A power component and a vehicle

Abstract

This invention relates to a power module and a vehicle, belonging to the field of vehicle technology, to at least solve the problems of low heat dissipation efficiency, large three-phase junction temperature difference, high system voltage drop, and insufficient platform flexibility in the heat dissipation channels of existing power modules. The power module provided in this application includes a base and multiple power modules connected to the base. The base is provided with heat dissipation channels, and the multiple power modules are thermally connected to the heat dissipation channels, with the heat dissipation efficiency of the multiple power modules through the heat dissipation channels being consistent.

Description

Technical Field

[0001] This invention relates to the technical field of vehicles, and more specifically to a power component and a vehicle. Background Technology

[0002] In the field of automotive-grade power semiconductors for new energy vehicles, power modules, as core components of inverters, directly impact vehicle reliability and efficiency due to their heat dissipation performance. With the widespread adoption of 800V high-voltage platforms and the extensive use of SiC (Silicon Carbide) chips, the integration and thermal density of power modules have significantly increased. While chip size has shrunk, heat generation has increased dramatically, leading to higher junction temperatures, wider temperature differences between power module junctions, and even module failure. Therefore, designing efficient heat sinks to balance heat dissipation efficiency and junction temperature control has become a key technological challenge.

[0003] Existing power module heat sinks improve heat dissipation efficiency by eliminating the gap between the pinfin heat sink substrate and the cooling channels through blind holes in the base plate, allowing the coolant to fully contact the pinfin heat sink substrate and increasing the flow rate. However, this approach has some drawbacks: Firstly, the increased flow rate leads to greater energy loss when the coolant contacts the pinfin heat sink substrate, resulting in a significant increase in system pressure drop and placing higher demands on the pump performance. Secondly, this structure does not consider the temperature differences between the power modules. The coolant gradually heats up along the flow direction, resulting in lower temperatures for power modules near the inlet and significantly higher temperatures for those near the outlet, leading to a large junction temperature difference between the power modules and severely affecting their lifespan and stability.

[0004] In addition, some existing technologies employ microchannel liquid cooling plate designs, achieving efficient heat dissipation by etching staggered microchannels on both sides of the substrate. While this approach can improve heat dissipation efficiency through a high specific surface area, its microchannel structure significantly increases fluid flow resistance, resulting in a higher system pressure drop compared to traditional structures. Furthermore, the uniformity of coolant flow within the microchannels is poor, easily leading to localized overheating. Moreover, microchannel manufacturing relies on high-precision etching or 3D printing processes, requiring advanced equipment and technology, increasing processing costs compared to traditional Pin-Fin heat dissipation substrate structures, and making it difficult to adapt to the iterative upgrade needs of different power modules. Summary of the Invention

[0005] One objective of this invention is to provide a power component that solves the problems of low heat dissipation efficiency, large three-phase junction temperature difference, high system voltage drop, and insufficient platform flexibility in the heat dissipation channels of existing power modules; another objective is to provide a vehicle.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0007] According to a first aspect of this application, a power component includes a base and a plurality of power modules connected to the base. The base is provided with a heat dissipation channel, the plurality of power modules are thermally connected to the heat dissipation channel, and the heat dissipation efficiency of the plurality of power modules through the heat dissipation channel is consistent.

[0008] Based on the above technical means, by rationally designing the heat dissipation channel structure, the heat dissipation efficiency of multiple power modules is made consistent, which effectively solves the problem of large junction temperature difference among power modules, ensures the performance balance of each power module, and improves the stability and reliability of the entire power component.

[0009] In some alternative implementations, the heat dissipation channel has a liquid inlet and a liquid outlet, and the extension direction of the heat dissipation channel from the liquid inlet to the liquid outlet is consistent with the arrangement direction of the multiple power modules.

[0010] Based on the above technical means, the coolant flows through each power module in sequence, which facilitates continuous heat dissipation of multiple power modules. The structure is relatively simple and can be designed for targeted heat dissipation according to the arrangement order of the power modules.

[0011] In some alternative implementations, the cross-sectional area of ​​the heat dissipation channel gradually decreases from the inlet hole to the outlet hole.

[0012] According to the above technical means, as the coolant flows, the cross-sectional area of ​​the heat dissipation channel gradually decreases, which gradually increases the flow rate of the coolant. As the coolant temperature gradually increases, it can still maintain a good heat dissipation effect, balance the cooling efficiency between power modules, and further reduce the junction temperature difference between power modules.

