Line laser

Abstract

The invention relates to a line laser which comprises a lamp panel and an optical module, the lamp panel comprises a substrate and a plurality of laser chips arranged on the substrate, any laser chip can output line laser extending in the first direction, and the laser chips are arranged in an array mode in the first direction and the second direction perpendicular to the first direction; the optical module comprises a first lens group and a second lens group which are sequentially arranged along the light emitting direction of the laser chip; the first lens group is used for compressing or widening fast axis divergence angles of the plurality of line lasers, and the second lens group is used for combining the plurality of line lasers into one line laser. The scheme that the optical module jointly composed of the first lens group and the second lens group is used for directly processing the multiple line lasers is adopted, it can be ensured that the finally output line lasers have high power density, the structure of the optical module can be simple, the design difficulty is small, the manufacturing cost is reduced, and the production efficiency is improved. Therefore, the wide development of the line laser is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of laser instruments, and in particular to a line laser. Background Art

[0002] At present, the line lasers emitted by existing line lasers are mostly obtained by shaping the circular spot with an optical shaping device. Due to the complex structure and difficult design of the optical shaping device, the cost of the line laser is high, which limits the further development of the line laser. Summary of the Invention

[0003] Based on this, it is necessary to provide a line laser with reduced manufacturing cost.

[0004] A line laser comprising: A light board comprising a substrate and a plurality of laser chips disposed on the substrate, wherein each of the laser chips is capable of outputting a line laser extending along a first direction, and the plurality of laser chips are arranged in an array along the first direction and a second direction perpendicular to the first direction; An optical module includes a first lens group and a second lens group arranged in sequence along the light output direction of the laser chip; the first lens group is used to compress or widen the fast axis divergence angle of multiple line lasers, and the second lens group is used to combine the multiple line lasers into one line laser.

[0005] In the aforementioned line laser, since the multiple laser chips installed on the lamp board can output multiple line lasers, the multiple line lasers are arranged in parallel, and their divergence angles are changed when passing through the first lens group. They are then combined into a line laser through the second lens group, thereby achieving high-power density line laser output. Compared with the conventional solution of shaping a circular spot through an optical shaping device to obtain a line laser, the present application adopts an optical module composed of a first lens group and a second lens group to directly process multiple line lasers. This not only ensures that the final output line laser has a high power density, but also eliminates the use of complex optical shaping lenses in the optical shaping device, making the optical module structure simpler and less difficult to design, thereby reducing manufacturing costs and promoting the widespread development of line lasers.

[0006] In one embodiment, the laser chip is an HCSEL chip, and its spectral width is less than or equal to 5nm and its slow axis divergence angle is less than or equal to 0.5°. This configuration can make the line laser emitted by the laser chip close to collimated light, which can significantly reduce the difficulty of optical shaping. In addition, the horizontal cavity structure of the HCSEL chip is compatible with standard semiconductor processes and can achieve large-scale integration at the wafer level, thereby reducing manufacturing costs. Moreover, the HCSEL chip has a large light output aperture size of up to 10mm, which can significantly reduce current density and improve device life. In industrial applications, the lifespan can reach tens of thousands of hours.

[0007] In one embodiment, the plurality of laser chips form a plurality of chip columns arranged along the first direction and a plurality of chip rows arranged along the second direction; the first lens group includes a plurality of first cylindrical lenses, the cylindrical axes of the plurality of first cylindrical lenses all being along the second direction, and the plurality of first cylindrical lenses corresponding one-to-one to the plurality of chip columns; the second lens group includes at least one second cylindrical lens, the cylindrical axis of the second cylindrical lens being along the first direction. Because the line lasers output by the plurality of laser chips all extend along the first direction, the plurality of line lasers output by the plurality of laser chips in a chip row are collinear along the first direction and, after being shaped by the corresponding first cylindrical lenses, form a single line laser with good uniformity. Consequently, the plurality of line lasers output by the plurality of laser chips, after passing through the first lens group, form a plurality of line lasers equal in number to the number of chip rows and with good uniformity. These plurality of line lasers, after passing through the second lens group, are combined to form a single line laser.

