatic temperature matching system and method for silk-screen baking process

Abstract

The invention relates to the technical field of PCB (printed circuit board) processing, and discloses a rapid and automatic temperature matching system and method for a silk-screen baking process, and the system comprises a multi-dimensional monitoring module and an intelligent adjustment module. According to the system, board data, silk-screen data and baking data of all batches of PCBs are obtained through a multi-dimensional monitoring module and are classified to form a data set, an intelligent adjusting module analyzes the production quality of each batch of PCBs, generates a monitoring data set and ensures the consistency of materials, then analyzes the silk-screen effect of each batch of PCBs and generates silk-screen indexes, and the production efficiency of the PCBs is improved. The intelligent adjusting module analyzes the baking state of each batch of PCBs, generates a baking data set, accurately recognizes the problem of poor curing or uneven heating, evaluates the uniformity, the silk-screen processing quality and the baking state of each batch of PCBs, generates an early warning signal and a control instruction, and sends the early warning signal and the control instruction to the control module; baking parameters are automatically adjusted, the optimal curing efficiency is ensured, the energy consumption cost is reduced, and the product quality is good through multi-dimensional evaluation.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB board processing, and in particular to a system and method for rapid automatic temperature matching in a silk-screen baking process. Background Art

[0002] PCBs, or printed circuit boards, are essential components in electronic devices. They primarily consist of an insulating base plate, connecting conductors, and pads for mounting and soldering electronic components. Through sophisticated design and manufacturing processes, PCBs enable electrical connections between components within a circuit and provide mechanical support. Furthermore, to meet specific application requirements, PCBs may require screen printing and baking. Before screen printing, a series of preparatory steps are required, including cleaning the PCB, inspecting the screen, mixing the ink, securing the mounting surface, and printing the ink. After ink printing, the PCB undergoes a baking process to ensure ink adhesion. First, the screen-printed PCB is preheated in a baking machine. The temperature is gradually increased to reduce thermal stress caused by sudden temperature changes and prevent deformation or damage. After preheating, the baking machine is raised to the set baking temperature. This temperature is determined based on the ink's curing requirements and the PCB's heat resistance. This ensures complete evaporation of the ink's solvents and sufficient curing of the ink, resulting in a strong and durable marking. After baking, allow the PCB to cool naturally to room temperature within the baking equipment to avoid rapid temperature changes that could cause thermal stress and deformation or damage. Throughout the entire screen printing baking process, process parameters and operating specifications must be strictly controlled at each step to ensure that the final product meets quality requirements.

[0003] Currently, the temperature matching system of traditional screen printing baking processes lacks automated control and monitoring methods, making it difficult to achieve real-time monitoring and dynamic adjustment of the baking process. In actual operations, due to factors such as structural limitations of the baking equipment or uneven heat conduction, cold spots with lower temperatures than surrounding areas are easily formed on the surface of the PCB board. The ink in these cold spots may cause board cracking due to insufficient curing, ultimately leading to reduced product adhesion and reliability. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention provides a fast and automatic temperature matching system and method for the silk screen baking process, which has the advantages of more timely real-time monitoring response and multi-dimensional evaluation of product quality. It solves the problem that the temperature matching system of the traditional silk screen baking process lacks automated control means and reduces product adhesion.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a fast and automatic temperature matching system for a silk-screen baking process, comprising a multi-dimensional monitoring module and an intelligent adjustment module;

[0006] The multi-dimensional monitoring module consists of a plate management unit, a screen printing monitoring unit and a baking monitoring unit. The plate data unit collects plate data sets through a network connection detection device, the screen printing monitoring unit collects screen printing data sets through a network connection detection device, and the baking monitoring unit collects baking data sets through a network connection sensing device and detection device;

[0007] The intelligent adjustment module consists of a plate evaluation unit, a screen printing evaluation unit, a baking evaluation unit, and a dynamic management unit. The plate evaluation unit analyzes the production quality of each batch of PCB boards based on the plate data set and generates a corresponding monitoring data set Jcsj. The screen printing evaluation unit analyzes the screen printing effect of each batch of PCB boards based on the screen printing data set and generates a corresponding screen printing index Syz. The baking evaluation unit analyzes the baking status of each batch of PCB boards based on the baking data set and generates a corresponding baking data set Hksj. The dynamic management unit is set with fixed values for thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Combined with the monitoring data set Jcsj, screen printing index Syz, and baking data set Hksj, it evaluates the uniformity, screen printing processing quality, and baking status of each batch of PCB boards and generates corresponding early warning signals and control instructions.