[0013] In some alternative embodiments, the base includes a bottom wall and a top wall located on opposite sides of the heat dissipation channel. The top wall is used to mount multiple power modules, and the liquid inlet and drain are located on the bottom wall. The surface of the bottom wall facing the top wall is a first surface, extending from the liquid inlet to the drain, and the first surface is inclined toward the top wall.

[0014] Based on the aforementioned technical means, by forming a sloping structure, the distance between the power modules and the cooling channels gradually decreases. This results in a slower coolant velocity and lower temperature below the power modules near the inlet, while the velocity and temperature gradually increase as the coolant flows to the other power modules. This balances the cooling effect across multiple power modules, reduces the maximum junction temperature difference between them, and also lowers the pressure drop.

[0015] In some optional implementations, the heat dissipation channel includes a first main channel, a second main channel, and a plurality of branch channels connected between the first main channel and the second main channel. The first main channel has a liquid inlet hole, the second main channel has a liquid outlet hole, and the plurality of power modules are thermally connected to the plurality of branch channels respectively.

[0016] Based on the above technical means, the coolant can enter multiple branch channels at the same time to dissipate heat from each power module, thereby improving the heat dissipation efficiency and enabling more flexible control of the heat dissipation of each power module.

[0017] In some optional embodiments, the positions of the multiple branch channels connecting the first main channel are arranged sequentially from the end closest to the inlet hole to the end furthest from the inlet hole, and the cross-sectional size of the first main channel gradually decreases from the end closest to the inlet hole to the end furthest from the inlet hole; among the multiple branch channels, the branch channel closest to the inlet hole is the first branch channel, and the branch channel furthest from the inlet hole is the second branch channel, and the cross-sectional size of the second main channel gradually increases from the end connecting the first branch channel to the end connecting the second branch channel.

[0018] Based on the above technical means, by rationally designing the cross-sectional size changes of the first and second main channels, the coolant can be more evenly distributed to each branch channel, avoiding the problem of excessive or insufficient coolant flow in some branch channels, further improving the heat dissipation balance of each power module, and reducing the junction temperature difference of each power module.

[0019] In some alternative implementations, the first main channel and the second main channel are located on the same layer, and multiple branch channels are stacked with the first main channel and the second main channel.

[0020] Based on the above-mentioned technical means, this stacked structure makes the spatial layout of power components more compact, reduces the overall volume, and also facilitates the flow of coolant between the main channel and the branch channels, thereby improving heat dissipation efficiency.

[0021] In some alternative implementations, the direction in which the first main channel extends from the end near the inlet hole to the end away from the inlet hole is parallel to the direction in which the second main channel extends from the end connecting the first branch channel to the end connecting the second branch channel.

[0022] Based on the above technical means, the parallel arrangement of the first and second main channels makes the flow of coolant in the main channel smoother, reduces flow resistance, lowers system pressure drop, and also facilitates the connection of branch channels and the distribution of coolant.

[0023] In some alternative implementations, multiple branch channels are arranged sequentially along the extension direction of the first main channel and the extension direction of the second main channel.

[0024] Based on the above technical means, the orderly arrangement of the branch channels allows each power module to contact the coolant more evenly, improving the uniformity of heat dissipation and further reducing the junction temperature difference of each power module.

[0025] In some alternative embodiments, the portion of the base located between the first main channel and the second main channel is a connecting rib, and the connecting rib is inclined relative to the extension direction of the first main channel and the extension direction of the second main channel from one end to the other.

[0026] Based on the above technical means, the inclined connecting ribs can guide the flow of coolant between the main channel and the branch channel, so that the coolant can participate more fully in heat exchange, improve heat dissipation efficiency, and also enhance the structural strength of the base.

[0027] In some alternative implementations, the connecting rib extends in a stepped manner from one end to the other.

[0028] Based on the above technical means, the connecting ribs of the stepped structure can further balance the coolant flow of heat exchange in each functional module, reduce the situation where some coolant flows out directly from the outlet, and enable the coolant below each functional module to fully participate in heat exchange, improve cooling efficiency, and reduce the junction temperature difference of each functional module.

[0029] In some alternative embodiments, the power module includes a power device, a heat dissipation substrate disposed on the power device, and heat dissipation fins disposed on the surface of the heat dissipation substrate facing away from the power device, the heat dissipation fins being disposed in heat dissipation channels.