[0008] In one embodiment, the line laser includes a cooling plate connected to a side of the substrate facing away from the laser chip. A liquid inlet and outlet channel are provided within the cooling plate. A heat dissipation cavity is formed within the substrate, connecting the liquid inlet and outlet channels. Heat generated by the laser chip is transferred to the substrate and cooling plate, and then dissipated by a cooling medium flowing through a cooling channel formed by the liquid inlet, heat dissipation cavity, and liquid outlet channel, thereby cooling the laser chip.

[0009] In one embodiment, the inner wall surface of the substrate that forms the heat dissipation cavity is provided with heat dissipation teeth; and / or, the substrate is provided with a second opening connecting the liquid inlet channel and the heat dissipation cavity and a third opening connecting the liquid outlet channel and the heat dissipation cavity, the lamp board has multiple, the second openings and the third openings have multiple, and they are all arranged in sequence along the first direction, in the first direction, the multiple second openings gradually approach the liquid inlet on the guide path of the liquid inlet channel, and the multiple third openings gradually move away from the liquid outlet on the guide path of the liquid outlet channel. By providing heat dissipation teeth, the contact area between the substrate and the cooling medium can be increased inside the heat dissipation cavity, thereby improving the cooling effect. The provision of multiple second openings and multiple third openings can ensure that the temperature and flow rate of the cooling medium entering the multiple lamp boards remain consistent, thereby ensuring the junction temperature consistency of multiple laser chips.

[0010] In one embodiment, there are multiple light panels arranged sequentially along the first direction, with the first lens group and the second lens group completely covering all of the light panels. Because the line laser beam formed by the second lens group extends along the first direction, by arranging multiple light panels in the first direction, the length of the line laser can be extended in the first direction. In this way, by changing the number of light panels, customized line lasers with various output lengths can be achieved.

[0011] In one embodiment, the line laser includes a control board and multiple driver devices. Multiple laser chips located on the same substrate are connected in series to form a chipset. Multiple driver devices are connected one-to-one to multiple chipsets, and each driver device is connected to the control board. All laser chips on a lamp board (i.e., a chipset) are connected in series to form a circuit, so that one driver device controls one lamp board, adjusting the current or current duty cycle to control the power of the laser chips on the lamp board. This ensures consistent current and light output power for each laser chip on a lamp board, ensuring uniformity and stability of multiple laser lines. Furthermore, the control board can independently control multiple lamp boards by controlling multiple driver devices, thereby achieving zoned control. This allows for adjustable laser power in different areas of the line laser, enabling individual switching, and editing of the line laser's power curve to achieve different processing scenarios. Furthermore, each area of the line laser is addressable and can be externally controlled and linked, enabling a fully automated operating mode based on actual application scenarios.

[0012] In one embodiment, the line laser includes a cooling plate connected to a side of the plurality of substrates facing away from the laser chip, and the plurality of driver devices are each connected to a side of the cooling plate facing away from the substrate. One side of the cooling plate is connected to the driver device, and the other side is connected to the substrate, so that the cooling plate can cool and dissipate heat for both the lamp board and the driver device.

[0013] In one embodiment, the cooling plate and the driver device are connected via a thermally conductive adhesive layer. Using the thermally conductive adhesive layer to connect the driver device and the cooling plate not only reduces the contact thermal resistance between the driver device and the cooling plate but also fills gaps, thereby achieving a stable connection and rapid heat transfer between the driver device and the cooling plate.

[0014] In one embodiment, the line laser includes a panel that covers the second lens group and has a light-transmitting window corresponding to the second lens group. The line laser light transmitted through the second lens group can be further emitted through the light-transmitting window on the panel. The panel protects the second lens group from dust contamination. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the structure of a line laser in some embodiments of the present application; Figure 2 for Figure 1 Exploded schematic diagram of the structure of the line laser shown; Figure 3 for Figure 2 A schematic diagram of the structure of multiple light panels and the first lens group in the line laser shown; Figure 4 for Figure 1 Another structural schematic diagram of the line laser shown; Figure 5 for Figure 4 A cross-sectional view along the AA direction of the line laser shown; Figure 6 for Figure 5 An enlarged schematic diagram of the structure at position B in the structure shown; Figure 7 for Figure 1 Another structural schematic diagram of the line laser shown; Figure 8 for Figure 7 A cross-sectional view of the line laser along the CC direction is shown; Description of reference numerals: 10. Line laser; 20. Lamp board; 21. Base plate; 211. Heat dissipation cavity; 212. First opening; 22. Laser chip; 23. Chip array; 24. Chip row; 30. Optical module; 31. First lens group; 311. First cylindrical lens; 32. Second lens group; 321. Second cylindrical lens; 33. First mounting seat; 34. Second mounting seat; 40. Cooling plate; 41. Liquid inlet channel; 411. Liquid inlet; 412. First flow channel; 4 13. Second flow channel; 42. Liquid outlet channel; 421. Liquid outlet; 422. Third flow channel; 423. Fourth flow channel; 43. Second opening; 44. Third opening; 45. Liquid inlet connector; 46. Liquid outlet connector; 50. Control panel; 60. Drive device; 70. Panel; 71. Light-transmitting window; 72. Red light indicator; 81. Cover; 82. Side panel; 83. Electrical connector; 84. Handle; 85. Fixing foot. DETAILED DESCRIPTION