[0008] Preferably, the plate data set includes the number of PCB boards, the thickness of the PCB boards, the moisture content of the PCB boards, and the glass transition temperature of the PCB boards in each batch.

[0009] Preferably, the screen printing data set includes screen tension, scraper flatness error, ink viscosity and ink transparency of each batch.

[0010] Preferably, the baking data set includes processing temperature, processing air volume, processing humidity and ink double bond conversion rate.

[0011] Preferably, the calculation process of the monitoring data group Jcsj is as follows:

[0012] Based on the plate data set, extract the plate data of the i-th batch, mark the number of PCB boards in the i-th batch as N, mark the thickness of each PCB board in the i-th batch as {h1, h2, h3, ..., hN}, mark the moisture content of each PCB board in the i-th batch as {s1, s2, s3, ..., sN}, and mark the glass transition temperature of each PCB board in the i-th batch as {z1, z2, z3, ..., zN};

[0013]

[0014] In the formula, represents the average thickness of the PCB board in the i-th batch, represents the average moisture content of the PCB board in the i-th batch, represents the average glass transition temperature of the PCB board in the i-th batch, hx represents the thickness of the x-th PCB board in the i-th batch, x∈N, sx represents the moisture content of the x-th PCB board in the i-th batch, zx represents the glass transition temperature of the x-th PCB board in the i-th batch, represents the standard deviation of the thickness of the PCB board in the i-th batch, represents the standard deviation of the moisture content of the PCB board in the i-th batch, Indicates the standard deviation of the glass transition temperature of the PCB board in the i-th batch, Jcsj i Represents the monitoring data set of the i-th batch of PCB boards.

[0015] Preferably, the calculation process of the silk screen index Syz is as follows:

[0016] According to the silk screen data set, extract the silk screen data of the PCB board of the i-th batch and mark the silk screen tension of the i-th batch as wz i , mark the scraper flatness error of the i-th batch as dp i , mark the viscosity of the ink of batch i as mn i , mark the ink transparency of batch i as mt i ;

[0017]

[0018] In the formula, BWZ represents the standard value for measuring screen tension, α1 represents the weight for the ratio of screen tension to the standard value, BDP represents the standard value for measuring scraper flatness error, α2 represents the weight for the ratio of the standard value to scraper flatness error, BMN represents the standard value for measuring ink viscosity, α3 represents the weight for the ratio of the standard value to ink viscosity, BMT represents the standard value for measuring ink transparency, α4 represents the weight for the ratio of ink transparency to the standard value, α1, α2, α3 and α4 are all constants, and α1+α2+α3+α4=1. Indicates that the silk screen index Syz of the i-th batch is calculated according to the weights α1, α2, α3 and α4 i .

[0019] Preferably, the calculation process of the baking data set Hksj is as follows:

[0020] According to the baking data set, the baking data of the i-th batch of PCB boards are extracted, and the ink double bond conversion rate of each PCB board in the i-th batch is marked as {g1, g2, g3, ..., gN}, and the processing temperature of the i-th batch is marked as wd i , mark the processing air volume of batch i as fl i , mark the processing humidity of batch i as sd i ;

[0021]

[0022]

[0023] In the formula, represents the average double bond conversion rate of the ink of the PCB board in the i-th batch, ge represents the double bond conversion rate of the ink of the e-th PCB board in the i-th batch, It represents the standard deviation of the double bond conversion rate of the ith batch of PCB board ink, It represents the ratio of the average double bond conversion rate of ink to the processing temperature. It represents the ratio of the average double bond conversion rate of ink to the processing air volume. Indicates the ratio of the average double bond conversion rate of ink to the processing humidity, Hksj i Represents the baking data set of the i-th batch of PCB boards.