[0030] Based on the above technical means, the heat dissipation area is increased by setting heat dissipation fins, which improves heat dissipation efficiency and can more effectively transfer the heat generated by power devices to the coolant, thereby reducing the chip junction temperature.

[0031] In some alternative embodiments, the heat dissipation channel has a liquid inlet and a liquid outlet, at least one of which includes a main body section and a flared section, the flared section being connected between the main body section and the heat dissipation channel.

[0032] Based on the above-mentioned technical means, by setting a gradually expanding structure at the coolant inlet and outlet, the pressure loss of the coolant can be reduced, the pressure drop of the system can be reduced, thereby reducing energy consumption and improving the efficiency of the entire system.

[0033] According to a second aspect of this application, this application provides a vehicle that includes the aforementioned power components.

[0034] Based on the aforementioned technical means, by applying high-performance power components to vehicles, the performance and reliability of vehicle power modules can be improved, the heat dissipation requirements of vehicles for high-voltage platform power semiconductor modules can be met, and the overall performance and stability of vehicles can be improved.

[0035] The beneficial effects of this invention are:

[0036] (1) By setting a ramp or stepped structure in the series channel and a stepped or ramp structure in the parallel channel, the present invention effectively reduces the junction temperature of the chip, reduces the junction temperature difference of each power module, and reduces the system voltage drop.

[0037] (2) The present invention adopts a wave-shaped heat dissipation substrate structure, which increases the heat dissipation area and turbulence effect, and improves the heat exchange efficiency;

[0038] (3) By designing the coolant inlet and outlet as a gradually expanding structure, the present invention reduces pressure loss and system pressure drop;

[0039] (4) By setting the ramp or stepped structure as an independent and replaceable structure, the present invention has high platform flexibility and is conducive to product iteration and upgrading. Attached Figure Description

[0040] Figure 1 A schematic diagram of the packaging structure of a power module provided by the present invention;

[0041] Figure 2 A schematic diagram of a series heat dissipation substrate provided by the present invention;

[0042] Figure 3 This is a schematic diagram of a parallel heat dissipation substrate provided by the present invention;

[0043] Figure 4 A schematic diagram of the connection structure between a power module and a series heat dissipation channel provided by the present invention;

[0044] Figure 5 Left view of a connection structure between a power module and a series heat dissipation channel provided by the present invention;

[0045] Figure 6 This is a front view of a series heat dissipation channel structure provided by the present invention;

[0046] Figure 7 This is a top view of a series heat dissipation channel structure provided by the present invention;

[0047] Figure 8 This is a left view of a series heat dissipation channel structure provided by the present invention;

[0048] Figure 9 This invention provides a schematic diagram of the connection structure between a power module and a parallel heat dissipation channel.

[0049] Figure 10 Left view of a connection structure between a power module and a parallel heat dissipation channel provided by the present invention;

[0050] Figure 11 A bottom view of a parallel heat dissipation channel structure provided by the present invention;

[0051] Figure 12 A top view of a parallel heat dissipation channel structure provided by the present invention;

[0052] Figure 13 This is a front view of a parallel heat dissipation channel structure provided by the present invention;

[0053] Figure 14 The left view shows a parallel heat dissipation channel structure provided by the present invention.

[0054] Among them, 100 is the power component; 10 is the base; 11 is the bottom wall; 12 is the top wall; 20 is the power module; 21 is the power device; 22 is the heat dissipation substrate; 23 is the heat dissipation fins; 30 is the heat dissipation channel; 31 is the first main channel; 32 is the second main channel; 33 is the branch channel; 310 is the liquid inlet; 320 is the liquid outlet; 301 is the main body section; 302 is the flared section; and 40 is the connecting rib. Detailed Implementation

[0055] The embodiments of the present invention will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention and not for limiting the scope of protection of the present invention.

[0056] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0057] In the description of the embodiments in this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0058] In the description of the embodiments of this application, the term "multiple" refers to two or more (including two).

[0059] In some embodiments, this application provides a vehicle. The specific type of vehicle is not specifically limited in this application; for example, the vehicle provided in this application can be an electric vehicle, a hybrid electric vehicle, or a solar-powered vehicle. Furthermore, the vehicle provided in this application can also be of different forms. For example, the vehicle provided in this application can be a sedan, a sport utility vehicle (SUV), or a multi-purpose vehicle (MPV).

[0060] Next, see Figures 1-14 The following describes the power groups provided in some embodiments of this application.