[0016] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0017] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0018] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0019] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0020] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0021] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0022] Combine Figures 1 to 8 As shown, a line laser 10 provided in one embodiment of the present application includes a lamp board 20 and an optical module 30. The lamp board 20 includes a substrate 21 and multiple laser chips 22 disposed on the substrate 21. Each laser chip 22 is capable of outputting a line laser extending along a first direction. The multiple laser chips 22 are arranged in an array along the first direction (i.e., the X direction) and a second direction perpendicular to the first direction (i.e., the Y direction). The optical module 30 includes a first lens group 31 and a second lens group 32, which are sequentially arranged along the light output direction of the laser chips 22. The first lens group 31 is used to compress or widen the fast-axis divergence angle of multiple line lasers, and the second lens group 32 is used to combine the multiple line lasers into a single line laser.

[0023] In the above-mentioned line laser 10, since the multiple laser chips 22 provided on the lamp board 20 can output multiple line lasers, the multiple line lasers are arranged in parallel, and the divergence angle is changed when passing through the first lens group 31, and then they are combined into a line laser through the second lens group 32, thereby achieving high-power density line laser output. Compared with the conventional solution of shaping a circular spot through an optical shaping device to obtain a line laser, the present application adopts an optical module 30 composed of the first lens group 31 and the second lens group 32 to directly process the multiple line lasers. This not only ensures that the final output line laser has a high power density, but also eliminates the use of complex optical shaping lenses in the optical shaping device, making the structure of the optical module 30 relatively simple and less difficult to design, thereby reducing manufacturing costs and promoting the widespread development of the line laser 10.

[0024] Specifically in the present application, the laser chip 22 is an HCSEL chip, and its spectral line width is less than or equal to 5nm, and the slow axis divergence angle is less than or equal to 0.5°. It can be understood that the HCSEL chip is also a Horizontal Cavity Surface-Emitting Laser chip, or also called a horizontal cavity surface emitting laser chip. Since the spectral line width of the HCSEL chip used is less than or equal to 5nm and the slow axis divergence angle is less than or equal to 0.5°, the line laser it emits is close to collimated light, which can also significantly reduce the difficulty of optical shaping. In addition, the horizontal cavity structure of the HCSEL chip is compatible with standard semiconductor processes and can be integrated on a large scale at the wafer level, thereby reducing manufacturing costs. Moreover, the light output aperture size of the HCSEL chip is large, which can reach 10mm, which can greatly reduce the current density and improve the device life. In industrial applications, the lifespan can reach tens of thousands of hours.

[0025] Combine Figures 1 to 3 As shown, in this application, multiple laser chips 22 are arranged in an array, forming multiple chip columns 23 arranged along a first direction and multiple chip rows 24 arranged along a second direction. The layout of the laser chips 22 on the lamp board 20 can be adjusted based on the power density and length of the combined laser line, enabling applications such as laser heating, laser cleaning, and laser welding. A greater number of chip rows 24 results in a higher power density of the combined laser line, while a greater number of chip columns 23 results in a longer combined laser line.