[0024] Preferably, in the monitoring data set Jcsj, when the standard deviation of the thickness of a single batch of PCB boards exceeds the thickness threshold HDY, it indicates that the thickness differences between the single batch of PCB boards are large, and a board abnormality signal is generated. If the standard deviation of the moisture content of a single batch of PCB boards exceeds the moisture threshold SFY, it indicates that the moisture content differences between the single batch of PCB boards are large, and a board abnormality signal is generated. If the standard deviation of the glass transition temperature of a single batch of PCB boards exceeds the transition threshold ZBY, it indicates that the glass transition temperature differences between the single batch of PCB boards are large, and a board abnormality signal is generated, and processing should be stopped immediately and the PCB boards should be optimized. When the silk screen index Syz is lower than the silk screen threshold SYY, it indicates that the silk screen processing quality of the single batch of PCB boards is poor, and a silk screen abnormality signal is generated, and silk screen printing should be stopped immediately and the PCB boards should be reprocessed.

[0025] Preferably, in the baking data set Hksj, when the standard deviation of the ink double bond conversion rate of a single batch of PCB boards exceeds the curing threshold GHY, it indicates that uneven heating exists among the PCB boards in the single batch, and the baking should be stopped immediately and the PCB boards should be restacked. If the ratio of the average ink double bond conversion rate to the processing temperature exceeds the temperature curing threshold WGY, it indicates that the single batch of PCB boards has an insufficient thermosetting reaction, and a thermosetting abnormality signal is generated, and the temperature curve should be optimized in a timely manner. If the ratio of the average ink double bond conversion rate to the processing air volume exceeds the air volume threshold WLY, it indicates that the single batch of PCB boards has a poor curing problem, and an air volume abnormality signal is generated, and the processing air volume should be adjusted in a timely manner. If the ratio of the average ink double bond conversion rate to the processing humidity exceeds the humidity threshold SDY, it indicates that the single batch of PCB boards has a poor curing problem, and a humidity abnormality signal is generated, and the processing humidity should be adjusted in a timely manner.

[0026] A method for rapid and automatic temperature matching in a silk screen baking process, comprising the following steps:

[0027] Step 1: Connect the detection device and the sensor device through the network to obtain the board data, screen printing data, and baking data of all batches of PCB boards, and classify them into board data sets, screen printing data sets, and baking data sets;

[0028] Step 2: Analyze the production quality of each batch of PCB boards based on the board data set and generate the corresponding monitoring data set Jcsj;

[0029] Step 3: Analyze the silk screen printing effect of each batch of PCB boards based on the silk screen printing data set and generate the corresponding silk screen printing index Syz;

[0030] Step 4: Analyze the baking status of each batch of PCB boards according to the baking data set, and generate the corresponding baking data group Hksj;

[0031] Step 5: Set fixed values for the thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Combined with the monitoring data group Jcsj, screen printing index Syz, and baking data group Hksj, evaluate the uniformity, screen printing quality, and baking status of each batch of PCB boards, and generate corresponding warning signals and control instructions.

[0032] Compared with the prior art, the present invention provides a system and method for rapid and automatic temperature matching in a silk-screen baking process, which has the following beneficial effects:

[0033] 1. The present invention connects the detection device and the sensor device through a multi-dimensional monitoring module network to obtain the plate data, screen printing data, and baking data of all batches of PCB boards, and classifies them into plate data sets, screen printing data sets, and baking data sets. The intelligent adjustment module analyzes the production quality of each batch of PCB boards based on the plate data sets and generates a corresponding monitoring data set Jcsj, ensuring the consistency of each batch of materials. The intelligent adjustment module analyzes the screen printing effect of each batch of PCB boards based on the screen printing data sets and generates a corresponding screen printing index Syz to quantify the screen printing effect, prevent defective products from flowing into subsequent processes, and provide more timely real-time monitoring response.

[0034] 2. The present invention uses an intelligent adjustment module to analyze the baking status of each batch of PCB boards based on the baking data set and generate a corresponding baking data set Hksj. This accurately identifies problems such as poor curing or uneven heating, thereby improving the reliability of the finished product. The intelligent adjustment module is equipped with fixed values for thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Combined with the monitoring data set Jcsj, screen printing index Syz, and baking data set Hksj, the module evaluates the uniformity, screen printing quality, and baking status of each batch of PCB boards, generating corresponding warning signals and control instructions. In actual production, the threshold configuration of all indicators can be flexibly adjusted to adapt to multi-variety, small-batch production scenarios, achieve automatic adjustment of baking parameters, ensure optimal curing efficiency, reduce energy consumption costs, and evaluate product quality from multiple dimensions. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 This is a flow chart of the system of the present invention;