[0061] In some embodiments, see Figures 1-14 This application proposes a power component, including a base 10 and multiple power modules 20 connected to the base 10. The base 10 is provided with a heat dissipation channel 30, and the multiple power modules 20 are thermally connected to the heat dissipation channel 30. The heat dissipation efficiency of the multiple power modules 20 through the heat dissipation channel 30 is consistent. It should be noted that the heat dissipation channel 30 described in this embodiment is used for the flow of coolant, wherein the coolant can be a water-based coolant, an oil-based coolant, a fluorinated liquid (electronic fluorinated liquid), a boiling type coolant (such as boiling electronic fluorinated liquid), etc.

[0062] It should be noted that the multiple power modules 20 described in this embodiment may be two, three, four, five, or six power modules 20, etc. The specific number can be designed and configured according to the specific vehicle model and technical requirements (such as three power modules 20), and is not limited here.

[0063] It should be noted that the consistent heat dissipation efficiency of multiple power modules 20 through the heat dissipation channel 30 means that the heat transfer capacity of the multiple power modules tends to be balanced during operation, so as to control the junction temperature difference of each module within a reasonable range. Here, "consistent" does not require absolute identical performance, but rather allows for a certain reasonable difference in practical engineering.

[0064] For example, multiple power modules 20 are thermally connected to the heat dissipation channel 30. At least a portion of the power module 20 can be placed inside the heat dissipation channel 30, and heat exchange with the power module 20 can be achieved by the coolant flowing through the heat dissipation channel 30.

[0065] It should be noted that at least part of the power module 20 described in this embodiment refers to the physical contact between the key components (such as heat sink fins, heat sink substrate, etc.) that directly participate in heat conduction in the power module and the heat dissipation channel. Its core is to enable heat to be efficiently transferred to the coolant through structural design.

[0066] Based on this, the structure of the heat dissipation channel 30 is optimized to ensure uniform flow rate, velocity, and temperature distribution of the coolant flowing under each power module 20, thereby achieving consistent heat dissipation efficiency. This effectively solves the problem of large junction temperature differences among the power modules, ensures the performance balance of each power module, and improves the stability and reliability of the entire power assembly.

[0067] In some embodiments, see Figures 4-8 The heat dissipation channel 30 has a liquid inlet 310 and a liquid outlet 320. The extension direction of the heat dissipation channel 30 from the liquid inlet 310 to the liquid outlet 320 is consistent with the arrangement direction of the multiple power modules 20.

[0068] Based on this, since the extension direction of the heat dissipation channel 30 is consistent with the arrangement direction of the multiple power modules 20, the coolant entering the heat dissipation channel 30 flows sequentially through each power module 20 to achieve continuous heat dissipation for the multiple power modules 20.

[0069] In some embodiments, see Figure 4 and Figure 6 From the liquid inlet 310 to the liquid outlet 320, the cross-sectional area of ​​the heat dissipation channel 30 gradually decreases.

[0070] For example, to achieve a gradual decrease in the cross-sectional area of ​​the heat dissipation channel 30, the bottom surface of the heat dissipation channel 30 can be set as an inclined slope, or an inclined guide plate can be set inside the heat dissipation channel 30, with the guide plate and the inclined surface inclined upwards towards the drain hole 320. Alternatively, the heat dissipation channel 30 can be set as a stepped pipe, that is, the cross-sectional area of ​​the pipe gradually decreases from one end near the inlet hole 310 to the other end.

[0071] Specifically, when the heat dissipation channel is a series structure, the cross-sectional area of ​​the heat dissipation channel 30 gradually decreases from the inlet hole 310 to the outlet hole 320, which gradually increases the flow rate of the coolant entering the heat dissipation channel 30. As a result, even when the coolant temperature gradually increases, it can still maintain a good heat dissipation effect, balance the cooling efficiency between each power module 20, and further reduce the junction temperature difference between each power module 20.

[0072] Understandably, by designing the cross-sectional area of ​​the heat dissipation channel 30 to gradually decrease from the inlet hole 310 to the outlet hole 320, the coolant flows slowly and at a low temperature in the area near the power module 20 with a larger cross-sectional area. According to fluid mechanics principles, a slower flow rate means a longer residence time for the coolant near the inlet hole 310, allowing it to fully absorb heat from the power module 20 and raise its own temperature. The heated coolant does not accumulate quickly but gradually flows towards the remaining power modules 20. At this point, the coolant that first flows near the inlet hole 310 has already carried some heat. As it flows through the remaining power modules 20, the gradually decreasing cross-sectional area of ​​the heat dissipation channel 30 increases the flow rate, rapidly flushing the surface of the remaining power modules 20 and carrying away even more heat. That is, the power module 20 near the liquid inlet 310 is subjected to low-speed, low-temperature heat absorption by the coolant, while the other power modules 20 are cooled by high-speed, strong convection, so as to avoid the temperature of a certain power module 20 being too high due to insufficient heat dissipation, thereby balancing the junction temperature difference between the power modules 20.