[0026] Specifically, in the present application, there are multiple lamp boards 20, and the multiple lamp boards 20 are arranged in sequence along the first direction, and the first lens group 31 and the second lens group 32 completely cover all the lamp boards 20. It can be understood that since the line laser after the second lens group 32 is combined extends along the first direction, by arranging multiple lamp boards 20 in the first direction, the length of the line laser can be extended in the first direction. In this way, by changing the number of lamp boards 20, the customization requirements of line lasers 10 with various output lengths can be achieved. For example, conventional line lasers are limited by shaping devices, and the line length is difficult to reach more than 1m, so they cannot be used in application scenarios with a working distance of more than 1m. In the present application, by arranging multiple lamp boards 20 in sequence in the first direction, the line length of the line laser can be extended to several meters.

[0027] In addition, no matter how many lamp boards 20 there are, the first lens group 31 and the second lens group 32 need to completely cover all the lamp boards 20, so that the line lasers output by all the laser chips 22 on each lamp board 20 can pass through the first lens group 31 and the second lens group 32 in sequence.

[0028] In the present application, the first lens group 31 includes a plurality of first cylindrical lenses 311, each having its cylindrical axis along the second direction. The plurality of first cylindrical lenses 311 correspond one-to-one to the plurality of chip arrays 23. The second lens group 32 includes at least one second cylindrical lens 321, each having its cylindrical axis along the first direction.

[0029] It will be appreciated that the first cylindrical lens 311 extends in a strip shape along the second direction, thereby adjusting the divergence angle of the multiple laser lines output by the multiple laser chips 22 in the corresponding chip array 23. The cylindrical axes of the first cylindrical lens 311 and the second cylindrical lens 321 are arranged at a 90° angle, so that the first cylindrical lens 311 can combine the multiple laser lines into a single laser line.

[0030] It is understood that the number of first cylindrical lenses 311 must be greater than or equal to the number of chip arrays 23, so that each chip array 23 corresponds to a corresponding first cylindrical lens 311. There may be multiple second cylindrical lenses 321, each of which is shorter in the first direction and arranged closely together along the first direction. In this way, the number of first and second cylindrical lenses 311, 321 can be adjusted based on the number of light boards 20. Alternatively, in other embodiments, a single second cylindrical lens 321 with a longer length in the first direction can be provided to cover all laser chips 22.

[0031] Since the line lasers output by the multiple laser chips 22 all extend along the first direction, the multiple line lasers output by the multiple laser chips 22 in a chip row 24 are collinear along the first direction, and after being shaped by the corresponding first cylindrical lenses 311, they form a line laser with good uniformity. Therefore, the multiple line lasers output by the multiple laser chips 22 will form a number of line lasers equal to the number of chip rows 24 and with good uniformity after passing through the first lens group 31, and the multiple line lasers will be combined to form a line laser after passing through the second lens group 32.

[0032] Combine Figure 2 、 Figures 4 to 8 As shown, in the present application, the line laser 10 includes a cooling plate 40, which is connected to the side of the substrate 21 facing away from the laser chip 22. The cooling plate 40 is provided with a liquid inlet channel and a liquid outlet channel 42. The substrate 21 is hollow inside to form a heat dissipation cavity 211, which connects the liquid inlet channel and the liquid outlet channel 42. It can be understood that the heat generated by the laser chip 22 can be transferred to the substrate 21 and the cooling plate 40, and the heat is dissipated by the cooling medium flowing through the cooling channel formed by the liquid inlet channel, the heat dissipation cavity 211, and the liquid outlet channel 42, thereby cooling the laser chip 22.

[0033] Furthermore, since laser chip 22 is an HCSEL chip, its horizontal cavity design allows its bottom to directly contact substrate 21, which acts as a heat sink. This creates a more efficient heat dissipation path, reducing thermal resistance by over 50%. Specifically, laser chip 22 is directly packaged on substrate 21, ensuring excellent heat dissipation and stable power and performance for the entire line laser 10.

[0034] Specifically in the present application, the substrate 21 is a water-cooled radiator having a heat dissipation cavity 211 therein, and two first openings 212 are provided on the substrate 21 at intervals, both of which are connected to the heat dissipation cavity 211. On the cooling plate 40, the liquid inlet channel 41 and the liquid outlet channel 42 each extend in a strip shape with one end closed and the other end extending to the side of the cooling plate 40. A second opening 43 is provided on the cooling plate 40 at a position corresponding to the liquid inlet channel 41, and the second opening 43 is connected to the liquid inlet channel 41. A third opening 44 is provided on the cooling plate 40 at a position corresponding to the liquid outlet channel 42, and the third opening 44 is connected to the liquid outlet channel 42. After the substrate 21 is fixedly mounted on the cooling plate 40, the two first openings 212 are connected to the second opening 43 and the third opening 44, respectively, so that the liquid inlet channel 41, the heat dissipation cavity 211, and the liquid outlet channel 42 are connected in sequence.