[0036] Figure 2 This is a step diagram of the method of the present invention. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] The traditional temperature matching system for screen printing and baking processes lacks automated control and monitoring, making it difficult to achieve real-time monitoring and dynamic adjustment of the baking process. In actual operation, due to factors such as structural limitations of the baking equipment or uneven heat conduction, cold spots are easily formed on the PCB surface where the temperature is lower than the surrounding areas. The ink in these cold spots may not fully cure, causing the board to explode, ultimately leading to reduced product adhesion and reliability. Therefore, a fast and automatic temperature matching system and method for screen printing and baking processes is provided. Please refer to the following. Figure 1-Figure 2 , a fast and automatic temperature matching system for screen printing and baking process, including a multi-dimensional monitoring module and an intelligent adjustment module;

[0039] The multi-dimensional monitoring module consists of a board management unit, a screen printing monitoring unit, and a baking monitoring unit. The board data unit collects board data sets through a network connection to the detection device. The board data sets include the number of PCB boards in each batch, PCB board thickness, PCB board moisture content, and PCB board glass transition temperature.

[0040] Specifically, the moisture content of the PCB board directly reflects the dryness of the board. When the moisture content is too high, it will directly affect the ink adhesion, resulting in poor screen printing effect. The higher the glass transition temperature of the PCB board, the better the heat and moisture resistance of the material, and it is not easy to absorb moisture and deform in high temperature and high humidity environments.

[0041] The screen printing monitoring unit collects screen printing data sets through a network connection to the detection device. The screen printing data sets include screen tension, scraper flatness error, ink viscosity, and ink transparency for each batch.

[0042] Specifically, choosing a screen with appropriate tension, a scraper, and low-viscosity, high-transparency screen printing ink can ensure that the ink can adhere and spread well on the PCB surface to avoid latent image problems;

[0043] The baking monitoring unit is connected to the sensor device and the detection device through the network to collect the baking data set, and the baking data set includes the processing temperature, processing air volume, processing humidity and ink double bond conversion rate;

[0044] Specifically, the double bond conversion rate of ink is a key indicator to measure the degree of curing. When the double bond conversion rate reaches its maximum value and tends to be stable, it means that the ink has reached the highest degree of curing.

[0045] The intelligent adjustment module consists of a board evaluation unit, a screen printing evaluation unit, a baking evaluation unit, and a dynamic management unit. The board evaluation unit analyzes the production quality of each batch of PCB boards based on the board data set and generates a corresponding monitoring data set Jcsj. The calculation process is as follows:

[0046] Based on the plate data set, extract the plate data of the i-th batch, mark the number of PCB boards in the i-th batch as N, mark the thickness of each PCB board in the i-th batch as {h1, h2, h3, ..., hN}, mark the moisture content of each PCB board in the i-th batch as {s1, s2, s3, ..., sN}, and mark the glass transition temperature of each PCB board in the i-th batch as {z1, z2, z3, ..., zN};

[0047]

[0048] In the formula, represents the average thickness of the PCB board in the i-th batch, represents the average moisture content of the PCB board in the i-th batch, represents the average glass transition temperature of the PCB board in the i-th batch, hx represents the thickness of the x-th PCB board in the i-th batch, x∈N, sx represents the moisture content of the x-th PCB board in the i-th batch, zx represents the glass transition temperature of the x-th PCB board in the i-th batch, represents the standard deviation of the thickness of the PCB board in the i-th batch, represents the standard deviation of the moisture content of the PCB board in the i-th batch, Indicates the standard deviation of the glass transition temperature of the PCB board in the i-th batch, Jcsj i Represents the monitoring data set of the i-th batch of PCB boards, ensuring the consistency of each batch of materials;

[0049] The silk screen evaluation unit analyzes the silk screen effect of each batch of PCB boards based on the silk screen data set and generates the corresponding silk screen index Syz. The calculation process is as follows:

[0050] According to the silk screen data set, extract the silk screen data of the PCB board of the i-th batch and mark the silk screen tension of the i-th batch as wz i , mark the scraper flatness error of the i-th batch as dp i , mark the viscosity of the ink of batch i as mn i , mark the ink transparency of batch i as mt i ;

[0051]