[0073] In some embodiments, see Figure 4 The base 10 includes a bottom wall 11 and a top wall 12 located on opposite sides of the heat dissipation channel 30. The top wall 12 is used to mount multiple power modules 20. An inlet 310 and a drain 320 are provided on the bottom wall 11. The surface of the bottom wall 11 facing the top wall 12 is a first surface. From the inlet 310 to the drain 320, the first surface is inclined towards the top wall 12. The inclination angle of the first surface can be designed according to actual conditions and is not limited here.

[0074] It should be noted that the top wall 12 described in this embodiment may be a connecting rib between two adjacent power modules 20.

[0075] For example, multiple power modules 20 are thermally connected to the heat dissipation channel 30. The heat dissipation substrate 22 of the power module 20 can be mechanically pressed or welded to the top wall 12 of the base 10, where the top wall 12 is the upper wall surface of the heat dissipation channel 30. The contact surface between the heat dissipation substrate 22 and the top wall 12 can be precision machined to ensure no gaps. Heat is transferred from the power device 21 → heat dissipation substrate 22 → top wall 12 of the base → coolant within the channel. The conduction path is short, relying on the high thermal conductivity of the metal substrate (such as copper or aluminum). This method is suitable for modules with uniform heat generation and moderate power density (such as IGBT modules); where a simplified channel structure is required (no need to design fin insertion positions).

[0076] Based on this, by forming a sloping structure (the first surface tilts towards the top wall 12), the cross-sectional area of ​​the flow channel gradually changes, from the inlet hole 310 to the outlet hole 320, the cross-sectional area of ​​the heat dissipation flow channel 30 gradually decreases. For example, the initial cross-sectional area is A1, the end cross-sectional area is A2, and A1 > A2. By reducing the flow cross-sectional area, the fluid velocity is increased, compensating for the decrease in heat dissipation capacity caused by the increase in coolant temperature. Even if the coolant velocity is slow and the temperature is low below the power module 20 near the inlet hole 310, as the coolant flows to the other power modules 20, the velocity gradually increases and the temperature gradually rises, balancing the cooling effect of each power module 20 and reducing the maximum junction temperature difference of each power module 20.

[0077] In some embodiments, see Figures 9-13 The heat dissipation channel 30 includes a first main channel 31, a second main channel 32, and a plurality of branch channels 33 connected between the first main channel 31 and the second main channel 32. The first main channel 31 has a liquid inlet 310, the second main channel 32 has a liquid outlet 320, and the plurality of power modules 20 are thermally connected to the plurality of branch channels 33 respectively.

[0078] For example, multiple power modules 20 are thermally connected to multiple branch channels 33 respectively. This can be achieved by placing at least a portion of the power modules 20 within the branch channels 33 and allowing the coolant to flow through the branch channels 33 to achieve heat exchange with the power modules 20.

[0079] Based on this, when the heat dissipation channel 30 is a parallel structure, the coolant can enter multiple branch channels 33 at the same time to dissipate heat from each power module 20, thereby improving the heat dissipation efficiency and enabling more flexible control of the heat dissipation of each power module.

[0080] In some embodiments, see Figures 9-13 The positions of the multiple branch channels 33 connected to the first main channel 31 are arranged sequentially from the end closest to the inlet hole 310 to the end furthest from the inlet hole 310, and the cross-sectional size of the first main channel 31 gradually decreases from the end closest to the inlet hole 310 to the end furthest from the inlet hole 310.

[0081] Among the multiple branch channels 33, the branch channel 33 closer to the liquid inlet 310 is the first branch channel, and the branch channel 33 farther away from the liquid inlet 310 is the second branch channel. From the end connected to the first branch channel to the end connected to the second branch channel, the cross-sectional size of the second main channel 32 gradually increases.