[0035] Furthermore, one end of the liquid inlet channel 41 is a liquid inlet 411, and one end of the liquid outlet channel 42 is a liquid outlet 421. A liquid inlet connector 45 is connected to the position corresponding to the liquid inlet 411 on the cooling plate 40, and a liquid outlet connector 46 is connected to the position corresponding to the liquid outlet 421. The cooling medium can enter the liquid inlet channel 41 through the liquid inlet connector 45, and then sequentially enter the heat dissipation cavity 211 and the liquid outlet channel 42, and finally be discharged from the liquid outlet connector 46. Furthermore, the liquid inlet connector 45 and the liquid outlet connector 46 can be quick-connect connectors to facilitate rapid connection of external pipelines to the liquid inlet connector 45 and the liquid outlet connector 46.

[0036] Specifically in this application, there are multiple lamp boards 20, multiple second openings 43 and multiple third openings 44, and one second opening 43 and one third opening 44 form a pair to correspond to the heat dissipation cavity 211 connected to the substrate 21 in one lamp board 20.

[0037] The liquid inlet channel 41 is U-shaped and has a first flow channel 412 and a second flow channel 413 that are parallel to each other. Both the first flow channel 412 and the second flow channel 413 extend in a long strip along a first direction. The end of the first flow channel 412 away from the second flow channel 413 is a liquid inlet 411. The plurality of second openings 43 are arranged along the first direction and correspond to the second flow channels 413. Thus, along the first direction, the plurality of second openings 43 gradually approach the liquid inlet 411 along the flow path of the liquid inlet channel 41.

[0038] The liquid outlet channel 42 includes a third flow channel 422 and a fourth flow channel 423. The third flow channel 422 extends in a long strip along the first direction. The fourth flow channel 423 is L-shaped, with one end connected to the third flow channel 422 and the other end forming a liquid outlet 421. A plurality of third openings 44 are arranged along the first direction and correspond to the third flow channels 422. Thus, along the first direction, the plurality of third openings 44 gradually move away from the liquid outlet 421 along the liquid outlet channel 42's flow path.

[0039] Therefore, the flow channel length of the liquid inlet channel 4141 is longer than the flow channel length of the liquid outlet channel 42, and the cooling medium can enter the heat dissipation cavity 211 through multiple second openings 43 in the second flow channel 413 away from the liquid inlet 411, and then flow back to the third flow channel 422 of the liquid outlet channel 42 through multiple third openings 44, and then turn twice along the fourth flow channel 423, and finally be discharged from the liquid outlet 421.

[0040] It can be understood that the liquid inlet connector 45 and the liquid outlet connector 46 are disposed on the same side of the cooling plate 40. Among the multiple lamp boards 20, for the lamp board 20 closest to the liquid inlet connector 45 and the liquid outlet connector 46, the second opening 43 communicating with its heat dissipation cavity 211 is farthest from the liquid inlet connector 45 on the flow path of the liquid inlet channel 41, while the third opening 44 communicating with its heat dissipation cavity 211 is closest to the liquid outlet connector 46 on the flow path of the liquid outlet channel 42. Conversely, for the lamp board 20 farthest from the liquid inlet connector 45 and the liquid outlet connector 46, the second opening 43 communicating with its heat dissipation cavity 211 is closest to the liquid inlet connector 45 on the flow path of the liquid inlet channel 41, while the third opening 44 communicating with its heat dissipation cavity 211 is farthest from the liquid outlet connector 46 on the flow path of the liquid outlet channel 42. This arrangement ensures that the temperature and flow rate of the cooling medium entering the multiple lamp boards 20 remain consistent, thereby ensuring consistent junction temperatures of the multiple laser chips 22.

[0041] In the present application, the inner wall surface of the substrate 21 that forms the heat dissipation cavity 211 is provided with heat dissipation teeth (not shown). By providing the heat dissipation teeth, the contact area between the substrate 21 and the cooling medium can be increased inside the heat dissipation cavity 211, thereby improving the cooling effect.