[0052] In the formula, BWZ represents the standard value for measuring screen tension, α1 represents the weight for the ratio of screen tension to the standard value, BDP represents the standard value for measuring scraper flatness error, α2 represents the weight for the ratio of the standard value to scraper flatness error, BMN represents the standard value for measuring ink viscosity, α3 represents the weight for the ratio of the standard value to ink viscosity, BMT represents the standard value for measuring ink transparency, α4 represents the weight for the ratio of ink transparency to the standard value, α1, α2, α3 and α4 are all constants, and α1+α2+α3+α4=1. Indicates that the silk screen index Syz of the i-th batch is calculated according to the weights α1, α2, α3 and α4 i , quantify the silk screen printing effect and avoid defective products flowing into subsequent processes;

[0053] The baking evaluation unit analyzes the baking status of each batch of PCB boards based on the baking data set and generates the corresponding baking data set Hksj. The calculation process is as follows:

[0054] According to the baking data set, the baking data of the i-th batch of PCB boards are extracted, and the ink double bond conversion rate of each PCB board in the i-th batch is marked as {g1, g2, g3, ..., gN}, and the processing temperature of the i-th batch is marked as wd i , mark the processing air volume of batch i as fl i , mark the processing humidity of batch i as sd i ;

[0055]

[0056] In the formula, represents the average double bond conversion rate of the ink of the PCB board in the i-th batch, ge represents the double bond conversion rate of the ink of the e-th PCB board in the i-th batch, e∈N, It represents the standard deviation of the double bond conversion rate of the ith batch of PCB board ink, It represents the ratio of the average double bond conversion rate of ink to the processing temperature. It represents the ratio of the average double bond conversion rate of ink to the processing air volume. Indicates the ratio of the average double bond conversion rate of ink to the processing humidity, Hksj i Represents the baking data set of the i-th batch of PCB boards, accurately identifying problems such as poor curing or uneven heating, and improving the reliability of the finished product;

[0057] The dynamic management unit is equipped with fixed values for thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Combined with the monitoring data group Jcsj, screen printing index Syz, and baking data group Hksj, it evaluates the uniformity, screen printing quality, and baking status of each batch of PCB boards, and generates corresponding warning signals and control instructions.

[0058] In the monitoring data set Jcsj, if the standard deviation of the thickness of a single batch of PCB boards exceeds the thickness threshold HDY, it indicates that the thickness differences between the single batch of PCB boards are large, and a board abnormality signal is generated. If the standard deviation of the moisture content of a single batch of PCB boards exceeds the moisture threshold SFY, it indicates that the moisture content differences between the single batch of PCB boards are large, and a board abnormality signal is generated. If the standard deviation of the glass transition temperature of a single batch of PCB boards exceeds the transition threshold ZBY, it indicates that the glass transition temperature differences between the single batch of PCB boards are large, and a board abnormality signal is generated. Processing should be stopped immediately and the PCB boards should be optimized. If the silk screen index Syz is lower than the silk screen threshold SYY, it indicates that the silk screen processing quality of the single batch of PCB boards is poor, and a silk screen abnormality signal is generated. Silk screen printing should be stopped immediately and the PCB boards should be reprocessed. This can detect problems in the early stages of batch production, avoid large-scale rework or scrap, and reduce the waste of raw materials and energy.

[0059] In the baking data set Hksj, if the standard deviation of the ink double bond conversion rate for a single batch of PCB boards exceeds the curing threshold GHY, it indicates uneven heating across the batch. Baking should be stopped immediately and the PCB boards should be restacked. If the ratio of the average ink double bond conversion rate to the processing temperature exceeds the curing threshold WGY, it indicates insufficient thermosetting reaction within the batch of PCB boards, generating a thermosetting anomaly signal and prompting timely temperature curve optimization. If the ratio of the average ink double bond conversion rate to the processing air volume exceeds the air volume threshold WLY, it indicates poor curing within the batch of PCB boards, generating an air volume anomaly signal and prompting timely adjustment of the processing air volume. If the ratio of the average ink double bond conversion rate to the processing humidity exceeds the humidity threshold SDY, it indicates poor curing within the batch of PCB boards, generating a humidity anomaly signal and prompting timely adjustment of the processing humidity. In actual production, the threshold configuration of all indicators can be flexibly adjusted to accommodate high-variety, small-batch production scenarios, enabling automatic adjustment of baking parameters to ensure optimal curing efficiency and reduce energy costs.