[0082] Based on this, by rationally designing the cross-sectional size changes of the first main channel 31 and the second main channel 32, the coolant can be more evenly distributed to each branch channel 33, avoiding the problem of excessive or insufficient coolant flow in some branch channels 33, further improving the heat dissipation balance of each power module and reducing the junction temperature difference of each power module.

[0083] In some embodiments, see Figures 11-13 The first main channel 31 and the second main channel 32 are located on the same layer, and multiple branch channels 33 are stacked with the first main channel 31 and the second main channel 32.

[0084] Based on this, the stacked structure makes the spatial layout of the power components 100 more compact, reduces the overall volume, and also facilitates the flow of coolant between the main channels (first main channel 31 and second main channel 32) and the branch channels 33, thereby improving heat dissipation efficiency.

[0085] In some embodiments, see Figures 11-13 The direction in which the first main channel 31 extends from the end near the liquid inlet 310 to the end away from the liquid inlet 310 is parallel to the direction in which the second main channel 32 extends from the end connected to the first branch channel to the end connected to the second branch channel.

[0086] Based on this, the parallel arrangement of the first main channel 31 and the second main channel 32 makes the flow of coolant in the main channel smoother, reduces flow resistance, lowers system pressure drop, and also facilitates the connection of the branch channel 33 and the distribution of coolant.

[0087] Understandably, the cross-sectional size of the first main channel 31 gradually decreases from the end closest to the inlet port 310 to the end furthest from the inlet port 310. This gradual decrease in cross-sectional size helps to balance the inlet pressure of each branch channel 33. The cross-sectional size of the second main channel 32 gradually increases from the end connecting to the first branch channel to the end connecting to the second branch channel, thereby reducing the outlet back pressure.

[0088] In some embodiments, see Figure 11 and Figure 12 Multiple tributary channels 33 are arranged sequentially along the extension direction of the first main channel 31 and the extension direction of the second main channel 32.

[0089] Based on this, the orderly arrangement of the branch channels allows each power module 20 to contact the coolant more evenly, improving the uniformity of heat dissipation and further reducing the junction temperature difference of each power module 20.

[0090] Understandably, multiple branch channels 33 correspond to individual power modules 20 and are stacked with the main channel (such as an upper and lower layer structure). By reducing flow resistance through short straight channels, heat dissipation efficiency is effectively improved.

[0091] In some embodiments, see Figure 11The portion of the base 10 located between the first main channel 31 and the second main channel 32 is a connecting rib 40. The connecting rib 40 is inclined relative to the extension direction of the first main channel 31 and the extension direction of the second main channel 32, pointing from one end to the other.

[0092] Based on this, the inclined connecting ribs 40 can guide the flow of coolant between the main channel and the branch channel 33, so that the coolant can participate more fully in heat exchange, improve heat dissipation efficiency, and also enhance the structural strength of the base 10.

[0093] In some embodiments, see Figure 11 The connecting rib 40 extends from one end to the other in a stepped manner.

[0094] Based on this, by tilting the connecting rib 40 of the base 10 between the two main channels (the first main channel 31 and the second main channel 32) in a stepped manner, the fluid can be effectively guided to be evenly distributed to each branch channel 33, avoiding the problem of "excessive flow at the near end and insufficient flow at the far end". This further balances the coolant flow rate of heat exchange in each functional module, reduces the situation where some coolant flows out directly from the outlet, and allows the coolant below each functional module to fully participate in heat exchange, improving cooling efficiency and reducing the junction temperature difference between each functional module.

[0095] In some embodiments, see Figure 4 and Figure 5 The power module 20 includes a power device 21, a heat dissipation substrate 22 disposed on the power device 21, and heat dissipation fins 23 disposed on the surface of the heat dissipation substrate 22 facing away from the power device 21. The heat dissipation fins 23 are disposed in a heat dissipation channel 30. By disposing the heat dissipation fins 23 in the heat dissipation channel 30, the contact area between the heat dissipation fins 23 and the coolant passing through the heat dissipation channel 30 is increased, and the turbulence effect is enhanced, thereby improving the heat exchange efficiency.

[0096] For example, multiple power modules 20 are thermally connected to the heat dissipation channel 30. Heat dissipation fins 23 can be provided on the side of the heat dissipation substrate 22 of the power module 20 facing away from the power device 21. The heat dissipation fins 23 extend directly into the heat dissipation channel 30 and are in direct contact with the coolant (such as a water-glycol mixture). The heat dissipation fins 23 can be designed as straight fins, wavy fins (such as a sinusoidal profile), or pin fins to increase the contact area. That is, the heat generated by the power device 21 is conducted to the heat dissipation fins 23 through the heat dissipation substrate 22, and the heat dissipation fins 23 directly exchange heat with the flowing coolant through convection, utilizing the surface area of ​​the heat dissipation fins 23 to enhance heat transfer. This is suitable for high power density modules (such as SiC chips) that require rapid removal of concentrated heat.