[0042] like Figure 2 As shown, in the present application, the line laser 10 includes a control board 50 and multiple driver devices 60. Multiple laser chips 22 located on the same substrate 21 are connected in series to form a chipset. The multiple driver devices 60 are connected to the multiple chipsets in a one-to-one correspondence, and the multiple driver devices 60 are all connected to the control board 50.

[0043] As can be understood, all laser chips 22 of a lamp board 20 (i.e., a chipset) are connected in series to form a circuit, allowing one driver device 60 to control each lamp board 20. This ensures consistent current and light output power across all laser chips 22 on a lamp board 20, ensuring uniformity and stability of multiple laser lines. Furthermore, the number of driver devices 60 matches the number of lamp boards 20. Multiple driver devices 60 can independently control different lamp boards 20 to produce line lasers of varying power by individually adjusting their duty cycles, and the number of driver devices 60 can be adjusted as the number of lamp boards 20 changes. Specifically, the driver devices 60 and laser chips 22 are connected by conductive cables, forming an electrical circuit.

[0044] It can be understood that the control board 50 can control multiple light boards 20 by controlling multiple driver devices 60, thereby achieving the purpose of zone control. This allows the laser power of different areas of the line laser to be adjusted and individually turned on and off, and the power curve of the line laser can be edited to achieve different processing scenarios. The line laser in each area is addressable and can be externally controlled and linked, achieving a fully automated operating mode based on the actual application scenario. Specifically, the control board 50 and the multiple driver devices 60 are connected by communication lines, and each driver device 60 can be controlled separately by the host computer program.

[0045] In the present application, the control board 50 may also provide other supporting functions, such as red light indication, temperature detection, voltage and current monitoring, etc.

[0046] Specifically in this application, multiple driving devices 60 are connected to the side of the cooling plate 40 facing away from the substrate 21. In this way, one side of the cooling plate 40 is connected to the driving device 60, and the other side is connected to the substrate 21, so that the cooling plate 40 can cool and dissipate heat for the lamp board 20 and the driving device 60 at the same time.

[0047] Specifically, the cooling plate 40 and the driver 60 are connected via a thermally conductive adhesive layer. Using the thermally conductive adhesive layer to connect the driver 60 and the cooling plate 40 not only reduces the contact thermal resistance between the driver 60 and the cooling plate 40 but also fills gaps, thereby achieving a stable connection and rapid heat transfer between the driver 60 and the cooling plate 40.

[0048] In this application, the line laser 10 includes a panel 70, which covers the second lens group 32 and has a light-transmitting window 71 corresponding to the second lens group 32. Specifically, the line laser light transmitted through the second lens group 32 can be further emitted through the light-transmitting window 71 on the panel 70. The light-transmitting window 71 has a high-transmittance film that can transmit more than 99.8% of the line laser light.

[0049] Specifically, the first lens group 31 is fixedly mounted on the cooling plate 40 via a first mounting bracket 33, and the second lens group 32 is fixedly mounted on the cooling plate 40 via a second mounting bracket 34, covering the first lens group 31 and the lamp board 20. The panel 70 is fixedly mounted on the second mounting bracket 34, covering the second lens group 32. This protects the laser chip 22, the first lens group 31, and the second lens group 32 from dust contamination. Furthermore, the light-transmitting window 71 on the panel 70 is composed of multiple window pieces, which are polished to ensure sealing.

[0050] Furthermore, since the line laser output by the HCSEL chip is infrared light and cannot be seen by the naked eye, a red light indicator 72 is provided on the panel 70 to indicate the light output position of the line laser 10, thereby assisting in identification and providing laser safety guidance. The red light indicator 72 is mounted on one side of the light-transmitting window 71 and is connected to the control board 50.

[0051] Combine Figure 1 and Figure 2 As shown, in the present application, the line laser 10 includes a cover plate 81 and multiple side plates 82. The multiple side plates 82 are connected end to end to form a ring structure with openings at both ends. The cover plate 81 is connected to one opening surrounded by the multiple side plates 82 and seals the opening, and the side of the cooling plate 40 facing away from the substrate 21 is connected to the other opening surrounded by the multiple side plates 82 and seals the other opening. In this way, the cover plate 81, the multiple side plates 82 and the cooling plate 40 together form a sealed space to prevent dust from entering, and the multiple driving devices 60 can be protected in the sealed space.