[0060] A method for rapid and automatic temperature matching in a silk screen baking process, comprising the following steps:

[0061] Step 1: Connect the detection device and the sensor device through the network to obtain the board data, screen printing data, and baking data of all batches of PCB boards, and classify them into board data sets, screen printing data sets, and baking data sets;

[0062] Step 2: Analyze the production quality of each batch of PCB boards based on the board data set and generate the corresponding monitoring data set Jcsj;

[0063] Step 3: Analyze the silk screen printing effect of each batch of PCB boards based on the silk screen printing data set and generate the corresponding silk screen printing index Syz, which enables real-time monitoring and more timely response;

[0064] Step 4: Analyze the baking status of each batch of PCB boards according to the baking data set, and generate the corresponding baking data group Hksj;

[0065] Step 5: Set fixed values for thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Then, combine the monitoring data group Jcsj, screen printing index Syz, and baking data group Hksj to evaluate the uniformity, screen printing quality, and baking status of each batch of PCB boards, generate corresponding early warning signals and control instructions, and evaluate product quality in multiple dimensions.

[0066] Example 1:

[0067] In this experiment, 5 PCB boards were selected as experimental objects. These 5 PCB boards belonged to the same batch. After testing, the thickness of the PCB boards in this batch were 1.2mm, 1.3mm, 1.1mm, 1.4mm and 1.0mm respectively. The moisture content of the PCB boards were 0.3%, 0.4%, 0.2%, 0.5% and 0.1% respectively. The glass transition temperatures of the PCB boards were 130℃, 132℃, 128℃, 135℃ and 125℃ respectively. The monitoring data set Jcsj for this batch of PCB boards i The calculation process is as follows:

[0068]

[0069] In the formula, Indicates the average thickness of the PCB board in this batch. Indicates the average moisture content of the batch of PCB boards. Indicates the average glass transition temperature of this batch of PCB boards. Indicates the standard deviation of the thickness of the PCB board in this batch. Indicates the standard deviation of the moisture content of the PCB board in this batch. Indicates the standard deviation of the glass transition temperature of this batch of PCB boards. The thickness threshold HDY is set to 0.3mm, the moisture threshold SFY is set to 0.5%, and the transition threshold ZBY is set to 3°C. After judgment, it is determined that the standard deviation of the glass transition temperature of this batch of PCB boards has exceeded the transition threshold ZBY, indicating that the glass transition temperatures of the boards in this batch vary greatly. A board abnormality signal is generated, and processing should be stopped immediately, and the PCB boards should be optimized.

[0070] Example 2:

[0071] In this experiment, a screen printing machine with a screen tension of 18N was selected as the experimental object. After testing, the scraper flatness error of the machine when processing a single batch of PCB boards was 0.03mm, the ink viscosity was 800Pa·s, and the ink transparency was 75%. The screen printing index Syz of this batch of PCB boards was i The calculation process is as follows:

[0072]

[0073] In the formula, BWZ = 20 represents the standard value for measuring screen tension, α1 = 0.3 represents the weight for the ratio of screen tension to the standard value, BDP = 0.05 represents the standard value for measuring scraper flatness error, α2 = 0.2 represents the weight for the ratio of the standard value to scraper flatness error, BMN = 1000 represents the standard value for measuring ink viscosity, α3 = 0.4 represents the weight for the ratio of the standard value to ink viscosity, BMT = 0.8 represents the standard value for measuring ink transparency, α4 = 0.1 represents the weight for the ratio of ink transparency to the standard value, α1, α2, α3 and α4 are all constants, and 0.3 + 0.2 + 0.4 + 0.1 = 1. According to the weights of α1, α2, α3 and α4, the screen printing index Syz of this batch of PCB boards is calculated. i It is approximately 1.197. The silk screen threshold SYY is set to 1.5. After judgment, the silk screen index Syz4 of this batch of PCB boards is lower than the silk screen threshold SYY, indicating that the silk screen processing quality of this batch of PCB boards is poor. A silk screen abnormality signal is generated. The silk screen printing should be stopped immediately and the PCB boards should be reprocessed.