[0097] Preferably, the heat sink fins 23 can adopt a continuous wave-shaped PinFin structure. This design can greatly increase the heat dissipation area of ​​the heat sink substrate 22. At the same time, the curved structure of the heat sink fins 23 can greatly improve the turbulence effect between the fluid and the wall, thereby increasing the heat dissipation efficiency and reducing the chip junction temperature.

[0098] For example, see Figure 2 When the heat dissipation channel is a series structure, multiple corrugated fins can be arranged so that the direction of the corrugation of the fins is consistent with the direction of the coolant flow. This design can create a disturbance effect on the coolant when the coolant flows along the corrugated gaps of the fins, and increase the contact area between the coolant and the corrugated fins, thereby increasing the heat dissipation efficiency and reducing the chip junction temperature.

[0099] For example, see Figure 3 and Figure 12 When the heat dissipation channels are in parallel, multiple corrugated fins can be arranged so that the direction of the corrugation extends in the same direction as the flow of the coolant in the branch channel 33. This design can also effectively improve the disturbance effect on the coolant, thereby increasing heat dissipation efficiency and reducing the chip junction temperature.

[0100] It is understandable that by setting heat dissipation fins 23, the heat dissipation area can be increased and the heat dissipation efficiency can be improved, thereby more effectively transferring the heat generated by the power device 21 to the coolant and reducing the chip junction temperature.

[0101] Specifically, when the heat dissipation channels 30 are in parallel, the coolant flows into the first main channel 31 from the inlet hole 310. As the cross-section of the first main channel 31 gradually narrows, the inlet pressure of each branch channel 33 tends to be consistent. The fluid flows vertically upward through the branch channels 33 into the area below the power module 20, evenly scouring the heat dissipation fins 23 before converging into the second main channel 32. The stepped connecting ribs 40 can guide the fluid to diffuse laterally, eliminating the flow deviation of the parallel branches, ensuring that the cooling intensity of each power module 20 is consistent, balancing the cooling flow of each power module 20, and preventing the coolant from flowing to the power module 20 closest to the drain hole 320. Instead, each power module 20 can be fully cooled, reducing the chip temperature and narrowing the temperature difference between the power modules 20.

[0102] In some embodiments, see Figure 4 The heat dissipation channel 30 has an inlet hole 310 and an outlet hole 320. At least one of the inlet hole 310 and the outlet hole 320 includes a main body section 301 and a flared section 302, with the flared section 302 connected between the main body section 301 and the heat dissipation channel 30.

[0103] Based on this, by setting a gradually expanding structure in the coolant inlet hole 310 and the drain hole 320, the fluid can transition smoothly, reduce the pressure loss of the coolant, reduce the pressure drop of the system, thereby reducing energy consumption and improving the efficiency of the entire system.

[0104] Understandably, as the coolant flows from the narrow cross-section (main section 301) to the wide cross-section (flared section 302), the cross-sectional area of ​​the flow channel gradually increases. According to the continuity equation, the fluid velocity will gradually decrease. The decrease in velocity means a reduction in kinetic energy. According to Bernoulli's equation, the reduction in kinetic energy will be converted into an increase in pressure energy (i.e., static pressure recovery), thereby compensating for the pressure loss caused by friction, turbulence, etc., during the fluid flow process and reducing the overall pressure drop.

[0105] It should be noted that the sloping structure (i.e., the surface of the bottom wall 11 facing the top wall 12 is the first surface, and the first surface slopes towards the top wall 12 from the liquid inlet 310 to the liquid outlet 320) and the stepped structure (i.e., the cross-sectional size of the first main channel 31 gradually decreases from the end near the liquid inlet 310 to the end away from the liquid inlet 310, or the cross-sectional size of the second main channel 32 gradually increases from the end connecting the first branch channel to the end connecting the second branch channel) described in the above embodiments can both be applied in series and parallel heat dissipation channels. That is, a stepped structure can be used in series heat dissipation channels, and a sloping structure can also be used in parallel heat dissipation channels. Both structures can be integrated with the heat dissipation channel 30 or can be independent and replaceable structures. The slope of the sloping structure and the height difference of the stepped structure depend on the specific cooling efficiency and are not limited here. This allows for adaptation to different power modules 20, helping SiC devices to better perform and accelerating product upgrades.