[0052] Furthermore, there are four side panels 82, two of which are arranged opposite each other. A control board 50 is fixed to one of the side panels 82. The control board 50 can be connected to an external communication line for external computer control of the line laser 10. An electrical connector 83 is provided on the other side panel 82 corresponding to the side panel 82 connected to the control board 50. This electrical connector 83 connects to the multiple driver devices 60 to provide power to the multiple driver devices 60 and the multiple laser chips 22, thereby driving each lamp board 20 to output line lasers. A copper busbar connects the electrical connector 83 to the driver devices 60.

[0053] Specifically, a foldable handle 84 is installed on the exposed surface of the cover 81 to facilitate the transportation of the line laser 10. In addition, a fixing foot 85 is installed on the exposed side of the cooling plate 40, and the fixing foot 85 can be used to facilitate the fixing of the line laser 10.

[0054] The technical features of the above-mentioned embodiments can be arbitrarily grouped. In order to make the description concise, not all possible groups of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the groups of these technical features, they should be considered to be within the scope of this specification.

[0055] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A line laser, characterized in that include: A light board comprising a substrate and a plurality of laser chips disposed on the substrate, wherein each of the laser chips is capable of outputting a line laser extending along a first direction, and the plurality of laser chips are arranged in an array along the first direction and a second direction perpendicular to the first direction; An optical module includes a first lens group and a second lens group arranged in sequence along the light output direction of the laser chip; the first lens group is used to compress or widen the fast axis divergence angle of multiple line lasers, and the second lens group is used to combine the multiple line lasers into one line laser.

2. The line laser according to claim 1, characterized in that The laser chip is an HCSEL chip, and its spectral line width is less than or equal to 5nm, and its slow axis divergence angle is less than or equal to 0.5°.

3. The line laser according to claim 1, characterized in that The plurality of laser chips form a plurality of chip columns arranged along the first direction and a plurality of chip rows arranged along the second direction; the first lens group includes a plurality of first cylindrical lenses, the cylindrical axes of the plurality of first cylindrical lenses are all along the second direction, and the plurality of first cylindrical lenses correspond one-to-one to the plurality of chip columns; the second lens group includes at least one second cylindrical lens, the cylindrical axis of the second cylindrical lens is along the first direction.

4. The line laser according to claim 1, characterized in that The line laser includes a cooling plate connected to a side of the substrate facing away from the laser chip. A liquid inlet channel and a liquid outlet channel are provided inside the cooling plate. The interior of the substrate is hollow to form a heat dissipation cavity, and the heat dissipation cavity connects the liquid inlet channel and the liquid outlet channel.

5. The line laser according to claim 4, characterized in that The inner wall surface of the substrate that forms the heat dissipation cavity is provided with heat dissipation teeth; and / or, a second opening connecting the liquid inlet channel and the heat dissipation cavity and a third opening connecting the liquid outlet channel and the heat dissipation cavity are provided on the substrate, and there are multiple lamp boards, and there are multiple second openings and multiple third openings, and they are all arranged in sequence along the first direction. In the first direction, the multiple second openings gradually approach the liquid inlet on the guide path of the liquid inlet channel, and the multiple third openings gradually move away from the liquid outlet on the guide path of the liquid outlet channel.

6. The line laser according to claim 1, characterized in that There are multiple light boards, and the multiple light boards are arranged in sequence along the first direction. The first lens group and the second lens group completely cover all the light boards.

7. The line laser according to claim 6, characterized in that The line laser includes a control board and multiple driving devices. Multiple laser chips located on the same substrate are connected in series to form a chipset. Multiple driving devices are connected to multiple chipsets in a one-to-one correspondence, and multiple driving devices are all connected to the control board.

8. The line laser according to claim 7, characterized in that The line laser includes a cooling plate connected to a side of the plurality of substrates facing away from the laser chip, and the plurality of driving devices are all connected to a side of the cooling plate facing away from the substrate.

9. The line laser according to claim 8, characterized in that The cooling plate and the driving device are connected via a heat-conducting adhesive layer.

10. The line laser according to claim 1, characterized in that The line laser includes a panel covering the second lens group and having a light-transmitting window corresponding to the second lens group.

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