[0074] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A fast and automatic temperature matching system for screen printing baking process, characterized by: Including multi-dimensional monitoring module and intelligent adjustment module; The multi-dimensional monitoring module consists of a plate management unit, a screen printing monitoring unit and a baking monitoring unit. The plate data unit collects plate data sets through a network connection detection device, the screen printing monitoring unit collects screen printing data sets through a network connection detection device, and the baking monitoring unit collects baking data sets through a network connection sensing device and detection device; The intelligent adjustment module consists of a plate evaluation unit, a screen printing evaluation unit, a baking evaluation unit, and a dynamic management unit. The plate evaluation unit analyzes the production quality of each batch of PCB boards based on the plate data set and generates a corresponding monitoring data set Jcsj. The screen printing evaluation unit analyzes the screen printing effect of each batch of PCB boards based on the screen printing data set and generates a corresponding screen printing index Syz. The baking evaluation unit analyzes the baking status of each batch of PCB boards based on the baking data set and generates a corresponding baking data set Hksj. The dynamic management unit is set with fixed values for thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Combined with the monitoring data set Jcsj, screen printing index Syz, and baking data set Hksj, it evaluates the uniformity, screen printing processing quality, and baking status of each batch of PCB boards and generates corresponding early warning signals and control instructions.

2. The rapid automatic temperature matching system for screen printing baking process according to claim 1, characterized in that: The board data set includes the number of PCB boards in each batch, the thickness of the PCB boards, the moisture content of the PCB boards, and the glass transition temperature of the PCB boards.

3. The rapid automatic temperature matching system for screen printing baking process according to claim 2, characterized in that: The screen printing dataset includes screen tension, squeegee flatness error, ink viscosity, and ink transparency for each batch.

4. The rapid automatic temperature matching system for screen printing baking process according to claim 3, characterized in that: The baking data set includes processing temperature, processing air volume, processing humidity and ink double bond conversion rate.

5. The rapid automatic temperature matching system for screen printing baking process according to claim 4, characterized in that: The calculation process of the monitoring data set Jcsj is as follows: Based on the plate data set, extract the plate data of the i-th batch, mark the number of PCB boards in the i-th batch as N, mark the thickness of each PCB board in the i-th batch as {h1, h2, h3, ..., hN}, mark the moisture content of each PCB board in the i-th batch as {s1, s2, s3, ..., sN}, and mark the glass transition temperature of each PCB board in the i-th batch as {z1, z2, z3, ..., zN}; In the formula, represents the average thickness of the PCB board in the i-th batch, represents the average moisture content of the PCB board in the i-th batch, represents the average glass transition temperature of the PCB board in the i-th batch, hx represents the thickness of the x-th PCB board in the i-th batch, x∈N, sx represents the moisture content of the x-th PCB board in the i-th batch, zx represents the glass transition temperature of the x-th PCB board in the i-th batch, represents the standard deviation of the thickness of the PCB board in the i-th batch, represents the standard deviation of the moisture content of the PCB board in the i-th batch, Indicates the standard deviation of the glass transition temperature of the PCB board in the i-th batch, Jcsj i Represents the monitoring data set of the i-th batch of PCB boards.

6. The rapid automatic temperature matching system for screen printing baking process according to claim 5, characterized in that: The calculation process of the silk screen index Syz is as follows: According to the silk screen data set, extract the silk screen data of the PCB board of the i-th batch and mark the silk screen tension of the i-th batch as wz i , mark the scraper flatness error of the i-th batch as dp i , mark the viscosity of the ink of batch i as mn i , mark the ink transparency of batch i as mt i ; In the formula, BWZ represents the standard value for measuring screen tension, α1 represents the weight for the ratio of screen tension to the standard value, BDP represents the standard value for measuring scraper flatness error, α2 represents the weight for the ratio of the standard value to scraper flatness error, BMN represents the standard value for measuring ink viscosity, α3 represents the weight for the ratio of the standard value to ink viscosity, BMT represents the standard value for measuring ink transparency, α4 represents the weight for the ratio of ink transparency to the standard value, α1, α2, α3 and α4 are all constants, and α1+α2+α3+α4=1. Indicates that the silk screen index Syz of the i-th batch is calculated according to the weights α1, α2, α3 and α4 i .