[0106] The above embodiments are merely preferred embodiments provided to fully illustrate the present invention, and the scope of protection of the present invention is not limited thereto. Equivalent substitutions or modifications made by those skilled in the art based on the present invention are all within the scope of protection of the present invention.

Claims

1. A power component, characterized in that, Includes a base (10) and multiple power modules (20) connected to the base (10). The base (10) is provided with a heat dissipation channel (30). The multiple power modules (20) are thermally connected to the heat dissipation channel (30). The heat dissipation efficiency of the multiple power modules (20) through the heat dissipation channel (30) is consistent. The heat dissipation channel (30) includes a first main channel (31), a second main channel (32), and a plurality of branch channels (33) connected between the first main channel (31) and the second main channel (32). The first main channel (31) has a liquid inlet (310), and the second main channel (32) has a liquid outlet (320). The plurality of power modules (20) are thermally connected to the plurality of branch channels (33). The base (10) includes a bottom wall (11) and a top wall (12) located on opposite sides of the heat dissipation channel (30). The top wall (12) is used to mount the plurality of power modules (20). The liquid inlet (310) and the liquid outlet (320) are provided on the bottom wall (11). The surface of the bottom wall (11) facing the top wall (12) is a first surface, extending from the liquid inlet (310) to the liquid outlet (320). The first surface is inclined toward the top wall (12). The first main channel (31) and the second main channel (32) are located on the same layer, and the plurality of branch channels (33) are stacked with the first main channel (31) and the second main channel (32).

2. The power component according to claim 1, characterized in that, The heat dissipation channel (30) has a liquid inlet (310) and a liquid outlet (320). The extension direction of the heat dissipation channel (30) from the liquid inlet (310) to the liquid outlet (320) is consistent with the arrangement direction of the plurality of power modules (20).

3. The power component according to claim 2, characterized in that, From the liquid inlet (310) to the liquid outlet (320), the cross-sectional area of ​​the heat dissipation channel (30) gradually decreases.

4. The power component according to claim 1, characterized in that, The positions of the first main channel (31) connecting the plurality of branch channels (33) are arranged sequentially from the end near the liquid inlet (310) to the end away from the liquid inlet (310), and the cross-sectional size of the first main channel (31) gradually decreases from the end near the liquid inlet (310) to the end away from the liquid inlet (310). Among the plurality of branch channels (33), the branch channel (33) closer to the liquid inlet (310) is the first branch channel, and the branch channel (33) farther away from the liquid inlet (310) is the second branch channel. The cross-sectional size of the second main channel (32) gradually increases from the end connected to the first branch channel to the end connected to the second branch channel.

5. The power component according to claim 4, characterized in that, The first main channel (31) extends from one end near the liquid inlet (310) to the end away from the liquid inlet (310) in a direction parallel to the second main channel (32) extending from one end connected to the first branch channel to the end connected to the second branch channel.

6. The power component according to claim 5, characterized in that, The plurality of tributary channels (33) are arranged sequentially along the extension direction of the first main channel (31) and the extension direction of the second main channel (32).

7. The power component according to claim 5, characterized in that, The portion of the base (10) located between the first main channel (31) and the second main channel (32) is a connecting rib (40). The connecting rib (40) is inclined relative to the extension direction of the first main channel (31) and the extension direction of the second main channel (32) from one end to the other.

8. The power component according to claim 7, characterized in that, The connecting rib (40) extends from one end to the other end in a stepped manner.

9. The power component according to claim 1, characterized in that, The power module (20) includes a power device (21), a heat dissipation substrate (22) disposed on the power device (21), and heat dissipation fins (23) disposed on the surface of the heat dissipation substrate (22) facing away from the power device (21). The heat dissipation fins (23) are disposed in the heat dissipation channel (30).

10. The power component according to claim 1, characterized in that, The heat dissipation channel (30) has an inlet hole (310) and a drain hole (320). At least one of the inlet hole (310) and the drain hole (320) includes a main body section (301) and a flared section (302). The flared section (302) is connected between the main body section (301) and the heat dissipation channel (30).

11. A vehicle, characterized in that, Includes the power component (100) as described in any one of claims 1-10.

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