7. The rapid automatic temperature matching system for screen printing baking process according to claim 6, characterized in that: The calculation process of the baking data set Hksj is as follows: According to the baking data set, the baking data of the i-th batch of PCB boards are extracted, and the ink double bond conversion rate of each PCB board in the i-th batch is marked as {g1, g2, g3, ..., gN}, and the processing temperature of the i-th batch is marked as wd i , mark the processing air volume of batch i as fl i , mark the processing humidity of batch i as sd i ; In the formula, represents the average double bond conversion rate of the ink of the PCB board in the i-th batch, ge represents the double bond conversion rate of the ink of the e-th PCB board in the i-th batch, e∈N, It represents the standard deviation of the double bond conversion rate of the ith batch of PCB board ink, It represents the ratio of the average double bond conversion rate of ink to the processing temperature. It represents the ratio of the average double bond conversion rate of ink to the processing air volume. Indicates the ratio of the average double bond conversion rate of ink to the processing humidity, Hksj i Represents the baking data set of the i-th batch of PCB boards.

8. The rapid automatic temperature matching system for screen printing baking process according to claim 7, characterized in that: In the monitoring data set Jcsj, if the standard deviation of the thickness of a single batch of PCB boards exceeds the thickness threshold HDY, it indicates that the thickness differences between the single batch of PCB boards are large, and a board abnormality signal is generated. If the standard deviation of the moisture content of a single batch of PCB boards exceeds the moisture threshold SFY, it indicates that the moisture content differences between the single batch of PCB boards are large, and a board abnormality signal is generated. If the standard deviation of the glass transition temperature of a single batch of PCB boards exceeds the transition threshold ZBY, it indicates that the glass transition temperature differences between the single batch of PCB boards are large, and a board abnormality signal is generated, indicating that processing should be stopped immediately and the PCB boards should be optimized. If the silk screen index Syz is lower than the silk screen threshold SYY, it indicates that the silk screen processing quality of the single batch of PCB boards is poor, and a silk screen abnormality signal is generated, indicating that silk screen printing should be stopped immediately and the PCB boards should be reprocessed.

9. The rapid automatic temperature matching system for screen printing baking process according to claim 8, characterized in that: In the baking data set Hksj, if the standard deviation of the ink double bond conversion rate of a single batch of PCB boards exceeds the curing threshold GHY, it indicates that uneven heating exists among the PCB boards in the single batch. Baking should be stopped immediately and the PCB boards should be restacked. If the ratio of the average ink double bond conversion rate to the processing temperature exceeds the temperature curing threshold WGY, it indicates that the single batch of PCB boards has an insufficient thermosetting reaction. A thermosetting abnormality signal is generated, and the temperature curve should be optimized promptly. If the ratio of the average ink double bond conversion rate to the processing air volume exceeds the air volume threshold WLY, it indicates that the single batch of PCB boards has a poor curing problem. A air volume abnormality signal is generated, and the processing air volume should be adjusted promptly. If the ratio of the average ink double bond conversion rate to the processing humidity exceeds the humidity threshold SDY, it indicates that the single batch of PCB boards has a poor curing problem. A humidity abnormality signal is generated, and the processing humidity should be adjusted promptly.

10. A method for rapid automatic temperature matching in a screen printing baking process, applied to a system for rapid automatic temperature matching in a screen printing baking process as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: Connect the detection device and the sensor device through the network to obtain the board data, screen printing data, and baking data of all batches of PCB boards, and classify them into board data sets, screen printing data sets, and baking data sets; Step 2: Analyze the production quality of each batch of PCB boards based on the board data set and generate the corresponding monitoring data set Jcsj; Step 3: Analyze the silk screen printing effect of each batch of PCB boards based on the silk screen printing data set and generate the corresponding silk screen printing index Syz; Step 4: Analyze the baking status of each batch of PCB boards according to the baking data set, and generate the corresponding baking data group Hksj; Step 5: Set fixed values for the thickness threshold HDY, moisture threshold SFY, transition threshold ZBY, screen printing threshold SYY, curing threshold GHY, temperature curing threshold WGY, air volume threshold WLY, and humidity threshold SDY. Combined with the monitoring data group Jcsj, screen printing index Syz, and baking data group Hksj, evaluate the uniformity, screen printing quality, and baking status of each batch of PCB boards, and generate corresponding warning signals and control instructions.

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